Occupancy Sensor Node Reference Design Board User's Guide

© 2016 NXP B.V.

Occupancy Sensor Node Reference Design

Board User's Guide

1. Introduction

This guide describes the NXP reference design board

Occupancy Sensor Node. The Occupancy Sensor Node

circuit board provides a diverse reference design with

all necessary I/O connections to use as a self-contained

board or for connection to an external application.

The Occupancy Sensor Node board is built on NXP's

KW2xD wireless platform. The KW2xD wireless MCU

is a 2.4 GHz Industrial, Scientific, and Medical (ISM)

single-chip device intended for the IEEE® Std. 802.15.4,

including Thread©, ZigBee® Pro, ZigBee RF4CE, and

IPv6/6loWPAN protocols.

The Occupancy Sensor Node board contains the

MKW24D512 wireless MCU that works in conjunction

with a software stack to implement an IEEE Std.

802.15.4 platform solution.

NXP Semiconductors Document Number: OSNRDBUG

User's Guide Rev. 0 , 06/2016

Contents

1. Introduction .................................................................... 1 1.1. Audience .............................................................. 2

2. Board Overview and Description ..................................... 2 2.1. Board features ...................................................... 2

3. Occupancy Sensor Node Reference Design Board ............ 4 3.1. Functional description ........................................... 4 3.2. Schematic, board layout, and bill of material ........ 10

4. PCB Manufacturing Specifications ................................ 15 4.1. Single PCB construction ..................................... 15 4.2. Panelization ........................................................ 16 4.3. Materials ............................................................ 16 4.4. Solder mask ........................................................ 17 4.5. Silk screen .......................................................... 17 4.6. Electrical PCB testing ......................................... 17 4.7. Packaging ........................................................... 17 4.8. Hole specification/tool table ................................ 17 4.9. File description ................................................... 17

5. Revision History ........................................................... 18

Board Overview and Description

Occupancy Sensor Node Reference Design Board User's Guide, Rev. 0, 06/2016

2 NXP Semiconductors

1.1. Audience

This manual is intended for system designers and system engineers.

2. Board Overview and Description

The Occupancy Sensor Node board is based on the KW2xD Wireless MCU family of products which

incorporates a complete low-power IEEE Std. 802.15.4, 2.4 GHz radio frequency transceiver.

The Occupancy Sensor Node platform contains the MKW24D512 device with 32 MHz reference

oscillator crystal, RF circuitry including antenna, a 6-axis sensor with integrated linear accelerometer

and magnetometer, an EEPROM, an occupancy sensor and supporting circuitry in a reduced form factor

board. The board is a standalone and supports applications developed for IEEE Std. 802.15.4

applications.

2.1. Board features

The Occupancy Sensor Node reference design board contains the MKW24D512 device and is used to

demonstrate and evaluate the available features of the KW2xD platform in a reduced form factor board

with a specific application taking advantage of the KW2xD low-power capabilities, USB module and

NXP Combo sensor. It is powered by a Lithium-ion Rechargeable Cell Battery or via USB.

Figure 1 shows the Occupancy Sensor Node reference design board.

Figure 1. Occupancy Sensor Node reference design board

The Occupancy Sensor Node reference design board includes the following features:

• The NXP low-power Kinetis MKW24D512 wireless MCU

• Full IEEE Std. 802.15.4 compliant wireless node; Thread capable

Board Overview and Description


NXP Semiconductors 3

• Reference design area with small footprint, low-cost RF node

— RF circuitry includes a Balun to convert the differential I/O pin of the MKW24D512

transciever to single-ended for on-board signal routing

— Low off-chip component count

— Programmable output power from -35 dBm to +8 dBm

— Receiver sensitivity: -102 dBm, typical (@1 % PER for 20 byte payload packet)

• Integrated PCB meander horizontal antenna

• 32 MHz reference oscillator

• 32 kHz clock oscillator

• 2.4 GHz frequency operation (ISM Band)

• Cortex 10-pin (0.05 inch) JTAG/SWD debug port for target MCU

• 1 RGB LED indicator

• 2 interrupt push button switches

• 1 FXOS87000CQ combo sensor

• 1 Coin Cell battery holder

• 1 Occupancy Sensor

• 1 EEPROM

• 1 Battery Charger

• 1 micro-USB connector

• 1 on/off switch

Figure 2 shows the main board features of the NXP Occupancy Sensor Node board.

Figure 2. Occupancy Sensor Node reference design components

PCB antenna

Reset switch

SWD connector

On/Off switch

Battery charger

FXOS8700CQ

Application switches

Micro-USB connector

RGB LED

EEPROM

32MHz Crystal

MKW24D512

Occupancy Sensor Node Reference Design Board



3. Occupancy Sensor Node Reference Design Board

The Occupancy Sensor Node board is a reference design based on the NXP KW2xD Wireless MCU.

The core device is accompanied by a 32 MHz reference oscillator crystal, RF circuitry including a PCB

antenna (and supporting circuitry), accelerometer/magnetometer sensor, EEPROM, Occupancy Sensor,

and RGB LED in a small form factor board. Figure 3 shows a simple block diagram.

Figure 3. Occupancy Sensor Node block diagram

3.1. Functional description

The Occupancy Sensor Node board is built around the NXP KW2xD Wireless MCU in a 63-pin (56-pin

usable) LGA package. The KW2xD family of devices features an IEEE Std. 802.15.4 2.4 GHz radio

frequency transceiver and a Kinetis family low-power, mixed-signal ARM® Cortex®-M4 MCU in a

single package. This two-layer board is intended as a reference design platform and/or as a building

block for application development. The principal purpose of the reference design board is to

demonstrate some of the available features of the KW2xD Wireless MCU platform in a reduced form

factor board with a specific application taking advantage of the KW2xD’s USB and low-power

capabilities.




3.1.1. RF performance and considerations

The Occupancy Sensor Node reference design board includes a 1 mW nominal output PA with internal

voltage controlled oscillator (VCO), integrated transmit/receive switch, on-board power supply

regulation, and full spread-spectrum encoding and decoding. Key specifications for the KW2xD

transceiver are:

• Programmable output power from -35 dBm to +8 dBm MCU output pins

• Typical sensitivity is -102 dBm (@1 % PER for 20 byte payload packet)

• Frequency range is 2360 MHz to 2480 MHz

• Differential bidirectional RF I/O port with integrated transmit/receive switch

• Meander horizontal printed metal antenna for a small footprint, low-cost design

• The board features a low component count RF matching network with off-chip 1:1 Balun

The layout has provision for out-of-band signal suppression (components L1 and C2) if required.

Figure 4 shows the typical topology for the RF circuitry.




Figure 4. Occupancy Sensor Node RF circuitry

3.1.2. Clocks

The Occupancy Sensor Node has two clocks:

• 32 MHz Reference Oscillator: Figure 5 shows the external 32 MHz external crystal Y1. This

mounted crystal must meet the specifications outlined in the AN3251 application note. The IEEE

Std. 802.15.4 requires that the frequency be accurate to less than ±40 ppm.

— Capacitors C20 and C21 provide the bulk of the crystal load capacitance. At 25 °C it is

desired to have the frequency accurate to ±10 ppm or less to allow for temperature

variation

— To measure the 32 MHz oscillator frequency, signal CLKOUT (PTA18/CLK_OUT) can

optionally be programmed to provide a buffered output clock signal

• Optional 32.768 kHz Crystal Oscillator: Provision is also made for a secondary 32.768 kHz

crystal Y2 (see Figure 6). This oscillator can be used for a low power accurate time base.

— The module comes provided with this Y2 crystal and its load capacitors C23 and C24

— Load capacitors C23 and C24 provide the entire crystal load capacitance; there is no

onboard trim capacitance

— The 32 kHz oscillator components are supplied

http://cache.nxp.com/files/rf_if/doc/app_note/AN3251.pdf?fsrch=1&sr=1&pageNum=1




Figure 5. Occupancy Sensor Node 32 MHz reference oscillator circuit

Figure 6. Occupancy Sensor Node 32.768 kHz optional oscillator circuit

3.1.3. Power management

The Occupancy Sensor Node power management circuit is shown in Figure 7.

Figure 7. Occupancy Sensor Node power management circuit




3.1.4. Battery charger

The Occupancy Sensor Node battery charger circuit is shown in Figure 8.

Figure 8. Occupancy Sensor Node battery charger circuit

3.1.5. USB connector

The Occupancy Sensor Node USB connector circuit is shown in Figure 9.

Figure 9. Occupancy Sensor Node USB connector circuit




3.1.6. External flash memory

The Occupancy Sensor Node External Flash Memory circuit is shown in Figure 10.

Figure 10. Occupancy Sensor Node External flash memory circuit

3.1.7. Peripheral functions – Combo sensor (I2C interface)

Component U2 is an NXP sensor, FXOS8700C, a 6-axis sensor with integrated linear accelerometer and

magnetometer, very low power consumption, I2C selectable. Figure 11 shows the sensor circuit.

• Sensor power supply is P3V3_BRD

• Discrete pull-up resistors for the I2C port are provided

• Two interrupt signals

Figure 11. Occupancy Sensor Node FXOS8700CQ combo sensor




3.2. Schematic, board layout, and bill of material

3.2.1. Schematic 5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

3 2 MHz cr y st a l3 2 k Hz cr y st a l

RGB LED

I n Ci r cu i tTest GNDPr ob in g

HARMONI C TRAP

100 Ohm cont r ol l edi mpedance f r om DUTt o bal un.

50 ohm cont r ol l edi mpedence l i ne f r omBal un t o SMA and F_Ant enna

CAD NOTE:Embed pads i nt o50 Ohm l i ne.

MKW 2 4 D5 1 2 V

RF

I n t er r u p t Pu sh Bu t t on s

Reset

USB Co n n ect o r

PIN FUNCTIONS USED NET NAMES

JTAG / SW D Co n n ect o r

SPI Flash Mem or y

PI R Sen so r

Bat t er y Ch ar g er

Bat t er y Measu r em en t

Pow er Man ag em en tBat t er y

FXOS8 7 0 0 CQ COMBO SENSOR

XTAL_32M

EXTAL_32M

PTE2_SW

PTE1_SW

RF_P

XTAL_32K EXTAL_32K

RX_SWITCH

PTA18

RGB_BLUE

RGB_RED LEDRGB_GREEN

LEDRGB_BLUE

LEDRGB_RED RGB_GREEN

VD

D_

RF

/_IF

/_P

A

XTAL_32M

EXTAL_32M

RST_TGTMCU_B

TX_SWITCH

Z_RF_P

Z_CAP

RF_ANT

RF_N

Z_RF_N

PTA3

PTA2

PTA1

VDD_REGD

PTA0

TAMPER0

ANT_A

ANT_B

PTD1

RGB_RED

PTE1_SW PTE2_SW

EXTAL_32K

XTAL_32K

RST_TGTMCU_BPTA1JTAG_TDI/EZP_DIPTA2JTAG_TDO/TRACE_SWO/EZP_DOPTA0JTAG_TCLK/SWD_CLK/EZP_CLKPTA3JTAG_TMS/SWD_DIO

SENSOR

PTC6_SPI_SOUT

PTC5_SPI_CLK

PTC4_SPI_SS

PTC7_SPI_SIN

PTC6_SPI_SOUT

PTC5_SPI_CLK

PTC4_SPI_SS PTC7_SPI_SIN

SENSOR

USB_DN

USB_DP

CHRG_CHG

CHRG_PPR

CHRG_EN

USB_DN

USB_DPKW22_USB_DP

KW22_USB_DN

KW

22_

US

B_S

HL

D

PTD1

CHRG_EN

RGB_BLUE

RGB_GREEN

PTD2/I2C0_SCL

PTD3/I2C0_SDA

RST_FXOS8700CQ

BY

P_

FX

OS

8700

CQ

PTA4

INT2_FXO

PTD3/I2C0_SDA

PTD2/I2C0_SCL

CHRG_CHG

VD

D_

RF

/_IF

/_P

A

VD

D_

RF

/_IF

/_P

A

PTA4

P3V3_BRD

GND

P3V3_MCU

P3V3_MCU

P3V3_MCU

P3V3_MCU

P3V3_MCU

P3V3_MCU

P3V3_BRD

P3V3_BRD

P3V3_BRD

V_IN

P5V_USB V_BATT

P5V_USB

P5V_USB

VOUT33

P3V3_BRD

P3V3_MCU

V_BATT

P3V3_BRD

V_IN

VOUT33

P5V_USB

P3V3_BRD

P3V3_BRD

P3V3_BRD

P3V3_BRD

VDD_RF/_IF/_PA VDD_REGD

RST_TGTMCU_B

Drawing Title:

Size Document Number Rev

Date: Sheet of

Page Title:

ICAP Classification: FCP: FIUO: PUBI:

SCH-xxxxx PDF: SPF-xxxxx X3

X-KW2X-OSN-RD

C

Friday, November 27, 2015

Main MCU

3 3

___ ___X

Drawing Title:


Date: Sheet of

Page Title:



X-KW2X-OSN-RD

C


Main MCU

3 3

___ ___X

Drawing Title:


Date: Sheet of

Page Title:



X-KW2X-OSN-RD

C


Main MCU

3 3

___ ___XR10 220

R14

6.04K

1%

C27

0.1UF

SW2

SKQYAFE010

12

Y2

32.768KHZ

21

R170

J1

hdr_2x5

1 23 4

657 89 10

U1

MKW24D512V

VD

D_M

CU

20

VD

DA

25

VR

EF

H26

VR

EF

L27

VS

SA

28

VB

AT

_M

CU

32

VD

D_M

CU

38

VB

AT

2_R

F42

VD

D_R

EG

D43

VD

D_P

A52

VD

D_IF

53

VD

D_R

F54

GN

D_P

A3

63

GN

D_P

A1

48

GN

D_P

A2

51

EXTAL_32M1

TAMPER0/RTC_WAKEUP29

XTAL3230

EXTAL3231

RESET41

RX_SWITCH46

TX_SWITCH47

RF_OUTP49

RF_OUTN50

XTAL_32M56

GPIO12

GPIO23

PTA0/JTAG_TCLK/SWD_CLK/EZP_CLK/UART0_CTS/UART0_COL/FTM0_CH533

PTA1/JTAG_TDI/EZP_DI/UART0_RX/FTM0_CH634

PTA2/JTAG_TDO/TRACE_SWO/EZP_DO/UART0_TX/FTM0_CH735

PTA3/JTAG_TMS/SWD_DIO/UART0_RTS/FTM0_CH036

PTA4/LLWU_P3/NMI/EZP_CS/FTM0_CH137

PTA18/EXTAL0/FTM0_FLT2/FTM_CLKIN039

PTA19/XTAL0/FTM1_FLT0/FTM_CLKIN1/LPTMR0_ALT140

PTC4/LLWU_P8/SPI0_PCS0/UART1_TX/FTM0_CH3/CMP1_OUT4

PTC5/LLWU_P9/SPI0_SCK/LPTMR0_ALT2/I2S0_RXD0/CMP0_OUT5

PTC6/LLWU_P10/CMP0_IN0/SPI0_SOUT/PDB0_EXTRG/I2S0_RX_BCLK/I2S0_MCLK6

PTC7/CMP0_IN1/SPI0_SIN/USB_SOF_OUT/I2S0_RX_FS7

PTD1/ADC0_SE5B/SPI0_SCK/UART2_CTS8

PTD2/LLWU_P13/SPI0_SOUT/UART2_RX/I2C0_SCL/GPIO4_BSM_DATA9

PTD3/SPI0_SIN/UART2_TX/I2C0_SDA/GPIO5_BSM_CLK10

PTD4/LLWU_P14/MADC0_SE21/SPI0_PCS1/UART0_RTS/FTM0_CH4/EWM_IN/GPIO_BSM_FRAME11

PTD5/ADC0_SE6B/SPI0_PCS2/UART0_CTS/UART0_COL/FTM0_CH5/EWM_OUT12

PTD6/LLWU_P15/ADC0_SE7B/SPI0_PCS3/UART0_RX/FTM0_CH6/FTM0_FLT013

PTD7/MADC0_SE22/CMT_IRO/UART0_TX/FTM0_CH7/FTM0_FLT114

PTE0/MADC0_SE10/SPI1_PCS1/UART1_TX/MTRACE_CLKOUT/I2C1_SDA/RTC_CLKOUT15

PTE1/LLWU_P0/MADC0_SE11/SPI1_SOUT/UART1_RX/MTRACE_D3/I2C1_SCL/SPI1_SIN16

USB0_DP21

USB0_DM22

VO

UT

33

23

VR

EG

IN24

PTE2/LLWU_P1/MADC0_DP1/SPI1_SCK/UART1_CTS/MTRACE_D217

PTE3/MADC0_DM1/SPI1_SIN/UART1_RTS/MTRACE_D1/SPI1_SOUT18

PTE4/LLWU_P2/SPI1_PCS0/MTRACE_D019

EP

_G

ND

164

EP

_G

ND

265

NC_5757

NC_5858

NC_5959

NC_6060

NC_6161

NC_6262

VB

AT

_R

F55

ANT_A44

ANT_B45

SH1 0

C1

1PF

U2

FXOS8700CQ

VD

DIO

1

BYP2

RSVD13

SCL/SCLK4

GN

D1

5

SDA/MOSI6

SA0/MISO7

CRST8

INT29

SA1/CS10

INT111

GN

D2

12

RSVD213

VD

D14

NC_1515

RST16

Q1

EKMB1301112K

3

OUT

2VDD

GND1

R2 0

TP3

J2

USB_MICRO_AB

VBUS1

D-2

D+3

ID4

GND5

SH

ELL1

6

SH

ELL2

7S

HE

LL3

8

SH

ELL4

9

SHELL510

ANT1

MEANDER_ANT_HORZ

21

TP13

MH2

MH_80mil

11

L5

330 OHM

12

R11 220

C8

0.1UF

TP6

R160

R21

10K

TP12

-

+ BT1

LIR3048

21

R15

330

SH3 0

SW1

SKQYAFE010

1 2

C31

1000pF

R20

10K

TP16

R5 33

TP17

C2

1.8pF

R7

26.7K

1%

C23

12PF

C32

1000pFSH4 0

C60.33UF

C2011pF

R1 0

D7

MSS1P3LAC

TP9

R3

1M

C733PF

C14

0.1UF

TP14

R G

B

LED1

CLV1A-FKB-CJ1M1F1BB7R4S3

1

2 3

4

C533PF

TP7

C10

2.2uF

C29

0.1UF

C25

0.1UF

C2111pF

AB

SW4

09.10201.02

2 1 3

C301UF

C35

0.1UF

D8

MSS1P3LA C

U4

MC34671AEP

CHG3

PPR2 V

IN1

EN4

GN

D5

FAST6

ISET7

BAT8

EP

AD

9

TP5

R9 10.0K 1%

C33

4.7uF

C180.47UF

TP10

TP18

U3

AT45DB161E-SSHD

SCK2 VCC

6

WP5

RESET3

GND7

CS4

SI1

SO8

C34

0.1UF

L4

330 OHM

1 2

R12 220

Y1

32MHZ

1 4

32

TP1

DNP

R13

10.0K

1%

C13

0.1UF

MH1

MH_80mil

11

SW3

SKQYAFE010

1 2

LED2

RED

AC

TP2

R19

10K

SH2 0

R4 33

R18

0

L1

2.2nH

12

C26 0.1UF

C24

12PF

C28

2.2uF

TP15

TP4

C19

1000pF

Z1

2400MHz 50OHM

5

1

6

2

3

4

C4

10PF

TP11

C17

0.1UF

Figure 12. Occupancy Sensor Node schematic Rev X3




Figure 13. Occupancy Sensor Node board component location (top view)

Figure 14. Occupancy Sensor Node board test points




Figure 15. Occupancy Sensor Node board layout (top view)

Figure 16. Occupancy Sensor Node board layout (bottom view)




3.2.2. Bill of Materials

Table 1. Bill of materials (common parts for all frequency bands)

Item Qty Reference Value Description Mfg. Name Mfg. Part Number

1 1 ANT1 MEANDER_AN

T_HORZ

PCB MEANDER ANTENNA

HORIZONTAL, NO PART TO

ORDER

NO PART TO

ORDER

NO PART TO

ORDER

2 1 BT1 LIR3048 BATTERY HOLDER 3032

HORIZONTAL TH

KEYSTONE

ELECTRONICS 301

3 1 C1 1 pF CAP CER 1PF 50V 5% C0G 0402 MURATA GRM1555C1H1R0

CA01B

4 1 C2 1.8 pF CAP CER 1.8PF 50V 0.25PF C0G

0402 MURATA

GRM1555C1H1R8

CA01D

5 1 C4 10 pF CAP CER 10PF 50V 5% C0G 0402 AVX 04025A100JAT2A

6 2 C5, C7 33 pF CAP CER 33PF 50V 5% C0G 0402 VENKEL

COMPANY

C0402C0G500-

330JNE

7 1 C6 0.33 uF CAP CER 0.33UF 6.3V 10% X5R

0402 MURATA

GRM155R60J334

KE01D

8 7

C8, C13,

C14, C17,

C25, C27,

C29

0.1 uF CAP CER 0.1UF 16V 10% X7R

0402 KEMET

C0402C104K4RA

C

9 2 C10, C28 2.2 uF CAP CER 2.2uF 6.3V 10% X5R

0402 MURATA

GRM155R60J225

KE95

10 1 C18 0.47 uF CAP CER 0.47UF 6.3V 10% X5R

0402 MURATA

GRM155R60J474

KE19D

11 3 C19,C31,

C32 1000 pF

CAP CER 1000PF 50V 5% C0G

0402 MURATA

GRM1555C1H102

JA01D

12 2 C20,C21 11 pF CAP CER 11pF 50V 1% C0G 0402 AVX 04025U110FAT2A

13 2 C23, C24 12 pF CAP CER 12PF 50V 5% C0G 0402 MURATA GRM1555C1H120

JZ01D

14 3 C26,C34,

C35 0.1 uF

CAP CER 0.1UF 10V 10% X5R

0402 KEMET

C0402C104K8PA

C

15 1 C30 1 uF CAP CER 1UF 6.3V 20% X5R

0402 MURATA

GRM155R60J105

ME19D

16 1 C33 4.7 uF CAP CER 4.7UF 6.3V 20% X5R

0402

VENKEL

COMPANY

C0402X5R6R3-

475MNP

17 2 D7, D8 MSS1P3L DIODE SCH 1A 20V MICROSMP

SMT

VISHAY

INTERTECHNOL

OGY

MSS1P3L-M3/89A

18 1 J1 hdr_2x5 HDR 2X5 TH 50MIL CTR 254H AU

91L SAMTEC FTSH-105-04-F-D

19 1 J2 USB_MICRO_A

B

CON 5

USB_MICRO_AB_RECEPTACLE

RA SKT SMT 0.65 MM SP 122H

AU

MOLEX 475900001

20 1 LED1

CLV1A-FKB-

CJ1M1F1BB7R

4S3

LED RED BL GRN SGL

50/25/25mA SMT CREE, INC

CLV1A-FKB-

CJ1M1F1BB7R4S

3

21 1 LED2 RED LED RED CLEAR SGL 30MA SMT

0805 LITE ON LTST-C171KRKT

22 1 L1 2.2 nH IND -- 2.2NH@500MHZ 220 mA

4% 0402 MURATA LQP15MN2N2B02

23 2 L4, L5 330 OHM IND FER BEAD

330OHM@100MHZ 2.5A -- SMT TDK MPZ2012S331A






24 2 MH1, MH2 MH_80 mil MOUNTING HOLE NON-PLATED

80MIL TH NO PART TO ORDER NA

Mounting Hole -

80Mil drill NPTH

25 1 Q1 EKMB1301112

K

SENSOR TYPE PYROELECTRIC

PIR Motion Sensor

PANASONIC

CORPORATION EKMB1301112K

26 5

R1, R2,

R16, R17,

R18

0 RES MF ZERO OHM 1/16W 5%

0402 ROHM MCR01MZPJ000

27 1 R3 1 M RES MF 1.0M 1/10W 5% 0402 PANASONIC ERJ-2GEJ105X

28 2 R4, R5 33 RES MF 33 OHM 1/16W 5% 0402 SMEC RC73L2Z330JTF

29 1 R7 26.7 K RES MF 26.7K 1/16W 1% 0402 KOA SPEER RK73H1ETTP267

2F

30 2 R9, R13 10.0 K RES MF 10.0K 1/16W 1% 0402

WALSIN

TECHNOLOGY

CORP.

WR04X1002FTL

31 3 R10, R11,

R12 220 RES MF 220 OHM 1/16W 5% 0402 KOA SPEER

RK73B1ETTP221

J

32 1 R14 6.04 K RES MF 6.04K 1/16W 1% 0402 KOA SPEER RK73H1ETTP604

1F

33 1 R15 330 RES MF 330 OHM 1/16W 5% 0402

VISHAY

INTERTECHNOL

OGY

CRCW0402330RJ

NED

34 3 R19,R20,

R21 10 K RES MF 10K 1/16W 5% 0402

VISHAY

INTERTECHNOL

OGY

CRCW040210K0J

NED

35 4 SH1,SH2,

SH3, SH4 0

ZERO OHM CUT TRACE 0402

PADS; NO PART TO ORDER

LAYOUT

ELEMENT ONLY

LAYOUT

ELEMENT ONLY

36 3 SW1,SW2,

SW3 SKQYAFE010

SW SPST MOM PB 50MA 12V

SMT

ALPS ELECTRIC

(USA) INC. SKQYAFE010

37 1 SW4 09.10201.02 SW SPDT RA SLD 12V 500MA TH EAO SWITCH 09-10201-02

38 1 TP1 TEST POINT

WHITE

TEST POINT WHITE 40 MIL

DRILL 180 MIL TH 109L

COMPONENTS

CORPORATION TP-105-01-09

39 15

TP2,TP3,

TP4,TP5,

TP6,TP9,

TP10,TP11,

TP12,TP13,

TP14,TP15,

TP16,TP1,

TP18

TPAD_030 TEST POINT PAD 30MIL DIA

SMT, NO PART TO ORDER

NOT A

COMPONENT

NOT A

COMPONENT

40 1 TP7 TPAD_040 TEST POINT PAD 40MIL DIA

SMT, NO PART TO ORDER

NOT A

COMPONENT

NOT A

COMPONENT

41 1 U1 MKW22D512V

HA5

IC MCU XCVR 2.4GHZ 64KB RAM

512KB FLASH - USB 1.8-3.6V

LGA56

NXP MKW22D512VHA

5

42 1 U2 FXOS8700CQ

IC ACCELEROMETER AND

MAGNETOMETER SENSOR 3-

AXIS 2.5V QFN16

NXP FXOS8700CQ

43 1 U3 AT45DB161E-

SSHD

IC FLASH 16MBIT 85MHZ 2.5-

3.6V SOIC8 ATMEL

AT45DB161E-

SSHD-T

44 1 U4 MC34671AEP IC CHARGER LI-ION BATT 24V

DFN8 NXP MC34671AEP

45 1 Y1 32 MHZ XTAL 32MHZ 9PF -- SMT

3.2X2.5MM NDK EXS00A-CS02368

PCB Manufacturing Specifications





46 1 Y2 32.768 KHZ XTAL 32.768 KHZ SMT ROHS

COMPLIANT

EPSON

ELECTRONICS

FC-135

32.7680KA-A3

47 1 Y3 2400 MHz

50 OHM

XFMR BALUN 2400 +/-100MHZ

SMT MURATA

LDB212G4005C-

001

4. PCB Manufacturing Specifications

This section provides the specifications used to manufacture the Occupancy Sensor Node development

printed circuit board (PCB) described in this guide.

The Occupancy Sensor Node development platform PCBs must comply with the following:

• The PCB must comply with Perfag1D/3C (www.perfag.dk/en/)

• The PCB manufacturer’s logo is required

• The PCB production week and year code is required

— The manufacturer’s logo and week/year code must be stamped on the back of the PCB

solder mask

— The PCB manufacturer cannot insert text on the PCB either in copper or in silkscreen

without written permission from NXP Semiconductors

• The required Underwriter’s Laboratory (UL) Flammability Rating

— The level is 94V-0 (http://ulstandards.ul.com/standard/?id=94)

— The UL information must be stamped on the back of the PCB solder mask

NOTE

A complete set of design files is available for the Occupancy Sensor

Node transceiver at the NXP website (document KW2xD) under

“Software and Tools.” These reference designs should be used as a

starting point for a custom application.

The NXP IEEE 802.15.4 / ZigBee Package and Hardware Layout

Considerations Reference Manual, (document ZHDCRM) is also

available at the same web site to provide additional design guidance.

4.1. Single PCB construction

This section describes individual PCB construction details.

• The Occupancy Sensor Node PCBs are two-layer, multi-layer designs

• The PCBs contain no blind, buried, or micro vias

• PCB data:

— Occupancy Sensor Node board’s size: approximately 63.9 x 33.2 mm (2.52 x 1.31

inches)

— Occupancy Sensor Node board’s final thickness (Cu/Cu): 1.57 mm (0.62 inches) ±10 %

(excluding solder mask)

http://www.perfag.dk/en/

http://ulstandards.ul.com/standard/?id=94

http://www.nxp.com/products/microcontrollers-and-processors/arm-processors/kinetis-cortex-m-mcus/w-series/kinetis-kw2x-2.4-ghz-rf-analog-mixed-signal-ieee-802.15.4-low-power-microcontrollers-mcus:KW2x

http://cache.nxp.com/files/rf_if/doc/ref_manual/ZHDCRM.pdf?fsrch=1&sr=1&pageNum=1




Table 2 defines some of the layers of the completed PCB. The artwork identification refers to the name

of the layer in commonly used terms.

Table 2. Occupancy Sensor Node layer by layer overview

Layer Artwork Identification File Name

1 Silkscreen Top PSS.art

2 Top Layer Metal L1_PS.art

3 Bottom Layer Metal L2_SS.art

4 Silkscreen Bottom SSS.art

CAUTION:

The Occupancy Sensor Node reference design board contains high frequency 2.4

GHz RF circuitry. As a result, RF component placement, line geometries and

layout, and spacing to the ground plane are critical parameters. As a result,

BOARD STACKUP GEOMETRY IS CRITICAL.

Dielectric and copper thicknesses and spacing must not be changed; follow the

stackup (see Figure 17) information provided with the reference design.

Figure 17. Occupancy Sensor Node FXOS8700CQ combo sensor

• Solder mask is required

• Silk screen is required

4.2. Panelization

The panel size can be negotiated depending on production volume.

4.3. Materials

The PCB composite materials must meet the following requirements:

• Laminate: the base material (laminate) must be FR4. If the laminate material is changed, the RF

electrical characteristics may change and degrade RF performance

• Copper foil:

— Top and Bottom copper layers must be 1 oz. copper

• Plating: All pad plating must be Hot Air Leveling (HAL




4.4. Solder mask

The solder mask must meet the following requirements:

• Solder mask type: Liquid Film Electra EMP110 or equivalent

• Solder mask thickness: 10–30 μm

4.5. Silk screen

The silk screen must meet the following requirements:

• Silk screen color: White

• Silk screen must be applied after application of solder mask if solder mask is required

• The silk screen ink must not extend into any plated-thru-holes

• The silk screen must be clipped back to the line of resistance

4.6. Electrical PCB testing

• All PCBs must be 100 % tested for opens and shorts

• Impedance measurement: An impedance measurement report is not mandatory

4.7. Packaging

Packaging for the PCBs must meet the following requirements:

• Finished PCBs must remain in panel

• Finished PCBs must be packed in plastic bags that do not contain silicones or sulphur materials

These materials can degrade solderability.

4.8. Hole specification/tool table

See the ncdrill-1-2.tap file included with the Gerber files and the FAB-KW2X-OSN-RD_X3.pdf file.

4.9. File description

Downloadable files include: Design, Gerber, and PDF files. Gerber files are RS-274x format.

Not all files included with the Gerber files are for PCB manufacturing.

PDF files included are:

• FAB-KW2X-OSN-RD_X3.pdf—board fabrication drawing

• GRB-KW2X-OSN-RD_X3.pdf—metal layers, solder mask, solder paste and silk screen

• SPF-KW2X-OSN-RD_X3.pdf—schematic diagram

Design files are in Allegro format with OrCAD schematic capture.

Revision History



5. Revision History Table 3. Revision history

Revision number Date Substantive changes

0 06/2016 Initial release

Document Number: OSNRDBUG Rev. 0

06/2016

How to Reach Us:

Home Page:

nxp.com

Web Support:

nxp.com/support

Information in this document is provided solely to enable system and software

implementers to use NXP products. There are no express or implied copyright licenses

granted hereunder to design or fabricate any integrated circuits based on the

information in this document. NXP reserves the right to make changes without further

notice to any products herein.

NXP makes no warranty, representation, or guarantee regarding the suitability of its

products for any particular purpose, nor does NXP assume any liability arising out of

the application or use of any product or circuit, and specifically disclaims any and all

liability, including without limitation consequential or incidental damages. “Typical”

parameters that may be provided in NXP data sheets and/or specifications can and do

vary in different applications, and actual performance may vary over time. All operating

parameters, including “typicals,” must be validated for each customer application by

customer’s technical experts. NXP does not convey any license under its patent rights

nor the rights of others. NXP sells products pursuant to standard terms and conditions

of sale, which can be found at the following address:

nxp.com/SalesTermsandConditions.

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Freescale, the Freescale logo, and Kinetis are trademarks of NXP B.V. All other

product or service names are the property of their respective owners.

ARM, the ARM powered logo, and Cortex are registered trademarks of ARM Limited (or

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Engineers, Inc. (IEEE). This product is not endorsed or approved by the IEEE.

© 2016 NXP B.V.

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Occupancy Sensor Node Reference Design Board User's Guide

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