Lextar Proprietary & Confidential Chip Scale Package

Lextar Proprietary & Confidential

Chip Scale Package

Presenter JD Guo

Title AVP Lextar

Date 2013/11/01


Outline

• CSP introduction

– CSP名詞說明White chip, PFC, POD ,PCC , ELC,....

– 各家種類

– 優缺點比較

• Process introduction• White chip process

• White chip Testing, Sorting, Packing

• CSP application

– Direct-lit BLU

– High efficiency tube in HK Lighting show


CSP introductionCSP introduction



What is CSP? Chip Scale Package

Search wiki or google, IC


What is CSP? Chip Scale Package


Lumileds

• Philips Lumileds的LUXEON Flip-Chip採用省略打線流程的倒裝CSP技術，除了達到可以通過高電流的特性外，體積的縮小也同步提升封裝的密集度

• Philips Lumileds看好Flip-Chip在光效、性價比與封裝體積優勢，預計將Flip-Chip技導入中功率LED。

2008 Luxeon Rebel2016– size 2.0mmx1.6mm

& 1.7mmx1.3mm

Thin film flip chip : yield issueAlN ceramic substrate : high cost

Trouble free for SMT

2012/Q4 – LUXEON Flip Chip

2013/Q4 – LUXEON Q


Cree

Shrink PKG size

AlN ceramic substrate : high costTrouble free for SMT

2013/Q1XQB – size 1.6mmx1.6mm

chip 1mmx1mm

2013/Q4XQE – size 1.6mmx1.6mm

chip 1mmx1mm


TSMC-SSL

• 無封裝PoD模組採用台積固態照明所開發之倒裝式芯片結構，以先進製程螢光粉包覆晶片，無需額外的封裝製程，就能成為LED發光元件。這樣的元件具有：體積小流明密度高，150度大發光角度，彈性的流明組合，一致的色溫，高驅動電壓（Vf）組合。


聯京聯京聯京聯京

• Mercury 1515 Series為目前世界最小之高功率LED發光點光源，面積雖僅為1.5X1.5 mm2，卻可提供超過3.6W的光效和約13,000 lm/cm2 的光密度。

• 使用銅基板散熱模組

40W RGBW60W Bi-CCT 雙色溫雙色溫雙色溫雙色溫


Epistar--ELC


Forepi--PFC


White Chip(Die)

Package Free Chip (PFC)

Phosphor molding On Die (PoD)

Phosphor & glue

Flip Chip

Only Chip with Phosphor


Chip Scale Package (CSP)

Phosphor & glue

Sub-mount

Flip Chip

White Chip on Substrate or Sub-mount

Sub-mount type

1.Ceramic (Al2O3, AlN)

2.MCPCB

3.Flat PLCC LF

4.Thin Metal (3um~20um)

5.Thick Metal (50um~250um)


優缺點比較優缺點比較優缺點比較優缺點比較

產出分佈大產出分佈大產出分佈大產出分佈大( 波長波長波長波長,電壓電壓電壓電壓,亮度亮度亮度亮度））））

仍需封裝製程仍需封裝製程仍需封裝製程仍需封裝製程

光輸出密度高光輸出密度高光輸出密度高光輸出密度高

易於進行光學設計易於進行光學設計易於進行光學設計易於進行光學設計ELC

Wafer levelForepi

製程難度高製程難度高製程難度高製程難度高

RA risk

可直接可直接可直接可直接SMT

色均勻性佳色均勻性佳色均勻性佳色均勻性佳


ELCEpistar

High cost




信賴性佳信賴性佳信賴性佳信賴性佳

LUXEON QLumileds

WeaknessAdvantageProduct

需晶片封裝整合能力需晶片封裝整合能力需晶片封裝整合能力需晶片封裝整合能力


Low cost


CSPLextar

RA risk



Low cost

COB聯京聯京聯京聯京

RA risk光輸出密度高光輸出密度高光輸出密度高光輸出密度高

Low costPoDTSMC

High cost




易於進行光學設計易於進行光學設計易於進行光學設計易於進行光學設計


XQB

XQECree


White chipWhite chip

CChip hip SScale cale PPackage ackage (CSP)(CSP)

Bonding

LBLB

Die Bonder / flux Eutectic Process

High accuracy Bonding (±25~38μ)

Low thermal resistance

A new process for SMT fab

SMT / solder bond

Normal Accuracy Bonding(±100μup)

Need to control solder paste Rth

Existing process

How to bond white chip on Lightbar

(PCB/MCPCB) ?


White Chip Product

Product Remark

L0 : Chip LevelL0 : Chip Level

Package Free Chip (PFC)

Sub-mount (1616)

L1 : PKG LevelL1 : PKG Level

Ceramic Substrate (3535)

L2 : Board LevelBonding process by

1.PKG

2.SMT

White chipWhite chip

CChip hip SScale cale PPackage ackage (CSP)(CSP)

White chip EmitterWhite chip Emitter

White chip PLCCWhite chip PLCC

White chip COBWhite chip COB


White Chip processWhite Chip process



Chip Scale Package Process

Phosphor & glue

Sub-mount

Flip Chip

White Chip on Substrate or Sub-mount

Phosphor process

Submout process


Concept

Phosphor Process 1

Realization (@ Lextar TD sample line)

Press molding & Curing Dicing & Sorting

Phosphor sheet sorting

Chip sorting

White Chip

White Chip PKG


Sheet dicingSheet dicing

Check Item

�切割刀型號切割刀型號切割刀型號切割刀型號

�切割參數切割參數切割參數切割參數

Risk

Sheet bending

Die bonding testDie bonding test

Check Item

�Bonding head pick &place check

Risk

螢光膜片與藍膜能否脫離螢光膜片與藍膜能否脫離螢光膜片與藍膜能否脫離螢光膜片與藍膜能否脫離

螢光膜片是否會沾黏螢光膜片是否會沾黏螢光膜片是否會沾黏螢光膜片是否會沾黏

Hot plate curingHot plate curing

Check item

�Curing profile

Risk

螢光膜片偏移螢光膜片偏移螢光膜片偏移螢光膜片偏移

氣泡氣泡氣泡氣泡& Peeling

��ProcessProcess

Phosphor Process 2��Test Model: FB 40S +3535 CeramicTest Model: FB 40S +3535 Ceramic


Phosphor Process 3: Flat Molding

Highlight

Towa 以重量進行厚度控制, 不同色點不同螢光粉比例之產品厚度將不同


Phosphor Process 4

Chip on wafer Phosphor spray

coating

Window Attach

Release wafer &

dicingWhieWhie chipchip

Solder PAD type

Phosphor & glue

Sub-mount PAD

Flip ChipSolder PAD type

1. Bare chip Pad

2. Sub-mount type1subject to sub-mount process

1. Ceramic (Al2O3, AlN)

2. MCPCB

3. Flat PLCC LF (EMC/SMC…)3. Sub-mount type2

sub-mount integrated process

1. Thin Metal (3um~20um)2.Thick Metal (50um~250um)

Chip PAD


Thin metal process flowThin metal process flow

Chip on wafer Phosphor spray

coating

Attach glass

Release wafer PR mask

lithography

E-gun pad metal

deposition

PR lift off Dicing

White ChipWhite Chip

PR mask

lithography


Thick metal ProcessThick metal Process

�Wafer上需有對位孔

�White sheet+ Sheet 需合Metal carrier脫離

�光阻塗佈可行性

�Wafer上需有切割對位道

White chip on Carrier

Flip bonding to Wafer PR deposition

PR mask lithography E-gun pad metal

deposition

PR lift off

Dicing White chipWhite chip

�光罩需與Wafer對位�去光阻液對phosphor sheet影響未知�背鍍金屬層與膠材接著性


White chip BEOLWhite chip BEOL



White chip back-end of the lineProcess flow :

B-Test

UPH: Testing 6~7K

Sorting

UPH:18~20K UPH:6~7K

TapingReverse

UPH:手動翻片 1K

0.370.380.390.40.410.420.430.39 0.4 0.41 0.42 0.43 0.44 0.45 0.46CIE_x

CIE_y色度分佈色度分佈色度分佈色度分佈、、、、亮度受相鄰晶片影響亮度受相鄰晶片影響亮度受相鄰晶片影響亮度受相鄰晶片影響掉料周圍掉料周圍掉料周圍掉料周圍、、、、方片外圍測試值失真方片外圍測試值失真方片外圍測試值失真方片外圍測試值失真


White Chip Prober 校正評估

IS 標準機中柱+輔助光源量測

(3535ceramic on star)

Prober點測

K factor 校正 prober

FC prober

400pcs 點測

IS 標準機中柱+輔助光源量測300pcs 抽樣檢測

(3535ceramic on star)

校正模式:

確認色度及亮度規格符合IS標準機


CSP application exampleCSP application example

: Direct: Direct--BLU proposalBLU proposal



New

PKG &

New lens

design

D-LED TV BLU concept

13” Q4 14” H1 H2

OD=45~25mm

Based on 32” D-LED TV

CCFL Replacement

OD=15~10 mm

6ea 3030_40FC or

eutectic_700mA

less than 18eaChip Scale Package & Wide View Angle

30mil-like FC or eutectic_450mA

可大量(>10k) 送樣時間


Way to reduce # of LEDs in BLU

1. View angle=120

2. Color deviation at large angle

3. Difficult to meet small light emitting area

4. Limited operating current

5. Need TIR lens for further LED reduction

1. View angle=140~160

2. Uniform angular color conversion

3. Chip scale light emitting area

4. High operating current

chip

Phosphor slurryFlip chip

Phosphorglue

【【【【Convention】】】】【【【【White Chip】】】】


【【【【3030 photo】】】】

White Chip for direct-lit Backlight

【【【【Schematic】】】】【【【【white chip photo】】】】

� Wide View Angle

� reduce cost of LED/Lens numbers

� Uniform Color distribution

� Better optical quality

� Flip Chip design

� high operating current, more robust

【【【【Characteristics】】】】 View angle=160View angle=160°°°°°°°°


White Chip View Angle

【【【【View Angle】】】】

View angle=160View angle=160°°°°°°°°

White chip 40SWhite chip 40S

Chip size 40mil x40 mil

Top surface 1.032mm2

Side surface 0.609mm2

T/S ratio 1.69

View angle=138View angle=138°°°°°°°°

White chip 55SWhite chip 55S

Chip size 55mil x55 mil

Top surface 1.96mm2

Side surface 0.838mm2

T/S ratio 2.33


2nd LensTraditional PKG or Emitter

White Chip Advantage(減少因二次光學產生的藍黃圈問題)

CCT 4450 CCT 3200

� CCT 600 � CCT 150

White Chip 2nd Lens


CIE coordinates

0.00

0.10

0.20

0.30

0.40

0.50

0.60

0.70

0.80

0.90

0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70CIE-x

CIE-y

1616 @ (0.26,0.20)

Flux(lm) vs. CIE - x @ 350mA

0.0

20.0

40.0

60.0

80.0

100.0

0.220 0.240 0.260 0.280 0.300CIE - x

Lu

min

ou

s F

lux

(lm

)

1616 @ (0.26,0.20)

0

20

40

60

80

100

120

140

160

180

200

0 100 200 300 400 500 600 700 800 900 1000 1100 1200

Current (mA)

Flux (lm)

1616 @ (0.26,0.20)

Flux(lm) vs. Current

Phosphor Conversion Chip(PCC1616)

Lextar Proprietary & ConfidentialLextar Proprietary & Confidential

2013 2013 香港國際照明展香港國際照明展

200lm/W in L2 level


Transparent High Efficiency LED Tube V1 (Demo sample)

Features:

5 W>80360o

5000 K1000 lm300 mm

PowerCRIBeam AngleCCTLumenDimension

Sample Spec.:

★ High efficacy: 200 lm/W

�� Package-free technologies (Without reflection & scattering & phosphor re-absorption loss )

�� High light extraction efficiency (Transparent substrate)

★ 360-degree wide beam angle

�� Same light view angle with traditional light tube

★ Low cost

�� PKG free & Substrate自製

Lextar Proprietary & Confidential Chip Scale Package

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