Post on 21-Jan-2023
www.microchip.com
Focus Product Selector Guide
Focus Product Selector GuideMicrocontrollers • Digital Signal Controllers • Analog • Memory • Wireless
2 Focus Product Selector Guide
Microchip: A Partner in Your Success
8-bit PIC® MicrocontrollersBased on a powerful RISC core, the PIC microcontroller architecture provides users with an easy migration path from 6 to 100 pins among all families, with little or no code change required. Advanced features include sophisticated timing peripherals, integrated analog-to-digital converters and communications peripherals (Ethernet/I2C™/SPI/USB/CAN ports, LIN USARTs, op amp and digital-to-analog converters). For more information visit: www.microchip.com/8bit.
16-bit PIC MicrocontrollersThe 16-bit PIC24 Family is comprised of two sub-families. The PIC24F offers a cost-effective low power step up in performance, memory and peripherals for many applications that are pushing the envelope of 8-bit microcontroller capabilities. For more demanding applications, the PIC24H/E offers up to 70 MIPS performance, up to 150°C operation, more memory and additional peripherals, such as CAN communication modules. For more information visit: www.microchip.com/16bit.
dsPIC® Digital Signal ControllersThe dsPIC family of Digital Signal Controllers (DSCs) features a fully implemented digital signal processor (DSP) engine, with up to 70 MIPS performance, C compiler friendly design and a familiar microcontroller architecture and design environment. The dsPIC 16-bit Flash DSCs provide the industry’s highest performance, and have features supporting motor control, digital power conversion, speech and audio, intelligent sensing and general purpose embedded control applications. For more information visit: www.microchip.com/dspic.
32-bit PIC MicrocontrollersThe PIC32 family adds more performance and more memory while maintaining pin, peripheral and software compatibility with Microchip’s 16-bit MCU/DSC families. The PIC32 family operates at up to 105 DMIPS and offers ample code and data space capabilities with up to 512 KB Flash and 128 KB RAM. For more information visit: www.microchip.com/32bit.
Analog and Interface ProductsMicrochip’s integrated analog technology, peripherals and features are engineered to meet today’s demanding design requirements. Our broad spectrum of analog products addresses thermal management, power management, battery management, mixed-signal, linear, interface and safety & security solutions. Our broad portfolio of stand-alone analog and interface devices offers highly integrated solutions that combine various analog functions in space-saving packages and support a variety of bus interfaces. Many of these devices support functionality that enhances the analog features currently available on PIC microcontrollers. For more information visit: www.microchip.com/analog.
Microchip is a leading provider of microcontroller and analog semiconductors, providing low-risk product development, lower total system cost and faster time to market for thousands of diverse customer applications worldwide. Offering outstanding technical support along with dependable delivery and quality, Microchip serves over 70,000 customers in more than 65 countries who are designing high-volume embedded control applications in the consumer, automotive, office-automation, communications and industrial-control markets worldwide.
Table of Contents
8-bit PIC Microcontrollers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .316-bit PIC Microcontrollers . . . . . . . . . . . . . . . . . . . . . . . . . . . .10dsPIC DSC Families . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1432-bit PIC Microcontrollers . . . . . . . . . . . . . . . . . . . . . . . . . . . .17Analog and Interface Products . . . . . . . . . . . . . . . . . . . . . . . . . .19Real Time Clock/Calendar (RTCC) . . . . . . . . . . . . . . . . . . . . . . .24Serial Memory Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25Serial Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27LPC Firmware Flash/Firmware Hub Flash Memory . . . . . . . . . . . .27Parallel Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Wireless Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29USB Products. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30Ethernet and Networking Products . . . . . . . . . . . . . . . . . . . . . . .32Automotive Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33PC System & I/O Controllers . . . . . . . . . . . . . . . . . . . . . . . . . . .35Capacitive Touch Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36Wireless Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37Terms and Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
RF Front End ProductsMicrochip’s selection of RF front end devices enhance the performance and operating range of wireless products at 2.4 and 5 GHz. SST Power amplifier products provide high linear output power as required for 802.11 (Wi-Fi®) and 802.15.4 (ZigBee®) standards with industry leading efficiency and reliability. Our selection of integrated Front End Modules (FEM), combines the function of power amplifier with switches, Low Noise Amplifier (LNA) and filters into a single space saving package. The FEM reduces board complexity and sizes. For more information visit: www.microchip.com/analog.
Wireless ProductsMicrochip offers radio-frequency products for adding wireless connectivity to embedded PIC microcontroller and dsPIC DSC-based designs for the following technologies: IEEE 802.15.4/ZigBee, Sub-GHz RF, Bluetooth® and IEEE 802.11/Wi-Fi. For more information visit: www.microchip.com/wireless.
Memory ProductsMicrochip’s broad portfolio of memory devices include Serial EEPROM, Serial SRAM, Serial Flash and Parallel Flash Devices. Our innovative, low-power designs and extensive testing have ensured industry leading robustness and endurance along with best-in-class quality at low costs. For more information visit: www.microchip.com/memory.
Real-Time ClocksMicrochip offers a family of highly integrated, low cost Real-Time Clock/Calendar devices with battery backup capability, digital trimming along with onboard EEPROM and SRAM memory. For more information visit: www.microchip.com/clock.
MOST®Media Oriented Systems Transport (MOST) is the accepted standard in high-bandwidth automotive infotainment systems. MOST is broadly standardized from the physical layer up to the application level. Various speed grades and physical layers are available. MOST carries A/V streaming, packet, isochronous and control data, has a high flexibility and scalability and is approved to carry DVD and Blu-ray™ content using Digital Transmission Content Protection (DTCP). For more information visit: www.microchip.com/automotivesmsc.
PC System & I/O ControllersMicrochip offers a full line of mobile PC solutions including embedded controllers, keyboard controllers (KBC), mobile I/O controllers and docking products. For more information visit: www.microchip.com/pcsystemscontrollerssmsc.
3Focus Product Selector Guide
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2F50
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8PD
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6F50
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5 KB
1
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6F52
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5 KB
1
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9PD
IP (P
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9PD
IP (P
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PIC1
6F18
23
R14
12EM
R3.
5 KB
2
KwRW
128
256
1.8V
-5.5
V32
MHz
32 M
Hz,
31 k
Hz–
8–
8–
2–
––
––
1–
––
–2
1–
11
––
–BO
RSW
◊
$0
.78
PDIP
(P),
SOIC
(SL)
, TS
SOP
(ST)
, 4 ×
4 Q
FN (M
L)Te
mp*
4 Focus Product Selector Guide
Prod
ucts
sor
ted
by p
in c
ount
follo
wed
by p
ricin
g.†
Pric
ing
subj
ect t
o ch
ange
; ple
ase
cont
act y
our M
icro
chip
repr
esen
tativ
e fo
r mos
t cur
rent
pric
ing.
◊ So
ftwar
e PL
VD im
plem
ente
d vi
a AD
C.*
Inte
grat
ed T
empe
ratu
re In
dica
tor:
Ref
eren
ce A
pplic
atio
n N
ote
AN13
33 fo
r im
plem
enta
tion.
eXt
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w P
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var
iant
s av
aila
ble.
8-b
it P
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MiC
ro
Co
ntr
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Prod
uct
released (r) not released (nr)
Pins
Core
Mem
ory
Voltage range
ope
ratin
g sp
eed
lCD segments
mtouch™ Channels
Anal
og s
ensi
ng &
Mea
sure
men
tD
igita
lCo
mm
unic
atio
nM
onito
rs
sr-latch
timer 1 Gate
5 ku Pricing†
Pack
ages
(D
esig
nato
r)sp
ecia
l Fe
atur
es
total
i/o
Program
self-read/Write
Data rAM (b)
Data ee (b)
Maximum speed
internal oscillator
8-bit ADC
10-bit ADC
12-bit ADC
Comparators
Charge time Measurement Unit
op Amp
DAC (5b/8b/9b)
PWM
CCP
eCCP
CWG/CoG
nCo
PsMC
ClC
8-bit timer
16-bit timer
AUsArt
eUsArt
i2C™/sPi
ethernet (MAC/PHY)
Usb 2.0 Device
CAn
bor/Pbor
PlVD
14-Pin (Cont.)
PIC1
6F18
24
R14
12EM
R7
KB
4 Kw
RW25
625
61.
8V–5
.5V
32 M
Hz32
MHz
, 31
kHz
–8
–8
–2
––
––
22
––
––
41
–1
1–
––
BOR
SW◊
üü
$0.8
4PD
IP (P
), SO
IC (S
L),
TSSO
P (S
T), 4
× 4
QFN
(ML)
DSM
, Tem
p*
PIC1
6F63
0R
1412
MR
1.75
KB
1 Kw
–64
128
2V–5
.5V
20 M
Hz4
MHz
––
––
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––
––
––
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11
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.91
PDIP
(P),
SOIC
(SL)
, TS
SOP
(ST)
, 4 ×
4 Q
FN (M
L)
PIC1
6F14
54
R14
12EM
R7
KB
4 Kw
RW51
2–
1.8V
–5.5
V48
MHz
48 M
Hz,
31 K
Hz–
––
––
––
––
––
––
––
–1
1–
11
–ü
–PB
ORSW
–ü
$0.9
1PD
IP (P
), TS
SOP
(ST)
, SO
IC (S
L), 4
× 4
QFN
(ML)
Crys
tal F
ree
USB
PIC1
6F63
6R
1412
MR
3.5
KB
2 Kw
–12
825
62V
–5.5
V20
MHz
8 M
Hz,
31 k
Hz–
––
––
2–
––
––
––
––
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1–
––
––
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R–
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2PD
IP (P
), SO
IC (S
L),
TSSO
P (S
T), 4
× 4
QFN
(ML)
KeeL
oq®
PIC1
6F18
25
R14
12EM
R14
KB
8 Kw
RW10
2425
61.
8V–5
.5V
32 M
Hz32
MHz
, 31
kHz
–8
–8
–2
––
––
22
––
––
41
–1
1–
––
BOR
SW◊
üü
$0.9
2PD
IP (P
), SO
IC (S
L),
TSSO
P (S
T), 4
× 4
QFN
(ML)
DSM
, Tem
p*
PIC1
6F67
6R
1412
MR
1.75
KB
1 Kw
–64
128
2V–5
.5V
20 M
Hz4
MHz
–8
–8
–1
––
––
––
––
––
11
––
––
––
BOR
––
ü$0
.98
PDIP
(P),
SOIC
(SL)
, TS
SOP
(ST)
, 4 ×
4 Q
FN (M
L)
PIC1
6F68
4R
1412
MR
3.5
KB
2 Kw
–12
825
62V
–5.5
V20
MHz
8 M
Hz,
31 k
Hz–
8–
8–
2–
––
––
1–
––
–2
1–
––
––
–BO
R–
–ü
$0.9
8PD
IP (P
), SO
IC (S
L),
TSSO
P (S
T), 4
× 4
QFN
(ML)
PIC1
6F68
8R
1412
MR
7 KB
4
KwR
256
256
2V–5
.5V
20 M
Hz8
MHz
, 31
kHz
–8
–8
–2
––
––
––
––
––
11
–1
––
––
BOR
––
ü$1
.04
PDIP
(P),
SOIC
(SL)
, TS
SOP
(ST)
, 4 ×
4 Q
FN (M
L)
PIC1
6F14
55
R14
12EM
R14
KB
8 Kw
RW10
24–
1.8V
–5.5
V48
MHz
48 M
Hz,
31 K
Hz–
5–
5–
2–
––
2–
––
––
–2
1–
11
–ü
–PB
ORSW
–ü
$1.0
4PD
IP (P
), TS
SOP
(ST)
, SO
IC (S
L), 4
× 4
QFN
(ML)
Crys
tal F
ree
USB
PIC1
6F17
05
NR14
12EM
R14
KB
RW10
24–
1.8V
–5.5
V32
MHz
32 M
Hz–
12–
12–
2–
20/
1/0
22
00/
1–
–4
41
–1
1–
––
BOR
––
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ll fo
r pr
icin
gPD
IP (P
), SO
IC (S
L), T
SSOP
(ST)
, 4
× 4
QFN
(ML)
18-Pin
PIC1
6F54
R18
12BL
0.75
KB
0.50
Kw
–25
–2V
–5.5
V20
MHz
––
––
––
––
––
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––
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––
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––
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.39
PDIP
(P),
SOIC
(SO)
, SSO
P (S
S)
PIC1
6F18
26
R18
16EM
R3.
5 KB
2
KwRW
256
256
1.8V
–5.5
V32
MHz
32 M
Hz,
31 k
Hz–
12–
12–
2–
––
––
1–
––
–2
1–
11
––
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RSW
ן
ü$0
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PDIP
(P),
SOIC
(SO)
, SSO
P (S
S),
QFN
(ML)
DSM
, Tem
p*
PIC1
6F18
27
R18
16EM
R7
KB
4 Kw
RW38
425
61.
8V–5
.5V
32 M
Hz32
MHz
, 31
kHz
–12
–12
–2
––
––
22
––
––
41
–1
2–
––
BOR
SW◊
üü
$1.0
4PD
IP (P
), SO
IC (S
O), S
SOP
(SS)
, QF
N (M
L)DS
M, T
emp*
PIC1
6F18
47
R18
16EM
R14
KB
8 Kw
RW10
2425
61.
8V–5
.5V
32 M
Hz32
MHz
, 31
KHz
––
–12
–2
––
––
22
––
––
41
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2–
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PBOR
SWü
ü$1
.09
PDIP
(P),
SOIC
(SO)
, SSO
P (S
S),
QFN
(ML)
, UQF
N (M
V)DS
M, T
emp*
20-Pin
PIC1
6F52
7R
2018
EBL
1.5
KB
1 Kw
RW68
642V
–5.5
V20
Mhz
8 M
Hz–
–8
––
2–
2–
––
––
––
–1
––
––
––
–BO
R–
––
$0.4
9PD
IP (P
), 4
× 4
QFN
(ML)
, SSO
P (S
S), S
OIC
(SO)
PIC1
6F15
07R
2018
EMR
3.5
KB
2 Kw
RW12
8–
1.8V
–5.5
V20
MHz
16 M
Hz–
––
12–
––
––
4–
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01
–1
21
––
––
––
PBOR
SW–
ü$0
.69
PDIP
(P),
SOIC
(SO)
, SSO
P,
4 ×
4 QF
N (M
L)Te
mp*
PIC1
6F72
0R
2018
MR
3.5
KB
2 Kw
RW12
8–
1.8V
–5.5
V16
MHz
16 M
Hz,
500
kHz
–12
12–
––
––
––
1–
––
––
21
1–
1–
––
BOR
SW◊
–ü
$0.7
7PD
IP (P
), SO
IC (S
O), S
SOP
(SS)
, QF
N (M
L)Te
mp*
PIC1
6F15
08
R20
18EM
R7
KB
4 Kw
RW25
6–
1.8V
–5.5
V20
MHz
16 M
Hz–
2–
12–
2–
––
4–
–1/
01
–1
21
–1
1–
––
PBOR
SW–
ü$0
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PDIP
(P),
SOIC
(SO)
, SSO
P,
4 ×
4 QF
N (M
L)Te
mp*
PIC1
6F15
09
R20
18EM
R14
KB
8 Kw
RW51
2–
1.8V
–5.5
V20
MHz
16 M
Hz–
2–
12–
2–
––
4–
–1/
01
–1
21
–1
1–
––
PBOR
SW–
ü$0
.81
PDIP
(P),
SOIC
(SO)
, SSO
P,
4 ×
4 QF
N (M
L)Te
mp*
PIC1
6F72
1R
2018
MR
7 KB
4
KwRW
256
–1.
8V–5
.5V
16 M
Hz16
MHz
, 50
0 kH
z–
1212
––
––
––
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––
––
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11
–1
––
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RSW
◊–
ü$0
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PDIP
(P),
SOIC
(SO)
, SSO
P (S
S),
QFN
(ML)
Tem
p*
PIC1
6F63
1R
2018
MR
1.75
KB
1 Kw
R64
128
2V–5
.5V
20 M
Hz8
MHz
, 31
kHz
––
––
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––
––
––
––
––
11
––
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BOR
SW◊
üü
$0.9
1PD
IP (P
), SO
IC (S
O), S
SOP
(SS)
, QF
N (M
L)
PIC1
6F67
7R
2018
MR
3.5
KB
2 Kw
R12
825
62V
–5.5
V20
MHz
8 M
Hz,
31 k
Hz–
12–
12–
2–
––
––
––
––
–1
1–
–1
––
–BO
RSW
ן
ü$0
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PDIP
(P),
SOIC
(SO)
, SSO
P (S
S),
QFN
(ML)
PIC1
6F18
28
R20
18EM
R7
KB
4 Kw
RW25
625
61.
8V–5
.5V
32 M
Hz32
MHz
, 31
kHz
–12
–12
–2
––
––
22
––
––
41
–1
1–
––
BOR
SW◊
üü
$0.9
9PD
IP (P
), SO
IC (S
O), S
SOP
(SS)
, QF
N (M
L)DS
M, T
emp*
PIC1
6F18
29
R20
18EM
R14
KB
8 Kw
RW10
2425
61.
8V–5
.5V
32 M
Hz32
MHz
, 31
kHz
–12
–12
–2
––
––
22
––
––
41
–1
2–
––
BOR
SW◊
üü
$1.0
6PD
IP (P
), SO
IC (S
O), S
SOP
(SS)
, QF
N (M
L)DS
M, T
emp*
PIC1
6F68
7R
2018
MR
3.5
KB
2 Kw
R12
825
62V
–5.5
V20
MHz
8 M
Hz,
31 k
Hz–
12–
12–
2–
––
––
––
––
–1
1–
11
––
–BO
RSW
ן
ü$1
.07
PDIP
(P),
SOIC
(SO)
, SSO
P (S
S),
QFN
(ML)
PIC1
6F78
5R
2018
MR
3.5
KB
2 Kw
–12
825
62V
–15V
20 M
Hz8
MHz
, 31
kHz
–12
–12
–2
–2
–2
1–
––
––
21
––
––
––
BOR
SW◊
–ü
$1.1
2PD
IP (P
), SO
IC (S
O), S
SOP
(SS)
, QF
N (M
L)
PIC1
6F68
5R
2018
MR
7 KB
4
KwR
256
256
2V–5
.5V
20 M
Hz8
MHz
, 31
kHz
–12
–12
–2
––
––
–1
––
––
21
––
––
––
BOR
SW◊
üü
$1.1
3PD
IP (P
), SO
IC (S
O), S
SOP
(SS)
, QF
N (M
L)
PIC1
6F68
9R
2018
MR
7 KB
4
KwR
256
256
2V–5
.5V
20 M
Hz8
MHz
, 31
kHz
–12
–12
–2
––
––
––
––
––
11
–1
1–
––
BOR
SW◊
üü
$1.1
3PD
IP (P
), SO
IC (S
O), S
SOP
(SS)
, QF
N (M
L)
5Focus Product Selector Guide
Prod
ucts
sor
ted
by p
in c
ount
follo
wed
by p
ricin
g.†
Pric
ing
subj
ect t
o ch
ange
; ple
ase
cont
act y
our M
icro
chip
repr
esen
tativ
e fo
r mos
t cur
rent
pric
ing.
◊ So
ftwar
e PL
VD im
plem
ente
d vi
a AD
C.*
Inte
grat
ed T
empe
ratu
re In
dica
tor:
Ref
eren
ce A
pplic
atio
n N
ote
AN13
33 fo
r im
plem
enta
tion.
eXt
rem
e Lo
w P
ower
var
iant
s av
aila
ble.
8-b
it P
iC®
MiC
ro
Co
ntr
oll
ers
Prod
uct
released (r) not released (nr)
Pins
Mem
ory
Voltage range
ope
ratin
g sp
eed
lCD segments
mtouch™ Channels
Anal
og s
ensi
ng &
Mea
sure
men
tD
igita
lCo
mm
unic
atio
nM
onito
rs
sr-latch
timer 1 Gate
5 ku Pricing†
Pack
ages
(D
esig
nato
r)sp
ecia
l Fe
atur
es
total
i/o
Program
self-read/Write
Data rAM (b)
Data ee (b)
Maximum speed
internal oscillator
8-bit ADC
10-bit ADC
12-bit ADC
Comparators
Charge time Measurement Unit
op Amp
DAC (5b/8b/9b)
PWM
CCP
eCCP
CWG/CoG
nCo
PsMC
ClC
8-bit timer
16-bit timer
AUsArt
eUsArt
i2C™/sPi
ethernet (MAC/PHY)
Usb 2.0 Device
CAn
bor/Pbor
PlVD
20-Pin (Cont.)
PIC1
6F14
59
R20
1814
KB
8 Kw
RW10
24–
1.8V
–5.5
V48
MHz
48 M
Hz,
31 K
Hz–
9–
9–
2–
––
2–
––
––
–2
1–
11
–ü
–PB
ORSW
◊–
ü$1
.18
PDIP
(P),
SOIC
(SO)
, SSO
P (S
S),
4 ×
4 QF
N (M
L)Cr
ysta
l Fre
e US
B
PIC1
6F69
0R
2018
7 KB
4
KwR
256
256
2V–5
.5V
20 M
Hz8
MHz
, 31
kHz
–12
–12
–2
––
––
–1
––
––
21
–1
1–
––
BOR
SW◊
üü
$1.2
0PD
IP (P
), SO
IC (S
O), S
SOP
(SS)
, QF
N (M
L)
PIC1
8F13
K22
R20
188
KB
4 Kw
RW25
625
61.
8V–5
.5V
64 M
Hz64
MHz
, 31
kHz
–12
–12
–2
––
––
–1
––
––
13
–1
1–
––
PBOR
SW◊
ü–
$1.3
3PD
IP (P
), SO
IC (S
O), S
SOP
(SS)
, QF
N (M
L)Te
mp*
PIC1
8F13
K50
R20
158
KB
4 Kw
RW51
225
61.
8V–5
.5V
48 M
Hz32
MHz
, 31
kHz
–9
–9
–2
––
––
–1
––
––
13
–1
1–
ü–
PBOR
SW◊
ü–
$1.3
9PD
IP (P
), SO
IC (S
O), S
SOP
(SS)
, QF
N (M
L)Te
mp*
PIC1
8F14
K22
R20
1816
KB
8 Kw
RW51
225
61.
8V–5
.5V
64 M
Hz64
MHz
, 31
kHz
–12
–12
–2
––
––
–1
––
––
13
–1
1–
––
PBOR
SW◊
ü–
$1.4
7PD
IP (P
), SO
IC (S
O), S
SOP
(SS)
, QF
N (M
L)Te
mp*
PIC1
8F14
K50
R20
1516
KB
8 Kw
RW76
825
61.
8V–5
.5V
48 M
Hz32
MHz
, 31
kHz
–9
–9
–2
––
––
–1
––
––
13
–1
1–
ü–
PBOR
SW◊
ü–
$1.5
3PD
IP (P
), SO
IC (S
O), S
SOP
(SS)
, QF
N (M
L)Te
mp*
PIC1
6F17
09
NR20
18EM
RRW
1024
–1.
8V–5
.5V
32 M
Hz32
MHz
–12
–12
–2
–2
0/1/
02
20
0/1
––
44
1–
11
––
–BO
R–
–ü
call
for
pric
ing
PDIP
(P),
SOIC
(SO)
, SSO
P (S
S),
4 ×
4 QF
N (M
L)
28-Pin
PIC1
6F57
0NR
2825
3 KB
2
KwRW
132
642V
–5.5
V20
MHz
8 M
Hz–
–8
––
2–
2–
––
––
––
–1
––
––
––
–BO
R–
––
call
for
pric
ing
SPDI
P (P
), 6
× 6
QFN
(ML)
, SSO
P (S
S), S
OIC
(SO)
PIC1
6F57
R28
203
KB
2 Kw
–72
–2V
–5.5
V20
MHz
––
––
––
––
––
––
––
––
–1
––
––
––
––
––
–$0
.52
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S)
PIC1
6F72
2A
R28
253.
5 KB
2
KwR
128
–1.
8V–5
.5V
20 M
Hz16
MHz
–11
11–
––
––
––
2–
––
––
21
1–
1–
––
BOR
SW◊
–ü
$0.7
8SP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, 6
× 6
QFN
(ML)
, 4 ×
4 U
QFN
(MV)
Tem
p*
PIC1
6LF1
902
R28
253.
5 KB
2
KwRW
128
–1.
8V–3
.6V
20 M
Hz16
MHz
7211
–11
––
––
––
––
––
––
11
––
––
––
–SW
◊–
–$0
.78
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S),
4 ×
4 UQ
FN (M
V)Te
mp*
PIC1
6F15
12
R28
253.
5 KB
2
KwRW
128
–1.
8V–5
.5V
20 M
Hz16
MHz
, 31
KHz
–17
–17
––
––
––
2–
––
––
21
–1
1–
––
PBOR
SW–
ü$0
.81
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S),
4 ×
4 UQ
FN (M
V)Te
mp*
PIC1
6F72
3A
R28
257
KB
4 Kw
R19
2–
1.8V
–5.5
V20
MHz
16 M
Hz–
1111
––
––
––
–2
––
––
–2
11
–1
––
–BO
RSW
◊–
ü$0
.85
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S),
6 ×
6 QF
N (M
L), 4
× 4
UQF
N (M
V)Te
mp*
PIC1
6LF1
903
R28
257
KB
4 Kw
RW25
6–
1.8V
–3.6
V20
MHz
16 M
Hz72
11–
11–
––
––
––
––
––
–1
1–
––
––
––
SW◊
––
$0.8
5SP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, 4
× 4
UQFN
(MV)
Tem
p*
PIC1
6F15
13
R28
257
KB
4 Kw
RW25
6–
1.8V
–5.5
V20
MHz
16 M
Hz,
31 K
Hz–
17–
17–
––
––
–2
––
––
–2
1–
11
––
–PB
ORSW
–ü
$0.8
8SP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, 4
× 4
UQFN
(MV)
Tem
p*
PIC1
6LF1
906
R28
2514
KB
8 Kw
RW51
2–
1.8V
–3.6
V20
MHz
16 M
Hz72
11–
11–
––
––
––
––
––
–1
1–
1–
––
––
SW◊
––
$0.9
1SP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, 4
× 4
UQFN
(MV)
Tem
p*
PIC1
6F15
16
R28
2514
KB
8 Kw
RW51
2–
1.8V
–5.5
V20
MHz
16 M
Hz–
17–
17–
––
––
–2
––
––
–2
1–
11
––
–PB
ORSW
–ü
$0.9
5SP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, 4
× 4
UQFN
(MV)
Tem
p*
PIC1
6F15
18
R28
2528
KB
16 K
wRW
1024
–1.
8V–5
.5V
20 M
Hz16
MHz
–17
–17
––
––
––
2–
––
––
21
–1
1–
––
PBOR
SW–
ü$1
.01
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S),
4 ×
4 UQ
FN (M
V)Te
mp*
PIC1
6F88
2R
2825
3.5
KB
2 Kw
RW12
812
82V
–5.5
V20
MHz
8 M
Hz,
31 k
Hz–
11–
11–
2–
––
–1
1–
––
–2
1–
11
––
–BO
RSW
ן
ü$1
.16
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S),
6 ×
6 QF
N (M
L)
PIC1
6F72
6 R
2825
14 K
B 8
KwR
368
–1.
8V–5
.5V
20 M
Hz16
MHz
–11
11–
––
––
––
2–
––
––
21
1–
1–
––
BOR
SW◊
–ü
$1.2
3SP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, 6
× 6
QFN
(ML)
, 4 ×
4 U
QFN
(MV)
Tem
p*
PIC1
6F17
82
R28
253.
5 KB
2
KwRW
256
256
1.8V
–5.5
V32
MHz
32 M
Hz–
11–
–11
3–
20/
1/0
–2
––
–2
–2
1–
11
––
–BO
RSW
◊–
ü$1
.23
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S),
6 ×
6 QF
N (M
L), 4
× 4
UQF
N (M
V)
PIC1
6F19
33
R28
257
KB
4 Kw
RW25
625
61.
8V–5
.5V
32 M
Hz32
MHz
, 31
kHz
6011
–11
–2
––
––
23
––
––
41
–1
1–
––
PBOR
SW◊
üü
$1.2
3SP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, 6
× 6
QFN
(ML)
, 4 ×
4 U
QFN
(MV)
Tem
p*
PIC1
8F23
K20
R28
258
KB
4 Kw
RW51
225
61.
8V–3
.6V
64 M
Hz16
MHz
, 31
kHz
–11
–11
–2
––
––
11
––
––
13
–1
1–
––
BOR
ü–
–$1
.23
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S),
6 ×
6 QF
N (M
L), 4
× 4
UQF
N (M
V)
PIC1
6F17
83
R28
257
KB
4 Kw
RW51
225
61.
8V–5
.5V
32 M
Hz32
MHz
–11
––
113
–2
0/1/
0–
2–
––
2–
21
–1
1–
––
BOR
SW◊
–ü
$1.3
0SP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, 6
× 6
QFN
(ML)
, 4 ×
4 U
QFN
(MV)
PIC1
6F19
36
R28
2514
KB
8 Kw
RW51
225
61.
8V–5
.5V
32 M
Hz32
MHz
, 31
kHz
6011
–11
–2
––
––
23
––
––
41
–1
1–
––
PBOR
SW◊
üü
$1.3
0SP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, 6
× 6
QFN
(ML)
, 4 ×
4 U
QFN
(MV)
Tem
p*
PIC1
8F24
K20
R28
2516
KB
8 Kw
RW76
825
61.
8V–3
.6V
64 M
Hz16
MHz
, 31
kHz
–11
–11
–2
––
––
11
––
––
13
–1
1–
––
PBOR
ü–
–$1
.30
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S),
6 ×
6 QF
N (M
L)
PIC1
6F88
3R
2825
7 KB
4
KwRW
256
256
2V–5
.5V
20 M
Hz8
MHz
, 31
kHz
–11
–11
–2
––
––
11
––
––
21
–1
1–
––
BOR
SW◊
üü
$1.3
7SP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, 6
× 6
QFN
(ML)
PIC1
6F17
86
R28
2514
KB
8 Kw
RW10
2425
61.
8V–5
.5V
32 M
Hz32
MHz
–11
––
114
–2
0/1/
0–
3–
––
3–
21
–1
1–
––
BOR
SW◊
–ü
$1.3
7SP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, 6
× 6
QFN
(ML)
PIC1
6F19
38
R28
2528
KB
16 K
wRW
1024
256
1.8V
–5.5
V32
MHz
32 M
Hz,
31 k
Hz60
11–
11–
2–
––
–2
3–
––
–4
1–
11
––
–PB
ORSW
ן
ü$1
.37
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S),
6 ×
6 QF
N (M
L), 4
× 4
UQF
N (M
V)Te
mp*
PIC1
8F25
K20
R28
2532
KB
16 K
wRW
1536
256
1.8V
–3.6
V64
MHz
16 M
Hz,
31 k
Hz–
11–
11–
2–
––
–1
1–
––
–1
3–
11
––
–PB
ORü
––
$1.3
7SP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, 6
× 6
QFN
(ML)
6 Focus Product Selector Guide
Prod
ucts
sor
ted
by p
in c
ount
follo
wed
by p
ricin
g.†
Pric
ing
subj
ect t
o ch
ange
; ple
ase
cont
act y
our M
icro
chip
repr
esen
tativ
e fo
r mos
t cur
rent
pric
ing.
◊ So
ftwar
e PL
VD im
plem
ente
d vi
a AD
C.*
Inte
grat
ed T
empe
ratu
re In
dica
tor:
Ref
eren
ce A
pplic
atio
n N
ote
AN13
33 fo
r im
plem
enta
tion.
eXt
rem
e Lo
w P
ower
var
iant
s av
aila
ble.
8-b
it P
iC®
MiC
ro
Co
ntr
oll
ers
Prod
uct
released (r) not released (nr)
Pins
Core
Mem
ory
Voltage range
ope
ratin
g sp
eed
lCD segments
mtouch™ Channels
Anal
og s
ensi
ng &
Mea
sure
men
tD
igita
lCo
mm
unic
atio
nM
onito
rs
sr-latch
timer 1 Gate
5 ku Pricing†
Pack
ages
(D
esig
nato
r)sp
ecia
l Fe
atur
es
total
i/o
Program
self-read/Write
Data rAM (b)
Data ee (b)
Maximum speed
internal oscillator
8-bit ADC
10-bit ADC
12-bit ADC
Comparators
Charge time Measurement Unit
op Amp
DAC (5b/8b/9b)
PWM
CCP
eCCP
CWG/CoG
nCo
PsMC
ClC
8-bit timer
16-bit timer
AUsArt
eUsArt
i2C™/sPi
ethernet (MAC/PHY)
Usb 2.0 Device
CAn
bor/Pbor
PlVD
28-Pin (Cont.)
PIC1
8F23
K22
R28
25PI
C18
8 KB
4
KwRW
512
256
1.8V
–5.5
V64
MHz
16 M
Hz,
31 k
Hz–
17–
17–
2ü
––
–1
1–
––
––
3–
22
––
–PB
ORü
üü
$1.4
1SP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, 6
× 6
QFN
(ML)
, 4 ×
4 U
QFN
(MV)
Tem
p*
PIC1
8F24
J10
R28
21PI
C18
16 K
B 8
KwRW
1024
–2V
–3.6
V40
MHz
32 k
Hz–
10–
10–
2–
––
–2
––
––
––
2–
11
––
–BO
R–
––
$1.4
4SP
DIP
(SP)
, SOI
C (S
O), Q
FN (M
L)
PIC1
6F17
88
NR28
25EM
R28
KB
16 K
wRW
2K25
61.
8V–5
.5V
32 M
Hz32
MHz
–11
––
114
–2
3/1/
0–
3–
––
4–
21
–1
1–
––
BOR
SW◊
–ü
$1.4
4SP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, 6
× 6
QFN
(ML)
PIC1
8F24
K22
R28
25PI
C18
16 K
B 8
KwRW
768
256
1.8V
–5.5
V64
MHz
16 M
Hz,
31 k
Hz–
17–
17–
2ü
––
–1
1–
––
––
3–
22
––
–PB
ORü
üü
$1.4
8SP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, 6
× 6
QFN
(ML)
, 4 ×
4 U
QFN(
MV)
Tem
p*
PIC1
6F88
6R
2825
MR
14 K
B 8
KwRW
368
256
2V–5
.5V
20 M
Hz8
MHz
, 31
kHz
–11
–11
–2
––
––
11
––
––
–1
–1
1–
––
BOR
SWן
ü$1
.49
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S),
6 ×
6 QF
N (M
L)
PIC1
8F25
J10
R28
21PI
C18
32 K
B 16
Kw
RW10
24–
2V–3
.6V
40 M
Hz32
kHz
–10
–10
–2
––
––
2–
––
––
–2
–1
1–
––
BOR
––
–$1
.58
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S),
QFN
(ML)
PIC1
8F25
K22
R28
25PI
C18
32 K
B 16
Kw
RW15
3625
61.
8V–5
.5V
64 M
Hz16
MHz
, 31
kHz
–17
–17
–2
ü–
––
23
––
––
–4
–2
2–
––
PBOR
üü
ü$1
.62
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S),
6 ×
6 QF
N (M
L)Te
mp*
PIC1
8F24
J11
R28
21PI
C18
16 K
B 8
KwRW
3800
–2V
–3.6
V48
MHz
8 M
Hz,
31 k
Hz–
10–
10–
2ü
––
––
2–
––
––
3–
22
––
–BO
RSW
◊–
–$1
.65
SPDI
P (S
P), S
OIC
(SO)
, QFN
(ML)
Perip
hera
l Pin
Sel
ect,
Deep
Sle
ep M
ode
PIC1
8F24
K50
R28
25PI
C18
16 K
B 8
KwRW
2K25
61.
8V–5
.5V
48 M
Hz48
MHz
–14
–14
–2
ü–
––
11
––
––
22
–1
1–
ü–
BOR
––
–$1
.65
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S),
6 ×
6 QF
N (M
L)
PIC1
8F26
K20
R28
25PI
C18
64 K
B 32
Kw
RW39
3610
241.
8V–3
.6V
64 M
Hz16
MHz
, 31
kHz
–11
–11
–2
––
––
11
––
––
–3
–1
1–
––
PBOR
ü–
–$1
.65
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S),
6 ×
6 QF
N (M
L)Te
mp*
PIC1
8F25
K50
R28
25PI
C18
16 K
B 16
Kw
RW2K
256
1.8V
–5.5
V48
MHz
48 M
Hz–
14–
14–
2ü
––
–1
1–
––
–2
2–
11
–ü
–BO
R–
––
$1.7
6SP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, 6
× 6
QFN
(ML)
Crys
tal F
ree
USB
PIC1
8F25
J11
R28
21PI
C18
32 K
B 16
Kw
RW38
00–
2V–3
.6V
48 M
Hz8
MHz
, 31
kHz
–10
–10
–2
ü–
––
–2
––
––
–3
–2
2–
––
BOR
SW◊
––
$1.7
9SP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, QF
N (M
L)Pe
riphe
ral P
in S
elec
t, De
ep S
leep
Mod
e
PIC1
8F24
J50
R28
22PI
C18
16 K
B 8
KwRW
3800
–2V
–3.6
V48
MHz
8 M
Hz,
31 k
Hz–
10–
10–
2ü
––
––
2–
––
–2
3–
22
–ü
–BO
RSW
◊–
–$1
.86
SPDI
P (S
P), S
OIC
(SO)
, QFN
(ML)
Perip
hera
l Pin
Sel
ect,
Deep
Sle
ep M
ode
PIC1
8F26
K22
R28
25PI
C18
64 K
B 32
Kw
RW38
9610
241.
8V–5
.5V
64 M
Hz16
MHz
, 31
kHz
–17
–17
–2
ü–
––
23
––
––
34
–2
2–
––
PBOR
üü
ü$1
.92
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S),
6 ×
6 QF
N (M
L)Te
mp*
PIC1
8F25
K80
R28
24PI
C18
32 K
B 16
Kw
RW36
4810
241.
8V–5
.5V
64 M
Hz8
MHz
, 31
kHz
–8
––
82
ü–
––
41
––
––
23
–2
1–
–ü
PBOR
ü–
–$1
.93
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S),
QFN
(ML)
Deep
Sle
ep M
ode
PIC1
8F25
J50
R28
22PI
C18
32 K
B 16
Kw
RW38
00–
2V–3
.6V
48 M
Hz8
MHz
, 31
kHz
–10
–10
–2
ü–
––
–2
––
––
23
–2
2–
ü–
BOR
SW◊
––
$2.0
0SP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, QF
N (M
L)Pe
riphe
ral P
in S
elec
t, De
ep S
leep
Mod
e
PIC1
8F26
J11
R28
21PI
C18
64 K
B 32
Kw
RW38
00–
2V–3
.6V
48 M
Hz8
MHz
, 31
kHz
–10
–10
–2
ü–
––
–2
––
––
23
–2
2–
––
BOR
SW◊
––
$2.0
7SP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, QF
N (M
L)Pe
riphe
ral P
in S
elec
t, De
ep S
leep
Mod
e
PIC1
8F26
K80
R28
24PI
C18
64 K
B 32
Kw
RW36
4810
241.
8V–5
.5V
64 M
Hz8
MHz
, 31
kHz
–8
––
82
ü–
––
41
––
––
23
–2
1–
–ü
PBOR
ü–
–$2
.21
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S),
QFN
(ML)
Deep
Sle
ep M
ode
PIC1
8F26
J13
R28
23PI
C18
64 K
B 32
Kw
RW38
08–
2V–3
.6V
48 M
Hz8
MHz
, 31
kHz
–10
––
103
ü–
––
73
––
––
44
–2
2–
––
BOR
ü–
–$2
.24
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S),
QFN
(ML)
SPI w
/DM
A
PIC1
8F26
J50
R28
22PI
C18
64 K
B 32
Kw
RW38
00–
2V–3
.6V
48 M
Hz8
MHz
, 31
kHz
–10
–10
–2
ü–
––
–2
––
––
23
–2
2–
ü–
BOR
SW◊
––
$2.2
8SP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, QF
N (M
L)Pe
riphe
ral P
in S
elec
t, De
ep S
leep
Mod
e
PIC1
8F26
J53
R28
22PI
C18
64 K
B 32
Kw
RW38
08–
2V–3
.6V
48 M
Hz8
MHz
, 31
kHz
–10
––
103
ü–
––
73
––
––
44
–2
2–
ü–
BOR
ü–
–$2
.45
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S),
QFN
(ML)
SPI w
/DM
A
PIC1
8F27
J13
R28
23PI
C18
128
KB
64 K
wRW
3808
–2V
–3.6
V48
MHz
8 M
Hz,
31 k
Hz–
10–
–10
3ü
––
–7
3–
––
–4
4–
22
––
–BO
Rü
––
$2.4
8SP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, QF
N (M
L)SP
I w/D
MA
PIC1
8F27
J53
R28
22PI
C18
128
KB
64 K
wRW
3808
–2V
–3.6
V48
MHz
8 M
Hz,
31 k
Hz–
10–
–10
3ü
––
–7
3–
––
–4
4–
22
–ü
–BO
Rü
––
$2.6
9SP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, QF
N (M
L)SP
I w/D
MA
PIC1
6F17
18
NR28
25EM
R28
KB
RW20
48–
1.8V
–5.5
V32
MHz
32 M
Hz–
17–
17–
2–
21/
1/0
22
00/
11
–4
41
–1
1–
––
BOR
––
üca
ll fo
r pr
icin
gPD
IP (P
), SO
IC (S
O), S
SOP
(SS)
, UQ
FN 4
× 4
(MV)
, QFN
6 ×
6 (M
L)
40-Pin
PIC1
6F59
R40
32BL
3 KB
2
Kw–
134
–2V
–5.5
V20
MHz
––
––
––
––
––
––
––
––
–1
––
––
––
––
––
–$0
.85
PDIP
(P),
TQFP
(PT)
PIC1
6LF1
904
R40
36EM
R7
KB
4 Kw
RW25
6–
1.8V
–3.6
V20
MHz
16 M
Hz11
614
–14
––
––
––
––
––
––
11
–1
––
––
––
––
$1.1
9PD
IP (P
), TQ
FP (P
T),
5 ×
5 UQ
FN (M
V)In
tegr
ated
LCD
Dr
iver,
Tem
p*
PIC1
6LF1
907
R40
36EM
R14
KB
8 Kw
RW51
2–
1.8V
–3.6
V20
MHz
16 M
Hz11
614
–14
––
––
––
––
––
––
11
–1
––
––
––
––
$1.2
5PD
IP (P
), TQ
FP (P
T),
5 ×
5 UQ
FN (M
V)In
tegr
ated
LCD
Dr
iver,
Tem
p*
PIC1
6F15
17
R40
36EM
R14
KB
8 Kw
RW51
2–
1.8V
–5.5
V20
MHz
16 M
Hz–
28–
28–
––
––
–2
––
––
–2
1–
11
––
–PB
ORSW
–ü
$1.3
2PD
IP (P
), TQ
FP (P
T),
5 ×
5 UQ
FN (M
V)Te
mp*
PIC1
6F15
19
R40
36EM
R28
KB
16 K
wRW
1024
–1.
8V–5
.5V
20 M
Hz16
MHz
–28
–28
––
––
––
2–
––
––
21
–1
1–
––
PBOR
SW–
ü$1
.37
PDIP
(P),
TQFP
(PT)
, 5
× 5
UQFN
(MV)
Tem
p*
PIC1
6F72
4 R
4036
MR
7 KB
4
KwRW
192
–1.
8V–5
.5V
20 M
Hz16
MHz
–16
14–
––
––
––
2–
––
––
21
1–
1–
––
BOR
SW◊
–ü
$1.4
0PD
IP (P
), TQ
FP (P
T), 8
× 8
QFN
(M
L), 5
× 5
UQF
N (M
V)Te
mp*
PIC1
6F19
34
R40
36EM
R7
KB
4 Kw
RW25
625
61.
8V–5
.5V
32 M
Hz32
MHz
, 31
kHz
9616
–14
–2
––
––
23
––
––
41
–1
1–
––
PBOR
SWן
ü$1
.47
PDIP
(P),
TQFP
(PT)
, 8 ×
8 Q
FN
(ML)
, 5 ×
5 U
QFN
(MV)
Tem
p*
PIC1
8F43
K20
R40
36PI
C18
8 KB
4
KwRW
512
256
1.8V
–3.6
V64
MHz
16 M
Hz,
31 k
Hz–
14–
14–
2–
––
–1
1–
––
–1
3–
11
––
–BO
Rü
––
$1.4
7PD
IP (P
), TQ
FP (P
T), 8
× 8
QFN
(M
L), 5
× 5
UQF
N (M
V)
7Focus Product Selector Guide
Prod
ucts
sor
ted
by p
in c
ount
follo
wed
by p
ricin
g.†
Pric
ing
subj
ect t
o ch
ange
; ple
ase
cont
act y
our M
icro
chip
repr
esen
tativ
e fo
r mos
t cur
rent
pric
ing.
◊ So
ftwar
e PL
VD im
plem
ente
d vi
a AD
C.*
Inte
grat
ed T
empe
ratu
re In
dica
tor:
Ref
eren
ce A
pplic
atio
n N
ote
AN13
33 fo
r im
plem
enta
tion.
eXt
rem
e Lo
w P
ower
var
iant
s av
aila
ble.
8-b
it P
iC®
MiC
ro
Co
ntr
oll
ers
Prod
uct
released (r) not released (nr)
Pins
Core
Mem
ory
Voltage range
ope
ratin
g sp
eed
lCD segments
mtouch™ Channels
Anal
og s
ensi
ng &
Mea
sure
men
tD
igita
lCo
mm
unic
atio
nM
onito
rs
sr-latch
timer 1 Gate
5 ku Pricing†
Pack
ages
(D
esig
nato
r)sp
ecia
l Fe
atur
es
total
i/o
Program
self-read/Write
Data rAM (b)
Data ee (b)
Maximum speed
internal oscillator
8-bit ADC
10-bit ADC
12-bit ADC
Comparators
Charge time Measurement Unit
op Amp
DAC (5b/8b/9b)
PWM
CCP
eCCP
CWG/CoG
nCo
PsMC
ClC
8-bit timer
16-bit timer
AUsArt
eUsArt
i2C™/sPi
ethernet (MAC/PHY)
Usb 2.0 Device
CAn
bor/Pbor
PlVD
40/44-Pin (Cont.)
PIC1
6F72
7 R
4036
MR
14 K
B 8
KwRW
368
–1.
8V–5
.5V
20 M
Hz16
MHz
–16
14–
––
––
––
2–
––
––
21
1–
1–
––
BOR
SW◊
–ü
$1.5
4PD
IP (P
), TQ
FP (P
T), 8
× 8
QFN
(M
L), 5
× 5
UQF
N (M
V)Te
mp*
PIC1
6F17
84
R40
36EM
R7
KB
4 Kw
RW51
225
61.
8V–5
.5V
32 M
Hz32
MHz
––
––
144
–3
0/1/
0–
3–
––
3–
21
–1
1–
––
BOR
SW◊
–ü
$1.5
4PD
IP (P
), TQ
FP (P
T), 8
× 8
QFN
(M
L), 5
× 5
UQF
N (M
V)
PIC1
6F19
37
R40
36EM
R14
KB
8 Kw
RW51
225
61.
8V–5
.5V
32 M
Hz32
MHz
, 31
kHz
9616
–14
–2
––
––
23
––
––
41
–1
1–
––
PBOR
SW◊
üü
$1.5
4PD
IP (P
), TQ
FP (P
T), 8
× 8
QFN
(M
L), 5
× 5
UQF
N (M
V)Te
mp*
PIC1
8F44
K20
R40
36PI
C18
16 K
B 8
KwRW
768
256
1.8V
–3.6
V64
MHz
16 M
Hz,
31 k
Hz–
14–
14–
2–
––
–1
1–
––
–1
3–
11
––
–PB
ORü
––
$1.5
4PD
IP (P
), TQ
FP (P
T), 8
× 8
QFN
(M
L), 5
× 5
UQF
N (M
V)
PIC1
6F17
87
R40
36EM
R14
KB
8 Kw
RW10
2425
61.
8V–5
.5V
32 M
Hz32
MHz
––
––
144
–3
0/1/
0–
3–
––
3–
21
–1
1–
––
BOR
SW◊
–ü
$1.6
1PD
IP (P
), TQ
FP (P
T), 8
× 8
QFN
(M
L), 5
× 5
UQF
N (M
V)
PIC1
6F19
39
R40
36EM
R28
KB
16 K
wRW
1024
256
1.8V
–5.5
V32
MHz
32 M
Hz,
31 k
Hz96
16–
14–
2–
––
–2
3–
––
–4
1–
11
––
–PB
ORSW
ן
ü$1
.61
PDIP
(P),
TQFP
(PT)
, 8 ×
8 Q
FN
(ML)
, 5 ×
5 U
QFN
(MV)
Tem
p*
PIC1
8F45
K20
R40
36PI
C18
32 K
B 16
Kw
RW15
3625
61.
8V–3
.6V
64 M
Hz16
MHz
, 31
kHz
–14
–14
–2
––
––
11
––
––
13
–1
1–
––
PBOR
ü–
–$1
.61
PDIP
(P),
TQFP
(PT)
, 8 ×
8 Q
FN
(ML)
, 5 ×
5 U
QFN
(MV)
PIC1
6F88
4R
4036
MR
7 KB
4
KwRW
256
256
2V–5
.5V
20 M
Hz8
MHz
, 31
kHz
–14
–14
–2
––
––
11
––
––
21
–1
1–
––
BOR
SW◊
üü
$1.6
3PD
IP (P
), TQ
FP (P
T),
8 ×
8 QF
N (M
L)
PIC1
8F44
J10
R40
32PI
C18
16 K
B 8
KwRW
1024
–2V
–3.6
V40
MHz
31 k
Hz–
13–
13–
2–
––
–1
1–
––
–1
2–
12
––
–BO
R–
––
$1.6
7PD
IP (P
), TQ
FP (P
T), Q
FN (M
L)
PIC1
8F43
K22
R40
36PI
C18
8 KB
4
KwRW
512
256
1.8V
–5.5
V64
MHz
16 M
Hz,
31 k
Hz–
28–
28–
2ü
––
–1
1–
––
–1
3–
22
––
–PB
ORP
PP
$1.6
8 PD
IP (P
), TQ
FP (P
T), 8
× 8
QFN
(M
L), 5
× 5
UQF
N (M
V)Te
mp*
PIC1
8F17
89
NR40
36EM
R28
KB
16 k
WRW
2K25
61.
8V–5
.5V
32 M
Hz32
MHz
–14
––
144
–3
3/1/
0–
3–
––
4–
21
–1
1–
––
BOR
––
ü$1
.68
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S), 6
× 6
QFN
(ML)
, 4 ×
4
UQFN
(MV)
PIC1
8F44
K22
R40
36PI
C18
16 K
B 8
KwRW
768
256
1.8V
–5.5
V64
MHz
16 M
Hz,
31 k
Hz–
28–
28–
2ü
––
–1
1–
––
–1
3–
22
––
–PB
ORP
PP
$1.7
5 PD
IP (P
), TQ
FP (P
T), 8
× 8
QFN
(M
L), 5
× 5
UQF
N (M
V)Te
mp*
PIC1
6F88
7R
4036
MR
14 K
B 8
KwRW
368
256
2V–5
.5V
20 M
Hz8
MHz
, 31
kHz
–14
–14
–2
––
––
11
––
––
21
–1
1–
––
BOR
SW◊
üü
$1.7
8PD
IP (P
), TQ
FP (P
T),
8 ×
8 QF
N (M
L)
PIC1
8F45
J10
R40
32PI
C18
32 K
B 16
Kw
RW10
24–
2V–3
.6V
40 M
Hz31
kHz
–13
–13
–2
––
––
11
––
––
12
–1
2–
––
BOR
––
–$1
.81
PDIP
(P),
TQFP
(PT)
, QFN
(ML)
PIC1
8F46
K20
R40
36PI
C18
64 K
B 32
Kw
RW39
3610
241.
8V–3
.6V
64 M
Hz16
MHz
, 31
kHz
–14
–14
–2
––
––
11
––
––
13
–1
1–
––
PBOR
ü–
–$1
.82
PDIP
(P),
TQFP
(PT)
, 8
× 8
QFN
(ML)
PIC1
8F45
K22
R40
36PI
C18
32 K
B 16
Kw
RW15
3625
61.
8V–5
.5V
64 M
Hz16
MHz
, 31
kHz
–28
–28
–2
ü–
––
22
––
––
34
–2
2–
––
PBOR
üü
ü$1
.89
PDIP
(P),
TQFP
(PT)
, 8 ×
8 Q
FN
(ML)
, 5 ×
5 U
QFN
(MV)
Tem
p*
PIC1
8F44
J11
R40
34PI
C18
16 K
B 8
KwRW
3800
–2V
–3.6
V48
MHz
8 M
Hz,
31 k
Hz–
13–
13–
2ü
––
––
2–
––
–2
3–
22
––
–BO
RSW
◊–
–$1
.95
TQFP
(PT)
, QFN
(ML)
Perip
hera
l Pin
Sel
ect,
Deep
Sle
ep M
ode
PIC1
8F45
K50
R40
36PI
C18
32KB
16
kW
RW2K
256
1.8V
–5.5
V48
MHz
48 M
Hz–
25–
25–
2ü
––
–1
1–
––
–2
2–
11
–ü
–BO
R–
––
$1.9
9PD
IP (P
), TQ
FP (P
T), 5
× 5
UQ
FN (M
V)Cr
ysta
l Fre
e US
B
PIC1
8F45
J11
R40
34PI
C18
32 K
B 16
Kw
RW38
00–
2V–3
.6V
48 M
Hz8
MHz
, 31
kHz
–13
–13
–2
ü–
––
–2
––
––
23
–2
2–
––
BOR
SW◊
––
$2.0
9TQ
FP (P
T), Q
FN (M
L)Pe
riphe
ral P
in S
elec
t, De
ep S
leep
Mod
e
PIC1
8F44
J50
R40
34PI
C18
16 K
B 8
KwRW
3800
–2V
–3.6
V48
MHz
8 M
Hz,
31 k
Hz–
13–
13–
2ü
––
––
2–
––
–2
3–
22
–ü
–BO
RSW
◊–
–$2
.16
TQFP
(PT)
, QFN
(ML)
Perip
hera
l Pin
Sel
ect,
Deep
Sle
ep M
ode
PIC1
8F45
K80
R40
35PI
C18
32 K
B 16
Kw
RW36
4810
241.
8V–5
.5V
64 M
Hz8
MHz
, 31
kHz
–11
––
112
ü–
––
41
––
––
23
–2
1–
–ü
PBOR
üü
ü$2
.17
PDIP
(P),
TQFP
(PT)
, QFN
(ML)
Deep
Sle
ep M
ode
PIC1
8F46
K22
R40
36PI
C18
64 K
B 32
Kw
RW38
9610
241.
8V–5
.5V
64 M
Hz16
MHz
, 31
kHz
–28
–28
–2
ü–
––
22
––
––
34
–2
2–
––
PBOR
üü
ü$2
.17
PDIP
(P),
TQFP
(PT)
, 8 ×
8 Q
FN
(ML)
, 5 ×
5 U
QFN
(MV)
Tem
p*
PIC1
8F45
J50
R40
34PI
C18
32 K
B 16
Kw
RW38
00–
2V–3
.6V
48 M
Hz8
MHz
, 31
kHz
–13
–13
–2
ü–
––
–2
––
––
23
–2
2–
ü–
BOR
SW◊
––
$2.3
0TQ
FP (P
T), Q
FN (M
L)Pe
riphe
ral P
in S
elec
t, De
ep S
leep
Mod
e
PIC1
8F46
J11
R40
34PI
C18
64 K
B 32
Kw
RW38
00–
2V–3
.6V
48 M
Hz8
MHz
, 31
kHz
–13
–13
–2
ü–
––
–2
––
––
23
–2
2–
––
BOR
SW◊
––
$2.3
7PD
IP (P
), TQ
FP (P
T), Q
FN (M
L)Pe
riphe
ral P
in S
elec
t, De
ep S
leep
Mod
e
PIC1
8F46
K80
R44
35PI
C18
64 K
B 32
Kw
RW36
4810
241.
8V–5
.5V
64 M
Hz8
MHz
, 31
kHz
–11
––
112
ü–
––
41
––
––
23
–2
1–
–ü
PBOR
ü–
–$2
.45
PDIP
(P),
TQFP
(PT)
, QFN
(ML)
Deep
Sle
ep M
ode
PIC1
8F46
J13
R44
34PI
C18
64 K
B 32
Kw
RW38
08–
2V–3
.6V
48 M
Hz8
MHz
, 31
kHz
–13
––
133
ü–
––
73
––
––
44
–2
2–
––
BOR
ü–
–$2
.52
TQFP
(PT)
, QFN
(ML)
SPI w
/DM
A
PIC1
8F46
J50
R40
34PI
C18
64 K
B 32
Kw
RW38
00–
2V–3
.6V
48 M
Hz8
MHz
, 31
kHz
–13
–13
–2
ü–
––
–2
––
––
23
–2
2–
ü–
BOR
SW◊
––
$2.5
8PD
IP (P
), TQ
FP (P
T), Q
FN (M
L)Pe
riphe
ral P
in S
elec
t, De
ep S
leep
Mod
e
PIC1
8F46
J53
R44
33PI
C18
64 K
B 32
Kw
RW38
08–
2V–3
.6V
48 M
Hz8
MHz
, 31
kHz
–13
––
133
ü–
––
73
––
––
44
–2
2–
ü–
BOR
ü–
–$2
.73
TQFP
(PT)
, QFN
(ML)
Inte
grat
ed L
CD
Drive
r, SP
I w/D
MA
PIC1
8F47
J13
R44
34PI
C18
128
KB
64 K
wRW
3808
–2V
–3.6
V48
MHz
8 M
Hz,
31 k
Hz–
13–
–13
3ü
––
–7
3–
––
–4
4–
22
––
–BO
Rü
––
$2.7
6TQ
FP (P
T), Q
FN (M
L)SP
I w/D
MA
PIC1
8F47
J53
R44
33PI
C18
128
KB
64 K
wRW
3808
–2V
–3.6
V48
MHz
8 M
Hz,
31 k
Hz–
13–
–13
3ü
––
–7
3–
––
–4
4–
22
–ü
–BO
Rü
––
$2.9
7TQ
FP (P
T), Q
FN (M
L)In
tegr
ated
LCD
Dr
iver,
SPI w
/DM
A
PIC1
6F17
19
NR40
36EM
R28
KB
RW20
48–
1.8V
–5.5
V32
MHz
32 M
Hz–
28–
28–
2–
31/
1/0
22
00/
11
–4
41
–1
1–
––
BOR
––
üca
ll fo
r pr
icin
gPD
IP (P
), TQ
FP (P
T),
5 ×
5 UQ
FN (M
V)
8 Focus Product Selector Guide
Prod
ucts
sor
ted
by p
in c
ount
follo
wed
by p
ricin
g.†
Pric
ing
subj
ect t
o ch
ange
; ple
ase
cont
act y
our M
icro
chip
repr
esen
tativ
e fo
r mos
t cur
rent
pric
ing.
◊ So
ftwar
e PL
VD im
plem
ente
d vi
a AD
C.*
Inte
grat
ed T
empe
ratu
re In
dica
tor:
Ref
eren
ce A
pplic
atio
n N
ote
AN13
33 fo
r im
plem
enta
tion.
eXt
rem
e Lo
w P
ower
var
iant
s av
aila
ble.
8-b
it P
iC®
MiC
ro
Co
ntr
oll
ers
Prod
uct
released (r) not released (nr)
Pins
Core
Mem
ory
Voltage range
ope
ratin
g sp
eed
lCD segments
mtouch™ Channels
Anal
og s
ensi
ng &
Mea
sure
men
tD
igita
lCo
mm
unic
atio
nM
onito
rs
sr-latch
timer 1 Gate
5 ku Pricing†
Pack
ages
(D
esig
nato
r)sp
ecia
l Fe
atur
es
total
i/o
Program
self-read/Write
Data rAM (b)
Data ee (b)
Maximum speed
internal oscillator
8-bit ADC
10-bit ADC
12-bit ADC
Comparators
Charge time Measurement Unit
op Amp
DAC (5b/8b/9b)
PWM
CCP
eCCP
CWG/CoG
nCo
PsMC
ClC
8-bit timer
16-bit timer
AUsArt
eUsArt
i2C™/sPi
ethernet (MAC/PHY)
Usb 2.0 Device
CAn
bor/Pbor
PlVD
64-Pin
PIC1
6F15
26
R64
54EM
R14
KB
8 Kw
RW76
8–
1.8V
–5.5
V20
MHz
16 M
Hz–
30–
30–
––
––
–10
––
––
–6
3–
22
––
–PB
ORSW
◊–
ü$1
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TQFP
(PT)
, QFN
(MR)
Tem
p*
PIC1
6F15
27
R64
54EM
R28
KB
16 K
wRW
1536
–1.
8V–5
.5V
20 M
Hz16
MHz
–30
–30
––
––
––
10–
––
––
63
–2
2–
––
PBOR
SW◊
–ü
$1.5
4TQ
FP (P
T), Q
FN (M
R)Te
mp*
PIC1
6F19
46
R64
53EM
R14
KB
8 Kw
RW51
225
61.
8V–5
.5V
32 M
Hz32
MHz
, 31
kHz
184
17–
17–
3–
––
–2
3–
––
–4
1–
22
––
–BO
RSW
ן
ü$1
.75
TQFP
(PT)
, QFN
(MR)
Tem
p*
PIC1
6F19
47
R64
53EM
R28
KB
16 K
wRW
1024
256
1.8V
–5.5
V32
MHz
32 M
Hz, 3
1 kH
z18
417
–17
–3
––
––
23
––
––
41
–2
2–
––
BOR
SW◊
üü
$1.8
2TQ
FP (P
T), Q
FN (M
R)Te
mp*
PIC1
8F63
J11
R64
54PI
C18
8 KB
4
KwRW
1024
–2V
–3.6
V40
MHz
8 M
Hz, 3
1 kH
z–
12–
12–
2–
––
–2
––
––
–1
31
11
––
–PB
ORSW
◊–
–$2
.20
TQFP
(PT)
PIC1
8F65
J10
R64
50PI
C18
32 K
B 16
Kw
RW20
48–
2V–3
.6V
40 M
Hz31
kHz
–11
–11
–2
––
––
23
––
––
23
–2
2–
––
BOR
ü–
–$2
.25
TQFP
(PT)
PIC1
8F64
J11
R64
54PI
C18
16 K
B 8
KwRW
1024
–2V
–3.6
V40
MHz
8 M
Hz, 3
1 kH
z–
12–
12–
2–
––
–2
––
––
–1
31
11
––
–BO
RSW
◊–
–$2
.27
TQFP
(PT)
PIC1
8F63
J90
R64
51PI
C18
8 KB
4
KwRW
1024
–2V
–3.6
V40
MHz
8 M
Hz, 3
1 kH
z13
212
–12
–2
––
––
2–
––
––
13
11
1–
––
BOR
ü–
–$2
.35
TQFP
(PT)
Inte
grat
ed L
CD D
river
PIC1
8F65
J11
R64
54PI
C18
32 K
B 16
Kw
RW20
48–
2V–3
.6V
40 M
Hz8
MHz
, 31
kHz
–12
–12
–2
––
––
2–
––
––
13
11
1–
––
BOR
SW◊
––
$2.3
7TQ
FP (P
T)
PIC1
8F65
J94
R64
51PI
C18
32 K
B 16
Kw
RW40
96–
2V–3
.6V
64 M
Hz64
MHz
224
24–
1616
3ü
––
ü7
3–
––
–4
4–
42
–ü
–BO
R–
–ü
$2.3
8QF
N (M
R), T
QFP
(PT)
USB
& LC
D
PIC1
8F65
K22
R64
53PI
C18
32 K
B 16
Kw
RW20
4810
241.
8V–5
.5V
64 M
Hz31
kHz
, 500
kHz
, 1
6 M
Hz–
16–
–16
3ü
––
–5
3–
––
–4
4–
22
––
–BO
Rü
––
$2.3
9TQ
FP (P
T), Q
FN (M
R)
PIC1
8F64
J90
R64
51PI
C18
16 K
B 8
KwRW
1024
–2V
–3.6
V40
MHz
8 M
Hz, 3
1 kH
z13
212
–12
–2
––
––
2–
––
––
13
11
1–
––
BOR
ü–
–$2
.41
TQFP
(PT)
Inte
grat
ed L
CD D
river
PIC1
8F66
J10
R64
50PI
C18
64 K
B 32
Kw
RW20
48–
2V–3
.6V
40 M
Hz31
kHz
–11
–11
–2
––
––
23
––
––
23
–2
2–
––
BOR
ü–
–$2
.49
TQFP
(PT)
PIC1
8F65
J90
R64
50PI
C18
32 K
B 16
Kw
RW20
48–
2V–3
.6V
40 M
Hz8
MHz
, 31
kHz
132
12–
12–
2–
––
–2
––
––
–1
31
11
––
–BO
Rü
––
$2.5
2TQ
FP (P
T)In
tegr
ated
LCD
Driv
er
PIC1
8F65
K90
R64
53PI
C18
32 K
B 16
Kw
RW20
4810
241.
8V–5
.5V
64 M
Hz31
kHz
, 500
kHz
, 1
6 M
Hz13
216
––
163
ü–
––
53
––
––
44
–2
2–
––
BOR
ü–
–$2
.53
TQFP
(PT)
, QFN
(MR)
Inte
grat
ed L
CD D
river
PIC1
8F65
J50
R64
49PI
C18
32 K
B 16
Kw
RW39
04–
2V–3
.6V
48 M
Hz8
MHz
, 31
kHz
–8
–8
–2
––
––
23
––
––
23
–2
2–
ü–
BOR
ü–
–$2
.63
TQFP
(PT)
PIC1
8F66
J11
R64
50PI
C18
64 K
B 32
Kw
RW39
04–
2V–3
.6V
48 M
Hz8
MHz
, 31
kHz
–11
–11
–2
––
––
23
––
––
23
–2
2–
––
BOR
ü–
–$2
.63
TQFP
(PT)
PIC1
8F66
J94
R64
51PI
C18
64 K
B 32
Kw
RW40
96–
2V–3
.6V
64 M
Hz64
MHz
224
24–
1616
3ü
––
ü7
3–
––
–4
4–
42
–ü
–BO
R–
–ü
$2.6
9QF
N (M
R), T
QFP
(PT)
USB
& LC
D
PIC1
8F66
J93
R64
51PI
C18
64 K
B 32
Kw
RW39
00–
2V–3
.6V
48 M
Hz8
MHz
, 31
kHz
132
12–
–12
2ü
––
–2
––
––
–1
31
11
––
–BO
Rü
––
$2.7
0TQ
FP (P
T)In
tegr
ated
LCD
Driv
er,
RTCC
PIC1
8F65
K80
R64
54PI
C18
32 K
B 16
Kw
RW36
4810
241.
8V–5
.5V
64 M
Hz8
MHz
, 31
kHz
–11
––
112
ü–
––
41
––
––
23
–2
1–
–ü
PBOR
ü–
–$2
.70
TQFP
(PT)
, QFN
(MR)
Deep
Sle
ep M
ode
PIC1
8F66
K22
R64
53PI
C18
64 K
B 32
Kw
RW40
9610
241.
8V–5
.5V
64 M
Hz31
kHz
, 500
kHz
, 1
6 M
Hz–
16–
–16
3ü
––
–7
3–
––
–6
5–
22
––
–BO
Rü
––
$2.7
0TQ
FP (P
T), Q
FN (M
R)
PIC1
8F67
J10
R64
50PI
C18
128
KB
64 K
wRW
3936
–2V
–3.6
V40
MHz
31 k
Hz–
11–
11–
2–
––
–2
3–
––
–2
3–
22
––
–BO
Rü
––
$2.7
7TQ
FP (P
T)
PIC1
8F66
K90
R64
53PI
C18
64 K
B 32
Kw
RW40
9610
241.
8V–5
.5V
64 M
Hz31
kHz
, 500
kHz
, 1
6 M
Hz13
216
––
163
ü–
––
73
––
––
65
–2
2–
––
BOR
ü–
–$2
.84
TQFP
(PT)
, QFN
(MR)
Inte
grat
ed L
CD D
river
PIC1
8F66
J50
R64
49PI
C18
64 K
B 32
Kw
RW39
04–
2V–3
.6V
48 M
Hz8
MHz
, 31
kHz
–8
–8
–2
––
––
23
––
––
23
–2
2–
ü–
BOR
ü–
–$2
.90
TQFP
(PT)
PIC1
8F67
J11
R64
50PI
C18
128
KB
64 K
wRW
3904
–2V
–3.6
V48
MHz
8 M
Hz, 3
1 kH
z–
11–
11–
2–
––
–2
3–
––
–2
3–
22
––
–BO
Rü
––
$2.9
3TQ
FP (P
T)
PIC1
8F67
J94
R64
51PI
C18
128
KB
64 K
wRW
4096
–2V
–3.6
V64
MHz
64 M
Hz22
424
–16
163
ü–
–ü
73
––
––
44
–4
2–
ü–
BOR
––
ü$2
.93
QFN
(MR)
, TQF
P (P
T)US
B &
LCD
PIC1
8F67
K22
R64
53PI
C18
128
KB
64 K
wRW
4096
1024
1.8V
–5.5
V64
MHz
31 k
Hz, 5
00 k
Hz,
16
MHz
–16
––
163
ü–
––
73
––
––
65
–2
2–
––
BOR
ü–
–$2
.94
TQFP
(PT)
, QFN
(MR)
PIC1
8F66
K80
R64
54PI
C18
64 K
B 32
Kw
RW36
4810
241.
8V–5
.5V
64 M
Hz8
MHz
, 31
kHz
–11
––
112
ü–
––
41
––
––
23
–2
1–
–ü
PBOR
ü–
–$2
.98
TQFP
(PT)
, QFN
(MR)
Deep
Sle
ep M
ode
PIC1
8F67
J93
R64
51PI
C18
128
KB
64 K
wRW
3900
–2V
–3.6
V48
MHz
8 M
Hz, 3
1 kH
z13
212
––
122
ü–
––
2–
––
––
13
11
1–
––
BOR
ü–
–$3
.00
TQFP
(PT)
Inte
grat
ed L
CD D
river
, RT
CC
PIC1
8F67
K90
R64
53PI
C18
128
KB
64 K
wRW
4096
1024
1.8V
–5.5
V64
MHz
31 k
Hz, 5
00 k
Hz,
16 M
Hz13
216
––
163
ü–
––
73
––
––
65
–2
2–
––
BOR
ü–
–$3
.08
TQFP
(PT)
, QFN
(MR)
Inte
grat
ed L
CD D
river
PIC1
8F67
J50
R64
49PI
C18
128
KB
64 K
wRW
3904
–2V
–3.6
V48
MHz
8 M
Hz, 3
1 kH
z–
8–
8–
2–
––
–2
3–
––
–2
3–
22
–ü
–BO
Rü
––
$3.1
9TQ
FP (P
T)
9Focus Product Selector Guide
Prod
ucts
sor
ted
by p
in c
ount
follo
wed
by p
ricin
g.†
Pric
ing
subj
ect t
o ch
ange
; ple
ase
cont
act y
our M
icro
chip
repr
esen
tativ
e fo
r mos
t cur
rent
pric
ing.
◊ So
ftwar
e PL
VD im
plem
ente
d vi
a AD
C.*
Inte
grat
ed T
empe
ratu
re In
dica
tor:
Ref
eren
ce A
pplic
atio
n N
ote
AN13
33 fo
r im
plem
enta
tion.
eXt
rem
e Lo
w P
ower
var
iant
s av
aila
ble.
8-b
it P
iC®
MiC
ro
Co
ntr
oll
ers
Prod
uct
released (r) not released (nr)
Pins
Core
Mem
ory
Voltage range
ope
ratin
g sp
eed
lCD segments
mtouch™ Channels
Anal
og s
ensi
ng &
Mea
sure
men
tD
igita
lCo
mm
unic
atio
nM
onito
rs
sr-latch
timer 1 Gate
5 ku Pricing†
Pack
ages
(D
esig
nato
r)sp
ecia
l Fe
atur
es
total
i/o
Program
self-read/Write
Data rAM (b)
Data ee (b)
Maximum speed
internal oscillator
8-bit ADC
10-bit ADC
12-bit ADC
Comparators
Charge time Measurement Unit
op Amp
DAC (5b/8b)
PWM
CCP
eCCP
CWG/CoG
nCo
PsMC
ClC
8-bit timer
16-bit timer
AUsArt
eUsArt
i2C™/sPi
ethernet (MAC/PHY)
Usb 2.0 Device
CAn
bor/Pbor
PlVD
80-Pin
PIC1
8F83
J11
R80
70PI
C18
8 KB
4
KwRW
1024
–2V
–3.6
V40
MHz
8 M
Hz, 3
1 kH
z–
12–
12–
2–
––
–2
––
––
–1
31
11
––
–BO
RSW
◊–
–$2
.46
TQFP
(PT)
PIC1
8F85
J10
R80
66PI
C18
32 K
B 16
Kw
RW20
48–
2V–3
.6V
40 M
Hz31
kHz
–15
–15
–2
––
––
23
––
––
23
–2
2–
––
BOR
ü–
–$2
.49
TQFP
(PT)
PIC1
8F84
J11
R80
70PI
C18
16 K
B 8
KwRW
1024
–2V
–3.6
V40
MHz
8 M
Hz, 3
1 kH
z–
12–
12–
2–
––
–2
––
––
–1
31
11
––
–BO
RSW
◊–
–$2
.52
TQFP
(PT)
PIC1
8F83
J90
R80
66PI
C18
8 KB
4
KwRW
1024
–2V
–3.6
V40
MHz
8 M
Hz, 3
1 kH
z19
212
–12
–2
––
––
2–
––
––
13
11
1–
––
BOR
ü–
–$2
.60
TQFP
(PT)
Inte
grat
ed L
CD D
river
PIC1
8F85
J11
R80
70PI
C18
32 K
B 16
Kw
RW20
48–
2V–3
.6V
40 M
Hz8
MHz
, 31
kHz
–12
–12
–2
––
––
2–
––
––
13
11
1–
––
BOR
SW◊
––
$2.6
3TQ
FP (P
T)
PIC1
8F85
J94
R80
67PI
C18
32 K
B 16
Kw
RW40
96–
2V–3
.6V
64 M
Hz64
MHz
352
24–
2424
3ü
––
ü7
3–
––
–4
4–
42
–ü
–BO
R–
–ü
$2.6
5TQ
FP (P
T)US
B &
LCD
PIC1
8F85
K22
R80
69PI
C18
32 K
B 16
Kw
RW20
4810
241.
8V–5
.5V
64 M
Hz31
kHz
, 500
kHz
, 16
MHz
24–
–24
3ü
––
–5
3–
––
–4
4–
22
––
–BO
Rü
––
$2.6
6TQ
FP (P
T)
PIC1
8F84
J90
R80
66PI
C18
16 K
B 8
KwRW
1024
–2V
–3.6
V40
MHz
8 M
Hz, 3
1 kH
z19
212
–12
–2
––
––
2–
––
––
13
11
1–
––
BOR
ü–
–$2
.67
TQFP
(PT)
Inte
grat
ed L
CD D
river
PIC1
8F86
J10
R80
66PI
C18
64 K
B 32
Kw
RW20
48–
2V–3
.6V
40 M
Hz31
kHz
–15
–15
–2
––
––
23
––
––
23
–2
2–
––
BOR
ü–
–$2
.74
TQFP
(PT)
PIC1
8F85
J90
R80
66PI
C18
32 K
B 16
Kw
RW20
48–
2V–3
.6V
40 M
Hz8
MHz
, 31
kHz
192
12–
12–
2–
––
–2
––
––
–1
31
11
––
–BO
Rü
––
$2.7
7TQ
FP (P
T), L
QFP
(PL)
Inte
grat
ed L
CD D
river
PIC1
8F85
K90
R80
69PI
C18
32 K
B 16
Kw
RW20
4810
241.
8V–5
.5V
64 M
Hz31
kHz
, 500
kHz
, 16
MHz
192
24–
–24
3ü
––
–5
3–
––
–4
4–
22
––
–BO
Rü
––
$2.8
0TQ
FP (P
T)In
tegr
ated
LCD
Driv
er
PIC1
8F85
J50
R80
65PI
C18
32 K
B 16
Kw
RW39
04–
2V–3
.6V
48 M
Hz8
MHz
, 31
kHz
–12
–12
–2
––
––
23
––
––
23
–2
2–
ü–
BOR
ü–
–$2
.90
TQFP
(PT)
PIC1
8F86
J11
R80
66PI
C18
64 K
B 32
Kw
RW39
04–
2V–3
.6V
48 M
Hz8
MHz
, 31
kHz
–15
–15
–2
––
––
23
––
––
23
–2
2–
––
BOR
ü–
–$2
.90
TQFP
(PT)
PIC1
8F86
J94
R80
67PI
C18
64 K
B 32
Kw
RW40
96–
2V–3
.6V
64 M
Hz64
MHz
352
24–
2424
3ü
––
ü7
3–
––
–4
4–
42
–ü
–BO
R–
–ü
$2.9
5TQ
FP (P
T)US
B &
LCD
PIC1
8F86
J93
R80
67PI
C18
64 K
B 32
Kw
RW39
00–
2V–3
.6V
48 M
Hz8
MHz
, 31
kHz
192
12–
–12
2ü
––
–2
––
––
–1
31
11
––
–BO
Rü
––
$2.9
7TQ
FP (P
T)In
tegr
ated
LCD
Driv
er,
RTCC
PIC1
8F86
K22
R80
69PI
C18
64 K
B 32
Kw
RW40
9610
241.
8V–5
.5V
64 M
Hz31
kHz
, 500
kHz
, 16
MHz
24–
–24
3ü
––
–7
3–
––
–6
5–
22
––
–BO
Rü
––
$2.9
7TQ
FP (P
T)
PIC1
8F87
J10
R80
66PI
C18
128
KB
64 K
wRW
3936
–2V
–3.6
V40
MHz
31 k
Hz–
15–
15–
2–
––
–2
3–
––
–2
3–
22
––
–BO
Rü
––
$3.0
2TQ
FP (P
T), L
QFP
(PL)
PIC1
8F86
K90
R80
69PI
C18
64 K
B 32
Kw
RW40
9610
241.
8V–5
.5V
64 M
Hz31
kHz
, 500
kHz
, 16
MHz
192
24–
–24
3ü
––
–7
3–
––
–6
5–
22
––
–BO
Rü
––
$3.1
1TQ
FP (P
T)In
tegr
ated
LCD
Driv
er
PIC1
8F86
J50
R80
65PI
C18
64 K
B 32
Kw
RW39
04–
2V–3
.6V
48 M
Hz8
MHz
, 31
kHz
–12
–12
–2
––
––
23
––
––
23
–2
2–
ü–
BOR
ü–
–$3
.15
TQFP
(PT)
PIC1
8F87
J11
R80
66PI
C18
128
KB
64 K
wRW
3904
–2V
–3.6
V48
MHz
8 M
Hz, 3
1 kH
z–
15–
15–
2–
––
–2
3–
––
–2
3–
22
––
–BO
Rü
––
$3.1
9TQ
FP (P
T)
PIC1
8F87
J94
R80
67PI
C18
128
KB
64 K
wRW
4096
–2V
–3.6
V64
MHz
64 M
Hz35
224
–24
243
ü–
–ü
73
––
––
44
–4
2–
ü–
BOR
––
ü$3
.19
TQFP
(PT)
USB
& LC
D
PIC1
8F87
K22
R80
69PI
C18
128
KB
64 K
wRW
4096
1024
1.8V
–5.5
V64
MHz
31 k
Hz, 5
00 k
Hz,
16 M
Hz24
––
243
ü–
––
73
––
––
65
–2
2–
––
BOR
ü–
–$3
.21
TQFP
(PT)
PIC1
8F87
J93
R80
67PI
C18
128
KB
64 K
wRW
3900
–2V
–3.6
V48
MHz
8 M
Hz, 3
1 kH
z19
212
––
122
ü–
––
2–
––
––
13
11
1–
––
BOR
ü–
–$3
.26
TQF
P (P
T)In
tegr
ated
LCD
Driv
er,
RTCC
PIC1
8F87
K90
R80
69PI
C18
128
KB
64 K
wRW
4096
1024
1.8V
–5.5
V64
MHz
31 k
Hz, 5
00 k
Hz,
16 M
Hz19
224
––
243
ü–
––
73
––
––
65
–2
2–
––
BOR
ü–
–$3
.35
TQFP
(PT)
Inte
grat
ed L
CD D
river
PIC1
8F87
J50
R80
65PI
C18
128
KB
64 K
wRW
3904
–2V
–3.6
V48
MHz
8 M
Hz, 3
1 kH
z–
12–
12–
2–
––
–2
3–
––
–2
3–
22
–ü
–BO
Rü
––
$3.4
4 T
QFP
(PT)
PIC1
8F86
J60
R80
55PI
C18
64 K
B 32
Kw
RW38
08–
2V–3
.6V
42 M
Hz31
kHz
–15
–15
–2
––
––
23
––
––
23
–2
11
––
BOR
ü–
–$3
.63
TQFP
(PT)
Inte
grat
ed M
AC,
10 B
ase
T PH
Y
PIC1
8F87
J60
R80
55PI
C18
128
KB
64 K
wRW
3808
–2V
–3.6
V42
MHz
32 k
Hz, 3
1 kH
z–
15–
15–
2–
––
–2
3–
––
–2
3–
21
1–
–BO
Rü
––
$3.9
2 T
QFP
(PT)
Inte
grat
ed M
AC,
10 B
ase
T PH
Y
PIC1
8F86
J72
R80
51PI
C18
64 K
B 32
Kw
RW39
23–
2V–3
.6V
48 M
Hz8
MHz
, 31
kHz
132
12–
–12
2ü
––
–2
––
––
–1
31
11
––
–BO
Rü
––
$4.1
2TQ
FP (P
T)
2 ×
24-b
it AD
C, R
TCC
PIC1
8F87
J72
R80
51PI
C18
128
KB
64 K
wRW
3923
–2V
–3.6
V48
MHz
8 M
Hz, 3
1 kH
z13
212
––
122
ü–
––
2–
––
––
13
11
1–
––
BOR
ü–
–$4
.35
TQFP
(PT)
2
× 24
-bit
ADC,
RTC
C
100-Pin
PIC1
8F95
J94
R10
085
PIC1
832
KB
16 K
wRW
4096
–2V
–3.6
V64
MHz
64 M
Hz48
024
–24
243
ü–
–ü
73
––
––
44
–4
2–
ü–
BOR
––
ü$2
.83
TQFP
(PT/
PF)
USB
& LC
D
PIC1
8F96
J94
R10
085
PIC1
864
KB
32 K
wRW
4096
–2V
–3.6
V64
MHz
64 M
Hz48
024
–24
243
ü–
–ü
73
––
––
44
–4
2–
ü–
BOR
––
ü$3
.14
TQFP
(PT/
PF)
USB
& LC
D
PIC1
8F97
J94
R10
085
PIC1
812
8 KB
64
Kw
RW40
96–
2V–3
.6V
64 M
Hz64
MHz
480
24–
2424
3ü
––
ü7
3–
––
–4
4–
42
–ü
–BO
R–
–ü
$3.3
7TQ
FP (P
T/PF
)US
B &
LCD
PIC1
8F96
J60
R10
070
PIC1
864
KB
32 K
wRW
3808
–2V
–3.6
V42
MHz
31 k
Hz–
16–
16–
2–
––
–2
3–
––
–2
3–
22
1–
–BO
Rü
––
$3.8
4 T
QFP
(PT)
Inte
grat
ed M
AC,
10 B
ase
T PH
Y
PIC1
8F97
J60
R10
070
PIC1
812
8 KB
64
Kw
RW38
08–
2V–3
.6V
42 M
Hz31
kHz
–16
–16
–2
––
––
23
––
––
23
–2
21
––
BOR
ü–
–$4
.13
TQFP
(PT)
, LQF
P (P
L)In
tegr
ated
MAC
, 10
Bas
e T
PHY
10 Focus Product Selector Guide
Prod
ucts
sor
ted
by p
in c
ount
follo
wed
by p
ricin
g.†
Pric
ing
subj
ect t
o ch
ange
; ple
ase
cont
act y
our M
icro
chip
repr
esen
tativ
e fo
r mos
t cur
rent
pric
ing.
16
-bit
PiC
® M
iCr
oCo
ntr
oll
ers (
PiC
24
F)
Prod
uct
released (r) not released (nr)
i/o Pins
Core
Mem
ory
Voltage range
ope
ratin
g sp
eed
Anal
og s
ensi
ng &
Mea
sure
men
t
lCD segments
Graphics Controller
output Compare/PWM
input Capture
16-bit timer(2)
Com
mun
icat
ion
PMP
rtCC/CrC
PPs
5 ku Pricing†
Mon
itors
Pack
ages
(Des
igna
tor)
Program (Kb)
Data rAM (b)
eeProM
DMA #Ch
Maximum MiPs
internal oscillator
Charge time Measurement Unit
10-bit ADC
10/12-bit ADC 1100/500 KsPs
Comparators
Digital Communication
Usb 2.0 (Peripheral, Host, otC)
syst
em M
gmt.
Feat
ures
14-Pin
PIC2
4F04
KL10
0 R
12PI
C24
451
2AN
1095
(1)
–1.
8V–3
.6V
168
MHz
, 32
kHz
––
–1
––
22
21
UART
, 1 S
PI/I
2 C™
(M
SSP)
––
––
$1.0
6BO
R, H
LVD,
POR
, PW
RT,
WDT
, XLP
PDIP
(P),
TSSO
P (S
T)
PIC2
4F04
KA20
0 R
12PI
C24
451
2AN
1095
(1)
–1.
8V3.
6V16
8 M
Hz, 3
2 kH
zü
7–
2–
–1
13
1 UA
RT, 1
SPI
, 1 I2 C
–
––
–$1
.16
BOR,
POR
, WDT
, De
ep S
leep
, XLP
SPDI
P (S
P), T
SSOP
(ST)
PIC2
4F08
KL20
0 R
12PI
C24
851
2AN
1095
(1)
–1.
8V–3
.6V
168
MHz
, 32
kHz
–7
–1
––
22
21
UART
, 1 S
PI/I
2 C
(MSS
P)–
––
–$1
.25
BOR,
HLV
D, P
OR, P
WRT
, W
DT, X
LPPD
IP (P
), TS
SOP
(ST)
20-Pin
PIC2
4F08
KM10
1 NR
18PI
C24
810
2451
2–
1.8V
–5.5
V16
8 M
Hz, 3
2KHz
ü–
161
––
55
111
UART
, 1 S
PI/I
2 C
(MSS
P)–
–ü
–$1
.08
BOR,
HLV
D, P
OR,W
DT,
OST,
XLP
PDIP
(P),
SOIC
(SO)
PIC2
4F04
KL10
1 R
17PI
C24
451
2AN
1095
(1)
–1.
8V–3
.6V
168
MHz
, 32
kHz
––
–1
––
22
21
UART
, 1 S
PI/I
2 C
(MSS
P)–
––
–$1
.15
BOR,
HLV
D, P
OR, P
WRT
, W
DT, X
LPPD
IP (P
), SO
IC (S
O), S
SOP
(SS)
, 5 ×
5
QFN
(MQ)
PIC2
4F04
KA20
1 R
18PI
C24
451
2AN
1095
(1)
–1.
8V–3
.6V
168
MHz
, 32
kHz
ü9
–2
––
11
31
UART
, 1 S
PI, 1
I2 C
––
––
$1.2
5BO
R, P
OR, W
DT,
Deep
Sle
ep, X
LPPD
IP (P
), SO
IC (S
O), S
SOP
(SS)
, QFN
(MQL
)
PIC2
4F08
KL20
1 R
17PI
C24
851
2AN
1095
(1)
–1.
8V–3
.6V
168
MHz
, 32
kHz
–12
–1
––
22
21
UART
, 1 S
PI/I
2 C
(MSS
P)–
––
–$1
.30
BOR,
HLV
D, P
OR, P
WRT
, W
DT, X
LPPD
IP (P
), SO
IC (S
O), S
SOP
(SS)
, 5 ×
5
QFN
(MQ)
PIC2
4F08
KL30
1 R
18PI
C24
810
2425
6–
1.8V
–3.6
V16
8 M
Hz, 3
2 kH
z–
––
2–
–6
32
2 UA
RT, 2
SPI
/I2 C
(M
SSP)
––
––
$1.2
7BO
R, H
LVD,
POR
, PW
RT,
WDT
, XLP
PDIP
(P),
SOIC
(SO)
, SSO
P (S
S), 5
× 5
QF
N (M
Q)
PIC2
4F08
KL40
1 R
18PI
C24
810
2451
2–
1.8V
–3.6
V16
8 M
Hz, 3
2 kH
z–
12–
2–
–6
32
2 UA
RT, 2
SPI
/I2 C
(M
SSP)
––
––
$1.3
6BO
R, H
LVD,
POR
, PW
RT,
WDT
, XLP
PDIP
(P),
SOIC
(SO)
, SSO
P (S
S), 5
× 5
QF
N (M
Q)
PIC2
4F16
KL40
1 R
18PI
C24
1610
2451
2–
1.8V
–3.6
V16
8 M
Hz, 3
2 kH
z–
12–
2–
–6
32
2 UA
RT, 2
SPI
/I2 C
(M
SSP)
––
––
$1.4
3BO
R, H
LVD,
POR
, PW
RT,
WDT
, XLP
PDIP
(P),
SOIC
(SO)
, SSO
P (S
S), 5
× 5
QF
N (M
Q)
PIC2
4F08
KA10
1 R
18PI
C24
815
3651
2–
1.8V
–3.6
V16
8 M
Hz, 3
2 kH
zü
9–
2–
–1
13
2 UA
RT, 1
SPI
, 1 I2 C
––
ü–
$1.4
4BO
R, P
OR, W
DT,
Deep
Sle
ep, X
LPPD
IP (P
), SO
IC (S
O), S
SOP
(SS)
, QFN
(MQL
)
PIC2
4F16
KA10
1 R
18PI
C24
1615
3651
2–
1.8V
–3.6
V16
8 M
Hz, 3
2 kH
zü
9–
2–
–1
13
2 UA
RT, 1
SPI
, 1 I2 C
––
ü–
$1.5
1BO
R, P
OR, W
DT,
Deep
Sle
ep, X
LPPD
IP (P
), SO
IC (S
O), S
SOP
(SS)
, QFN
(MQL
)
PIC2
4FJ3
2MC1
01R
15PI
C24
3220
48AN
1095
(1)
–3V
–3.6
V16
7.37
MHz
, 32
kHz
ü6
–3
––
83
51
UART
, 1 S
PI, 1
I2 C–
–ü
ü$1
.68
BOR,
POR
, WDT
PDIP
(P),
SOIC
(SO)
, SSO
P (S
S), Q
FN (M
QL)
PIC2
4FJ1
6MC1
01
R15
PIC2
416
1024
AN10
95(1
)–
3V–3
.6V
167.
37 M
Hz, 3
2 kH
zü
4–
3–
–8
33
1 UA
RT, 1
SPI
, 1 I2 C
–
–ü
ü$1
.73
BOR,
POR
, WDT
PDIP
(P),
SOIC
(SO)
, SSO
P (S
S), Q
FN (M
QL)
PIC2
4F16
KA30
1 R
18PI
C24
1620
4851
2–
1.8V
–5.5
V16
8 M
Hz, 3
2 kH
zü
–9
3–
–3
35
2 UA
RT, 2
SPI
, 2 I2 C
––
ü–
$1.8
6PW
RT, H
LVD,
POR
, OS
T, W
DTSP
DIP
(SP)
, SSO
P (S
S), S
OIC
(SO)
PIC2
4F32
KA30
1 R
18PI
C24
3220
4851
2–
1.8V
–5.5
V16
8 M
Hz, 3
2 kH
zü
–9
3–
–3
35
2 UA
RT, 2
SPI
, 2 I2 C
––
ü–
$2.0
0PW
RT, H
LVD,
POR
, OS
T, W
DTSP
DIP
(SP)
, SSO
P (S
S), S
OIC
(SO)
28-Pin
PIC2
4F08
KL30
2 R
24PI
C24
810
2425
6–
1.8V
–3.6
V16
8 M
Hz, 3
2 kH
z–
––
2–
–6
32
2 UA
RT, 2
SPI
/I2 C
(M
SSP)
––
––
$1.3
2BO
R, H
LVD,
POR
, PW
RT,
WDT
, XLP
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S), 5
× 5
QF
N (M
Q), 6
× 6
QFN
(ML)
PIC2
4F08
KL40
2 R
24PI
C24
810
2451
2–
1.8V
–3.6
V16
8 M
Hz, 3
2 kH
z–
12–
2–
–6
32
2 UA
RT, 2
SPI
/I2 C
(M
SSP)
––
––
$1.4
0BO
R, H
LVD,
POR
, PW
RT,
WDT
, XLP
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S), 5
× 5
QF
N (M
Q), 6
× 6
QFN
(ML)
PIC2
4F16
KL40
2 R
24PI
C24
1610
2451
2–
1.8V
–3.6
V16
8 M
Hz, 3
2 kH
z–
12–
2–
–6
32
2 UA
RT, 2
SPI
/I2 C
(M
SSP)
––
––
$1.4
7BO
R, H
LVD,
POR
, PW
RT,
WDT
, XLP
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S), 5
× 5
QF
N (M
Q), 6
× 6
QFN
(ML)
PIC2
4F08
KA10
2 R
24PI
C24
815
3651
2–
1.8V
–3.6
V16
8 M
Hz, 3
2 kH
zü
9–
2–
–1
13
2 UA
RT, 1
SPI
, 1 I2 C
––
ü–
$1.5
1BO
R, P
OR, W
DT,
Deep
Sle
ep, X
LPSP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, QFN
(ML)
PIC2
4F16
KA10
2 R
24PI
C24
1615
3651
2–
1.8V
–3.6
V16
8 M
Hz, 3
2 kH
zü
9–
2–
–1
13
2 UA
RT, 1
SPI
, 1 I2 C
––
ü–
$1.5
8BO
R, P
OR, W
DT,
Deep
Sle
ep, X
LPSP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, QFN
(ML)
PIC2
4FJ1
6MC1
02
R21
PIC2
416
1024
AN10
95(1
)–
3V–
3.6V
167.
37 M
Hz, 3
2 kH
zü
6–
3–
–8
33
1 UA
RT, 1
SPI
, 1 I2 C
–
–ü
ü$1
.68
BOR,
POR
, WDT
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S), Q
FN (M
L)
TLA
(TL)
PIC2
4FJ1
6MC1
01
R15
PIC2
416
1024
AN10
95(1
)–
3V–3
.6V
167.
37 M
Hz, 3
2 kH
zü
4–
3–
–8
33
1 UA
RT, 1
SPI
, 1 I2 C
–
–ü
ü$1
.73
BOR,
POR
, WDT
PDIP
(P),
SOIC
(SO)
, SSO
P (S
S), Q
FN (M
QL)
PIC3
2FJ3
2MC1
02R
21PI
C24
3220
48AN
1095
(1)
–3V
–3.6
V16
7.37
MHz
, 32
kHz
ü8
–3
––
83
51
UART
, 1 S
PI, 1
I2 C–
–ü
ü$1
.73
BOR,
POR
, WDT
PDIP
(P),
SOIC
(SO)
, SSO
P (S
S), Q
FN (M
QL),
VTLA
(TL)
PIC2
4FJ1
6GA0
02R
21PI
C24
1640
96AN
1095
(1)
–2V
–3.6
V16
8 M
Hz, 3
2 kH
z–
10–
2–
–5
55
2 UA
RT, 2
SPI
, 2 I2 C
–ü
üü
$1.7
4BO
R, L
VD, P
OR, W
DTSP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, QFN
(ML)
PIC2
4F08
KM10
2 NR
24PI
C24
810
2451
2–
1.8V
–5.5
V16
8 M
Hz, 3
2 KH
zü
–19
1–
–5
511
1 UA
RT, 1
SPI
/I2 C
(M
SSP)
––
ü–
$1.7
5BO
R, H
LVD,
POR
,WDT
, OS
T, X
LPSP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, QF
N (M
QL)
PIC2
4F16
KM10
2 NR
24PI
C24
1610
2451
2–
1.8V
–5.5
V16
8 M
Hz, 3
2 KH
zü
–19
1–
–5
511
1 UA
RT, 1
SPI
/I2 C
(M
SSP)
––
ü–
$1.8
2BO
R, H
LVD,
POR
,WDT
, OS
T, X
LPSP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, QF
N (M
QL)
PIC2
4F08
KM20
2 NR
24PI
C24
820
4851
2–
1.8V
–5.5
V16
8 M
Hz, 3
2 KH
zü
–19
3–
–5
511
2 UA
RT, 2
SPI
/I2 C
(M
SSP)
––
ü–
$1.8
2BO
R, H
LVD,
POR
,WDT
, OS
T, X
LPSP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, QF
N (M
QL)
PIC2
4F16
KM20
2 NR
24PI
C24
1620
4851
2–
1.8V
–5.5
V16
8 M
Hz, 3
2 KH
zü
–19
3–
–5
511
2 UA
RT, 2
SPI
/I2 C
(M
SSP)
––
ü–
$1.8
9BO
R, H
LVD,
POR
,WDT
, OS
T, X
LPSP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, QF
N (M
QL)
PIC2
4FJ3
2GA0
02R
21PI
C24
3281
92AN
1095
(1)
–2V
–3.6
V16
8 M
Hz, 3
2 kH
z–
10–
2–
–5
55
2 UA
RT, 2
SPI
, 2 I2 C
–
üü
ü$2
.06
BOR,
LVD
, POR
, WDT
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S), Q
FN (M
L)
PIC2
4F16
KA30
2 R
24PI
C24
1620
4851
2–
1.8V
–5.5
V16
8 M
Hz, 3
2 kH
zü
–10
3–
–3
35
2 UA
RT, 2
SPI
, 2 I2 C
––
ü–
$2.0
6PW
RT, H
LVD,
POR
, OS
T, W
DTSP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, QFN
(ML)
PIC2
4F32
KA30
2 R
24PI
C24
3220
4851
2–
1.8V
–5.5
V16
8 M
Hz, 3
2 kH
zü
–10
3–
–3
35
2 UA
RT, 2
SPI
, 2 I2 C
––
ü–
$2.2
0PW
RT, H
LVD,
POR
, OS
T, W
DTSP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, QFN
(ML)
PIC2
4FJ3
2GA1
02
R21
PIC2
432
8192
AN10
95(1
)–
2V–3
.6V
168
MHz
, 32
kHz
ü10
–3
––
55
52
UART
, 2 S
PI, 2
I2 C
–ü
üü
$2.2
3BO
R, L
VD, P
OR, W
DT,
Deep
Sle
ep, X
LPSP
DIP
(SP)
, SOI
C (S
O), Q
FN (M
L)
PIC2
4FJ3
2GB0
02
R19
PIC2
432
8192
AN10
95(1
)–
2V–3
.6V
168
MHz
, 32
kHz
ü9
–3
––
55
52
UART
, 2 S
PI, 2
I2 C
üü
üü
$2.4
4BO
R, L
VD, P
OR, W
DT,
Deep
Sle
ep, X
LPSP
DIP
(SP)
, SOI
C (S
O), Q
FN (M
L)
PIC2
4FJ6
4GA0
02R
21PI
C24
6481
92AN
1095
(1)
–2V
–3.6
V16
8 M
Hz, 3
2 kH
z–
10–
2–
–5
55
2 UA
RT, 2
SPI
, 2 I2 C
–ü
üü
$2.4
8BO
R, L
VD, P
OR, W
DTSP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, QFN
(ML)
PIC2
4FJ6
4GA1
02
R21
PIC2
464
8192
AN10
95(1
)–
2V–3
.6V
168
MHz
, 32
kHz
ü10
–3
––
55
52
UART
, 2 S
PI, 2
I2 C–
üü
ü$2
.65
BOR,
LVD
, POR
, WDT
, De
ep S
leep
, XLP
SPDI
P (S
P), S
OIC
(SO)
, QFN
(ML)
PIC2
4FJ6
4GB0
02
R19
PIC2
464
8192
AN10
95(1
)–
2V–3
.6V
168
MHz
, 32
kHz
ü9
–3
––
55
52
UART
, 2 S
PI, 2
I2 C
üü
üü
$2.8
6BO
R, L
VD, P
OR, W
DT,
Deep
Sle
ep, X
LPSP
DIP
(SP)
, SOI
C (S
O), Q
FN (M
L)
* Pa
rts
avai
labl
e w
ith H
igh
Tem
pera
ture
Opt
ions
(150
°C).
not
e 1
: See
App
licat
ion
Not
e "A
N10
95: E
mul
atin
g D
ata
EEPR
OM
".
2: T
wo
16-b
it tim
ers
can
be c
onca
tena
ted
to fo
rm a
32-
bit t
imer
.
11Focus Product Selector Guide
Prod
ucts
sor
ted
by p
in c
ount
follo
wed
by p
ricin
g.†
Pric
ing
subj
ect t
o ch
ange
; ple
ase
cont
act y
our M
icro
chip
repr
esen
tativ
e fo
r mos
t cur
rent
pric
ing.
16
-bit
PiC
® M
iCr
oCo
ntr
oll
ers (
PiC
24
F)
Prod
uct
released (r) not released (nr)
i/o Pins
Core
Mem
ory
Voltage range
ope
ratin
g sp
eed
Anal
og s
ensi
ng &
Mea
sure
men
t
lCD segments
Graphics Controller
output Compare/PWM
input Capture
16-bit timer(2)
Com
mun
icat
ion
PMP
rtCC/CrC
PPs
5 ku Pricing†
Mon
itors
Pack
ages
(Des
igna
tor)
Program (Kb)
Data rAM (b)
eeProM
DMA #Ch
Maximum MiPs
internal oscillator
Charge time Measurement Unit
10-bit ADC
10/12-bit ADC 1100/500 KsPs
Comparators
Digital Communication
Usb 2.0 (Peripheral, Host, otC)
syst
em M
gmt.
Feat
ures
44-Pin
PIC2
4FJ1
6GA0
04R
35PI
C24
1640
96AN
1095
(1)
–2V
–3.6
V16
8 M
Hz, 3
2 kH
z–
13–
2–
–5
55
2 UA
RT, 2
SPI
, 2 I2 C
™–
üü
ü$1
.93
BOR,
LVD
, POR
, WDT
TQFP
(PT)
, QFN
(ML)
PIC2
4FJ3
2MC1
04R
35PI
C24
3220
48AN
1095
(1)
–3V
–3.6
V16
7.37
MHz
, 32
kHz
ü14
–3
––
83
51
UART
, 1 S
PI, 1
I2 C–
–ü
ü$2
.02
BOR
POR,
WDT
TQFP
(PT)
, TLA
, QFN
(ML)
PIC2
4F16
KM10
4 NR
38PI
C24
1610
2451
2–
1.8V
–5.5
V16
8 M
Hz, 3
2 KH
zü
–22
1–
–5
511
1 UA
RT, 1
SPI
/I2 C
(M
SSP)
––
ü–
$2.0
6BO
R, H
LVD,
POR
,WDT
, OS
T, X
LPTQ
FP, Q
FN, U
QFN
PIC2
4F08
KM20
4 NR
38PI
C24
820
4851
2–
1.8V
–5.5
V16
8 M
Hz, 3
2 KH
zü
–22
3–
–5
511
2 UA
RT, 2
SPI
/I2 C
(M
SSP)
––
ü–
$2.0
6BO
R, H
LVD,
POR
,WDT
, OS
T, X
LPTQ
FP, Q
FN, U
QFN
PIC2
4F16
KM20
4 NR
38PI
C24
1620
4851
2–
1.8V
–5.5
V16
8 M
Hz, 3
2 KH
zü
–22
3–
–5
511
2 UA
RT, 2
SPI
/I2 C
(M
SSP)
––
ü–
$2.1
3BO
R, H
LVD,
POR
,WDT
, OS
T, X
LPTQ
FP, Q
FN, U
QFN
PIC2
4FJ3
2GA0
04R
35PI
C24
3281
92AN
1095
(1)
–2V
–3.6
V16
8 M
Hz, 3
2 kH
z–
13–
2–
–5
55
2 UA
RT, 2
SPI
, 2 I2 C
–ü
üü
$2.3
0BO
R, L
VD, P
OR, W
DTTQ
FP (P
T), Q
FN (M
L)
PIC2
4F16
KA30
4 R
38PI
C24
1620
4851
2–
1.8V
–5.5
V16
8 M
Hz, 3
2 kH
zü
–16
3–
–3
35
2 UA
RT, 2
SPI
, 2 I2 C
––
ü–
$2.3
0PW
RT, H
LVD,
POR
, OS
T, W
DTTQ
FP (P
T), Q
FN (M
L), U
QFN
(MV)
PIC2
4FJ3
2GA1
04
R35
PIC2
432
8192
AN10
95(1
)–
2V–3
.6V
168
MHz
, 32
kHz
ü13
–3
––
55
52
UART
, 2 S
PI, 2
I2 C
–ü
üü
$2.4
4BO
R, L
VD, P
OR, W
DT,
Deep
Sle
ep, X
LPTQ
FP (P
T), Q
FN (M
L)
PIC2
4F32
KA30
4 R
38PI
C24
3220
4851
2–
1.8V
–5.5
V16
8 M
Hz, 3
2 kH
zü
–16
3–
–3
35
2 UA
RT, 2
SPI
, 2 I2 C
––
ü–
$2.4
4PW
RT, H
LVD,
POR
, OS
T, W
DTTQ
FP (P
T), Q
FN (M
L), U
QFN
(MV)
PIC2
4FJ3
2GB0
04
R33
PIC2
432
8192
AN10
95(1
)–
2V–3
.6V
168
MHz
, 32
kHz
ü13
–3
––
55
52
UART
, 2 S
PI, 2
I2 C
üü
üü
$2.6
5BO
R, L
VD, P
OR, W
DT,
Deep
Sle
ep, X
LPTQ
FP (P
T), Q
FN (M
L)
PIC2
4FJ6
4GA0
04R
35PI
C24
6481
92AN
1095
(1)
–2V
–3.6
V16
8 M
Hz, 3
2 kH
z–
13–
2–
–5
55
2 UA
RT, 2
SPI
, 2 I2 C
–ü
üü
$2.7
2BO
R, L
VD, P
OR, W
DTTQ
FP (P
T), Q
FN (M
L)
PIC2
4FJ6
4GA1
04
R35
PIC2
464
8192
AN10
95(1
)–
2V–3
.6V
168
MHz
, 32
kHz
ü13
–3
––
55
52
UART
, 2 S
PI, 2
I2C
–ü
üü
$2.8
6BO
R, L
VD, P
OR, W
DT,
Deep
Sle
ep, X
LPTQ
FP (P
T), Q
FN (M
L)
PIC2
4FJ6
4GB0
04
R33
PIC2
464
8192
AN10
95(1
)–
2V–3
.6V
168
MHz
, 32
kHz
ü13
–3
––
55
52
UART
, 2 S
PI, 2
I2 C
üü
üü
$3.0
7BO
R, L
VD, P
OR, W
DT,
Deep
Sle
ep, X
LPTQ
FP (P
T), Q
FN (M
L)
64-Pin
PIC2
4FJ6
4GA3
06
R53
PIC2
464
8192
AN10
95(1
)6
2V–3
.6V
168
MHz
, 32
kHz
ü–
163
240
–7
75
4 UA
RT, 2
SPI
, 2 I2 C
–ü
üü
$2.7
7BO
R, L
VD, P
OR, W
DT, X
LP,
Deep
Sle
epTQ
FP (P
T), Q
FN (M
R)
PIC2
4FJ1
28GA
306
R53
PIC2
412
881
92AN
1095
(1)
62V
–3.6
V16
8 M
Hz, 3
2 kH
zü
–16
324
0–
77
54
UART
, 2 S
PI, 2
I2 C–
üü
ü$3
.00
BOR,
LVD
, POR
, WDT
, XLP
, De
ep S
leep
TQFP
(PT)
, QFN
(MR)
PIC2
4FJ6
4GA0
06R
53PI
C24
6481
92AN
1095
(1)
–2V
–3.6
V16
8 M
Hz, 3
2 kH
z–
16–
2–
–5
55
2 UA
RT, 2
SPI
, 2 I2 C
–ü
ü–
$3.0
5BO
R, P
OR, W
DTTQ
FP (P
T)
PIC2
4FJ6
4GA1
06R
53PI
C24
6416
384
AN10
95(1
)–
2V–3
.6V
168
MHz
, 32
kHz
ü16
–3
––
99
54
UART
, 3 S
PI, 3
I2 C–
üü
ü$3
.32
BOR,
LVD
, POR
, WDT
TQFP
(PT)
, QFN
(MR)
PIC2
4FJ1
28GA
006
R53
PIC2
412
881
92AN
1095
(1)
–2V
–3.6
V16
8 M
Hz, 3
2 kH
z–
16–
2–
–5
55
2 UA
RT, 2
SPI
, 2 I2 C
–ü
ü–
$3.3
5BO
R, P
OR, W
DTTQ
FP (P
T)
PIC2
4FJ1
28GA
106
R53
PIC2
412
816
384
AN10
95(1
)–
2V–3
.6V
168
MHz
, 32
kHz
ü16
–3
––
99
54
UART
, 3 S
PI, 3
I2 C
–ü
üü
$3.5
6BO
R, L
VD, P
OR, W
DTTQ
FP (P
T), Q
FN (M
R)
PIC2
4FJ6
4GB1
06R
52PI
C24
6416
384
AN10
95(1
)–
2V–3
.6V
168
MHz
, 32
kHz
ü16
–3
––
99
54
UART
, 3 S
PI, 3
I2 C
üü
üü
$3.6
4BO
R, L
VD, P
OR, W
DTTQ
FP (P
T), Q
FN (M
R)
PIC2
4FJ1
28GB
106
R52
PIC2
412
816
384
AN10
95(1
)–
2V–3
.6V
168
MHz
, 32
kHz
ü16
–3
––
99
54
UART
, 3 S
PI, 3
I2 C
üü
üü
$3.9
3BO
R, L
VD, P
OR, W
DTTQ
FP (P
T), Q
FN (M
R)
PIC2
4FJ2
56GA
106
R53
PIC2
425
616
384
AN10
95(1
)–
2V–3
.6V
168
MHz
, 32
kHz
ü16
–3
––
99
54
UART
, 3 S
PI, 3
I2 C
–ü
üü
$3.9
8BO
R, L
VD, P
OR, W
DTTQ
FP (P
T), Q
FN (M
R)
PIC2
4FJ1
28GB
206
R52
PIC2
412
898
304
AN10
95(1
)–
2.2V
–3.6
V16
8 M
Hz, 3
2 kH
zü
16–
3–
–9
95
4 UA
RT, 3
SPI
, 3 I2 C
ü
üü
ü$4
.30
BOR,
LVD
, POR
, WDT
TQFP
(PT)
, QFN
(MR)
PIC2
4FJ1
28DA
106
R52
PIC2
412
824
576
AN10
95(1
)–
2.2V
–3.6
V16
8 M
Hz, 3
2 kH
zü
16–
3–
ü9
95
4 UA
RT, 3
SPI
, 3 I2 C
ü
–ü
ü$4
.34
BOR,
LVD
, POR
, WDT
TQFP
(PT)
, QFN
(MR)
PIC2
4FJ2
56GB
106
R 52
PIC2
425
616
384
AN10
95(1
)–
2V–3
.6V
168
MHz
, 32
kHz
ü16
–3
––
99
54
UART
, 3 S
PI, 3
I2 C
üü
üü
$4.3
5 BO
R, L
VD, P
OR, W
DTTQ
FP (P
T), Q
FN (M
R)
PIC2
4FJ2
56GB
206
R52
PIC2
425
698
304
AN10
95(1
)–
2.2V
–3.6
V16
8 M
Hz, 3
2 kH
zü
16–
3–
–9
95
4 UA
RT, 3
SPI
, 3 I2 C
ü
üü
ü$4
.65
BOR,
LVD
, POR
, WDT
TQFP
(PT)
, QFN
(MR)
PIC2
4FJ2
56DA
106
R52
PIC2
425
624
576
AN10
95(1
)–
2.2V
–3.6
V16
8 M
Hz, 3
2 kH
zü
16–
3–
ü9
95
4 UA
RT, 3
SPI
, 3 I2 C
ü
–ü
ü$4
.69
BOR,
LVD
, POR
, WDT
TQFP
(PT)
, QFN
(MR)
PIC2
4FJ1
28DA
206
R52
PIC2
412
898
304
AN10
95(1
)–
2.2V
–3.6
V16
8 M
Hz, 3
2 kH
zü
16–
3–
ü9
95
4 UA
RT, 3
SPI
, 3 I2 C
ü
–ü
ü$4
.76
BOR,
LVD
, POR
, WDT
TQFP
(PT)
, QFN
(MR)
PIC2
4FJ2
56DA
206
R52
PIC2
425
698
304
AN10
95(1
)–
2.2V
–3.6
V16
8 M
Hz, 3
2 kH
zü
16–
3–
ü9
95
4 UA
RT, 3
SPI
, 3 I2 C
ü
–ü
ü$5
.11
BOR,
LVD
, POR
, WDT
TQFP
(PT)
, QFN
(MR)
80-Pin
PIC2
4FJ6
4GA3
08
R69
PIC2
464
8192
AN10
95(1
)6
2V–3
.6V
168
MHz
, 32
kHz
ü–
163
368
– 7
75
4 UA
RT, 2
SPI
, 2 I2 C
–ü
üü
$2.9
8BO
R, L
VD, P
OR, W
DT, X
LP,
Deep
Sle
epTQ
FP (P
T)
PIC2
4FJ1
28GA
308
R69
PIC2
412
881
92AN
1095
(1)
62V
–3.6
V16
8 M
Hz, 3
2 kH
zü
–16
336
8–
77
54
UART
, 2 S
PI, 2
I2 C–
üü
ü$3
.23
BOR,
LVD
, POR
, WDT
, XLP
, De
ep S
leep
TQFP
(PT)
PIC2
4FJ6
4GA0
08
R 69
PIC2
464
8192
AN10
95(1
)–
2V–3
.6V
168
MHz
, 32
kHz
–16
–2
––
55
52
UART
, 2 S
PI, 2
I2 C
–ü
ü–
$3.3
0 BO
R, P
OR, W
DTTQ
FP (P
T)
PIC2
4FJ6
4GA1
08R
69PI
C24
6416
384
AN10
95(1
)–
2V–3
.6V
168
MHz
, 32
kHz
ü16
–3
––
99
54
UART
, 3 S
PI, 3
I2 C–
üü
ü$3
.58
BOR,
LVD
, POR
, WDT
TQFP
(PT)
PIC2
4FJ1
28GA
008
R 69
PIC2
412
881
92AN
1095
(1)
–2V
–3.6
V16
8 M
Hz, 3
2 kH
z–
16–
2–
–5
55
2 UA
RT, 2
SPI
, 2 I2 C
–
üü
–$3
.60
BOR,
POR
, WDT
TQFP
(PT)
PIC2
4FJ1
28GA
108
R 69
PIC2
412
816
384
AN10
95(1
)–
2V–3
.6V
168
MHz
, 32
kHz
ü16
–3
– –
99
54
UART
, 3 S
PI, 3
I2 C
–ü
üü
$3.8
2 BO
R, L
VD, P
OR, W
DTTQ
FP (P
T)
PIC2
4FJ6
4GB1
08
R 68
PIC2
464
1638
4AN
1095
(1)
–2V
–3.6
V16
8 M
Hz, 3
2 kH
zü
16–
3–
–9
95
4 UA
RT, 3
SPI
, 3 I2 C
ü
üü
ü$3
.91
BOR,
LVD
, POR
, WDT
TQFP
(PT)
* Pa
rts
avai
labl
e w
ith H
igh
Tem
pera
ture
Opt
ions
(150
°C).
not
e 1
: See
App
licat
ion
Not
e "A
N10
95: E
mul
atin
g D
ata
EEPR
OM
".
2: T
wo
16-b
it tim
ers
can
be c
onca
tena
ted
to fo
rm a
32-
bit t
imer
.
12 Focus Product Selector Guide
Prod
ucts
sor
ted
by p
in c
ount
follo
wed
by p
ricin
g.†
Pric
ing
subj
ect t
o ch
ange
; ple
ase
cont
act y
our M
icro
chip
repr
esen
tativ
e fo
r mos
t cur
rent
pric
ing.
16
-bit
PiC
® M
iCr
oCo
ntr
oll
ers (
PiC
24
F)
Prod
uct
released (r) not released (nr)
i/o Pins
Core
Mem
ory
Voltage range
ope
ratin
g sp
eed
Anal
og s
ensi
ng &
Mea
sure
men
t
lCD segments
Graphics Controller
output Compare/PWM
input Capture
16-bit timer(2)
Com
mun
icat
ion
PMP
rtCC/CrC
PPs
5 ku Pricing†
Mon
itors
Pack
ages
(Des
igna
tor)
Program (Kb)
Data rAM (b)
eeProM
DMA #Ch
Maximum MiPs
internal oscillator
Charge time Measurement Unit
10-bit ADC
10/12-bit ADC 1100/500 KsPs
Comparators
Digital Communication
Usb 2.0 (Peripheral, Host, otC)
syst
em M
gmt.
Feat
ures
80-Pin (Cont.)
PIC2
4FJ1
28GB
108
R 68
PIC2
412
816
384
AN10
95(1
)–
2V–3
.6V
168
MHz
, 32
kHz
ü16
–3
––
99
54
UART
, 3 S
PI, 3
I2 C™
ü
üü
ü$4
.20
BOR,
LVD
, POR
, WDT
TQFP
(PT)
PIC2
4FJ2
56GA
108
R 69
PIC2
425
616
384
AN10
95(1
)–
2V–3
.6V
168
MHz
, 32
kHz
ü16
–3
––
99
54
UART
, 3 S
PI, 3
I2 C
–ü
üü
$4.2
4 BO
R, L
VD, P
OR, W
DTTQ
FP (P
T)
PIC2
4FJ2
56GB
108
R 68
PIC2
425
616
384
AN10
95(1
)–
2V–3
.6V
168
MHz
, 32
kHz
ü16
–3
––
99
54
UART
, 3 S
PI, 3
I2 C
üü
üü
$4.6
2 BO
R, L
VD, P
OR, W
DTTQ
FP (P
T)
100-Pin
PIC2
4FJ6
4GA3
10
R85
PIC2
464
8192
AN10
95(1
)6
2V–3
.6V
168
MHz
, 32
kHz
ü–
243
480
–7
75
4 UA
RT, 2
SPI
, 2 I2 C
–ü
üü
$3.1
6BO
R, L
VD, P
OR, W
DT, D
eep
Slee
pTQ
FP (P
T), B
GA12
1 (B
G)
PIC2
4FJ1
28GA
310
R85
PIC2
412
881
92AN
1095
(1)
62V
–3.6
V16
8 M
Hz, 3
2 kH
zü
–24
348
0–
77
54
UART
, 2 S
PI, 2
I2 C–
üü
ü$3
.42
BOR,
LVD
, POR
, WDT
, Dee
p Sl
eep
TQFP
(PT)
, BGA
121
(BG)
PIC2
4FJ6
4GA0
10
R 85
PIC2
464
8192
AN10
95(1
)–
2V–3
.6V
168
MHz
, 32
kHz
–16
–2
––
55
52
UART
, 2 S
PI, 2
I2 C
–ü
ü–
$3.5
1 BO
R, P
OR, W
DTTQ
FP (P
T)
PIC2
4FJ6
4GA1
10R
85PI
C24
6416
384
AN10
95(1
)–
2V–3
.6V
168
MHz
, 32
kHz
ü16
–3
––
99
54
UART
, 3 S
PI, 3
I2 C–
üü
ü$3
.79
BOR,
LVD
, POR
, WDT
TQFP
(PT)
, BGA
121
(BG)
PIC2
4FJ1
28GA
010
R 85
PIC2
412
881
92AN
1095
(1)
–2V
–3.6
V16
8 M
Hz, 3
2 kH
z–
16–
2–
–5
55
2 UA
RT, 2
SPI
, 2 I2 C
–
üü
–$3
.81
BOR,
POR
, WDT
TQFP
(PT)
PIC2
4FJ1
28GA
110
R 85
PIC2
412
816
384
AN10
95(1
)–
2V–3
.6V
168
MHz
, 32
kHz
ü16
–3
––
99
54
UART
, 3 S
PI, 3
I2 C
–ü
üü
$4.0
3 BO
R, L
VD, P
OR, W
DTTQ
FP (P
T), B
GA12
1 (B
G)
PIC2
4FJ6
4GB1
10
R 84
PIC2
464
1638
4AN
1095
(1)
–2V
–3.6
V16
8 M
Hz, 3
2 kH
zü
16–
3–
–9
95
4 UA
RT, 3
SPI
, 3 I2 C
ü
üü
ü$4
.12
BOR,
LVD
, POR
, WDT
TQFP
(PT)
, BGA
121
(BG)
PIC2
4FJ1
28GB
110
R 84
PIC2
412
816
384
AN10
95(1
)–
2V–3
.6V
1616
MHz
, 32
kHz
ü16
–3
––
99
54
UART
, 3 S
PI, 3
I2 C
üü
üü
$4.4
1 BO
R, L
VD, P
OR, W
DTTQ
FP (P
T), B
GA12
1 (B
G)
PIC2
4FJ2
56GA
110
R 85
PIC2
425
616
384
AN10
95(1
)–
2V–3
.6V
168
MHz
, 32
kHz
ü16
–3
––
99
54
UART
, 3 S
PI, 3
I2 C
–ü
üü
$4.4
5 BO
R, L
VD, P
OR, W
DTTQ
FP (P
T), B
GA12
1 (B
G)
PIC2
4FJ1
28GB
210
R84
PIC2
412
898
304
AN10
95(1
)–
2.2V
–3.6
V16
8 M
Hz, 3
2 kH
zü
24–
3–
– 9
95
4 UA
RT, 3
SPI
, 3 I2 C
ü
üü
ü$4
.79
BOR,
LVD
, POR
, WDT
TQFP
(PT)
, BGA
121
(BG)
PIC2
4FJ1
28DA
110
R84
PIC2
412
824
576
AN10
95(1
)–
2.2V
–3.6
V16
8 M
Hz, 3
2 kH
zü
24–
3–
ü9
95
4 UA
RT, 3
SPI
, 3 I2 C
ü
üü
ü$4
.83
BOR,
LVD
, POR
, WDT
TQFP
(PT)
, BGA
121
(BG)
PIC2
4FJ2
56GB
110
R 84
PIC2
425
616
384
AN10
95(1
)–
2V–3
.6V
168
MHz
, 32
kHz
ü16
–3
––
99
54
UART
, 3 S
PI, 3
I2 C
üü
üü
$4.8
3 BO
R, L
VD, P
OR, W
DTTQ
FP (P
T), B
GA12
1 (B
G)
PIC2
4FJ2
56GB
210
R84
PIC2
425
698
304
AN10
95(1
)–
2.2V
–3.6
V16
8 M
Hz, 3
2 kH
zü
24–
3–
–9
95
4 UA
RT, 3
SPI
, 3 I2 C
ü
üü
ü$5
.14
BOR,
LVD
, POR
, WDT
TQFP
(PT)
, BGA
121
(BG)
PIC2
4FJ2
56DA
110
R84
PIC2
425
624
576
AN10
95(1
)–
2.2V
–3.6
V16
8 M
Hz, 3
2 kH
zü
24–
3–
ü9
95
4 UA
RT, 3
SPI
, 3 I2 C
ü
üü
ü$5
.18
BOR,
LVD
, POR
, WDT
TQFP
(PT)
, BGA
121
(BG)
PIC2
4FJ1
28DA
210
R84
PIC2
412
898
304
AN10
95(1
)–
2.2V
–3.6
V16
8 M
Hz, 3
2 kH
zü
24–
3–
ü9
95
4 UA
RT, 3
SPI
, 3 I2 C
ü
üü
ü$5
.25
BOR,
LVD
, POR
, WDT
TQFP
(PT)
, BGA
121
(BG)
PIC2
4FJ2
56DA
210
R84
PIC2
425
698
304
AN10
95(1
)–
2.2V
–3.6
V16
8 M
Hz, 3
2 kH
zü
24–
3–
ü9
95
4 UA
RT, 3
SPI
, 3 I2 C
üü
üü
$5.6
0BO
R, L
VD, P
OR, W
DTTQ
FP (P
T), B
GA12
1 (B
G)
* Pa
rts
avai
labl
e w
ith H
igh
Tem
pera
ture
Opt
ions
(150
°C).
not
e 1
: See
App
licat
ion
Not
e "A
N10
95: E
mul
atin
g D
ata
EEPR
OM
".
2: T
wo
16-b
it tim
ers
can
be c
onca
tena
ted
to fo
rm a
32-
bit t
imer
.
16
-bit
PiC
® M
iCr
oCo
ntr
oll
ers (
PiC
24
H/e
)
Prod
uct
released (r) not released (nr)
i/o Pins
Core
Mem
ory
Voltage range
ope
ratin
g sp
eed
Anal
og s
ensi
ng &
Mea
sure
men
t
output Compare/PWM
Motor Control PWM Ch.
Qei
input Capture
16-bit timer(2)
Com
mun
icat
ion
PMP
rtCC/CrC
PPs
5 ku Pricing†
Mon
itors
Pack
ages
(Des
igna
tor)
Program (Kb)
Data rAM (b)
eeProM
DMA #Ch
Maximum MiPs
internal oscillator
Charge time Measurement Unit
10-bit ADC
10/12-bit ADC 1100/500 KsPs
Comparators
op Amps
Digital Communication
CAn
Fs Usb otG
syst
em M
gmt.
Feat
ures
18-Pin
PIC2
4HJ1
2GP2
01
R13
PIC2
412
1AN
1095
(1)
–3V
–3.6
V40
7.37
MHz
, 32
KHz
––
6 ch
–
–2
––
43
1 UA
RT, 1
SPI
, 1 I2 C
™–
––
–ü
$2.0
9PB
OR, P
OR, W
DTPD
IP (P
), SO
IC(S
O)
28-Pin
PIC2
4EP3
2MC2
02
R21
PIC2
432
4AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü–
6 ch
1
+2*
210
61
45
2 UA
RT, 2
SPI
, 1 I2 C
––
–ü
ü$1
.89
PBOR
, POR
, WDT
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S), Q
FN (M
M)
PIC2
4EP3
2GP2
02
R21
PIC2
432
4AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü–
6 ch
1
+2*
24
––
45
2 UA
RT, 2
SPI
, 1 I2 C
––
–ü
ü$1
.89
PBOR
, POR
, WDT
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S), Q
FN (M
M)
PIC2
4EP6
4MC2
02
R21
PIC2
464
8AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü–
6 ch
1
+2*
210
61
45
2 UA
RT, 2
SPI
, 1 I2 C
––
–ü
ü$2
.45
PBOR
, POR
, WDT
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S), Q
FN (M
M)
PIC2
4EP6
4GP2
02
R21
PIC2
464
8AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü–
6 ch
1
+2*
24
––
45
2 UA
RT, 2
SPI
, 1 I2 C
––
–ü
ü$2
.45
PBOR
, POR
, WDT
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S), Q
FN (M
M)
PIC2
4EP1
28M
C202
R
21PI
C24
128
16AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü–
6 ch
1
+2*
210
61
45
2 UA
RT, 2
SPI
, 1 I2 C
––
–ü
ü$2
.66
PBOR
, POR
, WDT
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S), Q
FN (M
M)
PIC2
4EP1
28GP
202
R21
PIC2
412
816
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
–6
ch
1 +2
* 2
4–
–4
52
UART
, 2 S
PI, 1
I2 C–
––
üü
$2.6
6PB
OR, P
OR, W
DTSP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, QFN
(MM
)
* Pa
rts
avai
labl
e w
ith H
igh
Tem
pera
ture
Opt
ions
(150
°C).
‡ Op
am
p co
nfigu
red
as c
ompa
rato
r. n
ote
1: S
ee A
pplic
atio
n N
ote
"AN
1095
: Em
ulat
ing
Dat
a EE
PRO
M".
2
: Tw
o 16
-bit
timer
s ca
n be
con
cate
nate
d to
form
a 3
2-bi
t tim
er.
13Focus Product Selector Guide
Prod
ucts
sor
ted
by p
in c
ount
follo
wed
by p
ricin
g.†
Pric
ing
subj
ect t
o ch
ange
; ple
ase
cont
act y
our M
icro
chip
repr
esen
tativ
e fo
r mos
t cur
rent
pric
ing.
16
-bit
PiC
® M
iCr
oCo
ntr
oll
ers (
PiC
24
H/e
)
Prod
uct
released (r) not released (nr)
i/o Pins
Core
Mem
ory
Voltage range
ope
ratin
g sp
eed
Anal
og s
ensi
ng &
Mea
sure
men
t
output Compare/PWM
Motor Control PWM Ch.
Qei
input Capture
16-bit timer(2)
Com
mun
icat
ion
PMP
rtCC/CrC
PPs
5 ku Pricing†
Mon
itors
Pack
ages
(Des
igna
tor)
Program (Kb)
Data rAM (b)
eeProM
DMA #Ch
Maximum MiPs
internal oscillator
Charge time Measurement Unit
10-bit ADC
10/12-bit ADC 1100/500 KsPs
Comparators
op Amps
Digital Communication
CAn
Fs Usb otG
syst
em M
gmt.
Feat
ures
28-Pin (Cont.)
PIC2
4EP2
56M
C202
R
21PI
C24
256
32AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü–
6 ch
1
+2*
210
61
45
2 UA
RT, 2
SPI
, 1 I2 C
™–
––
üü
$3.1
4PB
OR, P
OR, W
DTSP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, QFN
(MM
)
PIC2
4EP2
56GP
202
R21
PIC2
425
632
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
–6
ch
1 +2
* 2
4–
–4
52
UART
, 2 S
PI, 1
I2 C–
––
üü
$3.1
4PB
OR, P
OR, W
DTSP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, QFN
(MM
)
PIC2
4EP5
12M
C202
NR
21PI
C24
512
48AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü–
6 ch
1
+2*
210
61
45
2 UA
RT, 2
SPI
, 1 I2 C
––
–ü
ü$3
.50
PBOR
, POR
, WDT
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S), Q
FN (M
M)
PIC2
4EP5
12GP
202
NR21
PIC2
451
248
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
–6
ch
1 +2
* 2
4–
–4
52
UART
, 2 S
PI, 1
I2 C–
––
üü
$3.5
0PB
OR, P
OR, W
DTSP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, QFN
(MM
)
36-Pin
PIC2
4EP6
4MC2
03
R25
PIC2
464
8AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü–
8 ch
1
+2*
310
61
45
2 UA
RT, 2
SPI
, 1 I2 C
––
–ü
ü$2
.52
PBOR
, POR
, WDT
VTLA
(TL)
PIC2
4EP6
4GP2
03
R25
PIC2
464
8AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü–
8 ch
1
+2*
34
––
45
2 UA
RT, 2
SPI
, 1 I2 C
––
–ü
ü$2
.52
PBOR
, POR
, WDT
VTLA
(TL)
PIC2
4EP3
2MC2
03
R25
PIC2
432
4AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü–
8 ch
1
+2*
310
61
45
2 UA
RT, 2
SPI
, 1 I2 C
––
–ü
ü$1
.96
PBOR
, POR
, WDT
VTLA
(TL)
PIC2
4EP3
2GP2
03
R25
PIC2
432
4AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü–
8 ch
1
+2*
34
––
45
2 UA
RT, 2
SPI
, 1 I2 C
––
–ü
ü$1
.96
PBOR
, POR
, WDT
VTLA
(TL)
44-Pin
PIC2
4EP3
2MC2
04
R35
PIC2
432
4AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü–
9 ch
1
+3*
310
61
45
2 UA
RT, 2
SPI
, 1 I2 C
––
–ü
ü$2
.03
PBOR
, POR
, WDT
VTLA
(TL)
, QFN
(ML)
, TQF
P(PT
)
PIC2
4EP3
2GP2
04
R35
PIC2
432
4AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü–
9 ch
1
+3*
34
––
45
2 UA
RT, 2
SPI
, 1 I2 C
––
–ü
ü$2
.03
PBOR
, POR
, WDT
VTLA
(TL)
, QFN
(ML)
, TQF
P(PT
)
PIC2
4EP6
4MC2
04
R35
PIC2
464
8AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü–
9 ch
1
+3*
310
61
45
2 UA
RT, 2
SPI
, 1 I2 C
––
–ü
ü$2
.59
PBOR
, POR
, WDT
VTLA
(TL)
, QFN
(ML)
, TQF
P(PT
)
PIC2
4EP6
4GP2
04
R35
PIC2
464
8AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü–
9 ch
1
+3*
34
––
45
2 UA
RT, 2
SPI
, 1 I2 C
––
–ü
ü$2
.59
PBOR
, POR
, WDT
VTLA
(TL)
, QFN
(ML)
, TQF
P(PT
)
PIC2
4EP1
28M
C204
R
35PI
C24
128
16AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü–
9 ch
1
+3*
310
61
45
2 UA
RT, 2
SPI
, 1 I2 C
––
–ü
ü$2
.80
PBOR
, POR
, WDT
VTLA
(TL)
, QFN
(ML)
, TQF
P(PT
)
PIC2
4EP1
28GP
204
R35
PIC2
412
816
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
–9
ch
1 +3
* 3
4–
–4
52
UART
, 2 S
PI, 1
I2 C–
––
üü
$2.8
0PB
OR, P
OR, W
DTVT
LA(T
L), Q
FN(M
L), T
QFP(
PT)
PIC2
4EP2
56M
C204
R
35PI
C24
256
32AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü–
9 ch
1
+3*
310
61
45
2 UA
RT, 2
SPI
, 1 I2 C
––
–ü
ü$3
.28
PBOR
, POR
, WDT
VTLA
(TL)
, QFN
(ML)
, TQF
P(PT
)
PIC2
4EP2
56GP
204
R35
PIC2
425
632
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
–9
ch
1 +3
* 3
4–
–4
52
UART
, 2 S
PI, 1
I2 C–
––
üü
$3.2
8PB
OR, P
OR, W
DTVT
LA(T
L), Q
FN(M
L), T
QFP(
PT)
PIC2
4EP5
12M
C204
NR
35PI
C24
512
48AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü–
9 ch
1
+3*
310
61
45
2 UA
RT, 2
SPI
, 1 I2 C
––
–ü
ü$3
.64
PBOR
, POR
, WDT
QFN(
ML)
, TQF
P(PT
)
PIC2
4EP5
12GP
204
NR35
PIC2
451
248
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
–9
ch
1 +3
* 3
4–
–4
52
UART
, 2 S
PI, 1
I2 C–
––
üü
$3.6
4PB
OR, P
OR, W
DTQF
N(M
L), T
QFP(
PT)
64-Pin
PIC2
4EP6
4MC2
06
R53
PIC2
464
8AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü–
16 c
h 1
+3*
310
61
45
2 UA
RT, 2
SPI
, 1 I2 C
––
–ü
ü$2
.73
PBOR
, POR
, WDT
QFN(
MR)
, TQF
P(PT
)
PIC2
4EP6
4GP2
06
R53
PIC2
464
8AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü–
16 c
h 1
+3*
34
––
45
2 UA
RT, 2
SPI
, 1 I2 C
––
–ü
ü$2
.73
PBOR
, POR
, WDT
QFN(
MR)
, TQF
P(PT
)
PIC2
4EP1
28M
C206
R
53PI
C24
128
16AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü–
16 c
h 1
+3*
310
61
45
2 UA
RT, 2
SPI
, 1 I2 C
––
–ü
ü$2
.94
PBOR
, POR
, WDT
QFN(
MR)
, TQF
P(PT
)
PIC2
4EP1
28GP
206
R53
PIC2
412
816
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
–16
ch
1 +3
* 3
4–
–4
52
UART
, 2 S
PI, 1
I2 C–
––
üü
$2.9
4PB
OR, P
OR, W
DTQF
N(M
R), T
QFP(
PT)
PIC2
4EP2
56M
C206
R
53PI
C24
256
32AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü–
16 c
h 1
+3*
310
61
45
2 UA
RT, 2
SPI
, 1 I2 C
––
–ü
ü$3
.42
PBOR
, POR
, WDT
QFN(
MR)
, TQF
P(PT
)
PIC2
4EP2
56GP
206
R53
PIC2
425
632
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
–16
ch
1 +3
* 3
4–
–4
52
UART
, 2 S
PI, 1
I2 C–
––
üü
$3.4
2PB
OR, P
OR, W
DTQF
N(M
R), T
QFP(
PT)
PIC2
4EP5
12M
C206
NR
53PI
C24
512
48AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü–
16 c
h 1
+3*
310
61
45
2 UA
RT, 2
SPI
, 1 I2 C
––
–ü
ü$3
.78
PBOR
, POR
, WDT
QFN(
MR)
, TQF
P(PT
)
PIC2
4EP5
12GP
206
NR53
PIC2
451
248
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
–16
ch
1 +3
* 3
4–
–4
52
UART
, 2 S
PI, 1
I2 C–
––
üü
$3.7
8PB
OR, P
OR, W
DTQF
N(M
R), T
QFP(
PT)
PIC2
4EP5
12GP
806
NR53
PIC2
453
652
AN10
95(1
)15
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
–24
ch,
2
A/D
3–
16–
–16
94
UART
, 2 S
PI, 2
I2 C2
–ü
üü
$5.6
0PB
OR, P
OR, W
DTQF
N(M
R), T
QFP(
PT)
100-Pin
PIC2
4HJ6
4GP2
10A
R85
PIC2
464
8AN
1095
(1)
83V
–3.6
V40
7.37
MHz
, 32
KHz
––
32 c
h–
–8
––
89
2 UA
RT, 2
SPI
, 2 I2 C
––
––
–$3
.88
PBOR
, POR
, WDT
TQFP
(PT,
PF)
PIC2
4HJ6
4GP5
10A
R85
PIC2
464
8AN
1095
(1)
83V
–3.6
V40
7.37
MHz
, 32
KHz
––
32 c
h–
–8
––
89
2 UA
RT, 2
SPI
, 2 I2 C
––
––
–$3
.88
PBOR
, POR
, WDT
TQFP
(PT,
PF)
PIC2
4HJ1
28GP
210A
R85
PIC2
412
88
AN10
95(1
)8
3V–3
.6V
407.
37 M
Hz, 3
2 KH
z–
–32
ch
––
8–
–8
92
UART
, 2 S
PI, 2
I2 C–
––
––
$3.8
8PB
OR, P
OR, W
DTTQ
FP (P
T, P
F)
PIC2
4HJ1
28GP
310A
R85
PIC2
412
816
AN10
95(1
)8
3V–3
.6V
407.
37 M
Hz, 3
2 KH
z–
–32
ch
––
8–
–8
92
UART
, 2 S
PI, 2
I2 C–
––
––
$3.8
8PB
OR, P
OR, W
DTTQ
FP (P
T, P
F)
PIC2
4HJ1
28GP
510A
R85
PIC2
412
88
AN10
95(1
)8
3V–3
.6V
407.
37 M
Hz, 3
2 KH
z–
–32
ch
––
8–
–8
92
UART
, 2 S
PI, 2
I2 C–
––
––
$3.8
8PB
OR, P
OR, W
DTTQ
FP (P
T, P
F)
PIC2
4HJ2
56GP
210A
R85
PIC2
425
616
AN10
95(1
)8
3V–3
.6V
407.
37 M
Hz, 3
2 KH
z–
–32
ch
––
8–
–8
92
UART
, 2 S
PI, 2
I2 C–
––
––
$3.8
8PB
OR, P
OR, W
DTTQ
FP (P
T, P
F)
PIC2
4HJ2
56GP
610A
R85
PIC2
425
616
AN10
95(1
)8
3V–3
.6V
407.
37 M
Hz, 3
2 KH
z–
–32
ch,
2
ADC
––
8–
–8
92
UART
, 2 S
PI, 2
I2 C2
––
––
$3.8
8PB
OR, P
OR, W
DTTQ
FP (P
T, P
F)
PIC2
4EP2
56GU
810
R85
PIC2
428
028
AN10
95(1
)15
3V–3
.6V
607.
37 M
Hz, 3
2 KH
z–
–32
ch,
2
ADC
3–
16–
–16
94
UART
, 4 S
PI, 2
I2 C2
üü
üü
$5.7
0PB
OR, P
OR, W
DTTQ
FP (P
T, P
F)
PIC2
4EP5
12GU
810
R85
PIC2
453
652
AN10
95(1
)15
3V–3
.6V
607.
37 M
Hz, 3
2 KH
z–
–32
ch,
2
ADC
3–
16–
–16
94
UART
, 4 S
PI, 2
I2 C2
üü
üü
$5.3
7PB
OR, P
OR, W
DTTQ
FP (P
T, P
F)
144-Pin
PIC2
4EP2
56GP
814
R12
2PI
C24
280
28AN
1095
(1)
153V
–3.6
V60
7.37
MHz
, 32
KHz
––
32 c
h,
2 AD
C3
–16
––
169
4 UA
RT, 4
SPI
, 2 I2 C
2ü
üü
ü$6
.31
PBOR
, POR
, WDT
TQFP
(PT,
PF)
PIC2
4EP5
12GU
814
R12
2PI
C24
536
28AN
1095
(1)
153V
–3.6
V60
7.37
MHz
, 32
KHz
––
32 c
h,
2 AD
C3
–16
––
169
4 UA
RT, 4
SPI
, 2 I2 C
2ü
üü
ü$6
.99
PBOR
, POR
, WDT
TQFP
(PT,
PF)
* Pa
rts
avai
labl
e w
ith H
igh
Tem
pera
ture
Opt
ions
(150
°C).
‡ Op
am
p co
nfigu
red
as c
ompa
rato
r. n
ote
1: S
ee A
pplic
atio
n N
ote
"AN
1095
: Em
ulat
ing
Dat
a EE
PRO
M".
2
: Tw
o 16
-bit
timer
s ca
n be
con
cate
nate
d to
form
a 3
2-bi
t tim
er.
14 Focus Product Selector Guide
Prod
ucts
sor
ted
by p
in c
ount
follo
wed
by p
ricin
g.†
Pric
ing
subj
ect t
o ch
ange
; ple
ase
cont
act y
our M
icro
chip
repr
esen
tativ
e fo
r mos
t cur
rent
pric
ing.
dsP
iC3
3 D
sC G
ener
Al
PU
rP
ose
An
D M
oto
r C
on
tro
l FA
Mil
Y
Prod
uct
released (r) not released (nr)
i/o Pins
Core
Mem
ory
Voltage range
ope
ratin
g sp
eed
Anal
og s
ensi
ng &
Mea
sure
men
t
output Compare/PWM
input Capture
Motor Control PWM Ch
Qei
16-bit timer(2)
Com
mun
icat
ion
PMP
rtCC/CrC
PPs
5 ku Pricing†
Mon
itors
Pack
ages
(Des
igna
tor)
Program (Kb)
Data rAM (b)
eeProM
DMA #Ch
Maximum speed MiPs
internal oscillator
Charge time Measurement Unit
ADC 10/12-bit 1100/500 ksps
DAC
Comparators
op Amps
Digital Communication
CAn
Fs Usb otG
syst
em M
gmt.
Feat
ures
20- Pin
dsPI
C33F
J16G
P101
*R
13ds
PIC®
161
AN10
95(1
)–
3V–3
.6V
167.
37 M
Hz, 3
2 KH
zü
4 ch
(10-
bit)
–3
–2
3–
–3
1 UA
RT, 1
SPI
, 1 I2 C
™–
––
üü
$1.5
7BO
R, P
OR, W
DTPD
IP(P
), SO
IC(S
O), Q
FN (M
QL),
SSOP
(SS)
dsPI
C33F
J16M
C101
*R
15ds
PIC
161
AN10
95(1
)–
3V–3
.6V
167.
37 M
Hz, 3
2 KH
zü
4 ch
(10-
bit)
–3
–2
36
–3
1 UA
RT, 1
SPI
, 1 I2 C
––
–ü
ü$1
.57
BOR,
POR
, WDT
PDIP
(P),
SOIC
(SO)
, QFN
(MQL
), SS
OP (S
S)
dsPI
C33F
J32G
P101
*R
13ds
PIC
322
AN10
95(1
)–
3V–3
.6V
167.
37 M
Hz, 3
2 KH
zü
6 ch
–
3–
23
––
51
UART
, 1 S
PI, 1
I2 C–
––
üü
$1.6
8BO
R, P
OR, W
DTPD
IP(P
), SO
IC(S
O), Q
FN (M
QL),
SSOP
(SS)
dsPI
C33F
J32M
C101
*R
15ds
PIC
322
AN10
95(1
)–
3V–3
.6V
167.
37 M
Hz, 3
2 KH
zü
6 ch
–
3–
23
6–
51
UART
,1 S
PI, 1
I2 C–
––
üü
$1.6
8BO
R, P
OR, W
DTPD
IP(P
), SO
IC (S
O), S
SOP
(SS)
28-Pin
dsPI
C33F
J16G
P102
*R
21ds
PIC
161
AN10
95(1
)–
3V–3
.6V
167.
37 M
Hz, 3
2 KH
zü
6 ch
(10-
bit)
–3
–2
3-
–3
1 UA
RT, 1
SPI
, 1 I2 C
––
–ü
ü$1
.68
BOR,
POR
, WDT
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S), Q
FN (M
QL),
VTLA
(TL)
dsPI
C33F
J16M
C102
*R
21ds
PIC
161
AN10
95(1
)–
3V–3
.6V
167.
37 M
Hz, 3
2 KH
zü
6 ch
(10-
bit)
–3
–2
36
–3
1 UA
RT, 1
SPI
, 1 I2 C
––
–ü
ü$1
.68
BOR,
POR
, WDT
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S), Q
FN (M
QL),
VTLA
(TL)
dsPI
C33F
J32G
P102
*R
21ds
PIC
322
AN10
95(1
)–
3V–3
.6V
167.
37 M
Hz, 3
2 KH
zü
8 ch
–
3–
23
––
51
UART
, 1 S
PI, 1
I2 C–
––
üü
$1.7
3BO
R, P
OR, W
DTSP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, QFN
(MQL
), VT
LA (T
L)
dsPI
C33F
J32M
C102
*R
21ds
PIC
322
AN10
95(1
)–
3V–3
.6V
167.
37 M
Hz, 3
2 KH
zü
8 ch
–
3–
23
6-
51
UART
,1 S
PI, 1
I2 C–
––
üü
$1.7
3BO
R, P
OR, W
DTSP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, QFN
(MM
),
dsPI
C33E
P32G
P502
* R
21ds
PIC
324
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
6 ch
–
1 +
2‡
24
4–
–5
2 UA
RT, 2
SPI
, 1 I2 C
1–
–ü
ü$2
.10
PBOR
, POR
, WDT
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S), Q
FN (M
M),
dsPI
C33E
P32M
C502
* R
21ds
PIC
324
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
6 ch
–
1 +
2‡
24
46
15
2 UA
RT, 2
SPI
, 1 I2 C
1–
–ü
ü$2
.10
PBOR
, POR
, WDT
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S), Q
FN (M
M),
dsPI
C33E
P64M
C202
*R
21ds
PIC
648
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
6 ch
–
1 +
2‡
24
46
15
2 UA
RT, 2
SPI
, 1 I2 C
0–
–ü
ü$2
.45
PBOR
, POR
, WDT
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S), Q
FN (M
M),
dsPI
C33E
P64G
P502
*R
21ds
PIC
648
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
6 ch
–
1 +
2‡
24
4–
–5
2 UA
RT, 2
SPI
, 1 I2 C
1–
–ü
ü$2
.66
PBOR
, POR
, WDT
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S), Q
FN (M
M),
dsPI
C33E
P64M
C502
* R
21ds
PIC
648
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
6 ch
–
1 +
2‡
24
46
15
2 UA
RT, 2
SPI
, 1 I2 C
1–
–ü
ü$2
.66
PBOR
, POR
, WDT
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S), Q
FN (M
M),
dsPI
C33E
P128
MC2
02*
R21
dsPI
C12
816
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
6 ch
–
1 +
2‡
24
46
15
2 UA
RT, 2
SPI
, 1 I2 C
0–
–ü
ü$2
.66
PBOR
, POR
, WDT
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S), Q
FN (M
M),
dsPI
C33E
P128
GP50
2*
R21
dsPI
C12
816
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
6 ch
–
1 +
2‡
24
4–
–5
2 UA
RT, 2
SPI
, 1 I2 C
1–
–ü
ü$2
.87
PBOR
, POR
, WDT
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S), Q
FN (M
M),
dsPI
C33E
P128
MC5
02*
R21
dsPI
C12
816
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
6 ch
–
1 +
2‡
24
46
15
2 UA
RT, 2
SPI
, 1 I2 C
1–
–ü
ü$2
.87
PBOR
, POR
, WDT
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S), Q
FN (M
M),
dsPI
C33E
P256
MC2
02*
R21
dsPI
C25
632
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
6 ch
–
1 +
2‡
24
46
15
2 UA
RT, 2
SPI
, 1 I2 C
0–
–ü
ü$3
.14
PBOR
, POR
, WDT
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S), Q
FN (M
M),
dsPI
C33E
P256
GP50
2*R
21ds
PIC
256
32AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü6
ch
–1
+ 2‡
2
44
––
52
UART
, 2 S
PI, 1
I2 C1
––
üü
$3.3
5PB
OR, P
OR, W
DTSP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, QFN
(MM
),
dsPI
C33E
P256
MC5
02*
R21
dsPI
C25
632
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
6 ch
–
1 +
2‡
24
46
15
2 UA
RT, 2
SPI
, 1 I2 C
1–
–ü
ü$3
.35
PBOR
, POR
, WDT
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S), Q
FN (M
M),
dsPI
C33E
P512
MC2
02*
NR21
dsPI
C51
248
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
6 ch
–
1 +
2‡
24
46
15
2 UA
RT, 2
SPI
, 1 I2 C
0–
–ü
ü$3
.50
PBOR
, POR
, WDT
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S), Q
FN (M
M),
dsPI
C33E
P512
GP50
2*NR
21ds
PIC
512
48AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü6
ch
–1
+ 2‡
2
44
––
52
UART
, 2 S
PI, 1
I2 C1
––
üü
$3.7
1PB
OR, P
OR, W
DTSP
DIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, QFN
(MM
),
dsPI
C33E
P512
MC5
02*
NR21
dsPI
C51
248
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
6 ch
–
1 +
2‡
24
46
15
2 UA
RT, 2
SPI
, 1 I2 C
1–
–ü
ü$3
.71
PBOR
, POR
, WDT
SPDI
P (S
P), S
OIC
(SO)
, SSO
P (S
S), Q
FN (M
M),
36-Pin
dsPI
C33E
P32M
C203
* R
25ds
PIC
324
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
8 ch
–
1 +
2‡
34
46
15
2 UA
RT, 2
SPI
, 1 I2 C
0–
–ü
ü$1
.96
PBOR
, POR
, WDT
VTLA
(TL)
dsPI
C33E
P32G
P503
*R
25ds
PIC
324
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
8 ch
–
1 +
2‡
34
4–
–5
2 UA
RT, 2
SPI
, 1 I2 C
1–
–ü
ü$2
.17
PBOR
, POR
, WDT
VTLA
(TL)
dsPI
C33E
P32M
C503
* R
25ds
PIC
324
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
8 ch
–
1 +
2‡
34
46
15
2 UA
RT, 2
SPI
, 1 I2 C
1–
–ü
ü$2
.17
PBOR
, POR
, WDT
VTLA
(TL)
dsPI
C33E
P64M
C203
*R
25ds
PIC
648
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
8 ch
–
1 +
2‡
34
46
15
2 UA
RT, 2
SPI
, 1 I2 C
0–
–ü
ü$2
.52
PBOR
, POR
, WDT
VTLA
(TL)
dsPI
C33E
P64G
P503
* R
25ds
PIC
648
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
8 ch
–
1 +
2‡
34
4–
–5
2 UA
RT, 2
SPI
, 1 I2 C
1–
–ü
ü$2
.73
PBOR
, POR
, WDT
VTLA
(TL)
dsPI
C33E
P64M
C503
* R
25ds
PIC
648
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
8 ch
–
1 +
2‡
34
46
15
2 UA
RT, 2
SPI
, 1 I2 C
1–
–ü
ü$2
.73
PBOR
, POR
, WDT
VTLA
(TL)
dsPI
C33E
P256
MC2
03*
R25
dsPI
C25
632
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
8 ch
–
1 +
3‡
34
46
15
2 UA
RT, 2
SPI
, 1 I2 C
––
–ü
ü$3
.21
PBOR
, POR
, WDT
VTLA
(TL)
44-Pin
dsPI
C33F
J32G
P104
*R
35ds
PIC
322
AN10
95(1
)–
3V–3
.6V
167.
37 M
Hz, 3
2 KH
zü
14 c
h –
3–
23
––
51
UART
, 1 S
PI, 1
I2 C–
––
üü
$2.0
2BO
R, P
OR, W
DTTQ
FP (P
T), T
LA, Q
FN (M
L)
dsPI
C33F
J32M
C104
*R
35ds
PIC
322
AN10
95(1
)–
3V–3
.6V
167.
37 M
Hz, 3
2 KH
zü
14 c
h –
3–
23
6–
51
UART
,1 S
PI, 1
I2 C–
––
üü
$2.0
2BO
R, P
OR, W
DTTQ
FP (P
T), V
TLA
(TL)
, QFN
(ML)
dsPI
C33E
P32M
C204
*R
35ds
PIC
324
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
9 ch
–
1 +
3‡
34
46
15
2 UA
RT, 2
SPI
, 1 I2 C
0–
–ü
ü$2
.03
PBOR
, POR
, WDT
TQFP
(PT)
, VTL
A (T
L), Q
FN (M
L)
dsPI
C33E
P32G
P504
*R
35ds
PIC
324
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
9 ch
–
1 +
3‡
34
4–
–5
2 UA
RT, 2
SPI
, 1 I2 C
1–
–ü
ü$2
.24
PBOR
, POR
, WDT
TQFP
(PT)
, VTL
A (T
L), Q
FN (M
L)
dsPI
C33E
P32M
C504
* R
35ds
PIC®
324
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
9 ch
–
1 +
3‡
34
46
15
2 UA
RT, 2
SPI
, 1 I2 C
1–
–ü
ü$2
.24
PBOR
, POR
, WDT
TQFP
(PT)
, VTL
A (T
L), Q
FN (M
L)
dsPI
C33E
P64M
C204
*R
35ds
PIC
648
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
9 ch
–
1 +
3‡
34
46
15
2 UA
RT, 2
SPI
, 1 I2 C
0–
–ü
ü$2
.59
PBOR
, POR
, WDT
TQFP
(PT)
, VTL
A (T
L), Q
FN (M
L)
dsPI
C33E
P64G
P504
*R
35ds
PIC
648
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
9 ch
–
1 +
3‡
34
4–
–5
2 UA
RT, 2
SPI
, 1 I2 C
1–
–ü
ü$2
.80
PBOR
, POR
, WDT
TQFP
(PT)
, VTL
A (T
L), Q
FN (M
L)
dsPI
C33E
P64M
C504
* R
35ds
PIC
648
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
9 ch
–
1 +
3‡
34
46
15
2 UA
RT, 2
SPI
, 1 I2 C
1–
–ü
ü$2
.80
PBOR
, POR
, WDT
TQFP
(PT)
, VTL
A (T
L), Q
FN (M
L)
dsPI
C33E
P128
MC2
04*
R35
dsPI
C12
816
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
9 ch
–
1 +
3‡
34
46
15
2 UA
RT, 2
SPI
, 1 I2 C
0–
–ü
ü$2
.80
PBOR
, POR
, WDT
TQFP
(PT)
, VTL
A (T
L), Q
FN (M
L)
* Pa
rts
avai
labl
e w
ith H
igh
Tem
pera
ture
Opt
ions
(150
°C).
‡ Op
am
p co
nfigu
red
as c
ompa
rato
r. n
ote
1: S
ee A
pplic
atio
n N
ote
"AN
1095
: Em
ulat
ing
Dat
a EE
PRO
M".
2
: Tw
o 16
-bit
timer
s ca
n be
con
cate
nate
d to
form
a 3
2-bi
t tim
er.
15Focus Product Selector Guide
Prod
ucts
sor
ted
by p
in c
ount
follo
wed
by p
ricin
g.†
Pric
ing
subj
ect t
o ch
ange
; ple
ase
cont
act y
our M
icro
chip
repr
esen
tativ
e fo
r mos
t cur
rent
pric
ing.
dsP
iC3
3 D
sC G
ener
Al
PU
rP
ose
An
D M
oto
r C
on
tro
l FA
Mil
Y
Prod
uct
released (r) not released (nr)
i/o Pins
Core
Mem
ory
Voltage range
ope
ratin
g sp
eed
Anal
og s
ensi
ng &
Mea
sure
men
t
output Compare/PWM
input Capture
Motor Control PWM Ch
Qei
16-bit timer(2)
Com
mun
icat
ion
PMP
rtCC/CrC
PPs
5 ku Pricing†
Mon
itors
Pack
ages
(Des
igna
tor)
Program (Kb)
Data rAM (b)
eeProM
DMA #Ch
Maximum speed MiPs
internal oscillator
Charge time Measurement Unit
ADC 10/12-bit 1100/500 ksps
DAC
Comparators
op Amps
Digital Communication
CAn
Fs Usb otG
syst
em M
gmt.
Feat
ures
44-Pin (Cont.)
dsPI
C33E
P128
GP50
4*R
35ds
PIC®
128
16AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü9
ch
–1
+ 3‡
3
44
––
52
UART
, 2 S
PI, 1
I2 C™
1–
–ü
ü$3
.01
PBOR
, POR
, WDT
TQFP
(PT)
, VTL
A (T
L), Q
FN (M
L)
dsPI
C33E
P128
MC5
04*
R35
dsPI
C12
816
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
9 ch
–
1 +
3‡
34
46
15
2 UA
RT, 2
SPI
, 1 I2 C
1–
–ü
ü$3
.01
PBOR
, POR
, WDT
TQFP
(PT)
, VTL
A (T
L), Q
FN (M
L)
dsPI
C33E
P256
MC2
04*
R35
dsPI
C25
632
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
9 ch
–
1 +
3‡
34
46
15
2 UA
RT, 2
SPI
, 1 I2 C
0–
–ü
ü$3
.28
PBOR
, POR
, WDT
TQFP
(PT)
, VTL
A (T
L), Q
FN (M
L)
dsPI
C33E
P256
GP50
4*R
35ds
PIC
256
32AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü9
ch
–1
+ 3‡
3
44
––
52
UART
, 2 S
PI, 1
I2 C1
––
üü
$3.4
9PB
OR, P
OR, W
DTTQ
FP (P
T), V
TLA
(TL)
, QFN
(ML)
dsPI
C33E
P256
MC5
04*
R35
dsPI
C25
632
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
9 ch
–
1 +
3‡
34
46
15
2 UA
RT, 2
SPI
, 1 I2 C
1–
–ü
ü$3
.49
PBOR
, POR
, WDT
TQFP
(PT)
, VTL
A (T
L), Q
FN (M
L)
dsPI
C33E
P512
MC2
04*
NR35
dsPI
C51
248
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
9 ch
–
1 +
3‡
34
46
15
2 UA
RT, 2
SPI
, 1 I2 C
0–
–ü
ü$3
.64
PBOR
, POR
, WDT
TQFP
(PT)
, VTL
A (T
L), Q
FN (M
L)
dsPI
C33E
P512
GP50
4*NR
35ds
PIC
512
48AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü9
ch
–1
+ 3‡
3
44
––
52
UART
, 2 S
PI, 1
I2 C1
––
üü
$3.8
5PB
OR, P
OR, W
DTTQ
FP (P
T), Q
FN (M
L)
dsPI
C33E
P512
MC5
04*
NR35
dsPI
C51
248
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
9 ch
–
1 +
3‡
34
46
15
2 UA
RT, 2
SPI
, 1 I2 C
1–
–ü
ü$3
.85
PBOR
, POR
, WDT
TQFP
(PT)
, VTL
A (T
L), Q
FN (M
L)
64-Pin
dsPI
C33E
P64M
C206
*R
53ds
PIC
648
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
16 c
h –
1 +
3‡
34
46
15
2 UA
RT, 2
SPI
, 1 I2 C
0–
–ü
ü$2
.73
PBOR
, POR
, WDT
TQFP
(PT)
, QFN
(MR)
dsPI
C33E
P64G
P506
*R
53ds
PIC
648
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
16 c
h –
1 +
3‡
34
4–
–5
2 UA
RT, 2
SPI
, 1 I2 C
1–
–ü
ü$2
.94
PBOR
, POR
, WDT
TQFP
(PT)
, QFN
(MR)
dsPI
C33E
P64M
C506
*R
53ds
PIC
648
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
16 c
h –
1 +
3‡
34
46
15
2 UA
RT, 2
SPI
, 1 I2 C
1–
–ü
ü$2
.94
PBOR
, POR
, WDT
TQFP
(PT)
, QFN
(MR)
dsPI
C33E
P128
MC2
06*
R53
dsPI
C12
816
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
16 c
h –
1 +
3‡
34
46
15
2 UA
RT, 2
SPI
, 1 I2 C
0–
–ü
ü$2
.94
PBOR
, POR
, WDT
TQFP
(PT)
, QFN
(MR)
dsPI
C33E
P128
GP50
6*R
53ds
PIC
128
16AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü16
ch
–1
+ 3‡
3
44
––
52
UART
, 2 S
PI, 1
I2 C1
––
üü
$3.1
5PB
OR, P
OR, W
DTTQ
FP (P
T), Q
FN (M
R)
dsPI
C33E
P128
MC5
06*
R53
dsPI
C12
816
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
16 c
h –
1 +
3‡
34
46
15
2 UA
RT, 2
SPI
, 1 I2 C
1–
–ü
ü$3
.15
PBOR
, POR
, WDT
TQFP
(PT)
, QFN
(MR)
dsPI
C33E
P256
MC2
06*
R53
dsPI
C25
632
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
16 c
h –
1 +
3‡
34
46
15
2 UA
RT, 2
SPI
, 1 I2 C
0–
–ü
ü$3
.42
PBOR
, POR
, WDT
TQFP
(PT)
, QFN
(MR)
dsPI
C33E
P256
GP50
6*R
53ds
PIC
256
32AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü16
ch
–1
+ 3‡
3
44
––
52
UART
, 2 S
PI, 1
I2 C1
––
üü
$3.6
3PB
OR, P
OR, W
DTTQ
FP (P
T), Q
FN (M
R)
dsPI
C33E
P256
MC5
06*
R53
dsPI
C25
632
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
16 c
h –
1 +
3‡
34
46
15
2 UA
RT, 2
SPI
, 1 I2 C
1–
–ü
ü$3
.63
PBOR
, POR
, WDT
TQFP
(PT)
, QFN
(MR)
dsPI
C33E
P512
MC2
06*
NR53
dsPI
C51
248
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
16 c
h –
1 +
3‡
34
46
15
2 UA
RT, 2
SPI
, 1 I2 C
0–
–ü
ü$3
.78
PBOR
, POR
, WDT
TQFP
(PT)
, QFN
(MR)
dsPI
C33E
P512
GP50
6*NR
53ds
PIC
512
48AN
1095
(1)
43V
–3.6
V70
7.37
MHz
, 32
KHz
ü16
ch
–1
+ 3‡
3
44
––
52
UART
, 2 S
PI, 1
I2 C1
––
üü
$3.9
9PB
OR, P
OR, W
DTTQ
FP (P
T), Q
FN (M
R)
dsPI
C33E
P512
MC5
06*
NR53
dsPI
C51
248
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
zü
16 c
h –
1 +
3‡
34
46
15
2 UA
RT, 2
SPI
, 1 I2 C
1–
–ü
ü$3
.99
PBOR
, POR
, WDT
TQFP
(PT)
, QFN
(MR)
dsPI
C33E
P512
MC8
06*
NR53
dsPI
C53
652
AN10
95(1
)15
3V–3
.6V
707.
37 M
Hz, 3
2 KH
z–
24 c
h, 2
ADC
–3
–16
168
29
4 UA
RT, 2
SPI
, 2 I2 C
2Y
Yü
ü$5
.22
PBOR
, POR
, WDT
TQFP
(PT)
, QFN
(MR)
dsPI
C33E
P512
GP80
6*NR
53ds
PIC
536
52AN
1095
(1)
153V
–3.6
V70
7.37
MHz
, 32
KHz
–24
ch,
2 A
DC–
3–
1616
––
94
UART
, 2 S
PI, 2
I2 C2
–Y
üü
$5.6
0PB
OR, P
OR, W
DTTQ
FP (P
T), Q
FN (M
R)
dsPI
C33E
P256
MU8
06*
R53
dsPI
C51
248
AN10
95(1
)4
3V–3
.6V
707.
37 M
Hz, 3
2 KH
z–
24 c
h, 2
ADC
–3
–16
168
29
4 UA
RT, 2
SPI
, 2 I2 C
2–
Yü
ü$5
.60
PBOR
, POR
, WDT
TQFP
(PT)
, QFN
(MR)
100-Pin
dsPI
C33F
J64G
P310
A*R
85ds
PIC
6416
AN10
95(1
)8
3V–3
.6V
407.
37 M
Hz, 3
2 KH
z–
32 c
h–
––
88
––
92
UART
, 2 S
PI, 2
I2 C–
––
––
$3.9
9PB
OR, P
OR, W
DTTQ
FP (P
T, P
F)
dsPI
C33F
J64M
C510
A*R
85ds
PIC
648
AN10
95(1
)8
3V–3
.6V
407.
37 M
Hz, 3
2 KH
z–
24 c
h–
––
88
81
92
UART
, 2 S
PI, 2
I2 C1
––
––
$4.3
3PB
OR, P
OR, W
DTTQ
FP (P
T, P
F)
dsPI
C33F
J128
GP31
0A*
R85
dsPI
C12
816
AN10
95(1
)8
3V–3
.6V
407.
37 M
Hz, 3
2 KH
z–
32 c
h–
––
88
––
92
UART
, 2 S
PI, 2
I2 C–
––
––
$4.2
5PB
OR, P
OR, W
DTTQ
FP (P
T, P
F)
dsPI
C33F
J128
MC5
10A*
R85
dsPI
C12
88
AN10
95(1
)8
3V–3
.6V
407.
37 M
Hz, 3
2 KH
z–
24 c
h–
––
88
81
92
UART
, 2 S
PI, 2
I2 C1
––
––
$4.5
9PB
OR, P
OR, W
DTTQ
FP (P
T, P
F)
dsPI
C33F
J64G
P710
A*R
85ds
PIC
6416
AN10
95(1
)8
3V–3
.6V
407.
37 M
Hz, 3
2 KH
z–
32 c
h, 2
ADC
––
–8
8–
–9
2 UA
RT, 2
SPI
, 2 I2 C
2–
––
–$4
.61
PBOR
, POR
, WDT
TQFP
(PT,
PF)
dsPI
C33F
J64M
C710
A*R
85ds
PIC
6416
AN10
95(1
)8
3V–3
.6V
407.
37 M
Hz, 3
2 KH
z-
24 c
h, 2
ADC
––
–8
88
19
2 UA
RT, 2
SPI
, 2 I2 C
2–
––
–$4
.91
PBOR
, POR
, WDT
TQFP
(PT,
PF)
dsPI
C33F
J256
GP51
0A*
R85
dsPI
C25
616
AN10
95(1
)8
3V–3
.6V
407.
37 M
Hz, 3
2 KH
z-
32 c
h –
––
88
––
92
UART
, 2 S
PI, 2
I2 C1
––
––
$4.6
6PB
OR, P
OR, W
DTTQ
FP (P
T, P
F)
dsPI
C33F
J128
GP71
0A*
R85
dsPI
C12
816
AN10
95(1
)8
3V–3
.6V
407.
37 M
Hz, 3
2 KH
z-
32 c
h, 2
ADC
––
–8
8–
–9
2 UA
RT, 2
SPI
, 2 I2 C
2–
––
–$4
.86
PBOR
, POR
, WDT
TQFP
(PT,
PF)
dsPI
C33F
J256
MC5
10A*
R85
dsPI
C25
616
AN10
95(1
)8
3V–3
.6V
407.
37 M
Hz, 3
2 KH
z-
16 c
h –
––
88
81
92
UART
, 2 S
PI, 2
I2 C1
––
––
$4.9
7PB
OR, P
OR, W
DTTQ
FP (P
T, P
F)
dsPI
C33F
J128
MC7
10A*
R85
dsPI
C12
816
AN10
95(1
)8
3V–3
.6V
407.
37 M
Hz, 3
2 KH
z-
24 c
h, 2
ADC
––
–8
88
19
2 UA
RT, 2
SPI
, 2 I2 C
2–
––
–$5
.18
PBOR
, POR
, WDT
TQFP
(PT,
PF)
dsPI
C33F
J256
GP71
0A*
R85
dsPI
C25
630
AN10
95(1
)8
3V–3
.6V
407.
37 M
Hz, 3
2 KH
z-
32 c
h, 2
ADC
––
–8
8–
–9
2 UA
RT, 2
SPI
, 2 I2 C
2–
––
–$5
.32
PBOR
, POR
, WDT
TQFP
(PT,
PF)
dsPI
C33F
J256
MC7
10A*
R85
dsPI
C25
630
AN10
95(1
)8
3V–3
.6V
407.
37 M
Hz, 3
2 KH
z-
24 c
h, 2
ADC
––
–8
88
19
2 UA
RT, 2
SPI
, 2 I2 C
2–
––
–$5
.67
PBOR
, POR
, WDT
TQFP
(PT,
PF)
dsPI
C33E
P256
MU8
10*
R83
dsPI
C28
028
AN10
95(1
)15
3V–3
.6V
607.
37 M
Hz, 3
2 KH
z-
32 c
h, 2
ADC
–3
–16
1612
29
2 UA
RT, 2
SPI
, 2 I2 C
2ü
üü
ü$5
.70
PBOR
, POR
, WDT
TQFP
(PT,
PF)
dsPI
C33E
P512
MU8
10*
R83
dsPI
C53
652
AN10
95(1
)15
3V–3
.6V
607.
37 M
Hz, 3
2 KH
z-
32 c
h, 2
ADC
–3
–16
1612
29
2 UA
RT, 2
SPI
, 2 I2 C
2ü
üü
ü$6
.37
PBOR
, POR
, WDT
TQFP
(PT,
PF)
144-Pin
dsPI
C33E
P256
MU8
14*
R12
2ds
PIC
280
28AN
1095
(1)
153V
–3.6
V60
7.37
MHz
, 32
KHz
-32
ch,
2 A
DC–
3–
1616
122
92
UART
, 2 S
PI, 2
I2 C2
üü
üü
$6.3
1PB
OR, P
OR, W
DTTQ
FP (P
T, P
F)
dsPI
C33E
P512
MU8
14*
R12
2ds
PIC
536
52AN
1095
(1)
153V
–3.6
V60
7.37
MHz
, 32
KHz
-32
ch,
2 A
DC–
3–
1616
122
92
UART
, 2 S
PI, 2
I2 C2
üü
üü
$6.9
9PB
OR, P
OR, W
DTTQ
FP (P
T, P
F)
* Pa
rts
avai
labl
e w
ith H
igh
Tem
pera
ture
Opt
ions
(150
°C).
‡ Op
am
p co
nfigu
red
as c
ompa
rato
r. n
ote
1: S
ee A
pplic
atio
n N
ote
"AN
1095
: Em
ulat
ing
Dat
a EE
PRO
M".
2
: Tw
o 16
-bit
timer
s ca
n be
con
cate
nate
d to
form
a 3
2-bi
t tim
er.
16 Focus Product Selector Guide
Prod
ucts
sor
ted
by p
in c
ount
follo
wed
by p
ricin
g.†
Pric
ing
subj
ect t
o ch
ange
; ple
ase
cont
act y
our M
icro
chip
repr
esen
tativ
e fo
r mos
t cur
rent
pric
ing.
dsP
iC3
3 D
sC s
MP
s A
nD
DiG
itA
l P
oW
er C
on
Ver
sio
n F
AM
ilY
Prod
uct
released (r) not released (nr)
i/o Pins
Core
Mem
ory
Voltage range
ope
ratin
g sp
eed
Anal
og
output Compare/PWM
input Capture
Power supply PWM Ch(1)
Qei
16-bit timer(2)
Com
mun
icat
ion
PMP
rtCC
PPs
5 ku Pricing†
Mon
itors
Pack
ages
(Des
igna
tor)
Program (Kb)
Data rAM (b)
eeProM
DMA #Ch
Maximum speed MiPs
internal oscillator
ADC 10-bit 2000 ksps (‡ 4000 ksps)
DAC
Comparators
Digital Communication
CAn
syst
em M
gmt.
Feat
ures
18-Pin
dsPI
C33F
J06G
S001
R13
dsPI
C®6
256
AN10
95(1
)–
3V–3
.6V
407.
37 M
Hz, 3
2 kH
z6
ch2
× 10
-bit
2–
–4
–2
1 UA
RT, 1
SPI
, 1 I2 C
™–
––
ü$1
.61
BOR,
POR
, WDT
PDIP
(P),
SOIC
(SO)
, SSO
P (S
S)
dsPI
C33F
J06G
S101
AR
13ds
PIC
625
6AN
1095
(1)
–3V
–3.6
V40
7.37
MHz
, 32
kHz
6 ch
––
1–
4–
21
UART
, 1 S
PI, 1
I2 C–
––
ü$1
.75
BOR,
POR
, WDT
PDIP
(P),
SOIC
(SO)
, SSO
P (S
S)
28-Pin
dsPI
C33F
J06G
S102
AR
21ds
PIC
625
6AN
1095
(1)
–3V
–3.6
V40
7.37
MHz
, 32
kHz
6 ch
––
1–
4–
21
UART
, 1 S
PI, 1
I2 C–
––
ü$1
.95
BOR,
POR
, WDT
SDIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, QFN
(MM
)
dsPI
C33F
J06G
S202
AR
21ds
PIC
610
24AN
1095
(1)
–3V
–3.6
V40
7.37
MHz
, 32
kHz
6 ch
2 ×
10-b
it2
11
4–
21
UART
, 1 S
PI, 1
I2 C–
––
ü$2
.06
BOR,
POR
, WDT
SDIP
(SP)
, SOI
C (S
O), S
SOP
(SS)
, QFN
(MM
)
dsPI
C33F
J09G
S302
R21
dsPI
C9
1024
AN10
95(1
)–
3V–3
.6V
407.
37 M
Hz, 3
2 kH
z8
ch2
× 10
-bit
21
16
–2
1 UA
RT, 1
SPI
, 1 I2 C
––
–ü
$2.1
7BO
R, P
OR, W
DTSD
IP (S
P), S
OIC
(SO)
, SSO
P (S
S), Q
FN (M
M)
dsPI
C33F
J16G
S402
* R
21ds
PIC
1620
48AN
1095
(1)
–3V
–3.6
V50
7.37
MHz
, 32
kHz
8 ch
––
22
6–
31
UART
, 1 S
PI, 1
I2 C
––
–ü
$2.5
2 BO
R, P
OR, W
DTSP
DIP
(SP)
, SOI
C (S
O), Q
FN (M
M)
dsPI
C33F
J16G
S502
* R
21ds
PIC
1620
48AN
1095
(1)
–3V
–3.6
V50
7.37
MHz
, 32
kHz
8 ch
, 2
ADC‡
4 ×
10-b
it4
22
8–
31
UART
, 1 S
PI, 1
I2 C
––
–ü
$3.0
4 BO
R, P
OR, W
DTSP
DIP
(SP)
, SOI
C (S
O), Q
FN (M
M)
44-Pin
dsPI
C33F
J16G
S404
* R
35ds
PIC
1620
48AN
1095
(1)
–3V
–3.6
V50
7.37
MHz
, 32
kHz
8 ch
––
22
6–
31
UART
, 1 S
PI, 1
I2 C
––
–ü
$2.7
7 BO
R, P
OR, W
DTTQ
FP (P
T), Q
FN (M
L)
dsPI
C33F
J16G
S504
* R
35ds
PIC
1620
48AN
1095
(1)
–3V
–3.6
V50
7.37
MHz
, 32
kHz
12 c
h, 2
AD
C‡4
× 10
-bit
42
28
–3
1 UA
RT, 1
SPI
, 1 I2 C
–
––
ü$3
.42
BOR,
POR
, WDT
TQFP
(PT)
, QFN
(ML)
64-Pin
dsPI
C33F
J32G
S406
R58
dsPI
C32
4096
AN10
95(1
)–
3V–3
.6V
507.
37 M
Hz, 3
2 kH
z16
ch
––
44
121
52
UART
, 2 S
PI, 2
I2 C
––
––
$3.0
7BO
R, P
OR, W
DTTQ
FP (P
T), Q
FN (M
R)
dsPI
C33F
J64G
S406
R58
dsPI
C64
8192
AN10
95(1
)–
3V–3
.6V
507.
37 M
Hz, 3
2 kH
z16
ch
––
44
121
52
UART
, 2 S
PI, 2
I2 C
––
––
$3.3
5BO
R, P
OR, W
DTTQ
FP (P
T), Q
FN (M
R)
dsPI
C33F
J32G
S606
R58
dsPI
C32
4096
AN10
95(1
)–
3V–3
.6V
507.
37 M
Hz, 3
2 kH
z16
ch,
2
ADC‡
4 ×
10-b
it 4
44
122
52
UART
, 2 S
PI, 2
I2 C
––
––
$3.3
6BO
R, P
OR, W
DTTQ
FP (P
T), Q
FN (M
R)
dsPI
C33F
J64G
S606
R58
dsPI
C64
9216
AN10
95(1
)4
3V–3
.6V
507.
37 M
Hz, 3
2 kH
z16
ch,
2
ADC‡
4 ×
10-b
it 4
44
122
52
UART
, 2 S
PI, 2
I2 C
1–
––
$3.8
1BO
R, P
OR, W
DTTQ
FP (P
T), Q
FN (M
R)
80-Pin
dsPI
C33F
J32G
S608
R74
dsPI
C32
4096
AN10
95(1
)–
3V–3
.6V
507.
37 M
Hz, 3
2 kH
z18
ch,
2
ADC‡
4 ×
10-b
it 4
44
162
52
UART
, 2 S
PI, 2
I2 C
––
––
$3.8
5BO
R, P
OR, W
DTTQ
FP (P
T)
dsPI
C33F
J64G
S608
R74
dsPI
C64
9216
AN10
95(1
)4
3V–3
.6V
507.
37 M
Hz, 3
2 kH
z18
ch,
2
ADC‡
4 ×
10-b
it 4
44
162
52
UART
, 2 S
PI, 2
I2 C
1–
––
$4.3
4BO
R, P
OR, W
DTTQ
FP (P
T)
100-Pin
dsPI
C33F
J32G
S610
R85
dsPI
C32
4096
AN10
95(1
)–
3V–3
.6V
507.
37 M
Hz, 3
2 kH
z24
ch,
2
ADC‡
4 ×
10-b
it 4
44
182
52
UART
, 2 S
PI, 2
I2 C
––
––
$4.4
1BO
R, P
OR, W
DTTQ
FP (P
F, P
T)
dsPI
C33F
J64G
S610
R85
dsPI
C64
9216
AN10
95(1
)4
3V–3
.6V
507.
37 M
Hz, 3
2 kH
z24
ch,
2
ADC‡
4 ×
10-b
it 4
44
182
52
UART
, 2 S
PI, 2
I2 C
1–
––
$4.8
9BO
R, P
OR, W
DTTQ
FP (P
F, P
T)
* Pa
rts
avai
labl
e w
ith H
igh
Tem
pera
ture
Opt
ions
(150
°C).
‡ 4
Msp
s de
vices
with
2 A
DCs
not
e 1
: See
App
licat
ion
Not
e "A
N10
95: E
mul
atin
g D
ata
EEPR
OM
".
2: T
wo
16-b
it tim
ers
can
be c
onca
tena
ted
to fo
rm a
32-
bit t
imer
.
17Focus Product Selector Guide
Prod
ucts
sor
ted
by p
in c
ount
follo
wed
by p
ricin
g.†
Pric
ing
subj
ect t
o ch
ange
; ple
ase
cont
act y
our M
icro
chip
repr
esen
tativ
e fo
r mos
t cur
rent
pric
ing.
32
-bit
PiC
32
MiC
ro
Co
ntr
oll
ers
Prod
uct
released (r) not released (nr)
i/o Pins
Core
Mem
ory
DMA Channels General/Dedicated
Voltage range
ope
ratin
g sp
eed
Charge time Measurement Unit
Anal
og
iC/oC/PWM
timers 16/32-bit
Com
mun
icat
ion
PMP
rtCC
Peripheral Pin select (PPs)
5 ku Pricing†
Mon
itors
Pack
ages
(Des
igna
tor)
Flash Kb + boot Flash
Data rAM (Kb)
eeProM
Maximum speed (MHz)
internal oscillator
ADC 10-bit 1,000 ksps
Comparators
sPi/i2s
i2C™
UArts
Fs Usb
ethernet
CAn
syst
em M
gmt.
Feat
ures
28-Pin
PIC3
2MX1
10F0
16B
R21
PIC3
216
+ 3
4AN
1095
4/0
2.3V
–3.6
V40
8 M
Hz, 3
2 KH
zü
10 c
h3
5/5/
55/
22/
22
2–
––
üü
ü$1
.51
POR,
BOR
, LVD
, WDT
SPDI
P (S
P), S
OIC
(SO)
, SSO
C (S
S), Q
FN (M
L)
PIC3
2MX2
10F0
16B
R21
PIC3
216
+ 3
4AN
1095
4/2
2.3V
–3.6
V40
8 M
Hz, 3
2 KH
zü
10 c
h3
5/5/
55/
22/
22
2De
vice
––
üü
ü$1
.62
POR,
BOR
, LVD
, WDT
SPDI
P (S
P), S
OIC
(SO)
, SSO
C (S
S), Q
FN (M
L)
PIC3
2MX1
20F0
32B
R21
PIC3
232
+ 3
8AN
1095
4/0
2.3V
–3.6
V50
8 M
Hz, 3
2 KH
zü
10 c
h3
5/5/
55/
22/
22
2–
––
üü
ü$1
.71
POR,
BOR
, LVD
, WDT
SPDI
P (S
P), S
OIC
(SO)
, SSO
C (S
S), Q
FN (M
L)
PIC3
2MX2
20F0
32B
R21
PIC3
232
+ 3
8AN
1095
4/2
2.3V
–3.6
V50
8 M
Hz, 3
2 KH
zü
10 c
h3
5/5/
55/
22/
22
2De
vice
––
üü
ü$1
.82
POR,
BOR
, LVD
, WDT
SPDI
P (S
P), S
OIC
(SO)
, SSO
C (S
S), Q
FN (M
L)
PIC3
2MX1
30F0
64B
R21
PIC3
264
+ 3
16AN
1095
4/0
2.3V
–3.6
V40
8 M
Hz, 3
2 KH
zü
10 c
h3
5/5/
55/
22/
22
2–
––
üü
ü$2
.03
POR,
BOR
, LVD
, WDT
SPDI
P (S
P), S
OIC
(SO)
, SSO
C (S
S), Q
FN (M
L)
PIC3
2MX1
50F1
28B
R21
PIC3
212
8 +
332
AN10
954/
02.
3V–3
.6V
508
MHz
, 32
KHz
ü10
ch
35/
5/5
5/2
2/2
22
––
–ü
üü
$2.3
1PO
R, B
OR, L
VD, W
DTSP
DIP
(SP)
, SOI
C (S
O), S
SOC
(SS)
, QFN
(ML)
PIC3
2MX2
30F0
64B
R21
PIC3
264
+ 3
16AN
1095
4/2
2.3V
–3.6
V40
8 M
Hz, 3
2 KH
zü
10 c
h3
5/5/
55/
22/
22
2OT
G–
–ü
üü
$2.3
1PO
R, B
OR, L
VD, W
DTSP
DIP
(SP)
, SOI
C (S
O), S
SOC
(SS)
, QFN
(ML)
PIC3
2MX2
50F1
28B
R21
PIC3
212
8 +
332
AN10
954/
22.
3V–3
.6V
508
MHz
, 32
KHz
ü10
ch
35/
5/5
5/2
2/2
22
OTG
––
üü
ü$2
.59
POR,
BOR
, LVD
, WDT
SPDI
P (S
P), S
OIC
(SO)
, SSO
C (S
S), Q
FN (M
L)
36-Pin
PIC3
2MX1
10F0
16C
R25
PIC3
216
+ 3
4AN
1095
4/0
2.3V
–3.6
V40
8 M
Hz, 3
2 KH
zü
12 c
h3
5/5/
55/
22/
22
2–
––
üü
ü$1
.65
POR,
BOR
, LVD
, WDT
VTLA
(TL)
PIC3
2MX2
10F0
16C
R25
PIC3
216
+ 3
4AN
1095
4/2
2.3V
–3.6
V40
8 M
Hz, 3
2 KH
zü
12 c
h3
5/5/
55/
22/
22
2De
vice
––
üü
ü$1
.76
POR,
BOR
, LVD
, WDT
VTLA
(TL)
PIC3
2MX1
20F0
32C
R25
PIC3
232
+ 3
8AN
1095
4/0
2.3V
–3.6
V50
8 M
Hz, 3
2 KH
zü
12 c
h3
5/5/
55/
22/
22
2–
––
üü
ü$1
.85
POR,
BOR
, LVD
, WDT
VTLA
(TL)
PIC3
2MX2
20F0
32C
R25
PIC3
232
+ 3
8AN
1095
4/2
2.3V
–3.6
V50
8 M
Hz, 3
2 KH
zü
12 c
h3
5/5/
55/
22/
22
2De
vice
––
üü
ü$1
.96
POR,
BOR
, LVD
, WDT
VTLA
(TL)
PIC3
2MX1
30F0
64C
R25
PIC3
264
+ 3
16AN
1095
4/0
2.3V
–3.6
V40
8 M
Hz, 3
2 KH
zü
12 c
h3
5/5/
55/
22/
22
2–
––
üü
ü$2
.17
POR,
BOR
, LVD
, WDT
VTLA
(TL)
PIC3
2MX1
50F1
28C
R25
PIC3
212
8 +
332
AN10
954/
02.
3V–3
.6V
508
MHz
, 32
KHz
ü12
ch
35/
5/5
5/2
2/2
22
––
–ü
üü
$2.4
5PO
R, B
OR, L
VD, W
DTVT
LA (T
L)
PIC3
2MX2
30F0
64C
R25
PIC3
264
+ 3
16AN
1095
4/2
2.3V
–3.6
V40
8 M
Hz, 3
2 KH
zü
12 c
h3
5/5/
55/
22/
22
2OT
G–
–ü
üü
$2.4
5PO
R, B
OR, L
VD, W
DTVT
LA (T
L)
PIC3
2MX2
50F1
28C
R25
PIC3
212
8 +
332
AN10
954/
22.
3V–3
.6V
508
MHz
, 32
KHz
ü12
ch
35/
5/5
5/2
2/2
22
OTG
––
üü
ü$2
.73
POR,
BOR
, LVD
, WDT
VTLA
(TL)
44-Pin
PIC3
2MX1
10F0
16D
R34
PIC3
216
+ 3
4AN
1095
4/0
2.3V
–3.6
V40
8 M
Hz, 3
2 KH
zü
13 c
h3
5/5/
55/
22/
22
2–
––
üü
ü$1
.75
POR,
BOR
, LVD
, WDT
TQFP
(PT)
, QFN
(ML)
, VTL
A (T
L)
PIC3
2MX2
10F0
16D
R34
PIC3
216
+ 3
4AN
1095
4/2
2.3V
–3.6
V40
8 M
Hz, 3
2 KH
zü
13 c
h3
5/5/
55/
22/
22
2De
vice
––
üü
ü$1
.85
POR,
BOR
, LVD
, WDT
TQFP
(PT)
, QFN
(ML)
, VTL
A (T
L)
PIC3
2MX1
20F0
32D
R34
PIC3
232
+ 3
8AN
1095
4/0
2.3V
–3.6
V50
8 M
Hz, 3
2 KH
zü
13 c
h3
5/5/
55/
22/
22
2–
––
üü
ü$1
.95
POR,
BOR
, LVD
, WDT
TQFP
(PT)
, QFN
(ML)
, VTL
A (T
L)
PIC3
2MX2
20F0
32D
R34
PIC3
232
+ 3
8AN
1095
4/2
2.3V
–3.6
V50
8 M
Hz, 3
2 KH
zü
13 c
h3
5/5/
55/
22/
22
2De
vice
––
üü
ü$2
.04
POR,
BOR
, LVD
, WDT
TQFP
(PT)
, QFN
(ML)
, VTL
A (T
L)
PIC3
2MX1
30F0
64D
R34
PIC3
264
+ 3
16AN
1095
4/0
2.3V
–3.6
V40
8 M
Hz, 3
2 KH
zü
13 c
h3
5/5/
55/
22/
22
2–
––
üü
ü$2
.24
POR,
BOR
, LVD
, WDT
TQFP
(PT)
, QFN
(ML)
, VTL
A (T
L)
PIC3
2MX1
50F1
28D
R34
PIC3
212
8 +
332
AN10
954/
02.
3V–3
.6V
508
MHz
, 32
KHz
ü13
ch
35/
5/5
5/2
2/2
22
––
–ü
üü
$2.5
2PO
R, B
OR, L
VD, W
DTTQ
FP (P
T), Q
FN (M
L), V
TLA
(TL)
PIC3
2MX2
30F0
64D
R34
PIC3
264
+ 3
16AN
1095
4/2
2.3V
–3.6
V40
8 M
Hz, 3
2 KH
zü
13 c
h3
5/5/
55/
22/
22
2OT
G–
–ü
üü
$2.5
2PO
R, B
OR, L
VD, W
DTTQ
FP (P
T), Q
FN (M
L), V
TLA
(TL)
PIC3
2MX2
50F1
28D
R34
PIC3
212
8 +
332
AN10
954/
22.
3V–3
.6V
508
MHz
, 32
KHz
ü13
ch
35/
5/5
5/2
2/2
22
OTG
––
üü
ü$2
.80
POR,
BOR
, LVD
, WDT
TQFP
(PT)
, QFN
(ML)
, VTL
A (T
L)
64-Pin
PIC3
2MX3
30F0
64H
NR53
PIC3
264
+ 1
216
AN10
95(1
)4/
02.
3V–3
.6V
808
MHz
, 32
KHz
ü28
25/
5/5
5/2
2/2
24
––
–ü
üü
call
for
pric
ing
POR,
BOR
, LVD
, WDT
TQFP
(PT)
, QFN
(MR)
PIC3
2MX4
30F0
64H
NR53
PIC3
264
+ 1
216
AN10
95(1
)4/
22.
3V–3
.6V
808
MHz
, 32
KHz
ü28
25/
5/5
5/2
2/2
24
OTG
––
üü
üca
ll fo
r pr
icin
gPO
R, B
OR, L
VD, W
DTTQ
FP (P
T), Q
FN (M
R)
PIC3
2MX3
20F0
32H
R 51
PI
C32
32 +
12
8AN
1095
(1)
0/0
2.3V
–3.6
V40
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
12/
02
2–
––
üü
–$3
.09
POR,
BOR
, LVD
, WDT
TQFP
(PT)
, QFN
(MR)
PIC3
2MX3
20F0
64H
R 51
PI
C32
64 +
12
16AN
1095
(1)
0/0
2.3V
–3.6
V40
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
12/
02
2–
––
üü
–$3
.36
POR,
BOR
, LVD
, WDT
TQFP
(PT)
, QFN
(MR)
PIC3
2MX4
20F0
32H
R 51
PI
C32
32 +
12
8AN
1095
(1)
0/2
2.3V
–3.6
V40
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
12/
02
2OT
G–
–ü
ü–
$3.3
6PO
R, B
OR, L
VD, W
DTTQ
FP (P
T), Q
FN (M
R)
PIC3
2MX3
20F1
28H
R 51
PI
C32
128
+ 12
16AN
1095
(1)
0/0
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
12/
02
2–
––
üü
–$3
.75
POR,
BOR
, LVD
, WDT
TQFP
(PT)
, QFN
(MR)
PIC3
2MX5
34F0
64H
R 51
PI
C32
64 +
12
16AN
1095
(1)
4/4
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
13/
04
6OT
G–
1ü
ü–
$3.8
9PO
R, B
OR, L
VD, W
DTTQ
FP (P
T), Q
FN (M
R)
PIC3
2MX3
40F1
28H
R 51
PI
C32
128
+ 12
32AN
1095
(1)
4/0
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
12/
02
2–
––
üü
–$3
.96
POR,
BOR
, LVD
, WDT
TQFP
(PT)
, QFN
(MR)
PIC3
2MX5
64F0
64H
R 51
PI
C32
64 +
12
32AN
1095
(1)
4/4
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
13/
04
6OT
G–
1ü
ü–
$4.1
0PO
R, B
OR, L
VD, W
DTTQ
FP (P
T), Q
FN (M
R)
PIC3
2MX4
40F1
28H
R 51
PI
C32
128
+ 12
32AN
1095
(1)
4/2
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
12/
02
2OT
G–
–ü
ü–
$4.2
3PO
R, B
OR, L
VD, W
DTTQ
FP (P
T), Q
FN (M
R)
PIC3
2MX3
40F2
56H
R 51
PI
C32
256
+ 12
32AN
1095
(1)
4/0
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
12/
02
2–
––
üü
–$4
.31
POR,
BOR
, LVD
, WDT
TQFP
(PT)
, QFN
(MR)
PIC3
2MX5
64F1
28H
R 51
PI
C32
128
+ 12
32AN
1095
(1)
4/4
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
13/
04
6OT
G–
1ü
ü–
$4.3
4PO
R, B
OR, L
VD, W
DTTQ
FP (P
T), Q
FN (M
R)
PIC3
2MX6
64F0
64H
R 51
PI
C32
64 +
12
32AN
1095
(1)
4/4
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
13/
04
6OT
G10
/100
–ü
ü–
$4.3
4PO
R, B
OR, L
VD, W
DTTQ
FP (P
T), Q
FN (M
R)
PIC3
2MX4
40F2
56H
R 51
PI
C32
256
+ 12
32AN
1095
(1)
4/2
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
12/
02
2OT
G–
–ü
ü–
$4.5
8PO
R, B
OR, L
VD, W
DTTQ
FP (P
T), Q
FN (M
R)
PIC3
2MX6
64F1
28H
R 51
PI
C32
128
+ 12
32AN
1095
(1)
4/4
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
13/
04
6OT
G10
/100
–ü
ü–
$4.5
8PO
R, B
OR, L
VD, W
DTTQ
FP (P
T), Q
FN (M
R)
not
e 1
: See
App
licat
ion
Not
e "A
N10
95: E
mul
atin
g D
ata
EEPR
OM
".
18 Focus Product Selector Guide
32
-bit
PiC
32
MiC
ro
Co
ntr
oll
ers
Prod
uct
released (r) not released (nr)
i/o Pins
Core
Mem
ory
DMA Channels General/Dedicated
Voltage range
ope
ratin
g sp
eed
Charge time Measurement Unit
Anal
og
iC/oC/PWM
timers 16/32-bit
Com
mun
icat
ion
PMP
rtCC
Peripheral Pin select (PPs)
5 ku Pricing†
Mon
itors
Pack
ages
(Des
igna
tor)
Flash Kb + boot Flash
Data rAM (Kb)
eeProM
Maximum speed (MHz)
internal oscillator
ADC 10-bit 1,000 ksps
Comparators
sPi/i2s
i2C™
UArts
Fs Usb
ethernet
CAn
syst
em M
gmt.
Feat
ures
64-Pin (Cont.)
PIC3
2MX7
64F1
28H
R 51
PI
C32
128
+ 12
32AN
1095
(1)
4/6
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
13/
04
6OT
G10
/100
1ü
ü–
$4.6
9PO
R, B
OR, L
VD, W
DTTQ
FP (P
T), Q
FN (M
R)
PIC3
2MX3
40F5
12H
R 51
PI
C32
512
+ 12
32AN
1095
(1)
4/0
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
12/
02
2–
––
üü
–$4
.77
POR,
BOR
, LVD
, WDT
TQFP
(PT)
, QFN
(MR)
PIC3
2MX5
75F2
56H
R 51
PI
C32
256
+ 12
64AN
1095
(1)
8/4
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
13/
04
6OT
G–
1ü
ü–
$4.9
6PO
R, B
OR, L
VD, W
DTTQ
FP (P
T), Q
FN (M
R)
PIC3
2MX4
40F5
12H
R 51
PI
C32
512
+ 12
32AN
1095
(1)
4/2
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
12/
02
2OT
G–
–ü
ü–
$5.0
4PO
R, B
OR, L
VD, W
DTTQ
FP (P
T), Q
FN (M
R)
PIC3
2MX6
75F2
56H
R 51
PI
C32
256
+ 12
64AN
1095
(1)
8/4
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
13/
04
6OT
G10
/100
–ü
ü–
$5.1
9PO
R, B
OR, L
VD, W
DTTQ
FP (P
T), Q
FN (M
R)
PIC3
2MX5
75F5
12H
R 51
PI
C32
512
+ 12
64AN
1095
(1)
8/4
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
13/
04
6OT
G–
1ü
ü–
$5.4
2PO
R, B
OR, L
VD, W
DTTQ
FP (P
T), Q
FN (M
R)
PIC3
2MX7
75F2
56H
R 51
PI
C32
256
+ 12
64AN
1095
(1)
8/8
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
13/
04
6OT
G10
/100
2ü
ü–
$5.4
2PO
R, B
OR, L
VD, W
DTTQ
FP (P
T), Q
FN (M
R)
PIC3
2MX6
75F5
12H
R 51
PI
C32
512
+ 12
64AN
1095
(1)
8/4
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
13/
04
6OT
G10
/100
–ü
ü–
$5.6
6PO
R, B
OR, L
VD, W
DTTQ
FP (P
T), Q
FN (M
R)
PIC3
2MX7
75F5
12H
R 51
PI
C32
512
+ 12
64AN
1095
(1)
8/8
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
13/
04
6OT
G10
/100
2ü
ü–
$5.8
8PO
R, B
OR, L
VD, W
DTTQ
FP (P
T), Q
FN (M
R)
PIC3
2MX6
95F5
12H
R 51
PI
C32
512
+ 12
128
AN10
95(1
)8/
42.
3V–3
.6V
808
MHz
, 32
kHz
–16
ch
25/
5/5
5/1
3/0
46
OTG
10/1
00–
üü
–$6
.13
POR,
BOR
, LVD
, WDT
TQFP
(PT)
, QFN
(MR)
PIC3
2MX7
95F5
12H
R 51
PIC3
251
2 +
1212
8AN
1095
(1)
8/8
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
13/
04
6OT
G10
/100
2ü
ü–
$6.3
6PO
R, B
OR, L
VD, W
DTTQ
FP (P
T), Q
FN (M
R)
100-Pin
PIC3
2MX3
30F0
64L
NR85
PIC3
264
+ 1
216
AN10
95(1
)4/
02.
3V–3
.6V
808
MHz
, 32
KHz
ü28
25/
5/5
5/2
2/2
25
––
–ü
ü–
call
for
pric
ing
POR,
BOR
, LVD
, WDT
TQFP
(PT,
PF)
, VT
LA (T
L)
PIC3
2MX4
30F0
64L
NR85
PIC3
264
+ 1
216
AN10
95(1
)4/
22.
3V–3
.6V
808
MHz
, 32
KHz
ü28
25/
5/5
5/2
2/2
25
OTG
––
üü
–ca
ll fo
r pr
icin
gPO
R, B
OR, L
VD, W
DTTQ
FP (P
T, P
F),
VTLA
(TL)
PIC3
2MX5
34F0
64L
R 85
PI
C32
64 +
12
16AN
1095
(1)
4/4
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
14/
05
6OT
G–
1ü
ü–
$4.3
7PO
R, B
OR, L
VD, W
DTTQ
FP (P
T, P
F), X
BGA
(BG)
PIC3
2MX3
20F1
28L
R 85
PIC3
212
8 +
1216
AN10
95(1
)0/
02.
3V–3
.6V
808
MHz
, 32
kHz
–16
ch
25/
5/5
5/1
2/0
22
––
–ü
ü–
$4.4
4PO
R, B
OR, L
VD, W
DTTQ
FP (P
T), X
BGA
(BG)
PIC3
2MX3
40F1
28L
R 85
PI
C32
128
+ 12
32AN
1095
(1)
4/0
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
12/
02
2–
––
üü
–$4
.44
POR,
BOR
, LVD
, WDT
TQFP
(PT)
, XBG
A (B
G)
PIC3
2MX5
64F0
64L
R 85
PIC3
264
+ 1
232
AN10
95(1
)4/
42.
3V–3
.6V
808
MHz
, 32
kHz
–16
ch
25/
5/5
5/1
4/0
56
OTG
–1
üü
–$4
.58
POR,
BOR
, LVD
, WDT
TQFP
(PT,
PF)
, XBG
A (B
G)
PIC3
2MX4
40F1
28L
R 85
PI
C32
128
+ 12
32AN
1095
(1)
4/2
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
12/
02
2OT
G–
–ü
ü–
$4.7
0PO
R, B
OR, L
VD, W
DTTQ
FP (P
T), X
BGA
(BG)
PIC3
2MX3
60F2
56L
R 85
PIC3
225
6 +
1232
AN10
95(1
)4/
02.
3V–3
.6V
808
MHz
, 32
kHz
–16
ch
25/
5/5
5/1
2/0
22
––
–ü
ü–
$4.7
9PO
R, B
OR, L
VD, W
DTTQ
FP (P
T), X
BGA
(BG)
PIC3
2MX5
64F1
28L
R 85
PI
C32
128
+ 12
32AN
1095
(1)
4/4
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
14/
05
6OT
G–
1ü
ü–
$4.8
2PO
R, B
OR, L
VD, W
DTTQ
FP (P
T, P
F), X
BGA
(BG)
PIC3
2MX6
64F0
64L
R 85
PIC3
264
+ 1
232
AN10
95(1
)4/
42.
3V–3
.6V
808
MHz
, 32
kHz
–16
ch
25/
5/5
5/1
4/0
56
OTG
10/1
00–
üü
–$4
.82
POR,
BOR
, LVD
, WDT
TQFP
(PT,
PF)
, XBG
A (B
G)
PIC3
2MX4
60F2
56L
R 85
PI
C32
256
+ 12
32AN
1095
(1)
4/2
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
12/
02
2OT
G–
–ü
ü–
$5.0
5PO
R, B
OR, L
VD, W
DTTQ
FP (P
T), X
BGA
(BG)
PIC3
2MX6
64F1
28L
R 85
PIC3
212
8 +
1232
AN10
95(1
)4/
42.
3V–3
.6V
808
MHz
, 32
kHz
–16
ch
25/
5/5
5/1
4/0
56
OTG
10/1
00–
üü
–$5
.05
POR,
BOR
, LVD
, WDT
TQFP
(PT,
PF)
, XBG
A (B
G)
PIC3
2MX7
64F1
28L
R 85
PI
C32
128
+ 12
32AN
1095
(1)
4/6
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
14/
05
6OT
G10
/100
1ü
ü–
$5.1
7PO
R, B
OR, L
VD, W
DTTQ
FP (P
T, P
F), X
BGA
(BG)
PIC3
2MX3
60F5
12L
R 85
PIC3
251
2 +
1232
AN10
95(1
)4/
02.
3V–3
.6V
808
MHz
, 32
kHz
–16
ch
25/
5/5
5/1
2/0
22
––
–ü
ü–
$5.2
5PO
R, B
OR, L
VD, W
DTTQ
FP (P
T), X
BGA
(BG)
PIC3
2MX5
75F2
56L
R 85
PI
C32
256
+ 12
64AN
1095
(1)
8/4
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
14/
05
6OT
G–
1ü
ü–
$5.4
3PO
R, B
OR, L
VD, W
DTTQ
FP (P
T, P
F), X
BGA
(BG)
PIC3
2MX4
60F5
12L
R 85
PIC3
251
2 +
1232
AN10
95(1
)4/
22.
3V–3
.6V
808
MHz
, 32
kHz
–16
ch
25/
5/5
5/1
2/0
22
OTG
––
üü
–$5
.52
POR,
BOR
, LVD
, WDT
TQFP
(PT)
, XBG
A (B
G)
PIC3
2MX6
75F2
56L
R 85
PI
C32
256
+ 12
64AN
1095
(1)
8/4
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
14/
05
6OT
G10
/100
–ü
ü–
$5.6
7PO
R, B
OR, L
VD, W
DTTQ
FP (P
T, P
F), X
BGA
(BG)
PIC3
2MX5
75F5
12L
R 85
PIC3
251
2 +
1264
AN10
95(1
)8/
42.
3V–3
.6V
808
MHz
, 32
kHz
–16
ch
25/
5/5
5/1
4/0
56
OTG
–1
üü
–$5
.89
POR,
BOR
, LVD
, WDT
TQFP
(PT,
PF)
, XBG
A (B
G)
PIC3
2MX7
75F2
56L
R 85
PI
C32
256
+ 12
64AN
1095
(1)
8/8
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
14/
05
6OT
G10
/100
2ü
ü–
$5.8
9PO
R, B
OR, L
VD, W
DTTQ
FP (P
T, P
F), X
BGA
(BG)
PIC3
2MX6
75F5
12L
R 85
PIC3
251
2 +
1264
AN10
95(1
)8/
42.
3V–3
.6V
808
MHz
, 32
kHz
–16
ch
25/
5/5
5/1
4/0
56
OTG
10/1
00–
üü
–$6
.13
POR,
BOR
, LVD
, WDT
TQFP
(PT,
PF)
, XBG
A (B
G)
PIC3
2MX7
75F5
12L
R 85
PI
C32
512
+ 12
64AN
1095
(1)
8/8
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
14/
05
6OT
G10
/100
2ü
ü–
$6.3
6PO
R, B
OR, L
VD, W
DTTQ
FP (P
T, P
F), X
BGA
(BG)
PIC3
2MX6
95F5
12L
R 85
PIC3
251
2 +
1212
8AN
1095
(1)
8/4
2.3V
–3.6
V80
8 M
Hz, 3
2 kH
z–
16 c
h2
5/5/
55/
14/
05
6OT
G10
/100
–ü
ü–
$6.6
1PO
R, B
OR, L
VD, W
DTTQ
FP (P
T, P
F), X
BGA
(BG)
PIC3
2MX7
95F5
12L
R 85
PI
C32
512
+ 12
128
AN10
95(1
)8/
82.
3V–3
.6V
808
MHz
, 32
kHz
–16
ch
25/
5/5
5/1
4/0
56
OTG
10/1
002
üü
–$6
.83
POR,
BOR
, LVD
, WDT
TQFP
(PT,
PF)
, XBG
A (B
G), V
TLA
(TL)
not
e 1
: See
App
licat
ion
Not
e "A
N10
95: E
mul
atin
g D
ata
EEPR
OM
".
19Focus Product Selector Guide
tHer
MA
l M
An
AG
eMen
t: t
empe
ratu
re s
enso
rs
Prod
uct
Des
crip
tion
# te
mps
. M
onito
red
typi
cal/
Max
Ac
cura
cy (°
C)te
mp.
ran
ge (°
C)Vc
c r
ange
(V)
typi
cal s
uppl
y Cu
rren
t (µA
)Al
erts
res
ista
nce
erro
r Co
rrec
tion
beta
Co
mpe
nsat
ion
Pack
ages
MCP
9501
/2/3
/4Te
mpe
ratu
re S
witc
h re
plac
ing
MAX
6501
/2/3
/41
1.0/
3.0
−40
to +
125
+2.
7 to
+5.
525
––
–5-
pin
SOT-
23
MCP
9509
/10
Resi
stor
-Pro
gram
mab
le T
empe
ratu
re S
witc
h1
0.5/
3.5
−40
to +
125
+2.
7 to
+5.
530
––
–5-
pin
SOT-
23
MCP
9800
/1/2
/3SM
Bus/
I2 C™
Tem
pera
ture
Sen
sor
10.
5/1.
0−5
5 to
+12
5 +
2.7
to +
5.5
200
1–
–5-
pin
SOT-
23
MCP
9804
SMBu
s/I2 C
Tem
pera
ture
Sen
sor
10.
25/1
.0−4
0 to
+12
5 +
2.7
to +
5.5
200
1-–
–8-
pin
DFN,
8-p
in M
SOP
MCP
9808
SMBu
s/I2 C
Tem
pera
ture
Sen
sor
10.
25/0
.5−4
0 to
+12
5 +
2.7
to +
5.5
200
1–
–8-
pin
DFN,
8-p
in M
SOP
MCP
9824
3SM
Bus/
I2 C T
empe
ratu
re S
enso
r with
EEP
ROM
10.
5/3.
0−4
0 to
+12
5 +
3.0
to +
3.6
200
1–
–8-
pin
DFN,
8-p
in T
DFN,
8-p
in T
SSOP
, 8-p
in U
DFN
MCP
9843
SMBu
s/I2 C
JED
EC T
empe
ratu
re S
enso
r1
0.5/
3.0
−40
to +
125
+3.
0 to
+3.
620
01
––
8-pi
n DF
N, 8
-pin
TDF
N, 8
-pin
TSS
OP
TCN7
5ASM
Bus/
I2 C T
empe
ratu
re S
enso
r1
0.5/
3.0
−40
to +
125
+2.
7 to
+5.
520
01
––
8-pi
n M
SOP,
8-p
in S
OIC
150m
il
MCP
9700
/01
Line
ar A
ctive
The
rmis
tor I
C1
1.0/
4.0
−40
to +
150
+2.
3 to
+5.
56
––
–3-
pin
SOT-
23, 3
-pin
TO-
92, 5
-pin
SC-
70
MCP
9700
/01A
Line
ar A
ctive
The
rmis
tor I
C1
1.0/
2.0
−40
to +
150
+2.
3 to
+5.
56
––
–3-
pin
SOT-
23, 3
-pin
TO-
92, 5
-pin
SC-
70
EMC1
033
SMBu
s/I2 C
Mul
ti Te
mpe
ratu
re S
enso
r3
1.0/
3.0
−40
to +
125
+3.
0 to
+3.
650
2ü
–8-
pin
MSO
P
EMC1
043
SMBu
s/I2 C
Mul
ti Te
mpe
ratu
re S
enso
r3
0.5/
1.0
−40
to +
125
+3.
0 to
+3.
610
5–
üCo
nfigu
rabl
e8-
pin
MSO
P
EMC1
046
SMBu
s/I2 C
Mul
ti Te
mp
Sens
or w
ith H
otte
st o
f Zon
es6
0.25
/1.0
−40
to +
125
+3.
0 to
+3.
639
5–
üAu
tom
atic
10-p
in M
SOP
EMC1
047
SMBu
s/I2 C
Mul
ti Te
mp
Sens
or w
ith H
otte
st o
f Zon
es7
0.25
/1.0
−40
to +
125
+3.
0 to
+3.
639
5–
üAu
tom
atic
10-p
in M
SOP
EMC1
412/
3/4
SMBu
s/I2 C
Mul
ti Te
mpe
ratu
re S
enso
r2/
3/4
0.25
/1.0
−40
to +
125
+3.
0 to
+3.
643
02
üAu
tom
atic
8-pi
n TD
FN, 8
-pin
MSO
P, 1
0-pi
n DF
N, 1
0-pi
n M
SOP
EMC1
422/
3/4
SMBu
s/I2 C
Mul
ti Te
mp
Sens
or w
ith S
hutd
own
2/3/
40.
25/1
.0−4
0 to
+12
5 +
3.0
to +
3.6
430
1ü
Auto
mat
ic8-
pin
MSO
P, 1
0-pi
n M
SOP
EMC1
428
SMBu
s/I2 C
Mul
ti Te
mp
Sens
or w
ith H
otte
st o
f Zon
es8
0.25
/1.0
−40
to +
125
+3.
0 to
+3.
645
01
üAu
tom
atic
16-p
in Q
FN
tHer
MA
l M
An
AG
eMen
t: F
an C
ontr
olle
rs
Prod
uct
Des
crip
tion
# Fa
n D
river
sPW
M/l
inea
r Co
ntro
l#
exte
rnal
tem
p.
inpu
tsty
pica
l Acc
urac
ytp
yica
l/M
ax.
Accu
racy
Vcc
ran
ge
(V)
inte
rfac
eAl
erts
Fan
spee
d lo
okup
ta
ble
Pack
ages
EMC2
101
Prog
ram
mab
le F
an C
ontro
ller w
ith T
herm
al M
gt1
PWM
20.
50.
5/1.
0+3
.0 to
+3.
6SM
Bus/
I2 C™
üü
8-pi
n M
SOP,
8-p
in S
OIC
EMC2
300
Prog
ram
mab
le M
ulti-
Fan
Cont
rolle
r with
The
rmal
Mgt
3PW
M3
0.25
0.25
/3.0
+3.0
to +
3.6
SMBu
s/I2 C
üü
16-p
in S
SOP
EMC2
112
Prog
ram
mab
le F
an C
ontro
ller w
ith T
herm
al M
gt1
Line
ar3
0.25
0.25
/1.0
+3.3
and
+5
SMBu
s/I2 C
üü
20-p
in Q
FN
EMC2
103-
1Pr
ogra
mm
able
Fan
Con
trolle
r with
The
rmal
Mgt
1PW
M1
0.5
0.5/
1.0
+3.0
to +
3.6
SMBu
s/I2 C
üü
12-p
in Q
FN
EMC2
103-
4Pr
ogra
mm
able
Fan
Con
trolle
r with
EEP
ROM
Loa
d1
PWM
30.
50.
5/1.
0+3
.0 to
+3.
6SM
Bus/
I2 Cü
ü16
-pin
QFN
EMC2
104
Prog
ram
mab
le M
ulti-
Fan
Cont
rolle
r with
The
rmal
Mgt
2PW
M4
0.25
0.25
/1.0
+3.0
to +
3.6
SMBu
s/I2 C
üü
20-p
in Q
FN
EMC2
105
Prog
ram
mab
le F
an C
ontro
ller w
ith T
herm
al M
gt1
Line
ar4
0.25
0.25
/1.0
+3.3
and
+5
SMBu
s/I2 C
üü
20-p
in Q
FN
EMC2
113
Prog
ram
mab
le F
an C
ontro
ller w
ith T
herm
al M
gt1
PWM
30.
50.
5/1.
0+3
.0 to
+3.
6SM
Bus/
I2 Cü
ü16
-pin
QFN
EMC2
301/
2/3/
5Pr
ogra
mm
able
Fan
Con
trolle
r1
/2/3
/5PW
M–
––
+3.0
to +
3.6
SMBu
s/I2 C
ü–
8-pi
n M
SOP,
10-
pin
MSO
P, 1
2-pi
n QF
N, 1
6-pi
n QF
N
Po
Wer
MA
nA
GeM
ent:
sw
itchi
ng r
egul
ator
s/P
WM
Con
trol
lers
Prod
uct
inpu
t Vol
tage
r
ange
(V)
out
put
Volta
ge (V
) o
pera
ting
tem
p.
ran
ge (°
C)
Cont
rol
sche
me
switc
hing
Fr
eque
ncy
(kH
z)
typi
cal A
ctiv
e Cu
rren
t (μA
) o
utpu
t Cu
rren
t (m
A)
Feat
ures
Pa
ckag
es
TC13
03/0
4/13
2.
7 to
5.5
DC
/DC:
0.8
to 4
.5
LDO:
1.5
to 3
.3
−40
to +
85
PFM
/PW
M
2000
65
/600
DC
/DC:
500
mA
LDO:
300
mA
Sync
hron
ous
Buck
Reg
ulat
or, L
DO w
/Pow
er G
ood
with
PFM
/PW
M a
uto-
switc
hing
, Pow
er G
ood
outp
ut o
r Pow
er S
eque
ncin
gM
SOP,
DFN
MCP
1602
/32.
7 to
5.5
0.
8 to
4.5
/4.
0 −4
0 to
+85
PF
M/P
WM
20
00
35/
4550
0 Sy
nchr
onou
s Bu
ck R
egul
ator
PFM
, PW
M a
uto-
switc
hing
, UVL
O, S
oft-s
tart,
Pow
er G
ood
indi
cato
r, Ov
er-te
mpe
ratu
re/c
urre
nt p
rote
ctio
n M
SOP,
DFN
, TSO
T
MCP
1630
/163
1/V/
HV/V
HV3.
0 to
16
–−4
0 to
+12
5PW
M10
00/2
000
2800
/370
0Ex
tCu
rrent
/Vol
tage
mod
e PW
M c
ontro
llers
. Op
tions
with
inte
grat
ed 1
6V L
DO, I
nteg
rate
d er
ror a
mpl
ifier
, Cur
rent
and
vol
tage
sen
se
ampl
ifier
, Ove
rvol
tage
com
para
tor a
nd in
tegr
ated
MOS
FET
drive
rM
SOP,
SSO
P, T
SSOP
, DFN
MCP
1903
54.
5 to
30
–−4
0 to
+12
5PW
M30
060
00Ex
tVo
ltage
mod
e PW
M s
ynch
rono
us b
uck
cont
rolle
r. In
tegr
ates
LDO
, erro
r am
plife
r, cu
rrent
and
vol
tage
sen
se, U
VLO/
OVLO
/MOS
FET
Dead
Tim
e ad
j, an
d M
OSFE
T Dr
ivers
DFN
MCP
1640
/B/C
/D0.
65 to
62.
0 to
5.5
−40
to +
85PW
M o
r PW
M/P
FM50
019
350
Inte
grat
ed s
ynch
rono
us b
oost
regu
lato
r, −0
.65V
sta
rt-up
vol
tage
, Sof
t-sta
rt, T
rue
load
dis
conn
ect o
r inp
ut-to
-out
put b
ypas
s op
tion
SOT-
23, D
FN
MCP
1650
/1/2
/32.
7 to
5.5
2.5
to e
xt. t
x lim
ited
−40
to +
125
Cons
tant
Fre
quen
cy75
0 12
0 56
0/44
0 St
ep-u
p DC
/DC
Cont
rolle
r with
shu
tdow
n co
ntro
l, Lo
w ba
ttery
det
ect,
Powe
r Goo
d in
dica
tor,
UVLO
, Sof
t sta
rt M
SOP
MCP
1630
14.
0 to
30
2.0
to 1
5−4
0 to
+85
PWM
500
2000
600
Inte
grat
ed N
-cha
nnel
, UVL
O, S
oft-s
tart,
Ove
r-tem
pera
ture
pro
tect
ion
SOT-
23
MCP
1632
16
to 2
40.
9 to
5−4
0 to
+12
5PW
M/P
FM10
0023
0010
00In
tegr
ated
swi
tche
s, In
tern
al c
ompe
nsat
ion,
Pea
k cu
rrent
mod
e co
ntro
l, So
ft-st
art,
UVLO
, Pow
er G
ood
pin
QFN
MCP
1632
26
to 2
40.
9 to
5−4
0 to
+12
5PW
M/P
FM10
0023
0020
00In
tegr
ated
swi
tche
s, In
tern
al c
ompe
nsat
ion,
Pea
k cu
rrent
mod
e co
ntro
l, So
ft-st
art,
UVLO
, Pow
er G
ood
pin
QFN
MCP
1632
36
to 1
80.
9 to
5−4
0 to
+12
5PW
M/P
FM10
0023
0030
00In
tegr
ated
swi
tche
s, In
tern
al c
ompe
nsat
ion,
Pea
k cu
rrent
mod
e co
ntro
l, So
ft-st
art,
UVLO
, Pow
er G
ood
pin
QFN
Po
Wer
MA
nA
GeM
ent:
Hyb
rid
PW
M C
ontr
olle
rs
Prod
uct
inpu
t Vol
tage
r
ange
(V)
out
put V
olta
ge
(V)
ope
ratin
g te
mp.
r
ange
(°C)
to
polo
gies
su
ppor
ted
inte
grat
ed M
CUPr
ogra
m M
emor
y si
ze (k
Wor
ds)
rAM
(byt
es)
Feat
ures
Pack
ages
MCP
1911
14.
5 to
32
–−4
0 to
+12
5Bu
ckü
425
6Sy
nchr
onou
s bu
ck c
ontro
ller,
Inte
grat
ed M
CU, L
DO, a
nd s
ynch
rono
us M
OSFE
T dr
iver,
User
con
figur
able
/pro
gram
mab
le
incl
udin
g M
OSFE
T de
ad ti
me,
Swi
tchi
ng fr
eque
ncy,
Anal
og lo
op c
ompe
nsat
ion,
and
pro
tect
ion
thre
shol
dsQF
N
20 Focus Product Selector Guide
Po
Wer
MA
nA
GeM
ent:
Pow
er M
osFe
ts
Prod
uct
Vds
(V)
Confi
gura
tion
Pola
rity
rds
(on)
@ 4
.5V
(m
Ω, M
ax.)
rds
(on)
@ 1
0V
(mΩ
, Max
.)Q
g @
4.5
V
(nC,
Max
.)id
(A, M
ax.
@ 2
5°C,
tca
se)
Vgs
(th)
(V, M
in.)
Qgd
(n
C, t
yp.)
rg
(Ω
typ
.)Pa
ckag
e
MCP
8701
825
Sing
le–
2.2
1.9
3710
01
131.
55
× 6
PDFN
MCP
8702
225
Sing
le–
2.6
2.3
2910
01
91.
35
× 6
PDFN
MCP
8703
025
Sing
le–
43.
522
100
16.
71.
25
× 6
PDFN
MCP
8705
025
Sing
le–
65
1510
01
4.7
1.1
5 ×
6 PD
FN
MCP
8705
525
Sing
le–
76
1460
14.
52.
13.
3 ×
3.3
PDFN
MCP
8709
025
Sing
le–
1210
.510
641.
12.
81.
85
× 6
PDFN
, 3.3
× 3
.3 P
DFN
MCP
8713
025
Sing
le–
16.5
13.5
854
1.1
2.6
1.7
5 ×
6 PD
FN, 3
.3 ×
3.3
N
Po
Wer
MA
nA
GeM
ent:
lin
ear
reg
ulat
ors
Prod
uct
Max
. inp
ut
Volta
ge (V
) o
utpu
t Vo
ltage
(V)
out
put
Curr
ent (
mA)
ty
pica
l Ac
tive
Curr
ent (
μA)
typi
cal D
ropo
ut V
olta
ge
@ M
ax. i
out
(mV)
ty
pica
l out
put V
olta
ge
Accu
racy
(%)
Feat
ures
Pa
ckag
es
TC10
16/1
76
1.8
to 4
.080
/150
5315
0/28
5±0
.5
Shut
down
SO
T-23
A, S
C70
TC13
01A/
B6
1.5
to 3
.3LD
O1: 3
00 L
DO2:
150
10
3/11
4LD
O1: 1
04 L
DO2:
150
±0
.5
Dual
LDO
plu
s Re
set o
utpu
t, Sh
utdo
wn, R
efer
ence
byp
ass,
Vol
tage
det
ect
MSO
P, D
FN
TC13
02AB
6
1.5
to 3
.3LD
O1: 3
00 L
DO2:
150
10
3/11
4LD
O1: 1
04 L
DO2:
150
±0
.5
Dual
LDO
, Shu
tdow
n, R
efer
ence
byp
ass,
Vol
tage
det
ect
MSO
P, D
FN
TC20
14/5
, TC2
185
61.
8 to
5.0
50/1
00/1
5055
45/9
0/14
0±0
.4
Shut
down
, Ref
eren
ce b
ypas
s in
put
SOT-
23A
TC20
54/5
, TC2
186
61.
8 to
5.0
50/1
00/1
5055
45/9
0/14
0±0
.4
Shut
down
, Erro
r out
put
SOT-
23A
MCP
1700
6
1.2
to 5
.025
01.
630
0±0
.4
Very
low
I qSO
T-23
A, S
OT-8
9, T
O-92
MCP
1702
/3 /
3A13
.2/1
6/16
1.2
to 5
.025
02
330/
625/
625
±0.4
Ve
ry lo
w I q
DFN,
TO-
92, S
OT-2
3A, S
OT-8
9, S
OT-2
23
MCP
1725
/6/7
60.
8 to
5.0
500
/100
0/15
0012
0/14
0/14
021
0/30
0/33
0±0
.5
Shut
down
, Cde
lay,
Pow
er G
ood
SOIC
, DFN
MCP
1754
/S16
1.8
to 5
.515
056
300
±0.4
Powe
r Goo
d, S
hutd
own
DFN,
SOT
-23A
, SOT
-89,
SOT
-223
MCP
1790
/130
3.0,
3.3
, 5.0
70
7050
0±0
.2
Load
dum
p, S
hutd
own,
Pow
er G
ood
SOT-
223,
DDP
AK
MCP
1801
/210
0.
9 to
6.0
150/
300
2525
0/80
0±0
.4
Shut
down
, Hig
h PS
RR
SOT-
23A
MCP
1804
281.
8 to
18
150
5030
0±0
.5Sh
utdo
wn, H
igh
PSRR
SOT-
23, S
OT-8
9, S
OT-2
23
MCP
1824
/5/6
/76
0.8
to 5
.0 3
00/5
00/1
000/
1500
120/
120/
140/
140
200/
210/
300/
330
±0.5
Fi
xed
and
Adju
stab
le o
utpu
t, Sh
utdo
wn, P
ower
Goo
d SO
T-23
, SOT
-223
, TO-
220,
DDP
AK
MCP
1824
S/5S
/6S/
7S6
0.8
to 5
.030
0/50
0/10
00/1
500
120/
120/
140/
140
200/
210/
300/
330
±0.5
3-
pin
high
cur
rent
LDO
sSO
T-22
3, T
O-22
0, D
DPAK
Po
Wer
MA
nA
GeM
ent:
Cha
rge
Pum
p D
C-to
-DC C
onve
rter
s
Prod
uct
inpu
t Vol
tage
ran
ge (V
)o
utpu
t Vol
tage
(V)
ope
ratin
g te
mp.
ran
ge (°
C)M
ax. i
nput
Cur
rent
(µA)
typi
cal o
utpu
t Cur
rent
(mA)
Feat
ures
Pack
ages
TC10
44S
1.5
to 1
2−V
In o
r 2*V
In
−40
to +
8516
020
85 k
Hz o
scill
ator
Boo
st m
ode
PDIP
, SOI
C
TC76
601.
5 to
10
−VIn
or 2
*VIn
−4
0 to
+85
180
2010
kHz
osc
illat
or
PDIP
, SOI
C
TC76
60H
1.5
to 1
0−V
In o
r 2*V
In
−40
to +
8510
0020
120
kHz
osci
llato
r PD
IP, S
OIC
TC76
60S
1.5
to 1
2−V
In o
r 2*V
In
−40
to +
8516
020
45 k
Hz o
scill
ator
Boo
st m
ode
PDIP
, SOI
C
TC76
62B
1.5
to 1
5−V
In o
r 2*V
In
−40
to +
8518
020
35 k
Hz o
scill
ator
Boo
st m
ode
PDIP
, SOI
C
TC76
62A
3.0
to 1
8−V
In o
r 2*V
In
−40
to +
8520
040
12 k
Hz o
scill
ator
PD
IP, S
OIC
MCP
1256
1.8
to 3
.6
3.3
−40
to +
85
100
100
Powe
r Goo
d Sl
eep
mod
e M
SOP,
DFN
MCP
1257
1.8
to 3
.6
3.3
−40
to +
85
100
100
Slee
p m
ode
low
batte
ry in
dica
tion
MSO
P, D
FN
MCP
1258
1.8
to 3
.6
3.3
−40
to +
85
100
100
Low
batte
ry in
dica
tion
inpu
t/ou
tput
byp
ass
1M
SOP,
DFN
Po
Wer
MA
nA
GeM
ent:
CP
U/s
yste
m s
uper
viso
rs
Prod
uct
Des
crip
tion
ope
ratin
g te
mp.
ran
ge (°
C)
Feat
ures
P
acka
ges
MCP
11(1
/2)
TC (1
/2/3
/4)
Syst
em V
olta
ge D
etec
tors
(N
o Re
set D
elay
)−4
0 to
+12
5 −4
0 to
+85
Wid
e VC
C in
put r
ange
, Wid
e de
tect
ion
rang
e (c
usto
m o
ptio
ns a
vaila
ble)
, Low
cur
rent
, CM
OS/P
ush-
Pull
activ
e lo
w re
set o
ptio
ns5-
SOT-
23, 3
-TO-
92, 3
-SOT
-23A
, 3-S
OT-8
9, 3
-SC7
0
MCP
809,
MCP
100,
MCP
130,
MCP
120
MCP
13XX
, TC1
270A
and
mor
eSy
stem
Vol
tage
Sup
ervis
ors
(A
vaila
ble
Rese
t Del
ays)
−40
to +
125
−40
to +
85W
ide
dete
ctio
n ra
nge
(cus
tom
opt
ions
ava
ilabl
e), L
ow c
urre
nt, P
ush-
Pull/
Open
Dra
in,
Activ
e hi
gh/l
ow, W
atch
dog,
Man
ual r
eset
, Dua
l out
put o
ptio
ns, M
ultip
le re
set d
elay
opt
ions
8-SO
IC (1
50 m
il), 5
-SOT
-23,
4-S
OT-1
43, 3
-TO-
92, 3
-SOT
-23,
5-S
C70
21Focus Product Selector Guide
Po
Wer
MA
nA
GeM
ent:
Pow
er M
osFe
t D
rive
rs
Prod
uct
Confi
gura
tion
ope
ratin
g te
mp.
ran
ge (°
C)Pe
ak o
utpu
t Cur
rent
(A)
out
put r
esis
tanc
e (M
ax. @
25°
C)M
ax s
uppl
y Vo
ltage
(V)
inpu
t/o
utpu
t Del
ay (n
s)Pa
ckag
es
MCP
1401
/02
Sing
leIn
vert
ing/
Non-
inve
rtin
g−4
0 to
+12
50.
518
/16
1840
/40
SOT-
23
MCP
1415
/16
Sing
leIn
vert
ing/
Non-
inve
rtin
g −4
0 to
+12
51.
57.
5/5.
518
50/5
5SO
T-23
TC44
67/8
/9 Q
uad
Inve
rtin
g/ N
on-in
vert
ing
−40
to +
851.
215
/15
1840
/40
PDIP
, SOI
C
TC44
26A/
27A/
28A
Dual
Inve
rtin
g/No
n-in
vert
ing
−40
to +
125
1.5
9/9
1830
/30
PDIP
, SOI
C, D
FN
TC44
23A/
24A/
25A
Dual
Inve
rtin
g/No
n-in
vert
ing
−40
to +
125
33
(typ.
)/4
(typ.
)18
40 (t
yp.)/
40 (t
yp.)
PDIP
, SOI
C, D
FN
MCP
14E3
/E4/
E5 D
ual
Inve
rtin
g/No
n-in
vert
ing
−40
to +
125
43.
5/3.
018
55/5
5PD
IP, S
OIC,
DFN
MCP
14E6
/E7/
E8 D
ual
Inve
rtin
g/No
n-in
vert
ing/
Inve
rtin
g an
d No
n-in
vert
ing
−40
to +
125
22.
2/2.
818
45/4
5PD
IP, S
OIC,
DFN
MCP
14E9
/E10
/E11
Dua
lIn
vert
ing/
Non-
inve
rtin
g/In
vert
ing
and
Non-
inve
rtin
g−4
0 to
+12
53
2.2/
2.8
1875
/75
PDIP
, SOI
C, D
FN
MCP
1406
/07
Sing
leIn
vert
ing/
Non-
inve
rtin
g−4
0 to
+12
56
1.8/
2.0
(typ.
)18
30/3
0TO
-220
, PDI
P, S
OIC,
DFN
TC44
20/2
9In
vert
ing/
Non-
inve
rtin
g−4
0 to
+12
56
2.8/
2.5
1855
/55
TO-2
20, P
DIP,
SOI
C, D
FN
TC44
21A/
22A
Sing
leIn
vert
ing
/Non
-inve
rtin
g−4
0 to
+12
5 9
1.25
(typ
.)/1.
518
38/4
2 TO
-220
, PDI
P, S
OIC,
DFN
TC44
51/5
2 Si
ngle
Inve
rtin
g /N
on-in
vert
ing
−40
to +
125
120.
6 (ty
p.)/
1.5
1815
/15
TO-2
20, P
DIP,
SOI
C, D
FN, D
DPAK
TC44
31/3
2 Si
ngle
Inve
rtin
g /N
on-in
vert
ing
−40
to +
85
1.5
10/1
030
62/7
8PD
IP, S
OIC
Po
Wer
MA
nA
GeM
ent:
syn
chro
nous
buc
k H
igh-
sid
e D
rive
r
Prod
uct
Confi
gura
tion
ope
ratin
g te
mp
ran
ge (°
C)Pe
ak o
utpu
t Cur
rent
(A)
out
put r
esis
tanc
e (M
ax.@
25°
C)M
ax s
uppl
y Vo
ltage
(V)
inpu
t/o
utpu
t Del
ay (n
s)Pa
ckag
es
MCP
1470
0/14
628
Dual
inpu
t/Si
ngle
inpu
t−4
0 to
+85
2
2.5/
2.5
5 (V
dd),
36 (B
oot P
in)
18/2
0 SO
IC, D
FN
Po
Wer
MA
nA
GeM
ent:
bat
tery
Cha
rger
s
Prod
uct
Mod
eCe
ll ty
pe
# of
Ce
lls
Vcc
ran
ge
(V)
Cell
Volta
ge (V
) M
ax. C
harg
ing
Curr
ent (
mA)
M
ax. V
olta
ge
reg
ulat
ion
(%)
int/
ext F
et
Feat
ures
Pa
ckag
es
MCP
7311
3/14
/23
Line
ar
Li-io
n/Li
-Pol
ymer
and
LiF
ePO4
1 4
to 1
6 3.
6, 4
.1, 4
.2, 4
.35,
4.4
11
00
±0.5
In
t 6.
5/5.
8V O
verv
olta
ge p
rote
ctio
n, U
VLO,
The
rmal
regu
latio
n 10
-pin
3 ×
3 D
FN
MCP
7321
3/23
Li
near
Li
-ion/
Li-P
olym
er a
nd L
iFeP
O42
4 to
16
7.2,
8.2
, 8.4
, 8.7
, 8.8
11
00
±0.6
In
t 13
V Ov
ervo
ltage
pro
tect
ion
10-p
in 3
× 3
DFN
MCP
7383
0/L
Line
arLi
-ion/
Li-P
olym
er1
3.75
to 6
4.2
1000
/200
±0.7
5In
tSo
ft-st
art,
Char
ge e
nabl
e pi
n6-
pin
2 ×
2 TD
FN
MCP
7383
1/2
Line
ar
Li-Io
n/Li
-Pol
ymer
1
3.7
to 6
.0
4.2,
4.3
5, 4
.4, 4
.5
500
±0.7
5 In
t UV
LO, T
herm
al re
gula
tion,
Pro
gram
mab
le c
harg
e cu
rrent
, Tri-
stat
e or
ope
n-dr
ain
STAT
pin
8-
pin
2 ×
3 DF
N, 5
-pin
SOT
-23
MCP
7383
7/8
Line
ar
Li-Io
n/Li
-Pol
ymer
1
3.7
to 6
.0
4.2,
4.3
5, 4
.4, 4
.5
1000
±0
.75
Int
Dual
inpu
t (US
B/DC
) aut
o-sw
itchi
ng, T
herm
isto
r inp
ut, P
ower
Goo
d ou
tput
or T
imer
ena
ble
inpu
t 10
-pin
MSO
P, 1
0-pi
n 3
× 3
DFN
MCP
7387
1 Li
near
Li
-Ion/
Li-P
olym
er
1 3.
75 to
6.0
4.
1, 4
.2, 4
.35,
4.4
15
00 (A
/C A
dapt
er)
500
(USB
) ±0
.5
Int
Sim
ulta
neou
s ch
argi
ng o
f loa
d an
d ba
ttery
, Loa
d-de
pend
ent c
harg
ing,
Mul
tiple
pro
gram
mab
le
char
ge c
urre
nts
20-p
in 4
× 4
QFN
lin
eAr
: op
Am
ps
Prod
uct
# pe
r Pa
ckag
e G
bWP
(MH
z)iq
typ
ical
(μ
A)
Vos
Max
(m
V)
ope
ratin
g Vo
ltage
(V)
Pack
ages
Pr
oduc
t #
per
Pack
age
GbW
P (M
Hz)
iq t
ypic
al
(μA)
Vo
s M
ax
(mV)
o
pera
ting
Volta
ge (V
) Pa
ckag
es
MCP
661/
2/3/
4/5/
91/
2/1/
4/2/
460
6000
82.
5 to
5.5
SOIC
, MSO
P, D
FN, T
SSOP
, QFN
, SOT
MCP
6V26
/7/8
1/2/
12
620
0.00
22.
3 to
5.5
SOIC
, MSO
P, D
FN
MCP
651/
1S/2
/3/4
/5/9
1/
1/2/
1/4/
2/4
5060
00
0.2
2.5
to 5
.5
SOIC
, MSO
P, D
FN, T
SSOP
, QFN
, SOT
M
CP60
71/2
/41/
2/4
1.2
110
0.15
1.8
to 6
.0
SOIC
, TSS
OP, D
FN, S
OT
MCP
631/
2/3/
4/5/
91/
2/1/
4/2/
424
2500
82.
5 to
5.5
SOIC
, MSO
P, D
FN, T
SSOP
, QFN
, SOT
MCP
6H01
/2/4
1/2/
41.
213
54.
53.
5 to
16
SOIC
, TSS
OP, T
DFN,
SOT
, SC7
0
MCP
621/
1S/2
/3/4
/5/9
1/1/
2/1/
4/2/
420
2500
0.2
2.5
to 5
.5SO
IC, M
SOP,
DFN
, TSS
OP, Q
FN, S
OTM
CP60
01/2
/41/
2/4
110
0 4.
51.
8 to
6.0
PD
IP, S
OIC,
MSO
P, T
SSOP
, TDF
N, S
OT, S
C70
MCP
6H91
/2/4
1/2/
410
2000
43.
5 to
12.
0DF
N, S
OIC,
TSS
OPM
CP64
01/2
/41/
2/4
145
4.5
1.8
to 6
.0SO
IC, T
SSOP
, TDF
N, S
OT, S
C70
MCP
6021
/2/3
/4
1/2/
1/4
1010
00
0.5
2.5
to 5
.5
PDIP
, SOI
C, M
SOP,
TSS
OP, S
OT
MCP
6061
/2/4
1/2/
40.
7360
0.15
1.8
to 6
.0
SOIC
, TSS
OP, D
FN, S
OT
MCP
6291
/2/3
/4/5
1/
2/1/
4/2
1010
00
3 2.
4 to
6.0
PD
IP, S
OIC,
MSO
P, T
SSOP
, SOT
MCP
6241
/2/4
1/
2/4
0.55
50
5 1.
8 to
5.5
PD
IP, S
OIC,
MSO
P, T
SSOP
, TDF
N, S
OT, S
C70
MCP
6491
17.
553
01
2 to
5.5
SOT,
SC7
0M
CP60
51/2
/4
1/2/
40.
385
30
0.15
1.
8 to
6.0
SO
IC, T
SSOP
, DFN
, SOT
MCP
6H81
/2/4
1/2/
45.
570
04
3.5
to 1
2.0
DFN,
SOI
C, T
SSOP
MCP
6V31
10.
323
0.00
81.
8 to
5.5
SOT,
SC7
0
MCP
6281
/2/3
/4/5
1/
2/1/
4/2
544
5 3
2.2
to 6
.0
PDIP
, SOI
C, M
SOP,
TSS
OP, S
OTM
CP62
31/2
/4
1/2/
40.
320
5
1.
8 to
6.0
PD
IP, S
OIC,
MSO
P, T
SSOP
, TDF
N, S
OT, S
C70
MCP
6481
14
240
12
to 5
.5SO
T, S
C70
MCP
616/
7/8/
9 1/
2/1/
40.
1919
0.
15
2.3
to 5
.5
PDIP
, SOI
C, M
SOP,
TSS
OP
MCP
6286
1 3.
554
0 1.
5 2.
2 to
5.5
SO
T M
CP60
6/7/
8/9
1/2/
1/4
0.15
519
0.
25
2.5
to 6
.0
PDIP
, SOI
C, T
SSOP
, SOT
MCP
601/
2/3/
4 1/
2/1/
42.
823
0 2
2.7
to 6
.0
PDIP
, SOI
C, T
SSOP
, SOT
MCP
6141
/2/3
/4
1/2/
1/4
0.1
0.6
3 1.
4 to
6.0
PD
IP, S
OIC,
MSO
P, T
SSOP
, SOT
MCP
6H71
/2/4
1/2/
42.
748
04
3.5
to 1
2.0
DFN,
SOI
C, T
SSOP
MCP
6V11
10.
087.
50.
008
1.6
to 5
.5SO
T, S
C70
MCP
6271
/2/3
/4/5
1/2/
1/4/
22
170
3 2.
0 to
6.0
PD
IP, S
OIC,
MSO
P, T
SSOP
, SOT
MCP
6041
/2/3
/4
1/2/
1/4
0.01
40.
6 3
1.4
to 6
.0
PDIP
, SOI
C, M
SOP,
TSS
OP, S
OT
MCP
6471
12
100
12
to 5
.5SO
T, S
C70
MCP
6031
/2/3
/4
1/2/
1/4
0.01
0.9
0.15
1.
8 to
5.5
SO
IC, M
SOP,
TSS
OP, D
FN, S
OT
MCP
6V01
/2/3
1/2/
11.
330
00.
002
1.8
to 5
.5SO
IC, D
FN, T
DFN
MCP
6441
/2/4
1/2/
40.
009
0.45
4.5
1.4
to 6
.0SO
IC, M
SOP,
TSS
OP, S
OT, S
C70
MCP
6V06
/7/8
1/2/
11.
330
00.
003
1.8
to 5
.5SO
IC, D
FN, T
DFN
22 Focus Product Selector Guide
lin
eAr
: Com
para
tors
Prod
uct
# pe
r Pac
kage
ty
pica
l Pro
paga
tion
Del
ay (μ
s)
iq t
ypic
al (μ
A)
Vos
Max
(mV)
o
pera
ting
Volta
ge (V
) te
mpe
ratu
re r
ange
(°C)
Fe
atur
es
Pack
ages
MCP
6541
/2/3
/4
1/2/
1/4
4 1
5 1.
6 to
5.5
−4
0 to
+12
5 Pu
sh-P
ull,
Rail-
to-R
ail I
nput
/Out
put
PDIP
, SOI
C, M
SOP,
TSS
OP, S
OT, S
C70
MCP
6546
/7/8
/9
1/2/
1/4
4 1
5 1.
6 to
5.5
−4
0 to
+12
5 Op
en-d
rain
, 9V,
Rai
l-to-
Rail
Inpu
t/Ou
tput
PDIP
, SOI
C, M
SOP,
TSS
OP, S
OT, S
C70
MCP
65R4
1/6
14
2.5
101.
8 to
5.5
−40
to +
125
Inte
grat
ed V
reF (
1.21
V or
2.4
V)SO
T-23
MCP
6561
/2/4
1/
2/4
0.04
7 10
0 10
1.
8 to
5.5
−4
0 to
+12
5 Pu
sh-P
ull,
Rail-
to-R
ail I
nput
/Out
put
SOIC
, MSO
P, T
SSOP
, SOT
, SC7
0
MCP
6566
/7/9
1/
2/4
0.04
7 10
0 10
1.
8 to
5.5
−4
0 to
+12
5 Op
en-D
rain
, Rai
l-to-
Rail
Inpu
t/Ou
tput
SOIC
, MSO
P, T
SSOP
, SOT
, SC7
0
Mix
eD s
iGn
Al:
suc
cess
ive
App
roxi
mat
ion
reg
iste
r (s
Ar
) A
nalo
g-to
-Dig
ital C
onve
rter
s
Prod
uct
res
olut
ion
(bits
)M
axim
um s
ampl
ing
rat
e (k
sam
ples
/sec
)#
of in
put C
hann
els
inpu
t typ
ein
terf
ace
Max
. sup
ply
Curr
ent (
μA)
tem
pera
ture
ran
ge (°
C)Pa
ckag
es
MCP
3021
/322
110
/12
221
Sing
le-e
nded
I2 C
™25
0 −4
0 to
+12
5 SO
T-23
A
MCP
3001
/2/4
/8
10
200
1/2/
4/8
Sing
le-e
nded
SPI
500-
550
−40
to +
85
PDIP
, SOI
C, M
SOP,
TSS
OP
MCP
3201
/2/4
/812
10
0 1/
2/4/
8Si
ngle
-end
edSP
I 40
0-55
0 −4
0 to
+85
PD
IP, S
OIC,
MSO
P, T
SSOP
MCP
3301
/2/4
13
100
1/2/
4Di
ffere
ntia
lSP
I 45
0 −4
0 to
+85
PD
IP, S
OIC,
MSO
P, T
SSOP
Mix
eD s
iGn
Al:
Dig
ital-t
o-A
nalo
g Con
vert
ers
Prod
uct
res
olut
ion
(bits
) D
AC C
hann
els
inte
rfac
e Vo
ltage
ref
eren
ceo
utpu
t set
tling
ti
me
(μs)
Dn
l (±
lsb)
ty
pica
l ope
ratin
g Cu
rren
t (μA
)te
mpe
ratu
re r
ange
(°
C)Pa
ckag
es
MCP
47DA
16
1I2 C
™Vd
d6
0.25
130
−40
to +
125
SOT-
23
MCP
4706
/16/
268/
10/1
21
I2 CEx
t6
0.05
/0.1
88/0
.75
210
−40
to +
125
SOT-
23
MCP
4725
121
I2 CVd
d6
0.75
175
−40
to +
125
SOT-
23
MCP
4728
124
I2 CIn
t6
0.75
250
−40
to +
125
MSO
P
MCP
4801
/11/
218/
10/1
21
SPI
Int
4.5
0.5/
0.5/
0.75
330
−40
to +
125
PDIP
, SOI
C, M
SOP,
2x3
DFN
MCP
4802
/12/
228/
10/1
22
SPI
Int
4.5
0.5/
0.5/
0.75
415
−40
to +
125
MSO
P, P
DIP,
SOI
C
MCP
4901
/11/
218/
10/1
21
SPI
Ext
4.5
0.5/
0.5/
0.75
175
−40
to +
125
PDIP
, SOI
C, M
SOP,
2x3
DFN
MCP
4902
/12/
228/
10/1
22
SPI
Ext
4.5
0.5/
0.5/
0.75
350
−40
to +
125
PDIP
, SOI
C, T
SSOP
TC13
20/1
8/10
1SM
bus
Ext
100.
8/2
350
−40
to +
85M
SOP,
SOI
C
Mix
eD s
iGn
Al:
ene
rgy
Mea
sure
men
t iC
s
Prod
uct
Dyn
amic
r
ange
typi
cal
Accu
racy
AD
C Ch
anne
lsG
ain
sele
ctio
no
utpu
t typ
e ty
pica
l sup
ply
Curr
ent (
mA)
Anal
og
Volta
ge r
ange
(V)
Dig
ital
Volta
ge r
ange
(V)
tem
pera
ture
r
ange
(°C)
Pa
ckag
es
MCP
3911
24-b
it re
solu
tion
94.5
dB
SINA
D2
up to
32
SPI
1.7
2.7
to 3
.62.
7 to
3.6
−40
to +
125
SSOP
, QFN
MCP
3903
24-b
it re
solu
tion
91 d
B SI
NAD
6up
to 3
2SP
I8.
34.
5 to
5.5
2.7
to 3
.6−4
0 to
+12
5SS
OP
MCP
3905
A/06
A50
0:1
/100
0:1
0.1%
2up
to 3
2Ac
tive
powe
r pul
se3.
94.
5 to
5.5
4.5
to 5
.5−4
0 to
+12
5SS
OP
MCP
3909
1000
:10.
1%2
up to
16
Activ
e po
wer p
ulse
/SPI
3.9
4.5
to 5
.54.
5 to
5.5
−40
to +
125
SSOP
Mix
eD s
iGn
Al:
Cur
rent
/DC P
ower
Mea
sure
men
t iC
s
Prod
uct
# Cu
rren
t se
nsor
sD
escr
iptio
nFu
ll sc
ale
ran
ge
(mV)
Curr
ent M
easu
rem
ent
Max
. Acc
r. (%
)ef
fect
ive
sam
plin
g in
terv
al
Min
. to
Max
. (m
sec)
bus
Volta
ge
ran
ge (V
)#
tem
p. M
onito
rs
(am
bien
t, re
mot
e)te
mp.
Acc
urac
y ty
p./M
ax. (
°C)
Aler
t/th
erm
.Pe
ak
Det
ectio
nin
terf
ace
Pack
ages
PAC1
710
1Cu
rrent
/DC
Powe
r Sen
sor
10, 2
0, 4
0, 8
0±1
2.5
to 2
600
0 to
+40
N/A
n/a
1–
SMBu
S/I2 C
™10
-pin
DFN
PAC1
720
2Du
al C
urre
nt/
DC P
ower
Sen
sor
10, 2
0, 4
0, 8
0±1
2.5
to 2
600
0 to
+40
N/A
N/A
1–
SMBu
s/I2 C
10-p
in D
FN
EMC1
701/
2/4
1Cu
rrent
/DC
Powe
r Sen
sor
with
Tem
pera
ture
Mon
itorin
g10
, 20,
40,
80
±12.
5 to
260
0+3
to +
241,
0/1
/3±0
.25/
±1.0
2ü
SMBu
s/I2 C
12-p
in Q
FN, 1
0-pi
n M
SOP,
16-
pin
QFN,
14-
pin
SOIC
23Focus Product Selector Guide
Mix
eD s
iGn
Al:
Dig
ital P
oten
tiom
eter
s
Prod
uct
# of
ta
ps
Mem
ory
Chan
nels
inte
rfac
e r
esis
tanc
e (k
Ω)
tem
pera
ture
r
ange
(°C)
Pa
ckag
es
Prod
uct
# of
ta
ps
Mem
ory
Chan
nels
inte
rfac
e r
esis
tanc
e (k
Ω)
tem
pera
ture
r
ange
(°C)
Pa
ckag
es
MCP
4011
/12/
13/1
4 64
Vola
tile
1Up
/Dow
n 2.
1, 5
, 10,
50
−40
to +
125
DFN,
SOT
-23
MCP
4331
/32
129
Vola
tile
4SP
I 5,
10,5
0,10
0−4
0 to
+12
5TS
SOP,
QFN
MCP
4017
/18/
19
128
Vola
tile
1I2 C
™5,
10,
50,
100
−4
0 to
+12
5 SC
70
MCP
4351
/52
257
Vola
tile
4SP
I 5,
10,5
0,10
0−4
0 to
+12
5TS
SOP,
QFN
MCP
40D1
7/D1
8/D1
9 12
8Vo
latil
e 1
I2 C5,
10,
50,
100
−4
0 to
+12
5 SC
70
MCP
4431
/32
129
Vola
tile
4I2 C
5, 1
0, 5
0, 1
00−4
0 to
+12
5TS
SOP,
QFN
MCP
4021
/22/
23/2
4 64
Nonv
olat
ile
1Up
/Dow
n 2.
1, 5
, 10,
50
−40
to +
125
DFN,
SOT
-23
MCP
4441
/42
129
Nonv
olat
ile4
I2 C5,
10,
50,
100
−40
to +
125
TSSO
P, Q
FN
MCP
4141
/42
128
Nonv
olat
ile
1SP
I 5,
10,
50,
100
−4
0 to
+12
5 M
SOP,
QFN
, DFN
MCP
4451
/52
257
Vola
tile
4I2 C
5, 1
0, 5
0, 1
00−4
0 to
+12
5TS
SOP,
QFN
MCP
4241
/42
128
Nonv
olat
ile
2SP
I 5,
10,
50,
100
−4
0 to
+12
5 M
SOP,
QFN
, DFN
MCP
4461
/62
257
Nonv
olat
ile4
I2 C5,
10,
50,
102
−40
to +
125
TSSO
P, Q
FN
MCP
4131
/32
128
Vola
tile
1SP
I 5,
10,
50,
100
−4
0 to
+12
5 QF
N, D
FN
MCP
4531
/32
128
Vola
tile
1I2 C
5, 1
0, 5
0, 1
00
−40
to +
125
MSO
P, D
FN
MCP
4231
/32
128
Vola
tile
2SP
I 5,
10,
50,
100
−4
0 to
+12
5 M
SOP,
QFN
, DFN
MCP
4631
/32
128
Vola
tile
2I2 C
5, 1
0, 5
0, 1
00
−40
to +
125
MSO
P, D
FN
MCP
4151
/52
256
Vola
tile
1SP
I 5,
10,
50,
100
−4
0 to
+12
5 M
SOP,
QFN
, DFN
MCP
4541
/42
128
Nonv
olat
ile
1I2 C
5, 1
0, 5
0, 1
00
−40
to +
125
MSO
P, D
FN
MCP
4161
/62
256
Nonv
olat
ile
1SP
I 5,
10,
50,
100
−4
0 to
+12
5 M
SOP,
QFN
, DFN
MCP
4641
/42
128
Nonv
olat
ile
2I2 C
5, 1
0, 5
0, 1
00
−40
to +
125
MSO
P, D
FN
MCP
4251
/52
256
Vola
tile
2SP
I 5,
10,
50,
100
−4
0 to
+12
5 M
SOP,
QFN
, DFN
MCP
4551
/52
256
Vola
tile
1I2 C
5, 1
0, 5
0, 1
00
−40
to +
125
MSO
P, D
FN
MCP
4261
/62
256
Nonv
olat
ile
2SP
I 5,
10,
50,
100
−4
0 to
+12
5 M
SOP,
QFN
, DFN
MCP
4651
/52
256
Vola
tile
2I2 C
5, 1
0, 5
0, 1
00
−40
to +
125
MSO
P, D
FN
MCP
4341
/42
129
Nonv
olat
ile4
SPI
5, 1
0, 5
0, 1
00−4
0 to
+12
5TS
SOP,
QFN
MCP
4561
/62
256
Nonv
olat
ile
1I2 C
5, 1
0, 5
0, 1
00
−40
to +
125
MSO
P, D
FN
MCP
4361
/62
257
Nonv
olat
ile4
SPI
5, 1
0, 5
0, 1
00−4
0 to
+12
5TS
SOP,
QFN
MCP
4661
/62
256
Nonv
olat
ile
2I2 C
5, 1
0, 5
0, 1
00
−40
to +
125
MSO
P, D
FN
Mix
eD s
iGn
Al:
Del
ta s
igm
a A
nalo
g-to
-Dig
ital C
onve
rter
s
Prod
uct
res
olut
ion
(bits
)M
axim
um s
ampl
ing
rat
e (s
ampl
es/s
ec)
# of
inpu
t Cha
nnel
sin
terf
ace
typi
cal s
uppl
y Cu
rren
t (μA
)te
mpe
ratu
re r
ange
(°C)
Feat
ures
Pa
ckag
es
MCP
3421
/2/3
/418
to 1
2 4
to 2
40
1/2/
2/4
Diff
I2 C™
155
−40
to +
125
PGA,
Vre
FSO
IC, T
SSOP
, MSO
P, D
FN, S
OT
MCP
3425
/6/7
/816
to 1
215
to 2
401/
2/2/
4 Di
ffI2 C
155
−40
to +
125
PGA,
Vre
FSO
IC, T
SSOP
, MSO
P, D
FN, S
OT
MCP
3550
/1/3
22
13
/14/
601
Diff
SPI
120
−40
to +
125
50 &
60
Hz R
ejec
tion
SOIC
, MSO
P
inte
rFA
Ce:
Con
trol
ler
Are
a n
etw
ork
(CA
n),
infr
ared
, lin
tra
nsce
iver
s, e
ther
net,
ser
ial P
erip
hera
ls, U
sb
Prod
uct
Des
crip
tion
ope
ratin
g te
mpe
ratu
re
ran
ge (°
C)
oth
er F
eatu
res
Pack
ages
MCP
2515
Stan
d-al
one
CAN
cont
rolle
r with
SPI
Inte
rface
−40
to +
125
3 Tx
Buf
fers
, 2 R
x Buf
fers
, 6 F
ilter
s, 2
Mas
ks, I
nter
rupt
out
put,
MCP
2510
upg
rade
PDIP
, SOI
C, T
SSOP
, QFN
MCP
2551
CAN
(Con
trolle
r Are
a Ne
twor
k), H
igh-
spee
d CA
N tra
nsce
iver
−40
to +
125
1 M
bps
max
. CAN
bus
spe
ed, I
SO11
898
com
patib
le, I
ndus
try s
tand
ard
pino
utPD
IP, S
OIC
MCP
200(
3/4)
A, M
CP20
2(1/
2)A,
M
CP20
25, M
CP20
50LI
N (L
ocal
Inte
rcon
nect
Net
work
) tra
nsce
ivers
−40
to +
125
Prod
uct o
ptio
ns: S
tand
-alo
ne tr
ansc
eive
r, in
terg
rate
d V r
eg =
3.3
V or
5V
@ 7
0 m
A, in
tegr
ated
WW
DT, i
nteg
rate
d ra
tio-m
etric
bat
tery
mon
itor.
VCC
Rang
e =
6 to
18
V, M
ax B
aud
Rate
= 2
0 Kb
aud,
Com
plia
nt w
ith L
IN 1
.3, 2
.0 2
.1, S
AE J
2602
, Aut
omot
ive g
rade
PDIP
, SOI
C, T
SSOP
, DF
N, Q
FN
MCP
23X0
9/18
8-bi
t I/O
por
t exp
ande
r, 16
-bit
I/O
port
expa
nder
−40
to +
125
I2 C™
(up
to 3
.4 M
Hz) o
r SPI
(up
to 1
0 M
Hz) i
nter
face
, 25
mA
sour
ce/s
ink
per I
/OPD
IP, S
DIP,
SOI
C, S
SOP
MCP
212(
0/2)
, MCP
2140
A, M
CP21
5(0/
5)In
frare
d IrD
A en
code
rs, D
ecod
ers,
Pro
toco
l han
dler
s−4
0 to
+85
UART
to IR
enc
oder
/dec
oder
w/h
ardw
are
& so
ftwar
e ba
ud ra
te s
elec
tion,
IrDA
® st
anda
rd p
roto
col h
andl
er p
lus
enco
der/
deco
der
PDIP
, SDI
P, S
OIC,
SSO
P
MCP
2200
, MCP
2210
USB
Brid
ge P
rodu
cts:
USB
-to-U
ART,
USB
-to-S
PI−4
0 to
+85
Supp
orts
full
spee
d, U
SB 2
.0 c
ompl
iant
, int
egra
ted
PHY,
Tx/
Rx b
uffe
r size
64–
128
byte
s ea
ch, 8
–9 G
PIO,
Vdd
Ran
ge =
3.0
to 5
.5V
SOIC
, SSO
P, Q
FN
ENC2
8J60
Stan
d-al
one
10 B
ase-
T Et
hern
et c
ontro
ller w
ith S
PI in
terfa
ce−4
0 to
+85
Ethe
rnet
con
trolle
r, 8
KB R
AM B
uffe
r, In
tegr
ated
10
BASE
-T P
HYSP
DIP,
SOI
C, S
SOP,
QFN
ENC4
24J6
00St
and-
alon
e 10
/100
Bas
e-T
Ethe
rnet
con
trolle
r with
SPI
and
par
alle
l int
erfa
ce−4
0 to
+85
Ethe
rnet
con
trolle
r, 24
KB
RAM
Buf
fer,
Cryp
togr
aphi
c Se
curit
y En
gine
, 10/
100
Base
-T P
HYTQ
FP, Q
FN
ENC6
24J6
00St
and-
alon
e 10
/100
Bas
e-T
Ethe
rnet
con
trolle
r with
SPI
and
par
alle
l int
erfa
ce−4
0 to
+85
Ethe
rnet
con
trolle
r, 24
KB
RAM
Buf
fer,
Cryp
togr
aphi
c Se
curit
y En
gine
, 10/
100
Base
-T P
HYTQ
FP
inte
rFA
Ce:
Usb
Por
t Pow
er C
ontr
olle
rs w
ith C
harg
er e
mul
atio
n
Prod
uct
Des
crip
tion
Usb
Port
Pow
er s
witc
h (5
5 m
W)
Hi-s
peed
Usb
2.0
sw
itch
batt
ery
Char
ger
emul
atio
n Pr
ofile
s8
res
isto
r set
Cur
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st
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tion
& Un
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cal
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tion
& Un
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PDIP
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EU-
48™
MAC
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ser
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MeM
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bus
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Density
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Max. Clock Frequency
operating Voltage
temperature range
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Max. Write spreeds
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125°
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tile
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page
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(MC)
, 5-S
OT-2
3 (O
T)
24XX
01/0
14R
1 Kb
× 8
400
kHz
1.7V
–5.5
V 1.
5V–3
.6V
−40°
C to
+15
0°C
1M20
0 Ye
ars
5 m
s1
µAü
–W
, ½$0
.18
Addr
ess
pin
optio
n: c
onne
ct u
p to
8 d
evic
es o
n bu
s,
Very
low
volta
ge o
ptio
nPD
IP (P
), SO
IC (S
N), T
SSOP
(ST)
, MSO
P (M
NY),
DFN
(MC)
, 5-S
OT-2
3 (O
T), S
C70
(LT)
24XX
02/0
24/E
48R
2 Kb
× 8
400
kHz
1.7V
–5.5
V 1.
5V–3
.6V
−40°
C to
+12
5°C
1M20
0 Ye
ars
5 m
s1
µAü
–W
, ½$0
.20
Addr
ess
pin
optio
n –
conn
ect u
p to
8 d
evic
es o
n bu
s, V
ery
low
volta
ge
optio
n, U
niqu
e EU
I-48/
EUI-6
4 M
AC a
ddre
ss o
ptio
n av
aila
ble
PDIP
(P),
SOIC
(SN)
, TSS
OP (S
T), M
SOP
(MNY
), DF
N (M
C), 5
-SOT
-23
(OT)
, SC7
0 (L
T)
34XX
02R
2 Kb
× 8
1 M
Hz1.
7V–5
.5V
1.5V
–3.6
V−4
0°C
to +
125°
C1M
200
Year
s5
ms
1 µA
üü
W, ½
$0.1
8 1
MHz
@ 2
.5V,
Per
man
ent a
nd re
stab
le s
oftw
are
WP
– DI
MM
-DDR
2/3
PDIP
(P),
SOIC
(SN)
, TSS
OP (S
T), M
SOP
(MS)
, DFN
(MNY
), 6-
SOT-
23 (O
T),
24XX
00R
128
b×
840
0 kH
z1.
7V–5
.5V
−40°
C to
+12
5°C
1M20
0 Ye
ars
4 m
s1
µA–
––
$0.1
7 10
0 KH
z op
erat
ion
from
1.7
V to
4.5
VPD
IP (P
), SO
IC (S
N), T
SSOP
(ST)
, DFN
(MC)
, 5-S
OT-2
3 (O
T)
24XX
01/0
14R
1 Kb
× 8
400
kHz
1.7V
–5.5
V 1.
5V–3
.6V
−40°
C to
+15
0°C
1M20
0 Ye
ars
5 m
s1
µAü
–W
, ½$0
.18
Addr
ess
pin
optio
n: c
onne
ct u
p to
8 d
evic
es o
n bu
s,
Very
low
volta
ge o
ptio
nPD
IP (P
), SO
IC (S
N), T
SSOP
(ST)
, MSO
P (M
NY),
DFN
(MC)
, 5-S
OT-2
3 (O
T), S
C70
(LT)
24XX
02/0
24/E
48R
2 Kb
× 8
400
kHz
1.7V
–5.5
V 1.
5V–3
.6V
−40°
C to
+12
5°C
1M20
0 Ye
ars
5 m
s1
µAü
–W
, ½$0
.20
Addr
ess
pin
optio
n: c
onne
ct u
p to
8 d
evic
es o
n bu
s, V
ery
low
volta
ge
optio
n, U
niqu
e EU
I-48/
EUI-6
4 M
AC a
ddre
ss o
ptio
n av
aila
ble
PDIP
(P),
SOIC
(SN)
, TSS
OP (S
T), M
SOP
(MNY
), DF
N (M
C), 5
-SOT
-23
(OT)
, SC7
0 (L
T)
34XX
02R
2 Kb
× 8
1 M
Hz1.
7V–5
.5V
1.5V
–3.6
V−4
0°C
to +
125°
C1M
200
Year
s5
ms
1 µA
üü
W, ½
$0.1
8 1
MHz
@ 2
.5V,
Per
man
ent a
nd re
stab
le s
oftw
are
WP
– DI
MM
-DDR
2/3
PDIP
(P),
SOIC
(SN)
, TSS
OP (S
T), M
SOP
(MS)
, DFN
(MNY
), 6-
SOT-
23 (O
T)
24XX
04R
4 Kb
× 8
400
kHz
1.7V
–5.5
V−4
0°C
to +
125°
C1M
200
Year
s5
ms
1 µA
ü–
W, ½
$0.2
1 40
0 KH
z @
2.5
V, 1
6 by
te p
age
write
buf
fer,
No a
ddre
ss p
ins
PDIP
(P),
SOIC
(SN)
, TSS
OP (S
T), M
SOP
(MNY
), DF
N (M
C), 5
-SOT
-23
(OT)
, WLC
SP (C
S)
24XX
08R
8 Kb
× 8
400
kHz
1.7V
–5.5
V−4
0°C
to +
125°
C1M
200
Year
s5
ms
1 µA
ü–
W, ½
$0.2
3 40
0 KH
z @
2.5
V, 1
6 by
te p
age
write
buf
fer,
No a
ddre
ss p
ins
PDIP
(P),
SOIC
(SN)
, TSS
OP (S
T), M
SOP
(MS)
, DFN
(MNY
), 5-
SOT-
23 (O
T),
24XX
16R
16 K
b×
840
0 kH
z1.
7V–5
.5V
−40°
C to
+12
5°C
1M20
0 Ye
ars
5 m
s1
µAü
–W
, ½$0
.25
400
KHz
@ 2
.5V,
16
byte
pag
e wr
ite b
uffe
r, No
add
ress
pin
sPD
IP (P
), SO
IC (S
N), T
SSOP
(ST)
, MSO
P (M
NY),
DFN
(MC)
, 5-S
OT-2
3 (O
T), W
LCSP
(CS)
24XX
32A
R32
Kb
× 8
400
kHz
1.7V
–5.5
V−4
0°C
to +
125°
C1M
200
Year
s5
ms
1 µA
ü–
W, ¼
$0.3
1 40
0 KH
z @
2.5
V, 3
2 by
te p
age
write
buf
fer,
conn
ect u
p to
8 d
evic
es
on b
usPD
IP (P
), SO
IC (S
N), T
SSOP
(ST)
, MSO
P (M
NY),
DFN
(MC)
, 5-S
OT-2
3 (O
T), W
LCSP
(CS)
24XX
64/6
5R
64 K
b×
81
MHz
1.7V
–5.5
V−4
0°C
to +
125°
C1M
, 10
M20
0 Ye
ars
5 m
s1
µAü
–W
, ¼$0
.38
1 M
Hz @
2.5
V, 3
2/64
byt
e pa
ge, R
eloc
atab
le 4
Kb
bloc
k wi
th 1
0M
cycl
es e
ndur
ance
PDIP
(P),
SOIC
(SN)
, TSS
OP (S
T), M
SOP
(MNY
), DF
N (M
C), 5
-SOT
-23
(OT)
, WLC
SP (C
S)
24XX
128
R12
8 Kb
× 8
1 M
Hz1.
7V–5
.5V
−40°
C to
+12
5°C
1M20
0 Ye
ars
5 m
s1
µAü
–W
$0.5
4 1
MHz
@ 2
.5V,
64
byte
pag
e, C
onne
ct u
p to
8 d
evic
es o
n bu
sPD
IP (P
), SO
IC (S
N), T
SSOP
(ST)
, MSO
P (M
NY),
DFN
(MC)
, WLC
SP (C
S)
24XX
256
R25
6 Kb
× 8
1 M
Hz1.
7V–5
.5V
−40°
C to
+12
5°C
1M20
0 Ye
ars
5 m
s1
µAü
–W
$0.8
3 1
MHz
@ 2
.5V,
64
byte
pag
e, C
onne
ct u
p to
8 d
evic
es o
n bu
sPD
IP (P
), SO
IC (S
N), T
SSOP
(ST)
, SOI
J (S
M),
MSO
P (M
S), D
FN (M
F), W
LCSP
(CS)
24XX
512
R51
2 Kb
× 8
1 M
Hz1.
7V–5
.5V
−40°
C to
+12
5°C
1M20
0 Ye
ars
5 m
s1
µAü
–W
$1.5
0 1
MHz
@ 2
.5V,
128
byt
e pa
ge, C
onne
ct u
p to
8 d
evic
es o
n bu
sPD
IP (P
), SO
IC (S
N), T
SSOP
(ST)
, DFN
(MF)
, SOI
J (S
M),
WLC
SP (C
S)
24XX
1025
/26
R1
Mb
× 8
1 M
Hz1.
7V–5
.5V
−40°
C to
+12
5°C
1M20
0 Ye
ars
5 m
s5
µAü
–W
$3.1
4 1
MHz
@ 2
.5V,
128
byt
e pa
ge, C
onne
ct u
p to
4 d
evic
es o
n bu
sPD
IP (P
), SO
IC (S
N), S
OIJ
(SM
)
24XX
1024
NR1
Mb
× 8
1 M
Hz2.
5V–5
.5V
−40°
C to
+12
5°C
1M20
0 Ye
ars
5 m
s5
µAü
–W
–1
MHz
@ 2
.5V,
256
byt
e pa
ge,C
onne
ct u
p to
4 d
evic
es o
n bu
sPD
IP (P
), SO
IC (S
N), T
SSOP
(ST)
, DFN
(MF)
, SOI
J (S
M)
1: A
ll de
vice
s ar
e Pb
-Fre
e an
d Ro
HS
com
plia
nt.
2: E
SD p
rote
ctio
n >
4kV
(HBM
); >
400V
(MM
) on
all p
ins.
3
: Writ
e Pr
otec
t (W
P); W
= W
hole
Arr
ay, ½
= H
alf A
rray
, ¼ Q
uart
er A
rray
. 4
: Fac
tory
pro
gram
and
uni
que
ID o
ptio
ns a
vaila
ble.
5
: Die
and
waf
er o
ptio
ns a
vaila
ble
on a
ll de
vice
s.
† Pr
icin
g su
bjec
t to
chan
ge; p
leas
e co
ntac
t you
r Mic
roch
ip re
pres
enta
tive
for m
ost c
urre
nt p
ricin
g.
26 Focus Product Selector Guide
ser
iAl
MeM
or
Y P
ro
DU
Cts
bus
Prod
uct
released (r) not released (nr)
Density
organization
Max. Clock Frequency
operating Voltage
temperature range
e/W endurance (Minimum)
Data retention (Minimum)
Max. Write spreeds
Max. standby Current (@ 5.5V, 85°C)
Writ
e Pr
otec
t
Protected Array size
5 ku Pricing†
spec
ial/
Uniq
ue F
eatu
res
Pack
ages
Hardware
software
ser
ial e
erP
oM
(Con
t.)
Microwire
93XX
46A/
B/C
R1
Kb×
8/×
163
MHz
1.8V
–5.5
V−4
0°C
to +
125°
C1M
200
Year
s6
ms
1 µA
––
–$0
.18
ORG
pin
to s
elec
t wor
d si
ze o
n 46
C ve
rsio
nPD
IP (P
), SO
IC (S
N), T
SSOP
(ST)
, MSO
P (M
S), D
FN (M
NY),
6-SO
T-23
(OT)
93XX
56A/
B/C
R2
Kb×
8/×
163
MHz
1.8V
–5.5
V−4
0°C
to +
125°
C1M
200
Year
s6
ms
1 µA
––
–$0
.20
ORG
pin
to s
elec
t wor
d si
ze in
56C
ver
sion
PDIP
(P),
SOIC
(SN)
, TSS
OP (S
T), M
SOP
(MS)
, DFN
(MNY
), 6-
SOT-
23 (O
T)
93XX
66A/
B/C
R4
Kb×
8/×
163
MHz
1.8V
–5.5
V−4
0°C
to +
125°
C1M
200
Year
s6
ms
1 µA
––
–$0
.21
ORG
pin
to s
elec
t wor
d si
ze in
66C
ver
sion
PDIP
(P),
SOIC
(SN)
, TSS
OP (S
T), M
SOP
(MS)
, DFN
(MNY
), 6-
SOT-
23 (O
T)
93XX
76A/
B/C
R8
Kb×
8/×
163
MHz
1.8V
–5.5
V−4
0°C
to +
125°
C1M
200
Year
s6
ms
1 µA
ü–
W$0
.30
ORG
pin
to s
elec
t wor
d si
ze in
76C
ver
sion
PDIP
(P),
SOIC
(SN)
, TSS
OP (S
T), M
SOP
(MS)
, DFN
(MNY
), 6-
SOT-
23 (O
T)
93XX
86A/
B/C
R16
Kb
× 8/
× 16
3 M
Hz1.
8V–5
.5V
−40°
C to
+12
5°C
1M20
0 Ye
ars
6 m
s1
µAü
–W
$0.3
3 OR
G pi
n to
sel
ect w
ord
size
in 8
6C v
ersi
onPD
IP (P
), SO
IC (S
N), T
SSOP
(ST)
, MSO
P (M
S), D
FN (M
NY),
6-SO
T-23
(OT)
sPi
25XX
010A
R1
Kb×
810
MHz
1.8V
–5.5
V−4
0°C
to +
150°
C1M
200
Year
s5
ms
1 µA
üü
W, ½
, ¼$0
.30
5 M
Hz @
2.5
V, S
tatu
s re
gist
er, 1
6 by
te p
age
PDIP
(P),
SOIC
(SN)
, TSS
OP (S
T), M
SOP
(MS)
, DFN
(MNY
), 6-
SOT-
23 (O
T)
25XX
020A
/E48
R2
Kb×
810
MHz
1.8V
–5.5
V−4
0°C
to +
150°
C1M
200
Year
s5
ms
1 µA
üü
W, ½
, ¼$0
.31
5 M
Hz @
2.5
V, S
tatu
s re
gist
er, 1
6 by
te p
age,
Uni
que
EUI-4
8™/E
UI-6
4™
MAC
add
ress
opt
ion
avai
labl
ePD
IP (P
), SO
IC (S
N), T
SSOP
(ST)
, MSO
P (M
S), D
FN (M
NY),
6-SO
T-23
(OT)
25XX
040A
R4
Kb×
810
MHz
1.8V
–5.5
V−4
0°C
to +
150°
C1M
200
Year
s5
ms
1 µA
üü
W, ½
, ¼$0
.33
5 M
Hz @
2.5
V, S
tatu
s re
gist
er, 1
6 by
te p
age
PDIP
(P),
SOIC
(SN)
, TSS
OP (S
T), M
SOP
(MS)
, DFN
(MNY
), 6-
SOT-
23 (O
T)
25XX
080C
/DR
8 Kb
× 8
10 M
Hz1.
8V–5
.5V
−40°
C to
+15
0°C
1M20
0 Ye
ars
5 m
s1
µAü
üW
, ½, ¼
$0.4
0 16
/32
byte
pag
e, 5
MHz
@ 2
.5V,
Sta
tus
regi
ster
PDIP
(P),
SOIC
(SN)
, TSS
OP (S
T), M
SOP
(MS)
, DFN
(MNY
)
25XX
160C
/DR
16 K
b×
810
MHz
1.8V
–5.5
V−4
0°C
to +
150°
C1M
200
Year
s5
ms
1 µA
üü
W, ½
, ¼$0
.41
16/3
2 by
te p
age,
5 M
Hz @
2.5
V, S
tatu
s re
gist
erPD
IP (P
), SO
IC (S
N), T
SSOP
(ST)
, MSO
P (M
S), D
FN (M
NY)
25XX
320A
R32
Kb
× 8
10 M
Hz1.
8V–5
.5V
−40°
C to
+15
0°C
1M20
0 Ye
ars
5 m
s1
µAü
üW
, ½, ¼
$0.4
5 5
MHz
@ 2
.5V,
Sta
tus
regi
ster
, 32
byte
pag
ePD
IP (P
), SO
IC (S
N), T
SSOP
(ST)
, MSO
P (M
S), D
FN (M
NY)
25XX
640A
R64
Kb
× 8
10 M
Hz1.
8V–5
.5V
−40°
C to
+15
0°C
1M20
0 Ye
ars
5 m
s1
µAü
üW
, ½, ¼
$0.4
6 5
MHz
@ 2
.5V,
Sta
tus
regi
ster
, 32
byte
pag
ePD
IP (P
), SO
IC (S
N), T
SSOP
(ST)
, MSO
P (M
S), D
FN (M
NY, M
F),
25XX
128
R12
8 Kb
× 8
10 M
Hz1.
8V–5
.5V
−40°
C to
+15
0°C
1M20
0 Ye
ars
5 m
s1
µAü
üW
, ½, ¼
$0.7
4 5
MHz
@ 2
.5V,
Sta
tus
regi
ster
, 64
byte
pag
ePD
IP (P
), SO
IC (S
N), T
SSOP
(ST)
, DFN
(MF)
25XX
256
R25
6 Kb
× 8
10 M
Hz1.
8V–5
.5V
−40°
C to
+15
0°C
1M20
0 Ye
ars
5 m
s1
µAü
üW
, ½, ¼
$1.0
1 5
MHz
@ 2
.5V,
Sta
tus
regi
ster
, 64
byte
pag
ePD
IP (P
), SO
IC (S
N), T
SSOP
(ST)
, DFN
(MF)
, SOI
J (S
M)
25XX
512
R51
2 Kb
× 8
20 M
Hz1.
8V–5
.5V
−40°
C to
+12
5°C
1M20
0 Ye
ars
5 m
s10
µA
üü
W, ½
, ¼$1
.53
10 M
Hz @
2.5
V, D
eep
powe
r dow
n, S
tatu
s re
gist
er, P
age/
sect
or/c
hip
eras
ePD
IP (P
), SO
IC (S
N), D
FN (M
F), S
OIJ
(SM
)
25XX
1024
R1
Mb
× 8
20 M
Hz1.
8V–5
.5V
−40°
C to
+12
5°C
1M20
0 Ye
ars
6 m
s12
µA
üü
W, ½
, ¼$2
.59
10 M
Hz @
2.5
V, D
eep
powe
r dow
n, S
tatu
s re
gist
er, P
age/
sect
or/c
hip
eras
ePD
IP (P
), DF
N (M
F), S
OIJ
(SM
)
1: A
ll de
vice
s ar
e Pb
-Fre
e an
d Ro
HS
com
plia
nt.
2: E
SD p
rote
ctio
n >
4kV
(HBM
); >
400V
(MM
) on
all p
ins.
3
: Writ
e Pr
otec
t (W
P); W
= W
hole
Arr
ay, ½
= H
alf A
rray
, ¼ Q
uart
er A
rray
. 4
: Fac
tory
pro
gram
and
uni
que
ID o
ptio
ns a
vaila
ble.
5
: Die
and
waf
er o
ptio
ns a
vaila
ble
on a
ll de
vice
s.
† Pr
icin
g su
bjec
t to
chan
ge; p
leas
e co
ntac
t you
r Mic
roch
ip re
pres
enta
tive
for m
ost c
urre
nt p
ricin
g.
27Focus Product Selector Guide
ser
iAl
FlA
sH
MeM
or
Ybus
Prod
uct
released (r) not released (nr)
Density
organization
Max. Clock Frequency
operating Voltage
temperature range
e/W endurance (Minimum)
Data retention (Minimum)
Write spped (typical)
Writ
e Pr
otec
t
spec
ial/
Uniq
ue F
eatu
res
Pack
ages
*
Max. standby Current
Hardware
software
Protected Array size
×1
SST2
5VF5
12A
R51
2 Kb
64K
× 8
33 M
Hz2.
7–3.
6V 0
°C to
70°
C −4
0°C
to +
85°C
−2
0 to
+85
°C
100,
000
cycl
es (t
ypic
al)
100
year
s14
µs
(Byt
e Pr
ogra
m)
8 µA
üü
Vario
usAu
to a
ddre
ss in
crem
ent p
rogr
amm
ing,
Fas
t rea
d, p
rogr
am a
nd e
rase
8L-S
OIC,
8C-
WSO
N,
8B-X
FBGA
SST2
5VF0
10A
R1
Mb
128K
× 8
33 M
Hz2.
7–3.
6V 0
°C to
70°
C −4
0°C
to +
85°C
−2
0 to
+85
°C
100,
000
cycl
es (t
ypic
al)
100
year
s14
µs
(Byt
e Pr
ogra
m)
8 µA
üü
Vario
usAu
to a
ddre
ss in
crem
ent p
rogr
amm
ing,
Fas
t rea
d, p
rogr
am a
nd e
rase
8L-S
OIC,
8C-
WSO
N,
8B-X
FBGA
SST2
5VF0
20B
R2
Mb
256K
× 8
80 M
Hz2.
7–3.
6V 0
°C to
70°
C −4
0°C
to +
85°C
10
0,00
0 cy
cles
(typ
ical
)10
0 ye
ars
7 µs
(Wor
d Pr
ogra
m)
5 µA
üü
Vario
usAu
to a
ddre
ss in
crem
ent p
rogr
amm
ing,
Fas
t rea
d, p
rogr
am a
nd e
rase
8L-S
OIC,
8C-
WSO
N
SST2
5PF0
20B
R2
Mb
256K
× 8
40 M
Hz2.
3–3.
6V 0
°C to
70°
C −4
0°C
to +
85°C
100,
000
cycl
es (t
ypic
al)
100
year
s7
µs (W
ord
Prog
ram
)5
µAü
üVa
rious
Auto
add
ress
incr
emen
t pro
gram
min
g, F
ast r
ead,
pro
gram
and
era
se8L
-SOI
C, 8
C-W
SON
SST2
5WF0
20A
NR2
Mb
256K
× 8
40 M
Hz1.
65–1
.95V
0°C
to 7
0°C
−40°
C to
+85
°C10
0,00
0 cy
cles
(typ
ical
)20
yea
rs3
ms
(Pag
e Pr
ogra
m)
10 µ
Aü
üVa
rious
Sing
le-in
put p
age
prog
ram
, Fas
t rea
d, p
rogr
am a
nd e
rase
8L-S
OIC,
8C-
WSO
N
SST2
5VF0
40B
R4
Mb
512K
× 8
80 M
Hz2.
7–3.
6V−4
0°C
to +
85°C
100,
000
cycl
es (t
ypic
al)
100
year
s7
µs (W
ord
Prog
ram
)5
µAü
üVa
rious
Auto
add
ress
incr
emen
t pro
gram
min
g, F
ast r
ead,
pro
gram
and
era
se8L
-SOI
C, 8
C-W
SON,
8B
-XFB
GA
SST2
5PF0
40B
R4
Mb
512K
× 8
40 M
Hz2.
3–3.
6V 0
°C to
70°
C −4
0°C
to +
85°C
100,
000
cycl
es (t
ypic
al)
100
year
s7
µs (W
ord
Prog
ram
)5
µAü
üVa
rious
Auto
add
ress
incr
emen
t pro
gram
min
g, F
ast r
ead,
pro
gram
and
era
se8L
-SOI
C, 8
C-W
SON
SST2
5VF0
80B
R8
Mb
1M ×
880
MHz
2.7–
3.6V
−40°
C to
+85
°C10
0,00
0 cy
cles
(typ
ical
)10
0 ye
ars
7 µs
(Wor
d Pr
ogra
m)
5 µA
üü
Vario
usAu
to a
ddre
ss in
crem
ent p
rogr
amm
ing,
Fas
t rea
d, p
rogr
am a
nd e
rase
8L-S
OIC,
8C-
WSO
N,
8B-X
FBGA
SST2
5PF0
80B
R8
Mb
1M ×
840
MHz
2.3–
3.6V
0°C
to 7
0°C
−40°
C to
+85
°C10
0,00
0 cy
cles
(typ
ical
)10
0 ye
ars
7 µs
(Wor
d Pr
ogra
m)
5 µA
üü
Vario
usAu
to a
ddre
ss in
crem
ent p
rogr
amm
ing,
Fas
t rea
d, p
rogr
am a
nd e
rase
8L-S
OIC,
8C-
WSO
N
SST2
5VF0
16B
R16
Mb
2M ×
875
MHz
2.7–
3.6V
−40°
C to
+85
°C10
0,00
0 cy
cles
(typ
ical
)10
0 ye
ars
7 µs
(Wor
d Pr
ogra
m)
5 µA
üü
Vario
usAu
to a
ddre
ss in
crem
ent p
rogr
amm
ing,
Fas
t rea
d, p
rogr
am a
nd e
rase
8L-S
OIC,
8C-
WSO
N
SST2
5VF0
32B
R32
Mb
4M ×
880
MHz
2.7–
3.6V
−40°
C to
+85
°C10
0,00
0 cy
cles
(typ
ical
)10
0 ye
ars
7 µs
(Wor
d Pr
ogra
m)
5 µA
üü
Vario
usAu
to a
ddre
ss in
crem
ent p
rogr
amm
ing,
Fas
t rea
d, p
rogr
am a
nd e
rase
8L-S
OIC,
8C-
WSO
N
×1, ×2
SST2
5WF0
40B
NR4
Mb
512K
× 8
40 M
Hz1.
65–1
.95V
0°C
to 7
0°C
−40°
C to
+85
°C10
0,00
0 cy
cles
(typ
ical
)20
yea
rs1
ms
(Pag
e Pr
ogra
m)
10 µ
Aü
üVa
rious
Dual
out
put a
nd d
ual I
/O re
ad, S
ingl
e- a
nd d
ual-in
put p
age
prog
ram
, Fas
t rea
d,
prog
ram
and
era
se8L
-SOI
C, 8
C-W
SON
SST2
5WF0
80B
NR8
Mb
1M ×
840
MHz
1.65
–1.9
5V 0
°C to
70°
C −4
0°C
to +
85°C
100,
000
cycl
es (t
ypic
al)
20 y
ears
1 m
s (P
age
Prog
ram
)10
µA
üü
Vario
usDu
al o
utpu
t and
dua
l I/O
read
, Sin
gle-
and
dua
l-inp
ut p
age
prog
ram
, Fa
st re
ad, p
rogr
am a
nd e
rase
8L-S
OIC,
8C-
WSO
N
SST2
5VF0
64C
R64
Mb
8M ×
880
MHz
2.7–
3.6V
−40°
C to
+85
°C10
0,00
0 cy
cles
(typ
ical
)10
0 ye
ars
1.5
ms
(Pag
e Pr
ogra
m)
5 µA
üü
Vario
usDu
al o
utpu
t and
dua
l I/O
read
, Sin
gle-
and
dua
l-inp
ut p
age
prog
ram
, One
-tim
e pr
ogra
mm
able
ar
ea, F
ast r
ead,
pro
gram
and
era
se
8L-S
OIC,
8C-
WSO
N,
16L-
SOIC
×4
SST2
6VF0
16R
16 M
b2M
× 8
80 M
Hz2.
7–3.
6V−4
0°C
to +
85°C
100,
000
cycl
es
(min
imum
)10
0 ye
ars
1 m
s (P
age
Prog
ram
)8
µAü
üVa
rious
SQI™
Qua
d I/
O re
ad/p
rogr
am/e
rase
, Bur
st re
ad, I
ndex
jum
p fe
atur
e, In
divid
ual b
lock
read
and
wr
ite p
rote
ctio
n. F
ast r
ead,
pro
gram
and
era
se
8L-S
OIC,
8C-
WSO
N
SST2
6VF0
32R
32 M
b4M
× 8
80 M
Hz2.
7–3.
6V−4
0°C
to +
85°C
100,
000
cycl
es
(min
imum
)10
0 ye
ars
1 m
s (P
age
Prog
ram
)8
µAü
üVa
rious
SQI Q
uad
I/O
read
/pro
gram
/era
se, B
urst
read
, Ind
ex ju
mp
feat
ure,
Indi
vidua
l blo
ck re
ad a
nd
write
pro
tect
ion.
Fas
t rea
d, p
rogr
am a
nd e
rase
8L
-SOI
C, 8
C-W
SON
×1, ×2, ×4
SST2
6WF0
80B
NR8
Mb
1M ×
810
4 M
Hz1.
65–1
.95V
0°C
to 7
0°C
−40°
C to
+85
°C
100,
000
cycl
es
(min
imum
)10
0 ye
ars
1 m
s (P
age
Prog
ram
)3
µAü
üVa
rious
×1, ×
2, ×
4 re
ad, S
ingl
e-an
d qu
ad-in
put p
age
prog
ram
, Bur
st re
ad, W
rite
susp
end,
Indi
vidua
l bl
ock
read
and
writ
e pr
otec
tion,
Fas
t rea
d, p
rogr
am a
nd e
rase
8L
-SOI
C, 8
C-W
SON
SST2
6WF0
16B
NR16
Mb
2M ×
810
4 M
Hz1.
65–1
.95V
0°C
to 7
0°C
−40°
C to
+85
°C
100,
000
cycl
es
(min
imum
)10
0 ye
ars
1 m
s (P
age
Prog
ram
)3
µAü
üVa
rious
×1, ×
2, ×
4 re
ad, S
ingl
e-an
d qu
ad-in
put p
age
prog
ram
, Bur
st re
ad, W
rite
susp
end,
Indi
vidua
l bl
ock
read
and
writ
e pr
otec
tion,
Fas
t rea
d, p
rogr
am a
nd e
rase
8L
-SOI
C, 8
C-W
SON
SST2
6VF0
32B/
BANR
32 M
b4M
× 8
104
MHz
2.7–
3.6V
0°C
to 7
0°C
−40°
C to
+85
°C
100,
000
cycl
es
(min
imum
)10
0 ye
ars
1 m
s (P
age
Prog
ram
)15
µA
üü
Vario
us×1
, ×2,
x×4
read
, Sin
gle-
and
quad
-inpu
t pag
e pr
ogra
m, B
urst
read
, Writ
e su
spen
d, In
divid
ual
bloc
k re
ad a
nd w
rite
prot
ectio
n, F
ast r
ead,
pro
gram
and
era
se
8L-S
OIC,
8C-
WSO
N
SST2
6VF0
64B/
BANR
64 M
b8M
× 8
104
MHz
2.7–
3.6V
0°C
to 7
0°C
−40°
C to
+85
°C
100,
000
cycl
es
(min
imum
)10
0 ye
ars
1 m
s (P
age
Prog
ram
)15
µA
üü
Vario
us×1
, ×2,
×4
read
, Sin
gle-
and
quad
-inpu
t pag
e pr
ogra
m, B
urst
read
, Writ
e su
spen
d, In
divid
ual
bloc
k re
ad a
nd w
rite
prot
ectio
n, F
ast r
ead,
pro
gram
and
era
se
8L-S
OIC,
8C-
WSO
N
*Onl
y st
anda
rd p
acka
ges
are
liste
d he
re. P
leas
e in
quire
with
you
r loc
al s
ales
offi
ce fo
r dev
ices
in d
ie fo
rm o
r in
chip
-sca
le p
acka
ges.
lPC F
irM
WA
re
FlA
sH
/Fir
MW
Ar
e H
Ub
FlA
sH
MeM
or
Y
bus
Prod
uct
released (r) not released (nr)
Density
organization
Max. Clock Frequency
operating Voltage
temperature range
e/W endurance (Minimum)
Data retention (Minimum)
Write spped (typical)
Writ
e Pr
otec
t
spec
ial/
Uniq
ue F
eatu
res
Pack
ages
Max. standby Current
Hardware
software
Protected Array size
×4
SST4
9LF0
08A
R8
Mb
1M ×
833
MHz
3.0–
3.6V
0°C
to 7
0°C
100,
000
cycl
es (m
inim
um)
100
year
s14
µs
(Byt
e Pr
ogra
m)
14 µ
Aü
üVa
rious
Firm
ware
Hub
(FW
H) d
evic
e fo
r PC-
BIOS
app
licat
ion,
pro
vide
prot
ectio
n fo
r the
sto
rage
and
upd
ate
of c
ode
and
data
32
L-PL
CC,
32L-
TSOP
SST4
9LF0
16C
R16
Mb
2M ×
833
MHz
3.0–
3.6V
0°C
to 7
0°C
100,
000
cycl
es (m
inim
um)
100
year
s14
µs
(Byt
e Pr
ogra
m)
14 µ
Aü
üVa
rious
Firm
ware
Hub
(FW
H) d
evic
e fo
r PC-
BIOS
app
licat
ion,
pro
vide
prot
ectio
n fo
r the
sto
rage
and
upd
ate
of c
ode
and
data
32
L-PL
CC,
32L-
TSOP
SST4
9LF0
80A
R8
Mb
1M ×
833
MHz
3.0–
3.6V
0°C
to 7
0°C
100,
000
cycl
es (m
inim
um)
100
year
s14
µs
(Byt
e Pr
ogra
m)
14 µ
Aü
üVa
rious
LPC
Flas
h de
vices
com
ply
with
the
stan
dard
Inte
l Low
Pin
Cou
nt (L
PC) I
nter
face
Spe
cific
atio
n 1.
1, p
rovid
e pr
otec
tion
for t
he s
tora
ge a
nd u
pdat
e of
cod
e an
d da
ta32
L-PL
CC,
32L-
TSOP
SST4
9LF1
60C
R16
Mb
2M ×
833
MHz
3.0–
3.6V
0°C
to 7
0°C
100,
000
cycl
es (m
inim
um)
100
year
s14
µs
(Byt
e Pr
ogra
m)
14 µ
Aü
üVa
rious
LPC
Flas
h de
vices
com
ply
with
the
stan
dard
Inte
l Low
Pin
Cou
nt (L
PC) I
nter
face
Spe
cific
atio
n 1.
1, p
rovid
e pr
otec
tion
for t
he s
tora
ge a
nd u
pdat
e of
cod
e an
d da
ta32
L-PL
CC
28 Focus Product Selector Guide
PAr
All
el F
lAsH
MeM
or
Ybus
Prod
uct*
released (r) not released (nr)
Density
organization
Max. Clock Frequency
operating Voltage
temperature range
e/W endurance (Minimum)
Data retention (Minimum)
Write spped (typical)
Writ
e Pr
otec
t
spec
ial/
Uniq
ue F
eatu
res
Pack
ages
**
Max. standby Current
Hardware
software
Protected Array size
×8
SST3
9SF0
10A
R1
Mb
128K
× 8
45/7
0 ns
4.5–
5.5V
0°C
to 7
0°C
−40°
C to
+85
°C
100,
000
cycl
es10
0 ye
ars
14 µ
s (B
yte
Prog
ram
)30
µA
––
N/A
Fast
read
, pro
gram
and
era
se; L
ow p
ower
; Sm
all e
rase
sec
tor
32L-
PLCC
, 32L
-PDI
P, 3
2L-T
SOP
SST3
9LF0
10R
1 M
b51
2K ×
845
ns
3.0–
3.6V
0°C
to 7
0°C
100,
000
cycl
es10
0 ye
ars
14 µ
s (B
yte
Prog
ram
)1
µA–
–N/
AFa
st re
ad, p
rogr
am a
nd e
rase
; Low
pow
er; S
mal
l era
se s
ecto
r48
B-TF
BGA,
32L
-TSO
P, 3
2L-P
LCC
SST3
9VF0
10R
1 M
b51
2K ×
870
ns
2.7–
3.6V
0°C
to 7
0°C
−40°
C to
+85
°C
100,
000
cycl
es10
0 ye
ars
14 µ
s (B
yte
Prog
ram
)1
µA–
–N/
AFa
st re
ad, p
rogr
am a
nd e
rase
; Low
pow
er; S
mal
l era
se s
ecto
r48
B-TF
BGA,
32L
-TSO
P, 3
2L-P
LCC
SST3
9LF0
20R
2 M
b51
2K ×
845
ns
3.0–
3.6V
0°C
to 7
0°C
100,
000
cycl
es10
0 ye
ars
14 µ
s (B
yte
Prog
ram
)1
µA–
–N/
AFa
st re
ad, p
rogr
am a
nd e
rase
; Low
pow
er; S
mal
l era
se s
ecto
r48
B-TF
BGA,
32L
-TSO
P, 3
2L-P
LCC
SST3
9SF0
20A
R2
Mb
256K
× 8
45/5
5/70
ns
4.5–
5.5V
0°C
to 7
0°C
−40°
C to
+85
°C
100,
000
cycl
es10
0 ye
ars
14 µ
s (B
yte
Prog
ram
)30
µA
––
N/A
Fast
read
, pro
gram
and
era
se; L
ow p
ower
; Sm
all e
rase
sec
tor
32L-
PLCC
, 32L
-PDI
P, 3
2L-T
SOP
SST3
9VF0
20R
2 M
b51
2K ×
870
ns
2.7–
3.6V
0°C
to 7
0°C
−40°
C to
+85
°C
100,
000
cycl
es10
0 ye
ars
14 µ
s (B
yte
Prog
ram
)1
µA–
–N/
AFa
st re
ad, p
rogr
am a
nd e
rase
; Low
pow
er; S
mal
l era
se s
ecto
r48
B-TF
BGA,
32L
-TSO
P, 3
2L-P
LCC
SST3
9SF0
40R
4 M
b51
2K ×
845
/70
ns4.
5–5.
5V 0
°C to
70°
C −4
0°C
to +
85°C
10
0,00
0 cy
cles
100
year
s14
µs
(Byt
e Pr
ogra
m)
30 µ
A–
–N/
AFa
st re
ad, p
rogr
am a
nd e
rase
; Low
pow
er; S
mal
l era
se s
ecto
r32
L-PL
CC, 3
2L-P
DIP,
32L
-TSO
P
SST3
9LF0
40R
4 M
b51
2K ×
845
ns
3.0–
3.6V
0°C
to 7
0°C
100,
000
cycl
es10
0 ye
ars
14 µ
s (B
yte
Prog
ram
)1
µA–
–N/
AFa
st re
ad, p
rogr
am a
nd e
rase
; Low
pow
er; S
mal
l era
se s
ecto
r48
B-TF
BGA,
32L
-TSO
P, 3
2L-P
LCC
SST3
9VF0
40R
4 M
b51
2K ×
870
ns
2.7–
3.6V
0°C
to 7
0°C
−40°
C to
+85
°C
100,
000
cycl
es10
0 ye
ars
14 µ
s (B
yte
Prog
ram
)1
µA–
–N/
AFa
st re
ad, p
rogr
am a
nd e
rase
; Low
pow
er; S
mal
l era
se s
ecto
r48
B-TF
BGA,
32L
-TSO
P, 3
2L-P
LCC
SST3
9VF1
68X
R16
Mb
2M ×
870
ns
2.7–
3.6V
0°C
to 7
0°C
−40°
C to
+85
°C
100,
000
cycl
es10
0 ye
ars
7 µs
(Byt
e Pr
ogra
m)
3 µA
ü–
64 K
BFa
st re
ad, p
rogr
am a
nd e
rase
; Low
pow
er; S
mal
l era
se s
ecto
r48
B-TF
BGA,
48L
-TSO
P
×16
SST3
9LF2
00A
R2
Mb
128K
× 1
655
ns
3.0–
3.6V
0°C
to 7
0°C
100,
000
cycl
es10
0 ye
ars
14 µ
s (W
ord
Prog
ram
)3
µA–
–N/
AFa
st re
ad, p
rogr
am a
nd e
rase
; Low
pow
er; S
mal
l era
se s
ecto
r48
B-TF
BGA,
48L
-TSO
P
SST3
9VF2
00A
R2
Mb
128K
× 1
670
ns
2.7–
3.6V
0°C
to 7
0°C
−40°
C to
+85
°C
100,
000
cycl
es10
0 ye
ars
14 µ
s (W
ord
Prog
ram
)3
µA–
–N/
AFa
st re
ad, p
rogr
am a
nd e
rase
; Low
pow
er; S
mal
l era
se s
ecto
r48
B-TF
BGA,
48L
-TSO
P, 4
8B-W
FBGA
SST3
9LF4
0XC
R4
Mb
256K
× 1
655
ns
3.0–
3.6V
0°C
to 7
0°C
100,
000
cycl
es10
0 ye
ars
7 µs
(Wor
d Pr
ogra
m)
3 µA
ü–
8 KB
Fast
read
, pro
gram
and
era
se; L
ow p
ower
; Sm
all e
rase
sec
tor;
Indu
stry
sta
ndar
d co
mm
and
set a
nd b
oot b
lock
stru
ctur
e 48
B-TF
BGA,
48L
-TSO
P, 4
8B-W
FBGA
SST3
9WF4
00B
R4
Mb
256K
× 1
670
ns
1.65
–1.9
5V 0
°C to
70°
C −4
0°C
to +
85°C
10
0,00
0 cy
cles
100
year
s28
µs
(Wor
d Pr
ogra
m)
5 µA
––
N/A
Fast
read
, pro
gram
and
era
se; L
ow p
ower
; Sm
all e
rase
sec
tor
48B-
TFBG
A, 4
8B-W
FBGA
, 48B
-XFB
GA
SST3
9VF4
0XC
R4
Mb
256K
× 1
670
ns
2.7–
3.6V
0°C
to 7
0°C
−40°
C to
+85
°C
100,
000
cycl
es10
0 ye
ars
7 µs
(Wor
d Pr
ogra
m)
3 µA
ü–
8 KB
Fast
read
, pro
gram
and
era
se; L
ow p
ower
; Sm
all e
rase
sec
tor;
Indu
stry
sta
ndar
d co
mm
and
set a
nd b
oot b
lock
stru
ctur
e 48
B-TF
BGA,
48L
-TSO
P, 4
8B-W
FBGA
SST3
9WF8
00B
R8
Mb
512K
× 1
670
ns
1.65
–1.9
5V 0
°C to
70°
C −4
0°C
to +
85°C
10
0,00
0 cy
cles
100
year
s28
µs
(Wor
d Pr
ogra
m)
5 µA
––
N/A
Fast
read
, pro
gram
and
era
se; L
ow p
ower
; Sm
all e
rase
sec
tor
48B-
TFBG
A, 4
8B-W
FBGA
, 48B
-XFB
GA
SST3
9LF8
0XC
R8
Mb
512K
× 1
655
ns
3.0–
3.6V
0°C
to 7
0°C
100,
000
cycl
es10
0 ye
ars
7 µs
(Wor
d Pr
ogra
m)
3 µA
ü–
N/A
Fast
read
, pro
gram
and
era
se; L
ow p
ower
; Sm
all e
rase
sec
tor;
Indu
stry
sta
ndar
d co
mm
and
set a
nd b
oot b
lock
stru
ctur
e 48
B-TF
BGA,
48L
-TSO
P, 4
8B-W
FBGA
SST3
9VF8
0XC
R8
Mb
512K
× 1
670
ns
2.7–
3.6V
0°C
to 7
0°C
−40°
C to
+85
°C
100,
000
cycl
es10
0 ye
ars
7 µs
(Wor
d Pr
ogra
m)
3 µA
ü–
N/A
Fast
read
, pro
gram
and
era
se; L
ow p
ower
; Sm
all e
rase
sec
tor;
Indu
stry
sta
ndar
d co
mm
and
set a
nd b
oot b
lock
stru
ctur
e 48
B-TF
BGA,
48L
-TSO
P, 4
8B-W
FBGA
SST3
9WF1
60X
R16
Mb
1M ×
16
70 n
s1.
65–1
.95V
0°C
to 7
0°C
−40°
C to
+85
°C
100,
000
cycl
es10
0 ye
ars
28 µ
s (W
ord
Prog
ram
)5
µAü
–32
KB
Fast
read
, pro
gram
and
era
se; L
ow p
ower
; Sm
all e
rase
sec
tor
48B-
TFBG
A, 4
8B-W
FBGA
, 48B
-XFB
GA
SST3
9VF1
60XC
R16
Mb
1M ×
16
70 n
s2.
7–3.
6V 0
°C to
70°
C −4
0°C
to +
85°C
10
0,00
0 cy
cles
100
year
s7
µs (W
ord
Prog
ram
)3
µAü
–8
KBFa
st re
ad, p
rogr
am a
nd e
rase
; Low
pow
er; S
mal
l era
se s
ecto
r; In
dust
ry s
tand
ard
com
man
d se
t and
boo
t blo
ck s
truct
ure
48B-
TFBG
A, 4
8L-T
SOP,
48B
-WFB
GA
SST3
9VF1
60X
R16
Mb
2M ×
870
ns
2.7–
3.6V
0°C
to 7
0°C
−40°
C to
+85
°C
100,
000
cycl
es10
0 ye
ars
7 µs
(Byt
e Pr
ogra
m)
3 µA
ü–
64 K
BFa
st re
ad, p
rogr
am a
nd e
rase
; Low
pow
er; S
mal
l era
se s
ecto
r48
B-TF
BGA,
48L
-TSO
P
SST3
9VF3
20XB
R32
Mb
2M ×
16
70 n
s2.
7–3.
6V 0
°C to
70°
C −4
0°C
to +
85°C
10
0,00
0 cy
cles
100
year
s7
µs (W
ord
Prog
ram
)4
µAü
–32
KB
Fast
read
, pro
gram
and
era
se; L
ow p
ower
; Sm
all e
rase
sec
tor
48B-
TFBG
A, 4
8L-T
SOP
SST3
9VF3
20XC
R32
Mb
2M ×
16
70 n
s2.
7–3.
6V 0
°C to
70°
C −4
0°C
to +
85°C
10
0,00
0 cy
cles
100
year
s7
µs (W
ord
Prog
ram
)4
µAü
–8
KBFa
st re
ad, p
rogr
am a
nd e
rase
; Low
pow
er; S
mal
l era
se s
ecto
r; In
dust
ry s
tand
ard
com
man
d se
t and
boo
t blo
ck s
truct
ure
48B-
TFBG
A, 4
8L-T
SOP
SST3
8VF6
40X
R64
Mb
4M ×
16
70 n
s2.
7–3.
6V 0
°C to
70°
C −4
0°C
to +
85°C
10
0,00
0 cy
cles
100
year
s7
µs/1
.75
µs
(Writ
e Bu
ffer P
rogr
am)
3 µA
üü
32 K
B/
8 KB
Fast
read
, pro
gram
and
era
se; L
ow p
ower
; Sm
all e
rase
sec
tor I
ndus
try s
tand
ard
com
man
d se
t and
boo
t blo
ck s
truct
ure,
Sec
urity
feat
ures
48
B-TF
BGA,
48L
-TSO
P
SST3
8VF6
40XB
NR64
Mb
4M ×
16
70 n
s2.
7–3.
6V 0
°C to
70°
C −4
0°C
to +
85°C
10
0,00
0 cy
cles
100
year
s7
µs/1
.75
µs
(Writ
e Bu
ffer P
rogr
am)
3 µA
üü
32 K
B/
8 KB
Fast
read
, pro
gram
and
era
se; L
ow p
ower
; Ind
ustry
sta
ndar
d co
mm
and
set a
nd b
oot b
lock
stru
ctur
e, S
ecur
ity fe
atur
es
48B-
TFBG
A, 4
8L-T
SOP
*X is
a w
ildca
rd to
indi
cate
"to
p" o
r "bo
ttom
" bo
ot b
lock
sup
port
. Ple
ase
refe
r to
the
resp
ectiv
e da
tash
eets
for m
ore
deta
ils.
**O
nly
stan
dard
pac
kage
s ar
e lis
ted
here
. Ple
ase
inqu
ire w
ith y
our l
ocal
sal
es o
ffice
for d
evic
es in
die
form
or i
n ch
ip-s
cale
pac
kage
s.
29Focus Product Selector Guide
Wir
eles
s P
ro
DU
Cts
Prod
uct
Pin
Coun
tFr
eque
ncy
ran
ge (G
Hz)
sens
itivi
ty
(dbm
)Po
wer
out
put
(dbm
)r
ssi
tx P
ower
Co
nsum
ptio
n (m
A)rx
Pow
er
Cons
umpt
ion
(mA)
Cloc
ksl
eep
MAC
MAC
Fe
atur
esPr
otoc
ols
encr
yptio
nin
terf
ace
Volu
me
Pric
ing†
Pack
ages
ieee
80
2.1
1 M
odul
es
MRF
24W
B0M
A36
2.41
2–2.
484
−91
10Ye
s 15
685
25 M
Hz0.
1 μA
(1)
Yes
802.
11b
Wi-F
i® C
onne
ctio
n M
anag
er, A
nnou
nce,
DN
S, D
DNS,
DHC
P, FT
P, HT
TP, N
BNS,
SN
MP,
SNTP
, SSL
, TCP
, UDP
, Zer
oCon
f(2)
WPA
, WPA
2, W
EP
4-wi
re S
PI$1
2.48
36
/Mod
ule
MRF
24W
B0M
B36
2.41
2–2.
484
−91
10Ye
s 15
685
25 M
Hz0.
1 μA
(1)
Yes
802.
11b
Wi-F
i Con
nect
ion
Man
ager
, Ann
ounc
e,
DNS,
DDN
S, D
HCP,
FTP,
HTTP
, NBN
S,
SNM
P, SN
TP, S
SL, T
CP, U
DP, Z
eroC
onf(2
)W
PA, W
PA2,
WEP
4-
wire
SPI
$12.
48
36/M
odul
e
RN17
149
2.41
2–2.
484
−83
12Ye
s13
030
44 M
Hz4
μAYe
s80
2.11
b/g,
Wi-F
i Dire
ct,
SoftA
P, W
PS, W
ebsc
anDH
CP, D
NS, A
RP, I
CMP,
FTP
clie
nt, H
TTP
clie
nt, T
CP, U
DPW
EP, W
PA, W
PA2
UART
, SPI
Sl
ave,
Wi-F
i$1
8.11
49/M
odul
e
MRF
24W
G0M
A36
2.41
2–2.
484
−95
18Ye
s24
015
625
MHz
0.1
mA(1
)Ye
s80
2.11
b/g,
Wi-F
i Dire
ct,
SoftA
P, W
PS
Wi-F
i Con
nect
ion
Man
ager
, Ann
ounc
e,
DNS,
DDN
S, D
HCP,
FTP,
HTTP
, NBN
S,
SNM
P, SN
TP, S
SL, T
CP, U
DP, Z
eroC
onf(2
)
WPA
2-PS
K,
WPA
-PSK
, WEP
4-wi
re S
PI$1
8.75
36/M
odul
e
MRF
24W
G0M
B36
2.41
2–2.
484
−95
18Ye
s24
015
625
MHz
0.1
mA(1
)Ye
s80
2.11
b/g,
Wi-F
i Dire
ct,
SoftA
P, W
PS
Wi-F
i Con
nect
ion
Man
ager
, Ann
ounc
e,
DNS,
DDN
S, D
HCP,
FTP,
HTTP
, NBN
S,
SNM
P, SN
TP, S
SL, T
CP, U
DP, Z
eroC
onf(2
)
WPA
2-PS
K,
WPA
-PSK
, WEP
4-wi
re S
PI$1
8.75
36/M
odul
e
RN13
1C44
2.41
2–2.
484
−85
18Ye
s21
0 (+
18 d
Bm)
4044
MHz
4 μA
Yes
802.
11b/
g, W
i-Fi D
irect
, So
ftAP,
WPS
, Web
scan
DHCP
, DNS
, ARP
, ICM
P, FT
P cl
ient
, HT
TP c
lient
, TCP
, UDP
WEP
, WPA
, WPA
2UA
RT, S
PI
Slav
e, W
i-Fi
$24.
9044
/Mod
ule
RN13
1G44
2.41
2–2.
484
−85
18Ye
s21
0 (+
18 d
Bm)
4044
MHz
4 μA
Yes
802.
11b/
g, W
i-Fi D
irect
, So
ftAP,
WPS
, Web
scan
DHCP
, DNS
, ARP
, ICM
P, FT
P cl
ient
, HT
TP c
lient
, TCP
, UDP
WEP
, WPA
, WPA
2UA
RT, S
PI
Slav
e, W
i-Fi
$27.
7544
/Mod
ule
ieee
80
2.1
5.4
tra
nsei
vers
/Mod
ules
MRF
24J4
040
2.40
5–2.
48−9
50
Yes
2319
20 M
Hz2
µAYe
sCS
MA-
CA–
AES1
284-
wire
SPI
$2.3
6 40
/QFN
MRF
24J4
0MA
122.
405–
2.48
−95
0Ye
s23
1920
MHz
2 µA
Yes
CSM
A-CA
–AE
S128
4-wi
re S
PI$4
.94
12/M
odul
e
MRF
24J4
0MB
122.
405–
2.48
−102
20Ye
s13
025
20 M
Hz5
µAYe
sCS
MA-
CA–
AES1
284-
wire
SPI
$10.
6612
/Mod
ule
MRF
24J4
0MC
122.
405–
2.48
−108
20Ye
s12
025
20 M
Hz12
µA
Yes
CSM
A-CA
–AE
S128
4-wi
re S
PI$1
0.66
12
/Mod
ule
1.
Indi
cate
s "o
ff" c
urre
nt fo
r sle
ep c
olum
n.
2.
Supp
orte
d in
the
prov
ided
sta
ck.
Wir
eles
s P
ro
DU
Cts
Prod
uct
Pin
Coun
tFr
eque
ncy
ran
ge (G
Hz)
sens
itivi
ty
(dbm
)Po
wer
out
put
(dbm
)Po
wer
Con
sum
ptio
nsl
eep
MAC
Profi
les
inte
rfac
eVo
lum
e Pr
icin
g†Pa
ckag
es
blu
etoo
th®
RN42
-I/RM
352.
4 to
2.4
8 −8
04
Stan
dby/
Idle
25
mA,
Con
nect
ed (n
orm
al m
ode)
3 m
A,
Conn
ecte
d (lo
w po
wer s
niff)
8 m
ASt
andb
y/Id
le (d
eep
slee
p en
able
d) 2
6 μA
Yes
SPP,
DUN,
HID
, iAP
, HCI
, RFC
OMM
, L2C
AP, S
DPUA
RT, U
SB, B
luet
ooth
®$1
2.50
35
/Mod
ule
RN52
-I/RM
*40
2.4
to 2
.48
-85
4TB
DSt
andb
y/Id
le (d
eep
slee
p en
able
d) 2
6 μA
Yes
A2DP
, AVR
CP, S
PP, H
FP/H
SP, i
AP(a
udio
) Ana
log
spea
ker,
mic
roph
one,
I2 S m
aste
r m
ode,
S/P
DIF,
(dat
a) U
ART,
USB,
GPI
O $
16.0
4 40
/Mod
ule
RN41
-I/RM
352.
4 to
2.4
8 −8
015
Stan
dby/
Idle
25
mA,
Con
nect
ed (n
orm
al m
ode)
30
mA,
Co
nnec
ted
(low
powe
r sni
ff) 8
mA
Stan
dby/
Idle
(dee
p sl
eep
enab
led)
250
μA
Yes
SPP,
DUN,
HID
, iAP
, HCI
, RFC
OMM
, L2C
AP, S
DPUA
RT, U
SB, B
luet
ooth
$18.
75
35/M
odul
e
*N
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et r
elea
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sub
-GH
z tr
ansc
eive
rs/M
odul
es
Prod
uct
Pin
Coun
tFr
eque
ncy
ran
ge (M
Hz)
sens
itivi
ty
(dbm
)Po
wer
out
put
(dbm
)r
ssi
tx P
ower
Co
nsum
ptio
n (m
A)r
x Po
wer
Co
nsum
ptio
n (m
A)Cl
ock
slee
pin
terf
ace
Volu
me
Pric
ing†
Pack
ages
MRF
49XA
16
433
/868
/915
−110
7Ye
s15
mA
@ 0
dBm
1110
MHz
0.3
µA 4
-wire
SPI
$1.7
1 16
/TSS
OP
MRF
89XA
32
868
/915
/950
−113
12.5
Yes
25 m
A @
0 d
Bm3
12.8
MHz
0.1
µA 4
-wire
SPI
$1.7
632
/TQF
N
MRF
89XA
M8A
12
868
−113
12.5
Yes
25 m
A @
0 d
Bm3
12.8
MHz
0.1
µA4-
wire
SPI
$5.2
012
/Mod
ule
MRF
89XA
M9A
12
915
−113
12.5
Yes
25 m
A @
0 d
Bm3
12.8
MHz
0.1
µA4-
wire
SPI
$5.2
012
/Mod
ule
rfP
iC™
tra
nsm
itter
s +
PiC
® M
CU
s
Prod
uct
i/o
Pin
sFr
eque
ncy
ran
ge (M
Hz)
Prog
ram
M
emor
y (b
ytes
)ee
Pro
M
(byt
es)
rAM
(b
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igita
l ti
mer
Wat
ch D
og
tim
erM
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peed
(M
Hz)
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™M
odul
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ata
rat
e (k
bps)
out
put P
ower
(d
bm)
ope
ratin
g Vo
ltage
Volu
me
Pric
ing†
Pack
ages
PIC1
2F52
9T48
A6
418–
868
2.3
K–
201
11
8Ye
sOO
K/FS
K10
010
2.0–
3.7
$0.8
5 14
/TSS
OP
PIC1
2F52
9T39
A6
310–
928
2.3
K–
201
11
8Ye
sOO
K/FS
K10
010
2.0–
3.7
$0.9
5 14
/TSS
OP
PIC1
2LF1
840T
48A
641
8–86
87.
1 K
256
256
21
32Ye
sOO
K/FS
K10
010
1.8–
3.6
$1.1
2 14
/TSS
OP
PIC1
2LF1
840T
39A
631
0–92
87.
1 K
256
256
21
32Ye
sOO
K/FS
K10
010
1.8–
3.6
$1.2
7 14
/TSS
OP
rfPIC
12F6
75F
638
0–45
01.
7 K
128
641
120
Yes
ASK/
FSK
4010
2.0–
5.5
$2.1
1 20
/SSO
P
rfPIC
12F6
75H
685
0–93
01.
7 K
128
641
120
Yes
ASK/
FSK
4010
2.0–
5.5
$2.1
1 20
/SSO
P
rfPIC
12F6
75K
629
0–35
01.
7 K
128
641
120
Yes
ASK/
FSK
4010
2.0–
5.5
$2.1
1 20
/SSO
P
† Pr
icin
g su
bjec
t to
chan
ge; p
leas
e co
ntac
t you
r Mic
roch
ip re
pres
enta
tive
for m
ost c
urre
nt p
ricin
g.
30 Focus Product Selector Guide
Usb
: sup
erspe
ed U
sb
3.0
Hub
sU
SB
3.0
Hub
Con
trol
ler
Fam
ily f
or C
ompu
ting
and
Con
sum
er A
pplic
atio
ns
Prod
uct
Feat
ures
Dow
nstr
eam
Usb
Por
tsin
dust
rial t
emp.
opt
ion
(−
40 to
85°
C)Pi
nPa
ckag
es
USB5
532B
USB
3.0
Supe
rspe
ed h
ub, t
wo p
ort,
OTP
flash
pro
gram
mab
le w
ith a
dvan
ced
batte
ry c
harg
ing
supp
ort
2US
B553
2Bi
64QF
N
USB5
533B
USB
3.0
Supe
rspe
ed h
ub, t
hree
por
t, OT
P fla
sh p
rogr
amm
able
with
adv
ance
d ba
ttery
cha
rgin
g su
ppor
t3
USB5
533B
i64
QFN
USB5
534B
USB
3.0
Supe
rspe
ed h
ub, f
our p
ort,
OTP
flash
pro
gram
mab
le w
ith a
dvan
ced
batte
ry c
harg
ing
supp
ort
4US
B553
4Bi
64QF
N
USB5
537B
USB
3.0
hybr
id h
ub, s
even
tota
l por
ts, f
our U
SB 3
.0 w
ith th
ree
addi
tiona
l USB
2.0
dow
nstre
am p
orts
, OTP
flas
h pr
ogra
mm
able
with
adv
ance
d ba
ttery
ch
argi
ng s
uppo
rtUS
B 3.
0: 4
US
B 2.
0: 3
USB5
537B
i72
QFN
Usb
: Hi-s
peed
Usb
2.0
Hub
sLo
w-P
ower
, Sm
all-F
ootp
rint,
Cos
t-Eff
ectiv
e U
SB
2.0
Hub
Con
trol
ler
Fam
ily
Prod
uct
Feat
ures
Dow
nstr
eam
Usb
Por
tsin
dust
rial t
emp.
opt
ion
(−
40 to
85°
C)Pi
nPa
ckag
es
USB2
422
Smal
l-foo
tprin
t, tw
o po
rt va
lue
hub,
com
mer
cial
and
indu
stria
l tem
pera
ture
with
USB
bat
tery
cha
rgin
g 1.
12
USB2
422i
24QF
N
USB2
412
Smal
l-foo
tprin
t, lo
w-po
wer,
stan
dard
com
mer
cial
tem
pera
ture
rang
e2
–28
QFN
USB2
512B
Low-
powe
r, ex
tend
ed c
omm
erci
al te
mpe
ratu
re ra
nge,
USB
Bat
tery
Cha
rgin
g 1.
12
USB2
512B
i 36
QFN
USB2
513B
Low-
powe
r, sm
all-f
ootp
rint,
exte
nded
com
mer
cial
tem
pera
ture
rang
e, U
SB B
atte
ry C
harg
ing
1.1
(USB
2513
B/25
14B
only)
, SM
SC’s
pro
prie
tary
Por
tMap
, Po
rtSwa
p, T
rueS
peed
, PHY
Boos
t and
Mul
tiTRA
K™ te
chno
logi
es3
USB2
513B
i36
QFN
USB2
514B
Low-
powe
r, sm
all-f
ootp
rint,
exte
nded
com
mer
cial
tem
pera
ture
rang
e, U
SB B
atte
ry C
harg
ing
1.1
(USB
2513
B/25
14B
only)
, SM
SC’s
pro
prie
tary
Por
tMap
, Po
rtSwa
p, T
rueS
peed
, PHY
Boos
t and
Mul
tiTRA
K te
chno
logi
es4
USB2
514B
i36
/64
QFN,
VFB
GA
USB2
517
Low-
powe
r, sm
all-f
ootp
rint,
exte
nded
com
mer
cial
tem
pera
ture
rang
e, U
SB B
atte
ry C
harg
ing
1.1
(USB
2513
B/25
14B
only)
, SM
SC’s
pro
prie
tary
Por
tMap
, Po
rtSwa
p, T
rueS
peed
, PHY
Boos
t and
Mul
tiTRA
K te
chno
logi
es7
USB2
517i
64QF
N
USB2
524
Mul
tiSwi
tch™
tech
nolo
gy c
ombi
ning
Hi-S
peed
USB
hub
and
swi
tchi
ng fu
nctio
nalit
y in
a s
ingl
e-ch
ip, c
ost-e
ffect
ive s
olut
ion
2 up
stre
am/4
dow
nstre
am–
56QF
N
USB2
532
Low-
powe
r, sm
all-f
ootp
rint,
exte
nded
com
mer
cial
tem
pera
ture
rang
e, U
SB B
atte
ry C
harg
ing
1.2,
Por
tMap
, Por
tSwa
p, T
rueS
peed
, PHY
Boos
t, M
ultiT
RAK,
Va
riSen
se a
nd F
lexC
onne
ct te
chno
logi
es2
USB2
532i
36SQ
FN
USB2
533
Low-
powe
r, sm
all-f
ootp
rint,
exte
nded
com
mer
cial
tem
pera
ture
rang
e, U
SB B
atte
ry C
harg
ing
1.2,
Por
tMap
, Por
tSwa
p, T
rueS
peed
, PHY
Boos
t, M
ultiT
RAK,
Va
riSen
se a
nd F
lexC
onne
ct te
chno
logi
es3
USB2
533i
36SQ
FN
USB2
534
Low-
powe
r, sm
all-f
ootp
rint,
exte
nded
com
mer
cial
tem
pera
ture
rang
e, U
SB B
atte
ry C
harg
ing
1.2,
Por
tMap
, Por
tSwa
p, T
rueS
peed
, PHY
Boos
t, M
ultiT
RAK,
Va
riSen
se™
and
Fle
xCon
nect
tech
nolo
gies
4US
B253
4i36
SQFN
USB3
613
Ultra
sm
all,
extre
mel
y lo
w po
wer,
mob
ile e
mbe
dded
USB
2.0
hub
with
HSI
C ho
st c
onne
ctivi
ty, L
PM c
ompa
tibili
ty a
nd a
dvan
ced
batte
ry c
harg
ing
supp
ort
USB
2.0:
2
HSIC
: 1
USB3
613i
30W
LCSO
P
USB3
813
Ultra
sm
all,
extre
mel
y lo
w po
wer,
mob
ile e
mbe
dded
USB
2.0
hub
with
USB
2.0
hos
t con
nect
ivity
, LPM
com
patib
ility
and
adv
ance
d ba
ttery
cha
rgin
g su
ppor
tUS
B 2.
0: 2
HS
IC:
1US
B381
3i30
WLC
SOP
USB4
604
Adva
nced
USB
2.0
hub
with
USB
2.0
dow
nstre
am p
orts
and
HSI
C or
USB
hos
t con
nect
ivity
, I/O
brid
ging
, low
pow
er a
nd a
dvan
ced
batte
ry c
harg
ing
supp
ort
USB
2.0
4US
B460
4i48
QFN
USB4
624
Adva
nced
USB
2.0
hub
with
USB
2.0
/HSI
C do
wnst
ream
por
ts a
nd H
SIC
or U
SB h
ost c
onne
ctiv
ity, I
/O b
ridgi
ng, l
ow p
ower
and
adv
ance
d ba
ttery
ch
argi
ng s
uppo
rtUS
B 2.
0: 2
HS
IC:
2US
B462
4i48
QFN
Usb
: Hi-s
peed
Usb
2.0
Por
tabl
e H
ubs
Ultr
a-S
mal
l Hub
s fo
r Po
rtab
le A
pplic
atio
ns
Prod
uct
Feat
ures
indu
stria
l tem
p. o
ptio
n
(−40
to 8
5°C)
Upst
ream
inte
rfac
ePi
n/ba
llPa
ckag
es
USB3
803C
Ultra
-sm
all,
extre
mel
y lo
w st
andb
y po
wer,
high
-per
form
ance
, bui
lt-in
ESD
pro
tect
ion,
USB
Bat
tery
Cha
rgin
g 1.
2 de
tect
ion
USB3
803i
USB
25W
LCSP
USB3
503A
Ultra
-sm
all,
extre
mel
y lo
w st
andb
y po
wer,
high
-per
form
ance
, bui
lt-in
ESD
pro
tect
ion,
USB
Bat
tery
Cha
rgin
g 1.
2 de
tect
ion
USB3
503i
HSIC
25W
LCSP
Usb
: Hi-s
peed
Usb
to
ethe
rnet
Con
trol
lers
US
B 2
.0 t
o 10/1
00 o
r 10/1
00/1
000 E
ther
net
Con
trol
lers
Prod
uct
Feat
ures
indu
stria
l tem
p. o
ptio
n
(−40
to 8
5°C)
Pin
Pack
ages
LAN9
500A
10/1
00, N
etDe
tach
™ te
chno
logy
, EEP
ROM
-less
ope
ratio
n, U
niCl
ock™
tech
nolo
gyLA
N950
0Ai
56QF
N
LAN7
500
10/1
00/1
000
Giga
bit c
ontro
ller w
ith in
tegr
ated
USB
and
Eth
erne
t PHY
s, s
ingl
e-ch
ip, h
igh-
perfo
rman
ce, c
ost-e
ffect
ive, E
EPRO
M-le
ss o
pera
tion,
Uni
Cloc
k te
chno
logy
LAN7
500i
56QF
N
LAN9
730
HSIC
Eth
erne
t con
trolle
r, m
ultip
le lo
w-po
wer m
odes
, HSI
C in
terfa
ce re
duce
s pi
n co
unt a
nd p
ower
bud
get,
drive
rs fu
lly b
ackw
ard
com
patib
le to
exis
ting
USB
2.0
softw
are
for
seam
less
tran
sitio
n, in
dust
rial t
empe
ratu
re fo
r rug
ged
envir
onm
ents
LAN9
730i
56QF
N
Usb
: Hi-s
peed
Usb
to
ethe
rnet
Con
trol
lers
US
B 2
.0 H
ub a
nd 1
0/1
00 E
ther
net
Con
trol
lers
with
Sup
erio
r ES
D P
rote
ctio
n
Prod
uct
Feat
ures
Dow
nstr
eam
Usb
Por
tsin
dust
rial t
emp.
opt
ion
(−
40 to
85°
C)Pi
nPa
ckag
es
LAN9
512
Indu
stry
’s fi
rst f
ully-
inte
grat
ed, s
ingl
e-ch
ip d
evic
e, U
niCl
ock™
tech
nolo
gy, E
EPRO
M-le
ss d
esig
n op
tion
2LA
N951
2i64
QFN
LAN9
513
Indu
stry
’s fi
rst f
ully-
inte
grat
ed, s
ingl
e-ch
ip d
evic
e, U
niCl
ock
tech
nolo
gy, E
EPRO
M-le
ss d
esig
n op
tion
3LA
N951
3i64
QFN
LAN9
514
Indu
stry
’s fi
rst f
ully-
inte
grat
ed, s
ingl
e-ch
ip d
evic
e, U
niCl
ock
tech
nolo
gy, E
EPRO
M-le
ss d
esig
n op
tion
4LA
N951
4i64
QFN
31Focus Product Selector Guide
Usb
: Hi-s
peed
Usb
Fla
sh M
edia
Con
trol
lers
Sta
ndal
one
US
B 2
.0, M
ulti-
Form
at F
lash
Med
ia C
ontr
olle
rs
Prod
uct
Feat
ures
sock
et t
ype
supp
orts
indu
stria
l tem
p. o
ptio
n
(−40
to 8
5°C)
Pin
Pack
ages
USB2
240
Ultra
Hi-S
peed
, cos
t-effe
ctive
, ext
erna
l or i
nter
nal R
OM o
ptio
n, s
ecur
e m
emor
y fo
rmat
opt
ions
Sing
leSD
™/M
ultiM
edia
Card
™/S
mar
tMed
ia™
/xD-
Pict
ure
Card
™/M
emor
y St
ick®
USB2
240i
36QF
N
USB2
241
Ultra
Hi-S
peed
, cos
t-effe
ctive
, ext
erna
l or i
nter
nal R
OM o
ptio
n, s
ecur
e m
emor
y fo
rmat
opt
ions
Sing
leSD
/Mul
tiMed
iaCa
rd/S
mar
tMed
ia/M
emor
y St
ick
USB2
241i
36QF
N
USB2
242
Ultra
Hi-S
peed
, cos
t-effe
ctive
, ext
erna
l or i
nter
nal R
OM o
ptio
n, s
ecur
e m
emor
y fo
rmat
opt
ions
Sing
leM
emor
y St
ick
USB2
242i
36QF
N
USB2
244
Ultra
Hi-S
peed
, cos
t-effe
ctive
, ext
erna
l or i
nter
nal R
OM o
ptio
n, s
ecur
e m
emor
y fo
rmat
opt
ions
Sing
leSD
/Mul
tiMed
iaCa
rdUS
B224
4i36
QFN
USB2
250
Ultra
Hi-S
peed
, cos
t-effe
ctive
, ext
erna
l or i
nter
nal R
OM o
ptio
n, s
ecur
e m
emor
y fo
rmat
opt
ions
Mul
tiSD
/Mul
tiMed
iaCa
rd/S
mar
tMed
ia/x
D-Pi
ctur
e Ca
rd/M
emor
y St
ick/
Com
pact
Fla
sh®
and
exte
rnal
mem
ory
USB2
250i
128
VTQF
P
USB2
251
Ultra
Hi-S
peed
, cos
t-effe
ctive
, ext
erna
l or i
nter
nal R
OM o
ptio
n, s
ecur
e m
emor
y fo
rmat
opt
ions
Mul
tiSD
/Mul
tiMed
iaCa
rd/S
mar
tMed
ia/x
D-Pi
ctur
e Ca
rd/M
emor
y St
ick/
Com
pact
Fla
sh a
nd e
xter
nal m
emor
yUS
B225
1i12
8VT
QFP
Usb
: tra
nsce
iver
s H
i-Spe
ed U
SB
2.0
Tra
nsce
iver
s
Prod
uct
Feat
ures
inte
rfac
er
efer
ence
Clo
ckPi
n/ba
llPa
ckag
es
USB3
310
High
ly-in
tegr
ated
, sm
all f
ootp
rint,
inte
rnal
ESD
pro
tect
ion
circ
uits
, int
egra
ted
3.3V
LDO
regu
lato
r, in
tegr
ated
USB
swi
tch,
ext
erna
l pas
sive
com
pone
nts
min
imize
d, fl
exPW
R® te
chno
logy
1.8V
ULP
IM
ulti-
frequ
ency
24-p
inQF
N
USB3
311
High
ly-in
tegr
ated
, sm
all f
ootp
rint,
inte
rnal
ESD
pro
tect
ion
circ
uits
, int
egra
ted
3.3V
LDO
regu
lato
r, in
tegr
ated
USB
swi
tch,
ext
erna
l pas
sive
com
pone
nts
min
imize
d, fl
exPW
R te
chno
logy
1.8V
ULP
I26
MHz
24-p
in /
25-b
all
QFN,
VFB
GA
USB3
313
High
ly-in
tegr
ated
, sm
all f
ootp
rint,
inte
rnal
ESD
pro
tect
ion
circ
uits
, int
egra
ted
3.3V
LDO
regu
lato
r, in
tegr
ated
USB
swi
tch,
ext
erna
l pas
sive
com
pone
nts
min
imize
d, fl
exPW
R te
chno
logy
1.8V
–3.3
V UL
PI26
MHz
25-b
all
VFBG
A
USB3
315
High
ly-in
tegr
ated
, sm
all f
ootp
rint,
inte
rnal
ESD
pro
tect
ion
circ
uits
, int
egra
ted
3.3V
LDO
regu
lato
r, in
tegr
ated
USB
swi
tch,
ext
erna
l pas
sive
com
pone
nts
min
imize
d, fl
exPW
R te
chno
logy
1.8V
–3.3
V UL
PI24
MHz
24-p
inQF
N
USB3
316
High
ly-in
tegr
ated
, sm
all f
ootp
rint,
inte
rnal
ESD
pro
tect
ion
circ
uits
, int
egra
ted
3.3V
LDO
regu
lato
r, in
tegr
ated
USB
swi
tch,
ext
erna
l pas
sive
com
pone
nts
min
imize
d, fl
exPW
R te
chno
logy
1.8V
ULP
I19
.2 M
Hz24
-pin
/25
-bal
lQF
N, V
FBGA
, UFB
GA
USB3
317
High
ly-in
tegr
ated
, sm
all f
ootp
rint,
inte
rnal
ESD
pro
tect
ion
circ
uits
, int
egra
ted
3.3V
LDO
regu
lato
r, in
tegr
ated
USB
swi
tch,
ext
erna
l pas
sive
com
pone
nts
min
imize
d, fl
exPW
R te
chno
logy
1.8V
–3.3
V UL
PI26
MHz
24-p
in /
25-b
all
QFN,
VFB
GA
USB3
318
High
ly-in
tegr
ated
, sm
all f
ootp
rint,
inte
rnal
ESD
pro
tect
ion
circ
uits
, int
egra
ted
3.3V
LDO
regu
lato
r, in
tegr
ated
USB
swi
tch,
ext
erna
l pas
sive
com
pone
nts
min
imize
d, fl
exPW
R te
chno
logy
1.8V
–3.3
V UL
PI13
MHz
24-p
inQF
N
USB3
319
High
ly-in
tegr
ated
, sm
all f
ootp
rint,
inte
rnal
ESD
pro
tect
ion
circ
uits
, int
egra
ted
3.3V
LDO
regu
lato
r, in
tegr
ated
USB
swi
tch,
ext
erna
l pas
sive
com
pone
nts
min
imize
d, fl
exPW
R te
chno
logy
1.8V
ULP
I13
MHz
24-p
in /
25-b
all
QFN,
VFB
GA
USB3
320
Full-
feat
ured
, USB
OTG
tran
scei
ver,
inte
grat
ed V
bus
over
-volta
ge p
rote
ctio
n, U
SB s
witc
h, E
SD p
rote
ctio
n ci
rcui
ts a
nd 3
.3V
LDO
regu
lato
r, UL
PI 6
0 M
Hz c
lock
-in m
ode
incl
udin
g cr
ysta
l su
ppor
t, fle
xPW
R te
chno
logy
1.8V
–3.3
V UL
PIM
ulti-
frequ
ency
32-p
inQF
N
USB3
321
Smal
l-foo
tprin
t, in
tegr
ated
Vbu
s ov
er-vo
ltage
pro
tect
ion,
USB
swi
tch,
ESD
pro
tect
ion
circ
uits
and
3.3
V LD
O re
gula
tor,
ULPI
60
MHz
clo
ck-in
mod
e, fl
exPW
R te
chno
logy
1.8V
ULP
I26
MHz
25-b
all
WLC
SP
USB3
322
Smal
l-foo
tprin
t, in
tegr
ated
Vbu
s ov
er-vo
ltage
pro
tect
ion,
USB
swi
tch,
ESD
pro
tect
ion
circ
uits
and
3.3
V LD
O re
gula
tor,
ULPI
60
MHz
clo
ck-in
mod
e, fl
exPW
R te
chno
logy
1.8V
ULP
I12
MHz
25-b
all
WLC
SP
USB3
326
Smal
l-foo
tprin
t, in
tegr
ated
Vbu
s ov
er-vo
ltage
pro
tect
ion,
USB
swi
tch,
ESD
pro
tect
ion
circ
uits
and
3.3
V LD
O re
gula
tor,
ULPI
60
MHz
clo
ck-in
mod
e, fl
exPW
R te
chno
logy
1.8V
ULP
I19
.2 M
Hz25
-bal
lW
LCSP
USB3
327
Smal
l-foo
tprin
t, in
tegr
ated
Vbu
s ov
er-vo
ltage
pro
tect
ion,
USB
swi
tch,
ESD
pro
tect
ion
circ
uits
and
3.3
V LD
O re
gula
tor,
ULPI
60
MHz
clo
ck-in
mod
e, fl
exPW
R te
chno
logy
1.8V
ULP
I27
MHz
25-b
all
WLC
SP
USB3
329
Smal
l-foo
tprin
t, in
tegr
ated
Vbu
s ov
er-vo
ltage
pro
tect
ion,
USB
swi
tch,
ESD
pro
tect
ion
circ
uits
and
3.3
V LD
O re
gula
tor,
ULPI
60
MHz
clo
ck-in
mod
e, fl
exPW
R te
chno
logy
1.8V
ULP
I13
MHz
25-b
all
WLC
SP
USB3
330
Smal
l-foo
tprin
t, in
tegr
ated
Vbu
s ov
er-vo
ltage
pro
tect
ion,
inte
rnal
ESD
pro
tect
ion
circ
uits
, int
egra
ted
1.8V
& 3
.3V
LDO
regu
lato
rs, U
LPI 6
0 M
Hz c
lock
-in m
ode,
flex
PWR
tech
nolo
gy, b
atte
ry
char
ger d
etec
tion
supp
orte
d th
roug
h Ra
pidC
harg
e An
ywhe
re™
tech
nolo
gy1.
8V U
LPI
Mul
ti-fre
quen
cy25
-bal
lW
LCSP
USB3
331
Smal
l-foo
tprin
t, in
tegr
ated
Vbu
s ov
er-vo
ltage
pro
tect
ion,
inte
rnal
ESD
pro
tect
ion
circ
uits
, int
egra
ted
1.8V
& 3
.3V
LDO
regu
lato
rs, i
nteg
rate
d US
B sw
itch,
ULP
I 60
MHz
clo
ck-in
mod
e, fl
exPW
R te
chno
logy
, bat
tery
cha
rger
det
ectio
n su
ppor
ted
thro
ugh
Rapi
dCha
rge
Anyw
here
tech
nolo
gy1.
8V U
LPI
26 M
Hz25
-bal
lW
LCSP
USB3
333
Smal
l-foo
tprin
t, in
tegr
ated
Vbu
s ov
er-vo
ltage
pro
tect
ion,
inte
rnal
ESD
pro
tect
ion
circ
uits
, int
egra
ted
1.8V
& 3
.3V
LDO
regu
lato
rs, U
LPI 6
0 M
Hz c
lock
-in m
ode,
flex
PWR
tech
nolo
gy, b
atte
ry
char
ger d
etec
tion
supp
orte
d th
roug
h Ra
pidC
harg
e An
ywhe
re te
chno
logy
1.8V
–3.3
V UL
PI19
.2 M
Hz/2
6 M
Hz25
-bal
lW
LCSP
USB3
336
Smal
l-foo
tprin
t, in
tegr
ated
Vbu
s ov
er-vo
ltage
pro
tect
ion,
inte
rnal
ESD
pro
tect
ion
circ
uits
, int
egra
ted
1.8V
& 3
.3V
LDO
regu
lato
rs, i
nteg
rate
d US
B sw
itch,
ULP
I 60
MHz
clo
ck-in
mod
e, fl
exPW
R te
chno
logy
, bat
tery
cha
rger
det
ectio
n su
ppor
ted
thro
ugh
Rapi
dCha
rge
Anyw
here
tech
nolo
gy1.
8V U
LPI
19.2
MHz
25-b
all
WLC
SP
USB3
338
Smal
l-foo
tprin
t, in
tegr
ated
Vbu
s ov
er-vo
ltage
pro
tect
ion,
inte
rnal
ESD
pro
tect
ion
circ
uits
, int
egra
ted
1.8V
& 3
.3V
LDO
regu
lato
rs, U
LPI 6
0 M
Hz c
lock
-in m
ode,
flex
PWR
tech
nolo
gy, b
atte
ry
char
ger d
etec
tion
supp
orte
d th
roug
h Ra
pidC
harg
e An
ywhe
re te
chno
logy
1.8V
ULP
I38
.4 M
Hz25
-bal
lW
LCSP
USB3
340
High
ly-in
tegr
ated
, sm
all-f
ootp
rint,
inte
rnal
ESD
pro
tect
ion
circ
uits
, int
egra
ted
1.8V
& 3
.3V
LDO
regu
lato
rs, i
nteg
rate
d US
B sw
itch,
ULP
I 60
MHz
clo
ck-in
mod
e, fl
exPW
R te
chno
logy
, bat
tery
ch
arge
r det
ectio
n su
ppor
ted
thro
ugh
Rapi
dCha
rge
Anyw
here
tech
nolo
gy1.
8V–3
.3V
ULPI
Mul
ti-fre
quen
cy32
-pin
QFN
USB3
341
High
ly-in
tegr
ated
, sm
all-f
ootp
rint,
inte
rnal
ESD
pro
tect
ion
circ
uits
, int
egra
ted
1.8V
& 3
.3V
LDO
regu
lato
rs, i
nteg
rate
d US
B sw
itch,
ULP
I 60
MHz
clo
ck-in
mod
e, fl
exPW
R te
chno
logy
, bat
tery
ch
arge
r det
ectio
n su
ppor
ted
thro
ugh
Rapi
dCha
rge
Anyw
here
tech
nolo
gy1.
8V U
LPI
26 M
Hz24
-pin
QFN
USB3
343
High
ly-in
tegr
ated
, sm
all-f
ootp
rint,
inte
rnal
ESD
pro
tect
ion
circ
uits
, int
egra
ted
1.8V
& 3
.3V
LDO
regu
lato
rs, U
LPI 6
0 M
Hz c
lock
-in m
ode,
flex
PWR
tech
nolo
gy, b
atte
ry c
harg
er d
etec
tion
supp
orte
d th
roug
h Ra
pidC
harg
e An
ywhe
re te
chno
logy
1.8V
–3.3
V UL
PI26
MHz
cry
stal
24-p
inQF
N
USB3
346
High
ly-in
tegr
ated
, sm
all-f
ootp
rint,
inte
rnal
ESD
pro
tect
ion
circ
uits
, int
egra
ted
1.8V
& 3
.3V
LDO
regu
lato
rs, i
nteg
rate
d US
B sw
itch,
ULP
I 60
MHz
clo
ck-in
mod
e, fl
exPW
R te
chno
logy
, bat
tery
ch
arge
r det
ectio
n su
ppor
ted
thro
ugh
Rapi
dCha
rge
Anyw
here
tech
nolo
gy1.
8V U
LPI
19.2
MHz
24-p
inQF
N
USB3
347
High
ly-in
tegr
ated
, sm
all-f
ootp
rint,
inte
rnal
ESD
pro
tect
ion
circ
uits
, int
egra
ted
1.8V
& 3
.3V
LDO
regu
lato
rs, U
LPI 6
0 M
Hz c
lock
-in m
ode,
flex
PWR
tech
nolo
gy, b
atte
ry c
harg
er d
etec
tion
supp
orte
d th
roug
h Ra
pidC
harg
e An
ywhe
re te
chno
logy
1.8V
ULP
I27
MHz
24-p
inQF
N
Usb
: sw
itche
sH
i-Spe
ed U
SB
2.0
Sw
itche
s
Prod
uct
Feat
ures
Pin
Pack
ages
USB3
740
Ultra
-sm
all p
acka
ge o
ptio
ns, h
igh-
band
widt
h, e
xtre
mel
y lo
w op
erat
ing
powe
r, lo
w on
resi
stan
ce10
QFN
32 Focus Product Selector Guide
Usb
: Hi-s
peed
Usb
Hub
and
Fla
sh M
edia
Con
trol
lers
H
i-Spe
ed U
SB
2.0
Hub
and
Mul
ti-Fo
rmat
Fla
sh M
edia
Rea
der
Com
bos
Prod
uct
Feat
ures
sock
et t
ype
supp
orts
Dow
nstr
eam
Usb
Por
tsin
dust
rial t
emp.
opt
ion
(−
40 to
85°
C)Pi
nPa
ckag
es
USB2
660
Ultra
Hi-S
peed
, cos
t-effe
ctive
, low
-pow
er, s
mal
l-foo
tprin
tDu
alSD
™/M
ultiM
edia
Card
™/x
D-Pi
ctur
e Ca
rd™
/Mem
ory
Stic
k®2
USB2
660i
64QF
N
USB2
640
Ultra
Hi-S
peed
, cos
t-effe
ctive
, low
-pow
er, s
mal
l-foo
tprin
tSi
ngle
SD/M
ultiM
edia
Card
/Mem
ory
Stic
k2
USB2
640i
48QF
N
USB2
641
Ultra
Hi-S
peed
, cos
t-effe
ctive
, low
-pow
er, s
mal
l-foo
tprin
tSi
ngle
SD/M
ultiM
edia
Card
/xD-
Pict
ure
Card
/Mem
ory
Stic
k2
USB2
641i
48QF
N
USB2
601/
2602
Inte
grat
ed c
ard
powe
r FET
s an
d Hi
-Spe
ed U
SB 2
.0 h
ubM
ulti
SD/M
ultiM
edia
Card
/Sm
artM
edia
™/M
emor
y St
ick®
/Com
pact
Flas
h® a
nd e
xter
nal m
emor
y3
–12
8VT
QFP
USB4
640
Ultra
-fast
dig
ital,
Hi-S
peed
Inte
rchi
p In
terfa
ce (H
SIC)
Sing
leSD
/Mul
tiMed
iaCa
rd/x
D-Pi
ctur
e Ca
rd/M
emor
y St
ick
2US
B464
0i48
QFN
Usb
: Hi-s
peed
Usb
2.0
Por
tabl
e Pow
er
Prod
uct
Feat
ures
Pin
Pack
ages
USB3
750
Ultra
-sm
all p
acka
ge o
ptio
ns, V
BUS
over
-volta
ge a
nd E
SD p
rote
ctio
n, U
SB B
atte
ry C
harg
ing
v1.2
det
ectio
n16
QFN
USB3
751
Ultra
-sm
all p
acka
ge o
ptio
ns, V
BUS
over
-volta
ge a
nd E
SD p
rote
ctio
n, U
SB B
atte
ry C
harg
ing
v1.2
det
ectio
n16
QFN
Usb
: HsiC
Con
trol
lers
Hi-S
peed
US
B In
terc
hip
Con
trol
lers
for
On-
Boa
rd U
SB
Con
nect
ivity
Prod
uct
Feat
ures
Upst
ream
Por
tD
owns
trea
m P
ort
brid
ge F
unct
ion
Pin/
ball
Pack
ages
USB4
640
HSIC
Fla
sh m
edia
read
er h
ub m
ulti-
func
tion
cont
rolle
rHS
ICUS
BSD
™/M
ultiM
edia
Card
™/M
emor
y St
ick®
48QF
N
USB3
503
3-po
rt HS
IC h
ub fo
r por
tabl
e ap
plic
atio
ns, u
ltra-
smal
l, ex
trem
ely
low
stan
dy p
ower
, hig
h-pe
rform
ance
, bui
lt-in
ESD
pro
tect
ion,
USB
Bat
tery
Cha
rgin
g 1.
2 de
tect
ion
HSIC
USB
USB
pass
-thru
25W
LCSP
LAN9
730
HSIC
Eth
erne
t con
trolle
r, m
ultip
le lo
w-po
wer m
odes
, HSI
C in
terfa
ce re
duce
s pi
n co
unt a
nd p
ower
bud
get,
drive
rs fu
lly b
ackw
ard
com
patib
le to
exis
ting
USB
2.0
softw
are
for s
eam
less
tran
sitio
n, in
dust
rial t
empe
ratu
re fo
r rug
ged
envir
onm
ents
HSIC
N/A
10/1
00 E
ther
net
56QF
N
SEC4
410
USB
secu
re a
uthe
ntic
atio
n an
d en
cryp
ted
stor
age
toke
n wi
th A
ES e
ncry
ptio
n, 3
5 M
B/s
trans
fer r
ates
and
32-
bit c
ontro
ller
HSIC
N/A
SD/M
ultiM
edia
Card
/ISO
-781
664
/72
QFN
etH
ern
et:
Hi-s
peed
Usb
to
ethe
rnet
Con
trol
lers
U
SB
2.0
to
10/1
00 o
r 10/1
00/1
000 E
ther
net
Con
trol
lers
Prod
uct
Feat
ures
indu
stria
l tem
p. o
ptio
n
(−40
to 8
5°C)
Pin
Pack
ages
LAN9
500A
10/1
00, N
etDe
tach
™ te
chno
logy
, EEP
ROM
-less
ope
ratio
n, U
niCl
ock™
tech
nolo
gyLA
N950
0Ai
56QF
N
LAN7
500
10/1
00/1
000
Giga
bit c
ontro
ller i
nteg
rate
d US
B an
d Et
hern
et P
HYs,
sin
gle-
chip
, hig
h-pe
rform
ance
, cos
t-effe
ctive
, EE
PROM
-less
ope
ratio
n, U
niCl
ock
tech
nolo
gyLA
N750
0i56
QFN
LAN9
730
HSIC
Eth
erne
t con
trolle
r, m
ultip
le lo
w-po
wer m
odes
, HSI
C in
terfa
ce re
duce
s pi
n co
unt a
nd p
ower
bud
get,
drive
rs fu
lly b
ackw
ard
com
patib
le to
exis
ting
USB
2.0
softw
are
for s
eam
less
tran
sitio
n, in
dust
rial t
empe
ratu
re fo
r rug
ged
envir
onm
ents
LAN9
730i
56QF
N
etH
ern
et:
Hi-s
peed
Usb
and
eth
erne
t Con
trol
lers
U
SB
2.0
and
10/1
00 E
ther
net
Con
trol
lers
with
Sup
erio
r ES
D P
rote
ctio
n
Prod
uct
Feat
ures
Dow
nstr
eam
Usb
Por
tsin
dust
rial t
emp.
opt
ion
(−
40 to
85°
C)Pi
nPa
ckag
es
LAN9
512
Indu
stry
’s fi
rst f
ully-
inte
grat
ed, s
ingl
e-ch
ip d
evic
e, ±
8 kV
/±15
kV
ESD
prot
ectio
n, U
niCl
ock™
tech
nolo
gy, E
EPRO
M-le
ss d
esig
n op
tion
2LA
N951
2i64
QFN
LAN9
513
Indu
stry
’s fi
rst f
ully-
inte
grat
ed, s
ingl
e-ch
ip d
evic
e, ±
8 kV
/±15
kV
ESD
prot
ectio
n, U
niCl
ock
tech
nolo
gy, E
EPRO
M-le
ss d
esig
n op
tion
3LA
N951
3i64
QFN
LAN9
514
Indu
stry
’s fi
rst f
ully-
inte
grat
ed, s
ingl
e-ch
ip d
evic
e, ±
8 kV
/±15
kV
ESD
prot
ectio
n, U
niCl
ock
tech
nolo
gy, E
EPRO
M-le
ss d
esig
n op
tion
4LA
N951
4i64
QFN
etH
ern
et:
PCi e
ther
net
Con
trol
lers
H
igh-
Perf
orm
ance
10/1
00
Eth
erne
t C
ontr
olle
rs S
uppo
rtin
g H
P Au
to-M
DIX
Prod
uct
Feat
ures
bus
inte
rfac
e (b
its)
indu
stria
l tem
p. o
ptio
n
(−40
to 8
5°C)
Pin
Pack
ages
LAN9
420
33 M
Hz, P
CI 3
.0-c
ompl
iant
inte
rface
32LA
N942
0i12
8VT
QFP
etH
ern
et:
loca
l bus
eth
erne
t Con
trol
lers
1
0/1
00 E
ther
net
Con
trol
lers
Sup
port
ing
HP
Auto
-MD
IX
Prod
uct
Feat
ures
bUs
inte
rfac
e (b
its)
indu
stria
l tem
p. o
ptio
n
(−40
to 8
5°C)
Pin
Pack
ages
LAN9
221
Smal
l-foo
tprin
t, ad
vanc
ed p
erfo
rman
ce o
ptio
ns, s
uppo
rts a
wid
e ra
nge
of s
oftw
are
drive
rs, s
uppo
rts lo
cal b
us in
terfa
ce fr
om 1
.8V
to 3
.3V,
inte
grat
ed c
heck
sum
offl
oad
engi
ne16
LAN9
221i
56QF
N
LAN9
220
Smal
l-foo
tprin
t, ad
vanc
ed p
erfo
rman
ce o
ptio
ns, s
uppo
rts a
wid
e ra
nge
of s
oftw
are
drive
rs, s
uppo
rts lo
cal b
us in
terfa
ce fr
om 1
.8V
to 3
.3V,
inte
grat
ed c
heck
sum
offl
oad
engi
ne16
–56
QFN
LAN9
218
High
-thro
ughp
ut p
erfo
rman
ce o
ptio
ns32
LAN9
218i
100
TQFP
LAN9
217
Exte
rnal
MII,
hig
h-th
roug
hput
per
form
ance
opt
ions
16–
100
TQFP
33Focus Product Selector Guide
etH
ern
et:
ethe
rnet
sw
itche
s 1
0/1
00 E
ther
net
Sw
itche
s
Prod
uct
Feat
ures
Port
sH
ost i
nter
face
indu
stria
l tem
p. o
ptio
n
(−40
to 8
5°C)
Pin
Pack
ages
LAN9
303
High
-per
form
ance
, sm
all-f
ootp
rint,
full-
feat
ured
3Si
ngle
MII/
RMII
LAN9
303i
56QF
N
LAN9
303M
High
-per
form
ance
, sm
all-f
ootp
rint,
full-
feat
ured
3Du
al M
II/RM
IILA
N930
3Mi
72QF
N
LAN9
311
Loca
l bus
, IEE
E 15
88 s
uppo
rt2
16-b
it lo
cal b
usLA
N931
1i12
8VT
QFP,
XVT
QFP
LAN9
312
Loca
l bus
, IEE
E 15
88 s
uppo
rt2
32-b
it lo
cal b
us–
128
VTQ
FP, X
VTQ
FP
LAN9
313
MII
inte
rface
, IEE
E 15
88 s
uppo
rt3
(1-p
ort M
II)Si
ngle
MII
LAN9
313i
128
VTQ
FP, X
VTQ
FP
etH
ern
et:
ethe
rnet
tra
nsce
iver
s 1
0/1
00 a
nd 1
0/1
00/1
00
0 T
rans
ceiv
ers
with
Sup
erio
r Pe
rfor
man
ce
Prod
uct
Feat
ures
indu
stria
l tem
p. o
ptio
n
(−40
to 8
5°C)
Hos
t int
erfa
cePi
nPa
ckag
es
LAN8
710A
Full-
feat
ured
, sm
all-f
ootp
rint,
varia
ble
I/O,
low
powe
r con
sum
ptio
nLA
N871
0Ai
MII/
RMII
32QF
N
LAN8
720A
Full-
feat
ured
, sm
all-f
ootp
rint,
varia
ble
I/O,
low
powe
r con
sum
ptio
nLA
N872
0Ai
RMII
24QF
N
LAN8
740A
Smal
l-foo
tprin
t, fu
ll-fe
atur
ed v
aria
ble
I/O
with
Ene
rgy
Effic
ient
Eth
erne
t, W
ake-
on-L
AN fo
r ove
rall
syst
em p
ower
redu
ctio
n, c
able
dia
gnos
tics
for e
ase
of n
etwo
rk in
stal
latio
n an
d m
aint
enan
ce (D
evic
es a
vaila
ble
for s
ampl
ing)
LAN8
740i
MII/
RMII
32SQ
FN
LAN8
741A
Smal
l-foo
tprin
t, fu
ll-fe
atur
ed v
aria
ble
I/O
with
Ene
rgy
Effic
ient
Eth
erne
t, W
ake-
on-L
AN fo
r ove
rall
syst
em p
ower
redu
ctio
n, c
able
dia
gnos
tics
for e
ase
of n
etwo
rk in
stal
latio
n an
d m
aint
enan
ce (D
evic
es a
vaila
ble
for s
ampl
ing)
LAN8
741i
MII/
RMII
32SQ
FN
LAN8
742A
Smal
l-foo
tprin
t, fu
ll-fe
atur
ed v
aria
ble
I/O
with
Ene
rgy
Effic
ient
Eth
erne
t, W
ake-
on-L
AN fo
r ove
rall
syst
em p
ower
redu
ctio
n, c
able
dia
gnos
tics
for e
ase
of n
etwo
rk in
stal
latio
n an
d m
aint
enan
ce (D
evic
es a
vaila
ble
for s
ampl
ing)
LAN8
742i
RMII
24SQ
FN
LAN8
810
Sing
le-c
hip
Ethe
rnet
phy
sica
l lay
er tr
ansc
eive
r (PH
Y), c
ompl
iant
with
IEEE
802
.3ab
(100
0BAS
E-T)
, IEE
E 80
2.3u
(Fas
t Eth
erne
t) an
d IS
O 80
2-3/
IEEE
802
.3 (1
0BAS
E-T)
LAN8
810i
GMII
72QF
N
LAN8
820
Sing
le-c
hip
Ethe
rnet
phy
sica
l lay
er tr
anse
iver (
PHY)
, com
plia
nt w
ith IE
EE 8
02.3
ab (1
000B
ASE-
T), I
EEE
802.
3u (F
ast E
ther
net)
and
ISO
802-
3/IE
EE 8
02.3
(10B
ASE-
T) (D
evic
es a
vaila
ble
for s
ampl
ing)
LAN8
820i
RGM
II56
QFN
net
Wo
rK
inG
: A
rCn
et C
ontr
olle
rs
Con
trol
lers
Fea
turin
g D
eter
min
istic
Thr
ough
put
and
an O
pera
ting
Tem
pera
ture
Wel
l-Sui
ted
for
Indu
stria
l and
Em
bedd
ed N
etw
orki
ng E
nviro
nmen
ts
Prod
uct
Feat
ures
spee
dPi
nPa
ckag
es
COM
2001
9iCo
ntro
ller w
ith o
pera
ting
tem
pera
ture
rang
e of
−40
° to
85°
C31
2.5
Kbps
28/4
8PL
CC/T
QFP
COM
2002
0iCo
ntro
ller w
ith o
pera
ting
tem
pera
ture
rang
e of
−40
° to
85°
C5
Mbp
s28
/48
PLCC
/TQF
P
COM
2002
2iCo
ntro
ller w
ith o
pera
ting
tem
pera
ture
rang
e of
−40
° to
85°
C10
Mbp
s48
TQFP
TMC2
005
5-po
rt hu
b15
6.25
K–10
Mbp
s64
TQFP
HYC9
088A
R-L
FHi
gh-im
peda
nce
trans
ceive
r2.
5 M
bps
20SI
P
HYC2
000
High
-impe
danc
e tra
nsce
iver
156.
25–6
25 K
bps
8SI
P
HYC5
000
High
-impe
danc
e tra
nsce
iver
2.5M
–10
Mbp
s8
SIP
net
Wo
rK
inG
: Circl
ink®
Con
trol
lers
D
eriv
ativ
e of
AR
CN
ET, W
ell-S
uite
d fo
r In
dust
rial &
Com
mer
cial
Mac
hine
ry
Prod
uct
Feat
ures
spee
dPi
nPa
ckag
es
TMC2
074
Perip
hera
l and
sta
ndal
one
5 M
bps
128
VTQF
P
TMC2
072
Perip
hera
l5
Mbp
s10
0TQ
FP
TMC2
084
Stan
dalo
ne5
Mbp
s48
TQFP
AU
toM
oti
Ve:
Mo
st®
(M
edia
orien
ted
sys
tem
s tr
ansp
ort)
net
wor
k in
ferf
ace
Con
trol
lers
In
telli
gent
Net
wor
k In
terf
ace
Con
trol
ler
(INIC
) fo
r M
OS
T N
etw
orks
Prod
uct
Feat
ures
inte
rfac
ete
mpe
ratu
re r
ange
Pin
Pack
ages
OS81
110
INIC
Fully
-enc
apsu
late
d, s
ingl
e-ch
ip, e
mbe
dded
net
work
man
agem
ent,
supp
orts
MOS
T em
bedd
ed E
ther
net
chan
nel a
nd is
ochr
onou
s ch
anne
ls (M
OST1
50)
MOS
T150
FOT
or M
OST1
50 c
oax
trans
ceive
r, I²C
™, I
²S™
/SPD
IF, T
SI, S
PI,
Med
iaLB
®−4
0° to
105
°C48
QFN
OS81
082
INIC
Fully
-enc
apsu
late
d, s
ingl
e-ch
ip, e
mbe
dded
net
work
man
agem
ent (
MOS
T50)
MOS
T50
elec
trica
l (UT
P), I
²C, I
²S, M
edia
LB−4
0° to
95°
C64
ETQF
P
OS81
092
INIC
ROM
ver
sion
of O
S810
82 IN
IC (M
OST5
0)M
OST5
0 el
ectri
cal (
UTP)
, I²C
, I²S
, Med
iaLB
−40°
to 1
05°C
48QF
N
OS81
050
INIC
Fully
-enc
apsu
late
d, s
ingl
e-ch
ip w
ith e
mbe
dded
net
work
man
agem
ent (
MOS
T25)
MOS
T25
FOT,
I²C, I
²S, M
edia
LBSt
anda
rd ra
nge:
−40
° to
85°
C
Exte
nded
rang
e: −
40°
to 1
05°C
44Q
FP, E
TQFP
OS81
060
INIC
ROM
ver
sion
of O
S810
50 IN
IC (M
OST2
5)M
OST2
5 FO
T, I²C
, I²S
, Med
iaLB
−40°
to 1
05°C
(tar
gete
d)40
QFN
34 Focus Product Selector Guide
AU
toM
oti
Ve:
Pow
er M
anag
emen
t Com
pani
on
For
Dia
gnos
tics,
Sta
us M
onito
ring
and
Pow
er S
uppl
y
Prod
uct
Feat
ures
inte
rfac
ete
mpe
ratu
re r
ange
Pin
Pack
ages
MPM
8500
0Po
wer m
anag
emen
t com
pani
on fo
r dia
gnos
tics,
sta
tus
mon
itorin
g an
d po
wer s
uppl
yLI
N 2.
0, I²
C™−4
0° to
105
°C24
QFN
AU
toM
oti
Ve:
Mul
timed
ia i/
o C
ompa
nion
M
ultim
edia
I/O
Por
t Ex
pand
er
Prod
uct
Feat
ures
inte
rfac
ete
mpe
ratu
re r
ange
Pin
Pack
ages
OS85
650
Low-
cost
mul
timed
ia I/
O po
rt ex
pand
er, D
TCP
co-p
roce
ssor
Med
iaLB
3-p
in a
nd 6
-pin
, Hos
t Bus
In
terfa
ce (H
BI),
2 ×
mul
ti-ch
anne
l st
ream
ing
ports
, 2 ×
TSI
, 2 ×
SPI
, I²C
™−4
0° to
105
°C12
8ET
QFP
OS85
652
Low-
cost
mul
timed
ia I/
O po
rt ex
pand
erM
edia
LB 3
-pin
and
6-p
in, H
ost B
us
Inte
rface
(HBI
), 2
× m
ulti-
chan
nel
stre
amin
g po
rts, 2
× T
SI, 2
× S
PI, I
²C−4
0° to
105
°C12
8ET
QFP
OS85
656
Low-
cost
mul
timed
ia I/
O po
rt ex
pand
er w
ell-s
uite
d fo
r stre
amin
g ap
plic
atio
nsM
edia
LB 3
-pin
, stre
amin
g po
rt I²S
™ (F
SYN,
FCL
K, 4
× IN
, 4 ×
Out
, @ 5
12 F
s ),
seria
l tra
nspo
rt st
ream
inte
rface
(TSI
), I²C
−40°
to 1
05°C
48QF
N
OS85
654
Low-
cost
mul
timed
ia I/
O po
rt ex
pand
er w
ell-s
uite
d fo
r stre
amin
g ap
plic
atio
ns, D
TCP
co-p
roce
ssor
Med
iaLB
3-p
in, s
tream
ing
port
I²S (F
SYN,
FCL
K, 4
× IN
, 4 ×
Out
, @ 5
12 F
s ),
seria
l tra
nspo
rt st
ream
inte
rface
(TSI
), I²C
−40°
to 1
05°C
48QF
N
AU
toM
oti
Ve:
ethe
rnet
Con
trol
lers
1
0/1
00 E
ther
net
Con
trol
lers
with
US
B 2
.0, H
SIC
or
HB
I
Prod
uct
Feat
ures
inte
rfac
ete
mpe
ratu
re r
ange
Pin
Pack
ages
LAN8
9218
High
-per
form
ance
, sin
gle-
chip
con
trolle
r with
HP
Auto
-MDI
X su
ppor
t*M
AC/P
HY, 1
0BAS
E-T/
100B
ASE-
TX, 3
2- a
nd 1
6-bi
t Hos
t Bus
Inte
rface
(HBI
)−4
0° to
85°
C10
0TQ
FP
LAN8
9530
Hi-S
peed
USB
2.0
to 1
0/10
0 Et
hern
et c
ontro
ller
USB
2.0
−40°
to 8
5°C
56QF
N
LAN8
9730
Hi-S
peed
HSI
C to
10/
100
Ethe
rnet
con
trolle
rHS
IC−4
0° to
85°
C56
QFN
*H
P Au
to M
DIX
elim
inat
es t
he n
eed
for
spec
ial "
cros
sove
r" c
able
s w
hen
conn
ectin
g LA
N d
evic
es t
oget
her.
AU
toM
oti
Ve:
ethe
rnet
sw
itch
10
/100 M
anag
ed E
ther
net
Sw
itch
with
HP
Auto
-MD
IX S
uppo
rt
Prod
uct
Feat
ures
inte
rfac
ete
mpe
ratu
re r
ange
Port
sPi
nPa
ckag
es
LAN8
9303
High
-per
form
ance
, sm
all-f
ootp
rint,
full-
feat
ured
, sin
gle
MII/
RMII/
Turb
o M
II su
ppor
tM
II/RM
II, 2
× 1
0/10
0 PH
YS, 3
× 1
0/10
0 M
ACs
−40°
to 8
5°C
456
QFN
AU
toM
oti
Ve:
ethe
rnet
tra
nsce
iver
10
/100 E
ther
net
Tran
scei
ver
with
HP
Auto
-MD
IX S
uppo
rt*, F
eatu
ring
flexP
WR
® Te
chno
logy
Prod
uct
Feat
ures
inte
rfac
ete
mpe
ratu
re r
ange
Pin
Pack
ages
LAN8
8730
Smal
l-foo
tprin
t, lo
w-po
wer c
onsu
mpt
ion,
full-
feat
ured
10BA
SE-T
/100
BASE
-TX,
MII/
RMII
LAN8
8730
AM: −
40°
to 8
5°C
LAN8
8730
BM: −
40°
to 1
05°C
32QF
N
*H
P Au
to M
DIX
elim
inat
es t
he n
eed
for
spec
ial "
cros
sove
r" c
able
s w
hen
conn
ectin
g LA
N d
evic
es t
oget
her.
AU
toM
oti
Ve:
Hi-s
peed
Usb
2.0
Hub
U
SB
2.0
Hub
Fea
turin
g M
ultiT
RAK
™ T
echn
olog
y
Prod
uct
Feat
ures
inte
rfac
ete
mpe
ratu
re r
ange
Port
sPi
nPa
ckag
es
USB8
2512
Vers
atile
, cos
t-effe
ctive
, ene
rgy-e
ffici
ent,
inco
rpor
atin
g M
ultiT
RAK™
, Por
tMap
, Por
tSwa
p, P
HYBo
ost t
echn
olog
ies
SMBu
s/I²C
™−4
0° to
85°
C2
36QF
N
USB8
2513
Vers
atile
, cos
t-effe
ctive
, ene
rgy-e
ffici
ent,
inco
rpor
atin
g M
ultiT
RAK,
Por
tMap
, Por
tSwa
p, P
HYBo
ost t
echn
olog
ies
SMBu
s/I²C
−40°
to 8
5°C
336
QFN
USB8
2514
Vers
atile
, cos
t-effe
ctive
, ene
rgy-e
ffici
ent,
inco
rpor
atin
g M
ultiT
RAK,
Por
tMap
, Por
tSwa
p, P
HYBo
ost t
echn
olog
ies
SMBu
s/I²C
−40°
to 8
5°C
436
QFN
AU
toM
oti
Ve:
Hi-s
peed
Usb
2.0
Hub
and
Fla
sh M
edia
Car
d Con
trol
lers
US
B 2
.0 H
ub a
nd C
ard
Con
trol
ler
Com
bos
Prod
uct
Feat
ures
sock
et
type
supp
orts
tem
pera
ture
r
ange
Usb
Port
sPi
nPa
ckag
es
USB8
2640
Feat
ures
Por
tMap
, Por
tSwa
p an
d PH
YBoo
st te
chno
logi
esSi
ngle
SD™
/SD
High
Cap
acity
™/M
ultiM
edia
Card
™/M
emor
y St
ick®
/MS
PRO™
, MS
PRO-
HG™
−40°
to 8
5°C
248
QFN
USB8
2642
USB
brid
ge/c
ard
read
er c
ombo
with
USB
to S
DIO
and
USB
to I²
C™ b
ridgi
ng fu
nctio
nalit
y an
d Po
rtMap
, Por
tSwa
p an
d PH
YBoo
st te
chno
logi
esSi
ngle
SD/S
D Hi
gh C
apac
ity/M
ultiM
edia
Card
/Mem
ory
Stic
k/M
S PR
O, M
S PR
O-HG
−40°
to 8
5°C
248
QFN
USB8
2662
USB
brid
ge/c
ard
read
er c
ombo
with
USB
to S
DIO
and
USB
to I²
C br
idgi
ng fu
nctio
nalit
y an
d Po
rtMap
, Por
tSwa
p an
d PH
YBoo
st te
chno
logi
esDu
alSD
/SD
High
Cap
acity
/Mul
tiMed
iaCa
rd/M
emor
y St
ick/
MS
PRO,
MS
PRO-
HG−4
0° to
105
°C2
64QF
N
AU
toM
oti
Ve:
Hi-s
peed
Usb
2.0
tra
nsce
iver
US
B 2
.0 T
rans
ceiv
er w
ith 1
.8V
ULP
I Int
erfa
ce
Prod
uct
Feat
ures
inte
rfac
ete
mpe
ratu
re r
ange
Port
sPi
nPa
ckag
es
USB8
3340
Mul
ti-fre
quen
cy re
fere
nce
cloc
k1.
8V U
LPI
−40°
to 1
05°C
132
QFN
35Focus Product Selector Guide
AU
toM
oti
Ve:
Hi-s
peed
Usb
2.0
bat
tery
Cha
rger
Sta
ndal
one
US
B B
atte
ry C
harg
er
Prod
uct
Feat
ures
tem
pera
ture
ran
gesu
ppor
tsPi
nPa
ckag
es
UCS8
1001
USB
batte
ry c
harg
er s
uppo
rting
BC1
.2, C
hina
cha
rgin
g, A
pple
® a
nd R
IM®
cha
rgin
g pr
ofile
s as
wel
l as
prog
ram
mab
le c
harg
ing
profi
les
for u
nfor
esee
n pe
riphe
rals
−40°
to 8
5°C
USB,
I2 C™
, SM
Bus
28QF
N
UCS8
1002
USB
batte
ry c
harg
er s
uppo
rting
BC1
.2, C
hina
cha
rgin
g, A
pple
and
RIM
cha
rgin
g pr
ofile
s as
wel
l as
prog
ram
mab
le c
harg
ing
profi
les
for u
nfor
esee
n pe
riphe
rals
−40°
to 8
5°C
USB,
I2 C, S
MBu
s28
QFN
AU
toM
oti
Ve:
Wirel
ess
Aud
ioR
adio
Req
uenc
y D
igita
l Aud
io T
rans
ceiv
er
Prod
uct
Feat
ures
typi
cal s
ink
Mod
e Po
wer
Co
nsum
ptio
nPA
out
put P
ower
Audi
oQ
ualifi
catio
n
KLR8
3012
Wire
less
ly st
ream
s un
com
pres
sed
loss
less
aud
io u
p to
25m
ove
r rob
ust 2
.4 G
Hz ra
dio
link,
mul
ti-po
int t
o m
ulti-
poin
t con
nect
ivity
, stro
ng W
i-Fi®
coe
xiste
nce,
dat
a ch
anne
l fo
r aud
io p
layb
ack
cont
rol,
very
low
powe
r con
sum
ptio
n20
mW
1.5
dBm
16 b
it, 4
4.1
Ks/s
ste
reo
AEC
Q100
AU
toM
oti
Ve:
Cap
aciti
ve t
ouch
sen
sors
Prod
uct
Feat
ures
inpu
t Cha
nnel
sle
D D
river
sPr
oxim
ity in
clud
edin
terf
ace
Pin
Pack
ages
CAP8
1188
Rese
t, wa
ke a
nd a
lert,
aut
omat
ic re
calib
ratio
n, b
ase
capa
cita
nce
com
pens
atio
n8
8ü
I2 C™
/SPI
/SM
SC B
C-Li
nk™
24QF
N
PC s
Yste
M &
i/o
Co
ntr
oll
ers:
not
eboo
k P
C P
rodu
cts
Embe
dded
Con
trol
ler
and
I/O
Dev
ices
for
Not
eboo
k PC
Pla
tfor
ms
Prod
uct
Feat
ures
i/o
Por
tssy
stem
inte
rfac
ePi
nPa
ckag
es
MEC
1621
32-b
it em
bedd
ed c
ontro
ller w
ith 1
92K
byte
s em
bedd
ed fl
ash,
1K
byte
s EE
PROM
, 16K
byt
es S
RAM
, ADC
, te
mp
sens
ing,
con
nect
ed s
tand
by s
uppo
rt3
PS/2
, 3 S
MBu
s, 2
SPI
, 16
PWM
, 6 ta
chs,
1 s
eria
l (2-
pin)
, 16
ADC
chan
nels
, 4
tem
p in
puts
, 3 L
ED, 1
HDM
I-CEC
, 146
GPI
Os, 3
SM
SC B
C-Li
nk™
LPC/
SMBu
s17
6/22
5LF
BGA,
LFB
GA
MEC
1620
32-b
it em
bedd
ed c
ontro
ller w
ith 1
92K
byte
s em
bedd
ed fl
ash,
1K
byte
s EE
PROM
, 16K
byt
es S
RAM
, ADC
, co
nnec
ted
stan
dby
supp
ort
3 PS
/2, 3
SM
Bus,
2 S
PI, 1
6 PW
M, 6
tach
s, 1
ser
ial (
2-pi
n), 1
6 AD
C ch
anne
ls, 3
LED
, 1
HDM
I-CEC
, 153
GPI
Os, 3
SM
SC B
C-Li
nkLP
C/SM
Bus
176
LFBG
A, L
FBG
A
MEC
1308
8-bi
t em
bedd
ed c
ontro
ller w
ith 6
4K b
ytes
SRA
M, S
PI F
lash
Mem
ory
Inte
rface
, ADC
, Con
sum
er IR
, SM
SC B
C-Li
nk te
chno
logy
4 PS
/2, 2
SM
Bus,
4 P
WM
s, 2
tach
s, 1
ser
ial (
2-pi
n), 5
5 GP
IOs,
RC-
6 CI
R, 1
SM
SC B
C-Li
nkLP
C/SM
Bus
128/
144
VTQ
FP, T
FBG
A
MEC
1312
8-bi
t em
bedd
ed c
ontro
ller w
ith 9
6K b
ytes
SRA
M, S
PI F
lash
Mem
ory
Inte
rface
, PEC
I, AD
C, P
ID F
an C
ontro
l, SM
SC B
C-Li
nk te
chno
logy
4 PS
/2, 3
SM
Bus,
PEC
I, 4
PWM
s, 2
tach
s, 1
ser
ial (
2-pi
n), 6
3 GP
IOs,
1 S
MSC
BC-
Link
LPC/
SMBu
s12
8VT
QFP
SIO1
028
Supe
r I/O
con
trolle
r, sm
all f
orm
fact
or p
acka
ge3
seria
l, 24
GPI
OsLP
C64
QFN
LPC4
7N21
7Su
per I
/O c
ontro
ller f
or n
oteb
ook
and
embe
dded
PC
appl
icat
ions
1 se
rial,
1 pa
ralle
l, 14
GPI
Os, I
rDA®
, CIR
LPC
64/5
6ST
QFP
LPC4
7N21
7NSu
per I
/O c
ontro
ller f
or n
oteb
ook
and
embe
dded
PC
appl
icat
ions
1 se
rial,
1 pa
ralle
l, 14
GPI
OsLP
C64
/56
STQ
FP, Q
FN
ECE1
088
GPIO
exp
ande
r with
SM
SC B
C-Li
nk te
chno
logy
20 G
PIOs
SMBu
s or
SM
SC B
C-Li
nk28
QFN
ECE1
099
GPIO
exp
ande
r with
Key
scan
and
SM
SC B
C-Li
nk te
chno
logy
32 G
PIOs
, 23:
8 Ke
ysca
nSM
Bus
or S
MSC
BC-
Link
40QF
N
ECE1
105
GPIO
exp
ande
r with
Key
scan
, PS/
2 an
d SM
SC B
C-Li
nk te
chno
logy
40 G
PIOs
, 23:
8 Ke
ysca
n, 2
PS/
2SM
Bus
or S
MSC
BC-
Link
48QF
N
PC s
Yste
M &
i/o
Co
ntr
oll
ers:
Des
ktop
PC P
rodu
cts
Embe
dded
Con
trol
ler
and
Hig
hly-
Inte
grat
ed S
uper
I/O
Dev
ices
for
Des
ktop
PC
Pla
tfor
ms
Prod
uct
Feat
ures
i/o
Por
tssy
stem
inte
rfac
ePi
nPa
ckag
es
SCH5
636
Desk
top
embe
dded
con
trolle
r, em
bedd
ed S
RAM
for c
usto
m a
pplic
atio
ns, c
lose
d-lo
op fa
n co
ntro
l, PE
CI 3
.0 s
uppo
rt,
tem
pera
ture
and
vol
tage
mon
itorin
gFD
C, p
aral
lel,
2 se
rial,
8042
KB
cont
rolle
r, 2
SMBu
s, 4
PW
Ms,
4 ta
chs,
60
GPIO
sLP
C12
8QF
P
SCH5
627
Desk
top
embe
dded
con
trolle
r, SM
Bus
mas
ter f
or P
CH te
mpe
ratu
re s
uppo
rt, P
ECI 3
.0 s
uppo
rt, v
olta
ge m
onito
ring
FDC,
par
alle
l, 2
seria
l, 80
42 K
B co
ntro
ller,
2 SM
Bus,
4 P
WM
s, 4
tach
s, 6
0 GP
IOs
LPC
128
QFP
SCH5
627P
Desk
top
embe
dded
con
trolle
r with
“XL
S5”
powe
r sav
ings
mod
e, S
MBu
s m
aste
r for
PCH
tem
pera
ture
sup
port,
PE
CI 3
.0 s
uppo
rt an
d vo
ltage
mon
itorin
gFD
C, p
aral
lel,
2 se
rial,
8042
KB
cont
rolle
r, 2
SMBu
s, 4
PW
Ms,
4 ta
chs,
60
GPIO
sLP
C12
8QF
P
SCH5
147
Supe
r I/O
con
trolle
r, LP
C ha
rdwa
re m
onito
ring,
PEC
I sup
port,
vol
tage
mon
itorin
gFD
C, p
aral
lel,
2 se
rial,
8042
KB
cont
rolle
r, 2
SMBu
s, 3
PW
Ms,
3 ta
chs,
29
GPIO
sLP
C12
8QF
P
PC s
Yste
M &
i/o
Co
ntr
oll
ers:
ser
ver/
Wor
ksta
tion
Pro
duct
sEm
bedd
ed C
ontr
olle
r an
d S
uper
I/O
Dev
ices
for
Ser
ver
and
Wor
ksta
tion
PC P
latf
orm
s
Prod
uct
Feat
ures
i/o
Por
tssy
stem
inte
rfac
ePi
nPa
ckag
es
SCH4
304
Supe
r I/O
con
trolle
r, X-
Bus
inte
rface
, RTC
and
aut
o fa
n co
ntro
l ove
r Sen
sorB
us™
sen
sor i
nter
face
FDC,
par
alle
l, 2
seria
l, 80
42 K
B co
ntro
ller,
SMBu
s, 3
PW
Ms,
8 ta
chs,
51
GPIO
sLP
C12
8QF
P
PC s
Yste
M &
i/o
Co
ntr
oll
ers:
embe
dded
i/o
Pro
duct
sH
ighl
y-In
tegr
ated
Sup
er i/
O D
evic
es w
ith L
ong
Prod
uct
Life
cycl
es f
or E
mbe
dded
PC
Pla
tfor
ms
Prod
uct
Feat
ures
i/o
Por
tssy
stem
inte
rfac
ePi
nPa
ckag
es
SCH3
112
Supe
r I/O
con
trolle
r with
SM
Bus
hard
ware
and
vol
tage
mon
itorin
g2
seria
l, pa
ralle
l, FD
C, 8
042
KB c
ontro
ller,
40 G
PIOs
LPC
128
VTQF
P
SCH3
114
Supe
r I/O
con
trolle
r with
SM
Bus
hard
ware
and
vol
tage
mon
itorin
g4
seria
l, pa
ralle
l, FD
C, 8
042
KB c
ontro
ller,
40 G
PIOs
LPC
128
VTQF
P
SCH3
116
Supe
r I/O
con
trolle
r with
SM
Bus
hard
ware
and
vol
tage
mon
itorin
g6
seria
l, pa
ralle
l, FD
C, 8
042
KB c
ontro
ller,
40 G
PIOs
LPC
128
VTQF
P
LPC4
7M10
XSu
per I
/O c
ontro
ller,
full
lega
cy I/
O su
ppor
t2
seria
l por
ts, p
aral
lel,
8042
KB
cont
rolle
r, FD
C, 3
7 GP
IOs
LPC
100
QFP
SIO1
ON26
8Su
per I
/O c
ontro
ller f
or IS
A or
LPC
des
igns
, X-B
us in
terfa
ce fo
r I/O
mem
ory
and
FWH
emul
atio
n4
seria
l por
ts, p
aral
lel,
FDC,
WDT
, 33
GPIO
sLP
C/IS
A12
8VT
QFP
FDC3
7B78
XSu
per I
/O c
ontro
ller,
real
-tim
e cl
ock,
con
sum
er IR
, wat
chdo
g tim
er, 5
V op
erat
ion
2 se
rial p
orts
, par
alle
l, FD
C, 8
042
KB c
ontro
ller,
para
llel I
RQs,
ser
ial I
RQs,
20
GPIO
sIS
A12
8QF
P
36 Focus Product Selector Guide
CA
PACit
iVe
toU
CH
sen
so
rs
Prod
uct
inpu
t Cha
nnel
sle
D D
river
sAd
ditio
nal F
eatu
res
Prox
imity
incl
uded
inte
rfac
ePi
nPa
ckag
es
CAP1
114
1411
Slid
er, r
eset
and
ale
rt, a
utom
atic
reca
libra
tion,
bas
e ca
paci
tanc
e co
mpe
nsat
ion
üI²C
™/S
MBu
s32
QFN
CAP1
188
88
Rese
t, wa
ke a
nd a
lert,
aut
omat
ic re
calib
ratio
n, b
ase
capa
cita
nce
com
pens
atio
nü
I²C/S
PI/S
MSC
BC-
Link
™24
QFN
CAP1
128
82
Rese
t, wa
ke a
nd a
lert,
aut
omat
ic re
calib
ratio
n, b
ase
capa
cita
nce
com
pens
atio
nü
I²C/S
PI/S
MSC
BC-
Link
20QF
N
CAP1
166
66
Rese
t, wa
ke a
nd a
lert,
aut
omat
ic re
calib
ratio
n, b
ase
capa
cita
nce
com
pens
atio
nü
I²C/S
PI/S
MSC
BC-
Link
20QF
N
CAP1
126
62
Rese
t, wa
ke a
nd a
lert,
aut
omat
ic re
calib
ratio
n, b
ase
capa
cita
nce
com
pens
atio
nü
I²C/S
PI/S
MSC
BC-
Link
16QF
N
CAP1
133
33
Aler
t, au
tom
atic
reca
libra
tion,
bas
e ca
paci
tanc
e co
mpe
nsat
ion
üI²C
/SM
Bus
10DF
N
CAP1
106
60
Aler
t, au
tom
atic
reca
libra
tion,
bas
e ca
paci
tanc
e co
mpe
nsat
ion
üI²C
/SM
SC B
C-Li
nk10
DFN
CAP1
105
50
Auto
mat
ic re
calib
ratio
n, b
ase
capa
cita
nce
com
pens
atio
nü
SPI
10DF
N
CAP1
214
1411
Slid
er, r
eset
and
ale
rt, a
utom
atic
reca
libra
tion,
bas
e ca
paci
tanc
e co
mpe
nsat
ion,
aud
io o
utpu
tü
I²C/S
MBu
s32
QFN
Wir
eles
s A
UD
io:
Hig
hly
inte
grat
ed W
irel
ess
Aud
io b
aseb
and
Pro
cess
ors
Prod
uct
Addi
tiona
l Fea
ture
sFr
eque
ncy
inte
rfac
ePi
nPa
ckag
es
DARR
82Su
ppor
ts s
tream
ing
of fo
ur w
irele
ss u
ncom
pres
sed
ster
eo a
udio
cha
nnel
s si
mut
aneo
usly
or c
ompl
ete
wire
less
7.1
cha
nnel
sur
roun
d so
und
syst
em, l
aten
cy <
20
ms,
poi
nt-to
-mul
ti-po
int t
rans
mis
sion
in
hom
e au
dio
netw
orki
ng, S
D &
HD a
udio
, exc
elle
nt W
i-Fi®
and
Blu
etoo
th®
coe
xiste
nce,
bi-d
irect
iona
l aud
io s
uppo
rt, c
ontro
l dat
a ch
anne
l up
to 1
00kb
ps, i
nteg
rate
d M
CU a
nd S
RCDu
al-b
and
2.4/
5.8G
HzI²S
, S/P
DIF,
I²C™
, SPI
80LQ
FP
DARR
83Su
ppor
ts s
tream
ing
of fo
ur w
irele
ss u
ncom
pres
sed
ster
eo a
udio
cha
nnel
s si
mut
aneo
usly
or c
ompl
ete
wire
less
7.1
cha
nnel
sur
roun
d so
und
syst
em, l
aten
cy <
20
ms,
poi
nt-to
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ti-po
int t
rans
mis
sion
in
hom
e au
dio
netw
orki
ng, S
D &
HD a
udio
, exc
elle
nt W
i-Fi a
nd B
luet
ooth
coe
xiste
nce,
bi-d
irect
iona
l aud
io s
uppo
rt, c
ontro
l dat
a ch
anne
l up
to 1
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ps, i
nteg
rate
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CU a
nd S
RC, i
nteg
rate
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dio
clas
s US
BTr
i-ban
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/PDI
F, I²C
, SPI
, USB
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129
FBGA
DARR
84Su
ppor
ts s
tream
ing
of tw
o wi
rele
ss u
ncom
pres
sed
ster
eo a
udio
cha
nnel
s si
mul
tane
ousl
y, s
uppo
rts a
mic
roph
one
inpu
t for
voi
ce a
pplic
atio
ns, l
aten
cy <
20
ms,
poi
nt-to
-mul
ti-po
int t
rans
mis
sion
, SD
& HD
aud
io, e
xcel
lent
Wi-F
i and
Blu
etoo
th c
oexis
tenc
e us
ing
Wire
less
DNA
TM te
chno
logy
, con
trol d
ata
chan
nel u
p to
100
kbp
s, in
tegr
ated
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and
SRC
, int
egra
ted
code
c an
d he
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ampl
ifier
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head
set a
pplic
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nsTr
i-ban
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/PDI
F, I²C
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ked
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ia p
roce
ssor
, hig
hly-fl
exib
le in
terfa
ce p
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wel
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ted
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ecur
e, re
al ti
me
enco
ding
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odin
g an
d pr
oces
sing
of m
ulti-
chan
nel m
edia
con
tent
, offe
ring
indu
stry
sta
ndar
d ne
twor
king
an
d I/
O in
terfa
ces,
ena
bles
rapi
d pr
oduc
t dev
elop
men
t by
OEM
s an
d OD
Ms,
API
stru
ctur
e on
the
softw
are
pack
ages
allo
ws fo
r eas
y pr
oduc
t cus
tom
izatio
n re
sulti
ng in
a fa
ster
tim
e to
mar
ket.
2.4G
Hz, 8
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1 b/
gI²S
, S/P
DIF,
I²C, U
SB, S
D/SD
IO, E
ther
net,
TFT
for
Disp
lay,
SPI,
CCIR
656
out
320
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A
DM87
5Re
duce
d fe
atur
e se
t ver
sion
of t
he D
M87
0A w
ith n
o LC
D an
d vid
eo o
utpu
t cap
abili
ty, w
ell-s
uite
d fo
r cus
tom
er a
pplic
atio
ns th
at s
uppo
rt st
anda
rd s
oftw
are
AirP
lay ®
sof
twar
e pa
ckag
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4GHz
, 802
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/PDI
F, I²C
, USB
, SD/
SDIO
, Eth
erne
t, SP
I,32
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BGA
DM86
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aila
ble
as a
n al
tern
ative
to D
M87
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ith n
o W
i-Fi c
apab
ility
.–
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/PDI
F, I²C
, USB
, SD/
SDIO
, Eth
erne
t, TF
T fo
r Di
spla
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I, CC
IR 6
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ut32
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BGA
Wir
eles
s A
UD
io:
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esig
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atur
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e D
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sion
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sed
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less
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ital a
udio
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ver O
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odul
es b
ased
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nd D
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p to
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o st
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ata
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ging
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omat
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atic
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Sing
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GHz
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™ ,S
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Con
nect
or42
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e PC
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sed
wire
less
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ital a
udio
tran
scei
ver O
EM m
odul
es b
ased
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nd D
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p to
four
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ata
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i-di
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omat
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atic
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onne
ctor
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mm
Squ
are
PCB
DWUS
B83
Unco
mpr
esse
d wi
rele
ss d
igita
l aud
io tr
ansc
eive
r OEM
mod
ules
bas
ed o
n th
e DA
RR82
and
DAR
R83
chip
sets
, sup
ports
up
to fo
ur s
tere
o au
dio
stre
ams,
dat
a en
cryp
tion,
bi-
dire
ctio
nal c
ontro
l mes
sagi
ng, a
utom
atic
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ring,
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N de
tect
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aut
omat
ic fr
eque
ncy
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nTr
i-ban
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mm
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Unco
mpr
esse
d wi
rele
ss d
igita
l aud
io tr
ansc
eive
r OEM
mod
ule
base
d on
the
DARR
82 c
hip,
sup
ports
up
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o st
ereo
aud
io s
tream
s, d
ata
encr
yptio
n,
bi-d
irect
iona
l con
trol m
essa
ging
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omat
ic p
airin
g, W
LAN
dete
ctio
n, a
utom
atic
freq
uenc
y al
loca
tion,
wel
l-sui
ted
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ecei
ver a
pplic
atio
ns s
uch
as s
peak
ers
Tri-b
and,
2.4
/5.2
/5.8
GHz
USB
–30
× 2
6.8
mm
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82Un
com
pres
sed
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less
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ital a
udio
tran
scei
ver O
EM m
odul
e ba
sed
on th
e DA
RR82
chi
p, s
uppo
rts u
p to
two
ster
eo a
udio
stre
ams,
dat
a en
cryp
tion,
bi
-dire
ctio
nal c
ontro
l mes
sagi
ng, a
utom
atic
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ring,
WLA
N de
tect
ion,
aut
omat
ic fr
eque
ncy
allo
catio
n, w
ell-s
uite
d fo
r rec
eive
r app
licat
ions
suc
h as
spe
aker
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ngle
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.4 G
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DIF,
I²C, S
PI26
-pin
Pin
Hea
der C
onne
ctor
30 ×
50
mm
Rec
tang
le
37Focus Product Selector Guide
Wir
eles
s A
UD
io:
Hig
hly-
inte
grat
ed W
irel
ess
Aud
io M
odul
esPr
oduc
tFe
atur
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eque
ncy
inte
rfac
ePi
nM
odul
e D
imen
sion
s
DWHS
84Un
com
pres
sed
wire
less
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ital a
udio
read
y-to-
go h
eads
et a
nd h
eadp
hone
app
licat
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refe
renc
e de
sign
that
sup
ports
aud
io a
nd m
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phon
e in
puts
to p
roce
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amin
g an
d VO
IP h
eads
ets/
head
phon
e ap
plic
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ns, s
uppo
rts m
ultip
le R
F ba
nds
mak
ing
it we
ll-su
ited
to e
ffect
ively
man
age
the
inte
rfere
nce
com
mon
ly as
soci
ated
with
Wi-F
i®, B
luet
ooth
® an
d m
icro
wave
ove
ns, u
sing
our
W
irele
ss D
NA a
rchi
tect
ure,
inte
grat
es 1
MB
SPI F
lash
, ena
blin
g SM
SC’s
Kle
erNe
t™ in
tero
pera
bilit
y pl
atfo
rm w
hich
allo
ws fo
r con
nect
ivity
acr
oss
prod
ucts
and
bra
nds
Tri-b
and
2.
4/5.
2/5.
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, S/P
DIF,
I²C™
, SPI
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× 5
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mm
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84Un
com
pres
sed
wire
less
dig
ital a
udio
tran
scei
ver O
EM m
odul
e ba
sed
on th
e DA
RR84
chi
p, s
uppo
rts u
p to
two
ster
eo a
udio
stre
ams,
dat
a en
cryp
tion,
bi-d
irect
iona
l con
trol m
essa
ging
, au
tom
atic
pai
ring,
WLA
N de
tect
ion,
exc
elle
nt W
i-Fi a
nd B
luet
ooth
coe
xiste
nce
usin
g W
irele
ss D
NA a
rchi
tect
ure,
wel
l-sui
ted
for a
pplic
atio
ns s
uch
as s
peak
ers
and
soun
dbar
s wi
th s
ubwo
ofer
sTr
i-ban
d
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m
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rd, n
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laye
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edia
pro
cess
ors,
ena
bles
fast
pro
duct
dev
elop
men
ts w
ith E
ther
net,
USB
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i con
nect
ivity
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nect
s to
sta
ndar
d le
gacy
com
pone
nts
in v
ario
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udio
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eo/L
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ontro
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s.2.
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erne
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T fo
r Dis
play
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mm
Wir
eles
s A
UD
io:
rad
io F
requ
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Dig
ital A
udio
tra
nsce
iver
s
Prod
uct
Feat
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typi
cal s
ink
Mod
e Po
wer
Con
sum
ptio
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out
put P
ower
Audi
oQ
ualifi
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Wire
less
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ream
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com
pres
sed
loss
less
aud
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p to
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ust 2
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dio
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mul
ti-po
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o m
ulti-
poin
t con
nect
ivity
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ng W
i-Fi®
coe
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nce,
dat
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anne
l for
aud
io
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trol,
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itY:
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art
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ncry
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mily
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nter
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ates
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Anal
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nit
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Univ
ersa
l Syn
chro
nous
Asy
nchr
onou
s Re
ceiv
er
Tran
scei
ver
U
sb
Un
iver
sal S
eria
l Bus
U
sb
(Fu
ll spe
ed)
12 M
b/s
Dat
a Ra
te
Usb
otG
US
B O
n-Th
e-G
o
xlP
na
noW
att X
LP e
Xtre
me
Low
Pow
er T
echn
olog
y
38 Focus Product Selector Guide
Plas
tic
Thin
shr
ink
smal
l out
line
Tsso
P
20-le
ad T
SS
OP
(ST)
14-le
ad T
SS
OP
(ST)
8-le
ad T
SS
OP
(ST)
Plas
tic
shrin
k sm
all o
utlin
ess
oP
8-le
ad M
SO
P (M
S)
10-le
ad M
SO
P (U
N)
16-le
ad Q
SO
P (Q
R)
20-le
ad S
SO
P (S
S)
28-le
ad S
SO
P (S
S)
smal
l o
utlin
ed
ual f
lat
no
Lead
dfn
8-le
ad D
FN (M
C)
2 ×
3 ×
0.9
mm
8-le
ad D
FN (M
F)3
× 3
× 0.
9 m
m
8-le
ad D
FN (M
F)6
× 5
× 0.
9 m
m
8-le
ad D
FN (M
D)
4 ×
4 ×
0.9
mm
Qua
d fl
at n
o Le
adQ
fnPl
asti
c sm
all o
utlin
eso
iC
18-le
ad S
OIC
(SO
)
28-le
ad S
OIC
(SO
)
20-le
ad S
OIC
(SO
)
8-le
ad S
OIC
(SM
)
8-le
ad S
OIC
(SN
)
16-le
ad S
OIC
(SL)
14-le
ad S
OIC
(SL)
Pack
ages
are
sho
wn
appr
oxim
ate
size
.Ad
ditio
nal p
acka
ges
are
avai
labl
e: c
onta
ct y
our
loca
l Mic
roch
ip s
ales
offi
ce fo
r in
form
atio
n.Fo
r de
taile
d di
men
sion
s, v
iew
our
Pac
kage
Dra
win
g an
d D
imen
sion
s S
peci
fi cat
ion
at: w
ww.
mic
roch
ip.c
om/p
acka
ging
.
Die
/Waf
er(W
LCS
P)
5-le
ad S
C70
(LT)
3-le
ad S
OT-
23
(TT/
CB
)
5-le
ad S
OT-
23
(OT)
6-le
ad S
OT-
23
(OT/
CH
)
3-le
ad S
C70
(LB
)
3-S
OT-
223
(DB
)
4-le
ad S
OT-
143
(RC
)
3-le
ad T
O-9
2 (T
O/Z
B)
3-le
ad D
DPA
K (E
B)
5-le
ad D
DPA
K (E
T)
3-le
ad S
OT-
89
5-le
ad T
O-2
20 (A
T)
Bum
ped
Die
(W
LCS
P)
8-le
ad T
DFN
(MN
)2
× 3
× 0.
75 m
m
8-le
ad U
DFN
(MU
)2
× 3
× 0.
5 m
m20
-lead
QFN
(MQ
)5
× 5
× 0.
9 m
m
20-le
ad Q
FN (M
L)4
× 4
× 0.
9 m
m
16-le
ad Q
FN (M
G)
3 ×
3 ×
0.9
mm
44-le
ad Q
FN (M
L)8
× 8
× 0.
9 m
m
64-le
ad Q
FN (M
R)
9 ×
9 ×
0.9
mm
28-le
ad U
QFN
(MV)
4 ×
4 ×
0.5
mm
40-le
ad U
QFN
(MV)
5 ×
5 ×
0.5
mm
28-le
ad Q
FN (M
M &
ML)
6 ×
6 ×
0.9
mm
28-le
ad Q
FN (M
Q)
5 ×
5 ×
0.9
mm
Prod
uct
Pack
ages
Very
Thi
n Th
erm
al L
eadl
ess
arr
ayVT
La
36-le
ad V
TLA
(TL)
5 ×
5 ×
0.9
mm
44-le
ad V
TLA
(TL)
6 ×
6 ×
0.9
mm
124-
lead
VTL
A (T
L)9
× 9
× 0.
9 m
m
39Focus Product Selector Guide
Plas
tic
Qua
d fl
atpa
ck
QfP
Plas
tic
Thin
Qua
d fl
atpa
ckTQ
fP
64-le
ad T
QFP
(PF)
14 ×
14
× 1
mm
80-le
ad T
QFP
(PT)
12 ×
12
× 1
mm
44-le
ad T
QFP
(PT)
10 ×
10
× 1
mm
64-le
ad T
QFP
(PT)
10 ×
10
× 1
mm
100-
lead
TQ
FP (P
T)12
× 1
2 ×
1 m
m
80-le
ad T
QFP
(PF)
14 ×
14
× 1
mm
100-
lead
TQ
FP (P
F)14
× 1
4 ×
1 m
m
8-le
ad P
DIP
(P)
18-le
ad P
DIP
(P)
28-le
ad S
PDIP
(SP)
40-le
ad P
DIP
(P)
20-le
ad P
DIP
(P)
14-le
ad P
DIP
(P)
24-le
ad P
DIP
(P)
Plas
tic
dua
l in-
Line
Pd
iPa
ddit
iona
lPa
ckag
e o
ptio
ns
100-
ball
BG
A (B
G)
10 ×
10
× 1.
1 m
m
Bal
l Grid
arr
ayB
Ga
8-le
ad W
SO
N (A
6/Q
AE)
5 ×
6 m
m
32-le
ad P
DIP
(P2/
PHE)
600
mil
48-le
ad T
SO
P (W
9/EK
E)12
× 2
0 ×
1.2
mm
48-le
ad W
FBG
A (3
T/M
AQE)
4 ×
6 ×
0.73
mm
40-le
ad T
SO
P (W
8/EI
E)10
× 2
0 m
m
32-le
ad P
LCC
(PE/
NH
E)0.
452"
× 0
.552
"
48-le
ad T
FBG
A (8
T/B
3KE)
6 ×
8 ×
1.2
mm
no
r f
lash
mem
ory
16-le
ad L
FLG
A (M
F/M
LCF)
4 ×
4 ×
1.4
mm
8-le
ad X
SO
N (Q
7/Q
X8E)
2 ×
2 ×
0.5
mm
6-le
ad X
SO
N (Q
X/Q
X6E)
1.5
× 1.
5 ×
0.5
mm
44-le
ad P
LCC
(T2/
NJE
)0.
652"
× 0
.652
"
6-le
ad U
QFN
(QU
/QU
6E)
3 ×
1.6
× 0.
5 m
m
8051
-bas
edm
icro
cont
rolle
rs
rf
dev
ices
121-
ball
BG
A (B
G)
10 ×
10
× 0.
8 m
m
144-
lead
TQ
FP (P
H)
16 ×
16
× 1
mm
32-le
ad L
QFP
(LQ
)7
× 7
× 1.
4 m
m
44-le
ad M
QFP
(PQ
)10
× 1
0 ×
2 m
m
144-
lead
LQ
FP (P
L)20
× 2
0 ×
1.4
mm
Prod
uct
Pack
ages
Pack
ages
are
sho
wn
appr
oxim
ate
size
.Ad
ditio
nal p
acka
ges
are
avai
labl
e: c
onta
ct y
our
loca
l Mic
roch
ip s
ales
offi
ce fo
r in
form
atio
n.Fo
r de
taile
d di
men
sion
s, v
iew
our
Pac
kage
Dra
win
g an
d D
imen
sion
s S
peci
fi cat
ion
at: w
ww.
mic
roch
ip.c
om/p
acka
ging
.
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11/27/12
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