Product Update Automotive Exterior OSRAM Opto Semiconductors

www.osram-os.com

Product Update Automotive Exterior

OSRAM Opto Semiconductors

Jan. 2014 | OS LED | Jerry Tseng

OSRAM Automotive LED Update

1. OSRAM Opto Semiconductors – at a glance

2. Automotive (Exterior) Market Trends

3. Future Exterior Lighting Key Package Roadmap

4. OSRAM Opto Semiconductors – a strong partner

5. Application and Technical Support

6. Design Trends

OSRAM Automotive LED | OS LED MK | Juliana Baron 2

Dezember 2013

OSRAM Opto Semiconductors at a glance

A consistent, well positioned market leader

2020 2016

13 12

2011

9

Total CAGR 4%

LCD Backlighting

CAGR

2011-2020

16 %

8 %

1 %

8 %

-11 %

IR/Laser

Other LED 4)

Automotive General Illumination

w/o backlighting 1)

CAGR 7%

899858

743

2012 2010 2011

Revenue (in € mn)

OSRAM Opto Semiconductors, Regensburg

Opto Semiconductor Component Market (in €m) 3)

Market leader across diversified product portfolio 1)

• Number 1 in Automotive

• Number 1 in Sensors 2)

• Number 2 in Projection

• Number 2 in Industry

• Among Top 5 in General Illumination

1) Based on revenue 2011 2) Optical sensors for mobile devices and industrial applications 3) OSRAM estimates based on McKinsey Market Report 2012 4) incl. LED for industry appl. such as video walls, LED projectors or white goods and consumer & communication applications such as camera flash for mobile phones


Dezember 2013

Production - Centers for High Tech


Regensburg

Headquarters

Chip Production*:

• Chips for visible and infrared LED

• InGaAlP, AlGaAs and InGaN chip

technology

Penang

LED Assembly

• Packaging of visible & IR LED, etc

Chip Production*:

• Chips for InGaN LED

R&D center for advanced packaging

FUTURE: Wuxi

Planned LED Assembly

• Packaging of visible & IR LED, etc

• Production start : end 2013

R&D center for advanced packaging

* On 4inch and 6inch wafer

Dezember 2013

Fro

nt-

en

d

LED production

Front-end and Back-end processes

Input

Substrates and others

• Substrates / wafer

- Materials: Sapphire, GaAs, Silicon, ..

- Diameters: 2 .. 6 inch

• Gases, metals, ..

LED chips

• Side length: 0.2 .. 2 mm

• Different light colors

Chip processing

Epitaxy Coating & structuring Singulation, testing

All process steps applied on wafer level, i.e., at the same time for later up to 100.000

chips !!

Output

Packaged LED

• Power levels: 40mW .. 10W

• Packages mostly application specific

Die and wire bonding Conversion Sawing, testing

Process steps mostly applied to single devices or on small panels

Chips and others Processing

• Leadframes,

• Ceramics

• Silicones and glues

• Bond wires

• Phosphors

• ..

Ba

ck

-en

d


Dezember 2013

Chip Technology – Chip structure

Conductive carrier

n

p

Cross sectional view

Top view

n

p

Cross sectional view

Conductive carrier

Thin GaN

Top view

UX:3 improvement

Current

distribution

structure on

top of chip

Current

distribution

structure

embedded in

the the chip

OSRAM OSTAR HL Pro

OSRAM OSTAR HL Gen2

Ceramic Converter Technology/Color Over Temperature

New Color Binning (IEC / PAS 62707-1 Ed.1)

OSRAM LED Technology Update and New Products | OS LED

May 15th 2013

7

ebxD68

Ceramic Converter

Temperature Characteristics

OSRAM LED Technology Update and New Products | OS LED

May 15th 2013

0

0,2

0,4

0,6

0,8

1

1,2

-60 -40 -20 0 20 40 60 80 100 120 140

Tj

Phiv

/ P

hiv

25 °C

next Generation

Gen2

Δ 10%

8







6. Design Trends


Dezember 2013

Semiconductor Light for Automotive

The unique properties of LED, IRED, Laser and Sensors already enabled

completely new solutions - not only pure replacement of classical lamps.

• High brightness LED portfolio for exterior

lighting still growing, increasing efficiency and

innovative package designs

• Multi pixel LED for intelligent forward lighting

becoming main trend in Europe

• Powerful colored LED for light guide solutions in

rear lighting, 3D appearance, saturated colors

• Color on demand LED for personalized interior

lighting

• Powerful LED and Lasers for safety applications

• …

Coming Up:


Dezember 2013

Development of LED Penetration per

Segment and Application

O high low minimal Penetration Rate:

LB Exterior 2017

E &

F

D

C

A&

B

LB

DRL/Fog/Turn RCL/Signaling AFS

Exterior 2012

LB/HB

O

O O

O

O

Year

Car Segment

Application DRL/Fog/Turn RCL/Signaling AFS LB/HB

O

O

O O

O


Dezember 2013

0

50

100

150

200

250

Mio

€

2012 2017

Segment A/B

RCL FWL

0

50

100

150

200

250

Mio

€

2012 2017

Segment C

RCL FWL

0

50

100

150

200

250

Mio

€

2012 2017

Segment D

RCL FWL

0

50

100

150

200

250

Mio

€

2012 2017

Segment E/F

RCL FWL

Segm

ent A

-B

Segm

ent C

Segm

ent E

-F

Segm

ent D

Innovation

Design Follower

Optimised System Cost

Full LED?

Forward Lighting LED Market

Growth Driver by Segment


Dezember 2013







6. Design Trends


Dezember 2013

Product Strategy Signaling

by Market Trends and Integration Level

Car Segment Design Trend Top Emitter

E & F

D

B & C

Super Red

Light Guide

Pixel Design

Whole family

Flat surface

Dual Binning

LA/Y

High power product extension for design driven designs


Dezember 2013

Year 2012 2013 2014

Next gen top looker

- OSLON® Black Flat

- LA, LR, LS available

Established side

looker

- SIDELED®

Established top looker

- (Power) TOPLED®

- Power TOPLED® w/ lens

- Adv. Power TOPLED®

- Golden Dragon

Future Automotive Product Portfolio

Discrete LEDs for RCL

OSLON Black Flat

Transition phase

Next Generation of

Brightness Improvements

Next Generation

QFN Package


Dezember 2013

http://app-rbg05.germany.osram-os.com/Livelink/livelink.exe/?func=ll&objID=21205955&parentID=358257&objAction=editimage






ECE amber/red/super red norm

Standard amber 612 ~ 624 nm

Super RED 627 ~ 639 nm


Dezember 2013

Super Red LEDs for RCL

Covers full range of brightness

Brightness distribution of Amber ( Stop/tail )

OSRAM Automotive LED | OS LED MK | Juliana Baron

Dezember 2013

17

Device Current

/ mA

Typ. Brightness /

mcd

Q2

R1

R2

S1

S2

T1

T2

U1

U2

V1

V2

AA

AB

BA

BB

CA

CB

...

DB

EA

EB

LA G6SP 140 5600~(DBEB)

LA E67F 50 2240~ (BBCB)

LA A67F 30 1120~(AABA)

LA T67F 20 900~ (V2AB)

LA T67D 20 560~ (U2AA)

LA T676 20 140~ (R2T1)

LA A676 20 140~ (R2T1)

Covers full range of brightness

Brightness distribution of superred

OSRAM Automotive LED | OS LED MK | Juliana Baron

Dezember 2013

18

Device Current

/ mA

Min. Brightness /

mcd

P1

P2

Q1

Q2

R1

R2

S1

S2

T1

T2

U1

U2

V1

V2

AA

AB

BA

BB

....

DA

DB

EA

LS G6SP 140 4500~(DAEA)

LS E67F 50 1400~ (ABBB)

LS A67F 30 900~ (V2AB)

LS T67F 20 710~ (V1AA)

LS T67D 20 355~ (T2V1)

LS T676 20 90~ (Q2S1)

LS A676 20 90~ (Q2S1)

Product Strategy FWL

by Market Trends and Integration Level

Fastest moving application segment in automotive lighting

OSRAM offers comprehensive and flexible solutions

Tomorrow

White and Yellow

Toolkit Approach

Reliable High

Performance LEDs

Today

OSRAM OSTAR

Headlamp Pro

OSRAM OSTAR

Compact

Golden Dragon

APT

Trend

Matrix Beam

Entry Level

Headlamp/Fog

Car Segment

E & F

D

B & C

OSLON

Compact

HL Pro 1x5

AFS

AFS Solutions

DRL, TI

Light guide


Dezember 2013

OSRAM‘s new SMT LEDs

for FWL applications

Package

Dimensions Rth,JS,el (typ.) Flux (typ.)

3.75 x 3.75 x

0.5 mm³ 3.0 K/W

200 lm

@ 700 mA*

(275lm @1A*)

1.6 x 1.2 x

0.8 mm³ 9.4 K/W

100 lm

@ 350 mA**

1.9 x 1.5 x

0.8 mm³ 4.1 K/W

200 lm

@ 700 mA*

Single chip SMT LEDs for FWL applications

Status: SOP end 2013

Product Technical Details Highlights

ultra flat

low Rth

high contrast ratio

high reliability

(temperature cycles)

Smallest LED available!

Light emission surface

= package surface

Tool kit approach

Optimized for easy

series connection on

board

* Cx/Cy 0.335/0.35 / 1mm² die / @1A, Tj=25°C

**Cx/Cy 0.335/0.35 / 0.56mm² die / @1A, Tj=25°C

OSLON Black Flat

OSLON Compact CM

OSLON Compact CL

Status: mass production

Status: line set up


Dezember 2013

Year 2012 2013 2014

OSLON® Black Flat

- Reliable high

performance LED

- Ultimate Rth

OSLON® Compact CL /

CM

- “Chip size” package

- Tight tolerances

OSLON® LX 120°

- Ceramics package

- Isolated heatsink

Advanced Power

TOPLED®

- Robust & Reliable

leadframe


Discrete “white” LEDs

UX:3 Ge UX:3 Gen II

LW G6CP LUW GVCP

LUW H9QP LUW HWQP

LUW CVBP

LUW CEUN

LUW CEUP

Next Generation

QFN Package

22 OSRAM Automotive LED | OS LED MK | Juliana Baron

Dezember 2013







Brightness range covered (Tj=25°C)

If min to If max

OSLON

Compact CL

LUW CEUP

OSLON LX 120°

LUW CVBP

Advanced Power

TOPLED

LW G6CP

LUW GVCP

OSLON Black Flat

LUW H9QP

OSLON Black Flat

LUW HWQP

100 lm

200 lm

300 lm

OSLON

Compact CM

LUW CEUN

600mA

1000mA

1200mA 1200mA

1500mA If increase by Rth improved UX:3

1.2A => 1.5A


Dezember 2013

Product Technical Details

Highlights

OSLON footprint: 3 x 3 x 1.7 mm³

Thermal resistance Rth JS 9K/W (typ.)

Silicon conversion element

Estimated flux 2013:

Typ. 125lm @ 350mA

Status: Pre-series production

PPAP available

Attack C segment

120° lens for max

outcoupling efficiency

Optimised lumen / €

ratio

OSLON LX Automotive 120° LUW CVBP


Dezember 2013

Footprint: 3,2 x 3,4 x 1.9 mm³

Leadframe & white epoxy package

UX:3 (Ge) chip Technology

UX:3 (Gen II)

Lifetime L70 (140mA, Ts=80°C) >40k hours

Thermal Resistance Rth = typ. 25 K/W

(max. 29 K/W)

Estimated luminous intensity 2013

Typ. 12,8Cd @ 140mA

+20% flux vs. LW G6CP

Status: Pre-series production

PPAP available

Reliable leadframe

package

Colour coordinate

updated to LUW to match

other LUW products

Performance

improvement by UX:3

technology

Advanced Power TOPLED (LUW GVCP) with UX:3

Product Technical Details Highlights


Dezember 2013

OSLON Black Flat Ultra White (LUW HWQP)

UX:3 chip with improved thermal resistance

Product Technical Details

Ultra flat package: 3.75 x 3.75 x 0.5mm³

UX:3 (improved thermal resistance)

chip technology

Ceramic conversion element

Thermal resistance Rth JS 3.0K/W (typ.)

- 30 % compared to LUW H9QP

If max increased from 1.2A (H9QP) to

1.5A (HWQP)

+25% compared to LUW H9QP

Estimated flux 2014 at 1A

Typ 280lm @1A 210 lm @700mA

Status

Pre-series available

PPAP spring 2014

Highlights

Basis: Successfull

OSLON Black Flat

Package

Usage of UX:3 with

improved thermal

resistance optimises

thermal resistance of

package (-30%)


Dezember 2013

Year 2012 2013 2014

OSRAM OSTAR® PRO

Head Lamp Platform

Chip: 1mm² UX:3


Forward Lighting

Connector

LE UW U1Ax 01 LE UW U1Ax 01

HL Pro 1x5 AFS

LE UW U1A 05

UX:3 Ge UX:3 (Gen II)

OSRAM OSTAR® PRO

Head Lamp Platform

Chip: 1mm² UX:3

Gen II LE UW S1Ax 01

Multiple Derivates

in Development

Rth Improved Head Lamp

Development


Dezember 2013








6. Design Trends


Dezember 2013

OSRAM Opto Semiconductors‘ support

along the LED headlamp development timeline


► alignment on working as well as management level

Frequent information transfer and regular project alignment meetings between setmaker, OSRAM and OEM

Benefits / Win-Win

•Our experience & knowledge helps our

customers to be a step ahead in innovative

headlamp designs (design freedom, branding and

image)

•We can develop LEDs to the needs of our customers

•Early alignment allows for safe launch & more

flexibility

•The regular exchange of information, progress

and results supports the mutual understanding

and a strong pursuit of common goals

+ Strong Application Support

Application Notes

Optical simulation

Thermal simulation and thermal

management support

Electrical simulation, SPICE models

Package CAD Data (...)

SOP Predevelopment Development Tooling Testing of first-

off samples Homologation

Concept release /

award of contract Construction release Homologation

sometimes

parallel to testing

Pa

rtn

ers

hip

/ O

sra

m S

up

po

rt

Dezember 2013







6. Design Trends


Dezember 2013

OSRAM OS AE Competencies


Advanced

Optics Concepts

Lightguide Coupling

estimation rules

Application Prototypes &

Reference Designs

Electronics &

Drivers

LED Contacting &

Mounting

Factors influencing

Lifetime & Reliability

Thermal Reference

Designs

Thermal Simulation &

Training

Assembly & Soldering

Mechanical Design

Optical Design &

Reference Designs

LED Modelling

Backlight Homogeneity

Simulation & Measurement

Whitepoint Calculation &

LED mixing

Lightguide Design

Rayfile Support

CUSTOMER

Dezember 2013







6. Design Trends


Dezember 2013

2006

2014

2010

Day time running

light

DRL Design Trends


Dezember 2013

http://www.autobild.de/projektor/galerie.php?pos=9&artikel_id=14110

http://images.google.de/imgres?imgurl=http://www.zcars.com.au/images/2008-audi-a4-led-headlights1.jpg&imgrefurl=http://www.motor-talk.de/forum/tagfahrlicht-led-fuer-den-mazda-mx5-nb-nachruesten-t1695641.html&h=800&w=1200&sz=96&hl=de&start=1&tbnid=TVRsYhfTbVFatM:&tbnh=100&tbnw=150&prev=/images?q=Audi+A4+LED+Tagfahrlicht&gbv=2&hl=de&sa=G

RCL Design Trends

2006

2014

2010


Dezember 2013

http://www.autobild.de/projektor/galerie.php?pos=5&artikel_id=14483

Thank you for your attention.

Product Update Automotive Exterior OSRAM Opto Semiconductors

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