N C H C IntelliSuite Capability Overview

N C H C

微機電設計模擬軟體微機電設計模擬軟體微機電設計模擬軟體微機電設計模擬軟體IntelliSuite

基礎訓練課程基礎訓練課程基礎訓練課程基礎訓練課程

v 8.0

姚志民姚志民姚志民姚志民

工程計算與推廣組工程計算與推廣組工程計算與推廣組工程計算與推廣組

2006 / 08/ 1-2

IntelliSuite v8.0 22

IntelliSuite Capability Overview

� Process Construction� Visualization

� Process Check

� Layout Builder (IntelliMask)

� Layout Import/Export (GDS

II & DXF)(IntelliMask)

� Model Construction� Process Builder

� Manual 3D Mesh Geometry

Builder (3D Builder)

� Geometry 3D Manipulator

� ANSYS/PATRAN/I-DEAS

Import/Export

� Analysis

� ThermoElectroMechanical

Analysis

� Microfluidic Analysis

� Electromagnetic Analysis

� Anisotropic Etch (AnisE)

� Database

� Material Database (MEMaterial)

� (Fabrication Database)


Types of Deposition

� Top, Bottom, BothSpecial Type of

Deposition: Doping and

Electroplating

Note: If you have etched a

structure all the way through

(e.g., a big hole from the top to

the bottom) and are doing

conformal deposition on one

side, be sure the other side is

flat (i.e., the coordinates of all

the points around the opening

have the same z-coordinate).

The thickness of a planarization layer

is measured from the highest point in

the lower topography.


Etching

� Process removing films from the substrate

� Processes: acid etches, solvent etches, cleaning

� Three types of etching

• Etching through

• Partial Etching

• Sacrifice

� Sacrifice

• (setting depth of the etching (t_etch)≥1,000,000)

� Partial etching

• etching the depth to specified in t_etch

� Etch all the way through the film

• setting t_etch ≥ film thickness or = 990000

� Cleaning (no effect on the geometry)

� The wafer side (top, bottom, or both) is also specified.

若是要蝕刻的材料，

在etch原本提供的材

料沒有提供，則要新

增Etch的材料，或是

更改沉積的材料


Geometry Menu

� Construct

� If an analysis file is currently open, a dialog window will pop up showing the temporary filename for the analysis file that was just open. When the user clicks OK, the 3D Builder will open with thesame model. Loads and Boundary conditions must be reassigned after using the 3D Builder. If no analysis file is currently open, a blank 3D Builder window will open.

� Manipulate

� Open the Geometry3D Window

� Note: Loads and Boundary conditions must be reassigned after using the Geometry Manipulator module


Static Analysis Options


Static Analysis Options (cont.)


Frequency Analysis Options


Dynamic Analysis Options


Dynamic Analysis Options (cont.)


MEMaterial Introduction

� It is a powerful, easy-to-use simulation tool for the mechanical,

electrical, and optical modeling of thin films deposited on silicon

substrates.

� The software presents data on the properties of materials in two- and

three dimensional graphs as well as in tables. Using a wealth of

experimental data from respected sources, the software applies

IntelliSense’s unique multi-dimensional estimation and optimization

routines to calculate material property values for any combination of

parameters.

� With MEMaterial, you can

� simulate material behavior prior to fabrication

� add proprietary data

� get values of the property of interest for any combination of parameters

� Find maxima/minima

� View graphically the fabrication dependence of material properties

� Determine the nearest experimental points


To open a material file

� File … Open Select one material with

property and technology by

Category or File Name

Double Click to Select


Single Value Procedure

Click the value number to change to the desired

number and press Enter key


2D & 3D Graph Procedures

1. Select Type of View

� View … 2D Graph or 3D Graph

Ctrl + Click to select

two parameters

(4. Update Values)2.

3.


2D Graphic

� The red diamonds are all of the experimental points available for that data

combination. They are in the third dimension according to a variety of the

other parameters so they will not necessarily line up with the 2D graph.


3D Graphic

Click and

Drag to

Rotate


Experimental Points and References

Scroll

down


AnisE: Anisotropic Etching Simulator

Top mask file:

Name.simt.msk

Bottom mask

Name.simb.msk

Note: When using

Layout…Import… to

import mask, the file

name will be the same

the imported file.

Layout figures must

be on first quadrant


3D View and View…View Profile 3D

View Profile 3D

3D View


3D Builder

� To build and mesh 3D geometry of MEMS structures.

� To generate geometry model based on direct input from the user,

which is independent of how the device is fabricated

� an easy-to-use graphical user interface and is seamlessly integrated

with other IntelliSuite modules.

� In practice, the fabrication builder is more automated while the

Interactive3D Builder is more flexible, as it can handle devices with

more complex geometry.

� Mask data files in DXF and GDS-II format or internal format can be

imported to both builders for geometry model construction.

� Build layer by layer; Element by Element; Floor and Ceiling

� The 3D Builder uses all figures from all layers of an open *.msk file.

Also, all *.msk files opened in the 3D Builder will revert to one layer

including all figures from all levels. To prevent this, save only the

needed layers in the *.msk file


Building Concept

Partition horizontal and

vertical levels and entities

Entities: May be treated as

Materials

Building Procedure:

1. Select the level and entity

2. Draw the 4 node elements

(Grid pt, Element pt, Mask

pt or Keyboard)


Geometry (Mesh) Manipulation

This allows for the rotation and

translation of the selected elements.

This allows you to

specify the relative

angle between two

areas of the structure.


IntelliMask

Control…Show Toolbars

Tools > Mask point coordinatesTools > Distance (2 points)

N C H C IntelliSuite Capability Overview

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