Service Manual - LG

Service Manual

Model : LG

-C300

Internal Use Only

Service ManualLG-C300

Date: August, 2010 / Issue 1.0

- � -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes

LGE Internal Use Only

Table Of Contents

1. INTRODUCTION ..................................................................5

1.1 Purpose ............................................................................................... 5

1.2 Regulatory Information ............................................................... 5

1.� Abbreviations ................................................................................... 7

2. PERFORMANCE ...................................................................9

2.1 H/W Features .................................................................................... 9

2.2 Technical Specification ...............................................................11

3. TECHNICAL BRIEF .............................................................16

�.1 Baseband Processor Introduction .........................................16

�.2 Power Management ....................................................................21

�.� FEM with integrated Power Amplifier Module

(RF7161, U�01) ...............................................................................��

�.4 Crystal(26 MHz, X102) .................................................................�6

�.5 RF Subsystem of PMB8810 (U102).........................................�7

�.6 MEMORY(PF�8F6066M0Y�DE, U102) ..................................42

�.7 BT module (U�02) .........................................................................44

�.8 SIM Card Interface ........................................................................46

�.9 LCD Interface ..................................................................................47

�.10 Battery Charger Interface .......................................................50

�.11 Keypad Interface ........................................................................51

�.12 Audio Front-End .........................................................................5�

�.1� Camera Interface(2M Fixed Focus Camera) .....................59

�.14 KEY BACLKLIGHT LED Interface ............................................61

�.15 Vibrator Interface .......................................................................62

4. TROUBLE SHOOTING .......................................................63

4.1 RF Component...............................................................................6�

4.2 RX Trouble .......................................................................................64

4.� TX Trouble ........................................................................................68

4.4 Power On Trouble .........................................................................72

4.5 Charging Trouble ..........................................................................75

4.6 Vibrator Trouble .............................................................................77

4.7 LCD Trouble .....................................................................................80

4.8 Camera Trouble .............................................................................84

4.9 Speaker Trouble ............................................................................88

4.10 Earphone Trouble ......................................................................90

4.11 Receiver Trouble .........................................................................92

4.12 Microphone Trouble .................................................................94

4.1� SIM Card Interface Trouble .....................................................96

4.14 KEY backlight Trouble ..............................................................98

4.15 Micro SD (uSD) Trouble ......................................................... 100

4.16 Bluetooth Trouble ................................................................... 102

4.17 FM Radio Trouble .................................................................... 104

5. DOWNLOAD ................................................................... 106

6. BLOCK DIAGRAM ........................................................... 119

7. CIRCUIT DIAGRAM ........................................................ 121

8. BGA PIN MAP ................................................................. 125

9. PCB LAYOUT ................................................................... 127

10.ENGINEERING MODE ................................................... 129

11. STAND ALONE TEST .................................................... 130

11.1 Introduction .............................................................................. 1�0

11.2 Setting Method ........................................................................ 1�0

11.� Tx Test ........................................................................................... 1��

11.4 Rx Test .......................................................................................... 1�5

12.AUTO CALIBRATION ..................................................... 137

12.1 Overview .................................................................................... 1�7

12.2 Configuration of HotKimchi ............................................... 1�7

12.� Description of Basic File ....................................................... 1�8

12.4 Procedure ................................................................................... 1�9

12.5 AGC ............................................................................................... 142

12.6 APC ............................................................................................... 142

12.7 ADC ............................................................................................... 142

12.8 Target Power ............................................................................. 142

13 EXPLODED VIEW & REPLACEMENT

PART LIST ...................................................................... 143

1�.1 EXPLODED VIEW ...................................................................... 14�

1�.2 Replacement Parts.................................................................. 145

1�.� Accessory ................................................................................... 16�

- 5 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes


1. INTRODUCTION

1. INTRODUCTION

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1.1 PurposeThis manual provides the information necessary to repair, calibration, description and download the features of this model.

1.2 Regulatory InformationA. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it.

The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the this phone or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

1. INTRODUCTION

1. INTRODUCTION


1. INTRODUCTION

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E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated

by the sign. Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system

boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat

which is also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective

package as described.

2. INTRODUCTION



1. INTRODUCTION

1.3 AbbreviationsFor the purposes of this manual, following abbreviations apply:

Offset Phase Locked LoopOPLL

Light Emitting DiodeLED

Low Drop OutputLDO

Liquid Crystal DisplayLCD

Intermediate FrequencyIF

International Portable User IdentityIPUI

Global System for Mobile CommunicationsGSM

General Purpose Interface BusGPIB

Gaussian Minimum Shift KeyingGMSK

Flexible Printed Circuit BoardFPCB

Electrostatic DischargeESD

Electrical Erasable Programmable Read-Only MemoryEEPROM

Digital Signal ProcessingDSP

dB relative to 1 milli wattdBm

Digital Communication SystemDCS

Digital to Analog ConverterDAC

Constant Current – Constant VoltageCC-CV

Bit Error RatioBER

BasebandBB

Automatic Power ControlAPC

1. INTRODUCTION


1. INTRODUCTION

Wireless Application ProtocolWAP

Voltage Control Temperature Compensated Crystal OscillatorVCTCXO

Voltage Controlled OscillatorVCO

Universal Asynchronous Receiver/TransmitterUART

Time Division Multiple AccessTDMA

Time Division DuplexTDD

Travel AdapterTA

Side Tone Masking RatingSTMR

Pseudo SRAMPSRAM

Static Random Access MemorySRAM

Sending Loudness RatingSLR

Subscriber Identity ModuleSIM

Surface Acoustic WaveSAW

Real Time ClockRTC

Root Mean SquareRMS

Receiving Loudness RatingRLR

Radio FrequencyRF

Public Switched Telephone NetworkPSTN

Phase Locked LoopPLL

Programmable Gain AmplifierPGA

Printed Circuit BoardPCB

Power Amplifier ModulePAM

1. INTRODUCTION



2. PERFORMANCE

2. PERFORMANCE

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2.1 H/W Features

2. SYSTEM SPECIFICATION

Item Feature Comment

Standard Battery Li-ion, 3.7V 900mAh

Talk time Up to 8 hrs : GSM850 & EGSM,TX Level : 10

Stand by time Up to 500 hrs : Paging Period 9

Charging time Under 3 hrs

RX Sensitivity GSM, EGSM: -109dBm, DCS: -109dBm c

TX output power GSM, EGSM: 33 dBm(Level 5), DCS , PCS: 30 dBm(Level 0)

SIM card type 3.0V / 1.8V

Display MAIN : 2.4” TFT 240 320 QVGA

Status Indicator

Hard icons. Key Pad (Qwerty)A ~ Z,0 ~ 9, #, *, Up/Down Left/Right OK KeySend Key, PWR Key ,Soft Key(Left/Right),Side key(Volume Up/Volume Down)

ANT Internal type (QUAD band)

EAR Phone Jack Yes (Stereo)

PC Synchronization Yes

Speech coding EFR/FR/HR/NB-AMR

Data and Fax Yes

GPRS compatibility Class 12

Vibrator Yes

Loud Speaker Yes

Voice Recoding Yes

Microphone Yes



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Travel Adapter Yes

Speaker/Receiver 18x12 Speaker/ Receiver

MIDI SW decoded max. 32 poly

Item Feature Comment

Camera

Bluetooth / FM Radio BT 2.1 + EDR / 87.5 ~ 108MHz supported

Speaker DIS 16 mm, 3.4T spring / Receiver 1207*2.5T



2. PERFORMANCE

2.2 Technical Specification

Item Description Specification

1 Frequency Band

GSM850 EGSMTX: 824 ~ 849 MHz TX: 880 ~ 915MHzRX: 869 ~ 894 MHz RX: 925 ~ 960 MHz

DCSTX: 1710 ~ 1785 MHzRX: 1805 ~ 1880 MHz

PCSTX: 1850 ~ 1910 MHzRX: 1930 ~ 1990 MHz

2 Phase Error RMS < 5 degreesPeak < 20 degrees

3 Frequency Error < 0.1 ppm

4 Power Level

Level Power Toler. Level Power Toler.

6 31dBm 3dB 14 15dBm 3dB






12 19dBm 3dB

GSM850/EGSM


Level Power Toler. Level Power Toler.








DCS/PCS




2. PERFORMANCE

5 Output RF Spectrum(due to modulation)

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600~ <1,200 -60

1,200~ <1,800 -60

1,800~ <3,000 -63

3,000~ <6,000 -65

6,000 -71

GSM850/ EGSM

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600~ <1,200 -60

1,200~ <1,800 -60

1,800~ <3,000 -65

3,000~ <6,000 -65

6,000 -73

DCS/PCS

6Output RF Spectrum(due to switching transient)

GSM850/ EGSM

Offset from Carrier (kHz). Max. dBm

400 -19

600 -21

1,200 -21

1,800 -24



- 1� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes


2. PERFORMANCE


6Output RF Spectrum(due to switching transient)

Offset from Carrier (kHz). Max. dBm

400 -22

600 -24

1,200 -24

1,800 -27

7 Spurious Emissions Conduction, Emission Status

8 Bit Error Ratio

GSM850, EGSMBER (Class II) < 2.439% @-102 dBmDCS,PCSBER (Class II) < 2.439% @-102 dBm

9 RX Level Report Accuracy 3 dB

10 SLR 15 3 dB

11 Sending Response

300 -12

1,000 -6

2,000 -6

3,000 -6

Frequency (Hz) Max.(dB) Min.(dB)

100 -

200 -

4,000 -

3,400 -9

0

0

4

4

-12

0

0

4

12 RLR 4 3 dB

DCS/PCS



2. PERFORMANCE


13 Receiving Response

300 -7

500 -5

1,000 -5

3,000 -5

Frequency (Hz) Max.(dB) Min.(dB)

100 -

200 -

4,000

3,400 -10

2

*

0

2

-12

0

2

2

14 STMR 17 5 dB

* Mean that Adopt a straight line in between 300 Hzand 1,000 Hz to be Max. level in the range.

15 Stability Margin > 6 dB

-20

-10

0

7

dB to ARL (dB) Level Ratio (dB)

-35

-30

10

30.7

33.3

33.7

31.7

17.5

22.5

25.5

16 Distortion

17 Side Tone Distortion Three stage distortion < 10%

18 System frequency (13 MHz) tolerance 2.5 ppm

19 32.768KHz tolerance 30 ppm

20 Ringer VolumeAt least 55 dBspl under below conditions:1. Ringer set as ringer.2. Test distance set as 1 m




2. PERFORMANCE



21 Charge CurrentConstant Charge Current : <. 400 mA

Total Charging Time : < 3 hours ( Battery 900mA )

2 -> 1

0 -> OFF

Bar Number Power

4 -> 2

-104 3

-106 Min.

-98 3

-101 322 Antenna Display

2 -> 1

1 -> 0

Battery Bar Number Voltage

3

3 -> 2 3.61 0.05 V 23 Battery Indicator

24 Low Voltage Warning( Blinking Bar)

3.46 0.05V (Call), 1 time per 1 minute (Receiver)

3.46 0.05V (Standby), 1 time per 3 minutes(Speaker)

25 Forced shut down Voltage

3.35 0.05V

27 Battery Type

Lithium-Ion Battery, Inner packStandard Voltage = 3.7 VBattery full charge voltage = 4.2 VCapacity: 900mAh

28 Travel ChargerSwitching-mode chargerInput: 100 ~ 240V, 50/60 HzOutput: 4.8V, 700mA

3.73 0.05 V

26 Sustain RTC without battery Over 50 hours

3.46 0.05 V

3.35 0.05 V

7

7 -> 5

5 -> 4

-92 Max.

-93 3

1 -> 0 -106 3


3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

3.1 Digital Main Processor

Figure. 3.1.1 X-Gold tm 213 Hardware Block Diagram

3. TECHNICAL BRIEF

3. TECHNICAL BRIEF



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3. TECHNICAL BRIEF

3.1.1 General• Technology:– SoC, Monolithic, 65 nm CMOS• Package:– eWLB, 8x8x0.8 mm– 0.5 mm pitch– 217 balls / 6-layer PCB

3.1.2 RF Transceiver• Dual-band direct conversion receiver• Tri/Quad-band possible with external circuitry• Fully integrated digital controlled X0• Additional buffer for 2 external system clocks• Fully digital RF-Synthesizer incl. -Transmitter

3.1.3 Baseband• DSP:– 156 MHz TeakLite™

• MCU:– ARM1176® @ 208 MHz

• MCU RAM:– 3.00Mbit

• Memory I/F:– 512 Mbit

• Modem:– GPRS class 12, (RX/TX CS1-CS4)– EGPRS class 12, (RX MCS1-MCS9, TX MCS1-MCS4)• Cipher Units:– A51/2/3– GEA-1/2/3• Security:– OMTP TR0– Secure Boot– RSA(ROM)/SHA-1(HW accel.)– OCDS disabling– Certificate Management


3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

• Speech Codec:– FR / HR / EFR / NB-AMR• Audio Codec (running on ARM1176):– SP-MIDI– SB-ADPCM– MP3– WB-AMR– AAC/AAC+/eAAC+• Others:– DARP (SAIC)– TTY• Customization:– E-Fuses

3.1.4 External Memory• External Bus Unit– 25-bit address bus (512 Mbit)– 16-bit data bus– 1.8V & 2.8V support• Flash / RAM– NOR Type– Serial Flash SPI and SPI-4– Parallel Flash (Page & Burst Mode)- 16-bit Demultiplexed- 16-bit AD-multiplexed- 16-bit AAD-multiplexed– iNAND Type e.g. oneNAND• Memory card– SD/MMC card interface with 1 or 4 data lines

3.1.5 Connectivity• 3xUSIF (configurable either as SPI or UART), I2C, I2S; Interfaces @ 1.8V• Direct (U)SIM 1.8/3V• USB2.0 up to 480 Mbit/s (High Speed) w/ external USB Phy over ULPI interface• Stereo Headset (Amplifier integrated)• 3 external analog measurement PIN’s• Bluetooth



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3. TECHNICAL BRIEF

3.1.6 Mixed Signal• Improved audio performance• Loudspeaker Audio Class D Amplifier, 700 mW@8 mono for hands-free and ringing• Stereo Headset 2x30 mW@16 w/o coupling C• Mono Earpiece 100 mW@16 • Digital microphone supported• Differential microphone inputs

3.1.7 FM Radio• Integrated FM radio– FM Stereo RDS Receiver– Sensitivity 2 V EMF– Support for US & EU bands– Stereo recording

3.1.8 Power Management• Direct-to-Battery Connection– LDOs (incl. capless)– DC/DC step-down converter– DC/DC step-up for white LED supply• Battery Type– Li-Polymer• Charging control– Battery temperature– Watchdog protection– Start-up on flat battery• External Charger– Switch mode• USB battery charging– USB charging spec 1.0 compliant• Backlight– Up to 5 serial white LEDs (integrated LDO)


3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

3.1.10 Main LCD Display• Type– 240*320, QVGA, 262k color (parallel)• Interface– Parallel 8bit MIPI-DBI Type B– Serial MIPI-DBI Type C– Interf. voltage at 1.8V or 2.8V• gRacr - Display Controller (Hardware)– 30 fps Display update without DMA (up to 60 fps) (full or partial)– Video post processing Scaling, Rotation (90 steps), Mirroring– Overlay with alpha blending– Color conversion YUV -> RGB– 2D vector graphics (Lines, filled rectangles, Bit block transfer (e.g. sprites, scrolling,

antialiased bitmap fonts)

3.1.11 Camera• 2.0 Mpxls, FF• Frame Rate : 15@UXGA, 30@SVGA • 39 MHz Pixel Rate• 15 [email protected] Mpx full resolution

3.1.12 Video Capabilities• Video Decoding MPEG-4/H.263– QCIF@30 fps– QVGA@15fps• Video Encoding MPEG-4/H.263– QCIF@15 fps

3.1.13 Audio Capabilities• Polyphonic ring tones– 64 voices MIDI, SP-MIDI– FM synthesizer• AMR-WB• True ring tones (MP3)• MP3, eAAC+• G.722 SB-ADPCM encoding/decoding



3. TECHNICAL BRIEF

3.2 Power ManagementA mobile platform requires power supplies for different functions. These power supplies are generated in the integrated power management Unit (PMU). The PMU is designed to deliver the power for a typical standard phone.

Figure. 3-2-1 Block Figure of the PMU Modules X-Gold tm 213

3. TECHNICAL BRIEF


3. TECHNICAL BRIEF3. TECHNICAL BRIEF

DC/DC Step Down Converter for 1.8V (SD1) The DC/DC converter generates a 1.8V supply rail. This voltage rail is used to supply main parts of the system, like the digital core of the chip (via LDO LCORE), some parts of the mixed signal macro, parts of the RF macro and the external memory if a 1.8V memory is used. The efficiency of the DC/DC converter is optimized for an average load current of 100mA. That is the load current estimated for the GSM talk mode.

Linear voltage Regulators (low dropout) LDOs The LDOs are used to generate the supply for the different supply domains not directly supplied out of the DC/DC converter.The VSIM output current is high enough to drive USB SIM cards.

LCOREThe LCORE LDO provides the VCORE supply used for most of the digital parts of the chip

LPMUThe LPMU provides VPMU sued for the PMU supply, e.g. for the startup state machine and analog parts like ADC, sense amplifier etc.

LUSBThe LUSB LDO generates the supply for the USB transceiver (output driver and input). If no USB interface is required, LUSB can be used as general purpose LDO.

LAUXThe LAUX generates VAUX. It is a general purpose LDO and can be used for different functions depending on the phone application, e.g. for the display or Camera.

LMMCThe LMMC generates VMMC. It is a general purpose LDO and can be used e,g. for memory cards

LSIMThe LSIM LDO generates the VSIM supply for the SIM card and interface. It is designed to supply Standard SIM cards.

Other LDOsThe RF module has implemented several LDO’s for different RF Power domain.The mixed signal module has some LDO’s for the audio driver and microphone supply.



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3. TECHNICAL BRIEF

Table. 3-2-1 Power supply Domains (without RF)


3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

3.2.1 Power on and startup

Analog startup Circuit

Because the POR circuit and the LPBG are directly connected to the battery, it is not possible to switch them off. If the battery voltage exceed the power on reset threshold (2.5V), the power on reset is released, the LPMU regulator and the LRTC voltage regulator are switched on. The LPMU regulator starts in its ultra-low power mode.

The LPMU regulator generates a control signal (lpmu_OK) that enables the 50KHZ PMU oscillator. The output clock of the oscillator is checked with a fully coded counter. A counter overflow releases the reset (vpmu_rst_n) signal for the small PMU state-machine.

Small first digital State-Machine

The small PMU state-machine is always connected to VPMU After starting from reset the small startup state machine enters the SYSTEM OFF state and only continuous the startup procedure if a switch on event like first connect, on-key, wake up or charge detect occurs.

PMU-main State-Machine

The main PMU state-machine is always connected to VPMU also. The power up sequence driven by the PMU state-machine can be seen in Figure18. After enabling the reference (HPGB) and waiting for the settling time, the battery voltage is measured and compared with the power on threshold. If the battery voltage is high enough, the SD1 DC/DC converter and the LCORE LDO are started. A timer ensures that the supply voltage will be stable before the DCXO is enabled. The DCXO settling time is ensured using a fixed timer. After an overflow of this timer, the reset is released for the rest of the system. The PMU state machine remains in this System-ON state until the system is switched into the OFF state. For example the system sleep mode is completely configured by software( for example switching off the LDO’s, switching of the DCXO etc.) and controlled by the VCXO_enable signal. The reason for the startup is stored in the ResetSourceRead register.

Battery Measurement

The ADC and the oscillator for the ADC needs the VDD_ADC supply voltage from the LADC LDO. LADC uses either the charger voltage VDD_CHARGE or VDDRTC as input voltage. The input voltage is selected automatically by a bulk switch circuit. LADC, the ADC and the oscillator are enabled on request for every battery measurement if the charger unit is not running. This is handled by an ADC control block in one of the state-machines. If the charger unit is running the ADC is controlled by the charger state-machine



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3. TECHNICAL BRIEF

Figure.3.2.1 First Part of the State Machine, Running in Different Power Domains than the Second Part


3. TECHNICAL BRIEF 3. TECHNICAL BRIEF

Figure 3.2.2 Second (Main) Part of the Startup State Machine in the VPMU Domain



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3. TECHNICAL BRIEF

3.2.2 Switching on due to first connectIf the battery voltage is connected the first time, that means the system enters the first time the SYSOFF state, this is stored in a first connect flag. If the first connect flag is set, the system will start immediately and not wait for any other system on event in the SYSOFF state.

3.2.3 Switching on due to on-Key eventThe on key is connected to the ONKEY pad. The ESD protection and the input structure of this pad are connected to VRTC. If the ONKEY pad is forced to VRTC by an external key or similar circuit, the system starts. The ONKEY is sampled with the PMU clock. It has to be sampled four times high before a valid on event is generated. The status of the ON key can be read in the PMU registers, so it can be used as a functional key during phone operation also.

3.2.4 Switching on due to RTC alarmThe real time clock can generate a wakeup signal called RTC alarm. This signal is sampled from the state-machine and after successfully detecting a high, the system is switched on.

3.2.5 Switching on due to chargingWhen a battery with a voltage below the SSONLEV level is inserted, the state machine will not start the system. As long as the battery voltage stays lover than SYSONLEV the system will stay off. The only possibility to start up the system is due to an external charger.

If an external charger is connected and detected and the battery is charged above the SYSONPRE voltage level the system will start up.The PMU main state machine waits in the Check battery state until the battery voltage condition is fulfilled. The charger state machine provides the necessary pre-charge indication signal. This pre-charge signal is denounced in a small counter to have a stable signal. This is important, especially in half/full-wave charging where the charger detection is switching between charger detected/not detected according the AC supply frequency. Reasons for details on pre-charging see the charger chapter. The charger is controlled by an independent state machine. The pre-charge signal is used to trigger the pre-charge signal is used to trigger the pre-charge functionality. The charger state machine fully control the pre-charge, the PMU-state machine now changes to state HPBG on state and the system starts. This state change is indicated to the charger state-machine to enable the charger watchdog for safety

3. TECHNICAL BRIEF

3.2.6 Power Supply Start-up sequenceIn order to avoid an excessive drop on the battery voltage caused by in-rush current during system power-on, possibly leading to system instability and “hick-ups” a staggered turn-on approach for the regulators is implemented. The regulators are turned on in a well defined sequence, thus spreading the in-rush current transients over time.

The IO’s of X-GOLD TM 213 are isolated in OFF mode (core supply is off). The isolation signal is controlled by the PMU state machine. This ensures that the PADs are in a well defined state during core supply settling. This allows to power up the LCORE core regulator and wait for the core to reach reset state before powering up the I/O supply regulators.


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3. TECHNICAL BRIEF

Figure 3.2.3 Start Up Sequence (triggered by First Connect Event)



3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

3.2.7 External Reset Handling

The chip reset can be controlled by an external RESET_N ball. If this ball is pulled low, the chip will be reset. All PMU registers are reset during the external reset including LSIM control bits. The PMU statemachines are also not reset from the external reset. An SW or watchdog reset will not reset the PMU registers. A SW and Watchdog reset is seen on the reset_n pad to allow the reset of external devices. Basically there are three reset sources, first the reset signal controlled by the PMU (reset_pmu_n_o), second the reset signal controlled by the SCU (resetout_o) and third the external reset (RESET_N). The SCU reset is triggered by SW (for example due to a SW reset or watchdog reset). The PMU reset is controlled by the PMU state machine. The output of the reset handling block is the reset_postscu_n_o signal. This signal controls for example the C subsystem and releases reset for the controller. During normal start up, the PMU releases the reset_pmu_n_o signal after entering the SYSTEM ON state. At this time the resetout_o signal is high, the RESET_N pad is not pulled low and therefore the reset_postscu_n_o signal follows the reset_pmu_n_o signal. That means the C reset will be released and the C starts operation. If the SW triggers an external reset via the SCU, signal resetout_o will be forced to low for a certain time and RESET_N will be forced to low by the open drain driver. At the same time the feedback to the SCU will be masked to not reset the baseband. The RESET_N pad is in the VDDRTC domain but the internal pull up is connected to the VDD_VDIG1 (1.8V) domain. That allows the pad to be used as reset for external devices running in the VDD1V8 domain. The RESET_N pad can also be used to monitor the chip internal reset condition during startup.

The open drain driver is a weak driver, that means it can be forced to high during debug from external pushing some current into the pad. In testmode signal reset_pmu_n_o is high, that means the chip reset is fully controlled from external .

- �0 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes

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3. TECHNICAL BRIEF

3.2.8 Sysclock Switching

The PMU controls the rf_sysclk_en signal of the DCXO in the RF macro. During startup the PMU enables the DCXO. After the system is running the DCXO is controlled by the SCU of the baseband by using the vcxo_enable signal. This is handled by a dedicated logic in the PMU, see Figure 21. As long as rf_sysclk_en_pmu, the output of the PMU state-machine is high, vcxo_enable controls the rf_sysclk_en signal to the RF. If rf_sysclk_en_pmu is low, the DXCO is switched off, independent from vcxo_enable.

Figure 3.2.4 PMU, CGU and External Reset

- �1 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes


3. TECHNICAL BRIEF

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3. TECHNICAL BRIEF

3.2.10 Software Reset

A software reset does not affect any PMU register. The PMU register are reset with the reset_pmufsm_n_o signal. That means all PMU register are reset in OFF state. For details about the SW reset see chapter External Reset Handling .

3.2.9 Undervoltage Shutdown

In active mode the PMU periodically measures the battery voltage using the ADC from the charger unit. If the battery is measured to be below the programmable shut-down level (called SYSOFF), the system changes to OFF mode. This is done via the SHUTDOWN state of the PMU state machine. (see chapter switch OFF)

Figure 3.4.2 How sysclock Enable is Routed in the PMU


3. TECHNICAL BRIEF

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3. TECHNICAL BRIEF

3.2.11 PMU Clock

During the first startup (for example plugging in a battery) a PMU internal oscillator is used for generation of the PMU clock (pmu_clock). The frequency is slightly above 32 kHz (typ. 50 kHz) to be out of the audio band also for worst case devices. After first startup the software shall enable the 32 kHz crystal oscillator. It is not possible to use the 32 kHz oscillator during first startup, because the settling time of the oscillator can be quite long. After the 32 kHz oscillator is running and settled the software shall switch the PMU clock to the 32 kHz clock and disable the internal PMU oscillator for power saving reasons. The 32 kHz oscillator shall never be disabled after the PMU clock has been switched. The ADC in the charger unit has it’s own oscillator generating a frequency of about 10 MHz. This oscillator is running during charging and during battery measurements triggered by the PMU. It is off otherwise.

3.2.12 System Sleep Mode

The sleep mode is controlled by using the VCXO_enable signal. This signal is used to switch the LDO’s and the DC/DC converter SD1 in a programmable way into its low power mode (PFM). In addition DC/DC converter SD1 can be configured to change the output voltage to a lower value for additional power saving. VCXO_enable is also used to deactivate the HPBG and setting LDO LPMU in the ultra-low-power mode. In addition the DCXO is switched off by the VCXO_enable signal. The VCXO_enable signal is also used to switch some LDO’s (software configured) to sleep and/or off mode or to change the output voltages of said LDO’s. The state of the main PMU state machine is not changed due to VCXO_enable.

3.2.13 DC/DC Pre-Load Register Handling

The DC/DC converter works in different modes. If the mode is switched from PFM to PWM the pulse-width of the DC/DC converter depends on the current battery voltage (and on the output voltage). The PMU state-machine knows the battery voltage because of the battery supervision function. Depending on this value it selects a startup pulse-width for the DC/DC converter out of a register table. (4-values)

3.2.14 Power Down Sequence

Setting bit OFF in the GeneralControl register switches the system into OFF mode. After the turn off event, the state-machine switches to the SHUTDOWN state. The reset_pmu_n_o signal changes to low, the I/O pads are isolated using the padisolation_n signal, the LCORE LDO and the SD1 DC/DC converter are switched off, the LPMU LDO is switched to ultra-low power mode, the DCXO is turned off and the bandgap buffer is disabled. Before switching OFF the software shall have enabled the 32 kHz oscillator and has switched the PMU clock to the 32 kHz clock to archive the target OFF current .

- �� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes


3. TECHNICAL BRIEF

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3.3.1 Internal Block Diagram

3.3 FEM with integrated Power Amplifier Module (RF7161, U301)

Figure. 3-3-1 RF7161 FUNCTIONAL BLOCK DIAGRAM

3.3.2 General Description

The RF7161 is a quad-band (GSM850/EGSM900/DCS1800/PCS1900) GSM/GPRS, Class 12compliant transmit module with four interchangeable receive ports. This transmit modulebuilds upon RFMD’s leading power amplifier with PowerStar® integrated power control technology, pHEMT switch technology, and integrated transmit filtering for best-in-class harmonic performance. The results are high performance, reduced solution size, and ease ofimplementation. The device is designed for use as the final portion of the transmitter section ina GSM850/EGSM900/DCS1800/PCS1900 handset and eliminates the need for a PA-toantennaswitch module matching network. The device provides 50 matched input and outputports requiring no external matching components.

The RF7161 features RFMD’s latest integrated power-flattening circuit which significantly reduces current and power variation into load mismatch. Additionally, a VBATT tracking feature is incorporated to maintain switching performance as supply voltage decreases. The RF7161 also integrates an ESD filter to provide excellent ESD protection at the antenna port. The RF7161 is designed to provide maximum efficiency at rated POUT.

3. TECHNICAL BRIEF


3. TECHNICAL BRIEF

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3.3.1 Internal Block Diagram

3.3 FEM with integrated Power Amplifier Module (RF7161, U301)

Figure. 3-3-1 RF7161 FUNCTIONAL BLOCK DIAGRAM

3.3.2 General Description

The RF7161 is a quad-band (GSM850/EGSM900/DCS1800/PCS1900) GSM/GPRS, Class 12compliant transmit module with four interchangeable receive ports. This transmit modulebuilds upon RFMD’s leading power amplifier with PowerStar® integrated power control technology, pHEMT switch technology, and integrated transmit filtering for best-in-class harmonic performance. The results are high performance, reduced solution size, and ease ofimplementation. The device is designed for use as the final portion of the transmitter section ina GSM850/EGSM900/DCS1800/PCS1900 handset and eliminates the need for a PA-toantennaswitch module matching network. The device provides 50 matched input and outputports requiring no external matching components.

The RF7161 features RFMD’s latest integrated power-flattening circuit which significantly reduces current and power variation into load mismatch. Additionally, a VBATT tracking feature is incorporated to maintain switching performance as supply voltage decreases. The RF7161 also integrates an ESD filter to provide excellent ESD protection at the antenna port. The RF7161 is designed to provide maximum efficiency at rated POUT.

3. TECHNICAL BRIEF



3. TECHNICAL BRIEF

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Figure 3.3.2 Band SW Logic Table

Figure 3.3.3 FEM CIRCUIT DIAGRAM

3. TECHNICAL BRIEF

1. RX1, RX2, RX3, and RX4 are broadband receive ports and each supports the EGSM, GSM850, PCS, and DCS bands.

10

R327

DNIC359

103U

21

11

10

9

8

7

31

6

41

5

51

4

61

3

71

2

18

1

19

20

21

22

23GND_SLUG

VRAMP

TX_ENABLE

GPCTRL0

GPCTRL1

1D

NG

VBATT

2D

NG

2LRT

CP

G

BL_NIF

R

9D

NG

3D

NG

8D

NG

BH_

NIFR

TN

A

4D

NG

4X

R

GND5

GND6

GND7

RX1

RX2

3X

R33pC302

303C

p33

p33403

C

L301 3.3n 3.3nL302

22pC343

3.3nL303

1nL308

1pC305

L306 3.3n

C3141.5p

C31539p

10nC316 C317

4.7u

1nC318

1nC319

DNIC392

VBAT

C32233p

1nC323

33pC325

1nC326

4.7uC327

56pC306

VLOGICBS2BS1TX_EN

GSM_OUT

DCS_PCS_OUT

TX_RAMP


3. TECHNICAL BRIEF

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3.4 Crystal(26 MHz, X102)

Figure. 3.4.2 Digital PREDISTORTION with LUXO

The DCXO tuning characteristic should be a first order linear function of the programming word AFC. The variable capacitance array is a first order linear function of the digital word DIG, which leads to a nonlinear curve ppm vs. DIG (and also a nonlinear ppm vs. AFC for DIG=AFC). In order to linearize the ppm vs. AFC curve the implementation of a predistortion is necessary. To get the wanted linear ppm vs. AFC tuning curve some digital predistortion of the AFC word is required. This predistortion is performed by the linearization unit for crystal oscillator (LUXO). The LUXO calculates the corresponding DIG value according to the given AFC value.

Figure. 3.4.1 Crystal Oscillator External Connection

The X-GOLDTM213 RF-Subsystem contains a fully integrated 26 MHz digitally controlled crystal oscillator, designed for 8 pF crystals. The only external part of the oscillator is the crystal itself. Overall pulling range of the DCXO is approximately 55 ppm, controllable by a 13-bit tuning word.

This frequency serves as comparison frequency within the RF-PLL and as clock frequency for the digital circuitry.The 26 MHz reference clock can also be applied to external components like Bluetooth or GPS, via the two buffered output signals FSYS1 and FSYS2.

3. TECHNICAL BRIEF

3.4 Crystal(26 MHz, X102)



3. TECHNICAL BRIEF

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3.5 RF Subsystem of PMB8810 (U101)

3.5.1 GENERAL DESCRIPTION

The PMB8810 RF subsystem is designed for dual-band GSM voice and data applications (GPRS class 12). The system can be configured to support one low band, GSM850 or EGSM900, and one high band, DCS1800 or PCS1900. A block diagram of the RF subsystem is given in Figure 3-5-1.

Figure. 3-5-1 Block DIAGRAM of RF Subsystem

3. TECHNICAL BRIEF

3.5 RF Subsystem of PMB8810 (U102)

3.5.1 GENERAL DESCRIPTIONThe PMB8810 RF subsystem is designed for dual-band GSM voice and data applications (GPRS class 12). The system can be configured to support one low band, GSM850 or EGSM900, and one high band, DCS1800 or PCS1900. A block diagram of the RF subsystem is given in Figure 3-4-1.

Figure. 3-5-1 Block DIAGRAM of RF Subsystem

3. TECHNICAL BRIEF3.5 RF Subsystem of PMB8810 (U101)


3. TECHNICAL BRIEF

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3.5.2 FUNCTIONAL DESCRIPTION

Figure. 3.5.2 RECEIVER CHAIN BLOCK DIAGRAM

3. TECHNICAL BRIEF

3.5.2.1 Receiver

The X-GOLD™213 dual-band receiver is based on a Direct Conversion Receiver (DCR) architecture. Input impedance of the LNAs is optimized to achieve a matching without (external) high quality inductors. By use of frequency dividers (by 2/4) the LO frequency is derived from the RF frequency synthesizer.The receive path is fully differential to suppress the on-chip interferences and reduce DC-offsets. The analog chain of the receiver contains two LNAs (low/high band), a quadrature mixer followed by an analog baseband filter and 14-bit continuous-time delta-sigma analog-to-digital converter. The filtered and digitized signal is fed into the digital signal processing chain, which provides decimation, DC offset removal and programmable gain control.



3. TECHNICAL BRIEF

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Figure. 3.5.3 TRANSMITTER CHAIN BLOCK DIAGRAM

3. TECHNICAL BRIEF

3.5.2.2 Transmitter

The GMSK transmitter supports power class 4 for GSM850 or GSM900 as well as power class 1 for DCS1800 or PCS1900. The digital transmitter architecture is based on a fractional-N sigma-delta synthesizer for constant envelope GMSK modulation. This configuration allows a very low power design without any external components.Up- and down-ramping is performed via the ramping DAC connected to VRAMP.

RF synthesizer

The RF subsystem contains a fractional-N sigma-delta synthesizer for the frequency synthesis. Respective to the chosen band of operation the phase locked loop (PLL) operates at twice or forth of the target signal frequency. In receive operation mode the divided output signal of the digital controlled oscillator output (DCO) serves as local oscillator signal for the balanced mixer. For transmit operation the fractional-N sigma-delta synthesizer is used as modulation loop to process the phase/frequency signal. The 26 MHz reference signal of the phase detector incorporated in the PLL is provided by the reference oscillator.


3. TECHNICAL BRIEF

Figure. 3.5.4 PA AND FEM CONTROL BLOCK DIAGRAM

3. TECHNICAL BRIEF

3.5.2.3 Front-end/PA Control Interface

Two outputs (FE1, FE2) for direct control of antenna switch modules enable to select RX- and TX-mode as well as low- and high-band operation.An extra band select signal PABS for the power amplifier is used, to support discrete PA and switching modules. Time accurate power dissipation of the PA is achieved by the control signal PAEN. A minor set of power amplifiers require a bias voltage to enhance power efficiency. Support of this power amplifiers is achieved by the implemented bias DAC.



3. TECHNICAL BRIEF

Figure. 3.5.5 POWER SUPPLY BLOCK DIAGRAM

3. TECHNICAL BRIEF

3.5.2.4 Power Supply

To increase power efficiency most parts of the RF subsystem are supplied by the DCDC converter situated in the PMU subsystem. Conversion of the 1.8 V output voltage of the DCDC to the 1.3 V/1,4 V circuit supply voltages is achieved by several Low-DropOut regulators (LDO).One embedded direct-to-battery LDO provides the 2.5 V supply voltage for the remaining circuits.


3. TECHNICAL BRIEF

3.6 MEMORY(PF38F6066M0Y3DE, U102)

The Numonyx™ StrataFlash® Cellular Memory (M18) device provides high read and write performance at low voltage on a 16-bit data bus.The flash memory device has a multi-partition architecture with read-while-program and read-while-erase capability.The device supports synchronous burst reads up to 108 MHz using ADV# and CLK address-latching (legacy-latching) on some litho/density combinations and up to 133 MHz using CLK address-latching only on some litho/density combinations. It is listed below in the following table..

Figure. 3.6.1 MEMORY BLOCK DIAGRAM

3. TECHNICAL BRIEF

3.6 MEMORY(PF38F6066M0Y3DE, U102)



3. TECHNICAL BRIEF

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3. TECHNICAL BRIEF

In continuous-burst mode, a data Read can traverse partition boundaries.Upon initial power-up or return from reset, the device defaults to asynchronous arrayread mode. Synchronous burst-mode reads are enabled by programming the Read Configuration Register. In synchronous burst mode, output data is synchronized with a user-supplied clock signal. A WAIT signal provides easy CPU-to-flash memory synchronization.Designed for low-voltage applications, the device supports read operations with VCC at 1.8 V, and erase and program operations with VPP at 1.8 V or 9.0 V. VCC and VPP can be tied together for a simple, ultra-low power design. In addition to voltage flexibility, a dedicated VPP connection provides complete data protection when VPP is less than VPPLK.A Status Register provides status and error conditions of erase and program operations.One-Time-Programmable (OTP) registers allow unique flash device identification that can be used to increase flash content security. Also, the individual block-lock feature provides zero-latency block locking and unlocking to protect against unwanted program or erase of the array.The flash memory device offers three power savings features:• Automatic Power Savings (APS) mode: The device automatically enters APS following a read-cycle completion.• Standby mode: Standby is initiated when the system deselects the device by deasserting CE#.• Deep Power-Down (DPD) mode: DPD provides the lowest power consumption and is enabled by programming in the Enhanced Configuration Register. DPD is initiatied by asserting the DPD pin.

Table 3_6_1 M18 Frequency combinations


3. TECHNICAL BRIEF

3.7 BT module (U302)

3. TECHNICAL BRIEF

Figure 3_7_1. BT BLOCK DIAGRAM

This module has an integrated radio transceiver that has been optimized for use in 2.4GHz Bluetooth Wireless systems. It has been designed to provide low-power, robust communications for applications Operating in the globally available 2.4GHz unlicensed ISM band. It is fully compliant with the Bluetooth Radio Specification and enhanced data rate specification and meets or exceed the requirement to provide the highest communication link quality of service.

3.7 BT module (U302)



3. TECHNICAL BRIEF

3.7.1 Transmitter path

3. TECHNICAL BRIEF

This module features a fully integrated zero IF transmitter. The baseband transmitted data Is digitally modulated in the modem block and up-converted the 2.4GHz ISM band in the Transmitter path. The transmitter path consists of signal filtering, I/Q up-conversion, high -output power amplifier(PA), and RF filtering. It also incorporates modulation schemes P/4-DQPSK for 2 Mbps and 8-DPSK for 3 Mbps to support enhanced data rate.

• Digital modulator

The digital modulator performs the data modulation and filtering required for the GFSK, b/4DQPSK, and 8-DPSK signal. The fully digital modulator minimizes any frequency drift or anomalies in the modulation characteristics of the transmitted signal and is much more Stable than direct VCO modulation schemes.

• Power Amplifier

The integrated PA for the BCM2070 is configurable for Class 2 operation, transmitting up to +4 dBm as well as Class 1 operation and transmit power up to +12 dBm at the chip, gFSK, >2.5V supply. Due to the linear nature of the PA, combined with some integrated filtering, no External filters are requires for meeting Bluetooth and regulatory harmonic and spurious requirements. For integrated mobile handset applications, where Bluetooth is integrated next to the celluar radio, minimal external filtering can be applied to achieve near thermal noise levels for spurious and radiated noise emissions. Using a highly linearized, temperature compensated design the PA can transmit +12 dBm for Basic rate and +10 dBm for enhanced data rates(2 to 3 Mbps). A flexible supply voltage range Allows the PA to operate from 1.2V to 3.0V. The minimum supply voltage at VDDTF is 1.8V to achieve +10dBm of transmit power.

3.7.2 Receiver path

The receiver path uses a low IF scheme to down-convert the received signal for demodulation in the digital demodulator and bit synchronizer. The receiver path provides a high degree of Linearity, an extended dynamic range, and high order on-chip channel filtering to ensure reliable operation in the noisy 2.4GHz ISM bnad. The front-end topology, with built-in out -of-bnad attenuation, enables the device to be used in most applications with no off-chip Filtering. For integrated handset operation where the Bluetooth function is integrated close to the celluar transmitter, minimal external filtering is required to eliminate the desensitization of The receiver by the cellular transmit signal.


3. TECHNICAL BRIEF

3.8 SIM Card Interface

Figure 3-8-1. SIM CARD Interface

Signal Description

SIM_RST This signal makes SIM card to HW default status.

SIM_CLK This signal is transferred to SIM card.

SIM_DATA This signal is interface datum.

The Main Base Band Processor(XMM2130) provides SIM Interface Module. The XMM2130 checks status Periodically During established call mode whether SIM card is inserted or not, but it doesn't check during deep sleep mode. In order to communicate with SIM card, 3 signals SIM_DATA, SIM_CLK, SIM_RST.And This model supports 1.8/3V SIM Card.

3. TECHNICAL BRIEF

J401

8 7

6 3

5 2

4 1VCCGND

RSTVPP

CLKI_O

GND1GND2

ZD403 ZD401

R4174.7K

2V85_VSIM

2V85_VSIM

0.1uC413

DNIC414

22pC415

ZD40222pC416

DNIR418

SIM_CLKSIM_RST

SIM_DATA

These are added for CMCC ESD test

ZD200ZD201 is DNI defaultly

SIM_CONNECTOR 1(Default)

3.8 SIM Card Interface



3. TECHNICAL BRIEF

3.9 LCD Interface

Figure 3-9-1. LCD Interface of LCD FPCB

3. TECHNICAL BRIEF

VBAT

444R

smho

K001

1uFC425

1V8_VDD

C426

2.2u

C42727pF

100ohms

R445

VA415

FL403

01

5

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

1G

2G

VMMC

C4281uF

TP402

TP403

TP404TP405

VA416

100ohms

R446

CN403

27

26

25

24

23

22

21

20

19

18

17

16

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

0.001uFC429

FL404

01

5

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

1G

2G

C4300.001uF

FL405

01

5

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

1G

2G

LCD_RSNLCD_MAIN_CS

LCD_DATA00LCD_DATA01LCD_DATA02LCD_DATA03


LCD_VSYNC

NLCD_WR

_LCD_RESET

LCD_ID

MLED5MLED4MLED3MLED2MLED1

MAKER ID : LOW

LCD CONNECTOR


3. TECHNICAL BRIEF

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The RT9396 is an integrated solution for backlighting and phone camera input supply. The part contains a charge pump white LED driver and dual low dropout linear regulators. This IC can be shutdown by pulling ENA low.

In the section of charge pump, The RT9396 can power up 5 white LEDs with regulated constant current for uniform intensity. Each channel (LED1-LED5) can support up to25mA. The part maintains highest efficiency by utilizing a x1/x1.5/x2 fractional charge pump and low dropout current regulators. An internal 5-bit DAC is used for brightness control. Users can easily configure up to 32-step of LED current by I2C interface.

In the section of linear regulator, The RT9396 comprises a dual channel, low noise, and low dropout regulator sourcing up to 300mA at each channel. The range of output voltage can be configured from 1.1V to 3.3V by I2C interface. The outputs of LDO offer 3% accuracy and low dropout voltage of 250mV @300mA. The LDO also provides current limiting and output short circuit thermal folded back protection.

Figure 3-9-2. RT9396 CIRCUIT DIAGRAM

3. TECHNICAL BRIEF

1u

C401

1u

C402

R427

100K0.1u

C418

2.2u

C419

1u

C433C420

1u

1V8_HPVDD

2.2u

C421 C422

2.2u

VBAT

324C u1

424C u1

U402

24

23

22

21

20

19

18

8

7

6

5

9

4

10

3

11

2

12

1

31 41 51 61 7 1L

CS

AD

S

NE

MW

P

FC

DN

GP

LDO1

N2C

LDO2

N1C

LDO3

P1C

LDO4

P2C

AGND

VIN

LDOIN

LED6

LED5

LED4

LED3

LED2

LED1

VOUT

1V8_VDD

K0 1

344R

CAM_A_2V8

CAM_D_1V5

CAM_IO_1V8

I2C_SCLI2C_SDA

LCD_BL_CTRL




3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

Figure 3-9-3. RT9396C FUNCTION BLOCK DIAGRAM


3. TECHNICAL BRIEF

3.10 Battery Charger Interface

Figure 3-10-1 BATTERY CHARGER BLOCK

The RT9524 is a fully integrated single-cell Li-Ion battery charger IC ideal for portable applications. The RT 9524 optimizes the charging task by using a control algorithm including pre-charge mode, fast charge mode and constant voltage mode. The input voltage range of the VIN pin can be as high as 30V. When the input voltage exceeds the OVP threshold, it will turn off the charging MOSFET to avoid overheating of the chip.

In RT9524, the maximum charging current can be programmed with an external resister. For the USB application, user can set the current to 100mA/500mA through EN/SET pin. For the factory mode, the RT9524 can allow 4.2V/2.3V power pass through to support system operation. It also provides a 50mA LDO to support the power of peripheral circuit. The internal thermal feedback circuit regulates the die temperature to optimize the charge rate for all ambient temperatures. The RT9524 provides protection functions such as under voltage protection, over voltage protection for VIN supply and thermal protection for battery temperature.

The RT9524 is available in a WDFN-10L 2x3 package to achieve optimized solution for PCB space and thermal considerations.

3. TECHNICAL BRIEF

From External Source(Travel Adaptor or USB)

0.1uC257

1V8_VDD

C2211u

0.1u

C222

VBUS_USB

1u

C223

RT9524EUSY0410801

U203

65

74

83

92

101

11PGND

VIN BATT

ISET PGB

GND1 CHGSB

LDO GND2

IEOC EN_SET

VBAT

100KR217

820

R233

3.9K

R234

CHG_EN

LDO_OUT_EOC

(25V)(10V)

CHARGING IC

From External Source(Travel Adaptor or USB)



3. TECHNICAL BRIEF

3.11 Keypad Interface

Figure 3-11-1 MAIN KEY STRUCTURE

3. TECHNICAL BRIEF

Figure 3-11-1 MAIN KEY STRUCTURE

KB431KB432KB433

CN401

4

3

2

1

VA419

KB404

KB434KB430KB435KB436KB437

KB405KB406KB407KB445

KB411 KB410 KB409 KB438 KB408 KB403 KB402 KB401

KB419KB418KB417KB416KB415KB414KB413KB412

KB440 KB439 KB443 KB444 KB421 KB441 KB442 KB420


R416 100ohms

VA417

R428 100ohmsR429 100ohms

VA418

KEY_COL0

KEY_COL2

KEY_COL3

KEY_COL4

KEY_ROW7

KEY_ROW7

KEY_COL5

KEY_COL5

KEY_ROW0

KEY_ROW1

KEY_ROW2

KEY_ROW5

KEY_ROW6

KEY_ROW6

KEY_ROW3

KEY_COL1

KEY_ROW4

@

Q W E R T Y U I

O P AS D F G H

J K L

BACK SHIFT

Z X C

V B N M ?(QUES) ENTER LOCK MESSAGE

SENDRIGHT SOFTLEFT SOFTSYM.(PRIOD),(COMMA)SPACE

OK LEFT RIGHT UP DOWN

2.2u

C146

VRTC

100KR117

100

R118

D101

END_KEY

KB101

PWRON

POWER ON


3. TECHNICAL BRIEF

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The Keypad Interface is a peripheral controller, which can be used for scanning external keypad matrices with up to 8 rows and 8 columns (that is 64 standard keys). By adding an additional row of keys connected to ground the number of keys can be extended by up to 8 keys. This results in a maximum number of 72 keys to by identified by the Keypad Interface Controller.The Keypad Scan Module reduces the number of interrupts and polling through the processor and therefore reduces the power consumption. The module is able to debounce and scan the external keypad matrix automatically without any software intervention. After debouncing it generates an interrupt. The interface controller contains information about the key (or key combination) that was pressed and how long it was pressed.

Figure 3-11-3 Block Diagram and System Integration of the KPD

3. TECHNICAL BRIEF



3. TECHNICAL BRIEF

3.12 Audio Front-End

Figure 3.12.1 Audio Section Overview

3.12.1 Functional Overview

The audio front-end of X-GOLD™213 offers the digital and analog circuit blocks for both receive and transmit audio operation, from a mobile phone perspective (called audio-in and audio-out subsequently). It features a high-quality, stereo digital-to-analog path with amplifier stages for connecting acoustic transducers to X-GOLD™213. In audio-in path the supply voltage generation for electret microphones, a low-noise amplifier and analog to digital conversion are integrated in X-GOLD™213. A more detailed functional description will be given in the following sections.

The audio front-end itself can be considered to be organized in three sub-blocks:• Interface to processor cores (TEAKLite® and - indirectly - ARM)• Digital filters• Analog part

The following figure shows an architecture overview of the Audio section.

1. TECHNICAL BRIEF


3. TECHNICAL BRIEF

The audio front-end of X-GOLD™213 has the following major operation modes:

• Power-down: All analog parts are in power down and all clocks of the digital part are switched off.• Audio mode: Digital decimation/interpolation filters are connected to the interface buffers and the analog part is enabled.

These major modes can be modified by certain control register settings.

• Due to the new gain settings in the TX path, the maximum input voltage is limited to 0.8 Vpp.• In both voiceband paths, the value range for voice samples is confined to 97.5%, i.e. to [-31948, 31947] or [8334H, 7CCBH] in X-GOLD™213.• On the TX path, 83% "1"s on the VTPDM line correspond to a 16-bit value of 7CCBH and 17% "1"s correspond to a 16-bit value of 8334H at the digital filter output. Thus the usable range is 66%. This range can be scaled to 100% by Firmware.• The high-pass functions of the voiceband filters have to be implemented in firmware on TEAKLite®.

3. TECHNICAL BRIEF

Figure 3.12.2 Overview of Clocking and Interfaces of Audio Front End



3. TECHNICAL BRIEF

Interpolation Filter

The interpolation path of the X-GOLD™213 audio front-end increases the sampling rate of the audio samples to the rate of the digital-to-analog converter. Because the input sampling rates can vary between 8 kHz and 47.619 kHz the filter characteristic and oversampling ratio can be adjusted to the respective sampling rate. The requirements for the interpolation filters depend on the sampling rate, because a sufficient out-of-band discrimination in the audio frequency band (20 Hz,...,20 kHz) has to be ensured.

Decimation Filter

The digital decimation filter on X-GOLD™213 has two operating modes: 8 kHz output sampling rate and 16 kHz output sampling rate (or 16 kHz output sample rate and 16kHz bandwidth in case of doubled ASMD clock).

3.12.3 Analog Part

The analog part of the X-GOLD™213 audio front-end in audio-out direction consists of a stereo digital to analog converter (multi-bit oversampling converter) which transforms the output of the digital interpolation filter into analog signals. It is followed by the gain control/amplifier section. The DAC outputs can be switched to several output buffers. In audio-in section there is an input multiplexer which selects either one of two differential microphone inputs to be connected to the low-noise amplifier and analog pre-filter. The signals from the analog pre-filter are input to a second-order sigma-delta analog-to-digital converter. In addition there is a connection for FM-radio playing.

Audio-out Part

The analog audio-out part consists of two multi-bit digital-to-analogue converters (DAC) and an output stage. The signal sources are switched to the output drivers in the output stage. The output drivers consist of: a) one mono, differential class-D Loudspeaker driver, b) one mono, differential Earpiece driver and c) one stereo, single-ended (with uni- or bipolar signals), Headset driver.

3. TECHNICAL BRIEF

3.12.2 Digital Part

The digital part of the X-GOLD™213 audio front-end comprises an interface to the TEAKLite® bus, interfaces to the interrupt units of TEAKLite®, digital interpolation filters for oversampling digital-to-analog conversion, digital decimation filters for analog-to-digital conversion and an interface to the analog part of the audio front-end. For the digital microphone all the filtering is done in a dedicated hardware. The output sample stream is then fed in a duplicated ring buffer structure like the data from the analog microphone path (after A/D conversion and subsequent digital filtering).


3. TECHNICAL BRIEF

Output Amplifier

The different output buffers in X-GOLD™213 are driven by the outputs of the selection block. The differential earpiece driver can be used to drive a 16 earpiece and works in differential. The two single ended headset drivers can be used to drive a 16 headset. They can work unipolar mode, where an AC coupling of the headset might be needed, or can work also in bipolor mode. The differential loudspeaker driver can be used to drive a 8 loudspeaker. As it is a class-D amplifier the needed suppression of the higher harmonics of the switching signalshas to be achieved by the external circuitry. The buffers are designed to be short circuit protected.

3. TECHNICAL BRIEF

Figure 3.12.3 Switching for R/L DACs onto Buffers

Digital-to-analog converters

The multi-bit oversampling DACs of the X-GOLD™213 audio front-end convert the 16-bit data words coming from the digital interpolation filters to analogue signals.



3. TECHNICAL BRIEF

Figure 3.12.4 Different Application Scenarios

3. TECHNICAL BRIEF

In order to achieve the single-speaker concept by parallel connection of Earpiece and Headset amplifier the Earpiece amplifier have to sustain the up to 5 V voltage of the class-D amplifier.

Audio-in Path

The audio-in path of X-GOLD™213 provides two differential microphone input sources, MIC1and MIC2.

• The inputs for microphone MIC1 are MICP1 and MICN1.• The inputs for microphone MIC2 are MICP2 and MICN2.

The audio-in path consists of an input selector, a low noise amplifier and following pre-filter with gain control, a second order -converter and a digital decimation filter. It supports both standard GSM (bandwidth 3.5 kHz) and wideband (bandwidth 7 kHz) speech bands.The differential input signal from the microphone first passes a low noise amplifier and following pre-filter and an anti-aliasing pre-filtering stage achieving and overall variable gain ranging from 0 dB to +39 dB . The signal is then modulated by a second order -converter which is clocked with the same clock rate as the digital to analog converters. The -converter delivers a 1-bit pulse density modulated data stream at a rate of 2 MHz to the digital decimation filter which reduces the rate to 8 kHz or 16 kHz, depending on the current mode.To improve SNR the sample frequency can be doubled in dedicated modes and the modulated data stream is 4MHz instead of 2 MHz.


3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

Microphone Supply

X-GOLD™213 has a single ended power-supply concept for electret microphones:For both modes a minimal load capacitance of t.b.d. nF is necessary to guarantee stable operation of the buffer.The maximal load capacitance must not exceed t.b.d. nF.2 microphone supplies VMIC and VUMIC are available. The supply VUMIC has a ultra-low-power mode, where the current consumption is minimum, whilst at the same time the noise performance is reduced. For this purpose the VUMIC is directly supplied out of the VMIC regulator, the Mic-Buffer can be switched off and only the quiescent current of the VMIC regulator is present. This mode can be used to supply a headset and allow accessory detection with highly reduced current consumption For normal operation the supply can be switched to normal operation mode with improved noise performance. In case of an digital microphone VMIC can be used for supplying this microphone.

Figure 3.12.5 Typical Microphone Supply Generation (alternative)



3. TECHNICAL BRIEF

3.13 Camera Interface(2M Fixed Focus Camera)

3.13.1 PMB8810 Camera Interface

The Camera Interface (CIF) represents a complete video and still picture input interface (see Figure 3.13.1).

The CIF contains image processing, scaling, and compression functions. The integrated image processing unit supports image sensors with integrated YCbCr processing.

Scaling is used for downsizing the sensor data for either displaying them on the LCD, or for generating data streams for MPEG-4 compression. In general, YCbCr 4:2:2 JPEG compressed images should use the full sensor resolution, but they can also be downscaled to a lower resolution for smaller JPEG files. Scaling also can be used for digital zoom effects, because the scalers are capable of up-scaling as well.CIF all data is transmitted via the memory interface to an AHB bus system using a bus master interface.Programming is done by register read/write transactions using an AHB slave interface.

3. TECHNICAL BRIEF

Figure 3.13.1 Block Diagram of Camera Interface


3. TECHNICAL BRIEF

Functional Overview of CIF

The following list gives an overview over the CIF’s functionality:

• 78 MHz system clock • 78 MHz sensor clock• 78 MHz JPEG encoder clock• 32-bit AHB slave programming interface• ITU-R BT 601 compliant video interface supporting YCbCr• ITU-R BT 656 compliant video interface supporting YCbCr data• 8-bit camera interface• 12-bit resolution per color component internally• YCbCr 4:2:2 processing• Hardware JPEG encoder incl. JFIF1.02 stream generator and programmable quantization and

Huffman tables• Windowing and frame synchronization• Continuous resize support• Frame skip support for video (e.g. MPEG-4) encoding• Macro block line, frame end, capture error, data loss interrupts and sync. (h_start, v_start) interrupts• Programmable polarity for synchronization signals• Luminance/chrominance and chrominance blue/red swapping for YUV input signals• Maximum input resolution of 3 Mpixels (2048x1536 pixels)• Main scaler with pixel-accurate up- and down-scaling to any resolution between 3 MP (2048x1536)

and 32x16• pixel in processing mode• Buffer in system memory organized as ring-buffer• Buffer overflow protection for raw data and JPEG files• Asynchronous reset input, software reset for the entire IP and separate software resets for all sub-

modules• Interconnect test support• Semi planar storage format• Color processing (contrast, saturation, brightness, hue)• Power management by software controlled clock disabling of currently not needed sub-modules

3. TECHNICAL BRIEF



3. TECHNICAL BRIEF

3.14 KEY BACLKLIGHT LED Interface

Key Backlight LED is controlled by switch (Q401). If KEY_BL_EN is high, Current is flowing from VBAT to LED. Then Light emitted from The LED. KEY_BL_EN is operating PWM. It is reducing current consumption.

Figure 3-14-1 Key Backlight Block

3. TECHNICAL BRIEF

LD408 LD406 LD403 LD407 LD404 LD405 LD409 LD410 LD411 LD414 LD413 LD412

D401

051

104R

LD401

Q401

1

23

K001

844R

LD402

VBAT

smho051

034R

smh o051

134R

234R

sm ho05 1

334R

smh o051

smh o051

434R

smho051

534R

smho051

634R

smho051

734R

smho051

834R

smho051

934R

smho051

044R

144R

smho051

244R

smho051

1.2K

R447

0.1u

C431

KEY_BL_EN

Figure 3-14-1 Key Backlight Block


3. TECHNICAL BRIEF

3.15 Vibrator Interface

Support PWM signal which generated by hardware itself via register control direct connect to the VIB and VSSVIB pin from XMM2130 without any external component required it is capable to driver the vibrator motor up to 150mA.

Figure 3-15-1 Vibrator Driver Block Diagram

3. TECHNICAL BRIEF

Figure 3-15-2 Vibrator Driver Block

L208 0.1uH

0.1uH

L209

VB201

2

1

33p

C253

1uFC254

VIB_P

SJMY0007110VIB_N

VIB_P

MOTOR



4. TROUBLE SHOOTING

4. TROUBLE SHOOTING

4.1 RF Component

4. TROUBLE SHOOTING

Figure 4.1

U102 Memory(512NOR/128pSDRAM)PF38F5060M0Y3DF

U101(PMB8810) Main Chip (A-GOLDRADIO)

U301 FEM(Tx Module)

X102 Crystal, 26MHz Clock

U102

U301

X102U101

4. TROUBLE SHOOTING

SW301


4.2 RX Trouble

CHECKING FLOW

4. TROUBLE SHOOTING

START

Re-download SW or Do calibration again

HP8960 : Test mode62 CH, 7 level setting (TCH)

62CH, -60dBm setting (BCCH)Spectrum analyzer setting

Oscilloscope setting

(1) CheckCrystal Circuit

(2) CheckMobile SW &TX module

(3) Check PLL Control

4. TROUBLE SHOOTING



4. TROUBLE SHOOTING

(1) Checking Crystal Circuit

4. TROUBLE SHOOTING

TEST POINT

CIRCUIT WAVEFORM

CHECKING FLOW

1 pin

Figure 4.2.1

26 MHz O.K?No

Crystal is OK.See next page to check PLL Circuit

Yes

Replace X102

Figure 4.2.2 Figure 4.2.3

1 pin : 26MHz

X102

2V85_VSIM

G4

G2

G3

M8

A11

B11

K12

K11

B2

A3

B3

A2

J8

H7USIF2_RTS_N

USIF2_CTS_N

USIF1_TXD_MTSR

USIF1_RXD_MRST

USIF1_RTS_N

USIF1_CTS_N

DPLUS

DMINUS

XOX

XO

VSIM

SIM_IO

SIM_CLK

SIM_RST0.1uC126

26MHz

DSX321G-26MX102

21

34

SIM_CLK

BT_RXDBT_TXDUSB_DPUSB_DM

UART_TXUART_RX

NLB_AD25

NUB

SIM_RST

SIM_DATA

Close to the 26MHz XTAL EINT2

CC1CC6IO

Connect GND plane directly

TP1


4. TROUBLE SHOOTING

(2) Checking Mobile SW &FEM

4. TROUBLE SHOOTING

TEST POINT

CIRCUIT

Figure 4.2.4

CONTROL LOGIC

EGSM Rx

VLOGIC

Tx_EN

BS1

BS2

TP1

TP2TP3

TP4

BS2BS1

TX_EN

VLOGIC

TXRAMP

Test point

TP1

10

R327

DNIC359

103U

21

11

10

9

8

7

31

6

41

5

51

4

61

3

71

2

18

1

19

20

21

22

23GND_SLUG

VRAMP

TX_ENABLE

GPCTRL0

GPCTRL1

1D

NG

VBATT

2D

NG

2LRT

CP

G

BL_NIF

R

9D

NG

3D

NG

8D

NG

BH_

NIFR

TN

A

4D

NG

4X

R

GND5

GND6

GND7

RX1

RX2

3X

R33pC302

303C

p33

p33403

C

L301 3.3n 3.3nL302

22pC343

3.3nL303

1nL308

1pC305

869M894M,925M960MHz

FL301 SFSB0001803

105

63

72

94

81IN_881_5 OUT_881_5

IN_942_5 OUT_942_5

GND1 GND2

GND3 GND4

GND5 GND6

L306 3.3n

C3141.5p

C31539p

10nC316 C317

4.7u

1nC318

1nC319

DNIC392

VBAT

C32233p

1nC323

1.8n

L320

L3092.2n

33pC325

1nC326

1.8n

L319

1805M1880M,1930M1990M

FL302 SFSB0001903

105

63

72

94

81IN_1842_5 OUT_1842_5

IN_1960 OUT_1960

GND1 GND2

GND3 GND4

GND5 GND6

4.7uC327

L310DNI

56pC306

22p

C396

9.1nL305

27nL312

22p

C398

VLOGICBS2BS1TX_EN

RX12

RX12X

RX34

RX34X

GSM_OUT

DCS_PCS_OUT

TX_RAMP

.

.

.

.

.

.

TP1



4. TROUBLE SHOOTING

CHECKING FLOW

4. TROUBLE SHOOTING

Check TP1 of SW301

TP1 Signal is OK? Replace Mobile SW (SW301)

Yes

No

Yes

Mobile SW & TX Module is OK.

Check PMB8810Control Signal is

(VLogic, BS1, BS2)OK ?

No

Yes

Check TP4 of U301 ?

Replace FEM (U301)TP2(High Band), TP3(Low Band) Signal is OK ?

No

Yes

EGSM Rx


4. TROUBLE SHOOTING

4.3 TX Trouble

CHECKING FLOW

4. TROUBLE SHOOTING

START

Redownload SW or Do calibration again

HP8960 : Test mode62 CH, 7 level setting (TCH)

62CH, -60dBm setting (BCCH)Spectrum analyzer setting

Oscilloscope setting

(1)CheckCrystal Circuit

(2) CheckMobile SW &FEM

(3) Check PLL Control



4. TROUBLE SHOOTING

(1) Checking Crystal Circuit

4. TROUBLE SHOOTING

TEST POINT

CIRCUIT WAVEFORM

CHECKING FLOW

Figure 4.3.1

26 MHz O.K?No

Crystal is OK.See next page to check PLL Circuit

Yes

Replace X102

Figure 4.3.2 Figure 4.3.3

1 pin : 26MHz

X101

1 pin

2V85_VSIM

G4

G2

G3

M8

A11

B11

K12

K11

B2

A3

B3

A2

J8

H7USIF2_RTS_N

USIF2_CTS_N

USIF1_TXD_MTSR

USIF1_RXD_MRST

USIF1_RTS_N

USIF1_CTS_N

DPLUS

DMINUS

XOX

XO

VSIM

SIM_IO

SIM_CLK

SIM_RST0.1uC126

26MHz

DSX321G-26MX102

21

34

SIM_CLK

BT_RXDBT_TXDUSB_DPUSB_DM

UART_TXUART_RX

NLB_AD25

NUB

SIM_RST

SIM_DATA

Close to the 26MHz XTAL EINT2

CC1CC6IO


TP1


4. TROUBLE SHOOTING

(2) Checking Mobile SW & TX Module

4. TROUBLE SHOOTING

TEST POINT

CIRCUIT

Figure 4.2.4

CONTROL LOGIC

EGSM Tx

VLOGIC

Tx_EN

BS1

BS2

TP1

TP2TP3

TP4

BS2BS1

TX_EN

VLOGIC

TXRAMP

SW301

TP2 TP3

10

R327

DNIC359

103U

21

11

10

9

8

7

31

6

41

5

51

4

61

3

71

2

18

1

19

20

21

22

23GND_SLUG

VRAMP

TX_ENABLE

GPCTRL0

GPCTRL1

1D

NG

VBATT

2D

NG

2LRT

CP

G

BL_NIF

R

9D

NG

3D

NG

8D

NG

BH_

NIFR

TN

A

4D

NG

4X

R

GND5

GND6

GND7

RX1

RX2

3X

R33pC302

303C

p33

p33403

C

L301 3.3n 3.3nL302

22pC343

3.3nL303

1nL308

1pC305

869M894M,925M960MHz

FL301 SFSB0001803

105

63

72

94

81IN_881_5 OUT_881_5

IN_942_5 OUT_942_5

GND1 GND2

GND3 GND4

GND5 GND6

L306 3.3n

C3141.5p

C31539p

10nC316 C317

4.7u

1nC318

1nC319

DNIC392

VBAT

C32233p

1nC323

1.8n

L320

L3092.2n

33pC325

1nC326

1.8n

L319

1805M1880M,1930M1990M

FL302 SFSB0001903

105

63

72

94

81IN_1842_5 OUT_1842_5

IN_1960 OUT_1960

GND1 GND2

GND3 GND4

GND5 GND6

4.7uC327

L310DNI

56pC306

22p

C396

9.1nL305

27nL312

22p

C398

VLOGICBS2BS1TX_EN

RX12

RX12X

RX34

RX34X

GSM_OUT

DCS_PCS_OUT

TX_RAMP

.

.

.

.

.

.

TP2TP�



4. TROUBLE SHOOTING

CHECKING FLOW

4. TROUBLE SHOOTING

Check TP2& TP3

Mobile SW & FEM is OK.

Yes

TP5 signal same as TP1? Replace SW301

No

Yes

Replace PMB8810 (U101)TP2(High Band), TP3(Low Band) Signal is OK ?

No

Yes

Check PMB8810Control Signal is (VLogic,TX EN, BS1, BS2)OK ?

No

Yes

Yes

Check TP4 of U301 ?

TP1 Signal is OK? Replace FEM (U301)No

EGSM Tx


4. TROUBLE SHOOTING

4.4 Power On Trouble

4. TROUBLE SHOOTING

Figure 4.1

TEST POINT

VMMC

VCORE

VDDMS VDDXO

VDDTDC

VRTCVPMUVAUX

VUSB VDDRF2



4. TROUBLE SHOOTING

4. TROUBLE SHOOTING

Figure 4.2 power block of LG-C300

CIRCUIT

Figure 4.2 Power block of LG-C300

C1012.2u

1V8_VDD

1V8_VDD

VUSB

1V8_VDD

VBAT

75FB101

R1030

VCORE

1V8_VDD

VDDMS

1V8_VDD

VUSB

VDDTRX

1V8_VDD

1V8_VDD

VDDTDC

C1060.1u

1V8_VDD

1V8_VDD

VDDRF2 VDDTDC

VMMC

470R106

VCORE

Q101

1

23

VMMC

1V8_VDDVRF1

C1110.1u

VAUX

VAUX

0.1uC113

1uC114

VRF1VDDMS

100K

R107

3.3u

101L

VBAT

VDDXO

C1152.2u470n

C117

VBAT_RF2

470nC118

1V8_VDD VPMU

4.7nC119

VBAT

47nC120

C121470n

47nC122

VPMUVBAT

VBAT VDDRF2

0.1uC124

L4A14

K1A15

P2

N1R15

M2T15

N3M11

M1M10

L1N11

K2R11

K3T11

N12

6K

5T

6R

7M

4T

6M

6L

01

L

51

C

51F

01H

31

G

9M

7L

21F

8P

21E

41

G

61

R

21A

21B

11

E

31

H

21G

31A

01J

31

F

41

F

51

P

41P

8G

8K

9J

9H

8F

9T

01P

5R

7K

9G

8N

61P

41

L

7R

7T

6T

7P

1D

S_D

DV

BF_1D

S

1D

S_S

SV

WS_ 1

DS

SM

SS

V

PST

AB

V

UM

P _TA

BV

1OI

DD

V

2OI

DD

V

UB

E_D

DV

UM

PV

UM

P_S

SV

1E

RO

C_S

SV

2E

RO

C_S

SV

3E

RO

C _S

SV

ER

OC

V

ER

OC

DD

V

PC8

V1D

DV

RSL

SS

V

XRT

SS

V

XR

SS

V

18V1

DD

V

PM

AR

V

GID_

SS

V

SM

DD

V

OX

DD

V

CDT

DD

V

DM

MD

DV

GE

ND

DV

TA

BV

OC

DS

SV

XU

AV

OX

SS

V

CM

MV

BS

UV

2 FR

DD

V

1FR

V

OL_S

SV

FR

SS

V

CTR

V

NE

SN

ES

PE

SN

ES

GH

CD

DV

SC

BS

C

GH

CV

TN

HS

V

M0

M1 A_D0

M2 A_D1

VDD_FMR A_D2

FMRIN A_D3

FMRINX A_D4

CP1 A_D5

CP2 A_D6

A_D7

TX1 A_D8

FE2 A_D9

VBAT

C1251u

C1280.1u

VDDXO

C1290.1u

220nC130

VBAT_RF2 VRTC

R1093.9K

220nC131

5.6KR110

18pC132

C107

22u

C147

5p

C133 DNIR111

0

4.7n

C123

211R

0

IND

531C

C134 10u

BS2

FM_ANT

LCD_IDBAT_TEMP

GSM_OUT

TX_RAMP

LDO_OUT

AD09AD08AD07AD06AD05AD04AD03AD02AD01AD00

ABB

(10V)

PIN_H10Seperate and shield

Speaker Supply

(10V)

VDD_IO2

VBATSP

(1%)

PMU PADSRF SUPPLY DOMAIN

VDD1V8CP

VDD_IO1

PIN_H13PIN_B14

RF SUPPLIES (DIRTY GND)

PMU SUPPLIES

PIN K8PIN M9PIN L7PIN P8

RF SUPPLIES (CLEAN GND)

(10V)

VBAT_PMU

PIN P14PIN P16

PIN P10

PIN R5PIN G9

PIN_B12PIN_E11PIN_G14PIN_G13

ABB SUPPLIES

DBB SUPPLIES

PIN K7

PIN N8

VDD_EBU

RF


4. TROUBLE SHOOTING

4. TROUBLE SHOOTING

CHECKING FLOW

START

Check Battery Voltage> 3.35V

Push power-on keyAnd check the level change

into high of POWERKEY

Check the voltage ofThe LDO outputs at U102

Is the phone power on?

The phone willProperly operating.

Charge or Change Battery

Check the contact of power keyOr dome-switch

Replace U101

VCORE=1.2V, VPMU=1.2V. VRTC=2.3V, VUSB=3.1VVAUX=2.85V,VMMC=2.85V, VDD_RF2=2.5V, VDDMS=1.3V, VDDXO=1.3V, VDDTDC=1.3V

Does it work properly?

Replace the main board

YES

YES

YES

YES

NO

NO

NO

NO

NO

Replace U101 and Re-download software



4. TROUBLE SHOOTING

4.5 Charging Trouble

TEST POINT

CIRCUIT

Figure 4.5

4. TROUBLE SHOOTING

CN201

U203

C223

TP1

0.1uC257

1V8_VDD

C2211u

0.1u

C222

VBUS_USB

1u

C223

RT9524EUSY0410801

U203

65

74

83

92

101

11PGND

VIN BATT

ISET PGB

GND1 CHGSB

LDO GND2

IEOC EN_SET

VBAT

100KR217

820

R233

3.9K

R234

CHG_EN

LDO_OUT_EOC

(25V)(10V)

CHARGING IC

TP1


4. TROUBLE SHOOTING

CHECKING FLOW

4. TROUBLE SHOOTING

START

Is I/O Connector(CN201)well-soldered ?

Check the voltage atPin 1 U203 = 5.1V ?

(C223)

YES

YES

Battery is charged?

YES

Charging isproperly operating

NO

NO

NO

Resolder the CN201(Pin 1 : VBUS_USB)

The TA is out of orderChange the TA

Replace the main board

Battery is charged?

NO

Change the battery

Charging isproperly operating

YES



4. TROUBLE SHOOTING

4. TROUBLE SHOOTING

4.6 Vibrator Trouble

TEST POINT

Figure 4.6

Vibrator PAD

Rear Cover

C254_TP1

L209_TP2


4. TROUBLE SHOOTING

4. TROUBLE SHOOTING

CIRCUIT

MainIC

(U101)

TP1

TP2

9R

5A

5B

8C

8B

8A

8D

4B

31L

51L

61L

4A

8R

8T

01F

9E

9C

9B

9D

01E

01D

3NI _

PK

4NI _

PK

5N I_

PK

0TU

O_P

K

1TU

O_P

K

2 TU

O_P

K

3TU

O_P

K

5TU

O_P

K

B IV

B IV_

SS

V

0 TU

OKL

C

K23 F

K 23C

SO

N_TE

SE

R

N I2 T

0KL

C_1S 2I

XR_1

S 2I

XT _1S2I

0A

W _1S2 I

LC

S _C2 I

AD

S _C2 I

FFO

NO

K23K L

C

TNI _

BB

D_TB

TNI _

C IU

M

XR_

MC

PX T_

MC

P

NE_

ANL_

MF

TC

ETE

D_K

OO

H

TE

D _D

SU

TNI _

YE

K

S TC _T

B

STR_T

B

P_BI

V

PWRON

TE

SE

RN

TNI_I

PS

AD

S_Y

EK

LC

S_Y

EK

5 TNI

E

6 TNI

E

VDDP_DIG1

0TNI

E

4TNI

E

1TN I

E

1TNI

E

0TNI

E

L208 0.1uH

0.1uH

L209

VB201

2

1

33p

C253

1uFC254

VIB_P

SJMY0007110VIB_N

VIB_P

MOTOR

Main IC (U101)

TP1

TP2



4. TROUBLE SHOOTING

4. TROUBLE SHOOTING

CHECKING FLOW

SETTING : Enter the engineering mode, and set vibrator on at vibration of BB test menu

START

YES

NO

Replace vibrator

YES

VibratorWorking well !

Check the contact pinof vibrator ?

Clean the Pad.

YES

Replace the U102 NOIs the voltage at

Pin (+) high?

YES

Replace the U102 NOIs the voltage at

Vibrator PAD(+) high?


4. TROUBLE SHOOTING

4.7 LCD Trouble

TEST POINT

Figure 4.7

CN403

FL403

FL404

FL405

C415_TP2

R417_TP1

U402



4. TROUBLE SHOOTING

4. TROUBLE SHOOTING

CIRCUIT

Test point

TP2

TP1

VBAT

444R

smho

K001

1uFC425

1V8_VDD

C426

2.2u

C42727pF

100ohms

R445

VA415

FL403

01

5

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

1G

2G

VMMC

C4281uF

TP402

TP403

TP404TP405

VA416

100ohms

R446

CN403

27

26

25

24

23

22

21

20

19

18

17

16

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

0.001uFC429

FL404

01

5

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

1G

2G

C4300.001uF

FL405

01

5

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

1G

2G

LCD_RSNLCD_MAIN_CS



LCD_VSYNC

NLCD_WR

_LCD_RESET

LCD_ID


MAKER ID : LOW

LCD CONNECTOR

1u

C401

1u

C402

R427

100K0.1u

C418

2.2u

C419

1u

C433C420

1u

1V8_HPVDD

2.2u

C421 C422

2.2u

VBAT

324C u1

424C u1

U402

24

23

22

21

20

19

18

8

7

6

5

9

4

10

3

11

2

12

1

31 41 51 61 7 1L

CS

AD

S

NE

MW

P

FC

DN

GP

LDO1

N2C

LDO2

N1C

LDO3

P1C

LDO4

P2C

AGND

VIN

LDOIN

LED6

LED5

LED4

LED3

LED2

LED1

VOUT

1V8_VDD

K0 1

344R

CAM_A_2V8

CAM_D_1V5

CAM_IO_1V8

I2C_SCLI2C_SDA

LCD_BL_CTRL


TP�

TP�


4. TROUBLE SHOOTING

4. TROUBLE SHOOTING

Waveform

Graph 4.7.1. LCD Backlight Control Signal Waveform

Graph 4.7.2. LCD Data Waveform

LCD_BL_CTRL

LCD_RS

LCD_CS

LCD_WR



4. TROUBLE SHOOTING

4. TROUBLE SHOOTING

CHECKING FLOW

START

Is the connection ofCN403 with LCD connector ok ?

YES

NOReassemble LCD connector

NO

Check the Voltage Level of C422 is about Battery voltage ?(LCD_BL_CTRL signal

is high Level)

NO

YES

YES

Check the Waveform ofEMI filter ?

Resoldering or Replace U402

NO

Resoldering EMI filter.(FL403,FL404,FL405)

Does LCD workproperly ?

Replace LCD module

LCD working well !

YES


4. TROUBLE SHOOTING

4. TROUBLE SHOOTING

4.8 Camera Trouble

TEST POINT

Figure 4.8

CN402

C420

U402

C401 C402

TP1

TP2TP3TP4



4. TROUBLE SHOOTING

CIRCUIT

TP1

TP2

TP3TP4

5pF

FL401

0 15

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

1G

2G

GND

2.2KR407

2.2KR408

C403DNI

C404DNI

CAM_IO_1V8 CAM_D_1V5CAM_A_2V8100KR409

1V8_VDD

0.1uC405

R410 22

R411 51

C4060.1u

C4070.1u

C40856p56p

C40956p

C410

15pC411

15pC412

CN40261413171612518

7594103112121182419232022

52627282920313231

DN

GP

2D

NG

P3

DN

GP

4D

NG

P5

DN

GP

6D

NG

P7

DN

GP

8D

NG

P

D0 PCLKD1 VSYNCD2 HSYNCD3 STANDBYD4 SCKD5 SDAD6 RESETBD7 MCLK

1D

NG

D2

DN

GD

3D

NG

D1

DN

GA

2D

NG

AD

DV

DO I

DD

VD

DV

A

5pFFL402

015

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

1G

2G

CAM_DATA0CAM_DATA1CAM_DATA2CAM_DATA3


CAM_HSYNC

CAM_PCLK

CAM_RESET

CAM_VSYNC

CAM_MCLK

I2C_SCLI2C_SDA

CAM_STANDBY

CAMERA INTERFACE

1u

C401

1u

C402

R427

100K0.1u

C418

2.2u

C419

1u

C433C420

1u

1V8_HPVDD

2.2u

C421 C422

2.2u

VBAT

324C u1

424C u1

U402

24

23

22

21

20

19

18

8

7

6

5

9

4

10

3

11

2

12

1

31 41 51 61 7 1L

CS

AD

S

NE

MW

P

FC

DN

GP

LDO1

N2C

LDO2

N1C

LDO3

P1C

LDO4

P2C

AGND

VIN

LDOIN

LED6

LED5

LED4

LED3

LED2

LED1

VOUT

1V8_VDD

K0 1

344R

CAM_A_2V8

CAM_D_1V5

CAM_IO_1V8

I2C_SCLI2C_SDA

LCD_BL_CTRL


TP1TP2

TP�TP4


4. TROUBLE SHOOTING

4. TROUBLE SHOOTING

Waveform

Graph 4.8.1. I2C Data Waveform

Graph 4.8.3.CAM_VSYNC vs.CAM_HSYNC Waveform

Graph 4.8.2. MCLK Waveform

Graph 4.8.4.CAM_HSYNC vs.CAM_PCLK Waveform

I2C_DATA

CAM_RESET

CAM_MCLK

CAM_MCLK

26MHz

CAM_VSYNC

CAM_HSYNC 26MHz

CAM_HSYNC

CAM_PCLK



4. TROUBLE SHOOTING

CHECKING FLOW

4. TROUBLE SHOOTING

Is the connection ofCN402 with Camera ok ?

Check the each voltage Level of

C402( 2.8V), C420( 1.8V) is right ?(SWIF signal is high Level)

Does Camera workproperly ?

Check the Waveform of I2C_CLK, I2C_DATA,

CAM_MCLK(26MHz) ?

Check the Waveform ofData pins on CN402?

START

Camera working well !

NO Reassemble camera connectorwith camera.

NO

YES

YES

Resoldering or Replace U402

NO Replace U101 or Change the board

YES

YES

YES

NO Replace U101 or Change the board

NO Replace Camera Module.


4. TROUBLE SHOOTING

4.9 Speaker Trouble

2. TROUBLE SHOOTING

TEST POINT

CIRCUIT

Figure 4.11.1

U202

C210_TP2 C209_TP1

L211_TP4

L210_TP3

C255

C256

TP1TP2

TP3

TP4

R263

DNI

0.1uC203

WM9093ECS-RU202

EUSY0403901

3B

A4

C3

C2

2B

D1

D3

4D

C1

A1D2

1B

D5

A2

A5

A3B5

4B

C5

4C

DN

G

OUT+

DD

VP

H

CPVDDCPVSS

CN

HPL

OUT-

SAI

B

IN2- HPR

IN1+

DD

VS

IN3-

IN2+

AD

S

IN1-

IN3+

CP

LC

S

10uC202

C2040.1u

C2052.2u

C206

2.2u

1uC256

C209

47p

C210

47p

C211

0.1u

C212

0.1u

C213 2.2u

C214 2.2uR20120 20

R208

C218 2.2u

0

R212

1V8_VDD

VBAT

1uC255

1800R238

DNI

FB207

1V8_HPVDD

R250

DNI

I2C_SCL

I2C_SDA

EAR_SPK_NEAR_SPK_P

HP_LOUTHP_ROUT

EAR_GND

EAR_GND

EAR_GND

SPK_NSPK_P

AUDIO AMP SUB SYSTEM & SIGNAL DISTRIBUTOR

TP2

C201100pF

SUSY0024805

CN202

2

1L210

0

C21647pF

C21747pF

VA201 VA202

L211

0

SPK_N

SPK_P

SPK

TP�

TP1

TP4



4. TROUBLE SHOOTING

CHECKING FLOW

2. TROUBLE SHOOTING

START < Cal l >

Check the state of contact of speaker

Speaker Working well!!

Check the Audio signalC255, C256

No

Yes

Change the U101

Replace/Change speakerNo

Check the Audio signalC210,C209

No Replace/Change the U202

Yes

Yes

START< Mp3>

Check the state of contact of speaker

Speaker Working well!!

Check the Audio signalC255,C256

Yes

Check the Audio signalL210. L211

Yes

Yes

No

No

No


4. TROUBLE SHOOTING

4.10 Earphone Trouble

2. TROUBLE SHOOTING

TEST POINT

Figure 4.11.1

CIRCUIT

U202

C210

FB206_TP4

FB205_TP3

C209

C255_TP1

C256_TP2

TP3

TP4TP1TP2

4.10 Earphone Trouble

2. TROUBLE SHOOTING

TEST POINT

Figure 4.11.1

CIRCUIT

U202

C210

FB206_TP4

FB205_TP3

C209

C255_TP1

C256_TP2

TP3

TP4TP1TP2

R263

DNI

0.1uC203

WM9093ECS-RU202

EUSY0403901

3B

A4

C3

C2

2B

D1

D3

4D

C1

A1D2

1B

D5

A2

A5

A3B5

4B

C5

4C

DN

G

OUT+

DD

VP

H

CPVDDCPVSS

CN

HPL

OUT-

SAI

B

IN2- HPR

IN1+

DD

VS

IN3-

IN2+

AD

S

IN1-

IN3+

CP

LC

S

10uC202

C2040.1u

C2052.2u

C206

2.2u

1uC256

C209

47p

C210

47p

C211

0.1u

C212

0.1u

C213 2.2u

C214 2.2uR20120 20

R208

C218 2.2u

0

R212

1V8_VDD

VBAT

1uC255

1800R238

DNI

FB207

1V8_HPVDD

R250

DNI

I2C_SCL

I2C_SDA

EAR_SPK_NEAR_SPK_P

HP_LOUTHP_ROUT

EAR_GND

EAR_GND

EAR_GND

SPK_NSPK_P

AUDIO AMP SUB SYSTEM & SIGNAL DISTRIBUTOR

762R

0

IN

D

8 62R

C244 47p

0

252R

VAUX

R265

DNI

R264

DNI

270pF

C240

IN

D

522R

0081

402BF

24 2C

F p4 2

L2020.1uH

FB205

1800

VA205

L203

0.1uH1V8_VDD

VA211

VA206

0.1uH

L204

DNI

R239

1800

FB206

270pFC252

VA209

L207

0.1uH

VA210

DNI

R230

R266

DNI

C262DNI

C261

DNI

R251

0

J201

2

3

4

5

6

1 M5

M4

M3

M4F

M1

M6

Q201

S

G

D

062R

01

1V8_VDD

R262

1M

R261

100K

008 1

802BF

FM_ANT

HP_LOUT

HP_ROUT

JACK_DETECT

EAR_GND

EAR_GND

TP2

TP1

TP4

TP�



4. TROUBLE SHOOTING

CHECKING FLOW

2. TROUBLE SHOOTING

START

YES

Earphone will work properly

Can you hear Your voice fromthe earphone?

Set the audio part of the test Equipment

to echo mode

Change the earphone

and try again

NOCan you hearthe sound fromthe earphone?

Set the audio part of the test equipment to PRBS

or Continuous wave mode

YES

YES

Resolder J201 NO

YES

Can you hearthe sound fromthe earphone?

NO

Change the earphone

and try again

NOCan you hear

Your voice fromthe earphone?

NO

Resolder FB205,FB206

C210,C209 (Call, MP3)

Resolder C255,C256

or Change theU202 & U101

Check the Display on ear-jack

detect icon


4. TROUBLE SHOOTING

4.11 Receiver Trouble

4. TROUBLE SHOOTING

TEST POINT

CIRCUIT

Figure 4.11Receiver

padC142_TP1 C143_TP2

C246_TP4C245_TP3

TP3

TP4

TP1

TP2

1nC102

C105220n

47pC108

47pC109C110

47pC11247p

VMIC

T1

A1

T16

A16

T10

P11

R10

P13

P12

T13

R13

T12

R12

N15

N16

T14

R14

M16

M15

K15

T2

P9

J6

R3

M3

K4

N4

T3

J3A_D21

A_D22

A_D23

A_D24

CS0_N

CS1_N

ADV_N

WAIT_N

ANAMON

BFCLK0

FSYS_EN

EPN

EPP

HSL

HSR

LSN

LSP

MICN1

MICP1

MICN2

MICP2

VMIC

VUMIC

ACD

AGND

VREF

NC1

NC2

NC3

NC4

1nC127

C136DNI 47p

C142C14347pDNI

C144VHSMIC

RCV_N

MIC_N

HS_MIC_NMIC_P

HS_MIC_P

AD22AD21

MEM_CLK

NWAITNADVNRAM_CSNROM_CS

EAR_SPK_NEAR_SPK_P

RCV_P

FSYS_EN

AD23

AD24

PLACE THESE CAPS NEAR BB IC

VDDP_DIG1

TP1SURY0013401

CN204

2

10.1uHL205

L206 0.1uH

VA207

ICVL0518100Y500FR

C24547pF

VA208

ICVL0518100Y500FR

47pFC246

RCV_N

RCV_P

MAIN RECEIVER

TP2

TP�TP4



4. TROUBLE SHOOTING

CHECKING FLOW

4. TROUBLE SHOOTING

START

Does waveform atC142 and C143

Fluctuate?

NOChange the U101

YES

Receiver will work properly.

Is receiver connectedProperly?

YES

NOResolder/Change the receiver

Does waveform atC245 and C246

Fluctuate?

No Replace/Change the receiver

Yes

SETTING : After initialize Agilent 8960, Test EGSM900, DCS mode ( or GSM850, PCS mode )

Set the property of audio as PRBS or continuous wave. Set the receiving volume of mobile as Max.


4. TROUBLE SHOOTING

4.12 Microphone Trouble

TEST POINT

CIRCUIT

Figure 4.12

2. TROUBLE SHOOTING

C233_TP2C231_TP1 MIC201C236_TP3

TP3

TP1

TP2

VMIC

100n

L201

39p

C230 C231

10u

C232

39p

332C

u1.0

632C

u1.0

C237

39p

C238

39p0

R235D201

SUMY0010609

MIC201

4

3

2

1P

G1

G2

O

VA204VA203

MIC_N

MIC_P

MICROPHONE

TP1

TP2

TP�



4. TROUBLE SHOOTING

SETTING : After initialize Agilent 8960, Test EGSM900, DCS mode ( or GSM850, PCS mode )

CHECKING FLOW

START

NO

YES

Microphone will workproperly.

YES

Check the signalLevel at each side of MIC201.

Is it a few tensmV AC?

Check the soldering ofC233, C236

Make a phone call, then check C231 mic bias signal

comes from U101?

NO

Change the microphone

YES

NOResolder component

1. Check mic Bias signal line2. Change the U101

Check microphone sound hole

2. TROUBLE SHOOTING


4. TROUBLE SHOOTING

4.13 SIM Card Interface Trouble

TEST POINT

CIRCUIT

Figure 4.13

4. TROUBLE SHOOTING

PIN 6

PIN 4

PIN 1

PIN 3

J401

Pin1Pin3 Pin4Pin6

J401

8 7

6 3

5 2

4 1VCCGND

RSTVPP

CLKI_O

GND1GND2

ZD403 ZD401

R4174.7K

2V85_VSIM

2V85_VSIM

0.1uC413

DNIC414

22pC415

ZD40222pC416

DNIR418

SIM_CLKSIM_RST

SIM_DATA




PIN6

PIN1PIN�

PIN4



4. TROUBLE SHOOTING

CHECKING FLOW

4. TROUBLE SHOOTING

START

Does the SIM cardsupport 3V or 1.8V ?

NO Change the SIM Card. This phone supports 3V or 1.8V SIM card.

YES

Is Voltage at the pin1 of J201

2.85V or 1.8V?

NOChange the U101

NO

YES

Resolder J401YES

Voltage output of VSIM LDO

Is 2.85V?

Change the SIM Card and try again.

Does it workProperly?

YES

SIM card is properly working

redownload SW.Does it work

Properly?

NOChange the main board

NO

YES

SIM card is properly working.


4. TROUBLE SHOOTING

4. TROUBLE SHOOTING

4.14 KEY backlight Trouble

TEST POINT

Q201

LD401 ~ LD414

Figure 4.14



4. TROUBLE SHOOTING

4. TROUBLE SHOOTING

CHECKING FLOW

START

Is Pin3 of Q401 low at KEY_BL_EN

= high ?

NO Check Q401

Are all LEDsWorking?

NO

YES

Check the solderingeach R and LED

Backlight will work properly.

NO

Replace or resoldercomponent

YES

CIRCUIT

TP1LD408 LD406 LD403 LD407 LD404 LD405 LD409 LD410 LD411 LD414 LD413 LD412

D401

051

104R

LD401

Q401

1

23

K001

844R

LD402

VBAT

smho051

034R

smh o051

134R

234R

sm ho05 1

334R

smh o051

smh o051

434R

smho051

534R

smho051

634R

smho051

734R

smho051

834R

smho051

934R

smho051

044R

144R

smho051

244R

smho051

1.2K

R447

0.1u

C431

KEY_BL_EN

TP1


4. TROUBLE SHOOTING

4. TROUBLE SHOOTING

4.15 Micro SD (uSD) Trouble

TEST POINT

CIRCUIT

R211_TP1

Figure 4.15

TP1

3 02D

43

52

61

ENSY0020901S201

1

2

3

4

5

6

7

8

SWA SWB

GND

FB202

202R

smho

K7 4

smh o

K 74

30 2R

47ohms

R204

R205

100Kohms

0.001uFC215

1V8_VDD

VA212

DNI

90 2R

smho

K74

VA213

DNI

smho

K74

0 12R

1 12R

smh o

K74

2.2uF

C220

VMMC

20 2D

43

52

61

USD_DET

USD_CLK

USD_CMD

USD_D1

USD_D2

USD_D3

USD_D0

MICRO SD Connector

TP1



4. TROUBLE SHOOTING

4. TROUBLE SHOOTING

CHECKING FLOW

Micro SD Card willwork properly

Micro SD DetectOK?

START

NO

YES

Check out MC_CLK & Data

Timing OK?Re-download SWNO

YES

YES

Replace Micro SD Card

Check theR250=2.8V?

YES

NO

Change U101


4. TROUBLE SHOOTING

4. TROUBLE SHOOTING

4.16 Bluetooth Trouble

TEST POINT

CIRCUIT

Figure 4.16.1

C374_TP4 BT_CLK

ANT

U302

C389_TP1

C385_TP2

C386_TP3

Test pointTest point

TP1

TP2TP3

TP4C389 100p

2450MHz

FL303

4231

IN OUTGND1 GND2

TP319

TP321

DNIC393

C371 10p

L3071.2n

613R

0

TP325TP324

TP327TP326

TP322

DNIC391

L318 2.2n

ANT304SNMF0059501

23

1FEED

GND2 GND1

C384 2.2u

673C

IN

D

IN

D573

C

BCM2070CB0KUFBXGU302

2C

2D

2F3D

6C

7A

7G

5E

4E

6B

B7

E3

E6

B3

E8B5

D7

D8G3

C8G2

F5A4

F4

G6C7

F6A8

F3E7

C4F7

B2

B4D1

G4

2A

1C

1B

1E1F

1G

1A

5A

8B8F

5G

6A

8G

3A

TA

BV

3O

DD

V

2O

DD

V

1O

DD

V

3C

DD

V

2C

DD

V

1C

DD

V

GE

RV

XP

DD

V

FR

DD

V

ANL

DD

V

FID

DV

FTD

DV

VH

GE

RV

RES

RFP RST_N

REG_EN

SCL TM0

SDA TM2

SPIM_CLK PCM_IN

SPIM_CS_N PCM_OUT

PCM_CLK

LPO_IN PCM_SYNC

XIN UART_TXD

XOUT UART_RXD

UART_RTS_N

GPIO_0 UART_CTS_N

GPIO_1

TCXO_OR_OUT_GPIO_5

TCXO_OR_IN_GPIO_6

GPIO_7

NI_X

EO

C

0TU

O_X

EO

C

1TU

O_X

EO

C

7S

SV

6S

SV

5S

SV

4S

SV

3S

SV

2S

SV

1S

SV

TP320

TP323

1V8_VDD1nC377

2.2uC386

1V8_VDDVAUX

C3852.2u

0R326

10pC382

10nC381

10nC380

10nC383

10pC378 C379

1u

600

TJ106-5001M1-

BH

FB304

C374 1n

C373 1n

15KR308

DNIC370 C372

DNI

R330

DNI

R329

0

CLK32K

DBB_BT_INT

BT_DBB_INT

BT_CLK

PCM_CLKPCM_RXPCM_TX

PCM_SYNC

BT_CTSBT_RTS

BT_RXDBT_TXD

FSYS_EN

BT_RESET

Bluetooth

TP�TP2

TP1

TP2



4. TROUBLE SHOOTING

4. TROUBLE SHOOTING

CHECKING FLOW

YES

BT willwork properly

Check condition of matching components

(C389)

A condition is good?NO

YES

Give the additory solder inC389

Check Bias VoltageVAUX at C386

1V8_VDD at C385

YES

NO ReplaceU101

Check the C374 BT_CLK

YES

NO ReplaceU101

Check BT Test point pinNO Replace

U302


4. TROUBLE SHOOTING

4. TROUBLE SHOOTING

4.17 FM Radio Trouble

TEST POINT

CIRCUIT

Figure 4.17

Q301

ANT301L304_TP1

TP1

4.7nC119

B13

C14

E16

F16

C16

D16

A14

A15

R15

T15

M11

M10

N11

R11

T11

N12

41L

7R

7T

6T

7P

1D

S_D

DV

BF_1D

S

1D

S_S

SV

WS_ 1

DS

M0

M1

M2

VDD_FMR

FMRIN

FMRINX

CP1

CP2

TX1

FE2

RX12

RX12X

RX34

RX34X

VDET

C133 DNIR111

0

BS2

FM_ANT

LCD_IDBAT_TEMP

RX12RX12X

RX34RX34X

GSM_OUT Q301

2

13

C3101u

24KR303

22n

L304

R304270ohms

4.7KR305

470n

C312

470n

C313

5.1ohmsR306

27p

C341

270n

L313

C394

27p

ANT301

2

1L314

56n

FM_ANT

FM_LNA_EN

FM_ANT_1

FM_ANT_1

.

C244 47p

0

252R

24 2C

F p4 2

L2020.1uH

L203

0.1uH

VA211

R251

0

J201

2

3

4

5

6

1 M5

M4

M3

M4F

M1

M6

FM_ANT

EAR_GND

TP1



4. TROUBLE SHOOTING

4. TROUBLE SHOOTING

CHECKING FLOW

A condition is good?

STARTCheck of ear_jack

condition

NO

YES

FM_radio willwork properly

Check condition of matching components

(C389, C371, L318)

A condition is good?NO

YES

Give the additory solder in

C389, C371, L318

Replace J201

Check FM LNA EN(L304)

YES

NO ReplaceU101


5. DOWNLOAD

5. DOWNLOAD

LG-C�00

LG-C�00



5. DOWNLOAD

LG-C�00

LG-C�00

LG-C�00



5. DOWNLOAD

LG-C�00


5. DOWNLOAD


5. DOWNLOAD

‘LG-C�00’



5. DOWNLOAD



5. DOWNLOAD

LG-C�00

LG-C�00

LG-C�00 ‘LG-C�00’

LG-C�00 LG-C�00

LG-C�00 ‘LG-C�00’

LG-C�00


5. DOWNLOAD

LG-C�00 LG-C�00

LG-C�00 LG-C�00

LG-C�00 LG-C�00



5. DOWNLOAD

LG-C�00 LG-C�00



6. BLOCK DIAGRAM

6. BLOCK DIAGRAMLG

E In

tern

al U

se O

nly

LG-A

133

Blo

ck D

iagr

am

Rec

eive

r/ S

peak

erB

luet

ooth

Mod

leB

TA

NT

Aud

ioA

MP

5 pi

nµ-

USB

.TA

Mem

ory

( 512

M N

OR

+

128M

pSR

AM

)

Vibr

ator

Mod

ule

BT

AN

T

UAR

T/ P

CM

/ Con

trol

Sil

MU

IC

AM

P

Cal

l/ H

eads

et

/ MP3

/FM

Rad

io

5p H

eads

et

LCD

FPC

B

Hea

dset

Mai

n LC

D2.

0” T

FT L

CD

(QC

IF, 1

76x2

20)

Sub

LCD

BA

TLi

-Ion

Cha

rger

IC

Sign

als

VCH

G /

VBU

SI2

C

/FM

Rad

io

I2C

54pi

n

Con

n.

0.98

” ST

N L

CD

(MO

NO

, 96x

64)

900m

Ah

Bas

eBan

d

(PM

B88

10_A

-Gol

dRad

io+)

LCD

Inte

rfac

e

SAW

Filte

rTX

MO

DU

LE

IC

LCD

Bac

klig

htC

harg

e Pu

mp

&LD

O (1

.8V/

2.8V

)

LCD

Bac

klig

ht

Cam

era

(VG

A, F

F)I2

C /

Cam

era

Inte

rfac

e

Num

/ N

avi

VBAT

/ I2

C

MIC

SIM

Car

d

Mai

n A

NT

(850

/900

/180

0/19

00)

µSD

Car

d

/ Sid

e K

ey

Bac

kup

Cha

lleng

e10

10Th

e Pe

ople

Com

pany

Bat

tery

Fold

er P

art

- 121 -

7. CIRCUIT DIAGRAM

LGE Internal Use OnlyCopyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes

R10210K

16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

L

K

J

I

H

G

F

E

D

C

B

A

L

K

J

I

H

G

F

E

D

C

B

A

16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

C1012.2u

1V8_VDD

1V8_VDD

VUSB

1nC102

1V8_VDD

1V8_VDD

VBAT

75FB101

R1030

VCORE

R104DNI

1V8_VDD

VDDMS

1V8_VDD

VUSB

VDDTRX

1V8_VDD

101TAB

1V8_VDD

1uC104

VDDTDC

C105220n

C1060.1u

1V8_VDD

ON_SW

1V8_VDD

VDDRF2

100KR105

VBUS_USB

47pC108

VDDTDC

VMMC

470R106

47pC109C110

47p

VCORE

841R

K001

Q101

1

23

VRTC

VMMC

1V8_VDDVRF1

C1110.1u

VAUX

VAUX

C11247p

0.1uC113

1uC114

VRF1VDDMS

OJ101

VMIC

100K

R107

VBAT

3.3u

101L

VBAT

VDDXO

C1152.2u

TP101

VDDTRX

100KR108

470nC117

UA101

12

11

10

9

8

7

6

5

4

3

2

1GND

RX

TX

NC1

ON_SW

VBAT

NC2

NC3

NC4

DSR

RTS

CTS

GND

RX

TX

VCHAR

ON_SW

VBAT

PWR

URXD

UTXD

3G 2.5G

2V85_VSIM

VBAT_RF2

470nC118

1V8_VDD VPMU

4.7nC119

VBAT

47nC120

C121470n

47nC122

R137

1K

VPMUVBAT

VBAT VDDRF2

0.1uC124

U101

9R

5A

5B

8C

8B

8A

8D

4B

31

L

51

L

61

L

4A

8R

8T

01

F

9E

9C

9B

9D

01

E

01

D

01

C

01

B

01

A

9A

6E

7G

6F

7E

7F

6G

8E

7C

6C

7B

7A

5C

6B

6A

2D

1G

1F

4D

3C

3E

4F

2E

3F

1B

1C

2C

3D

2F

1D

1E

9L

01

K

8L

F9G10

H11

T1J11

A1F11

T16G11

A16C4

J12

T10J13

P11K16

R10H15

H16

P13G16

P12J16

T13J15

R13H12

T12

R12K5

G5

N15H6

N16H2

T14H3

R14H1

M16

M15G4

G2

K15G3

M8

T2

P9A11

J6B11

R3K12

M3K11

K4B2

N4A3

T3B3

J3A2

R2J8

P4H7

H4J7

J2H8

J4

R1B14

C12

J1B15

R4B16

C13

P3B13

P1C14

P5E16

N2F16

L3C16

L2D16

L4A14

K1A15

P2

N1R15

M2T15

N3M11

M1M10

L1N11

K2R11

K3T11

N12

6K

5T

6R

7M

4T

6M

6L

01L

51C

51F

01H

31G

9M

7L

21F

8P

21E

41G

61R

21A

21B

11E

31H

21G

31A

01J

31F

41F

51P

41P

8G

8K

9J

9H

8F

9T

01P

5R

7K

9G

8N

61P

41L

7R

7T

6T

7P

1D

S_D

DV

BF_1D

S

1D

S_S

SV

WS_ 1

DS

SM

SS

V

PST

AB

V

UM

P _TA

BV

1OI

DD

V

2OI

DD

V

UB

E_D

DV

UM

PV

UM

P_S

SV

1E

RO

C_S

SV

2E

RO

C_S

SV

3E

RO

C _S

SV

ER

OC

V

ER

OC

DD

V

PC8

V1D

DV

RSL

SS

V

XRT

SS

V

XR

SS

V

18V1

DD

V

PM

AR

V

GID_

SS

V

SM

DD

V

OX

DD

V

CDT

DD

V

DM

MD

DV

GE

ND

DV

TA

BV

OC

DS

SV

XU

AV

OX

SS

V

CM

MV

BS

UV

2FR

DD

V

1FR

V

OL_S

SV

FR

SS

V

CTR

V

NE

SN

ES

PE

SN

ES

GH

CD

DV

SC

BS

C

GH

CV

TN

HS

V

M0

M1 A_D0

M2 A_D1

VDD_FMR A_D2

FMRIN A_D3

FMRINX A_D4

CP1 A_D5

CP2 A_D6

A_D7

TX1 A_D8

FE2 A_D9

RX12 A_D10

RX12X A_D11

RX34 A_D12

RX34X A_D13

VDET A_D14

PABS A_D15

PABIAS

FE1 WR_N

TX2 RD_N

PAEN

VDDTRX A_D16

A_D17

USIF2_TXD_MTSR A_D18

USIF2_RXD_MRST A_D19

USIF2_RTS_N A_D20

USIF2_CTS_N A_D21

USIF1_TXD_MTSR A_D22

USIF1_RXD_MRST A_D23

USIF1_RTS_N A_D24

USIF1_CTS_N CS0_N

DPLUS CS1_N

DMINUS ADV_N

XOX WAIT_N

XO ANAMON

BFCLK0

VSIM

SIM_IO FSYS_EN

SIM_CLK

SIM_RST EPN

EPP

MMCI_CMD HSL

MMCI_DAT_0 HSR

MMCI_CLK LSN

MMCI_DAT_1 LSP

MMCI_DAT_2

MMCI_DAT_3 MICN1

MICP1

SWIF_TXRX MICN2

TDO MICP2

TDI VMIC

TMS VUMIC

TCK

TRST_N ACD

TRIG_IN AGND

MON1 VREF

MON2

MON3 NC1

FSYS1 NC2

FSYS2 NC3

DIGUP_CLK NC4

DIGUP1

DIGUP2 VDDFS

NBF

DEL

PBF

DE L

VR

DD

E L

0D_FI

D

1D _FI

D

2D _FI

D

3D_FI

D

4D_FI

D

5D_FI

D

6D _FI

D

7D_FI

D

8D_FI

D

1S

C_FID

DC_FI

D

RW_FI

D

DR_FI

D

DH_FI

D

DV_FI

D

TE

SE

R _FID

0D_FI

C

1D_FI

C

2D _FI

C

3D_FI

C

4D_FI

C

5D_FI

C

6D _FI

C

7D_FI

C

KLC

P_FIC

CN

YS

H_FIC

CN

YS

V _FIC

2 TU

OK L

C

DP_FI

C

TE

SE

R_FIC

0NI_

PK

1NI_

PK

2NI_

PK

3NI_

PK

4NI_

PK

5NI_

PK

0TU

O_P

K

1TU

O_P

K

2TU

O_P

K

3TU

O_P

K

5TU

O_P

K

BIV

BIV_

SS

V

0TU

OKL

C

K23 F

K23C

SO

N_TE

SE

R

NI2T

0KL

C_1S2I

XR_1

S2I

XT_1S2I

0A

W_1S2I

LC

S_C2I

AD

S_C2I

FFO

NO

VBAT

1V8_VDD

C1251u

0.1uC126

2.2u

C146

1nC127

C1280.1u

VDDXO

C1290.1u

220nC130

VBAT_RF2

CN101

9

8

7

6

5

4

3

2

1

VRTC

R1093.9K

220nC131

5.6KR110

18pC132

VRTC

C107

22u

TP102

TP104

TP105

IND

631R

OJ102

C147

5p

C136DNI

1V8_VDD

0.1uR135

0.1u

C137

R113 100KR114 100K

1V8_VDD

0.1u

C138

1u

C139

1V8_VDD

1uC140

1V8_VDD

201D

43

52

61

100KR117

100

R118

C141 470n

C133 DNI

R120DNI

47pC142

R121 100K

TP106

R122

10

TP107

TP108

DNIR123R124

DNI

K7.4

521R

C14347pDNI

C144

10KPT101

10R126

10R127

VHSMIC

U102

C4

C11

E7

D12

D4

E5

D10

E10

D11

E4

G3

G4

F6

F7

G8

G9

F10

F11

F4

F5

G6

G7

F8

F9

G11

G12

K14

K1

H12

H3

C12

C3

A14

A1

D9

G5

F3

E12

D5

G10

E3

H4

D7

H11

E9

E8

E11

E6

F12

D8

D6

H7

C8

C7

D3

H8P_CRE

WAIT_

P_LB_P_UB_P_CE1_

CLK

WE_OE_

AVD_

F1_CE_

F_RST_F_WP_P_CE2

F_DPD

VCC1VCC2

VCCQ1VCCQ2

VSS1VSS2VSS3VSS4

F_VPP

NC1NC2NC3NC4NC5NC6NC7NC8

ADQ0ADQ1ADQ2ADQ3ADQ4ADQ5ADQ6ADQ7ADQ8ADQ9ADQ10ADQ11ADQ12ADQ13ADQ14ADQ15

A16A17A18A19A20A21A22A23A24A25

22p

C103

D101

R111

0

ON_SW

26MHz

DSX321G-26MX102

21

34

C148

DNI

END_KEY

KB101

32.768KHz

FC-135

X101

21

22p

C116F_MODE

R119 43K

4.7n

C123

211R

0

IND

531C

C134 10u

R130100K100K

R131

TP110

U103

65

7

8

4

2

1

3OUT1

IN

OUT2

EN_SET

OUT3

OUT4

GND OUT5

1V8_VDD

R132100K

R133100K100K

R134

C1451u

0AT

AD_

MA

C1

A TA

D_M

AC

2A T

AD_

MA

C3

ATA

D_M

AC

4AT

AD_

MA

C5

A TA

D_M

AC

6AT

AD_

MA

C7

ATA

D_M

AC

CN

YS

H_M

AC

KLC

P _M

AC

TE

SE

R_M

AC

CN

YS

V_M

AC

K23KL

C

KLC

M_M

AC

SR_

DC L

SC_

NIA

M _D

CLN

00AT

AD_

DCL

1 0AT

AD _

DCL

2 0AT

AD _

DCL

30AT

AD_

DCL

4 0AT

AD_

DCL

5 0AT

AD _

DCL

60AT

AD _

DCL

70AT

AD _

DCL

NE_

GH

CT

NI _TB _

BB

D

CN

YS

V_D

CL

RW _

DCL

N

TNI_

BB

D_TB

TNI_

CIU

M

RCV_N

VLOGIC

BS2

FM_ANT

BT_CLK

I2C_SCLI2C_SDA

PCM_CLK

XR_

MC

PXT_

MC

P

PCM_SYNC

SC_I

PS

_LCD_RESET

NE_

ANL_

MF

TC

ETE

D_K

OO

H

TE

D_D

SU

TNI_

YE

K

LCD_IDBAT_TEMP

MIC_N

HS_MIC_NMIC_P

HS_MIC_P

USD_CLK

USD_CMD

USD_D1USD_D2USD_D3

BS1

TX_EN

RX12RX12X

RX34RX34X

SIM_CLK

GSM_OUT

DCS_PCS_OUT

STC_T

B

STR_T

B

BT_RXDBT_TXD

TX_RAMP

P_BI

V

TDO

TDO

TCK

TCK

TMS

TMS

TDI

TDI

LDO_OUT

USB_DPUSB_DM

PWRON

PWRON

PWRON

AD22

AD22

AD21

AD21

AD20

AD20

AD19

AD19

AD18

AD18

AD17

AD17

AD16

AD16

MEM_CLK

MEM_CLK

NWAIT

NWAIT

AD15

AD15

AD14

AD14

AD13

AD13

AD12

AD12

AD11

AD11

AD10

AD10

AD09

AD09

AD08

AD08

AD07

AD07

AD06

AD06

AD05

AD05

AD04

AD04

AD03

AD03

AD02

AD02

AD01

AD01

AD00

AD00

NADV

NADV

NRAM_CS

NRAM_CS

NRD

NRD

NWR

NWR

NRESET

NRESET

TE

SE

RN

NROM_CS

NROM_CS

1V8_VDD

UART_TX

UART_TX

UART_TX

UART_RX

UART_RX

UART_RX

NLB_AD25

NLB_AD25

NLB_AD25NUB

NUB

EAR_SPK_NEAR_SPK_P

ON_SW

ON_SW

RCV_PNTRST

NTRST

CO

E_

USD_D0

TC

ETE

D_K

CAJ

FSYS_EN

BT_RESET

BT_RESET

SIM_RST

SIM_DATA

LCD_BL_CTRL

LCD_BL_CTRLNE_L

B_Y

EK

TNI_I

PS

SPI_MISOSPI_MOSI

SPI_CLK

WLAN_RESET

WLAN_REG_ON

IO_EXPANDER0

IO_EXPANDER0

AD

S_Y

EK

LC

S_Y

EK

YB

DN

ATS_

MA

C

AD23

AD23AD24

AD24

F_MODE

EDOM

_F

CTR_

DD

V

ABB

RF

RF

5TNI

E

INT PORT

0TNI

E

VDDP_SIMBT_DBB_INT

DIF_RESETEINT4

LIGHT BLUERF PADS

(SUPER CAP)

USIF1_CTS_N

Not Assembly BT Model

VDDP_DIG1

(10V)

PIN_H10

PIN COLOR DESCRIPTION

EINT4/EINT1

PT101 is DNI defaultly

Seperate and shield

Speaker Supply

(10V)

MEMORY

6TNI

E

_CHG_EOC

VDD_IO2

PLACE THESE CAPS NEAR BB IC

Close to the 26MHz XTAL

VBATSP

SLIDET2INSIGNAL NAME

DIGUP2

BACKUP BATTERY

ABB

VDDP_DIG1

MUIC_INTCC0CC1IO

ON BOARD ARM9 JTAG & ETM INTERFACE

(1%)

0TNI

E

ABB PADSVDDP_EBU

CC0CC1IO

PMU PADSRF SUPPLY DOMAIN

VDDP_DIG1

VDDP_MMC

DBB SUPPLIES

4TNI

E

VDD1V8CP

EINT2

VDD_IO1

1TNI

E

EINT7CC1CC6IO

EINT0PIN NAME

PIN_H13PIN_B14

RF SUPPLIES (DIRTY GND)

ORANGE

PMU SUPPLIES

PIN K8PIN M9PIN L7PIN P8

VDDP_DIG1

VDDP_ULPI

RF SUPPLIES (CLEAN GND)

(NOT MOUNTED)

1TNI

E

VDDP_DIG1

uSD_DET

(10V)

YELLOW

7TNI

E

VBAT_PMU

PIN P14PIN P16

POWER ON

CC1CC6IO

USIF1_RTS_N

PIN P10

PIN R5PIN G9

1GI

D_P

DD

V

VDDP_DIG2

VDDP_DIG1

EINT3


CN101 : SW DEBUG

6TNI

E

PIN_B12PIN_E11PIN_G14PIN_G13

UART PORT

CC0CC7IO

OI3C

C1C

C

ABB SUPPLIES

DBB SUPPLIES

PIN K7

PIN N8

(FOR SW DEBUGGING / NOT MOUNTED)

VDD_EBU

0TNI

E

RF

DBB SIGNAL PADSMAGENTA

PMU PADSLIGHT GREEN

(1G NOR AD MUX / 256 pSRAM : De MUX type)

ON BOARD UART/USB INTERFACE

need to replace to 1% (5%) (1%)

7. CIRCUIT DIAGRAM


062C

n1

R263

DNI

FL201

INOUT

GND1GND2

302D

43

52

61

632R

K63

0.1uC203

762R

0

ENSY0020901S201

1

2

3

4

5

6

7

8

SWA SWB

GND

0.1uC257

IN

D

862R

C201100pF

C244 47p

04-5151-005-100-883

ENRY0010801

CN203

15

13

11

9

7

5

4

3

2

1

14

12

10

8

6

16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

L

K

J

I

H

G

F

E

D

C

B

A

L

K

J

I

H

G

F

E

D

C

B

A

16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

FB202

SUSY0024805

CN202

2

1

VBUS_USB

WM9093ECS-RU202

EUSY0403901

3B

A4

C3

C2

2B

D1

D3

4D

C1

A1D2

1B

D5

A2

A5

A3B5

4B

C5

4C

DN

G

OUT+

DD

VP

H

CPVDDCPVSS

CN

HPL

OUT-

SAI

B

IN2- HPR

IN1+D

DV

S

IN3-

IN2+

AD

S

IN1-

IN3+

CP

LC

S

10uC202

C2040.1u

C2052.2u

C206

2.2u

0

252R

L210

0

1uC256

C209

47p

C210

47p

C211

0.1u

C212

0.1u

C213 2.2u

C214 2.2uR20120

202R

smho

K74

smho

K74

302R

47ohms

R204

R205

100Kohms

0.001uFC215

1V8_VDD

C21647pF

C21747pF

VAUX

VA212

DNI

20R208

C218 2.2u

902R

smho

K74

VA213

DNI

smh o

K74

012R

1 12R

smh o

K74

2.2uF

C220

1V8_VDD

C2211u

0.1u

C222

0

R212

51KR213

0

412R

MUIC_DM

VBUS_USB

1u

C223

VA201

RT9524EUSY0410801

U203

65

74

83

92

101

11PGND

VIN BATT

ISET PGB

GND1 CHGSB

LDO GND2

IEOC EN_SET

R216100K

VA202

1V8_VDD

0.1uC224 C225

39p

VBAT

100KR217

1V8_VDD

10R219

VBAT

VBAT

VMIC

100n

L201

39p

C230 C231

10u

C232

39p

SURY0013401

CN204

2

1

332C

u1.0

R265

DNI

EUSY0407701LMV331U204

4 3

2

5 1IN+VCC

GND

IN-OUT

100uC235

632C

u1.0

C237

39p

C238

39p

R264

DNI

VHSMIC

smho

K5.1

422R

270pF

C240

IN

D

522R

0081

402BF

622R

smho

K022

722R

smho

M1

120pFC241

242C

Fp42

L2020.1uH

FB205

1800

VA205

0.022uFC243

47ohms

R228

L203

0.1uH

VBAT

1V8_VDD

VA211

VBUS_USB

VA206

0.1uH

L204

DNI

R239

VAUX

132R

IN

D

0.1uHL205

L206 0.1uH

VA207

ICVL0518100Y500FR

C24547pF

VA208

ICVL0518100Y500FR

47pFC246

10pFC247

R232

2.2Kohms

1800

FB206

560pFC248

C249

560pF

2.2uFC250

0.022uFC251

270pFC252

VA209

L207

0.1uH

VA210

VMMC

820

R233

3.9K

R234

DNI

R230

202D

43

52

61

R266

DNI

C262DNI

C261

DNI

100R237

0R235

HSBC-3PT25-17N

ENZY0020402

CN201

3

24

1

1uC255

R251

0

D201

1800R238

102CS

21

J201

2

3

4

5

6

1 M5

M4

M3

M4F

M1

M6

DNI

C258

DNI

FB207

SUMY0010609

MIC201

4

3

2

1P

G1

G2

O

Q201

S

G

D

1V8_HPVDD

1V8_VDD

L211

0

VA204VA203

R250

DNI

L208 0.1uH

0.1uH

L209

VB201

2

1

062R

01

1V8_VDD

33p

C253

R262

1M

R261

100K

008 1

802BF

C259270pF

1uFC254

0.1uC226

C2390.1u

R207 1

2.2KR215

FB203 1000

TP201

U201

4B

D2

B2

A1A2

B3

C2

A4

C1

A3D1

E4

D3D4

E3

E2C3

E1C4

1B

YLP

PU

SV

UART_TX VBUS

UART_RX DM

DP

USB_DM ID

USB_DP

AUDIO_L R2_2K

AUDIO_R

MIC

DSS

_INT

SDA CLDO

SCL

GND TE

SI

1 R206

R2182.2K

C227 2.2u

R220DNI

2.2uC228

1.5nC229

1V8_VDD

VBAT

R222 27

R223 27

CHG_EN

MUIC_INT

RCV_N

FM_ANT

I2C_SCL

I2C_SCL

I2C_SDA

I2C_SDA

HOOK_DETECT

USD_DET

BAT_TEMP

MIC_N

HS_MIC_N

MIC_P

HS_MIC_P

USD_CLK

USD_CMD

USD_D1

USD_D2

USD_D3

VIB_P

LDO_OUT

USB_DPUSB_DM

UART_TXUART_RX

EAR_SPK_NEAR_SPK_P

RCV_P

_EOC

USD_D0

HP_LOUT

HP_LOUT

HP_ROUT

HP_ROUT

MUIC_ID

MUIC_ID

MUIC_DM

MUIC_DM

MUIC_DP

MUIC_DP

JACK_DETECTEAR_GND

EAR_GND

EAR_GND

EAR_GND

EAR_GND

SPK_N

SPK_N

SPK_P

SPK_P

SJMY0007110

MUIC

need to replace to 1%

(5%)

(1%)

SPK

5PIN CONNECTOR

(25V)

MICRO SD Connector

3.5phi HEADSETAUDIO AMP SUB SYSTEM & SIGNAL DISTRIBUTOR

MAIN RECEIVER

(1%)

(10V)

BATTERY CONNECTOR

(1%)

( USB & EAR MIC & TA &UART )CHARGING IC

MUST BE PLACED NEAR IO CONNECTOR

MICROPHONE

VIB_N

(25V)

(10V)

VIB_P

MOTOR

- 123 -

7. CIRCUIT DIAGRAM


10

R327

DNIC359

103U

21

11

10

9

8

7

31

6

41

5

51

4

61

3

71

2

18

1

19

20

21

22

23GND_SLUG

VRAMP

TX_ENABLE

GPCTRL0

GPCTRL1

1D

NG

VBATT

2D

NG

2LRT

CP

G

BL_NIF

R

9D

NG

3D

NG

8D

NG

BH_

NIFR

TN

A

4D

NG

4X

R

GND5

GND6

GND7

RX1

RX2

3X

R

123L 2.7n

33pC302

C389 100p

2450MHz

FL303

4231

IN OUTGND1 GND2

303C

p33

p33403

C

L301 3.3n 3.3nL302

Q301

2

13

22pC343

3.3nL303

TP319

TP321

SW301

43

2

1ANT COMMON

G3 G4

DNIC393

1nL308

1pC305

ANT302

C371 10p

C320

1p

GND301 C308

6.8p

C3101u

24KR303

22n

L304

869M894M,925M960MHz

FL301 SFSB0001803

105

63

72

94

81IN_881_5 OUT_881_5

IN_942_5 OUT_942_5

GND1 GND2

GND3 GND4

GND5 GND6

R304270ohms

4.7KR305

470n

C312

470n

C313

L306 3.3n

C3141.5p

C31539p

5.1ohmsR306

10nC316 C317

4.7u

1nC318

1nC319

27p

C341

L3071.2n

DNIC392

VBAT

613R

0

C32233p

1nC323

1.8n

L320

270n

L313

16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

L

K

J

I

H

G

F

E

D

C

B

A

L

K

J

I

H

G

F

E

D

C

B

A

16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

L3092.2n

33pC325

1nC326

1.8n

L319

1805M1880M,1930M1990M

FL302 SFSB0001903

105

63

72

94

81IN_1842_5 OUT_1842_5

IN_1960 OUT_1960

GND1 GND2

GND3 GND4

GND5 GND6

4.7uC327

L310DNI

TP325TP324

TP327TP326

TP322

DNIC391

L318 2.2n

ANT304SNMF0059501

23

1FEED

GND2 GND1

C384 2.2u

673C

IN

D

C394

27p

56pC306

IN

D573

C

BCM2070CB0KUFBXGU302

2C

2D

2F3D

6C

7A

7G

5E

4E

6B

B7

E3

E6

B3

E8B5

D7

D8G3

C8G2

F5A4

F4

G6C7

F6A8

F3E7

C4F7

B2

B4D1

G4

2A

1C

1B

1E1F

1G

1A

5A

8B8F

5G

6A

8G

3A

TA

BV

3O

DD

V

2O

DD

V

1O

DD

V

3C

DD

V

2C

DD

V

1C

DD

V

GE

RV

XP

DD

V

FR

DD

V

ANL

DD

V

FID

DV

FTD

DV

VH

GE

RV

RES

RFP RST_N

REG_EN

SCL TM0

SDA TM2

SPIM_CLK PCM_IN

SPIM_CS_N PCM_OUT

PCM_CLK

LPO_IN PCM_SYNC

XIN UART_TXD

XOUT UART_RXD

UART_RTS_N

GPIO_0 UART_CTS_N

GPIO_1

TCXO_OR_OUT_GPIO_5

TCXO_OR_IN_GPIO_6

GPIO_7

NI_X

EO

C

0TU

O_X

EO

C

1TU

O_X

EO

C

7S

SV

6S

SV

5S

SV

4S

SV

3S

SV

2S

SV

1S

SV

TP320

ANT301

2

1

TP323

22p

C396

9.1nL305

1V8_VDD1nC377

2.2uC386

1V8_VDDVAUX

C3852.2u

0R326

10pC382

10nC381

10nC380

10nC383

10pC378 C379

1u

600

TJ106-5001M1-

BH

FB304

C374 1n

C373 1n

15KR308

DNIC370 C372

DNI

27nL312

R330

DNI

22p

C398

0513

R

L322

8.2n

L314

56n

R329

0

CLK32K

DBB_BT_INT

BT_DBB_INT

VLOGICBS2

FM_ANT

BT_CLK

PCM_CLKPCM_RXPCM_TX

PCM_SYNC

FM_LNA_EN

BS1TX_EN

RX12

RX12X

RX34

RX34X

GSM_OUT

DCS_PCS_OUT

BT_CTSBT_RTS

BT_RXDBT_TXD

TX_RAMP

FM_ANT_1

FM_ANT_1

FSYS_EN

BT_RESET

LOWLOWLOWLOW

LOWLOW

TX_EN

LOW

.

LOWHIGHHIGHLOW

HIGH

RF PART

.

.

LOWHIGHHIGH

BS2

.

LOWLOWHIGH

MODE

STANDBYEGSM_RX

GSM850_RX

.

.

.

PCS_RXDCS_RXLB_TXHB_TX

VLOGIC

LOWHIGHLOWLOWLOW

HIGHHIGH

BS1

LOWLOW

HIGH

Bluetooth

7. CIRCUIT DIAGRAM


KB431

5pF

FL401

015

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

1G

2G

KB432J401

8 7

6 3

5 2

4 1VCCGND

RSTVPP

CLKI_O

GND1GND2

LD408

KB433

LD406

GND

LD403 LD407 LD404 LD405 LD409 LD410 LD411 LD414 LD413 LD412

D401

051

104R

1u

C401

1u

C402

CN401

4

3

2

1

LD401

Q401

1

23

VA419

KB404

KB434KB430KB435

100ohmsR402

R4033.3K

1V8_VDD

100ohmsR404

R405 100ohms

KB436

R406 100ohms

KB437

KB405KB406KB407KB445

KB411 KB410 KB409 KB438

2.2KR407

KB408 KB403

2.2KR408

C403DNI

KB402 KB401


KB440 KB439 KB443 KB444

C404DNI

KB421 KB441 KB442

1UFC432

KB420

KB429KB428KB427

CAM_IO_1V8 CAM_D_1V5CAM_A_2V8

KB426KB425

100KR409

1V8_VDD

0.1uC405

KB424KB423

R410 22

KB422ZD403

R411 51

C4060.1u

C4070.1u

C40856p56p

C40956p

C410

15pC411

15pC412

CN402

61413171612518

7594103112121182419232022

52627282920313231

DN

GP

2D

NG

P3

DN

GP

4D

NG

P5

DN

GP

6D

NG

P7

DN

GP

8D

NG

P

D0 PCLKD1 VSYNCD2 HSYNCD3 STANDBYD4 SCKD5 SDAD6 RESETBD7 MCLK

1D

NG

D2

DN

GD

3D

NG

D1

DN

GA

2D

NG

AD

DV

DOI

DD

VD

DV

A

K001

844R

100pFC434

100ohmsR412100ohmsR413

R414 100ohms

R415 100ohms

R416 100ohms

ZD401

R4174.7K

2V85_VSIM

2V85_VSIM

0.1uC413

DNIC414

22pC415

ZD40222pC416

R4193.3K

120K

R420

100ohmsR421R422 100ohms


100ohmsR425

1UFC417

U401

4 131211 10 198

157

166

175

184

193

202

211

2232425262728292D

NG

P

2D

NG

BTE

SE

R

IX O

X

LE

S_KL

C

DD

V

01P

TEST P40

SEL_28P P41

P57 P42

P56 P43

P55 P44

P17 P45

P15 P46

1D

NG

45P

35P

25P

15P

05P

74P

100ohmsR426

104A

V204

AV

404A

V

504A

V

604A

V

16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

L

K

J

I

H

G

F

E

D

C

B

A

L

K

J

I

H

G

F

E

D

C

B

A

16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

VA417

R427

100K


0.1u

C418

2.2u

C419

VA418

LD402

VBAT

5pFFL402

015

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

1G

2G

smho051

034R

smho051

134R

234R

smho051

334R

smho051

smho051

434R

1u

C433

VA403

100pFC435

smho051

534R

100pFC436

944R

IND

smho051

634R

smho051

734R

smho051

834R

704A

V

smho051

934R

smho051

044R

144R

smho051

244R

smho051

804A

V

904A

V

014A

V

114A

V

214A

V

314A

V414

AV

C420

1u

1V8_HPVDD

2.2u

C421 C422

2.2u

VBAT

324C u1

424C u1

U402

24

23

22

21

20

19

18

8

7

6

5

9

4

10

3

11

2

12

1

31 41 51 61 71L

CS

AD

S

NE

MW

P

FC

DN

GP

LDO1

N2C

LDO2

N1C

LDO3

P1C

LDO4

P2C

AGND

VIN

LDOIN

LED6

LED5

LED4

LED3

LED2

LED1

VOUT

1V8_VDD

K01

344R

10R450

CAM_A_2V8

CAM_D_1V5

10R452

CAM_IO_1V8

VBAT

444R

smho

K001

10R451

1uFC425

1V8_VDD

C426

2.2u

C42727pF

100ohms

R445

VA415

FL403

01

5

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

1G

2G

VMMC

C4281uF

TP402

TP403

TP404TP405

VA416

100ohms

R446

CN403

27

26

25

24

23

22

21

20

19

18

17

16

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

0.001uFC429

FL404

01

5

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

1G

2G

C4300.001uF

FL405

01

5

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

1G

2G

DNIR4181.2K

R447

0.1u

C431



CAM_HSYNC

CAM_PCLK

CAM_RESET

CAM_VSYNC

CAM_MCLK

LCD_RSNLCD_MAIN_CS



LCD_VSYNC

NLCD_WR

I2C_SCL

I2C_SCL

I2C_SDA

I2C_SDA

_LCD_RESET

KEY_INT

LCD_ID

SIM_CLK

KEY_COL0

KEY_COL0

KEY_COL2

KEY_COL2

KEY_COL3

KEY_COL3

KEY_COL4

KEY_COL4

KEY_ROW7

KEY_ROW7

KEY_ROW7

KEY_COL5

KEY_COL5

KEY_COL5

KEY_ROW0

KEY_ROW0

KEY_ROW1

KEY_ROW1

KEY_ROW2

KEY_ROW2

KEY_ROW5

KEY_ROW5

KEY_ROW6

KEY_ROW6

KEY_ROW6

KEY_ROW3

KEY_ROW3

KEY_COL1

KEY_COL1

KEY_ROW4

KEY_ROW4

SIM_RSTSIM_DATA

LCD_BL_CTRL

KEY_BL_EN

KEY_SDA

KEY_SCL

MLED5

MLED5

MLED4

MLED4

MLED3

MLED3

MLED2

MLED2

MLED1

MLED1

CAM_STANDBY

@

Q W E R T Y

CAMERA INTERFACE

U I

O



P A


S D F G H

J K L

BACK SHIFT

Z X C

V B N M ?(QUES) ENTER LOCK MESSAGE

SENDRIGHT SOFTLEFT SOFTSYM.(PRIOD),(COMMA)SPACE

OK LEFT RIGHT UP DOWN

MAKER ID : LOW

LCD CONNECTOR



8. BGA PIN MAP

8. BGA PIN MAP

118/133

8 BGA PIN MAP (Top View)

BGA IC pin check (U101)

Ball Diagram (Top View), PMB8810(A-GOLDRADIO+)

: not in use



8. BGA PIN MAP


Ball Diagram (Top View), PF38F6066M0Y3DE

: not in use


- 127 -

9. PCB LAYOUT


104DL

KB

431K

B415

KB

439K

B438

544BK

204DL

134R

014BK

504BK

404BK

014DL

404DL

804DL

KB

435K

B442

KB

426K

B419

314DL

KB

101K

B444

KB

423K

B417

LD407

KB

422K

B416

R434

LD414

KB

443K

B408

KB

402

LD403

LD411

KB

406

KB

432K

B409

KB

440K

B414

KB

433K

B429

KB

413

MIC

201

R235

KB

434K

B428

KB

412D

201

KB

407

034R

KB

430K

B411

KB

427K

B420

LD412

LD409

KB

403

LD406

KB

436K

B441

R432

LD405

KB

425K

B418

KB

401K

B424

KB

437K

B421

LG-C300_MAIN_SPFY0229001-1.0_TOP

MIC201 (Main Mic)- No Mic Operation

9. PCB LAYOUT


L

8

7A CB D E F

G

1

41

K

J

H

G

F

E

D

C

B

A

1

1

D

5

T R MP N JK EFGH D C B

4

5

BA1

A1

16

EDC

202NC

102 NC

R132

914AV

101 D

304 R744 R

102AV

612 C

012L

112L

712 C

202AV

983 C 303LF

U103

R131

714AV

614 R

R118

924 R

824 R

814AV

134 C

634 C

514 R

844 R

254 R

434 C

944 R

154 R

R421914 R

VA

402

183 C

601 R

234 C

223PT

283 C

C355

R107

201 U

R119

832 C

302AV

904 C

R216

CN

402R

201R

208C

117

901 C

C127

201 C

801 C

201PT

J401

804 C

202L

112AV

242 C

C244

L203

012AV

R230

C418

R443

R427

312 C

VA

209

702 R

402BF

502AV

J201

VA

206

C421

U201

201X

231 C

021 C

213L

611 C

L320

903L

C303

X101

301 C

203LF

101TAB

062 R

302 U

103 U

C318

193 C

L318

073 C C371273 C

C387

R332

TP308

R127

CN

401

104 Q

304AV

104 D

302 D

202 D

R126

C353

R135

S201

714 C 024 R

ANT304

U304

C358

C357

R130

TP110

R117

U401

VA

404

VA

405

R425

VA

406R

405

VA

414R

422

R406

R316R

330

C378

C379

C311

C399

L317

R134

202 R312AV

041 C

014AV624 R

054 R534 C

L307

913PT

C201

773 C

083 C

683 C

R329

023PTR326

373 C

483 C

C356

843 C

C301

C145

R109

101 Q

R121 TP

106

701PT

R113

731 C

TP108

R114

R133

R205

C215

402 R

902 R

112 R

012 R

022 C

202BF

212AV

302 R

114AV404 R

104AV

424 R

314AV

204 R

214AV

324 R

314 R

214 R

VA

407

904AV

R414

804AV

C347

522 C

232 C

834 R

NC2

40

802AV

702AV

642 C

602L

542 C

502L

123PT

423PT 523PT 723PT

623PT C383

U302

C349

103X

643 C

833 R

303 U

413 R

543 C

532 C

R110

632 C

R124

C141

R123

102L

732 C

402AV

C231

032 C

934 R

634 R

734 R

044 R

104 R

334 R

144 R

244 R

534 R

403BF

673 C

312 R

C224

C138

C404

R410

583 C

573 C

C412

473 C

323PT

393 C

803 R FL402

912 R

931 C 952 C

C233 304 DZ

414 C 614 C

104 DZ

014 C 604 C

921 C

821 C

C121

601 CR122

021 R

C114

R103

401 R

101TP

C126C

413

C415814 R

204 DZ714 R

401PT

704 C 504 C

212 C

C107

C134

L101

112 C 412 C

552 C

202 U502 C

R212

652 C

C203

C111

501 C

101 C

911 C

C113

C136

111 R

531 C

C124331 C

C110

C144

C112

211 R

501PT

R315

GN

D301

304 C

704 R

R252

R251

R409

804 R

R411

114 C

FL401C

204

R238

C206

202 C

C210

362 R

812 C

C209

052 R

C143031 C

511 C

241 C

914 C

932 R

C401

702BF

C433

R264

C420

C402

204 U

544 R C430

VA

415

C429

R446

VA

416

444 R

524 C

VB

201U

101

C427

C428

902L

C118

R105

C258

R237

R265

C422

C241

R228

632 R

U204

C423

C424 624 C

CN

403

L208

352 C

452 C

C229

TP101

R215

TP201

722 C

822 C

R108

C131

R102

R136

741 C

FB101

413 C

L303

C359

L306S

W301

C308

023 C

L207

FB205

C262

C240

C146

401 C

712 RR

306

403 RL304FB203

321 C

232 R 422 R

052 C

R225

FB206

342 C 942 C

C252

C261

842 CC247

152 C

R266

L204

722 R

R214

R231

622 R

R261

521 R

493 C

313L

R303

413L

Q301

213 C

C313

503 R

143 C

752 C

013 C

R218

C221

R223

R222

R220

R206

C226

C239

221 C

521 C

503L

013L

L319

C396

C398

C322

103LF

C302

C304

713 C

C323

613 C

723 C523 C

C326

841 C

841 R

731 R

201 D

L321L322

AN

T302

FL403

R267

R268

332 R

CN

203C

306C

392

Q201

R262

FB208

304PT

404PT

FL404

504PT

FL405

204PT

103TNA

432 R C260

222 C

C223

FL201

102 CS

103L

503 C

L308

L302C

343

R327

C319

C315

CN

101

LG-C300_MAIN_SPFY0229001-1.0_BOT

CN402 (Camera Module socket)- No Camera

BAT101 (Backup Battery)-RTC Rest

U402 (Charge Pump)- No LCD Backlight

CN403(LCD Connector)- No LCD Display

VB201 (vibrator pad)- No vibrator

U203 (Charging IC)- No Charging

U201 (MUIC)- No Booting- No USB/Serial Connection

X102 (X-tal 26M)- No Power On- No Service

U301 (PAM)- No Call

ANT302 (Main RF contact pad)

U302 (BT Module)- No BT Operation

U202 (Audio AMP)- No Sound

CN201(Battery Connector)- No Power On

CN401 (Side-key pad)- No side key Operation

U102 (Memory)- No Power On- No Download

U101 (BB IC)- No Power On- No Download- No Display

S201 (µ-SD Connector)- No µ-SD Operation

J401 (SIM Connector)- No SIM Operation

U401(Tr. for Key Backlight)- No Key Backlight



10.ENGINEERING MODE

10.ENGINEERING MODE10. ENGINEERING MODE

9. ENGINEERING MODE

Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. The key sequence for switching the engineering mode on is “1809#*300# “Select. Pressing END will switch back to non-engineering mode operation. Use Up and Down key to select a menu and press ‘select’ key to progress the test. Pressing ‘back key will switch back to the original test menu.

[1] DEVICE TEST

[1-1] Auto All Test

[1-2] Main LCD

[5] Factory Reset

[3] SW Sanity Test

[4] Version

[2] ELT Mode

[3-1] FPRI Test

[1] Usage Info

[2-1] Band Selection[2-2] Battery Info[2-3] Audio Tunning[2-4] UART Setting[2-5] BT Testing[2-6] Defect Report System

[1-3] Sub LCD[1-4] LCD Backlight[1-5] Key Backlight[1-6] Speaker[1-7] Vibrator[1-8] Camera[1-9] Sub Camera[1-10] Mic Loopback[1-11] Key Press Test[1-12] Speaker Vib Test

[2] Eng Mode

[3-2] DB Check[3-3] E Serial NO[3-4] UA.String[3-5] Unlock SIM

1. Factory Mode 2. Eng Mode

[3] Band Select[3-1] Auto[3-2] GSM 850[3-3] GSM900[3-4] DCS 1800[3-5] PCS 1900

[4] Network Info

[3-1] Cell Env. (Idle)[3-2] Cell Env. (Ded)[3-3] PS Log Save[3-4] TCPIP Debug[3-5] PCS 1900

[5] Other[5-1] Bluetooth Test Menu[5-2] PS Attach Mode[5-3] MMS Test[5-4] SIM Info

[6] Debug Setting[5-1] Variable Watch[5-2] Heap Freesize[5-3] Heap Leakage[5-4] Heap Assert[6-5] QM Heap Freesize[6-6] Developer Debug

- 1�0 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes

11. STAND ALONE TEST

11. STAND ALONE TEST11. STAND ALONE TEST

11.1 IntroductionThis manual explains how to examine the status of RX and TX of the model.

A. Tx TestTX test - this is to see if the transmitter of the phones is activating normally.

B. Rx TestRX test - this is to see if the receiver of the phones is activating normally.

11.2 Setting Method


1. Set COM Port2. Check PC Bau Rate3. Confirm EEPROM & Delta file prefix name



Change “ptest mood”

5. For the purpose of the Standalone Test, Change the Phone to “ptest mode” and then Click the “Reset” bar.

6. Select “Non signaling” in the Quick Bar menu. Then Standalone Test setup is finished.



2. Put the number of TX Channel in the ARFCN3. Select “Tx” in the RF mode menu and “PCL” in the PA Level menu.4. Finally, Click “Write All” bar and try the efficiency test of Phone.





11.4 Rx Test

1. Put the number of RX Channel in the ARFCN.2. Select “Rx” in the RF mode menu.3. Finally, Click “Write All” bar and try the efficiency test of Phone.



Change “normal mode “

4. The Phone must be changed “normal mode” after finishing Test. 5. Change the Phone to “normal mode” and then Click the “Reset” bar.




12.AUTO CALIBRATION

12.AUTO CALIBRATION

12.1 Overview

Auto-cal (Auto Calibration) is the PC side Calibration tool that perform Tx, Rx and BatteryCalibration with Agilent 8960(GSM call setting instrument) and Tektronix PS2521G(ProgrammablePower supply).Auto-cal generates calibration data by communicating with phone and measuring equipment thenwrite it into calibration data block of flash memory in GSM phone.

12. AUTO CALIBRATION


CM_GSM_MULTI

Common

Debug

dll,ocx

Hot_Kimchi

Model

UI

Multi_HK

LG_UI_Ad6500_004.dll

KF300d

Spec_GD350_001

dwdio.dll

LG_RfCal_InfiKE000Ag_177.dll

LG_RfTest_E5515C_122.dll

xmm2130_eep008.cfg

AutoSetup_GD350_001

Ezlooks

Procedure_GD350_001

PwrSupply_Cmd

script_001

Setup_Cal_Parameter_001

PwrSupply_Cmd

DLL_PwrControlD.dll

Dll_SerialATD.dll

LG_CL_039.dll

At_Serial_Cmd

ComLMPLib_1_11.dll

HK_40

ShieldBox_DllD.dll

GuiTk115d.dll

Dll_EzLooksMQ_016.dll

ComLMPLib_2_11.dll

Debug

Result

Auto

CalAuto

Cal

DLL_E5515CD.DLL

(Windows 98)MFCD DLL COPY

vsflex7l_ocx_regist

(Windows XP)MFCD DLL COPY

(Windows 2000)MFCD DLL COPY

12.2 Configuration of HotKimchi

12.1 Overview

LG-C�00

LG-C�00

LG-C�00

LG-C300


12.AUTO CALIBRATION

12.3 Description of Basic File

12.1 Common-. LG_CL_039.dll : Common logic dll, Module In Charge of Reading PID & S/W Version, Booting.-. Dll_SerialATD.dll : Serial Communication Module From Phone by AT Command.-. DLL_PwrControlD.dll : Communication Module From Power supply.-. DLL_E5515CD.DLL : Communication Module From Agilent 8960(Test Set).-. At_Serial_Cmd.xml : Definition File of AT Command.-. PwrSupply_Cmd.xml : Definition File of Power supply command.

12.2 Debug-. Debug - Cal : Result File of Calibration.

Auto : Result File of Auto Test.CalAuto : Result File of Cal & Auto Test.

12.3 dll, ocx-. vsflex7l_ocx_regist : Registration File for System use

-. Windows XXX)MFCD DLL : Registration File for System use

12.4 HotKimchi-. HK_40.exe : Execute File, HK_XX XX is File Version.-. ComLMPLib_1_11.dll : Communication Module With PLC or Shield Box In Automation Rack.

Support to J&S Shield Box and Tescom TC-5981A.-. ComLMPLib_2_11.dll : Communication Module With PLC or Shield Box In Automation Rack.

Support to J&S Shield Box and Tescom TC-5981A.-. Dll_EzLooksMQ_005.dll : Communication Module with ezTray Installed In Local PC.-. GuiTk115d.dll : control library-. ShieldBox_DllD.dll : Communication with Shield Box. Support to Tescom TC-5952B.

12.5 Model-. LG_RfCal_InfiKE000Ag_177.dll : Main Module of Calibration-. LG_RfTest_E5515C_122.dll : Main Module of Auto Test-. Xmm2130_eep008.cfg : Cal Data Save binary Module.-. AutoSetup_LG-A133_100.xml : RF TEST Setup Module.-. Ezlooks.xml : Calibration ezLooks Item & Cal Spec Definition Module.-. Procedure_LG-A133_001.xml : RF TEST Procedure Definition Module.-. Script_001.xml : RF TEST Setup calibration Setup Module.-. Spec_LG-A133_001.xml : Definition Module of Auto Test Spec -. Setup_Cal_Parameter_001.xml : Calibration Definition Module.


LG-C300

LG-C300

LG-C300&



12.AUTO CALIBRATION

1. Connect as Fig 6-2(RS232 serial cable is connected between COM port of PC and MON port of TEST

JIG, in general)

2. Set the Power Supply 4.0V

3. Set the 3rd, 4th of DIP SW ON state always

4. Press the Phone power key, if the Remote ON is used, 1st ON state

1. Copy the file to C:\Cm_Gsm_Multi

2. Copy the files of((Windows XXX)MFCD DLL, vsflex7l_ocx_regist to C:\Cm_Gsm_Multi\dll,ocx

3. Select MFCD DLL of your computer OS

4. Click on “vsflex7l_ocx_regist”

5. Click on “Multi_HK reg”

6. Connect as Fig 11-2 (RS232 serial cable is connected between COM port of PC, in general.)

7. . Run HK_40exe to start calibration.

8. Click “ Logic Operation” of “SETTING” menu bar


12.4 Procedure

12.6 UI-. LG_UI_Ad6500_002.dll : ADI Model UI Dll.

12.7 Multi_HK-. Registration File For System Setting.


12.AUTO CALIBRATION

9. Set PORT (using RS232 cable) that PC can communicate with the phone


10. Select “ LOGIC MODE” that you want

Logic mode: 1-> Calibration only2-> Auto test only

3-> Cal & Auto



12.AUTO CALIBRATION


11. Select the model name “LG-A133”

12. Click “start” button

Model name Start button

LG-C�00

LG-C�00

LG-C�00


12.AUTO CALIBRATION


12.5 AGCThis procedure is for Rx calibration.In this procedure, We can get RSSI correction value. Set band EGSM and press Start button theresult window will show correction values per every power level and gain code and the samemeasure is performed per every frequency.

12.6 APCThis procedure is for Tx calibration.In this procedure you can get proper scale factor value and measured power level.

12.7 ADCThis procedure is for battery calibration.You can get main Battery Config Table and temperature Config Table will be reset.

12.8 Target Power

29dBm29dBm29dBmMax power

1909.8 MHz1880 MHz1850.2 MHzFrequency

810661512Channel

PCS 1900

29.5dBm29.5dBm29.5dBmMax power

1784.8 MHz1747.6 MHz1710.2 MHzFrequency

885699512Channel

DCS1800



12437975Channel

EGSM 900



251191128Channel

GSM 850

HighMiddleLowDescriptionBAND

- 143 -

13. EXPLODED VIEW & REPLACEMENT PART LIST

13.1 EXPLODED VIEW


Location No. Part Name

ACGA00 COVER, BATTERY, ASSY

SBPL00 BATTERY

GMEY00 SCREW

SNGF00 INTENNA, MAIN

SJMY00 MOTOR

SUSY00 SPEAKER

SNGF01 INTENNA, FM

ACGM00 COVER, REAR, ASSY

ACKA00 CAN, SHIELD, ASSY

SVCY00 CAMERA

MIC201 MICROPHONE

ADCA00 DOME, METAL ,ASSY

SPKY00 PCB, SIDE KEY

SURY00 RECEIVER

SVLM00 LCD

SAFY00 PCB, ASSY

AKAC00 KEYPAD, MAIN

AKAD00 KEYPAD, SUB

MBJZ00 BUTTON, VOLUME

MTAD00 TAPE, WINDOW, LCD

MWAC00 WINDOW, LCD

ACGK00 COVER, FRONT, ASSY

ACGK00

MWAC00 MTAD00

SVLM00 SURY00

SVCY00SNGF01

SUSY00

SJMY00

SNGF00

GMEY00

SBPL00

SPKY00

ACKA00

MIC201

ADCA00

MBJZ00

AKAD00

AKAC00

SAFY00 ACGM00 ACGA00




by SBOM standard on GCSC

Level LocationNo. Description Part Number Spec Color Remark

1 GSM,BAR/FILP TGSM0088401 WHITEORANGE

2 AAAY00 ADDITION AAAY0486204 WHITEORANGE

3 ACGA00 COVER ASSY,BATTERY ACGA0041303 PINK

4 MCJA00 COVER,BATTERY MCJA0127001 MOLD, PC LUPOY SC-1004A, , , , , WHITE

2 APAY00 PACKAGE APAY0151001 LG-C300 STD(EU1) WITHOUTCOLOR

3 APLY00 PALLET ASSY APLY0003901 EU1 TYPE_Body(SW)+Cap(EU)+AL_1200EA WITHOUTCOLOR

4 MBEC00 BOX,CARTON MBEC0003601 BOX, TW, , , , , WITHOUTCOLOR

4 MCCL00 CAP,BOX MCCL0002501 BOX, TW, , , , , WITHOUTCOLOR

4 MPCY00 PALLET MPCY0012403 COMPLEX, (empty), , , , , DARK BLUE

3 MBAD00 BAG,VINYL(PE) MBAD0005204 COMPLEX, (empty), , , , , WITHOUTCOLOR

3 MBEE00 BOX,MASTER MBEE0061001 BOX, TW, , 307, 170, 251, 1 COLOR WITHOUTCOLOR

3 MBEF00 BOX,UNIT MBEF0148902 BOX, TW, , , , , WITHOUTCOLOR

3 MLAC00 LABEL,BARCODE MLAC0004541 PRINTING, (empty), , , , , WithoutColor

3 MLAJ00 LABEL,MASTER BOX MLAJ0004402 LABEL,MASTER BOX(for CGR TDR 2VER. mbox_label) WithoutColor

3 MLAZ01 LABEL MLAZ0050901 PRINTING, (empty), , , , , WITHOUTCOLOR

2 APEY PHONE APEY0915204 WHITEORANGE

3 ACGY COVER ASSY,EMS ACGY0007804 WHITEORANGE

4 ACGK00 COVER ASSY,FRONT ACGK0162601 WHITE

5 AKAC00 KEYPAD ASSY,MAIN AKAC0014501 WITHOUTCOLOR

13.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered

<Mechanic component>




5 AKAD00 KEYPAD ASSY,SUB AKAD0004301 WITHOUTCOLOR

5 MBJZ00 BUTTON MBJZ0034001 MOLD, PC LUPOY SC-1004A, , , , , WITHOUTCOLOR

5 MCJK00 COVER,FRONT MCJK0130101 MOLD, PC LUPOY SC-1004A, , , , , COLORUNFIXED

5 MDAY00 DECO MDAY0073101 MOLD, PC LUPOY SC-1004A, , , , , WITHOUTCOLOR

5 MDAY01 DECO MDAY0073001 COMPLEX, (empty), , , , , WITHOUTCOLOR

5 MPBG00 PAD,LCD MPBG0110201 COMPLEX, (empty), , , , , WITHOUTCOLOR

5 MPBZ00 PAD MPBZ0297701 COMPLEX, (empty), , , , , WITHOUTCOLOR


5 MTAB00 TAPE,PROTECTION MTAB0402101 COMPLEX, (empty), , , , , WITHOUTCOLOR

5 MTAD00 TAPE,WINDOW MTAD0128001 COMPLEX, (empty), , , , , WITHOUTCOLOR

5 MTAZ00 TAPE MTAZ0317501 COMPLEX, (empty), , , , , WITHOUTCOLOR

5 MWAC00 WINDOW,LCD MWAC0145101 MOLD, Tempered Glass, , , , , WITHOUTCOLOR

4 ACGM00 COVER ASSY,REAR ACGM0162301 ORANGE

5 MCCE00 CAP,RECEPTACLE MCCE0059601 MOLD, PC LUPOY SC-1004A, , , , , WITHOUTCOLOR

5 MCJN00 COVER,REAR MCJN0122801 MOLD, PC LUPOY SC-1004A, , , , , ORANGE

5 MDAY00 DECO MDAY0073201 MOLD, PC LUPOY SC-1004A, , , , , WITHOUTCOLOR

5 MFBC FILTER,SPEAKER MFBC0051901 COMPLEX, (empty), , , , , BLACK

5 MLAB LABEL,A/S MLAB0001102 C2000 USASV DIA 4.0 WHITE

5 MPBN00 PAD,SPEAKER MPBN0095501 COMPLEX, (empty), , , , , WITHOUTCOLOR

5 MPBT00 PAD,CAMERA MPBT0095601 COMPLEX, (empty), , , , , WITHOUTCOLOR


5 MSAZ00 SHEET MSAZ0074201 COMPLEX, (empty), , , , , WITHOUTCOLOR

5 MTAA00 TAPE,DECO MTAA0223901 COMPLEX, (empty), , , , , WITHOUTCOLOR





5 MWAE00 WINDOW,CAMERA MWAE0062101 CUTTING, PMMA MR 200, , , , , WITHOUTCOLOR

4 GMEY00 SCREW MACHINE,BIND GMEY0014301 2.7 mm,3.5 mm,MSWR3 ,Ni,+ ,NYLOK(0.6) Silver

6 ACKA00 CAN ASSY,SHIELD ACKA0037201 WITHOUTCOLOR

7 MAAA00 ABSORBER,ELECTROMAGNETIC WAVE MAAA0007501 COMPLEX, (empty), , , , , WITHOUT

COLOR

7 MCBA00 CAN,SHIELD MCBA0077401 PRESS, STS, , , , , WITHOUTCOLOR

6 ADCA00 DOME ASSY,METAL ADCA0114601 WITHOUTCOLOR

6 MIDZ00 INSULATOR MIDZ0255401 COMPLEX, (empty), , , , , WITHOUTCOLOR




6 MSAZ00 SHEET MSAZ0073801 COMPLEX, (empty), , , , , WITHOUTCOLOR

6 MTAC00 TAPE,SHIELD MTAC0094601 COMPLEX, (empty), , , , , TRANSPARENT

6 MTAZ00 TAPE MTAZ0317701 COMPLEX, (empty), , , , , WITHOUTCOLOR

6 MLAZ00 LABEL MLAZ0038301 PID Label 4 Array WITHOUTCOLOR

7 ANT301 CONTACT MCIZ0004401 PRESS, STS, 0.12, , , , WITHOUTCOLOR

7 SC201 CAN,SHIELD MCBA0059201 PRESS, STS, , , , , WITHOUTCOLOR

3 MLAA00 LABEL,APPROVAL MLAA0062303 COMPLEX, (empty), , , , , WITHOUTCOLOR





5 SJMY00 VIBRATOR,MOTOR SJMY0007905 3 V,0.08 A,5.8*5.1*9 ,cylinder motor ,; ,3V , , ,11000 , , ,,29

5 SNGF ANTENNA,GSM,FIXED SNGF0061901 3.0 ,-5.0 dBd, ,LG-C300 FM Internal_FPCB, Pb-Free ,;,SINGLE ,-5.0 ,50ohm ,3.0

5 SNGF00 ANTENNA,GSM,FIXED SNGF00618013.0 ,-2.0 dBd, ,LG-C300 Main InternalGSM850+900+1800+1900, Pb-Free ,; ,QUAD ,-2.0,50ohm ,3.0

5 SUSY00 SPEAKER SUSY0024805 PIN ,8 ohm,91 dB,16 mm,3.4T spring 0.9W ,; , , , , , ,,CONTACT

4 SAFY PCB ASSY,MAIN SAFY0376404

5 SAFB00 PCB ASSY,MAIN,INSERT SAFB0121301

6 BRAH00 RESIN,PC BRAH0001301 ; , , , ,[empty] Black

6 SPKY00 PCB,SIDEKEY SPKY0090601 POLYI ,0.18 mm,MULTI-2 , ,; , , , , , , , , ,

6 SURY00 RECEIVER SURY0010120 ASSY , dB, ohm,1207*2.5T ,10mm ,; , , , , , ,WIRE ,

6 SVCY00 CAMERA SVCY0026901 CMOS ,MEGA ,2M FF, Hynix 1/5", 7x7x4.1t, Socket

6 SVLM00 LCD MODULE SVLM0034001 Main ,2.4" ,320*240 ,54.3*46.8*1.7t ,262K ,TFT ,TM,NT35399 ,Landscape LCD ,

5 SAFF PCB ASSY,MAIN,SMT SAFF0278104

6 SAFC00 PCB ASSY,MAIN,SMTBOTTOM SAFC0148701

7 ANT304 ANTENNA,MOBILE,FIXED SNMF0059501 3.0 ,-2.0 dB,Amotech-3015 Size BT Chip Antenna, Pb-Free ,; ,SINGLE ,-2.0 ,50ohm ,3.0

7 BAT101 MODULE,ETC SMZY0023501 3.8 Backup Capacitor 0.03F ,; ,Module Assembly

7 C101 CAP,CERAMIC,CHIP ECCH0005603 2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP

7 C102 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

7 C103 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

7 C104 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

7 C105 CAP,CHIP,MAKER ECZH0001216 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP

7 C106 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP

7 C107 CAP,CHIP,MAKER ECZH0025502 22000000 pF,6.3V ,M ,X5R ,HD ,2012 ,R/TP ,; ,0.85t,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]



13.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered

<Main component>












7 C117 CAP,CHIP,MAKER ECZH0001217 470 nF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

7 C118 CAP,CHIP,MAKER ECZH0001210 470 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP

7 C119 CAP,CERAMIC,CHIP ECCH0000151 4.7 nF,25V,K,X7R,HD,1005,R/TP

7 C120 CAP,CERAMIC,CHIP ECCH0002002 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP


7 C122 CAP,CERAMIC,CHIP ECCH0002002 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP











7 C134 CAP,CERAMIC,CHIP ECCH0007803 10 uF,10V ,M ,X5R ,HD ,1608 ,R/TP ,; , ,[empty] ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm











7 C146 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP

7 C147 CAP,CHIP,MAKER ECZH0000806 5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

7 C201 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

7 C202 CAP,CERAMIC,CHIP ECCH0007803 10 uF,10V ,M ,X5R ,HD ,1608 ,R/TP ,; , ,[empty] ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm

7 C203 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP






7 C211 CAP,CERAMIC,CHIP ECCH0002001 0.1 uF,6.3V ,K ,B ,HD ,1005 ,R/TP , , ,[empty] ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,.5 mm

7 C212 CAP,CERAMIC,CHIP ECCH0002001 0.1 uF,6.3V ,K ,B ,HD ,1005 ,R/TP , , ,[empty] ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,.5 mm








7 C221 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP


7 C223 CAP,CHIP,MAKER ECZH0003503 1 uF,25V ,K ,X5R ,HD ,1608 ,R/TP



7 C226 CAP,CHIP,MAKER ECZH0003504 100 nF,25V ,K ,X7R ,HD ,1608 ,R/TP

7 C227 NOT ASSEMBLE 99999999999 NOT ASSEMBLE ColorUnfixed








7 C231 CAP,CERAMIC,CHIP ECCH0005604 10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty],[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm



7 C235 CAP,TANTAL,CHIP ECTH0002703 100 uF,10V ,M ,STD ,3216 ,R/TP ,; ,0.0001 ,20% ,10V ,,-55TO+125C , ,3.2X1.6X1MM ,NONE ,SMD ,R/TP







7 C243 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP




7 C247 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

7 C248 CAP,CHIP,MAKER ECZH0003118 560 pF,50V ,K ,X7R ,HD ,1005 ,R/TP



7 C251 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
















7 C308 CAP,CERAMIC,CHIP ECCH0001001 6.8 pF,50V ,D ,NP0 ,TC ,1005 ,R/TP ,; , ,0.5PF ,50V,NP0 ,[empty] ,1005 ,R/TP , mm




7 C314 CAP,CHIP,MAKER ECZH0000822 1.5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP



7 C317 CAP,CERAMIC,CHIP ECCH0007802 4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP








7 C327 CAP,CERAMIC,CHIP ECCH0007802 4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP

























7 CN201 CONNECTOR,ETC ENZY0020402 3 ,2.5 mm,BOTTOM , ,

7 CN203 CONNECTOR,I/O ENRY0010801 5 ,0.65 mm,STRAIGHT ,- ,M USB Normal ,; ,5 ,0.64MM,STRAIGHT ,RECEPTACLE ,DIP ,[empty] ,

7 CN402 CONN,SOCKET ENSY0023701 24 ,ETC , ,0.7 mm,7x7x3.95t, (1.3M Socket)

7 CN403 CONNECTOR,FFC/FPC ENQY0014201 27 PIN,0.3 mm,STRAIGHT , , ,; , ,0.30MM ,FFC/FPC,STRAIGHT ,BOTH ,SMD ,R ,LOCKING ,

7 D101 DIODE,TVS EDTY0010101 SOD-923 ,5 V,300 mW,R/TP ,15pF ,; , ,5.8V(MIN),12.5V(1A) ,40A ,300mW ,[empty] ,[empty] ,2P ,2

7 D102 DIODE,TVS EDTY0009801 SOT-963 ,5 V,25 W,R/TP , ,; , , , , , ,[empty] ,[empty] ,2P,1



7 D401 VARISTOR SEVY0004301 18 V, ,SMD ,10pF, 1005

7 FB101 FILTER,BEAD,CHIP SFBH0007103 75 ohm,1005 ,CHIP BEAD, 300mA

7 FB202 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 ,


7 FB204 FILTER,BEAD,CHIP SFBH0008105 1800 ohm,1005 ,Chip bead ,; ,1800ohm ,; ,[empty] ,R/TP





7 FL201 FILTER,EMI/POWER SFEY0007101 SMD ,1CH,1608Feedthru ESD/EMI filter for power Pb-free

7 FL301 FILTER,SAW,DUAL SFSB0001803

881.5 MHz,25 MHz,2.5 dB,23 dB,942.5 MHz,35 MHz,2.9dB,18 dB,1.8*1.4*0.5 ,SMD,869M~894M,925M~960M,10p,B,150,LH,GSM850+EGSM Rx,DIP_OUT ,; ,881.5+942.5 ,1.8*1.4*0.5 ,SMD ,R/TP





7 FL302 FILTER,SAW,DUAL SFSB0001903

1842.5 MHz,75 MHz,3.1 dB,12 dB,1960 MHz,60 MHz,3.2dB,8 dB,1.8*1.4*0.5 ,SMD,1805M~1880M,1930M~1990M,10p,B,170,DCS+PCSRx,LH,DIP_OUT ,; ,1842.5+1960 ,1.8*1.4*0.5 ,SMD,R/TP

7 FL303 FILTER,DIELECTRIC SFDY0003001 2450 MHz,2.0*1.25*1.05 ,SMD ,2400M~2500M, IL 1.6,4pin, U-U, 50-50, BT BPF ,; ,BPF ,2450 ,100 ,SMD ,R/TP

7 FL401 FILTER,EMI/POWER SFEY0015501 SMD ,Pb-free_4ch_5p-100ohm-5p ,; ,Filter,LCR

7 FL402 FILTER,EMI/POWER SFEY0015501 SMD ,Pb-free_4ch_5p-100ohm-5p ,; ,Filter,LCR

7 FL403 FILTER,EMI/POWER SFEY0012501 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (200 Ohm,25pF)



7 J201 CONN,JACK/PLUG,EARPHONE ENJE0008001 ,6 , ,; ,[empty] ,4P ,[empty] ,R/TP , ,BLACK

,12.55x6.3x4.0t

7 J401 CONN,SOCKET ENSY0022101 6 ,ETC , ,2.54 mm,H=1.5

7 L101 INDUCTOR,SMD,POWER ELCP00094103.3 uH,N ,2x2.5x1.0 ,R/TP ,chip power ,; ,3.3uH ,30% ,;,400mA ,; ,; ,; ,SHIELD ,2.5X2MM ,[empty] ,R/TP,Inductor,Wire Wound,Chip

7 L201 INDUCTOR,CHIP ELCH0003842 100 nH,J ,1005 ,R/TP ,MLCI

7 L202 INDUCTOR,CHIP ELCH0005009 100 nH,J ,1005 ,R/TP ,








7 L210 PCB ASSY,MAIN,PADSHORT SAFP0000501

7 L211 PCB ASSY,MAIN,PADSHORT SAFP0000501

7 L301 INDUCTOR,CHIP ELCH0003826 3.3 nH,S ,1005 ,R/TP ,chip




7 L305 INDUCTOR,CHIP ELCH0003818 9.1 nH,J ,1005 ,R/TP ,





7 L307 INDUCTOR,CHIP ELCH0001411 1.2 nH,S ,1005 ,R/TP ,PBFREE

7 L308 INDUCTOR,CHIP ELCH0001403 1 nH,S ,1005 ,R/TP ,PBFREE

7 L309 INDUCTOR,CHIP ELCH0005001 2.2 nH,S ,1005 ,R/TP ,


7 L313 INDUCTOR,CHIP ELCH0010402 270 nH,M ,1005 ,R/TP ,CHIP

7 L314 INDUCTOR,CHIP ELCH0003825 56 nH,J ,1005 ,R/TP ,chip inductor,PBFREE

7 L318 INDUCTOR,CHIP ELCH0003832 2.2 nH,S ,1005 ,R/TP ,MLCI

7 L319 INDUCTOR,CHIP ELCH0003847 1.8 nH,S ,1005 ,R/TP ,chip coil

7 L320 INDUCTOR,CHIP ELCH0003847 1.8 nH,S ,1005 ,R/TP ,chip coil

7 L321 INDUCTOR,CHIP ELCH0003815 2.7 nH,S ,1005 ,R/TP ,

7 L322 INDUCTOR,CHIP ELCH0003838 8.2 nH,J ,1005 ,R/TP ,MLCI

7 PT101 THERMISTOR SETY0006301 NTC ,10000 ohm,SMD ,1005, 3350~3399k, J, R/T,PBFREE

7 Q101 TR,BJT,NPN EQBN0020501 ESM ,0.15 W,R/TP , ,; ,NPN ,5V ,60V ,50V ,150mA,0.1uA MAX ,10 MIN 700 MAX ,100mW ,ESM ,R/TP ,3P

7 Q201 TR,FET,P-CHANNEL EQFP0007601 ESM (EMT3) ,0.1 W,-30 V,-0.05 A,R/TP ,High Speed P-ch MOSFET, Pb-free

7 Q301 TR,BJT,NPN EQBN0019201 VSM ,0.1 W,R/TP ,1.2*1.2*0.5 Vcbo=20, Vceo=12,Vebo=2V, Ic=100mA

7 Q401 TR,BJT,NPN EQBN0020501 ESM ,0.15 W,R/TP , ,; ,NPN ,5V ,60V ,50V ,150mA,0.1uA MAX ,10 MIN 700 MAX ,100mW ,ESM ,R/TP ,3P

7 R102 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

7 R103 PCB ASSY,MAIN,PADSHORT SAFP0000501


7 R106 RES,CHIP,MAKER ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP

7 R107 RES,CHIP,MAKER ERHZ0000204 100 Kohm,1/16W ,F ,1005 ,R/TP













7 R118 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

7 R119 RES,CHIP ERHY0000272 43K ohm,1/16W,J,1005,R/TP



7 R125 RES,CHIP ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP

7 R126 RES,CHIP,MAKER ERHZ0000206 10 ohm,1/16W ,F ,1005 ,R/TP


7 R137 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP


























7 R224 RES,CHIP,MAKER ERHZ0000529 1.5 Kohm,1/16W ,J ,1005 ,R/TP





7 R233 RES,CHIP ERHY0000185 820 ohm,1/16W ,F ,1005 ,R/TP


7 R236 RES,CHIP ERHY0000140 36K ohm,1/16W,F,1005,R/TP


7 R238 FILTER,BEAD,CHIP SFBH0008105 1800 ohm,1005 ,Chip bead ,; ,1800ohm ,; ,[empty] ,R/TP










7 R306 RES,CHIP,MAKER ERHZ0003801 5.1 ohm,1/16W ,J ,1005 ,R/TP






7 R330 PCB ASSY,MAIN,PADOPEN SAFO0000501 0OHM_1005_DNI















7 R411 RES,CHIP ERHY0000105 51 ohm,1/16W,F,1005,R/TP






































7 S201 CONN,SOCKET ENSY0020901 8 PIN,STRAIGHT , , mm,

7 SW301 CONN,RF SWITCH ENWY0008701 STRAIGHT H=1.35 ,SMD , dB, ,; ,1.40MM ,STRAIGHT,SOCKET ,SMD ,P/TR ,AU , ,

7 U101 IC EUSY0421201BGA ,210 ,R/TP ,EDGE Rx,ARM11208MHz,FMR,2.0Mp,QVGA Display ,; ,IC,DigitalBaseband Processor

7 U102 IC EUSY0417801 FBGA ,56 ,ETC ,Fully 1.8V ADmux 1G(mono die) NOR +256M(128*2) psRAM ,; ,IC,MCP

7 U201 IC EUSY0372001 WCSP ,20 ,R/TP ,MUIC ,; ,IC,Analog Switch

7 U202 IC EUSY0403901 WLCSP ,20 ,R/TP ,Mono Audio Subsystem ,; ,IC,AudioSub System

7 U203 IC EUSY0410801 DFN ,10 ,R/TP ,DFN Cal Test Mode Single Charger IC forMicro USB ,; ,IC,Charger

7 U204 IC EUSY0407701 SC-70 ,5 ,R/TP ,Comparator ,; ,IC,TTL

7 U301 RF MODULE,HANDSET SMRH0006301 MHz, MHz, ,GPRS QUAD TX MODULE, SP6T,6.63*5.24*1.02, 22pin

7 U302 IC EUSY0382201 FPBGA ,50 ,R/TP ,4.5x4.0x0.6, BT2.1, 0.5pitch ,;,IC,Bluetooth

7 U401 IC EUSY0300008 QFN ,28 ,R/TP ,64key ,; ,IC,Bus Controller

7 U402 IC EUSY0344403 QFN ,24 ,R/TP ,4CH+2LDO ,; ,IC,Sub PMIC

7 VA201 VARISTOR SEVY0004301 18 V, ,SMD ,10pF, 1005







7 VA203 DIODE,TVS EDTY0010101 SOD-923 ,5 V,300 mW,R/TP ,15pF ,; , ,5.8V(MIN),12.5V(1A) ,40A ,300mW ,[empty] ,[empty] ,2P ,2


7 VA205 VARISTOR SEVY0005202 5.5 V,+-30 ,SMD ,1005, 100 pF, Pb free






7 VA211 DIODE,TVS EDTY0010501 1.0 x 0.6 x 0.5mm ,15 V,120 W,R/TP , ,; , ,16.7V (min),28V (max) ,4A , ,[empty] ,R/TP ,2P ,1




















7 X101 X-TAL EXXY0018701 32.768 KHz,20 PPM,12.5 pF,70 Kohm,SMD ,3.2*1.5*0.9,




7 X102 X-TAL EXXY002700126 MHz,7 PPM,8 pF,40 ohm,SMD ,3.2*2.5*0.75 ,26MHzIFX ULC2 Ref. Clock, Pb-Free ,; ,26MHz ,[empty] ,3.6fF-Motion ,1.0pF-Shunt , ,SMD ,R/TP

7 ZD401 DIODE,TVS EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE



6 SAFD00 PCB ASSY,MAIN,SMT TOP SAFD0146901

7 D201 DIODE,TVS EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE

7 LD401 DIODE,LED,CHIP EDLH0011901 WHITE ,1608 ,R/TP ,PB-FREE(ZENER)














7 MIC201 MICROPHONE SUMY0010609 UNIT ,-42 dB,3.76*2.95*1.1 ,mems smd mic ,; , , ,OMNI,[empty] , ,[empty]






7 SPFY00 PCB,MAIN SPFY0229001 FR-4 ,1.0 mm,STAGGERED-6 ,GW200 ,; , , , , , , , , ,






3 SBPL00 BATTERY PACK,LI-ION SBPL00982013.7 V,900 mAh,1 CELL,PRISMATIC,463450,INNERPACK,WW ,; ,3.7 ,900 ,180 ,PRISMATIC,4.6X34X50 ,5.1X34X50 ,BLACK ,INNERPACK ,

3 BATTERY PACK,LI-ION SBPL00989013.7 V,900 mAh,1 CELL,PRISMATIC ,463450,innerpack,WW ,; ,3.7 ,900 ,180 ,PRISMATIC ,4.6x34x50 ,4.6x34x53,BLACK ,innerpack ,

BLACK

3 SSAD00 ADAPTOR,AC-DC SSAD0034501100-240V ,5060 Hz,4.8 V,0.4 A,CE ,AC-DC ADAPTOR ,;,90Vac~264Vac ,4.8Vdc ,400mA ,5060 , ,WALL 2P ,USB,

3 ADAPTOR,AC-DC SSAD0034502100-240V ,5060 Hz,4.8 V,.4 A,CE ,AC-DC ADAPTOR ,;,90Vac~264Vac ,4.8Vdc ,400mA ,5060 , ,WALL 2P ,USB,



13.3 Accessory Note: This Chapter is used for reference, Part order is ordered

Service Manual - LG

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