HB Automation product overview - Hilpert electronics

Product overview Reflow and wave soldering

2 HB Automation product overview

HB AUTOMATION

HB Automation product overview 3

The global SMT market is un-dergoing constant change and requires continuous adaptation. Together, we can keep up with this ever-changing industry.

About HB Automation

Based in the heart of Shenzhen, China, HB Automation produces more than 100 machines a month, employing around 200 people in a factory with an area of over 10,000 square meters. The company is one of the leading suppliers of soldering systems in Asia.

Using its many years of experience, HB Automation always works closely with its customers in order to fulfil both current and future market requirements.

The company bases its processes on current standards: It is certified in accordance with ISO-9001 and all machine types conform to the CE standard.

HB AUTOMATION


We want our products to sup-port you in your everyday work. Our incentive is to ensure you benefit.

Reflow

• Special insulation/zone concept for optimal temperature constancy

• Independent regulation of the convection zo-nes enables flexible profile control

• Energy-efficient design to reduce energy con-sumption

• Condensation filter in the cooling zone for ef-ficient waste air purification

• Five-year guarantee on heating elements and fan motors

Wave

• Titanium alloy finger conveyor for safe hand-ling of PCBs

• Economic use of flux thanks to application via spray valves

• Pre-heat tunnel has independent zones for variable preheating

• Durable double-wave solder bath made from a titanium alloy

• Five year guarantee on heating elements, fan motors and the solder bath

You will benefit immediately from good-value products, innovative technology and a reliable after-sales service.

The soldering systems from HB Automation offer the following advantages:

Perfect partners: HB Automation & Solderstar

• Data loggers for all soldering processes (wave, reflow, selective or vapour phase soldering systems)

• Compact size, suitable for ovens with low tunnel heights

• Variable number of measuring channels (max. 16)

• Smartlink interface to ensure rapid connection

• Highly temperature resistant USB rechargeable batteries

• Data transfer via USB cable or radio communication

• High level of heat insulation in the shuttle

• Solderstar software supplies process data, profile analyses and statistics, and offers a simulation function


Reflow ovens in the HS seriesCost-effective solution for medium-sized businesses

The HS series enables a stable and reproducible reflow process.

The modular design allows rapid and simple access to the system, which reduces operating costs.

HB Automation reflow ovens meet the more stringent requirements of a lead-free process.

HB AUTOMATION


Optional:

• Nitrogen preparation

• Full nitrogen system

• Water cooling

• Centre support

• Automatic adjustment of transport width

• Double-track transport

Spezifications

Model HS-0601 HS-0802 HS-1002 HS-1202

Dimensions in mm (L x W x H) 3,600 x 1,383 x 1,490 5,310 x 1,353 x 1,490 6,100 x 1,353 x 1,496 6,915 x 1,353 x 1,496

Weight (approx.) 1,325 kg 2,200 kg 2,400 kg 2,600 kg

Number of heat zones Top 6 + bottom 6 Top 8 + bottom 8 Top 10 + bottom 10 Top 12 + bottom 12

Length of heat zones 2,359 mm 3,121 mm 3,891 mm 4,706 mm

Nozzle plates Aluminum plates (8 mm)

Number of cooling zones Top 1 Top 2

Length of cooling zones 500 mm 900 mm

Cooling process Forced-air cooling (optional: water cooling)

Extraction volume 2 x 10 m3/min

Control system

Electrical connection Three-phase, 380V 50/60Hz

Start-up/warm-up power 26 kW 28 kW 34 kW 38 kW

Normal power consumption 7 kW 9 kW 10 kW 11 kW

Warm-up time 30 minutes (approx,)

Temperature range Ambient temperature up to 300° C

Temperature control +/- 1.0° C

Temperature deviation on the PCB +/- 1.5° C (HB test standard)

Transport system

Max. PCB width 400 mm (optional: 610 mm)

Transport width 50 - 400 mm (single track, optional: 50–610 mm)

Max. component height Top/bottom: 25 mm

Conveyor method Chain and mesh (optional: chain and centre support)

Speed/direction 300–2,000 mm/min/L to R (optional: R to L)

Transport height 900 mm (+/- 20 mm)

Chain lubrication Automatic (standard)

Features

Up to 12 heat zones

Forced air cooling with two cooling zones (optional: cooling zone at the bottom)

Motor-driven adjustment of transport width

Energy-efficient overall design

Automatic transport lubrication

Waste air system with quick-change filters

SMEMA interface

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Reflow ovens in the TP series Energy-efficient high-end solution for increased requirements

The TP series guarantees a high level of productivity and availability, even when used in 24/7 three-shift operation. The basic equipment supplied with the machines includes more standard functions than is common on the market.

Our heating elements developed in-house reach the desired temperature quickly and respond immedia-tely to changes in temperature. This means that deviations are counterbalanced immediately.

All TP convection ovens are designed to reduce the ΔT on the PCB, and to handle the increased tempera-ture requirements of lead-free processes.

Perfect partners: HB Automation and Alpha®

Alpha offers a full line of technologically advanced solder pastes developed to provide high throughput and yield, for a wide range of applications. The range includes leading lead-free, no-clean, halogen-free solder paste technologies for applications such as fine feature printing, low temperature processing, and many others.

Alpha solde paste delivers:

• Excellent print definition and consistent volumetric performance

• Outstanding reflow process window

• High compatibility

• Long tack and stencil life

HB AUTOMATION


Spezifications

Model TP-0803 TP-1003 TP-1203

Dimensions in mm (L x W x H) 5,580 x 1,400 x 1,520 6,370 x 1,400 x 1,520 7,185 x 1,400 x 1,520

Weight (approx.) 2,600 kg 2,800 kg 3,000 kg

Number of heat zones Top 8 + bottom 8 Top 10 + bottom 10 Top 12 + bottom 12

Length of heat zones 3,125 mm 3,895 mm 4,710 mm

Nozzle plates Aluminium plates (8 mm with coating)

Number of cooling zones Top 3 + bottom 3

Length of cooling zones 1,350 mm

Cooling process Forced-air cooling (optional: water cooling)

Extraction volume 2 x 10 m3/min

Control system

Electrical connection Three-phase, 380 V, 50/60 Hz

Start-up/warm-up power 28 KW 34 KW 38 KW

Power consumption 7 KW 8 KW 9 KW

Warm-up time 30 minutes (approx.)


Temperature control +/- 1.0° C

Temperature deviation on the PCB +/- 1.5° C (HB test standard)

Transport system

Max. PCB width 400 mm (optional: 610 mm)

Transport width 50–400 mm (single track, optional: 50–610 mm)

Max. component height Top/bottom: 25 mm

Conveyor method Chain and mesh (optional: chain and centre support)


Transport height 900 mm (+/-20 mm)

Chain lubrication Automatic (standard)

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Features

Up to 12 heat zones

Forced air cooling with three cooling zones (top and bottom)

Highly energy-efficient overall design

Automatic transport lubrication

Innovative multi-phase temperature management

Powerful waste air system with quick-change filters

SMEMA interface

Optional:

• Nitrogen preparation


• Water cooling

• Centre support


• Double-track transport

Lead-free wave soldering machines in the HW seriesAn intelligent concept that has everything you need

The reliable double-wave soldering machines in the HW series are immediately available for production applications in their standard configuration.

An economical flux system guarantees an even application of flux.

The modular design of the preheating elements makes maintenance easy.

The independent temperature and speed control systems ensure a high level of flexibility.

The titanium double-wave solder bath is durable and corrosion-resistant.


Perfect partners: HB Automation and Alpha®

Alpha solder bars for the wave soldering process ensure a reliable solder connection. There are many different alloys to choose from, with comprehensive product guidelines guaranteeing consistent soldering bath quality.

Alpha solder delivers:

• High purity

• Good wetting

• Low oxides, low drossing

• Vaculoy® process during production ensures a longer service life and a clean wave

HB AUTOMATION

Optional:


• Centre support


• Ultrasonic fluxer

• Air curtain

• IR preheating (top/bottom)

• USV

Features

Compact wave soldering machine

Titanium alloy finger transport

Motor-driven adjustment of transport width

Economical spray fluxer

Three independent preheating zones

Double-wave solder bath

SMEMA interface


Spezifications

Model HW-350 HW-450

Dimensions in mm (L x W x H) 4,430 x 1,620 x 1,710

Weight (net) 2,300 kg 2,600 kg

Number of preheating zones Bottom 3 (optional: Top 3, IR)

Length of preheating zones 1,800 mm

Preheating process Hot air (optional: IR)

Cooling zone Bottom 1

Length of cooling zone 305 mm

Cooling process Forced-air cooling

Extraction volume 25 m3/min

Flux system Spray fluxer (standard), optional: ultrasonic

Control system

Electrical connection Three phase, 380V 50/60Hz, 63A

Power consumption 12 kW 12 kW

Warm-up time for preheating 15 minutes to reach 150° C (approx.)


Solder bath Titanium alloy (standard)

Warm-up time for the bath 180 minutes to reach 250° C (approx.)

Bath temperature Up to max. 300° C

Bath capacity 480 kg 550 kg

Transport system

Max. PCB width 350 mm 450 mm

Transport width 60 - 350 mm 60 - 450 mm

Max. component height Top/bottom: 120 mm/15 mm (optional: 160 mm)

Conveyor method Titanium fingers (V/L)


Transport height 750 mm (+/- 20 mm)

Transport angle 4 - 7°

Finger cleaning system Brushes (standard)

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Your distribution partner:

Hilpert electronics AGTäfernstrasse 29CH-5405 Baden-DättwilTel: +41 56 483 25 25Fax: +41 56 483 25 [email protected]

© 2017-07 Hilpert electronics. All information subject to change. We accept no liability for printing errors or changes to technical data.

HB Automation product overview - Hilpert electronics

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