Koh Young SPI Verifies ADCO Circuits' PCB Assemblies

LEMONT, IL — Progress in ap-plied research at Argonne Nation-al Laboratory raises hopes thatsolid-state batteries will replaceconventional lithium-ion batter-ies sooner rather than later.

The lithium-ion batteriesthat primarily power everydaydevices are lightweight and cost-effective to produce. However,they are by nature flammable,which raises concerns abouttheir safety and reliability aspower and grid storage demandscontinue to grow.

Lithium-ion batteries still re-quire a liquid or gel to allow thebattery to be charged and dis-charged; that is why older batter-ies sometimes leak with age.

A new, safer generation ofbatteries does not rely on liquidsor gels. Instead, these solid-statebatteries use a very thin, solid

film to keep charge-generatingparts (cathodes and anodes) sep-arate and enable the battery tobe charged and discharged. Sol-id-state batteries can store moreenergy, are safer, and take upless space.Better Sintering

Sintering is important insolid-state batteries because thethin material separating thecathode and anode must bestrong enough and dense enoughto withstand handling duringmanufacture, assembly and op-eration.

It must also deliver highperformance; that is, the batterymust allow for fast charging, con-duct electricity well and last along time. By improving the sin-tering process, Argonne’s scien-

DULUTH, GA — An ideal part-nership should feel like a naturalextension of the vendor and cus-tomer relationship. However,there are many ways to getthere. One of them is “profession-al persistence,” which gained

Koh Young an audience with AD-CO Circuits.

A 40-year electronics assem-bly veteran, ADCO operates a55,000 ft2 facility in RochesterHills, Michigan. There it coverseverything from PCB assembly

to systems-level and box-buildfor volumes from prototype toproduction. ADCO Circuitsworked with Koh Young to im-plement a Zenith AOI machineto inspect through-hole solderjoints.To SPI, or Not to SPI

Recently, ADCO replaced allits surface mount equipment in-cluding screen printers, but hadnever seen a need for an SPI so-lution. This was despite severaltrade shows and meetings withJoel Scutchfield, director of salesand applications at Koh Youngand his local sales partner, JimRittman from Aligned Solutions.

Tirelessly, they would ex-plain the immediate benefits ofSPI and why it was the most im-portant inspection machine inthe electronics assembly line.

Nov/Dec 2021

ADCO Circuits’ new Koh Young KY8030-3 SPI System.

Koh Young SPI Verifies ADCOCircuits’ PCB Assemblies

Next Issue Focus:

Assembly andAutomation

Continued on page 6

Argonne Scientists PursueNext-Gen Batteries

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U.S. DODFunds R&Dfor Lead-FreeElectronicsWASHINGTON, D.C. — TheU.S. Defense Department (DoD)is taking another step towardunderstanding and embracingthe use of lead-free electronics inhigh-performance defense areasby allocating another round offunding to a public-private re-search effort.

The U.S. Partnership for As-sured Electronics (USPAE) is therecipient of a $8.9 million awardfrom the DoD Office of IndustrialPolicy’s Industrial Base Analysisand Sustainment (IBAS) Pro-gram to grow the Defense Elec-tronics Consortium (DEC) andexpand its work on the Lead-Free Defense Electronics Project.

The project is led by PurdueUniversity, the University ofMaryland, and Auburn Universi-

Continued on page 8

This Month’s Focus:

PCB and Components

Continued on page 8

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While this decade certainly got off on the wrong foot, the out-look for science and technology through 2030 is stronger thanever. As the year draws to a close, we end 2021 by both re-

flecting on the past and preparing for the future.The engines of the world are cranking up again, and the semicon-

ductor industry in particular looks very well prepared. After scram-bling to find enough production capacity to meet increased demandbefore the pandemic, the virus brought supply chains to a grindinghalt. The market was left in a strange and quiet limbo between lock-down and cautiously returning to work.

However, this year we saw many of 2020’s postponements returnto action, like the summer olympic games held in Tokyo. After a fewtentative starts, the electronics manufacturing industry is back tobooking trade shows, conferences and exhibitions of all kinds.

In a bit of an effort to salvage the year, many shows have takenplace this fall and are still scheduled through the end of December.Some highlights for U.S. Tech included MD&M West, The BatteryShow, The ASSEMBLY Show, SMTA International, and the motherof all electronics shows, productronica.

In this edition we have even highlighted some products and serv-ices that will be shown at SEMICON West, which was rescheduledfrom its usual slot in July to December.

The pent up energy of millions of homebound workers is being re-leased. Each trade show and exhibition since lockdown has been likea family reunion — one of the pleasures of our tight-knit electronicsmanufacturing community.

But, every good opportunity in life requires action to grasp it. Now,a wave is building and people are growing bolder. As the businessworld resumes, those who can navi-gate the wake of the pandemic suc-cessfully will be far ahead of the packwhen the tide comes in. r

A“deepfake” is a clever piece of digital media that is made to lookor sound like a real, actual video or audio recording. The catchis that the subject’s words or actions can be entirely made up.

Most commentators, especially in the media, have focused sim-ply on the spectacle of a computer program that appears like a budg-et version of a celebrity or public figure. It can be made to say some-thing silly or rude, or wink slyly at the camera while mimicking itssubject’s other mannerisms.

This parrot act was unnerving the first few times we saw it, butyou know deep down that you’re being tricked. You willingly suspendyour disbelief to enjoy the performance, or maybe to get a quick thrillfrom the idea that the digital media we so heavily rely on is about tobecome totally untrustworthy. But, these early shallows aren’t thedeep end of altered reality that many would like us to believe.

There are far deeper applications for a computer program thatcan generate lifelike human speech and mannerisms. In fact, it’s notso hard to imagine that more complex deepfakes could be used to re-cursively train artificial intelligence systems and give distinct “iden-tities” to their collections of words and actions.

There will come a time that we are so intimately familiar withthe physical workings of the human body that we can identify andharness the brain’s response to sensory information. A discreet brainimplant would be the interface between the conscious person andtheir own subconscious activities.

An AI-trained identity combined with a brain implant could beused to serve as a sort of “mental prosthetic” in the event of traumat-ic brain injury or psychological disorder. This interface could theneasily be programmed to respond in certain ways to specific scenar-ios, controlling aspects of the body at the chemical level.

Early applications of brain implants are focused on specific ap-plications, like restoring motor function to parts of the body lockeddown by spinal or nervous system injuries. Another such use may beto break addiction, like smoking cigarettes or binge drinking, by nul-lifying the rush of dopamine that comes with that particular behav-ior.

The reward pathways of the brain are enormously influential inhow a person acts and how they are perceived by others. Being ableto tune reward circuits, maybe a bit like turning up or down the gainof a particular signal, would be a powerful tool for treating cripplingmental disorders like depression or schizophrenia. Today, these con-ditions are treated with strong drugs that must be ingested and oftencarry loads of side effects. This method is also impossible to control atthe actual mechanical level of the medication. We resort to behavioraltherapy to try and train the patient under the influence of medicationfrom the outside in.

The ability to model a seemingly human identity is absolutelyout of any realm of possibility at present. But, using the power of ar-tificial intelligence to improvise given a set of rules, a model identityas a control, and a human-brain interface, might one day be the mostreal deepfake of all. r


SOUNDING OFFBy Michael Skinner

Editor

The Deepest Fakes are Still to Come

TECH-OP-EDTECH-OP-ED

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CONTENTS

www.us-tech.com

were not even a thought, it wasprocess control and understand-ing that drives process variation.

Kevin continues, “A wholenew world had opened up around

the screen-printing process. Theability to measure and capturethe data allowed us to fine-tunestencils and machine settings aswell as fine-tune our AOI.”

With the skills and knowl-edge learned using the KohYoung SPI, ADCO Circuits’ engi-neers can review the require-ments ahead of time, design ormodify the stencil based on thedata accumulated over time, andthen determine how much pasteis needed and where.

From then on it was a closecollaboration to bring the solu-tion to fruition. Kevin was par-ticularly struck with the efficien-cy and speed at which things gotdone. When ADCO Circuits hadan issue, it would share the datawith Koh Young and within aday or so have an update to re-solve the challenge. Kevin de-scribes the collaboration as “Agreat partnership, because itwas almost real-time.”

The collaboration includedplenty of input from both sides,

Continued from page 1

Things began to change when ADCO Circuits began complet-ing more and more customer sur-veys with questions about the onsite SPI capabilities.

Then came a critical point when a potential new customer for ADCO Circuits refused to provide new business to any po-tential manufacturing partner without SPI capabilities on at least one production line.

Koh Young had, on numer-ous occasions, offered a demo machine, so this seemed like the perfect time to get that machine on the factory floor for an evalu-ation. With the machine in place, ADCO Circuits had little in the way of expectations be-yond finding the rare instance of missing solder.

As a part of the success plan, Koh Young offered the sup-port of Ray Welch, customer projects manager and Six Sigma print process expert. Kevin Bar-rett, ADCO Circuits’ operations manager explains, “This was huge for us because he really opened our eyes to the fact that the machine does more than just look, it measures.”“The [AOI] machine does more than just look, it measures.”

Before SPI ADCO Circuits’ biggest concern was missing sol-der from a clogged aperture, so printer set up and visual inspec-tion was focused on that chal-lenge. Yields were good at AOI and at the final test. After this introduction to SPI and with Ray’s help, clogged apertures

Koh Young SPI and ADCOCircuits’ PCB Assemblies

ADCO says the collaborationwith Koh Young was nearly

real-time.

Continued on page 8

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Lowering CostsIn order for new mate-

rials to be adopted by in-dustry, the processes tomake them must be cost competi-tive to what is currently beingdone, and the materials must pos-sess significant advantages overmaterial in the current market.

The cost-effective processesfor making new materials by re-placing expensive components,lowering energy consumption,reducing waste and improvingprocessing conditions without

sacrificing the performance ofthe material, is the ultimategoal. Doing this research at theallows Argonne scientists to de-risk technologies and provide in-dustry with a ready-to-go,

scaled-up process.Argonne is one of the U.S.

national laboratories working toscale solid-state electrolyte ma-terials for batteries. It does so aspart of its ongoing push to scaleup complex materials and chem-ical processes critical to U.S.competitiveness in industrialmanufacturing.

Web: www.anl.gov r

U.S. DOD Funds R&D forLead-Free Electronics


Continued from page 1tists can also allow for the re-placement of the graphite mate-rial commonly used today with lithium metal. This replacement doubles the energy density of the battery, which means that the same size battery can store twice as much energy.

Testing and improving the processes and technolo-gies that create these solid battery materials at mean-ingful industrial scale andat lower cost is critical. Currently, no one produces solid-state batteries that are cost competitive with traditional lithium-ion bat-teries.

Argonne Scientists PursueNext-Gen Batteries

Continued from page 1ty. Participants include Bing-hamton University, Northrop Grumman, Raytheon Technolo-gies, Lockheed Martin, BAE Systems, Boeing, Plexus, and many others.

“This award enables us to continue our work to support the defense electronics ecosystem and to accelerate the adoption of lead-free electronics, just as the commercial market has done,” says Christopher Peters, execu-tive director of USPAE.

The project’s goal is to de-velop scientific evidence that can help accelerate the adoption of lead-free electronics in aero-space, defense, and other high-performance sectors. Specifical-ly, the team will develop data-driven solder-performance speci-fications for lead-free solutions in defense systems. The outcome will be a “road map” to help en-gineers and buyers better under-stand when lead-free electronics can and cannot be used in high-performance applications.

The benefits to the DoD will include reduced supply chain risks, faster delivery times, and a greater ability to leverage lead-free commercial technolo-gies. The project is also projected to yield more than $100 million

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Koh Young SPIVerifies ADCOCircuits’ PCBAssembliesContinued from page 6including Koh Young staff spending time onsite at ADCO Circuits to make sure the solu-tion was really performing exact-ly as they needed. Now, SPI is a part of its process that ADCO would never do without.

Contact: Koh Young America, Inc., 1950 Evergreen Boulevard, Suite 200, Duluth, GA 30096 % 704-651-2860 E-mail: brent.fischthal@ kohyoung.comWeb: www.kohyoung.com r


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Amajor problem with to-day’s IoT implementationis a lack of common under-

standing. One reason is that westill all don’t agree on whatwords to use to define certainthings. Now, it’s unavoidable.

Cloud-based sensing and ac-tuation, as well as data compil-ing, have created an enormousneed to define new terms and un-derstand difficult concepts.All Different in the Same Way

In machinery we talk aboutrevolutions per minute (RPM) orstrokes per minute (SPM) — orspindle speeds or inches per

minute (IPM), etc. all of theseterms are machinery-related.Parts per minute (PPM) is thenumber we should be concernedwith.

When we look at IoT and ourdesired outcome, it’s often themeasurement and metrics wherewe cloud our data and confuseour information. On the manu-facturing floor, a manager mightask to “speed up” a machine tomeet increased demand, or if aproduct needs to meet a tightdeadline.

Optional solutions may be torun the machine faster, this is al-so ambiguous because turningup the motor speed or strokes

per minute can result in a quali-ty issue. In stamping it could bethat increasing the slide velocityresults in the forming tearingthe material as it forms. In ma-chining the fact that you are try-ing to take off more material in asingle pass can cause heat, lossof control and a poor finish. On apress brake you can end up withgreater spring back. So, thequestion is how we can achievethe same part quality at a higherrate.

Sensors enable more granu-lar control of a process. Using AI,many systems can provide sever-al scenarios based on the pastIoT feedback and anticipated re-sults.

The key is to stay in a kindof pure continuous mode, whichcan be used to create more partsthan would be possible by run-ning the machine faster andwaiting for the automation. Thisalso helps to alleviate some bot-tlenecks by spreading the excesstime among all machines in auseful way.Interpreting Sensor Data

The information from a sen-sor has to be interpreted correct-ly, however. If a sensor reportsthat a part has come off the line,it usually doesn’t say whetherthe part is good or not, or thatthe part was finished or pack-aged. This is changing, as more

systems now allow for tracking ofgood and bad parts.

This is of course providingthat the bad part is an anomalyand not a failure. This data canfire a diverter and allow a badpart to be rejected and ejected.

Too often we give up on data be-cause it doesn’t change or solve the problem or what we are gath-ering doesn’t turn out to yield the results we need to act upon.

We feel that sensors provide solutions but a sensor without da-ta gathering, and comparison is just a data point. Tracking multi-ple data points to determine a trend is the first step to improv-ing a process. Information and knowledge will build over time, which is necessary to improve production in a meaningful way.Garbage in, Garbage Out

Today’s data systems are improving rapidly and notation is a major part of this, especially in analog sensing, where we need to know the values associat-ed. Visual cues are also very use-ful where the operator can un-derstand immediately and act upon the signal, without the need to find a supervisor to inter-pret some coded data.

The destiny of manufactur-ing is dependent on data. We are currently moving through an in-termediate step of advancement. It’s not hard to imagine systems that are capable of not only re-sponding in a formulaic way, but also to understand input errors and find out what the user really wants.

Contact: MRO Electric and Supply Company, Inc., 1652 Old Apex Road, Cary, NC 27513 %724-504-1339 E-mail: [email protected] Web: www.mroelectric.com r

TECH WATCH Nov/Dec 2021www.us-tech.com

TECH WATCH

How to Understand and InterpretFactory-Floor IoT DataBy Joseph Zulick, Writer and Manager, MRO Electric and Supply Company, Inc.

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PEOPLE IN THE NEWSThermaltronics Gains Veteran Technical ManagerGREAT NECK, NY — Thermaltronics has hired Ed Zamborsky as aregional and technical support manager at its new facility in OrmondBeach, Florida. A seasoned executive in the electronics industry with30 years of experience, Mr. Zamborsky has a successful track recordof growing businesses in diverse industrial and global electronicsmarkets. He is a specialist in both automated and manual hand sol-dering and rework. Mr. Zamborsky is adept at leading sales organi-zations and distribution channels to achieve strategic initiatives.

Web: www.thermaltronics.com

Mycronic Appoints 2022 NominationCommitteeTÄBY, SWEDEN — Mycronic has appointed the nomination commit-tee for its 2022 annual general meeting. The committee is made upof: Henrik Blomquist, Bure Equity; Patrik Jönsson, SEB Funds;Thomas Ehlin, The Fourth Swedish National Pension Fund; and ischaired by Patrik Tigerschiöld. This committee represents approxi-mately 47 percent of Mycronic’s votes and shares.

Web: www.mycronic.com

Beckhoff Hires Director for Eastern USSAVAGE, MN — Beckhoff USA has appointed Steve Rastberger totake over as the regional director for the eastern United States. Hisappointment follows the retirement of Graham Harris. Mr. Rastberg-er has held many positions in technical sales and managementthroughout his career. Formerly, he is the former director of solutionsand service at Omron Automation Americas, and has also been a re-gional sales manager for Unitronics.

Web: www.beckhoff.com

CalcuQuote Gains Strategic Adviser DALLAS, TX — CalcuQuote is delighted to officially announce the ad-dition of Steve Vecchiarelli, who joins the global CalcuQuote team inan advisory capacity. With 40 years of distribution experience, Vec-chiarelli adds to the company’s depth of electronics supply chain ex-perience. With a focus on applying process and technology solutionsto the electronics supply chain, CalcuQuote is digitizing old process-es, and assisting customers in rethinking productivity.

Web: www.calcuquote.com

SMTA Welcomes New Board MembersMINNEAPOLIS, MN — The SMTA has finalized its board for thenext year, which began its term in October. Newly elected membersinclude: Jason Keeping, Celestica; Adam Klett, L3Harris, CherylTulkoff, National Instruments Corporation; and Kirk Van Dreel,Plexus. While many board members remain from last year, the SM-TA bids farewell to Robert Kinyanjui, Richard Coyle, Bill Cardoso,and Tim Jensen.

Web: www.smta.org

Libra Adds Sr. Director of BusinessDevelopmentMENTOR, OH — Libra Industries has hired Joe Anderson as its sen-ior director of business development. Mr. Anderson is an establishedglobal sales executive with more than 20 years of experience. He willbe concentrating on developing business growth for Libra’s Cleve-land, Dayton, Dallas, and Mexico facilities. Prior to Libra, Mr. Ander-son served as director of business development for TT Electronics.

Web: www.libraindustries.com

DuPont Scientists Recognized for Materials ResearchMARLBOROUGH, MA — DuPont Electronics announced that threeof its scientists in its semiconductor technologies business group haverecently been honored with industry recognitions for their work in de-veloping materials for advanced semiconductor fabrication. EmadAqad, Alaaeddin Alsbaiee, and Jae Hwan Sim, were awarded fortheir work in developing materials for semiconductor production.

Web: www.dupont.com

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BUSINESS NEWSBUSINESS NEWS

HANOVER, GERMANY — Vis-com AG has won the “Supplier ofthe Year 2020” award from Con-tinental. The evaluation criteriaare based on both the perform-ance of the past years and the fu-ture potential of a supplier. Theaward ceremony, held in Sep-tember, was purely a virtual af-fair due to the pandemic.

In competition with almost900 evaluated suppliers from allproduction areas, Viscom wasable to secure the top position inthe “Production Equipment” cat-egory. Besides the aspect of tech-nology, decisive factors for the fi-nal evaluation included productquality, commitment, costs, andpurchasing conditions.

“We’re really honored by theaward. It clearly confirms thesuccess of our focus on innova-tive developments and our cus-tomer care concept,” statedCarsten Salewski, executiveboard member for sales, market-ing and international business,

Viscom AG. “As a manufacturerof inspection systems for elec-tronics production, we see our-selves as a global partner accom-

panying Continental to ensurethe highest production quality.”

The award underscores Vis-

com’s strength and greater po-tential. Dr. Nicolas Thiemeyer,head of key account manage-ment, Viscom AG, added, “Being

honored as one of the top suppli-ers of 2020 is an outstanding tes-timonial for us and at the same

time an incentive to continue shaping technological change alongside Continental as a reli-able partner.”

The awards recognize sup-pliers who have made an excep-tional contribution to customer satisfaction across various cate-gories. Each year, the technology company can build on a strong global network of strategic part-ners, the best of whom receive recognition in this way.

For Viscom, winning this award is not just confirmation of many years of successful cooper-ation — it is also a tremendous motivation to continue to create more powerful and highly accu-rate inspection technology.

Contact: Viscom, Inc., 1775 Breckinridge Parkway, Suite 500, Duluth, GA 30096 % 678-966-9835 E-mail: [email protected] Web: www.viscom.com r


Viscom Named “Supplier of the Year”by Continental

Viscom executives from left to right: Carsten Salewski, Peter Krippner, and Torsten Pelzer.

LeeMAH Installs Electrovert Wave Solder System

CAMDENTON, MO — A deepfreeze in February burst a pipeat LeeMAH Electronics’ manu-facturing facility in Texas. Thisnatural disaster was turned intoan opportunity to rearrange theproduction floor for better manu-facturing process flow. It also ledto the decision to install a newElectrovert VectraES wave sol-

dering machine to replace the ex-isting selective soldering system.

The new inline wave solder-ing machine allows for much high-er throughput at a better overallcost to LeeMAH to keep up with

their increasing production de-mand. An added benefit is thatthe new wave machine allowedLeeMAH to switch to a new solderalloy. With the clear return on in-vestment realized at the Texasplant, the plan is to also have theCalifornia plant switch over to thenew solder alloy as well.

“The new VectraES was up

and running quickly with no is-sues at all,” said Bob Smith,LeeMAH plant manager. “Thenew inline wave soldering ma-chine has easily kept up withproduction and also improved

the consistency of solderingthroughout the entire lot.”

Contact: ITW EAE, a divi-sion of Illinois Tool Works, 8860207th Street West, Lakeville,

MN 55044 % 952-469-8278 E-mail: [email protected] Web: www.itweae.com


INGUN Celebrates 50-Year Milestone

LAKE WYLIE, SC — INGUNhas marked its 50th year in busi-ness with a refined portfolio ofservices and an online shop.

In 1971, Wolfgang Karl andWerner H. Heilmann co-founded“Ingenieur Union” in Constance,Germany. Now known simply asINGUN, the company beganwith seven employees and nowcounts more than 400 spreadthroughout the world.

The company has stayedtrue to its roots by manufactur-ing exclusively in Constance. Forhalf a century, the company hasbeen developing high-perform-ance test technology for electricaland electronic products. Testtechnology enables smartphones,autonomous driving and ad-

vances in medical technology.“We are proud to support

our customers worldwide with future-oriented, reliable testing solutions, and in doing so active-ly shape the world of tomorrow,” said Armin Karl, INGUN man-aging director. “Our goal is to im-prove everyday life and the qual-ity of life in the long term with our products — we embrace this challenge every day anew with the greatest passion and will continue to do so in the future.”

Contact: INGUN USA, Inc., 252 Latitude Lane, Suite 105-106, Lake Wylie, SC 29710 % 803-831-1200 E-mail: [email protected] Web: www.ingun.com r


LeeMAH’s new Electrovert VectraES.

BUSINESS BRIEFSCount On Tools Offers Discount Online Until 2022GAINESVILLE, GA — Count On Tools, Inc. (COT), a leading providerof precision components and SMT spare parts, has announced salepricing on standard tooling for all types of pick-and-place machines.Use code “COUNTON” to receive 15 percent off online orders until theend of the year. The company strives to offer the widest range of SMTnozzles and consumables as possible. All COT products are new andmeet or exceed all OEM specifications.

Web: www.nozzles4smt.com

Radiant Awarded for Visual InspectionREDMOND, WA — Radiant Vision Systems’ Vision Inspection Pack,VIP™, software was recognized as among the best by the “2021 LaserFocus World Innovators” awards. A panel of judges from the opticsand photonics community recognized Radiant as a Silver honoree. VIPis an all-in-one solution for backlit symbol inspection that simultane-ously performs photometric measurement with machine vision-basedregistration and defect detection.

Web: www.radiantvisionsystems.com

MCS Test Partners with Keysight in UKSOUTHLAKE, TX — MCS Test is now an authorized UK distributorfor Keysight Technologies. The Keysight brand and product range isexpected to enable the company to address a wider market across var-ious industry segments. For more than 20 years, MCS Test has beena leading supplier of avionics, EMC, wireless and RF & microwavetest equipment. The company offers new, used, and rental equipmentwith calibration.

Web: www.testequity.com

Specialty Coating Systems Opens New Custom Facility in PAJOHNSTOWN, PA — Specialty Coating Systems (SCS) has opened anew facility in Johnstown, Pennsylvania. SCS relocated its John-stown operations in June, a customized facility designed to improvemanufacturing flow and enable future growth. The old location wasthe site of Diamond-MT, which SCS acquired in March. The John-stown facility specializes in the application of conformal coatings, in-cluding parylene conformal coatings as well as acrylics, silicones, ure-thanes, and epoxies. The site is ISO 9001:2015, AS9100D-certified,and ITAR-registered.

Web: www.scscoatings.com

RCD Components Revamps Logo and WebsiteGOWANDA, NY — RCD Components has unveiled a redesigned logoand revamped website. The rebrand reflects RCD’s fresh new perspec-tive as it joins the progressive iNRCORE family of companies. RCD’srobust offerings and extensive capabilities are reflected in the pur-poseful design of the new logo. The new website is designed to be user-friendly and contains an extensive technical library.

Web: www.rcdcomponents.com

PRIDE Industries Honors Disabled EmployeesSACRAMENTO, CA — PRIDE Industries recently participated in “Dis-ability Employment Awareness Month” (NDEAM). Established by Con-gress in 1988, NDEAM is celebrated every October as a way to raiseawareness of disability employment issues. It is also a time to recognizethe many and varied contributions of America’s workers with disabilities.PRIDE has many employee and customer success stories that demon-strate the social impact and benefits of inclusive hiring.

Web: www.prideindustries.com

Lumsden Belting Expands HeadquartersLANCASTER, PA — Lumsden Belting, a manufacturer of industrialconveyor belt heating, has expanded its headquarters in Lancaster,Pennsylvania. The new 23,000 square foot expansion increases thecompany’s production capacity and speeds delivery. Now, Lumsden’soperations are able to continue 24 hours a day, six days a week.

Web: www.lumsdencorp.com


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The semiconductor industryemploys various methods ofplasma technology. Typical

applications include treatmentbefore wire bonding, die bonding,thermal compress bonding, andpre-molding. However, it’s im-portant to mark the distinctionbetween two types of plasmaprocesses — low pressure and at-mospheric pressure.

Low pressure plasma re-quires a vacuum chamber, butcan process several componentsat once. Drawbacks include highequipment costs and long processtimes. This process also cannotbe used for selective treatmentas all component surfaces are ex-posed to plasma.

On the other hand, atmos-pheric plasma processing sys-tems, like Plasmatreat’s Ope-nair-Plasma can selectively treatareas on a component. The sys-tem can operate with compressedair, rather than more expensivegases, and may be guided by arobot. With this capability, thesystem can be used for both auto-mated inline production or as astandalone solution.

Materials and TreatmentsThe Openair-Plasma system

is versatile, performing cleaning,surface activation, and plasmacoatings on virtually any surface.These include plastics, metals,glass, ceramics, and composites.

It is particularly good forcleaning metallic surfaces. Insemiconductor manufacturing,the use of special gas mixturesmakes it possible to treat sub-stances such as copper. Copper isextremely sensitive to oxidation,especially at high temperatures,and is usually treated in low-pressure plasma systems or aprotective atmosphere.

Openair-Plasma’s reducingtreatment can be used to cleancopper leadframes very quickly.After cleaning, there is no visiblediscoloration of the copper frameand thermal stress on the compo-nent is very low.

Boards with plastic or metalcores can be processed withoutthe risk of damage. The systemcan also be used to treat ceramicand circuit breaker carriers afterdie bonding and before wire

bonding. Plasmatreat channeledits expertise into the plasma jetsto ensure that they stay neutraland pose no threat to the chipsthrough electrostatic discharge.Tailoring Complete Systems

Plasmatreat also suppliescomplete systems. One longstanding customer had been us-ing Plasmatreat’s jets in systemsmanufactured by another inte-grator, but it came time for thosesystems to be replaced.

Plasmatreat offers com-

plete plasma treatment units,known as “PTUs.” These are in-dividual manufacturing cells forseamless integration into pro-duction lines, which the compa-ny tailors to the customer’sprocess engineering needs. Thisincludes the handling and au-tomation systems that enableefficient surface treatment and

precise transport of assembliesand components.

This specific system was tobe integrated into the line andoperate at the highest possiblecycle time. Plasmatreat cus-tomized a process that includedparallel handling of two JEDECtrays on two conveyors withinone system, along with barcodescanning for traceability of eachchip. Each component was to beselectively treated, which alsomade using vacuum plasma im-possible.

The completed system can process JEDEC trays with 8 or 128 components. It reads the barcode of each component, then fixes them in place and treats their surfaces with Plasma-treat’s RD1004 rotary jets. The jets are equipped with an inte-grated suction system. After plasma treatment, they are sent through an external fluxer and then bonded by thermal com-pression.

The dual-lane design allows pairs of trays to be processed, while more trays are queued up behind them along a conveyor belt. The system is compatible with SECS/GEM, which is stan-dard in the semiconductor in-dustry.

The customer’s workers were trained through online meetings and the acceptance test was even carried out digitally, unavoidable due to the pandem-ic. Plasmatreat’s expertise in in-tegrating plasma solutions, is complemented by its skill in au-tomation and mechanical engi-neering. This skill and dedica-tion has resulted in a new cycle-time-optimized alternative for chip and microprocessor manu-facturing.

Contact: Plasmatreat USA, Inc., 2541 Technology Drive, Suite 407, Elgin, IL 60124 % 847-783-0622 Web: www.plasmatreat.com rSee at productronica, A2.445

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MANAGEMENTMANAGEMENTNov/Dec 2021

Optimize Both Surface and Cycle Time: Automated Inline Plasma Treatment

By Nico Coenen, Global Market Segment Manager — Electronics, Plasmatreat GmbH

Atmospheric plasma processing systems, like Plasmatreat’s Openair-Plasma can selectively treat areas on a component. The system can operate with compressed air, rather than more expensive gases,

and may be guided by a robot.


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With more than two decades in theelectromedical business, Italian com-pany Eltech K-Laser designs, manu-

factures and markets laser device equipmentfor the global medical, dermoestetic and sur-gical industries. K-Laser provides advancedtechnology, built for high performance, relia-bility and safety.

The company has highly qualified staffthat work in close collaboration with promi-nent consultants and renowned universitiesand clinics. K-Laser is highly committed toresearch and development, consistently in-vesting its resources to develop the mosttechnologically advanced products across theworld.

Founded in 1999 by Francesco Zanata,the company internally designs, developsand produces its laser devices. In 2002, Zana-ta launched the first K-Laser, which was thefirst portable power laser in the world (classIV) in the sports physiotherapy market. Justone year later, K-Laser became the mostused portable laser by numerous importantcompanies across the globe. Since then, the

company has launched lasers for the medical,dental and veterinarian industries. Today, itis known for quality, innovation and success.

To stay ahead of competition and pro-vide the world with innovative “K-Lasers”the company partners with companies thatshare its innovative spirit, flexibility andhigh quality reputation. Weller Tools is onesuch partner.

Custom Weller Solution

K-Laser needed a movable fume extrac-tion solution. It had to be compact enough tofit into their trolley where laser equipment isinstalled, but also silent enough to not both-er clients receiving laser treatments. Finally,it needed to be powerful enough to absorb allthe smells associated with laser treatments.

Weller’s MG130 system checked all theboxes; however, K-Laser needed to customizethe systems for a best-fit need. To make thesolution work for K-Laser, Weller used a 32mm arm (instead of the standard-sized one) toreduce the impact of the arm while in use.

Weller and K-Laser: “Made in Italy” at its Finest

By Giorgia Zanata, Legal Representative, K-Laser

Continued on next pageWeller WG130 fume extraction system.

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When considering the devicesin the scientific and technologicalfields that have improved thequality of affordable care for pa-tients, laser therapy comes tomind. The mechanism upon whichits functionality is based revolvesaround the properties of light;more specifically, laser therapymakes it possible to concentrateand transfer a very high quantityof energy on a specific surface.

The human body transformsthis bright energy into chemicalenergy through cellular mecha-nisms. This chemical energy is es-sential to carrying out daily bio-logical functions. In this case, thefunctions include shorter timespans with very high efficacy.

The laser therapy processtranslates into reduced recoverytime for patients as well as otherbenefits such as decreased pain,inflammation and swelling.

This type of treatment doesnot expose patients to risks pro-vided that the professional haslearned basic knowledge throughspecial training.

In this field, K-Laser pro-vides excellent technology, mak-ing it possible for the professionalto perform very high-level treat-ments, confirmed by the satisfac-tion reported by thousands of cus-tomers treated to date. The proto-cols in K-Laser devices are the re-sult of much experience, whichcombines basic and clinical re-search, intended to offer profes-sionals the most efficient thera-peutic tool commercially available

on the market today. Additionally, K-Laserorganizes focused training courses, both the-oretical and practical, to ensure the clinicianof all necessary knowledge to achieve thebest results.

Weller Tool’s innovative technologyand flexibility in customizing its solutionshas allowed it to create a fume extractionsystem that best meets K-Laser’s needswhile providing its customers with a safer,more pleasant laser therapy experience.

Contact: Apex Tool Group, 670 Industrial Drive, Lexington, SC 29072 ☎ 470-503-9584E-mail: [email protected] Web: www.apextoolgroup.com/brands/weller ❒


Weller and K-Laser: “Made in Italy” at its FinestContinued from previous pageWeller created an SKU (FT91000105N) that includes the MG130 unit with a custom set-ting to avoid alarm when using a 32 mm arm along with a, 1.5m long, 32 mm flexible arm.

The MG130 fume extraction system pro-vides numerous benefits including 100 to 240V power supply for global use, filter alarm and three-step speed control all in a small footprint design. The unit is easy to in-stall and operate. Additionally, it is supplied completely ready to be placed near the work-bench and purifies the air around two work-stations, which was important to K-Laser. Additional applications include hand solder-ing, heavy duty and general soldering, glu-ing, cleaning, filling, fine dust, MEK, and cleanrooms. Laser Therapy

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LCD displays are very fragile and nor-mally require a cover lens to be addedin front of the display to protect it from

damage and ensure that the data on displaycan be seen as clearly as possible. Cover lens-es are usually fabricated from glass.

However, not all glass is equal and thereare different treatments that can complicatethe decision process. The two main types ofglass used to manufacture cover lenses eachhave their own properties and are used fordifferent applications.

Soda-lime is the most well-known typeof glass and makes up around 90 percent ofthe glass used in the world. As would beexpected from its popularity, it offers awell-balanced list of specifications that in-cludes good mechanical strength, opticalparameters, and temperature resistance.As it is easy to manufacture, it is very af-fordable.

The main alternative to soda-limeglass is aluminosilicate glass, which offersbetter performance than its competitor,but is much harder to produce and there-fore can be much more expensive. Becauseof its cost, it is usually only found in high-er-end and niche applications where addi-tional strength and protection is para-mount, such as smartphones and AR/AV

devices. The main features that make alumi-nosilicate glass attractive for cover lens useare its resistance to high temperature andchemical exposure, and its ability to with-stand scratching.Optical bonding

The cover lens has to be situated in frontof the LCD display. It can be fixed in placewith an air gap or be optically bonded to the

LCD. While using an air gap is cheaper thanoptical bonding, it is inferior in almost everyother way, especially if the display is to beused outside or in other areas where there ishigh ambient luminance.

The air gap causes repeat refraction andreflection between the three different compo-nents of the display (LCD, air gap, coverlens), meaning that some of the light fromthe display is reflected back to it, impacting

the intensity and clarity of the image. Op-tical bonding involves filling the air gapwith a resin, which bonds the lens and thedisplay together.

This allows the light to move throughunhindered, and as more of the light fromthe display reaches the surface of the cov-er lens, the image is clearer and brighter.A second benefit is that optical bonding al-so allows external light to pass with verylittle being directly reflected and thus “ab-sorbed” in the display cavity.

Optical bonding also helps in other ar-eas. The resin can absorb shock to makethe display module more rugged, and itprovides a barrier that stops dust and wa-ter from penetrating between the coverlens and the display. It also stops conden-sation forming in the gap between the two. Many types of glass and coatings are avail-

able to tailor a display to an application.

Anders: Choosing the Right Cover Lens for LCDs

By Alexander Pang, Applications and Development Engineer, Anders Electronics

Continued on next page

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ment or surface chemical liquid treatment.Anti-reflective coatings are another so-

lution to stop light from external sources be-ing reflected off the screen, which can makethe display more difficult to see clearly. Thistechnique works in a different way to anti-glare coatings. Anti-reflective coated glassuses the principle of optical thin film inter-ference.

Multiple layers of nano-optical materialsare coated onto the cover lens surface by vac-uum reactive sputtering, improving thetransmittance of the glass and reducing sur-face reflectivity. As well as cutting down theamount of light reflected, anti-reflective coat-ing also stops effects such as ghosting andthe whitening of the screen which happens

when the screen is exposed to strong externallight over a period of time.

Each application has its own require-ments from an LCD screen. These require-ments could depend on the environmentwhere the display will be situated, the user’sreading position or how durable the displayhas to be. Choosing the correct cover lens andtreatments make it possible to tailor the dis-play to the exact needs of each applicationand get the best possible optical performanceout of every LCD display.

Contact: Anders Electronics plc, KingsStudios, 43-45 Kings Terrace, London, NW10JR, UK % +44-0-207-388-7171 E-mail: [email protected] Web: www.andersdx.com r


Anders: Choosing the Right Cover Lens for LCDsContinued from previous pageProtective Coatings

While optical bonding assists in the re-duction of glare from the screen, it is also possible to use additional coatings to further reduce screen glare. The anti-glare coating gives the surface of the screen a matte effect that can diffuse light in multiple directions instead of directly reflecting it.

However, the coating may also have an effect on the image being displayed as the light from that can be diffused at the same time. An excess of anti-glare coating will have a small impact on the contrast and vi-brancy of the image, making it appear slight-ly dull. The anti-glare coating can be applied by either surface spray treat-

Siborg ImprovesLCR-ReaderDigital MultimeterWATERLOO, ON, CANADA —Siborg has debuted its new LCR-Reader-R2 with 250 kHz test fre-quency.

The LCR-Reader line of multimeters requires no set up between measurements. When the devices’ gold-plated tweezer probes are in contact with a com-ponent, the LCR-Reader will au-tomatically determine the type of component and best test range; all measurement values are in-stantly available on the display.

LCR-Reader-R2, based on the award winning LCR-Reader-MPA , will be released soon. Si-borg’s newest model offers a 250 kHz and analog signature analy-sis. The R2 offers better stability while testing in-circuit due to the ability to switch test signal source resistance from 100Wto 1.4 kW. This higher source resist-ance reduces noise while meas-uring small resistances.

Analog signature analysis feature is a circuit board trou-bleshooting technique that uti-lizes an AC sine wave across to points of an electronic component or a circuit board. When the sine wave passes across the two points, the resulting waveform on the dis-play can be compared to a known good circuit board to determine the tested board’s health.

Some of the main differences between LCR-Reader-R2 and LCR-Reader-MPA is the removal of some of MPA’s features for R2, including AC/DC voltage meas-urements up to 15 V, Frequency meter, AC/DC current measure-ments and oscilloscope mode. Contact: Siborg Systems, Inc., 24 Combermere Crescent, Waterloo, Ontario, N2L 5B1, Canada%519-888-9906 E-mail: [email protected] Web: www.siborg.com

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Xesol Innovation is a global-ly active company special-ized in “artificial vision”

and deep learning. Its offeringsinclude solutions for safer driv-ing and road safety. One such so-lution is Drivox® Security, a safe-ty system for industrial vehicles.It detects pedestrians and ob-jects to the front and rear of thevehicle to prevent collisions.FRAMOS is supplying industrialGigE depth cameras with IP66protection to Xesol and providingintegration support.Intralogistics Challenge

Intralogistics has high de-mands for efficiency. Warehousesoften contain numerous industrialtrucks and forklifts moving rapid-ly back and forth between workersand pallets. Highly dynamicprocesses of this kind bring risksand dangers. Drivers are often in-experienced and have to work un-der intense time pressure.

There are various conceiv-able ways of detecting people andobjects that could trigger an au-dible warning signal, e.g. ultra-

sound systems, infrared technol-ogy, and safety laser scanners, orcamera-based solutions.

Camera technology fromFRAMOS delivers enhancedsafety in industrial vehicles Hav-ing studied the problem in depth,Xesol Innovation decided on a 3Dvision system, since ultrasoundsystems offer poorer resolutionand have little ability to distin-guish between humans and ma-chines. Laser-based systems, in

turn, are susceptible to interfer-ence from reflections and day-light. On the other hand, 3Dstereoscopic systems are regard-ed as the most robust technology

for both indoor and outdoor ap-plications.Machine Vision

The current solution Dri vox®

Security by Xesol Innovation con-sists of three components:FRAMOS D435e cameras, fittedat the front and rear of the vehi-cle for three-dimensional percep-tion, a microprocessor unit for AI-based image analysis, and a dis-play serving as a monitor for the

driver, which also shows the cal-culation results. If a potential col-lision risk occurs, the systemwarns the driver with a visibleand audible signal. One of the

project’s main goals was to limitthe number of accidents in work-ing environments to prevent in-terruptions to operations, andabove all to protect workers’ lives.

In this project, FRAMOS sup-plies the Drivox® Security´s“eyes.” FRAMOS also providedsupport for integrating the cam-eras into the complete safety solu-tion. The depth technology and 3Dimaging are crucial in this appli-cation, where people and objectsmust be reliably detected at vari-ous distances, in any posture, po-sition or surroundings, and the re-spective hazards assessed.

FRAMOS has developed anindustrial version of the 3D cam-era that allows the advantages ofIntel technology to be used for in-dustrial vision systems in harshenvironments. The FRAMOScamera works with the Intel sdkand thus allows easily to migratefrom regular RS cameras withlittle need to rewrite code.Artificial Intelligence

With advanced image analy-


Adapting AI Visual Assistance to Industrial Vehicles


By the Staff of FRAMOS

From left: TFT LCD monitor, FRAMOS depth camera, and Intel-based AI image processor.

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The internal Intel D4

processor in the camera per-forms the computations, i.e. ittakes care of “merging” the twoimages. To do this, it calculatesthe disparity and hence the asso-ciated depth in real-time forevery pixel in the image.

An IR projector in the cam-era ensures good image resultseven if the scene contains verylittle structure for calculatingthe disparity.

Additional texture from theIR projector (texture generator)improves the computation re-sults and means a depth map

can be generated even with uni-form structures.

Drivox security can detectpedestrians and obstacles inthree different detection zonesand indicates the individual col-lision risks in each case. Theseare computed by neural net-works for element detection andidentification, with correspon-ding decision algorithms. Thesoftware is configured individu-ally for the specific vehicle.

When pedestrians or obsta-cles are identified in the variousdetection zones, the system gives

a visible and/or audible alarm. The colors red, orange, and yel-low represent the different colli-sion risk levels.

The system reliably detects pedestrians in all conceivable po-sitions and postures, so it cannot be outsmarted even by a “dis-guised” approach.

Contact: FRAMOS Technol -ogies, Inc., 2733 Lancaster Road, Suite 210, Ottawa, Ontario, Canada, K1B 0A9 % 613-686-1152 E-mail: [email protected] Web: www.framos.com r


Adapting AI Visual Assistance to Industrial VehiclesContinued from previous pagesis or AI functions, the back-ground in the depth image can be masked out, distant objects can be hidden, or objects can be shown with a distance indicator, and so on. The depth accuracy depends on the distance between the camera and the object, the specific site, and the lighting conditions.

This technology requires considerable processing power, as the disparity has to be calcu-lated for each pixel in the two images. For this application, it is essential that the two cameras are suitably positioned and fo-cused. The Intel RealSense cam-eras are therefore precalibrated and precisely aligned.

Takaya“Lights Out”Flying ProbeTester, Newfrom TexmacWEST WARWICK, RI — TEX-MAC is now offering the latestflying probe test systems fromTAKAYA, which make up thecompany’s “lights-out” solution.TAKAYA offers the full path tocomplete flying probe test au-tomation with 4.0 level line inte-gration, communications, andnear-zero operator assistance.

APT-1600FD-A flying probe tester.

TAKAYA systems offer pre-cise, accurate testing for single-or double-sided PCBs, while eliminating the need for costly fixturing.

Takaya’s APT-1600FD pro-vides average head-speed in-creases of up to 50 percent with throughput improvements of 30 to 50 percent over existing mod-els, making the company’s fastest flying probe test system. The APT-1600FD incorporates a new 10-flying-Z-axis design, in-cluding four vertical flying probes that provide access to test points where conventional an-gled probes fail to contact.

Contact: TEXMAC, Inc., 3370 Montgomery Drive, Santa Clara, CA 95054 % 408-970-9171 E-mail: [email protected] Web: www.texmac.com See at productronica, A3.441

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Within Saint Louis University’s (SLU)Department of Physics, research hasbeen ongoing in the development of

novel techniques for synthesis, characteri-zation and measurement of low dimension-al (1D and 2D) systems. This is in hopes tobetter understand how size, geometry or in-terfacing various materials and nanostruc-tures influences the properties of the result-ing systems.Nanolithography Research

Nanolithography in general terms isconcerned with the study and application offabricating nanometer-scale structures,meaning patterns with at least one lateraldimension between 1 and 100 nm.

A prime focus is very large-scale inte-gration (VLSI) and ultra-large-scale inte-gration (ULSI) technology of nanoelectro-mechanical (NEMS) systems, and the needfor better atomic-scale understanding of is-sues arising from the miniaturization of sil-icon devices.

Under the direction of Dr. Irma Kul-janishvili, who heads up SLU’s nanomateri-als and nanofabrication research lab, thegroup’s focus is on redesigning and imple-menting a nanolithography approach cen-

tered on “direct write patterning” — a scan-ning probe microscopy-based (SPM) pattern-

ing and surface modification method.This approach is similar to a technique

known as dip pen nanolithography. In thistechnique, AFM tips or sharp needles canbe employed to transfer small, femtolitervolumes of molecular solutions, or other liq-uid-based “ink”, to predefined locations onthe surface of samples.

“Carbon nanotubes, graphene and oth-er atomically monolayered materials are be-ing considered as prime candidates fornanoscale science and technology applica-tions, due to their unique and superior com-bination of electrical, thermal, optical andmechanical properties,” says Kuljanishvili.Bad Vibrations

Nanopositioning techniques for SPM-based nanolithography applications aresensitive to mechanical vibrations, andeven acoustic vibrations, on a similar levelto vibration isolation requirements foratomic force microscopy. At Kuljanishvili’slab, these vibrations were coming upthrough the floor, and were primarily of lowfrequency.

“We were using almost nothing for vi-bration isolation,” explains Kuljanishvili.

Vibration Isolation Facilitates Scanning Probe

Nanolithography Patterning

SLU’s negative-stiffness vibration isolation system.

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To achieve a higher level of

vibration isolation, the SLU De-partment of Physics employednegative-stiffness vibration iso-lation. Developed by Minus KTechnology, negative-stiffnessisolators employ a unique andcompletely mechanical conceptin low-frequency vibration isola-tion.

They do not require electric-ity or compressed air. There areno motors, pumps or chambers,and no maintenance becausethere is nothing to wear out.They operate purely in a passive

mechanical mode. “Since the installation of

Negative-Stiffness vibration iso-lation, we have been able to per-form high-resolution patterningat micro and nanoscales, by sig-nificantly eliminating mechani-cal vibrations,” concludes Dr.Kuljanishvili.

Contact: Minus K Technolo-gy, Inc., 460 S. Hindry Avenue,Unit C, Inglewood, CA 90301 % 310-348-9656 E-mail: [email protected] Web: www.minusk.com r

Vibration Isolation Facilitates Scanning Probe Nanolithography PatterningContinued from previous page“Position and mechanical stabil-ity during patterning is essen-tial for this work. Although acoustic vibrations were rela-tively easy to take care of, by in-stalling wall padding and using acoustic enclosures, low-fre-quency mechanical vibrations are generally much harder to fight.”Vibration Isolation

IQE plcIntegratesGlobal MESSolution FromCritical Manufacturing AUSTIN, TX — IQE plc has se-lected Critical Manufacturing’s Manufacturing Execution Sys-tem (MES) to replace legacy sys-tems across its global business. Critical Manufacturing was se-lected following detailed techni-cal discussions and evaluation based on its experience in the semiconductor industry, compre-hensive functionality, and exten-sive configurability.

IQE will be installing the new MES at all its global produc-tion facilities. A core model will initially be deployed at its two facilities in South Wales, and then rolled out globally.

Critical Manufacturing’s MES is specifically designed to handle highly complex processes and will enable IQE to continue to deliver world-leading quality with tight integration between applications and physical manu-facturing equipment.

The MES gives IQE the ca-pacity to readily reschedule pro-duction needs, taking into con-sideration all production factors such as equipment setup and throughput time, manpower and materials availability.

With its ability to integrate processes and systems, IQE will be able to increase the level of au-tomation throughout its facilities. This will lead to improved produc-tion speed, reduced errors, and less need for manual interven-tions, thereby optimizing the uti-lization of IQE resources.

The MES solution is highly modular to deliver all the capabil-ities IQE requires, integrated into a single, unified solution with user configurable, intuitive graph-ical user interfaces.

Users will have access to sup-port their daily process routines through a single application, en-suring they have the correct infor-mation to carry out tasks swiftly and correctly.

The MES is designed to pro-vide complete manufacturing traceability and visibility, ensur-ing correct information reaches relevant users to enable in-formed, fast, and error-free exe-cution of processes.

Contact: Critical Manufac-turing, Inc., 9901 Brodie Lane, Suite 160-240, Austin, TX 78748 %512-291-0068 E-mail: [email protected] Web: www.criticalmanufacturing.comSee at productronica, B1.120

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ELECTRONIC MFG PRODUCTSELECTRONIC MFG PRODUCTS

FREMONT, CA — ViTrox offers afull range of advanced 3D PCBSMT assembly solu-tions, including 3DSPI, 3D AOI, 3D AXI,robotic vision sys-tems, V-ONE, ViTrox’Industry 4.0 solution.

V-ONE, whichenables machine con-nectivity and bigdata analytics. ViT-rox vision solutionsare designed to deliv-er high quality andcomprehensive in-spection capabilitieswith less manual in-spection.

Beyond that,ViTrox vision solutions providean unprecedented experiencewith artificial intelligence capa-bilities, which can effectivelycapture defects and reduce falsecalls. With this power, ViTroxenables users to achieve faster

and more accurate inspectionperformance.

Contact: ViTrox USA, 163 Whitney Place, Fremont, CA 94539 % 970-481-3663 E-mail: [email protected] Web: www.vitrox.com


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v310i solder paste inspection system.

Nov/Dec 2021

INDEPENDENCE, MO —HEMCO’s new ModuLab canachieve strict environmentalcontrol by incorporating HEPAfiltration to regulate air quality

ranging from Class 1,000 to100,000. Modulab can be used inconjunction with dust collectorsto control room dust levels. Pre-cise temperature control can bemaintained with optional modi-

fied cooling systems for lowertemperature requirements. Hu-midity can be regulated withdesiccant systems available forlower humidity requirements.

The ModuLab has a chem-ical-resistant modular con-struction and is flexible anddurable. A variety of options in-clude a wide selection of doors,lighting, plumbing, electricaland lab furniture systems thatcan be factory installed. Modu-Lab is a custom-designed roomenclosure with control systemsthat meet a variety of environ-mental and class clean require-ments. ModuLab is the idealchoice for such industrial appli-cations as powder coating, foodprocessing, seed production,

mining, and bulk solids handling.Contact: HEMCO Corp., 711

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ERLANGER, KY — SEHO SystemsGmbH is now offering new solutions forgreater productivity in electronics pro-duction. With the LeanSelect-plus, SEHOpresents the scalable version of the wellknown LeanSelect, the selective solderingsystem especially for lean production is-land manufacturing. Starting from abasic system, the LeanSelect-plus can beexpanded at any time with additionalmodules and takes up only approximately75 ft2 (7m2).

The assemblies are loaded and un-loaded via two separate transports on thefront. Therefore, the system can be flexi-bly integrated into any produc-tion concept: from manual opera-tion with a simple transverseconveyor, through the individual-ized, semi-automatic worksta-tion, to integration in a fully au-tomated production line withseveral workstations.

The workstations are inte-grated in the system in a count-er-clockwise U-shape. All processsteps are fully automated andare continuously monitored.

When it comes to equippingthe workstations, the LeanSe-lect-plus shows its flexibility:fluxers, preheating stations, sev-eral soldering units and addition-al processes such as cooling sta-tion, and a selective brushingunit for automatic solderingpoint cleaning can be added ontothe system. It also supportsSEHO’s PowerVision AOI systemwhich is designed for THTprocesses.

The LeanSelect-plus is ideal-ly suited for the LongLife solder-ing nozzles developed by SEHO,which significantly reduce thesystem’s consumption costs. A

highlight of LeanSelect-plus is the newly developed software component Smart-Split, which turns an efficient system for batch production into an innovative se-lective soldering system. SmartSplit is an intelligent software that controls and coordinates the process flow for different assemblies in mixed operation.

Contact: SEHO North America, Inc., 1445 Jamike Avenue, Suite 1, Erlanger, KY 41018 % 859-371-7346 fax: 859-282-6718 E-mail: [email protected] Web: www.seho.de/en/north-america



High-Mix/High-Volume Production Systems from SEHO

LeanSelect-plus selective soldering system.

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NASHVILLE, TN — KYZEN isnow offering its E5325 spray-in-air maintenance and pallet clean-er and AQUANOX A4727 next-Generation aqueous assemblycleaner. KYZEN E5325 is used inspray-in-air applications to effec-tively and efficiently perform of-fline maintenance cleaning to re-move even the most difficult flux-es and solder pastes from pallets,wave solder fingers, reflow oven

parts and associated tooling.E5325 has proven compati-

ble with aluminum, copper, andsteel as well as standard materi-als used in reflow oven systems,wave solder and associated tool-ing. KYZEN E5325 is a low odorsolution that delivers successfulresults with minimal exposuretime. The solution will reduce


ITW EAE, MPM, Camelot,Electrovert, Vitronics Soltek

Coming to productronicaLAKEVILLE, MN — ITW EAE isplanning to showcase its latestdevelopments at this year’s pro-ductronica. The company willshare advancements it has madeon interface solutions for Indus-try 4.0/MES that will lead to im-provements in yield, data collec-tion and overall equipment effec-tiveness. Also exhibiting will beMPM, Camelot, Electrovert, andVitronics Soltec.

MPM will be presenting livedemonstrations of the Edison IIACT™ (Automatic ChangeoverTechnology) which is in the finalstage of development. Thispatent-pending technology pro-vides a simple, cost-effective so-lution that can be implementedin progressive stages towardsfull automation.

Camalot will provide a sneakpeek at an advanced tilt and ro-tate dispensing solution. This in-novative and new Camalot designreduces wet out areas and im-

proves capillary flow for underfill and provides access to dispense on side walls underneath or around tall components.

Electrovert will reveal a new auto exit wing that is under de-velopment. It automatically ad-justs to achieve proper wave flow characteristics to avoid bridging and solder splashing.

Vitronics Soltec will feature ZEVA selective soldering solu-tions with the patented SDC de-bridging tool which is now inte-grated with the n2 cone. This de-sign is only feasible with the de-sign freedom of 3D metal print-ing technology. The nozzle is 3D printed out of stainless steel and is then hard chromized.

Contact: ITW EAE, a divi-sion of Illinois Tool Works, 8860 207th Street West, Lakeville, MN 55044 % 952-469-8278 E-mail: [email protected] Web: www.itweae.com


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processing, multi-conductor cables and multi-layer insulation material can be processed quickly,

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E5325 is compatible with aluminum, copper, and steel. maintenance and machine down-time, therefore increasing pro-duction and reducing overall cost. KYZEN E5325 has no VOCs, making it an environmen-tally friendly chemistry.

AQUANOX A4727 is engi-neered to be effective, stable and predictable. It is designed for reli-able production and assembly op-erations. The advanced technolo-gy provides a stable pH and pre-dictable compatibility through out its long bath life.

Contact: KYZEN, 430 Hard-ing Industrial Drive, Nashville, TN 37211 % 615-831-0888 E-mail: [email protected] Web: www.kyzen.com

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DULUTH, GA — Viscom AG ispresenting its latest inspectionsystems and solutions for thewidest possible range of the elec-tronics industry’s testing re-quirements at this year’s produc-tronica.

The biggest advances weremade in the new Viscom iX7059generation of inline X-ray sys-tems which covers a broad spec-trum of current and future re-quirements with, as one of itsspecial features, flexible inspec-tion concepts that have a muchwider application than classicprinted circuit boards. The 3DAXI system iX7059 heavy dutyInspection which belongs to thisnew generation will be on viewat productronica. Its uniquecharacteristic is its rapid han-dling of inspection objects weigh-ing up to 88.2 lb (40 kg) and stateof the art X-ray technology withpowerful radiation.

The iX7059 is customized inparticular to handle encasedcomponents and the require-ments of power electronics. Typi-cal uses include electromobility,telecommunication, and renew-able energy.

With a new generation offlat panel detectors, the powerfulcomputer tomography of theiX7059 systems provides excel-lent slice images, optimal pres-entation, and simple verification.The innovative dynamic 3D Evo-lution 5 imaging technology en-ables several hundred images tobe captured from a number ofdifferent viewpoints in just a fewseconds to obtain an unambigu-ous 3D analysis.

Void sizes and percentage

incidence in the overall surfaceof the soldered joint are meas-

ured during inspection. The iX7059 will also detect mechani-cal damage, twisted, missing and incorrect components as well as the degree of filling and pin heights in THT solder joints.

Contact: Viscom, Inc., 1775 Breckinridge Parkway, Suite 500, Duluth, GA 30096 % 678-966-9835 E-mail: [email protected] Web: www.viscom.com

See at productronica, A2.177iX7059 3D AXI system.

Viscom Launches Next-Gen X-Ray Inspection Systems

www.cyberoptics.comCopyright © 2021. CyberOptics Corporation. All rights reserved.

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Powered by Multi-Reflection Suppression™ (MRS™) sensor technology, the new 5 Micron Ultra-High Resolution MRS sensor offers unmatched accuracy by meticulously identifying and rejecting reflection based distortions caused by shiny components and surfaces. The result is ultra-high quality 3D images, high-speed inspection and metrology, and improved yields and processes.

Count on the SQ3000+ for superior performance for advanced applications including advanced packaging, mini LED, advanced SMT applications for medical, military, aerospace, electronics, 008004/0201 solder paste inspection, socket metrology and other high-end CMM applications.

Omron Debuts 3DAOI SystemHOFFMAN ESTATES, IL —Omron Automation Americas has introduced its VT-S10 series of AOI machines, which features a new kind of imaging technique and artificial intelligence.

In order to overcome the limitation of present-day 3D AOI technology, Omron’s patented approach combines the most ad-vanced illumination, sophisticat-ed image processing and full 3D measurement data.

The shadow and secondary reflection impacts common to 3D AOI have been eliminated through new hardware developments like quad, MPS (multi-phase shift) pro-jectors that allow for stable inspec-tion across the PCBA.

Combining the high-preci-sion solder shape reconstruction from Omron’s new and advanced 3D AOI system along with high-speed 3D CT AXI capabilities, improves the overall quality of the manufacturing process.

Contact: Omron Automation Americas, 2895 Greenspoint Parkway, Suite 200, Hoffman Estates, IL, 60169 % 847-575-6515 E-mail: [email protected] Web: www.automation.omron.com

See at productronica, A2.433 SEMICON West, Booth 1639See at productronica, A2.244 and

http://www.cyberoptics.com/


Acentury ago, Ernst Sachs launched in-dustrial soldering by developing andmass-producing the first electric solder-

ing iron. November 18, 2021 marks the begin-ning of the company, and what could be morefitting that to celebrate it at productronica?Yesterday, Tomorrow and Beyond

When Ernst Sachs applied for a patentfor the first electric soldering iron on July 8,1921 and founded his company Ersa inBerlin on November 18, 1921, he was in goodcompany. Major electrical pioneers such asSiemens and Bosch had already been activefor years, and

In the same year, Bosch founded his carrepair shops, and Max Braun started hiseponymous electrical appliance company inFrankfurt am Main. In the first years afterthe patent application, Ernst Sachs did wellwith the H1 soldering iron.

Fundamental inventions from this time,such as the protective contact plug (“Schukoplug”), promoted the international distribu-tion of the new Ersa standard solderingirons. After the new start in Wertheim withthe end of the Second World War, the pace ofinnovation picked up. In 1947, the initial ver-sion of the Ersa 30 soldering iron was pre-sented at the first export trade fair inHanover, followed in the 1950s by the firstpower regulated Ersa soldering irons.

The economic upswing of the postwarperiod was linked to an increasing demandfor consumer electronics such as radio re-

ceivers, tape recorders and television sets.With the beginning of the 1950s, demand andquantities increased rapidly, and the manualassembly of electronic devices reached itseconomic limits. In this situation, the indus-try remembered Paul Eisler, who had al-ready applied the printed circuit board forpatent in 1943. The introduction of the print-ed circuit board into electronics production inthe early 1950s enabled the rapid, repro-

ducible manufacturing of electronic assem-blies in high volumes.Development of Wave Solder

The soldering of wired componentsbegan as a manual process. However, as thenumber of components on the assemblies in-creased, manual soldering became a produc-tion bottleneck. Fry’s Metals solved this chal-lenge with the invention of the solder wave in1955, which was granted a patent in 1958 forwhat is now the foundation of all wave sol-

dering systems.Ersa recognized the potential of this de-

velopment and in 1961 began selling Flow-solder soldering systems from Fry’s Metals.

In 1968, the development of Ersa’s ownsoldering systems began. The first EST se-ries was followed by other well-known wavesoldering systems such as MODULINE, ETS,EWS, N-WAVE and finally the current gen-eration of POWERFLOW, which allows high-est flexibility and throughput under nitrogenatmosphere.

In the history of wave development,Ersa has set many benchmarks — automatictransport systems, double-wave solderingunits, program-controlled soldering systems,soldering in a nitrogen atmosphere and de-velopments for flux-free soldering such as So-No-Clean.

Today’s Ersa wave soldering systemsprocess PCB sizes up to 600 x 800 mm, whichaccommodates the assemblies needed in theconstruction of the 5G mobile communica-tions infrastructure.Miniaturization

Another upheaval in global electronicsmanufacturing was the establishment of sur-face mount technology (SMT) in the early tomid-1980s. This technology dispensed theclassic holes in circuit boards through whichthe wired components are inserted and sol-dered from below. In SMT, placement andsoldering are done on the same PCB side,

For a century, Ersa’s soldering tools and systems have expanded theboundaries of electronics production.

“Global. Ahead. Sustainable.” Kurtz Ersa Celebrates 100th Anniversary

By Rainer Krauss and Hansjürgen Bolg, Kurtz Ersa GmbH



https://www.viscotec-america.com/


In the field of selective solder-

ing, Ersa’s modular VERSA -FLOW platform can be tailored toa range of applications. The com-pact SMARTFLOW and ECOSE-LECT are suitable for standaloneproduction, while high-end sys-tems like the VERSAFLOW 3/66can handle up to three meter 5Gmobile antenna units.

The technological superiori-ty is reflected in solutions suchas integrated AOI systems forquality assurance or the VER-SAFLEX modules, in which twosoldering units work independ-ently on separate axis systems inone solder module.

With the innovative Indus-try 4.0 approach “Kurtz ErsaConnect,” Ersa offers its cus-

tomers a smart solution viawhich services, machines andproduction can be centrally net-worked and controlled. As a sys-tem provider, Ersa increasinglyrealizes integrated automationsolutions from a single source inaddition to pure systems andproduction lines.

Together with the group’s

sister company Kurtz Ersa Au-tomation GmbH, innovative proj-ects are implemented in close, perfectly coordinated cooperation that sustainably increase effi-ciency and productivity.

Kurtz Ersa as a globally oper-ating group with nine demo cen-ters, twelve sales and service sub-sidiaries as well as partners in more than 70 countries. Today, the company focuses on operating as “one family,” creating the basis for a sustainable future driven by innovative technology.

Contact: Kurtz Ersa, Inc., 1779 Pilgrim Road, Plymouth, WI 53073 % 920-893-1779 E-mail: [email protected] Web: www.ersa.com rSee at productronica, A4.171VERSAFLOW

selective soldering system.

Kurtz Ersa Celebrates 100 YearsContinued from previous page

which allows the top and bottom of the PCB to be used to build the circuit.

Initially the distribution of reflow soldering systems was based on infrared radiation from an American partner, but from 1986 onwards the company de-veloped its own first reflow gen-eration with the Ersa ERS se-ries. It used a combined radia-tion and convection heating that enabled soldering in a nitrogen atmosphere in the Ersa ERS 506.

Increasing market demands led to the introduction of the HOTFLOW full-convection sol-dering systems in 1993, the next generation of which Ersa is pre-senting at its 100th anniversary. The EXOS rounds off the product range in the reflow sector - it is based on the successful HOT-FLOW series, but also features a vacuum chamber for almost void-free soldering joints.

In the soldering tools sector, further soldering stations were developed at this time with in-ternally heated, replaceable sol-dering tips, sensor-based tem-perature measurement and con-trol. The range of applications for hand soldering tools was in-creasingly expanded — from pure production tools to tools for de-velopment and prototype con-struction, which also were used in rework and service. Going Lead-Free

In 2006, the introduction of lead-free solders required the company to develop tools that could handle the demanding heat requirements. The company launched its i-CON soldering station and 150W i-TOOL solder-ing iron.

For printing, the company now offers its VERSAPRINT 2, which is a printer with integrated 2D or 3D inspection. The latest i-CON soldering stations are gradu-ally giving up their pure stand-alone existence by the integration into soldering robots such as the SOLDER SMART. With the i-CON VARIO 4, Ersa offers a four-channel soldering station that si-multaneously provides the user with one ready-to-use hot-air sol-dering iron, one soldering iron as well as a pair of SMD desoldering tweezers and one THT desolder-ing iron.Strategic Innovation

But let’s go back to the 1990s: Parallel to the SMT main-stream, it was still necessary to solder wired components onto al-ready reflow-soldered assem-blies. In 1996 this resulted in the VERSAFLOW technology. The success of the VERSAFLOW 3 generation, which has been man-ufactured since 2009, has led to 1,500 systems now installed worldwide.

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CLEVELAND, OH — Ultrasonicscan penetrate fine-pitch and ultrafine-pitch areas that spray sys-tems cannot reach. The most im-portant feature of stencil cleaningis the chemistry. Smart Sonic’s440-R SMT detergent is activatedutilizing one of the Smart Sonicultrasonic stencil cleaners.

All Smart Sonic cleaners useside-mounted “sweep frequency”ultrasonic transducers to providethe ultimate in cleaning efficien-cy by directing the nondestruc-

tive ultrasonic energy toward thesurface to be cleaned.

Each Smart Sonic cleanerhas been engineered and ultra-sonically powered to meet the taskof removing even dry RMA solderpaste and post solder flux buildupsafely and completely in seconds.

The Model 6000 stencil clean-er is a fully automatic ultrasonicsystem that utilizes 440-R SMTdetergent solution. The wash timeis completed in approximately oneminute and rinsing in less than 10

seconds. An optional handhelddryer is also available. Low-pres-sure dry compressed air can be ap-plied to dry a stencil in about twominutes.

In addition to the ultrasoniccleaners, the EZ-0 evaporatorworks in conjunction with ourstencil cleaners and provideszero discharge and environmen-tal peace of mind. Smart Sonicevaporators are designed to meetthe rigid requirements and de-mands of the printed circuitboard industry.

The wash water from the stencil cleaner is fed to the evap-orator via the transfer pump. The water is boiled off and the re-maining solids can be hauled away. Expected evaporation rate is 3 to 5 gallons per hour.

Contact: Smart Sonic Corp., 837 E. 79 Street, Cleveland, OH 44103 % 818-610-7900 E-mail: [email protected] Web: www.smartsonic.com


High-resolution X-ray Technology

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APEX 2022APEX 2022

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Clean Fine-Pitch Stencils with Smart Sonic’s 440-R

Model 6000 automated ultrasonic cleaner.

BTU DemosNew FluxManagementTechnologyNORTH BILLERICA, MA — BTU International is showcasing its Aqua Scrub™ Flux Management Technology as well as a PYRA-MAX™ 125A at this year’s pro-ductronica. Aqua Scrub Technolo-gy is BTU’s next-generation solder reflow flux management system.

The patent-pending design uses an aqueous-based scrubber technology compatible with most known paste and flux types. The flux and solution are automatical-ly contained and packaged for dis-posal. The Aqua Scrub Technology has a very attractive cost of own-ership and is designed to decrease operational cost by four times compared to traditional condensa-tion systems. Reduction in cost can be attributed to reduced downtime, labor and disposal costs. The Aqua Scrub is purpose-built as a stand-alone system that can be easily retrofitted on PYRA-MAXreflow ovens already in the field as well as being configured on new PYRAMAX ovens. This self-contained unit mounts on the back side of the oven to minimize the impact on oven operation and factory floor space.

Contact: BTU International, Inc., 23 Esquire Road, North Billerica, MA 01862 % 978-667-4111 Web: www.btu.com


See at productronica, A2.249 and SEMICON West, Booth 1051

https://nikonmetrology.com/en-us/

ROSWELL, GA — Highlydurable and reliable electroniccomponents are of great impor-tance for many sectors, such asthe energy sector or medicaltechnology. An LED headlight ina vehicle or the charging stationof an e-vehicle produces a lot ofheat that must be reliably dissi-pated via gap filler or heat con-ducting materials.

Even stricter requirementsapply in medical technology.High-quality applied protectivematerials in products such asPCA probes, spinal cord stimula-tors or cardiac pacemakers areabsolutely vital.

With Rehm’s Protecto dis-

pensing and coating systemsmanufacturers can protect elec-tronic assemblies in a variety ofways and thus ensure the func-tionality of the assembly. For anoptimal result, a vacuum can beapplied after the material appli-cation with the RDS VAC inorder to reduce possible air inclu-sions (voids) and thus meet thehigh quality demands on theelectronics.

The precision dosing needleof the Protecto brings the materi-al so close to the edge of the com-ponent that the capillary force

pulls the protective coating underthe component. Since air inclu-sions cannot be completely ruledout in this process despite all theprecision, these are then reduced

to an absolute minimum. The result is a highly reli-

able assembly. With a vacuum value between 100 mbar and 10 mbar, pore area fractions of less than 2 percent are possible. The pressure curve and the speed at which the vacuum is pulled can also be set individually.

Contact: Rehm Thermal Systems, LLC, 3080 Northfield Place, Suite 109, Roswell, GA 30076 % 770-442-8913 fax: 770-442-8914 Web: www.rehm-group.com

See at productronica A4.335


Reduce Voids During Soldering with Vacuum from Rehm

Void reduction is becomingcritical in auto applications.

KIC OffersSolutions forSolderProcess OptimizationSAN DIEGO, CA — Along with reflow process inspection (RPI) and wave process inspection (WPI), the KIC team will discuss NPI set up, process and recipe optimization for reduced defects, improved OEE, oven perform-ance tracking, and their com-plete ecosystem of solutions for thermal processes.

KIC has solutions for chal-lenges such as handling process audits, automating manual pro-filing and data reporting tasks, MES connectivity, Industry 4.0 implementation, NPI process setup, reducing solder defects (voiding, head in pillow, tomb-stoning), and more.

Electronics manufacturing today requires automated and real-time process control and traceability. Like SPI and AOI are for optical inspection, inspec-tion of the production reflow temperature profile is a must.

Process control, traceability and quality solder joints can be delivered with real-time inspec-tion capabilities.

The latest addition to the thermal process inspection fami-ly is KIC’s WPI, bringing its award winning technology and thermal experience to the wave solder process. WPI provides users with automatic profiling —including dwell time and paral-lelism measurement for each production board — real-time preheat and wave analytics, and automatic SPC charting.

Contact: KIC, 16120 W. Bernardo Drive, San Diego, CA 92127 % 858-673-6050 E-mail: [email protected] Web: www.kicthermal.com


https://www.nordson.com/en/divisions/electronics-solutions


Antiviral and antibacterial are familiarterms to most of us. They fight virusesand bacteria, respectively. Antimicro-

bial, however, refers to microbes. Microbesinclude bacteria, many fungi and spores, mi-croscopic algae and protozoa. Viruses are alsousually included, although these are not liv-ing organisms in the true sense of the word(they have no metabolism of their own).

Antimicrobial substances are substancesthat inhibit the growth of microorganisms oreven kill them. This approach is not new, andconsequently various solutions coexist on themarket. All disinfectants, for example, areclassified as antimicrobial substances.

However, there are also high-tech sur-face structures that have an antimicrobial ef-fect through the disinfecting action of silverand copper or by means of nanostructuresmade of titanium dioxide.Photodynamic Self-Purification

The principle of photodynamics is basedon the excitation of a photocatalyst by meansof light waves from the visible spectral range.The transfer of energy to the ambient oxygen

produces what is known as singlet oxygen.This particularly reactive oxygen species ef-fectively kills microorganisms by oxidation.

Many infectious diseases are transmit-ted via contaminated surfaces and is knownas “smear infection.” Antimicrobial coatings,varnishes and paints can be applied to count-

less surfaces. They are therefore ideal for fa-cilities where high and the highest standardsof hygiene are required. These include hospi-tals, the food industry, schools, or even re-

tirement homes. Depending on the pathogen, microorganisms can remain active for up to 16 months.

SCHURTER tested switch coatings in collaboration with a German manufacturer of specialized paints and varnishes. Only switches with a circumferential groove, such as switches with a mechanical stroke, are somewhat more difficult to coat, since the coating could flow into the interior of the switch.

For these, the coating would have to be limited to the actuator and would have to be applied before final assembly. All completely sealed SCHURTER switches (piezoelectric, capacitive or ToF) are perfectly suited for this upgrade.

SCHURTER now offers this upgrade as a customer-specific variant. After all, switch-es are one of the most common interfaces be-tween man and machine.

Contact: SCHURTER, Inc., 447 Avia-tion Boulevard, Santa Rosa, CA 95403 % 707-636-3000 fax: 707-636-3033 E-mail: [email protected] Web: www.schurterinc.com r

Completely sealed switches such as the SCHURTER PSE are ideal for

antimicrobial coating.

Antimicrobial Switches Protect Users from Infectious Disease

By the Staff of SCHURTER AG

https://www.camiresearch.com/videoclips/


SHINGLE SPRINGS, CA — PDRhas introduced its GenX-130P X-ray system. The system offers re-markable image clarity with pro-prietary HD camera systems,flat panel detector choices, cus-tomizable software solutions,image chain optimization config-urations per applications, state-of-the art motion control andboard rotation options foroblique X-ray imagery.

The compact GenX-130P ac-commodates PCB sizes up to 21 x17.5 in. (533 x 445 mm). Cus-

tomizable flat panel detectors orimage intensifier options areavailable to meet varying appli-cation requirements. Additional-ly, the high-performance X-raysystem offers programmablefour-axis fully motorized motioncontrol. PDR X-ray cabinets areengineered to exceed industrialX-ray safety standard require-ments on three continents.

The GenX130P and all PDRX-ray systems are upgradeable tohigher kV X-ray sources should acustomer’s requirements changeover time. This is achievable due

to PDR’s focus on radiation safetyand a highly shielded X-ray cabi-

net design. PDR’s X-ray systems set a new industry standard for high quality X-ray images at an affordable price. X-ray for quality control or X-ray for process control can be vital to the success of both PCB inspection programs as well as for semiconductor inspection, counterfeit detection, and failure analysis.

Contact: PDR Americas, 3869 Dividend Drive, Shingle Springs, CA 95682 % 530-676-6262 E-mail: [email protected]: www.pdr-rework.com/americasGenX-130P X-ray system.

PDR Introduces Next-Gen X-Ray Inspection System

PRESENTING OUR NEXT ACT

COMINGSOON!

See a live demo at Productronica Hall A4, stand 554, November 16-19and at APEX Booth 1433, January 25-27, 2022

Automatic Changeover Technology® Edison II ACT™ Printer

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A division of Illinois Tools WorksLearn more at www.itweae.com

FREMONT, CA — Juki Automa-tion Systems (JAS), Inc., haslaunched a new component inser-tion system, the JM-50. The sys-tem is equipped with Juki’s ad-vanced TAKUMI placement head.

This head automatically ad-justs its height to provide the opti-mal speed and component han-dling at the same time. It can pickwith up to four nozzles at thesame time. The JM-50 is support-ed by Juki’s JaNets line control

JM-50 insertion system. software, along with all other cur-rent pick-and-place models.

This makes it easy to pro-gram the entire line from one software package. Laser and vi-sion inspection allow the JM-50 to inspect the leads and the body of a component and a lead correc-tion unit straightens and cor-rects bent leads.

Multiple nozzle types are available, including vacuum, axial, gripper, and mini chuck, and the system can handle radi-al, axial, stick, bowl, tray, and SMT tape feeders. The new MVF feeder enables the JM-50 to han-dle bulk components.

Contact: Juki Automation Systems, 412 Kato Terrace, Fre-mont, CA 94539 % 510-468-6213 E-mail: [email protected] Web: www.jukiamericas.com


JukiLaunchesJM-50 InsertionPlatform


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Nordson T&I: X-Ray Counters, AOI and Acoustic

Imaging SystemsVISTA, CA — Nordson Test & In-spection offers a comprehensiverange of test and inspection sys-tems. The DAGE Quadra™ se-ries X-ray inspection containsproprietary QuadraNT™ sealedX-ray tube technology which al-lows the user to non-destructive-ly inspect obscured areas insidedevices and components at up to68,000 times magnification.

Assure Flex Automation is afully automatic, operator-freereel counting solution. Tailored

to the user’s specific needs, abroad spectrum of loading andunloading options are availablefor high throughput standaloneoperation.

The Gen7 C-SAM inspectionsystem is the latest generation inacoustic micro imaging. TheGen7 delivers the most advancedhardware ever available allow-ing new features and analysisthat can now be completed fasterthan ever before.

Advanced features such asPolyGate, SonoSimulator, virtu-al rescanning mode (VRM) andfrequency domain imaging (FDI)add value and confidence.

With its large, easy access il-luminated scanning area, theGen7 has the capability to effi-ciently scan parts up to 13.8 in.

(350 mm) in size.Also, the FX-940 AOI sys-

tem offers high-speed PCB as-sembly inspection with excep-tional defect coverage, inspectingsolder joints and verifying cor-rect part assembly, enablingusers to improve quality and in-crease throughput.

DAGE AssureFlex X-ray component counter.Contact: Nordson DAGE,

2370 Oakridge Way, Suite B, Vista, CA 92081 % 510-683-3930 E-mail: [email protected] Web: www.nordson.com

REDEXPERT. Würth Elektronik’s online platform for simple

component selection and performance simulation.

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Advanced X-Ray Component Countersfrom VJ Electronix

CHELMSFORD, MA — Demandfor high-performance X-ray com-ponent counters continues togrow amidst the worldwide elec-tronic component shortage. In-creased risk of line down situa-tions from stock-outs or inaccu-

rate inventory management is asignificant concern.

An XQuik component count-ing system from VJ Electronix isone of the best choices for elec-tronics manufacturers lookingfor a solution that is highly accu-rate, cost-efficient, and reliable.

The XQuik III and XQuik IIPlus meet the demands of today’s

complex inventory requirementswith advanced AI componentrecognition, extremely fast cycletimes, 99.8 percent accuracyacross a wide range of compo-nents, real-time MES/ ERP up-dates, sim ple user interface, and

competitively low pric-ing. Both the XQuik IIIand XQuik II Plus aredesigned for automa-tion flexibility. VJElectronix offers turn -key robot systems andcustom ized interfacesolutions for customerspecific automation in-tegration. XQuik robot-ic loading and transfer,and pass-through au-tomations are in opera-tion at customer sitesworldwide.

VJ Electronix alsoplans to give Produc-tronica attendees a

sneak-peak of a new advanced X-ray inspection system set to be released in the first half of 2022.

Contact: VJ Electronix, Inc., 19 Alpha Road, Chelmsford, MA 01824 % 978-486-4777 E-mail: [email protected] Web: www.vjelectronix.comSee at productronica, A2.165

XQuik II and XQuik II Plus X-ray component counters.

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Nov/Dec 2021www.us - tech.com

Seica Showcases FlagshipFlying Probe Tester

HAVERHILL, MA — Seica’s flag-ship Pilot V8 is an extensive fly-ing probing test platform. Thissystem offers full in-circuit test-

ing as well as onboard program-ming, using the company’s inno-vative Device Clip programmerand integrated Flypod option,which ensures quick, reliable con-nection to any connector or pro-grammable device on the DUT.

To enhance test coveragewhere traditional ICT test meth-ods may not be used, the Flypodcan also provide access to the DUTfor third-party boundary scan testsolutions, to perform cluster testsand run BSD files. Power up testcapability enables many addition-al test techniques to be applied,

such as LED testing.In addition, Seica’s Quick-

Test software environment allowsthe user to easily generate and in-

corporate functional test routines within full ICT test programs. Whether the need is to test large PCBs, probe cards where pad sizes are less than 32µ, or even for high-frequency tests ranging over 4 Ghz, Seica has a unique, but standard solution.

Contact: Seica, Inc., 110 Avco Road, Haverhill, MA 01835 % 603-890-6002 E-mail: [email protected] Web: www.seica-na.com

See at productronica, A1.445, and SEMICON West,

Booth 1361

Pilot V8 flying probe tester.

PVA Unveils New Features for AutomatedCoating and Dispensing

COHOES, NY — At productroni-ca 2021 PVA is demonstrating itsDelta 8 conformal coating anddispensing system with some in-novative new features. PVA’snew Valve Tool Changer featurecan accommodate four additionalvalves in the machine that canbe automatically picked up andused at any time. Users can nowincrease the number of applica-tions each machine can satisfywithout sacrificing valuablework area.

Fifth Axis Tilt is a motorizedprogrammable tilt that can beconfigured to adjust to any anglebetween –45° to 45°. This flexi-bility allows greater part accessi-bility for more accurate dispenseand spray processes. Ideal for se-lective coating, potting, bead,and meter-mix dispensing appli-cations, the Delta 8 is designedfor maximum flexibility and canbe configured for custom assem-bly applications.

The Delta 8 has many op-tions and integrated features in-cluding: repeatability of ±25 mi-crons; patented servo-controlledoptional four-axis motion featur-

ing valve tilt and rotate; an on-board PC; and PVA’s exclusivePathMaster programming envi-ronment.

Delta 8 coating and dispensing system.

Contact: PVA, One Mustang Drive, Cohoes, NY 12047 % 518-371-2684 E-mail: [email protected]: www.pva.net


https://www.icape-group.com/

Nov/Dec 2021 www.us - tech.com

ViscoTec Dispenses ComplexPotting Compound for Auto

KENNESAW, GA — ViscoTec’sdispensing technology was re-cently employed by Strama-MPSMaschinenbau GmbH & Co. KG,an automaker. The dispensingapplication in the field of batteryproduction poses some chal-lenges, both in terms of the na-ture of the material to be dis-pensed and the mixing ratio ofthe components.

A two-component PU adhe-sive has to be dispensed. Compo-nent A has a high viscosity (be-tween 190,000 to 250,000 mPas)and contains mineral, abrasivefillers. Component B has a verylow viscosity (between 300 to 700mPas). In addition to the differ-ent viscosities of the components,there is also an extreme mixingratio: 100:9 of weight or 100:17.7of volume.

The material describedabove is applied to a heatsink ina meandering pattern. Theheatsink is used in battery pro-

duction for the automotive in-dustry. In order to be able to op-timally dissipate the heat gener-ated, it must be wetted with ex-actly 95 percent thermal paste.

After application, the paste is pressed into place. In order to be able to rule out defects at a later stage, the amount of paste applied is monitored and weighed.

Component A of the material to be dispensed is fed by a Vis-coMT-XL with a 200l stirring tank, including degassing and heating. Component B is fed by a ViscoTreat-R with an 80l tank and a flux pump. A ViscoDuo-VMP dispenser is responsible for the actual dispensing. Compo-nent A is additionally heated to ensure a better flowability of the material. The volume to be ap-plied is very high, at up to 10 ml per second.

The in-house technical cen-ter, in close cooperation with the customer, the dispensing special-ists at ViscoTec developed a dedi-cated mixing helix which contains more mixing elements than usual over the same length.

Contact: ViscoTec America, Inc., 1955 Vaughn Road NW, Suite 209, Kennesaw, GA 30144 % 770-422-4281 E-mail: [email protected] Web: www.viscotec-america.com


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SAN JOSE, CA — SHENMAOAmerica is now offering a widerange of products, including lead-free solder pastes, solder wires,solder bars, solder spheres, andsolder preforms. The company’sproducts are available from NeVo.

SHENMAO’s PF918-P250paste is formulated with the newSn4Ag3Bi Alloy design with highthermal impact reliability. PF918-P250 can increase thermal relia-bility performance by a minimumof 30 percent. It provides bettermechanical shock performancethan typical solder alloys such as

SAC305 and SAC405, and is suit-able for use in consumer electron-ics, servers and automotive elec-

tronics applications.PF918-P250 has a similar

melting point to SAC305 so thatthe regular SAC305 reflow profilecan be applied. With the innova-tive flux design, voiding can beeasily controlled to less than 10percent. With a wide reflow win-dow, PF606-P245X can easily fitinto the process of the most com-plicated PCB designs. The specialalloy design provides excellent re-liability and improves the life ofelectronic assembly products. Thenew paste has been developed forhigh-speed network and commu-

nication applications.Shenmao’s PF606-P245X

lead-free temperature solder paste is specially designed to provide long-term stability over a wide range of temperature con-ditions. Compared with common pastes, the no-clean paste pro-vides consistent printing per-formance, low voiding, stable vis-cosity life, and excellent testabil-ity. With the wide reflow win-dow, it even can be easily fit into the process of the most compli-cated PCB design.

Contact: SHENMAO Ameri-ca, Inc., 2156 Ringwood Avenue, San Jose, CA 95131 % 408-943-1755 E-mail: [email protected] Web: www.shenmao.com

See at productronica, A4.311TECHNICA, U.S.A.Fulfilling Manufacturing Needs Throughout the Electronics Industry

•Fast setup & changeover

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xcellent choice for High Mix, Medium Volume Production

1-800-909-8697www.technica.com

Available in the United Statesexclusively through Technica U.S.A.

SHENMAO Releases New Solder Pastes

PF606-P245X solder paste.

C

CLEARWATER, FL — Solder-star has launched a zero set-up datalogger for thermal profiling, the SLX. It has been designed for operation with zero measure-ment set-up, so it is instantly ready to use making the process of data capture quick and easy.

The new Solderstar SLX is an accurate, robust, ultra-compact, battery powered datalogger used for measuring and recording process parameters from any sol-dering process. The SLX unit can be docked onto any SMARTLink reflow heat shield or other process accessory and will auto-configure itself for data capture.

Unlike traditional datalog-gers, SLX automatically detects what test adapter is connected and intelligently auto configures the information. The system al-lows fast, accurate and noise-free measurements to be made from up to 12 temperature channels while simultaneously measuring from other secondary process pa-rameter sensors. If higher chan-nel counts are required then the new SLX can extend to 24 or 36 channels with special adapters.

The new unit features USB download speeds 10 times faster than previous models, 2.4Ghz telemetry options along with in-creased measurement range all while maintaining accuracy to within half of one degree centi-grade.

ontact: Solderstar LLC, 4500 140th Avenue N, Suite 101, Clearwater, FL 33762 % 727-461-2270 fax: 727-538-4237 E-mail: [email protected] Web: www.solderstar.com


SolderstarLaunchesZero Set-UpDatalogger

https://www.technica.com/


ROWLEY, MA — In addition to its latest in-tegrated SMT line, along with advanced jetprinting, dispensing and material handlingsolutions, Mycronic is highlighting recent ad-vances in 3D inspection technologies, processanalysis tools and process control software.

As electronics assembly continues togrow more complex, with a trend towardssmaller batch sizes and less predictable pro-duction environments, Mycronic will offer anarray of new opportunities to enhance manu-facturing agility.

High-reliability manufacturers will alsohave the opportunity to discoverhow Mycronic’s solutions canhelp secure their output qualityfor mission-critical applicationssuch as aerospace, medical or ad-vanced driving assistance, wherefailure is not an option.

The MYPro Line is the com-pany’s integrated SMT line solu-tion. The MYPro Link software,which correlates data betweensolder paste inspection and auto-mated optical inspection, nowfeatures even more interconnect-ed process controls to further im-prove inspection efficiency and

line performance.The company’s award-winning solder

paste inspection and jet printing repair sys-tem is also available, which is an example ofhow smart process integration can eliminate

defects and automatically increase first pass yield. This solution will prove especially use-ful in electronics manufacturing for automo-tive applications, where rework of PCBs is typically not allowed. In addition, the new MYCenter Analysis software will provide op-portunities to simplify production and en-hance overall equipment effectiveness.

Contact: Mycronic, Inc., 320 Newburyport Turnpike, Rowley, MA 01969 % 978-948-6919 fax: 978-948-6915 Web: www.mycronic.com


Mycronic integrated SMT line.

Mycronic Highlights PCB Assembly Process Control Systems

ECD to Demo Solder SystemProcess ControlMILWAUKIE, OR — ECD’s line-up includes various systems for solder process control. Highlights include ECD’s OvenSENTINEL™ continuous monitoring software and its brand new SelectiveRID-ER™ verification pallet.

Process optimization across soldering disciplines is enabled by ECD’s standard-setting M.O.L.E.®

in-transit thermal profiling de-vice, which interfaces with all sol-dering process measurement pal-lets for a holistic approach and fu-ture-proofing confidence.

For reflow soldering process control, ECD’s OvenSENTINEL TrueProfile™ capability allows extended measures to provide a more thorough and customizable traceability record.

New Profile SnapShot™, al-lows on-demand profile viewing and data generation, and makes OvenSENTINEL an even more powerful yield-enhancing, cost-saving system. Along with the ECD M.O.L.E. thermal profiler, tools such as OvenRIDER™ and ECD’s tough thermal barriers, OvenSENTINEL closes the loop on reflow soldering processes.

Contact: ECD, 4287-B SE International Way, Milwaukie, OR 97222 % 503-659-6100 E-mail: [email protected] Web: www.ecd.com


https://www.keyelco.com/content.cfm/keyelco/Terminals-Test-Points/content_id/43

OSAGE BEACH, MO — Nihon Superior Co.Ltd. is now offering its SN100CV P608 solderpaste. The TempSave™ series of low-tempera-ture soldering materials has been designed toaddress the industry’s goals of reduced peakreflow temperature to reduce defects con-tributing to package warpage, reduce energyconsumption during the reflow process, andavoid potential damage to temperature-sensi-tive devices.

TempSave B58 is a eutectic SnBi alloywith a melting point of 139°C while Temp-Save B37 is a ductile hypoeutectic SnBi alloyand does not contain Ag. The halogen-freeP610 flux medium is specifically designed forBi alloys. The TempSave B37 P610 solderpaste can be reflowed with a peak tempera-ture of 190°C. Additionally, TempSave B37 is

available as a flux cored wire. SN100CV®P608 is a completely halogen free, lead-free,

noclean solder paste. Unlike silver- contain-ing alloys that derive their strength from adispersion of fine particles of eutectic Ag3Sn,SN100CV gains its strength from soluteatoms in the tin matrix of the joint. Althoughsilver-free, in tensile tests the SN100CValloymatches the strength of SAC305 while main-taining a high level of resistance to impactloading. LF-C2 is a high reliability lead-freealloy as it uses both dispersion and solid so-lution strengthening.

The P608 flux medium provides wettingcomparable with that of halogen-containingpaste. SN100CV P608 and LF-C2 both deliv-er excellent performance over a wide range ofcomponent types and process parameters.

Contact: Nihon Superior USA, LLC,1395 Hawk Island Drive, Osage Beach, MO

65065 % 573-280-2357 E-mail: [email protected] Web: www.nihonsuperior.com


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PITMAN, NJ — Essemtec is nowoffering a dispensing solution forboth the electronics and medicalindustries. A puma systemequipped with the Archerfish sol-der jet dispensing solution andan additional second dispensingvalve is adaptable to many med-ical requirements.

At productronica 2021, thesystem will be set up to demon-strate its pick-and-place capabil-

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The integration of the VDST valve gives Essemtec’s state-of-the-art machines the ability to jet solder paste for components 01005 (0.4 mm pitch) up to 0402 after adjustment of the settings.

The Archerfish offers freely selectable and combinable set-tings of jet parameters for opti-mal adaptation to customer re-quirements and characteristics of the dispensing material. Its dynamic shockwave technology allows it to jet several hundred shots per second with high accu-racy and repeatability.

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PRODUCTION

Additive manufacturing, or 3D printing, has made its move froman intriguing buzzword to a versatile and widely-used solutionfor creating customized products. Its flexibility has allowed it

to be applied across a broad range of industries. It also plays a largepart in Industry 4.0, where it can be part of a diversified and distrib-uted supply chain in which parts are produced efficiently across anentire network of factories.

Additive manufacturing is found in every step of the product lifecycle — from prototype to production. It’s particularly useful for pro-totype iteration and for when makers need quick parts, jigs, fixtures,tooling, and handling accessories.

3D printing has many benefits, including Bill of Materials con-solidation or making a complex assembly less complicated. It also al-lows designers and engineers more freedom to create geometries thatwere never before possible, which can be very useful in applicationssuch as light-weighting.Collaboration with Jabil

Digi-Key Electronics, which offers the world’s largest selection ofelectronic components in stock for immediate shipment, is rolling outa new 3D printing and additive manufacturing tool, powered byJabil.

Customers can upload design files, receive instant quotes andhave custom 3D products and items shipped directly to their doorfrom Jabil. Featuring a seamless upload and “add to cart” experiencefor users, this new additive manufacturing tool provides fast turn-around times and free shipping to customers in the U.S.

There are very few design constraints for additive manufactur-ing, making it an extremely flexible method of manufacturing. Themost important design consideration is wall thickness — featurestend to print the best with a wall thickness of about one millimeter.Although thinner walls can work, they can be more difficult to repli-cate consistently during production.

The new 3D printing and additive manufacturing service pro-vides electrical, mechanical and industrial engineers the ability to easily create custom 3D products for manufacturing purposes.

This introduction marks the flagship launch of Digi-Key’s addi-tive manufacturing services portfolio and plans to expand its offer-ings to include many suppliers, serving a variety of needs in the ad-ditive manufacturing market.

Jabil has a long relationship with Digi-Key and the 3D printing and additive manufacturing tool service is an important step in mak-ing Jabil’s advanced digital manufacturing capabilities available to a broader set of users.

Jabil plans to continuously enhance the tool through its digital manufacturing platform with powerful and innovative features to offer increased value and greater agility to customers.

The launch of the 3D printing tool is part of the DK Marketplace initiative, a singular shopping experience for all things related to technology innovation.

Digi-Key is a leader in distribution of electronic components and automation products worldwide. Today, the company provides some 12.6 million components from more than 2,000 quality name-brand manufacturers with an industry-leading breadth and depth of prod-uct in stock and available for immediate shipment. Beyond the prod-ucts that drive technology innovation, Digi-Key also supports design engineers and procurement professionals with a wealth of digital so-lutions and tools.

Contact: Digi-Key Electronics, 701 Brooks Avenue South, Thief River Falls, MN 56701 % 216-681-6674 E-mail: [email protected] Web: www.digikey.com r

Digi-Key and JabilDebut 3D ElectronicsPrinting ServiceBy Missy Hall, Vice President — New Market Development,Digi-Key Electronics

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Nickel and nickel-alloy sur-face coatings are widelyused across many indus-

tries to create a tough finish withsignificant wear and anti-corro-sion properties. This makesthese coatings indispensable forcritical applications, especiallywhere harsh conditions areprevalent.Nickel-Phosphorus Alloys

Nickel-phosphorus platingalloys have grown in popularity,due to several unique physico-chemical properties. These alloysare typically applied through anelectroless, autocatalytic processdue to the unique ability to pro-vide coating uniformity acrosscomplex geometries.

Known as electroless plat-ing, this technique does havesome drawbacks. The worst ofwhich is when one must repair orre-plate ENP coated parts.Extrusion Dies

The traditional method ofretouching or repairing ENPcomponents involves strippingand replating the entire part, re-quiring the removal of the com-ponent from its setting.

Davis-Standard, a manufac-turer of polymer processing ex-trusion and converting equip-ment, faced this problem. Manyof the company’s componentshave surface coatings that pro-vide an array of enhancements,including protection from corro-sion. Extrusion dies are oftenplated with electroless nickel toresist corrosion.

Many of these extrusion diescontain multiple surface featuresand can get quite large. Due tothe complicated geometries andsize, there are instances wheresome areas of the die do not getcompletely coated during theelectroless nickel immersionprocess. Additionally, some partsmay require further machiningafter the electroless nickel is ap-plied, inevitably resulting in theremoval of the coating.

Regardless of the reason,areas of the electroless nickel mayrequire touch-ups, and Davis-Standard’s choice was either tosend the part back for recoatingor scrap the part entirely.Selective Plating

To drastically cut logisticaldelays and processing costs,

Davis-Standard reached out toSIFCO ASC for contract serviceand onsite touch up of their elec-troless nickel coated componentsusing selective electroplating.Through this process, SIFCOASC can target the specific areain question through an in-situ,portable, quick, and immersion-less coating process.

In simple terms, nickel plat-ing that mirrored the perform-ance characteristics of ENP wasapplied accurately through selec-tive electroplating to small andclearly defined areas of Davis-Standard’s extrusion dies with-out the need to immerse the partin a plating bath.

This eliminates the need toreplace the whole part, and inmany cases, the need to disas-semble components. Also, theplating equipment can be takento the site and used directly onthe part.

Today, the SIFCO Process®

of selective plating has approvalsacross multiple industries.

In selective plating, an elec-tric current is run through a cir-cuit which is completed when ananode — the plating brush —touches the component to be plat-ed. This allows the deposit to flowonto the negatively charged part.

This entire process is donewithout immersing the part in atraditional plating tank. The de-posit can be applied accuratelyand reliably to very localizedareas without the need for post-

machining. Deposition rates arealso up to 60 times faster thantank plating, further minimizingdowntime.

Apart from portability andbeing able to repair specificareas, the plating quality of theSIFCO Process is comparable totank plating in terms of perform-ance, hardness and adhesion.Just like traditional tank platingmethods, selective plating formsa metallurgical bond to the basematerial. The selective platingprocess can also deliver good re-sults on aluminum substratesthat may require ENP touch-up. Adjustable Alloy Coating

SIFCO ASC has also spe-cially developed its 5709 nickel-phosphorus, which allows theplating operator to adjust thelevel of phosphorus content to fitthe application.

Both low- and high-phospho-rus coatings can be applied, de-pending on the desired surfacecharacteristics. When appliedwith a high phosphorus content,the coating structure changesfrom crystalline to amorphous, re-sulting in a coating with superbcorrosion resistance properties.

Finally, the SIFCO Processoffers a range of environmentallysafe alternatives. It also usesless energy and produces less ef-fluent waste than tank platingand brings considerable environ-mental benefits too.

For operations committed toin-house resources, the processcan also be automated to deliverconsistent application duringboth pre-treatment and plating.Data logging and traceability canbe added to the list of benefits

As a tried and tested alter-native, selective plating with theSIFCO Process delivers ease,speed and convenience. Most im-portantly, it creates a tough, cor-rosion resistant finish on eventhe smallest areas, preservingthe function and integrity of thecomponent while minimizingdowntime and costs.

Contact: SIFCO ASC, 5708E Schaaf Road, Independence,OH 44131 %800-765-4131 E-mail: [email protected] Web: www.sifcoasc.com r


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DISTRIBUTIONMouser Receives Numerous Business AwardsMANSFIELD, TX — Mouser Electronics has received 19 businessawards from its manufacturer partners for best-in-class distributionperformance during 2020 and 2021. Manufacturers gave a variety ofreasons for the awards, including global logistics, sales growth, andfast NPIs. Companies include TE, Vishay, and Molex.

Web: www.mouser.com

ITW EAE Expands Partnership with SincotronLAKEVILLE, MN — ITW EAE has expanded its partnership with Sin-cotron to represent and distribute Vitronics Soltec soldering equipmentin Norway, Sweden, Finland, Latvia, Estonia, and Lithuania. Thisagreement is an expansion of Sincotron’s representation of ITW EAE’sproduct line which already included MPM printers, Camalot dis-pensers, and Electrovert soldering and cleaning equipment. For morethan 50 years Sincotron has worked closely with customers to under-stand their operations and help them choose the right equipment.

Web: www.itweae.com

FHP Reps Now Offers YXLON X-Ray SystemsARLINGTON, TX — YXLON International, a part of Swiss tech hold-ing firm Comet Group, has appointed FHP Reps as its representative.FHP provides equipment, consumables and services to the electron-ics manufacturing industry. YXLON builds X-ray systems for radio-logical inspection and electronics manufacturing inspection. Systemsare available in manual, semi-automatic, and automatic versions,and can be used for R&D and production alike.

Web: www.yxlon.com

Digi-Key Stocks Futaba OLED ModulesTHIEF RIVER FALLS, MN — Digi-Key Electronics is now stockingFutaba OLED modules. They are available through Digi-Key’s Mar-ketplace. Futaba builds displays for battery-operated devices andTFT-LCD modules, both with USB interfaces and resistive touchpanels, as well as industrial remote controls for heavy-duty radiocommunications. The modules offer high contrast, USB or RS-232 in-terfaces, a single 5V input supply, and low power consumption.

Web: www.digikey.com

Avnet Ships New Otava RF Filters and SwitchesPHOENIX, AZ — Avnet is now shipping three ultra-linear tunable RFfilters and two wideband RF switches from Otava, a fabless mmWand mixed-signal IC design company best known for developing itsOTBF103 millimeter wave beamformer IC. Both the filters and theswitches are currently available as small form factor devices, whichallows for maximum layout efficiency. Avnet is also offering Otava’sswitch evaluation boards, which enable engineers to quickly assessthe device’s performance and simplify prototyping and verification.

Web: www.avnet.com

Richardson Offers Analog Devices’MMIC AmplifierGENEVA, IL — Richardson RFPD is distributing a new gallium ar-senide MMIC amplifier from Analog Devices. The ADL8150 is a self-biased GaAs MMIC, heterojunction bipolar transistor, low phasenoise amplifier that operates from 6 GHz to 14 GHz. The ADL8150 isversatile and can be used in a range of applications, including mili-tary and space, test instrumentation, and communications devices.

Web: www.richardsonrfpd.com

PDM Tech Reps Transition AutomationTYNGSBORO, MA — Transition Automation has selected PDMTechServices as its exclusive representative for Permalex edge metalsqueegee and universal squeegee holder systems as well as advancedbatch SMT printers in Canada. PDMTech focuses on SMT printer serv-ice, spare parts, and preventive maintenance. This new representationadvances Transition Automation in the North American SMT market.

Web: www.transitionautomation.com

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As communications providers race todeliver on the potential of 5G, researchand design projects are already looking

towards 6G and beyond. The promise ofultra-fast broadband speeds — potentially ashigh as 10 Gb/s — can catapult cellular tech-nology into new markets like smart cities,connected vehicles, defense, and the rapidlyexpanding IoT.

However, a major hurdle awaits theimpending move up the millimeter wave(mmWave) spectrum; that being a lack ofacceptable mmWave components such as cir-culators.

“It is an enormous technical challenge weare facing,” says Fred Daneshgaran, aCalifornia State University, Los Angeles, pro-fessor who specializes in RF design, telecom-munications and quantum communications.As such, Daneshgaran is frequently brought inas lead technician on some of the most cutting-edge RF military and telecom projects.

“The only way to support the billions ofusers at higher data rates is to keep utilizinghigher and higher frequency bands, so compo-nents are going to have to catch up,” explainsDaneshgaran. “The problem is, however, asyou go up the spectrum it gets harder andharder to build critical components like circu-lators that can operate at those frequencies.”Moving On Up

The higher-end of the 5G spectrum (26GHz to 86 GHz) will provide much of the leapforward in data speeds, capacity, quality andreduced latency. However, at such frequen-cies the design of transmit/receive compo-nents becomes critical. Without advance-ments, the deployment of systems capable ofoperating even higher on the spectrum, with-in the terahertz regime where 6G and 7G willoperate, are also in jeopardy.

Recognizing that national security couldbe affected, in late 2020 the Department ofDefense announced more than half a billiondollars in awards for 5G experimentationand testing. Given this impetus, microwavecomponents such as antennas, waveguides,isolators and circulators are now being devel-oped that are capable of broadband operationat mmWave frequencies up to 330 GHz andbeyond.

“One component that is especially criti-

cal to telecom infrastructure is the circula-tor,” Daneshgaran explains. “Antenna sys-tems capable of both transmitting and receiv-ing a signal are typically expensive becausethey are reciprocal devices. To keep the sig-nals separated you have to put somethinglike a circulator at the front end, otherwiseyou’d need two different antennas.”

Basically, a circulator is a three-portdevice in which power entering any port istransmitted to the next port in rotation.Hence, any signal that goes into port one,goes out port two, and any signal coming in

port two, goes out to port three.This issue of duplexing at mmWave fre-

quencies is not only problematic for telecomapplications, but also for radar technologywhich relies on circulators to separate thesignal on the transmission path from the sig-nal on the receiving side.

Overcoming Performance Challenges In a recent effort to design and build an

R&D system for a major commercial contrac-tor, the lack of a circulator capable of operat-ing at 120 GHz stopped Daneshgaran’s teamin its tracks.

“Theoretically, you can design one, thensimulate its performance, and it will be fine.However, actually making them is more of anart than a science,” explains Daneshgaran.“It is just very hard to build circulators at themmWave range.”

“At first, we couldn’t find anybody thatwas capable of producing circulators in thefrequency band we required, much less withthe high isolation and wide bandwidth wewanted,” says Daneshgaran.

In a continued search for a circulatorwith the necessary attributes, Daneshgaranand his team learned of Micro Harmonics,who had developed a circulator for mmWavesystems while working with NASA on a num-ber of SBIR projects.

Micro Harmonics Corporation special-izes in components for mmWave applicationsand successfully developed an advanced lineof circulators operating from 25 GHz up to150 GHz.

“Micro Harmonics fine-tuned the designto meet the performance characteristics weneeded within the very precise band we weregoing to be operating on,” explainsDaneshgaran.

Whether it’s for high-speed data trans-mission and reception, or for target detection,isolation is a key parameter.

“If the circulator doesn’t have good port-to-port isolation, you get self-interference;meaning the signal I’m trying to transmit isinterfering with the signal I’m trying toreceive,” he adds. So, you want as much iso-lation as possible.”

The Micro Harmonics circulatorsdemonstrated some pretty awesome isola-tions,” continues Daneshgaran. “At the fre-quency we operated on, we realized almost 30dB of port-to-port isolation, which is a lot.Typically, it is very hard to even get above20.” A circulator must also offer a wide band-width, a major challenge at mmWave fre-quencies.

“For telecoms, the more bandwidth you

New Advanced Circulators OvercomemmWave Design Challenges

By Greg Rankin


Telecoms are under pressure toincrease bandwidths in preparation for widespread use of 5G networks.

culators is achieved by abandon-ing complicated dielectric imped-ance-matching elements in favorof a mechanical engineeringsolution. This makes the per-formance highly repeatable fromone assembly to the next.

“With these circulators weare getting a clean ‘couple of giga-hertz,’ if not more, of bandwidthwithin the characteristic limits of30 dB isolation we seek for ourapplication,” notes Daneshgaran.“If we were willing to acceptsomething like 20 dB of port isola-tion, we could have four or moregigahertz of bandwidth, which isvery significant.”

“Because of the initial delays in finding workable mmWave components, we really needed to jump in and make sev-eral measurements that we had fallen behind on,” concludes Daneshgaran. “With the imple-mentation of advanced circula-tors our machine has been run-ning continuously ever since we set it up, and we could not be more pleased with the results.”

Contact: Micro Harmonics, 20 S Roanoke Street, Suite 202, Fincastle, VA 24090 % 540-473-9983 E-mail: [email protected]: www.microharmonics.com r


Advanced Circulators Overcome mmWave Design ChallengesContinued from previous pagehave the more data you can sup-port,” says Daneshgaran. “This is because your data rate is directly proportional to the amount of bandwidth you have around your carrier frequency.”

Daneshgaran goes on to explain that in a radar applica-tion, wide bandwidth is important because it involves continuous fre-quency sweeps. The larger the bandwidth, the easier it is to dis-cern a target in a given sweep.

In Micro Harmonics’ case, increased bandwidth for its cir- Micro Harmonics circulator

for mmWave applications.

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SAN DIEGO, CA — AdvancedTest Equipment Corp. (ATEC)now calibrates Fluke and FLIRthermal cameras and imagers.Customers can visit ATEC’s new,easy-to-use calibration portal toreceive instant RMAs and check-out for calibration of FLIR andFluke products.

ATEC CalibratesFluke andFLIR ThermalImagers

Fluke and FLIR thermal cameras and imagers. New products include the

FLIR T-Series, E-Series, and B-Series Fluke TiX, Ti, TiR, and TiS.

ATEC has led the test equip-ment industry in customer care, technical expertise, and quick shipping since its inception in 1981, and is now expanding its calibration capabilities to over 50 test equipment manufacturers, including Narda STS, Fluke Networks, Anritsu, and more.

ATEC’s online calibration checkout allows customers to search for a manufacturer, choose the products they want to calibrate, and check out online, simplifying the quote process to a few clicks.

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Ultrasonic-based scanning acousticmicroscopy (SAM) has long been themethod of choice for quality testing

and failure analysis of silicon ingots, wafers,integrated circuits, MEMS, and other elec-tronic packages.

Ultrasound can locate voids and dis-bonds between material layers betterthan other non-destructive methodsbecause sound waves can look inside thelayers to detect the thinnest of air gapsand delaminations down to a hundredthof a micron.

Increasingly, however, manufactur-ers in the industrial, aerospace and med-ical sectors are turning to SAM technolo-gy to ensure good adhesion and mechani-cal integrity of devices by examining theirinternal structures, interfaces, and sur-faces. Because potential defects can occurin different layers, more advanced equip-ment is required to inspect each simulta-neously.SAM in Examination

Many are choosing to outsource SAMservices rather than do this quality testingin-house. Outsourcing offers manufacturerskey advantages, including capital cost sav-ings on SAM systems, access to specializedexpertise in image management and analy-

sis, and the ability to diagnose and isolatematerial defects.

“Customers typically come to us for SAMtesting to address one of three needs,” saysLisa Logan, SAM applications manager at

PVA TePla America. The company providescontract services and sales for both PVATePla Analytical and OKOS, both of whichdesign and manufacture advanced scanningacoustic microscopes. “As part of productR&D, an engineering team may be evaluat-

ing welds, bonds, or the effectiveness of anadhesive. When a product is in production,we may be asked to scan trays of parts forquality assurance testing. We may also useSAM testing to investigate why a particular

part failed.” “Often, when customers come to us,

they don’t know what problem they have.If it is relatively easy to solve, investingthe time and expense in bringing a SAMsystem in-house is unnecessary,” sheadds.

Contracting SAM services can alsobe a better match for one-time projects.“The customer’s project may be finite,”said Logan. “They may only need to scan10,000 parts, and then the project is done.It is much more cost-effective to outsourcethe work in this case.”

“Convenience is a big factor, too,”adds Logan. “It is just simpler to giveparts to a trusted partner to evaluate.Our customers often give us a part to ana-lyze when they can’t isolate the issue andask us to use our expertise to determine

the problem for them.Superior Non-Destructive Testing

SAM uses the interaction of acousticwaves with the elastic properties of a speci-


Outsourced SAM is a Cost-Effective Method of Quality Control

By Stephen Armstrong

PVA TePla offers a range of SAM tools and services.



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sound hitting the object is eitherscattered, absorbed, reflected(scattered at 180°), or transmit-ted (scattered at 0°).

By detecting the direction ofscattered pulses and the “time offlight,” the presence of a bound-ary or object can be determinedas well as its distance.

To produce an image usingSAM, samples are scanned pointby point and line by line.Scanning modes range from sin-gle-layer views to tray scans andcross-sections. Multi-layer scanscan include up to 50 independentlayers.

The resolution of the micro-

scopic image depends on theacoustic frequency, materialproperties, and aperture of thetransducer. Transducers performsuch a critical role that manufac-turers like PVA TePla designand manufacture an extensiverange of different transducersused in their contracted testingservices. The frequency of theultrasonic signals can beincreased to the GHz range,which makes it possible to detectdefects in the sub-micron range.

Given the critical role itplays, in-depth knowledge of theadvanced software featuresavailable is another considerable

benefit. “SAM testing houses that

purchase equipment may only befamiliar with some of the fea-tures of the software,” saysLogan. “As the manufacturer,we have to understand all thefeatures and can even requestcustomizations if needed.”A Matter of Interpretation

The quality of the equipmentand knowledge of its use is onlyone factor in SAM testing.Operating a SAM system requiresa trained technician and, evenmore importantly, experience con-


Outsourced SAM for Quality Control...Continued from previous pagemen to image the interior of an opaque material. A transducer, the heart of a SAM system, directs focused sound at a small point on a target object. The

Continued on page 57

OXFORD, CT — MIRTEC recent-ly released a “comprehensive AI-based smart factory automationsolution,” INTELLI-PRO.

INTELLI-PRO consists of aproprietary deep-learning basedautomatic part search and teach-ing function, AI-based; automaticparameter optimization, charac-ter recognition, foreign object

MIRTECReleasesAI-Based PinInspectionSystems

GENESYS-PIN pin inspection system.

detection, placement inspection algorithms and an automatic defect type classification function.

INTELLI-PRO has three stages in the inspection process: preparation stage, inspection stage, and post-inspection stage. At the preparation stage, teach-ing and debugging are required to run an AOI machine. MIRTEC’s deep learning tool searches for proper part type, size, and other information on the PCB from a parts library. It then places inspection windows on parts with preprogrammed inspection algo-rithms and parameters.

MIRTEC will also display its GENESYS-PIN, a pin inspec-tion system for automotive elec-tronics. The GENESYS-PIN machine can measure tall con-nector pins, single pins, pin arrays, press-fit pins, and fork pins. It also finds types of defects such as missing, offset (bent/tilt), distance between pins and inner/outer diameter of fork pin. The GENESYS-PIN machine operates in two different modes. One for precision and the other for speed.

Contact: MIRTEC Corp., 3 Morse Road, Oxford, CT 06478 % 203-881-5559 fax: 203-881-3322 E-mail: [email protected] Web: www.mirtec.com


https://www.printedcircuits.com/


Designing a heavy copper board is verydifferent from a standard copperdesign. While the connectivity is

directly from the electrical schematic (IPC-D-356 file), the layout constraints are morecomplex. The layout software must have thedesign rules modified for trace, space, pad-over-hole, dielectric separation, and copperfloods.

When designing with logic circuits, theprimary concern is the density that can beachieved. Heavy copper is about the longevi-ty of the laminate when subjected to the heatcreated by the (expected) current in thetraces and the effects of higher voltages onthe dielectric separation.Issues with Heat

In the first article of this series, we dis-cussed issues related to the heat created byhigh currents in PCBs. To control this heatwe have two options: use cooling techniquessuch as moving air to remove the heat; orreduce the DC resistance to drop the powerloss in the conductor.

Power loss is converted to heat wherethe power (in Watts) is directly proportionalto the DC resistance (in Ohms) and propor-

tional to the square of the current (in Amps):P = I2 x R.

To protect the PCB and to get approvalfrom safety agencies, the internal heatingmust be kept to a level that does not degradethe PCB. For most applications, the maxi-mum allowable temperature rise above ambi-

ent is 20°C in a trace or plane, while manyapplications allow only a 10°C rise.

With internal traces or planes, the onlyoption to control the heat is to reduce the DCresistance.

IPC-2221 offers a chart that gives therequired cross sectional area to keep the tem-perature rise below 20°C for a given DC cur-rent. The problem with that chart is that itdoes not directly convert the cross sectionalarea into traces and spaces.

While the algebra to convert the IPCequation into length and width is straightfor-ward, the assumption is that the resultingtrace will be rectangular. This is an errorthat can result in traces within the PCB thatoverheat at the rated current and damagethe PCB and/or the final assembly.

Figure 1 is a micro-section picture of a13 oz trace showing the process reductionthat occurs to the theoretical width in thedesigner’s Gerber file.

If the trace width to yield a 20°C risewas based on the “foot” of the resulting trace,the cross-sectional area would be in error.The amount of area degradation that occursvaries with the thickness of the copper.Therefore, a chart of trace width vs. current(at a constant temperature) must account forthe reduction during etching and not assumea rectangular shape.

Figure 2 was created from the IPC-2221

Heavy Copper Design ConsiderationsPart 2: A Suggested Process

Figure 1: microsection image of a 13 oz copper trace.

By Stanley L. Bentley, P.E., Technical Director — Americas, ICAPE Group


https://pctconformalcoating.com/

Figure 3 (next page) should

be used once the minimum trace

width has been established.

This chart outlines the mini-

mum trace or space that can be

reproduced at a given thickness

of copper. If the current vs.

trace width calculates a width

that cannot be produced, the

next larger trace must be used.

To provide a sanity check of

our results, we are going to pick

a point where the 20A line inter-

sects the 20°C curve and com-

pare that to the area from our

trace width chart. From the

chart, choose 20A using 10 oz

copper.

The resulting trace thick-

ness is 13.7 mils and the suggest-

ed trace width is 58.7 mils.

Using a formula of A = L x W, the

resulting area (in square mils) is


Heavy Copper Design Considerations...Continued from previous pageequation with modifications to account for the process reduc-

tion. The fabricator “etch factor” was discussed in article one of this series. The important point is that with heavy copper, the fabricator attempts to match the midpoint of the trace to the orig-

inal design thickness. The fabri-

cator does not make any repre-

sentation about matching the desired cross-sectional area of the trace.

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3535

CAMBRIDGE, ENGLAND —

XJTAG® has released an

enhanced version of XJFlash, its

ultra-fast in-system flash pro-

grammer that uses the JTAG

interface to connect to the target

board. The software already pro-

vides rapid erase and program-

ming, but by adding compression

to its data transfer algorithm,

the verify times are now also

shorter — 256 Mb can now be

verified in 5.4 seconds, depend-

ing on the circuit.

Combining this with its

rapid erase and program cycles

makes XJFlash significantly

faster than other programmers.

XJFlash can be used for Xilinx

Zynq UltraScale™+ and Zynq-

7000 SPI flash programming, as

well as with a wide range of

FPGAs from Intel/Altera,

Lattice, and Microsemi/Actel.

Production lines benefit from

XJFlash’s rapid erase cycle:

repaired boards can be passed

down the line along with new

ones without wasting time eras-

ing already-empty memories.

XJFlash checks the existing

contents, only erasing blocks it

finds aren’t empty. XJFlash can

take an empty 256 Mb flash

through the erase step in under 4

seconds, a potential saving of up

to 94 percent.

The latest version of

XJFlash can program and verify

a 256 Mb flash in 42 seconds,

and only needs 7 seconds for a 32

Mb device. XJFlash can be used

as part of an XJRunner bound-

ary scan test project without

needing an additional licence or

used for a separate program-

ming-only stage.

Contact: XJTAG, Camtech

House, 137 Cambridge Road,

Cambridge, CM24 6AZ, UK

% +44-1-223-223007

E-mail: [email protected]

Web: www.xjtag.com

XJTAGReleasesUltra-FastFlashProgrammer

Figure 2: length and width calculation accounting for etch factor. Continued on next page

https://www.virtual-ii.com/


The second most common

error when using the IPC graphor formula is the use of a “con-stant” (k) to increase the tracewidth for inner layers. This con-stant has been determined to betoo large.

The heating on internal lay-ers is complex to calculate as itmust also include the adjacenttraces and the number of heavycopper layers. Also important isthe difference in how a trace isformed on an inner layer vs anouter layer.

The trace formation process

allows for smaller traces andspaces on an inner layer, but thecross-sectional area must still beadequate for the current.Therefore as a starting point inthe design, the author recom-mends that the trace width (fromthe inner layer etch factor chart)be used for internal traces.

One other constraint on thedesign is the minimumspacing between the con-ductors for the operatingvoltage. Figure 4 can beused when high voltagesare also a part of theheavy copper design.Note that for operatingvoltages above 500V,there is a formula in IPC2221 for the minimumspacing. This is notincluded here because

use of the formula is onlya starting point.

Additional considerationsmust be made for the laminatecomparative tracing index (CTI),the inner layer resin construc-tion, and the solder mask thick-ness over the trace edges.Basic Guidelines

To begin the design of aheavy copper PCB, the minimumconsiderations are: maximumvoltage between traces, maximumoperating current, and the operat-ing environment for temperature

(outside, underhood, etc.)First, select the proper lami-

nate from the IPC 4101 chart tomeet the operating environment.A minimum Tg of 170°C is criti-cal. Give the high current tracesa unique “D code” so they can beadjusted as the current and tem-perature calculations are made.

Use the lowest copper

weight (thickness) for the maxi-mum current in the design, usingthe interior and exterior chartsas a starting point in the layoutsoftware. Consider using parallellayers where appropriate to min-imize copper weight.

Then use the chart for mini-mum spacing between heavy cop-per conductors to set the mini-mum distance between traces.

Match the cross-sectional area ofthe via plating to the attachedtrace. An increase of 25 percentis recommended.

Avoid “sharp” inner layerfeatures and balance the innerlayer copper across the layer.Avoid large areas with no copperfill. Then, design the PCB tomatch the schematic, entering

the normal requirements for a layout.

Finally, consider this to be an iterative process between cal-culations and the PCB layout software.

Contact: ICAPE USA, 8102 Zionsville Road, Indianapolis, IN 46268 %317-405-9427 E-mail: [email protected]: www.icape-group.com r

Figure 3: design requirements forminimum trace/space.

Figure 4: minimum spacing for trace voltage.

Heavy Copper Design Considerations...Continued from previous page804. However, if we look at theIPC-2221 chart we see a value ofapproximately 670 square mils.The reason for this difference isthat when you compensate forthe etch factor, which results in atrapezoidal shape, the startingtrace width must be greater.


http://www.shenmao.com/en/

valuable insight into materialanalysis, time-of-flight imaging,amplitude, and polarity. The Ascan must be interpreted appro-priately to produce an accurate Bor C scan, which is shared withthe customer.

“An operator needs to inter-pret, focus and change the vol-ume of the A scan as well asadjust certain things for theimage to be accurate,” saysLogan. “It is important to ensurethat the image does not conveysomething false.”

“The smallest and thinnestparts increase the difficulty ofinterpretation because the

echoes of the interface becomereally tiny and close together,”said Logan. “It causes an overlapof echoes, and you end up havingto adjust the frequencies used.As you go higher up in frequency,it is more difficult to manage thetransducers.” Finding a SAM Partner

When selecting a SAM part-ner to outsource quality testingand failure analysis, manufac-turers should consider how wellthe SAM equipment matchestheir testing needs and thebreadth and depth of experienceof the testing team.

In-depth knowledge of the SAM equipment is critical to optimize image resolution. The ideal situation is having factory-level experience in the manufac-turing of acoustic microscopes and their software development.

With a strong SAM out-sourced partner, manufacturers effectively add a powerful resource to resolve quality testing and failure analysis challenges.

Contact: PVA TePla America, Inc., 251 Corporate Terrace, Corona, CA 92879%951-371-2500 E-mail: [email protected] Web: www.pvateplaamerica.com r


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Outsourced SAM is a Cost-Effective Method of Quality ControlContinued from page 53figuring the equipment and inter-preting the scans. Setting up the scans and interpreting the images is similar to a radiologist reading MRI scans of a medical patient.

SAM system experts know how to work with three different imaging modes, A, B, and C.

The A mode is an X, Y, or Z point and provides information on all the echoes occurring inside of a part. These echoes provide

DONGGUAN, CHINA — 1 ClickSMT is showcasing its latestselective soldering system, theMAS-i4 at productronica 2021.Detech is 1 Click SMT’s exclu-sive distributor in England andIreland.

The MAS-i4 is the latestgeneration selective solderingmachine with the highest flexi-bility and output. The systemfeatures an x/y servo table for

1 Click SMTHighlightsLatestSelectiveSolder System

MAS-i2 selective solder system.

two independent fluxer nozzles.The distance between the

fluxers is automatically adjusted by servo motors, as programmed by the software. For preheating, the MAS-i4 is equipped with a top convection preheating zone and bottom IR preheating zone. The top preheating zone is above the soldering section for better solder fill up. For the soldering section, MAS-i4 is equipped with two Z axes, each with one Ti sol-der tank.

Each solder tank features two independent wave tunnels. This provides maximum flexibili-ty and production for customers. The ability to use two fluxer valves and four solder pumps in conjunction allows customers to increase production by up to four times. The system requires mini-mal floor space.

Contact: 1 Click SMT Technology Co., Ltd., Bld 1, Hua Ke Bao Chuang Industry Zone, Shi Da Road, Daling Shan, DongGuan, China % +86-769-853-3739 E-mail: [email protected]: www.1clicksmt.com


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NEW PRODUCTSNEW PRODUCTSHEIDENHAIN IntrosDual Rotary Encoder

SCHAUMBURG, IL — Designedto fulfill two critical needs with asingle component in high-accura-cy robots, HEIDENHAIN hasintroduced the innovative KCI120 Dplus rotary encoder.

This new uniqueabso lute encoder pro-vides both reliable feed-back to a robot’s motorand accurate positionmeasurement to its con-troller to enable safe andaccurate motion.

Extremely compact,the KCI 120 Dplusencoder consists of onescanning head and twodifferent types of rotorunits, all connectable toa controller or drive by asingle cable.

Only 0.8 in. (20 mm)in height, its small foot-print and low weight make ituseful in tight installationspaces, rendering it attractivefor a variety of high-accuracymotion control applications.

The rigid design of this newtwo-in-one encoder from HEI-DENHAIN permits high vibra-tion loads of up to 1312.3 ft/s2

(400 m/s2) on the stator and1968.5 ft/s2 (600 m/s2) on therotor. With its robust inductivescanning method, the KCI 120

Dplus rotary encoder is particu-larly resistant to contaminationand magnetic fields.

The KCI 120 Dplus encoderis available with FunctionalSafety capability and, with

measures in the control, can achieve SIL 3 safety rating. This allows manufacturers to mini-mize malfunctions and facilitate the safe operation of its associat-ed machines and automated sys-tems.

Contact: HEIDENHAIN Corp., 333 E. State Parkway, Schaumburg, IL 60173 % 847-519-4702 E-mail: [email protected] Web: www.heidenhain.us

KCI 120 Dplus rotary encoder.

DATA MODUL PresentsUHD2 Digital Display

HAUPPAUGE, NY — DATAMODUL has introduced a new55 in. (1,400 mm) UHD2 display.Designed, developed and manu-factured completely in-house,

this display’s high resolution,brightness and slim design makeit ideal for digital signage appli-cations.

Driven by DATA MODUL’sown eMotion UHD2 scaler card,its UHD resolution (3840 x 2160)and a brightness of 700 cd/m2

provides excellent image qualityand readability of content in thedisplay, even in bright environ-ments and in direct sunlight.

In addition to extremely

flexible connectivity, partly dueto two HDMI and DisplayPortinterfaces, this embedded plat-form also supports the use of awide range of additional func-

tions, including ambient light control, backlight lifetime expan-sion, display performance moni-toring, or pixel shifting. The 55 in. (1,400 mm) UHD2 display is available now and can be cus-tomized upon request.

Contact: DATA MODUL, Inc., 275 Marcus Boulevard, Unit R, Hauppauge, NY 11788 % 631-951-0800 E-mail: [email protected]: www.data-modul.com

UHD2 display for digital signage.

https://tapesplice.com/

https://www.siborg.com/


LAKE WYLIE, SC — Spring-loaded test probes designed tomeet international standards area well-established kind of probefor ICT and FCT tests, which donot have a collar. Depending onthe working stroke of the test fix-ture or the components and testpoints to be contacted, differentinstallation heights are neces-sary. These are achieved by theappropriate combination of testprobe and receptacle.

Using long-stroke probes,

ICT and FCT can be combined ina dual-stage test fixture. Byintroducing the new GKS-013probe, INGUN is following thetrend towards miniaturizationand now also offers long-strokeprobes for 1 mm grids. For opti-mum contact to the DUT, theseare available with various tipstyles and spring forces. Theoptimum installation height isachieved using the receptacle.

Three new tip styles are now

available for the GKS-040 andGKS-100 series with standard

stroke. Between four or six (GKS-135) new tip styles are available for the GKS-015, GKS-035, and GKS-135 series for opti-mum contact with the DUT.

Contact: INGUN USA, Inc., 252 Latitude Lane, Suite 105-106, Lake Wylie, SC 29710% 803-831-1200E-mail: [email protected] Web:www.ingun.com


PulseForge® The Future of Soldering

1VMTF'PSHF�4PMEFSJOH�UPPMT�IJHI�JOUFOTJUZ �QVMTFE�MJHIU�UFDIOPMPHZ�TPMEFST�DPNQPOFOUT�UP�DJSDVJU�CPBSET�JO�TFDPOET�o�OPU�NJOVUFT��

-FBSO�NPSF�BU�OPWBDFOUSJY�DPN�

shown: PulseForge Soldering Batchalso available in PulseForge Soldering In-Line

New long-stroke GKS for 1 mm grid.

INGUN Releases Long-Stroke Spring-Loaded Test Probes

GOWANDA, NY — GowandaElectronics, a designer and man-ufacturer of high-performanceinductors and magnetic compo-nents for demanding RF andpower applications, announcesthe introduction of a new non-magnetic RF thru-hole (leaded)inductor series — 28MG.

This series was designed toaddress the market need for non-magnetic inductors that couldachieve inductance values of upto 18 µH.

GowandaDevelops Non-MagneticRF Inductors

28MG non-magnetic inductor.

This series is ideal for use in medical imaging equipment and other applications where mag-netic materials must be avoided, including use in telecommunica-tions, security systems, instru-mentation, laboratory analysis equipment, aviation equipment, navigation equipment and elec-tronic test equipment.

The performance range pro-vided by the 60 discrete parts within the 28MG series includes Inductance from 1.2 to 18 µH, DCR Ohms from 0.079 to 4.15 and current rating mA DC from 315 to 2,400. All of Gowanda’s non-magnetic surface mount and through-hole inductors, includ-ing this new 28MG series, pro-vide relative permeability of less than or equal to 1.00003.

Contact: Gowanda Electronics, One Magnetics Parkway, Gowanda, NY 14070 % 716-532-2234 E-mail: [email protected] Web: www.gowanda.com


https://www.novacentrix.com/

RALEIGH, NC — Coval´s new

LEMAX IO series of mini vacu-

um pumps with IO LINK com-

munication integrate all the

required functions for optimized

vacuum management in a com-

pact package. Via their IO-Link

communications interface, the

mini vacuum pumps communi-

cate permanently with the envi-

ronment and due to “air saving

control” (ASC) technology, com-

bine productivity with energy

savings, adapting to a multitude

of applications in packaging,

robotics or plastics processing.

Without needing extra peripher-

als, these all-in-one mini pumps

are fully compatible with

Industry 4.0 automation.

The IO-Link interface

ensures efficient real-time com-

munication between LEMAX IO

vacuum pumps and all the high-

er-level protocols (Ethernet/IP,

PROFINET, EtherCAT, etc.)

used for supervising the produc-

tion line. IO-Link enables contin-

uous diagnostics, centralized

programming and pump control.

EAGAN, MN — Ironwood Elec -

tronics recently introduced a new

socket addressing high-perform-

ance requirements for testing

NAND Flash memory devices, the

SBT-BGA-6572. The contactor is

a stamped spring pin with 31g

actuation force per ball and cycle

life of 125,000 insertions. The self

inductance of the contactor is 0.88

nH, insertion loss of less

than 1 dB at 15.7 GHz and

capacitance 0.097 pF. The

current capacity of each con-

tactor is 4A and its operating

temperature range is –67 to

+356°F (–55 to +180°C).

It features a floating

guide for precise ball to pin

alignment. It also features

an open top lid allowing the

top surface to reach a specif-

ic temperature very quickly

by forced-air heating. The socket

is designed for BGA packages

with 8 x 6 mm body size, 1 mm

pitch, and 5 x 5 ball arrays.

Simply drop the IC into the

socket and down force is applied

by torquing four screws on the

periphery in a zig-zag manner.

This socket can be used for hand

test and quick-turn custom burn-

in applications with the most

stringent requirements.

Contact: Ironwood Electron -

ics, 1335 Eagandale Court, Eagan, MN 55121

% 952-229-8200 Web:

www.ironwoodelectronics.com


Socket for NAND Flash Memory from Ironwood

SBT-BGA-6572 test socket.

DL Technology has been the leader in micro dispensing technology for over 15 years. For more &+#,/*�1&,+Ǿ�,/�#,/�0&7"�,/�0-" &Ɯ �1&,+0�,+�,2/�)&+"�,#�+""!)"0Ǿ�-2*-0�,/�3�)3"0Ǿ�3&0&1� www.dltechnology.com

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COVAL Launches Seriesof Mini Vacuum Pumps

LEMAX IO mini vacuum pump.

In addition to fast and cost-

effective installation, preventive maintenance is easier and the replacement of vacuum pumps does not require reconfiguration.

ASC technology, designed to ensure intelligent vacuum con-

trol by stopping air consumption when the set vacuum level is reached, can generate energy savings of between 75 and 99 percent depending on the appli-

cation. In addition, ASC ana-

lyzes the application and adapts to either impermeable or porous parts to optimize operation and energy consumption.

Contact: COVAL Vacuum Technology, Inc., 901 Jones Franklin Road, Suite 100, Raleigh, NC 27606

% 919-233-4855

E-mail: [email protected] Web: www.coval.com

https://dltechnology.com/

https://www.fknsystek.com/

Nov/Dec 2021

WALDENBURG, GERMANY —

The range of MagI3C-FDSM

power modules with 36V input

voltage has been expanded to

include a version with 1 V output

voltage. The power module in a

SIP-3 package is a cost-effective

solution to meet the require-

ments for the real-world voltage

transients of a 24V industrial

power architecture.

The new module operates

from 16 to 36 VIN and generates

a fixed output voltage of 12V

with current up to 1A. The

FDSM series MagI3C power

modules are fully integrated

DC/DC voltage converters with a

fixed output voltage. The mod-

ules incorporate all of the compo-

nents needed, like the controller,

inductor and input/output capac-

itors, with the added benefit of

thermal overload and short cir-

cuit protection.

Since there are no external

components required for opera-

tion, there is essentially no cir-

cuit design needed. This reduces

development costs and makes it

possible to get to market quickly

with new applications. This

power module has around 95

percent efficiency while the lin-

ear regulator will have an effi-

ciency of 50 percent. The stan-

dard THT housing for easy mounting is pin-compatible with L78x linear controllers.

Pre-compliance testing has shown both the radiated and con-

ducted emissions on an evalua-

tion board are below the limits of EMC standards EN55032/

CISPR32 Class B.

Contact: Würth Elektronik eiSos GmbH & Co. KG, Max-

Eyth-Strasse 1, 74638 Waldenburg, Germany

% +49-7942-945-5186

E-mail: sarah.hurst@we-

online.de Web: www.we-online.de12V power modules.

www.us-tech.com

Würth Adds 12V Power Modules

CHANDLER, AZ — Microchip

Technology has launched a new

1,200V production-ready digital

gate driver, providing system

developers with multiple levels of

control and protection for safe,

reliable operation and qualified to

stringent transportation require -

ments.

Microchip’sSiC MOSFETsAre NowProductionReady

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AgileSwitch 2ASC-12A2HP gate driver.

For designers of silicon car-

bide-based power conversion equip ment, Microchip’s Agile -

Switch® 2ASC-12A2HP 1,200V dual-channel digital gate driver with its Augmented Switching™ technology is production-qualified and fully configurable.

To ensure reliable, safe oper-

ation, the 2ASC-12A2HP gate driver provides multiple levels of control and a higher level of pro-

tection for silicon carbide MOS-

FET-based power systems.

The 2ASC-12A2HP digital gate driver can source/sink up to 10A of peak current and includes an isolated DC/DC converter with low capacitance isolation barrier for pulse width modula-

tion signals and fault feedback.

Microchip’s 2ASC-12A2HP gate driver is compatible with the company’s latest release of the Intelligent Configuration Tool (ICT). This interface allows users to configure gate driver parame-

ters including the gate switching profiles, system critical monitors and controller interface settings.

Contact: Microchip Technology, Inc., 2355 West Chandler Boulevard, Chandler, AZ 85224 % 480-792-4386

E-mail: cathy.gedvilas@ microchip.com

Web: www.microchip.com

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Molex: Flex-to-BoardConnectors for 5G

Mobile DevicesLISLE, IL — Molex, a globalelectronics leader and connectiv-ity innovator, today introducedthe 5G25 series flex-to-board RFmmWave connector to providesignal integrity at higher fre-quencies up to 25 GHz. This lat-est Molex micro connectorenables manufacturers of RFantenna modules as well asdesigners of mobile devices tooptimize high-speed 5G compo-nents while alleviating spaceconstraints on extremely smallyet increasingly crowded printedcircuit boards.

The 5G25 series supportshigh-speed data transmission ina space-saving solution thatoffers extra protection fromharsh environmental conditions.Featuring a signal pitch of 0.35mm, a mated body height of only0.6 mm, as well as a short bodywidth of 2.5 mm and length of 3.6mm, the compact size of the5G25 offers elevated printedwiring board (PWB) design flexi-bility.

Moreover, the 5G25 enablesdesigners of RF antenna mod-ules and mobile devices to com-bine RF and non-RF signals,which reduces the need for addi-

tional connectors while produc-ing additional space and costsavings.

The 5G25 features full EMIshielding, encompassing both RF

5G25 connectors.terminal and full connector shielding to ensure superior sig-nal integrity. By employing a center shield-in contact with receptacle and plug, each row can be isolated to boost overall signal-integrity stability. Additionally, Molex’s fully-shielded design delivers best-in-class far-field gain performance, which is ideal for connecting 5G antennas to the rest of the trans-ceiver.

Molex, LLC, 2222 Wellington Court, Lisle, IL 60532 % 630-969-4550 Web: www.molex.comSee at productronica, A2.153

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CARTERET, NJ —Fujipoly®

USA introduces new 5 and6W/m-K SARCON® thermallyconductive greases to the NorthAmerican market. SARCON SG-50NS and SG-60NS greases offerexcellent stability over wide tem-perature ranges with low ther-mal resistance. They featureexceptionally low bleed andevaporation as well as the non-silicone advantages of no creepor migration.

SG-50NS and SG-60NS arehigh-performance, thermalgreases designed to meet thethermal, reliability and low-price

requirements of high-endchipset, graphic processors trendever-faster clock speeds. Theyare used as an efficient thermal“path” between a flip-chip micro-processor package and its device-cooling heat sink to fill themicroscopic irregularities of thecomponents, resulting in verylow thermal resistance.

SARCON SG-50NS and SG-60NS high thermal conductivitygreases are currently only avail-able to the North American mar-ket. North American customers

can request samples and infor-mation on this product from

Fujipoly USA. Greases are available in pre-

filled 3, 10, or 30 cc syringes as well as 1 lb jar containers. Custom packaging is also avail-able upon request. Additional sil-icone and non-silicone formula-tions with a thermal conductivity up to 4.2 W/m-K are also avail-able to all markets.

Contact: Fujipoly America Corp., 900 Milik Street, Carteret, NJ 07008 % 732-969-0100 E-mail: [email protected] Web: www.fujipoly.com


SARCON thermally conductive greases.

Thermally Conductive Non-Silicone Greases from Fujipoly

DUSSLINGEN, GERMANY —Through “E-ssembly,” EutectGmbH has created a line produc-tion concept which is character-ized by maximum flexibility,dynamics and sustainability.The newly created possibilitiesare not only relevant for elec-tronics production and packag-ing technology, but also forautomation in general.

By means of the E-cell con-cept created jointly withTaktomat GmbH, the specialmachine manufacturer fromDusslingen offers a commonbasis for generating maximumcustomer benefit with integra-tions such as the floating 2Dproduct transport systemXPlanar from Beckhoff.

With regard to flexibility: i.e. each mover and therefore each product can be transported separately and independently through the individual process stations and cells and positioned with the utmost precision.

This means that the XPlanar can completely take over the axis and robot handling systems that are necessary in many processes, thus saving costs. Aaccelerations as well as the general speeds of the XPlanar suit it well for the job.

Contact: Eutect GmbH, Filsenbergstrasse 10, 72144 Dusslingen, Germany % +49-0-7072-92890 E-mail: [email protected]: www.eutect.deSee at productronica, A4.315

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Surface Mount & Thru-Hole Built To Perform.With transparent signal processing & minimal distortion, the LL-68500 series of data-bus transformers are an essential series forAerospace and Military Applications ensuring high reliabilityfor communications involving transmitters and receivers.

• Complies with MIL-PRF-21080 Requirements• Minimal Leakage Inductance & DC Resistance • Ultra-miniature (.18”ht.)• High Reliability• Available with Custom Design

Engineering Support Available Contact PICO Electronics at 800-431-1064 or www.picoelectronics.com

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NXP Powers Xiaomi’s“Point-to-Connect”

AUSTIN, TX — NXP Semicon -ductors’ Trimension Ultra-Wideband (UWB) solution powersnew “Point-to-connect” capabili-ties in Xiaomi’s latest flagshipphone, the MIX4. UWB deliv-ers new levels of smarthomeconvenience through therapid and accurate connectionof the smartphone to selectdevices in the Xiaomi smarthome ecosystem, such asXiaomi Sound Smart speak-ers and TVs, and opens thedoor for expanded use casesacross the IoT.

NXP’s Trimension tech-nology enables the secureranging and precision sens-ing for a new dimension ofspatial context.

This precision is the key todelivering a range of smart con-nected use cases such as securehands free access, indoor naviga-tion, hands free payment, anditem tracking.

The breadth of UWB possi-bilities extends across mobile,automotive, Internet-of-Things(IoT) and the industrial spaceand is rooted in NXP’s expertiseand standardization efforts inbodies such as the FiRa Consor -tium and the Car ConnectivityConsortium.

Xiaomi’s system simplifies

the connectivity of select devicesin its smart home ecosystem.Thanks to UWB’s high accuracyand directional capabilities, the

MIX4 smartphone can point to compatible Xiaomi devices and display operation control cards on the phone screen to achieve instant connection and ultimate operating convenience. This cre-ates ultimate control of the smart home environment, like a universal remote control with an intuitive interface.

Contact: NXP USA, Inc., 6501 William Cannon Drive West, Austin, TX 78735 % 408-802-0602 E-mail: [email protected] Web: www.nxp.com

Xiaomi MIX4 smartphones.


https://www.picoelectronics.com/

https://www.pi-usa.us/en/

SAN JOSE, CA — Power Integra -tions has launched its Inno -Switch™ 3-PD family of ICs. Thechips are highly integrated solu-tion for USB Type-C, USB PowerDelivery (PD), and USB Program -mable Power Supply (PPS)adapters.

This compact InSOP™-24D-packaged IC includes a USB-Cand PD controller, a high-voltagePowiGaN™ switch, a multi-mode quasi-resonant flybackcontroller, secondary-side sens-ing, FluxLink™ isolated digitalfeedback and a synchronous-rec-tification driver.

InnoSwitch3-PD ICs targetdesigners seeking the ultimatein charger power density. Thisrequires the highest level of inte-gration and maximum efficiencyto limit self-heating. The latestaddition to the InnoSwitch3 fam-ily dramatically simplifies thedevelopment and manufacturing

of compact, energy-efficient USBPD power supplies for smart-phones, tablets, notebooks, andother devices that benefit fromfast charging.

InnoSwitch3-PD ICs reducethe BOM count to half that ofconventional designs, reducingdesign time and simplifyinghigh-volume manufacture forslim, ultra-compact OEM andaftermarket chargers.

Featuring no-load powerconsumption as low as 14 mW,power supply designs usingInnoSwitch3-PD ICs meet allglobal energy-efficiency regula-

tions. The high efficiency of thesedevices ensures low heat dissipa-tion, eliminating the need forbulky heatsinks.

Power Integrations’ Flux -

Link high-speed communications feedback link ensures fast, accu-rate secondary-side regulation. InnoSwitch3-PD ICs are also fully protected, with input volt-age monitoring, accurate brown-in/brown-out and overvoltage protection, and output over- and under-voltage fault detection with independently configurable fault response.

Contact: Power Integrations, Inc., 5245 Hellyer Avenue, San Jose, CA 95138 % 408-414-8573 E-mail: [email protected] Web: www.power.com


Power Integrations Intros Flyback Switcher ICs

InnoSwitch3-PD flybackswitcher.

CrystalResonatorEngineeringDesign Kitfrom RaltronMIAMI, FL — Raltron Elec -tronics Corporation has intro-duced a crystal resonator engi-neering design kit to maximizeease of use during project designstages. The engineering designkit features more than sixty com-binations of frequencies, loadcapacitances and package sizesthat are recommended for usewith many of the popular ICs.

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kit includes frequencies from 8 to 50 MHz in ceramic package sizes from 5032 to 1210, and 32.768 kHz in 3215 to 1210 size pack-ages. A printed card behind each sample pocket allows the user to connect to a special website pro-viding the Raltron part number, part description, full specs, envi-ronmental data, an RFQ form and a connection to distributors who carry the item in inventory. Users can also request additional samples or parameter modifica-tions.

Contact: Raltron Electronics Corp., 10400 NW 33rd Street, Suite 290, Miami, FL 33172 % 305-593-6033 E-mail: [email protected] Web: www.raltron.com

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VAN NUYS, CA — OptimalEngineering Systems (OES) isoffering a new series of high-pre-cision, low-profile, low-costmotorized dual-axis X/Z position-ing stages.

The compact XZ110 dual-axis linear stages are availablewith x-axis and z-axis travellengths of 0.6, 1.2, 2, and 3 in.(15, 30, 50, and 75 mm).

Precision ground leadscrews with only 2 microns ofbacklash and high precisioncross roller linear travel guidesassure repeatability of 3 microns,and positional accuracy of 10microns.

Open-loop resolution of eachstepper motor driven axis is 0.5microns using a 10 micro-steps-per-step stepper motor driver.However, even greater precisionand higher travel speeds can beachieved with the selection ofeither a three-phase brushlessservo motor or DC brush servomotor.

Each of the tables has a pre-cision pattern of 16 threadedmounting holes for the additionof custom tooling. The base hasdrilled and countersunk holes foreasy integration into new andexisting applications.

The knob on the back of thestepper motors for manualadjustments can be replaced

XZ110 dual-axis linear stage.with an incremental encoder for position verification. Each stage includes limit switches that should be used to avoid over-travelling. Any of XZ110 series of linear positioning stages can be ordered as a complete plug-and-play system with fully compati-ble multi-axis motion controllers.

Contact: Optimal Engineer -ing Systems, Inc., 6901 Woodley Avenue, Van Nuys, CA 91406 % 888-777-1826 E-mail: [email protected] Web: www.oesincorp.com

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HARRISBURG, PA — PhoenixContact now offers high-contrastcapacitive touch displays andmembrane keypads for its indus-trial housing line.

The configurable new optionsgive electronics manufacturersan off-the-shelf, cost-effectiveenclosure design option and cre-ate a user-friendly interface fordevice operators.

With the new web-based

configurator, designers can cus-tom-position the display oradjust the shape, color, buttonsize, and printing of keypads tomeet specific application require-ments. The coordinated con-struction of the components cre-ates a contemporary design.

The plug-and-play modulesare prefabricated and tested,ready for final assembly. The dis-plays provide visualization andintuitive operation for applica-tions such as pressure or flowmeasurements, machine statesor errors, energy monitoring, or

building automation controls.The displays are integrated flush

into the housing front. High-res-olution, graphic-capable 2.4-inch color displays, with or without touch function, are available for Phoenix Contact’s ICS, ME-IO, and UCS enclosure families. Display/touch combinations up to 7 in. are available for the UCS family. Due to the larger size, these displays can visualize more complex processes.

Contact: Phoenix Contact, P.O. Box 4100, Harrisburg, PA 17111 % 717-944-1300 E-mail: [email protected] Web: www.phoenixcontact.com


High-Contrast Touch Displays from Phoenix Contact

Prefabricated touch displays.YamaichiRefinesCircularConnectorDesignSAN JOSE, CA — The successfulY-Circ P series of push-pull cir-cular connectors from YamaichiElectronics is being expandedwith a new release system. The

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system is flexible and designed for easy unlocking.

The opening assistance is compatible with all straight and angled cable connectors of the Y-Circ P series and can be used for all standard sizes. With its facil-itating release function, this accessory helps the user to gain full advantage of the push-pull connectors — especially within tight mounting spaces.

Merely pulling on the lan-yard leads to an unlocking effect for the push-pull circular connec-tor. The lanyard extends the cir-cular connector.

Therefore, the push-pull system’s features and advan-tages are completely maintained. An increase in time-efficiency can be gained through a better accessibility of the unlocking device, on behalf of extremely tight connector positions. The circular connectors are accessible and can be pulled without much effort. Yamaichi Electronics offers new products of the Y-Circ P series pre-assembled. The new release system can be used immediately after delivery.

Contact: Yamaichi Electronics USA, 475 Holger Way, San Jose, CA 95134 % 408-715-9100 E-mail: [email protected]: www.yeu.com

See at productronica, B1.106 and SEMICON West, Booth 1139

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GAITHERSBURG, MD — GLCommunications has introduceda range of test solutions for 5Gnetwork technology. The solu-tions are organized into cate-gories that include core networktesting, and voice and data qual-ity testing. GL can simulate the

multitude of 5G core network ele-ments, such as the UE+gNB,AMF, SMF, UPF, AUSF, UDM,UDR, NSSF, and NRF.

GL can measure voice quali-ty, latency, and throughputacross all wireless networksincluding 5G by directly connect-ing to endpoint devices such ascell phones and sending andrecording audio files.

GL Communications hasdeveloped its MAPS™ (MessageAutomation and Protocol Simu -lation) software simulation suite.This versatile software programcan emulate a multitude of dif-ferent protocols spanning thetime-domain multiplexing (CAS,SS7, ISDN, etc.), voice over IP

(SIP, RTP, SIGTRAN, etc.), andwireless (2G, 3G, 4G LTE, 5G)domains.

The end-to-end 5G networkcomprises the 5G access network(gNB), access and mobility man-agement function (AMF),authentication server function

(AUSF), network slice selection function (NSSF), unified data management (UDM), session management function (SMF), and user plane function (UPF) connected to data server or appli-cation functions and to EPC/IMS core for interoperability.

The core network and all its underlying entities can be accu-rately tested for functionalities and performance using the MAPS framework.

Contact: GL Communications, 818 W Diamond Avenue, Suite 3, Gaithersburg, MD 20878% 301-670-4784 E-mail: [email protected]: www.gl.com

5G network test solution.

GL Launches 5G Test Solutions

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COLUMBIA, MD — The reverberation chambers from Bluetest incombination with the R&S CMX500 now enable developers and man-ufacturers of 5G components and devices to perform MIMO stresstesting under realistic conditions with high data rates.

Bluetest, based in Gothenburg, Sweden,specializes in reverberation chambers such asthe RTS65 for efficient OTA performance evalu-ation of the device under test (DUT). Unlike ane-choic test chambers, reverberation chambersreflect an RF signal inside the chamber to thegreatest possible extent to create a Rayleighfaded multipath RF environment similar to realworld indoor and city conditions.

The setup is run by the Bluetest Flow soft-ware, an integrated test environment for com-plex wireless solutions. It features characteris-tics such as an integrated result database,comprehensive customizationoptions and a full-fledged scien-

tific computing environment, and supports legacy as well as the lat-est wireless standards such as 5G NR.

The R&S CMX500 emulates the network in the test setup. It is afuture-proof solution for 5G NR testing, allowing both non-standalone

and standalone testing in FR1 and FR2. Featuring a modular design, the R&S CMX500 adds 5G capabilities to LTE based legacy solu-tions such as the well-established R&S CMW500 wideband radio communication tester or the R&S CMWflexx platform.

Contact: Rohde & Schwarz USA, Inc., 6821 Benjamin Franklin Drive, Columbia, MD 21046 % 888-837-8772 E-mail:[email protected] Web: www.rohde-schwarz.com

See at productronica, A1.375R&S CMX500.

R&S 5G Tester Integrated by Bluetest

ZukenExpandsModel-BasedSystemsEngineeringWESTFORD, MA — Zuken has formed a new R&D unit to help customers to transform their product development process through the introduction of model-based systems engineer-ing (MBSE).

MBSE has proven effective in developing extensive and com-plicated systems such as aero-space, aircraft, and the automo-bile industries. The challenge many product development com-panies face today is not just introducing MBSE but bridging MBSE into a digital engineering-based design process afterward. Zuken is uniquely positioned to offer both MBSE and detailed design solutions for electrical and electronic systems. Combining these disciplines enables customers to produce better product definition and communication, leading to fewer design errors and improved traceability.

Zuken has established a process innovation development department, which will assist the company’s process innova-tion promotion department. That department has been responsible for business development in the fields of MBSE and systems engineering in Japan. The department will enable Zuken to work closely with Zuken Vitech to expedite efforts to develop application software and utilities linked to the GENESYS model-ing tool, and interfaces with existing Zuken products.

Contact: Zuken USA, Inc., 238 Littleton Road, Suite 100, Westford, MA 01886 % 972-691-3284 E-mail: [email protected] Web: www.zuken.com

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STONEHAM, MA — From precise monitor-ing to picking and automation, there arecountless applications that benefit from reli-able image information. With the introduc-tion of uEye XCP, uEye XLE and Ensenso S,camera specialist IDS proves that industrial-grade image processing technology does notneed to be expensive.

The new uEye XCP camera family fromIDS shows that cost-effective industrial cam-eras with C-mount can also be offered in theindustry’s smallest standard format.Initially, the USB3 camera will be launchedwith the 2.3 MP AR0234 global shutter sen-sor and the 5 MP AR0521 rolling shutter sen-sor from ON Semiconductor.

Their cost-optimized design makes themideal for high-volume and price-sensitiveprojects. The cameras feature a fully encloseddie-cast zinc housing and their C-mount

adapter allows the use of common lens sizesand ensures a favourable system price.

For anyone looking for cameras specifi-cally designed for high-volume and price-sen-sitive projects, the uEye XLE camera familyis also worth considering. Thanks to differenthousing and lens holder variants, extremelycompact dimensions and USB3 interface, thecameras can be easily integrated into anyimage processing system.

Customers can choose between modelswith plastic housing and C/CS mount or S-mount and board-level version with or with-out C/CS mount or S-mount lens holder.Available with the 2.3 MP sensor ONSemiconductor AR0234 and the light-sensi-

tive 5 MP sensor ON Semiconductor AR0521, other sensors will follow.

For users with particularly high demands on resolution, image quality and transmission speed, IDS will launch industrial cameras with a 10 GigE high-speed interface and various sen-sors under the name uEye Warp10. They are capable of pre-cisely capturing even high-speed processes and forwarding the image information in the net-work without delay.

Contact: IDS Imaging Development Systems, Inc., 92 Montvale Avenue, Suite 2800, Stoneham, MA 02180 % 781-787-0048 E-mail: [email protected] Web: www.ids-imaging.us

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Treston AddsBattery toMotorizedWorkstationsCANTON, GA — Traditional mobile workspaces have been limited to benches and carts with manual height adjustment. Now, Treston has launched a battery pack for its Concept Motor and TED workstations, allowing for motorized height adjustment wherever it is needed.

By plugging the battery into the motor table control box, the user is able to change the motor table height, without being tied directly to a wall outlet.

Treston is a global supplier of industrial and laboratory fur-niture. The company has deliv-ered over 500,000 workstations and is now present in over 30 countries via subsidiaries and an extensive network of selected distributors. Treston’s high-qual-ity modular products and expert-ise in the areas of ergonomics, ESD, and LEAN help its cus-tomers to create functional, safe and productive workplaces.

Contact: Treston, Inc., 156 Bluffs Court, Canton, GA 30114 % 800-437-6772 E-mail: [email protected] Web: www.treston.us

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WIXOM, MI — The CFRP pro-duction team at BMW createdcustomized carbon spats of theMINI John Cooper Works GPcar, using RAMPF’s C-DS com-pact dispensing system. Duringthe fully automated process, the

spats are wet-pressed onto injec-tion-molded plastic inner panels.

RAMPF’s technology en suresthe reactive polyurethane adhe-sive system is applied rapidly andwith outstanding precision. Themodular design of the C-DSmeans it is easy to integrate intothe overall production line, whilethe continuous monitoring of pres-sures, temperatures, and fill lev-els with graphically supportedprocess overviews ensures maxi-mum reliability.

The C-DS is equipped with

the MS-C 100 mixing systemdeveloped by RAMPF ProductionSystems. This dynamic compact

system covers a dispensing out-put range of around 2 to 120g per second. Its small external dimen-sions give the mixing system greater flexibility for applying complex component contours, which is a key advantage when it comes to the spats.

Contact: RAMPF Group, Inc., 49037 Wixom Tech Drive, Wixom, MI 48393 % 248-295-0223 E-mail: [email protected] Web: www.rampf-group.comSee at productronica, A3.339


Custom carbon spats used by BMW.

RAMPF Creates Carbon Spats for Automobile

OAKWOOD, GA — Mencom, theNorth American distributor forILME connectors, offers rectan-gular enclosures with EMCshielding to protect sensitive sig-nals from external electromag-netic signals but also to sealstronger signals from leaking tothe outside and interfering withsurrounding electronics.

According to the transferimpedance measurement test byCESI EMC Laboratory based onGerman Military standards VG95214-10 and VG 95214-11,Mencom’s EMC series enclosures

MencomIntros EMCRectangularEnclosures

Rectangular EMC enclosure.with dedicated electromagnetic shields provide additional im -prove ments with better shielding attenuation than their standard metal enclosures that already pro-vide a decent level of shielding attenuation.

These EMC enclosures are especially useful when sensitive electronics transmitting critical data/signal operates near weld-ing robots because the EMC series rectangular enclosures can effectively protect the sig-nals and communication inward and outward from electromag-netic interference (EMI) or radio frequency interference (RFI).

The EMC rectangular enclo-sures are available in bulkhead and surface mount housings, and hood versions with various sizes. The surface of the enclosures and gaskets are corrosion-resistant and engineered to be extremely conducive to seal off stray EMI/RFI signals.

Contact: Mencom Corp., 5750 Mcever Road, Oakwood, GA 30566 % 770-534-4585 E-mail: [email protected] Web: www.mencom.com

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times of 0.3 ms and 40 ms typical,

respectively.

Available in 8-pin SOP Wide Body

and 8L WSON packages, the devices

operate from a single 2.7 to 3.6V power

supply over an industrial temperature

range of –40 to +185°F (–40 to +85°C).

The solutions offer typical erase/pro-

gram currents of 20 mA and maximum

read currents of 25 mA at 104 MHz, and

they provide reliable, long-term per-

formance with 100,000 program/ erase

cycles and 10-year data retention.

AS25F series devices support uni-

form 4, 32 or 64 kB erase, offer an

8/16/32/64B wrap-around burst read

mode, and feature program/erase sus-

pend and resume. Advanced security fea-

tures include block protection and 4 kb


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CONVINCING SOLUTIONS FOR ALL CHALLENGESFor 5G applications, we offer you process efficient solutions for electronics manufacturing to securely connect components and assemblies of various forms and sizes. In selective and wave soldering up to PCB formats of 610 - 3,000 mm.

For rework applications from micro chips (01005) to components of 120 x 120 mm edge length (BGA). We offer POWERFLOW ULTRA wave soldering systems for up to 850 mm and HOTFLOW reflow soldering systems for up to 1,200 mm board length - also with split conveyor, without “changeover times”.

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Soft-termination MLCCs.termination has a slightly higher terminal electrode resistance, it is necessary to keep the resist-

ance low to reduce loss. TDK’s new kind of soft termination is resistant to board flexure stress while limiting rising resistance by covering only the board mounting side with a resin layer.

TDK predicts these products will encourage replacing MLCCs in power lines with soft termina-

tion to improve reliability. These new products have a higher capacitance than conventional products, help reduce parts and downsize equipment. TDK will continue to expand its MLCC line-up to meet customer needs in the future.

Contact: TDK Corporation of America, 511 E John Carpenter Freeway, Irving, TX 75062

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secured OTP to protect content from hostile access and inadver-

tent programming and erasing.

Contact: Alliance Memory, Inc., 511 Taylor Way, San Carlos, CA 94070 %650-610-6800

E-mail: [email protected] Web: www.alliancememory.com

TDK Adds LowResistance SoftTerminationMLCCsIRVING, TX — TDK Corporation has expanded its CN series of multilayer ceramic capacitors (MLCCs). The new products, 10 µF capacitance in 3216 size and 22 µF capacitance in 3225 size, offer low-resistance soft termina-

tion with low terminal resist-

ance.

MLCCs with soft termina-

tion prevent short-circuits in power lines. However, since soft

3V Multi-I/O Flash Memory from Alliance

3V serial NOR flash memory.


https://www.kurtzersa.com/homepage.html

LONG BEACH, CA — Epson has launched its RC+ Express robot programming software, an intuitive visual-based teaching environment.

It is suitable for users with little-to-no programming experience, enabling manufac-turers to quickly and easily develop robotic programs to overcome cost and time barriers associated with running industrial robots.

Developed for Epson T-Series All-in-One and LS-B Series SCARA robots, Epson RC+ Express features a simple, visual-based teaching environment that integrates an easy-to-learn, block-style format with the power and flexibility of a scripted-text pro-gramming language. Ready-to-use templatesare included, allowing users toquickly create common pick-and-place, palletizing and depalletiz-

ing applications.Epson RC+ Express includes a simple-

to-navigate visual user interface, making it easy to learn and manage key functions like jogging, gripper control, and motion. The software is equipped with time-saving fea-tures such as Epson proprietary Focus Assist technology with auto generated fields for quick and easy setup, and a built-in 3D sim-ulator to help visualize and fine-tune appli-cations.

Contact: Epson America, Inc., 3840 Kilroy Airport Way, Long Beach, CA 90806 % 562-290-5683 E-mail: [email protected]: www.epsonrobots.com


FLEMINGTON, NJ — Magna-Power Electronics has added 54new models to its TS SeriesMagnaDC programmable powersupply line, expanding it to 75kW in 12U and 100 kW in 16U,voltage ratings up to 6,000 VDCfloating, and current ratings upto 8,000 ADC. The new TS seriesmodels occupy less than 25 per-cent of the volume as Magna-Power’s previous 75 kW and 100kW offerings, respectively, pro-

TS series programmable DCpower supply.

viding significant space savings for high-power applications.

A new enhanced mechanical design, featuring removable cast-ers, AC grommet, and protective DC covers, provides flexibility to allow the new models to be operat-ed with or without a standard rack. With the casters removed and using the included heavy-duty rack-mount kit, the products can be easily integrated with other instrumentation into stan-dard rack enclosures, including Magna-Power’s range of CAB1 (12U) to CAB4x3 (36Ux3) racks.

Contact: Magna-Power Electronics, Inc., 39 Royal Road, Flemington, NJ 08822 % 908-237-2200 E-mail: [email protected] Web: www.magna-power.com

Magna-PowerExpands TSSeries ofPowerSupplies

RC+ Express robot control software.

Epson Releases No-Code Robot Control Software

https://www.us.lambda.tdk.com/


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Automotive Satellite CameraModules from ROHM

SANTA CLARA, CA — ROHMSemiconductor has launched newSerDes ICs and a power manage-ment IC (PMIC) (BD86852MUF-C) ideal for vehicle satellite cam-

era modules for ADAS. The newproducts solve issues concerningthe miniaturization and lowpower consumption of modules,and also provide features such aslow electromagnetic noise (EMI).Both products utilize a spreadspectrum function to reduce EMI,which simplifies design of anynecessary EMI countermeasures.

The BU18xMxx-C Ser Des ICoptimizes the transmission ratebased on video resolution, makingit possible to reduce power con-sumption by 27 percent over gen-eral products. The built-in spreadspectrum function reduces the

EMI peak by 20 dB, while an inte-grated video sticking detectionfunction improves the reliability ofthe entire ADAS by detectingfrozen images.

The BD86852MUF-C PMIC for cameras is designed to opti-mally manage the power supply systems of CMOS image sensors from all major manufacturers. This allows voltage settings and sequence control to be performed with a single IC, reducing mounting area by 41 percent and contributing to the miniaturiza-tion of vehicle camera modules.

Contact: ROHM Semicon -ductor USA, 2323 Owen Street, Santa Clara, CA 95054 % 408-720-1900Web: www.rohmsemiconductor.com

New ICs for vehicle satellite camera modules.

https://www.ironwoodelectronics.com/

https://www.camiresearch.com/testimonials.html

SANTA CLARITA, CA — The LSS-031-04-011-MEA is a new series of single-axis linearstepper stages that integrates a linearencoder into the single-axis linear steppermotor stage to operate the linear steppermotor as a two-phase brushless linear motorwhen coupled with an advanced motion con-trol electronics package provided by H2W.

When operated this way, the motors willtend to run cooler as they will only draw thecurrent needed to hold the desired position ormake the desired move. The H2W linearstepper motor STS-1220-AP3 powers thestage and generates a force of 11.0 lb (48.8 N)with a total stroke length of 31.0 in. (788mm) and integrated air bearings maintainthe required motor air gap. Thecustomer must supply 60-80 PSIof filtered compressed air for

proper operation of the stage.The integrated 1µ-resolution encoder

works with the control package to operatethe stepper motor as a two-phase brushless

linear motor, which generates higher speeds, and also allows for precise positioning.

Operating at high speeds could lead to cable fatigue and failure. The forcer and stage have a high-flex power cable and cable carrier for protection against fatigue and fail-ure. Some provisions allow the routing of cus-tomer cables within the cable carrier. Custom mounting holes on the moving table are available upon request at no additional charge.

Contact: H2W Technologies, 26380 Ferry Court, Santa Clarita, CA 91350 % 888-702-0540 fax: 661-291-1626 E-mail: [email protected]: www.h2wtech.com


High energy design, less than 6ft in length

Capable of both water and aqueous chemical cleaning applications

Maximize up time and productivity

~ƎƥĿŞĿǕĚē�ĿŞƎĿŠĳĚŞĚŠƥ�ĲūƑČĚ�îŠē�Ƿūǅ�ŞîŠîĳĚŞĚŠƥThe Nanojet is a batch cleaner replacement with similar size and SUPERIOR cleaning!Austin American Technology’s breakthrough advances in cleaning technology bring Progressive Energy Dynamics (PED) to the NanoJet™ inline Cleaning System resulting in cleaning power unequaled in its class. Developed using complex modeling techniques, this innovative approach to cleaning ensures that each progressive stage in the process optimizes mechanical, thermal, and chemical energy to achieve the best possible performance.

NanoJet™Inline Electronics Cleaning SystemT H E W O R L D ’ S S M A L L E S T I N L I N E C L E A N E R !

www.aat-corp.com

Single-axis linear stepper stage.

New Single-axis Linear Steppers from H2W

Knowles NowCustomizingCapacitorAssembliesITASCA, IL — Knowles Precision Devices, a division of Knowles Corporation, recently introduced a new customizable capacitor assembly for automotive, mili-tary and aerospace applications.

The custom approach to large capacitor assembly offers customers a unique combination of capability and durability, while helping to maximize board space. The capacitor assemblies utilize the vertical space above the circuit board to achieve very high capacitance and very high voltage in a smaller area.

The large capacitor assem-blies are highly customizable both in height and shape. They are custom built using large diameter pins that are low loss and ultra-stable dielectric.

The pins are mechanically decoupled from ceramic ele-ments, which allows the assem-bly to withstand severe mechani-cal shock, vibration and temper-ature variation.

The large capacitor assem-blies, initially available in ultra-stable low-loss C0G dielectric, have a high capacitance range of 10 nF to 3.9 µF and a voltage range from 500 to 5,000 VDC.

The pins used are large enough to handle very high rip-ple currents so that the capaci-tance does not drop with applied voltages or changes in tempera-ture.

The capacitor assemblies are tested to meet the demands of AEC-Q200 standards and par-ticularly suitable for use in elec-tric vehicle and resonant wire-less charging systems.

Contact: Knowles Corp., 1151 Maplewood Drive, Itasca, IL 60143 % 630-250-5100 E-mail: [email protected] Web: www.knowles.com

https://www.aat-corp.com/

PETACH TIKVA, Israel — STXIMotion is now offering a range ofsolutions designed for autono -mous mobile robots (AMRs).

Products include the mobiMSwheel drive system, servSDservo drives, stepIM integratedclosed loop steppers, Rayonharsh environment drives, andRayon embedded servo drives,all of which specifically targetAMR and automated guidedvehicle (AGV) deployment.

STXI Motion’s mobiMSmobile motion system is a com-plete wheel drive system for

AMRs and AGVs in intra logis-tics and warehousing applica-tions. It features a mobiGM high-torque density brushless servo motor, planetary gearbox, brake, encoder, and servSD servo drive.

The mobiMS integrated sys-tem saves space for other compo-nents and simplifies the cabling and mechanical design of the AMR or AGV. Designed for AMRs and AGVs, the servSD ready-to-connect, low-voltage servo drive offers high power density in a small footprint, with near-motor mounting for appli-cations with tight space con-straints.

The servSD also offers safe torque off (STO) functional safe-ty. STXI Motion also showcases the stepIM closed loop servo drive, which enhances motor performance with no step loss.

Contact: STXI Motion, Inc., 707 Augusta Drive, North Aurora, IL 60542 % 630-408-7033 E-mail: [email protected] Web: www.stxim.com


610-592-01671055 West Germantown PikeNorristown, PA 19403 USA

Only NorCom optical leak technologydetects both gross and fine leaks inhermetically sealed packages, this fast.Instead of using multiple technologies

and processes, you can leak test virtually any type of package with one high-speedsystem. The NorCom 2020™ series inspects hermetically sealed components to

MIL-STD 883 requirements either in seam seal trays, or when already mountedto circuits boards and assemblies. It automatically rejects failed

devices, and reports the leak rate for each part, eliminating“divide and conquer” leak testing.

Try it free. Send us your package samples today,for a leak test evaluation and report at no charge.

*Note: Test time is dependent on package volume

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STXI Offers Motion Controland Servo Solutions

Asahi Kasei IntroducesHalogen-FreePolyamide SOMERSET, NJ — Asahi Kasei has introduced its halogen- and red phosphorus free, semi-aro-matic polyamide 66 LEONA™ SN to the European market. The LEONA SN grades are certified with the V-0 flame retardancy according to the UL standard, and achieve 600V, the highest value on the Comparative Tracking Index (CTI).

In addition to the flame-retardant and creep-resistant properties, the material features a superior surface quality. This is achieved without additional treat-ment and coating and even with a glass-fiber content of up to 50 per-cent. Another characteristic of this material is its high retention rate of physical properties in a conditioned state. While compara-ble halogen-free PA66 materials show a significant decline in prop-erties, LEONA SN is formulated to maintain a high level of tensile strength and flexural modulus also after moisture absorption. This opens up new possibilities for applications in environments, where the use of standard FR PA66 can become an issue.

Contact: Asahi Kasei America, Inc., 800 Third Avenue, 30th Fl New York, NY 10022 % 212-371-9900 Web: www.ak-america.com


https://www.d2p.com/

https://www.advanced.com/

https://norcomsystemsinc.com/

IRVINE, CA — Henkel haslaunched a new class of 3D print-ing resins for healthcare applica-tions under its Loctite brand.

The broad portfolio of high-performance photopolymersoffers a range of biocompatibilitystandards from safe to touchparts to medical devices.

In addition to the establishedportfolio of Loctite 3D Printingresins, the company delivers tai-lored formulations to fit the specif-ic application requirements andmarket demands for optimizedproduction.

Henkel 3D printing resinsare designed and manufacturedin accordance with ISO 13485quality management standards toensure uniformity in design,development, production and

delivery of medical devices. InHenkel’s case specifically, it cov-ers the design and manufacturingof biocompatible resins and othermaterials used to produce non-implantable medical devices.

Henkel resins are validatedfor use in approved workflowswhich enables customers toachieve consistent results in vol-ume production while meetingthe relevant biocompatibilitymeasures.

This process allows the com-

pany to technically engage with partners to ensure results meet-ing the technical data sheets and are biocompatible.

Henkel can help customers de-risk the path to launch a product in the healthcare market by developing products and vali-dating workflows ensuring regu-latory requirements are met.

Contact: Henkel Corp., 14000 Jamboree Road, Irvine, CA 92606 %714-780-2909 Web: www.henkel.com


PACE’S New ADS200 AccuDrive™ Soldering Station with Cool Touch™ Handpiece

• Lightweight, ErgonomicAluminum HandpieceStays cool and comfortable all day.

• Most Cost-Effective SystemLow introductory price of $239(£199/€225) per station! Tip cartridgesare less than half the price of most cartridge style or curie point tips.

• One Tip Cartridge,Any TemperatureUnlike with curie point tips, selectany temperature for a chosen tipcartridge without having to buyadditional tips.

• Unsurpassed ThermalPerformance andProductivity

• Rugged All-MetalConstruction

• High-CapacityIntegrated HeaterDeliver up to 120 wattsof pure power.

Production Soldering REDEFINED.Try the new ADS200 and improve your bottom line in both light & heavy use environments.

Find out more at paceworldwide.com/ADS200

Solutions and systems for soldering, rework and repair of electronics1-877-882-7223 | paceworldwide.com

more at

Soldering Station with Cool Touch™ Handpiece

Lightweight, ErgonomicAluminum HandpieceStays cool and comfortable all day.

Most Cost-Effective SystemLow introductory price of $239 (£199/€225) per station! Tip cartridgesare less than half the price of most cartridge style or curie point tips.

One Tip Cartridge,Any TemperatureUnlike with curie point tips, selectany temperature for a chosen tipycartridge without having to buyadditional tips.

Unsurpassed ThermalPerformance andProductivity

Rugged All-MetalConstruction

High-CapacityIntegrated HeaterDeliver up to 120 wattsof pure power.

Try the new ADS200 and improve your bottom line in both light & heavy use environments.

Find out mFind out m

FRANKFURT, GERMANY —The HAHN Group is now offer-ing a range of solutions for theplastics industry through its sub-sidiaries WEMO Automation,Waldorf Technik and GeKu.

With Vario TIP®, WaldorfTechnik presents a patented sys-tem for the manufacture of med-ical and diagnostic consumerproducts. The Vario TIP systemis characterized by its excellentdegree of freedom for differenttool configurations and packag-

Vario TIP robotic handler. ing units, with an extremely space-saving design and com-plete cavity sorting.

The further development of the Vario TIP FSS with a particu-larly narrow structure opens up the market for MedTec injection moulders in new performance classes without requiring more clean room space. By cleverly arranging the buffer areas required for separating the cavi-ties, Waldorf Technik has suc-ceeded in reducing the area by half compared to the basic system.

Contact: HAHN Group GmbH, Frankfurt Airport Center 1, Hugo-Eckener-Ring, Gebäude 234, 60549 Frankfurt, Germany% +49-69-42-72-60-213 E-mail: [email protected] Web: www.hahn.group

DigitizedPlantSolutionsfrom HAHNGroup

Medical-grade3D printed parts.

Henkel Launches Loctite 3D Printing Resins


https://paceworldwide.com/


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YOUR SOURCE FOR THE

Latest in Global Electronics

Over three decades of in-depth technological coverage makes U.S. Tech the trusted source for the latest in the global electronics market.

Subscribe today or browse our publications

www.us-tech.com

Read your way with digital

and print versions available!

FREE

CONTA-CLIP Expands KES-ECable Entry Program

SOMERSET, NJ —CONTA-

CLIP’s new KES-E-R cable

entries allow for quick and

secure feeding of cables into con-

trol cabinets or machine hous-

ings. The plates are simply man-

ually pressed into the machined

openings.

The inner, elastic sealing lip

of the profile seal bulges on the

inside of the panel, ensuring

secure and vibration-proof hold.

In order to feed cables or hoses

into a housing, users simply

pierce the surface membrane at

one of the marked center points

and push the conduit through.

The new KES-E-R cable

entries are available in seven A

and seven B versions for cables

and pneumatic hoses with diam-

eters from 0.04 to 0.9 in. (1 to

22.5 mm).

Different versions hold up to

35 cables or conduits, allowing

high packing densities. The cable

entries provide IP54 protection

against dust and splashed water.

KES-E cable entries.They are made of TPE and are free of halogen and silicone. The material is suitable for ambient temperatures from –40 to

+194°F (–40 to +90°C).

Contact: CONTA-CLIP, Inc., 400 Apgar Drive, Suite D, Somerset, NJ 08873

% 732-564-0705

E-mail: [email protected] Web: www.contaclipinc.com

Frontend Module for VehicleComms from Richardson

GENEVA, IL — Richardson

RFPD, an Arrow Electronics com-

pany, has announced the avail-

ability and full design support for

a high-power frontend module

from Skyworks Solutions.

The Skyworks SKYA21043

is a highly integrated, 5 GHz

FEM incorporating a 5 GHz sin-

gle-pole, double-throw transmit/

receive switch, a 5 GHz high-

gain low-noise amplifier with

bypass, and a 5 GHz power

amplifier intended for high-

power 802.11p DSRC and C-V2X

applications and systems.

The LNA and PA disable

functions ensure low leakage

current in the off mode. An inte-

grated logarithmic power detec-

tor is included to provide closed-

loop power control over 20 dB of

dynamic range. The device is

provided in a compact LGA pack-

age. Qualified to AEC-Q100

(Grade 2), the SKYA21043 meets

SKYA21043 V2V module. requirements for automotive applications including vehicle-to-

vehicle (V2V) and vehicle-to-

everything (V2X).

Contact: Richardson RFPD, 1950 S. Batavia Avenue, Suite 100, Geneva, IL 60134

% 630-262-6800 E-mail: dross-

[email protected]

Web: www.richardsonrfpd.com

CAMARILLO, CA — Binder USA

has introduced five- and six-pin

versions of its M8 snap-in circu-

lar connectors. Previously avail-

able in only three- and four-pin

arrangements, the new versions

increase the flexibility for use in

a wider variety of applications.

These cable connectors are

ideal for signal transmission

applications that are subject to

space constraints, from industri-

al sensors and actuators to con-

veyor technology to drones.

The secure snap-in locking

mechanism does not use any

rotating elements, ensuring quick,

simple, and efficient installation.

Latching is confirmed with an

audible clicking sound. IP65-level

protection offers highly-reliable

performance in harsh industrial

environments.

Contact: Binder USA, 3903 Calle Tecate, Camarillo, CA 93012 % 805-437-9925

E-mail: [email protected] Web: www.binder-usa.com

M8 snap-in connectors.

Binder USA Adds to M8Connector Lineup




www.xjtag.comAdvertorial

Bamboo Systemswww.xjtag.com

The company’s engineeringteam is using XJTAG boundary scanto test the computers’ complexdigital PCBs. The XJTAG tools areused during board bring-up and atend-of-line production test, in eachcase helping to enhance flexibility,save time, and increase productivity.

By involving the XJTAG systemearly in the product lifecycle,engineers can establish confidence inthe base hardware while software forthe product is still in development.Bamboo Systems uses XJAnalyserduring board bring-up to verify basicfunctionality and allow somefunctional testing without runningsoftware on the Device Under Test(DUT). More testing can then be doneusing XJDeveloper to test devicessuch as DDR RAMs and NAND flashICs in BGA packages that wouldotherwise require functional tests tobe written by the software team.

“XJTAG adds value during the initialbring-up by letting us decouple thehardware activities from direct softwaresupport,” comments Malcolm Adams,Director of Hardware Engineering atBamboo Systems. “The XJTAG toolsallow us to start developing tests

before receiving the first manufacturedsystems, which accelerates designverification of low-speed interfaces.This is much faster than traditionaldevelopment using iterativemicrocontroller firmware builds.”

The first project he and the teamtackled involved developing a PCB aspart of a computing blade designed tobe integrated with a system to form ahyper-converged compute platform.The board’s major componentsinclude an STM32 microcontroller asthe board manager, a 10Gb Ethernetswitch, DDR and NAND flash chips,

EEPROMs, RTC, high-density I/Os,I2C and SPI devices, temperaturesensors, LEDs, and an interface forsingle-board computers (SBCs).Using XJTAG allowed this interfaceto be tested using ‘dummy’ JTAGmodules to save putting an expensiveSBC at risk during testing. A libraryof XJEase device models is readilyavailable for commonly used ICs,which significantly speeds up testdevelopment overall.

Bamboo Systems is also usingXJTAG to raise end-of-line productiontesting efficiency. XJTAG performsinitial testing of connections andcomponents to isolate any defectiveunits before the boards undergohigher-level functional tests.

“As part of the support providedwith our purchase, XJTAG committedto help develop tests for our firstboundary scan project,” continuesMalcolm Adams. “Working withXJTAG’s experts helped us understandthe tools quickly and provided insightsthat will save time on future projects.”XJTAG provides ongoing support andalso holds frequent boundary scanworkshops for engineers.

“Another attractive aspect ofXJTAG is the XJRunner system,which allows our manufacturingpartner to easily apply the tests wedevelop,” he adds. “XJTAG can alsointegrate with non-JTAG systemssuch as our power supply functionaltester, as well as producing outputthat can be understood by the WATStest data management platform weuse to analyse and then optimiseproduction performance.”

Bamboo Systems, based in Cambridge UK, uses embedded systemsmethodologies to create high-throughput computing solutions thatconsume a fraction of the energy and space of traditional servers.The product range addresses a wide range of vertical markets,delivering scale-out solutions designed for next generation datacenters, and includes the flagship B1000N series, which puts eight16-core Linux servers in a 1U enclosure.

“XJTAG adds value during the initial bring-up by letting us decouple thehardware activities from direct software support.”“The XJTAG tools allow us to start developing tests before receiving the

first manufactured systems, which accelerates design verification of low-speed interfaces. This is much faster than traditional development usingiterative microcontroller firmware builds.”“XJTAG can also integrate with non-JTAG systems such as our power

supply functional tester, as well as producing output that can be understoodby the WATS test data management platform we use to analyse and thenoptimise production performance.”

opinion Malcolm AdamsDirector of Hardware EngineeringBamboo Systems

Company Bamboo SystemsNature of ARM server companybusinessMain B1000N series of 1U high products throughput, high rack density,

low energy serversCustomers Next generation datacentres in a

wide range of vertical marketsFounded 2015Employees 25Locations Cambridge, UK

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BANNOCKBURN, IL — Under

the banner “Achieve Digital

Transcendance,” IPC APEX 2022

is scheduled to be held from

January 25 to 27 in San Diego.

From the exhibit floor to the

classroom and everywhere in

between, including the Inter -

national, Newcomers Net work -

ing, Show Floor, and Women in

Electronics at IPC APEX EXPO

Receptions; Ice Cream Social;

Ribbon Cutting Ceremony;

Keynote Sessions; New Products

Corridor; Trivia Networking

Night; and more, attendees will

be given opportunities to connect

and collaborate.

Among the highly anticipat-

ed special events is the opening

keynote by American science and

technology writer and TV host

David Pogue. His presentation is

titled, “Disruptive Tech & How it

Will Affect Your Business:

What’s Coming by 2026,” which

explores the cutting-edge science

that is powering the next wave of

technology.

On Wednesday, January 26,

John Mitchell, IPC president and

CEO, will assess the state of

electronics manufacturing and

identify the trends that will

define the industry’s financial

growth and technological

progress in 2022 and beyond.

Touching on topics that are the

focus of board rooms and shop

floors, such as factory modern-

ization, supply chain resiliency,

workforce demands, and envi-

ronmental stewardship, Mitchell

will cover ways to navigate

today’s dynamic global market-

place.

“Networking in person

makes a difference; and atten-

dees have an optimal opportuni-

ty to network with thousands of

their electronics industry col-

leagues at IPC APEX EXPO

2022,” said Alicia Balonek, IPC


HI-TECH EVENTSHI-TECH EVENTS

MORE SHOWS: www.topline.tv/tradeshows.cfm

2022 EDITORIAL ANDTRADE SHOW CALENDAR

Jan/Feb Assembly & Automation APEX 1/25-27 San Diego, CA

March Test & InspectionAPEC PP

APECDesignCon

ATX/MD&M West

3/22-244/5-7

4/12-14

Houston, TXSanta Clara, CA

Anaheim, CA

April/May

Manufacturing ServicesNEPCON China PP

SMTconnect/PCIM PPEDS PP

EWPTE PP

Nepcon China SMTconnect/PCIM

EDSEWPTE

4/20-225/10-125/10-135/11-12

Shanghai, ChinaNuremburg, Germany

Las Vegas, NVMilwaukee, WI

June Production & InspectionATX South PP ATX South 6/14-16 Charlotte, NC

July SMT & ProductionSEMICON West PP SEMICON West 7/12-14 San Francisco, CA

August PCB & AssemblyNEPCON Asia PP NEPCON Asia 8/23-25 Shenzhen, China

September Automation & PackagingThe Battery Show PP

PCB WestThe Battery ShowSMT Guadalajara

BIOMEDeviceIMAPS

9/7-89/13-159/21-229/28-2910/4-6

Santa Clara, CANovi, MI

Guadalajara, MexicoBoston, MABoston, MA

October

Components & Assemblyelectronica PP

SMTAI & MD&M MN PP The ASSEMBLY show PP

The ASSEMBLY ShowSMTAI & MD&M Minneapolis

electronica

10/24-2611/2-3

11/15-17

Rosemont, ILMinneapolis, MNMunich, Germany

Nov/Dec Test & Inspection BIOMEDeviceATX/MD&M West

12/14-152/14-16/2023

Santa Clara, CAAnaheim, CA

PP = Product Preview

TRADE SHOW CALENDAR(PENDING*)PCIM Asia 2022 to

Return to ShanghaiSHANGHAI, CHINA — After a

successful event this August in

Shenzhen, PCIM Asia will return

to Shanghai in 2022. The event is

to be held from August 31 to

September 2 at the Shanghai New

International Expo Centre and

showcase the latest offerings in

power electronics, intelligent

motion, renewable energy, and

energy management. Going for-

ward, the trade show will alter-

nate between Shenzhen and

Shanghai.

Shanghai is home to the

largest number of power electron-

ics companies in China. However,

an increasing number of domestic

companies are emerging in the

greater Yangtze River Delta

region, surrounding the city.

Across 27 major cities, the

Yangtze River Delta hosts a

large concentration of prominent

universities and research insti-

tutions, offering an excellent

location for PCIM Asia.

Held on the same date and

venue next autumn are Messe

Frankfurt’s Shanghai Intelligent

Building Technology, Shanghai

Smart Home Technology and

Parking China. Participants of

Information provided in the table (above) is subject to change. Please use the contact

information given with each listing to obtain the most current information.

December 7-9, 2021, Advanced Automotive Battery Conference. * San Diego

Convention Center, San Diego, CA. Contact: Cambridge EnerTech, 250 First Avenue,

Suite 300, Needham, MA 02494 % 781-972-5400 E-mail: [email protected]

January 5-8, 2022, CES. * Las Vegas Convention Center, Winchester, NV. Contact: Consumer Technology Association, 1919 S. Eads Street, Arlington, VA 22202 % 703-907-7600 Web: www.cta.tech


March 7-10, 2022, IMAPS Device Packaging. * WeKoPa Resort and Conference Center, Fountain Hills, AZ. Contact: International Microelectronics Assembly & Packaging Society, P.O. Box 110127, Research Triangle Park, NC 27709

% 919-293-5000 E-mail: [email protected] Web: www.imaps.org

December 8-10, 2021, International Electronics Circuit Exhibition(Shenzhen). * Shenzhen World Exhibition & Convention Center. Contact: HKPCA,

Unit 1508, Greenfield Tower, No. 1 Science Museum Road, Kowloon, Hong Kong

% 852-2155-5099 E-mail: [email protected]

February 15-17, 2022, Wafer-Level Packaging Symposium. * DoubleTree by Hilton, San Jose, CA. Contact: SMTA, 6600 City West Parkway, Suite 300, Eden Prairie, MN 55344 % 952-920-7682 E-mail: [email protected] Web: www.smta.org

“Achieve Digital Transcendance” at IPC APEX 2022


March 20-24, 2022, APEC. * George R. Brown Convention Center, Houston, TX. Contact: APEC c/o SmithBucklin, 330 N Wabash Avenue, Suite 2000, Chicago, IL 60611 % 202-973-8664 E-mail: [email protected] Web: www.apec-conf.org

January 25-27, 2022, SPIE Photonics West. * Moscone Center, San Francisco, CA. Contact: SPIE, P.O. Box 10, Bellingham, WA 98227 % 360-676-3290

E-mail: [email protected] Web: www.spie.org

December 8-9, 2021, BIOMEDevice. * San Jose McEnery Convention Center,

San Jose, CA. Contact: Informa Markets, 2901 28th Street, Suite 100-200,

Santa Monica, CA 90405 % 310-445-4200 E-mail: [email protected] Web:

www.informamarkets.com

November 3-4, 2021 MD&M Minneapolis. * Minneapolis Convention Center, Minneapolis, MN. Contact: Informa Markets, 2901 28th Street, Suite 100-200,

Santa Monica, CA 90405 % 310-445-4200 E-mail: [email protected]

Web: www.informamarkets.com

November 16-19, 2021, productronica. * Messe München, Munich, Germany. Contact: Messe München, Messegelände, 81823 München, Germany

% +49-89-949-11438 E-mail: [email protected] Web: www.productronica.com

December 7-9, 2021, SEMICON West. *Moscone Center, San Francisco, CA. Contact: SEMI, 673 South Milpitas Boulevard, Milpitas, CA 95035 % 408-943-6900 E-mail: [email protected] Web: www.semi.org

January 25-27, 2022, IPC APEX Expo. *San Diego Convention Center,

San Diego, CA. Contact: IPC International, Inc., 3000 Lakeside Drive, 105 N, Bannockburn, IL 60015 % 847-615-7100 E-mail: [email protected]

Web: www.ipc.org

http://us-tech.com/RelId/2686943/ISvars/default/Calendar.htm

http://us-tech.com/RelId/2686943/ISvars/default/Calendar.htm

ARLINGTON, VA — CES® 2022 isscheduled to return to Las Vegasnext year. The event will takeplace both physically and digital-ly, from January 5 to 8, 2022.More than 1,000 companies havecommitted to appear, includingAmazon, AMD, AT&T, DaimlerAG, Google, Hyundai, IBM, Intel,Lenovo, LG Electronics, Pana -sonic, Qual comm, SamsungElectron ics, and Sony.

New firms Indy Autono -mous Challenge and SierraSpace are planning to make aLas Vegas debut in 2022. EurekaPark will return with startupsrepresenting countries aroundthe world, including large dele-gations from France, Italy, theNetherlands, and South Korea.

“We’re thrilled to return toLas Vegas, home to CES for morethan 40 years, and look forwardto seeing many new and return-ing faces,” said Gary Shapiro,president and CEO, CTA.“Hundreds of executives havetold us how much they need CESto meet new and existing cus-tomers, find partners, reachmedia, and discover innovation.”

Digital audiences will also

experience the spirit of the liveevent in Las Vegas. The CESanchor desk, which debuted atCES 2021, will travel to LasVegas and connect the digitalaudience with exhibitors, confer-ence sessions, keynotes andproduct announcements from thelive event. New content will alsobe added once CES departs LasVegas, enabling attendees andexhibitors to continue connecting

and exploring.“Our customers are enthusi-

astic about returning to a live event in Las Vegas,” said Karen Chupka, EVP, CES. “Global brands and startups have shared that plans are already well underway and are committed to sharing the magic of an in-per-son CES with even more people from around the world.”

Web: www.ces.tech.com


CES 2022 to be Held Live in Las Vegas

Web: www.ipc.org r

PCIM Asia2022...Continued from previous pagePCIM Asia 2022 will be able to take advantage of synergies between the different fairs, with potential applications of power electronics across a wide range of sectors such as in smart home appliances with remote control systems, voice recognition and smart sensors as well as within building technology applications including heating, air condition-ing and refrigeration.

Web: www.pcimasia-expo.com r

IPC APEX2022...Continued from previous pagesenior director of trade shows and events. “Improving your compa-ny’s performance and furthering your own personal success, mak-ing new connections and strength-ening existing relationships is what makes the IPC APEX EXPO experience priceless.”

DDD III GGGGG IIII TTTT AAAA LLLLTTTT WWWWW

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AAAANNNNNAAAAAAAAAAALLLLLLLLLLLLLL

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San Diego Convention Center | CA

IPCAPEXEXPO. ORG | #IPCAPEXEXPO

Transcend your technical knowledge atNorth America’s largest conference for electronic industry professionals. If you seek career development, collaboration, and networking opportunities that cause an impact, join us in San Diego.

See you in San Diego at IPC APEX EXPO 2022!

Drive Digital Transcendence

Lost your news item of interest?Find it once again at www.us-tech.com

https://www.ipcapexexpo.org/



Advertiser..................................Page No. Advertiser..................................Page No. Advertiser...................................Page No.

ADVERTISER’S INDEXACL STATICIDE . . . . . . . . . . . . . . . . .12ADVANCED INTERCONNECTIONS 76

AMERICAN HAKKO PRODUCTS . . .21

APEX . . . . . . . . . . . . . . . . . . . . . . . . . . .81

ASM . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

AUSTIN AMERICAN TECH . . . . . . . .75

AVEN TOOLS . . . . . . . . . . . . . . . . . . .45

BTU . . . . . . . . . . . . . . . . . . . . . . . . . . . .23

CAMI RESEARCH . . . . . . . . . . . . . . . .34

CAMI RESEARCH . . . . . . . . . . . . . . . .74

CORNELL DUBILIER . . . . . . . . . . . . .61

COUNT ON TOOLS . . . . . . . . . . . . . . .44

CYBEROPTICS . . . . . . . . . . . . . . . . . .29

DAGE PRECISION INDUSTRIES . . . 3

DATA MODUL . . . . . . . . . . . . . . . . . . .28

DATEST . . . . . . . . . . . . . . . . . . . . . . . .13

DESIGN-2-PART SHOWS . . . . . . . . . .76

DISPLAY VISIONS . . . . . . . . . . . . . . .12

DL TECHNOLOGY . . . . . . . . . . . . . . .60

DOVE ELEC COMPONENTS . . . . . . .11

ECD . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

ELANTAS . . . . . . . . . . . . . . . . . . . . . . .62

ERSA . . . . . . . . . . . . . . . . . . . . . . . . . . .72

EXATRON . . . . . . . . . . . . . . . . . . . . . .19

FKN SYSTEK . . . . . . . . . . . . . . . . . . . .60

FLEXLINK SYSTEMS . . . . . . . . . . . .27

FOSTER AND JAMES . . . . . . . . . . . .78

FUJI CORPORATION . . . . . . . . . . . . .17

GLENBROOK TECHNOLOGIES . . . .15

GOWANDA ELECTRONICS . . . . . . . 8

HAMMOND MFG . . . . . . . . . . . . . . . .43

HANWHA TECHWIN . . . . . . . . . . . . .37

HEMCO . . . . . . . . . . . . . . . . . . . . . . . .82

ICAPE . . . . . . . . . . . . . . . . . . . . . . . . . .38

IDENTCO . . . . . . . . . . . . . . . . . . . . . . .69

INOVAXE . . . . . . . . . . . . . . . . . . . . . . .39

IPTE . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

IRONWOOD ELECTRONICS . . . . . . .74

ITW/EAE . . . . . . . . . . . . . . . . . . . . . . . .35

JTAG TECHNOLOGIES . . . . . . . . . . .70

JUKI AUTOMATION SYSTEMS . . . .47

KEYSTONE ELECTRONICS . . . . . . .41

KIC . . . . . . . . . . . . . . . . . . . . . . . . . . . .71

KOH YOUNG . . . . . . . . . . . . . . . . . . . .83

KOKI SOLDER AMERICA . . . . . . . . .48

KOMAX . . . . . . . . . . . . . . . . . . . . . . . . .28

KYZEN . . . . . . . . . . . . . . . . . . . . . . . . .57

LPKF LASER & ELECTRONICS . . . .39

MB MANUFACTURING . . . . . . . . . . .24

METALLIC RESOURCES . . . . . . . . . .65

METALLIC RESOURCES . . . . . . . . . .84

METCAL . . . . . . . . . . . . . . . . . . . . . . . .20

MID-AMERICA TAPE & REEL . . . . .66

MIRTEC . . . . . . . . . . . . . . . . . . . . . . . .49

NIHON SUPERIOR . . . . . . . . . . . . . . . 5

NIKON . . . . . . . . . . . . . . . . . . . . . . . . .32

NORCOM SYSTEMS . . . . . . . . . . . . . .76

NORDSON ASYMTEK . . . . . . . . . . . .33

NRD LLC . . . . . . . . . . . . . . . . . . . . . . .48

ON SITE GAS SYSTEMS . . . . . . . . . .46

PACE . . . . . . . . . . . . . . . . . . . . . . . . . . .77

PARA-COAT TECHNOLOGIES . . . . .54

PATLITE . . . . . . . . . . . . . . . . . . . . . . . .25

PDR AMERICAS . . . . . . . . . . . . . . . . .18

PI-PHYSIK . . . . . . . . . . . . . . . . . . . . . .64

PICO ELECTRONICS . . . . . . . . . . . . .64

PLASMA ETCH . . . . . . . . . . . . . . . . . .22

PRINTED CIRCUITS . . . . . . . . . . . . .53

PVA . . . . . . . . . . . . . . . . . . . . . . . . . . . .26

PVA TEPLA AMERICA . . . . . . . . . . . .68

REHM THERMAL SYSTEMS . . . . . .51

SCHLEUNIGER . . . . . . . . . . . . . . . . . .68

SCHURTER . . . . . . . . . . . . . . . . . . . . . 2

SEIKA MACHINERY . . . . . . . . . . . . .66

SHENMAO GROUP . . . . . . . . . . . . . . .56

SIBORG SYSTEMS . . . . . . . . . . . . . . .58

SIERRA ELECTRONICS . . . . . . . . . .58

SMART SONIC . . . . . . . . . . . . . . . . . .63

SOLDERSTAR . . . . . . . . . . . . . . . . . . .52

SPEA AMERICA . . . . . . . . . . . . . . . . .67SPECIALIZED COATING SVCS . . . .31

SPECIALTY COATING SYSTEMS . . 6

TDK-LAMBDA AMERICAS . . . . . . . .73

TECHCON . . . . . . . . . . . . . . . . . . . . . .62

TECHNIC . . . . . . . . . . . . . . . . . . . . . . .10

TECHNICA . . . . . . . . . . . . . . . . . . . . . .40

TOPLINE . . . . . . . . . . . . . . . . . . . . . . .82

US TECH . . . . . . . . . . . . . . . . . . . . . . .78

VIRTUAL INDUSTRIES . . . . . . . . . . .55

VISCOTEC AMERICA . . . . . . . . . . . . .30

VITROX TECHNOLOGIES . . . . . . . . 9

VJ ELECTRONIX . . . . . . . . . . . . . . . .42

WEST-BOND . . . . . . . . . . . . . . . . . . . .22

WUERTH ELEKTRONIK GmbH . . . .36

XJTAG LTD . . . . . . . . . . . . . . . . . . . . .79

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Koh Young SPI Verifies ADCO Circuits' PCB Assemblies

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