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Server, Storage, &

March 2015Request for Proposal

Wired NetworkingInfrastructure

Server, Storage, & Wired Networking Infrastructure March 2015 RFP Page 1 of 71 Version 1

CONTENTS

Contents ........................................................................................................................................................................ 1

Figures ........................................................................................................................................................................... 3

1 Invitation To Bid ..................................................................................................................................................... 4

1.1 Bid Information ............................................................................................................................................ 4

1.2 General Project Schedule ............................................................................................................................. 4

1.3 Pre-Bid Meeting ........................................................................................................................................... 5

1.4 EGRPS Personnel and Roles ......................................................................................................................... 5

2 General Terms and Conditions .............................................................................................................................. 6

3 Blade System Infrastructure .................................................................................................................................. 8

3.1 Summary ...................................................................................................................................................... 8

3.2 Sites of Work ................................................................................................................................................ 8

3.3 Current Blade System Solution .................................................................................................................... 8

3.4 Acceptable Manufacturers and Models ....................................................................................................... 9

3.5 Terms ........................................................................................................................................................... 9

3.6 Minimum Requirements ............................................................................................................................ 10

3.7 General Questions ...................................................................................................................................... 15

4 Storage Area Network Infrastructure .................................................................................................................. 17

4.1 Summary .................................................................................................................................................... 17

4.2 Sites of Work .............................................................................................................................................. 17

4.3 Current SAN Solution ................................................................................................................................. 17

4.4 Acceptable Manufacturers & Models ........................................................................................................ 18

4.5 Terms ......................................................................................................................................................... 19



5 Wired Network Infrastructure ............................................................................................................................. 26


5.1 Summary .................................................................................................................................................... 26

5.2 Sites of Work .............................................................................................................................................. 26

5.3 Current Wired Network Solution ............................................................................................................... 28

5.4 Acceptable Manufacturers ......................................................................................................................... 29

5.5 Terms ......................................................................................................................................................... 29



6 Bid Proposal Forms .............................................................................................................................................. 46

6.1 Intent to Bid Form ...................................................................................................................................... 47

6.2 Bid Submittal Instructions .......................................................................................................................... 48

6.3 Bid Submittal Checklist ............................................................................................................................... 48

6.4 Bid Proposal Form ...................................................................................................................................... 49

6.5 Michigan Familial Relationship Disclosure Statement ............................................................................... 51

6.6 Michigan Iran Economic Sanctions Act ...................................................................................................... 52

6.7 References.................................................................................................................................................. 53

7 Appendixes .......................................................................................................................................................... 54

7.1 Desired Blade System and SAN Solution .................................................................................................... 54

7.2 Current Blade System and SAN Solution .................................................................................................... 54

7.3 Current Blade System Phsyical Layout ....................................................................................................... 55

7.4 Current Blade System Original Bill of Materials ......................................................................................... 55

7.5 Current SAN Physical Layout ...................................................................................................................... 58

7.6 Current SAN Original Bill of Materials ........................................................................................................ 58

7.7 District Facilities and Locations Referenced in Document ......................................................................... 59

7.8 Current Wired Network Original Bill of Materials ...................................................................................... 67


FIGURES

Figure 1 ........................................................................................................................................................................ 31

Figure 2 ........................................................................................................................................................................ 32

Figure 3 ........................................................................................................................................................................ 33

Figure 4 ........................................................................................................................................................................ 34

Figure 5 ........................................................................................................................................................................ 35

Figure 6 ........................................................................................................................................................................ 36

Figure 7 ........................................................................................................................................................................ 37

Figure 8 ........................................................................................................................................................................ 38

Figure 9 ........................................................................................................................................................................ 39

Figure 10 ...................................................................................................................................................................... 40

Figure 11 ...................................................................................................................................................................... 54

Figure 12 ...................................................................................................................................................................... 55

Figure 13 ...................................................................................................................................................................... 55

Figure 14 ...................................................................................................................................................................... 58

Figure 15 ...................................................................................................................................................................... 60

Figure 16 ...................................................................................................................................................................... 61

Figure 17 ...................................................................................................................................................................... 62

Figure 18 ...................................................................................................................................................................... 63

Figure 19 ...................................................................................................................................................................... 64

Figure 20 ...................................................................................................................................................................... 65

Figure 21 ...................................................................................................................................................................... 66

Figure 22 ...................................................................................................................................................................... 67


1 INVITATION TO BID

East Grand Rapids Public Schools (hereinafter, “EGR Public Schools”, “EGRPS”, or “the Owner”) is requesting proposals from qualified vendors to provide Blade System, Storage Area Network, & Wired Networking Infrastructure, including all related components, to supply a complete system. This document is organized in to three categories: Blade System Infrastructure (hereinafter, “Blade System”), Storage Area Network Infrastructure (hereinafter, “SAN”), and Wired Networking Infrastructure (hereinafter, “Wired Networking”). Qualified vendors may respond to one, two, or all three of the categories.

1.1 BID INFORMATION

All bids must be received by April 13, 2015 @ 2:00 PM EST. All bids must be clearly labeled “Server, Storage, & Wired Networking Infrastructure March 2015 RFP”. Bids may be sent via email, mail, or hand delivered.

1.1.1 EMAIL

Bids must have the subject “Server, Storage, & Wired Networking Infrastructure March 2015 RFP” and be sent to [email protected]. Bids may be attached as a single pdf or zip file of multiple files in a format the district supports (Adobe PDF, Microsoft Office, common image file types). Please try and send all items in a single email. If multiple email messages are required; the date and time that the last email is received is the effective submittal time. Please note that the district email system has a 30MB attachment size limit.

1.1.2 MAIL

Bids sent via mail should be sent via Registered Mail or some other service that provides receipt notification. Bids must be clearly marked with “Server, Storage, & Wired Networking Infrastructure March 2015 RFP” and sent to: East Grand Rapids Public Schools c/o Jeff Crawford 2915 Hall St. SE Grand Rapids, MI 49506

1.1.3 HAND DELIVERED

Bids must be clearly marked with “Server, Storage, & Wired Networking Infrastructure March 2015 RFP” and delivered to East Grand Rapids Public Schools, 2915 Hall St. SE, Grand Rapids, MI, 49506.

1.2 GENERAL PROJECT SCHEDULE

RFP Released March 30, 2015 @ 2:00 PM EST Bidder Questions and Clarifications Begin March 30, 2015 @ 2:30 PM EST Pre-Bid Meeting April 1 , 2015 @ 9:00-11:00 AM EST Intent to Bid Form Due Back April 3, 2015 Bidder Questions and Clarifications End April 8, 2015 @ 4:30 PM EST Bids Due Back April 13, 2015 @ 2:00 PM EST Public Bid Opening April 13, 2015 @ 2:30 PM EST Owner Questions Begin April 13, 2015 @ 3:00 PM EST Owner Questions End April 17, 2015 @ 4:30 PM EST Winning Bidder Notified April 21, 2015

mailto:[email protected]


1.3 PRE-BID MEETING

A pre-bid meeting will be held on April 1, 2015 from 9:00 am until 11:00 am. A discussion of the project and review of bid documents will be followed by a review of the data center at the Middle School and an opportunity to ask questions. Attendance is highly encouraged for all prospective bidders interested in bidding on any of the three categories.

a) Location: East Grand Rapids Middle School Guidance Conference Room 2425 Lake Dr. SE Grand Rapids, MI 49506

See figure 18

1.4 EGRPS PERSONNEL AND ROLES

1.4.1 PROJECT ADMINISTRATOR

Name: Doug Jenkins Title: Director of Technology and Assessment Email: [email protected] Phone: 616-235-3535

1.4.2 PROJECT DESIGN, COORDINATION, AND MANAGEMENT

Name: Jeff Crawford Title: Manager of Networking and Security Email: [email protected] Phone: 616-235-3535

1.4.3 ACCOUNTS PAYABLE

Name: Teresa Catlin Title: Accounts Payable Email: [email protected] Phone: 616-235-3535





2 GENERAL TERMS AND CONDITIONS

a) All proposals must be submitted using the attached "Bid Proposal Forms" found in “Bid Proposal Forms”. The proposal must be signed by an individual authorized to bind the vendor to be valid. A bid bond (licensed in the State of Michigan) or certified check for 5% of the bid amount must accompany your proposal. Bids received after April 13, 2015 @ 2:00 PM EST will not be accepted.

b) References of three (3) K-12 school district accounts currently serviced, for whom comparable work has been performed, must be furnished. Failure to include references may be ample cause for rejection.

c) Any catalog, brand name or manufacturer’s reference in this RFP is descriptive – not restrictive – it is intended to indicate type and quality desired unless specified otherwise. If brand other than that specified is proposed, complete descriptive information of said article must be included with the proposal. Only like products, quality and warranty will be considered. If vendor takes no exception to specifications referenced in this RFP, brand names, models, etc. as specified, must be furnished.

d) All items proposed must be new, not reconditioned, including containers suitable for shipment and storage, unless otherwise indicated on the proposal.

e) East Grand Rapids Public Schools is not liable for any costs incurred by the vendor prior to the issuance of any agreements, contracts or purchase orders, and will not pay for information solicited or obtained in response to this RFP. The information obtained will be utilized solely to determine the suitability of the products or services offered. Subsequent procurement, if any, will be in accordance with appropriate rules and regulations.

f) All submitted proposals will be reviewed and evaluated by only those officials who have a legitimate interest. Any information within a proposal that a vendor considers to be proprietary should be identified as such in writing. Otherwise, East Grand Rapids Public Schools reserves the right to use any or all ideas presented with a proposal in any reply to this RFP. Selection or rejection of a vendor’s proposal does not affect this right.

g) Vendors may be required to make an oral presentation to East Grand Rapids Public Schools evaluators if clarification of a proposal is necessary to make a proper evaluation. A vendor’s original proposal cannot be changed by the vendor in any aspect as a result of an oral presentation. The oral presentation is only intended to provide an opportunity for vendors to clarify specific portions of their proposal. Oral presentations will be arranged at the discretion of East Grand Rapids Public Schools and will be by invitation only.

h) Any maintenance costs, shipping costs, taxes, project management, and any other potentially hidden costs shall be identified as part of the proposal.

i) The selected vendor will be required to provide serial numbers electronically for each device. j) Questions and clarifications regarding bid specifications must be sent via email to Jeff Crawford, Manager

of Networking and Security no sooner than March 30, 2015 @ 2:30 PM EST and no later than April 8, 2015 @ 4:30 PM EST. Email message must contain “Server, Storage, & Wired Networking Infrastructure March 2015 RFP” in the subject line and sent to [email protected]. Questions will be answered on a best effort basis (including nights and weekends). Questions will be responded to no later than 48 hours after receipt during normal operating hours (8 am to 5 pm). Questions and clarifications will only be communicated between the bidder and the owner unless the owner determines that the information is relevant to all bidders. Owner reserves the right to utilize all forms of communication for questions and clarifications as necessary.

k) Public questions and clarifications will be allowed immediately after the bid opening on April 13, 2015 @ 2:30 PM EST.

l) East Grand Rapids Public Schools reserves the right to ask questions and clarifications via email or phone beginning on April 13, 2015 @ 3:00 PM EST and ending on April 17, 2015 @ 4:30 PM EST. Due to the extremely short window we ask that all bidders ensure that a representative is available during this time as well as respond to the questions found at the end of each relevant category. Please provide the name and contact information for this individual where asked.

m) The Owner reserves the right to reject any or all bid proposals, either in whole or in part. The Owner reserves the right to waive any informalities or irregularities in the bidding and not to accept bid


alternates. The Owner also reserves the right to award a contract in any manner deemed by the Owner, in the Owner's sole discretion, to be in the Owner's best interest.

n) Withdrawal of any Bid Proposal after the opening time without specific approval by Owner may result in forfeiture of required bid security by Bidder.

o) Bidders must submit a single total lump sum for each category “Minimum Specification” responded to on both the “Bid Proposal Form” as well as the category unit price worksheet. Bidders do not have to respond to all categories and can indicate that they are not bidding using the checkboxes provided.

p) The East Grand Rapids Board of Education will vote on the EGRPS Technology Department’s recommendation(s) during their April 20, 2015 meeting which begins at 6:00 pm EST. The winning bidder will be notified the following day, April 21, 2015.


3 BLADE SYSTEM INFRASTRUCTURE

3.1 SUMMARY

EGRPS is looking to procure a new Blade System solution to replace the district’s current C7000 chassis and further consolidate the data center. The new Blade System shall be a single chassis, include eight blade servers, connect to the district wired network via a 40 Gbps connection, and connect directly to the new SAN via 8 Gbps fiber channel. The Blade System solution will be installed by EGRPS personnel with the assistance of the selected vendor in to an existing HP 10842 G2 42U Wide Rack. Power can be supplied by a Liebert Nfinity 16kVA single phase UPS or a HP RP12000/3 three phase UPS. The current rack has C20 outlets and thus will support C19 plugs. C13 plugs can be supported if required. See figure 11 for a layout of the desired solution. EGRPS expects the new Blade System solution to be 100% operational by August 15, 2015.

3.2 SITES OF WORK

The products specified in this section will be shipped to and installed in the second floor data center at East Grand Rapids Middle School. This is subject to change. EGRPS will confirm with the winning vendor the ship to and install locations once the project has commenced.

3.2.1 EAST GRAND RAPIDS MIDDLE SCHOOL

2425 Lake Drive, SE Grand Rapids, MI 49506 Phone: 616-235-7551 Fax: 616-235-7587 Principal: Mr. J. Peter Stuursma Assistant Principal: Mr. William Behrendt Secretary: Mrs. Evon Roberts Normal Hours: Monday-Friday, 7:30 AM to 4 PM Note: Does not have a loading dock See figure 18

3.3 CURRENT BLADE SYSTEM SOLUTION

EGRPS current Blade System consists of two HP C7000 Blade System chassis with ten blades in each. Four of the blades in each chassis have a 4 Gbps QLogic HBA to connect to the existing EMC SAN and the other eight blades in each chassis connect with 1 Gbps iSCSI. Each blade chassis is connected directly to the EGRPS core network switch via 10 Gbps copper CX4 cables through a HP 1/10GB Virtual Connect Ethernet interconnect module. Each chassis is connected to the EMC SAN via multiple redundant 4 Gbps multimode fiber patch cables through a HP 4GB VC-FC interconnect module connected to redundant Cisco MDS9124 SAN fabric switches. See figure 12 for a layout of the current blade and SAN solution. Each chassis has six standard blades and four fiber channel blades. Below are the specifications of each.


3.3.1 CURRENT STANDARD BLADE SPECIFICATION

Quantity Part Number Description

1 447707-B21 HP BL460c G1 Dvlss CTO Blade

1 459489-L21 HP E5450 BL460c G1 FIO Kit

1 459489-B21 HP E5450 BL460c G1 Kit

4 397413-B21 HP 4GB FBD PC2-5300 2x2GB Kit

1 447711-B21 HP HDD Bkpln BL460c FIO Kit

2 375861-B21 HP 72GB 10K SAS 2.5 Hot Plug Hard Drive

1 406770-B21 HP BLc NC373m Mfn Gigabit Svr Adapter

1 351580-B21 HP 128MB BBWC FOR SA641/642

3.3.2 CURRENT FIBER CHANNEL BLADE SPECIFICATION


1 447707-B21 HP BL460c G1 Dvlss CTO Blade

1 459489-L21 HP E5450 BL460c G1 FIO Kit

1 459489-B21 HP E5450 BL460c G1 Kit

4 397413-B21 HP 4GB FBD PC2-5300 2x2GB Kit

1 447711-B21 HP HDD Bkpln BL460c FIO Kit

2 375861-B21 HP 72GB 10K SAS 2.5 Hot Plug Hard Drive

1 406770-B21 HP BLc NC373m Mfn Gigabit Svr Adapter

1 403619-B21 HP BLc QLogic QMH2462 FC HBA Opt Kit

1 351580-B21 HP 128MB BBWC FOR SA641/642

Please see figure 13 for a drawing of the current physical layout. The current solution has four VMware vSphere 5.5 hosts and sixteen physical servers. The district plans on migrating the sixteen physical servers to virtual servers in the new solution.

3.4 ACCEPTABLE MANUFACTURERS AND MODELS

Manufacturer and models below were used as the basis of this RFP document. Please contact Jeff Crawford if you would like to propose an alternate solution.

Cisco

Dell

HP

3.5 TERMS

a) The systems must be manufactured, configured and tested in an ISO 9001:2000 registered facility. b) The system must be UL listed. c) The system must be FCC approved for commercial use. d) System must be Energy Star compliant. e) All components origin must be from the specified vendor listed. Voluntary alternates will be evaluated on

an individual basis. f) Each component must be from the Original Equipment Manufacturer (OEM) throughout the entire

hardware and warranty periods associated with the component. g) Owner reserves the right to have a third party audit all components and warranty terms at any time

throughout the contracted period.


h) Owner reserves the right to purchase +/-2 blade servers of the quantity specified in this category.

3.6 MINIMUM REQUIREMENTS

3.6.1 POWER REQUIREMENTS

a) Input voltage must be 110 V or 208 V b) Total input current cannot exceed 60 A c) IEC C12, C13, C19, and C20 outlets are supported

3.6.2 OPERATING SYSTEM SUPPORT

a) Tier I Support for SUSE Enterprise Server 11 & 12, VMware vSphere 5.5/6.0, and Windows Server 2008/2012

3.6.3 CHASSIS SPECIFICATIONS

a) One chassis with a minimum of eight slots b) N+1 redundancy for both power supplies and fans c) Redundant management modules d) 8 Gbps fiber channel switch module e) 40 Gbps Ethernet switch module f) Standard rack mounting hardware g) Server profiles

3.6.4 BLADE SERVER SPECIFICATIONS

a) 8 total nodes b) 2 x Intel Xeon E5-2660v3 Processors c) 256GB of DDR3 PC3-12800 memory d) 2 x 120GB SSD SATA3 drives in RAID1 configuration e) 1 x 32GB SD card for VMware OS installation f) Battery backed write cache g) Remote console connection (iLO/CIMC) h) 8 Gbps fiber channel i) 10 Gbps Ethernet

3.6.5 WARRANTY

a) Minimum 3-year next business day response time manufacturer's warranty required for all components of this category.

b) Provide optional 5-year next business day response time manufacturer's warranty required for all components of this category.

c) All on-site warranty work shall be performed by personnel or representatives of the manufacturer or reseller who are authorized and certified to perform the work required.

d) All documents and/or submittals required by the manufacturer to register the components for warranty must be provided.

3.6.6 REQUESTED BILL OF MATERIALS

It is required that you provide pricing for the products specified using the Bill of Materials below for the relevant manufacturer to your bid response. EGRPS encourages voluntary alternates and a menu of options, but this can only be included in addition to a base bid and pricing schedule that uses the “Requested Bill of Materials”. This ensures that EGRPS personnel will be able to evaluate proposals fairly.


3.6.6.1 CISCO UCS BILL OF MATERIALS


1 UCS-SP8-M-B200-VP UCS SP8 B200M3 VALUE PLUS 2x6324,1xCH,4xB200M3 w/2xE52660 v2

1 UCS-SP-MINI-AC2 (Not sold Standalone)UCS MINI SP 5108 Blade Svr AC2 Chassis

1 CON-SNT-6508AC2S SMARTNET 8X5XNBD UCS MINI SP 5108 Blade Svr AC2 Chassis

4 CAB-US520-C19-US NEMA 5-20 to IEC-C19 14ft US

1 N01-UAC1 Single phase AC power module for UCS 5108

1 N20-CAK Accessory kit for UCS 5108 Blade Server Chassis

8 N20-CBLKB1 Blade slot blanking panel for UCS 5108/single slot

8 N20-FAN5 Fan module for UCS 5108

1 N20-FW013 UCS Blade Server Chassis FW Package 3.0

1 UCSB-5108-PKG-HW UCS 5108 Packaging for chassis with half width blades.

4 UCSB-PSU-2500ACDV 2500W Platinum AC Hot Plug Power Supply - DV

1 UCS-SP-FI-M-6324 (Not sold Standalone)UCS SP 6324 In-Chassis FI

1 CON-SNT-FIM6324S SMARTNET 8X5XNBD UCS SP 6324 In-Chassis FI

2 GLC-T 1000BASE-T SFP

2 SFP-10G-SR 10GBASE-SR SFP Module

1 UCS-CTR-LIC UCS Central Per UCS Domain License (Physical)

1 CON-SAU-UCSMGRAS SW APP SUPP + UPGR UCS Central Per UCS Domain Lic-Physical

1 UCS-SP-FI-M-6324 (Not sold Standalone)UCS SP 6324 In-Chassis FI

1 CON-SNT-FIM6324S SMARTNET 8X5XNBD UCS SP 6324 In-Chassis FI

2 GLC-T 1000BASE-T SFP

2 SFP-10G-SR 10GBASE-SR SFP Module

4 UCS-SP7-SR-B200-VP (Not a standalone SKU) B200M3 w/ 2xE52660B,8x16GB,VIC1240

4 CON-PSW7-SP7B20VP UCS W PSS 24X7X4 OS,(Not a standalone SKU) B200M3 w/ 2xE5266

8 UCS-CPU-E52660B 2.20 GHz E5-2660 v2/95W 10C/25MB Cache/DDR3 1866MHz

32 UCS-MR-1X162RZ-A 16GB DDR3-1866-MHz RDIMM/PC3-14900/dual rank/x4/1.5v

8 N20-BBLKD UCS 2.5 inch HDD blanking panel

8 UCSB-HS-01-EP CPU Heat Sink for UCS B200 M3 and B420 M3

4 UCSB-MLOM-40G-01 Cisco UCS VIC 1240 modular LOM for blade servers

4 UCS-M3-V2-LBL Cisco M3 - v2 CPU asset tab ID label (Auto-Expand)

2 UCS-EZ7-B200-VP UCS SP7 B200 VALUE PLUS EXP w/ 2xE5-2660v2,128G,VIC1240

2 CON-PSWD6-EZ7B20VP

UCS W PSS 8X5X4 DR TBD

48 UCS-MR-1X162RZ-A= 16GB DDR3-1866-MHz RDIMM/PC3-14900/dual rank/x4/1.5v

2 UCS-6324-40G= 6324 Fabric Interconnect License for 40G Scalability Port

2 QSFP-H40G-ACU10M= 40GBASE-CR4 Active Copper Cable, 10m

3.6.6.2 DELL M1000E BLADE SYSTEM BILL OF MATERIALS


1 Blade Server Enclosure, No Blades, M1000E, PowerEdge (223-3244)

1 Mission Critical Package: 4-Hour 7x24 On-Site Service with Emergency Dispatch, 2 Year Extended (984-7982)


1 ProSupport : 7x24 HW / SW Tech Support and Assistance , 3 Year (984-8172)

1 Mission Critical Package: 4-Hour 7x24 On-Site Service with Emergency Dispatch, Initial Year (985-3800)

1 Dell Hardware Limited Warranty Plus On Site Service Extended Year(s) (989-0728)

1 Dell Hardware Limited Warranty Plus On Site Service Initial Year (989-0747)

1 MISSION CRITICAL PACKAGE: Enhanced Services, 3 Year (989-0788)

1 Dell ProSupport. For tech support, visit http://support.dell.com/ProSupport or call 1-800-945-3355 (989-3439)

1 On-Site Installation Declined (900-9997)

1 Enable CMC Extended Power Performance for (3+3) 3000W PSU configurations, M1000e (379-BBLN)

1 Redundant Power Supplies (3+3, 3000W) High Efficiency, M1000e Blade Chassis (450-ABIF)

1 Redundant Chassis Management Controller, PowerEdge M1000E (311-7787)

1 Flex Address Plus Enabled (342-1668)

1 CMC Extended Storage Card (342-2666)

1 No Operating System Media Kit (420-1908)

1 Users Guide, PowerEdge M-Series Blades (330-4117)

1 Dell OpenManage CD Kit for PowerEdge M620 Blade Server (331-4356)

1 Dell OpenManage CD Kit for PowerEdge M1000E Blade Server Chassis (310-9694)

1 Users Guide, PowerEdge M-Series Blades (330-4117)

1 Redundant Ethernet Switch Configuration (311-8060)

1 Redundant Ethernet Switch Configuration (311-8060)

1 No I/O Modules, (I/O Bay Filler Panels, Qty 2) M1000E Blade Server Chassis (310-9711)

1 PowerEdge M-Series Blade Multipack Box Processor FamilyLabel, Intel (310-9952)

1 Rack Chassis w/Rapid Rails forDell, HPQ or other Square HoleRacks (310-9689)

1 Avocent Integrated KVM Analog Switch Module, PowerEdge M1000E Chassis (430-2628)

2 Power Cords, QTY3, 2FT C19/C20 for M1000E Server Blade Chassis (330-0146)

1 Serial I/O Management Cable, for Ethernet Blade Switches (310-9696)

1 User Guide, Force10 MXL Blade Switch (331-8184)

1 Serial I/O Management Cable, for Ethernet Blade Switches (310-9696)

8 Blade Blanking Panel for PowerEdge M1000E Blade Server Chassis (310-9709)

8 PowerEdge M630 Blade Server (210-ACXR)

8 PowerEdge M630 Motherboard (329-BCLU)

8 PowerEdge M630 Regulatory Label, DAO (389-BESH)

8 PowerEdge Server FIPS TPM (461-AACZ)

8 No OS, No Utility Partition (421-2869)

8 Broadcom 57810-k Dual port 10Gb KR Blade Network Daughter Card (542-BBBN)

8 BCOM 57810-k,DP,10G KR,Mezz (543-BBCE)

8 No Operating System Media Kit (420-1908)


8 Thank you for choosing Dell ProSupport Plus. For tech support, visit http://www.dell.com/contactdell (951-2015)

8 Dell Hardware Limited Warranty Plus On Site Service (997-0181)

8 ProSupport Plus: 7x24 Next Business Day Onsite Service, 3 Year (997-0209)

8 ProSupport Plus: 7x24 HW/SW Tech Support and Assistance,3 Year (997-0218)

8 Dell Proactive Systems Management - Declined - www.dell.com/Proactive (909-0259)


8 Declined Remote Consulting Service (973-2426)

8 US Order (332-1286)

8 No System Documentation, No OpenManage DVD Kit (343-BBDG)

8 System ordered as part of Multipack order (750-AADI)

8 iDRAC8 Enterprise, integrated Dell Remote Access Controller, Enterprise (385-BBHO)

8 OpenManage Essentials, Server Configuration Management (634-BBWU)

8 2.5" Backplane with up to 2 Hard Drives and Onboard SATA (406-BBEN)

8 Standard Cooling,M630 (384-BBDP)

8 Performance BIOS Settings (384-BBBL)

8 Diskles Configuration, No Controller (780-BBIP)

8 No Controller (405-AACD)

8 Intel Xeon E5-2660 v3 2.6GHz,25M Cache,9.60GT/s QPI,Turbo,HT,10C/20T (105W) Max Mem 2133MHz (338-BFFG)

8 Upgrade to Two Intel Xeon E5-2660 v3 2.6GHz,25M Cache,9.60GT/s QPI,Turbo,HT,10C/20T (105W) (374-BBGN)

128 16GB RDIMM, 2133 MT/s, Dual Rank, x4 Data Width (370-ABUG)

8 2133MT/s RDIMMs (370-ABUF)

8 Performance Optimized (370-AAIP)

8 No Hard Drive (400-ABHL)

8 No Systems Documentation, No OpenManage DVD Kit (631-AACK)

8 Internal Dual SD Module (330-BBCV)

8 Redundant SD Cards Enabled (385-BBCF)

8 16GB SD Card For IDSDM (385-BBII)

8 16GB SD Card For IDSDM (385-BBII)

8 DIMM Blanks for System with 2 Processors (374-BBHL)

8 68MM Heatsink for PowerEdge M630 Processor 1 (412-AADY)

8 68MM Heatsink for PowerEdge M630 Processor 2 (412-AADZ)

8 68MM Processor Heatsink Shroud for PowerEdge M630 (750-AAFD)

2 Dell Force10 MXL 10/40 GbE DCB Blade Switch, Factory Installed in M1000e Chassis, Redundant (225-3527)

2 Dell Hardware Limited Warranty Plus On Site Service Initial Year (935-1685)

2 SW Support,Force 10 MXL10/40GbE,90 Day (935-1725)

2 Dell Hardware Limited Warranty Plus On Site Service Extended Year (935-2665)



2 ProSupport Plus: Mission Critical 4-Hour 7x24 On-Site Service with Emergency Dispatch, Initial Year (951-5145)

2 ProSupport Plus: 7x24 HW/SW Tech Support and Assistance, 3Year (951-5151)

2 ProSupport Plus: Mission Critical 4-Hour 7x24 On-Site Service with Emergency Dispatch, 2 Year Extended (951-5153)



2 SFP+ 10GbE Module, 4 port, Hot Swappable, 4x SFP+ ports (optics or direct attach cables required) (331-8187)

2 QSFP+ 40GbE Module, 2-Port, Hot Swap, used for 40GbE Uplink, Stacking, or 8x 10GbE Breakout (331-8186)

2 PowerConnect M8024-k Managed Switch, 24x10GbE Ports, Redundant (225-1204)

2 Dell Hardware Warranty, Initial Year (931-0487)

2 Dell Hardware Limited Warranty Extended Year (935-5368)


2 ProSupport Plus: Mission Critical 4-Hour 7x24 On-Site Service with Emergency Dispatch, Initial Year (951-7123)

2 ProSupport Plus: Mission Critical 4-Hour 7x24 On-Site Service with Emergency Dispatch, 2 Year Extended (951-7124)

2 ProSupport Plus: 7x24 HW/SW Tech Support and Assistance, 3 Year (951-7147)



2 PowerConnect M8024 SFP+ Module(four ports, no SFPs included) (330-2367)

3.6.6.3 HP C7000 BLADE SYSTEM BILL OF MATERIALS


1 681844-B21 HP BLC7000 CTO 3 IN LCD PLAT ENCLOSURE 1 E5Y41AAE HP OV 3YR 24X7 ENCL FIO 16 SVR E-LTU 2 691367-B21 HP BLC VC FLEXFABRIC-20/40 F8 MODULE 2 691367-B21 0D1 FACTORY INTEGRATED 8 AJ716B HP 8GB SHORT WAVE B-SERIES SFP+ 1 PACK 8 AJ716B 0D1 FACTORY INTEGRATED 8 455883-B21 HP BLC 10G SFP+ SR TRANSCEIVER 8 455883-B21 0D1 FACTORY INTEGRATED 6 412140-B21 HP BLC ENCL SINGLE FAN OPTION 6 412140-B21 0D1 FACTORY INTEGRATED 1 456204-B21 HP BLC7000 DDR2 ENCL MGMT OPTION 1 456204-B21 0D1 FACTORY INTEGRATED 1 413380-B21 HP BLC7000 3 PH NA/JP FIO POWER MOD OPT 1 H1K92A3 HP 3Y 4 HR 24X7 PROACTIVE CARE SVC 1 H1K92A3 7FX HP C7000 ENCLOSURE SUPPORT 1 H1K92A3 SVQ HP ONE VIEW FOR BLADES SUPP 2 H1K92A3 TG8 HP VC FLXFBRC SUPPORT 1 HA124A1 HP TECHNICAL INSTALLATION STARTUP SVC 1 HA124A1 56H HP STARTUP BLADSYS C7000 ENCD NTWK SVC


8 727021-B21 HP BL460C GEN9 10GB/20GB FLB CTO BLADE 8 726990-L21 HP BL460C GEN9 E5-2660V3 FIO KIT 8 726990-B21 HP BL460C GEN9 E5-2660V3 KIT 8 726990-B21 0D1 FACTORY INTEGRATED 128 726719-B21 HP 16GB 2RX4 PC4-2133P-R KIT 128 726719-B21 0D1 FACTORY INTEGRATED 8 700764-B21 HP FLEXFABRIC 20GB 2P 650FLB FIO ADPTR 8 761871-B21 HP SMART ARRAY P244BR/1G FIO CONTROLLER 8 700139-B21 HP 32GBMICROSDMAINSTREAM FLASH MEDIA KIT 8 700139-B21 0D1 FACTORY INTEGRATED 8 H1K92A3 HP 3Y 4 HR 24X7 PROACTIVE CARE SVC 6 H1K92A3 TT8 HP BL460C GEN9 SERVER BLADE SUPPORT

3.7 GENERAL QUESTIONS

Please respond to the following questions below. You may reference an identical answer in another category to avoid being redundant. If a question’s response is found in existing product literature please clearly indicate the exact location of the answer.

3.7.1 PHYSICAL HARDWARE

a) Describe your solution’s use of onboard management controllers. b) Explain your solution's blade server layout in the chassis. c) Explain how non-disruptive maintenance is achieved. d) Explain how your solution can expand beyond eight blade servers. e) Describe anything that pertains to the physical characteristics of your solution not included above that

differentiates it from that of others.

3.7.2 MANAGEMENT

a) Describe the process of managing your solution. a) Describe key features of the management system. b) Explain the types of management interfaces available for your solution. Does it include a mobile

(iOS/Android) application? c) Detail your solution’s integration with VMware. d) Explain the reporting features of your proposed solution. e) Explain notification capabilities of your proposed solution. f) Describe anything that pertains to management not included above that differentiates your solution from

that of others.

3.7.3 CONNECTIVITY

a) Explain how your solution can connect directly to a SAN solution without SAN switches. b) Explain how each blade server communicates to the network (north/south) via the proposed solution. c) Explain how each blade server communicates to other blade servers in the chassis (east/west). d) Detail all connectivity options available for the chassis including those that are not requested in this

document. e) Describe anything that pertains to connectivity not included above that differentiates your solution from

that of others.

3.7.4 DEPLOYMENT

a) Describe the involvement of project managers, engineers, and others in the deployment.


b) Detail the time required to install your proposed solution. c) Describe anything that pertains to the deployment not included above that differentiates your solution

from that of others.

3.7.5 TRAINING

a) Describe the training required for a minimum of one person to manage, maintain, and upgrade the proposed blade system.

b) Describe the type, location, and duration of all training. c) Detail the options for training after deployment. d) Describe anything that pertains to training not included above that differentiates your solution from that

of others.

3.7.6 SUPPORT

a) Define your level of support detailing items covered and the process for contacting support. b) Describe anything that pertains to support not included above that differentiates your solution from that

of others.

3.7.7 WARRANTY

a) Detail your proposed solution’s hardware warranty. b) Is an active warranty required to download firmware, patches, and other software updates to the items

specified in the above section? c) Detail the SLA (Service Level Agreement) included in your proposed solution. Include the time for

replacement parts to arrive and be installed. d) Explain the levels of the warranty proposed. Include software and hardware that is covered. e) Explain which updates and upgrades are included, how notifications about updates are made, and the

process of applying updates to your proposed solution. f) Explain the availability of an onsite engineer and the conditions under which one would be dispatched. g) Describe anything that pertains to Warranty/Maintenance not included above that differentiates your

solution from that of others.


4 STORAGE AREA NETWORK INFRASTRUCTURE

4.1 SUMMARY

EGRPS is looking to procure a new SAN solution to connect directly via fiber channel to the Blade System specified in the previous section. The SAN solution will be the districts primary SAN and handle multiple types of workloads including, but not limited to: user content (office productivity, CAD, multimedia projects); application content (databases, log files, executables); virtualization content (virtualized server images, datastores). The SAN solution will be installed by EGRPS personnel with the assistance of the selected vendor in to an existing HP 10842 G2 42U Wide Rack. Power can be supplied by a Liebert Nfinity 16kVA single phase UPS or a HP RP12000/3 three phase UPS. The current rack has C20 outlets and thus will support C19 plugs. C13 plugs can be supported if required. EGRPS expects the new SAN solution to be 100% operational by August 15, 2015.

4.2 SITES OF WORK

The products specified in this section will be shipped to and installed in the second floor data center at East Grand Rapids Middle School. This is subject to change. EGRPS will confirm with the winning vendor the ship to and install locations once the project has commenced.


2425 Lake Drive, SE Grand Rapids, MI 49506 Phone: 616-235-7551 Fax: 616-235-7587 Principal: Mr. J. Peter Stuursma Assistant Principal: Mr. William Behrendt Secretary: Mrs. Evon Roberts Normal Hours: Monday-Friday, 7:30 AM to 4 PM Note: Does not have a loading dock See figure 18

4.3 CURRENT SAN SOLUTION

EGRPS current SAN is an EMC Clariion CX3-10f with a Celerra NS20 NAS head. This SAN was acquired in June of 2008 and has not been significantly upgraded or modified since the original purchase. The SAN has two tiers. Tier 1 is comprised of 27 x 300GB 15K 4GB FC disks (5 are used for OS and 1 is designated as a hot spare). Tier 2 is made up of 10 x 1TB 7.2K SATA II disks (1 is designated as a hot spare). The SAN presents storage to hosts using iSCSI and 4 Gbps fiber channel and multiple gigabit iSCSI links. Please see figure 14 for a view of the physical layout. User content is files generated by EGRPS students & staff. Approximately 3.7TB of user content is stored on Tier 2. The LUNs are connected via iSCSI to a two node cluster running Novell Open Enterprise Server 11 SP2. The iSCSI protocol is required to support deduplication on the array. The majority of this content is used infrequently with over 80% of the content not being accessed in over two years. LUN Name Description Usable Space RAID FC/iSCSI Tier

11 BRETON Breton Downs student content 97.656 GB 5 iSCSI 2

1 HS EGRHS student content 393.652 GB 5 iSCSI 2

23 HS_p2 HS LUN expansion 191.991 GB 5 iSCSI 2

2 HS_PROJ EGRHS student project content 246.045 GB 5 iSCSI 2


3 LAKESIDE Lakeside student content 98.389 GB 5 iSCSI 2

4 MS EGRMS student content 246.045 GB 5 iSCSI 2

5 MS_PROJ EGRMS student project content 246.045 GB 5 iSCSI 2

6 STAFF Staff content 961.621 GB 5 iSCSI 2

22 STAFF_p2 Staff expansion 384.667 GB 5 iSCSI 2

7 TECH Technology staff content 393.701 GB 5 iSCSI 2

8 WEALTHY Wealthy student content 98.389 GB 5 iSCSI 2

Application content is content generated by applications that are not included in the districts virtualization infrastructure. Currently, the district has application content organized in the below LUNs: LUN LUN Name Description Usable Space RAID FC/iSCSI Tier

32 Email02Temp_lun32 Netmail Email archive temp data 100 GB 1/0 FC 1

20 hpsim_data HP Insight Control Environment data 192.285 GB 5 iSCSI 2

31 ArchiveProgram Netmail Email archive application 10 GB 1/0 FC 1

30 IndexProgram Netmail Email archive index application 20 GB 1/0 FC 1

29 WINDSX WinDSX access control data 4 GB 1/0 FC 1

28 gwdomain_lun28 GroupWise domain data 641.112 GB 1/0 FC 1

26 sky0_data LUN 26 Skyward SIS data 300 GB 1/0 FC 1

25 SF2K School Finance 2K data 20 GB 1/0 FC 1

23 EGRPSIndex Netmail Email archive index data 236.742 GB 1/0 FC 1

1022 EmailArchive Netmail Email archive data 805.113 GB 5 FC 1

1023 LUN 21 Netmail Email archive data expansion 268.371 GB 5 FC 1

1020 staffpo_lun27 GroupWise post office data 450 GB 1/0 FC 1

1021 LUN 33 GroupWise post office data expansion 191.112 GB 1/0 FC 1

9 ZEN Novell ZENworks image content 246.045 GB 5 iSCSI 2

The district uses VMware vSphere 5.5 to power its virtualization infrastructure. The solution has four host servers and 24 virtual machines. The virtual machines are a mix of SUSE Linux Enterprise Server 11 & Windows 2008 servers and appliances from Barracuda Networks (SPAM) & Extreme Networks (NAC and NetSight). Storage is connected via both fiber channel and iSCSI. All datastores are in VMFS5 format. LUN LUN Name Description Usable Space RAID FC/iSCSI Tier

19 vmcluster0lun19 3 virtual machines 525.616 GB 5 FC 1

24 vmcluser0lun24 18 virtual machines 1341.855 GB 5 FC 1

14 iscsi_ds0 2 virtual machines 288.574 GB 5 iSCSI 2

The district anticipates that the user, application, & virtualization content will change during the course of this project and will work with the awarded vendor to adjust the storage environment accordingly. EGRPS acquired a Data Domain DD2200 in June of 2014 to function as a backup target (Tier 3) that will continue to be used with the new array. The current backup software is ArcServe UDP.

4.4 ACCEPTABLE MANUFACTURERS & MODELS

a) EMC a) VNX 5400

b) HP 3PAR a) StoreServ 7200c

c) Nimble a) CS500

d) Tegile a) TS3700


4.5 TERMS

a) The systems must be manufactured, configured and tested in an ISO 9001:2000 registered facility. b) The system must be UL listed. c) The system must be FCC approved for commercial use. d) System must be Energy Star compliant. e) All components origin must be from the specified vendor listed. Voluntary alternates will be evaluated on

an individual basis. f) Each component must be from the Original Equipment Manufacturer (OEM) throughout the entire

hardware and warranty periods associated with the component. g) Owner reserves the right to have a third party audit all components and warranty terms at any time

throughout the contracted period. h) Owner reserves the right to purchase +/-25% of the quantity of TB specified in this category.


4.6.1 POWER REQUIREMENTS

a) Input voltage must be 110 V or 208 V b) Total input current cannot exceed 60 A c) IEC C12, C13, C19, and C20 outlets are supported

4.6.2 OPERATING SYSTEM SUPPORT

a) Tier I Support for SUSE Enterprise Server 11 & 12, VMware vSphere 5.5/6.0, and Windows Server 2008/2012

4.6.3 SAN ARRAY REQUIREMENTS

a) The storage array may contain SSD, SAS, and Nearline SAS tiers or just SSD and SAS Tiers a. Tier 0 – SSD

i. 4 TB Usable storage ii. 1ms latency

iii. 85,000 front end IOPS (assuming a 70/30 read/write workload) b. Tier 1 – SAS


iii. 2,500 front end IOPS (assuming a 70/30 read/write workload) c. Tier 2 – Nearline SAS


iii. 1,000 front end IOPS (assuming a 70/30 read/write workload) d. If the proposed solution only uses 1 tier of spinning drives instead of 2, then the spinning disk tier

must be able to support at least 3,500 front end IOPS (under 20ms latency) before factoring in cache benefits provided by the SSD tier.

b) The storage array must be considered 99.999% reliable with no single point of failure. c) Proposed solution must provide seamless integration with VMware vSphere version 5.5, enabling

scheduling and management of array-based snapshots directly from within vCenter. d) The storage array will support VMware thin provisioning. e) The storage array will support VMware virtual machine migration support for thick to thin provisioning. f) The storage array will provide seamless integration with Cisco UCS, Dell m1000e, and HP Blade System

and must include all hardware, software, and licensing necessary. g) The storage array will provide non-disruptive hardware & firmware updates, upgrades, and maintenance.


h) The storage array must include an interface for either 8 or 16 Gbps fiber channel. Including an additional 10 Gbps iSCSI interface would also benefit the district, but is not required.

i) The storage array will have redundant storage controllers. j) The storage array will have redundant storage. k) The storage array must be scalable. l) The storage array will include management software to report on the performance of the array. m) The storage array will include an optional, configurable ‘phone home’ service whereby diagnostic

information is automatically sent to the OEM for remote alerting. n) The storage array will have a minimum working life expectancy of seven years. o) This equipment must not hit the manufacturer’s end of life (EOL) for at least five years after the date of

purchase.

4.6.4 WARRANTY

e) Minimum 3-year next business day response time manufacturer's warranty required for all components of this category.

f) Provide optional 5-year next business day response time manufacturer's warranty required for all components of this category.

g) All on-site warranty work shall be performed by personnel or representatives of the manufacturer or reseller who are authorized and certified to perform the work required.

h) All documents and/or submittals required by the manufacturer to register the components for warranty must be provided.



4.6.5.1 HP SAN BILL OF MATERIALS


1 E7X67A HP 3PAR StoreServ 7200c 2N Fld Int Base

8 E7W54B HP M6710 480GB 6G SAS 2.5in MLC 5yr SSD

12 K0F26A HP M6710 1.8TB 6G SAS 10K 2.5in HDD

1 BC767B HP 3PAR 7200 Reporting Suite LTU

1 BC768B HP 3PAR 7200 App Suite VMware LTU

48 BC746A HP 3PAR 7200 OS Suite Drive LTU

1 BC745B HP 3PAR 7200 OS Suite Base LTU

1 BC753A HP 3PAR 7200 Virtual Copy Base LTU

48 BC754A HP 3PAR 7200 Virtual Copy Drive LTU

1 BC759A HP 3PAR 7200 Adaptive Opt Base LTU

48 BC760A HP 3PAR 7200 Adaptive Opt Drive LTU

1 BC757A HP 3PAR 7200 Dynamic Opt Base LTU

48 BC758A HP 3PAR 7200 Dynamic Opt Drive LTU

1 E7X64A HP M6710 SFF(2.5in) SAS Fld Int Drv Encl

8 E7W54B HP M6710 480GB 6G SAS 2.5in MLC 5yr SSD

12 K0F26A HP M6710 1.8TB 6G SAS 10K 2.5in HDD

1 E7X66A HP M6720 LFF(3.5in) SAS Fld Int Drv Encl

18 QR499A HP M6720 2TB 6G SAS 7.2K 3.5in NL HDD

1 HA114A1 HP Installation and Startup Service


1 HA114A1 5TP HP Startup 3PAR 7200 2-Nd Strg Base SVC

1 HA114A1 5TV HP Startup 3PAR 7000 2U SAS Enclosre SVC

1 HA114A1 5TW HP Startup 3PAR 7000 4U SAS Enclosre SVC

1 QR516B HP 3PAR 7000 Service Processor

1 BD362AAE HP 3PAR StoreServ Mgmt/Core SW E-Media

1 BD363AAE HP 3PAR 7000/7450 OS Suite E-Media

1 BD365AAE HP 3PAR 7000 Service Proc SW E-Media

1 BD372AAE HP 3PAR App Suite for VMware E-Media

1 BD373AAE HP 3PAR Reporting Suite E-Media

1 H1K92A5 HP 5Y 4 hr 24x7 Proactive Care SVC

1 H1K92A5 RD0 HP 3PAR 7200 OS Suite Base LTU Supp

1 H1K92A5 RD3 HP 3PAR 7200 Virtual Copy Base LTU Supp

1 H1K92A5 RD5 HP 3PAR 7200 Adaptive Opt Base LTU Supp

1 H1K92A5 RD6 HP 3PAR 7200 Dynamic Opt Base LTU Supp

1 H1K92A5 RDB HP 3PAR 7200 Reporting Suite LTU Supp

1 H1K92A5 RDC HP 3PAR 7200 App Suite LTU Supp

1 H1K92A5 RZ5 HP 3PAR 7000 Service Processor Supp

48 H1K92A5 S6L HP 3PAR 7200 OS Suite Drive LTU Supp

48 H1K92A5 S6Q HP 3PAR 7200 Virtual Copy Drive LTU Supp

48 H1K92A5 S6S HP 3PAR 7200 Dynamic Opt Drive LTU Supp

48 H1K92A5 S6T HP 3PAR 7200 Adaptive Opt Drive LTU Supp

16 H1K92A5 TGD HP 3PAR7000 480GB SAS SSD Supp

1 H1K92A5 TRE HP 3PAR StoreServ 7200c2NStrgbase HWSupp

5 H1K92A5 WSF HP 3PAR Internal Entitlement Purpose

42 H1K92A5 WUT HP 3PAR 7000 Drives over 1TB Support

2 H1K92A5 WUW HP 3PAR 7000 Drive Enclosure Support

4 QK734A HP Premier Flex LC/LC OM4 2f 5m Cbl

1 HA124A1 HP Technical Installation Startup SVC

1 HA124A1 5QW HP Startup 3PAR Vrt Cpy Lvl 1 Tier 1 SVC

1 HA124A1 5TH HP Startup 3PAR 7000 App Ste VMWare SVC

1 HA124A1 5TM HP Startup 3PAR 7000 Reporting Ste SVC

1 HA124A1 5TC HP Startup 3PAR 7000 Adaptive Opt SVC

4.6.5.2 EMC SAN BILL OF MATERIALS


1 VNXB54DP25F VNX5400 DPE 25X2.5" DRIVE SLOTS-FLD IN 2 VNXB6GSDAE15F VNXB 15X3.5 6G SAS EXP DAE-FIELD INST 1 VNXB6GSDAE25F VNXB 25X2.5 6G SAS EXP DAE-FIELD INST 1 VNXB6GSDAE25W VNXB 25X2.5 6G SAS PRI DAE-FIELD INST 32 V4-2S10-900 VNX 900GB 10K SAS 25X2.5 DPE/DAE 1 V-V4-290010 VNX 900GB 10K VAULT 25X2.5 DPE/DAE 7 FLV42S6F-200 VNX 200GB FAST CACHE 25X2.5 DPE/DAE 17 V4-2S07-020 VNX 2TB NL SAS 25X2.5 DPE/DAE 26 V4-2S6F-400 VNX 400GB FAST VP SSD 25X2.5 DPE/DAE 1 C13-250V-ULCSA 250V PWR CRD C13 TO 6-15P UL/CSA 1 VNX54-KIT VNX5400 Documentation Kit=IC 1 VSPBM8GFFEA VNXB 4 PORT 8G FC IO MODULE PAIR 1 ESRS-GW-200 EMC SECURE REMOTE SUPPORT GATEWAY CLIENT 1 APS-1-LS LS FOR APS = ID 1 RP-LS RECOVERPOINT LICENSE SOLUTION


1 456-104-620 RP/SE REM FOR V53 V54=IC 1 456-104-615 RP/SE LOC FOR V53 V54= IC 1 456-105-137 AppSync for VNX5400 =IC 1 456-105-142 Replication Manager for VNX5400 =IC 34 VNXBOECAPTB VNXB OE PER TB HI CAPACITY 42 VNXBOEPERFTB VNXB OE PER TB PERFORMANCE 1 VNXOE-5400 VNX5400 Operating Environment 1 EPAK-VNX5400 VNX5400 Total Efficiency Pack=IC 1 UNISB-VNX5400 VNX5400 Unisphere Block Suite=IC 1 ESA-VNX5400 EMC Storage Analytics VNX5400 Suite=IC 1 PSINST-ESRS ZERO DOLLAR ESRS INSTALL 1 CE-VALPAKVNX VNX SOL. (FAST; LOCAL PROTECT) VALUEPAK 1 M-ENHSWE-001 ENHANCED SW SUPPORT

4.6.5.3 NIMBLE SAN BILL OF MATERIALS

Model Pipe HD SSD Support

CS500 FC 40T 4T 3 Years

4.6.5.4 TEGILE SAN BILL OF MATERIALS


1 T3700 Tegile Intelligent Flash Array - All Flash Dual Controller; 4 * Xeon E5-2450, 192 GB memory, 24 TB SSD; Full SW license, Raw Capacity: 24 TB

2 ESH-20 Tegile ESH-20 Expansion Shelf; 1500 GB SSD, Raw Capacity: ˜18 TB 2 UPG-10CU-10 GbaseT 10Gbit Ethernet 10GBaseT Upgrade 2 UPG-8FC 8Gbit Fibre Channel Card Upgrade 2 ESH-20-3YR-NBD 3 Years Tegile ESH-20 Maintenance, NBD parts, 7 * 24 call support 1 3 Years Tegile T3700 Maintenance, NBD parts, 7 * 24 call support 1 Storage Solution Implementation Services. Includes travel and ancillary

expenses, and accounts for preparatory work in support of the implementation.



4.7.1 CAPACITY

a) Please describe your Compression and Deduplication support. b) Describe Thin Provisioning capabilities of the proposed system.

i. Does Thin Provisioning impact the performance of the array? ii. Do manufacturer whitepapers on provisioning document performance impacts from using Thin

Provisioning on high performance volumes such as databases, or even suggest Thin not be used on high performance volumes?

iii. Can the array “Thin” VMware volumes provisioned as EagerZeroedThick? iv. Are there any limitations to snapshots/replication or any other features for Thin Provisioned

volumes? c) Describe anything that pertains to capacity not included above that differentiates your solution from that

of others.


4.7.2 TIERING

a) EGRPS requires that your proposal examine the subject of tiering data among varying speeds of disks. Explain why your solution does or does not include tiering.

b) Detail the number and type of disks, disk speed, block size, and access time of each tier. c) If tiered automatically:

i. How frequently is usage scanned? ii. How frequently is data moved among the tiers?

iii. How large are the blocks of data moved among the tiers? iv. Describe how tiering can be customized to suit EGRPS’s needs.

4.7.3 CACHE

a) How does your array handle Cache? Is it full read/write, read only, or writes only? b) Can a portion of the SSD tier be used for cache? Does it require specific drives dedicated to cache or can a

portion of the capacity be dynamically assigned to cache? c) Explain your proposed solution’s use of cache and SSDs. d) Where are data optimization operations like garbage collection performed? e) What are the cache hit ratios in an array similar to the one specified?

4.7.4 PHYSICAL HARDWARE

a) Describe your solution’s use of controllers. b) Describe the Mean Time Between Failures (MTBF) of each disk type in your response. c) Describe the disk shelves including their physical size, number of drives they can contain, types of drives

they can contain, connectivity, power, and cooling requirements. d) What is the manufacturer and model of the SSD drives in your solution? What is the stated endurance of

the drive (in MB, GB, or TB)? e) Explain your solution's layout per shelf of disks. f) Define the total number of IOPS for the proposed solution. g) Describe redundant and/or hot-swappable components of your proposed solution (i.e. Raid Controllers,

PSU’s, etc.). h) Explain how non-disruptive maintenance is achieved. i) Explain how your solution addresses the addition of disks, shelves, and controllers. j) Describe anything that pertains to the physical characteristics of your solution not included above that

differentiates it from that of others. k) Describe the controller architecture of the proposed system. Is it Dual Controller? Active/Passive versus

Active/Active versus Full Mesh Active? l) Describe how hot spare drives or spare capacity is used in the solution. Are separate spare drives

required for SSDs used for data storage versus SSDs used for cache?

4.7.5 REDUNDANCY

a) Describe all redundant features of your proposed solution. Include a description of the elimination of all single points of failure.

b) Describe the number of spares drives included in your solution and how they can be brought online in the event of a drive failure.

c) Describe the solution’s ability to recover from hardware failures of various components in your solution. d) Detail the RAID levels or other technology that your proposed solution uses to achieve resilience. e) Explain the amount of raw storage that is consumed by your redundancy method. f) Describe anything that pertains to spare drives not included above that differentiates your solution from

that of others.


4.7.6 SUPPORT


of others.

4.7.7 WARRANTY

a) Detail your proposed solution’s hardware warranty. b) Detail the SLA (Service Level Agreement) included in your proposed solution. Include the time for

replacement parts to arrive and be installed. c) Explain the levels of the warranty proposed. Include software and hardware that is covered. d) Explain which updates and upgrades are included, how notifications about updates are made, and the

process of applying updates to your proposed solution. e) Explain the availability of an onsite engineer and the conditions under which one would be dispatched. f) Describe anything that pertains to Warranty/Maintenance not included above that differentiates your


4.7.8 MANAGEMENT

b) Describe the process of managing your solution. c) Describe key features of the management system. d) Explain the types of management interfaces available for your solution. Does it include a mobile

(iOS/Android) application? e) Detail your solution’s integration with VMware. f) Does the proposed storage array support VMware vVols?

i. If so, what vVol based services does the array support and how many total vVols? ii. If not, is vVol support scheduled to be added to the array specified?

i. If so, will vVol support cost EGRPS money to add (either hardware or software)? ii. If so, will adding vVol support cause array downtime or be data destructive?

iii. If not, why will vVol support not be added to the aray? g) Explain the reporting features of your proposed solution. h) Explain notification capabilities of your proposed solution. i) Describe anything that pertains to management not included above that differentiates your solution from

that of others.

4.7.9 CONNECTIVITY

a) Does your solution include iSCSI in addition to fiber channel natively? b) Explain the ability of the storage system to support SAN/NAS protocols such as Fibre Channel, iSCSI, CIFS,

NFS etc. c) Detail all connectivity options available for the array including those that are not requested in this

document. d) Describe the solutions multipath support specific to SUSE Enterprise Linux 11/12, VMware vSphere ESX

5.5/6, and Windows 2008/2012 Server. e) Describe anything that pertains to connectivity not included above that differentiates your solution from

that of others.

4.7.10 SNAPSHOTS/DATA PROTECTION

a) Describe your solution’s ability to take snapshots. b) Detail your solution’s ability to point to and recover a snapshot. c) Describe anything that pertains to snapshots not included above that differentiates your solution from

that of others.


4.7.11 DEPLOYMENT

a) Detail the process of deploying the new solution and migrating data from our current storage. b) Describe the involvement of project managers, engineers, and others in the deployment. c) Detail the time required to install your proposed solution. d) Describe anything that pertains to the deployment not included above that differentiates your solution


4.7.12 TRAINING

a) Describe the training required for a minimum of one person to manage, maintain, and upgrade the proposed storage system.


of others.

4.7.13 SOFTWARE

a) Describe all software features, included and optional, available in your proposed solution.

4.7.14 SHIPPING

a) What is the typical lead time required to deliver components similar to those listed in this category? b) What is the estimated delivery date of all of the components listed in this category to East Grand Rapids

Public Schools (assuming a Purchase Order is received by the winning party on April 21, 2015)? c) Will the components be shipped directly from the manufacturer? If not, please describe the shipping

process from the manufacturer to East Grand Rapids Public Schools?


5 WIRED NETWORK INFRASTRUCTURE

5.1 SUMMARY

EGRPS is looking to replace and upgrade the district’s current wired network infrastructure. This document is seeking proposals to upgrade the current 10Gbps core layer to 40Gbps, 4Gbps LACP distribution layer to 10Gbps, and mixed 100Mbps/1Gbps/POE/non-POE edge ports to all 1Gbps POE+ (802.3at). The proposal must include new layer 7 or application visibility capabilities. This document also contains a new “Classroom Layer”. The Classroom Layer will be installed in all 168 teaching spaces at EGRPS. This layer includes a single switch that will provide a minimum of 8 gigabit 802.3at POE+ ports and be rack mountable or sit securely on a shelf. The layer will connect end user devices (laptops & desktops) as well as AV integration equipment in each teaching space. The Classroom Layer will connect to the Edge Layer via a single gigabit Ethernet connection. EGRPS personnel will configure all necessary components with assistance from the awarded vendor if required. The district is also asking responses to include pricing to “rack and stack” the items included in this category. EGRPS expects the new wired network solution to be 100% operational by August 15, 2015.

5.2 SITES OF WORK

The products specified in this section will be shipped to and staged in the first floor Technology Services office at James E. Morse Administration Building at Woodcliff Center (also referred to as “District Office”) (see figure 22). Products will then be moved by EGRPS personnel or awarded vendor personnel, if “rack and stack” services are being provided, to the final installation destination. This is subject to change. EGRPS will confirm with the winning vendor the ship to, staging, and install locations once the project has commenced.

5.2.1 BRETON DOWNS ELEMENTARY SCHOOL

2500 Boston Street, SE Grand Rapids, MI 49506 Phone: 616-235-7552 Fax: 616-235-6733 Principal: Dr. Caroline Breault-Cannon Secretary: Mrs. Lisa Rogers Normal Hours: Monday-Friday, 7:30 AM to 4 PM Summer Hours: Monday-Friday, 7:30 AM to 3 PM Note: Does not have a loading dock See figure 15

5.2.2 LAKESIDE ELEMENTARY SCHOOL

2325 Hall Street, SE Grand Rapids, MI 49506 Phone: 616-235-7553 Fax: 616-235-3915


Principal: Mr. Craig Weigel Secretary: Mrs. Mary Buzalski Normal Hours: Monday-Friday, 7:30 AM to 4 PM Summer Hours: Monday-Friday, 7:30 AM to 3 PM Note: Does not have a loading dock See figure 16

5.2.3 WEALTHY ELEMENTARY SCHOOL

1961 Lake Drive, SE Grand Rapids, MI 49506 Phone: 616-235-7550 Fax: 616-235-3918 Principal: Mr. Anthony Morey Secretary: Mrs. Deanna Allchin Normal Hours: Monday-Friday, 7:30 AM to 4 PM Summer Hours: Monday-Friday, 7:30 AM to 3 PM Note: Does not have a loading dock See figure 17


2425 Lake Drive, SE Grand Rapids, MI 49506 Phone: 616-235-7551 Fax: 616-235-7587 Principal: Mr. J. Peter Stuursma Assistant Principal: Mr. William Behrendt Secretary: Mrs. Evon Roberts Normal Hours: Monday-Friday, 7:30 AM to 4 PM Summer Hours: Monday-Friday, 7:30 AM to 3 PM Note: Does not have a loading dock See figure 18

5.2.5 EAST GRAND RAPIDS HIGH SCHOOL

2211 Lake Drive, SE Grand Rapids, MI 49506 Phone: 616-235-7555 Fax: 616-235-8853 Principal: Mrs. Jennifer Fee


Assistant Principal: Mr. Steven Wojciechowski Secretary: Mrs. Anne Genthe Normal Hours: Monday-Friday, 7:30 AM to 4 PM Summer Hours: Monday-Friday, 7:30 AM to 3 PM Note: Does have a standard height loading dock and a non-standard height loading dock. See figures 19, 20, & 21

5.2.6 JAMES E. MORRIS ADMINISTRATION BUILDING AT WOODCLIFF CENTER (“DISTRICT

OFFICE”)

2915 Hall Street, SE Grand Rapids, MI 49506 Phone: 616-235-3535 Fax: 616-235-6730 Superintendent: Dr. Sara Shubel Assistant Superintendent for Instruction: Mrs. Jeanne Glowicki Assistant Superintendent for Business: Mr. Kevin Philipps Normal Hours: Monday-Friday, 7:30 AM to 4:30 PM Summer Hours: Monday-Friday, 7:30 AM to 4:30 PM Note: Does not have a loading dock See figure 22

5.3 CURRENT WIRED NETWORK SOLUTION

EGRPS Core Layer is configured in a star bus topology with EGR Middle School at the center of the star. The district has 12 strands of singlemode and multimode fiber from EGR Middle School to Lakeside Elementary, Wealthy Elementary, EGR High School, and District Office and 12 strands of singlemode from EGR Middle School to Breton Downs Elementary. The current core switch is an Extreme Networks (formerly Enterasys Networks, herein referred to as “Extreme”) N7 core chassis switch with 10 10GBase-LRM, 2 10GBase-CX4, and 96 1000Base-T ports. The Distribution Layer at Breton Downs Elementary connects b-idf1 to b-idf2 via 2 x 1000Base-T LACP copper links. b-idf1 is a mix of Extreme C2/C3 series switches and b-idf2 is all B3 series switches. The Distribution Layer at Wealthy Elementary connects w-idf1 to maint-idf1 via 2 x 1000Base-T LACP copper links. w-idf1 is a mix of Extreme C2/C3 series switches and maint-idf1 is a D2 series switch. The Distribution Layer at EGR Middle School connects core to ms-idf2/3/4/5/6 via 2 x 1000Base-SX LACP multimode fiber links and to ms-idf1 via 2 x 1000Base-T LACP copper links. core is the N7 chassis described above and ms-idf1/2/3/4/5/6 are all Extreme B3 series switches. The Distribution Layer at EGR High School connects hs-idf1 to hs-idf2/3/4/5/6 via 2 x 1000Base-SX LACP multimode fiber links. hs-idf7/8/9 are connected to hs-idf2 via a single 1000Base-SX multimode fiber link. hs-idf1 is a mix of Extreme C2/C3 series switches, hs-idf2/3/4/5/6/7 are all B3 series switches, and hs-idf8/9 are both D2 series switches. The Edge Layer at all buildings is a mix of 100Mbps/1Gbps/POE/non-POE edge ports.


The district uses an Extreme NAC to authenticate wired and wireless users using PEAP and MS-CHAPv2 protocols. The NAC uses the district’s Novell eDirectory LDAP directory as a user source. Upon authentication, users are assigned the appropriate VLAN and other policies like TOS, COS, and network/port acl’s are applied using Extreme’s Policy Manager. The NAC provides a “pseudo single sign-on” with the districts Palo Alto PA-3020 NGFW perimeter firewall and iboss Web/Application/Bandwidth Management 14600 by sending authentication and de-authentication notices from the NAC to both of the appliances. Extreme’s NetSight Suite is used to provide a single pane of glass view of all functions of the wired and wireless network.

5.4 ACCEPTABLE MANUFACTURERS

a) Cisco b) Extreme Networks c) HP

5.5 TERMS

a) The systems must be manufactured, configured and tested in an ISO 9001:2000 registered facility. b) The system must be UL listed. c) The system must be FCC approved for commercial use. d) System must be Energy Star compliant. Bidders are required to provide the electrical consumption/output

for each type of component. e) All components origin must be from the specified vendor listed. Voluntary alternates will be evaluated on

an individual basis. f) Each component will be required to have identical chipsets and components for each model described.

Please define how this will be validated. g) Each component must be from the Original Equipment Manufacturer (OEM) throughout the entire

hardware and warranty periods associated with the component. h) Owner reserves the right to have a third party audit all components and warranty terms at any time

throughout the contracted period. i) Owner may adjust the total number of edge Ethernet ports specified in this category by +/-25%. j) Include all modules and stacking cables necessary for configuration.


5.6.1 COMMON SPECIFICATIONS

a) Default VLAN support b) MAC Authentication Bypass c) Multi-Authentication d) RFC 3580 VLAN Assignment e) RADIUS/TACACS+ f) Basic RADIUS dictionary (Filter-ID attribute) g) 802.1x User Authentication (EAP) h) Downloadable ACLs i) Web-based Administration j) Secure Remote Administration (SSH) k) Access Control Lists (ACL) l) SNMP v1/v2c/v3 m) IPv6 support n) 802.1d, 802.1w, & 802.1s Spanning Tree o) IGMP snooping support


p) DHCP snooping

5.6.2 LAN MANAGEMENT SOFTWARE REQUIREMENTS

a) Device Discovery b) Automated switch deployment and configuration c) Network Topology Maps d) VLAN Management e) MIB import/export and management f) SMTP Alarms and Events

5.6.3 NETWORK ACCESS CONTROL (NAC) REQUIREMENTS

a) EAP and MS-CHAPv2 support b) Novell eDirectory and Microsoft Active Directory support c) Guest account management d) Device registration and session-based user login e) Interoperability with Microsoft NAP and Trusted Computing Group TNC f) Automatic endpoint discovery and location tracking by MAC, IP, user, or connection point g) Support for ChromeOS, iOS, Linux, Mac, and Windows client operating systems h) Integration with iboss Web/Application/Bandwidth Management appliance and Palo Alto NGFW a plus

5.6.4 NETWORK TRAFFIC ANALYTICS AND OPTIMIZATION REQUIREMENTS

a) Layer 4 through 7 traffic monitoring and analytics b) IP flow monitoring c) Application fingerprinting d) Network and application response time reporting e) Placed at Core (40Gbps) or Distribution (10Gbps) Layer

5.6.5 CORE LAYER REQUIREMENTS

a) Provide 40Gbps Ethernet connections to Breton Downs Elementary, Lakeside Elementary, Wealthy Elementary, High School, and District Office from Middle School over district owned 8.3/125 micron simplex singlemode fiber.

b) Provide 40Gbps QSFP+ slot to connect to Blade System specified in “3 Blade System Infrastructure”. c) Provide 10Gbps SFP+ slot to connect to SAN system specified in “4 Storage Area Network Infrastructure”. d) Provide Gigabit Ethernet copper connections to network devices located in data center. 802.3at POE+ is

not required, but would be considered. e) Fibre Channel over Ethernet (FCoE) support. f) CoreFlow II, NetFlow v5/9, or sFlow v5 support. g) Policy-based routing


Figure 1


Figure 2

5.6.6 DISTRIBUTION LAYER REQUIREMENTS

a) Provide in building 10Gbps Ethernet connections to IDF cabinets in Breton Downs Elementary, Middle School, and High School over district owned 62.5/125 micron simplex multimode fiber.


Figure 3


Figure 4


Figure 5


Figure 6


Figure 7


Figure 8


Figure 9


Figure 10

5.6.7 EDGE LAYER REQUIREMENTS

a) Provide 802.3at POE+ Gigabit Ethernet copper connections to end user devices, printers, access points, etc.

b) EGRPS is unable to specify a total watt per switch at this time. EGRPS personnel are currently working with their construction (OAK) and architecture/design (GMB) partners on two projects that will substantially grow the existing POE requirements. That is why this document is seeking to upgrade all ports to POE+. The actual power usage will be determined and calculated at a later date.

5.6.8 CLASSROOM LAYER REQUIREMENTS

a) Provide 8 802.3at POE+ Gigabit Ethernet copper connections to connect end user devices and AV equipment in classroom cart in 168 teaching spaces at EGRPS.

b) Switch should be capable of being mounted in a standard two pole 19” rack or sit securely on a rack mount shelf.

c) EGRPS prefers that the switch not require a fan for cooling. If a fan is required, the fan acoustic noise cannot exceed 10 dB(A) Sound Pressure (LpA) measured in accordance with ISO 7770:2010(E).


5.6.9 SWITCH PORT COUNT REQUIREMENTS 40GBase-

LR4 40GBase-

T 40GBase

QSFP+ 10GBase-

LRM 10GBase-

T 10GBase

SFP+ 1000Base-T POE+

1000Base-T

1000Base-SX

core 5 1 2 0 0 1 0 72 0

do-idf1 1 0 0 0 0 0 96 0 0

hs-idf1 1 0 0 5 0 1 192 0 0

hs-idf2 0 0 0 1 0 0 192 0 3

hs-idf3 0 0 0 1 0 0 48 0 0

hs-idf4 0 0 0 1 0 0 192 0 0

hs-idf5 0 0 0 1 0 0 144 0 0

hs-idf6 0 0 0 1 0 0 48 0 0

hs-idf7 0 0 0 0 0 0 48 0 2

hs-idf8 0 0 0 0 0 0 24 0 2

hs-idf9 0 0 0 0 0 0 24 0 2

ms-idf1 0 1 0 6 0 0 144 0 0

ms-idf2 0 0 0 1 0 0 144 0 0

ms-idf3 0 0 0 1 0 0 72 0 0

ms-idf4 0 0 0 1 0 0 72 0 0

ms-idf5 0 0 0 1 0 0 72 0 0

ms-idf6 0 0 0 1 0 0 72 0 0

b-idf1 1 0 0 1 0 0 192 0 0

b-idf2 0 0 0 1 0 0 96 0 0

l-idf1 1 0 0 0 0 0 288 0 0

w-idf1 1 0 0 0 0 0 288 0 0

maint-idf1

0 0 0 0 0 0 24 0 0

5.6.10 WARRANTY

a) Minimum 3-year next business day response time manufacturer's warranty required for all components of this category.

b) Provide optional 5-year next business day response time manufacturer's warranty required for all components of this category.

c) All on-site warranty work shall be performed by personnel or representatives of the manufacturer or reseller who are authorized and certified to perform the work required.

d) All documents and/or submittals required by the manufacturer to register the components for warranty must be provided.




5.6.11.1 CISCO WIRED NETWORK BILL OF MATERIALS

Will be included in Addendum 1

5.6.11.2 EXTREME NETWORKS WIRED NETWORK BILL OF MATERIALS

Will be included in Addendum 1

5.6.11.3 HP WIRED NETWORK BILL OF MATERIALS


6 JG894A HP FF 5700-48G-4XG-2QSFP+ Switch

12 JC683A HP 58x0AF Frt(ports)-Bck(pwr) Fan Tray

6 JG900A HP 58x0AF 300W AC Power Supply

5 JG661A HP X140 40G QSFP+ LC LR4 SM Transceiver

6 U4VF3E HP 3y 24X7 HP FF 5700 FC Service [for JG894A]

1 JG900A ABA INCLUDED: HP 58x0AF 300W AC Power Supply U.S. - English localization

4 JD092B HP X130 10G SFP+ LC SR Transceiver

2 JG325B HP X140 40G QSFP+ MPO SR4 Transceiver

69 JD096C HP X240 10G SFP+ SFP+ 1.2m DAC Cable

19 JD097C HP X240 10G SFP+ SFP+ 3m DAC Cable

2 QK732A HP Premier Flex LC/LC OM4 2f 1m Cbl

49 JG937A HP 5130-48G-PoE+-4SFP+ EI Switch

14 JD092B HP X130 10G SFP+ LC SR Transceiver

13 JG937A ABA INCLUDED: HP 5130-48G-PoE+-4SFP+ EI Switch U.S. - English localization

5 JD118B HP X120 1G SFP LC SX Transceiver

8 JG081C HP X240 10G SFP+ SFP+ 5m DAC Cable

6 JG936A HP 5130-24G-PoE+-4SFP+ EI Switch

5 JG936A ABA INCLUDED: HP 5130-24G-PoE+-4SFP+ EI Switch U.S. - English localization

2 JD118B HP X120 1G SFP LC SX Transceiver

2 U7PM8E HP 3y 4h Exc513024GPoE4SFPEISwch FC SVC [for JG936A]

2 UX117E HP Networks 36xx 51xx Startup SVC [for JG936A]

3 JG510A HP 5900AF-48G-4XG-2QSFP+ Switch

3 JC680A HP 58x0AF 650W AC Power Supply

6 JC683A HP 58x0AF Frt(ports)-Bck(pwr) Fan Tray

5 JG661A HP X140 40G QSFP+ LC LR4 SM Transceiver

3 U3GA3E HP 3y 24x7 HP 5900AF-48 2QSFP Swt FC SVC [for JG510A]

1 JG328A HP X240 40G QSFP+ QSFP+ 5m DAC Cable

1 JG327A HP X240 40G QSFP+ QSFP+ 3m DAC Cable

168 J9774A HP 2530-8G-PoE+ Switch

1 JG747AAE HP IMC Std SW Plat w/ 50 Nodes E-LTU

3 JG749AAE HP IMC Std and Ent Add 50-node E-LTU

1 JG752AAE HP IMC UAM SW Mod w/ 50-user E-LTU

1 JG753AAE HP IMC UAM SW Mod Add 50-user E-LTU

1 JG750AAE HP IMC NTA SW Mod w/ 5-node E-LTU

1 JG751AAE HP IMC NTA SW Mod Add 5-node E-LTU


1 U4AR0E HP 3y 24x7 IMC Std SW Plat ELTU FC SVC [for JG747AAE]

1 H7L38A1 HP IMC Startup Service [for JG747AAE]

3 U4AN8E HP 3y 24x7 IMC Std and Ent Add E- FC SVC [for JG749AAE]

1 U4AQ1E HP 3y 24x7 HP IMC UAM SW Mod ELTU FC SVC [for JG752AAE]

1 U4AM5E HP 3y 24x7 IMC UAM SW Mod Add E-L FC SVC [for JG753AAE]

1 U4AQ0E HP 3y 24x7 HP IMC NTA SW Mod ELTU FC SVC [for JG750AAE]

1 U4AN9E HP 3y 24x7 IMC NTAMod Add E- FC SVC [for JG751AAE]



5.7.1 LAN MANAGEMENT SOFTWARE

a) Does the LAN Management Software included provide a “single pane of glass” view and monitoring of all items included in this section?

b) Can the LAN Management Software manage and monitor competitor’s network electronics and devices? c) How is the LAN Management Software licensed?

5.7.2 NETWORK ACCESS CONTROL (NAC)

a) Does the NAC specified in your response integrate with iboss Web/Application/Bandwidth Management appliance 14600 or Palo Alto PA-3020 NGFW? If so, please describe the capabilities of the integration.

b) Describe how the NAC solution identifies end devices and operating systems. c) Describe anything that pertains to the NAC not included above that differentiates your solution from that

of others.

5.7.3 FLOW-BASED SWITCHING ARCHITECTURE

a) What type of flow-based (CoreFlow2, NetFlow, sFlow, etc.) switching architecture is supported in the products in your proposal?

b) Describe anything that pertains to flow-based switching architecture not included above that differentiates your solution from that of others.

5.7.4 CORE LAYER

a) Describe how the core switch can be expanded and what the maximum port counts for each port type are.

b) Describe how your core switch is redundant and if there are any single points of failure. c) Does the core switch support using 10Gbps links as a failover to the 40Gbps link? d) Describe anything that pertains to the Core Layer not included above that differentiates your solution


5.7.5 DISTRIBUTION LAYER

a) Describe how your solution supports 10Gbps Ethernet over 62.5 micron multimode fiber. b) Describe anything that pertains to the Distribution Layer not included above that differentiates your



5.7.6 EDGE LAYER

a) Will the switches specified in this category support the unratified 2.5/5Gbps (MGBASE-T) standard? If not, how will the switches support 802.11ac Wave 2 access points?

b) Describe anything that pertains to the Edge Layer not included above that differentiates your solution from that of others.

5.7.7 CLASSROOM LAYER

a) Does your proposal include rack mount hardware for the Classroom Layer switch? If not, what mounting options are available?

b) Describe anything that pertains to the Classroom Layer not included above that differentiates your solution from that of others.

5.7.8 DEPLOYMENT

a) Can “rack and stack” services be included? If so, at what cost? b) Describe the involvement of project managers, engineers, and others in the deployment. c) Detail the time required to install your proposed solution. d) Describe anything that pertains to the deployment not included above that differentiates your solution


5.7.9 TRAINING

a) Describe the training required for a minimum of one person to manage, maintain, and upgrade the proposed wired network.


of others.

5.7.10 SUPPORT


of others.

5.7.11 WARRANTY

a) Detail your proposed solution’s hardware warranty. b) Detail the SLA (Service Level Agreement) included in your proposed solution. Include the time for

replacement parts to arrive and be installed. c) Explain the levels of the warranty proposed. Include software and hardware that is covered. d) Explain which updates and upgrades are included, how notifications about updates are made, and the

process of applying updates to your proposed solution. e) Explain the availability of an onsite engineer and the conditions under which one would be dispatched. f) What is the annual cost of renewing maintenance, support, and all other agreements related to items

specified in this section after the three or five year agreement expires based on current pricing models? EGRPS understands that this is a projection based on current numbers and may change by renewal time.

g) Describe anything that pertains to Warranty/Maintenance not included above that differentiates your solution from that of others.

5.7.12 SHIPPING

a) What is the typical lead time required to deliver components similar to those listed in this category?


b) What is the estimated delivery date of all of the components listed in this category to East Grand Rapids Public Schools (assuming a Purchase Order is received by the winning party on April 21, 2015)?

c) Will the components be shipped directly from the manufacturer? If not, please describe the shipping process from the manufacturer to East Grand Rapids Public Schools?


6 BID PROPOSAL FORMS


6.1 INTENT TO BID FORM

Please complete and fill out this form if you intend to submit a proposal for this project. Only those responders who fill out this form will be notified of any required addenda or owner responses to bidder questions. Please return this form by email no later than April 3, 2015. Please note, this form is not required to bid on this project. This form is only required if you wish to receive any addenda or owner responses to bidder questions. Company Information

Name:

Address Line 1:

Address Line 2:

City, State, and Zip:

Primary Contact Information

Name:

Phone #:

Fax #:

Email Address:

Form Submittal Instructions Please submit this form via fax or email to the contact information listed below. Jeff Crawford Manager of Networking and Security East Grand Rapids Public Schools 2915 Hall St. SE Grand Rapids, MI 49506 Email: [email protected] Email the form in .doc, .docx, or .pdf format and please use the subject “Intent to Bid: Server, Storage, & Wired Networking Infrastructure March 2015 RFP”.



6.2 BID SUBMITTAL INSTRUCTIONS

All of the following pages are required. If any of the following pages are incomplete or missing the bid response could be determined to be incomplete and thus not considered. Bids may be packaged in one of the following ways: Email*

1. A single email with a single pdf or zip file of multiple files in a format the district supports (Adobe PDF, Microsoft Office, common image file types).

2. Multiple email messages with pdf or zip file of multiple files in a format the district supports (Adobe PDF, Microsoft Office, common image file types). The date and time that the last email is received is the effective submittal time.

*Please note that the district email system has a 30MB attachment size limit Mail or Hand Delivered

1. Blend of paper and electronic (preferred method for mail or hand delivery). Only the required forms are submitted on paper. All other required documentation is included on CD, DVD, or Flash Memory Stick. Here at East Grand Rapids Public Schools we support Adobe PDF and Microsoft Office formats.

2. All on paper. All required forms, answers to questions, required cut sheets, etc. may all be submitted on paper.

Bids must be sent via email, mail, or hand delivered. Bids must be sealed and clearly marked with “Server, Storage, & Wired Networking Infrastructure March 2015 RFP”. Bids sent via email shall be sent to [email protected]. Bids sent via mail shall be sent to: East Grand Rapids Public Schools c/o Jeff Crawford 2915 Hall St. SE Grand Rapids, MI 49506

6.3 BID SUBMITTAL CHECKLIST

Please use the checklist below to ensure that all required documents are included in your response. General Forms

☐ Bid Proposal Form

☐ Michigan Familial Relationship Statement

☐ Michigan Iran Economic Sanctions Act

☐ References

3 Blade System Infrastructure

☐ General Questions

☐ Bill of Materials which includes unit prices (supplied by bidder)

☐ Cut Sheets, specifications, and other supporting materials (supplied by bidder)

4 Storage Area Network Infrastructure




5 Wired Network Infrastructure






6.4 BID PROPOSAL FORM

Bid To: East Grand Rapids Public Schools Board of Education 2915 Hall St. SE Grand Rapids, MI 49506 Bid From:

Project: Server, Storage, & Wired Networking Infrastructure March 2015 RFP The undersigned, having familiarized themselves with all local conditions affecting the cost of work, and having examined the site and all applicable Bidding Documents herein, and herein referenced, including, but not limited to, all addenda issued thereto, hereby propose to furnish all labor, material, equipment, applicable taxes and services required for proper completion of each of the following categories of this project for the sum of:

Not Bidding

Category

☐

Title: Blade System Infrastructure with Three Year Warranty Option

$

Said amount written above constituting the Base Bid

Title: Blade System Infrastructure with Five Year Warranty Option

$

Said amount written above constitutes Base Bid + Five Year Warranty Option

Not Bidding

Category

☐

Title: Storage Area Network Infrastructure with Three Year Warranty Option

$

Said amount written above constitutes Base Bid

Title: Storage Area Network Infrastructure with Five Year Warranty Option

$


Not Bidding

Category

☐

Title: Wired Networking Infrastructure with Three Year Warranty Option

$

Said amount written above constitutes Base Bid

Title: Wired Networking Infrastructure with Five Year Warranty Option

$


6.4.1 TAXES

Bid sum includes all applicable taxes. The project is not subject to Michigan Sales Taxes for materials.

6.4.2 ALLOWANCES


Base bid includes all applicable allowance cost(s) as set forth herein.

6.4.3 BID SECURITY

Accompanying this Bid, as required herein, is a bid security in the form of Certified Check/Cashier’s Check/Bidder’s Bond in the amount of (5% of total cost):

payable to the Owner, which it is agreed, shall be retained as liquidated damages, not as a penalty, by the Owner, if the undersigned fails to execute the Contract in conformity with the form of Contract incorporated and referenced herein and fails to furnish specified bonds within ten (10) days after date of issuance of a Letter of Intent or Notice to Proceed to the undersigned. If awarded the Contract, the undersigned agrees to commence work within ten (10) calendar days after date of issuance of a Purchase Order form, which shall be considered as the Notice to Proceed, and agrees to complete the work in accordance with the schedule herein.

6.4.4 FAMILIAL DISCLOSURE

Accompanying this Bid, as required herein, is a legally executed and notarized Michigan Familial Disclosure Statement.

6.4.5 EXCEPTIONS

Bidder takes no exception to terms, conditions, specifications and/or any other requirements herein unless expressly noted, and in writing to the Owner prior to the Bid Due Date of April 13, 2015 @ 2:00 PM EST.

6.4.6 AGREEMENT

The undersigned agree(s) to provide the post-bid information required within ten (10) days after notification of a Letter of Intent and to execute an agreement for work covered by this Bid Proposal on the Owner’s standard Purchase Order for which terms and conditions are expanded to include all Bidding Documents and subsequent addenda issued thereto. In submitting this bid, it is understood that the Owner reserves the right to reject any or all bids. It is further agreed that this bid is binding for a period of Ninety (90) days from the opening thereof.

Firm:

Address:

Phone Number:

Fax Number:

Printed Name:

Title:

Signed:

Date:

$ ,


6.5 MICHIGAN FAMILIAL RELATIONSHIP DISCLOSURE STATEMENT

In accordance with Section 1267 of Michigan Revised School Code this sworn and notarized statement of an authorized representative, discloses any familial relationship between the owner and/or any employee of the Bidder, and any member of the project Owner’s governing Board(s) or Superintendent(s). If any conflict of interest is discovered subsequent to submission of bid, written disclosure shall be submitted to the project Owner within seven (7) days of discovery. The project Owner reserves the right to immediately terminate any contract with Bidder upon notification of a conflict of interest. Upon such termination, the project Owner shall compensate Bidder only for the value of any goods or services provided to the Owner prior to such termination as determined by the Owner.

Please select only one box below.

☐

It is hereby acknowledged and certified by Bidder that no familial relationship exists between the owner or any employee of the Bidder and any member of the project Owner’s governing Board(s) or Superintendent(s).

☐

A familial relationship exists between the owner or an employee of the Bidder and a Member of the project Owner’s governing Board(s) or Superintendent(s). The person(s) and the relationship(s) are as follows:

Bidder Board or Superintendent

Bidder Authorized Representative

Bidder:

Print Name:

Title:

Signature:

Subscribed and sworn this day of , 2014.

In the County of State of

Seal or Stamp:

By

Notary Public Signature

My commission expires on:


6.6 MICHIGAN IRAN ECONOMIC SANCTIONS ACT

In accordance with Act 517 of 2012 this sworn and notarized statement of an authorized representative, certifies, represents, and warrants that the Bidder is not an “Iran linked business”.

Please select only one box below.

☐

It is hereby acknowledged and certified by Bidder is not an “Iran linked business” within the meaning of the Iran Economic Sanctions Act, Michigan Public Act No. 517 of 2012 (the “Act”), and that in the event the Vendor is awarded a contract / purchase order as a result of the aforementioned Bid Package, the Vendor will not become an “Iran linked business” at any time during the course of performing the Work or any services under the contract.

The Vendor further acknowledges that any person who is found to have submitted a false certification is responsible for a civil penalty of not more than $250,000.00 or 2 times the amount of the contract/purchase order or proposed contract for which the false certification was made, whichever is greater, the cost of East Grand Rapids Public School’s investigation, and reasonable attorney fees, in addition to the fine. Moreover, any person who submitted a false certification shall be ineligible to provide pricing on request for proposals for three (3) years from the date it is determined that the person has submitted the false certification. Bidder Authorized Representative

Bidder:

Print Name:

Title:

Signature:

Subscribed and sworn this day of , 2014.

In the County of State of

Seal or Stamp:

By

Notary Public Signature

My commission expires on:


6.7 REFERENCES

Customer Name:

Address:

Contact:

Phone Number:

Description of Project:

Date Completed:

Customer Name:

Address:

Contact:

Phone Number:


Date Completed:

Customer Name:

Address:

Contact:

Phone Number:


Date Completed:


7 APPENDIXES

7.1 DESIRED BLADE SYSTEM AND SAN SOLUTION

Network

SAN Fabric

New Blade System

New SAN

Network

40Gbs copper

1Gbps copper

8Gbps fiber

Management

Figure 11

7.2 CURRENT BLADE SYSTEM AND SAN SOLUTION


c7000a c7000b

EMC Clarrion/Celerra

Cisco MDS9124 Cisco MDS9124

Cisco 2960G

To Network

20Gbs 802.3ad CX4

4Gbps 802.3ad copper

1Gbps copper

4Gbps fiber

Figure 12

7.3 CURRENT BLADE SYSTEM PHSYICAL LAYOUT

ProLiant C-Class Blade Enclosure

Blade

Slot

Blade

Slot

Blade

Slot

Blade

Slot

Blade

Slot

Blade

Slot

Blade

Slot

Blade

Slot

Blade

Slot

Blade

Slot

Blade

Slot

Blade

Slot

Blade

Slot

Blade

Slot

Blade

Slot

Blade

Slot

Admin Card Slot

I/O Card Slot 8 (Mezzanine 2 and 3)


I/O Card Slot 4 (Mezzanine 1)

I/O Card Slot 2 (LANs 2 and 4)





Power Connectivity Slot

Power Supply

Slot

Power Supply

Slot

Power Supply

Slot

Power Supply

Slot

Power Supply

Slot

Power Supply

Slot

Fan Slot

Enclosure Interlink

UID

Fan Slot Fan Slot Fan Slot Fan Slot Fan Slot Fan Slot Fan Slot Fan Slot Fan Slot

Dynamic Power System

OA/iLO IOIOIUSB

c7000a

Admin Card 456204-B21

IOIOI VGAUSBOA/iLO

BL460c G1 CTO Blade 447707-B21

Sm

all Form

Factor

Disk S

lotS

mall F

orm F

actorD

isk Slot

NC

373i multi-function

Dual P

ort 1GbE

iLO 2 100T

port

1 2

Mezzanine S

lot 2 (x8)

Mezzanine S

lot 1 (x4)

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

Xeon CPU 1

Xeon CPU 0

Internal US

B

Local I/O

Smart ArrayE200i RAID

64MB FIO Cache405102-B21

36GB

10k SA

S S

FF

SP

Disk 375859-

B21

36GB

10k SA

S S

FF

SP

Disk 375859-

B21

Xeon QC E5450 3.00GHz 1333FSB

459489-B21


459489-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

NC

373m D

ual Port 1G

b 406770-B21

QLogic Q

MH

2462 4Gb F

C

403619-B21

128MB BBWCache351580-B21


Sm

all Form

Factor

Disk S

lotS

mall F

orm F

actorD

isk Slot

NC

373i multi-function

Dual P

ort 1GbE

iLO 2 100T

port

1 2

Mezzanine S

lot 2 (x8)

Mezzanine S

lot 1 (x4)

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

Xeon CPU 1

Xeon CPU 0

Internal US

B

Local I/O



36GB

10k SA

S S

FF

SP

Disk 375859-

B21

36GB

10k SA

S S

FF

SP

Disk 375859-

B21


459489-B21


459489-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

NC

373m D

ual Port 1G

b 406770-B21

QLogic Q

MH

2462 4Gb F

C

403619-B21



Sm

all Form

Factor

Disk S

lotS

mall F

orm F

actorD

isk Slot

NC

373i multi-function

Dual P

ort 1GbE

iLO 2 100T

port1 2

Mezzanine S

lot 2 (x8)

Mezzanine S

lot 1 (x4)

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

Xeon CPU 1

Xeon CPU 0

Internal US

B

Local I/O



36GB

10k SA

S S

FF

SP

Disk 375859-

B21

36GB

10k SA

S S

FF

SP

Disk 375859-

B21


459489-B21


459489-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

NC

373m D

ual Port 1G

b 406770-B21

QLogic Q

MH

2462 4Gb F

C

403619-B21



Sm

all Form

Factor

Disk S

lotS

mall F

orm F

actorD

isk Slot

NC

373i multi-function

Dual P

ort 1GbE

iLO 2 100T

port

1 2

Mezzanine S

lot 2 (x8)

Mezzanine S

lot 1 (x4)

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

Xeon CPU 1

Xeon CPU 0

Internal US

B

Local I/O



36GB

10k SA

S S

FF

SP

Disk 375859-

B21

36GB

10k SA

S S

FF

SP

Disk 375859-

B21


459489-B21


459489-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

NC

373m D

ual Port 1G

b 406770-B21

QLogic Q

MH

2462 4Gb F

C

403619-B21



Sm

all Form

Factor

Disk S

lotS

mall F

orm F

actorD

isk Slot

NC

373i multi-function

Dual P

ort 1GbE

iLO 2 100T

port

1 2

Mezzanine S

lot 2 (x8)

Mezzanine S

lot 1 (x4)

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

Xeon CPU 1

Xeon CPU 0

Internal US

B

Local I/O



36GB

10k SA

S S

FF

SP

Disk 375859-

B21

36GB

10k SA

S S

FF

SP

Disk 375859-

B21


459489-B21


459489-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

NC

373m D

ual Port 1G

b 406770-B21



Sm

all Form

Factor

Disk S

lotS

mall F

orm F

actorD

isk Slot

NC

373i multi-function

Dual P

ort 1GbE

iLO 2 100T

port

1 2

Mezzanine S

lot 2 (x8)

Mezzanine S

lot 1 (x4)

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

Xeon CPU 1

Xeon CPU 0

Internal US

B

Local I/O



36GB

10k SA

S S

FF

SP

Disk 375859-

B21

36GB

10k SA

S S

FF

SP

Disk 375859-

B21


459489-B21


459489-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

NC

373m D

ual Port 1G

b 406770-B21



Sm

all Form

Factor

Disk S

lotS

mall F

orm F

actorD

isk Slot

NC

373i multi-function

Dual P

ort 1GbE

iLO 2 100T

port

1 2

Mezzanine S

lot 2 (x8)

Mezzanine S

lot 1 (x4)

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

Xeon CPU 1

Xeon CPU 0

Internal US

B

Local I/O



36GB

10k SA

S S

FF

SP

Disk 375859-

B21

36GB

10k SA

S S

FF

SP

Disk 375859-

B21


459489-B21


459489-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

NC

373m D

ual Port 1G

b 406770-B21



Sm

all Form

Factor

Disk S

lotS

mall F

orm F

actorD

isk Slot

NC

373i multi-function

Dual P

ort 1GbE

iLO 2 100T

port

1 2

Mezzanine S

lot 2 (x8)

Mezzanine S

lot 1 (x4)

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

Xeon CPU 1

Xeon CPU 0

Internal US

B

Local I/O



36GB

10k SA

S S

FF

SP

Disk 375859-

B21

36GB

10k SA

S S

FF

SP

Disk 375859-

B21


459489-B21


459489-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

NC

373m D

ual Port 1G

b 406770-B21



Sm

all Form

Factor

Disk S

lotS

mall F

orm F

actorD

isk Slot

NC

373i multi-function

Dual P

ort 1GbE

iLO 2 100T

port

1 2

Mezzanine S

lot 2 (x8)

Mezzanine S

lot 1 (x4)

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

Xeon CPU 1

Xeon CPU 0

Internal US

B

Local I/O



36GB

10k SA

S S

FF

SP

Disk 375859-

B21

36GB

10k SA

S S

FF

SP

Disk 375859-

B21


459489-B21


459489-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

NC

373m D

ual Port 1G

b 406770-B21



Sm

all Form

Factor

Disk S

lotS

mall F

orm F

actorD

isk Slot

NC

373i multi-function

Dual P

ort 1GbE

iLO 2 100T

port

1 2

Mezzanine S

lot 2 (x8)

Mezzanine S

lot 1 (x4)

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

Xeon CPU 1

Xeon CPU 0

Internal US

B

Local I/O



36GB

10k SA

S S

FF

SP

Disk 375859-

B21

36GB

10k SA

S S

FF

SP

Disk 375859-

B21


459489-B21


459489-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

NC

373m D

ual Port 1G

b 406770-B21



Sm

all Form

Factor

Disk S

lotS

mall F

orm F

actorD

isk Slot

NC

373i multi-function

Dual P

ort 1GbE

iLO 2 100T

port

1 2

Mezzanine S

lot 2 (x8)

Mezzanine S

lot 1 (x4)

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

Xeon CPU 1

Xeon CPU 0

Internal US

B

Local I/O



36GB

10k SA

S S

FF

SP

Disk 375859-

B21

36GB

10k SA

S S

FF

SP

Disk 375859-

B21


459489-B21


459489-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

NC

373m D

ual Port 1G

b 406770-B21



Sm

all Form

Factor

Disk S

lotS

mall F

orm F

actorD

isk Slot

NC

373i multi-function

Dual P

ort 1GbE

iLO 2 100T

port

1 2

Mezzanine S

lot 2 (x8)

Mezzanine S

lot 1 (x4)

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

Xeon CPU 1

Xeon CPU 0

Internal US

B

Local I/O



36GB

10k SA

S S

FF

SP

Disk 375859-

B21

36GB

10k SA

S S

FF

SP

Disk 375859-

B21


459489-B21


459489-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

NC

373m D

ual Port 1G

b 406770-B21


Active Cool 200 Fan

412140-B21

Active Cool 200 Fan

412140-B21

Active Cool 200 Fan

412140-B21

Active Cool 200 Fan

412140-B21

Active Cool 200 Fan

412140-B21

Active Cool 200 Fan

412140-B21

Active Cool 200 Fan

412140-B21

Active Cool 200 Fan

412140-B21

Active Cool 200 Fan

412140-B21

Active Cool 200 Fan

412140-B21

2250W Hot-Plug PS 412138-B21

Single Phase Power Connections 413379-B21

2250W Hot-Plug PS 412138-B21

2250W Hot-Plug PS 412138-B21

2250W Hot-Plug PS 412138-B21

2250W Hot-Plug PS 412138-B21

HP 1/10Gb VC-Enet Module 399593-B211 2 3 4

5 6 7 8

X2X1


5 6 7 8

X2X1


5 6 7 8

X2X1


5 6 7 8

X2X1

HP 4Gb Virtual Connect FC Module 409513-B211 2 3 4



OA/iLO IOIOIUSB

ProLiant C-Class Blade Enclosure

Blade

Slot

Blade

Slot

Blade

Slot

Blade

Slot

Blade

Slot

Blade

Slot

Blade

Slot

Blade

Slot

Blade

Slot

Blade

Slot

Blade

Slot

Blade

Slot

Blade

Slot

Blade

Slot

Blade

Slot

Blade

Slot

Admin Card Slot









Power Connectivity Slot

Power Supply

Slot

Power Supply

Slot

Power Supply

Slot

Power Supply

Slot

Power Supply

Slot

Power Supply

Slot

Fan Slot

Enclosure Interlink

UID

Fan Slot Fan Slot Fan Slot Fan Slot Fan Slot Fan Slot Fan Slot Fan Slot Fan Slot

Dynamic Power System

OA/iLO IOIOIUSB

c7000b


IOIOI VGAUSBOA/iLO


Sm

all Form

Factor

Disk S

lotS

mall F

orm F

actorD

isk Slot

NC

373i multi-function

Dual P

ort 1GbE

iLO 2 100T

port

1 2

Mezzanine S

lot 2 (x8)

Mezzanine S

lot 1 (x4)

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

Xeon CPU 1

Xeon CPU 0

Internal US

B

Local I/O



36GB

10k SA

S S

FF

SP

Disk 375859-

B21

36GB

10k SA

S S

FF

SP

Disk 375859-

B21


459489-B21


459489-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

NC

373m D

ual Port 1G

b 406770-B21

QLogic Q

MH

2462 4Gb F

C

403619-B21



Sm

all Form

Factor

Disk S

lotS

mall F

orm F

actorD

isk Slot

NC

373i multi-function

Dual P

ort 1GbE

iLO 2 100T

port

1 2

Mezzanine S

lot 2 (x8)

Mezzanine S

lot 1 (x4)

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

Xeon CPU 1

Xeon CPU 0

Internal US

B

Local I/O



36GB

10k SA

S S

FF

SP

Disk 375859-

B21

36GB

10k SA

S S

FF

SP

Disk 375859-

B21


459489-B21


459489-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

NC

373m D

ual Port 1G

b 406770-B21

QLogic Q

MH

2462 4Gb F

C

403619-B21



Sm

all Form

Factor

Disk S

lotS

mall F

orm F

actorD

isk Slot

NC

373i multi-function

Dual P

ort 1GbE

iLO 2 100T

port

1 2

Mezzanine S

lot 2 (x8)

Mezzanine S

lot 1 (x4)

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

Xeon CPU 1

Xeon CPU 0

Internal US

B

Local I/O



36GB

10k SA

S S

FF

SP

Disk 375859-

B21

36GB

10k SA

S S

FF

SP

Disk 375859-

B21


459489-B21


459489-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

NC

373m D

ual Port 1G

b 406770-B21

QLogic Q

MH

2462 4Gb F

C

403619-B21



Sm

all Form

Factor

Disk S

lotS

mall F

orm F

actorD

isk Slot

NC

373i multi-function

Dual P

ort 1GbE

iLO 2 100T

port

1 2

Mezzanine S

lot 2 (x8)

Mezzanine S

lot 1 (x4)

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

Xeon CPU 1

Xeon CPU 0

Internal US

B

Local I/O



36GB

10k SA

S S

FF

SP

Disk 375859-

B21

36GB

10k SA

S S

FF

SP

Disk 375859-

B21


459489-B21


459489-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

NC

373m D

ual Port 1G

b 406770-B21

QLogic Q

MH

2462 4Gb F

C

403619-B21



Sm

all Form

Factor

Disk S

lotS

mall F

orm F

actorD

isk Slot

NC

373i multi-function

Dual P

ort 1GbE

iLO 2 100T

port

1 2

Mezzanine S

lot 2 (x8)

Mezzanine S

lot 1 (x4)

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

Xeon CPU 1

Xeon CPU 0

Internal US

B

Local I/O



36GB

10k SA

S S

FF

SP

Disk 375859-

B21

36GB

10k SA

S S

FF

SP

Disk 375859-

B21


459489-B21


459489-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

NC

373m D

ual Port 1G

b 406770-B21



Sm

all Form

Factor

Disk S

lotS

mall F

orm F

actorD

isk Slot

NC

373i multi-function

Dual P

ort 1GbE

iLO 2 100T

port

1 2

Mezzanine S

lot 2 (x8)

Mezzanine S

lot 1 (x4)

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

Xeon CPU 1

Xeon CPU 0

Internal US

B

Local I/O



36GB

10k SA

S S

FF

SP

Disk 375859-

B21

36GB

10k SA

S S

FF

SP

Disk 375859-

B21


459489-B21


459489-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

NC

373m D

ual Port 1G

b 406770-B21



Sm

all Form

Factor

Disk S

lotS

mall F

orm F

actorD

isk Slot

NC

373i multi-function

Dual P

ort 1GbE

iLO 2 100T

port

1 2

Mezzanine S

lot 2 (x8)

Mezzanine S

lot 1 (x4)

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

Xeon CPU 1

Xeon CPU 0

Internal US

B

Local I/O



36GB

10k SA

S S

FF

SP

Disk 375859-

B21

36GB

10k SA

S S

FF

SP

Disk 375859-

B21


459489-B21


459489-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

NC

373m D

ual Port 1G

b 406770-B21



Sm

all Form

Factor

Disk S

lotS

mall F

orm F

actorD

isk Slot

NC

373i multi-function

Dual P

ort 1GbE

iLO 2 100T

port

1 2

Mezzanine S

lot 2 (x8)

Mezzanine S

lot 1 (x4)

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

Xeon CPU 1

Xeon CPU 0

Internal US

B

Local I/O



36GB

10k SA

S S

FF

SP

Disk 375859-

B21

36GB

10k SA

S S

FF

SP

Disk 375859-

B21


459489-B21


459489-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

NC

373m D

ual Port 1G

b 406770-B21



Sm

all Form

Factor

Disk S

lotS

mall F

orm F

actorD

isk Slot

NC

373i multi-function

Dual P

ort 1GbE

iLO 2 100T

port

1 2

Mezzanine S

lot 2 (x8)

Mezzanine S

lot 1 (x4)

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

Xeon CPU 1

Xeon CPU 0

Internal US

B

Local I/O



36GB

10k SA

S S

FF

SP

Disk 375859-

B21

36GB

10k SA

S S

FF

SP

Disk 375859-

B21


459489-B21


459489-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

NC

373m D

ual Port 1G

b 406770-B21



Sm

all Form

Factor

Disk S

lotS

mall F

orm F

actorD

isk Slot

NC

373i multi-function

Dual P

ort 1GbE

iLO 2 100T

port

1 2

Mezzanine S

lot 2 (x8)

Mezzanine S

lot 1 (x4)

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

Xeon CPU 1

Xeon CPU 0

Internal US

B

Local I/O



36GB

10k SA

S S

FF

SP

Disk 375859-

B21

36GB

10k SA

S S

FF

SP

Disk 375859-

B21


459489-B21


459489-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

NC

373m D

ual Port 1G

b 406770-B21



Sm

all Form

Factor

Disk S

lotS

mall F

orm F

actorD

isk Slot

NC

373i multi-function

Dual P

ort 1GbE

iLO 2 100T

port

1 2

Mezzanine S

lot 2 (x8)

Mezzanine S

lot 1 (x4)

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

Xeon CPU 1

Xeon CPU 0

Internal US

B

Local I/O



36GB

10k SA

S S

FF

SP

Disk 375859-

B21

36GB

10k SA

S S

FF

SP

Disk 375859-

B21


459489-B21


459489-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

NC

373m D

ual Port 1G

b 406770-B21



Sm

all Form

Factor

Disk S

lotS

mall F

orm F

actorD

isk Slot

NC

373i multi-function

Dual P

ort 1GbE

iLO 2 100T

port

1 2

Mezzanine S

lot 2 (x8)

Mezzanine S

lot 1 (x4)

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

RAM - PC2-5300 Pair

Xeon CPU 1

Xeon CPU 0

Internal US

B

Local I/O



36GB

10k SA

S S

FF

SP

Disk 375859-

B21

36GB

10k SA

S S

FF

SP

Disk 375859-

B21


459489-B21


459489-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

4GB (2x2GB) RAM 397413-B21

NC

373m D

ual Port 1G

b 406770-B21


Active Cool 200 Fan

412140-B21

Active Cool 200 Fan

412140-B21

Active Cool 200 Fan

412140-B21

Active Cool 200 Fan

412140-B21

Active Cool 200 Fan

412140-B21

Active Cool 200 Fan

412140-B21

Active Cool 200 Fan

412140-B21

Active Cool 200 Fan

412140-B21

Active Cool 200 Fan

412140-B21

Active Cool 200 Fan

412140-B21

2250W Hot-Plug PS 412138-B21

Single Phase Power Connections 413379-B21

2250W Hot-Plug PS 412138-B21

2250W Hot-Plug PS 412138-B21

2250W Hot-Plug PS 412138-B21

2250W Hot-Plug PS 412138-B21


5 6 7 8

X2X1


5 6 7 8

X2X1


5 6 7 8

X2X1


5 6 7 8

X2X1




OA/iLO IOIOIUSB

Figure 13

7.4 CURRENT BLADE SYSTEM ORIGINAL BILL OF MATERIALS


1 CPR-AF042A HP 10842 G2 42U WIDE RACK - SHOCK


1 CPS-AF042A#001 HP FACTORY EXPRESS BASE RACKING

1 CPR-412152-B22 HP BLC7000 CTO 3 IN LCD ENCL

1 HIN-412152-B22#0D1 HP FACTORY INTEGRATED

7 CPS-447707-B21 HP BL460C G1 DVLSS BLADE


7 HIN-459489-L21 HP E5450 BL460C G1 FIO KIT

7 CPR-459489-B21 HP E5450 BL460C G1 KIT

7 459489-B21#0D1 Factory Integrated HP E5450 BL460C g1 kit

28 FIO-397413-B21 HP CTO ONLY 4GB KIT PC2-5300 FBD

28 397413-B21#0D1 Factory Integrated HP 4GB FBD PC-5300 2x2GB kit

7 FIO-447711-B21 HP HDD BKPIN BL460C FIO KIT

14 FIO-375861-B21 HP CTO ONLY 72GB 3G PLUG SAS 10K SFF

14 375861-B21#0D1 Factory Integrated hp 72gb 10K 2.5 SAS HP SP HDD

7 CPR-406770-B21 HP BLC NC373M MF NIC ADAPTER KIT

7 406770-b21#0D1 Factory Integrated HP BLC NC373M MFN Gigabit svr adapter

7 FIO-339778-B21 HP CTO ONLY RAID 1 DRIVE 1 SETT

7 FIO-351580-B21 HP CTO ONLY 128MB BBWC FOR SA641/642

7 351580-0D1 Factory Integrated HP SA 641/642/E 200 128MB BBWC kit

3 FIO-447707-B21 HP CTO ONLY BL460C G1 DVLSS BLAD CTO



3 1351913 HP E5450 BL460C G1 KIT

3 459489-B21#0D1 Factory Integrated HP E5450 BL460C G1 kit


12 397413-B21#0D1 Factory Integrated 4gb FBD PC2-5300 2x2gb kit



6 375861-B21#0D1 Factory Integrated HP 72GB 10K 2.5 SAS HP SP HDD


3 406770-b21#0D1 Factory Integrated MS, ENTER HP BLC NC373M MFN Gigabit SVR Adapter

3 CPR-403619-B21 HP BLC QLOGIC QMH2462 FC MEZZ



3 351580-B21#0D1 Factory Integrated Hp SA 641/642/e200 128mb BBWC kit

3 CPR-399593-B22 HP 1/10GB VIRTUAL CONNECT ETH MOD

3 CPQ-399593-B22#0D1 HP FACTORY INTEGRATED

2 CPR-409513-B21 HP 4GB VIRTUAL CONNECT FIB CHAN MOD

2 409513-B21 Factory Integrated HP BLC 4G Virtual Connect FC OPT kit

6 CPR-412138-B21 HP BLC 10U ENCL PWR SPLY IEC320 OPTI


6 CPR-412140-B21 HP BLC 10U ENCL SINGLE FAN OPTION


1 CPS-413379-B21 HP BLC7000 1 PH FIO PWR MOD

1 HIN-417688-B23 HP CCLASS 24X7 1Y LIC

1 HIN-HA110A3 HP CP 3YR SUPPORT PLUS 24

1 CPS-HA110A3#4YN HP ICE-BL 16-SVR SW SUPPORT

1 CPS-HA110A3#7FX HP C7000 ENCLOSURE HW SUPP

11 HIN-HA110A3#7XE HP BL4XXC SVR BLD HW SUPPORT

1 CPS-HA114A1 HP CP INSTALLATION & STARTUP

1 HIN-HA114A1#5FY HP STARTUP BLADESYS C-CLASS INFR SYS


1 CPR-433718-B21 HP BLC7000 10K RACK SHP BRKT OPT KIT


1 CPR-412152-B22 HP BLC7000 CTO 3 IN LCD ENCL





7 CPR-459489-B21 HP E5450 BL460C G1 KIT

7 459489-B21#0D1 Factory Integrated E5450 BL460C G1 Kit


28 397413-B21#0D1 HP 4GB FBD PC2-5300 2x2gb kit Factory Installed



14 375861-B21#0D1 Factory Integrated hp 72GB 10K 2.5 SAS HP SP HDD



7 351580-B21#0D1 HP SA 641/642/E200 128mb BBWC KIT




3 CPR-459489-B21 HP E5450 BL460C G1 KIT

3 459489-B21#0D1 Factory Integrated HP E5450 BL460C g1 kit




6 375861-B21#0D1 Factory Integrated HP 72GB 10K 2.5 SAS HP SP HDD


3 406770-B21#0D1 Factory Integrated HP BLC NC373M MFN GIGABIT SVR Adapter

3 CPR-403619-B21 HP BLC QLOGIC QMH2462 FC MEZZ

3 403619B21-#0D1 Factory Integrated HP BLC Qlogic QMH2462 FC HBA OPT KIT



3 CPR-399593-B22 HP 1/10GB VIRTUAL CONNECT ETH MOD


2 CPR-409513-B21 HP 4GB VIRTUAL CONNECT FIB CHAN MOD

6 CPR-412138-B21 HP BLC 10U ENCL PWR SPLY IEC320 OPTI


6 CPR-412140-B21 HP BLC 10U ENCL SINGLE FAN OPTION


1 1002923 HP BLC7000 1 PH FIO PWR MOD

1 HIN-417688-B23 HP CCLASS 24X7 1Y LIC

1 HIN-HA110A3 HP CP 3YR SUPPORT PLUS 24

1 CPS-HA110A3#4YN HP ICE-BL 16-SVR SW SUPPORT

1 CPS-HA110A3#7FX HP C7000 ENCLOSURE HW SUPP

11 HIN-HA110A3#7XE HP BL4XXC SVR BLD HW SUPPORT

1 CPS-HA114A1 HP CP INSTALLATION & STARTUP

1 HIN-HA114A1#5FY HP STARTUP BLADESYS C-CLASS INFR SYS

1 1027790 HP BLC7000 10K RACK SHP BRKT OPT KIT

2 CPR-AF500A HP PDU INTL 7X C-13

1 CPR-AF090A HP 10K RACK AIRFLOW OPTIMIZATION KIT


2 CPQ-AF090A#B01 HP FACTORY INTEGRATED

1 CPR-AF066A HP 10K G2 STABILIZER 800W-ALL

1 AF066A#B01 Factory Integrated HP 10K 800W g2 stabilizer

1 CPR-AF054A HP 10642 G2 SIDEPANEL KIT

1 CPS-AF054A#0D1 HP FACTORY INTEGRATED

1 HIN-U5466S HP CARE PACK

36 CPS-U5466S#4NK HP TOTAL EDUCATION ONE SERVICE

1 CPS-HA124A1 HP CP TECH INSTALLATION & STARTUP

2 HIN-HA124A1#56H HP STARTUP BLADSYS C-CLASS ENCD SVC

1 HIN-U5466S HP CARE PACK

36 761754 HP TOTAL EDUCATION ONE SERVICE

7.5 CURRENT SAN PHYSICAL LAYOUT

USBKeybd

Mouse

USB

10/100/1000Serial - PPP Video

10/100

USB

2 Fibre 3 Fibre 2 Fibre 3 Fibre

0 iSCSI 1 iSCSI 0 iSCSI 1 iSCSI

BE 0 BE 0

10/100 10/100

B

A

SP

10/100

0 Fibre 1 FibreBE 0

5 Fibre4 Fibre3 Fibre2 Fibre

1

0

2 4

3 5

10/100

0 Fibre 1 FibreBE 0

5 Fibre4 Fibre3 Fibre2 Fibre

1

0

2 4

3 5

B

A

SP

15Krpm

300GB15Krpm

300GB15Krpm

300GB15Krpm

300GB15Krpm

300GB15Krpm

300GB15Krpm

300GB15Krpm

300GB15Krpm

300GB15Krpm

300GB15Krpm

300GB15Krpm

300GB15Krpm

300GB15Krpm

300GB15Krpm

300GB

15Krpm

300GB15Krpm

300GB15Krpm

300GB15Krpm

300GB15Krpm

300GB15Krpm

300GB15Krpm

300GB15Krpm

300GB15Krpm

300GB15Krpm

300GB15Krpm

300GB15Krpm

300GB

ATA

1TBATA

1TBATA

1TBATA

1TBATA

1TBATA

1TBATA

1TBATA

1TBATA

1TBATA

1TB

Figure 14

7.6 CURRENT SAN ORIGINAL BILL OF MATERIALS


1 EMD-NS22C-A-FD EMC NS20 INT-2DM-4GB-4

2 EMD-NS-4PDAE-FD EMC NS40 FLD EXP DAE

1 EMD-NS2-AUXFCR EMC NS20 CAPTIVE ARRAY XPE-CUST RACK

1 EMD-NS20DAE300XF5 EMC NS20 DAE OS W 5X300GB 15K FC DIS


1 EMD-NS20-CS-FD EMC NS20 CONTROL STATION (FLD INST)

1 EMD-NS20-CS-FD EMC 300GB 15K 4GB FC 520BPS HS

18 EMD-NS-4G15-300 EMC 300GB 15K 4GB FC 520BPS

8 EMD-NS-SA07-010 EMC ASSY DISK 1000GB 7.2K 512BPS SAT

1 EMD-NS2-AUXFCBLCR EMC CABLE & DOC KIT: NS22 TO AUXF

4 ESG-NAVAGT-WINKIT EMC NAVAGT WIN KIT

1 ESG-NAV-DPKIT EMC NAVI DEPARTMENTAL MEDIA

1 EMD-MODEM-US EMC CLARIION SERVICE MODEM-US

1 EMD-NAV31-DP EMC NAVISPHERE DEPARTMENTAL FOR CX3

1 EMD-NS20-IS-DCD EMC NS20 ISCSI APP DCD

1 EMD-NS22C-UNIX-L EMC CELERRA NS22C UNIX NFS LICENSE

1 EMD-NS20-IS-CI-L EMC NS20 ADD ISCSI LICENSE TO CIFS

1 EMD-NS22-CI-RYLT EMC NS20 CIFS ROYALTY FOR 2 BLADES

1 EMD-NS20-C-DCD EMC DOC AND CD: NS20 WITH CLARIION

1 EMD-NS20-FCOPT-L EMC NS20 FC PORT OPTION ENABLED LICE

1 EMD-CX31C-KIT EMC FLARE SW AND RTU

1 EMD-PS-BAS-NSGW EMC EMC CELERRA NS QUICKSTART

1 EMD-PS-BAS-PMBLK EMC COMMERCIAL PMGMT 4HRS QS

1 WU-PREHW-001 Premium Hardware Support Warr Upg

1 M-PRESW-001 Premium Software support

1 EMD-NS20-SPS-FD EMC NS20 OPTIONAL SECOND SPS

1 1190787 EMC PREMIUM SW SUPPORT

1 EMD-PS-BAS-SABLK-ACC EMC COMMERCIAL SA 4HOURS QS

5 EMD-PS-BAS-SABLK EMC COMMERCIAL SA 4HOURS QS

2 EMD-MDS-PW8-US EMC 845W CISCO POWER CORD

2 EMD-MDS-9124 EMC 4GB 8-PORT FC SWITCH

1 M-PREHW-001 Premium Hardware support

1 EMD-MDS-9124-4GSW EMC 4GB FC SW OPTIC

1 EMD-MDS-9124-8 EMC 4GB 8-PORT FC OPTIC KIT

1 EMD-DXNASWINDOWS EMC DX FOR NAS AND WINDOWS

1 ESG-456-004-569 EMC DISKXTENDER WIN 1TB CP

1 EMD-456-100-139 EMC DX FOR NAS

1 EMD-456-100-140 DX FOR NAS - WINDOWS - CELERRA

1 EMD-456-100-143 EMC DX FOR NAS - WINDOWS - DISK

1 1312638 EMC DX FOR NAS AND WINDOWS

1 EMD-456-100-493 EMC DX FOR NAS - WINDOWS - DEDUPE

1 PS-BAS-DXNAS Disktender NAS quickstart

1 M-PRESWL-002 Premium Software support

1 EMD-NS22C-A-FD EMC NS20 INT-2DM-4GB-4

7.7 DISTRICT FACILITIES AND LOCATIONS REFERENCED IN DOCUMENT


7.7.1 BRETON DOWNS ELEMENTARY

Figure 15


7.7.2 LAKESIDE ELEMENTARY

Figure 16


7.7.3 WEALTHY ELEMENTARY

Please note this is a map of the second floor.

Figure 17



Figure 18


7.7.5 EAST GRAND RAPIDS HIGH SCHOOL

Figure 19


Figure 20


Figure 21


7.7.6 JAMES E. MORRIS ADMINISTRATION BUILDING AT WOODCLIFF CENTER

Figure 22

7.8 CURRENT WIRED NETWORK ORIGINAL BILL OF MATERIALS

7.8.1 CORE


1 ETS-N7-SYSTEM-R ENTERASYS MATRIX N7 CHASSIS BUNDLE

4 ETS-7K4297-04 ENTERASYS PLATINUM DFE 4PT 10G XFP

2 ETS-7G4282-49 ENTERASYS PLATINUM DFE 48PT GIG NEM

4 ETS-10GBASE-CX4-XFP ENTERASYS 10GB XFP CX4 TWINAXIAL

1 ETS-NS-CON-U ENTERASYS NETSIGHT CONSOLE UNRESTCTD

1 ETS-NS-IM ENTERASYS NETSIGHT INVENTORY MGR

1 ETR-ES-SN-S14 ENTERASYS SUPPORTNET 24X7XNBD S14

2 ETS-7G-6MGBIC-A ENTERASYS NTWK EXP MOD NEM 6 1000BX

1 ETR-ES-SAS-S08 ENTERASYS SUPPORTNET 24X7 SW SUB S08

1 ETR-ES-SAS-S05 ENTERASYS SUPPORTNET 24X7 SW SUB S05


10 ETS-10GBASE-LR-XFP ENTERASYS 10GBE XFP LONG REACH 10KM

10 ETS-MGBIC-LC01 ENTERASYS MGBIC 1000BASE-SX LC MMF

7.8.2 B-IDF1


1 ETS-C2H124-48P ENTERASYS C2 48PT STACK 10/100 POE

1 ETS-C2K122-24 ENTERASYS C2 24PT STACK GIG 10GE

1 ETS-C3G124-24 ENTERASYS C3 24PT STACK GIG L3

2 ETS-C2H124-48 ENTERASYS C2 48PT STACK 10/100 L3


4 ETS-C2CAB-SHORT ENTERASYS B/C STACKING CABLE .3M

1 ETS-C2CAB-LONG ENTERASYS B/C STACKING CABLE 1M

7.8.3 B-IDF2


1 ETS-B3G124-48P ENTERASYS B3 48PT STACK GIG POE

1 ETS-B3G124-48 ENTERASYS B3 48PT STACK GIG




7.8.4 L-IDF1









7.8.5 W-IDF1









7.8.6 MAINT-IDF1



1 ETS-D2G124-12 ENTERASYS D2 12PT GIG CLASSROOM

7.8.7 DO-IDF1









7.8.8 MS-IDF1







7.8.9 MS-IDF2






7.8.10 MS-IDF3






7.8.11 MS-IDF4




7.8.12 MS-IDF5







7.8.13 MS-IDF6








7.8.14 HS-IDF1










7.8.15 HS-IDF2







7.8.16 HS-IDF3




7.8.17 HS-IDF4








7.8.18 HS-IDF5







7.8.19 HS-IDF6




7.8.20 HS-IDF7




7.8.21 HS-IDF8



7.8.22 HS-IDF9



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