Post on 12-Mar-2023
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Table Of Contents
1. INTRODUCTION ................................................. 51.1 Purpose ............................................................................................... 5
1.2 Regulatory Information ............................................................... 5
1.� Abbreviations ................................................................................... 7
2. PERFORMANCE .................................................. 92.1 Product Name .................................................................................. 9
2.2 Supporting Standard .................................................................... 9
2.� Main Parts : GSM Solution ........................................................... 9
2.4HW Features .....................................................................................10
2.5SW Features .....................................................................................12
2.6 HW SPEC. ..........................................................................................14
2.7 GD880 Figures ...............................................................................20
3. TECHNICAL BRIEF ............................................21�.1 Digital Baseband(DBB/MSM7227) .........................................21
�.2 Hardware Architecture ..............................................................22
�.� Sub system(MSM7227)...............................................................25
�.4 Power Block.....................................................................................�4
�.5 External memory interface .......................................................�9
�.6 H/W Sub system ............................................................................41
�.7 Audio and sound ..........................................................................52
�.8 Camera / LCD ..................................................................................58
�.9 Proximity Sensor ...........................................................................65
�.10 Luminance Sensor .....................................................................66
�.11 Motion Sensor .............................................................................67
�.12 Vibrators .........................................................................................68
�.1� GSM MODE ...................................................................................70
�.14 UMTS MODE .................................................................................72
�.15 GPS RECEIVER ..............................................................................75
�.16 LO GENERATION and DISTRIBUTION CIRCUIT ................75
�.17 OFF-CHIP RF COMPONENTS ..................................................76
�.18 LG GD880 Main Features.........................................................80
�.19 GD880 Main Component .......................................................81
4. TROUBLE SHOOTING ......................................864.1 RF Component...............................................................................86
4.2 Signal Path .......................................................................................88
4.� Checking TCXO Block ..................................................................92
4.4 Checking FEM Block ....................................................................9�
4.5 Checking WCDMA Block ............................................................96
4.6 Checking GSM Block ................................................................ 106
4.7 GPS/WIFI/BT/FM Radio RF components .......................... 11�
4.8 GPS/WIFI/BT/FM Radio SIGNAL PATH ................................ 115
4.9 GPS/WIFI/BT/FM Radio TROUBLE SHOOTING ................ 116
4.10 Power ON Troubleshooting ................................................ 122
4.11 Charger Troubleshooting .................................................... 126
4.12 USB trouble................................................................................ 1�0
4.1� Audio trouble ........................................................................... 1��
4. 14 5M Camera trouble ............................................................... 145
4. 15 VGA Camera trouble ............................................................. 148
4. 16 Main LCD trouble ................................................................... 150
4.17 SIM Detect Troubleshooting .............................................. 15�
4.18 Side Key Troubleshooting.................................................... 155
4.19 LINEAR MOTOR ........................................................................ 157
4.20 Proximity Sensor on/off trouble ....................................... 158
4.21 Luminance Sensor on/off trouble .................................... 160
4.22 Motion Sensor on/off trouble ............................................ 162
5. DOWNLOAD ...................................................164
6. BLOCK DIAGRAM ...........................................177
7. CIRCUIT DIAGRAM ........................................185
8. BGA PIN MAP .................................................195
9. PCB LAYOUT ...................................................201
10. RF CALIBRATION .........................................20510.1 Introduction .............................................................................. 206
10.2 Terminology .............................................................................. 206
10.� Tachyon Main UI ...................................................................... 206
11. EXPLODED VIEW & REPLACEMENT PART LIST ....................................................215
11.1 EXPLODED VIEW ...................................................................... 215
11.2 Replacement Parts.................................................................. 219
11.� Accessory ................................................................................... 244
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1. INTRODUCTION
1. INTRODUCTION
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1.1 PurposeThis manual provides the information necessary to repair, calibration, description and download the features of this model.
1.2 Regulatory InformationA. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the this phone or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.
1. INTRODUCTION
1. INTRODUCTION
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1. INTRODUCTION
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E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated
by the sign. Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat
which is also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective
package as described.
2. INTRODUCTION
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1. INTRODUCTION
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1.3 AbbreviationsFor the purposes of this manual, following abbreviations apply:
Offset Phase Locked LoopOPLL
Light Emitting DiodeLED
Low Drop OutputLDO
Liquid Crystal DisplayLCD
Intermediate FrequencyIF
International Portable User IdentityIPUI
Global System for Mobile CommunicationsGSM
General Purpose Interface BusGPIB
Gaussian Minimum Shift KeyingGMSK
Flexible Printed Circuit BoardFPCB
Electrostatic DischargeESD
Electrical Erasable Programmable Read-Only MemoryEEPROM
Digital Signal ProcessingDSP
dB relative to 1 milli wattdBm
Digital Communication SystemDCS
Digital to Analog ConverterDAC
Constant Current – Constant VoltageCC-CV
Bit Error RatioBER
BasebandBB
Automatic Power ControlAPC
1. INTRODUCTION
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1. INTRODUCTION
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Wireless Application ProtocolWAP
Voltage Control Temperature Compensated Crystal OscillatorVCTCXO
Voltage Controlled OscillatorVCO
Universal Asynchronous Receiver/TransmitterUART
Time Division Multiple AccessTDMA
Time Division DuplexTDD
Travel AdapterTA
Side Tone Masking RatingSTMR
Pseudo SRAMPSRAM
Static Random Access MemorySRAM
Sending Loudness RatingSLR
Subscriber Identity ModuleSIM
Surface Acoustic WaveSAW
Real Time ClockRTC
Root Mean SquareRMS
Receiving Loudness RatingRLR
Radio FrequencyRF
Public Switched Telephone NetworkPSTN
Phase Locked LoopPLL
Programmable Gain AmplifierPGA
Printed Circuit BoardPCB
Power Amplifier ModulePAM
1. INTRODUCTION
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2. PERFORMANCE
2. PERFORMANCEGD880 Product SPEC
3
2.1 Product Name
GD880 : WCDMA900/2100+EGSM/GSM850/DCS/PCS
(HSDPA 7.2Mbps / GPRS Class 12 / EDGE Class 12)
2.2 Supporting Standard
Item Feature Comment Supporting Standard WCDMA(FDD1,8)/EGSM/GSM850/DCS1800/PCS1900
with seamless handover Phase 2+(include AMR) SIM Toolkit: Class 1, 2, 3, C-E
Frequency Range WCDMA(FDD1) TX : 1920 – 1980 MHzWCDMA(FDD1) RX : 2110 – 2170 MHz WCDMA(FDD8) TX : 880 – 915 MHz WCDMA(FDD8) RX : 925 – 960 MHz EGSM TX: 880 – 915 MHz EGSM RX: 925 – 960 MHz GSM850 TX: 824 – 849 MHz GSM850 RX: 869 – 894 MHz DCS1800 TX : 1710 – 1785 MHz DCS1800 RX: 1805 – 1880 MHz PCS1900 TX: 1850 – 1910 MHz PCS1900 RX: 1930 – 1990 MHz
Application Standard WAP 2.0, JAVA 2.0
2.3 Main Parts : GSM Solution
Item Part Name Comment Digital Baseband MSM7227 : QualcommAnalog Baseband PM7540 : QualcommRF Chip RTR6285 : Qualcomm
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2. PERFORMANCE
GD880 Product SPEC
4
2.4HW Features
Item Feature Comment Form Factor Bar type Battery 1) Capacity
Standard : Li-Ion, 900mAh
2) Packing Type : Soft PackSize Standard :
102 x 47.6 x 10.6 mm Weight 99g With Battery Volume TBD PCB All Layer (10) , 0.75tStand by time 2G Up to 340 hrs
3G Up to 300 hrs @ Paging Period 5 (2G) @ DRX 7 (3G)
Charging time 3 hrs @ Power Off / 900mAh Talk time 2G Up to 190mins
3G Up to 250 mins @ Power Level 5 (2G) @ Tx = 12dBm (3G)
RX sensitivity WCDMA(FDD1) : -106.7 dBmWCDMA(FDD8) : -103.7 dBm EGSM : -105 dBm GSM850 : -105 dBm DCS 1800 : -105 dBm PCS 1900 : -105 dBm
TX output power
WCDMA/ GSM/ GPRS
WCDMA : 24dBm/3.84MHz,+1/-3dBmEGSM : 33dBm GSM850 : 33 dBm DCS 1800 : 30 dBm PCS 1900 : 30 dBm
Class3(WCDMA) Class4 (EGSM) Class4 (GSM850) Class1 (PCS) Class1 (DCS)
EDGE GSM 900 : 27 dBmDCS 1800 : 26 dBm PCS 1900 : 26 dBm
E2 (GSM900) E2 (PCS) E2 (DCS)
GPRS compatibility GPRS Class 12EDGE compatibility EDGE Class 12SIM card type Plug-In SIM
3V /1.8V Display Main LCD
TFT Main LCD(3.2’, 480 x 854)
Built-in Camera 5M CMOS Camera 1.3M CMOS Camera (VGA)
Status Indicator Yes Keypad Function Key : 2
Side Key : 2 Function Key: CAM, Power Side Key : Volume up/down
1.�M VGA CMOS Camera
�20 hrs
180 mins225 mins
No
No
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2. PERFORMANCE
GD880 Product SPEC
5
ANT Main : Internal Fixed TypeSystem connector 5 Pin Ear Phone Jack 3.5Phi, 4 Pole, StereoPC synchronization Yes Memory NAND Flash : 4Gbit
SDRAM : 4Gbit Speech coding FR, EFR, HR,AMRData & Fax Built in Data & Fax supportVibrator Built in VibratorBlue Tooth V2.1+ EDR MIDI(for Buzzer
Function) SW Decoded 72Poly
Music Player MP3/AAC/AAC+Video Player MPEG4, H.263,
Camcorder MPEG4, H.263,
Voice Recording Yes Speaker Phone modeSupport
Yes
Travel Adapter Yes CDROM Yes Stereo Headset Yes Data Cable Yes T-Flash (External Memory)
Yes
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2. PERFORMANCE
GD880 Product SPEC
6
2.5SW Features
Item Feature Comment RSSI 0 ~ 7 LevelsBattery Charging 0 ~ 3 LevelsKey Volume 0 ~ 7 Level Audio Volume 1 ~ 20 LevelTime / Date Display Yes Multi-Language Yes English/Spanish/Portuguese/K
orean Quick Access Mode Dialing / Call Log / Contact / Menu /
Message / Camera / Favorite PC Sync Schedule / Phonebook / MEMO / SMS /
Download (Photo, file) Speed Dial Yes (1~9) Voice mail center -> 1 key Profile Yes CLIP / CLIR Yes Phone Book Name + 5 Numbers + 1 Memo + 2 e-mail
+ 3 Group Select + Picture + Ringtone + Anniversary day
Total 1000 Member
Last Dial Number Yes Total Call DB Max 100 LDN (SIM) N/A
Last Received Number
Yes Total Call DB Max 100 LDN (SIM) N/A
Last Missed Number Yes Total Call DB Max 100 LDN (SIM) N/A
Search by Number / Name
Name and Number
Group 30 Fixed Dial Number Yes Service Dial Number Yes Own Number Yes Voice Memo Yes Call Reminder Yes Network Selection Automatic
Mute Yes Call Divert Yes Call Barring Yes Call Charge (AoC) Yes Call Duration Yes SMS (EMS) 1000 (10) EMS : Release4
(Except Text align) SMS Over GPRS Yes EMS Melody / PictureSend / Receive / Save
Yes Receive only
MMS MPEG4 Send / Receive / Save
Yes Yes
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2. PERFORMANCE
GD880 Product SPEC
7
Long Message MAX 1000 Characters SMS 7pages
Cell Broadcast Yes Download Over the WAPGame Yes Calendar Yes Memo 50 World Clock Yes Unit Convert Currency/Surface/Length/Volume/Weig
ht/Temperature/Velocity Stop Watch Yes Wall Paper Yes WAP Browser Over WAP 2.0 ObigoDownload Melody / Wallpaper
Yes Over WAP
SIM Lock Yes Operator Dependent SIM Toolkit Class 1, 2, 3, C-EMMS Yes Obigo +LG MMS Client EONS Yes CPHS Yes V4.2ENS No Camera Yes 5M AF /
Digital Zoom : x16 JAVA Yes CLDC V1.1 / MIDP V2.0
Download Over WAP Voice Dial No IrDa No Bluetooth Yes V2.0
HSP, HFP, OPP, FTP(server), BPP, A2DP, AVRCP
FM radio Yes
GPRS Yes Class 12EDGE Yes Class 12Hold / Retrieve Yes Conference Call Yes Max. 6DTMF Yes Memo pad Yes TTY No AMR Yes SyncML Yes IM No Email Yes
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2. PERFORMANCE
GD880 Product SPEC
8
2.6 HW SPEC. 1) GSM transceiver specification
Item Specification
Phase Error Rms : 5° Peak : 20 °
Frequency Error GSM : 0.1 ppm DCS/PCS : 0.1 ppm
EMC(Radiated Spurious Emission Disturbance)
GSM/DCS : < -28dBm
Transmitter Output power and Burst Timing
GSM : 5dBm – 33dBm ± 3dB DCS/PCS : 0dBm – 30dBm ± 3dB
Burst Timing <3.69usSpectrum due to modulation out to less than 1800kHz offset
200kHz : -36dBm 600kHz : -51dBm/-56dBm
Spectrum due to modulation out to larger than 1800kHz offset to the edge of the transmit band
GSM : 1800-3000kHz :< -63dBc(-46dBm) 3000kHz-6000kHz : <-65dBc(-46dBm) 6000kHz < : < -71dBc(-46dBm) DCS : 1800-3000kHz :< -65dBc(-51dBm) 6000kHz < : < -73dBc(-51dBm)
Spectrum due to switching transient 400kHz : -19dBm/-22dBm(5/0), -23dBm 600kHz : -21dBm/-24dBm(5/0), -26dBm
Reference Sensitivity – TCH/FS Class II(RBER) : -105dBm(2.439%)Usable receiver input level range 0.012(-15 - -40dBm)Intermodulation rejection – Speech channels
± 800kHz, ± 1600kHz : -98dBm/-96dBm (2.439%)
AM Suppression - GSM : -31dBm - DCS : -29dBm
-98dBm/-96dBm (2.439%)
Timing Advance ± 0.5T
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2. PERFORMANCE
GD880 Product SPEC
9
2) WCDMA transmitter specification
Item Specification
Transmit Frequency Band1 : 1920 MHz ~ 1980 MHzBand8 : 880MHz~915MHz
Maximum Output Power +24 dBm / 3.84 MHz, +1 / -3 dB
Frequency Error within ±0.1 PPMOpen Loop Power Control Normal Conditions : within ±9 dB,
Extreme Conditions : within ±12 dB Minimum Transmit Power < -50 dBm /3.84 MHz
Occupied Bandwidth < 5 MHz at 3.84 Mcps (99% of power)Adjacent Channel Leakage Power Ratio (ACLR)
> 33 dB @ ±5 MHz,> 43 dB @ ±10 MHz
Spurious Emissions |f-fc| > 12.5 MHz
< -36 dBm / 1 kHz RW @ 9 kHz ≤ f < 150 kHz < -36 dBm / 10 kHz RW @ 150 KHz ≤ f < 30 MHz < -36 dBm / 100 kHz RW @ 30 MHz ≤ f < 1 GHz < -30 dBm / 1 MHz RW @ 1 GHz ≤ f < 12.75 GHz < -60 dBm / 3.84 MHz RW @ 869 MHz ≤ f ≤ 894 MHz < -60 dBm / 3.84 MHz RW @ 1930 MHz ≤ f ≤ 1900 MHz < -60 dBm / 3.84 MHz RW @ 2110 MHz ≤ f ≤ 2155 MHz < -67 dBm / 100 kHz RW @ 925 MHz ≤ f ≤ 935 MHz < -79 dBm / 100 kHz RW @ 935 MHz < f ≤ 960 GHz < -71 dBm / 100 kHz RW @ 1805 MHz ≤ f ≤ 1880 MHz < -41 dBm / 300 kHz RW @ 1884.5 MHz < f < 1919.6 MHz
Transmit Intermodulation < -31 dBc @ 5 MHz & < -41 dBc @ 10 MHz
when Interference CW Signal Level = -40 dBc Error Vector Magnitude < 17.5 %, when Pout ≥ -20 dBmPeak Code Domain Error < -15 dB at Pout -20 dBm
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2. PERFORMANCE
GD880 Product SPEC
10
3) WCDMA receiver specification
Item SpecificationReceive Frequency Band1 : 2110 ~ 2170 MHz
Band8 : 925~960MHz Reference Sensitivity Level Band1 : BER < 0.001 when Îor = -106.7 dBm / 3.84 MHz
Band8 : BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz Maximum Input Level BER < 0.001 when Îor = -25 dBm / 3.84 MHz Adjacent Channel Selectivity (ACS)
ACS > 33 dB where BER < 0.001 when Îor = -92.7 dBm / 3.84 MHz & Ioac = –52 dBm / 3.84 MHz @ ±5 MHz
Blocking Characteristic BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz & Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset) = ±10 MHz or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset) = ±15 MHz
Spurious Response BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz & Iblocking = -44 dBm
Intermodulation BER < 0.001 when Îor= -103.7 dBm / 3.84 MHz & Iouw1 = -46 dBm @ Fuw1(offset) = ±10 MHz & Iouw2 = -46 dBm / 3.84 MHz @ Fuw2(offset) = ±20 MHz
Spurious Emissions < -57 dBm / 100 kHz BW @ 9 kHz ≤ f < 1 GHz< -47 dBm / 1 MHz BW @ 1 GHz ≤ f ≤ 12.75 GHz
Inner Loop Power Control In Uplink
Adjust output(TPC command)cmd 1dB 2dB 3dB +1 +0.5/1.5 +1/3 +1.5/4
0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5 -1 -0.5/-1.5 -1/-3 -1.5/-4 group(10equal command group) +1 +8/+12 +16/+24
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2. PERFORMANCE
GD880 Product SPEC
11
4) HSDPA transmitter specification
Item Specification
Transmit Frequency Band1 : 1920 MHz ~ 1980 MHzBand8 : 880MHz~915 MHz
Maximum Output Power Sub-Test1=1/15, 2=12/15 21~25dBm / 3.84 MHz 3=13/15 4=15/8 20~25dBm / 3.84 MHz 5=15/7 6=15/0 19~25dBm / 3.84 MHz
HS-DPCCH
Sub-test in table C.10.1.4
Power step
Power step slot boundary
Power step size,
P [dB]
Transmitter power step tolerance [dB]
5
1 Start of Ack/Nack
6 +/- 2.3
2 Start of CQI 1 +/- 0.6 3 Middle of CQI 0 +/- 0.6 4 End of CQI 5 +/- 2.3
Spectrum Emission Mask
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
Frequency offset from carrier △f
Minimum requirement Measurement Bandwidth
2.5 ~ 3.5 MHz -35-15×(△f-2.5)dBc 30 kHz 3.5 ~ 7.5 MHz -35-1×(△f-3.5)dBc 1 MHz 7.5 ~ 8.5 MHz -35-10×(△f-7.5)dBc 1 MHz
8.5 ~ 12.5 MHz -49dBc 1 MHz
Adjacent Channel Leakage Power Ratio (ACLR)
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
> 33 dB @ ±5 MHz > 43 dB @ ±10 MHz
Error Vector Magnitude < 17.5 %, when Pout ≥ -20 dBm
5) HSDPA receiver specification
Item SpecificationReceive Frequency
Band1 : 2110 ~ 2170 MHzBand8 : 925 ~ 960Hz
Maximum Input Level(BLER or R), 16QAM Only
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
BLER < 10% or R >= 700kbps
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2. PERFORMANCE
GD880 Product SPEC
12
6) WLAN 802.11b transceiver specification
Item Specification
Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )
Tx Power Level ≤ 20dBm under (Europe), ≤ 30dBm under (USA)
Frequency Tolerance within ±25 PPMChip clock FrequencyTolerance
within ±25 PPM
Spectrum Mask ≤ -30 @ fc-22MHz< f <fc-11MHz and fc+11MHz< f <fc+22MHz ≤ -50 @ f < fc-22MHz and f > fc+22MHz
Power ramp on/off time ≤ 2us
Carrier Suppression ≤ -15dBModulation Accuracy(Peak EVM)
≤ 35%
Spurious Emissions < -36 dBm @ 30MHz ~ 1GHz < -30 dBm above @ 1GHz ~ 12.75GHz < -47 dBm @ 1.8GHz ~ 1.9GHz < -47 dBm @ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity ≤ -76dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER ≤ 8%
Rx Max input Sensitivity ≥ -10dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER ≤ 8% Rx Adjacent ChannelRejection
≥ 35dB @FER ≤ 8%,interference input signal -70dBm@fc±25MHz(11Mbps)
GD880 Product SPEC
11
4) HSDPA transmitter specification
Item Specification
Transmit Frequency Band1 : 1920 MHz ~ 1980 MHzBand8 : 880MHz~915 MHz
Maximum Output Power Sub-Test1=1/15, 2=12/15 21~25dBm / 3.84 MHz 3=13/15 4=15/8 20~25dBm / 3.84 MHz 5=15/7 6=15/0 19~25dBm / 3.84 MHz
HS-DPCCH
Sub-test in table C.10.1.4
Power step
Power step slot boundary
Power step size,
P [dB]
Transmitter power step tolerance [dB]
5
1 Start of Ack/Nack
6 +/- 2.3
2 Start of CQI 1 +/- 0.6 3 Middle of CQI 0 +/- 0.6 4 End of CQI 5 +/- 2.3
Spectrum Emission Mask
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
Frequency offset from carrier △f
Minimum requirement Measurement Bandwidth
2.5 ~ 3.5 MHz -35-15×(△f-2.5)dBc 30 kHz 3.5 ~ 7.5 MHz -35-1×(△f-3.5)dBc 1 MHz 7.5 ~ 8.5 MHz -35-10×(△f-7.5)dBc 1 MHz
8.5 ~ 12.5 MHz -49dBc 1 MHz
Adjacent Channel Leakage Power Ratio (ACLR)
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
> 33 dB @ ±5 MHz > 43 dB @ ±10 MHz
Error Vector Magnitude < 17.5 %, when Pout ≥ -20 dBm
5) HSDPA receiver specification
Item SpecificationReceive Frequency
Band1 : 2110 ~ 2170 MHzBand8 : 925 ~ 960Hz
Maximum Input Level(BLER or R), 16QAM Only
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
BLER < 10% or R >= 700kbps
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2. PERFORMANCE
GD880 Product SPEC
13
7) WLAN 802.11g transceiver specification
Item Specification
Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )
Tx Power Level ≤ 20dBm under (Europe), ≤ 30dBm under (USA)
Frequency Tolerance within ±25 PPMChip clock FrequencyTolerance
within ±25 PPM
Spectrum Mask ≤ -20 @ ±11MHz offset (9Mhz ~ 11MHz)≤ -28 @ ±20MHz offset (11MHz ~ 20Mhz) ≤ -40 @ ±30MHz offset (20MHz ~ 30Mhz)
Transmitter constellation error (rms EVM)
≤ -5dB
Spurious Emissions < -36 dBm @ 30MHz ~ 1GHz< -30 dBm above @ 1GHz ~ 12.75GHz < -47 dBm @ 1.8GHz ~ 1.9GHz < -47 dBm @ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity PER ≤ 10%-82dBm@6Mbps, -81dBm@9Mbps, -79dBm@12Mbps -77dBm@18Mbps, -74dBm@24Mbps, -70dBm@36Mbps -66dBm@48Mbps, -65dBm@54Mbps
Rx Max input Sensitivity ≥ -20dBm(6,9,12,18,24,36,48,54Mbps) @ PER ≤ 10% Rx Adjacent ChannelRejection
PER ≤ 10%,
ACR ≥ 16dB@6Mbps, ACR ≥ 15dB@9Mbps, ACR ≥ 13dB@12Mbps, ACR ≥ 11dB@18Mbps, ACR ≥ 8dB@24Mbps, ACR ≥ 4dB@36Mbps ACR ≥ 0dB@48Mbps, ACR ≥ -1dB@54Mbps
※ACR shall be measured by setting the desired signal's strength 3 dB above the rate-dependent sensitivity specified in min input sensitivity
8) GPS receiver specification
Item Specification Receive Frequency 1574.42 MHz ~ 1576.42 MHzMinimum Sensitivity 1 satellite ≥-142dBm, 7 satellites ≥ -147dBm at coarse time aiding
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2. PERFORMANCE
GD880 Product SPEC
14
2.7 GD880 Figures
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3. TECHNICAL BRIEF
3. Technical Brief
3. Technical Description
3.1 Digital Baseband(DBB/MSM7227)
3.1.1 General Description
A. Features(MSM7227)
WCDMA Rel ‘99 plus HSDPA and HSUPAGSM/GPRS/EDGEHigh-performance ARM1136JF-S™ application processor at up to 600 MHz; QDSP5000™ at 320 MHzHigh-performance ARM926EJ-S™ modem processor at up to 400 MHz; QDSP4000™ at 122.88 MHzJava® hardware acceleration for faster Java-based games and other appletsSupport for Bluetooth® 2.1 EDR via an external Bluetooth System-on-Chip (SoC)High-speed, serial mobile display digital interface (MDDI) that optimizes the interconnectioncost between the MSM device and the LCD panelReceive diversity support for WCDMA mode, thereby providing improved capacity and data throughputUSB 2.0 compliant high-speed USB core with limited OTG capabilitiesIntegrated high-speed USB PHYIntegrated wideband stereo codec for digital audio applicationsDirect interface to digital camera module with video front-end (VFE) image processingGPS position location capabilitiesVocoder support (GSM-HR, FR, EFR, AMR, and AMR-WB/+)Advanced 12 × 12 ×1.05 mm, 0.4 mm pitch, 560 NSPHigh-performance ARM1136JF-S 600 MHz application processorIndustry standard ARM926EJ-S 400 MHz embedded microprocessor subsystemQDSP5000 320 MHz application digital signal processing (ADSP)QDSP4000 122.88 MHz modem digital signal processing (MDSP)256 kB internal memory (IMEM) for graphics, internal functions, DSP, etc.Dual-memory buses separating the high-speed memory subsystem (EBI1) from low-speedperipherals (EBI2) such as LCD panelsEnhanced EBI1 memory support: 200 MHz bus clock for DDR SDRAMEBI2 supportAll modes and data rates for WCDMA frequency division duplex (FDD), with the following restrictionsFull SF range support from 4 to 256SMS (CS and PS)PS data rate – 384 kb/s DL/384 kb/s ULCS data rate – 64 kb/s DL/64 kb/s ULAMR (all rates)
3. TECHNICAL BRIEF
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3. TECHNICAL BRIEF
3.2 Hardware Architecture
3. Technical Brief
Figure. Simplified Block Diagram of System
MINI Block Diagram
5Mega AFParallel Interface [0:9]
LBEH19UNBC
PCM I2CGSM FEMUART1/
DM
WCDMAGSM
VGA Camera
5Mega AFCamera
Camera I/F[0:9]
I2C
I2CGPS
GPS BT Wi-Fi
SDIO1
FMFM Audio R/L
Parallel Interface [2:9]
I2C
MSM7227
CAM I/F
MCP
RX
SBI
GSM8509001800
RX ADC
SSBI
EBI2 DATA
GSM FEMRTR6285
DM Camera I/F[0:9]
NANDFlash
3.2” FWVGA LCDMDDIGPS GPS ADC
RGBInterface
RGB 24bit
EDGEPAM
I2C
EBI2 ADDR
TXWCDMA9002100
1900
TX DACEBI1 DATAEBI1 ADDR
Duplexer
WCDMA PAM
DDRSDRAM2Gbit
Flash4Gbit
Charge Pump BD6084
8CH
LCD_PWM
SDIO2
Ambient LightSensor
RF Block8CH
(ALC)SDIO2
Speaker
Line O P/NHPH_R/L
EAR1OP/N Receiver Micro SD UART3/
UIM2
UART2/DM I2C
TouchSensor
ProximitySensor
Speaker AMP
E h R/L
TCXO_RTR_19.2MHz
3.5EarphonePM_SSBI USB I/F
MIC1P
UART2/UIM
I2C
Sensor
3-AxisSensor
Li
PWM
Headset AMPMIC2PEarphone R/L
Audio SubsystemLine L/R_IP FM Audio R/L
Earphone R/L
TRK_LO_ADJGPSD F/F
X-Tal(19.2MHz)
PM7540
SSBI
cro
US
Bne
ctor
USB 2.0 HS
USB
VBUS
OVP
LinearMotor
VCHG_VBUSTCXO_PM_19.2MHz
USIM
USIM Translator
UART1/DM : BT URRT2/DM : UART2(DP)UART2/UIM : USIMUART3/UIM2 : N.A
5pin
Mi
Con
n
MUICUART
D+ / D-
UART3/UIM2
3.2 Hardware Architecture
3. Technical Brief
Figure. Simplified Block Diagram of System
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3. TECHNICAL BRIEF
3. Technical Brief
Figure. Simplified Block Diagram of System
<POWER Block1>POWER Block
MSM7227PM7540
Charging IC(NUS5530MN)
VCHG_VBUSTA (5PIN)
5.1V,700mA
+VPWR
VREG_MSMC1_1.35V (500m A)
VREG_MSME_1.8V (500m A)
VREG_MSMA_2.6V (300m A)
VDD
PM7540
VSW_MSME
VREG_MSMA
VSW_MSMC1
VSW_MSMC2 VREG_MSMC2_1.25V (500m A)
VDD_VCORE1 ( 1.2V , 203mA )
VDD_VCORE1 ( 1.2V , 203mA )
VDD_P1/P2/P8 /MDDI ( 1.8V ,MAX 10mA )
VDD_A / PLL ( 2,6V , MAX 65mA )CHG_CTL_NBATT FET N
Battery900mAh
VBATT
VREG_MSMP_2.6V (300m A) VREG_MSMP
VREG_GP5VREG_AUX2_2.9V (150m A)
VDD_P3/P4 (2.6V , MAX 25mA )
VDD_QFUSE (2.9V , MAX 10mA )
VDD_USBPHYE (3.3V , MAX 10mA )USBLDO(3.3V)
BATT_FET_N
+VPWR
MCPSDRAM ( 1.8V , MAX 180mA )
NAND ( 1.8V , MAX 30mA )
RTR6285
GSM PAM
WCDMA PAM
VDDA ( 2.7V , MAX 93mA )
VDDM ( 2.6V , MAX 10mA )
VDDA ( 2.1V , MAX 70mA )
VREG_RF_2.7V (150mA)
VREG_SMPS_2.1V (300mA)
VREG_RFRX1
VSW_PA
VREG_GP2GPS LNA
VREG_LCD_2.8V (150mA)LCD moduleVIO (1.8V )
WCDMA PAM
VREG_SYNT
VREG_MSME2
VREG_GP1
Motion Sensor ( 2.7V, MAX ?mA)
VREG_GP6 VREG_SENSOR_2.6V (300mA) Proximity sensor( 2.7V, 20mA)
VREG_SYNTH_2.75VVREG_LCD_1.8V (150mA)
VREG_RGBC_1.5V (150mA)
FEMWVGA LCD Controller
CORE,DRAM,PLL,MD15 (1.5V )
MD18 PIO HIO (1 8V )
VDD (2.8V )
VREG_RFTX
VREG_GP3
VREG_MMC_3.0V (150mA)VREG_MMC MICRO SD slot (3.0V , , MAX mA )
VREG_TCXO_2.85V (50mA)VREG_TCXO TCXO (2.85V , , MAX 20mA )
GPS D FLIP-FLOP
VREG_RGBC_2.6V (150mA)MD18,PIO,HIO (1.8V )
DRAM,OSC (2.6V )
VREG_RFRX2
USIM SLOT (3.0V , , 1mA )VREG_RUIM_3.0V (150mA)VREG_RUIM1
VREG_MOTOR_3.0V (300mA) Linear Motor Driver ( 3.0V, mA ) VREG_WLAN
VREG_GP4
BACKUP BatteryVBACK_UP VCOIN
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3. TECHNICAL BRIEF 3. Technical Brief
Figure. Simplified Block Diagram of System
<Power Block2>
BD6084GUL
POWER Block
VREG_MSMP_2.6V
BD6084GUL
CAM_VDD_2.8V
CAM_VDD_1.8V
LDO2 (150mA)
LDO1 (150mA)
LDO3 (150mA)
5M CAMERA VIO
CAM_AF_2.8V
+V_PWR
LDO4 (150mA)
VBATVGA CAMERA
Touch ICTOUCH_VDD_3.3V
MLED ( 7ea )MLEDOUT ( 450mA )LCD_BACKLIGHT_4.8V
WIFI/BT/FM MODULEVBAT
VDDIO/VDDIO_SDVREG_MSMP_2.6V
LDO(2.8V) 26MHz TCXO for WIFI/BT/FM
MUIC
Audio Sub System
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3.3 Subsystem(MSM7227)
3.3.1 Architecture and baseband processing features
High-performance ARM1136JF-S 600 MHz application processor:- ARM® architecture v6- 32 kB instruction and 32 kB data cache- 256 kB ARM11™ L2 cache- 4 kB level-one tightly-coupled memory (TCM)- 8-stage pipeline, branch prediction with return stack- Supports the ARM and Thumb instruction sets, and Jazelle™ technology to enable direct- execution of Java byte-codes- Low-interrupt latencyIndustry standard ARM926EJ-S 400 MHz embedded microprocessor subsystem
- 16 kB instruction and 16 kB data cache- ARM version 5TEJ instructions- Higher-performance five-stage pipeline, Harvard cached architecture- Higher internal CPU clock rate with on-chip cache- Internal watchdog and sleep timers
QDSP5000 320 MHz application digital signal processing (ADSP)- 512 kB L2 cache
QDSP4000 122.88 MHz modem digital signal processing (MDSP)
3.3.2 Memory support features
256 kB internal memory (IMEM) for graphics, internal functions, DSP, etc.Dual-memory buses separating the high-speed memory subsystem (EBI1) from low-speed peripherals (EBI2) such as LCD panelsEnhanced EBI1 memory support: 200 MHz bus clock for DDR SDRAMEBI2 support:
- 1.8 or 2.6 V memory interface support- NAND/OneNAND™ flash memory interface- Boot from NAND/OneNAND- LCD and Universal Broadcast Modem™ (UBM™) support
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3. TECHNICAL BRIEF
3.3.3 Air interface features
3.3.3.1 WCDMA R99The MSM7227 device supports release 99, June 2004 of the WCDMA FDD standard, including the following features.All modes and data rates for WCDMA frequency division duplex (FDD), with the following restrictions:
- The downlink supports the following specifications.: Up to four physical channels, including the broadcast channel (BCH), if present: Up to three dedicated physical channels (DPCHs): Spreading factor (SF) range support from 4 to 256: Support for the following transmit diversity modes:
=> Space-time transmit diversity (STTD)=> Time-switched transmit diversity (TSTD)=> Closed-loop feedback transmit diversity (CLTD)
- The uplink supports the following specifications.: The uplink provides the following UE support.
=> One physical channel, eight TrCH, and 16 TrBks starting at any frame boundary=> A maximum data rate of 384 kb/s
Full SF range support from 4 to 256SMS (CS and PS)PS data rate – 384 kb/s DL/384 kb/s ULCS data rate – 64 kb/s DL/64 kb/s ULAMR (all rates)
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3.3.3.2 HSDPAThe MSM7227 device supports the release 5, December 2004 standard for HSDPA, including thefollowing features.The HSDPA enables PS data speeds up to 7.2 Mb/s on the downlink.HS-DSCH (HS-SCCH, HS-PDSCH, and HS-DPCCH) and the R99 transport channels, as defined in the 3GPP specificationsA maximum of four simultaneous HS-SCCH channels, as defined in the 3GPP specificationsA maximum of 10 HS-PDSCH channels, both QPSK and 16 QAM modulation and UE category 6 in software release 2.0, and category 8 in software release 3.0CQI and ACK/NACK on the HS-DPCCH channel, as defined in the 3GPP specificationsAll incremental redundancy versions for HARQ, as defined in the 3GPP specificationsCan switch between HS-PDSCH and DPCH channel resources as directed by the networkCan be configured to support any of the two power classes 3 or 4, as defined in the 3GPP R5 specifications (25.101)Network activation of compressed mode by SF/2 or HLS on the DPCH for conducting inter-frequency or inter-RAT measurements when the HS-DSCH is activeSTTD on both associated DPCH and HS-DSCH simultaneouslyCLTD mode 1 on the DPCH when the HS-PDSCH is activeSTTD on HS-SCCH when either STTD or CLTD mode 1 is configured on the associated DPCHTFC selection limitation on the UL factoring in transmissions on the HS-DPCCH, as required in TS 25.133
3.3.3.3 HSUPAThe MSM7227 device supports the release 6, March 2006 standard for HSUPA, including the following features.E-DCH data rates of up to 5.76 Mb/s for 2 ms TTI (UE category 6) uplinkN E-AGCH, E-RGCH and E-HICH channels for downlink, as defined in the 3GPP specifications. E-RGCH and E-HICH supports serving and non-serving radio links, with up to four radio links in the E-DCH active set.STTD on all HSUPA downlink channelsCLTD mode 1 on HS-PDSCH and DPCH along with HSUPA channelsAll incremental redundancy versions for HARQ and maximum number of HARQ retransmissions, as defined in 3GPP specificationsE-DCH channel on the uplink, as defined in the 3GPP specifications, with support for up to four E-DPDCH channelsHSUPA channels simultaneously with R99 and HSDPA channels, as defined in the 3GPP specificationsSwitch between HSUPA channels and DPCH channel resources as directed by the networkHandover using compressed mode with simultaneous E-DCH and HS-DSCH interactive/background and streaming QoS classes
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3. TECHNICAL BRIEF
3.3.3.4 GSM R99The following GSM modes and data rates are supported by the MSM7227 hardware. Support modes conform to release ‘99 specification of subfeatures.Voice features
- FR, EFR, AMR, HR, A5/1 and A5/2 cipheringCircuit-switched data features
- 9.6 k, 14.4 k, Fax- Transparent and non-transparent modes for CS data and fax- No subrates are supported.
3.3.3.5 GPRSPacket-switched data (GPRS)DTM (simple class A) operationMultislot class 12 data servicesCS schemes — CS1, CS2, CS3, and CS4GEA1, GEA2, and GEA3 cipheringMaximum of four Rx timeslots per frame
3.3.3.6 EDGEEDGE E2 power class for 8 PSKDTM (simple class A), multislot class 12Downlink coding schemes — CS 1-4, MCS 1-9Uplink coding schemes — CS 1-4, MCS 1-9BEP reportingSRB loopback and test mode B8-bit and 11-bit RACHPBCCH supportOne-phase/two-phase access proceduresLink adaptation and IRNACC, extended UL TBF
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3.3.3.7 GPS position locationNext-generation gpsOne® solution with an enhanced GPS engineEnhanced filtering software optimizes GPS accuracy and availability.Full integration with Windows Mobile®, Java, and BREW®-based development environmentsMS-assisted, MS-based, MS-assisted/hybrid, and standalone GPS modesgpsOneXTRA Assistance™ for enhanced standalone GPS performanceSupport for UMTS control plane, GSM control plane, and OMA SUPL 1.0 user plane assisted-GPS protocols
3.3.4 Supported multimedia features
3.3.4.1 General multimediaAdditional general-purpose MIPS
- QDSP5000 aDSP at 320 MHz- Dedicated hardware accelerators and compression engines
Improved Java, BREW, and game performance
3.3.4.2 Camera interfaceHigh-quality digital camera processing, supporting CCD or CMOS image sensors up to 8-megapixelsUp to 12-bit data width with timing synchronization via discrete or embedded signalsYUV (4:2:2) or Bayer data typesA multitude of image signal processing capabilities
- Black level correction, bad pixel correction, and color correction- Radial-based LROC, zoom, FOV crop, and frame drop- Statistical techniques such as pre-zoom statistic gathering, AE/AWB, and histogram- Gain adjustments including 4-channel and white balance- Chroma subsampling, high-quality downscaler, and Bayer noise filter
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3.3.4.3 VideoDedicated support for market-leading codecs such as MPEG-4, H.263, H.264, and Windows Media®
- Integrated stereo wideband codec for music/digital clips- CMX® – 128 polyphonic MIDI wavetable synthesizer- Audio codecs: MP3, AMR-WB/+, AAC, AAC+™, EAAC+, and Windows Media
3.3.4.4 Graphics support3D graphics core - Up to WVGA (800 × 480) display support256 kB internal memory3D support: OpenGL ES 1.1, 2.0, JSR 297, D3DM2D support: OpenVG, SVG, JSR226, GDI, DdrawPerformance:
- 27 megapixel triangles/s (peak 3D triangle rate)- 166 megapixel/s peak 3D pixel draw rate
- 1660 megapixel/s effective 3D pixel rate- 532 megapixel/s peak 3D pixel reject rate- 207 megapixel four-component-vector instructions/s- 166 megapixel/s 2D/OVG pixel draw rate
3.3.4.5 Audio processingIntegrated wideband stereo codec
- 16-bit DAC with typical 88 dB dynamic range- Sampling rates up to 48 kHz on the speaker path and 48 kHz on the microphone path- Supports summing of an external device’s stereo single-ended analog signal- Supports summing of an I2S digital audio signal- Supports headset switch press detection
Enhanced acoustic echo cancellation for full-duplex callsPureVoice Audio AGC™Internal vocoder supporting 13 kb/s PureVoice®
3.3.4.6 LCD controllerParallel LCD supportRGB888 interface
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3.3.5 Supported connectivity features
High-speed USB port with integrated PHYFour universal asynchronous receiver transmitter (UART) serial ports
- Two high-speed (DM via UART, 4 Mb/s)- Emergency software download on UART2
Two UIM ports (shared with UART2 and UART3)- 1.8 V and 3.0 V support; IS-820-C compliant
Four SDIO ports (SD 2.0)- SD card, mini SD card, micro SD card, and MMC up to 52 MHz- Boot from SD
Display support- High-speed serial MDDI port that optimizes the interconnection cost between the MSM
device and LCD panel- MDDI V1.0 interface that supports up to 384 Mb/s link rate- Dual displays
: Primary => LCD controller (LCDC) or MDDI; FWVGA resolution; 16-bit, 18-bit, and 24-bit true color depth; on-screen buffer support
: Secondary => EBI2 interface; up to WQVGA resolution; 16-bit, 18-bit, and 24-bit true color depth
- Mobile display processor: MDP v.3Touchscreen supportAUX_PCM for Bluetooth, SDAC, and SADC supportInter-integrated circuit (I2C) interface for peripheral devicesBluetooth 2.1 + EDR (external BTS4025™ IC)Transport stream interface (TSIF) and the ability to support broadcast technologies, including the Qualcomm MediaFLO™ technology, DVB-H, ISDB-T, T-DMB, and S-DMB
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3. TECHNICAL BRIEF
3.3.6 Configurable GPIO features
133 general-purpose I/O pinsInput configurations: pull-up, pull-down, keeper, or no-pullOutput configurations: programmable drive currentTwo groupings: non-ETM (group 1) and ETM (group 2)
- Group 2 GPIO functions are emulated by off-chip field-programmable gate arrays (FPGAs) in ETM mode, without software knowledge.
Top-level mode multiplexer (TLMM) provides a convenient way to program groups of GPIOs.
3.3.7 Features of internal functions
SecureMSM™ platform secures OMA DRM v2.0 services and e-commerce transactions.- Robust protection of subsidy locks and phone identifiers such as the IMEI, ESN, and SIMLock- Enables compliance with CMLA and OMTP TR0 specifications
SecureMSM platform features include:- Secure boot – protects against reflashing attacks
: Ensure device starts with known and trusted software: Data integrity and authenticity of code is verified every time phone starts
- Secure execution environment: Maintains integrity of device at run time: Memory separation keeps secret application data secret and protects applications from attacks.
- Secure file system (SFS): Provides confidentiality for secret data through AES encryption and a 128-bit fused hardware key: Operations using hardware key are run in on-chip RAM, making observation extremely difficult: Provides integrity protection for non-secret (public) key and certificates
PLLs and clock generation and distribution- Multiple internal clock regimes- General-purpose clock, M/N counter, and PDM outputs- Internal watchdog and sleep timers
Modes and resetsPower optimizationJTAG/ETM
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3.3.8 RF and PM interface features
Tx output chain controls- Multiple UMTS PA on/off and range controls- GSM PA power control- 14-bit generic RF controller (GRFC) interface
RTR6285 status and control- Tx enable and gain control
Rx/Tx analog baseband interfaces- Dual Rx analog baseband interfaces support UMTS diversity Rx plus S-GPS.- Tx analog baseband supports all phone transmission modes.
PM7540 status and control- SSBI- Interrupt port and other dedicated clock and control signals
TCXO enable and VCTCXO frequency control via PDM waveformThree housekeeping ADC inputs for monitoring analog sensors
- Selectable reference- 12-bit resolution, 10-bit accuracy, sampled at TCXO/8 (2.4 MHz)
3.3.9 Package features
560-pin nano-scale package (560 NSP)12 × 12 × 1.05 mm outline0.4 mm pitchMany ground pins for improved electrical grounding, mechanical strength, and thermal continuity
3. Technical Brief
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3.4 Power Block
3.4.1 General
MSM7227, included RF, is fully covered by PM7540(Qualcomm PMIC). PM7540 cover thepower of MSM7227, MSM memory, RF block, Bluetooth, USIM and TCXO.Major power components are :
PM7540(U400) : Phone main pmic BD6083GUL(Sub-pcb, U101) : LCD Backlight charge pump, Cam LDO, Touch LDONUS5530(U403) : main power path switch( battery charging circuit) MAX14528(U404) : OVP( Over voltage protection) IC
3.4.2 PM7540
The PM7540 device (Figure) integrates all wireless handset power management. The power management portion accepts power from all the most common sources – battery, external charger, adapter, coin cell back-up – and generates all the regulated voltages needed to power the appropriate handset electronics. It monitors and controls the power sources, detecting which sources are applied, verifying that they are within acceptable operational limits, and coordinates battery and coin cell recharging while maintaining The handset electronics supply voltages. Eight programmable output voltages are generated usinglow dropout voltage regulators, all derived from a common trimmed voltage reference.A dedicated controller manages the TCXO warm-up and signal buffering, and key parameters (under-voltage lockout and crystal oscillator signal presence) are monitored to protect against detrimental conditions.MSM device controls and statuses the PM7540 IC using Single Serial Bus Interface (SSBI) supplemented by an Interrupt Manager for time-critical information. Another dedicated IC Interface circuit monitors multiple trigger events and controls the power-on sequence.
3. Technical Brief
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3. TECHNICAL BRIEF
Figure. PM7540 Functional Block Diagram
3. Technical Brief
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3.4.3 Charging control
A programmable charging block in PM7540 is used for battery charging. It is possible to set limits for the charging current. The external supply typically connects directly to pin (VCHG). The voltage on this pin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied or not. For additional accuracy or to capture variations over time, this voltage is routed internally to the housekeeping ADC via the analog multiplexer. PM7540 circuits monitor voltages at VCHARGER and ICHARGE pins to determine which supply should be used and when to switch between the two supplies. These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively.
3. Technical Brief
U8210 Charging Control block
PM7540Input PowerManagement
NUS5530
PM7540 only include charging controller.
So it is necessary external charging path TR.
This is NUS5530.
This part also include battery side power path.NUS5530
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3. TECHNICAL BRIEF
Trickle Charging
Trickle Charging of the main battery, enabled through SBI control and powered from VDD, is provided by the PM7540 IC, The trickle charger is on-chip programmable current source that supplies current from VDD to pin (VBAT). Trickle charging can be used for lithium-ion and nickel-based batteries, with its performance specified below (3.2V). The charging current is set to 80mA.
Parameter Min Typ Max Unit
Trickle Current 60 80 100 mA
3. Technical Brief
PM7540Input PowerManagement
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Constant Current Charging
The PM7540 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V.
Constant Voltage Charging
Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V.The end of constant voltage charging is commonly detected 10% of the full charging current.
• Charging Method : CC & CV (Constant Current & Constant Voltage)
• Maximum Charging Voltage : 4.2V
• Maximum Charging Current : 660mA
• Nominal Battery Capacity : 900mAh
• Charging time : Max. 3h 30m
• Full charge indication current (icon stop current) : 50mA
• Cut-off voltage : 3.30V
3. Technical Brief
Indication Standby
Bar3 3.75 0.05V
Bar 3 → 2 3.75 0.05V
Bar 2 → 1 3.67 0.05V
Bar 1 → Blink 3.6 0.05V
Low Voltage,Warning message+ Blinking
3.6 0.05V (Stand-by) / 3.6 0.05V (Talk)
[Interval : 3min(Stand-by) / 1min(Talk)]
Power Off 3.3 0.05V
Battery icon display
≥
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3. TECHNICAL BRIEF
3.5 External memory interface
A. MSM7227
The MSM7227 device was designed to provide two distinct memory interfaces. EBI1 was targeted for supporting DDR synchronous memory devices. EBI2 was targeted towards supporting slower asynchronous devices such as LCD, NAND flash, SRAM, NOR flash etc. To support the high-bandwidth, high-density, and low-latency requirements of the advanced on-chip applications, the MSM7227 IChas two high-speed, high-performance memory slave interfaces: the external bus interface 1 (EBI1)and the stack memory interface (SMI). To achieve higher bandwidth and better use of the memorydevice interface, the SMI accepts multiple commands for the external memory device. The SMIinterface acts as a slave device to all of the bus masters within the MSM device. The masters arbitrateto gain access to the SMI, and upon obtaining the access, they issue commands to the SMI. The busmasters are connected to the SMI through an advanced extensible interface (AXI) bus bridge (orglobal interconnect block) and communicate over a 64-bit, non-blocking AXI bus protocol. The AXIbus bridge provides the arbitration logic for all of the bus masters.
EBI1 Features- Support for only low-power memories at 1.8-V I/O power supply voltage- AXI bus frequencies up to 133 MHz- A 16-bit/32-bit static and dynamic memory interfaceDDR SDRAM interface features include:
- Supports both 32-bit DDR SDRAM devices, up to 133-MHz bus speed- Supports auto precharge and manual precharge- Supports partial refresh- Separate CKE pin per chip-select to support partial operation mode- Idle power down to save idling power consumption
EBI2 Features- Support for asynchronous FLASH and SRAM(16bit & 8bit). - Interface support for byte addressable 16bit devices(UB_N & LB_N signals).- 2Mbytes of memory per chip select.- Support for 8 bit/16bit wide NAND flash. - Support for parallel LCD interfaces, port mapped of memory mapped(8 or 16 bit)
Multi Chip Package : DDR SDRAM and NAND Flash merged 1 package 2Gbit Mobile DDR SDRAM(64Mb x32) / 4Gbit NAND Flash
3. Technical Brief
Table#1. External memory interface for GD880
1.8V
1.8V45ns / 400MHzHynix
NAND
Interface Spec
Product GrPart Name MakerOperation Voltage(Flash / DRAM)
Speed (Flash / DRAM)
H8BCS0UN0MCR-4EM SDRAM
4G (LB/256Mx16) NAND+4G (DDR400/16Mx4x�2*2_2CS_2CKE) SDRAM
H8B ES0UU0MCR-4EM
- 40 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
3. TECHNICAL BRIEF
3. Technical Brief
Figure. Simplified Block Diagram of Memory Interface
MSM7227
DDR
SDRAM
2Gbit
NAND
4Gbit
SDRAM_D[31:0]
SDRAM_ADDR[13:0]
nSDRAM_WEnSDRAM_CS
SDRAM_DCLK[1:0]SDRAM_CKEnSDRAM_RASnSDRAM_CAS
nNAND_FLASH_CS
nOE2
nWE2
nUB2
nLB2
nRESETOUT1
NAND_FLASH_READY
EBI2_DATA[15:0]
EBI1 EBI2
External Memory
(MICRO SD card)
MMC_DATA[3:0]
MMC_CMDMMC_CLK
SDRAM_DQM[3:0]
SDRAM_DQS[3:0]
4
MICROSD_DATA[�:0]
MICROSD_CM
MICROSD_CLK
- 41 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
3.6 H/W Sub System
3.6.1 RF Interface
A. RTR6285 (WCDMA_Tx, GSM_Tx/Rx)
MSM7227 controls RF part(RTR6285) using these signals.SSBDT : SSBI I/F signals for control Sub-chipsetTX_ON : Power AMP on RF partRX0_I/Q_M/P,TX_I/Q_M/P : I/Q for T/Rx of RFTX_AGC_ADJ : control the gain of the Tx signal prior to the power amplifierDAC_REF : Reference input to the MSM Tx data DACs
B. the othersTRK_LO_ADJ: TCXO(19.2M) ControlPA_ON0/PA_RANGE0 : WCDMA(1900) TX Power Amp EnableANT_SEL[0-2]: Ant Switch Module Mode Selection(WCDMA,GSM Tx/Rx,DCS-PCS Tx/Rx)GSM_PA_BAND: GSM/DCS-PCS Band Selection of Power Amp GSM_PA_RAMP: Power Amp Gain Control of APC_IC GSM_PA_EN: Power Amp Gain Control Enable of APC_IC
C. ALM2412 (A-GPS LNA)* GPS_LNA_EN: GPS LNA Enable Signal (GPS LNA Shutdown)
3. Technical Brief
PA_ON0/PA_RANGE0/GPIB22 : WCDMA(2100, 900) TX Power Amp EnableANT_SEL[0-�], GPIO 72 ~75: Ant Switch Module Mode Selection(WCDMA,GSM Tx/Rx,DCS-PCS Tx/Rx)
- 42 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
3. TECHNICAL BRIEF
3. Common* REG_ON: If low the internal regulators will be disabled.* SLEEP_CLK: LPO clock (32.768kHz) input. Used for low-power mode timing.* CLK_IN: Crystal amplifier input or frequency reference input.* CLK_REQ: Crystal Circuit / Reference Clock Enable (active-high)
3. Technical Brief
D. LBEH19UNBC (BT / WiFi module )
1. WiFi* WLAN_CMD: WLAN SDIO Command Line.* WLAN_CLK: WLAN SDIO Clock Input.* WLAN_SDIO[3:0]: WLAN SDIO Data Line.* WLAN_RESET_N: Low asserting reset for WLAN core.* WLAN_HOST_WAKEUP: WL_HOST_WAKE signal output.
2. BT* BT_UART_RXD: Bluetooth UART Serial Input. * BT_UART_RTS: Bluetooth UART Request to Send. Active-low request.* BT_UART_CTS: Bluetooth UART Clear to Send. Active-low clear.* BT_UART_TXD: Bluetooth UART Serial Output.* BT_PCM_CLK: BT PCM clock, can be PCM-master (output) or PCM-slave (input).* BT_PCM_DIN: BT PCM data input.* BT_PCM_SYNC: BT PCM sync signal, can be PCM-master (output) or PCM-slave (input).* BT_PCM_DOUT : BT PCM data output.* BT_WAKEUP: BT Wakeup Input.* BT_HOST_WAKEUP: BT Host Wakeup Output* BT_RESET_N: Low asserting reset for BT core.
- 4� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
3. Technical Brief
E. FM Radio interfaceFM_ANT : FM RF input.SLEEP CLK : External reference oscillator input. (32.768KHz)FM_AUDIO_R : Right audio line output – digital input data.FM_AUDIO_L : Left audio line output – digital frame synchronization.
Figure. Block Diagram of WiFi Interface
Figure. Block Diagram of BT Interface
- 44 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
3. TECHNICAL BRIEF
ANT_SEL[0:3]Main Antenna GPIO72~75
GSM PAMASM
GSM_PA_RAMPGSM_PA_EN
GSM_PA_BAND
RTR_TX_ONDCS PCS TX
DCS_PCS_OUT
GSM_OUT
PA_PWR_CTL
GPIO80
GPIO79
TX ONRF ON
DCS_PCS_OUT
GSM_OUT
VAPC
TX_EN
BS
ANT PCN_PCS_OUT
GSM_OUT
RF
ASM RTR_DAC_REF
4
DCS_PCS_TX
GSM_TX
4 GSM Band Rx
4
RTR_TX_I/Q
_
DAC_REF
I/Q_RTR_P/M
_
DAC_IREF
TX_I/Q P/N
LB_RF_OUT1
HB_RF_OUT1DCS_PCS_IN
GSM_INWCDMA_2100
MSM7227
transceiver
WCDMA PAM
DPX
4
4
4
W900_TX_OUT
RFOUT_LOW
4
PDET IN
RX_WCDMA_900RX_WCDMA_2100
GPS_IN
RTR_RX_I/Q
RTR_DRX_I/Q
I/Q_IP/M_CH0
I/Q_IP/M_CH1
PRX_I/Q P/N
DRX_I/Q P/NGPS_IN
WPRXSE2WPRXLBLB_RF_OUT2
GSM_INRFin_Low
RFOUT_LOW
WCDMA_850
MSM7227DPXW900
4RTR_SSBI
W2100_TX_OUTW2100_PA_ONW900_PA_ON
W_PA_R0
PDET_IN
RX_WCDMA_900
GPIO59
PA_ON0
GPIO_22
PA_RANGE0
SBDTTCXO
PDET_IN
VmodeVen_Low
Ven_HighRFin_High
RFOUT_HIGH
VCTCXODf/f
TRK_LO
PMIC_TCXO
RTR_TRK_LODPX
W2100RFOUT_HIGH
TCXO_PM_19.2MHz
TCXO_RTR_19.2MHz
RX_WCDMA_2100
TRK_LO_ADJ
PMICPM7540
_
GSM_PA_DAC_REFPMIC_SSBI
GPS AntennaGPS_IN
TCXO
GSM_BG_REF
GPIO106SBDT_SSBI
MPP_8
TCXO_OUTTXCO_IN
GPSLNA GPS_EN
3. Technical Brief
Figure. Block Diagram of RF Interface
- 45 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
3. Technical Brief
Figure. Block Diagram of RF Interface
- 46 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
3. TECHNICAL BRIEF
3.6.2 MSM Sub System
3.6.2.1 USIM InterfaceSIM interface scheme is shown in Figure.And, there control signals are followed
USIM_CLK: USIM Clock USIM_Reset: USIM ResetUSIM_Data: USIM Data T/Rx
3.6.2.2 UART InterfaceUART signals are connected to MSM GPIO through IO connector with 115200 bps speed.
3. Technical Brief
GPIO_Map Name Note
GPIO_86 UART3_RX Data_Rx
GPIO_87 UART3_TX Data_Tx
Table. UART Interface
Figure. SIM Interface
MSM7227 PM7540 USIMUSIM CLK
USIM Reset
USIM Data USIM Data
USIM Reset
USIM CLK
VREG_UIM 3.0V
- 47 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
3.6.2.3 HS-USB
The universal serial bus (USB) is an interconnection standard widely supported by the electronic industry. The USB2.0 spec defines data rates as low-speed (1.5 Mbps), full-speed (12Mbps) and hi-speed (480 Mbps). When two devices are connected via a USB interface, one of the devices must act as a host, and the other device must act as a peripheral. The host is responsible for initiating and controlling traffic on the bus. The USB specification requires personal computers (PCs) to act as hosts, and other devices such as printers, keyboards, mice, etc. to act as peripherals. The OTG supplement creates a new class of devices called OTG devices. OTG devices can act as either hosts or peripherals, depending upon how they are connected and/or used.The MSM7227 device contains a new USB high-speed function that is based on a embedded UTMI+ core with a UTMI+ low pin interface (ULPI) compatible port. The MSM device’s ULPI interface connects to an external ULPI PHY chip to complete the design. The ULPI core embedded in the MSM along with the PM7540 IC and a USB high-speed PHY IC provide support for the high-speed interface.
3. Technical Brief
Name Note
USBH_CLK Input clock from TCXO
Table. HSUSB Signal Interface
Figure. USB block(MSM7227 Side & MAX14526 Side)
MSM7227
USBH_CLK
USBH_DMu-USB
Connector.
3.3V LDO
USBH_CS
USBH_DP MAX14526
DM
DP
TCXO.
- 48 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
3. TECHNICAL BRIEF
3.6.3 Side Key
There are 4 main key buttons that are controlled by MSM7227. Refer to the Side Key circuit. ‘Power Button’Key is connected to PMIC(PM7540:KPD_PWR_N).
3. Technical Brief
Table. Key Matrix Mapping Table
Figure. Power ON / OFF & Suspend Button Key circuit
KEY_COL[0] KEY_COL[1]
KEY_ROW[0] FOCUS VOL_DOWN
KEY_ROW[1] SHUTTER VOL_UP
470
R306
D302
KB300
PM_ON_SW
POWER ON
- 49 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
3. Technical Brief
Figure. Camera Key Circuit
Figure. Volume Key Circuit
KB301 KB302
KEY_ROW[0]
KEY_ROW[1]
KEY_COL[1]
VOL.UPVOL.down
SW300
CC_
BB_
DAKEY_ROW[0]
KEY_ROW[1]
KEY_COL[0]
AFcapture
- 50 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
3. TECHNICAL BRIEF
3.6.4 Touch InterfaceIn GD880 touch screen sensor is an optically clear, solid state, high resolution capacitive touch solutionthat enables precise and advanced finger-based input for portable electronic devices.
Touch screen module is a glass ClearPad sensor with an attached flexible PCB with control electroniccomponents.There is a cover lens to protect the sensor assembly. The communication protocol to host is RMI over I2C.
3. Technical Brief
Figure. Touch Sensor Schematic
U200
LCD connector(CN100)
M5
Y18
AC19
AF18
Y17
U16
AC18
AF17
W16
AE17
AC17
Y16
AB17
W5
W3
V5
V6
AB9
V9
V8
Y9
W8
AB8
V3
V2
U2
U8
6M
8M
9M
8EA
7FA
8CA
6FA
7CA
6EA
11R
81B
A
81W
11
Y
71C
71B
61H
81H
71M
62G
01
Y
11T
01
W
61E
A7
01
_OIP
G6
01
_OI
PG
501
_O
IP
G401_
OI
PG
301
_O
IPG
201_
OI
PG
101
_OI
PG
00
1_OIP
G99
_OIPG
89
_OIP
G79
_OI
PG
69_
OI
PG
59_
OI
PG
49
_OI
PG
39_OI
PG
29_OIP
G1
9_OIP
G09
_OIPG
98
_OIP
G88_
OI
PG
78
_O
IPG
68_
OI
PG
58
_OI
PG
GPIO_57GPIO_58GPIO_59GPIO_60GPIO_61GPIO_62GPIO_63GPIO_64GPIO_65GPIO_66GPIO_67GPIO_68GPIO_69GPIO_70GPIO_71
GPIO_72_GRFC_9GPIO_73_GRFC_8GPIO_74_GRFC_7GPIO_75_GRFC_6GPIO_76_GRFC_5GPIO_77_GRFC_4GPIO_78_GRFC_3GPIO_79_GRFC_2GPIO_80_GRFC_1GPIO_81_GRFC_0
GPIO_82GPIO_83GPIO_84
0 12P T
K001
612R
N_TE
SE
R_TB
N_
TES
ER_
NAL
W
BT_HOST_WAKEUP
BT_PCM_DOUTBT_PCM_DINBT_PCM_SYNCBT_PCM_CLK
BT_WAKEUP
PU
EK
AW_T
SO
H_N
ALW
ANT_SEL3
GSM_PA_BANDGSM_PA_EN
ANT_SEL2ANT_SEL1
1R_
AP_
W
RTR_SSBI
AD
S_
C2I_
OI
DUA
NE_
OX
CTI
BS
S_CI
MP LCS_
C2I
_OID
UA
NE _
SAI
B_CI
M _S
H
N_TE
SE
R_TV
C_D
CL
MICROSD_DATA[0]MICROSD_DATA[1]MICROSD_DATA[2]MICROSD_DATA[3]
MICROSD_CMDMICROSD_CLK
LIN_MOTOR_EN
TOUCH_I2C_SCLTOUCH_I2C_SDA
N_
TESE
R_
DCL
TN
I_WS
_C
IUM
DI
_RE
KA
M_D
CL
CNY
SV_T
VC
_DC
L
ANT_SEL0
3.6.4 Touch InterfaceIn GD880 touch screen sensor is an optically clear, solid state, high resolution capacitive touch solutionthat enables precise and advanced finger-based input for portable electronic devices.
Touch screen module is a glass ClearPad sensor with an attached flexible PCB with control electroniccomponents.There is a cover lens to protect the sensor assembly. The communication protocol to host is RMI over I2C.
3. Technical Brief
Figure. Touch Sensor Schematic
U200
LCD connector(CN100)CN100
31 30
32 29
33 28
34 27
35 26
36 25
37 24
38 23
39 22
40 21
41 20
42 19
43 18
44 17
45 16
46 15
47 14
48 13
49 12
50 11
51 10
52 9
53 8
54 7
55 6
56 5
57 4
58 3
59 2
60 1
G1G2
G3G4
VREG_LCD_1.8VVREG_LCD_2.8V
0.1u
C1120.1u
C113
TOUCH_VDD_2.8V
0.1u
C114
VREG_MSMP_2.6V
1211R
DNI311R
TOUCH_I2C_SDA
TOUCH_I2C_SCL
TOUCH_ACK
LCD_RESET_NLCD_MAKER_ID
MLED_OUTMLED1
MLED3
MLED5
LCD_PWM
MLED2
MLED4
MLED6
FLT_LCD_R[7]
FLT_LCD_R[6]
FLT_LCD_R[4]FLT_LCD_R[3]FLT_LCD_R[2]FLT_LCD_R[1]FLT_LCD_R[0]FLT_LCD_G[7]FLT_LCD_G[6]
FLT_LCD_G[2]
FLT_LCD_G[0]FLT_LCD_B[7]FLT_LCD_B[6]FLT_LCD_B[5]FLT_LCD_B[4]FLT_LCD_B[3]FLT_LCD_B[2]FLT_LCD_B[1]FLT_LCD_B[0]
FLT_LCD_SCLFLT_LCD_SDO
FLT_LCD_HSYNCFLT_LCD_VSYNC
FLT_LCD_SDI
FLT_LCD_DEN
FLT_LCD_G[1]
FLT_LCD_R[5]
FLT_LCD_G[4]FLT_LCD_G[3]
FLT_LCD_G[5]
FLT_LCD_CS_N
MLED7
FLT_LCD_DCLK
U200
LCD connector(CN100)
- 51 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
Figure. Touch Sensor Block Diagram
MSM7227(U200)
GPIO2 : TOUCH_IC2_SCLGPIO3 : TOUCH_IC2_SDA
GPIO84 : TOUCH_ACK
T1021(TOUCH IC)
VREG_TOUCH 3.0V
TOUCH PAD
SENSORX/Y Channels
LCD MODULE
- 52 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
3. TECHNICAL BRIEF
3.7.1 Overview of Audio & Sound & BT path
3. Technical Brief
3.7 Audio and sound
Figure. Block diagram of Audio & Sound path
PCM
AUDIO_I2C_SDA
Receiver
Head Set
MSM7200A
(CPU)
BT_PCM_OUT
XTALP
ANT
LBEH19NUBC(WLAN+BT+FM)
AudioSubsystem
MAX9877
SDASCL
BT_PCM_IN
BT_PCM_SYNCBT_PCM_CLK
AUDIO_I2C_SCL
HPH_L
HPH_R
MIC 1
3.5 PiEARJACK
Speaker
80pinMain & sub
I/F connector
MIC 2
LINE_OP
LINE_ON
Analogswitch
SPK_N
SPK_P
RCV_NRCV_P
RCV_NRCV_N
MIC_PMIC_P
MIC_1P
MIC_2P
FM_AUDIO_L
FM_AUDIO_R
EAR_MICP
EAR_LEAR_R
3.7.1 Overview of Audio & Sound & BT path
3. Technical Brief
3.7 Audio and sound
Figure. Block diagram of Audio & Sound path
PCM
AUDIO_I2C_SDA
Receiver
Head Set
MSM7200A
(CPU)
BT_PCM_OUT
XTALP
ANT
LBEH19NUBC(WLAN+BT+FM)
AudioSubsystem
MAX9877
SDASCL
BT_PCM_IN
BT_PCM_SYNCBT_PCM_CLK
AUDIO_I2C_SCL
HPH_L
HPH_R
MIC 1
3.5 PiEARJACK
Speaker
80pinMain & sub
I/F connector
MIC 2
LINE_OP
LINE_ON
Analogswitch
SPK_N
SPK_P
RCV_NRCV_P
RCV_NRCV_N
MIC_PMIC_P
MIC_1P
MIC_2P
FM_AUDIO_L
FM_AUDIO_R
EAR_MICP
EAR_LEAR_R
- 5� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
The MSM7227 audio front end comprises the stereo wideband codec, PCM interface,and additional DSP audio processing.The stereo wideband codec allows the MSM7227 device to support stereo music/ringermelody applications in addition to the 8 kHz voice band applications on the forward link.In the audio transmit path, the device operates as 13-bit linear converter with software,selectable 8 kHz and 16 kHz sampling rate. In the audio receive path, the device operatesas a software-selectable 13-bit or 16-bit linear converter with software selectable 8 kHz,16 kHz, 22.05 kHz, 24 kHz, 32 kHz, 44.1 kHz, or 48 kHz sampling rate. Through software,the Rx path can be configured as either a mono or stereo output.New to the MSM7227 device is a transmit (Tx) ADC path that now supports stereowideband sampling.The integrated codec contains all of the required conversion and amplification stages forthe audio front end. The codec operates as a 13-bit linear codec with the transmit (Tx) and receive (Rx) filters designed to meet ITU-T G.712 requirements. The codec includesa programmable side tone path for summing a portion of the Tx audio into the Rx path.
An on-chip voltage/current reference is provided to generate the precise voltages and currents required by the codec. This circuit requires a single capacitor of 0.1 μF to beconnected between the CCOMP and GND pins. The on-chip voltage reference also provides a microphone bias voltage required for electret condenser microphones typically used in handset applications. The MICBIAS output pin is designed to provide 1.8 V DC while delivering as much as 1 mA of current. Audio decoder summing and headset switchdetection are included.The codec interface includes the amplification stages for both the microphone andearphone. On the transmit (Tx) path, the interface supports two differential microphoneinputs, a differential auxiliary input, and a stereo line input. On the receive (Rx) path theinterface supports one differential earphone output, a stereo single-ended headphoneoutput, one differential auxiliary output, and stereo single-ended line outputs.The codec is configured by the codec SBI registers. The codec interface is shown inFigure.Also part of the audio front end is the PCM interface. The PCM interface allows for an
external codec to be used instead of the internal codec. This interface can be used in I2Smode which will allows for an external stereo DAC to be used.Finally, the audio front end includes additional DSP audio processing that does gains,filtering and other audio processing.The DSP audio processing is configured through the QDSP5000 command types and is
not directly controlled by the microprocessor.
3. Technical Brief
3.7.2 Audio signal processing & interface
3.7.2.1 MSM7227 audio interface
- 54 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
3. TECHNICAL BRIEF
3. Technical Brief
Figure. Detailed diagram of MSM7227 audio interface
3. Technical Brief
3.7.2.2 MAX9877 audio interface
The MAX9877 combines a high-efficiency Class D audio power amplifier with a stereo Class AB capacitorless DirectDrive® headphone amplifier. Maxim’s 3rdgeneration, filterless Class D amplifier with active emissions limiting technology provides Class AB performance with Class D efficiency.The MAX9877 delivers up to 725mW from a 3.7V supply into an 8Ω load with 87% efficiency to extend battery life. The filterless modulation scheme combined with activeemissions limiting circuitry and spread-spectrum modulation greatly reduces EMI while eliminating the need for output filtering used in traditional Class D devices.The stereo Class AB headphone amplifier in the MAX9877 uses Maxim’s patented DirectDrive architecture, that produces a ground-referenced output from a single supply, eliminating the need for large DC-blocking capacitors, saving cost, space, and component height.The device utilizes a user-defined input architecture, three preamplifier gain settings, an input mixer, volume control, comprehensive click-and-pop suppression, and I2C control. A bypass mode feature disables the integrated Class D amplifier and utilizes an internal DPST switch to allow an external amplifier to drive the speaker that is connected at the outputs of the MAX9877.The MAX9877 is available in a thermally efficient, space-saving 20-bump WLP package.
3. Technical Brief
Figure Detailed diagram of MSM7227 audio interfaceFigure. Detailed diagram of MSM7227 audio interface
- 55 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
Figure. Detailed diagram of MAX9877 audio interface
- 56 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
3. TECHNICAL BRIEF
3. Technical Brief
MSM7227 Block Handset main MIC Block
8H
6F
5F
01
J
01
H
9H
01
C
01
B
9C
9B
8F
8E
7F
7E
7C
7B
6C
5C
6B
5B
PI
_R
_E
NI
LN
I_R
_E
NIL
PI_
L_
ENI
LN
I_
L_
ENI
LP
1CIM
N1
CI
MP
2C
IM
N2
CI
MP
IX
UA
NI
XU
A
PO_
EN
IL
NO
_E
NI
LP
O_1
RA
EN
O_
1RA
ET
UO
XU
AR
_H
PH
L_
HP
H
PMO
CC
SAI
B_
CIM
FE
RV
_H
PH
MIC_BIAS
C201
47p
u1202
C
u1.03 02
C
u1 .040 2
C
502C
u1.0
u1 .060 2
C
u1.0702
C
u18 02
C
C210
0.1u
C21122u
33p
C7
39p
C223
MIC_VGND|GND
DNG
V_C
IM
R_O I
DU
A_MF
L_O I
DU
A_MF
NO_
ENI L
PO_
ENIL
P_V
CR
N_V
CR
L_H
PH
R_H
PH
PCI
M_R
AE
P_CI
M
nip
5E
ot eso
lC
+VPWR
DNI
C1
0.1u
C400
10u
604C
15p
704C
47p
804C
MIC400
4
3
2
1P
G1
G2
O
U400
94
63
52
71
8101B0 1A
1B1 S1
2B0 2A
2B1 S2
GND VCC
MIC401
4
3
2
1P
G1
G2
O
MIC_BIASMIC_BIAS
MIC_SEL
MIC_PMIC_1P
MIC_1P
MIC_2P
MIC_2PMIC1_VGNDMIC1_VGND
MIC2_VGND
MIC2_VGND
MIC2_VGND
MIC_VGNDSUMY0010609SMD, TOP
SMD, TOP
SUMY0010609
+VPWR
DNI
C1
0.1u
C400
10u
604C
15p
704C
47p
804C
MIC400
4
3
2
1P
G1
G2
O
U400
94
63
52
71
8101B0 1A
1B1 S1
2B0 2A
2B1 S2
GND VCC
MIC401
4
3
2
1P
G1
G2
O
MIC_BIASMIC_BIAS
MIC_SEL
MIC_PMIC_1P
MIC_1P
MIC_2P
MIC_2PMIC1_VGNDMIC1_VGND
MIC2_VGND
MIC2_VGND
MIC2_VGND
MIC_VGNDSUMY0010609SMD, TOP
SMD, TOP
SUMY0010609
+VPWR
DNI
C1
0.1u
C400
10u
604C
15p
704C
47p
804C
MIC400
4
3
2
1P
G1
G2
O
U400
94
63
52
71
8101B0 1A
1B1 S1
2B0 2A
2B1 S2
GND VCC
MIC401
4
3
2
1P
G1
G2
O
MIC_BIASMIC_BIAS
MIC_SEL
MIC_PMIC_1P
MIC_1P
MIC_2P
MIC_2PMIC1_VGNDMIC1_VGND
MIC2_VGND
MIC2_VGND
MIC2_VGND
MIC_VGNDSUMY0010609SMD, TOP
SMD, TOP
SUMY0010609
- 57 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
3. Technical Brief
Audio Subsystem(MAX9877) Block
3.5pi Ear/mic Set Jack Block
1R
2.2K
D505
U500
5
3 24 1
VOUTVDDGNDCE D
NG
P
1800FB503
1M705R
VREG_MSMP_2.6V
1800FB504
10K105R
2.2u
405
C
VREG_MSMP_2.6V
22p
C514D501
1800
FB502
J500
C8
100p
2R
1K
47
R508
D502100n
L500
47p
C517
47p
C518 D503
4.7u
C503
FM_ANT
EAR_SENSE
HOOK_ADC
HOOK_ADC|EAR_MICP
EAR_MICP
HS_MIC_BIAS_EN
EAR_REAR_L
Close
EAR_SENSE
OpenHIGH (detect)
LOW
S/W
1u
125C
4.7K505R
4.7K005R
VREG_MSMP_2.6V
C505
1u
10u
C5061u
205C
22nC509
22nC510
220nC508
220nC507
+VPWR
IC500
4C
3D
B4
D4
C3
B3
B5B2
D5C2
C1
D2
D1
A2
A1A5
A4
5C
1B
3A
SS
V
DD
V
DD
VPC1N
C1P HPR
HPL
INA2
INA1
INB2
INB1 OUT+
BIAS OUT-
SDA
SCL
RXIN+
RXIN- DN
G
DN
GP
1u
105C
AUDIO_I2C_SDA
LINE_ONLINE_OP
HPH_LHPH_R
AUDIO_I2C_SCL
SPK_N
EAR_R
EAR_L
SPK_P
- 58 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
3. TECHNICAL BRIEF
GD880 has two cameras : 5M Pixel CMOS Camera and VGA camera.Below figures shows the 5M camera I/F
3.8.1 5 Mega Camera Interface
3. Technical Brief
3.8 Camera / LCD
Figure. Schematic of 5 Mega Camera I/F
10u
C200
33p
C201
CN201
17
16
15
14
13
12
11
10
9
8
7
6
5
314
323
332
341
30
29
28
27
26
25
24
23
22
21
20
19
18
CAM_VDD_1.8V
0.1u
C207
CAM_AF_2.8V
CAM_VDD_2.8V
120
FB200
0.1u
C208
0.1u
C206
CAM_PCLK
CAM_VSYNCCAM_HSYNC
CAM_MCLK
MCAM_RESET
CAM_I2C_SCLCAM_I2C_SDA
S_CAM_DATA[0]S_CAM_DATA[1]S_CAM_DATA[2]S_CAM_DATA[3]S_CAM_DATA[4]S_CAM_DATA[5]S_CAM_DATA[6]S_CAM_DATA[7]S_CAM_DATA[8]S_CAM_DATA[9] MCAM_PWDN
5M CAMERA CON.
7.5pF
FL200
01
5
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
7.5pF
FL201
01
5
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
7.5pF
FL202
01
5
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
CAM_PCLKCAM_HSYNC
CAM_DATA[7]CAM_DATA[6]CAM_DATA[5]CAM_DATA[4]
CAM_DATA[3]CAM_DATA[2]CAM_DATA[1]CAM_DATA[0]S_CAM_DATA[0]
S_CAM_DATA[1]S_CAM_DATA[2]|S_VGA_CAM_DATA[0]S_CAM_DATA[2]
S_CAM_DATA[3]|S_VGA_CAM_DATA[1] S_CAM_DATA[3]
S_CAM_DATA[4]|S_VGA_CAM_DATA[2] S_CAM_DATA[4]S_CAM_DATA[5]|S_VGA_CAM_DATA[3] S_CAM_DATA[5]S_CAM_DATA[6]|S_VGA_CAM_DATA[4] S_CAM_DATA[6]S_CAM_DATA[7]|S_VGA_CAM_DATA[5] S_CAM_DATA[7]
S_CAM_DATA[8]|S_VGA_CAM_DATA[6] S_CAM_DATA[8]S_CAM_DATA[9]|S_VGA_CAM_DATA[7] S_CAM_DATA[9]
CAM_DATA[8]CAM_DATA[9]FLT_CAM_HSYNCFLT_CAM_PCLK
1608
1608
EMI FILTER
- 59 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
Table. Interface between 5M Camera Module and MAIN Board
3. Technical Brief
NO NAME TYPE Description
1 S_CAM_MCLK Input Master clock input
2 GND Ground Ground
3 S_CAM_PCLK Output CAMERA clock output
4 GND Ground Ground
5~14 DATA[0]~[9] NC NC
15 NC NC NC
16 NC Output Data line
17 GND Ground Ground
18 GND Ground Ground
19 CAM_VDD_AF_2.8V Power AF Motor power (2.8V)
20 GND Ground Ground
21 S_MCAM_PWDN Input Camera Power Down (Active “H”)
22 GND Ground Ground
23 S_CAM_HSYNC Input SYNC
24 S_CAM_VSYNC Input SYNC
25 GND Ground Ground
26 S_CAM_I2C_SCL Input I2C Clock
27 S_CAM_I2C_SDA Input/Output I2C Data
28 GND Ground Ground
29 S_MCAM_RESET_N Input Camera reset (Active “L”)
30 GND Ground Ground
31 CAM_VDD_2.8V Power Digital Power (2.8V)
32 CAM_VDD_1.8V Power Digital Power (1.8V)
33 GND Ground Ground
34 CAM_VDD_2.8V Input Digital Power (2.8V)
The camera port supply 64MHz master clock to camera module and receive serial data from camera module. And MSM7227 supply converted 8bits data, 48MHz pixel clock(max.15fps@ full resolution), vertical sync signal, horizontal sync signal, reset signal to MSM7227 again. The camera module is controlled by I2C port from MSM7227.
6MHz master clock60MHz pixel clock
- 60 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
3. TECHNICAL BRIEF
3.8.2 VGA Camera Interface
3. Technical Brief
Figure. Schematic of VGA Camera Module and I/F
The VGA Camera module is mounted to SPK FPCB. Its interface is dedicated camera interface port in MSM7227. The camera port supply 24MHz master clock to camera module and receive 19.2MHz pixel clock (max.30fps@VGA), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module. The camera module is controlled by I2C port from MSM7227.
100p
C210
CN200
4140
4239
4338
4437
4536
4635
4734
4833
4932
5031
5130
5229
5328
5427
5526
5625
5724
5823
5922
6021
6120
6219
6318
6417
6516
6615
6714
6813
6912
7011
7110
729
738
747
756
765
774
783
792
801
100
R205
DNI
C2047.5p
C203
1
R201
470
R211
7.5p
C214
4.7K902R
4.7K012R
470
R212
470
R213
RW
PV+
V8.1_D
CL_G
ER
V
V5.1_B
GR_
GE
RV
V6 .2_B
GR_
GE
RV
V8.2_D
CL_G
ER
V
V0.3_C
MM_
GE
RV
V0.3_R
OTO
M_G
ER
V
470
R214
V6.2_P
MS
M_G
ER
V
56K512R
56K612R
CAM_VDD_2.8V
VREG_MSMP_2.6V
V6.2_R
OS
NE
S_G
ER
V
RCV_P
RCV_N
VBACK_UP
MIC_BIAS
LCD_CVT_INT
LCD_CVT_RESET_N
TOUCH_I2C_SDA
TOUCH_I2C_SCL
KEY_ROW[0]
KEY_ROW[1]
KEY_COL[0]
KEY_COL[1]
MOTION_INT
LCD_SUBPM_RESET_N
LCD_SUBPM_I2C_SCL
LCD_SUBPM_I2C_SDA
MOTION_I2C_SCL
MOTION_I2C_SDA
PROXI_I2C_SCL
PROXI_I2C_SDA
PROXI_OUT
LIN_MOTOR_EN
LIN_MOTOR_PWM
MICROSD_CLK
MICROSD_CMD
SPK_P
SPK_NMIC_SEL
MIC_P
MICROSD_DET_N
MICROSD_DATA[3]
MICROSD_DATA[2]
MICROSD_DATA[1]
MICROSD_DATA[0]
TOUCH_ACK
LCD_RESET_N
LCD_CVT_VSYNC
MDDI_P_DATA_P
MDDI_P_STB_P
LCD_MAKER_ID
MDDI_P_STB_M
MDDI_P_DATA_M
CAM_VSYNC
CAM_DATA[7]
CAM_DATA[6]
CAM_DATA[5]
CAM_DATA[4]
CAM_DATA[3]
CAM_DATA[2]
CAM_DATA[1]
CAM_DATA[0]
CAM_MCLK
VGA_CAM_PWDN
VGA_CAM_RESET_N
MCAM_RESET
CAM_I2C_SCL
CAM_I2C_SDA
CAM_DATA[8]
CAM_DATA[9]
MCAM_PWDN
PM_ON_SW
MIC_VGND
FLT_CAM_HSYNC
FLT_CAM_PCLK
MAIN & SUB I/F CONNECTOR
0.1u
C211
0.1u
C212
60FB201
U200
1F
E3E4
E2A5
C4
A4
D4D6
C3C5
C2D3
C1C6
B4B5
B2
B1
B3
D2E5
D1B6
A3A2IOVDD DCLK
DVDD HSYNC
AVDD VSYNC
DATA0
DATA1
DATA2
EXTCLK DATA3
PWRDWN DATA4
RESET DATA5
SDA DATA6
SCL DATA7
GND1
GND2
VDD15_1 GND3
VDD15_2 GND4DN
GP
0.1u
C209
CAM_VDD_2.8VCAM_VDD_1.8V
D200
CAM_PCLK
CAM_VSYNCCAM_HSYNC
CAM_MCLKVGA_CAM_PWDN
VGA_CAM_RESET_N
CAM_I2C_SCLCAM_I2C_SDA
S_VGA_CAM_DATA[0]S_VGA_CAM_DATA[1]S_VGA_CAM_DATA[2]S_VGA_CAM_DATA[3]S_VGA_CAM_DATA[4]S_VGA_CAM_DATA[5]S_VGA_CAM_DATA[6]S_VGA_CAM_DATA[7]
SUB FPCB12MHz
- 61 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
3. Technical Brief
3.8.3 LCD module
Figure. LCD I/F Block Diagram
LCD_BL_EN
I2C
MDDI_P_DATA_PMDDI_P_DATA_M
MDDI_P_STB_MMDDI_P_STB_P
LCD_CVT_RESETLCD_CVT_INT
LCD_CVT_VSYNC
LCD_RESET_N
3.2’ TFT LCD
LCD backlight control
LCD module
BD6084GULLCD Backlight Driver2
MSM7227
7
PM7540
VREG_RGB_1.5VVREG_RGB_2.6VVREG_LCD_1.8VVREG_LCD_2.8V
S1D13775B00B60LRGB converter
24
4
WLED1:7
WLED_PWR
LCD_R[7:0]/B[7:0]/G[7:0]
LCD_SYNC
LCD_CS_N
LCD_SDI
LCD_SCL
LCD_RESET_N
I/O Vcc(1.8V)Vcc(2.8V)
- 62 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
3. TECHNICAL BRIEF
3.8.4 Display
Figure. Schematic of LCD connector (in Sub PCB)
3. Technical Brief
LCD module is connected to Main PCB with 60-pin connector(AXT660124). The LCD is controlled by RGB Interface in S1D13775B00B60L that is converter MDDI to RGB.
CN100
31 30
32 29
33 28
34 27
35 26
36 25
37 24
38 23
39 22
40 21
41 20
42 19
43 18
44 17
45 16
46 15
47 14
48 13
49 12
50 11
51 10
52 9
53 8
54 7
55 6
56 5
57 4
58 3
59 2
60 1
G1G2
G3G4
VREG_LCD_1.8VVREG_LCD_2.8V
0.1u
C1120.1u
C113
TOUCH_VDD_2.8V
0.1u
C114
VREG_MSMP_2.6V
1211R
DNI311R
TOUCH_I2C_SDA
TOUCH_I2C_SCL
TOUCH_ACK
LCD_RESET_NLCD_MAKER_ID
MLED_OUTMLED1
MLED3
MLED5
LCD_PWM
MLED2
MLED4
MLED6
FLT_LCD_R[7]
FLT_LCD_R[6]
FLT_LCD_R[4]FLT_LCD_R[3]FLT_LCD_R[2]FLT_LCD_R[1]FLT_LCD_R[0]FLT_LCD_G[7]FLT_LCD_G[6]
FLT_LCD_G[2]
FLT_LCD_G[0]FLT_LCD_B[7]FLT_LCD_B[6]FLT_LCD_B[5]FLT_LCD_B[4]FLT_LCD_B[3]FLT_LCD_B[2]FLT_LCD_B[1]FLT_LCD_B[0]
FLT_LCD_SCLFLT_LCD_SDO
FLT_LCD_HSYNCFLT_LCD_VSYNC
FLT_LCD_SDI
FLT_LCD_DEN
FLT_LCD_G[1]
FLT_LCD_R[5]
FLT_LCD_G[4]FLT_LCD_G[3]
FLT_LCD_G[5]
FLT_LCD_CS_N
MLED7
FLT_LCD_DCLK
MINI_3.2"_LCD
3.8.4 Display
Figure. Schematic of LCD connector (in Sub PCB)
3. Technical Brief
LCD module is connected to Main PCB with 60-pin connector(AXT660124). The LCD is controlled by RGB Interface in S1D13775B00B60L that is converter MDDI to RGB.
- 6� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
Table. Interface between 5M Camera Module and SUB Board
3. Technical Brief
3.8.5 Pin DescriptionInput Signal and Power: Pin Description (60Pin, AXT660124
- 64 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
3. TECHNICAL BRIEF
Table. Interface between LCD Module and MAIN Board
3. Technical Brief
- 65 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
When call connected, the object is moved nearer to the proximity sensor.LCD backlight and Touch screen is disable operation automatically.
U102 : GP2AP002S00F is Optical proximity sensor.
3. Technical Brief
3.9 Proximity Sensor
Figure. Proximity Sensor Schematic
Figure. Proximity Sensor Block Diagram
PMIC(U400)VREG_GP3
(2.7V)
GPIO124 : PROXI_OUT
MSM7227(U300)
GPIO123 : PROXI_SDA GPIO122 : PRGXI_SCL
0.1u
C301
2.2u
C302
4.7K
R308
4.7K
R309
VREG_SENSOR_2.6V
VREG_SENSOR_2.6V
R310
4.7
10u
C304
U300
54
63
72
81
AD
ELL
CS
CD
ELA
DS
CC
VOI
V
TU
OV
DN
G
10
R311VREG_SENSOR_2.6V
VREG_SENSOR_2.6V
1u
C305PROXI_I2C_SCL
PROXI_I2C_SDA
PROXI_OUT
When call connected, the object is moved nearer to the proximity sensor.LCD backlight and Touch screen is disable operation automatically.
U102 : GP2AP002S00F is Optical proximity sensor.
3. Technical Brief
3.9 Proximity Sensor
Figure. Proximity Sensor Schematic
Figure. Proximity Sensor Block Diagram
PMIC(U400)VREG_GP3
(2.7V)
GPIO124 : PROXI_OUT
MSM7227(U300)
GPIO123 : PROXI_SDA GPIO122 : PRGXI_SCL
U�00
MSM7227(U200)
- 66 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
3. TECHNICAL BRIEF
U101D2D1
6F1A
1F6A
E3F2
E5D3F5E2E6E1
F3C1
A4
C2E4B3D4A3B4B1D5B2A2
LED1LED2
VIO LED3RESETB LED4SCL LED5SDA LED6
WPWMIN
LEDGNDSBIAS
SSENS LDO1OSGND LDO2OGC2 LDO3OGC1 LDO4O
2T 4T 1T 3T
LED7LED8
TP101
GAIN1GAIN2
LCD_SUBPM_RESET_N
SBIAS
SENS
LCD_PWM
10K
213
R1u
C306
U301
6
43
2
51VCC IOUT
GND1
GC1 GC22D
NG
GAIN1 GAIN2
SBIAS SENS
Ambient Light Sensor
When ALC sensor turn on, automatically controls brightness of the display backlight.U801 : Backlight driver IC (BD6083) used I2C interface to MSM7227 [Main PCB ]U101 : Luminance Sensor [SPK_FPCB]
3. Technical Brief
3.10 Luminance Sensor
Luminance Sensor Schematic
MSM7227
(BD6083GUL)
Luminance Sensor Block Diagram
U301
U100
(BD6084GUL)
U101 : Backlight driver IC (BD6084GUL) used I2C interface to SM7227 [Main PCB ]
U�01 : Luminance Sensor [FPCB]
When ALC sensor turn on, automatically controls brightness of the display backlight.U801 : Backlight driver IC (BD6083) used I2C interface to MSM7227 [Main PCB ]U101 : Luminance Sensor [SPK_FPCB]
3. Technical Brief
3.10 Luminance Sensor
Luminance Sensor Schematic
MSM7227
(BD6083GUL)
Luminance Sensor Block Diagram
U301
U100
(BD6084GUL)
U101
ALS(BH1621FVC)
U200
- 67 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
According to tilt the cell phone, the screen is had rotated automatically.U200 : MMA7660FC IC used I2C interface to MSM7227
3. Technical Brief
3.11 Motion Sensor
Main Board
Luminance Sensor Block Diagram
U200MSM7227
U200MSM7227
U303BMA150
U303BMA150GPIO38 : Motion_I2C_SDA
GPIO37 : Motion_I2C_SCL
GPIO 18 : Motion_INT
VREG_MSMP_2.6V
Sub-PCB
Motion Sensor Schematic
U303
21
11
65
74
83
92
101NC1 NC2
VDD VDDIO
GND SDI
INT SDO
CSB SCK
1TO
N
2TO
N 0.1u
C300
VREG_MSMP_2.6V
TP300
1u
C309
4.7K513R
4.7K613R
VREG_MSMP_2.6V
MOTION_INT
MOTION_I2C_SCL
MOTION_I2C_SDA
U�0� : BMA150 IC used I2C interface to MSM7227
- 68 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
3. TECHNICAL BRIEF
(LIN_MOTOR_PWM for linear motor).
There is a linear motor.Depending on user scenario, one of these motors operates or two motors operate at the same time. The strength of vibration is determined by the duty cycle of PWM (DC_PWM_MAG for DC motor, LIN_PWM for linear motor).
U302 : SM100 is Linear motor driver IC.
3. Technical Brief
3.12 Vibrators
Linear Motor Schematic
VB300
2
1
100nL300
100n
L301
VREG_MOTOR_3.0V
1u
C3073.9n
C308313R
510K
10K41 3R U302
9
54
63
72
81EN V1
SIN VSS
TYPE VCC
OCT V2DN
GP
LIN_MOTOR_EN
LIN_MOTOR_PWM
Linear Motor PAD
1%
EUSY0200803
U�02 : SM100 is Linear motor driver IC.
(LIN_MOTOR_PWM for linear motor).
- 69 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
3. Technical Brief
Vibrator Block Diagram
U302MSM7227
U302MSM7227
Main Board
GPIO 28 : LIN_PWM
GPIO 58 : LIN_MOTOR_EN
U302Linear motor
Circuitry
U302Linear motor
Circuitry
Linearmotor
connector
U200
GPIO 28 : LIN_MOTOR_PWM
GPIO 26 : LIN_MOTOR_EN
- 70 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
3. TECHNICAL BRIEF
3. Technical Brief
3.13 GSM MODE3.13.1 GSM RECEIVER
The GSM-850, GSM-900, GSM-1800, and GSM-1900 receiver inputs of RTR6285 are connected
directly to the transceiver front-end Module. GSM-850, GSM-900, GSM-1800, and GSM-1900
receiver inputs use differential configurations to improve common-mode rejection and second-order
non-linearity performance. For example Figure 1-2 shows receiver input topologies for DCS and PCS
(GSM-850/900 have the same receiver input topologies). The balance between the complementary
signals is critical and must be maintained from the RF filter outputs all the way into the IC pins.
[Figure 1-2] DCS and PCS Receiver Inputs Topologies
- 71 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
3. Technical Brief
The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters. The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q) having passband and stopband characteristics suitable for GMSK or 8-PSK processing. These filter circuits include DC offset corrections. The filter outputs are buffered and passed on to the MSM7227 IC for further processing as shown in Figure 1-4.
3.13.2 GSM TRANSMITTER The RTR6285 transmitter outputs(HB_RF_OUT1 and LB_RF_OUT1) include on-chip output matching inductors. 50ohm output impedance is achieved by adding a series capacitor at the output pins. The capacitor value may be optimized for specific applications and PCB characteristics based on pass-band symmetry about the band center frequency as shown in Figure 1-3.
The RTR6285 IC is able to support GSM 850/900 and GSM 1800/1900 mode transmitting. This design guideline shows a tri-band GSM application. Both high-band and low band outputs are followed by resistive pads to ensure that the load presented to the outputs remains close to 50ohm.
[Figure 1-3] GSM Transmitter Outputs Topologies
Since GSM-850, GSM-900, GSM-1800, and GSM-1900 signals are time-division duplex (the handset can only receive or transmit at one time), switches are used to separate Rx and Tx signals in place of frequency duplexers – this is accomplished in the switch module. The GSM-850, GSM-900, GSM-1800, and GSM-1900 receive signals are routed to the RTR6285 through band selection filters and matching networks that transform single-ended 50-Ωsources to differential impedances optimized for gain and noise figure. The RTR input uses a differential configuration to improve second-order inter-modulation and common mode rejection performance. The RTR6285 input stages include MSM-controlled gain adjustments that maximize receiver dynamic range.
- 72 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
3. TECHNICAL BRIEF
3. Technical Brief
3.14 UMTS MODE
3.14.1 UMTS RECEIVER
The UMTS duplexer receiver output is routed to LNA circuits within the RTR6285 device as shown in
Figure 1-4. The UMTS Rx input is provided with an on-chip LNA that amplifies the signal before a second
stage filter that provides differential downconverter as shown in Figure 1-5. This second stage input is
configured differentially to optimize second-order intermodulation and common mode rejection
performance. The gain of the UMTS frontend amplifier and the UMTS second stage differential amplifier
are adjustable, under MSM control, to extend the dynamic range of the receivers. The second stage UMTS
Rx amplifiers drive the RF ports of the quadrature RF-to-baseband downconverters. The downconverted
UMTS Rx baseband outputs are routed to lowpass filters having passband and stopband characteristics
suitable for UMTS Rx processing. These filter circuits allow DC offset corrections, and their differential
outputs are buffered to interface shared with GSM Rx to the MSM IC. The UMTS baseband outputs are
turned off when the RTR6285 is downconverting GSM signals and on when the UMTS is operating.
[Figure 1-4] UMTS Receiver Inputs Topologies
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3. TECHNICAL BRIEF
3. Technical Brief
The RTR6285 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly high-level signals that are filtered and applied to the PA. Transmit power is delivered from the duplexer to the antenna through the switch module. The transceiver LO synthesizer is contained within the RTR6285 IC with the exception of the off-chip loop filter components and the VC-TCXO. This provides a simplified design for multimode applications. The PLL circuits include a reference divider, phase detector, charge pump, feedback divider, and digital logic generator. UMTS Tx. Using only PLL1, the LO generation and distribution circuits create the necessary LO signals for nine different frequency converters. The UMTS transmitter also employs the ZIF architecture to translate the signal directly from baseband to RF. This requires FLO to equal FRF, and the RTR6285 IC design achieves this without allowing FVCO to equal FRF. The RTR6285 IC is able to support UMTS 2100/1900/1800/1700 and 850 mode transmitting. This design guideline shows only UMTS 2100 applications.
3.14.2 UMTS TRANSMITTER
The UMTS Tx path begins with differential baseband signals (I and Q) from the MSM device. These analog input signals are amplified, filtered, and applied to the quadrature up-converter mixers. The up-converter output is amplified by multiple variable gain stages that provide transmit AGC control. The AGC output is filtered and applied to the driver amplifier; this output stage includes an integrated matching inductor that simplifies the external matching network to a single series capacitor to achieve the desired 50-Ω interface.
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3. TECHNICAL BRIEF
3. Technical Brief
[Figure 1.5] RTR6285 IC Functional Block Diagram
3. Technical Brief
[Figure 1.5] RTR6285 IC Functional Block Diagram
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3. TECHNICAL BRIEF
3. Technical Brief
3.15 GPS RECEIVER
The GPS receiver input employs a single-ended connection realized by this pin. The GPS input is routed from the GPS antenna switch, through a band pass filter and then an impedance transformer circuit that optimally matches the impedance looking into the GPS LNA. The impedance transformer circuit topology is shown in Figure 1-6.
[Figure 1.6] GPS Input Network Topology
3.16 LO GENERATION and DISTRIBUTION CIRCUIT
The integrated LO generation and distribution circuits are driven by internal VCOs to support various modes to yield highly flexible quadrature LO outputs that drive all GSM/EDGE, UMTS band and GPS up-converters and down-converters; with the help of these LO generation and distribution circuits, true zero-IF architecture is employed in all GSM and UMTS band receivers and transmitters to translate the signal directly from RF-to-baseband and from baseband-to-RF. Two fully functional fraction-N synthesizers, including VCOs and loop filters, are integrated within the RTR6285 IC. In addition, the RTR6285 has a third synthesizer used for GPS operation. The first synthesizer (PLL1) in the RTR6285 creates the transceiver Los that support the UMTS transmitter, and all four GSM band receivers and transmitters including: GSM850, GSM900, GSM1800, and GSM1900. The second synthesizer (PLL2) in the RTR6285 IC provides the LO for the UMTS primary receiver. For the RTR6285 IC only, the second synthesizer also provides the LO for the secondary UMTS receiver. The third synthesizer (PLL3), only in the RTR6285 IC, provides the LO for the GPS receiver. An external TCXO input signal is required to provide the synthesizer frequency reference to which the PLL is phase and frequency locked. The RTR6285 ICs integrate most of the PLL loop filter components on-chip except for three off-chip loop filter-series capacitors, which significantly reduces off-chip component requirement. With the integrated fractional-N PLL synthesizers, the RTR6285 ICs have the advantage of more flexible loop bandwidth control, fast lock time, and low-integrated phase error.
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3. TECHNICAL BRIEF
3. Technical Brief
3.17 OFF-CHIP RF COMPONENTS
3.17.1 UMTS PAM (U1002, ACPM-5281)
The ACPM-5281 is a dual-band PAM (Power Amplifier Module) designed for UMTS Band1 and Band8. The ACPM-5281 meets stringent UMTS linearity requirements. The 4mmx5mm form factor 14-pin surface mount package is self contained, incorporating 50ohm input and output matching networks The ACPM-5281 features 5th generation of CoolPAM circuit technology which supports 3 modes –bypass, mid and high power modes. The CoolPAM is stage bypass technology which enables power amplifier to lower power consumption. Active bypass feature is added to 5th generation to enhance power added efficiency at low output range and this technology extends talk time of mobiles more by further saving power amplifier’s current consumption. The power amplifier is manufactured on anadvanced InGaP HBT (hetero-junction Bipolar Transistor) MMIC (microwave monolithic integrated circuit) technology offering state-of-the-art reliability, temperature stability and ruggedness The Module is housed in a cost effective, small and thin 4x5mm package.
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3. TECHNICAL BRIEF
3.17.2 19.2MHz VCTCXO (X200, TG-5010LH_19_2M_75A)
The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference frequency for all RFIC synthesizers as well as clock generation functions within the MSM6285 IC. The oscillator frequency is controlled by the MSM6285 ICs. TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control TX_AGC_ADJ. A two-pole RC lowpass filter is recommended on this control line. The PM7540 IC controls the handset power-up sequence, including a special VCTCXO warm-up interval before other circuits are turned on. This warm-up interval (as well as other TCXO controller functions) is enabled by the MSM TCXO_EN line . The PM7540 IC VREG_TCXO regulated output voltage is used to power the VCTCXO and is enabled before most other regulated outputs. Any GSM mode power control circuits within the MSM7227 IC require a reference voltage for proper operation and sufficient accuracy. Connecting the PM7540 IC REF_OUT directly to the MSM7227 IC GSM_PA_PWR_CTL_REF provides this reference. This sensitive analog signal needs a 0.1 μF low frequency filter near to MSM side, and isolate from digital logic and clock traces with ground on both sides, plus ground above and below if routed on internal layers.
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3. TECHNICAL BRIEF
3. Technical Brief
3.17.3 ASM (FL1007, D5017)
This equipment uses a single antenna to support all handset operating modes, with an antenna switch module select the operating frequency and band. UMTS operation requires simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and transmit signals. The active connection is MSM-selected by three control lines (GPIO[72], GPIO[73], GPIO[74] and GPIO[75]). These GPIOs are programmed to be ANT_SEL3, ANT_SEL2, ANT_SEL1 and ANT_SEL0 respectively.
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3. TECHNICAL BRIEF
3.17.4 GSM PAM (U1004, SKY77336)
SKY77336 Power Amplifier Module (PAM) is designed in a compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800 and PCS1900, supporting Gaussian Minimum-Shift Keying (GMSK) and Polar Enhanced Data for GSM Evolution (EDGE) modulation. Class 12 General Packet Radio Service (GPRS) multi-slot operation is also supported. The module consists of GSM850/900 PA and DCS1800/PCS1900 PA blocks, impedance matching circuitry for 50 Ω input and output impedances, and
a Power Amplifier Control (PAC) block.
The custom CMOS integrated circuit provides the internal PAC function and interface circuitry. Fabricated in InGaP/GaAs, the Heterojunction Bipolar Transistor (HBT) PA blocks support the GSM850/900 bands and DCS1800/PCS1900 bands. Both PA blocks share common power supply pads to distributecurrent. The InGaP/GaAs die, Silicon (Si) controller die, and passive components are mounted on a multi-layer laminate substrate and the entire assembly is encapsulated with plastic overmold. RF input and output ports of the SKY77336 are internally matched to a 50 Ω load to reduce the number of external components for a quad-band design. Extremely low leakage current (10 μA, typical) of the PAM module maximizes handset standby time. The SKY77336 also contains band-select switching circuitry to select GSM (logic 0) or DCS/PCS (logic 1) as determined from the Band Select (BS) signal. See Figure shown below.
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3. TECHNICAL BRIEF
3. Technical Brief
3.17.5 GPS LNA (U1001, ALM-2412)
The ALM-2412 is an LNA module, with integrated filter, designed for GPS band applications at 1.575GHz. The LNA uses AVAGO Technologies’ proprietary GaAs Enhancement-mode pHEMT process to achieve high gain with very low noise figure and high linearity. Noise figure distribution is very tightly controlled. A CMOS-compatible shutdown pin is included either for turning the LNA on/off, or for current adjustment. The integrated filter utilizes an Avago Technologies’ leading edge FBAR filter for exceptional rejection at Cell/PCS Band frequencies. The ALM-2412 is useable down to 1V operation. It achieves low noise figure, high gain and linearity even at 1V, making it suitable for use in critical low-power GPS applications or during low-battery situations. The Module is housed in a cost effective, small and thin package (3.3X2.1X1.1mm3). This part is MSL Class 3 and HBM ESD Level Class 1A.
3.18 LG GD880 Main Features
- Bar Type Simple & Stylish design- UMTS 2100 + UMTS 900+
GSM 900 + DCS 1800 + PCS 1900 + GSM850 based GSM/GPRS/EDGE/UMTS- HSDPA 7.2Mbps- TFT Main LCD(3.2’, 480 x 854)- Touch Sensitive User Interface- 5M AF Camera - 3.5Phi Stereo Headset & Speaker phone- 64 Poly Sound- MP3/AAC/AMR/MIDI/3GP/SMAF decoder and play- MPEG4 encoder/decoder and play/save- JPEG en/decoder- Supports Bluetooth and HS-USB- Supports WLAN - 900 mAh (Li-Ion Polymer)
1. Main Features
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3. TECHNICAL BRIEF
3.19 GD880 Main Component
2. Main Components
Main board, Top Main board, Bottom
Sub board, Top Sub board, Bottom
Logic
USIM
SD Socket
5M Camera Connector
Connector
RF
GPS Logic & AudioWiFi+BT+FM BB/PMIC/MEM
Proximitor Sensor
VGA Camera LCD Connector
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3. TECHNICAL BRIEF
RF
2. Main Components
Reference Description Reference Description
FL1002 WCDMA (VIII) Duplexer FL1003 WCDMA (I) Duplexer
FL1006 WCDMA (VIII) TX SAW Filter FL1007 FEM
FL1005 WCDMA (I) TX SAW Filter U1004 GSM PAM
U1002 WCDMA Dual (1&8)PAM U1003 RTR6285(Transceiver)
FL1004 WCDMA (I) RX SAW Filter SW1002 RF Antenna connector
FL1001 GPS SAW Filter U1001 GPS LNA
U1003
U1002
FL1006
FL1005
FL1003
U1004
FL1002
FL1007
FL1004
SW1002
FL1001
U1001
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3. TECHNICAL BRIEF
Logic
2. Main Components
Reference Description Reference Description
U402 MUIC for 5Pin Micro USB J1 SIM Connector
U403 Power MOSFET for Changing ANT600 WiFi/BT Antenna
U404 Over-voltage Protection IC500 AUDIO_SUB_SYSTEM
U401 LDO for USB
U402
J1
ANT600
U403
U404
IC500
U401
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3. TECHNICAL BRIEF
BB / MEM / WiFi + BT
2. Main Components
Ref. Description Ref. Description
U200 MSM7227 U301 Memory, MCP
CN401 Battery Connector CN500 Main to Sub Connector
U400 PMIC, PM7540 J500 3.5phi Ear-Jack
CN400 Micro USB 5Pin Con. U600 Wi-Fi &BT Module
X200 TCXO (19.2MHz) X600 TCXO (26MHz)
U200
U301
CN401CN500
U400
J500
U600
X600
X200
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3. TECHNICAL BRIEF
Logic
2. Main Components
Ref. Description Ref. Description
S300 Micro-SD Socket CN201 5M Camera Connector
MIC400 MIC for Speaker Phone U101 LCD Charge-pump
U303 Motion sensor CN100 LCD Connector
U100 RGB Converter U300 Proximitor Sensor
U200 VGA Camera CN200 Sub to Main connector
MIC401 MIC
S300
CN201
MIC400
U101
U303
U100
CN100
U300U200
CN200
MIC401
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5.Trouble Shooting (RF)
4.1 RF Component
FL1001
FL1004
U1001
U1003FL1005 FL1006
U1002
FL1002FL1003
FL1007 U1004
SW1002
SW1002
86P
4. TROUBLE SHOOTING
4. TROUBLE SHOOTING
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4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
RF component (WCDMA / GSM)
Reference Description Reference Description
U1001 GPS LNA FL1005 WCDMA (1) Tx SAW Filter
U1002 WCDMA Dual(1 & 8) PAM FL1006 WCDMA (8) Tx SAW Filter
U1003 RTR6285 FL1007 Front End Module
U1004 GSM PAM X200 VCTCXO (19.2 MHz)
FL1001 GPS SAW Filter U600 Wifi/BT/FM Combo Module
FL1002 WCDMA (8) Duplexer ANT600 Wifi/BT Antenna
FL1003 WCDMA (1) Duplexer SW1001 RF Antenna Connector
FL1004 WCDMA (1) Rx Saw Filter SW1002 RF Mobile Switch
U600
ANT600
X200
87P
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4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
GSM850/GSM900/DCS/PCS’s RX/TX Signal PATHA. GSM850/GSM900/DCS1800/PCS1900 RX PATHB. GSM850/GSM900/DCS1800/PCS1900 TX PATH
C. COMMON TX/RX PATH
4.2 Signal Path
88P
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4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
WCDMA BAND I and VIII RX Signal PATHD1. WCDMA 2100 RX PATH
E1. W900 RX PATHF1. COMMON TX/RX PATH
89P
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4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
WCDMA BAND I and VIII TX Signal PATHD1. WCDMA 2100 TX PATH
E1. W900 TX PATHF1. COMMON TX/RX PATH
90P
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4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
GPS Signal PATHF. GPS Rx PATH
91P
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4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
4.3 Checking TCXO BlockThe output frequency (19.2MHz) of TCXO (X200) is used as the reference one of RTR6285 and PM7540 internal VCO
Schematic of the Crystal Part (19.2MHz)
100
R207
100p
C20933
R210
1nC212
TG-5010LH_19_2M_75AX200
19.2MHz
32
41VCONT VCC
GND OUT10n
C213
1n
C214
VREG_TCXO_2.85V
VREG_MSMA_2.6V
C215 100p
0.1u
C216
100K
R213
0.1u
C219
NC7SV00P5X_NL
U202
3
2
4
15
VCC
GND
TCXO_RTR_19.2MHZ
TCXO_PM_19.2MHZ
RTR_TRK_LO_ADJ
TCXO_EN
USBH_SYSCLK
1.0T
TCXO Circuit
Clesed to TCXO
TP2
TP�
TP1
5.Trouble Shooting (RF)
4.3 Checking TCXO Block
The output frequency (19.2MHz) of TCXO (X200) is used as the reference one of RTR6285 and PM7540 internal VCO
Schematic of the Crystal Part (19.2MHz)
TP3
TP2
TP1
TP2
92P
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4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
4.4 Checking FEM Block
ANT_SEL0 ANT_SEL1 ANT_SEL2ANT_SEL3
VREG_SYNTH_2.75V
93P
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4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
Schematic of the Antenna Switch Block
1KR1024
1KR1022
R1025 1K
100pC4
C3DNIDNI
C2
SW1001
G1
G2
ANTG3
15n
L1002
1KR1023
C1019
0.1u
C1043
33p
VREG_SYNTH_2.75V
FL1007
850,1900,2100MHz
65437
11
9
22
21
20
1324
1223
10
158
141
17
162
19
18PCS_RX1
PCS_RX2
ANT PCN_RX1
PCN_RX2
GND1 EGSM_RX1
GND2 EGSM_RX2
GND3
GND4 GSM850_RX1
GND5 GSM850_RX2
WCDMA_2100
WCDMA_850
WCDMA_1900
PCN_PCS_TX
GSM850_EGSM_TX
DD
V
1LRT
C
2LRT
C
3LRT
C
4LRT
C
SW1002
G4G3INOUT G1G2
68pC1080
ANT_SEL3ANT_SEL2ANT_SEL1ANT_SEL0
TP1
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4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
Checking Switch Block Power Source
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4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
4.5 Checking WCDMA Block
1. Check TCXO 19.2 MHz
START
2. Check FEM BlockRefer to 4.4
3. Check RF Tx Level
4. Check PAM BlockRefer to 4. 5. 4
5. Check RF Level
6. Re-download SW & Cal.
Refer to 4. 5. 3
96P
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4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
4.5.1 Checking TCXO Blockrefer to 4.3
4.5.2 Checking FEM Blockrefer to 4.4
4.5.3 Checking RF TX Level
Test Point (TX Level)
TP2
TP4
TP3
TP1
97P
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4. TROUBLE SHOOTING
C1022
0.5p
27p
8601C
C1057 100p
DNI
C1003
0501C 33p
3.9nL1020
C1038
0.5p C1104 DNI
C10141n
12n
L1021C10211n
3.9nL1017
0.75p
C1009
U1002
5 1
8 7
9 6
10 5
11 4
12 3
13 2
14 1RFIN_LOWRFOUT_LOW
VMODEGND3
VBPVCC2
VCC1GND2
VEN_LOWRFOUT_HI
VEN_HIGND1
RFIN_HICPL DN
GP
4.7n
L1024
0.5p
C1063
C1056 68p
C103522p
FL1002
897.5 MHz,942.5 MHz
95
8
4 72
3
61
RX1ANT
TXGND1
GND4GND2
RX2
GND3 GND6
L1022
12n
0101R
91
C1046100p
FL1003
1950MHz,2140MHz
75
84
92
3
16ANT RX
TX
GND1 GND6GND2 GND5GND3 GND4
C1039 4.7p
100pC1066
6101R
91
1.2n
L1003
18n
L1019
2.7nL1023
FL1005
1950MHz
5 3 2
4 1INOUT G1G2G3
5201L 1.2n
82
R1020
L1014
10n
+VPWR
FL1006
897.5MHz
5 3 2
4 1INOUT G1G2G3
68pC1028
C1101
4.7u
1 901C 3.3p
22p
C1112
GND
590 1C 3.3p
1.5nL1018
W_PA_R0
W_2100_PA_ON
W_PA_R1
W_900_PA_ON
WCDMA_900_TX_OUT
RX_WCDMA_2100
RX_WCDMA_900_M
PDET_IN
RX_WCDMA_900_P
WCDMA_2100_TX_OUT
SFSY0035101
W900 RX(925 - 960 MHz)
BAND1(2520):SAYP1G95AA0B00
SDMY0002801
Band 1
W900 TX(880 - 915 MHz)
BAND5 : B9425 ( SFSY0036501)
BAND 5/8
BAND2 : B9640 (SFSY0036601)
BAND8(2520) : B7953 (SDMY0002801)
SFSY0036501
BAND8 : B9442 (SFSY0037601)
BAND1 : B9414 (SFSY0035101)
SDMY0001901
BAND2(2520) : ACMD-7407
Band 8
BAND 1/2
W2100 TX(1920 - 1980 MHz)
5.Trouble Shooting (RF)
For testing, Max power output is needed.
1KR1024
1KR1022
R1025 1K
100pC4
C3DNIDNI
C2
SW1001
G1
G2
ANTG3
15n
L1002
1KR1023
C1019
0.1u
C1043
33p
VREG_SYNTH_2.75V
FL1007
850,1900,2100MHz
65437
11
9
22
21
20
1324
1223
10
158
141
17
162
19
18PCS_RX1
PCS_RX2
ANT PCN_RX1
PCN_RX2
GND1 EGSM_RX1
GND2 EGSM_RX2
GND3
GND4 GSM850_RX1
GND5 GSM850_RX2
WCDMA_2100
WCDMA_850
WCDMA_1900
PCN_PCS_TX
GSM850_EGSM_TX
DD
V
1LRT
C
2LRT
C
3LRT
C
4LRT
C
SW1002
G4G3INOUT G1G2
68pC1080
ANT_SEL3ANT_SEL2ANT_SEL1ANT_SEL0
TP1
TP2
TP�
TP4
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4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
Check TP 1Over 21 dBm ?
No
Check TP 2Over 21 dBm ?
No
Check TP 3Over 21 dBm ?
No
Check TP 4Over 8 dBm ?
No
Check ANT_SEL 0, 1, 2, 3
Check PAM BlockRefer to 4.5.4
Yes RF Tx Level is OK
Yes Check TX Module
Yes Check Duplexer
Yes Check RTR 6285
RTR 6285 Maximum output Power = 7 dBmRTR 6285 minimum output Power = -80 dBmPAM (ACPM 5281) = Maximum input Power = 8 dBm(High Power Mode ), 5 dBm( Low Power Mode )
WCDMA Band I : Low, High, Low, HighWCDMA Band VIII : Low, Low, High, High
99P
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4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
4.5.4 Checking PAM Block
PAM control signalW2100_PA_ON, W900_PA_ON : PAM EnableW_PA_RO : PAM Gain ControlW_PA_R1 must be LOW (under 2.6V) : Use 2 stage gainPAM Enable must be HIGH (over 2.6V)
PAM IN/OUT Signal :When PAM is under the operation of high power mode (W_PA_R0 :Low),PAM OUT power must be over 21 dBmPAM IN power must be under 8 dBm
TP2
TP3
TP1
100P
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4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
Check TP3Over 21 dBm ?
No
Check TP2W_PA_R0 ? 2.6 V
No
Check TP1Over 8 dBm?
No
Set the phone Tx is ON andPDM is 210
Yes RF Tx Level is OK
Yes Check MSM7227
Yes Check RTR6285
Change the board
C1022
0.5p
C1057 100p
DNI
C1003
C10141n
12n
L1021C10211n
0.75p
C1009
U1002
5 1
8 7
9 6
10 5
11 4
12 3
13 2
14 1RFIN_LOWRFOUT_LOW
VMODEGND3
VBPVCC2
VCC1GND2
VEN_LOWRFOUT_HI
VEN_HIGND1
RFIN_HICPL DN
GP
4.7n
L1024
C1056 68p
C103522p
L1022
12n
0101R
91
C1046100p
C1039 4.7p
100pC1066
6101R
91
2.7nL1023
FL1005
1950MHz
5 3 2
4 1INOUT G1G2G3
5201L 1.2n
82
R1020
+VPWR
FL1006
897.5MHz
5 3 2
4 1INOUT G1G2G3
68pC1028
C1101
4.7u
22p
C1112
GND
W_PA_R0
W_2100_PA_ON
W_PA_R1
W_900_PA_ON
WCDMA_900_TX_OUT
PDET_IN
WCDMA_2100_TX_OUT
SFSY0035101
BAND5 : B9425 ( SFSY0036501)
BAND 5/8
BAND2 : B9640 (SFSY0036601)
SFSY0036501
BAND8 : B9442 (SFSY0037601)
BAND1 : B9414 (SFSY0035101)
TP�
TP2
TP1
- 102 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
4.5.5 Checking RF Rx Level
Test Point (RF Rx Level)
TP2
TP4
TP3
TP1
Bias
102P
- 10� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
1KR1024
1KR1022
R1025 1K
100pC4
C3DNIDNI
C2
SW1001
G1
G2
ANTG3
15n
L1002
1KR1023
C1019
0.1u
C1043
33p
VREG_SYNTH_2.75V
FL1007
850,1900,2100MHz
65437
11
9
22
21
20
1324
1223
10
158
141
17
162
19
18PCS_RX1
PCS_RX2
ANT PCN_RX1
PCN_RX2
GND1 EGSM_RX1
GND2 EGSM_RX2
GND3
GND4 GSM850_RX1
GND5 GSM850_RX2
WCDMA_2100
WCDMA_850
WCDMA_1900
PCN_PCS_TX
GSM850_EGSM_TX
DD
V
1LRT
C
2LRT
C
3LRT
C
4LRT
C
SW1002
G4G3INOUT G1G2
68pC1080
ANT_SEL3ANT_SEL2ANT_SEL1ANT_SEL0
TP1
- 104 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
27p
8601C
0501C 33p
3.9nL1020
C1038
0.5p C1104 DNI
3.9nL1017
0.5p
C1063
FL1002
897.5 MHz,942.5 MHz
95
8
4 72
3
61
RX1ANT
TXGND1
GND4GND2
RX2
GND3 GND6
FL1003
1950MHz,2140MHz
75
84
92
3
16ANT RX
TX
GND1 GND6GND2 GND5GND3 GND4
1.2n
L1003
18n
L1019
L1014
10n
1901C 3.3p
5901C 3.3p
1.5nL1018
RX_WCDMA_2100
RX_WCDMA_900_M
RX_WCDMA_900_P
W900 RX(925 - 960 MHz)
BAND1(2520):SAYP1G95AA0B00
SDMY0002801
Band 1
W900 TX(880 - 915 MHz)
BAND8(2520) : B7953 (SDMY0002801)
SDMY0001901
BAND2(2520) : ACMD-7407
Band 8
BAND 1/2
W2100 TX(1920 - 1980 MHz)
TP2
1.8pC1010
VREG_SMPS_2.1V
L10062.2n
L1004 1.2n
1K
R1009C1048100p
L10073.6n
C10640.1u
2140MHz
FL1004
52
4
31IN OUT
_OUTG1 G3
1.8pC1086
C1111DNI
RX_WCDMA_2100_LNA_OUT
WB2100_MIX_INP
WB2100_MIX_INM
W2100 RX(2110 - 2170 MHz)
W2100 RX(2110 - 2170 MHz)BAND1: SFSY0035001
WCDMA RX 2100 LNA Circuit
BAND1 : B9411 (SFSY0035001)BAND2 : B9419 (SFSY0034901)
TP�
Bias
TP4
- 105 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
Check bias block soldering
Set the Phone Rx is ON
Check BIAS over2.1 V ?
Change the board
No
Check TP 1Signal exist ?
Check RF Switch (M /S)
Check TP 2Signal exist ?
Check FEM ModuleRefer 4.4
Check TP 3Signal exist ? Check Duplexer
Yes
Yes
Yes
No
No
No
Check TP 4Signal exist ?
Check RTR 6285 andRx SAW filter
Yes
No
Yes
105P
- 106 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
4.6 Checking GSM Block
1. Check TCXO Block
2. Check FEM
3. Check RF TRX Level
4. Re-download SW & Cal.
Start
5.Trouble Shooting (RF)
4.6 Checking GSM Block
1. Check TCXO Block
2. Check FEM
3. Check RF TRX Level
4. Re-download SW & Cal.
Start
- 107 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
4.6.1 Checking TCXO Blockrefer to 4.3
4.6.2 Checking FEM Blockrefer to 4.4
4.6.3.1 Checking RF TX Level
TP2
TP3TP1
107P
- 108 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
1KR1024
1KR1022
R1025 1K
100pC4
C3DNIDNI
C2
2.2n
L1012
3.9p
C1055
3.9pC1029
SW1001
G1
G2
ANTG3
3001R
180
15n
L1002
1KR1023
C101139p
C1012 2.7p
C1019
0.1u
3.6n
L1009
7001R
120
2.7pC1037
51pC1041
DNI
C1042
C1043
33p
R1011
51
C1044DNI
U1004
23 22
24 21
25 20
26 19
27 18
28 17
9 8
10 7
11 6
12 5
13 4
14 3
15 2
16 1DCS_PCS_INDCS_PCS_OUT
BSGND6
TX_ENGND5
VBATTVCC_OUT
VAPCGND4
NCGND3
GND1GND2
GSM_INGSM_OUT
PGND1PGND12
PGND2PGND11
PGND3PGND10
PGND4PGND9
PGND5PGND8
PGND6PGND7
2.2n
L1013
15pC1100
2.2pC1051
VREG_SYNTH_2.75V
L1026
15n
L1011
15n
C106210u
5101R
120
7101R
180
R1018
2.2K
L1008
15n
2.7n
L1010
+VPWR
C1093 4.7p
2.2pC1094
30
R1021
12n
L1015
FL1007
850,1900,2100MHz
65437
11
9
22
21
20
1324
1223
10
158
141
17
162
19
18PCS_RX1
PCS_RX2
ANT PCN_RX1
PCN_RX2
GND1 EGSM_RX1
GND2 EGSM_RX2
GND3
GND4 GSM850_RX1
GND5 GSM850_RX2
WCDMA_2100
WCDMA_850
WCDMA_1900
PCN_PCS_TX
GSM850_EGSM_TX
DD
V
1LRT
C
2LRT
C
3LRT
C
4LRT
C
SW1002
G4G3INOUT G1G2
68pC1080
ANT_SEL3
GSM_PA_RAMP
GSM_PA_BANDGSM_PA_EN
ANT_SEL2ANT_SEL1
RX_PCS_P
RX_PCS_M
RX_DCS_P
RX_DCS_M
RX_GSM_900_P
RX_GSM_900_M
RX_GSM_850_P
RX_GSM_850_M
DCS_PCS_TX
GSM_TX
ANT_SEL0
PCS1900(1850-1910 MHz)LOW
2mm
HIGH
HIGH
LOW HIGH
HIGH
LOWLOW
LOW
LOW
HIGH
LOW
GSM(925-960 MHz)
HIGH5dB
LOW
LOW
HIGH
LOW
LOW
LOW
LOW
LOW LOW
LOW
ANTENNA SWITCH MODULE LOGIC
DCS/PCS TX
HIGH
GSM900(880-915 MHz)
LOW
ANT_SEL0 ANT_SEL2
PCS(1930-1990 MHz)
LOW
WCDMA 2100 (UMTS2)
LOW
GSM850/EGSM TX HIGH
DCS1800 RX
WCDMA 900 (UMTS1)
GSM850 RX
HIGH
HIGH
GSM850(824-849 MHz)
DCS1800(1710-1785 MHz)
LOW
LOW
ANT_SEL3
GSM(869-894 MHz)
ANT_SEL1
DCS(1805-1880 MHz)
EGSM RX
PCS1900 RX
SMPY0019101
8dB
TP1
TP�
5.Trouble Shooting (RF)
Schematic of GSM850/GSM900/DCS/PCS TX Block
TP2
- 109 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
Check TP 1If EGSM /GSM 850 over 31 dBm ?
If DCS /PCS over 28 dBm ?
Check soldering andcomponents
Start
Check TCXO BlockRefer to 4.3
No
Check TP 2, 3If EGSM /GSM 850(TP 2) under 6
dBm ?If DCS /PCS (TP 3) under 6 dBm ?
No
Change the board
Yes
EGSM /DCS /PCS /GSM 850Tx is OK
Check other part
Check FEM Block(EDGE PAM )
Refer to 4.4Yes
Check RTR & PAD
No Problem
No
Still exist Problem
For testing , Max power output is needed
109P
- 110 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
4.6.3.2 Checking RF RX Level
TP2
TP1
110P
- 111 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
Schematic of GSM850/GSM900/DCS/PCS RX Block
1KR1024
1KR1022
R1025 1K
2.2n
L1012
3.9p
C1055
3.9pC1029
15n
L1002
1KR1023
C1012 2.7p
C1019
0.1u
3.6n
L1009
2.7pC1037
C1043
33p
2.2n
L1013
2.2pC1051
L1011
15n
L1008
15n
2.7n
L1010
2.2pC1094
FL1007
850,1900,2100MHz
65437
11
9
22
21
20
1324
1223
10
158
141
17
162
19
18PCS_RX1
PCS_RX2
ANT PCN_RX1
PCN_RX2
GND1 EGSM_RX1
GND2 EGSM_RX2
GND3
GND4 GSM850_RX1
GND5 GSM850_RX2
WCDMA_2100
WCDMA_850
WCDMA_1900
PCN_PCS_TX
GSM850_EGSM_TX
DD
V
1LRT
C
2LRT
C
3LRT
C
4LRT
C
SW1002
G4G3INOUT G1G2
68pC1080
RX_PCS_P
RX_PCS_M
RX_DCS_P
RX_DCS_M
RX_GSM_900_P
RX_GSM_900_M
RX_GSM_850_P
RX_GSM_850_M
GSM(925-960 MHz)
PCS(1930-1990 MHz)
GSM(869-894 MHz)
DCS(1805-1880 MHz)
TP1
TP2
- 112 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
Set the Phone Rx is ON
Check TP 1Signal exist ?
Check RF Switch ( Mobile Switch)
Yes
No
Check TP 2Signal exist ?
Check FEM BlockRefer 4.4
No
Yes
Change the Board
112P
- 11� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
4.7 GPS/WIFI/BT/FM Radio RF components
RF component (GPS)
Reference Description
ANT1001 ANTENNA PAD
ANT1002 GND PAD
FL1001 GPS SAW FILTER
U1001 GPS LNA
FL1001
U1001
ANT1001
ANT1002
113P
5.Trouble Shooting (RF)
4.7 GPS/WIFI/BT/FM Radio RF components
RF component (GPS)
Reference Description
ANT1001 ANTENNA PAD
ANT1002 GND PAD
FL1001 GPS SAW FILTER
U1001 GPS LNA
- 114 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
RF component (WiFi / BT /FM Radio)
Reference Description
ANT600 ANTENNA(chip Antenna)
U600 Wifi/BT/FM Combo Chip
U600
ANT600
114P
- 115 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
4.8 GPS/WIFI/BT/FM Radio SIGNAL PATH
RF component (GPS)
WIFI/BT SIGNAL PATH FM Radio SIGNAL PATH
- 116 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
4.9 GPS/WIFI/BT/FM Radio TROUBLE SHOOTING
4.9.1 A-GPS Block
Schematic of A-GPS Block
TP2
TP1
116P
ANT1001
ANTPAD_GD880
FEED
3.9n
L1005
C1015DNI
U1001
3
2
5
4
1NI
_FR
FIL_OUT
VDD
S_D
GND
6.8nL1001
C1004
DNI
33pC1034
FL1001
1575.42MHz
5 3 2
4 1OUTIN G1G2G3
10KR1014
VREG_RF_2.7V
100pC1103
C1106DNI
DNI
C1108
C1109 3.9p
12
R1026
ANT1002
ANTPAD_GD880
FEED
GPS_LNA_EN GPS_IN
SMZY0016501
TP2
TP1
- 117 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
Set the Phone GPS is ON
Change the board
Check TP1About 2.7V ?
Check power LRC filter soldering
Check TP2About 2.6V ?
Check SW and NV item
Yes
Yes
No
No
- 118 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
4.9.2 WIFI/BT/FM Radio Block
- 119 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
4.9.2.1 WIFI/BT/FM Radio Module Part
Schematic of WIFI/BT Module
U600
0 392827 262524 23222120 291817161
31
3215
14
33
3413
3512
3611
3710
389
398
407
6
415
4
42
433
442
45
1
647484940515253 54 51
DN
G
2D
NG
3D
NG
4D
NG
B_E
KA
W_TS
OH_L
W
DXT_T
RA
U_TB
N_ST
C_TR
AU_T
B
N_ST
R_TR
AU_T
B
DX
R_TR
AU_T
B
ANT
BT_PCM_CLK
GND5 BT_PCM_OUT
VDD_WL_PA BT_PCM_SYNC
BT_PCM_IN
SDIO_CMD
SDIO_CLK VDD_BT_PA
SDIO_D3
SDIO_D2 S_CLK_IN
SDIO_D1 GND6
SDIO_D0 FM_ANT
WL_RST_N BT_GPIO_0
WL_WAKE_B BT_GPIO_1
REG_ON BT_GPIO_3
VBAT_IN BT_GPIO_4
BT_GPIO_7
SR_VLX1
SR_VLX1BB F_CLK_IN
F_CLK_OUT
BB2
XLV_
RS
BBT
UO
V_R
S
OID
DV
UP_L
ATX
DS _
OID
DV
TU
O_2P 1_
GID
TU
O_2P1_
GLN
A
ODL
V2P1_
NIV
TU
O_2O
DLNL
AD
S_ TB
LC
S_TB
1OI
DU
A
2OI
DU
A
N_TS
R_TB
7D
NG
L6014.7n
p5.1
426C
C604
0.5p
ANT600
SDBTPTR3015
2
31
4DUMMY3
FEED DUMMY2
DUMMY1
600
FB600
1u
C621C6208p
VREG_MSMP_2.6V
C606 820p
DNI
C603
C605 100p
1nC622
1u
C601
VDD_TCXO
2.2uFC619
+VPWR
C600
1u
VDD_TCXO
R605
100K
26MHz
X600TG-5010LH-87N
4 2
3 1NCOUT
GNDVCC
U601
5
3 24 1
VOUTVDDGNDCE D
NG
P
706C
u1 u18 06
C
u1906
C
016C
FU1.0
F u7.41 16
C
F u2.2206
C
C6120.1UF
C6130.1UF
4.7uL600
4.7uFC615 3.3uL610
C6160.1UF
C6174.7uF
0
R600
0.1u
C625C618
10uF
10u
C614
TP602
+VPWR
VREG_MSMP_2.6V
VREG_MSMP_2.6V
N_TE
SE
R_TB
WLAN_RESET_NBT_HOST_WAKEUP
WLAN_CMDWLAN_CLK
WLAN_SDIO[1]WLAN_SDIO[2]WLAN_SDIO[3]
WLAN_SDIO[0]
BT_PCM_DOUT
BT_PCM_DINBT_PCM_SYNC
BT_PCM_CLK
BT_UART1_CTS
SLEEP_CLK
BT_WAKEUP
R_O
IDU
A_M
F
WLAN_HOST_WAKEUP
FM_ANT
L_OI
DUA
_M
F
BT_UART1_TXD
BT_UART1_RXD
QE
R_KL
C
CLK_REQ
ANT_WLAN_BT
ANT_WLAN_BT
REG_ON
CLK_IN
CLK_IN
BT_UART1_RTS
LDO for TCXO26MHz TCXO
close to 3
close to 17
5.Trouble Shooting (RF)
4.9.2.1 WIFI/BT/FM Radio Module Part
Schematic of WIFI/BT Module
- 120 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
Test Point DescQription
Test Point Net Name Description
TP1 +VPWR Power for BT/Wifi BB core and Wifi Power Amp.
TP2 VREG_MSMP_2.6V Power for BT Power Amp (2.6V)
TP3 VREG_MSMP_2.6V Power for host interface (2.6V)
Yes
Yes
TP2TP3
TP1
120P
- 121 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
5.Trouble Shooting (RF)
4.9.2.2 WIFI/BT/FM Radio Main Clock Part
Test Point Description
Test Point Net Name Description
TP1 CLK_REGOn/Off Control external clock source0 : TCXO off1 : TCXO on
TP2 CLK_IN TCXO output clock : 26 MHz
TP2
TP1
121P
1nC622
1u
C601
VDD_TCXO
2.2uFC619
+VPWR
C600
1u
VDD_TCXO
R605
100K
26MHz
X600TG-5010LH-87N
4 2
3 1NCOUT
GNDVCC
U601
5
3 24 1
VOUTVDDGNDCE D
NG
P
CLK_REQ CLK_IN
LDO for TCXO26MHz TCXO
TP1 TP2
- 122 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
4.10 Power ON Troubleshooting
4. Troubleshooting (BB)
Start
Power On sequence of GD880 is : Power key press PM_ON_SW(D302) go to low PM7540 Power Up VMSMC1_1.35V(C408), VMSMC2_1.25V(C420), VMSME_1.8V(C416), VMSMP_2.6V(C410), VMSMA_2.6V(C405), VTCXO_2.85V(C214) power ON Phone booting and PS_HOLD(D400) go to High
Battery voltage. higher than 3.70V(OCV)?
TP1 or TP6 high to low
Change or charging the
Battery
1. Check correctly connectingSub PCB(CN200) connector and
NO
YES
NO
TP1 or TP6 high to lowwhen key press?
TP2, TP3, TP4, TP7, TP8, TP10power up?
Sub_PCB(CN200) connector and main B/d connector(CN500)2. Check correctly working power key
Change the Main board
YES
NO
Is clock ok?TP9 : 19.2MTP5 : 32.768Khz
Change the Main board
YES
YES
NO
NOYES
LCD is turn on? 1. Check correctly connectingSub B/d CN100 and LCD module
NOYES
Change LCD moduleRedownload sw image
*OCV( open circuit voltage)
- 12� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4. Troubleshooting (BB)
TP1: go to low
470
R306
D302
KB300
PM_ON_SW
- 124 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
4. Troubleshooting (BB)
TP10 TP2 TP3 TP4 TP9
TP8
TP5 TP6 TP7
4.7uL403
4.7uL402
L401 4.7u
u2.2644
C
VREG_LCD_1.8V
C445
1u
VREG_RGB_1.5V
L400 4.7u
2.2uC442
10u
C441
CM315_12_5PF
X40032.768KHz 2
1
0.1uC440
VREG_MSME_1.8V
C4382.2u
VREG_SYNTH_2.75V
VREG_RF_2.7V
E10
F10
C12
M12
K7
N13
M13
G10
D9
H12
C13
A13
A12
G12
G1
M1
D13
E12
N11
A3
A10
A8
H13
G13
A11
K13
E13
B13
A9
N12
J13
A2
M4
N4
M9
N10
M6
N6
M8
N8
J1
K1VSW_5V
VREG_5V
VSW_MSMC1
VREG_MSMC1
VSW_MSMC2
VREG_MSMC2
VSW_MSME
VREG_MSME
VSW_PA
VREG_PA
VREG_GP1
VREG_GP2
VREG_GP3
VREG_GP4
VREF_GP5
VREG_GP6
VREG_MMC
VREG_MSMA
VREG_MSME2
VREG_MSMP
VREG_RFRX1
VREG_RFRX2
VREG_RFTX
VREG_RUIM1
VREG_SYNT
VREG_TCXO
VREG_USB
VREG_WLAN
MIC_BIAS
REF_ISET
REG_GND
REF_BYP
TCXO_IN
TCXO_EN
TCXO_OUT
XTAL_IN
XTAL_OUT
SLEEP_CLK
AMUX_OUT
KPD_PWR_N
PON_RESET_N
PS_HOLD
R409 121K
KDS114E
D400
22pC435
VREG_TCXO_2.85V
51R406
C431
1n
2.2uC430
22pC429
2.2uC428
1n
C427
2.2uC425
VREG_MSMC1_1.35V
VREG_MMC_3.0V
200K
R404
C424
1n
VREG_RUIM_3.0V
C420
4.7u
C4192.2u2.2u
C418
VREG_MSMA_2.6V
10u
C416
C4152.2u
VREG_MSMC2_1.25V
VREG_SMPS_2.1V
C412
1n
C411
1u
VREG_MSMP_2.6V
4.7uC410
4.7u
C408
2.2uC407
VREG_MOTOR_3.0V
C4054.7u
C402
33p
VREG_AUX2_2.9V
VREG_RGB_2.6VVREG_LCD_2.8V
TP403
TP
2.2uC460
VREG_SENSOR_2.6V
SLEEP_CLK
JTAG_PS_HOLD
TCXO_PM_19.2MHZ
PS_HOLD
AMUX_OUT
PMIC_TCXO
nPON_RST
TCXO_EN
VSNS_MSMC2_1.25V
VSNS_MSME_1.8V
VSNS_MSMC1_1.25V
PM_ON_SW
0.3mm
Place crystal and load caps close to PM7540
1%
Local Ground PlanPlace in PM7540 room at shield edge
0.5mm
0.5mm
These CAPs close to inductors
0.5mm
Route together
TP7
100
R207
100p
C20933
R210
1nC212
TG-5010LH_19_2M_75AX200
19.2MHz
32
41VCONT VCC
GND OUT10n
C213
1n
C214
VREG_TCXO_2.85V
VREG_MSMA_2.6V
C215 100p
0.1u
C216
100K
R213
0.1u
C219
NC7SV00P5X_NL
U202
3
2
4
15
VCC
GND
TCXO_RTR_19.2MHZ
TCXO_PM_19.2MHZ
RTR_TRK_LO_ADJ
TCXO_EN
USBH_SYSCLK
1.0T
TCXO Circuit
Clesed to TCXO
TP2TP�
TP10
TP4
TP6
TP5
TP8
TP9
- 125 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4. Troubleshooting (BB)
PM7540 Power sequence
- 126 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
4.11 Charger Troubleshooting
Charging Procedure- Connect TA or u-USB Cable- Control the charging current by PM7540 IC- Charging current flows into the battery
Check Point- Connection of TA or USB Cable- Charging current path(NUS5530)- Battery
Troubleshooting Setup- Connect TA and battery to the phone
Troubleshooting Procedure- Check the charger (TA or USB Cable) connector- Check the OVP Circuit- Check the charging current Path- Check the battery
4. Troubleshooting (BB)
Charging Current Flow
Main Battery
TA(5.1V)
U404
MAX14528
9 6
5 3
4
8 2
7 1IN1OUT1
IN2OUT2
IC1
OVLOIC2
DN
G
DN
GP
VCHG_VBUS
1uF
NFM21PC105B1A3FL400
4 3
2 1INOUT
G1G2
D401
22p
C444
HSMU-5SB-24DR2
CN400
15
13
11
9
7
5
4
3
2
1
14
12
10
8
6
C457
1u
MAX_DPMAX_DM
USB_ID
uUSB 5pin
Close by uUSB CONN
Close by uUSB CONN
OVPchange circuit at REV B
2mm
2mm
U403 NUS5530MN
5
64
73
82
91
10DRAIN_B
NC1 COLLECTOR_B
COLLECTOR EMITTER
SOURCE BASE
DRAIN NC2
GATE
VCHG_VBUS
VBATT+VPWR
234R
smho
m001
C455
39p 33uFC448
ISNS_M
+VPWRCHG_CTL_N
BATT_FET_N
ISNS_P
Route together from both end of resistor 0.1ohm.
2mm1%
2mm(to the Batt. Conn.)2mm(to the GSM PAM)
TA (5.1V)
MainBattery
- 127 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4. Troubleshooting (BB)
Check the pin and batteryConnect terminals of I/O
Start
connector
Connection OK? Change I/O connectorNO
Is TP1 voltage 4.8V (or 5.0V)?
Change TA (or u-USB Cable)
Yes
NO
Is it charging properlyAfter turning on TP5
END
Yes
Yes
NO
Check TP1 SMT status by X-ray Exchange TP1 or Change the Main boardAnd Retest
Charger Troubleshooting Flow
- 128 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
U401RP103K331D
5
3 24 1
VOUTVDDGNDCE D
NG
P USB_3.3V
1u
C447
+VPWR
4.7uL403
4.7uL402
L401 4.7u
424R
K051
VREG_MSMP_2.6V
u2.2644
C
VREG_MSME_1.8V
R423
1K
VREG_LCD_1.8V
C445
1u
VREG_RGB_1.5V
L400 4.7u
2.2uC442
10u
C441
K 1
834R
1u
C461
+VPWR
CM315_12_5PF
X40032.768KHz 2
1
0.1uC440
VREG_MSME_1.8V
4.7uC439
C4382.2u
VREG_SYNTH_2.75V
VREG_RF_2.7V
M_SN
SI
PM7540U400
9J
8J
7J
6J
5J
9H
8H
7H
6H
5H
9G
8G
7G
6G
5G
9F
8F
7F
6F
5F
9E
8E
7E
6E
5E
H1
E10F1
F10E1
C12N2
B1
M12B2
K7
A5
N13A4
M13B5
B4
G10A7
D9A6
H12B7
B6
C13
A13D10
A12K10
H10
G12J10
G1
M1K4
D13J4
E12H4
N11M2
A3L2
A10H2
A8
H13K2
G13J2
A11G4
K13F4
E13D5
B13B3
A9M5
N12N3
J13N1
A2M3
K6
M4K5
N4K9
M9K8
N10M11
M6L12
N6A1
M8D4
N8B12
J1D8
K1N5
M7
2G
21
D
7D
8B
01
M
6D
9B
21
J
31
F
21
F
21
K
7N
9N
01
B
31
L
11
B
2F
4E
2C
1C
1D
1L
2D
2E
GH
CV
N_L TC _
GH
C
SU
BV_
BS
U
N_LTC_
BS
U
P_S
NSI
M_S
NSI
N_TEF_T
AB
TA
BV
N IO
CV
PU
KC
AB _
V
AN
A_D
DV
E_1C_
DD
V
AP _2
C _D
DV
2P
G_D
DV
6P
G_D
DV
2E
MS
M_D
DV
PM
SM_
DD
V
1FR_
DD
V
2FR_
DD
V
MIU
R _D
DV
RK
PS_L_
DD
V
RK
PS_
R _D
DV
OX
CT_D
DV
NAL
W_D
DV
MPP_1
MPP_2 VSW_5V
MPP_3 VREG_5V
MPP_4 VSW_MSMC1
MPP_5 VREG_MSMC1
MPP_6 VSW_MSMC2
MPP_7 VREG_MSMC2
MPP_8 VSW_MSME
MPP_9 VREG_MSME
MPP_10 VSW_PA
MPP_11 VREG_PA
MPP_12
MPP_13 VREG_GP1
MPP_14 VREG_GP2
MPP_15 VREG_GP3
MPP_16 VREG_GP4
MPP_17 VREF_GP5
MPP_18 VREG_GP6
MPP_19 VREG_MMC
MPP_20 VREG_MSMA
MPP_21 VREG_MSME2
MPP_22 VREG_MSMP
VREG_RFRX1
USB_ID VREG_RFRX2
USB_D_P VREG_RFTX
USB_D_M VREG_RUIM1
USB_OE_N VREG_SYNT
USB_DAT VREG_TCXO
USB_SE0 VREG_USB
VREG_WLAN
SBST MIC_BIAS
SBCK
SBDT_SSBI REF_ISET
MSM_INT_N REG_GND
REF_BYP
SPKR_IN_L_M
SPKR_IN_L_P TCXO_IN
SPKR_OUT_L_M TCXO_EN
SPKR_OUT_L_P TCXO_OUT
SPKR_IN_R_P
SPKR_IN_R_M XTAL_IN
SPKR_OUT_R_P XTAL_OUT
SPKR_OUT_R_M
SLEEP_CLK
VIDEO_IN AMUX_OUT
VIDEO_OUT
VIB_DRV_N KPD_PWR_N
KPD_DRV_N PON_RESET_N
LCD_DRV_N PS_HOLD
FLSH_DRV_N
1D
NG
2D
NG
3D
NG
4D
NG
5D
NG
6D
NG
7D
NG
8D
NG
9D
NG
01D
NG
11D
NG
21D
NG
3 1D
NG
41D
NG
51D
NG
61D
NG
7 1D
NG
81D
NG
91D
NG
02D
NG
1 2D
NG
22D
NG
32D
NG
42D
NG
52D
NG
R409 121K
KDS114E
D400
C437 0.1u
1nC436
22pC435
VREG_TCXO_2.85V
0.1uC434
C433 0.1u
10K
R407
0.1u
C432
51R406
C431
1n
2.2uC430
22pC429
2.2uC428
1n
C427
C426
33p
2.2uC425
VBATT
VREG_MSMC1_1.35V
VREG_MMC_3.0V
VCHG_VBUS
200K
R404
C424
1n
VREG_MSMP_2.6V
1nC423
C422 0.1u
VREG_RUIM_3.0V
C4212.2u
C420
4.7u
C4192.2u2.2u
C418
C417 0.1u
VREG_MSMA_2.6V
10u
C416
C4152.2u
VREG_MSMC2_1.25V
VREG_SMPS_2.1V
C414 0.1u
C413 0.1u
C412
1n
C411
1u
VREG_MSMP_2.6V
4.7uC410
0.1uC409
R403
4.7
4.7u
C408
2.2uC407
VREG_MOTOR_3.0V
TP400
C406 0.1u
C4054.7u
C404 0.1u
C403 0.1u
C402
33p
4.7uC401
C400 0.1u
VREG_AUX2_2.9V
VREG_RGB_2.6VVREG_LCD_2.8V
47K
R437
934R
K01
TP403
TP
2.2uC460
VREG_SENSOR_2.6V
TP404
K0 03
524R
RW
PV+
SLEEP_CLK
REMOTE_PWR_ON
JTAG_PS_HOLD
TCXO_PM_19.2MHZ
MSM_USIM_DATA
MSM_USIM_RST
MSM_USIM_CLK
PS_HOLD
PM_INT_N
GSM_PA_DAC_REF
AMUX_OUT
PMIC_TCXO
nPON_RST
TCXO_EN
PMIC_SSBI
VSNS_MSMC2_1.25V
VSNS_MSME_1.8V
VSNS_MSMC1_1.25V
PU_
KC
AB
V
USIM_DATA
USIM_RST
USIM_CLK
PM_ON_SW
USB_LDO_EN
USB_LDO_EN
PCB_REVISION
PCB_REVISION
N_LTC_
GH
C
N_TEF_TT
AB
P _S
NSI
VBAT_TEMP
VBAT_SENSE
1.30V
C432 close to MSM
USB 3.3V LDO
150K
150K
150K
ADC
150K
TEST&E
150K
0.3mm
R2
2.13V
10K
68K
47K
150K
150K
Place crystal and load caps close to PM7540
REV
1.93V
C&H
B&G
1%
Local Ground Plan
PM7540
Place in PM7540 room at shield edge
A&F
Rev.1.1
150K
150K
PCB Revision Check ADC
Route together
0.16V
Rev.1.0
D&I
0.5mm
Rev.1.2 680K
0.81V
0.5mm
These CAPs close to inductors100K
1.73V
0.62V
300K
R1
0.5mm
1.04V
430K
Route together
Place close to PM7540 pins
U403 NUS5530MN
5
64
73
82
91
10DRAIN_B
NC1 COLLECTOR_B
COLLECTOR EMITTER
SOURCE BASE
DRAIN NC2
GATE
VCHG_VBUS
VBATT+VPWR
234R
smho
m001
C455
39p 33uFC448
ISNS_M
+VPWRCHG_CTL_N
BATT_FET_N
ISNS_P
Route together from both end of resistor 0.1ohm.
2mm1%
2mm(to the Batt. Conn.)2mm(to the GSM PAM)
U404
MAX14528
9 6
5 3
4
8 2
7 1IN1OUT1
IN2OUT2
IC1
OVLOIC2
DN
G
DN
GP
VCHG_VBUS
1uF
NFM21PC105B1A3FL400
4 3
2 1INOUT
G1G2
D401
22p
C444
HSMU-5SB-24DR2
CN400
15
13
11
9
7
5
4
3
2
1
14
12
10
8
6
C457
1u
MAX_DPMAX_DM
USB_ID
uUSB 5pin
Close by uUSB CONN
Close by uUSB CONN
OVPchange circuit at REV B
2mm
2mm
TP�
TP2
TP1
- 129 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4. Troubleshooting (BB)
TP2
TP3
TP1
- 1�0 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
4. Trouble Shooting (BB)
USB Initial sequence of GD880 is : USB connected to GD880 VCHG_VBUS(FL400) go to 5V
VERG_MSME_1.8V is about 1.8V USB_CLK is OK(R210)->USB work
4.12 USB trouble
Start
VCHG_VBUS is aboutto 5V?
TP4 CLK is OK?
Change the Main board
Check TP2
Check TP3
NO
YES
YES
NO
Cable is insert?
YES
Cable insertNO
YES
NOTP5,TP6 signal is out? Check TP1
130 P
- 1�1 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
U404
MAX14528
9 6
5 3
4
8 2
7 1IN1OUT1
IN2OUT2
IC1
OVLOIC2
DN
G
DN
GP
VCHG_VBUS
1uF
NFM21PC105B1A3FL400
4 3
2 1INOUT
G1G2
D401
22p
C444
HSMU-5SB-24DR2
CN400
15
13
11
9
7
5
4
3
2
1
14
12
10
8
6
C457
1u
MAX_DPMAX_DM
USB_ID
uUSB 5pin
Close by uUSB CONN
Close by uUSB CONN
OVPchange circuit at REV B
2mm
2mmTP2
100
R207
100p
C20933
R210
1nC212
TG-5010LH_19_2M_75AX200
19.2MHz
32
41VCONT VCC
GND OUT10n
C213
1n
C214
VREG_TCXO_2.85V
VREG_MSMA_2.6V
C215 100p
0.1u
C216
100K
R213
0.1u
C219
NC7SV00P5X_NL
U202
3
2
4
15
VCC
GND
TCXO_RTR_19.2MHZ
TCXO_PM_19.2MHZ
RTR_TRK_LO_ADJ
TCXO_EN
USBH_SYSCLK
1.0T
TCXO Circuit
Clesed to TCXO
K7.4
924R
VREG_MSMP_2.6V
824R
K01
C451
1u
0.1u
C450
K7.4
724R
0.1u
C449
VCHG_VBUS
2.2K
R426
+VPWR
U402MAX14526EEWP+TCC6
2B
1C
2C
C3 A2
C4
D3
D1 D4
A1
B1
A3
B4 B3
B5 A5
C5 A4
D5 D2BATVB
DN1COMN1
DP2COMP2
U1UID
U2
RES
MIC
AUD1CAP
AUD2
GND
ISETIC
LC
S
AD
S
TNI
DNI
C459
USBH_DM
USBH_DP
MAX_MUIC_I2C_SCLMAX_MUIC_I2C_SDA
MUIC_SW_INT
UART2_RXDUART2_TXD
MAX_DPMAX_DM
USB_ID
C459 Close to MSM
MAX14526
TP� TP4
TP1TP5
TP6
- 1�2 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
4. Trouble Shooting (BB)
TP1
TP2
TP3
TP4
TP5 TP6
132 P
- 1�� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
Voice Receiver path as below:MSM7227 RCV_N / RCV_P 80PIN CONN RCV pad
Start
Change the Main boardNO
Connect the phone to networkEquipment and setup call
Setup 1KHz tone out
YES
Can you hear the tone?
YES
END
YESChange the Receiver
Hear the tone to the receiver?
NO
END
4. Trouble Shooting (BB)
4.13 Audio trouble
4.13.1 Receiver path
The sine wave appear atTP1
The sine wave appearat TP2?
Check the 80pin Conn.Or Sub PCB.
NO
133 P
Voice Receiver path as below:MSM7227 RCV_N / RCV_P 80PIN CONN RCV pad
Start
Change the Main boardNO
Connect the phone to networkEquipment and setup call
Setup 1KHz tone out
YES
Can you hear the tone?
YES
END
YESChange the Receiver
Hear the tone to the receiver?
NO
END
4. Trouble Shooting (BB)
4.13 Audio trouble
4.13.1 Receiver path
The sine wave appear atTP1
The sine wave appearat TP2?
Check the 80pin Conn.Or Sub PCB.
NO
133 P
CN200
729
738
747
756
765
774
783
792
801
RCV_P
RCV_N
MIC_BIAS
SPK_P
SPK_N
MIC_P
MIC_VGND
22p
C402
CN400
2
1
22p
C411
RCV_P
RCV_N
TP1
TP2
- 1�4 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
4. Trouble Shooting (BB)
TP2
TP1
134 P
- 1�5 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
Voice path for Head_Set as below:MSM7227 HPH_R,HPH_L C507,C508 IC500(Audio Subsystem) FB502,FB503 3.5pi Ear-jack
4. Trouble Shooting (BB)
4.13.2 Headset path (Voice & Multimedia play)
Start
The sine wave
appear at TP1?Change the Main board
NO
Connect the phone to networkEquipment and setup call
Setup 1KHz tone outAnd insert head_Set
YES
Can you hear the toneor sound?
NO
YESEND
YES
Check the TP5or change SUB PCB
The sine wave appear at TP2,TP3?
Check the TP4NO
YES
Or Play Multimedia ContentsAnd insert head_set
(Or Some Sound Signal)
135 P
1u
125C
22nC509
22nC510
220nC508
220nC507
IC500
D4
C3
B3
B2
C2
C1
D2
D1
A5
A4
5C
1B
3A
SS
V
DD
V
DD
VPC1N
C1P
INA2
INA1
INB2
INB1
BIAS
SDA
SCL
1u
105C
LINE_ONLINE_OP
HPH_LHPH_R
D505
1800FB503
1800FB504
10K105R
22p
C514D501
1800
FB502
J500
C8
100p
47
R508
D502100n
L500
47p
C517
47p
C518 D503
FM_ANT
EAR_SENSEEAR_MICP
EAR_REAR_L
TP1TP4
TP2
TP�
TP5
Audio Subsystem
- 1�6 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
4. Trouble Shooting (BB)
TP1
TP2 TP3
TP4
TP5
136 P
- 1�7 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
Loud speaker path as below:
MSM7227 LINE_OP,ON C509,C510 IC500(Audio Subsystem) 80pin Conn Speaker PAD
Start
The sine wave appear at TP2?
Change the Main boardNO
Connect the phone to networkEquipment and setup callSetup 1KHz tone outSet phone with speaker phone modeor Play the multimedia contents
YES
Check TP1, 80pin Con.Or Change SUB PCB
NO
YES
Can you hear the tone? Change the Speaker ModuleNO
YES
END
The sine wave appear at pads of speaker?
4. Trouble Shooting (BB)
4.13.3 Loud speaker path (voice speaker phone, Multimedia play)
137 P
1u
125C
22nC509
22nC510
220nC508
220nC507
IC500
D4
C3
B3
B2
C2
C1
D2
D1
A5
A4
5C
1B
3A
SS
V
DD
V
DD
VPC1N
C1P
INA2
INA1
INB2
INB1
BIAS
SDA
SCL
1u
105C
LINE_ONLINE_OP
HPH_LHPH_R
TP2
TP1
22p
C40922p
C410
CN401
2
1SPK_P
SPK_N
Audio Subsystem
- 1�8 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
4. Trouble Shooting (BB)
TP2
TP1
138P
- 1�9 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
Can you scoping some sound signal at TP3
Change the TP4NO
YES
YES
make some sound or voice to MIC
Work well? ENDYES
Start
TP1 is 1.8V? Change the Main B’dNO
Make a call
4. Trouble Shooting (BB)
4.13.4 Microphone for main MIC
Can you scoping some sound signal at TP2?
Check 80pin Conn.Or Change the SUB PCB
NO
YES
4.13.4.1 Normal Mode
Main Microphone path as below:MIC1 U400(Analog S/W) 80pin Conn -> C207 MSM7227
139P
TP�
DNI
C1MIC401
4
3
2
1P
G1
G2
O
MIC_BIAS
MIC_1PMIC1_VGND
SMD, TOP
SUMY0010609
+VPWR
0.1u
C400
U400
94
63
52
71
8101B0 1A
1B1 S1
2B0 2A
2B1 S2
GND VCC
MIC_SEL
MIC_PMIC_1P
MIC_2P
MIC1_VGND
MIC2_VGND
MIC_VGND
8H
6F
5F
01
J
01
H
9H
01
C
01
B
9C
9B
8F
8E
7F
7E
7C
7B
6C
5C
6B
5B
PI_
R_
EN
IL
NI
_R
_E
NIL
PI_
L_
EN
IL
NI_
L_
ENI
LP
1CI
MN
1CI
MP
2C
IM
N2
CI
MP
IX
UA
NI
XU
A
PO_
EN
IL
NO
_E
NI
LP
O_1
RA
EN
O_
1RA
ET
UO
XU
AR
_H
PH
L_
HP
H
PMO
CC
SAI
B_
CIM
FE
RV
_H
PH
MIC_BIAS
C201
47p
u1202
C
u1.03 02
C
u1 .040 2
C
502C
u1.0
u1 .060 2
C
u1.0702
C
u18 02
C
C210
0.1u
C21122u
33p
C7
39p
C223
MIC_VGND|GND
DNG
V_C
IM
R_O I
DU
A_MF
L_O I
DU
A_MF
NO_
ENI L
PO_
ENIL
P_V
CR
N_V
CR
L_H
PH
R_H
PH
PCI
M_R
AE
P_CI
M
nip
5E
ot
eso
lC
TP4
TP�
TP1
TP2
- 140 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
4. Trouble Shooting (BB)
TP2
TP1
TP3
TP4
140P
- 141 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
Can you scoping some sound signal at TP3
Change the TP4NO
YES
YES
make some sound or voice to MIC
Work well? ENDYES
Start
TP1 is 1.8V? Change the Main B’dNO
Make a call
4. Trouble Shooting (BB)
Can you scoping some sound signal at TP2?
Check 80pin Conn.Or Change the SUB PCB
NO
YES
4.13.4.2 Speaker phone Mode
Main Microphone path as below:MIC2 U400(Analog S/W) 80pin Conn -> C207 MSM7227
141P
TP�10u
604C
15p
704C
47p
804C
MIC400
4
3
2
1P
G1
G2
O
MIC_BIAS
MIC_2PMIC2_VGND
MIC2_VGND
SUMY0010609SMD, TOP
+VPWR
0.1u
C400
U400
94
63
52
71
8101B0 1A
1B1 S1
2B0 2A
2B1 S2
GND VCC
MIC_SEL
MIC_PMIC_1P
MIC_2P
MIC1_VGND
MIC2_VGND
MIC_VGND
8H
6F
5F
01
J
01
H
9H
01
C
01
B
9C
9B
8F
8E
7F
7E
7C
7B
6C
5C
6B
5B
PI_
R_
EN
IL
NI
_R
_E
NIL
PI_
L_
EN
IL
NI_
L_
ENI
LP
1CI
MN
1CI
MP
2C
IM
N2
CI
MP
IX
UA
NI
XU
A
PO_
EN
IL
NO
_E
NI
LP
O_1
RA
EN
O_
1RA
ET
UO
XU
AR
_H
PH
L_
HP
H
PMO
CC
SAI
B_
CIM
FE
RV
_H
PH
MIC_BIAS
C201
47p
u1202
C
u1.03 02
C
u1 .040 2
C
502C
u1.0
u1 .060 2
C
u1.0702
C
u18 02
C
C210
0.1u
C21122u
33p
C7
39p
C223
MIC_VGND|GND
DNG
V_C
IM
R_O I
DU
A_MF
L_O I
DU
A_MF
NO_
ENI L
PO_
ENIL
P_V
CR
N_V
CR
L_H
PH
R_H
PH
PCI
M_R
AE
P_CI
M
nip
5E
ot
eso
lC
TP4
TP�
TP1
TP2
- 142 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
4. Trouble Shooting (BB)
TP4
TP2
TP1
TP3
142P
- 14� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
MIC for Head_Set path as below:Insert Headset Interrupt which are the signal of Headset detecting arise in EAR_SENSE
MIC BIAS LDO U500’s R506(RES) :1.6V~1.8V(MIC BIAS) MIC signal FB504 C204->MSM7227
Insert Headset& Make a call
Check the TP2 orChange the Main b’d
TP1 is 1.6~1.8V ?YES NO
4. Trouble Shooting (BB)
4.13.5 Microphone for headset
Can you scoping some sound signal at TP4?
Check the 3.5pi Ear-jackOr Change Ear/mic SET
YES
YES
make some sound or voice to MIC
Work well? ENDYES
Can you scoping some sound signal at TP3?
Check TP3 Or Change the Main b’d
NO
NO
YES
Start
143P
1R
2.2K
U500
5
3 24 1
VOUTVDDGNDCE D
NG
P
1800FB504
2.2u
405
C
VREG_MSMP_2.6V
2R
1K
4.7u
C503
EAR_SENSE
HOOK_ADC
HOOK_ADC|EAR_MICP
EAR_MICP
HS_MIC_BIAS_EN
8F
8E
7F
7E
7C
7B
6C
5C
6B
5B
PI_
R_E
NI
LN
I_
R_
EN
IL
PI_L_E
NIL
NI_L_
EN
IL
P1C
IM
N1C
IM
P2C
IM
N2
CI
MPIX
UA
NI
XUA
u1202
C
u1.03 02
C
u1 .040 2
C
502C
u1.0
u1.0702
C
u18 02
C
33p
C7
39p
C223
MIC_VGND|GND
DNG
V_C
IM
R_O I
DU
A_MF
L_O I
DU
A_MF
PCI
M_R
AE
P_CI
M
TP�
TP1
TP2
TP4
- 144 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
4. Trouble Shooting (BB)
TP1
TP2
TP3
TP4
144P
- 145 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
5M camera control signals are generated by MSM7227.
4. Trouble Shooting (BB)
TP1,TP2,TP4 Check
Camera is OK?
Check the camera conn. andreconnect the camera
Camera is OK
Change the camera
Yes
NO
NO
Yes
Change the Sub board
EndYes
End
NO
START
4.14 5M Camera trouble
MSM7227 output signal checkTP3
Yes
NO
Check master clock and pixel clock
Yes
Check the TP5
Yes
No
Change the Filter (FL200,201,202)
NO
145P
- 146 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
10u
C200
33p
C201
CN201
17
16
15
14
13
12
11
10
9
8
7
6
5
314
323
332
341
30
29
28
27
26
25
24
23
22
21
20
19
18
CAM_VDD_1.8V
0.1u
C207
CAM_AF_2.8V
CAM_VDD_2.8V
120
FB200
0.1u
C208
0.1u
C206
CAM_PCLK
CAM_VSYNCCAM_HSYNC
CAM_MCLK
MCAM_RESET
CAM_I2C_SCLCAM_I2C_SDA
S_CAM_DATA[0]S_CAM_DATA[1]S_CAM_DATA[2]S_CAM_DATA[3]S_CAM_DATA[4]S_CAM_DATA[5]S_CAM_DATA[6]S_CAM_DATA[7]S_CAM_DATA[8]S_CAM_DATA[9] MCAM_PWDN
5M CAMERA CON.
7.5pF
FL200
01
5
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
7.5pF
FL201
01
5
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
7.5pF
FL202
01
5
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
CAM_PCLKCAM_HSYNC
CAM_DATA[7]CAM_DATA[6]CAM_DATA[5]CAM_DATA[4]
CAM_DATA[3]CAM_DATA[2]CAM_DATA[1]CAM_DATA[0]S_CAM_DATA[0]
S_CAM_DATA[1]S_CAM_DATA[2]|S_VGA_CAM_DATA[0]S_CAM_DATA[2]
S_CAM_DATA[3]|S_VGA_CAM_DATA[1] S_CAM_DATA[3]
S_CAM_DATA[4]|S_VGA_CAM_DATA[2] S_CAM_DATA[4]S_CAM_DATA[5]|S_VGA_CAM_DATA[3] S_CAM_DATA[5]S_CAM_DATA[6]|S_VGA_CAM_DATA[4] S_CAM_DATA[6]S_CAM_DATA[7]|S_VGA_CAM_DATA[5] S_CAM_DATA[7]
S_CAM_DATA[8]|S_VGA_CAM_DATA[6] S_CAM_DATA[8]S_CAM_DATA[9]|S_VGA_CAM_DATA[7] S_CAM_DATA[9]
CAM_DATA[8]CAM_DATA[9]FLT_CAM_HSYNCFLT_CAM_PCLK
1608
1608
EMI FILTER
TP1TP2
TP�
TP4
TP5
- 147 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4. Trouble Shooting (BB)
TP1
TP2
TP3
TP4
TP5
147P
- 148 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
VGA camera control signals are generated by MSM7227.
4. Trouble Shooting (BB)
TP2, TP3 Check
Camera is OK?
Camera is OK
Change the camera
Yes
NO
NO
Yes
Change the Sub PCB
EndYes
End
NO
START
4.15 VGA Camera trouble
MSM7227 output signal checkTP1
Yes
NO
Check master clock and pixel clock
Yes
NO
- 149 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4. Trouble Shooting (BB)
TP1
TP2
TP3
149P
0.1u
C211
0.1u
C212
60FB201
U200
1F
E3E4
E2A5
C4
A4
D4D6
C3C5
C2D3
C1C6
B4B5
B2
B1
B3
D2E5
D1B6
A3A2IOVDD DCLK
DVDD HSYNC
AVDD VSYNC
DATA0
DATA1
DATA2
EXTCLK DATA3
PWRDWN DATA4
RESET DATA5
SDA DATA6
SCL DATA7
GND1
GND2
VDD15_1 GND3
VDD15_2 GND4DN
GP
0.1u
C209
CAM_VDD_2.8VCAM_VDD_1.8V
D200
CAM_PCLK
CAM_VSYNCCAM_HSYNC
CAM_MCLKVGA_CAM_PWDN
VGA_CAM_RESET_N
CAM_I2C_SCLCAM_I2C_SDA
S_VGA_CAM_DATA[0]S_VGA_CAM_DATA[1]S_VGA_CAM_DATA[2]S_VGA_CAM_DATA[3]S_VGA_CAM_DATA[4]S_VGA_CAM_DATA[5]S_VGA_CAM_DATA[6]S_VGA_CAM_DATA[7]
TP1
TP2
TP�
- 150 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
Main LCD control signals are generated by MSM7227. Those signal’s path are :MSM7227 80-pin Main to SUB connector RGB converter 60-pin LCD connector LCD Module
4. Trouble Shooting (BB)
4.16 Main LCD trouble
The LCD works
START
Press END keyto turn the power on
Is the circuit powered? Follow the Power ONtrouble shooting
LCD display OK?
Check TP1,TP2,TP3
No
Yes
Yes
No
Disconnect and reconnect80-pin & 60-pin B to B
connector
Change the SUB BD
No
End
Yes
Display OK?Yes
NoNoChange the LCD module
NoChange the Main BDYes
Display OK?Yes
150P
- 151 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4. Trouble Shooting (BB)
TP1
TP2
TP3
TP4
151P
100p
C128
0
R100
100201R
100p
C126
15p
C102
VREG_RGB_2.6V
VREG_LCD_1.8V
10nC103
100p
C127
U100
9B
9D
1F
1E
11L
6J
9F
3F
8C
11A
1A
L1B11
K2C10
K1A8
K3
H2E9
L2A9
B10
G10
H10E2
H11E3
G11B8
G3
H3C9
G2
H1D10
J4D11
K4F10
L4F11
J5
L3C2
J1D2
J2C1
K5A7
L5
K6A2
L6A3
J7B2
J8D1
L7C3
K7A4
K9B3
K8B4
L8B5
L9A5
K10C5
L10B6
J10A6
J9C6
J11C7
K11B1
11
C
01
A
01
E
11
E
1G
2F
3J
9H
3D
7B
9G
4C
1D
DV
ER
OC
2D
DV
ER
OC
1D
DV
OIH
2D
DV
OIH
1D
DV
OIP
2D
DV
OIP
DD
VM
AR
D
CC
VM
AR
D
DD
V 81D
M
DD
V51D
M
DD
V LLP
DD
VC
SO
GPIOH0 FPDAT0
GPIOH1 FPDAT1
GPIOH2 FPDAT2
GPIOH3 FPDAT3
GPIOH4 FPDAT4
GPIOH5 FPDAT5
GPIOH6 FPDAT6
GPIOH7 FPDAT7
GPIOH8 FPDAT8
GPIOH9 FPDAT9
GPIOH10 FPDAT10
GPIOH11 FPDAT11
GPIOH12 FPDAT12
GPIOH13 FPDAT13
GPIOH14 FPDAT14
GPIOH15 FPDAT15
FPDAT16
GPIOH16_ADS FPDAT17
GPIOH17_RD_ GPIOP0_FPDAT18
GPIOH18_WR_ GPIOP1_FPDAT19
GPIOH19_CS GPIOP2_FPDAT20
GPIOP3_FPDAT21
MDATA0P GPIOP4_FPDAT22
MDATA0M GPIOP5_FPDAT23
MSTBP GPIOP12
MSTBM GPIOP13
GPIOP14
INT GPIOP15
RESET_
TE FPFRAME
CNF FPLINE
TESTEN FPSHIFT
FPDRDY
PLP
PLPAV FPCS_1
MDREF FPCS_2
FPSCK
CLKI FPAO
OSCI FPSO
OSCO NC
1S
SV
2S
SV
3S
SV
4S
SV
5S
SV
6S
SV
7S
SV
1S
SV
MA
RD
2S
SV
MA
RD
SS
VD
M
SS
VLLP
3.3K
R103
100401R
2.2u
C105
2.2u
C1062.2u
C107
2.2u
C108
2.2u
C109
U102
43
52
61VCC1 VCC
A NC
GND Y
VREG_RGB_1.5V
4.7nC111
8208 01R
27MHz
X100FA-238_27MHz_9PF
2 1
3 4
5.6p
C1175.6p
C118
1M
R111
VREG_RGB_2.6VVREG_LCD_1.8V
LCD_CVT_INTLCD_CVT_RESET_N
LCD_CVT_VSYNC
MDDI_P_DATA_P
MDDI_P_STB_P
LCD_SCL
LCD_SDI
LCD_CS_N
LCD_SDO
LCD_VSYNC
LCD_R[6]
LCD_R[3]LCD_R[2]
LCD_DEN
LCD_HSYNC
LCD_B[0]LCD_B[1]LCD_G[0]LCD_G[1]LCD_R[0]LCD_R[1]
LCD_R[4]LCD_B[5]LCD_B[6]LCD_B[7]LCD_G[5]LCD_G[6]LCD_G[7]LCD_R[5]
LCD_B[2]LCD_B[3]LCD_B[4]LCD_G[2]LCD_G[3]LCD_G[4]
LCD_R[7]
MDDI_P_STB_M
MDDI_P_DATA_M
LCD_CVT_VSYNC_LS
LCD_CVT_VSYNC_LS
LCD_DCLK
sa esolC s
A
EUSY0366801
TP1TP�
TP2
TP4
- 152 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
4. Trouble Shooting (BB)
TP1
TP3
TP2
TP4
TP5
152P
CN100
31 30
32 29
33 28
34 27
35 26
36 25
37 24
38 23
39 22
40 21
41 20
42 19
43 18
44 17
45 16
46 15
47 14
48 13
49 12
50 11
51 10
52 9
53 8
54 7
55 6
56 5
57 4
58 3
59 2
60 1
G1G2
G3G4
VREG_LCD_1.8VVREG_LCD_2.8V
0.1u
C1120.1u
C113
TOUCH_VDD_2.8V
0.1u
C114
VREG_MSMP_2.6V
1211R
DNI311R
TOUCH_I2C_SDA
TOUCH_I2C_SCL
TOUCH_ACK
LCD_RESET_NLCD_MAKER_ID
MLED_OUTMLED1
MLED3
MLED5
LCD_PWM
MLED2
MLED4
MLED6
FLT_LCD_R[7]
FLT_LCD_R[6]
FLT_LCD_R[4]FLT_LCD_R[3]FLT_LCD_R[2]FLT_LCD_R[1]FLT_LCD_R[0]FLT_LCD_G[7]FLT_LCD_G[6]
FLT_LCD_G[2]
FLT_LCD_G[0]FLT_LCD_B[7]FLT_LCD_B[6]FLT_LCD_B[5]FLT_LCD_B[4]FLT_LCD_B[3]FLT_LCD_B[2]FLT_LCD_B[1]FLT_LCD_B[0]
FLT_LCD_SCLFLT_LCD_SDO
FLT_LCD_HSYNCFLT_LCD_VSYNC
FLT_LCD_SDI
FLT_LCD_DEN
FLT_LCD_G[1]
FLT_LCD_R[5]
FLT_LCD_G[4]FLT_LCD_G[3]
FLT_LCD_G[5]
FLT_LCD_CS_N
MLED7
FLT_LCD_DCLK
MINI_3.2"_LCD
100p
C210
LCD_RESET_N
TP5TP�TP2TP1
TP4
- 15� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.17 SIM Detect Troubleshooting
Start
Work well?
TP1, TP2, TP3,TP4 is run?
Change the Sub board
End
Check J1
Yes
No
YES
NO
Re-insert the SIM card
Change SIM card
Work well? EndYes
No
4. Troubleshooting (BB)
USIM Initial sequence of GD880 is : SIM_CLK,SIM_RST,SIM_IO triggered VRUIM_3.0V go to 2.8V SIM IF work
153P
- 154 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
4. Troubleshooting (BB)
TP1
TP2
TP3
TP4
154P
D504
43
52
61
J1
9 8
10 7
6 3
5 2
4 1VCCGND1
RSTVPP
CLKIO
GND2GND5
GND3GND4
10p
C522
15K20 5R
1u
C500
VREG_RUIM_3.0V
VREG_RUIM_3.0V
22p
C520
22p
C519
USIM_DATA
USIM_DATAUSIM_RST
USIM_RST
USIM_CLK
USIM_CLK
TP4
TP�TP2TP1
- 155 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.18 Side Key Troubleshooting
There are 2 main Key, Volume and Camera Key, which is connected to Sub-PCB.
Volume Key consists of Volume up and Volume down. Also, Camera Key is composed of Focus and Shutter.
Start
Check Sub-PCB NO
Yes
Key press
Check R211 and R212NO
TP1 or TP2 is High?
4. Troubleshooting (BB)
TP3 or TP4 is High?
Yes
Check an U200 or Change the Main boardAnd Retest
155P
24
23
22
21
20
19
18
17
16
15
14
13
470
R211
470
R212
470
R213
470
R214
56K512R
56K612R
VREG_MSMP_2.6VLCD_CVT_INT
LCD_CVT_RESET_N
KEY_ROW[0]
KEY_ROW[1]
KEY_COL[0]
KEY_COL[1] LIN_MOTOR_EN
LCD_CVT_VSYNC
MDDI_P_STB_M
PM_ON_SWTP4 TP�
TP2TP1
- 156 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
4. Troubleshooting (BB)
TP1
TP2
TP3
TP4
156P
- 157 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4. Troubleshooting (BB)
4.19 LINEAR MOTOR
Linear Motor trouble shooting can be processed as below :
U302 uses the PWM pulse.VB300_LMOTOR_P and VB300_LMOTOR_N : output of U302.
Start
Work well?
TP3 is 3V?TP4 is high?
TP5 is working?
End
Check an U302 SMT status by X-ray,
Exchange it
YES
No
NO
YES
Reboot
Check SW
TP1, TP2 is OK? Check motor & FPCB connection
YES
No
TP1
TP2
TP3
TP4
TP5
157P
VB300
2
1
100nL300
100n
L301
VREG_MOTOR_3.0V
1u
C3073.9n
C308313R
510K
10K41 3R U302
9
54
63
72
81EN V1
SIN VSS
TYPE VCC
OCT V2DN
GP
LIN_MOTOR_EN
LIN_MOTOR_PWM
Linear Motor PAD
1%
LINEAR MOTOR DRIVER
EUSY0200803
TP1TP2TP�
TP4
TP5
- 158 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
4. Trouble Shooting (BB)
Proximity Sensor is worked as below : Send Key click Phone number click Call connected Object moved at the sensor
Control the screen’s on/off operation automatically
Send Key click & call connected
Object moved at the Proximity Sensor
LCD on/off?
No
Start
End
Yes
NOChange the Main Board
4.20 Proximity Sensor on/off trouble
YES
Work well?
TP1 output checkNO
Change the sensor (U300)
TP2, TP3, TP4 checkNO
Change the Main Board
YES
YES
158P
Change the Sub Board
- 159 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4. Trouble Shooting (BB)
1) Measurement : U300-. VCC : VREG_SENSOR_2.6V (C304,R310)-. PROXI_OUT :(U300)-. PROXI_SDA / SCL : data / CLK pulse (R308, R309)
TP1
TP2
TP3
TP4
159P
0.1u
C301
2.2u
C302
4.7K
R308
4.7K
R309
VREG_SENSOR_2.6V
VREG_SENSOR_2.6V
R310
4.7
10u
C304
U300
54
63
72
81
AD
ELL
CS
CD
ELA
DS
CC
VOI
V
TU
OV
DN
G
10
R311VREG_SENSOR_2.6V
VREG_SENSOR_2.6V
1u
C305PROXI_I2C_SCL
PROXI_I2C_SDA
PROXI_OUT
TP1TP2
TP4
TP�
- 160 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
4. Trouble Shooting (BB)
Luminance Sensor is worked as below : Sensor ALC function On Object moved at the Luminance sensor
automatically controls brightness of the display backlight. (Very slowly)
4.21 Luminance Sensor on/off trouble
Sensor ALC function On
Object moved at the Luminance sensor
LCD backlight change (slowly)?
No
Start
End
Yes
NOChange the Sub Board
YES
Work well?
TP5,TP6,TP7,TP8 checkNO Change the Luminance sensor
U301
TP1, TP2, TP3, TP4 checkNO
Change the Main Board
YES
YES
160P
- 161 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4. Trouble Shooting (BB)
1) Measurement : Main U801 SPK FPCB U101-. +VPWR : 4V (C125) -. VREG_MSMP_2.6V : 2.6V (C124)-. U101 (GC1 / GC2) : data pulse -. U301 (SENS)-. LCD_SUBPM_I2C_SDA / SCL : data / CLK pulse (R107, R110)
TP1 TP2 TP3 TP4
TP5 TP6
TP7
TP8
161P
U101D2D1
6F1A
1F6A
E3F2
E5D3F5E2E6E1
F3C1
A4
C2E4B3D4A3B4B1D5B2A2
F4D6B6
5A
6C
5B
5C
4C
N1C
P1C
N2C
P 2C
DN
GP
C
VBATCP VOUTVBAT
LED1LED2
VIO LED3RESETB LED4SCL LED5SDA LED6
WPWMIN
LEDGNDSBIAS
SSENS LDO1OSGND LDO2OGC2 LDO3OGC1 LDO4O
2T 4T 1T 3T
LED7LED8
2.2u
C115
CAM_AF_2.8V
2.2u
C116
TOUCH_VDD_2.8V
4.7K701R
4.7K011R
VREG_MSMP_2.6V
TP101
1u
C1191u
C120
+VPWR
1u
121
C
CAM_VDD_1.8V CAM_VDD_2.8V
2.2u
C1222.2u
C123
1u
C124
VREG_MSMP_2.6V
10u
521
C
GAIN1GAIN2
LCD_SUBPM_RESET_N
SBIAS
LCD_SUBPM_I2C_SCLLCD_SUBPM_I2C_SDA
SENS
MLED_OUT
MLED1
MLED3
MLED5
LCD_PWM
MLED2
MLED4
MLED6MLED7
LCD Charge-pump (with ALC)
TP2
10K
213
R1u
C306
U301
6
43
2
51VCC IOUT
GND1
GC1 GC22D
NG
GAIN1 GAIN2
SBIAS SENS
Ambient Light Sensor
TP1
TP�
TP4
TP5TP6 TP7
TP8
- 162 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4. TROUBLE SHOOTING
4. Trouble Shooting (BB)
Motion Sensor is worked as below : Accelerometer Sensor function On Tilt the phone (90˚) The screen is had rotated automatically.
4.22 Motion Sensor on/off trouble
Accelerometer Sensor function On
Tilt the phone
The screen is rotated
No
Start
End
Yes
NOChange the Sub Board
YES
Work well?
TP1,TP2 checkNO Change the Motion sensor
U303
TP3 checkNO
Change the Sub Board
YES
YES
162P
Change The Main Board
- 16� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.Trouble Shooting (BB)
1) Measurement : Sub board-. VREG_MSMP_2.6V : 2.6V (C309)-. MOTION_INT : High enable (TP300)-. MOTION_I2C_SDA / SCL : data / CLK pulse (R315, R316)
TP1 TP2 TP3
163P
U303
21
11
65
74
83
92
101NC1 NC2
VDD VDDIO
GND SDI
INT SDO
CSB SCK
1TO
N
2TO
N 0.1u
C300
VREG_MSMP_2.6V
TP300
1u
C309
4.7K513R
4.7K613R
VREG_MSMP_2.6V
MOTION_INT
MOTION_I2C_SCL
MOTION_I2C_SDA
Motion Sensor
TP�TP2
TP1
4.Trouble Shooting (BB)
1) Measurement : Sub board-. VREG_MSMP_2.6V : 2.6V (C309)-. MOTION_INT : High enable (TP300)-. MOTION_I2C_SDA / SCL : data / CLK pulse (R315, R316)
TP1 TP2 TP3
163P
- 164 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
5. DOWNLOAD
5. DOWNLOAD
- 165 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
- 166 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
5. DOWNLOAD
- 167 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
- 168 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
5. DOWNLOAD
- 169 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
- 170 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
5. DOWNLOAD
- 171 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
- 172 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
5. DOWNLOAD
- 17� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
- 174 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
5. DOWNLOAD
- 175 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
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5. DOWNLOAD
- 177 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
6. BLOCK DIAGRAM
6. BLOCK DIAGRAM
MINI Block Diagram
5Mega AFParallel Interface [0:9]
LBEH19UNBC
PCM I2CGSM FEMUART1/
DM
WCDMAGSM
VGA Camera
5Mega AFCamera
Camera I/F[0:9]
I2C
I2CGPS
GPS BT Wi-Fi
SDIO1
FMFM Audio R/L
Parallel Interface [2:9]
I2C
MSM7227
CAM I/F
MCP
RX
SBI
GSM8509001800
RX ADC
SSBI
EBI2 DATA
GSM FEMRTR6285
DM Camera I/F[0:9]
NANDFlash
3.2” FWVGA LCDMDDIGPS GPS ADC
RGBInterface
RGB 24bit
EDGEPAM
I2C
EBI2 ADDR
TXWCDMA9002100
1900
TX DACEBI1 DATAEBI1 ADDR
Duplexer
WCDMA PAM
DDRSDRAM2Gbit
Flash4Gbit
Charge Pump BD6084
8CH
LCD_PWM
SDIO2
Ambient LightSensor
RF Block8CH
(ALC)SDIO2
Speaker
Line O P/NHPH_R/L
EAR1OP/N Receiver Micro SD UART3/
UIM2
UART2/DM I2C
TouchSensor
ProximitySensor
Speaker AMP
E h R/L
TCXO_RTR_19.2MHz
3.5EarphonePM_SSBI USB I/F
MIC1P
UART2/UIM
I2C
Sensor
3-AxisSensor
Li
PWM
Headset AMPMIC2PEarphone R/L
Audio SubsystemLine L/R_IP FM Audio R/L
Earphone R/L
TRK_LO_ADJGPSD F/F
X-Tal(19.2MHz)
PM7540
SSBI
cro
US
Bne
ctor
USB 2.0 HS
USB
VBUS
OVP
LinearMotor
VCHG_VBUSTCXO_PM_19.2MHz
USIM
USIM Translator
UART1/DM : BT URRT2/DM : UART2(DP)UART2/UIM : USIMUART3/UIM2 : N.A
5pin
Mi
Con
nMUIC
UARTD+ / D-
UART3/UIM2
- 178 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
6. BLOCK DIAGRAM
POWER Block
MSM7227PM7540
Charging IC(NUS5530MN)
VCHG_VBUSTA (5PIN)
5.1V,700mA
+VPWR
VREG_MSMC1_1.35V (500m A)
VREG_MSME_1.8V (500m A)
VREG_MSMA_2.6V (300m A)
VDD
PM7540
VSW_MSME
VREG_MSMA
VSW_MSMC1
VSW_MSMC2 VREG_MSMC2_1.25V (500m A)
VDD_VCORE1 ( 1.2V , 203mA )
VDD_VCORE1 ( 1.2V , 203mA )
VDD_P1/P2/P8 /MDDI ( 1.8V ,MAX 10mA )
VDD_A / PLL ( 2,6V , MAX 65mA )CHG_CTL_NBATT FET N
Battery900mAh
VBATT
VREG_MSMP_2.6V (300m A) VREG_MSMP
VREG_GP5VREG_AUX2_2.9V (150m A)
VDD_P3/P4 (2.6V , MAX 25mA )
VDD_QFUSE (2.9V , MAX 10mA )
VDD_USBPHYE (3.3V , MAX 10mA )USBLDO(3.3V)
BATT_FET_N
+VPWR
MCPSDRAM ( 1.8V , MAX 180mA )
NAND ( 1.8V , MAX 30mA )
RTR6285
GSM PAM
WCDMA PAM
VDDA ( 2.7V , MAX 93mA )
VDDM ( 2.6V , MAX 10mA )
VDDA ( 2.1V , MAX 70mA )
VREG_RF_2.7V (150mA)
VREG_SMPS_2.1V (300mA)
VREG_RFRX1
VSW_PA
VREG_GP2GPS LNA
VREG_LCD_2.8V (150mA)LCD moduleVIO (1.8V )
WCDMA PAM
VREG_SYNT
VREG_MSME2
VREG_GP1
Motion Sensor ( 2.7V, MAX ?mA)
VREG_GP6 VREG_SENSOR_2.6V (300mA) Proximity sensor( 2.7V, 20mA)
VREG_SYNTH_2.75VVREG_LCD_1.8V (150mA)
VREG_RGBC_1.5V (150mA)
FEMWVGA LCD Controller
CORE,DRAM,PLL,MD15 (1.5V )
MD18 PIO HIO (1 8V )
VDD (2.8V )
VREG_RFTX
VREG_GP3
VREG_MMC_3.0V (150mA)VREG_MMC MICRO SD slot (3.0V , , MAX mA )
VREG_TCXO_2.85V (50mA)VREG_TCXO TCXO (2.85V , , MAX 20mA )
GPS D FLIP-FLOP
VREG_RGBC_2.6V (150mA)MD18,PIO,HIO (1.8V )
DRAM,OSC (2.6V )
VREG_RFRX2
USIM SLOT (3.0V , , 1mA )VREG_RUIM_3.0V (150mA)VREG_RUIM1
VREG_MOTOR_3.0V (300mA) Linear Motor Driver ( 3.0V, mA ) VREG_WLAN
VREG_GP4
BACKUP BatteryVBACK_UP VCOIN
- 179 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
6. BLOCK DIAGRAM
BD6084GUL
POWER Block
VREG_MSMP_2.6V
BD6084GUL
CAM_VDD_2.8V
CAM_VDD_1.8V
LDO2 (150mA)
LDO1 (150mA)
LDO3 (150mA)
5M CAMERA VIO
CAM_AF_2.8V
+V_PWR
LDO4 (150mA)
VBATVGA CAMERA
Touch ICTOUCH_VDD_3.3V
MLED ( 7ea )MLEDOUT ( 450mA )LCD_BACKLIGHT_4.8V
WIFI/BT/FM MODULEVBAT
VDDIO/VDDIO_SDVREG_MSMP_2.6V
LDO(2.8V) 26MHz TCXO for WIFI/BT/FM
MUIC
Audio Sub System
- 180 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
3. Technical Brief
E. FM Radio interfaceFM_ANT : FM RF input.SLEEP CLK : External reference oscillator input. (32.768KHz)FM_AUDIO_R : Right audio line output – digital input data.FM_AUDIO_L : Left audio line output – digital frame synchronization.
Figure. Block Diagram of WiFi Interface
Figure. Block Diagram of BT Interface
6. BLOCK DIAGRAM
- 181 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
6. BLOCK DIAGRAM
3. Technical Brief
E. FM Radio interfaceFM_ANT : FM RF input.SLEEP CLK : External reference oscillator input. (32.768KHz)FM_AUDIO_R : Right audio line output – digital input data.FM_AUDIO_L : Left audio line output – digital frame synchronization.
Figure. Block Diagram of WiFi Interface
Figure. Block Diagram of BT Interface
- 182 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
ANT_SEL[0:3]Main Antenna GPIO72~75
GSM PAMASM
GSM_PA_RAMPGSM_PA_EN
GSM_PA_BAND
RTR_TX_ONDCS PCS TX
DCS_PCS_OUT
GSM_OUT
PA_PWR_CTL
GPIO80
GPIO79
TX ONRF ON
DCS_PCS_OUT
GSM_OUT
VAPC
TX_EN
BS
ANT PCN_PCS_OUT
GSM_OUT
RF
ASM RTR_DAC_REF
4
DCS_PCS_TX
GSM_TX
4 GSM Band Rx
4
RTR_TX_I/Q
_
DAC_REF
I/Q_RTR_P/M
_
DAC_IREF
TX_I/Q P/N
LB_RF_OUT1
HB_RF_OUT1DCS_PCS_IN
GSM_INWCDMA_2100
MSM7227
transceiver
WCDMA PAM
DPX
4
4
4
W900_TX_OUT
RFOUT_LOW
4
PDET IN
RX_WCDMA_900RX_WCDMA_2100
GPS_IN
RTR_RX_I/Q
RTR_DRX_I/Q
I/Q_IP/M_CH0
I/Q_IP/M_CH1
PRX_I/Q P/N
DRX_I/Q P/NGPS_IN
WPRXSE2WPRXLBLB_RF_OUT2
GSM_INRFin_Low
RFOUT_LOW
WCDMA_850
MSM7227DPXW900
4RTR_SSBI
W2100_TX_OUTW2100_PA_ONW900_PA_ON
W_PA_R0
PDET_IN
RX_WCDMA_900
GPIO59
PA_ON0
GPIO_22
PA_RANGE0
SBDTTCXO
PDET_IN
VmodeVen_Low
Ven_HighRFin_High
RFOUT_HIGH
VCTCXODf/f
TRK_LO
PMIC_TCXO
RTR_TRK_LODPX
W2100RFOUT_HIGH
TCXO_PM_19.2MHz
TCXO_RTR_19.2MHz
RX_WCDMA_2100
TRK_LO_ADJ
PMICPM7540
_
GSM_PA_DAC_REFPMIC_SSBI
GPS AntennaGPS_IN
TCXO
GSM_BG_REF
GPIO106SBDT_SSBI
MPP_8
TCXO_OUTTXCO_IN
GPSLNA GPS_EN
6. BLOCK DIAGRAM
- 18� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
6. BLOCK DIAGRAM
3. Technical Brief
Figure. Block Diagram of RF Interface
- 184 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
- 185 -
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
C1022
0.5p
1KR1024
1KR1022
R1025 1K
ANT1001
ANTPAD_GD880
FEED
3.9n
L1005
C1015DNI
100pC4
C3DNIDNI
C2
2.2n
L1012
27p
8601C
3.9p
C1055
3.9pC1029
C1057 100p
SW1001
G1
G2
ANTG3
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
LGE Internal Use Only
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
U1001
3
2
5
4
1NI
_FR
FIL_OUT
VDD
S_D
GND
C10020.1u
DNI
C1003
6.8nL1001
0
R1001
C1004
DNI
VREG_RF_2.7V
DNI
R1002
3001R
180
15n
L1002
0501C 33p
C1087 10n
1KR1023
4.7u
C1026
C1049
68p
22pC1007
3.9nL1020
C1038
0.5p
1.8pC1010
C101139p
C1012 2.7p
C1104 DNI
C1077
68p
VREG_SMPS_2.1V
C10141n
2.2R1005
33pC6
L10062.2n
L1004 1.2n
DNIC1017
C10180.1u
R1006
5.1
C1019
0.1u
12n
L1021C10211n
3.9nL1017
C1023 22p
4201
Cu1
.0C1025 22p
0.75p
C1009
100pC1027
U1002
51
8 7
9 6
10 5
11 4
12 3
13 2
14 1RFIN_LOWRFOUT_LOW
VMODEGND3
VBPVCC2
VCC1GND2
VEN_LOWRFOUT_HI
VEN_HIGND1
RFIN_HICPL DN
GP
3.6n
L1009
4.7n
L1024
C10310.1u
0.5p
C1063
C1056 68p
7001R
120
33pC1034
C103522p
FL1001
1575.42MHz
5 3 2
4 1OUTIN G1G2G3
5.1
R1008
22p
C1036
VREG_SMPS_2.1V
2.7pC1037
FL1002
897.5 MHz,942.5 MHz
95
8
4 72
3
61
RX1ANT
TXGND1
GND4GND2
RX2
GND3 GND6
L1022
12n
1K
R1009
33pC1040
U1003
32
92
82
53
43
96
62
61
60
54
4336
3738
2768
2552
2142
8
745
144
5347
2246
10
649
448
3
51
6750
1939
40
18
1741
16
1533
32
1331
1430
12
1159
58
956
24
557
55
65
6620
632
6426RF_ON TX_IP
TCXO TX_INSBDT TX_QP
TX_QNLB_RF_OUT1
LB_RF_OUT2 VTUNE1
VTUNE2HB_RF_OUT1 VTUNE_GPS
HB_RF_OUT2
HB_RF_OUT3 PRX_QP
PRX_QN
WPRXLBP PRX_IPWPRXLBN PRX_IN
WPRXHBP
WPRXHBN DRX_QP
DRX_QN
WDRXLB DRX_IP
DRX_IN
WDRXHB1
WDRXHB2 NC
GCELL_INP DAC_IREF
GCELL_INNVDDA1_1
EGSM_INP VDDA1_2
EGSM_INN VDDA1_3
VDDA1_4
DCS_INP VDDA1_5
DCS_INN VDDA1_6
GPCS_INP VDDA2_1
GPCS_INN VDDA2_2
VDDA2_3GPS_IN VDDA2_4
PDET_IN VDDA2_5TX_RBIAS VDDA2_6
WPRXSE1 VDDA2_7
WPRXSE2 VDDA2_8VDDA2_9
VDDA2_10
VDDA2_11
VDDA2_12DN
GP
TU
O_2E
SX
RP
W
TU
O_1E
SX
RP
W
PNI_
XM_
BW
MNI_
XM_
BW
MD
DV
51pC1041
0101R
91
DNI
C1042
C1043
33p
R1011
51
C1044DNI
0.1u
C1045
C1046100p
U1004
23 22
24 21
25 20
26 19
27 18
28 17
9 8
10 7
11 6
12 5
13 4
14 3
15 2
16 1DCS_PCS_INDCS_PCS_OUT
BSGND6
TX_ENGND5
VBATTVCC_OUT
VAPCGND4
NCGND3
GND1GND2
GSM_INGSM_OUT
PGND1PGND12
PGND2PGND11
PGND3PGND10
PGND4PGND9
PGND5PGND8
PGND6PGND7
2.2n
L1013
C1048100p
15pC1100
2.2pC1051
10nC1052
10R1012
1nC1053
L10073.6n
4.7u
C1069
VREG_SYNTH_2.75V
100pC5
L1026
15n
C1060 22p
L1011
15n
R1013
12K
22p
C1061
10KR1014
FL1003
1950MHz,2140MHz
75
84
92
3
16ANT RX
TX
GND1 GND6GND2 GND5GND3 GND4
C106210u
5101R
120
C1039 4.7p
C10640.1u
100pC1066
7601
Cp0
01
6101R
91
1.2n
L1003
18n
L1019
0701
Cu1
.0
1701
Cu1
.0
7101R
180
C107310u
VREG_RF_2.7V
R1018
2.2K
L1008
15n
100pC1075
C1076
0.1u
2.7nL1023
2.7n
L1010
2140MHz
FL1004
52
4
31IN OUT
_OUTG1 G3
FL1005
1950MHz
5 3 2
4 1INOUT G1G2G3
C10810.1u
100pC1082
5201L 1.2n
82
R1020
C1084 39p
+VPWR
5801
Cu1
.0
1.8pC1086
C1090100p
L1014
10n
C1092
0.1u
+VPWR
C1093 4.7p
2.2pC1094
30
R1021
0.1u
C1096
C1008
4.7u
C10970.1u
1n
C1098
FL1006
897.5MHz
5 3 2
4 1INOUT G1G2G3
68pC1028
C1101
4.7u
C11020.1u
VREG_MSMP_2.6V
100pC1103
12n
L1015
1901C 3.3p
C1106DNI
DNI
C1108
C1109 3.9p
DNIC1110
2.7nL1016
C1111DNI
FL1007
850,1900,2100MHz
65437
11
9
22
21
20
1324
1223
10
158
141
17
162
19
18PCS_RX1
PCS_RX2
ANT PCN_RX1
PCN_RX2
GND1 EGSM_RX1
GND2 EGSM_RX2
GND3
GND4 GSM850_RX1
GND5 GSM850_RX2
WCDMA_2100
WCDMA_850
WCDMA_1900
PCN_PCS_TX
GSM850_EGSM_TX
DD
V
1LRT
C
2LRT
C
3LRT
C
4LRT
C
22p
C1112
GND
SW1002
G4G3INOUT G1G2
2.2nC1113VREG_MSMA_2.6V
22pC111468pC1080
12
R1026
ANT1002
ANTPAD_GD880
FEED
5901C 3.3p
1.5nL1018
GPS_LNA_EN
RTR_DRXQPRTR_DRXQM
RTR_DRXIMRTR_DRXIP
RTR_RXQPRTR_RXQM
RTR_RXIMRTR_RXIP RTR_TXQM
RTR_TXQPRTR_TXIM
RTR_TXIP
RTR_DAC_REF
TCXO_RTR_19.2MHZ
ANT_SEL3
GSM_PA_RAMP
GSM_PA_BANDGSM_PA_EN
ANT_SEL2ANT_SEL1
W_PA_R0
RTR_TX_ON
W_2100_PA_ON
W_PA_R1
RTR_SSBI
W_900_PA_ON
RX_WCDMA_2100_LNA_OUT
RX_WCDMA_2100_LNA_OUT
WB2100_MIX_INP
WB2100_MIX_INP
WB2100_MIX_INM
WB2100_MIX_INM
RX_PCS_P
RX_PCS_P
RX_PCS_M
RX_PCS_M
RX_DCS_P
RX_DCS_P
RX_DCS_M
RX_DCS_M
RX_GSM_900_P
RX_GSM_900_P
RX_GSM_900_M
RX_GSM_900_MRX_GSM_850_P
RX_GSM_850_P
RX_GSM_850_M
RX_GSM_850_M
WCDMA_900_TX_OUT
WCDMA_900_TX_OUT
RX_WCDMA_2100
RX_WCDMA_2100
RX_WCDMA_900_M
RX_WCDMA_900_M
PDET_IN
PDET_IN
GPS_IN
GPS_IN
RX_WCDMA_900_P
RX_WCDMA_900_P
DCS_PCS_TX
DCS_PCS_TX
GSM_TX
GSM_TX
ANT_SEL0
WCDMA_2100_TX_OUT
WCDMA_2100_TX_OUT
PCS1900(1850-1910 MHz)
W2100 RX(2110 - 2170 MHz)
LOW
SFSY0035101
VDDA1 : Pin 3,4,6,10,22,53 = +2.7V VDC
W900 RX(925 - 960 MHz)
2mm
HIGH
HIGH
LOW
LNA for the GPS
HIGH
HIGH
BAND1(2520):SAYP1G95AA0B00
LOW
SDMY0002801
LOW
W2100 RX(2110 - 2170 MHz)
LOW
LOW
HIGH
LOW
GSM(925-960 MHz)
SMZY0016501
HIGH5dB
LOW
LOW
HIGH
BAND1: SFSY0035001
Near to RTR6285
LOW
(WCDMA_1900)
LOW
Band 1
W900 TX(880 - 915 MHz)
LOW
LOW
LOW LOW
LOW
ANTENNA SWITCH MODULE LOGIC
DCS/PCS TX
HIGH
BAND5 : B9425 ( SFSY0036501)
GSM900(880-915 MHz)
LOW
BAND 5/8
BAND2 : B9640 (SFSY0036601)
ANT_SEL0 ANT_SEL2
(WCDMA_1900)
WCDMA RX 2100 LNA Circuit
PCS(1930-1990 MHz)
BAND8(2520) : B7953 (SDMY0002801)
LOW
SFSY0036501
WCDMA 2100 (UMTS2)
LOW
GSM850/EGSM TX HIGH
DCS1800 RX
WCDMA 900 (UMTS1)
GSM850 RX
HIGH
BAND8 : B9442 (SFSY0037601)
BAND1 : B9414 (SFSY0035101)
HIGH
GSM850(824-849 MHz)
1%
SDMY0001901
WCDMA
DCS1800(1710-1785 MHz)
+2.1V
GSM
LOW
LOW
ANT_SEL3
BAND1 : B9411 (SFSY0035001)BAND2 : B9419 (SFSY0034901)
GSM(869-894 MHz)
ANT_SEL1
BAND2(2520) : ACMD-7407
DCS(1805-1880 MHz)
EGSM RX
PCS1900 RX
SMPY0019101
Band 8
1004430Y
SU
E
BAND 1/2
+2.7V
W2100 TX(1920 - 1980 MHz)
Route togetherVDDA2 : Pin 1,7,8,21,25,27,37,43,54,60,61,62 = +2.1V VDC
8dB
7. CIRCUIT DIAGRAM
- 186 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
D200
CN200
AXT610124
65
74
83
92
101
G1 G2
G3 G4
302R
IN
D
100R204
U200
MSM7227_DATA
M5
Y18
AC19
AF18
Y17
U16
AC18
AF17
W16
AE17
AC17
Y16
AB17
W5
W3
V5
V6
AB9
V9
V8
Y9
W8
AB8
V3
V2
U2
U8
U9
AF4
AE2
AB7
AE4
AE3
AD3
L2
L8
L3
L9
AD2
AC6
AC3
AC2
U15
W15
AC16
AB16
AF15
Y15
AC15
AB15
W14
AE14
AC14
Y14
AC13
U13
Y13
AB13
W13
W12
AB12
Y12
AC12
AC11
AF10
W9
AE10
U12
AF9
AC20
AF20
AB21
AE20
AF21
AF22
AC23
AE23
AC21
AF23
AE21
AB22
AC22
AE24
AE25
AF24
6M
8M
9M
8E
A
7F
A
8C
A
6F
A
7C
A
6E
A
11
R
81
BA
81
W
11
Y
71
C
71
B
61
H
81
H
71
M
62
G
01
Y
11
T
01
W
61
EA
8F
A
61
FA
5F
A
31
F
21
C
21
B
11
H
11
J
21
H
21
J
11
E
21
F
11
F
21
E
91
EA
91
FA
02
BA
51
C
61
F
31
H
41
H
41
J
31
J
11
C
41
L
3F
2F
3E
2E
2D
52
G
61
L
91
C
91
B
91
H
62
F
02
H
81
J
71
J
32
H
22
F
32
F
61
J
71
E
51
J
71
F
61
B
61
C
51
H
81
B
52
B
12
F
02
B
02
F
71
H
02
E
02
C
81
C
81
F
B21
B22
C21
E21
C22
C24
E26
B24
F25
C26
D26
C23
B23
C25
D25
E23
W20
AD26
N17
T20
J25
M20
N25
V26
H26
L25
P20
U26
V19
AC25
U19
U20
AB23
W25
W26
R19
T19
W22
AC26
V23
AB26
AB25
AA23
AA25
Y26
Y23
T17
Y22
W23
AA26
V20
J26
K20
J20
J23
J22
K19
K26
L22
L19
L23
L20
M19
L26
M26
M22
M23
N26
N19
N20
P26
R26
P19
R25
T26
R22
R23
R20
T23
T22
U25
U23
U22
4C
6G
5G
6N
3N
2N
2W
6W
3M
8T
2K
3K
2J
3J
2H
3H
2G
3G
6R
2P
3P
2R
3R
11B
41
FA
31
FA
21
FA
11FA
5BA
3BA
2B
A
3A
A
2A
A
2Y
6AA
2M
3U
11
W
9E
A
9C
A
6B
A
3Y
71
W
91
BA
51E
41
C
31
C
51B
41B
31
B
8H
6F
5F
01J
01H
9H
01
C
01
B
9C
9B
8F
8E
7F
7E
7C
7B
6C
5C
6B
5B
PI_
R_
ENIL
NI_
R_
EN
IL
PI_L
_E
NI
LN
I_L
_E
NI
LP1CIM
N1CI
MP2C
IM
N2CI
MPI
XUA
NI
XUA
PO_E
NI
LNO_E
NI
LPO_1
RA
ENO_
1RAE
TUO
XUA
R_
HPH
L_
HPH
PMOC
CS
AIB
_C
IM
FERV
_HPH
KLC
SYS
_Y
HPBSU
PD_
YHP
BS
UND
_YH
PB
SU
DI_
YH
PBS
US
UBV
_Y
HP
BSU
TXE
R_YHP
BS
U
N_NI
SE
RN_
TU
OS
ER
NE_G
ODW
0_ED
OM
1_ED
OM
2_EDO
M3_ED
OM
OXCT
JDA
_O
L_
KRT
KLC_
PEE
LS
IDTSMTN_TS
RT
ODTKCTKCT
R
P_AT
AD
_I
DDM
N_AT
AD_I
DDM
P_BTS
_ID
DM
N_BT
S_ID
DM
KLC
P_C
DCL
P_
TUO
_I
N_TU
O_I
P_TU
O_Q
N_TUO
_Q
FER_C
AD
0HC
_PI
_I
0H
C_
MI
_I
0H
C_P
I_
Q0
HC_
MI_
Q1
HC_
PI
_I
1HC_
MI
_I
1HC_P
I_Q
1HC_
MI
_Q
NO_X
TJ
DA
_C
GA
_XT
0NO_
AP
0EGN
AR
_A
PLTC_
RWP_
AP
M_L
TC_
RWP
_AP
FER
_GB
_MS
G
0NI
AK
H1
NIA
KH
2NIA
KH
EBI1_DQ_0EBI1_DQ_1EBI1_DQ_2EBI1_DQ_3EBI1_DQ_4EBI1_DQ_5EBI1_DQ_6EBI1_DQ_7EBI1_DQ_8EBI1_DQ_9EBI1_DQ_10EBI1_DQ_11EBI1_DQ_12EBI1_DQ_13EBI1_DQ_14EBI1_DQ_15EBI1_DQ_16EBI1_DQ_17EBI1_DQ_18EBI1_DQ_19EBI1_DQ_20EBI1_DQ_21EBI1_DQ_22EBI1_DQ_23EBI1_DQ_24EBI1_DQ_25EBI1_DQ_26EBI1_DQ_27EBI1_DQ_28EBI1_DQ_29EBI1_DQ_30EBI1_DQ_31
EBI1_ADR_0EBI1_ADR_1EBI1_ADR_2EBI1_ADR_3EBI1_ADR_4EBI1_ADR_5EBI1_ADR_6EBI1_ADR_7EBI1_ADR_8EBI1_ADR_9EBI1_ADR_10EBI1_ADR_11EBI1_ADR_12EBI1_ADR_13
EBI1_CKE0EBI1_CKE1EBI1_DCLKEBI1_DCLKBEBI1_WE_NEBI1_CS0_NEBI1_CS1_NEBI1_BA_0EBI1_BA_1EBI1_DQS_0EBI1_DQS_1EBI1_DQS_2EBI1_DQS_3EBI1_DM_0EBI1_DM_1EBI1_DM_2EBI1_DM_3EBI1_RAS_NEBI1_CAS_NEBI1_RESOUT_NEBI1_CAL
EBI2_DATA_0EBI2_DATA_1EBI2_DATA_2EBI2_DATA_3EBI2_DATA_4EBI2_DATA_5EBI2_DATA_6EBI2_DATA_7EBI2_DATA_8EBI2_DATA_9EBI2_DATA_10EBI2_DATA_11EBI2_DATA_12EBI2_DATA_13EBI2_DATA_14EBI2_DATA_150
_RD
A_
2IBE
1_RD
A_
2IBE
2_
RDA_
2IBE
3_
RDA_
2IBE
4_
RDA_
2IBE
5_
RDA_
2IBE
6_
RDA_
2IBE
7_
RDA_
2IBE
8_
RDA_
2IBE
9_
RDA_
2IBE
01_
RDA_
2IBE
11_
RDA_
2IBE
21_
RDA_
2IBE
31_
RDA_
2IBE
41_
RDA_
2IBE
51_
RDA_
2IBE
61_
RDA_
2IBE
N_
0SC_
2IBE
N_
1SC_
2IBE
N_
4SC_
2IBE
N_
5SC_
2IBE
N_
6SC_
2IBE
N_
7SC_
2IBE
KLC_
2IBE
N_
EW_
2IBE
N_
EO_
2IBE
N_
BU_
2IBE
N_
BL_
2IBE
N_0Y
SUB_
2IBE
RE
PIW
RL
_ST
LL
_ST
RU
_ST
LU
_ST
231_
OIPG
131_
OIPG
031_
OIPG
921_
OIPG
821_
OIPG
721_
OIPG
621_
OIPG
521_
OIPG
421_
OIPG
321_
OIPG
221_
OIPG
121_
OIPG
021_
OIPG
911_
OIPG
811_
OIPG
711_
OIPG
611_
OIPG
511_
OIPG
411_
OIPG
311_
OIPG
211_
OIPG
111_
OIPG
011_
OIPG
901_
OIPG
801_
OIPG
701_
OIPG
601_
OIPG
501_
OIPG
401_
OIPG
301_
OIPG
201_
OIPG
101_
OIPG
001_
OIPG
99_
OIPG
89_
OIPG
79_
OIPG
69_
OIPG
59_
OIPG
49_
OIPG
39_
OIPG
29_
OIPG
19_
OIPG
09_
OIPG
98_
OIPG
88_
OIPG
78_
OIPG
68_
OIPG
58_
OIPG
GPIO_0GPIO_1GPIO_2GPIO_3GPIO_4GPIO_5GPIO_6GPIO_7GPIO_8GPIO_9GPIO_10GPIO_11GPIO_12GPIO_13GPIO_14GPIO_15GPIO_16GPIO_17GPIO_18GPIO_19GPIO_20GPIO_21GPIO_22GPIO_23GPIO_24GPIO_25GPIO_26GPIO_27GPIO_28GPIO_29GPIO_30GPIO_31GPIO_32GPIO_33GPIO_34GPIO_35GPIO_36GPIO_37GPIO_38GPIO_39GPIO_40GPIO_41GPIO_42GPIO_43GPIO_44GPIO_45GPIO_46GPIO_47GPIO_48GPIO_49GPIO_50GPIO_51GPIO_52GPIO_53GPIO_54GPIO_55GPIO_56GPIO_57GPIO_58GPIO_59GPIO_60GPIO_61GPIO_62GPIO_63GPIO_64GPIO_65GPIO_66GPIO_67GPIO_68GPIO_69GPIO_70GPIO_71
GPIO_72_GRFC_9GPIO_73_GRFC_8GPIO_74_GRFC_7GPIO_75_GRFC_6GPIO_76_GRFC_5GPIO_77_GRFC_4GPIO_78_GRFC_3GPIO_79_GRFC_2GPIO_80_GRFC_1GPIO_81_GRFC_0
GPIO_82GPIO_83GPIO_84
IN
D502
R
MIC_BIAS
C201
47p
u1202
C
u1.03 02
C
u1 .040 2
C
502C
u1.0
u1.0602
C
R206
100
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
LGE Internal Use Only
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
u1.0702
C
u1802
C
100
R207
TP200
TP201
TP202
TP203
TP204
100p
C209
C210
0.1u
802R
K1
C21122u
VCHG_VBUS
0406
902R
TP205
VREG_MSMP_2.6V
33
R210
49.9
R211
K01
212R
V6.2_P
MS
M_G
ER
V
1nC212
V6.2_P
MS
M_G
ER
VK74812
R TG-5010LH_19_2M_75AX200
19.2MHz
32
41VCONT VCC
GND OUT10n
C213
TP206
1n
C214
VREG_TCXO_2.85V
TP207
TP
TP
TP208
TP209
TP
VREG_MSMA_2.6V
C215 100p
0.1u
C216
0.1u
C217
100K
R213
C218
33p
0.1u
C219
R214
2K
VREG_TCXO_2.85V
C220
33n
NC7SZ74L8X U201
5 4
6 3
7 2
8 1_PRVCC
_CLRCK
QD
GND_Q
012PT
33p
C7
102R
K051K003
002R
47p
C221
VREG_MSMP_2.6V
47pC222
NC7SV00P5X_NL
U202
3
2
4
15
VCC
GND
C200
15p
100
R202
K001
612R
712R
K01
VCHG_VBUS
UAT200
UART_TP
12
11
10
9
8
7
6
5
4
3
2
1GND
RX
TX
NC1
ON_SW
VBAT
NC2
NC3
NC4
DSR
RTS
CTS
GND
RX
TX
VCHAR
ON_SW
VBAT
PWR
URXD
UTXD
3G2.5G
VBATT
39p
C223
MIC_VGND|GND
DNG
V_C
IM
N_TE
SE
R_TB
N_
TES
ER
_NA
LW
BT_HOST_WAKEUP
WLAN_CMDWLAN_CLK
WLAN_SDIO[1]WLAN_SDIO[2]WLAN_SDIO[3]
WLAN_SDIO[0]
BT_PCM_DOUTBT_PCM_DINBT_PCM_SYNCBT_PCM_CLK
BT_UART1_CTS
KLC_
PE
ELS
BT_WAKEUP
R_OI
DU
A_MF
PU
EK
AW_T
SO
H_N
ALW
L_OI
DU
A_MF
BT_UART1_TXDBT_UART1_RXD
REG_ON
BT_UART1_RTS
GPS_LNA_EN
PQ
XR
D_RT
RM
QX
RD_
RTR
MIX
RD_
RTR
PIX
RD_
RTR
PQ
XR_
RTR
MQ
XR_
RTR
MIX
R_RT
RPI
XR_
RTR
MQ
XT_RT
RP
QXT_
RTR
MIXT_
RTR
PIXT_
RTR
FE
R_C
AD_
RTR
TCXO_RTR_19.2MHZ
ANT_SEL3
PM
AR_
AP_
MS
G
GSM_PA_BANDGSM_PA_EN
ANT_SEL2ANT_SEL1
0R_
AP_
W
NO_
XT_RT
R
NO_
AP_0012_
W
1R_
AP_
W
RTR_SSBI
W_900_PA_ON
REMOTE_PWR_ON
REMOTE_PWR_ON
JTAG_PS_HOLD
SDRAM_ADDR[13]
TCXO_PM_19.2MHZ
RTR_TRK_LO_ADJ
RTR_TRK_LO_ADJ
EAR_SENSE
nSDRAM_CAS
SDRAM_BA1SDRAM_BA0
AD
S_C
2I_
OIDUA
MSM_USIM_DATA
MSM_USIM_RSTMSM_USIM_CLK
PS_HOLDPM_INT_N
NO_
ENIL
PO_
ENIL
P_V
CR
N_V
CR
FE
R_C
AD_
AP_
MS
G
TU
O_X
UM
A
OL_K
RT
TRK_LO
OX
CT_CI
MP
PMIC_TCXO
TUO
SE
R_GA
TJn
|T
SR_
NO
Pn
TS
R_N
OPn
nJTAG_RESOUT
TU
OS
ER_
GATJn
MSM_RTCK
KCT
R_M
SM
MSM_TRSTN
NTS
RT_M
SM
KCT_
MS
M
MSM_TCK
SMT_
MS
M
MSM_TMSMSM_TDI
IDT_
MS
M
ODT_
MS
M
MSM_TDON
E_O
XCT
TCXO_EN
IB
SS_
CIM
P
EBI2_DATA[8]EBI2_DATA[9]
EBI2_DATA[10]EBI2_DATA[11]EBI2_DATA[12]EBI2_DATA[13]EBI2_DATA[14]EBI2_DATA[15]
EBI2_DATA[0]EBI2_DATA[1]EBI2_DATA[2]EBI2_DATA[3]EBI2_DATA[4]EBI2_DATA[5]EBI2_DATA[6]EBI2_DATA[7]
SC_
HS
ALF_D
NA
Nn
SDRAM_ADDR[6]
SDRAM_ADDR[0]SDRAM_ADDR[1]SDRAM_ADDR[2]SDRAM_ADDR[3]SDRAM_ADDR[4]SDRAM_ADDR[5]
SDRAM_ADDR[7]SDRAM_ADDR[8]SDRAM_ADDR[9]
SDRAM_ADDR[10]SDRAM_ADDR[11]SDRAM_ADDR[12]
nSDRAM_WE
nSDRAM_RAS
SDRAM_CKE
SDRAM_DCLK1SDRAM_DCLK0
SDRAM_DQS0SDRAM_DQS1SDRAM_DQS2SDRAM_DQS3SDRAM_DQM0SDRAM_DQM1SDRAM_DQM2SDRAM_DQM3
MD_
HB
SU
PD_
HB
SU
L_H
PH
R_H
PH
CD
A_K
OO
H
PCI
M_R
AE
LCS
_C
2I_O
IDUA
YD
AE
R_H
SALF_
DN
AN
NE_
SAI
B_CI
M_S
H
KLC
SY
S_H
BS
U
USBH_SYSCLK
MAX_MUIC_I2C_SCL
CAM_I2C_SCLCAM_I2C_SDA
MAX_MUIC_I2C_SDA
KEY_ROW[0]KEY_ROW[1]
KEY_COL[0]KEY_COL[1]
BL_D
NA
NnB
U_D
NA
Nn
SDRAM_DATA[31]SDRAM_DATA[30]SDRAM_DATA[29]SDRAM_DATA[28]SDRAM_DATA[27]SDRAM_DATA[26]SDRAM_DATA[25]SDRAM_DATA[24]SDRAM_DATA[23]SDRAM_DATA[22]SDRAM_DATA[21]SDRAM_DATA[20]SDRAM_DATA[19]SDRAM_DATA[18]SDRAM_DATA[17]
SDRAM_DATA[15]SDRAM_DATA[14]SDRAM_DATA[13]SDRAM_DATA[12]SDRAM_DATA[11]SDRAM_DATA[10]
SDRAM_DATA[9]SDRAM_DATA[8]SDRAM_DATA[7]SDRAM_DATA[6]SDRAM_DATA[5]SDRAM_DATA[4]SDRAM_DATA[3]SDRAM_DATA[2]SDRAM_DATA[1]
CAM_PCLK
CAM_VSYNCCAM_HSYNC
CAM_DATA[7]CAM_DATA[6]CAM_DATA[5]CAM_DATA[4]CAM_DATA[3]CAM_DATA[2]
CAM_DATA[0]
P_CI
M
CAM_MCLK
SDRAM_DATA[0]
SDRAM_DATA[16]
nRESETOUT
EW_
DN
ANn
EO_
DN
ANn
nSDRAM_CS0
MOTION_INT
TNI_T
VC_
DCL
N_TE
SE
R_TV
C_D
CL
MICROSD_DATA[0]MICROSD_DATA[1]MICROSD_DATA[2]MICROSD_DATA[3]
MICROSD_DET_N
MIC_SEL
MICROSD_CMDMICROSD_CLK
LIN_MOTOR_PWM
TUO
_I
XO
RP
ADS_
C2
I_I
XO
RP
LCS
_C2I
_IXO
RP
VGA_CAM_RESET_N
VGA_CAM_PWDNMOTION_I2C_SDA
MOTION_I2C_SCL
LCD_SUBPM_I2C_SDA
LCD_SUBPM_RESET_N
LIN_MOTOR_EN
CAM_DATA[1]
KC
A_H
CU
OTTOUCH_I2C_SCL
TOUCH_I2C_SDA
N_
TE
SE
R_DCL
LCD_SUBPM_I2C_SCL
CAM_DATA[8]CAM_DATA[9]
SDRAM_CKE1
nSDRAM_CS1
TN
I_
WS
_CIUM
MCAM_RESETMCAM_PWDN
P_AT
AD_
P_ID
DM
M_AT
AD_
P_ID
DM
P_BT
S_P_I
DD
MM_
BTS_
P_ID
DM
DI
_R
EK
AM_DCL
UART2_RXD
UART2_RXD
UART2_RXD
DX
T_
2TR
AU
UART2_TXD
UART2_TXD
KC
EH
C_D
NA
B_FR
RF_BAND_CHECK
CNY
SV_TV
C_D
CL
ANT_SEL0
0001 : Native, ARM9 + ARM11 on PJTAG
MODE[3:0]
ARM9&ARM11 JTAG
0000 : Native, ARM9 on PJTAG, ARM11 on AJTAG
1.0T
ARM9&ARM11 JTAG
UART TP
TCXO Circuit
GPS D FLIP-FLOP
Clesed to TCXO
Clesed to NC7SZ74L8X
Array TP
1% Close to MSM
nip 5E
ot
esolC
1%
1.30V
150K
150K
150K
ADC
150K
R2
2.13V150K
150K
BAND
1.93V
2100 + 850
HKAIN0 : RF BAND Check ADC
2100 + 900
1900 + 850 680K
100K
1.73V300K
R1
1.04V
430K
- 187 -
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
4.7u
C340
C315
4.7u
U200MSM7227
L5
E10
AE22
AD25
AE18
AE15
AE11
AE7
Y5
T5
H25
E25
E22
Y25
V25
T25
P25
M25
K25
AE12
AC10
AC5
Y8
AF26
AF25
AF3
AF2
AE26
AB11
Y20
W19
U17
U11
P23
N23
M11
L17
L12
K23
K9
J19
G23
E19
C2
B26
B3
B2
T2
R8
R5
P9
N8
K6
K5
J6
J5
F9
E6
C8
C3
U6
T6
T3
R9
P8
P5
N9
K8
J9
J8
H6
H5
E9
E5
D3
B8
AE13
AE5
AB14
AB10
AA22
Y19
Y6
V22
U14
T16
T15
T14
T13
T12
R17
R16
R15
R14
R13
R12
P22
P17
P16
P15
P14
P13
P12
P11
P6
N22
N16
N15
N14
N13
N12
M16
M15
M14
M13
M12
L15
L13
L6
K22
G22
F19
F15
F10
E14
B4
7GA
6GA
5GA
4GA
3GA
72G
A
62G
A
52G
A
42G
A
32G
A
22G
A
12G
A
02G
A
2GA
91G
A
81G
A
71G
A
61G
A
51G
A
41G
A
31G
A
21G
A
11G
A
01G
A
1GA
72F
A
1FA
72E
A
1EA
72D
A
1DA
72C
A
1CA
72B
A
1BA
72A
A
1AA
72A
62A
52A
42A
32A
22A
12A
02A
91A
81A
71A
61A
51A
41A
31A
21A
11A
01A
9A
8A
7A
6A
5A
4A
3A
2A
1A
61E
41
F
5A
A
22
H
11N
5N
81
E
31
E
5U
9T
72Y
1Y
72
W
1W
72V
1V
72U
1U
72T
1T
72
R
1R
72P
1P
72N
1N
72M
1M
72
L
1L
72K
1K
72J
1J
72H
1H
72
G
1G
72F
1F
72E
1E
72D
1D
72
C
1C
72
B
1B
9G
A
8GA
56_
CN
66_
CN
76_
CN
86
_CN
96
_CN
07_
CN
17_
CN
27_C
N37_
CN
47_
CN
57_
CN
67
_CN
77
_CN
87_
CN
97_
CN
08_C
N18_
CN
28_
CN
38_
CN
48
_CN
58
_CN
68_
CN
78_
CN
88_
CN
98_C
N09_
CN
19_
CN
29_
CN
39
_CN
49_
CN
59_
CN
69_
CN
79_C
N89_
CN
99_
CN
001
_CN
10
1_CN
20
1_CN
301
_CN
401
_C
N
1DVS
R2DV
SR
8P_
DDV
9P_D
DV
01P_
DDV
GRP_ESU
FQ_DD
V
1C_SNS_
DDV
2C_
SNS
_D
DV
6P2
_YHPBSU
_DDV
3P
3_
YHPBS
U_DDV
1_CN
2_CN
3_CN
4_CN
5_CN
6_CN
7_CN
8_CN
9_CN
01_CN
11_CN
21_CN
31_CN
41_CN
51_CN
61_
CN
71_CN
81_CN
91_CN
02_CN
12_CN
22_CN
32_CN
42_
CN
52_CN
62
_CN
72_CN
82_CN
92_CN
03_CN
13_CN
23_CN
33_CN
43
_CN
53_CN
63_CN
73_CN
83_CN
93_CN
04_CN
14_CN
24_CN
34_CN
44_CN
54_CN
64_CN
74_CN
84_CN
94_
CN
05_CN
15_CN
25_CN
35_CN
45_CN
55_CN
65_CN
75_CN
85_CN
95_CN
06_CN
16_CN
26_CN
36_CN
46_CN
GND1GND2GND3GND4GND5GND6GND7GND8GND9GND10GND11GND12GND13GND14GND15GND16GND17GND18GND19GND20GND21GND22GND23GND24GND25GND26GND27GND28GND29GND30GND31GND32GND33GND34GND35GND36GND37GND38GND39GND40GND41GND42GND43GND44GND45GND46GND47GND48GND49GND50
GND_A1GND_A2GND_A3GND_A4GND_A5GND_A6GND_A7GND_A8GND_A9GND_A10GND_A11GND_A12GND_A13GND_A14GND_A15GND_A16
VDD_A1VDD_A2VDD_A3VDD_A4VDD_A5VDD_A6VDD_A7VDD_A8VDD_A9VDD_A10VDD_A11VDD_A12VDD_A13
VDD_C1_1VDD_C1_2VDD_C1_3VDD_C1_4VDD_C1_5VDD_C1_6VDD_C1_7VDD_C1_8VDD_C1_9VDD_C1_10VDD_C1_11VDD_C1_12VDD_C1_13VDD_C1_14VDD_C1_15VDD_C1_16VDD_C1_17VDD_C1_18VDD_C1_19VDD_C1_20VDD_C1_21VDD_C1_22VDD_C1_23VDD_C1_24
VDD_C2_1VDD_C2_2VDD_C2_3
VDD_MDDI
VDD_P1_1VDD_P1_2VDD_P1_3VDD_P1_4VDD_P1_5VDD_P1_6
VDD_P2_1VDD_P2_2VDD_P2_3
VDD_P3_1VDD_P3_2VDD_P3_3VDD_P3_4VDD_P3_5VDD_P3_6
VDD_P4_1VDD_P4_2
VDD_P7_1VDD_P7_2
V3.3_B
SU
V6.2_A
MS
M_G
ER
V
10n
C300
V9.2_2X
UA_
GE
RV
V8.1_E
MS
M_G
ER
V
VREG_MSMP_2.6V
VREG_MSME_1.8V
VREG_MSMC2_1.25V
VREG_MSMC1_1.35V
VREG_MSMA_2.6V
4.7u
C342
0.1u
C301
USB_3.3V
C303
1n
C304
1n1n
C305C306
1n
C307
1n1n
C310
1n
C311
10n
C312C313
10n
1n
C314
TP
TP300
TP
TP301
C316
0.1u
DNI
R300
C317
0.1u0.1u
C318
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
LGE Internal Use Only
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
10n
C319C321
0.1u
1n
C322C323
1n
C324
0.1u
C325
10n0.1u
C326
10n
C327
0.1u
C328C329
0.1u
0.1u
C330
0.1u
C331C332
1n
R301
10K
10u
C333
10u
C334
C335
10u
C336
10u
C337
10u
VREG_MSMA_2.6VVREG_MSMP_2.6V
0.1u
C338
VREG_MSMC1_1.35V VREG_MSME_1.8VVREG_MSMC2_1.25V
VSNS_MSMC2_1.25V
VSNS_MSMC1_1.25V
U301H8BCS0UN0MCR-4EM
01R
9R
2R
1R
01A
9A
2A
01P
1P
4M
1G
3F01B
2B
1B
E5H7N5G5B5J7E7G9F8F10G6E9J8D10H2C9G2N9K1M10E3L9H8K9G8J10J2
M1C7P8C8H10D7H1D8D1D6B8E8D5M2F6P9F7J1E6H9H4C1H3B9F5G10E4F9F4E10G4D9G3C10J4N10H5M9H6L10J5K10J6J9G7P6K6C5K5K7C6L8C3K8C4L7B4L6B7L5B3L4B6
K2N8J3M7M3N7F1P5F2P4K3N4D4P3E2P2D3M8E1N6D2M6C2P7L3M5L2N3L1N2K4N1
IO0 A0IO1 A1IO2 A2IO3 A3IO4 A4IO5 A5IO6 A6IO7 A7IO8 A8IO9 A9IO10 A10IO11 A11IO12 A12IO13 A13IO14 BA0IO15 BA1
_CE DQ0_RE DQ1_WEN DQ2CLE DQ3ALE DQ4_WP DQ5R_B DQ6
DQ7VSSN1 DQ8VSSN2 DQ9VSSQ1 DQ10VSSQ2 DQ11VSSQ3 DQ12VSSQ4 DQ13VSSQ5 DQ14VSSQ6 DQ15VSSQ7 DQ16VSSQ8 DQ17VSSQ9 DQ18VSSQ10 DQ19VSS1 DQ20VSS2 DQ21VSS3 DQ22VSS4 DQ23VSS5 DQ24VSS6 DQ25
DQ26VDD1 DQ27VDD2 DQ28VDD3 DQ29VDD4 DQ30VDD5 DQ31VDD6
_CSVDDQ0 CLKVDDQ1 _CLKVDDQ2 CKEVDDQ3 _WEDVDDQ4 _RASVDDQ5 _CASVDDQ6 DQM0VDDQ7 DQM1VDDQ8 DQM2VDDQ9 DQM3
DQS0VCCN1 DQS1VCCN2 DQS2
DQS3
1C
N2
CN
3C
N4
CN
5C
N6
CN
7C
N8
CN
1U
ND
2U
ND
3U
ND
4U
ND
5U
ND
6U
ND
7U
ND
VSNS_MSME_1.8V
0.1u
C339
TP
TP302
TP303
TP
TP
TP304
TP305
TP
TP
TP306
1n
C341
TP307
TP
VREG_MSME_1.8V
VREG_MSME_1.8V
TP
TP308
VREG_MSME_1.8V
100KR308
0.1u
C343
VREG_MSME_1.8V
SDRAM_ADDR[13]
nSDRAM_CAS
SDRAM_BA1SDRAM_BA0
EBI2_DATA[8]EBI2_DATA[9]
EBI2_DATA[10]EBI2_DATA[11]EBI2_DATA[12]EBI2_DATA[13]EBI2_DATA[14]EBI2_DATA[15]
EBI2_DATA[0]EBI2_DATA[1]EBI2_DATA[2]EBI2_DATA[3]EBI2_DATA[4]EBI2_DATA[5]EBI2_DATA[6]EBI2_DATA[7]
nNAND_FLASH_CS
SDRAM_ADDR[6]
SDRAM_ADDR[0]SDRAM_ADDR[1]SDRAM_ADDR[2]SDRAM_ADDR[3]SDRAM_ADDR[4]SDRAM_ADDR[5]
SDRAM_ADDR[7]SDRAM_ADDR[8]SDRAM_ADDR[9]SDRAM_ADDR[10]SDRAM_ADDR[11]SDRAM_ADDR[12]
nSDRAM_WEnSDRAM_RAS
SDRAM_CKESDRAM_DCLK1SDRAM_DCLK0
SDRAM_DQS0SDRAM_DQS1SDRAM_DQS2SDRAM_DQS3
SDRAM_DQM0SDRAM_DQM1SDRAM_DQM2SDRAM_DQM3
NAND_FLASH_READY
nNAND_LBnNAND_UB
SDRAM_DATA[31]SDRAM_DATA[30]SDRAM_DATA[29]SDRAM_DATA[28]SDRAM_DATA[27]SDRAM_DATA[26]SDRAM_DATA[25]SDRAM_DATA[24]SDRAM_DATA[23]SDRAM_DATA[22]SDRAM_DATA[21]SDRAM_DATA[20]SDRAM_DATA[19]SDRAM_DATA[18]SDRAM_DATA[17]
SDRAM_DATA[15]SDRAM_DATA[14]SDRAM_DATA[13]SDRAM_DATA[12]SDRAM_DATA[11]SDRAM_DATA[10]SDRAM_DATA[9]SDRAM_DATA[8]SDRAM_DATA[7]SDRAM_DATA[6]SDRAM_DATA[5]SDRAM_DATA[4]SDRAM_DATA[3]SDRAM_DATA[2]SDRAM_DATA[1]SDRAM_DATA[0]
SDRAM_DATA[16]
nRESETOUT
nNAND_WEnNAND_OE
nSDRAM_CS0
1EKC
_MARDS
1SC_MARD
Sn
VREG_MSMC2_1.25V|VSNS_MSMC2_1.25V
VREG_MSME_1.8V|VSNS_MSME_1.8V
VREG_MSMC1_1.35V|VSNS_MSMC1_1.25V
MCP (Hynix)MSM7227 Power Part
Cap for MSM7227 Power
NAND 4G/DDR 2G (DDR400MHz)
7. CIRCUIT DIAGRAM
- 188 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
U404
MAX14528
9 6
5 3
4
8 2
7 1IN1OUT1
IN2OUT2
IC1
OVLOIC2
DN
G
DN
GP
VCHG_VBUS
R435
470Kohms
434
R
smh
oK0
86
U403 NUS5530MN
5
64
73
82
91
10DRAIN_B
NC1 COLLECTOR_B
COLLECTOR EMITTER
SOURCE BASE
DRAIN NC2
GATE
VCHG_VBUS
VREG_MSMP_2.6V
334R
smho
K6.08
VBATT
C45833u
1uF
NFM21PC105B1A3FL400
4 3
2 1INOUT
G1G2
KQ03LQ-3R
CN401
3
2
1D1
D2
VBATT+VPWR
234R
smho
m001
D401
C455
39p
K7.4
924R
VREG_MSMP_2.6V
0.1u
C454
C453
0.1u
824R
K01
C451
1u
0.1u
C450
K7.4
724R
0.1u
C449
VCHG_VBUS
33uFC448
ISNS_M
2.2K
R426
U401RP103K331D
5
3 24 1
VOUTVDDGNDCE D
NG
P USB_3.3V
1u
C447
+VPWR
4.7uL403
4.7uL402
L401 4.7u
424R
K051
VREG_MSMP_2.6V
u2.2644
C
VREG_MSME_1.8V
R423
1K
VREG_LCD_1.8V
C445
1u
22p
C444
VREG_RGB_1.5V
L400 4.7u
2.2uC442
SC_MINI
SC401
1
10u
C441
K1
834R
1u
C461
+VPWR
CM315_12_5PF
X40032.768KHz 2
1
0.1uC440
VREG_MSME_1.8V
4.7uC439
C4382.2u
VREG_SYNTH_2.75V
VREG_RF_2.7V
+VPWR
M_S
NSI
PM7540U400
9J
8J
7J
6J
5J
9H
8H
7H
6H
5H
9G
8G
7G
6G
5G
9F
8F
7F
6F
5F
9E
8E
7E
6E
5E
H1
E10F1
F10E1
C12N2
B1
M12B2
K7
A5
N13A4
M13B5
B4
G10A7
D9A6
H12B7
B6
C13
A13D10
A12K10
H10
G12J10
G1
M1K4
D13J4
E12H4
N11M2
A3L2
A10H2
A8
H13K2
G13J2
A11G4
K13F4
E13D5
B13B3
A9M5
N12N3
J13N1
A2M3
K6
M4K5
N4K9
M9K8
N10M11
M6L12
N6A1
M8D4
N8B12
J1D8
K1N5
M7
2G
21
D
7D
8B
01
M
6D
9B
21
J
31
F
21
F
21
K
7N
9N
01
B
31
L
11
B
2F
4E
2C
1C
1D
1L
2D
2E
GH
CV
N_LTC_
GH
C
SU
BV_
BS
U
N_LTC_
BS
U
P_S
NSI
M_S
NSI
N_TEF_T
AB
TA
BV
NIO
CV
PU
KC
AB_
V
AN
A_D
DV
E_1C_
DD
V
AP_2
C_D
DV
2P
G_D
DV
6P
G_D
DV
2E
MS
M_D
DV
PM
SM_
DD
V
1FR_
DD
V
2FR_
DD
V
MIU
R_D
DV
RK
PS_L_
DD
V
RK
PS_
R_D
DV
OX
CT_D
DV
NAL
W_D
DV
MPP_1
MPP_2 VSW_5V
MPP_3 VREG_5V
MPP_4 VSW_MSMC1
MPP_5 VREG_MSMC1
MPP_6 VSW_MSMC2
MPP_7 VREG_MSMC2
MPP_8 VSW_MSME
MPP_9 VREG_MSME
MPP_10 VSW_PA
MPP_11 VREG_PA
MPP_12
MPP_13 VREG_GP1
MPP_14 VREG_GP2
MPP_15 VREG_GP3
MPP_16 VREG_GP4
MPP_17 VREF_GP5
MPP_18 VREG_GP6
MPP_19 VREG_MMC
MPP_20 VREG_MSMA
MPP_21 VREG_MSME2
MPP_22 VREG_MSMP
VREG_RFRX1
USB_ID VREG_RFRX2
USB_D_P VREG_RFTX
USB_D_M VREG_RUIM1
USB_OE_N VREG_SYNT
USB_DAT VREG_TCXO
USB_SE0 VREG_USB
VREG_WLAN
SBST MIC_BIAS
SBCK
SBDT_SSBI REF_ISET
MSM_INT_N REG_GND
REF_BYP
SPKR_IN_L_M
SPKR_IN_L_P TCXO_IN
SPKR_OUT_L_M TCXO_EN
SPKR_OUT_L_P TCXO_OUT
SPKR_IN_R_P
SPKR_IN_R_M XTAL_IN
SPKR_OUT_R_P XTAL_OUT
SPKR_OUT_R_M
SLEEP_CLK
VIDEO_IN AMUX_OUT
VIDEO_OUT
VIB_DRV_N KPD_PWR_N
KPD_DRV_N PON_RESET_N
LCD_DRV_N PS_HOLD
FLSH_DRV_N
1D
NG
2D
NG
3D
NG
4D
NG
5D
NG
6D
NG
7D
NG
8D
NG
9D
NG
01D
NG
11D
NG
21D
NG
31D
NG
41D
NG
5 1D
NG
61D
NG
71D
NG
81D
NG
91D
NG
02D
NG
12D
NG
22D
NG
32D
NG
42D
NG
52D
NG
R409 121K
KDS114E
D400
C437 0.1u
1nC436
22pC435
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
LGE Internal Use Only
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
VREG_TCXO_2.85V
0.1uC434
C433 0.1u
10K
R407
0.1u
C432
51R406
C431
1n
2.2uC430
22pC429
2.2uC428
1n
C427
C426
33p
2.2uC425
VBATT
VREG_MSMC1_1.35V
VREG_MMC_3.0V
VCHG_VBUS
200K
R404
C424
1n
VREG_MSMP_2.6V
1nC423
C422 0.1u
VREG_RUIM_3.0V
C4212.2u
C420
4.7u
C4192.2u2.2u
C418
C417 0.1u
VREG_MSMA_2.6V
10u
C416
C4152.2u
R436
1K
VREG_MSMC2_1.25V
VREG_SMPS_2.1V
C414 0.1u
C413 0.1u
C412
1n
C411
1u
VREG_MSMP_2.6V
4.7uC410
0.1uC409
R403
4.7
4.7u
C408
2.2uC407
VREG_MOTOR_3.0V
TP400
C406 0.1u
C4054.7u
C404 0.1u
C403 0.1u
C402
33p
4.7uC401
C400 0.1u
VREG_AUX2_2.9V
VREG_RGB_2.6VVREG_LCD_2.8V
HSMU-5SB-24DR2
CN400
15
13
11
9
7
5
4
3
2
1
14
12
10
8
6
U402MAX14526EEWP+TCC6
2B
1C
2C
C3 A2
C4
D3
D1 D4
A1
B1
A3
B4 B3
B5 A5
C5 A4
D5 D2BATVB
DN1COMN1
DP2COMP2
U1UID
U2
RES
MIC
AUD1CAP
AUD2
GND
ISETIC
LC
S
AD
S
TNI
47K
R437
934R
K01
TP403
TP
DNI
C459
C457
1u
2.2uC460
VREG_SENSOR_2.6V
SC_MINI_BRACKET
SC402
21
TP404
K003
524R
ZD400
PLW0501H-LF
RW
PV+
+VPWR
SLEEP_CLK
REMOTE_PWR_ON
JTAG_PS_HOLD
TCXO_PM_19.2MHZ
MSM_USIM_DATA
MSM_USIM_RST
MSM_USIM_CLK
PS_HOLD
PM_INT_N
GSM_PA_DAC_REF
AMUX_OUT
PMIC_TCXO
nPON_RST
TCXO_EN
PMIC_SSBI
USBH_DM
USBH_DP
MAX_MUIC_I2C_SCLMAX_MUIC_I2C_SDA
MUIC_SW_INT
UART2_RXDUART2_TXD
VSNS_MSMC2_1.25V
VSNS_MSME_1.8V
VSNS_MSMC1_1.25V
PU_
KC
AB
V
USIM_DATA
USIM_RST
USIM_CLK
PM_ON_SW
USB_LDO_EN
USB_LDO_EN
MAX_DP
MAX_DP
MAX_DM
MAX_DM
PCB_REVISION
PCB_REVISION
CHG_CTL_N
N_LTC_
GH
C
BATT_FET_N
N_TEF_TT
AB
ISNS_P
P_S
NSI
USB_ID
USB_ID
VBAT_TEMP
VBAT_TEMP
VBAT_SENSE
VBAT_SENSE
1.30V
C432 close to MSM
C459 Close to MSM
uUSB 5pinClose by uUSB CONN
Close by uUSB CONN
OVPchange circuit at REV B
Battery Charging Circuit
Route together from both end of resistor 0.1ohm.
2mm
Shield CAN & 5pin IO Bracket
1%
2mm(to the Batt. Conn.)2mm(to the GSM PAM)
2mm
MAX14526
2mm
USB 3.3V LDO
150K
150K
150K
ADC
150K
TEST&E
150K
0.3mm
R2
2.13V
10K
68K
47K
150K
150K
Place crystal and load caps close to PM7540
REV
1.93V
C&H
B&G
1%
Local Ground Plan
PM7540
Place in PM7540 room at shield edge
A&F
Rev.1.1
150K
150K
PCB Revision Check ADC
Route together
0.16V
Rev.1.0
D&I
0.5mm
Rev.1.2 680K
0.81V
0.5mm
These CAPs close to inductors100K
1.73V
0.62V
300K
R1
0.5mm
1.04V
430K
Route together
Place close to PM7540 pins
- 189 -
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
1R
2.2K
D505
D504
43
52
61
V6.2_R
OS
NE
S_G
ER
V
J1
9 8
10 7
6 3
5 2
4 1VCCGND1
RSTVPP
CLKIO
GND2GND5
GND3GND4
U500
5
3 24 1
VOUTVDDGNDCE D
NG
P
CN500
4140
4239
4338
4437
4536
4635
4734
4833
4932
5031
5130
5229
5328
5427
5526
5625
5724
5823
5922
6021
6120
6219
6318
6417
6516
6615
6714
6813
6912
7011
7110
729
738
747
756
765
774
783
792
801
10p
C522
1800FB503
V6.2_P
MS
M_G
ER
V
V0 .3_R
OTO
M_G
ER
V
V0.3_C
MM_
GE
RV
V8. 2_D
CL_G
ER
V
V6.2_B
GR_
GE
RV
1u
125C
1M705R
VREG_MSMP_2.6V
1800FB504
10K105R
2.2u
405
C
VREG_MSMP_2.6V
22p
C514D501
1800
FB502
J500
C8
100p
2R
1K
47
R508
D502
4.7K505R
100n
L500
47p
C517
47p
C518 D503
15K20 5R
1u
C500
VREG_RUIM_3.0V
VREG_RUIM_3.0V
22p
C520
22p
C519
V5.1_B
GR_
GE
RV
V8. 1_D
CL_G
ER
V
RW
PV+
4.7K005R
VREG_MSMP_2.6V
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
LGE Internal Use Only
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
4.7u
C503
C505
1u
10u
C5061u
205C
22nC509
22nC510
220nC508
220nC507
+VPWR
IC500
4C
3D
B4
D4
C3
B3
B5B2
D5C2
C1
D2
D1
A2
A1A5
A4
5C
1B
3A
SS
V
DD
V
DD
VPC1N
C1P HPR
HPL
INA2
INA1
INB2
INB1 OUT+
BIAS OUT-
SDA
SCL
RXIN+
RXIN- DN
G
DN
GP
1u
105C
MIC_VGND
FM_ANT
EAR_SENSE
AUDIO_I2C_SDA
LINE_ONLINE_OP
RCV_P
RCV_N
HPH_LHPH_R
HOOK_ADC
HOOK_ADC|EAR_MICP
EAR_MICP
AUDIO_I2C_SCL
HS_MIC_BIAS_EN
MIC_BIAS
CAM_I2C_SCL
CAM_I2C_SDA
KEY_ROW[0]
KEY_ROW[1]
KEY_COL[0]
KEY_COL[1] CAM_PCLK
CAM_VSYNC
CAM_HSYNC
CAM_DATA[7]
CAM_DATA[6]
CAM_DATA[5]
CAM_DATA[4]
CAM_DATA[3]
CAM_DATA[2]
CAM_DATA[0]
MIC_P
CAM_MCLK
MOTION_INT
LCD_CVT_INT
LCD_CVT_RESET_N
MICROSD_DATA[0]
MICROSD_DATA[1]
MICROSD_DATA[2]
MICROSD_DATA[3]
MICROSD_DET_N
MIC_SEL
MICROSD_CMD
MICROSD_CLK
LIN_MOTOR_PWM
PROXI_OUT
PROXI_I2C_SDA
PROXI_I2C_SCL
VGA_CAM_RESET_N
VGA_CAM_PWDN
MOTION_I2C_SDA
MOTION_I2C_SCL
LCD_SUBPM_I2C_SDA
LCD_SUBPM_RESET_N
LIN_MOTOR_EN
CAM_DATA[1]
TOUCH_ACK
TOUCH_I2C_SCL
TOUCH_I2C_SDA
LCD_RESET_N
LCD_SUBPM_I2C_SCL
CAM_DATA[8]
CAM_DATA[9]
MCAM_RESET
MCAM_PWDN
MDDI_P_DATA_P
MDDI_P_DATA_M
MDDI_P_STB_P
MDDI_P_STB_M
LCD_MAKER_ID
VBACK_UPUSIM_DATA
USIM_DATAUSIM_RST
USIM_RST
USIM_CLK
USIM_CLK
PM_ON_SW
SPK_N
SPK_N
EAR_R
EAR_R
EAR_L
EAR_L
SPK_P
SPK_P
LCD_CVT_VSYNC
Close
EAR_SENSE
3.5pi Ear Jack Circuit
OpenHIGH (detect)
LOW
USIM
MAIN & SUB I/F CONNECTOR
AUDIO_SUB_SYSTEM
S/W
7. CIRCUIT DIAGRAM
- 190 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
U600
039282726252423222120291817161
31
3215
14
33
3413
3512
3611
3710
389
398
407
6
415
4
42
433
442
45
1
6474849405152535451
DN
G
2D
NG
3D
NG
4D
NG
B_E
KA
W_TS
OH_L
W
DXT_T
RA
U_TB
N_ST
C_TR
AU_T
B
N_ST
R_TR
AU_T
B
DX
R_TR
AU_T
B
ANT
BT_PCM_CLK
GND5 BT_PCM_OUT
VDD_WL_PA BT_PCM_SYNC
BT_PCM_IN
SDIO_CMD
SDIO_CLK VDD_BT_PA
SDIO_D3
SDIO_D2 S_CLK_IN
SDIO_D1 GND6
SDIO_D0 FM_ANT
WL_RST_N BT_GPIO_0
WL_WAKE_B BT_GPIO_1
REG_ON BT_GPIO_3
VBAT_IN BT_GPIO_4
BT_GPIO_7
SR_VLX1
SR_VLX1BB F_CLK_IN
F_CLK_OUT
BB2
XLV_
RS
BBT
UO
V_R
S
OID
DV
UP_L
ATX
DS_
OID
DV
TU
O_2P1_
GID
TU
O_2P1_
GLN
A
ODL
V2P1_
NIV
TU
O_2O
DLNL
AD
S_ TB
LC
S_TB
1OI
DU
A
2OI
DU
A
N_TS
R_TB
7D
NG
L6014.7n
p5.1
426C
C604
0.5p
ANT600
SDBTPTR3015
2
31
4DUMMY3
FEED DUMMY2
DUMMY1
600
FB600
1u
C621C6208p
VREG_MSMP_2.6V
C606 820p
DNI
C603
C605 100p
1nC622
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
LGE Internal Use Only
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
1u
C601
VDD_TCXO
2.2uFC619
+VPWR
C600
1u
VDD_TCXO
R605
100K
26MHz
X600TG-5010LH-87N
4 2
3 1NCOUT
GNDVCC
U601
5
3 24 1
VOUTVDDGNDCE D
NG
P
706C
u1 u1806
C
u1906
C
016C
FU1.0
Fu7.4116
C
Fu2.2206
C
C6120.1UF
C6130.1UF
4.7uL600
4.7uFC615 3.3uL610
C6160.1UF
C6174.7uF
0
R600
0.1u
C625C618
10uF
10u
C614
TP602
+VPWR
VREG_MSMP_2.6V
VREG_MSMP_2.6V
N_TE
SE
R_TB
WLAN_RESET_NBT_HOST_WAKEUP
WLAN_CMDWLAN_CLK
WLAN_SDIO[1]WLAN_SDIO[2]WLAN_SDIO[3]
WLAN_SDIO[0]
BT_PCM_DOUT
BT_PCM_DINBT_PCM_SYNC
BT_PCM_CLK
BT_UART1_CTS
SLEEP_CLK
BT_WAKEUP
R_O
IDU
A_M
F
WLAN_HOST_WAKEUP
FM_ANT
L_OI
DUA
_M
F
BT_UART1_TXD
BT_UART1_RXD
QE
R_KL
C
CLK_REQ
ANT_WLAN_BT
ANT_WLAN_BT
REG_ON
CLK_IN
CLK_IN
BT_UART1_RTS
LDO for TCXO26MHz TCXO
WLAN+BT+FM
close to 3
close to 17
- 191 - LGE Internal Use OnlyCopyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
FL100
01
5
64
73
82
91
7.5pF
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
U101D2D1
6F1A
1F6A
E3F2
E5D3F5E2E6E1
F3C1
A4
C2E4B3D4A3B4B1D5B2A2
F4D6B6
5A
6C
5B
5C
4C
N1C
P1C
N2C
P 2C
DN
GP
C
VBATCP VOUTVBAT
LED1LED2
VIO LED3RESETB LED4SCL LED5SDA LED6
WPWMIN
LEDGNDSBIAS
SSENS LDO1OSGND LDO2OGC2 LDO3OGC1 LDO4O2T 4T 1T 3T
LED7LED8
CN100
31 30
32 29
33 28
34 27
35 26
36 25
37 24
38 23
39 22
40 21
41 20
42 19
43 18
44 17
45 16
46 15
47 14
48 13
49 12
50 11
51 10
52 9
53 8
54 7
55 6
56 5
57 4
58 3
59 2
60 1
G1G2
G3G4
7.5pF
FL101
01
5
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
7.5pF
FL102
01
5
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
7.5pF
FL103
01
5
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
7.5pF
FL104
01
5
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
7.5pF
FL105
01
5
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
7.5pF
FL106
01
5
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
7.5pF
FL107
01
5
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
100p
C128
0
R100
100201R
100p
C126
15p
C102
VREG_RGB_2.6V
VREG_LCD_1.8V
10nC103
100p
C127
U100
9B
9D
1F
1E
11L
6J
9F
3F
8C
11A
1A
L1B11
K2C10
K1A8
K3
H2E9
L2A9
B10
G10
H10E2
H11E3
G11B8
G3
H3C9
G2
H1D10
J4D11
K4F10
L4F11
J5
L3C2
J1D2
J2C1
K5A7
L5
K6A2
L6A3
J7B2
J8D1
L7C3
K7A4
K9B3
K8B4
L8B5
L9A5
K10C5
L10B6
J10A6
J9C6
J11C7
K11B1
11C
01A
01E
11E
1G
2F
3J
9H
3D
7B
9G
4C
1D
DV
ER
OC
2D
DV
ER
OC
1D
DV
OIH
2D
DV
OIH
1D
DV
OIP
2D
DV
OIP
DD
VM
AR
D
CC
VM
AR
D
DD
V81D
M
DD
V51D
M
DD
VLLP
DD
VC
SO
GPIOH0 FPDAT0
GPIOH1 FPDAT1
GPIOH2 FPDAT2
GPIOH3 FPDAT3
GPIOH4 FPDAT4
GPIOH5 FPDAT5
GPIOH6 FPDAT6
GPIOH7 FPDAT7
GPIOH8 FPDAT8
GPIOH9 FPDAT9
GPIOH10 FPDAT10
GPIOH11 FPDAT11
GPIOH12 FPDAT12
GPIOH13 FPDAT13
GPIOH14 FPDAT14
GPIOH15 FPDAT15
FPDAT16
GPIOH16_ADS FPDAT17
GPIOH17_RD_ GPIOP0_FPDAT18
GPIOH18_WR_ GPIOP1_FPDAT19
GPIOH19_CS GPIOP2_FPDAT20
GPIOP3_FPDAT21
MDATA0P GPIOP4_FPDAT22
MDATA0M GPIOP5_FPDAT23
MSTBP GPIOP12
MSTBM GPIOP13
GPIOP14
INT GPIOP15
RESET_
TE FPFRAME
CNF FPLINE
TESTEN FPSHIFT
FPDRDY
PLP
PLPAV FPCS_1
MDREF FPCS_2
FPSCK
CLKI FPAO
OSCI FPSO
OSCO NC
1S
SV
2S
SV
3S
SV
4S
SV
5S
SV
6S
SV
7S
SV
1S
SV
MA
RD
2S
SV
MA
RD
SS
VD
M
SS
VLLP
3.3K
R103
100401R
2.2u
C105
2.2u
C1062.2u
C107
2.2u
C108
2.2u
C109
U102
43
52
61VCC1 VCC
A NC
GND Y
VREG_RGB_1.5V
DNI
C110
4.7nC111
1
R105
VREG_LCD_1.8VVREG_LCD_2.8V
0.1u
C1120.1u
C113
TOUCH_VDD_2.8V
0.1u
C114
2.2u
C115
CAM_AF_2.8V
2.2u
C116
TOUCH_VDD_2.8V
4.7K701R
8208 01R
VREG_MSMP_2.6V
4.7K011R
VREG_MSMP_2.6V
27MHz
X100FA-238_27MHz_9PF
2 1
3 4
5.6p
C1175.6p
C118
1M
R111
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
L
K
J
I
H
G
F
E
D
C
B
A
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
LGE Internal Use Only
TP101
1u
C1191u
C120
+VPWR
1u
121
C
CAM_VDD_1.8V CAM_VDD_2.8V
2.2u
C1222.2u
C123
1u
C124
VREG_MSMP_2.6V
10u
521
C
1211R
VREG_RGB_2.6VVREG_LCD_1.8V
DNI311R
LCD_CVT_INTLCD_CVT_RESET_N
TOUCH_I2C_SDA
TOUCH_I2C_SCL
GAIN1GAIN2
LCD_SUBPM_RESET_N
SBIAS
LCD_SUBPM_I2C_SCLLCD_SUBPM_I2C_SDA
SENS
TOUCH_ACK
LCD_RESET_N
LCD_CVT_VSYNC
MDDI_P_DATA_P
MDDI_P_STB_P
LCD_MAKER_ID
LCD_SCL
LCD_SCL
LCD_SDI
LCD_SDI
LCD_CS_N
LCD_CS_N
LCD_SDO
LCD_SDO
MLED_OUT
MLED_OUTMLED1
MLED1
MLED3
MLED3
MLED5
MLED5
LCD_PWM
LCD_PWM
MLED2
MLED2
MLED4
MLED4
MLED6
MLED6
FLT_LCD_R[7]
FLT_LCD_R[7]
FLT_LCD_R[6]
FLT_LCD_R[6]
FLT_LCD_R[4]
FLT_LCD_R[4]
FLT_LCD_R[3]
FLT_LCD_R[3]
FLT_LCD_R[2]
FLT_LCD_R[2]
FLT_LCD_R[1]
FLT_LCD_R[1]
FLT_LCD_R[0]
FLT_LCD_R[0]
FLT_LCD_G[7]
FLT_LCD_G[7]
FLT_LCD_G[6]
FLT_LCD_G[6]
FLT_LCD_G[2]
FLT_LCD_G[2]
FLT_LCD_G[0]
FLT_LCD_G[0]
FLT_LCD_B[7]
FLT_LCD_B[7]
FLT_LCD_B[6]
FLT_LCD_B[6]
FLT_LCD_B[5]
FLT_LCD_B[5]
FLT_LCD_B[4]
FLT_LCD_B[4]
FLT_LCD_B[3]
FLT_LCD_B[3]
FLT_LCD_B[2]
FLT_LCD_B[2]
FLT_LCD_B[1]
FLT_LCD_B[1]
FLT_LCD_B[0]
FLT_LCD_B[0]
FLT_LCD_SCL
FLT_LCD_SCL
FLT_LCD_SDO
FLT_LCD_SDO
FLT_LCD_HSYNC
FLT_LCD_HSYNC
FLT_LCD_VSYNC
FLT_LCD_VSYNC
FLT_LCD_SDI
FLT_LCD_SDI
LCD_VSYNC
LCD_VSYNC
LCD_R[6]
LCD_R[6]
LCD_R[3]
LCD_R[3]
LCD_R[2]
LCD_R[2]
FLT_LCD_DEN
FLT_LCD_DEN
LCD_DEN
LCD_DEN
LCD_HSYNC
LCD_HSYNC
LCD_B[0]
LCD_B[0]
LCD_B[1]
LCD_B[1]
LCD_G[0]
LCD_G[0]
LCD_G[1]
LCD_G[1]
LCD_R[0]
LCD_R[0]
LCD_R[1]
LCD_R[1]
LCD_R[4]
LCD_R[4]
LCD_B[5]
LCD_B[5]
LCD_B[6]
LCD_B[6]
LCD_B[7]
LCD_B[7]
LCD_G[5]
LCD_G[5]
LCD_G[6]
LCD_G[6]
LCD_G[7]
LCD_G[7]
LCD_R[5]
LCD_R[5]
LCD_B[2]
LCD_B[2]
LCD_B[3]
LCD_B[3]
LCD_B[4]
LCD_B[4]
LCD_G[2]
LCD_G[2]
LCD_G[3]
LCD_G[3]
LCD_G[4]
LCD_G[4]
LCD_R[7]
LCD_R[7]
FLT_LCD_G[1]
FLT_LCD_G[1]
FLT_LCD_R[5]
FLT_LCD_R[5]
FLT_LCD_G[4]
FLT_LCD_G[4]
FLT_LCD_G[3]
FLT_LCD_G[3]
FLT_LCD_G[5]
FLT_LCD_G[5]
FLT_LCD_CS_N
FLT_LCD_CS_N
MLED7
MLED7
MDDI_P_STB_M
MDDI_P_DATA_M
LCD_CVT_VSYNC_LS
LCD_CVT_VSYNC_LS
LCD_DCLK
LCD_DCLK
FLT_LCD_DCLK
FLT_LCD_DCLK
MINI_3.2"_LCD
sa esolC s
A
EUSY0366801
MDDI -> RGB 24bit Convertor
LCD Charge-pump (with ALC)
7. CIRCUIT DIAGRAM
- 192 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
L
K
J
I
H
G
F
E
D
C
B
A
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
LGE Internal Use Only
100p
C210
CN200
4140
4239
4338
4437
4536
4635
4734
4833
4932
5031
5130
5229
5328
5427
5526
5625
5724
5823
5922
6021
6120
6219
6318
6417
6516
6615
6714
6813
6912
7011
7110
729
738
747
756
765
774
783
792
801
100
R205
DNI
C2047.5p
C203
0.1u
C211
0.1u
C212
10u
C200
33p
C201
1
R201
CN201
17
16
15
14
13
12
11
10
9
8
7
6
5
314
323
332
341
30
29
28
27
26
25
24
23
22
21
20
19
18
470
R211
CAM_VDD_1.8V
0.1u
C207
CAM_AF_2.8V
7.5p
C214
CAM_VDD_2.8V
120
FB200
0.1u
C208
4.7K902R
4.7K012R
7.5pF
FL200
01
5
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
7.5pF
FL201
01
5
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
470
R212
60FB201
470
R213
RW
PV+
V8.1_D
CL_G
ER
V
V5.1_B
GR_
GE
RV
V6.2_B
GR_
GE
RV
V8.2_D
CL_G
ER
V
V0.3_C
MM_
GE
RV
V0.3_R
OTO
M_G
ER
V
470
R214
V6.2_P
MS
M_G
ER
V
7.5pF
FL202
01
5
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
56K512R
56K612R
CAM_VDD_2.8V
VREG_MSMP_2.6V
0.1u
C206
U200
1F
E3E4
E2A5
C4
A4
D4D6
C3C5
C2D3
C1C6
B4B5
B2
B1
B3
D2E5
D1B6
A3A2IOVDD DCLK
DVDD HSYNC
AVDD VSYNC
DATA0
DATA1
DATA2
EXTCLK DATA3
PWRDWN DATA4
RESET DATA5
SDA DATA6
SCL DATA7
GND1
GND2
VDD15_1 GND3
VDD15_2 GND4DN
GP
0.1u
C209
CAM_VDD_2.8VCAM_VDD_1.8V
D200
V6.2_R
OS
NE
S_G
ER
V
RCV_P
RCV_N
VBACK_UP
MIC_BIAS
LCD_CVT_INT
LCD_CVT_RESET_N
TOUCH_I2C_SDA
TOUCH_I2C_SCL
KEY_ROW[0]
KEY_ROW[1]
KEY_COL[0]
KEY_COL[1]
MOTION_INT
LCD_SUBPM_RESET_N
LCD_SUBPM_I2C_SCL
LCD_SUBPM_I2C_SDA
MOTION_I2C_SCL
MOTION_I2C_SDA
PROXI_I2C_SCL
PROXI_I2C_SDA
PROXI_OUT
LIN_MOTOR_EN
LIN_MOTOR_PWM
MICROSD_CLK
MICROSD_CMD
SPK_P
SPK_NMIC_SEL
MIC_P
MICROSD_DET_N
MICROSD_DATA[3]
MICROSD_DATA[2]
MICROSD_DATA[1]
MICROSD_DATA[0]
TOUCH_ACK
LCD_RESET_N
LCD_CVT_VSYNC
MDDI_P_DATA_P
MDDI_P_STB_P
LCD_MAKER_ID
MDDI_P_STB_M
MDDI_P_DATA_M
CAM_PCLK
CAM_PCLK
CAM_PCLK
CAM_VSYNC
CAM_VSYNC
CAM_VSYNC
CAM_HSYNC
CAM_HSYNC
CAM_HSYNC
CAM_DATA[7]CAM_DATA[7]
CAM_DATA[6]CAM_DATA[6]
CAM_DATA[5]CAM_DATA[5]
CAM_DATA[4]
CAM_DATA[4]
CAM_DATA[3]
CAM_DATA[3]
CAM_DATA[2]
CAM_DATA[2]
CAM_DATA[1]
CAM_DATA[1]
CAM_DATA[0]
CAM_DATA[0]
CAM_MCLK
CAM_MCLK
CAM_MCLK
VGA_CAM_PWDN
VGA_CAM_PWDN
VGA_CAM_RESET_N
VGA_CAM_RESET_N
MCAM_RESET
MCAM_RESET
CAM_I2C_SCL
CAM_I2C_SCL
CAM_I2C_SCL
CAM_I2C_SDA
CAM_I2C_SDA
CAM_I2C_SDA
S_CAM_DATA[0]
S_CAM_DATA[0]
S_CAM_DATA[1]
S_CAM_DATA[1]
S_CAM_DATA[2]|S_VGA_CAM_DATA[0]
S_VGA_CAM_DATA[0]
S_CAM_DATA[2]
S_CAM_DATA[2]
S_CAM_DATA[3]|S_VGA_CAM_DATA[1]
S_VGA_CAM_DATA[1]
S_CAM_DATA[3]
S_CAM_DATA[3]
S_CAM_DATA[4]|S_VGA_CAM_DATA[2]
S_VGA_CAM_DATA[2]
S_CAM_DATA[4]
S_CAM_DATA[4]
S_CAM_DATA[5]|S_VGA_CAM_DATA[3]
S_VGA_CAM_DATA[3]
S_CAM_DATA[5]
S_CAM_DATA[5]
S_CAM_DATA[6]|S_VGA_CAM_DATA[4]
S_VGA_CAM_DATA[4]
S_CAM_DATA[6]
S_CAM_DATA[6]
S_CAM_DATA[7]|S_VGA_CAM_DATA[5]
S_VGA_CAM_DATA[5]
S_CAM_DATA[7]
S_CAM_DATA[7]
S_CAM_DATA[8]|S_VGA_CAM_DATA[6]
S_VGA_CAM_DATA[6]
S_CAM_DATA[8]
S_CAM_DATA[8]
S_CAM_DATA[9]|S_VGA_CAM_DATA[7]
S_VGA_CAM_DATA[7]
S_CAM_DATA[9]
S_CAM_DATA[9]
CAM_DATA[8]
CAM_DATA[8]
CAM_DATA[9]
CAM_DATA[9]
MCAM_PWDN
MCAM_PWDN
PM_ON_SW
MIC_VGND
FLT_CAM_HSYNC
FLT_CAM_HSYNC
FLT_CAM_PCLK
FLT_CAM_PCLK
5M CAMERA CON.
1608
1608
EMI FILTER
MAIN & SUB I/F CONNECTORVGA CAMERASMT TYPE
7. CIRCUIT DIAGRAM
- 193 -
7. CIRCUIT DIAGRAM
LGE Internal Use OnlyCopyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
L
K
J
I
H
G
F
E
D
C
B
A
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
LGE Internal Use Only
S3008
7
6
5
4
3
2
1
G5 G3 G1 SW
C1
C2
C3
C4
C5
C6
C7
C8
G6 G4 G2 COM
22K303R
22K203R
22K103R
0.1u
C301
U303
21
11
65
74
83
92
101NC1 NC2
VDD VDDIO
GND SDI
INT SDO
CSB SCK
1TO
N
2TO
N
22K003R
0 03D
43
52
61
VREG_MMC_3.0V
220K
403R
2.2
R305
VREG_MSMP_2.6V
103D
43
52
61
22K703R
2.2u
C302
470
R306
VB300
2
1
0.1u
C300
VREG_MSMP_2.6V
4.7K
R308
4.7K
R309
VREG_SENSOR_2.6V
D302
SW300
CC_
BB_
DA
0.1u
C303
VREG_SENSOR_2.6V
KB300
R310
4.7
10u
C304
U300
54
63
72
81
AD
ELL
CS
CD
ELA
DS
CC
VOI
V
TU
OV
DN
G
TP300
1u
C309
10
R311VREG_SENSOR_2.6V
VREG_SENSOR_2.6V
1u
C305
10K
213
R1u
C306
U301
6
43
2
51VCC IOUT
GND1
GC1 GC22D
NG
KB301 KB302
100nL300
100n
L301
VREG_MOTOR_3.0V
1u
C3073.9n
C308313R
510K
10K413R U302
9
54
63
72
81EN V1
SIN VSS
TYPE VCC
OCT V2DN
GP
4.7K513R
4.7K613R
VREG_MSMP_2.6V
KEY_ROW[0]
KEY_ROW[0]KEY_ROW[1]
KEY_ROW[1]
KEY_COL[0]KEY_COL[1]
MOTION_INT
GAIN1 GAIN2
SBIAS SENS
MOTION_I2C_SCL
MOTION_I2C_SDA
PROXI_I2C_SCL
PROXI_I2C_SDA
PROXI_OUT
LIN_MOTOR_EN
LIN_MOTOR_PWM
MICROSD_CLK
MICROSD_CMD
MICROSD_DET_N
MICROSD_DATA[3]MICROSD_DATA[2]
MICROSD_DATA[1]
MICROSD_DATA[0]
PM_ON_SW
HIGH (Normal)
LOW (Detect)
S/W
Close (Detect =COM)
Detect
Open
Proximity Sensor
Ambient Light Sensor
Motion Sensor
CAMERA KEYSIDE KEY - VOLUME
Linear Motor PAD
1%
LINEAR MOTOR DRIVER
EUSY0200803
MICRO SD SOCKET
POWER ON
VOL.UPVOL.down
AFcapture
- 194 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
100p
C412
+VPWR
BAT400
DNI
C1
0.1u
C400
CN402
1
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
L
K
J
I
H
G
F
E
D
C
B
A
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
LGE Internal Use Only
22p
C402
ANT401
1
SW400
G1
ANTG2
ANT400
1
DNI
C403DNI
C404
100p
5 04C
10u
604C
15p
704C
47p
804C
MIC400
4
3
2
1P
G1
G2
O
U400
94
63
52
71
8101B0 1A
1B1 S1
2B0 2A
2B1 S2
GND VCC
CN400
2
1
22p
C40922p
C41022p
C411
MIC401
4
3
2
1P
G1
G2
O
CN401
2
1
RCV_P
RCV_N
VBACK_UP
MIC_BIASMIC_BIAS
SPK_P
SPK_N
MIC_SEL
MIC_PMIC_1P
MIC_1P
MIC_2P
MIC_2PMIC1_VGNDMIC1_VGND
MIC2_VGND
MIC2_VGND
MIC2_VGND
MIC_VGNDSUMY0010609SMD, TOP
ANTENNA FEEDING
SPEAKERRECEIVER
SMD, TOP
SUMY0010609
MICROPHONE
Backup BAT contact CNT
7. CIRCUIT DIAGRAM
- 195 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
8. BGA PIN MAP
8. BGA PIN MAP
사내한
LGE
Great Company Great PeopleGreat Company Great People Challenge 1010NC
U200 (560 NSP)
- 196 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
8. BGA PIN MAP
사내한
LGE
Great Company Great PeopleGreat Company Great People Challenge 1010NC
U301 (137 FBGA)
- 197 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
8. BGA PIN MAP
사내한
LGE
Great Company Great PeopleGreat Company Great People Challenge 1010NC
U400 (137 CSP)
- 198 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
8. BGA PIN MAP 사내한
LGE
Great Company Great PeopleGreat Company Great People Challenge 1010
U402 (20WLP)
NC
- 199 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
8. BGA PIN MAP
사내한
LGE
Great Company Great PeopleGreat Company Great People Challenge 1010
IC500 (20 CSP)
NC
- 200 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
- 201 -
9. PCB LAYOUT
LGE Internal Use OnlyCopyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
GD880-MAIN-TOP
J500 Ear-Jack Conn.Can not Sound.3.5phi Ear jack
Single 2-inputNAND gate for GPS
CN400 u-USB Conn.Can not operate USBDon’t chargeI/O Connector
X200 VC-TCXONo ServiceTCXO (19.2MHz)
X-tal(32.768KHz)
U400 PM7540 (PMIC)Can not power onCan not chargeNo Service
CN500 B to B conn.Can not power on.Don t operate vibrator, volume key, optical joystick, 3 sensor, speaker, Touch Window.Don’t detect USIM.Can’t operate Camera.No LCD display.Main-Sub B2B Connector
WiFi&BT ModuleTCXO (26MHz)
U600 Wi-Fi & BT & FM ModuleCan not use WLANService, BT andFM Radio Function
U200 MSM7227 (BB chipset)Can not power onNo LCD DisplayNo Service
U301 MemoryCan not bootNAND Flash Memory & SDRAM (4G+4G)
CN401 Battery Conn.Can not power onCan not detect batteryBattery CNT
9. PCB LAYOUT
- 202 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
GD880-MAIN-BOTTOM
FL1001 GPS SAWNo GPS Signal Detection
U1003 RF transceiverWCDMA/GSM/GPS RXSensitivity & TX PowerNo Service
U1001 GPS LNANo GPS Signal Detection
FL1004 WCDMA I RX SAWWCDMA I RX SensitivityNo Service
FL1005(I)/ FL1006(VIII)WCDMA TX SAWWCDMA I, VIII TX PowerNo Service
U1002 WCDMA Dual-PAMWCDMA I, VIII TX PowerNo Service
FL1002(VIII)/FL1003(I)DuplexerWCDMA TX Power &RX SensitivityNo Service
J1 USIM conn.Can not detect USIM
FL1007 FEMWCDMA/GSM RXSensitivity & TX PowerNo Service
U1004 GSM PAMGSM Tx powerNo service
- 203 -
9. PCB LAYOUT
LGE Internal Use OnlyCopyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
GD880-SUB-FPCB-TOP
U301 Luminance Sensor.Can not control the screen’sbrightness automatically.
U300 Proximity SensorCan not control the screen’s on/offoperation automatically.
U200 VGA Camera.Can not operate VGA Camera.
CN200 B to B conn.Can not power on.Don’t operate vibrator, volumekey, optical joystick, 3 sensor,speaker, Touch Window.Don’t detect USIM.Can not operate Camera.No LCD display.
SW300 Camera KeyCan not operate camera.
MIC401 MIC.Can not record or send user voice.
- 204 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
GD880-SUB-FPCB-BOT
9. PCB LAYOUT
MIC400 MIC.Can not record or send user voice.
CN201 Camera Conn.Can not operate 5M Camera.
BAT400 Backup Battery.RTC reset.
S300 Micro-SD SocketCan not use a micro-SD
U302 Motor Driver IC.Can not operate vibrator.
U101 LCD Backlight Charge PumpNo Display
U101 LCD Backlight Charge PumpNo Display
CN100 LCD/Touch Conn.No LCD Display.Can not operate Touch.
U100 RGB 24bit Converter.No LCD Display.
- 205 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
10. RF CALIBRATION
10. RF CALIBRATION
Tachyon User manual
- 1 - 10-GD880
<GD880 RF Calibration – Using by Tachyon Tool>
GD880 Target Power
W900 : 23dBmn W2100 : 22.5dBm
GSM850/900 : 32.5dBm GSM1800 : 29.5dBm
GSM1900 : 29dBm
- 206 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
10. RF CALIBRATION
Tachyon User manual
- 2 - 10-GD880
10.1 Introduction
Tachyon will explain how to use the program for the user.
Used in this article Tachyon except for a detailed description of the environment file, and only the description is
only required.
10.2 Terminology
Tachyon : CMTest2, HotKimchi integrated program.
- Dictionary meaning : Quick bitboda of virtual particles.
- Mean : Want to reduce the time means fast bitboda moment.
10.3 Tachyon Main UI
It will be explained in the Main Screen.
10.3.1 Menu / Toolbar / Run Button
Tachyon has “Menu”, “Toolbar” and Buttons.
<Picture 6>
- 207 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
10. RF CALIBRATION
Tachyon User manual
- 3 - 10-GD880
10.3.1.1 Menu
There are six kinds of menu.
(“Program”, “Run”, “Additional Function”, “Option”, “View”, “Help”)
Program
Menu Description
Model Selection Select model
Config Editor… Develope progress
NV Item Manager… Develop progress
Sequence Editor… Develope progress
Exit Exit program
Run
Menu Description
Calibration + Test Start Calibration and Auto Test
Calibration Only Start Calibration
Test Only Start Auto Test
Select band Calibration Start Calibration with selected Band
Select Band/Item Calibration Start Calibration with selected band and item.
Select Band Auto Test Start Auto Test with selected Band
NV Read Read the NV items.
NV Write Write the NV items.
Stop STOP
Additional Function
Menu 설명
Loss Adjustment… Configuratation and adjust RF-LOSS.
Instrument Calibration… Instrument calibration(available on E5515C)
Phone Control… Phone control
(like QPST, available on Qaulcomm)
RF Switch Check… Check the RF Switch Box.
Show Result… Result screen pop-up/pop-down
- 208 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
Tachyon User manual
- 4 - 10-GD880
Option
Menu Description
System Option… COM-Port configuration
Run Option… Special opstion.
Instrument Change… Change instrument
Voltage / Current Setting… Voltage,Current setting
View
Menu Description
Toolbar, Menubar Toggle.
Help
Menu Description
Tachyon Help Develope progress
Tachyon Hotkey…
About Tachyon…
10.3.1.2 Toolbar
Toolbar Provides for frequently used commands.
<Picture 7 : Toolbar>
<Picture 7> Commands in order are as follows :
1. Model Selection
2. Calibration + Test
3. Not availalable.
4. Stop
5. Test Only
6. Calibration Only
7. Phone Control
8. Loss Adjustment
9. System Option
10. Run Option
11. Voltage / Current Setting
12. Show Result
10. RF CALIBRATION
- 209 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
10. RF CALIBRATION
Tachyon User manual
- 5 - 10-GD880
10.3.1.3 Command Button
<Picture 8 : Start Button>
“Calibration + Test” Button , “Stop” Button .
10.3.2 UI Display Information
About the item on the screen output will be explained.
10.3.2.1 Port / Loss info
<Picture 9 : COM Port / Loss Information>
Area 1, the output is imformation about the COM port.
Area 2, Show the RF-LOSS for the selected model.
10.3.2.2 Phone Info / System Option Status
- 210 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
10. RF CALIBRATION
Tachyon User manual
- 6 - 10-GD880
Model Information : Information of model that user selected
Solution : chipset (Qualcomm, Emp, ADI, Infineon)
Model : Model name, Buyer : Buyer name
Binary Ver : Binary Version.(Phone s/w version)
Product ID : PID (read from phone).
System Information : ezlooks, shield box, rf switch box.
Local : Factory location, Ezlooks Mode : On-line/Off-line
Limo : Using Shield box or not
Run Information : Option
Repeat Test : Aging test, ESN Write : Write the ESN(IMEI).
Test Only : Only auto test
Rework : Rework Option.
Verification : Using verification or not.
Base Inst. Information : information of instrument
Base Inst. : Equipment type
Execution Mode : Display the Command that user input
Time Elapse : test time
Voltage : voltage
Current Limit : current limit
Consumption Current(mA) : doesn’t work
- 211 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
10. RF CALIBRATION
Tachyon User manual
- 7 - 10-GD880
10.4.2 Run / Stop This will be explained in detail about the functionality provided.
10.4.2.1 Calibration + Test
This perform the calibraton, Test.
Select when ‘Calibration and Auto Test’ process
Description.
Excution 1. <Menu> Run-> Calibration + Test.
2. <Toolbar> Click .
Hot Key F5 : Shield Box 1
F6 : Shield Box 2
Button
button Click.
<Calibration + Test> will be in the order. Sequence xml file has it.
i) Precede Action
- NV Write.
- Test command send
ii) Calibration
- Calibration
iii) Auto Test
- Auto test
iV) After Action
- Phone reset
- Change AMSS
If you have a multi-system, you must select the Channel(1,2) that you wanted, then you can test.
<Picture 15 : Channel selection>
- 212 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
10. RF CALIBRATION
Tachyon User manual
- 8 - 10-GD880
10.4.2.2 Calibration Only
This perform only the Calibraton.
Select when ‘Calibration only’ process.
Description.
Excution 1. <Menu> Run-> Calibration Only.
2. <Toolbar> Click.
Hot Key F9
Button NONE.
If you have a multi-system, you must select the Channel(1,2) that you wanted, then you can test.
<Picture 16 : Calibration Only>
- 21� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
10. RF CALIBRATION
Tachyon User manual
- 9 - 10-GD880
10.4.2.3 Test Only
This perform only the Test.
Select when “Test Only” process
Description.
Excution 1. <Menu> Run-> Test Only.
2. <Toolbar> Click.
Hot Key F8
Button NONE.
If you have a multi-system, you must select the Channel(1,2) that you wanted, then you can test.
<Picture 17 : Test Only>
10.4.2.4 Stop
This perform Stopping the process.
Description.
Excution 1. <Menu> Run-> STOP
2. <Toolbar> Click.
Hot Key ESC
Button
button Click.
- 214 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
10. RF CALIBRATION
Tachyon User manual
- 9 - 10-GD880
10.4.2.3 Test Only
This perform only the Test.
Select when “Test Only” process
Description.
Excution 1. <Menu> Run-> Test Only.
2. <Toolbar> Click.
Hot Key F8
Button NONE.
If you have a multi-system, you must select the Channel(1,2) that you wanted, then you can test.
<Picture 17 : Test Only>
10.4.2.4 Stop
This perform Stopping the process.
Description.
Excution 1. <Menu> Run-> STOP
2. <Toolbar> Click.
Hot Key ESC
Button
button Click.
- 215 -
11. EXPLODED VIEW & REPLACEMENT PART LIST
11.1 EXPLODED VIEW
LGE Internal Use OnlyCopyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
MTAB04
MTAB01
MTAB05
MBJZ03
MBJZ02
MPBZ01
SURY00
MPBZ05
MTAZ01
ACGK00
SACY00
MTAZ00
MPBZ00MPBZ03
AFBZ00
SVCY00
SWCC00 SUSY00
ADBY00
SJMY00
SC402
MCBA00
SC401
ANT1002
ANT1001
SAFY
ACGM
ACGA00
GMEY00
SBPL00
MLAA00
MBJZ01
MTAB02
- 216 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 217 - LGE Internal Use OnlyCopyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
ASS’Y EXPLODED VIEW
- 218 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
- 219 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
by SBOM standard on GCSC
Level LocationNo. Description Part Number Spec Color Remark
2 AAAY00 ADDITION AAAY0454201 BLACK
3 AMBA00 MANUALASSY,OPERATION AMBA0175301 GD880 manual assy for ORF WITHOUT
COLOR
4 MCDE00 CARD,SERVICE GUIDE MCDE0007101 PRINTING, (empty), , , , , WITHOUTCOLOR
4 MMBB00 MANUAL,OPERATION MMBB0374201 PRINTING, (empty), , , , , WITHOUTCOLOR
2 APAY00 PACKAGE APAY0142901 GD880 ORF(TR7-1/ORF UB/Void/12403_Pallet/500ea) WITHOUTCOLOR
3 APLY00 PALLET ASSY APLY0003203 TDR TR1-1 ORG STD Palletizing WithoutColor
4 MPBZ00 PAD MPBZ0219601 COMPLEX, (empty), , 503, 860, 145, WithoutColor U
4 MPCY00 PALLET MPCY0012403 COMPLEX, (empty), , , , , DARK BLUE
3 MLAC00 LABEL,BARCODE MLAC0004541 PRINTING, (empty), , , , , WithoutColor
3 MLAZ00 LABEL MLAZ0037104 PRINTING, (empty), , , , , METALSILVER
3 MLAZ01 LABEL MLAZ0050901 PRINTING, (empty), , , , , WITHOUTCOLOR
3 MPAE PACKING,BLISTER MPAE0008202 COMPLEX, (empty), , , , , WITHOUTCOLOR
3 MPAE01 PACKING,BLISTER MPAE0008203 COMPLEX, (empty), , , , , WITHOUTCOLOR
2 APEY00 PHONE APEY0873401 BLACK
3 ACGA00 COVER ASSY,BATTERY ACGA0033802 GD880_BATT,COVER ASSY_ORANGE BLACK Q', 27
4 MCJA00 COVER,BATTERY MCJA0100602 MOLD, PC LUPOY SC-1004A, , , , , BLACK
3 ACGY00 COVER ASSY,EMS ACGY0009001 BLACK
4 ACGM00 COVER ASSY,REAR ACGM0145901 BLACK 26
5 MCJN00 COVER,REAR MCJN0112101 MOLD, PC LUPOY SC-1004A, , , , , BLACK N'
6 MBIZ00 BUSHING MBIZ0004901 CASTING, Zn Alloy, , , , , WITHOUTCOLOR
6 MBIZ01 BUSHING MBIZ0005201 CASTING, Zn Alloy, , , , , WITHOUTCOLOR
6 MFEZ00 FRAME MFEZ0023201 PRESS, STS, , , , , WITHOUTCOLOR
5 MDAY00 DECO MDAY0046301 PRESS, STS, , , , , SILVER
11.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered
<Mechanic component>
- 220 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Color Remark
5 MGAZ00 GASKET MGAZ0075701 PRESS, STS, , , , , WITHOUTCOLOR
5 MIDZ00 INSULATOR MIDZ0242701 COMPLEX, (empty), , , , , WITHOUTCOLOR I'
5 MIDZ02 INSULATOR MIDZ0249001 COMPLEX, (empty), , , , , WITHOUTCOLOR G'
5 MPBT00 PAD,CAMERA MPBT0085601 COMPLEX, (empty), , , , , WITHOUTCOLOR J'
5 MPBZ00 PAD MPBZ0316101 COMPLEX, (empty), , , , , WITHOUTCOLOR
5 MSAZ00 SHEET MSAZ0063001 COMPLEX, (empty), , , , , BLACK K'
5 MTAD00 TAPE,WINDOW MTAD0116901 COMPLEX, (empty), , , , , WITHOUTCOLOR L'
5 MTAZ00 TAPE MTAZ0314001 COMPLEX, (empty), , , , , WITHOUTCOLOR H'
5 MWAE00 WINDOW,CAMERA MWAE0054201 MOLD, Tempered Glass, , , , , BLACK M'
4 ACGV COVER ASSY,BAR ACGV0012601 GD880_COVER ASSY,BAR_FRANCE BLACK
5 ACGK00 COVER ASSY,FRONT ACGK0147601 BLACK 1
6 MCCE00 CAP,RECEPTACLE MCCE0055501 MOLD, PC LUPOY SC-1004A, , , , , SILVER A
6 MCCG00 CAP,MULTIMEDIA CARD MCCG0022801 PRESS, STS, , , , , SILVER
6 MCJK00 COVER,FRONT MCJK0117101 MOLD, PC LUPOY SC-1004A, , , , , BLACK
7 MFEZ00 FRAME MFEZ0023101 PRESS, STS, , , , , WITHOUTCOLOR
7 MICA00 INSERT,FRONT MICA0019701 CASTING, Zn Alloy, , , , , WITHOUTCOLOR
6 MDAY00 DECO MDAY0045701 MOLD, PC LUPOY SC-1004A, , , , , BLACK
6 MDAY01 DECO MDAY0045801 MOLD, PC LUPOY SC-1004A, , , , , BLACK
6 MDAY02 DECO MDAY0045901 PRESS, STS, , , , , SILVER
7 MBIZ00 BUSHING MBIZ0004901 CASTING, Zn Alloy, , , , , WITHOUTCOLOR
7 MDAY00 DECO MDAY0046201 PRESS, STS, , , , , SILVER
6 MDAY03 DECO MDAY0046001 PRESS, STS, , , , , SILVER
6 MDAY04 DECO MDAY0046101 PRESS, STS, , , , , SILVER
6 MPBT00 PAD,CAMERA MPBT0085701 COMPLEX, (empty), , , , , WITHOUTCOLOR
6 MPFZ00 PLATE MPFZ0050701 PRESS, STS, , , , , WITHOUTCOLOR
6 MTAA00 TAPE,DECO MTAA0214801 COMPLEX, (empty), , , , , WITHOUTCOLOR
- 221 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Color Remark
6 MTAA01 TAPE,DECO MTAA0208301 COMPLEX, (empty), , , , , WITHOUTCOLOR
6 MTAA02 TAPE,DECO MTAA0208401 COMPLEX, (empty), , , , , WITHOUTCOLOR
6 MTAA03 TAPE,DECO MTAA0218101 COMPLEX, (empty), , , , , WITHOUTCOLOR
6 MTAA04 TAPE,DECO MTAA0218201 COMPLEX, (empty), , , , , WITHOUTCOLOR
6 MTAD00 TAPE,WINDOW MTAD0117001 COMPLEX, (empty), , , , , WITHOUTCOLOR
6 MWAE00 WINDOW,CAMERA MWAE0054101 MOLD, PC LUPOY HI-1002M, , , , , BLACK
5 ADBY00 DECO ASSY ADBY0015901 REAR BLACK 21
6 MCCZ00 CAP MCCZ0033901 MOLD, Silicone Rubber KE971-U, , , , , BLACK A'
6 MDAY00 DECO MDAY0045601 MOLD, PC LUPOY SC-1004A, , , , , BLACK Y
6 MTAZ00 TAPE MTAZ0256901 COMPLEX, (empty), , , , , WITHOUTCOLOR X
5 AFBZ00 FRAME ASSY AFBZ0015901 BLACK 20
6 MFEZ00 FRAME MFEZ0023001 MOLD, PC LUPOY SC-1004A, , , , , BLACK B'
6 MPBZ00 PAD MPBZ0248201 COMPLEX, (empty), , , , , WITHOUTCOLOR C', 5
5 GMEY00 SCREW MACHINE,BIND GMEY0011201 1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK WITHOUTCOLOR O', 22
5 MBJZ01 BUTTON MBJZ0014801 PRESS, STS, , , , , SILVER 2
대치 BUTTON MBJZ0034801 PRESS, STS, , , , , WITHOUTCOLOR C
5 MBJZ02 BUTTON MBJZ0014901 PRESS, STS, , , , , SILVER 3
대치 BUTTON MBJZ0034901 PRESS, STS, , , , , WITHOUTCOLOR D
5 MBJZ03 BUTTON MBJZ0015001 PRESS, STS, , , , , SILVER 4
대치 BUTTON MBJZ0035001 PRESS, STS, , , , , WITHOUTCOLOR B
5 MCCZ00 CAP MCCZ0034101 MOLD, Silicone Rubber KE971-U, , , , , BLACK E, 6
6 MFBZ00 FILTER MFBZ0005601 COMPLEX, (empty), , , , , WITHOUTCOLOR
5 MCCZ01 CAP MCCZ0034001 MOLD, Silicone Rubber KE971-U, , , , , BLACK Q, 18
6 MFBZ00 FILTER MFBZ0005501 COMPLEX, (empty), , , , , WITHOUTCOLOR
5 MCCZ03 CAP MCCZ0034201 MOLD, Silicone Rubber KE971-U, , , , , BLACK G, 8
5 MCCZ04 CAP MCCZ0036801 MOLD, Silicone Rubber KE971-U, , , , , BLACK F, 7
- 222 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Color Remark
6 MFBZ00 FILTER MFBZ0012001 COMPLEX, (empty), , , , , WITHOUTCOLOR
5 MIDZ00 INSULATOR MIDZ0265001 COMPLEX, (empty), , , , , WITHOUTCOLOR N, 30
5 MLAR00 LABEL,WARNING MLAR0005301 COMPLEX, (empty), , , , , YELLOW
5 MPBZ00 PAD MPBZ0248501 COMPLEX, (empty), , , , , WITHOUTCOLOR K, 9
5 MPBZ01 PAD MPBZ0248301 COMPLEX, (empty), , , , , WITHOUTCOLOR J
5 MPBZ02 PAD MPBZ0248401 COMPLEX, (empty), , , , , WITHOUTCOLOR O, 28
5 MPBZ03 PAD MPBZ0268901 COMPLEX, (empty), , , , , WITHOUTCOLOR 16
5 MPBZ05 PAD MPBZ0272001 COMPLEX, (empty), , , , , WITHOUTCOLOR P, 15
5 MTAB01 TAPE,PROTECTION MTAB0352401 COMPLEX, (empty), , , , , WITHOUTCOLOR
5 MTAB02 TAPE,PROTECTION MTAB0352301 COMPLEX, (empty), , , , , WITHOUTCOLOR
5 MTAB03 TAPE,PROTECTION MTAB0352701 COMPLEX, (empty), , , , , WITHOUTCOLOR
5 MTAB04 TAPE,PROTECTION MTAB0373801 COMPLEX, (empty), , , , , WITHOUTCOLOR
5 MTAB05 TAPE,PROTECTION MTAB0388501 COMPLEX, (empty), , , , , WITHOUTCOLOR
5 MTAZ00 TAPE MTAZ0285501 COMPLEX, (empty), , , , , WITHOUTCOLOR R, 10
5 MTAZ01 TAPE MTAZ0303101 COMPLEX, (empty), , , , , WITHOUTCOLOR I, 23
5 MTAZ02 TAPE MTAZ0335701 COMPLEX, (empty), , , , , WITHOUTCOLOR H, 29
8 ANT400 TERMINAL,GROUND MTCA0002701 PRESS, BeCu, , , , , WITHOUTCOLOR
8 ANT401 TERMINAL,GROUND MTCA0002701 PRESS, BeCu, , , , , WITHOUTCOLOR
4 GMEY00 SCREW MACHINE,BIND GMEY0011201 1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK WITHOUTCOLOR
6 MCBA00 CAN,SHIELD MCBA0062301 PRESS, STS, , , , , WITHOUTCOLOR E'
7 MTAZ00 TAPE MTAZ0309901 COMPLEX, (empty), , , , , WITHOUTCOLOR D'
6 MLAB LABEL,A/S MLAB0004801 PRINTING, (empty), , , , , WITHOUTCOLOR
- 22� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Color Remark
6 MLAZ00 LABEL MLAZ0038301 PID Label 4 Array WITHOUTCOLOR
7 SC401 CAN,SHIELD MCBA0061701 PRESS, STS, , , , , WITHOUTCOLOR
7 SC402 BRACKET MBFZ0039301 PRESS, STS, , , , , WITHOUTCOLOR
7 ANT1001 CONTACT MCIZ0002601 PRESS, BeCu, , , , , WITHOUTCOLOR
7 ANT1002 CONTACT MCIZ0002601 PRESS, BeCu, , , , , WITHOUTCOLOR
3 MLAA00 LABEL,APPROVAL MLAA0062304 COMPLEX, (empty), , , , , WITHOUTCOLOR
- 224 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
by SBOM standard on GCSC
Level LocationNo. Description Part Number Spec Color Remark
1 IMT,BAR/FLIP TIMT0009801 COLORUNFIXED
4 SNGF00 ANTENNA,GSM,FIXED SNGF0057301 3.0 ,-2.0 dBd, ,GPS/BT(WiFi), FPCB ,; ,DUAL ,-2.0 ,50,3.0
6 SVLM00 LCD MODULE SVLM0037001 Main ,3.18 ,480*854 ,46.1*85.7*3.85 ,16.7M ,TFT ,TM,LG4573 ,Touch Window Hybrid ,
6 SNGF00 ANTENNA,GSM,FIXED SNGF00569033.0 ,-2.0 dBd,,GSM850/GSM900/DCS/PCS/BAND1/BAND8, FPCB ,;,MULTI ,-2.0 ,50 ,3.0
Z
5 SACY00 PCB ASSY,FLEXIBLE SACY0103201 SUB M, 11
6 SACB00 PCBASSY,FLEXIBLE,INSERT SACB0058501 SUB
6 SACE00 PCB ASSY,FLEXIBLE,SMT SACE0093001 SUB
7 SACC00 PCB ASSY,FLEXIBLE,SMTBOTTOM SACC0068401 SUB
8 BAT400 MODULE,ETC SMZY0023501 3.8 Backup Capacitor 0.03F ,; ,Module Assembly
8 C102 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
8 C103 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
8 C105 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
8 C106 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
8 C107 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
8 C108 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
8 C109 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
8 C111 CAP,CERAMIC,CHIP ECCH0000151 4.7 nF,25V,K,X7R,HD,1005,R/TP
8 C112 VARISTOR SEVY0003901 5.5 V, ,SMD ,Vdc 5.5, Vb 8, Cp 420, 1.0*0.5*0.6 , ,5.5 ,,480 ,1.0*0.5*0.6 ,[empty] ,SMD ,R/TP
8 C113 VARISTOR SEVY0003901 5.5 V, ,SMD ,Vdc 5.5, Vb 8, Cp 420, 1.0*0.5*0.6 , ,5.5 ,,480 ,1.0*0.5*0.6 ,[empty] ,SMD ,R/TP
8 C114 VARISTOR SEVY0003901 5.5 V, ,SMD ,Vdc 5.5, Vb 8, Cp 420, 1.0*0.5*0.6 , ,5.5 ,,480 ,1.0*0.5*0.6 ,[empty] ,SMD ,R/TP
8 C115 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
8 C116 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
8 C117 CAP,CERAMIC,CHIP ECCH0000185 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
8 C118 CAP,CERAMIC,CHIP ECCH0000185 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
8 C119 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
11.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered
<Main component>
- 225 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Color Remark
8 C120 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
8 C121 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
8 C122 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
8 C123 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
8 C124 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
8 C125 CAP,CERAMIC,CHIP ECCH0005604 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
8 C126 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
8 C127 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
8 C128 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
8 C200 CAP,CERAMIC,CHIP ECCH0005604 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
8 C201 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
8 C203 CAP,CERAMIC,CHIP ECCH0010501 7.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
8 C206 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
8 C207 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
8 C208 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
8 C209 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
8 C210 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
8 C211 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
8 C212 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
8 C214 CAP,CERAMIC,CHIP ECCH0010501 7.5 pF,50V ,D ,X7R ,TC ,1005 ,R/TP ,; ,C0G TYPE(NoX7R) ,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
8 C300 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
8 C301 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
8 C302 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
8 C303 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
8 C304 CAP,CERAMIC,CHIP ECCH0005604 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
8 C305 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
8 C306 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
8 C307 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
- 226 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Color Remark
8 C308 CAP,CHIP,MAKER ECZH0001120 3.9 nF,50V ,K ,X7R ,HD ,1005 ,R/TP , , ,[empty] ,[empty],[empty] ,[empty] ,[empty] ,[empty]
8 C309 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
8 C400 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
8 C402 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
8 C405 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
8 C406 CAP,TANTAL,CHIP ECTH0001901 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP
8 C407 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
8 C408 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
8 C409 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
8 C410 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
8 C411 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
8 C412 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
8 CN100 CONNECTOR,BOARD TOBOARD ENBY0045501 60 PIN,0.4 mm,STRAIGHT , , ,; , ,0.40MM ,STRAIGHT
,FEMALE ,SMD ,[empty] , ,
8 CN201 CONNECTOR,BOARD TOBOARD ENBY0040301 34 PIN,0.4 mm,ETC , ,H=1.0, Socket
8 CN402 CONNECTOR,ETC ENZY0018801 PIN, mm,ETC , ,RCS=1.35
8 D200 DIODE,TVS EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
8 D300 DIODE,TVS EDTY0009801 SOT-963 ,5 V,25 W,R/TP , ,; , , , , , ,[empty] ,[empty] ,2P,1
8 D301 DIODE,TVS EDTY0009801 SOT-963 ,5 V,25 W,R/TP , ,; , , , , , ,[empty] ,[empty] ,2P,1
8 D302 DIODE,TVS EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
8 FB200 FILTER,BEAD,CHIP SFBH0009901 120 ohm,1005 ,
8 FB201 FILTER,BEAD,CHIP SFBH0000909 60 ohm,1005 ,
8 FL100 FILTER,EMI/POWER SFEY0011401 SMD ,SMD, 18V, 4ch, EMI_ESD Filter (100 Ohm, 7.5pF)
8 FL101 FILTER,EMI/POWER SFEY0011401 SMD ,SMD, 18V, 4ch, EMI_ESD Filter (100 Ohm, 7.5pF)
8 FL102 FILTER,EMI/POWER SFEY0011401 SMD ,SMD, 18V, 4ch, EMI_ESD Filter (100 Ohm, 7.5pF)
8 FL103 FILTER,EMI/POWER SFEY0011401 SMD ,SMD, 18V, 4ch, EMI_ESD Filter (100 Ohm, 7.5pF)
8 FL104 FILTER,EMI/POWER SFEY0011401 SMD ,SMD, 18V, 4ch, EMI_ESD Filter (100 Ohm, 7.5pF)
8 FL105 FILTER,EMI/POWER SFEY0011401 SMD ,SMD, 18V, 4ch, EMI_ESD Filter (100 Ohm, 7.5pF)
8 FL106 FILTER,EMI/POWER SFEY0011401 SMD ,SMD, 18V, 4ch, EMI_ESD Filter (100 Ohm, 7.5pF)
8 FL107 FILTER,EMI/POWER SFEY0011401 SMD ,SMD, 18V, 4ch, EMI_ESD Filter (100 Ohm, 7.5pF)
8 FL200 FILTER,EMI/POWER SFEY0013701 SMD ,18 V,4ch. EMI_ESD Filter (100 Ohm, 7.5pF)
- 227 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Color Remark
8 FL201 FILTER,EMI/POWER SFEY0013701 SMD ,18 V,4ch. EMI_ESD Filter (100 Ohm, 7.5pF)
8 FL202 FILTER,EMI/POWER SFEY0013701 SMD ,18 V,4ch. EMI_ESD Filter (100 Ohm, 7.5pF)
8 L300 INDUCTOR,CHIP ELCH0004727 100 nH,J ,1005 ,R/TP ,
8 L301 INDUCTOR,CHIP ELCH0004727 100 nH,J ,1005 ,R/TP ,
8 MIC400 MICROPHONE SUMY0010609 UNIT ,-42 dB,3.76*2.95*1.1 ,mems smd mic ,; , , ,OMNI,[empty] , ,[empty]
8 R100 PCB ASSY,MAIN,PADSHORT SAFP0000501
8 R102 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
8 R103 RES,CHIP,MAKER ERHZ0000267 3300 ohm,1/16W ,F ,1005 ,R/TP
8 R104 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
8 R105 RES,CHIP,MAKER ERHZ0000434 1 ohm,1/16W ,J ,1005 ,R/TP
8 R107 RES,CHIP,MAKER ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP
8 R108 RES,CHIP,MAKER ERHZ0000513 820 ohm,1/16W ,J ,1005 ,R/TP
8 R110 RES,CHIP,MAKER ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP
8 R111 RES,CHIP,MAKER ERHZ0000205 1 Mohm,1/16W ,F ,1005 ,R/TP
8 R112 RES,CHIP,MAKER ERHZ0000434 1 ohm,1/16W ,J ,1005 ,R/TP
8 R201 RES,CHIP,MAKER ERHZ0000434 1 ohm,1/16W ,J ,1005 ,R/TP
8 R205 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
8 R209 RES,CHIP,MAKER ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP
8 R210 RES,CHIP,MAKER ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP
8 R211 RES,CHIP,MAKER ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP
8 R212 RES,CHIP,MAKER ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP
8 R213 RES,CHIP,MAKER ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP
8 R214 RES,CHIP,MAKER ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP
8 R215 RES,CHIP ERHY0000275 56K ohm,1/16W,J,1005,R/TP
8 R216 RES,CHIP ERHY0000275 56K ohm,1/16W,J,1005,R/TP
8 R300 RES,CHIP,MAKER ERHZ0000444 22 Kohm,1/16W ,J ,1005 ,R/TP
8 R301 RES,CHIP,MAKER ERHZ0000444 22 Kohm,1/16W ,J ,1005 ,R/TP
8 R302 RES,CHIP,MAKER ERHZ0000444 22 Kohm,1/16W ,J ,1005 ,R/TP
8 R303 RES,CHIP,MAKER ERHZ0000444 22 Kohm,1/16W ,J ,1005 ,R/TP
8 R304 RES,CHIP,MAKER ERHZ0000445 220 Kohm,1/16W ,J ,1005 ,R/TP
8 R305 RES,CHIP,MAKER ERHZ0000456 2.2 ohm,1/16W ,J ,1005 ,R/TP
- 228 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Color Remark
8 R306 RES,CHIP,MAKER ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP
8 R307 RES,CHIP,MAKER ERHZ0000444 22 Kohm,1/16W ,J ,1005 ,R/TP
8 R308 RES,CHIP,MAKER ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP
8 R309 RES,CHIP,MAKER ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP
8 R310 RES,CHIP,MAKER ERHZ0000488 4.7 ohm,1/16W ,J ,1005 ,R/TP
8 R311 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
8 R312 RES,CHIP,MAKER ERHZ0000203 10 Kohm,1/16W ,F ,1005 ,R/TP
8 R313 RES,CHIP,MAKER ERHZ0000296 510 Kohm,1/16W ,F ,1005 ,R/TP
8 R314 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
8 R315 RES,CHIP,MAKER ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP
8 R316 RES,CHIP,MAKER ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP
8 S300 CONN,SOCKET ENSY0023301 8 ,ETC , ,0.7 mm,H=1.52,(15*15)
8 SW400 CONN,RF SWITCH ENWY0003901 ,SMD , dB,
8 U100 IC EUSY0366801 BGA ,96 ,R/TP ,MDDI, SCALIER ,; ,IC,Mobile PixelLink(MPL)
8 U101 IC EUSY0383103 CSP ,35 ,R/TP ,8CH,PWM,ALC,4LDO ,; ,IC,Sub PMIC
8 U102 IC EUSY0240001 MICROPAK ,6 PIN,R/TP ,SINGLE BIT UNIT-DIRECTIONAL TRANSLATOR / PB FREE
8 U302 IC EUSY0200803 MFL ,8 ,R/TP ,Haptic Driver IC,2X2 ,; ,IC,Motor Driver
8 U303 IC EUSY0345201 3*3 QFN ,10 PIN,R/TP ,3xis Accelerometer ,; ,IC,A/DConverter
8 U400 IC EUSY0363501 uMLF ,10 ,R/TP ,0.4ohm Audio Analog Switch ,;,IC,Analog Switch
8 X100 X-TAL EXXY0023301 27 MHz,50 PPM,9 pF,50 ohm,SMD ,3.2*2.5*0.7 ,30ppmat -20'C ~ +70'C, Pb Free
7 SACD00 PCB ASSY,FLEXIBLE,SMTTOP SACD0080901 SUB
8 CN200 CONNECTOR,BOARD TOBOARD ENBY0051101 80 , mm,STRAIGHT , , ,; , ,0.40MM ,[empty] ,MALE
,[empty] ,[empty] , ,
8 MIC401 MICROPHONE SUMY0010609 UNIT ,-42 dB,3.76*2.95*1.1 ,mems smd mic ,; , , ,OMNI,[empty] , ,[empty]
8 SW300 SWITCH,TACT ESCY0006101 15 V,20 mA,HORIZONTAL ,1 G, ,; ,1C1P ,[empty],[empty] ,[empty] , ,[empty]
8 U200 CAMERA SVCY0019901 CMOS ,VGA ,Toshiba(1/10"), 4x4x2.23t, Reflow Type
8 U300 IC EUSY0376201 ,8 ,R/TP , ,; ,IC,PMIC
8 U301 IC EUSY0388201 WSOF6 ,5 ,R/TP ,1.6*1.6 ,; ,IC,PMIC
7 SPCY PCB,FLEXIBLE SPCY0203601 FR-4 ,0.4 mm,STAGGERED-6 ,WHITE-MINI ,; , , , , , , , ,,
- 229 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Color Remark
5 SJMY00 VIBRATOR,MOTOR SJMY0008510 2.0 V,0.1 A,10*3.6 ,spring ,; ,3V , , , , , , , W, 19
5 SURY00 RECEIVER SURY0010114 ASSY , dB, ohm,1207*2.5 ,10mm ,; , , , , , ,WIRE , L, 13
5 SUSY00 SPEAKER SUSY0027615 PIN ,8 ohm,88 dB,1810 mm,module ,; , , , , , , ,[empty] V, 17
5 SVCY00 CAMERA SVCY0025001 CMOS ,MEGA ,5M AF Toshiba(1/4"),8.5x8.5x5.4t,RAW,90degree,FPCB T, 12
5 SWCC00 CABLE,COAXIAL SWCC0009301 78 mm,1 LINE,U.FL_W.FL ,; ,[empty] ,[empty] ,0.075M ,,[empty] , ,[empty] S, 14
4 SAFY PCB ASSY,MAIN SAFY0349601 25
5 SAFB00 PCB ASSY,MAIN,INSERT SAFB0107801
6 BRAH00 RESIN,PC BRAH0001301 ; , , , ,[empty] Black
5 SAFF00 PCB ASSY,MAIN,SMT SAFF0260601 F'
6 SAFC00 PCB ASSY,MAIN,SMTBOTTOM SAFC0137201
7 C1113 CAP,CERAMIC,CHIP ECCH0009230 2200 pF,10V ,K ,X5R ,TC ,0603 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty]
7 C200 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
7 C201 CAP,CHIP,MAKER ECZH0025917 47 pF,25V ,J ,NP0 ,TC ,0603 ,R/TP
7 C202 CAP,CERAMIC,CHIP ECCH0017301 1000000 pF,6.3V ,M ,X5R ,HD ,0603 ,R/TP ,; ,1 ,20%,6.3V ,X5R ,-55TO+85C ,0603 ,R/TP ,0.3 mm
7 C203 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C204 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C205 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C206 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C207 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C208 CAP,CERAMIC,CHIP ECCH0017301 1000000 pF,6.3V ,M ,X5R ,HD ,0603 ,R/TP ,; ,1 ,20%,6.3V ,X5R ,-55TO+85C ,0603 ,R/TP ,0.3 mm
7 C209 CAP,CERAMIC,CHIP ECCH0009103 100 pF,50V ,J ,X7R ,TC ,0603 ,R/TP , , ,[empty] ,[empty],C0G ,[empty] ,[empty] ,[empty] ,0.3 mm
7 C210 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C211 CAP,TANTAL,CHIP ECTH0001903 22 uF,6.3V ,M ,L_ESR ,1608 ,R/TP
7 C212 CAP,CHIP,MAKER ECZH0025920 1 nF,16V ,K ,X7R ,HD ,0603 ,R/TP , , ,[empty] ,[empty],[empty] ,[empty] ,[empty] ,[empty]
7 C213 CAP,CERAMIC,CHIP ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP
7 C214 CAP,CHIP,MAKER ECZH0025920 1 nF,16V ,K ,X7R ,HD ,0603 ,R/TP , , ,[empty] ,[empty],[empty] ,[empty] ,[empty] ,[empty]
7 C215 CAP,CERAMIC,CHIP ECCH0009103 100 pF,50V ,J ,X7R ,TC ,0603 ,R/TP , , ,[empty] ,[empty],C0G ,[empty] ,[empty] ,[empty] ,0.3 mm
- 2�0 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Color Remark
7 C216 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C217 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C218 CAP,CHIP,MAKER ECZH0025916 33 pF,25V ,J ,NP0 ,TC ,0603 ,R/TP
7 C219 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C220 CAP,CERAMIC,CHIP ECCH0009203 33 nF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C221 CAP,CHIP,MAKER ECZH0025917 47 pF,25V ,J ,NP0 ,TC ,0603 ,R/TP
7 C222 CAP,CHIP,MAKER ECZH0025917 47 pF,25V ,J ,NP0 ,TC ,0603 ,R/TP
7 C223 CAP,CERAMIC,CHIP ECCH0009226 39 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
7 C300 CAP,CERAMIC,CHIP ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP
7 C301 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C303 CAP,CHIP,MAKER ECZH0025920 1 nF,16V ,K ,X7R ,HD ,0603 ,R/TP , , ,[empty] ,[empty],[empty] ,[empty] ,[empty] ,[empty]
7 C304 CAP,CHIP,MAKER ECZH0025920 1 nF,16V ,K ,X7R ,HD ,0603 ,R/TP , , ,[empty] ,[empty],[empty] ,[empty] ,[empty] ,[empty]
7 C305 CAP,CHIP,MAKER ECZH0025920 1 nF,16V ,K ,X7R ,HD ,0603 ,R/TP , , ,[empty] ,[empty],[empty] ,[empty] ,[empty] ,[empty]
7 C306 CAP,CHIP,MAKER ECZH0025920 1 nF,16V ,K ,X7R ,HD ,0603 ,R/TP , , ,[empty] ,[empty],[empty] ,[empty] ,[empty] ,[empty]
7 C307 CAP,CHIP,MAKER ECZH0025920 1 nF,16V ,K ,X7R ,HD ,0603 ,R/TP , , ,[empty] ,[empty],[empty] ,[empty] ,[empty] ,[empty]
7 C310 CAP,CHIP,MAKER ECZH0025920 1 nF,16V ,K ,X7R ,HD ,0603 ,R/TP , , ,[empty] ,[empty],[empty] ,[empty] ,[empty] ,[empty]
7 C311 CAP,CHIP,MAKER ECZH0025920 1 nF,16V ,K ,X7R ,HD ,0603 ,R/TP , , ,[empty] ,[empty],[empty] ,[empty] ,[empty] ,[empty]
7 C312 CAP,CERAMIC,CHIP ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP
7 C313 CAP,CERAMIC,CHIP ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP
7 C314 CAP,CHIP,MAKER ECZH0025920 1 nF,16V ,K ,X7R ,HD ,0603 ,R/TP , , ,[empty] ,[empty],[empty] ,[empty] ,[empty] ,[empty]
7 C315 CAP,CERAMIC,CHIP ECCH0017601 4.7 uF,6.3V ,M ,X5R ,HD ,1005 ,R/TP ,; , ,20% ,6.3V,X5R ,-55TO+85C ,1005 ,R/TP , mm
7 C316 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C317 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C318 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C319 CAP,CERAMIC,CHIP ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP
7 C321 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C322 CAP,CHIP,MAKER ECZH0025920 1 nF,16V ,K ,X7R ,HD ,0603 ,R/TP , , ,[empty] ,[empty],[empty] ,[empty] ,[empty] ,[empty]
- 2�1 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Color Remark
7 C323 CAP,CHIP,MAKER ECZH0025920 1 nF,16V ,K ,X7R ,HD ,0603 ,R/TP , , ,[empty] ,[empty],[empty] ,[empty] ,[empty] ,[empty]
7 C324 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C325 CAP,CERAMIC,CHIP ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP
7 C326 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C327 CAP,CERAMIC,CHIP ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP
7 C328 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C329 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C330 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C331 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C332 CAP,CHIP,MAKER ECZH0025920 1 nF,16V ,K ,X7R ,HD ,0603 ,R/TP , , ,[empty] ,[empty],[empty] ,[empty] ,[empty] ,[empty]
7 C333 CAP,CERAMIC,CHIP ECCH0005604 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
7 C334 CAP,CERAMIC,CHIP ECCH0005604 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
7 C335 CAP,CERAMIC,CHIP ECCH0005604 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
7 C336 CAP,CERAMIC,CHIP ECCH0005604 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
7 C337 CAP,CERAMIC,CHIP ECCH0005604 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
7 C338 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C339 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C340 CAP,CERAMIC,CHIP ECCH0017601 4.7 uF,6.3V ,M ,X5R ,HD ,1005 ,R/TP ,; , ,20% ,6.3V,X5R ,-55TO+85C ,1005 ,R/TP , mm
7 C341 CAP,CHIP,MAKER ECZH0025920 1 nF,16V ,K ,X7R ,HD ,0603 ,R/TP , , ,[empty] ,[empty],[empty] ,[empty] ,[empty] ,[empty]
7 C342 CAP,CERAMIC,CHIP ECCH0017601 4.7 uF,6.3V ,M ,X5R ,HD ,1005 ,R/TP ,; , ,20% ,6.3V,X5R ,-55TO+85C ,1005 ,R/TP , mm
7 C343 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C400 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C401 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
7 C402 CAP,CHIP,MAKER ECZH0025916 33 pF,25V ,J ,NP0 ,TC ,0603 ,R/TP
7 C403 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C404 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C405 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
- 2�2 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Color Remark
7 C406 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C407 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
7 C408 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
7 C409 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C410 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
7 C411 CAP,CERAMIC,CHIP ECCH0017301 1000000 pF,6.3V ,M ,X5R ,HD ,0603 ,R/TP ,; ,1 ,20%,6.3V ,X5R ,-55TO+85C ,0603 ,R/TP ,0.3 mm
7 C412 CAP,CHIP,MAKER ECZH0025920 1 nF,16V ,K ,X7R ,HD ,0603 ,R/TP , , ,[empty] ,[empty],[empty] ,[empty] ,[empty] ,[empty]
7 C413 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C414 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C415 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
7 C416 CAP,CERAMIC,CHIP ECCH0005604 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
7 C417 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C418 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
7 C419 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
7 C420 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
7 C421 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
7 C422 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C423 CAP,CHIP,MAKER ECZH0025920 1 nF,16V ,K ,X7R ,HD ,0603 ,R/TP , , ,[empty] ,[empty],[empty] ,[empty] ,[empty] ,[empty]
7 C424 CAP,CHIP,MAKER ECZH0025920 1 nF,16V ,K ,X7R ,HD ,0603 ,R/TP , , ,[empty] ,[empty],[empty] ,[empty] ,[empty] ,[empty]
7 C425 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
7 C426 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C427 CAP,CHIP,MAKER ECZH0025920 1 nF,16V ,K ,X7R ,HD ,0603 ,R/TP , , ,[empty] ,[empty],[empty] ,[empty] ,[empty] ,[empty]
7 C428 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
7 C429 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
7 C430 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
7 C431 CAP,CHIP,MAKER ECZH0025920 1 nF,16V ,K ,X7R ,HD ,0603 ,R/TP , , ,[empty] ,[empty],[empty] ,[empty] ,[empty] ,[empty]
7 C432 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C433 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C434 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
- 2�� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Color Remark
7 C435 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
7 C436 CAP,CHIP,MAKER ECZH0025920 1 nF,16V ,K ,X7R ,HD ,0603 ,R/TP , , ,[empty] ,[empty],[empty] ,[empty] ,[empty] ,[empty]
7 C437 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C438 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
7 C439 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
7 C440 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C441 CAP,CERAMIC,CHIP ECCH0005604 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
7 C442 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
7 C445 CAP,CERAMIC,CHIP ECCH0017301 1000000 pF,6.3V ,M ,X5R ,HD ,0603 ,R/TP ,; ,1 ,20%,6.3V ,X5R ,-55TO+85C ,0603 ,R/TP ,0.3 mm
7 C446 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
7 C453 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C454 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C460 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
7 C461 CAP,CERAMIC,CHIP ECCH0017301 1000000 pF,6.3V ,M ,X5R ,HD ,0603 ,R/TP ,; ,1 ,20%,6.3V ,X5R ,-55TO+85C ,0603 ,R/TP ,0.3 mm
7 C514 CAP,CERAMIC,CHIP ECCH0009216 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
7 C600 CAP,CERAMIC,CHIP ECCH0017301 1000000 pF,6.3V ,M ,X5R ,HD ,0603 ,R/TP ,; ,1 ,20%,6.3V ,X5R ,-55TO+85C ,0603 ,R/TP ,0.3 mm
7 C601 CAP,CERAMIC,CHIP ECCH0017301 1000000 pF,6.3V ,M ,X5R ,HD ,0603 ,R/TP ,; ,1 ,20%,6.3V ,X5R ,-55TO+85C ,0603 ,R/TP ,0.3 mm
7 C602 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
7 C606 CAP,CHIP,MAKER ECZH0001126 820 pF,50V ,K ,X7R ,HD ,1005 ,R/TP
7 C607 CAP,CERAMIC,CHIP ECCH0017301 1000000 pF,6.3V ,M ,X5R ,HD ,0603 ,R/TP ,; ,1 ,20%,6.3V ,X5R ,-55TO+85C ,0603 ,R/TP ,0.3 mm
7 C608 CAP,CERAMIC,CHIP ECCH0017301 1000000 pF,6.3V ,M ,X5R ,HD ,0603 ,R/TP ,; ,1 ,20%,6.3V ,X5R ,-55TO+85C ,0603 ,R/TP ,0.3 mm
7 C609 CAP,CERAMIC,CHIP ECCH0017301 1000000 pF,6.3V ,M ,X5R ,HD ,0603 ,R/TP ,; ,1 ,20%,6.3V ,X5R ,-55TO+85C ,0603 ,R/TP ,0.3 mm
7 C610 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C611 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
7 C612 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C613 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C614 CAP,CERAMIC,CHIP ECCH0005604 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
- 2�4 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Color Remark
7 C615 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
7 C616 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C617 CAP,CERAMIC,CHIP ECCH0007802 4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP
7 C618 CAP,CERAMIC,CHIP ECCH0005604 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
7 C619 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
7 C620 CAP,CHIP,MAKER ECZH0025908 8 pF,25V ,D ,NP0 ,TC ,0603 ,R/TP
7 C621 CAP,CERAMIC,CHIP ECCH0017301 1000000 pF,6.3V ,M ,X5R ,HD ,0603 ,R/TP ,; ,1 ,20%,6.3V ,X5R ,-55TO+85C ,0603 ,R/TP ,0.3 mm
7 C622 CAP,CHIP,MAKER ECZH0025920 1 nF,16V ,K ,X7R ,HD ,0603 ,R/TP , , ,[empty] ,[empty],[empty] ,[empty] ,[empty] ,[empty]
7 C625 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C7 CAP,CHIP,MAKER ECZH0025916 33 pF,25V ,J ,NP0 ,TC ,0603 ,R/TP
7 CN400 CONNECTOR,I/O ENRY0008701 5 , mm,ETC , , ,; , ,0.60MM ,[empty] ,RECEPTACLE,[empty] ,[empty] ,
7 CN401 CONNECTOR,ETC ENZY0026901 3 ,2.5 mm,ETC ,- ,-
7 CN500 CONNECTOR,BOARD TOBOARD ENBY0051201 80 , mm,STRAIGHT , , ,; , ,0.40MM ,[empty] ,FEMALE
,[empty] ,[empty] , ,
7 D200 DIODE,TVS EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
7 D400 DIODE,SWITCHING EDSY0010501 ESC ,30 V,100 mA,R/TP ,SWITCH DIODE
7 D401 DIODE,TVS EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
7 D502 DIODE,TVS EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
7 D503 DIODE,TVS EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
7 FB600 FILTER,BEAD,CHIP SFBH0008101 600 ohm,1005 ,
7 J500 CONN,JACK/PLUG,EARPHONE ENJE0006701 4 ,5 PIN, ,; ,4P ,4P ,ANGLE ,[empty] , ,BLACK ,
7 L400 INDUCTOR,SMD,POWER ELCP00080124.7 uH,M ,2.5*2*1.2 ,R/TP ,Coil ,; ,4.7 ,20% ,; ,1.3 ,0.338,; ,; ,SHIELD ,2.5X2X1MM ,[empty] ,R/TP ,Inductor,WireWound,Chip
7 L401 INDUCTOR,SMD,POWER ELCP00080124.7 uH,M ,2.5*2*1.2 ,R/TP ,Coil ,; ,4.7 ,20% ,; ,1.3 ,0.338,; ,; ,SHIELD ,2.5X2X1MM ,[empty] ,R/TP ,Inductor,WireWound,Chip
7 L402 INDUCTOR,SMD,POWER ELCP00080124.7 uH,M ,2.5*2*1.2 ,R/TP ,Coil ,; ,4.7 ,20% ,; ,1.3 ,0.338,; ,; ,SHIELD ,2.5X2X1MM ,[empty] ,R/TP ,Inductor,WireWound,Chip
7 L403 INDUCTOR,SMD,POWER ELCP00080124.7 uH,M ,2.5*2*1.2 ,R/TP ,Coil ,; ,4.7 ,20% ,; ,1.3 ,0.338,; ,; ,SHIELD ,2.5X2X1MM ,[empty] ,R/TP ,Inductor,WireWound,Chip
7 L500 INDUCTOR,CHIP ELCH0001430 100 nH,J ,1005 ,R/TP ,PBFREE
7 L600 INDUCTOR,SMD,POWER ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,
- 2�5 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Color Remark
7 L610 INDUCTOR,SMD,POWER ELCP00080073.3 uH,N ,2.5*2.0*1.0 ,R/TP ,MLCI Power ,; ,3.3 ,30% ,; ,;,; ,; ,; ,SHIELD ,2.5X2X1MM ,[empty] ,[empty],Inductor,Wire Wound,Chip
7 R200 RES,CHIP ERHY0000290 300K ohm,1/16W,J,1005,R/TP
7 R201 RES,CHIP,MAKER ERHZ0000222 150 Kohm,1/16W ,F ,1005 ,R/TP
7 R202 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
7 R203 PCB ASSY,MAIN,PADOPEN SAFO0000401 0OHM DNI
7 R204 RES,CHIP ERHY0009503 100 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R206 RES,CHIP ERHY0009503 100 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R207 RES,CHIP ERHY0009503 100 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R208 RES,CHIP ERHY0009504 1 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R209 RES,CHIP ERHY0024201 6040 ohm,1/16W ,F ,1005 ,R/TP ,; ,6040 ,1% ,1/16W,1005 ,R/TP
7 R210 RES,CHIP,MAKER ERHZ0000463 33 ohm,1/16W ,J ,1005 ,R/TP
7 R211 RES,CHIP ERHY0000104 49.9 ohm,1/16W,F,1005,R/TP
7 R212 RES,CHIP ERHY0009505 10 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R213 RES,CHIP,MAKER ERHZ0000204 100 Kohm,1/16W ,F ,1005 ,R/TP
7 R214 RES,CHIP ERHY0009592 2000 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R216 RES,CHIP ERHY0009506 100 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R218 RES,CHIP ERHY0009527 47 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R301 RES,CHIP ERHY0009505 10 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R308 RES,CHIP ERHY0009536 100 Kohm,1/20W(0.05W) ,F ,0603 ,R/TP
7 R403 RES,CHIP,MAKER ERHZ0000488 4.7 ohm,1/16W ,J ,1005 ,R/TP
7 R404 RES,CHIP ERHY0009547 200 Kohm,1/20W(0.05W) ,F ,0603 ,R/TP
7 R406 RES,CHIP ERHY0000105 51 ohm,1/16W,F,1005,R/TP
7 R407 RES,CHIP ERHY0009505 10 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R409 RES,CHIP,MAKER ERHZ0004201 121000 ohm,1/16W ,F ,1005 ,R/TP
7 R423 RES,CHIP ERHY0009504 1 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R433 RES,CHIP,MAKER ERHZ0000318 80.6 Kohm,1/16W ,F ,1005 ,R/TP
7 R434 RES,CHIP,MAKER ERHZ0000537 680000 ohm,1/16W ,F ,1005 ,R/TP
7 R435 RES,CHIP,MAKER ERHZ0000288 470 Kohm,1/16W ,F ,1005 ,R/TP
7 R436 RES,CHIP ERHY0009504 1 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R437 RES,CHIP ERHY0009527 47 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
- 2�6 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Color Remark
7 R438 RES,CHIP ERHY0009504 1 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R439 RES,CHIP ERHY0009505 10 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R507 RES,CHIP ERHY0009507 1 Mohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R600 PCB ASSY,MAIN,PADSHORT SAFP0000401
7 R605 RES,CHIP ERHY0009536 100 Kohm,1/20W(0.05W) ,F ,0603 ,R/TP
7 U200 IC EUSY0392302560 NSP ,12 ,R/TP,ARM11(600M),UPA5.7,FWGA,8M,WVGA30fps,WM,BMP,Android ,; ,IC,Digital Baseband Processor
7 U201 IC EUSY0306201 Micro pak ,8 PIN,R/TP ,D Flip Flip
7 U202 IC EUSY0216301 SC70 ,5 PIN,R/TP ,Single 2-Input NAND Gate
7 U301 IC EUSY0395604FBGA ,137 ,ETC ,4G(LB/256Mx16)NAND+4G(DDR400/16Mx4x32*2_2CS_2CKE) SDRAM ,;,IC,MCP
7 U400 IC EUSY0342201 CSP ,137 PIN,R/TP ,PMIC, for MSM7xxx ,; ,IC,PMIC
7 U600 MODULE,ETC SMZY0024901 WiFi 11bg+BT+FM Module 9x7.8 x1.2,54pin,BCM4325D1,; ,WLAN
7 U601 IC EUSY0355701 PLP1010-4 ,4 PIN,R/TP ,150mA 2.8V Single LDO ,;,IC,Voltage Regulator
7 X200 VCTCXO EXSK0007802 19.2 MHz,1.5 PPM,10 pF,SMD ,3.3*2.5*1.0 , ,; , ,2PPM,2.8V , , , , ,SMD ,P/TP
7 X400 X-TAL EXXY002430132.768 KHz,20 PPM,12.5 pF,70 Kohm,SMD ,3.2*1.5*0.9,-40'C ~ +85'C, C0 1.05pF, C1 fF ,; ,32.768 ,20PPM ,12.5, , ,SMD ,R/TP
7 X600 TCXO EXST0001901 26 MHz,2.5 PPM,10 pF,SMD ,32*15*1.0 ,TI_WL1251 ,; ,,2.5PPM ,2.8V , , , , ,SMD ,R/TP
7 ZD400 DIODE,TVS EDTY0008610 SOD-523 ,5 V,250 W,R/TP ,PB-FREE
6 SAFD00 PCB ASSY,MAIN,SMT TOP SAFD0134601
7 ANT600 ANTENNA,MOBILE,FIXED SNMF0051501 5 ,-5 dB,Internal, BT, Chip, Pb Free ,; ,SINGLE , , ,
7 C1002 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C1004 INDUCTOR,CHIP ELCH0001430 100 nH,J ,1005 ,R/TP ,PBFREE
7 C1007 CAP,CERAMIC,CHIP ECCH0009216 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
7 C1008 CAP,CERAMIC,CHIP ECCH0017601 4.7 uF,6.3V ,M ,X5R ,HD ,1005 ,R/TP ,; , ,20% ,6.3V,X5R ,-55TO+85C ,1005 ,R/TP , mm
7 C1009 CAP,CERAMIC,CHIP ECCH0000196 0.75 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
7 C1010 CAP,CERAMIC,CHIP ECCH0000183 1.8 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
7 C1011 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
7 C1012 CAP,CERAMIC,CHIP ECCH0000175 2.7 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP
7 C1014 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
- 2�7 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Color Remark
7 C1018 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C1019 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C1021 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
7 C1022 CAP,CHIP,MAKER ECZH0001002 0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP
7 C1023 CAP,CERAMIC,CHIP ECCH0009216 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
7 C1024 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C1025 CAP,CERAMIC,CHIP ECCH0009216 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
7 C1026 CAP,CERAMIC,CHIP ECCH0017601 4.7 uF,6.3V ,M ,X5R ,HD ,1005 ,R/TP ,; , ,20% ,6.3V,X5R ,-55TO+85C ,1005 ,R/TP , mm
7 C1027 CAP,CERAMIC,CHIP ECCH0009103 100 pF,50V ,J ,X7R ,TC ,0603 ,R/TP , , ,[empty] ,[empty],C0G ,[empty] ,[empty] ,[empty] ,0.3 mm
7 C1028 CAP,CHIP,MAKER ECZH0000844 68 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
7 C1029 CAP,CERAMIC,CHIP ECCH0000195 3.9 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
7 C1031 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C1034 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
7 C1035 CAP,CERAMIC,CHIP ECCH0009216 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
7 C1036 CAP,CERAMIC,CHIP ECCH0009216 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
7 C1037 CAP,CERAMIC,CHIP ECCH0000175 2.7 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP
7 C1038 CAP,CHIP,MAKER ECZH0001002 0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP
7 C1039 CAP,CHIP,MAKER ECZH0000839 4.7 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
7 C1040 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
7 C1041 CAP,CERAMIC,CHIP ECCH0000123 51 pF,50V,J,NP0,TC,1005,R/TP
7 C1043 CAP,CHIP,MAKER ECZH0025916 33 pF,25V ,J ,NP0 ,TC ,0603 ,R/TP
7 C1045 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C1046 CAP,CERAMIC,CHIP ECCH0009103 100 pF,50V ,J ,X7R ,TC ,0603 ,R/TP , , ,[empty] ,[empty],C0G ,[empty] ,[empty] ,[empty] ,0.3 mm
7 C1048 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
7 C1049 CAP,CERAMIC,CHIP ECCH0009206 68 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
7 C1050 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
7 C1051 CAP,CERAMIC,CHIP ECCH0000901 2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
7 C1052 CAP,CERAMIC,CHIP ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP
7 C1053 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
7 C1055 CAP,CERAMIC,CHIP ECCH0000195 3.9 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
- 2�8 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Color Remark
7 C1056 CAP,CHIP,MAKER ECZH0000844 68 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
7 C1057 CAP,CERAMIC,CHIP ECCH0009103 100 pF,50V ,J ,X7R ,TC ,0603 ,R/TP , , ,[empty] ,[empty],C0G ,[empty] ,[empty] ,[empty] ,0.3 mm
7 C1060 CAP,CERAMIC,CHIP ECCH0009216 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
7 C1061 CAP,CERAMIC,CHIP ECCH0009216 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
7 C1062 CAP,CERAMIC,CHIP ECCH0005604 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
7 C1063 CAP,CHIP,MAKER ECZH0001002 0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP
7 C1064 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
7 C1066 CAP,CERAMIC,CHIP ECCH0009103 100 pF,50V ,J ,X7R ,TC ,0603 ,R/TP , , ,[empty] ,[empty],C0G ,[empty] ,[empty] ,[empty] ,0.3 mm
7 C1067 CAP,CERAMIC,CHIP ECCH0009103 100 pF,50V ,J ,X7R ,TC ,0603 ,R/TP , , ,[empty] ,[empty],C0G ,[empty] ,[empty] ,[empty] ,0.3 mm
7 C1068 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
7 C1069 CAP,CERAMIC,CHIP ECCH0017601 4.7 uF,6.3V ,M ,X5R ,HD ,1005 ,R/TP ,; , ,20% ,6.3V,X5R ,-55TO+85C ,1005 ,R/TP , mm
7 C1070 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C1071 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C1073 CAP,CERAMIC,CHIP ECCH0005604 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
7 C1075 CAP,CERAMIC,CHIP ECCH0009103 100 pF,50V ,J ,X7R ,TC ,0603 ,R/TP , , ,[empty] ,[empty],C0G ,[empty] ,[empty] ,[empty] ,0.3 mm
7 C1076 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C1077 CAP,CERAMIC,CHIP ECCH0009206 68 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
7 C1080 CAP,CHIP,MAKER ECZH0000844 68 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
7 C1081 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C1082 CAP,CERAMIC,CHIP ECCH0009103 100 pF,50V ,J ,X7R ,TC ,0603 ,R/TP , , ,[empty] ,[empty],C0G ,[empty] ,[empty] ,[empty] ,0.3 mm
7 C1084 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
7 C1085 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C1086 CAP,CERAMIC,CHIP ECCH0000183 1.8 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
7 C1087 CAP,CERAMIC,CHIP ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP
7 C1090 CAP,CERAMIC,CHIP ECCH0009103 100 pF,50V ,J ,X7R ,TC ,0603 ,R/TP , , ,[empty] ,[empty],C0G ,[empty] ,[empty] ,[empty] ,0.3 mm
7 C1091 CAP,CERAMIC,CHIP ECCH0000180 3.3 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
7 C1092 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C1093 CAP,CHIP,MAKER ECZH0000839 4.7 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
- 2�9 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Color Remark
7 C1094 CAP,CERAMIC,CHIP ECCH0000901 2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
7 C1095 CAP,CERAMIC,CHIP ECCH0000180 3.3 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
7 C1096 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C1097 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C1098 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
7 C1100 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
7 C1101 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
7 C1102 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C1103 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
7 C1109 CAP,CERAMIC,CHIP ECCH0000195 3.9 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
7 C1112 CAP,CERAMIC,CHIP ECCH0009216 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
7 C1114 CAP,CERAMIC,CHIP ECCH0009216 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
7 C3 INDUCTOR,CHIP ELCH0001430 100 nH,J ,1005 ,R/TP ,PBFREE
7 C4 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
7 C444 CAP,CERAMIC,CHIP ECCH0009216 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
7 C447 CAP,CERAMIC,CHIP ECCH0017301 1000000 pF,6.3V ,M ,X5R ,HD ,0603 ,R/TP ,; ,1 ,20%,6.3V ,X5R ,-55TO+85C ,0603 ,R/TP ,0.3 mm
7 C448 CAP,TANTAL,CHIP ECTH0005203 33 uF,10V ,M ,STD ,2012 ,R/TP ,; , ,[empty] ,[empty] ,,[empty] , ,[empty] ,[empty] ,[empty] ,[empty]
7 C449 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C450 CAP,CERAMIC,CHIP ECCH0009101 0.1 uF,6.3V ,K ,X5R ,TC ,0603 ,R/TP
7 C451 CAP,CERAMIC,CHIP ECCH0017301 1000000 pF,6.3V ,M ,X5R ,HD ,0603 ,R/TP ,; ,1 ,20%,6.3V ,X5R ,-55TO+85C ,0603 ,R/TP ,0.3 mm
7 C455 CAP,CERAMIC,CHIP ECCH0009226 39 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
7 C457 CAP,CHIP,MAKER ECZH0003503 1 uF,25V ,K ,X5R ,HD ,1608 ,R/TP
7 C458 CAP,TANTAL,CHIP ECTH0005203 33 uF,10V ,M ,STD ,2012 ,R/TP ,; , ,[empty] ,[empty] ,,[empty] , ,[empty] ,[empty] ,[empty] ,[empty]
7 C5 CAP,CERAMIC,CHIP ECCH0009103 100 pF,50V ,J ,X7R ,TC ,0603 ,R/TP , , ,[empty] ,[empty],C0G ,[empty] ,[empty] ,[empty] ,0.3 mm
7 C500 CAP,CERAMIC,CHIP ECCH0017301 1000000 pF,6.3V ,M ,X5R ,HD ,0603 ,R/TP ,; ,1 ,20%,6.3V ,X5R ,-55TO+85C ,0603 ,R/TP ,0.3 mm
7 C501 CAP,CERAMIC,CHIP ECCH0017301 1000000 pF,6.3V ,M ,X5R ,HD ,0603 ,R/TP ,; ,1 ,20%,6.3V ,X5R ,-55TO+85C ,0603 ,R/TP ,0.3 mm
7 C502 CAP,CERAMIC,CHIP ECCH0017301 1000000 pF,6.3V ,M ,X5R ,HD ,0603 ,R/TP ,; ,1 ,20%,6.3V ,X5R ,-55TO+85C ,0603 ,R/TP ,0.3 mm
7 C503 CAP,CERAMIC,CHIP ECCH0017601 4.7 uF,6.3V ,M ,X5R ,HD ,1005 ,R/TP ,; , ,20% ,6.3V,X5R ,-55TO+85C ,1005 ,R/TP , mm
- 240 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Color Remark
7 C504 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
7 C505 CAP,CERAMIC,CHIP ECCH0017301 1000000 pF,6.3V ,M ,X5R ,HD ,0603 ,R/TP ,; ,1 ,20%,6.3V ,X5R ,-55TO+85C ,0603 ,R/TP ,0.3 mm
7 C506 CAP,CERAMIC,CHIP ECCH0005604 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
7 C507 CAP,CERAMIC,CHIP ECCH0032801 220 nF,6.3V ,M ,X5R ,HD ,0603 ,R/TP ,; , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.3 mm
7 C508 CAP,CERAMIC,CHIP ECCH0032801 220 nF,6.3V ,M ,X5R ,HD ,0603 ,R/TP ,; , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.3 mm
7 C509 CAP,CERAMIC,CHIP ECCH0009110 22 nF,6.3V ,K ,X7R ,TC ,0603 ,R/TP
7 C510 CAP,CERAMIC,CHIP ECCH0009110 22 nF,6.3V ,K ,X7R ,TC ,0603 ,R/TP
7 C517 CAP,CERAMIC,CHIP ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP
7 C518 CAP,CERAMIC,CHIP ECCH0009106 10 nF,16V ,K ,X7R ,TC ,0603 ,R/TP
7 C519 CAP,CERAMIC,CHIP ECCH0009216 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
7 C520 CAP,CERAMIC,CHIP ECCH0009216 22 pF,25V ,J ,X7R ,TC ,0603 ,R/TP
7 C521 CAP,CERAMIC,CHIP ECCH0017301 1000000 pF,6.3V ,M ,X5R ,HD ,0603 ,R/TP ,; ,1 ,20%,6.3V ,X5R ,-55TO+85C ,0603 ,R/TP ,0.3 mm
7 C522 CAP,CERAMIC,CHIP ECCH0009514 10 pF,25V ,D ,C0G ,HD ,0603 ,R/TP , , ,[empty] ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,0.3 mm
7 C6 CAP,CHIP,MAKER ECZH0025916 33 pF,25V ,J ,NP0 ,TC ,0603 ,R/TP
7 C604 CAP,CHIP,MAKER ECZH0001002 0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP
7 C605 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
7 C624 CAP,CHIP,MAKER ECZH0000822 1.5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
7 C8 CAP,CHIP,MAKER ECZH0025920 1 nF,16V ,K ,X7R ,HD ,0603 ,R/TP , , ,[empty] ,[empty],[empty] ,[empty] ,[empty] ,[empty]
7 D501 DIODE,TVS EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
7 D504 DIODE,TVS EDTY0009801 SOT-963 ,5 V,25 W,R/TP , ,; , , , , , ,[empty] ,[empty] ,2P,1
7 D505 DIODE,TVS EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
7 FB502 FILTER,BEAD,CHIP SFBH0008102 1800 ohm,1005 ,Bead
7 FB503 FILTER,BEAD,CHIP SFBH0008102 1800 ohm,1005 ,Bead
7 FB504 FILTER,BEAD,CHIP SFBH0008102 1800 ohm,1005 ,Bead
7 FL1001 FILTER,SAW SFSY00334031575.42 MHz,1.4*1.1*0.4 ,SMD ,1574.42M~1576.42M, IL1.2, 5pin, U-U, 50-50, GPS HIGH ATTEN. ,; ,1575.42,1.4*1.1*0.4 ,SMD ,R/TP
7 FL1002 DUPLEXER,IMT SDMY0002801
897.5 MHz,942.5 MHz,2.9 dB,3.8 dB,55 dB,45dB,2.5*2.0*0.94 ,SMD ,SAW, Band8, Rx balance type ,;,942.5 ,925 to 960 ,897.5 ,880 to 915 ,3.8 ,2.9,2.5x2.0x0.94 ,DUAL ,SMD ,R/TP
- 241 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Color Remark
7 FL1003 DUPLEXER,IMT SDMY0001901
1950 MHz,2140 MHz,1.8 dB,2.4 dB,52 dB,43dB,2.5*2.0*0.55 ,SMD ,Band1, 2520size, SAW, Rx unbal,; ,2140 ,2110 to 2170 ,1950 ,1920 to 1980 ,2.4 ,1.8,2.5x2.0x0.55 ,DUAL ,SMD ,R/TP
7 FL1004 FILTER,SAW SFSY00350012140 MHz,1.4*1.1*0.45 ,SMD ,2110M~2170M, IL 2.3,5pin, U-B, 50-100_20, WCDMA BAND I Rx ,; ,2140,1.4*1.1*0.45 ,SMD ,R/TP
7 FL1005 FILTER,SAW SFSY00351011950 MHz,1.4*1.1*0.45 ,SMD ,1920M~1980M, IL 3.2,5pin, U-U, 50-50, WCDMA BAND I Tx ,; ,1950,1.4*1.1*0.45 ,SMD ,R/TP
7 FL1006 FILTER,SAW SFSY0037601897.5 MHz,1.4*1.1*0.4 ,SMD ,880M~915M, IL 3.6, 5pin,U-U, 50-50, W-BAND VIII Tx ,; ,897.5 ,1.4*1.1*0.4 ,SMD,R/TP
7 FL1007 FILTER,SEPERATOR SFAY0012501 , , dB, dB, dB, dB,4532 ,
7 FL400 FILTER,EMI/POWER SFEY0006501 SMD ,3 TERMINAL EMI FILTER
7 IC500 IC EUSY0360201 CSP ,20 ,R/TP ,Class D(mono) + Capless HP + A/S ,;,IC,Audio Sub System
7 J1 CONN,SOCKET ENSY0024301 6 ,ETC , ,2.54 mm,16.3x17.4x1.5t, Stopper
7 L1001 INDUCTOR,CHIP ELCH0004713 6.8 nH,J ,1005 ,R/TP ,
7 L1002 INDUCTOR,CHIP ELCH0004710 15 nH,J ,1005 ,R/TP ,
7 L1003 INDUCTOR,CHIP ELCH0004720 1.2 nH,S ,1005 ,R/TP ,
7 L1004 INDUCTOR,CHIP ELCH0004720 1.2 nH,S ,1005 ,R/TP ,
7 L1005 INDUCTOR,CHIP ELCH0001430 100 nH,J ,1005 ,R/TP ,PBFREE
7 L1006 INDUCTOR,CHIP ELCH0004721 2.2 nH,S ,1005 ,R/TP ,
7 L1007 INDUCTOR,CHIP ELCH0003816 3.6 nH,S ,1005 ,R/TP ,
7 L1008 INDUCTOR,CHIP ELCH0004710 15 nH,J ,1005 ,R/TP ,
7 L1009 INDUCTOR,CHIP ELCH0003816 3.6 nH,S ,1005 ,R/TP ,
7 L1010 INDUCTOR,CHIP ELCH0004708 2.7 nH,S ,1005 ,R/TP ,
7 L1011 INDUCTOR,CHIP ELCH0001401 15 nH,J ,1005 ,R/TP ,Pb Free
7 L1012 INDUCTOR,CHIP ELCH0004721 2.2 nH,S ,1005 ,R/TP ,
7 L1013 INDUCTOR,CHIP ELCH0004721 2.2 nH,S ,1005 ,R/TP ,
7 L1014 INDUCTOR,CHIP ELCH0001048 10 nH,J ,1005 ,R/TP ,PBFREE
7 L1015 INDUCTOR,CHIP ELCH0004701 12 nH,J ,1005 ,R/TP ,
7 L1016 INDUCTOR,CHIP ELCH0003815 2.7 nH,S ,1005 ,R/TP ,
7 L1017 INDUCTOR,CHIP ELCH0004712 3.9 nH,S ,1005 ,R/TP ,
7 L1018 INDUCTOR,CHIP ELCH0004726 1.5 nH,J ,1005 ,R/TP ,
7 L1019 INDUCTOR,CHIP ELCH0004714 18 nH,J ,1005 ,R/TP ,
- 242 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Color Remark
7 L1020 INDUCTOR,CHIP ELCH0004712 3.9 nH,S ,1005 ,R/TP ,
7 L1021 INDUCTOR,CHIP ELCH0004701 12 nH,J ,1005 ,R/TP ,
7 L1022 INDUCTOR,CHIP ELCH0004701 12 nH,J ,1005 ,R/TP ,
7 L1023 INDUCTOR,CHIP ELCH0004708 2.7 nH,S ,1005 ,R/TP ,
7 L1024 INDUCTOR,CHIP ELCH0004704 4.7 nH,S ,1005 ,R/TP ,
7 L1025 INDUCTOR,CHIP ELCH0004105 1.2 nH,S ,0603 ,R/TP ,MLCI
7 L1026 INDUCTOR,CHIP ELCH0004710 15 nH,J ,1005 ,R/TP ,
7 L601 INDUCTOR,CHIP ELCH0004704 4.7 nH,S ,1005 ,R/TP ,
7 R1 RES,CHIP ERHY0009516 2.2 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R1001 RES,CHIP ERHY0009501 0 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R1002 PCB ASSY,MAIN,PADOPEN SAFO0000401 0OHM DNI
7 R1003 RES,CHIP,MAKER ERHZ0000327 180 ohm,1/16W ,F ,1005 ,R/TP
7 R1005 RES,CHIP,MAKER ERHZ0000456 2.2 ohm,1/16W ,J ,1005 ,R/TP
7 R1006 RES,CHIP,MAKER ERHZ0003801 5.1 ohm,1/16W ,J ,1005 ,R/TP
7 R1007 RES,CHIP,MAKER ERHZ0000411 120 ohm,1/16W ,J ,1005 ,R/TP
7 R1008 RES,CHIP,MAKER ERHZ0003801 5.1 ohm,1/16W ,J ,1005 ,R/TP
7 R1009 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP
7 R1010 RES,CHIP,MAKER ERHZ0000517 91 ohm,1/16W ,J ,1005 ,R/TP
7 R1011 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP
7 R1012 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP
7 R1013 RES,CHIP,MAKER ERHZ0000212 12 Kohm,1/16W ,F ,1005 ,R/TP
7 R1014 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
7 R1015 RES,CHIP,MAKER ERHZ0000411 120 ohm,1/16W ,J ,1005 ,R/TP
7 R1016 RES,CHIP,MAKER ERHZ0000517 91 ohm,1/16W ,J ,1005 ,R/TP
7 R1017 RES,CHIP,MAKER ERHZ0000327 180 ohm,1/16W ,F ,1005 ,R/TP
7 R1018 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP
7 R1020 RES,CHIP,MAKER ERHZ0000512 82 ohm,1/16W ,J ,1005 ,R/TP
7 R1021 RES,CHIP,MAKER ERHZ0000457 30 ohm,1/16W ,J ,1005 ,R/TP
7 R1022 RES,CHIP ERHY0009504 1 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R1023 RES,CHIP ERHY0009504 1 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R1024 RES,CHIP ERHY0009504 1 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
- 24� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level LocationNo. Description Part Number Spec Color Remark
7 R1025 RES,CHIP ERHY0009504 1 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R1026 RES,CHIP,MAKER ERHZ0000434 1 ohm,1/16W ,J ,1005 ,R/TP
7 R2 RES,CHIP ERHY0009504 1 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R424 RES,CHIP,MAKER ERHZ0000222 150 Kohm,1/16W ,F ,1005 ,R/TP
7 R425 RES,CHIP,MAKER ERHZ0000288 470 Kohm,1/16W ,F ,1005 ,R/TP
7 R426 RES,CHIP ERHY0009516 2.2 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R427 RES,CHIP ERHY0009526 4.7 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R428 RES,CHIP ERHY0009505 10 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R429 RES,CHIP ERHY0009526 4.7 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R432 RES,CHIP,MAKER ERHZ0003901 0.1 ohm,1/4W ,F ,2012 ,R/TP ,; ,0.1 ,1% ,1/4W ,2012,R/TP
7 R500 RES,CHIP ERHY0009526 4.7 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R501 RES,CHIP ERHY0009505 10 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R502 RES,CHIP,MAKER ERHZ0000422 15 Kohm,1/16W ,J ,1005 ,R/TP
7 R505 RES,CHIP ERHY0009526 4.7 Kohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 R508 RES,CHIP ERHY0009524 47 ohm,1/20W(0.05W) ,J ,0603 ,R/TP
7 SPFY00 PCB,MAIN SPFY0215601 FR-4 ,0.75 mm,ANY-LAYER10 , ,; , , , , , , , , ,
7 SW1001 CONN,RF SWITCH ENWY0004001 ,SMD ,1.3 dB,
7 SW1002 CONN,RF SWITCH ENWY0006801 ,SMD , dB, ,; ,0.40MM ,STRAIGHT ,SOCKET ,SMD,[empty] ,[empty] , ,
7 U1001 MODULE,ETC SMZY0021701 GPS LNA Module integrated Filter, 3.3x2.1x1.1 ,; ,RFModule
7 U1002 PAM SMPY0020101 dBm, %, A, dBc, dB,4x5 ,SMD ,3G Dual PAM B1+8.Coupler Integrated ,; , , , , , , , ,LGA ,R/TP ,
7 U1003 IC EUSY0344001 QFN ,68 ,R/TP ,Quad GSM, Tri WCDMA RF Transceiver,; ,IC,Tx/Rx
7 U1004 PAM SMPY0019101 dBm, %, A, dBc, dB,5x5 ,SMD ,Polar Edge for QCT ,; , , ,, , , , ,LGA ,R/TP ,
7 U401 IC EUSY0353801 PLP1010-4 ,4 PIN,R/TP ,1x1 LDO, 3.3V , 150mA ,;,IC,LDO Voltage Regulator
7 U402 IC EUSY0371201 WLP ,20 ,R/TP ,MUIC for 5Pin Micro USB ,; ,IC,AnalogSwitch
7 U403 TR,FET,P-CHANNEL EQFP0008601 DFN8 ,1.3 W,-20 V,-3.9 A,R/TP ,Intergrated powerMOSFET with PNP Transistor
7 U404 IC EUSY0374601 TDFN ,8 ,R/TP ,Programmable OVP ,; ,IC,Charger
7 U500 IC EUSY0355501 PLP1010-4 ,4 PIN,R/TP ,1.8V 150mA Single LDO ,;,IC,LDO Voltage Regulator
- 244 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
11. EXPLODED VIEW & REPLACEMENT PART LIST
by SBOM standard on GCSC
Level LocationNo. Description Part Number Spec Color Remark
3 SBPL00 BATTERY PACK,LI-ION SBPL01000013.7 V,900 mAh,1 CELL,PRISMATIC,533640,Innerpack,WW ,; ,3.7 ,900 ,180 ,PRISMATIC,5.3xx36x40 ,5.7x41x39 ,BLACK ,innerpack ,
P', 24
3 SGDY00 DATA CABLE SGDY0014302 ; ,[empty] ,[empty] ,1.2M , ,BLACK ,1.2m, 4, Shield caseMicroUSB, ID resistor open ,N
3 SGEY00 EAR PHONE/EAR MIKESET SGEY0007610
; ,20mW ,16 ohm ,99dB,1KHZ,1mW ,65dB 10KHZ,104dB 100KHZ ,[empty] ,[empty] ,3.5 L TYPE STEREO4POLE PLUG ,Mic Slimtype Canal(BK) ,Earphone,Stereo
3 SSAD00 ADAPTOR,AC-DC SSAD0031001 100-240V ,5060 Hz,5.1 V,0.7 A,CE ,STA-U12ED,Europe, Cableless ,; , ,5.1 ,0.7 , , ,WALL 2P ,USB ,
대치 ADAPTOR,AC-DC SSAD0031002 100-240V ,5060 Hz,5.1 V,0.7 A,CE ,STA-U12ER,Europe, Cableless ,; , ,5.1 ,0.7 , , ,WALL 2P ,USB ,
대치 ADAPTOR,AC-DC SSAD0031003 100-240V ,5060 Hz,5.1 V,0.7 A,CE ,STA-U12ES,Europe, Cableless ,; , ,5.1 ,0.7 , , ,WALL 2P ,USB ,
11.3 Accessory Note: This Chapter is used for reference, Part order is ordered
SGDY0016701