INTERFLEX An Energy Autonomous and Wireless System-in ...

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INTERFLEX

INTERFLEXAn Energy Autonomous and Wireless

System-in-Foil for Air Quality Monitoring

Matthias Mahlich, Metin KoyuncuRobert Bosch GmbH

Corporate Research, Waiblingen, Germany

www.project-interflex.eu, [email protected]

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Call: ICT-2009.3.3 b) Flexible or foil-based systems

Funding scheme: STREP

Proposal Acronym: Interflex (www.project-interflex.eu)

Duration: 36 Months

Project start: 01.01.2010

Interconnection Technologies for Flexible SystemsINTERFLEX

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INTERFLEX

Project Objectives Development of reliable assembly and interconnection technologies

for foil based electronic systems: Interconnection technologies between flexible components and

flexible foils as well as between functional foils. Three dimensional functional foil integration to achieve multi-foil

based systems, i.e. system-in-foil.

Demonstration of the developed technologies with an energy autonomous, indoor air quality sensing system capable of wireless communication of the measured data. Bendable to a bending radius of ½ its maximum dimension

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INTERFLEX

Outline

Future electronics: not only “more Moore”

Achieving Higher Packaging Density

Emerging Technologies: Polytronics and System-in-Foil

Integration Technologies for a System-in-Foil

Process-Flow for a System-in-Foil

Summary

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INTERFLEX

Moore’s Law and More

“More than Moore” component of the industry evolution is expected to increase

Research in diverse fields is necessary for sustaining the innovation Components, Materials, Processes, Integration concepts

SOURCE ITRS 2009

Sense, interact, empower

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INTERFLEX

System-in-Foil Hardware based on flexible foil substrates,

flexible components and compatible interconnects, that offers a high functional integration, high packaging density and mechanical flexibility.

Integration of components onto the foils and foil-to-foil integration plays a key role in the realisation of a system-in-foil.

System-in-foil offers a high potential for seamless integration of electronics onto non-planar surfaces and everyday objects.

Source: Holst Center

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Interconnection Technologies for a System-in-Foil


INTERFLEX

www.project-interflex.eu

Battery

Lamination

Power management

Antenna

SensorsTR.H.

CO2

DewµC

Tx

IC

ICWL

ConformableEnergy

Sensing

Communication

Photo-voltaics

IC: Integrated Circuit µC: Microcontroller

Wiring Layer (Printed Circuit Foil)

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INTERFLEX

Components of a System-in-FoilComponent Type

Components

Integrated Circuit Bare Die (<50µm)

Foil Component Battery, Solar cell, Sensors, OTFT, OLED

Wiring Layer / Printed Circuit Foil

Foil with already integrated foil components: “heterogeneously” and/or “homogeneously”

SMDsDiscrete transistor, capacitor, quartz, inductor, resistor

SMD: Surface Mount Device OLED: Organic Light Emitting DiodeOTFT: Organic Field Effect Transistor SMD: Surface Mount Device

Flexible PV array

Thinned Silicon Wafer

Flexible Sensors

Sensor Array on Foil

Thin Film Battery

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INTERFLEX

Energy autonomous air quality monitoring system with wireless data transfer capability.

Schematic Layout of the INTERFLEX DemonstratorVia connections

PEN / 50µm

PI / 50µm

PI / 50µm

(PEN / 50µm)

WL: Wiring Layer (Printed Circuit Foil)

SMD

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Layout – INTERFLEX Demonstrator


INTERFLEX

WL1 top side WL1 bottom side

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WL2 top side


INTERFLEX

Integration of Thin ICs

IC: Integrated CircuitWL: Wiring Layer

Wafer with Cu-pillars on blue tape Backgrinding to a wafer thickness ≤ 25µm and

subsequent plasma etching for stress release Mechanical and electrical integration onto

the WL in one step Pick and Place onto the WL with Die-Bonder

machine with adhesive either on WL or adhesive on the wafer/die

Curing of die adhesive for short time at elevated temperature and pressure

Cure shrinkage of die adhesive ensures electrical/mechanical contact of Cu-pillar onto foil pad

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INTERFLEX

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Majority of SMD are of 0402 size and all are on the backside of WL1 Assembly process flow consists of

jet dispensing ICP on layout pad positions followed by pick&place of components curing of ICP in box furnace

WL: Wiring Layer ICA: Isotropic Conductive Adhesive

Layout for ICP dispense and SMD place positions

Placed 0402 components

Used SMD Components

Example of ICP jetting

Heterogeneous Integration of SMD

Integration of Foil Components and Wiring Layer


INTERFLEX

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Video camera flexible in x/y direction

Wafer frame carries foil componet to be placed

Magnetic holder

Vacuum chuckadjustable in x, y, direction

• aligned lamination of 2 WLs with identical copper pattern• determination of shift between top to bottom WL in x/y-direction @6 positions• misalignment in x/y-direction better than 100μm


INTERFLEX

Integration of Foil Components onto a WL Photovoltaic Arrays based on a-Si Thickness including encapsulation ~200µm Mechanical integration onto WL using PSA Electrical integration using ICA Process: Jetting of conductive adhesive

WL: Wiring Layer ICA: Isotropic Conductive AdhesivePSA: Pressure Sensitive Adhesive

Height (mm)

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INTERFLEX

Integration of Foil Components onto a WL

WL: Wiring Layer TFB: Thin Film BatteryPSA: Pressure Sensitive Adhesive ACF: Anisotropic Conductive Film

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Battery Module with 8 TFB Pick/Place&Seal-ToolMounted TFB and X-section of bonding region

PSA

ACF

Preparation of WL: ACF is prebonded onto terminals with low force and temperature Application of PSA for battery fixation

Singulated TFBs are picked, placed, terminals are downbended and curing in one run with special designed tool


INTERFLEX

Foil-to-Foil Electrical Integration Interconnection between WLs Mechanical Integration ensured by

adhesives, e.g. PSA Electrical interconnection via

conductive adhesive or conductive ink Jetting of conductive paste or ink Screen printing conductive paste Good mechanical resistance to bending stress

WL: Wiring Layer ACF: Anisotropic Conductive FilmPSA: Pressure Sensitive Adhesive

Examples of via filled with conductive adhesive

Wiring LayerFoil Component

Jet

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Process Challenges


INTERFLEX

Variety of surfaces to be contacted, in some cases using one material.

Mechanical and electrical contacts between foils by 3D-Integration.

Wetting Envelope - Substrat für OFET - DuPontQ65FA - beschichtete Seite - O2 vs. Ar Plasma mit O2/N2 Spülgas

0

10

20

30

40

50

60

0 10 20 30 40 50

Disperse Component (mN/m)

Pol

ar C

ompo

nent

(mN

/m)

unbehandelt (0°)

O2-Plasma+O2 Spülgas(0°)

O2-Plasma+N2 Spülgas (0°)

Ar-Plasma+N2 Spülgas (0°)

Ar-Plasma+O2 Spülgas (0°)

Ar-Plasma+N2 Spülgas+Ethanol (0°)

Plasme treatment

Handling of flexible and diverse components

Entire assembly process in one equipment?

Integration of diverse components from 0.5 mm2

Si-ICs to 3000mm2

photovoltaic arrays onto wiring layers.

Flexible PV array

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Challenge of Emergence: System-in-Foil


INTERFLEX

System Design and Architecture

Application Materials (Substrates, Interconnects)

Components (rigid -> flexible)

Processes (2D / 3D-Heterogeneous Integration)

Specifications

Standardization

Testing

System

Components: Compatibility with processes and interconnects, performance on flexible substrates, performance in fieldMaterials: Substrates and interconnects compatible with processes and componentsProcesses: Handling, Speed, Roll-to-Roll compatibility, PET/PEN compatible, Key element in reducing the cost

Supply chain Testing and

Qualification What is flexible? What is conform?

COST!

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INTERFLEX

Summary System-in-foil offers

Very high functional integration Very high packaging density High potential for seamless integration into everyday life

Still open questions Components Materials and process flow of 2D and 3D integration Supply chain

Interaction between system designers, component developers and processing has to start at a very early stage

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INTERFLEX An Energy Autonomous and Wireless System-in ...

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