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1 ©2014 TCX Inc
Successful Entrepreneurship
for Microsystems
Rakesh Kumar, Ph.D., Life Fellow IEEE
April 21, 2014
858.945.3758
Teaching assistant – Kashyap Tumkur [email protected]
http://cse.ucsd.edu/~ktumkur
Tutor – Pavan Kumar [email protected]
Course presented at UCSD CSE 190, Spring Quarter 2014
Day 4_1
2 ©2014 TCX Inc
The “Productization / Commercialization” Lifecycle …Basic Research to High Volume Production
Basic Applied Research Research
Project “down-selection”
Lab
Demo
Funding Market
Customer Biz Plan
…
Model Prototype
“System”/ Produce-able
Prototype Production
1 Basic Principle 2 Concept 4 5 7 9
Technology Release Levels, Ref. nasa.gov
Ang
el
VC
IPO
, M&
A
FF
F
Methodologies
3 ©2014 TCX Inc
Methodologies
Lab
Demo
Funding Market
Customer Biz Plan
…
Model Prototype
“System”/ Produce-able
Prototype Production
1 2 4 5 7 9
Technology Release Levels, Ref. nasa.gov
Ang
el
VC
IPO
, M&
A
FF
F
IDEA
The “Productization / Commercialization” Lifecycle …Idea to High Volume Production
Biz Plan
5 ©2014 TCX Inc
A Biz Plan Document (usually ~20 pages)
An Overview Presentation (usually ~10 slides)
An “Elevator Pitch”
Key Requirements for Business Plan & Funding
6 ©2014 TCX Inc
Executive Summary Objectives Mission Key to Success
Company Summary Startup Summary Management Team Technical Team Company Locations and Facilities
Market Analysis Industry Overview Market Size Market Opportunities Competitions
Product Summary Product Description Sourcing and Technologies Product Development Schedules Competitive Analysis Product Advantages Product Roadmaps
Marketing and Sales Strategy Targeted Markets Customers Strategic Alliances Advertising and Promotion Selling Tactics
Manufacturing and Operations Plan Wafer Sourcing Backend Manufacturing Plan
Organization and Personnel Plan Organization Personnel Plan
Financial Plan
Business Plan – a typical Outline
7 ©2014 TCX Inc
IC Design
Global Planning
IC Production
Lifecycle of a Fabless IC development – the 4 phases
IC Prototyping
Series A
Series B
30 – 50% of TT$
8 ©2014 TCX Inc
IC Design
Global Planning
IC Production
Lifecycle of a Fabless IC development – activity highlites
“System” Architecture / Design / Simulation / Verification
Reference Boards
Customer Evaluation “Proof of Concept”
Customer Samples
Reference Design
FPGA Implementation
Customer Evaluation Design Acceptance
IC Prototyping
High Level Design
Floor Planning
Chip Design
RTL NL
Physical Des
NL GDSII F A T
Prod. Ramp
IC Qualification
Hi volume Debug
Analog IP Design
Series A
Series B
30 – 50% of TT$