Usage example of the Simcenter Flotherm model

©KOA CORPORATION

This document is subject to change without advance notice.Please contact our sales offices for more detail. URL : https://www.koaglobal.com/tech_support/productsFormFor reproduction of any part of the document, you are required to approve the disclaimer in the following URL: https://www.koaglobal.com/utility/disclaimer_TecDoc?sc_lang=en

USER GUIDE

www.koaglobal.com

1. SummaryWe will provide the thermal network model of resistors produced by KOA which can be used in thethermal fluid simulator Simcenter Flotherm.This model is developed based on the shape, materialand thermophysical property value of the resistor and the resistive element temperature andterminal part temperature can be calculated. The model data can be downloaded from our webpage.Web page URL:http://www.koaglobal.com/design_support_tools/flothermIn this paper, the overview and how to use the model is explained.

Fig.1 Image of analysis result using the thermal network model

Usage example of the Simcenter Flotherm model

Issued by:2020/03/31 No.KES-200331_2_HP1

Thermal fluid simulator Simcenter Flotherm

Thermal network model of resistors produced by KOA

©KOA CORPORATION


www.koaglobal.com

USER GUIDE

www.koaglobal.com

2

2. Model descriptionThermal network model of TLR and SL series are used as an example to explain the model nameconstitution and grid condition formed on the periphery.

2.1 Model name constitutionThe model name is consisted of 4 items; product code, power rating, nominal resistance and TCR(Fig.2). Please confirm the model name and select the relevant model in Simcenter Flotherm.

Fig.2 Model name constitution

Table 1. Comparison of model name and KOA part number

Product catalogue can be accessed fromURL:https://www.koaglobal.com/product

Model name constitutionKOA TLR 3AW 0.5m 150ppm

Product Power Nominal TCRcode rating resistance

Simcenter Flotherm Component library

Productcode

Power rating

Terminal surface material

TapingNominal

resistanceΩ

Resistance tolerance TCR

Model name TLR 3AW (Omitted) (Omitted)

0.5m2m10m

(Omitted) 150ppm

KOAPart

numberTLR 3AW D TD

L5002L0010L0

F 150

Issued by:2020/03/31 No.KES-200331_2_HP

©KOA CORPORATION


www.koaglobal.com

USER GUIDE

www.koaglobal.com

3

2.2 Model structureModel structure is explained with the example of TLR and SL series.

2.2.1 Model structure of TLR seriesTLR3AW is used as an example to explain the model structure of TLR series in Fig.3.This model structure is consisted of each network nodes (Resistive element, Electrode 01～04,Surface 01～10) set inside the network assembly (KOA TLR3AW0.5m150ppm). Each network nodeis connected by the function of the network assembly and form the thermal network shown inFig.5. Each network node correspond to each part shown in Fig.4 to 5. As shown in Fig.3,monitoring points (Resistive element temp. and terminal part temp.) are set to output the resistiveelement temperature and terminal part temperature.

At the time of analysis, please set the coordinate where the model is set in the network assemblyand set the heat generation amount of resistor in the network anode Resistive element. Pleaserefer to page 8 to 9 for how to use the model.

Fig.3 Model tree structure of TLR3AW0.5m150ppm

(Example) Model of TLR3AW0.5m150ppm Network assembly➣Coordinate of where to set the model (Enter)➣Thermal resistance and capacity (Already set)

Network node: Resistive element➣Generated heat of resistor (Enter)➣Monitoring point for output of resistive

element temperatureResistive element temp (Already set)

Each network node set inside network assembly

Network node: Electrode01➣ Monitoring point for output of terminal

part temperatureTerminal part temp (Already set)


©KOA CORPORATION


www.koaglobal.com

USER GUIDE

www.koaglobal.com

Surface03, Surface06-10: Node for calculating the heat dissipation from the resistor surfaceinto the ambient environment

Surface01-02, Surface04-05:Node for calculating the heat dissipation from the resistorelectrode into the circuit board model

Fig.4 Detailed model structure of TLR3AW0.5m150ppm (Surface)

R1, R2 : Thermal resistance [K/W] determined by the shape of the resistor andthermophysical property of the material

C1 : Thermal capacity [J/K] determined by the shape of the resistor andthermophysical property of the material

r : Thermal resistance [K/W] necessary for the calculation *fixed at 0.1[K/W]Fig.5 Detailed model structure of TLR3AW0.5m150ppm (Internal)

4

R2 R2

Circuit board model such as FR-4

Network node: Resistive elementHeat generation amount of resistor (Enter)Monitoring point for output of resistive element temperature: Resistive element temp (Already set)

Surface01 Surface02 Surface04 Surface05

Surface06 Surface07 Surface09 Surface10Surface08

Surface03

Electrode02 Electrode03Electrode04

C1

Setting of heat generation amount

Network node: Electrode01Monitoring point for output of terminal part temperature : Terminal part temp (Already set)

r r

rr

r

r

r r

rr

Surface02Surface03

Surface04Surface05

Surface01

Surface08Surface09

Surface10

Surface07Surface06Model (Top side) Model (Bottom side)

Environment temperature


©KOA CORPORATION


www.koaglobal.com

USER GUIDE

www.koaglobal.com

2.2.2 Model structure of SL seriesSL1 is used as an example to explain the model structure of SL series in Fig.6.This model structure is consisted of each network nodes (Resistive element, Electrode 01～04,Surface 01～10) set inside the network assembly (KOA SL1 100m100ppm). Each network node isconnected by the function of the network assembly and form the thermal network shown in Fig.8.Each network node correspond to each part shown in Fig.7 to 8. As shown in Fig.6, monitoringpoints (Resistive element temp. and terminal part temp.) are set to output the Resistive elementtemperature and terminal part temperature.

At the time of analysis, please set the coordinate where the model is set in the network assemblyand set the heat generation amount of resistor in the network node Resistive element. Please referto page 8 to 9 for how to use the model.

Fig.6 Model tree structure of SL1 100m100ppm

5

(Example) Model of SL1 100m100ppmNetwork assembly➣Coordinate of where to set the model (Enter)➣Thermal resistance and capacity (Already set)

Network node: Resistive element➣Generated heat of resistor (Enter)➣Monitoring point for output of resistive

element temperatureResistive element temp (Already set)

Each network node set inside network assembly

Network node: Electrode01➣ Monitoring point for output of terminal

part temperatureTerminal part temp (Already set)


©KOA CORPORATION


www.koaglobal.com

USER GUIDE

www.koaglobal.com

Surface01-02: Node for calculating the heat dissipation from the resistor surfaceinto the ambient environment

Surface03-04: Node for calculating the heat dissipation from the resistorelectrode into the circuit board model

Fig.7 Detailed model structure of SL1 100m100ppm (Surface)

R1 : Thermal resistance [K/W] determined by the shape of the resistor andthermophysical property of the material

C1 : Thermal capacity [J/K] determined by the shape of the resistor andthermophysical property of the material

r : Thermal resistance [K/W] necessary for the calculation *fixed at 0.1[K/W]

Fig.8 Detailed model structure of SL1 100m100ppm (Internal)

6

Surface02

Surface03

Surface04

Surface01

Model (Top side) Model (Bottom side)

Circuit board model such as FR-4

Surface03 Surface04

Surface01

Surface02

Electrode02

C1

Setting of heat generation amount

r

r

r r

Environment temperature

Network node: Resistive elementHeat generation amount of resistor (Enter)Monitoring point for output of resistive elementtemperature: Resistive element temp (Already set)

Network node: Electrode01Monitoring point for output of terminal part temperature:Terminal part temp (Already set)


©KOA CORPORATION


www.koaglobal.com

USER GUIDE

www.koaglobal.com

7

2.3 About the grid formed when the model is laid outThe grid condition when the model is laid out on the circuit board is shown in Fig.9. This modelsets the minimum condition of the local grid in the network assembly. Based on the specificationof Simcenter Flotherm, the grid is automatically formed along the edge of Resistive element andElectrode. However, please set the additional grids as needed.

Fig.9 Grid condition after setting the model

Electrode02

Resistive element

Electrode03 Electrode04Electrode01

Resistive element

Grid is formed along the edge of Resistive element and Electrode

X

Z

X

Y

Grid


©KOA CORPORATION


www.koaglobal.com

USER GUIDE

www.koaglobal.com

3. How to use the model

3.1 Model layoutSelect the network assembly of the relevant product from the model tree and enter the coordinateto set the model (Fig.10). The reference position of this model is set at the center of the undersurface (Fig.11).

Fig.10 Model layout setting

Fig.11 Reference position of the model

8

Reference position of model(X, Y, Z)

X

Y

Z

L dimension*Long side

Model: W dimension*Short side

t dimension*Thickness

Under surface of model

X

Y

Z

Under surface of model

Model tree of TLR3AW0.5m150ppm

Open the layout tab and enter the coordinate of model layoutSelect network assembly


©KOA CORPORATION


www.koaglobal.com

USER GUIDE

www.koaglobal.com

9

3.2 Setting heat generation amount of resistor

Select the network node Resistive element from the model tree and enter the heat generatingamount of the resistor (Fig.12).

Fig.12 Setting of heat generating amount given to the model

Select setting tab and push the edit button of the heat column.

Enter arbitrary value to the heat generating amount in the attribute data tab.

Model tree of TLR3AW0.5m150ppm

Select network node Resistive element.


Usage example of the Simcenter Flotherm model

Documents

Transcript of Usage example of the Simcenter Flotherm model