Design of one chip communication stack processor and MMS communication stack library based on IEC...

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1/22 Eunkyu In Hanyang University, Seoul, Korea [email protected] Design of One Chip Communication Stack Processor and MMS Communication Stack Library Based on IEC 61850

Transcript of Design of one chip communication stack processor and MMS communication stack library based on IEC...

1/22

Eunkyu In

Hanyang University, Seoul, Korea [email protected]

Design of One Chip Communication Stack Processor

and MMS Communication Stack Library Based on IEC 61850

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1.  What is IEC 61850? 2.  Network Processor based vs. Legacy IEDs 3.  Data Structure of IEC61850 in IED 4.  System Layer in IEC61850 5.  Structure of Proposed Processor 6.  Advantages of OneChip SoC and Library 7.  Development Goal 8.  Develop Procedure 9.  IEC 61850 Library 10.  Simulation 11.  Conclusion

Contents

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"   A set of standards associated with“Power systems management on information exchange”

"   Include the application of modern networking to electrical power substation automation such as §  Requirement – define quality requirements(reliability, maintenance, security,…)

§  Configuration – define system configuration §  Protocol – define network protocol requirements

§  Testing – define test requirements

"   MMS(Manufacturing Message Specification), GOOSE(Generic Object Oriented Substation Event), SV(Sampled Value)

"   Run over TCP/IP networks and/or substation LANs §  High speed switched Ethernet (response times with < 4 ms)

What is IEC 61850 ?

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Mapping is required

Network Processor based vs. Legacy IEDs

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" Standardized mapping instead of numbers or indexes in Legacy IED §  Easy to be implemented by IEC 61850 library

" Abstract Communication Service Interface(ACSI) §  Easy to create messages between application and many devices

" Independent network protocol in a substation §  Possible to be applied to all network protocol

" A configurable language §  Exchange information between IED and client

Core Functions of IEC 61850

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"   Properties of Data Objects §  Common logical node information

(e.g. name, health, position…) §  Status Information

(e.g. status of functions] §  Settings (for operation functions) §  Measured values (e.g. CT, VT…) §  Controls (e.g. ON / OFF) §  Protection

Data Structure of IEC 61850 in IED

Data Attribute

Logical Node

Data

Logical Device

Physical Device

"   Functions of Logical devices. e.g. XCBR: circuit breaker

"   Devices for Protection, Measurement, Control

"   Collections of Physical devices

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Device Model

Data Objects

Data Types

Naming Convention

Abstract Common Data Model (Objects, Services)

M A P P I N G MMS

GOOSE / SV

"   SCSM(Specific Communication Service Mapping) : §  Abstract data is mapped to specific standardized data (MMS, GOOSE, SV)

System Layer of IEC61850(1) "   ACSI(Abstract Communication Service Interface) :

Interface for the client and server communications

§  Abstract data structure for IED

§  Support -  Real-time data access and retrieval -  Device Control -  Event reporting and logging -  Communication between Sender (publisher) and receiver (subscriber) -  File transfer capabilities

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Device Model

Data Objects

Data Types

Naming Convention

Abstract Common Data Model (Objects, Services)

M A P P I N G MMS

GOOSE / SV

"  GOOSE(Generic Object Oriented Substation Event) : §  Used for sending trip messages to IED §  Multicast §  Time Limit of GOOSE is less than 4ms §  Send 3 times §  Layer 1 and 2 of OSI 7 Layers are used

"  MMS(Manufacturing Message Specification) :

§  Interface between Users and IEDs for data exchange

§  Used for reporting and requesting IED status

§  Change operating status of IED

§  All of the OSI 7 layers are used "  SV(Sampled Value) :

§  Sent to users from merging unit

§  Values of current and voltage

System Layer of IEC61850(2)

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What is Intelligent Electronic Device (IED)?

"   Functions of IED §  Protection

-  Of Over current and earth fault

§  Control -  Local and remote control

§  Monitoring -  Circuit-break condition, trip circuit, gas density, relay temperature -  Event recording

§  Metering -  Of currents, voltages, active power, reactive power

§  Communication -  With a control center and other IEDs

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Architecture of Legacy IED

CT/PT processor module

DPRAM

Main processor module

Digital input

IEC 61850 processor module

DPRAM

Digital output

DPRAM

Communication module

AB C

PT

CB

CT

Measurement Control4-20mA

PT100Ω

Digital I/O ControlIE

C 61850

Logic (HMI)

processor module

22900

22900

22900

0

1230

1230

1230

0

345

12

1234

98

Vca

Ic

Vbc

Ib

Ia

Vab

HMIVr

Vs

Vt

Vn

Ir

Is

It

In

kW

kAR

kWh

kARh

Hz

PF

Digital Inputs

Digital Outputs

1 2 3 4 5 6 7 8

1 2 3 4 5 6 7 8

HM

I Control

DPRAM

IED

IEC 61850 Wrapper

" The legacy IED consists of 3 H/W boards §  Measurement Control

-  CT/PT processor module : Converts analog(CT/PT) to digital -  Main processor module : Manages total operation of IED

§  HMI control -  Logic Processor module : Controls logic and peripherals, and performs function of IED

§  IEC 61850 -  IEC 61850 processor module : Performs IEC 61850 communication S/W -  Communication module : Performs communications with other IEDs

Control Center

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Structure of Proposed IED

CT/PT processor module

DPRAM

Main processor module

Digital input

IEC 61850 processor module

DPRAM

Digital output

DPRAM

Communication module

AB C

PT

CB

CT

Measurement Control4-20mA

PT100Ω

Digital I/O Control

IEC

61

85

0

Logic (HMI)

processor module

22900

22900

22900

0

1230

1230

1230

0

345

12

1234

98

Vca

Ic

Vbc

Ib

Ia

Vab

HMIVr

Vs

Vt

Vn

Ir

Is

It

In

kW

kAR

kWh

kARh

Hz

PF

Digital Inputs

Digital Outputs

1 2 3 4 5 6 7 8

1 2 3 4 5 6 7 8

HM

I Con

trol

DPRAM

CT/PT processor module

DPRAM

Main processor module

Digital input

IEC 61850 processor module

Digital output

DPRAM

Co

mm

un

icatio

n m

od

ule

AB C

PT

CB

CT

Measurement Control4-20mA

PT100Ω

Digital I/O Control

IEC

61850

Logic (HMI) processor module

22900

22900

22900

0

1230

1230

1230

0

345

12

1234

98

Vca

Ic

Vbc

Ib

Ia

Vab

HMIVr

Vs

Vt

Vn

Ir

Is

It

In

kW

kAR

kWh

kARh

Hz

PF

Digital Inputs

Digital Outputs

1 2 3 4 5 6 7 8

1 2 3 4 5 6 7 8

DPRAM

"   Architecture of Legacy IED "   Architecture of Proposed IED

§  IEC61850 Network Processor = Logic Processor Module + IEC 61850 Processor Module

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§  The Legacy IEC61850 board is big size and power consumption -> OneChip SoC is smaller, lower power

§  Long developing time in legacy IEC61850 board -> OneChip SoC skips the board development

§  Convenience of maintenance and repair – just replaced by SoC, not a board

§  OneChip SoC is 5 times cheaper than of legacy boards

Advantages of OneChip SoC

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§  Programming by OOP, easy to revise and analyze IEC 61850 library

§  Expandabilities and readabilities

§  Convenient GUI

Advantages of IEC 61850 Library

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Development Goal

"   IEC 61850 Network Processor

§  OneChip SoC

§  IEC 61850 Library

§  Logic Editor

OneChip SoC

Logic Editor

IEC 61850 Library

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Develop Procedure of IEC 61850 Network Processor

Logic editor

IEC 61850 Library

"   IEC 61850 Library §  SCL Configurator §  Service §  Communication

"   Logic Editor

Procedure 1

IEC61850 Processor

LogicProcessor

FPGA Mem

ory

LCD

IEC 61850 Platform

"   IEC 61850 Platform

§  IEC 61850 Processor

§  Logic Processor

§  FPGA

§  10/100/1000 Ethernet, I/O

Procedure 2 OneChip SoC

"   IEC 61850 OneChip SoC

§  Dual Processor

§  10/100/1000 Ethernet, I/O

Procedure 3

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IEC61850 Processor

LogicProcessor

FPGA Mem

ory

LCD

SoC

Platform for OneChip SoC

Specification

CPU Two ARM 926EJ-S

FPGA Xilinx vertex 5

High Speed Memory DDR2 SDRAM (SO-DIMM)

PC-133 64MB SDRAM 2MB Asynchronus SRAM Flash ROM 32MB

Communication 2-channel UART 10/100/1000 Ethernet USB 2.0 OTG

Video 4.3”(480 x 272) TFT-LCD

Audio AC97 Audio Codec

Download Port Xilinx Platform Flash

Power Supply Micro-ATX PC Power Supply

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Specification of OneChip SoC

Layout of OneChip SoC

Architecture of OneChip SoC

Specification

Design TSMC 0.13 Logic 1P/8M 1.2V Core 3.3V I/O

Package BGA 528, 27X27x2.23mm

CPU Dual ARM926 / 333MHz

RAM 64MByte

Flash memory 32 Mbyte

Ethernet 10/100/1000 MAC

Other interfaces USB2.0,I2C,SPI,Uart,LCD

I/O

24 freely prog. PIO pins(GPIO), 8 x IRQ, 2x external DMA, 3 timer Inputs/outputs 24-bit address bus, 16-bit data bus Color LCD Controller Nand Flash Controller

Operating Voltage 1.2V/3.3V

Heat dissipation 975mWatt

Temp. range -40 to 85 °C

IEC61850 Library Implementation

Object-Oriented Programming Full IEC 61850

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IEC 61850 Library

" 4 functions in IEC 61850 library

§  SCL Engineering -  Describe functions(LD, LN)

in IED and substation

§  Initialization -  Read LD and LN Values

from CID file

§  Service

-  Create and analyze IEC 61850 MMS message

-  Encode and decode messages

§  Communication -  OSI 7 Layers mapping

CID

SCL Engineering

Initialization

Service

Communication

MMSServerRsp

MMSCOMMREQServMMSCOMMRSPServ

MMSCl ientReq

MMSOPCode

MMSMpl

REQControl

ASN1

COMMServ

ACSEServ

ISOPP (Presentat ion Protocol )

ISOSP (Session Protocol )

ISOTP (Transpor t Protocol )

GeneralSock et

Ini t_SCL

MMSMsgUti lMMSDecoder

Structure of IEC 61850 Library

SSD

ICD

System Configurat

or SCD

IED Configurat

or

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"   All devices in substation are described by SCL engineering.

"   SCL(System Configuration Language)

§  XML type §  ICD(IED Capability Description)

-  Describe functions of LD and LN in IED

§  SSD(System Specification Description) -  Describe single PWR line and LN in the su

bstation

§  SCD(Substation Configured Description) -  Describe functions of the substation by mer

ging ICD and SSD

§  CID(Configured IED Description) -  Describe and configure functions for each I

ED

SCL Engineering

SCL Engineering

SSD ICD

SCD

CID1

CID2

SystemConfigulator

IEDConfigulator

IEC 61850 Station Bus

Ethernet Switch

IEC

61850 P

rocess B

us

Ethernet Switch

System Configurator

IED Configurator

SSD ICD

SCD

CID1

CID2

Control Center

IED

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"   Service Module

COMMServ

ACSEServ

ISOPP

ISOSP

ISOTP

GeneralSocket

"   Communication Layer Module

Functions to set or free the connection and take responsibility for receiving and sending packets.

Functions to provide OSI 7 layer environment of messages.

Functions to negotiate the transfer syntaxes.

Functions to manage session.

Functions to check error.

Functions to manage packets for actual communication.

MMSServerRsp

MMSCOMMRspServ MMSCOMMReqServ

MMSClientReq

MMS Response Packet Creation

MMS Request Packet Analysis

MMS Request Packet Creation

MMS Response Packet Analysis

MMS Response Packet transfer MMS Request Packet transfer

Initialization, Service, Communication

ASN 1 Functions to encode or decode response / request message to ASN. 1 format.

MMSDecoder

REQControl

Functions to decode MMS messages

MMSMpl

MMSMsgUtil MMSOPCode

Functions to manage request messages and check whether the response messages are received or not

Functions to make MMS messages for request / response.

Functions to map variable on MMS messages.

Functions to splits fields of MMS message.

"   Initialization Module

Init_SCL Functions to initialize data_set and read LN, LD data from CID file.

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Simulation

1) Server 2) client

3) Client 4) Server

"   1) server shows data value

"   2) client reads data from the server

"   3) client writes data to server

"   4) confirm data of server

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" Developed network processor (OneChip SoC and Library) for I

EC 61850 will be core functions in Smart Grid

" Network processor with high reliability, small size, low power an

d short period time of development

" Library with expandabilities and readabilities by OOP

" It is easy for users to develop an IED by providing one pass net

work processor

Conclusion