Controlled modification of octadecyltrichlorosilane self-assembled monolayer by CO 2 plasma
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Transcript of Controlled modification of octadecyltrichlorosilane self-assembled monolayer by CO 2 plasma
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Thin Solid Films 496 (
Controlled modification of octadecyltrichlorosilane self-assembled
monolayer by CO2 plasma
Nicolas Delorme a,b,c, Jean-Francois Bardeau a,c,*, Alain Bulou a,c, Fabienne Poncin-Epaillard b,c,*
a Laboratoire de Physique de l’Etat Condense (UMR CNRS 6087), Universite du Maine, Avenue Olivier Messiaen, 72085 Le Mans Cedex 9, Franceb Polymeres Colloıdes et Interfaces (UMR CNRS 6120), Universite du Maine, Avenue Olivier Messiaen, 72085 Le Mans Cedex 9, France
c Institut de recherche en ingenierie moleculaire et materiaux fonctionnels, (CNRS FR 2575), Universite du Maine, Avenue Olivier Messiaen,
72085 Le Mans Cedex 9, France
Received 11 April 2005; received in revised form 31 August 2005; accepted 15 September 2005
Available online 27 October 2005
Abstract
CO2-plasma is used to introduce functional groups on the uppermost surface of an alkoxysilane self-assembled monolayer (SAM). The
structural and chemical modifications of the material surface were monitored by X-ray reflectometry, atomic force microscopy, X-ray
photoelectrons spectroscopy and water contact angle measurements. Optimization of the plasma parameters is performed in order to achieve a
maximum functionalization and to prevent degradation of the SAM. Finally, the ability of grafting organic compounds onto the plasma modified
SAMS was demonstrated by the formation of an alkoxysilane bilayer.
D 2005 Elsevier B.V. All rights reserved.
Keywords: Plasma processing; Octadecyltrichlorosilane; Atomic force microscopy; X-ray photoelectron spectroscopy
1. Introduction
Self-assembled monolayers (SAMs) have attracted increas-
ing interests over the past 20 years due to their ability to form
spontaneously highly organized organic structures on mica and
silicon substrates. SAMs can be easily formed by adsorption
from solution onto a solid surface with molecules having an
appropriate terminal anchoring group with specific chemical
affinity (physic-sorption, chemi-sorption or covalent bond) to
the substrate surface. A long linear hydrocarbon chain favors
upright monolayer ordering on the surface and a terminal
functional group defines the surface functionality [1]. The
quality of the SAMs monolayer (chains orientation, packing. . .)is directly controlled by two main parameters: the reaction
temperature [2–5], and the water traces in the reaction solvent
[2,6]. Alkylsiloxane SAMs have emerged as one of the most
0040-6090/$ - see front matter D 2005 Elsevier B.V. All rights reserved.
doi:10.1016/j.tsf.2005.09.105
* Corresponding authors. Jean-Francois Bardeau is to be contacted at
Laboratoire de Physique de l’Etat Condense (UMR CNRS 6087), Universite
du Maine, Avenue Olivier Messiaen, 72085 Le Mans Cedex 9, France.
E-mail addresses: [email protected]
(J.-F. Bardeau), [email protected]
(F. Poncin-Epaillard).
widely studied SAMs [7] due to their convenient attachment to
hydroxyled and/or oxided surfaces and to their significant
applications in many important fields such as microfluidic [8,9],
protein adsorption [10], chromatography [11], and molecular
electronic [12].
The surface modification of alkoxyloxane SAMs was little
studied [13–16]. Reported experiments mainly concern SAMs
subjected to UV-light [14,16,17], electrons [15,18–20], or X-
ray exposures [21,22]. In most of the cases such an exposure
results in either partial or total damage. One of the perspectives
of modification of alkylsiloxane SAMs is the plasma proces-
sing. Whereas this method is widely applied in microelectron-
ics or chemical modification of polymeric surfaces, there are
only few examples for plasma treatment on SAMs [13,23–25].
The major reason is probably the large complexity of the
physical and chemical processes involving during the interac-
tions of plasma with these systems. Both ions, electrons, free
radicals and UV-light generated by the plasma, affect the SAM
at the same time, involving degradation and functionalization
in most cases [13,23–25].
In this study, octadecyltrichlorosilane (OTS) was selected
as a model of highly packed organic monolayer and because
of its widespread use in the literature [7,20,26–29]. The
2006) 612 – 618
ww
N. Delorme et al. / Thin Solid Films 496 (2006) 612–618 613
thickness and the density of the monolayer were controlled by
X-ray reflectivity measurements whereas the surface homo-
geneity was studied by atomic force microscopy (AFM)
[21,30–32].
CO2-plasma surface modification of the OTS monolayer
was characterized by X-ray photoelectron spectroscopy (XPS)
and contact angle measurements whereas structural modifica-
tions were detected by X-ray reflectivity (XR) and AFM
measurements. The systematic evaluation of the importance of
these two methods allowed us, mainly by controlling the
plasma parameters, to favor the functionalization of the
monolayer surface with regards to the degradation.
2. Experimental details
2.1. Materials
Octadecyltrichlorosilane (95%) was purchased from Aldrich
and was used without further purification. Sulfuric acid and
hydrogen peroxide were analytical grade and obtained from
Aldrich. Single side polished Si {100} (Siltronix) wafers were
used as substrates. Wafers were irradiated by a UV-ozone
cleaner (Jelight Company Inc.).
2.2. Substrate preparation
Before silanization, silicon wafers were ultrasonically
cleaned in methanol for 5 min and treated by a freshly
prepared Piranha solution (70% H2SO4, 30% H2O2) at 100 -Cfor 5 min in order to eliminate all the contaminants. Afterward,
wafers were rinsed with a copious amount of ultrapure water
and dried under a high-purity nitrogen stream. The surface
silanol groups were formed after placing substrates into the
chamber of a UV-ozone cleaner for 10 min. Samples were used
immediately to avoid further contamination. After this cleaning
procedure XPS measurements do not show any signal
corresponding to carbon element indicating the absence of
organic contaminants onto the surface. Furthermore, a total
wetting of the silicon surface with a drop of ultrapure water
was observed demonstrating the presence of silanol groups
onto the surface [29].
2.3. Silanization
OTS silanization was performed by immersing a cleaned
silicon wafer into a solution of OTS (5 I10�3 M) in bicyclo-
hexyl (cyclohexylcyclohexane) for 2 min. Then samples were
ultrasonically rinsed in toluene. This process was run two times
more in order to achieve the formation of a dense OTS
monolayer.
2.4. Contact angles measurements
Contact angles measurements were performed using a
Rame-Hart Inc. goniometer. Droplets of ultrapure water
(Millipore) with a resistivity higher than 18 MV/cm (2 AL)were used to measure the wettability of the surface. The
reported results are the averaged values of measurements
performed with five drops on each sample surface.
2.5. X-ray reflectivity
X-ray reflectivity measurements were performed using a
Philips X’Pert MPD with a parallel beam optics configura-
tion. X-ray was produced by a Cu-Ka-radiation (k=1.54 A)
at 40 keV and 30 mA. The experimental data are shown after
the theoretical Fresnel normalization [33,34] for favoring the
observation of the well defined Kiessig fringes. A quantitative
analysis of the X-ray reflectivity curves has been carried out
using the matrix method [33], rather than the Born
approximation [35]. The electron density profiles of the
samples are modelized by successive layers of uniform
electron density. Each layer is parameterized by an electron
density, a thickness and a smoothing/roughness parameter. In
the fitting procedure, these parameters can be either kept
fixed or varied.
2.6. CO2-plasma treatment
A tubular quartz sample chamber with dimension 76�500
mm (diameter� length) was used. Power (P) was supplied by
a microwave generator (433 MHz). A primary pump and a
diffusion pump were used to attempt a 10�4 Pa ultimate
pressure in the chamber. The plasma was turned on 5 min after
gas introduction. In the following, d denotes the distance
between the bottom of the plasma source and the sample, t the
treatment time, and F the gas flow.
2.7. X-ray photoelectron spectroscopy analysis
XPS spectra were acquired with an ESCA LHS 12
instrument (Leybold) at the Laboratoire de Physique des
Couches Minces (Institut des Materiaux de Nantes). The
photo-emission was excited by a monochromatic Mg Ka beam
at 1253.6 eV. Emission was analyzed at a take-off angle of 90-relative to the horizontal, yielding a sampling depth around 10
nm [36] due to the mean free path of the electrons. Calibration
was made on the C1s peak of C–C bonds at 285.0 eV. Curve
fitting was performed using Peak Fit 4.0 software (Jandel
Scientific). The Full Width at Half Maximum was narrower
than 1.5. Quantitative analysis of the surface composition was
estimated from the integrated peak areas normalized by the
relative sensitivity factors (RSF), the electronmeanfree path,
and the apparatus transmission function provided by the
manufacturer. The spectra were fitted assuming 80% Gaussian
and 20% Lorentzian lineshapes [37]. The surface composition
was expressed in atom percent, and the typical uncertainty was
5% of the measured values for the peaks above 10 at.% the
spectra processing.
2.8. Atomic force microscopy
AFM measurements were accomplished in air with a
Scientec Picoplus system. Silicon tips (k =42 N/m—Nano-
0.0 0.1 0.2 0.3 0.4 0.510-10
10-9
10-8
10-7
10-6
Measured Calculated
R/R
F [a
rb. u
nits
]
Qz [A-1]
Fig. 1. Fresnel normalized X-ray reflectivity results from an OTS-SAM onto
silicon (square) together with the calculated curve (full line).
832 pm
0 nm 50
0
50
100
150
100 150
0 pm
Fig. 2. AFM image of the OTS monolayer on silicon wafer in air (tapping
mode—image size=180�180 nm).
90
95
100
105
110
115
ngle
[deg
rees
]
N. Delorme et al. / Thin Solid Films 496 (2006) 612–618614
world-Switzerland) were used for intermittent contact mode.
The surface roughness Rq was evaluated by the root mean
square (RMS) which can be expressed as:
Rq ¼ffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffi1
MN~
M�1
k¼0
~N�1
l¼0
z xk ; ylð Þ � l½ �2s
where M�N is the image size and l is the mean height.
The reported Rq values were calculated using WS�M 4.0
software developed by Nanotec Electronica S.L. To make any
comparison meaning between the Rq values, the AFM images
were measured on the different samples with the same scan
size, pixel resolution, tip-sample force, and AFM tip.
3. Results and discussion
3.1. Formation of a compact OTS monolayer
Quality of the OTS monolayer was preliminary demonstrat-
ed by the high water contact angle (110 T2-) [7], and by the
analysis of X-ray reflectivity curves. In Fig. 1, we show the
Fresnel normalized XR curve of silicon wafer functionalized
by OTS-SAM and the best reflectivity fit as the solid line
which describes the two well-defined Kiessig fringes. The
fringes spacing of 0.240 A�1 which is inversely proportional to
the total film thickness and the Qz value of the first minimum at
0.125 A�1 (denoted Qzmin) are good indicators of the quality of
the SAM yielding to an approximate total film thickness of
2.5(T0.1) nm [34]. The full analysis of the XR curve gives a
fully description of both orientation and density packing of the
OTS monolayer. All the parameters found in this analysis and
Table 1
Parameters obtained from the fit to the experimental X-ray reflectivity curve of
OTS film grafted on the silicon substrate
q [e� A�3] Roughness [A] Thickness [A]
Substrate 0.710(*) 0.7 –
Oxide layer 0.670(*) 0.2 12.9
Transition layer 0.601 3.1 3.5
OTS layer 0.316(*) 2.8 23.0
(*) Parameters marked with an asterisk are maintained fixed during the fit.
0 25 50 75 100 125 150 175 200 22560
65
70
75
80
85
Wat
er c
onta
ct a
CO2-plasma treatment duration [s]
Fig. 3. Evolution of the water contact angle with the CO2-plasma treatmen
duration.
summarized in Table 1 were obtained from a four-component
model: a silicon substrate, a silicon oxide layer, a transition
layer and the OTS monolayer. The silicon substrate was
supposed to have an infinite thickness and an electron density
of 0.710 e� A�1 [34]. The electron density of silicon oxide
was fixed to 0.670 e� A�1 [21]. The introduction of a thin
transition layer is necessary to take into account a complex
interface between the silicon oxide layer and the OTS film
[21,33,34,38]. The structure of OTS monolayers which has
been investigated by FTIR-ATR spectroscopy, X-ray diffrac-
tion and X-ray reflectivity evidenced that OTS monolayers
were composed of close packed, generally vertical chains all-
trans extended [3]. As the total film thickness calculated from
the Qzmin is in agreement with a highly dense OTS monolayer
with alkyl chains in all-trans conformation [33,39], we have
performed constrained fits in which the length and the electron
density of the hydrocarbon chain was fixed to it expected
nominal values i.e. 0.316 e� A�1. The parameters which are
allowed to vary during the fit are therefore the thickness of the
OTS layer, the thickness of the silicon oxide layer, the
roughness of each interface and the transition oxide layer
parameters. The whole parameters are summarized in Table 1.
The fit yields roughness below 0.4 nm indicating the
presence of atomic-level smooth interfaces [33]. The thickness
of the silicon oxide layer was found to be 1.29 nm which was
in good agreement with the value proposed by Brzoska et al.
t
282 283 284 285 286 287 288 289 290
0
5000
10000
15000
20000
25000
285.0 eVC-C
Inte
nsity
[arb
. uni
ts]
Binding energy [eV]
(A)
282 283 284 285 286 287 288 289 290
0
2000
4000
6000
8000
10000
12000
14000
16000
288.7 eVCOO
287.4 eVC=O
286.1 eVC-O
285.0 eVC-C
Inte
nsity
[arb
. uni
ts]
Binding energy [eV]
(B)
Fig. 4. C1s-high resolution XPS spectra of (a) non treated OTS-film and (b)
CO2-plasma treated substrate (t =120 s).
0.0 0.1 0.2 0.3 0.4 0.5 0.6
10-11
10-10
10-9
10-8
10-7
10-6
10-5
10-4
20 s
90 s
210 s
120 s
60 s
0 s
30 s
R/R
F [a
rb. u
nits
]
Qz [A-1]
45 s
Fig. 5. Evolution of the Fresnel normalized X-ray reflectivity curves of OTS-
SAM deposited on silicon wafer with the CO2-plasma treatment duration.
N. Delorme et al. / Thin Solid Films 496 (2006) 612–618 615
for the typical thickness of the native silicon oxide layer on
silicon substrate (1.0–1.5 nm) [3,40]. The parameters obtained
for the transition layer (i.e. electron density and thickness) are
attributed to a complex interface between the silicon oxide
layer and the alkyl chains of the OTS monolayer [33].
Therefore, the fitting analysis of the X-ray reflectivity curve
provides a reliable measure of the thickness of the layers, the
electron density and interface roughness consistent with a
highly ordered OTS-SAM with fully extended hydrocarbon in
all-trans conformation [21,38,41].
The coverage of the monolayer surface was studied by AFM
(Fig. 2). RMS roughness determined from the AFM image
(180�180 nm) is found to be 0.15 nm indicating that, at this
scale, surface is smooth. The lack of default in a wider scale
(1�1 Am) confirms the high degree of homogeneity of the
OTS-SAM. Thus, this observation is consistent with the
Table 2
Total atomic percentage and C1s atomic percentage of the different carbon moieties
film
Plasma treatment time [s] Total atomic percentage [%]
Si [%] C [%] O [%] C
0 20 60 20 3.
20 19 59 22 2.
45 21 54 25 2.
60 22 51 27 1.
120 22 52 26 2.
210 28 46 26 1.
structural studies which clearly indicated the formation of a
dense and perpendicularly oriented OTS chains monolayer.
3.2. CO2-plasma surface modification of the OTS monolayer
Plasma containing oxygen species is a well-known tech-
nique to quantitatively introduce polar reactive groups onto
organic surfaces [42–44]. However, in order to chemically
modify the surface of the OTS monolayer, CO2-plasma was
preferred to O2 plasma because the degradation processes are
less efficient [13,45]. Four parameters can be monitored with
the plasma reactor used in this study: P the power, F the gas
flow, t the treatment duration and d the distance between the
bottom of the excitator and the sample. Parameters P and F
were chosen to be the most effective to introduce preferentially
hydroxyl (C–OH) and carboxyl groups (–COOH) onto
organic surface [42,45,46]. The distance ‘‘d’’ was kept to be
maximal (¨70 cm). Such positioning was expected to expose
OTS monolayer predominantly to radicals that are responsible
of the functionalization [47] and to avoid interaction with
electrons and ions responsible of the degradation that do not
exist in the post-discharge.
The effect of the plasma treatment was directly controlled
by contact angle measurement which is known to be sensitive
to the modification of the uppermost surface. The effect of the
plasma treatment onto the OTS monolayer was evaluated by
following the evolution of the water contact angle as a function
of the plasma treatment duration (Fig. 3). A decrease of the
water contact angle is observed since the first seconds of the
determined by XPS analysis versus the CO2-plasma treatment time on the OTS
Atomic percentage of C [%]
/O C–C [%] C–O [%] C_O [%] COO [%]
0 100 0 0 0
7 85 10 3 2
2 81 12 5 2
9 70 19 7 4
0 68 20 8 4
8 71 18 8 3
0 pm
978 pm
0 nm 50 100 150
0
50
100
150
0 pm
918 pm
0 nm 50 100 150
0
50
100
150
tplasma= 0 s
RRMS= 0.23 nm RRMS= 0.28 nm RRMS= 0.49 nm
tplasma= 120 s tplasma= 210 s
0 nm 50 100 150
0
50
100
150
832 pm
0 pm
Fig. 6. Evolution of AFM topography images and RMS roughness of monolayers as function of CO2-plasma treatment time (tapping mode—image
size=400�400 nm).
10-9
10-8
10-7
10-6
10-5
OTS+ plasma (t= 120 s)+ OTS
OTS+ plasma (t= 120 s)
R/R
F [a
rb. u
nits
]
OTS
N. Delorme et al. / Thin Solid Films 496 (2006) 612–618616
plasma treatment until treatment duration of 150 s, and then a
plateau is observed. Such variation can be assigned to the
progressive introduction of polar functions onto the monolayer
surface [13] leading, for the plasma duration of 150 s, to a
surface saturation with polar functions.
To check these results, surface chemical composition was
analyzed by X-ray photoelectron spectroscopy (XPS). Fig. 4
shows a comparison between two XPS spectra depicting the
differences of the surface chemical compositions before and
after a CO2-plasma treatment (t =120 s). After decomposition
of the XPS signal of the plasma treated monolayer, the
appearance of three components at 286.1, 287.4, and 288.7
eV can be observed corresponding to C–O, C_O, and COO
groups, respectively. Thus, XPS analysis confirms that CO2-
plasma introduces reactive polar groups onto the surface of the
OTS film. XPS analysis as a function of the plasma treatment
duration also indicates a progressive functionalization as
confirmed by water contact angle measurements. Indeed, Table
2 shows a progressive increase of the polar groups propor-
tions (C–O, C_O, and COO) with the treatment duration
until 210 s. For longer plasma treatments, there is a decrease
of the proportions of polar functions. This can be attributed to
the degradation of the monolayer surface, presumably caused
by fragmentation of chains containing polar groups. Since
after the plasma treatment the samples are transferred through
the laboratory atmosphere, a reaction between the plasma
modified OTS surface and the laboratory atmosphere cannot
be avoided. However, the clear dependency of the plasma
treatment time with the proportion of introduced groups
demonstrates that the effect of the reaction with the laboratory
atmosphere is not predominant for the surface modification.
Table 3
Evolution of the water contact angle at each step of the formation of the OTS
bilayer
Sample Water contact angle [-]
OTS monolayer 110 (T2)CO2-plasma treated (120 s) 72 (T2)
Second OTS layer 103 (T2)
The effect of the plasma treatment on the SAM has been
accurately controlled by X-ray reflectivity measurements. In
Fig. 5, it can be observed that for a treatment time below 120 s,
the position and the height of the first minimum are quite
similar. Such results indicate that under these conditions,
electron density and thickness of the plasma treated mono-
layers remain the same as the non treated one. This result
clearly indicates that until the treatment duration of 120 s, the
degradation of the monolayer may be negligible.
On the contrary, for plasma treatment times over 210 s
alterations of both height and position of the first minimum of
the reflectivity curve are observed indicating a decrease of the
monolayer electron density. The shift of the first minimum
towards low Qz wave vector transfers and the decrease of the
contrast are likely due to the decrease of the initial OTS
monolayer density and the polymerization of removed molec-
ular chains on the top-most surface. Consistently, the decrease of
the densities of polar groups observed by XPS measurements
was interpreted as the result of the degradation of the monolayer.
Surface structure of the plasma treated monolayer was
monitored using AFM. Topography images (Fig. 6) indicate
that the plasma treatment of 120 s does not significantly modify
0.0 0.1 0.2 0.3 0.4 0.510-11
10-10
Qz [A-1]
Fig. 7. The Fresnel normalized X-ray reflectivity curves of (a) the initial OTS
monolayer, (b) after CO2-plasma treatment (t =120s) and (c) after the grafting
of a second OTS layer.
N. Delorme et al. / Thin Solid Films 496 (2006) 612–618 617
the surface structure of the monolayer. Furthermore RMS
rugosities were comparable between plasma treated monolayer
(RRMS=0.28 nm) and the initial OTS monolayer (RRMS=0.23
nm); this support the previous conclusion that under these
conditions, the monolayer is not degraded by the plasma
treatment. On the contrary, AFM image of the 210 s plasma
treated monolayer shows morphological modification of the
surface with the appearance of hills and holes. This is
quantitatively evidenced by the large increase of the RMS
roughness (0.49 nm) which clearly proves a degradation of the
monolayer.
3.3. Grafting onto the CO2-plasma modified OTS monolayer
In order to prove the ability of grafting organic compounds
onto the plasma functionalized SAM, the grafting of a second
layer of OTS molecules was performed. Indeed, the presence of
C–OH and COOH groups onto the modified surface should
allow the grafting of alkoxysilane molecules [18,33]. The
evolution of the surface energy was studied by measuring the
water contact angle (Table 3).
The formation of a second layer of OTS molecules was
confirmed by X-ray reflectivity (Fig. 7) since the position of
the first minimum was shifted from 0.128 A�1 for the plasma
treated OTS monolayer to 0.65 A�1 after the deposition of the
second OTS layer. This shift correspond to an increase of the
thickness from 2.45 to 4.83 nm [21] confirming the presence of
a second OTS monolayer. Quantitative analysis of the X-ray
reflectivity curves and contact angle measurements have shown
that the second OTS layer is less organized than the first
monolayer. This is probably due to the random positioning of
the reactive groups introduced by the plasma treatment.
4. Conclusion
In this study, self-assembled OTS on silicon was used as a
platform to demonstrate the possibility to functionalize the
topmost surface of SAM deposited on silicon by CO2 plasma
treatment. In one hand, a combination of X-ray photoelectron
spectroscopy and contact angle measurements allowed to
monitor the surface modification of the OTS monolayer as a
function of the plasma parameters. On the other hand, the
control of the monolayer structure (density and thickness) by
a quantitative analysis of the X-ray reflectivity curves and by
the study of the surface topography using atomic force
microscopy have clearly shown a quantitative functionaliza-
tion of the topmost OTS monolayer without nanoscale
degradation of the highly organized organic structures.
Finally, the grafting of a second OTS layer onto the plasma
modified SAM has shown that this method should be suitable
for the grafting of a large number of organic compounds onto
SAMs.
Acknowledgment
This work was supported by the French PIR ‘‘Microfluidi-
que et Microsystemes fluidiques 2003’’ under projects
‘‘MI2F03-44’’. The authors thank E. Lepleux and L. Pacheco
for providing the AFM images.
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