SML-D12x8/D13x8 Series

SML-D12x8/D13x8 SeriesData Sheet

■Features ■Outline• EXCELEDTM series• Original device technology enables high brightness

and high reliability

■Size

■Dimensions ■Recommended Solder Pattern

■Moisture sensitivity level(MSL) : Level 3

■Specifications

Typ. IF Max. VR Min.*2 Typ. Max.*2 IF Min. Typ. IF

(V) (mA) (µA) (V) (nm) (nm) (nm) (mA) (mcd) (mcd) (mA)

625 630 635 16 40

615 620 625 25 63

602 605 608 40 100

587 590 593 25 63

569 572 575 10 25

557 560 563 2.5 6.3

2.1 615 620 625 40 70

587 590 593 63 100

569 572 575 16 30

*EXCELEDTM is ROHM's pending trademark.

Topr(ºC) Tstg(ºC)

EXCELEDTM

Yellowish green

ReverseOperating Temp. Storage Temp.

*1:Duty1/10, 1kHz *2:Measurement torelance：±1nm

IFP(mA) VR(V)

Current Current Voltage

AlGaInP

Red

54

20 20

Orange

Yellow

Green

Red 52

Yellow2.2

Yellowish green

20 100*1 5 -40〜+85 -40〜+100

2.2

20 10

Emitting

Color

5

PD(mW) IF(mA)

Part No. Chip Structure

Absolute Maximum Ratings (Ta=25ºC) Electrical and Optical Characteristics (Ta=25ºC)

Power Forward Peak Forward Forward Voltage VF Reverse Current IR Dominant Wavelength λD Luminous Intensity IV

Dissipation

54

SML-D12V8W

SML-D12U8W

SML-D12D8W

SML-D12Y8W

SML-D12M8W

SML-D12P8W

SML-D13U8W

SML-D13Y8W

SML-D13M8W

Tolerance : ±0.1(unit : mm) (unit : mm)

1608 (0603)

1.6×0.8mm (t=0.55mm)

ColorType V U D

Y PM

0.8

0.85

0.8

0.8

PCB Bonding Direction

1.6

1.2

0.8

0.65

0.8

0.55

0.18

Cathode index

1.5

0.5

R0.275

R0.15

Electrode

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www.rohm.com ©2020 ROHM Co., Ltd. All rights reserved 1/10 2020.4 - Rev.010

　　　　 [Data Sheet]

■Electrical Characteristics Curves

Fig.1 Forward Current Fig.2 Luminous Intensity - - Forward Voltages 　　　　　Atmosphere Temperature

Fig.3 Luminous Intensity - Forward Current Fig.4 Derating

Reference

[SML-D12x8/D13x8 series]

0.0

0.2

0.4

0.6

0.8

1.0

1.2

0 4 8 12 16 20

0.4

0.6

0.8

1

1.2

1.4

1.6

-40 -20 0 20 40 60 80 1001

10

100

1.5 2.0 2.5

Ta=25ºC

FORW

ARD

CURR

ENT

: I F

[mA]

FORWARD VOLTAGE : VF [V]

IF=20mA

RELA

TIVE

LUM

INO

US I

NTEN

SITY

[a.

u.]

ATMOSPHERE TEMPERATURE : Ta [ºC]

Ta=25ºC

RELA

TIVE

LUM

INO

US I

NTEN

SITY

FORWARD CURRENT : IF [mA]

MAX

IMUM

FO

RWAR

D CU

RREN

T :

[m

A]

AMBIENT TEMPERATURE : Ta [ºC]

SML-D12V8W SML-D12U8W SML-D12D8W SML-D12Y8W SML-D12M8W SML-D12P8W



0

10

20

30

-40 -20 0 20 40 60 80 100


＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿



■Electrical Characteristics Curves

Fig.1 Forward Current Fig.2 Luminous Intensity - - Forward Voltages 　　　　　Atmosphere Temperature

Fig.3 Luminous Intensity - Forward Current Fig.4 Derating

Reference


1

10

100

1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 3

0.0

0.2

0.4

0.6

0.8

1.0

1.2

0 4 8 12 16 20

0.4

0.6

0.8

1

1.2

1.4

1.6

-40 -20 0 20 40 60 80 100

Ta=25ºC IF=20mA

Ta=25ºC

FORW

ARD

CURR

ENT

: I F

[mA]

FORWARD VOLTAGE : VF [V]

RELA

TIVE

LUM

INO

US I

NTEN

SITY

[a.

u.]

ATMOSPHERE TEMPERATURE : Ta [ºC]

RELA

TIVE

LUM

INO

US I

NTEN

SITY

FORWARD CURRENT : IF [mA]

MAX

IMUM

FO

RWAR

D CU

RREN

T :

[m

A]

AMBIENT TEMPERATURE : Ta [ºC]

SML-D13U8W SML-D13Y8W SML-D13M8W


0

10

20

30

-40 -20 0 20 40 60 80 100



＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿



■Viewing Angle


Reference

SML-D12V8W SML-D12U8W SML-D13U8W SML-D12D8W SML-D13Y8W SML-D12Y8W SML-D12M8WSML-D13M8WSML-D12P8W

SCANNING ANGLE (deg) SCANNING ANGLE (deg)

RELATIVE INTENSITY (%) RELATIVE INTENSITY (%)

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■Rank Reference of Brightness* *Measurement tolerance:±10%


Red(V,U) (Ta=25ºC, IF＝20mA)

Rank H J K L M N P Q R S T UIv (mcd) 1.6〜2.5 2.5〜4.0 4.0〜6.3 6.3〜10 10〜16 16〜25 25〜40 40〜63 63〜100 100〜160 160〜250 2500〜400

SML-D13U8WSML-D12V8WSML-D12U8W

Orange(D) (Ta=25ºC, IF＝20mA)


SML-D12D8W

Yellow(Y) (Ta=25ºC, IF＝20mA)


SML-D13Y8WSML-D12Y8W

Yellowish Green/Green (M,P) (Ta=25ºC, IF＝20mA)Rank H J K L M N P Q R S T U

Iv (mcd) 1.6〜2.5 2.5〜4.0 4.0〜6.3 6.3〜10 10〜16 16〜25 25〜40 40〜63 63〜100 100〜160 160〜250 2500〜400SML-D13M8WSML-D12P8WSML-D12M8W

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■Taping(T86)

Unit:ｍｍ

Note)Tolerance is within ±0.2mm unless

otherwise specified.

■Part No. Construction

■Packing SpecificationComplying with IPC/JEDEC J-STD-033.


8.0

1.75

3.5

5.5

0～0.5

1

2

1.9

φ180

φ60

φ13

±0.1

±0.05 φ1.5

＋0.1

±0.1

+1 0

-30

±0.05

0

0.73

4

Packing quantity

3,000pcs/reel

Pull

direction

11.4

±1

+0.1

-0.07

+0.1

-0.07

±0.1

0.2

±0.05

*"-"will be taken out for emitting color Special Code will be applied for Chromaticity rank Rank signWB/B/E series. Emitting color WB/B/E series. (for white LED） (Brightness Rank)*

Series name Package Type Chip type Emitting Color Resin Color Taping Specification

SML P1 0 V TE1 1 U WD1 2 U2 BH1 3 DM1 4 Y301 5 Y2Z1/ZN 6 YA1 7 W81/82 8 M2

K1 M *Concerning the Brightness rank.S1 F *Please refer to the rank chart above for P2 P luminous intensity classification.52 E *Part name is individual for each rank.P34 B *When shipped as sample,the part name will P36 WB be a representative part name.VN T General products are free of ranks.

RGB Please contact sales if rank appointmentSCM 01 is needed.

P

Standard Type

1S M L － D 6 A2 M 8 W T 8

Chip LED 1.0x0.6 t=0.2mm1.6x0.8 t=0.36mm

Red

1.6x1.15 t=0.55mm

Ultra High Brightness type3.0x2.0 t=1.3mm3.5x2.8 t=1.9mm

Yellowish green

Yellow

3.4x1.25 t=1.1mm

2.0x1.25 t=0.8mm

YellowYellowYellow

Orange

3.2x1.6 t=1.85mm Green1.0x1.0 t=0.2mm Green

4.5x2.0 t=0.6mm Yellowish green

1.0x1.0 t=0.2mm Blue1.5x1.0 t=0.2mm White

1.3x1.5 t=0.6mm Green

3.0x1.5 t=2.2mm

3.5x2.8 t=0.6mm Phototransistors

Chip LEDRed/Green/Blue

Transparent Colorless T86 Cathode at sprocket hole side(the top)

1.6x0.8 t=0.55mmLow Current Type Red Milky White

BlackHigh Brightness type Red

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１．StorageIf the product is heated during the reflow under the condition of hygroscopic state, it may vaporize and expand which will influence the performance of the product. Therefore, the package is waterproof. Please use the product following the conditions:・Using Conditions

・BakingBake the product in case of below:①The expiration date is passed. ②The color of 5% and 10% on humidity indicator card is not green.

・Baking Conditions

２．Application Methods２－１．Precaution for Drive System and Off ModeDesign the circuit without the electric load exceeding the ABSOLUTE MAXIMUM RATING that

please do not apply voltage neither forward nor reverse. Especially, for the products with theAg-paste used in the die bonding, there’s high possibility to cause electro migration and result

２－２．About Derating　It is considered that derating characteristics will not result in LED chip's electrical destruction.Even within the derating, the reliability and luminous life can be affected depending on operatingconditions and ambient environment. So we would be appreciate it if you can confirm with your application again.２－３．About product lifeDepending on operating conditions and environment(applied current, ambient temperature andhumidity, corrosive gas), decreasing of luminosity and change of chromaticity may occur evenwithin the specification conditions.Please contact our sales office if you use it for the following applications.①It requires long luminosity life②It is always lit２－４．Applied Stress on ProductNo resin hardening agent such as filler is used in the sealing resin of the product. Therefore, please pay attention to the overstress on it which may influence its reliability.２－５．UsageThe Product is LED. We are not responsible for the usage as the diode such as Protection Chip, Rectifier, Switching and so on.

(Deviation of VF Value will cause deviation of current in LED.) Furthermore, for off mode,

in function failure.

■Precaution (Surface Mount Device)

Remark so please try not to apply stress on it.・Recommend bake once.

Please storing in the airtight container

Temperature Time Humidity

・Bake products in reel.・Reel and embossed tape are easy to be deformed when baking,

applies on the products. If drive by constant voltage, it may cause current deviation of the LED and result in deviation of luminous intensity, so we recommend to drive by constant current.


(Even if the product is before expiration date.)

60±3℃ 12〜24h Below 20%RH

①Before using 5〜30℃ 30〜70%RH Within 1 yearfrom Receiving Storage with waterproof package

②After openingpackage 5〜30℃ Below 70%RH Within 168h with our desiccant (silica gel)

Classification Temperature Humidity Expiration Date Remark

＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿



３．Others３－１．Surrounding GasNotice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) oralkali gas (ammonia), it may result in low soldering ability (caused by the change in quality of the plating surface ) or optical characteristics changes (light intensity, chrominance) and changein quality of cause die bonding (Ag-paste) materials. All of the above will function failure of

Therefore, please pay attention to the storage environment for mounted product (concern the

３－２．Electrostatic DamageThe product is part of semiconductor and electrostatic sensitive, there’s high possibility to be damaged by the electrostatic discharge. Please take appropriate measures to avoid the static electricity from human body and earthing of production equipment. Especially, InGaN type LEDs have lower resistancevalue of electrostatic discharge and it is recommended to introduce the ESD protection circuit.The resistance values of electrostatic discharge (actual values) vary with products, therefore, please call our Sales staffs for inquiries. ３－３． Electromagnetic WaveApplications with strong electromagnetic wave such as, IH cooker, will influence the reliability of LED, therefore please evaluate before using it.


the products.

generated gas of the surrounding parts of the products and the atmospheric environment).

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Stress strength according tohe mounting position:A＞B＞C＞D

so please pay attention to the touch on product.

We recommend the soldering pattern that shows on the right.It will be different according to mounting situation of circuit board,therefore, please concern before designing.

※The product has adopted the electrode structure that it should solderwith back electrode of the product.Thus, please be informed that the shape of electrode pin of solder fillet formation is not guaranteed.The through hole on electrode surface is for conduction of front

　and rear electrodes but not for formation of solder fillet.

expansion and moisture absorption at humidity will cause heat stress during soldering process and finally has bad influence on the product’s reliability.・The product is not guaranteed for flow soldering. ・Thermal stress during the flow soldering of surrounding parts will influence the reliability of LED and please evaluate the soldering conditions before using it. Also please make sure the expiration date

・Please set appropriate reflow temperature based on our product usage conditions and specification.・The max for reflowing is 2 times, please finish the second reflow soldering and flow soldering with other parts within the usage limitation after open the moistureproof package.・Compare with N2 reflow, during air reflow, because of the heat and surrounding conditions, it may cause the discoloration of the resin.

to prevent electrostatic charge.４－３. Mounting LocationThe stress like bending stress of circuit board dividing after mounting, may cause LED package crack or damage of LED internal junction, therefore, please concern the mounting direction and position to avoid bending or screwing with great stress of the circuit board.


４．Mounting４－１. Soldering・No resin hardening agent such as filler is used in the sealing resin of the product. Therefore, resin

・For our product that has no solder resist, because of its solder amount and soldering conditions, 　one of its specific characteristics is that solder will penetrate into LED. Thus, there's high possibilitythat will influence its reliability.Therefore, please be informed, concerning it before using it.４－２. Automatic Mounting４-２-１. Suction nozzleExcessive load may cause damage inside the LED product, so select an optimal suction nozzle according to the material and shape of the LED product.４-２-２. Mini Package (Smaller than 1608 size)・Vibration may result in low mounting rate since it will cause the static electricity of product and adhere to top cover tape. Therefore, the magnet should be set on parts feeder cassette of the mounter to control the product stabilization. In addition, it is recommended to set ionizer

after opening the moistureproof package.

４―４. Mechanical Stress after MountingThe mechanical stress may damage the LED after Circuit Mounting,

４－５．Soldering Pattern for Recommendation

0.8mm

0.85mm

0.8mm

0.8mm

PCB Bonding Direction

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Temperature Under 30℃ within 3 minutes

Heating on PCB pattern, not direct to theLED. (Fig-1)

Condition ) Temp. of iron top less than 400℃ within 3 sec.

b) Handling after soldering

Please handle after the part temp.goes down to room temp.

４－８．Cleaning after SolderingPlease follow the conditions below if the cleaning is necessary after soldering.

Solvent We recommend to use alcohols solvent such as, isopropyl alcohols

４－７．Attention Points in Soldering Operation This product was developed as a surface mount LED especially suitable for reflow soldering.So reflow soldering is recommended. In case of implementing manual soldering,please take care of following points.①SOLDER USEDSn-Cu，Sn-Ag-Cu，Sn-Ag-Bi-Cu②HAND SOLDERING CONDITIONLED products do not contain reinforcement material such as a glass fillers.

RECOMMENDED CONDITION

ΔTR/Δt Temperature rising rate Under 3℃/sec.ΔTD/Δt Temperature decreasing rate Over -3℃/sec.

※Above conditions are for reference. Therefore, evaluate by customer’s own circuit boards and reflow furnaces before using, because stress from circuit boards and temperature variations of reflow

tL Retention time for TL Within 40sec.TP Peak temperature 260℃(Max)tP Time for peak temperature Within 10sec.

Tsmin Minimum of pre-heating temperature 140℃ts Time from Tsmin to Tsmax Over 60sec.TL Reference temperature 230〜260℃

Ultrasonic Cleaning 15W／Below 1 liter (capacity of tank)Drying Under 100℃ within 3 minutes

furnaces vary by customer’s own conditions.

So thermal stress by soldering greatly influence its reliability.Please keep following points for manual soldering.

ITEM

a) Heating method


４－６．Reflow ProfileFor reflow profile, please refer to the conditions below:(※)■Meaning of marks, Conditions

Mark Meanings ConditionsTsmax Maximum of pre-heating temperature 180℃

Fig-1

SOLDERING LAND

SOLDERING IRON

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R1102Awww.rohm.com© 2015 ROHM Co., Ltd. All rights reserved.

Notice

ROHM Customer Support System http://www.rohm.com/contact/

Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us.

N o t e s

The information contained herein is subject to change without notice.

Before you use our Products, please contact our sales representative and verify the latest specifica-tions :

Although ROHM is continuously working to improve product reliability and quality, semicon-ductors can break down and malfunction due to various factors.Therefore, in order to prevent personal injury or fire arising from failure, please take safety measures such as complying with the derating characteristics, implementing redundant and fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no responsibility for any damages arising out of the use of our Poducts beyond the rating specified by ROHM.

Examples of application circuits, circuit constants and any other information contained herein are provided only to illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production.

The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM or any other parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of such technical information.

The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communi-cation, consumer systems, gaming/entertainment sets) as well as the applications indicated in this document.

The Products specified in this document are not designed to be radiation tolerant.

For use of our Products in applications requiring a high degree of reliability (as exemplified below), please contact and consult with a ROHM representative : transportation equipment (i.e. cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety equipment, medical systems, servers, solar cells, and power transmission systems.

Do not use our Products in applications requiring extremely high reliability, such as aerospace equipment, nuclear power control systems, and submarine repeaters.

ROHM shall have no responsibility for any damages or injury arising from non-compliance with the recommended usage conditions and specifications contained herein.

ROHM has used reasonable care to ensur the accuracy of the information contained in this document. However, ROHM does not warrants that such information is error-free, and ROHM shall have no responsibility for any damages arising from any inaccuracy or misprint of such information.

Please use the Products in accordance with any applicable environmental laws and regulations, such as the RoHS Directive. For more details, including RoHS compatibility, please contact a ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting non-compliance with any applicable laws or regulations.

When providing our Products and technologies contained in this document to other countries, you must abide by the procedures and provisions stipulated in all applicable export laws and regulations, including without limitation the US Export Administration Regulations and the Foreign Exchange and Foreign Trade Act.

This document, in part or in whole, may not be reprinted or reproduced without prior consent of ROHM.

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093475

ノート注釈

093475 : MigrationConfirmed

093475

ノート注釈

093475 : MigrationConfirmed

SML-D12x8/D13x8 Series

Documents

Transcript of SML-D12x8/D13x8 Series