EG21-G Reference Design - AURORA EVERNET
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Transcript of EG21-G Reference Design - AURORA EVERNET
EG21-G
Reference Design
LTE Standard Module Series
Rev. EG21-G_Reference_Design_V1.0
Date: 2019-12-05
Status: Released
www.quectel.com
LTE Standard Module Series EG21-G Reference Design
EG21-G_Reference_Design 1 / 8
Our aim is to provide customers with timely and comprehensive service. For any
assistance, please contact our company headquarters:
Quectel Wireless Solutions Co., Ltd.
Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai,
China 200233
Tel: +86 21 5108 6236
Email: [email protected]
Or our local office. For more information, please visit:
http://www.quectel.com/support/sales.htm
For technical support, or to report documentation errors, please visit:
http://www.quectel.com/support/technical.htm
Or email to: [email protected]
GENERAL NOTES
QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION
PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT
TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT
MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT
ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR
RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO
CHANGE WITHOUT PRIOR NOTICE.
COPYRIGHT
THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF
QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION
AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE
FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF
DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR
REGISTRATION OF A UTILITY MODEL OR DESIGN.
Copyright © Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved.
LTE Standard Module Series EG21-G Reference Design
EG21-G_Reference_Design 2 / 8
About the Document
Revision History
Revision Date Author Description
1.0 2019-12-05 Lim PENG/
Woody WU Initial
LTE Standard Module Series EG21-G Reference Design
EG21-G_Reference_Design 3 / 8
Contents
About the Document ................................................................................................................................... 2
Contents ....................................................................................................................................................... 3
Figure Index ................................................................................................................................................. 4
1 Reference Design ................................................................................................................................. 5
1.1. Introduction ................................................................................................................................ 5
1.2. Power-on/off and Resetting Scenarios ...................................................................................... 6
1.2.1. Power-on Scenario ........................................................................................................... 6
1.2.2. Power-off Scenario ........................................................................................................... 7
1.2.3. Resetting Scenario ........................................................................................................... 8
1.3. Schematics ................................................................................................................................ 8
LTE Standard Module Series EG21-G Reference Design
EG21-G_Reference_Design 4 / 8
Figure Index
FIGURE 1: TIMING OF TURNING ON MODULE ............................................................................................... 6
FIGURE 2: TIMING OF TURNING OFF MODULE ............................................................................................. 7
FIGURE 3: TIMING OF RESETTING MODULE ................................................................................................. 8
LTE Standard Module Series EG21-G Reference Design
EG21-G_Reference_Design 5 / 8
1 Reference Design
1.1. Introduction
This document provides the reference design for Quectel EG21-G module. And the reference design
includes power-on/off/resetting scenarios, block diagrams of power supply and module design, UART
interfaces, (U)SIM interface, audio interfaces, etc.
LTE Standard Module Series EG21-G Reference Design
EG21-G_Reference_Design 6 / 8
1.2. Power-on/off and Resetting Scenarios
1.2.1. Power-on Scenario
VIL≤0.5V
VH=0.8V
VBAT
PWRKEY
≥500ms
RESET_N
STATUS(OD)
Inactive ActiveUART
NOTE 1
Inactive ActiveUSB
≥2.5s
≥12s
≥13s
VDD_EXT
About 100ms
BOOT_CONFIG & USB_BOOT Pins
≥100ms. After this time, the BOOT_CONFIG pins can be set to high level by external circuit.
Figure 1: Timing of Turning on Module
1. Please make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is
no less than 30ms.
2. When using MCU to control module to enter the emergency download mode, please follow the above
timing sequence. It is not recommended to pull up USB_BOOT to 1.8V before powering up VBAT.
Short the test points as shown in Figure 28 can manually force the module to enter download mode.
NOTES
LTE Standard Module Series EG21-G Reference Design
EG21-G_Reference_Design 7 / 8
1.2.2. Power-off Scenario
VBAT
PWRKEY
≥29.5s≥650ms
RUNNING Power-down procedure OFFModuleStatus
STATUS(OD)
Figure 2: Timing of Turning off Module
1. In order to avoid damaging internal flash, please do not switch off the power supply when the module
works normally. Only after the module is shut down by PWRKEY or AT command, the power supply
can be cut off.
2. When turning off module with the AT command, please keep PWRKEY at a high level after the
execution of the command. Otherwise, the module will turn itself back on after being shut down.
NOTES
LTE Standard Module Series EG21-G Reference Design
EG21-G_Reference_Design 8 / 8
1.2.3. Resetting Scenario
VIL≤0.5V
VIH≥1.3V
VBAT
≥150ms
ResettingModule
StatusRunning
RESET_N
Restart
≤460ms
Figure 3: Timing of Resetting Module
1. Please ensure that there is no large capacitance with the max value exceeding 10nF on PWRKEY
and RESET_N pins.
2. RESET_N only resets the internal baseband chip of the module and does not reset the power
management chip.
3. It is recommended to use RESET_N only when failing to turn off the module by AT+QPOWD
command or PWRKEY pin.
1.3. Schematics
The schematics illustrated in the following pages are provided for your reference only.
NOTES
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Power Supply Block Diagram
DC-DCDC 5V OUTe.g. DC 12V IN DC 3.8V @2.0A
EG21-GMIC29302WU
MOS ON/OFFUSB_VBUS
ENVBAT_EN
SGM2019-ADJYN5G/TRDC 3.3V
SGM2019-ADJYN5G/TRDC 1.8V
CODEC_EN
ENVDD_EXT
MIC29302WUEN
ALC5616
TLV320AIC3104or
Codec
VBUS_CTRLEN
POWER_EN
SD cardMOS ON/OFFEN
DC 3.3V @0.8ASD_PWR_EN
SGMIIDC 3.3V @0.8A
51K
EG21-G
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Reference Design
2019/12/5DATE
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NOTE:A transistor translation circuit or a level translator TXS0108EPWR provided by Texas Instruments is recommended.
Reference Design Block Diagram
EG21-G
(U)SIM
VDD_EXT
FORCE_USB_BOOT
PCM
ANT_MAIN
ADC0
ADC1
MAIN UART
I2C
ANT_MAIN
WAKEUP_IN
STATUS
NET_MODE
NET_STATUS
MCU
PWRKEYGPIO_03
GPIO_04 RESET_N
GPIO_08
GPIO_05 W_DISABLE#
GPIO_06
USB USB
3.3V/1.8V
ALC5616
TLV320AIC3104or
(U)SIM Card
SDC2 SD Card
UART
DEBUG UART
Test Points
12-bit ADC0.3V~VBAT_BB
Status Indication
NOTE
VBAT3.8V, 2.0A
AP_READY
GPIO_01
GPIO_02
GPIO_07
GPIO_09
VDD
VBAT_EN
VBUS_CTRL
CODEC_POWER_EN
SD_PWR_EN
VDD_MCU
VBAT
Transistor Circuit
Main Antenna
Handset
or
Earphone
Level Translator
AR8033-AL1B-R FC3004SGMIIEPHY
RJ45
ANT_GNSS ANT_GNSS
GNSS Antenna
ANT_DIVANT_DIV
Rx-diversityAntenna
1.0
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Module Interface
1. Keep all RESERVED and unused pins unconnected, and ensure all GND pins are connected to the ground network.Notes:
2. Pins 73~84 are unused in the design, and can be ignored in schematic and PCB decal.
3. A common mode choke L0101 is recommended to be added in series between the module and customers' MCU in order to
Meanwhile, it is recommended to reserve the test points for upgrading the firmware over USB interface and minimize the
4. ADC pins cannot be directly connected to the module's power supply and the input voltage must not exceed VABT_BB.5. C0101 and C0102 should be placed close to the SGMII interface of the module.
Note 3
Note 6
Note 4
EG21-G
EG21-G
Note 5
extra stubs of the trace. The two resistors should be placed close to the module.
suppress EMI spurious transmission, and should be placed close to the module.
6. Do not pull up pin1,pin5, pin40,pin136,pin137and pin138 unless the module starts up sucessfully.
Meanwhile, these pins should be served as a keepout area.
R0111 NM_0R
R0109 NM_0R
R0113 100K
R0114 100K
R0116100K
R0115100K
R0118 0R
R0120 0R
R0122 0R
R0124 0R
R0108 0R
R0104 0R
R0106 0R
R0102 0R
1 WAKEUP_IN2 AP_READY3 RESERVED4 W_DISABLE#5 NET_MODE6 NET_STATUS7 VDD_EXT
8 GND9 GND
10 USIM_GND11 DBG_RXD12 DBG_TXD13 USIM_PRESENCE14 USIM_VDD15 USIM_DATA16 USIM_CLK17 USIM_RST18 RESERVED
19G
ND
20R
ES
ET_
N
21P
WR
KE
Y
22G
ND
23S
D2_
INS
_DE
T
24P
CM
_IN
25P
CM
_OU
T
26P
CM
_SY
NC
27P
CM
_CLK
28S
DC
2_D
ATA
3
29S
DC
2_D
ATA
2
30S
DC
2_D
ATA
1
31S
DC
2_D
ATA
0
32S
DC
2_C
LK
33S
DC
2_C
MD
34V
DD
_SD
IO
35A
NT_
DIV
36G
ND
37RESERVED
38RESERVED
39RESERVED
40RESERVED
41I2C_SCL
42I2C_SDA
43RESERVED
44ADC1
45ADC0
46GND
47ANT_GNSS
48GND
49ANT_MAIN
50GND
51GND
52GND
53GND
54GND
55R
ES
ER
VE
D56
GN
D57
VB
AT_
RF
58V
BA
T_R
F59
VB
AT_
BB
60V
BA
T_B
B61
STA
TUS
62R
I63
DC
D64
CTS
65R
TS66
DTR
67TX
D68
RX
D69
US
B_D
P70
US
B_D
M71
US
B_V
BU
S72
GN
D11
5U
SB
_BO
OT
116
RE
SE
RV
ED
113
RE
SE
RV
ED
114
RE
SE
RV
ED
141 RESERVED142 RESERVED 143RESERVED
144RESERVED
U0101-A
85 GND86 GND87 GND88 GND89 GND90 GND91 GND92 GND93 GND94 GND95 GND96 GND97 GND98 GND99 GND
100 GND101 GND102 GND103 GND104 GND105 GND106 GND107 GND108 GND109 GND110 GND 111GND
112GND
117RESERVED
118RESERVED
119EPHY_RST_N
120EPHY_INT_N
121SGMII_MDATA
122SGMII_MCLK
123SGMII_TX_M
124SGMII_TX_P
125SGMII_RX_P
126SGMII_RX_M
127RESERVED
128USIM2_VDD
129RESERVED
130RESERVED
131RESERVED
132RESERVED
133RESERVED
134RESERVED
135RESERVED
136RESERVED
137RESERVED
138RESERVED
139RESERVED
140RESERVED
U0101-B
C0101 100nFC0102 100nF
1 2
34
L0101
DLM0NSN900HY2D
[6] USIM_GND[14] DBG_RXD[14] DBG_TXD
[6] USIM_VDD
[6] USIM_CLK[6] USIM_RST
[6] USIM_DATA
[4,5,6,11,13,14] VDD_EXT
[14] NET_STATUS
[14] NET_MODE[4] W_DISABLE_EG21-G
[4] AP_READY_EG21-G
[4] RESET_N[4,14] PWRKEY
[10]
AN
T_D
IV
[10]ANT_MAIN
[10]ANT_GNSS
[4,14] USB_VBUS
[6] RXD_EG21-G
[6] TXD_EG21-G
[6]
DTR
_EG
21-G
[6] RTS_EG21-G
[6] CTS_EG21-G
[6]
DC
D_E
G21
-G[6
]R
I_E
G21
-G[1
4]S
TATU
S[3
,5,1
4]V
BA
T
[3,5
,14]
VB
AT
[6] USIM_PRESENCE
[7,8] CODEC_PCM_IN
[7,8] CODEC_PCM_OUT
[7,8] CODEC_PCM_SYNC
[7,8] CODEC_PCM_CLK
[7,8]I2C_SDA
[14] USB_DM_TEST
[14] USB_DP_TEST
ADC0_INPUTADC1_INPUT
[7,8]I2C_SCL
[14] USB_BOOT
[4] WAKEUP_IN_EG21-G
[13] SD2_INS_DET
[13]
SD2_
DAT
A3
[13]
SD2_
DAT
A2
[13]
SD2_
DAT
A1[1
3]SD
2_D
ATA0
[13]
SD2_
CLK
[13]
SD2_
CM
D
[13]
VDD
_SD
IO
[11]USIM2_VDD
[11]SGMII_RX_M[11]SGMII_RX_P
[11]SGMII_TX_P[11]SGMII_TX_M[11]SGMII_MDIO_CLK[11]SGMII_MDIO_DATA
[11]EPHY_INT_N[11]EPHY_RST_N
[4] USB_DP
[4] USB_DM
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1.0
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EG21-G
A2
Reference Design
5V power source from main board.
It is used to reset the module.It is used to turn on or off the module.
MCU Interface
The USB_VBUS pins of MCU and EG21-G should be powered by a 5V power system for USB detection, and USB_VBUS_CTRL is used to turn on/off USB_VBUS power supply.2. EG21-G can only work as a USB device and supports Full Speed and High Speed modes. To communicate with USB interface, MCU needs to support USB host or OTG function. 1. U0201 represents customers's MCU. The power domain of GPIO interfaces on EG21-G modules is 1.8V. If the domain on U0201's GPIO interfaces is the same, then the level translation circuit can be omitted.Notes:
3. AP_READY is used to detect the MCU's sleep state. For more details, please refer to
It is used to wake up the module. It is used to let the module enter airplane mode.
4. WAKEUP_IN_EG21-G should be kept at low level before the module starts up successfully.Quectel_EG21-G_Hardware_Design.
G
S D
Q0205
SI2333CDS-T1
Q0207
DTC043ZEBTL
R0204
10K
Q0202
DTC043ZEBTLQ0201
DTC043ZEBTL
Q0206
2SC4617TLQ
R02014.7K
R02024.7K
Q0204
DTC043ZEBTL
Q0203
DTC043ZEBTL
VDDGNDTXDRXDCTSRTS
USB_VBUSUSB_D+USB_D-
GPIO_01GPIO_02GPIO_03
USB_ID
GPIO_04GPIO_05GPIO_06GPIO_07GPIO_08GPIO_09GPIO_10GPIO_11GPIO_12GPIO_13
RIDCDDTR
U0201C0201
10nF
C0202
10nF
C0203
10nF
C0204
1nF
VDD_MCU
[6]RXD[6]TXD
[3]USB_DP[3]USB_DM
[3,4,14]USB_VBUS
[4]ON/OFF_MCU[4]RESET_MCU
[4]VBUS_CTRL
[5,14] DC_5V [3,4,14]USB_VBUS
[4] VBUS_CTRL
[4]W_DISABLE_MCU[4]SLEEP_STATUS
[3]RESET_N
[4] RESET_MCU
[3,14]PWRKEY
[4] ON/OFF_MCU
[6]CTS[6]RTS
[5]VBAT_EN
[3] AP_READY_EG21-G [4]SLEEP_STATUS
VDD_EXT VDD_EXT
[3]W_DISABLE_EG21-G
[4] W_DISABLE_MCU
[5]CODEC_POWER_EN
[3]WAKEUP_IN_EG21-G
[4] WAKEUP_IN_MCU
[4]WAKEUP_IN_MCU[13]SD_PWR_EN
[6]DTR
[6]RI[6]DCD
1.0
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A2
Reference Design
DC-DC Application
Notes:
2. VBAT should be routed in star mode to VBAT_BB and VBAT_RF pins.
Power Supply Design
VBAT DesignClosed to VBAT_BB pins.
Closed to VBAT_RF pins.
1. The power supply must be able to provide sufficient current up to 2A or more.
VDD_1V8 = (R0310/R0312+1)*1.207 = 1.8V
Power Supply for PCM CodecVDD_3.3V = (R0305/R0308+1)*1.207 = 3.3V
LDO ApplicationIt is used when the input voltage is below 7V.
VBAT = (R0301/R0307+1)*1.24 = 3.88VThe recommended load current is greater than 10mA.
Power Supply for SGMII and SD Card
VBAT = (R0314/R0318+1)*1.24 = 3.3VNote:
DC-DC LDO
LDODC 1.8V
LDO DC 3.3V
Codec
LDODC 3.3V 3.0A
EG21-G
SD Card
DC 5V OUT DC 3.8V 2.0Ae.g. DC12V IN
3. The recommended operating voltage of VBAT is 3.3V~4.3V.
The recommended load current of MIC29302WU is greater than 10mA.
Notes:1. CODEC_POWER_EN must be at low level in order to ensure the normal output voltage of VDD_3.3V.
2. The following power-on/off sequences should be complied with to ensure the audio codec
Power-on Sequence: power on VDD_1V8 first, then VDD_3.3V.
Note 1
If VDD_3.3V power supply needs to be switched off, please keep CODEC_POWER_EN at high level.
SGMII
It is used when the input voltage is above 7V. Use a DC-DC converter to convert a high input voltageinto a 5V output, and then the LDOs will generate 3.8V, 3.3V and 1.8V typical voltages.
Power-off Sequence: power off VDD_3.3V first, then VDD_1V8.
works normally.
+
C0301
100μF
C0302
100nF
C0303
33pF
C0304
10pF
C0306
100nF
C0307
33pF
C0308
10pF
+
C0305
100μF
D0301
WS4.5D3HV
1 IN3 EN
5OUT4BP
2G
ND
U0303
SGM2019-ADJYN5G/TR
C0320
4.7μF
R0310
39K1%
R031275K1%
C0318
100nFC0321
100nF
C0322
33pF
C0319
1μF
C0315
4.7μF
R030573.2K1%
R030842.2K1%
C0316
100nF
C0313
1μF
C0314
100nF
1 IN3 EN
5OUT4BP
2G
ND
U0302
SGM2019-ADJYN5G/TR
C0317
33pF
R030610K
+ C0311
470μF
1E
N
2 IN
3G
ND
4OUT
5A
DJ
U0301
MIC29302WU
C0312
100nF
C0310
100nF
+ C0309
470μF
R0301100K1%
R030747K1%
R0302
51KR0303330R
Q0301DTC043ZEBTL
R0311
100K
R0309 0R
+ C0325
470μF1E
N
2 IN
3G
ND
4OUT
5A
DJ
U0304
MIC29302WU
C0326
100nF
C0324
100nF
+ C0323
470μF
R0314
75K1%
R031847K1%
R0313
51KR0315330R
Q0304
DTC043ZE
[3,5,14]VBAT
[3,5,14]VBAT
VBAT
VDD_1V8
VDD_3.3V[4,5,14] DC_5V
[4] CODEC_POWER_EN
[4,5,14] DC_5V
VBAT
[4] VBAT_EN
[4,5,14] DC_5V
[3,4,6,11,13,14] VDD_EXT
[4,5,14] DC_5VVDD3V3
[5,7,8] VDD_1V8
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EG21-G
A2
Reference Design
(U)SIM and UART Designs
UART Translation - Transistor Solution
UART Translation - IC Solution
Notes:
(U)SIM Interface
1. There are two translation solutions: transistor solution and IC solution,
3. The transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps.The 1nF capacitors C0402 and C0403 can improve the signal quality.
2. The power supply voltage of VCCA should not exceed that of VCCB.
Notes:1. U401 is recommended to be used to offer good ESD protection,
2. It is recommended to connect the (U)SIM card connector's GND to the module's USIM_GND.
3. The pull-up resistor R0401 can improve anti-jamming capability,
4. R0407~R0409 are used for debugging,
5. C0401 capacitance should be less than 1μF.4. The RTS and DTR transistor circuits are similar to that of RXD interface.
If the ground is complete on customers' PCB, USIM_GND can be connected to PCB ground directly.
and the parasitic capacitance should not be more than 15pF.
and should be placed close to the (U)SIM card connector.
6. For more information about the layout, please refer to
For more information about TXS0108E, please refer to the datasheet from TI.
The CTS, RI and DCD transistor circuits are similar to that of TXD interface.
and C0404~C0406 are used for filtering interference of EGSM900.
and should be placed close to the (U)SIM card connector.
and IC solution is recommended to be selected.
Quectel_EG21-G_Hardware_Design.
Q0401
2SC4617TLQ
Q0402
2SC4617TLQ
R040610K
R0405
10K
R040310K
R040410K
C0401 100nF
1GND
2VPP
3I/O4 CLK
5 RST
6 VCC
78 PRESENCE
J0401
(U)SIM card connector
1
2
3 4 5 6
U0401 ESDA6V8AV6
R0402
51K
C0405
33pF
C0406
33pF
C0404
33pF
R0407 0R
R0408 0R
R0409 0R
R040115K
C0407100nF
R0411120K
R041010K
C0408 100nF
6 A5
7 A6
8 A7
9 A8
10 OE
5 A4
4 A3
19VCCB
20B1
18B2
14B6
13B7
12B8
11GND
3 A2
2 VCCA
1 A1
17B3
16B415B5
U0402
TXS0108E
C0403
1nF
C0402
1nF
[4,6] RXD [3,6]RXD_EG21-G
VDD_EXTVDD_EXT
[4,6] TXD [3,6]TXD_EG21-G
VDD_EXTVDD_MCU
[3]USIM_GND
VDD_EXTUSIM_VDD
[3] USIM_RST
[3] USIM_CLK
[3] USIM_DATA
USIM_VDD
[3] USIM_PRESENCE
VDD_EXT
VDD_EXT VDD_MCU
[3,6] TXD_EG21-G
[3,6] RXD_EG21-G[3] RI_EG21-G
[3] DTR_EG21-G
[4,6]TXD
[4,6]RXD
[4]DTR
[4]RI
[4]CTS
[4]RTS
[3] CTS_EG21-G
[3] RTS_EG21-G
[3] DCD_EG21-G [4]DCD
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EG21-G
A2
Reference Design
Audio Codec Design (ALC5616)
1. ALC5616 power-on sequence: DBVDD/I2C pull-up power/AVDD/DACREF/CPVDD -> MICVDD -> software initialization.Notes:
2. ALC5616 power-off sequence: close codec function by software -> MICVDD -> DBVDD/I2C pull-up power/AVDD/DACREF/CPVDD.3. EG21-G will automatically initialize the codec via I2C interface after it is turned on successfully, so all power supplies for the codec need to be powered on before that.4. Pin AGND and DGND of ALC5616 are connected together through 0R resisitor R0703.
5. The maximum output power of the codec is 30mW when the headphone driver with 32Ω load is used.
2 IN1P/DMC_DAT
3 IN2P4 IN2N/JD2
5D
AC
RE
F6
AV
DD
7A
GN
D
10LOUTR/N
11CPN2
12CPP2
13CPN1
14CPP1
15C
PV
DD
16CPVPP
18CPVREF
19CPVEE
20HPO_L
21 ADCDAT1
22 DACDAT1
23 LRCK1
26SCL
27SDA
28 GPIO1/IRQ1
29D
BV
DD
30D
CV
DD
31M
ICV
DD
32 MICBIAS1
8VREF2
24 BCLK1
1 JD1
9LOUTL/P
17HPO_R
25 MCLK
33D
GN
DU0501
ALC5616
C0504
4.7μF
C0505
4.7μF
C0506
100nF
R0503 0R
C0502
4.7μF
C0503
100nF
C05
112.
2μF
C05
1210
0nF
C05
074.
7μF
C05
0810
0nF
C05
102.
2μF
C0514 2.2μF
C0516 2.2μF
C0513 4.7μF R0507
0R
R0516 NM_10KR05174.7K
R0518
4.7K
C0528 4.7μF
C0523 2.2μFC0524 2.2μF
R0509 0R
R0511 0RR0513 0R
R0515 0R
C0526
NM
C0525
NM
C0527
NM
C0515 2.2μFC0517 2.2μF
R05141K
R05061.5K
R05051K
R05081.5K
C051910μF
R0502 0R
C0518 1μFC0520 1μF
C0521 1μFC0522 1μF
R0510 0RR0512 0R
R05010R
R05040R
C05
09N
M_3
3pF
C0501
NM_33pF
R0519 0RR0520 0R
VD
D_3
.3V
VD
D_1
V8
VDD_3.3V[3,8]I2C_SDA[3,8]I2C_SCL
VD
D_1
V8
VDD_1V8
[3,8] CODEC_PCM_OUT[3,8] CODEC_PCM_IN[3,8] CODEC_PCM_CLK[3,8] CODEC_PCM_SYNC
[7] MIC+[7] MIC-
[8,9]SPK_P[8,9]SPK_N
MICBIAS
[8,9] MIC_P[8,9] MIC_N
MICBIAS
[7]MIC+[7]MIC-
VDD_1V8
[8,9]SPK_R[8,9]SPK_L
1.0
EG21-GPROJECT TITLE
A2
Reference Design
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Power on reset
Differential signals, and are connected to handset and audio power amplifier.
Left and right channels, and are connected to headset.
Delay Circuit
Audio Codec Design (TLV320AIC3104)
1. TLV320AIC3104 power-on sequence: IOVDD -> AVDD/DRVDD -> DVDD -> software initialization.Notes:
2. The RC delay circuit, which is assembled with C0621 and R0608, is used to ensure that the power-on time difference between AVDD and DVDD is within 5ms.
4. EG21-G will automatically initialize the codec via I2C interface after it is turned on successfully,3. The RESET pin must be driven at low level for at least 10ns after all power supplies for TLV320AIC3104 are at their specified values.
5. The AGND and DGND of TLV320AIC3104 are connected together through 0R resisitor R0703 in Sheet 7. so all power supplies for the codec need to be powered on before that.
6.The maximum output power of the codec is 15mW when the surround stereo headphone driver with 32Ω load is used, and is 30mW when the surround stereoheadphone driver with 16Ω load is used.
1M
CLK
2B
CLK
3W
CLK
4D
IN
5D
OU
T
6DVSS
7IOVDD
8S
CL
9S
DA
10 MIC1LP/LINE1LP11 MIC1LM/LINE1LM
12 MIC1RP/LINE1RP13 MIC1RM/LINE1RM
14 MIC2L/LINE2L/MICDET
15 MICBIAS
16 MIC2R/LINE2R
17AVSS1
18DRVDD
19H
PLO
UT
20H
PLC
OM
21DRVSS
22H
PR
CO
M
23H
PR
OU
T
24DRVDD
25AVDD
26AVSS2
27LE
FT_L
OP
28LE
FT_L
OM
29R
IGH
T_LO
P30
RIG
HT_
LOM
31R
ES
ET
32DVDD
33G
ND
U0601TLV320AIC3104
C0619 100nF
C0618 100nF
R06141.5K
R06161.5K
C0613
2.2μF
C06
0510
0nF
C06
1110
uF
C06
061μ
F
C06
0710
0nF
C06
081μ
F
C06
101μ
F
C06
1410
0nF
C06
151μ
F
R0613 0R
C06
1610
0nF
C06
171μ
F
C0622 1μFC0623 1μF
R0607 10K
R0605 0RR0604 0R
R0601 0RR0603 0R
C0612
100nF
C0603
NM
C0601
NM
C0602
NM
C06
0910
0nF
R06091K
R06121K
C0620
10μF
R06104.7K
R06114.7K
R061710K
G
S D
Q0601
Si2333DS-T1-E3
C0621
10nF
R0608100K
Q0602
DTC043ZEBTL
R0615 NM_0R
C0624 22μF
C0604 22μF
R0606 NM_0R
R0602 0R
R0618 0RR0619 0R
R0620 0R
R0621 0R
[7,9] MIC_P[7,9] MIC_N
MICBIAS_3104
[3,7] I2C_SCL[3,7] I2C_SDA
VDD_3.3V
VDD_1V8
[7,9]SPK_P[7,9]SPK_N
DVDD
[3,7] CODEC_PCM_CLK[3,7] CODEC_PCM_SYNC
[7,9]SPK_R
[7,9]SPK_L
[5,7,8] VDD_1V8 [8]DVDD
[5,7,8] VDD_3.3V[8]DVDD
[5,7,8] VDD_1V8
[3,7] CODEC_PCM_OUT[3,7] CODEC_PCM_IN
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EG21-G
A2
Reference Design
Handset Application
Earphone Application
Close to earphone interface
Notes:
Audio Interfaces
CTIA OMTPR0702/R0705R0701/R0704 M
MNMNM
1. The analog output only drives earphone and headset. For larger power loads such as speakers, an audio power amplifier should be added in the design.2. In handset application, both the MIC and SPK signal traces need to be routed as differential pairs.3. In earphone application, the MIC signal traces need to be routed as differential pairs.4. All MIC and SPK signal traces should be routed with total grounding and far away from noise such as clock and DC-DC signals, etc. 5. ALC5616 and TLV320AIC3104 cannot be used simultaneously in audio codec design.
4132
J0701
D07
01
ESD9X5.0ST5G
D07
02
C07
02
33pF
C07
04
33pF
C07
05
10pF
C07
03
10pF
C07
06
33pF
C07
01
10pF
C07
09
10pF
C07
10
33pF
C07
11
10pF
C07
12
33pF
C07
08
33pF
C07
07
10pF
C0713
10pF
C0714
33pF
C0715
4.7μF
D07
03
PESD5V0S1BL
D07
04
R0703 0R
R-0805
1
2
3
45
J0702
C07
16
10pF
C07
17
33pF
D07
05E
SD
9X5.
0ST5
G
R0702 NM_0R
R0701 0R
R0704 0R
R0705 NM_0R
D07
06P
ES
D5V
0S1B
L
C07
18
10pF
C07
19
33pF
D07
07P
ES
D5V
0S1B
L
C07
20
10pF
C07
21
33pF
F0701 0R
F0702 0R
F0704 0RF0703 0R[7,8] SPK_P
[7,8,9] MIC_P[7,8,9] MIC_N
[7,8,9] MIC_N
[7,8] SPK_N
[7,8] SPK_R
[7,8] SPK_L[7,8,9] MIC_P
[7,8,9]MIC_P
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EG21-G
A2
Reference Design
RF and GNSS Designs
Main Antenna Circuit Diversity Antenna Circuit
GNSS Antenna Circuit
Notes:1. It is recommended to use PI type main/Rx-diversity antenna circuit, thus ensuring convenient subsequent debugging.2. The diversity reception function is ON by default. If diversity antenna is not used, there is a need to use AT command to turn off diversity reception. For more details of the AT command, please refer to
3. If an active antenna is selected for the GNSS antenna, a VDD power supply circuit is required; if a passive antenna is selected, the power supply circuit does not needs to be mounted.
Active Antenna
4. The impedance of the RF signal traces must be controlled as 50Ω when routing.
Passive Antenna
The power supply VDD of GNSS needs to be selected according to the requirements of the active antenna.
Quectel_EG21-G_Hardware_Design.
C0801NM
R0801 0R
J0801
C0802NM C0803
NM
R0802 0R
J0802
C0804
NM
L801
47nH
C805
0.1μF
R80310R
C808 100pF
J804
C810NM
C809NM
R0805 0R
[3]ANT_MAIN [3]ANT_DIV
[3]ANT_GNSS
VDD
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Reference Design
To minimize crosstalk, the reset trace must be at least 20mil
R916 should be placed close to AR8033.
The traces of the resistor must be away from other
and the trace width needs to be at least 25mil.
EMI filter is reserved. If LED pins are not used, please keep C0920/C0923/C0924=470pF.
SGMII_MDIO_DAT should be connected to the USIM2_VDD
MODE 2
MODE 1
MODE 0
MODE 3
Ethernet PHY Design
PH
Y_A
D2
PHY_AD1PHY_AD0
traces (especially the clock and MDI interface traces),
The two capacitors should be selected according to the actualload capacitance of crystal and the board-level test results.
Close to AR8033
Notes:1. In the following description, the SGMII data signal refers to the SGMII TX and RX differencial pair, and the SGMII control signal refers to the SGMII_MDIO_CLK, SGMII_MDIO_DATA, EPHY_RST_N and EPHY_INT_N.
3. Keep the maximum trace length of SGMII data signal less than 10 inches and keep the length difference between TX and RX signals less than 20mil.4. The differential impedance of SGMII data signal is 100Ω±10%, and the reference ground of the area should be complete.
EXT_INT_SEL
5. Make sure the trace spacing between SGMII RX and TX signals is at least 3 times of the trace width, and is the same to the adjacent signal traces.6. Module and AR8033 are recommended to be designed on the same PCB. The peripheral circuit layout of Ethernet PHY chip AR8033 should be designed on a
7. RJ45, network transformer, AR8033, and the SGMII interface should be placed as close as possible.
beside the module with a 1.5kΩ pull-up resistor.
away from other signal traces.
L0901, C0913 and C0914 need to be placed close to Pin 3.
2. SGMII data and control signals should be strictly surrounded with ground and kept away from RF, analog, clock and DC-DC signals etc.
four-layer PCB, and the second layer should be total grounded as the AR8033 reference GND.
1 MDC2 RSTN3 LX4 VDD335 INT6 XTLO7 XTLI8 AVDDL9 RBIAS
10 VDDH_REG11 TRXP012 TRXN0
13A
VD
DL
14TR
XP
115
TRX
N1
16A
VD
D33
17TR
XP
218
TRX
N2
19A
VD
DL
20TR
XP
321
TRX
N3
22N
C23
LED
_AC
T24
LED
_100
0 25CLK_25M
26LED_10_100
27RXD3
28RXD2
29VDDIO_REG
30RXD1
31RXD0
32RX_DV
33RX_CLK
34TX_EN
35GTX_CLK
36TXD0
37TX
D1
38TX
D2
39TX
D3
40W
OL_
INT
41S
D42
SO
N43
SO
P44
AV
DD
L45
SIN
46S
IP47
DV
DD
L48
MD
IO49
GN
D
U901AR8033-AL1B-R
R903NM_100K
C910 NM_1μF
R916
2.37K 1%
R908 10K
R906 NM_10K
C921
0.1μF
C9250.1μF
C92
60.
1μF
C911
10μF
C927
1μF
C928
0.1μF
FB902
BLM15AX700SN1D
C922
1μF
C916
0.1μF
C915
100pF
1XTAL
2 GND 3XTAL
4 GND
Y901
25MHz C917
10pF
C918
10pF
C924 NM/470pF
C923 NM/470pF
C919
NM
C920
NM/470pF
D901
GREEN
R915 510R
R901 0R
C908 0.1μFC909 0.1μF
R904 0R
R907 0R
+C904
100μF
C902
33pF
C901
10pF
C903
100nF
C912
0.1μF
FB901
BLM15AX700SN1D
R905 NM_10K
L9014.7μH
C913
10μF
C914
0.1μF
C905
0.1μF
R914 10K
R909 10K
R913 10K
R910 10KR911 10KR912 10K
R917 10KR918 10K
R9021.5K
C906
2.2μF
C907
0.1μF
[3] EPHY_RST_N
[3] EPHY_INT_N
AV
DD
_1V
1
[11]VDD33_SGMII
[3]SGMII_TX_M[3]SGMII_RX_P[3]SGMII_RX_M
[3]SGMII_TX_P
[11] VDD33_SGMII
[11] VDDH_2V5[12] TRXP0[12] TRXN0
[12]TRXP1
[12]TRXN1
[12]TRXP2
[12]TRXN2[12]TRXP3[12]TRXN3
[12]LED_ACT[12]LED_1000
[3] SGMII_MDIO_DATA[3] SGMII_MDIO_CLK
[11] VDD33_SGMII
CLK_25M
[11] VDD33_SGMII [5,13]VDD3V3
[3,4,5,6,13,14] VDD_EXT
[11]
VD
DH
_2V
5
[11]AVDD_1V1
[11] DVDD_1V1
[11]DVDD_1V1
[11] AVDD_1V1
[11]VDDH_2V5
[3]
US
IM2_
VD
D
AV
DD
_1V
1
[11]AVDD_1V1
[11] AVDD_1V1
An external 10kΩ pull-down resistor is required.
Application external
0 = Pull-down, 1 = Pull-up.
Mode select bit 0
Mode select bit 1
Mode select bit 2
Mode select bit 3
weak pull-up/down
01
1
0
0
0
0
0
0
0
0
0
0
0
0
configuration signal weak pull-up/down
EXT_INT_SEL
MODE 0
MODE 1
MODE 2
MODE 3
PHY_AD0
PHY_AD1
PHY_AD2
PHY core
1
Default internal
The upper two bits of the physical address are set to 00.PHY_AD[2:0] set the lower three bits of the physical address.
Description
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A2
Reference Design
Ethernet Network Port Design
Notes:1. Route MDI differential signals with 100Ω±10%, and the reference ground of the area should be complete.2. Keep skew of the MDI differential signals less than 20mil, and the maximum trace length must be less than10 inches.3. The connection method between MDI interface differential line and RJ45 line is 1/2, 3/6, 4/5 and 7/8.4. To minimize crosstalk, the distance between separate adjacent pairs that are on the same layer must be equal to or larger than 40mil.
1 TCT12 TD1+3 TD1-4 TCT25 TD2+6 TD2-7 TCT38 TD3+9 TD3-
10 TCT411 TD4+12 TD4- 13MX4-
14MX4+
15MCT4
16MX3-
17MX3+
18MCT3
19MX2-
20MX2+
21MCT2
22MX1-
23MX1+
24MCT1
U1001
FC3004
C10
03
0.1uF
C10
04
0.1uFC
1005
0.1uF
C10
06
0.1uF
1 TA+
14H
213
H1
3 TB+
5 TC-
7 TD+
2 TA-
4 TC+
6 TB-
8 TD-
9G-10G+
11Y-
12Y+
J1001
FC601-56-LED
R1001 75R 1%
R1003 75R 1%
R1004 75R 1%
R1006 75R 1%
C1001 NM_1000pF/2KV
C1002
1000pF/2KV
R1002 510R
R1007 510RR1005 0R
[11]LED_ACT
[11]LED_1000
[11] TRXP0[11]TRXN0
[11]TRXP1[11]TRXN1
[11]TRXP2[11] TRXN2
[11] TRXP3[11] TRXN3
13
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DATE 2019/12/5
A2
Reference Design
SD Card Interface Design
6. Keep SDIO signals far away from other sensitive circuits/signals such as RF circuits, analog signals, etc, as well as noisy signals such as clock and DC-DC signals, etc.
3. To avoid the jitter of bus, resistors R1204~R1208 are needed to pull up SDIO to VDD_SDIO.
4. In order to adjust signal quality, it is recommended to add 0Ω resistors R1209~R1214 in series between the module and the SD card connector.
9. Make sure the adjacent trace spacing is two times of the trace width and the bus capacitance is less than 15pF.
5. It is recommended to add ESD protection devices near the pins of SD card connector. The parasitic capacitance of ESD protection devices should be smaller than 15pF.
2. The supply voltage range of VDD for SD card is 2.7V~3.6V and sufficient current up to 0.8A needs to be provided.1. The pin 34 (VDD_SDIO) on the module can only be used for SDIO pull-up resistors and its maximum output current is 50mA.Notes:
The bypass capacitors C1206~C1211 are reserved and not mounted by default.
The value of these resistors is between 10kΩ~100kΩ and the recommended value is 100kΩ.
7. Route SDIO signals with 50Ω±10% impedance. It is important to route SDIO signals with total grounding, and the total trace length should be less than 23mm.8. It is recommended to keep the trace length difference between CLK and DATA/CMD less than 1mm.
C1203
100nF
R1209 0R
R1210 0R
R1212 0R
R1213 0R
R1214 0R
R1215120K
D1207
ESD9X3.3ST5G
R12161K
CMD
DATA3
DATA2
DATA0
DATA1
VSS
VDD
CLK
DETECT
J1201
SD card connector
C1206
NM
C1207
NM
C1208
NM
C1209
NM
C1210
NM
C1211
NM
R1204100K
R1205100K
R1206100K
R1207100K
R1208100K
R1211 0R
D1201
ESD9L5.0ST5G
D1202 D1203 D1204 D1205 D1206
R1202
10K
G
S D
Q1201
SI2333C1201
100nF
R1203100K
Q1202
DTC043ZE
R1201 0R
C1204
33pF
C1205
10pF
+
C1202
100uF
VDD_EXT
[3]SD2_INS_DET
[4] SD_PWR_EN
[3] SD2_CLK
[3] SD2_CMD
[3] SD2_DATA3
[3] SD2_DATA2
[3] SD2_DATA1
[3] SD2_DATA0
[3] VDD_SDIO
[5,11] VDD3V3
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DATE 2019/12/5
EG21-G
A2
Reference Design
Reserved Test Points
1. Test points for both USB and debug UART interfaces are reserved for software debugging.2. Test points for USB interface also can be reserved for firmware upgrade.
Indicators
2. For more details about NET_MODE and NET_STATUS, please refer to
Notes:1. The STATUS is an open drain output pin, and its drive current is less than 1mA.
Other Designs
3. Junction capacitance of ESD protection devices on USB data lines should be less than 2pF.
Notes:
3. If the current consumption is required as low as possible when the device is in sleep, replace the power supply of indicators with controllable one.
4. The module's debug UART interface supports 1.8V power domain,
Turn off the power when the module enters sleep mode.
1. It is recommended to reserve USB_BOOT design.Notes:
2. USB_BOOT is kept open by default.When it is at high level, the module will enter download mode.
A level translator should be used if the power domain of customers' application is 3.3V.
Quectel_EG21-G_Hardware_Design.
USB_BOOT Interface
D1307
SD12
D1306
ES
D9L
5.0S
T5G
D1305
ES
D9L
5.0S
T5G
D1309
ES
D9X
3.3S
T5G
D1310
ES
D9X
3.3S
T5G
Q1303
DTC043ZEBTL
R1304
2.2K
D1302
Q1302
DTC043ZEBTL
R13032.2K
D1301
D1311
ES
D9X
3.3S
T5G
1 2
J1301
R1306 4.7K
D1304
ESD9X3.3ST5G
4
5
6
3
2
1
7
8
9
J1302
Connector
R13072.2K
D1312
[3,5,14]VBAT
[3,4]PWRKEY
[3]USB_DP_TEST
[3]USB_DM_TEST
[3,4]USB_VBUS
[3]DBG_RXD
[3]DBG_TXD
[3] NET_STATUS
DC_5V
[3] NET_MODE
DC_5V
[3,4,5,6,11,13] VDD_EXT [3]USB_BOOT
DBG_TXD_FC20
[3] STATUS
VBAT