Compact CAN-to-Ethernet Converter Using 32-Bit ARM® Cortex

5 LEDs

USB

50-P

in C

onne

ctor

Debug Connector

MicrocontrollerTM4C129XNCZAD

Power 5.5 V to 3.3 VTPS62177DQC

CANSN65HVD256D

RS485

ESDTPD4E1U06

EthernetConnector

25-MHz Crystal

MII/RMII/SPI/I2C/UART interfaces

EMAC+

PHY

OsSpare 10-Pin

ADC I/Ps and digital I/

SN65HVD72DR

TI DesignsCompact CAN-to-Ethernet Converter Using 32-Bit ARM®Cortex™-M4F MCU

TI Designs Design FeaturesTI Designs provide the foundation that you need • TM4C129XNCZAD 32-Bit Advanced RISCincluding methodology, testing, and design files to Machines (ARM) Cortex-M4F Microcontrollerquickly evaluate and customize the system. TI Designs (MCU) Basedhelp you accelerate your time to market. • Integrated 10/100 Ethernet Media Access Control

(MAC) and Physical Interface Device (PHY)Design Resources• 10/100 Ethernet MAC With Advanced IEEE 1588

Precision Time Protocol (PTP) Hardware and BothTool Folder Containing Design FilesTM4C129XNCZADMedia Independent Interface (MII) and ReducedTPD4E1U06 Product Folder MII (RMII) Support

SN65HVD256D Product Folder• Provision to Connect to External Boards forTPS62177 Product Folder

Isolated Communication Interface and Power OverSN65HVD72DR Product FolderEthernet (POE)INA196AIDBVR Product Folder

• On-Board Non-Isolated Controller Area Network(CAN) and RS-485 PHY

ASK Our E2E Experts • 50-Pin Connector for External Interface With MIIWEBENCH® Calculator Tools and RMII Ethernet PHY

• Expansion Connectors for Access toCommunication, Analog-to-Digital Converter (ADC),Featured Applications and General Purpose Input and Output (GPIO)Interfaces• Industrial Motor Drives and Industrial Automation

• 1024-KB Flash Memory and 256-KB Single-Cycle• Circuit Breakers, Protection Relays, and PanelSystem SRAMMount Multi-Function Power and Energy Meters

• Substation Automation Products: Remote TerminalUnit (RTU), Protection Relay, Intelligent ElectronicDevices (IEDs), Converters, and Gateways

• Industrial Remote Monitoring: Remote I/O and DataLoggers

All trademarks are the property of their respective owners.

1TIDU706A–January 2015–Revised February 2015 Compact CAN-to-Ethernet Converter Using 32-Bit ARM® Cortex™-M4FMCUSubmit Documentation Feedback

Copyright © 2015, Texas Instruments Incorporated

http://www.ti.com/product/tm4c129XNCZAD

http://www.ti.com/product/tpd4e1u06

http://www.ti.com/product/SN65HVD256D

http://www.ti.com/product/tps62177

http://www.ti.com/product/sn65hvd72

http://www.ti.com/product/INA196AIDBVR

http://e2e.ti.com/

http://e2e.ti.com/support/development_tools/webench_design_center/default.aspx

http://e2e.ti.com

http://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=TIDU706A

System Description www.ti.com

An IMPORTANT NOTICE at the end of this TI reference design addresses authorized use, intellectual property matters and otherimportant disclaimers and information.

1 System DescriptionA simple and effective design makes Ethernet the most popular networking solution at the physical anddata link levels of the Open Systems Interconnection (OSI) model. With high speed options and a varietyof media types to choose from, Ethernet is efficient and flexible. In addition, the low cost of Ethernethardware makes Ethernet an attractive option for industrial networking applications. The opportunity to useopen protocols such as TCP/IP over Ethernet networks offers a high level of standardization andinteroperability. The result has been an ongoing shift to the use of Ethernet for industrial control andautomation applications. Ethernet is increasingly replacing proprietary communications.

The CAN-Ethernet Converter is useful in the field of industrial drives monitoring and control as well assupervisory control and data acquisition (SCADA) systems. The same hardware can be used either as aCAN-Ethernet gateway or as a CAN-Ethernet bridge with the changes in the firmware. The CAN-Ethernetgateway is useful for monitoring remote CAN networks over Ethernet or local area network (LAN). TheCAN-Ethernet bridge is useful for the transparent coupling of CAN networks through the internet or LAN.

The reference design platform demonstrates capabilities of the TM4C129XNCZAD 32-bit ARM Cortex-M4F MCU. The design supports 10/100 Base-T and is compliant with the IEEE 802.3 standard. Thereference design operates from a single power supply (5.5-V input with an on-board regulator of 3.3 V).

CAN standard:The CAN bus was developed by BOSCH as a multi-master, message broadcast system that specifies amaximum signaling rate of 1 Mbps. Unlike a traditional network, such as USB or Ethernet, CAN does notsend large blocks of data point-to-point between the nodes under the supervision of a central bus master.In a CAN network, many short messages are broadcast to the entire network, which provides dataconsistency in every node of the system. Although CAN was originally designed for the automotiveindustry, CAN has become a popular bus in industrial applications as well.

CAN bus cable and termination:The High-Speed ISO 11898 standard specifications are given for a maximum signaling rate of 1 Mbps witha bus length of 40 meters and a maximum of 30 nodes. The standard also recommends a maximumun-terminated stub length of 0.3 m. The cable is specified to be a shielded or unshielded twisted-pair witha 120-Ω characteristic impedance (ZO). The standard defines a single line of twisted-pair cable with thenetwork topology as shown in Figure 1. The cable is terminated at both ends with 120-Ω resistors, whichmatch the characteristic impedance of the line to prevent signal reflections. According to ISO 11898, avoidplacing RL on a node because the bus lines lose termination if the node is disconnected from the bus.

Figure 1. Details of a Typical CAN Node

2 Compact CAN-to-Ethernet Converter Using 32-Bit ARM® Cortex™-M4F TIDU706A–January 2015–Revised February 2015MCU Submit Documentation Feedback


http://www.ti.com


www.ti.com Design Features

2 Design Features

ITEM DESCRIPTIONMCU TM4C129XNCZAD 32-bit ARM Cortex

• Built-in 10/100 Ethernet MAC and PHYEthernet• Option for interfacing external 10/100 Ethernet PHY

Ethernet LEDs Activity, link, and speedSN65HVD256 Turbo-CAN transceiver for high data rates andCAN larger networks (meets ISO 11898-2 requirements)

RS485 Half duplex transceiver up to 250 kbpsPower supply Single supply - 3.3 V, 0.5-A output

External interface MII interface connector: 50-pin with an option for power input



http://www.ti.com


5 LEDs

USB

50-P

in C

onne

ctor

Debug Connector

MicrocontrollerTM4C129XNCZAD

Power 5.5 V to 3.3 VTPS62177DQC

CANSN65HVD256D

RS485

ESDTPD4E1U06

EthernetConnector

25-MHz Crystal

MII/RMII/SPI/I2C/UART interfaces

EMAC+

PHY

OsSpare 10-Pin

ADC I/Ps and digital I/

SN65HVD72DR

Block Diagram www.ti.com

3 Block DiagramThe system block diagram of the design is shown in Figure 2.

Figure 2. System Block Diagram

3.1 MCUThe Tiva TM4C129XNCZAD is an ARM Cortex-M4-based microcontroller with a 1024-KB flash programmemory, 256-KB SRAM, and 120-MHz operation; USB host, device, and on-the-go (OTG); Ethernetcontroller, integrated Ethernet PHY, and hibernation module; and a wide range of other peripherals. Seethe TM4C129XNCZAD microcontroller data sheet for complete device details. This device offers 140GPIOs and the internal multiplexer allows different peripheral functions to be assigned to these GPIOpads. The Tiva PinMux Utility can be used to quickly develop pin assignments and the code required toconfigure them.

3.2 EthernetThe TM4C129XNCZAD device supports the following Ethernet interfaces:1. 10/100 Ethernet interface with internal MAC and PHY2. Optional 10/100 Ethernet interface with internal MAC and external PHY—the external PHY is

interfaced with the MII/RMII interface

3.3 Power SupplyThe board is powered from an external, single 5.5-V power supply. The TPS62177 (28-V, 0.5-A step-downconverter) is used in this design to derive 3.3 V from the external input.



http://www.ti.com


www.ti.com Block Diagram

3.4 Non-Isolated RS485 InterfaceThis design uses the SN65HVD72DR device as the RS-485 transceiver. These type of devices are half-duplex transceivers designed for RS-485 data bus networks. Powered by a 3.3-V supply, the transceiversare fully compliant with the TIA/EIA-485A standard. This device features a wide common-mode voltagerange making the device suitable for multi-point applications over long cable runs. SN65HVD72DRdevices are optimized for signaling rates up to 250 kbps.

3.5 Non-Isolated CAN InterfaceThe SN65HVD256 Turbo-CAN transceiver is used for high data rates and large networks (the devicemeets the requirements of ISO 11898-2).

3.6 Expansion ConnectorsExpansion outputs have been provided for further use as required.

3.7 PCB Dimensions and PCB Physical LayoutThis reference design has been designed in a small-form factor, four-layer PCB with a dedicated groundand power plane.

3.8 ProgrammingTiva microcontrollers support the Joint Test Action Group (JTAG) interface for debugging andprogramming. The designer can place headers on the board and connect them to the JTAG pins on thechip (see the datasheet for pin out information). The use of an external JTAG programmer is required toconnect the PC to the board. The Tiva LaunchPad can also be used as an external programmer.

4 Featured ApplicationsThe Tiva C Series ARM Cortex-M4 microcontrollers provide top performance and advanced integration.The product family is positioned for cost-effective applications requiring significant control processing andconnectivity capabilities such as:• Network appliances, gateways, and adapters• Remote connectivity and monitoring• Security and access systems• Human-machine interface (HMI) control panels• Factory automation control• Motion control and power inversion• Electronic point-of-sale (POS) displays• Smart energy and smart grid solutions• Intelligent lighting control

The provided CAN interface can be used for the following applications:• Motor control• Power inverters• Industrial automation• Building automation networks• Automotive applications



http://www.ti.com


Circuit Design and Component Selection www.ti.com

5 Circuit Design and Component SelectionThe CAN-Ethernet converter is based on the TM4C129XNCZAD device, a 32-bit ARM Cortex-M4F core-based microcontroller. The program that runs on this microcontroller uses lwIP (lightweight IP) stack. LwIPis a widely used, open-source TCP/IP stack designed for embedded systems. LwIP was originallydeveloped by Adam Dunkels at the Swedish Institute of Computer Science and is now developed andmaintained by a worldwide network of developers.

5.1 MCUTiva C Series microcontrollers integrate a large variety of rich communication features to enable a newclass of highly connected designs with the ability to allow critical, real-time control between performanceand power. The microcontrollers feature integrated communication peripherals along with other high-performance analog and digital functions to offer a strong foundation for many different target uses,spanning from HMI to networked system management controllers.

In addition, Tiva C Series microcontrollers offer the advantages of ARM's widely available developmenttools, System-on-Chip (SoC) infrastructure, and a large user community. Additionally, thesemicrocontrollers use ARM's Thumb®-compatible Thumb-2 instruction set to reduce memory requirementsand cost. Finally, the TM4C129XNCZAD microcontroller is code-compatible to all members of theextensive Tiva C Series, providing flexibility to fit precise needs.

Some important features of the MCU are as follows:• Performance

– ARM Cortex-M4F processor core, 120-MHz operation; 150-Dhrystone million instructions persecond (DMIPS) performance, 1024-KB flash memory

– 256-KB single-cycle system SRAM, 6KB of electrically erasable programmable read-only memory(EEPROM)

• Communication interfaces– Eight universal asynchronous receivers and transmitters (UARTs); four quad synchronous serial

interface (QSSI) modules with bi-, quad-, and advanced synchronous serial interface (SSI) support;ten Inter-Integrated Circuit (I2C) modules with four transmission speeds, including high-speedmode; CAN 2.0 A male to B male (A/B) controllers; 10/100 Ethernet MAC and Ethernet PHY withIEEE 1588 PTP hardware support; and a USB 2.0 with host, device, and OTG compatibility with alow-pin interface (ULPI) option and link power management (LPM) support

• Analog support– Two 12-bit ADC modules, each with a maximum sample rate of one million samples per second

• One JTAG module with an integrated ARM serial wire debug (SWD)• 212-Ball grid array (BGA) package• Operating range (ambient)

– Industrial (–40°C to 85°C) temperature range– Extended (–40°C to 105°C) temperature range

5.2 EthernetThe TM4C129X supports 10/100 Mbps Ethernet connections. The board is designed to connect directly toan Ethernet network using RJ45 style connectors. The microcontroller contains a fully integrated EthernetMAC and PHY. This integration creates a simple, elegant, and cost-saving Ethernet circuit design.Example code is available for both the unmanaged internet protocol (uIP) and lwIP TCP/IP protocolstacks. The embedded Ethernet on this device can be programmed to act as an HTTP server, client, orboth. The design and integration of the circuit and microcontroller also enable users to synchronize eventsover the network using the IEEE1588 precision time protocol.



http://www.ti.com


Current Measure

EN3

VIN2

SLEEP8

NC4

FB5

PG7

SW9

VOS10

AGND6

PGND1

PW

PD

11

TPS62177DQCU5

12

2.2K

R19

12

1K

R21

12

0

R22

12

22uF, 6.3V

C6

1 2

10uH

L1

IND-WE-7440

1 2

1 Ohm, 1%

R16

12

100K

R51

12

2.2uF 50V

C43

1

TL2

1

TL3

1

TL1

HIB

GND GND

3.3V

GND

HIB

+5V

GND

+5V

GND

12

D8

12

330

R12

12

D15

12

330

R56

GND GND

+5V

3.3V

3.3V

3.9V

D9

1SMB5915BT3G

GND

12

0.1uF

C42

12

22uF, 6.3V

C36

GND

12

0.1uF

C37

1 2

0

R49

NOTE: Pull up resistors and decoupling cap should be located near U1

NOTE: C40 and C66 must be located near pin 2 and 7 of T1

12

49.9

R10

12

49.9

R9

12

49.9

R13

12

49.9

R11

12

4.87K

R41

12

0.1uF

C22

12

0.1uF

C24

12

0.1uF

C1112

0.1uF

C13

12

4700 pF

C9

12

1M

R28

V15V15

V14V14

W13W13

V13V13

W15W15

P17P17

N16N16

R17R17

P16P16

TM4C129XNCZADU2C

TX+1

TX-2

RX+3

TERM1A4

TERM1B5

RX-6

TERM2A7

TERM2B8

CHASISSH2

CHASISSH1

J1

RJ45_NOMAG_NOLED

12

75

R2

9

12

75

R3

4

12

75

R26

12

75

R27

12

1000pF

C8

EN0TX-

EN0RX-

EN0TX+

EN0RX+

TX+_RJ45TX-_RJ45RX+_RJ45

RX-_RJ45

3.3V

GND

3.3V

3.3V

GND GND

3.3V

GND GND

GND

3.3V

GND

CHGND

CHGND

D1+1

D1-6

NC5

GN

D2

D2+3

D2-4

D3

TPD4E1U06DCK

TD+1

TCT2

TD-3

TX-14

TX+16

NC412

NC313

NC14

NC25

CMT15

RD+6

RCT7

RD-8

RX-9

RX+11

CMT10

TRANSMIT

RECEIVE

T1

HX1198FNL

CHGND

www.ti.com Circuit Design and Component Selection

5.2.1 LEDsThe PHY controls three LEDs as shown in Table 1.

Table 1. PHY-LED Control

Pin FunctionPK4 EN0LED0 – LinkPK6 EN0LED1 – ActivityPF1 EN0LED2 – Speed

5.2.2 RJ45 and Isolation TransformerMagnetics are used in Figure 3 with the choke on the side of the PHY.

Figure 3. Magnetics for Ethernet Section

5.3 Power SupplyAs Figure 4 shows, the TPS62177 is programmed to a fixed output voltage of 3.3 V. For the fixed outputvoltage version, the FB pin is pulled low internally by a 400-kΩ resistor. TI recommends connecting the FBpin to AGND to improve thermal resistance.

Figure 4. Power Supply Section



http://www.ti.com


TXD1

GND2

VCC3

RXD4

VRXD5

CANL6

CANH7

S8

SN65HVD256D

U4

CAN1TXCAN1TX

GND

CAN1RXCAN1RX

GND

0.1µF

C30

GND

+5V

CANH

CANL

CANH

CANL

1

2

J6

CANH

CANL

3.3V

120R45


5.3.1 External Component Selection for the Power SupplyThe external components must fulfill the needs of the application, but also the stability criteria of thecontrol loop of the device. The TPS62175/7 is optimized to work within a wide range of externalcomponents. The inductance and capacitance of the LC output filter must be considered together, creatinga double pole that is responsible for the corner frequency of the converter.

5.3.2 Layout Considerations for the Power SupplyThe input capacitor must be placed as close as possible to the IC pins (VIN and PGND). The inductormust be placed close to the SW pin and connect directly to the output capacitor—minimizing the loop areabetween the SW pin, inductor, output capacitor, and PGND pin. The sensitive nodes like FB and VOSmust be connected with short wires instead of nearby high dv/dt signals (for example, the SW pin). Thefeedback resistors must be placed close to the IC and connect directly to the AGND and FB pins.

5.3.3 Thermal Data for the Power SupplyThe TPS62175/7 device is designed for a maximum operating junction temperature (Tj) of 125°C.Therefore the maximum output power is limited by the power losses. As the thermal resistance of thepackage is given, the size of the surrounding copper area and a proper thermal connection of the IC canreduce the thermal resistance.

5.4 Non-Isolated CAN Interface

Figure 5. CAN Interface

As Figure 5 shows, the CAN transceiver SN65HVD256 is used to provide the differential transmit anddifferential receive capabilities to the CAN controller of the MCU. This CAN transceiver meets theISO1189-2 High Speed CAN Physical Layer standard. The transceiver is designed for data rates inexcess of 1 Mbps for CAN in short networks, and enhanced timing margin and higher data rates in longand highly-loaded networks. The device provides many protection features to enhance device and CANnetwork robustness.



http://www.ti.com


1

2

3

4

5

6

J10

HEADER_TMM-103-01-G-D-RA

CAN1TX

CAN1RX

U3RTS

U3RX

U3TX

GND

TX_EN

1 2

3 4

5 6

7 8

9 10

11 12

13 14

15 16

17 18

19 20

21 22

23 24

25 26

27 28

29 30

31 32

33 34

35 36

37 38

39 40

41 42

43 44

45 46

47 48

49 50

J9

ERM8-025-05.0-L-DV-K-TR

GND GND

I2C8SCLI2C8SDASPI3CSSPI3SCKSPI3SDOSPI3SDICAN0RXCAN0TX

SPI0CSSPI0SCKSPI0SDOSPI0SDIU5TXU5RXU7TXU7RX

RESET_N

+5V

12

0

R62

1 20

R58

I2C8SCL

I2C8SDA

SPI3CS

SPI3SCK

SPI3SDO

SPI3SDI

CAN0RX

CAN0TX

RESET_N

U5TX

U5RX

U7TX

U7RX

EN0INTRN

PG0/PPS

1_5V_PS

SPI0CS

SPI0SCK

SPI0SDO

SPI0SDI

MDIOMDC

RXD3RXD2RXD0RXD1RX_DVRX_CLKRX_ER

TX_ENTXD0TXD1TXD2TXD3COLCRS

TX_CLK

TXD0

TXD1

TXD2

TXD3

COL

CRS

MDIO

MDC

TX_CLK

RXD3

RXD2

RXD0

RXD1

RX_DV

RX_CLK

RX_ER3.3V

GND

0.1

R57

0.1µF

C44

GND

MCU_ISENSEMCU_ISENSE

OU

T1

GN

D2

V+

3V

IN+

4

VIN

-5

INA196AIDBVR

U6

EN0TXEREN0TXER

EN0INTRNPG0/PPS

www.ti.com Circuit Design and Component Selection

5.5 Expansion ConnectorsIn the design, peripherals that are not currently used, such as SPI, UART, and I2C signals, are terminatedon the 50-pin SDCC connector as Figure 6 shows.

Figure 6. 50-Pin SDCC Connector

An option to measure the consumption of 3.3 V supplied to the external PHY interface has been provided.The same 50-pin has CAN, UART, SPI, and I2C signals.

5.5.1 Interface for Isolated UART and CAN:Figure 7 shows the connector that can be used to interface with the high-efficiency isolated CAN andProcess Field Bus (PROFIBUS) interface.

Figure 7. Interface for Isolated UART and CAN



http://www.ti.com


1 2

3 4

5 6

7 8

9 10

J7

HEADER_2041501

TMS

TCK

TDO

TDI

3.3V

GND

EXTDBGEXTDBG

T_TRST

12

10K

R17

12

10K

R20

12

10K

R54

12

10K

R52

3.3V

ACTIVITY(GREEN)

VIN5

EN4

GND2

OUT1

OC3

TPS2051BDBVT

U3

12

10

K

R4

2

12

4.7UF 6.3V

C21

12

4.7UF 6.3V

C17

12

10K

R44

12

3300pF

C3

1 2

1M

R7

1 2

D51 2

D4

1 2

D16

GND

USB0DP

USB0DM

USB0VBUSUSB0ID

USB0EPENUSB0PLFT

$$$22985

USB_PLFT

USB_ENUSB_EN

+VBUS

GND

+5V

GND

GND

GND

GND

USB_EN

GND

GND

USB_EN

VB

1

D-

2

D+

3

ID4

G5

6

7

10 11

8

9

J5 ZX62R-AB-5P

USB0DP

USB0DM

USB0ID

USB0VBUSUSB0EPEN

USB0PLFT

3.3V

33R3533R3633R1433R15

CHGND

TP19 TP20

1 210k

R18

EXTDBG

3.3V

1 2

3 4

5 6

7 8

9 10

J3

HEADER_2041501

ADC3

ADC2

ADC1

ADC0

SPARE4

SPARE1

SPARE2

SPARE3

I2C6SCL

I2C6SDA


5.5.2 Optional Interface for USB

Figure 8. Interface for ADC and Spare I/Os

Figure 9. Interface for USB

5.5.3 Programming Connector:The JTAG interface has been provided for programming as shown in Figure 10.

PIN FUNCTIONJTAG test clock signal. This pin is also the SWCLK signal for TCK serial wire debug (SWD)TCK - JTAG connections.

TMS - JTAG JTAG test mode select. This pin is also the SWDIO signal for TMS SWD connections.TDO - JTAG JTAG test data out. This pin is also the SWO signal for SWD connections.

TDI JTAG test data in.Pull this pin low to tri-state the on-board ICDI drive signals. This action prevents the ICDI fromEXT-DBG interfering with an external debug-in connection.

RESET Target reset pin.Ground pin of MCU. Connect this pin to the external JTAG programmer ground pin. In situations

GND where the LaunchPad is used as a programmer, this pin must be connected to the ground pin of theLaunchPad.

Figure 10. Programming Connector



http://www.ti.com


www.ti.com Software Description

6 Software DescriptionThe software provided for the CAN-Ethernet converter performs the CAN-Ethernet gateway operation.Using a PC and the CAN-Ethernet converter, the user can send and receive messages through the Telnetinterface (using a free terminal emulator application such as Tera Term). Telnet is a client-server protocolbased on a reliable connection-oriented transport. Typically, this protocol is used to establish a connectionto TCP port number 23, where a Telnet server application (telnetd) is listening. Tera Term is an open-source, free, software-implemented terminal emulator program. The example software provides testing ofthe hardware by simple character transfers via telnet to the CAN bus and vice versa. The software istested at different CAN baud rates of 10 kbps, 500 kbps, and 1 Mbps.



http://www.ti.com


USB Micro-B-plug-to-USB-A plug cable (connects to PC as a USB device)

DK-TM4C123G Development Board(Connected to USB port of PC, runs UART-CAN software example from TivaWare)

RJ45 Cable(Connecting PC to CAN-

Ethernet Converter)

5.5 V DC Power Supply (on J8)

Twisted pair connecting CANH and CANL terminals

(on J6)

120- Resistor

Test Results www.ti.com

7 Test Results

7.1 Functional Testing

Table 2. Functional Testing Values

Clock 25 MHzVCC (3 to 3.6 V) 3.31 VInternal 1.55 V 1.55 VMII interface OK

Link and activity LED OK

7.2 CAN-Ethernet Gateway Testing

7.2.1 Test SetupFigure 11 shows the test setup.• A 5.5-V DC power supply powers the CAN-Ethernet converter.• This board must be programmed with the CAN to Ethernet software provided. (Note: To program the

TM4C microcontrollers, the user can use the ARM JTAG debugger or the TM4C LaunchPad as aJTAG programmer. For programming, the user can use LM Flash Programmer GUI or Code ComposerStudio (CCS) available on www.ti.com).

• Use a standard RJ45 cable to connect the CAN-Ethernet converter to the PC.• Use the DK-TM4C123G evaluation board available from TI and program the board with the CAN

example software provided in the TivaWare software installation. (Note: TivaWare is available for freedownload on the TI website. When installing in the C:\ drive of the PC, the CAN example software canbe found in the folder C:\ti\TivaWare_C_Series-2.1.0.12573\examples\boards\dk-tm4c123g\can). Thissample program enables sending and receiving of characters via the UART to the CAN bus. Thisboard must be connected to the USB port of the PC. If TivaWare has been previously installed on thePC, the necessary drivers will automatically install and update upon connecting the board to the PC.

• Connect a 120-Ω resistor across the CANH and CANL terminals of the DK-TM4C123G board.• Connect the CAN outputs of the CAN-Ethernet converter and the DK-TM4C123G evaluation board

using a twisted-pair cable.• Download and install the free Tera Term software to use as a terminal emulator for the testing.• Download and install the free Wireshark network analyzer. For installation, right-click on the

downloaded .exe file and click Run as administrator.

Figure 11. Test Setup for Testing CAN-Ethernet Converter



http://www.ti.com

http://www.ti.com/tool/lmflashprogrammer

http://www.ti.com/tool/ccstudio

http://www.ti.com/tool/ccstudio


www.ti.com Test Results

7.2.2 Test Procedure• Assigning the IP address to PC Ethernet port (Figure 12):

– The user must manually assign an IP address to the PC, as the gateway is directly connected tothe PC. Click on the Windows Start button and type view network connections in the Searchprograms and files box. Click on View network connections under the Control Panel heading.

– Find the correct Local Area Connection for the Ethernet port and right-click on it. Select Properties.– Click on Internet Protocol Version 4 and then click the Properties button.– Click on Use the following IP address. Select and assign a compatible address to the port. The

address could be 169.254.31.001. The Subnet mask automatically defaults to 255.255.0.0.– Click OK.– If using a laptop, be sure to disable the wireless LAN connection.

Figure 12. Assigning the IP Address



http://www.ti.com



• Starting the test:– Power up the CAN-Ethernet converter with the Ethernet connected to the PC and run the

Wireshark program.– The CAN-Ethernet software uses auto IP, so the PC automatically assigns an IP to the CAN-

Ethernet converter.– As the Wireshark screen capture from Figure 13 shows, the CAN-Ethernet converter requests the

allocation of an IP address.– The PC allocates the IP address within five seconds. The same allocated address can be seen

from the Wireshark screen capture. For example, in Figure 13 the IP address allocated to the CAN-Ethernet board is 169.254.254.255.

Figure 13. Wireshark Capture

• Power up the DK-TM4C123G device by connecting to the USB of the PC.• Open the Tera Term program for creating a new connection, as Figure 14 shows. Select TCP/IP and

Telnet. Type in the IP address allocated to the CAN-Ethernet converter in the Host field. For example,if the IP address allocated is 169.254.254.255, enter that as the address.

Figure 14. Tera Term Telnet Connection



http://www.ti.com



• Open the Tera Term again for creating a new connection. Now select Serial and select the port onwhich the USB-COM driver of the DK-TM4C123G device is mounted. The port number becomesvisible in the Serial selection box. As Figure 15 shows, set the Baud rate field to "115200" , the Datafield to "8 bit", the Parity field to "none", the Stop field to "1 bit", and the Flow control field to "none".

Figure 15. Serial Communication Settings

• The user can now type in either the Telnet Tera Term connection or the Serial COM Tera Termconnection and observe the characters transmitting to the other terminal. Basically, through the SerialCOM Tera Term window, the DK-TM4C123G board receives the data from UART and sends the datato the CAN bus. The CAN-Ethernet board receives the data from the CAN bus and sends the data toEthernet. Similarly, the data can flow the other direction, as well.

NOTE: On modifying the (CAN-Ethernet Gateway) software: The example software is tested withCode Composer Studio V6. If the user wants to open, modify, or recompile the project,installing the CCS installation is required. The example software also uses the resourcesfrom TivaWare—the compiled project refers to the TivaWare installation at the defaultinstallation path C:\ti\TivaWare_C_Series-2.1.0.12573. The options and settings of theproject require updating if the TivaWare version number or the installation path is different.

7.3 Electromagnetic Interference-Radiated EmissionThe test distance for radiated emission from the equipment under test to antenna is 10 m. The test wasperformed in a semi-anechoic chamber, which conforms to the Volumetric Normalized Site Attenuation(VNSA) for ten-meter measurements.

Table 3. Specifications for Radiated Emissions

FREQUENCY RANGE CLASS A LIMITS QUASI-PEAK CLASS B LIMITS QUASI-PEAK30 MHz to 230 MHz and 230 MHz to 1 40 and 47 dB μV/m 30 and 37 dB μV/m

GHz

Table 4. Observation for Radiated Emissions

REQUIREMENTS FREQUENCY RESULTEN 55011: 2009 + A1: 2010, Class A 30 MHz to 1000 MHz Pass



http://www.ti.com



7.3.1 Test Result GraphsThe test is done with the TM4C129XNCZAD 32-bit ARM Cortex-M4F MCU with the internal MAC andPHY enabled. Figure 16 and Figure 17 show the graphs for horizontal and vertical polarization,respectively.

Figure 16. Horizontal Polarization

Figure 17. Vertical Polarization



http://www.ti.com



7.4 Electro Static Discharge (ESD), Electromagnetic Interference (EMI), andElectromagnetic Compatibility (EMC) Recommendations and Design GuidelinesThe following list provides recommendations to improve EMI performance:1. Use a guard ring for the crystal.2. Use a metal-shielded RJ-45 connector to connect the shield to chassis ground.3. Use magnetics with integrated, common-mode choking devices with the choke on the side of the PHY

(for example, the Pulse HX1198FNL).4. Do not overlap the circuit and chassis ground planes, keep them isolated. Connect the chassis ground

and system ground together using one capacitor with 4700 pF, 2 kV, 10% tolerance, and an X7R type.



http://www.ti.com

http://www.pulseelectronics.com/products/datasheets


External Ethernet PHY

NOTE: To guarantee risetime requirements

MII/RMII

12

0.1uF

C23

12

0.1uF

C5

12

0.1uF

C25

21

25MHz

Y1

12

1uF

C26

12

0.01UF

C29

12

1uF

C32

12

0.01 uF

C34

12

0.1uF

C16

12

1uF

C20

12

2.2 uF

C18

12

0.01uF

C27

12

0.1uF

C31

12

0.01uF

C28

12

0.1uF

C33

12

0.1uF

C40

12

0.1uF

C38

12

0.1uF

C35

12

0.01 uF

C4

V3V3

W3W3

T6T6

U5U5

V4V4

W4W4

V5V5

R7R7

A16A16

B16B16

A17A17

B17B17

C6C6

B6B6

F2F2

F1F1

B15B15

C15C15

D14D14

C14C14

M2M2

M1M1

L2L2

K3K3

C2C2

C1C1

D2D2

D1D1

A4A4

B4B4

B3B3

B2B2

H3H3

H2H2

G1G1

G2G2

A5A5

B5B5

A7A7

B7B7

U6U6

V6V6

W6W6

T7T7

V7V7

W7W7

T8T8

U8U8

N15N15

T14T14

V11V11

M16M16

K17K17

K15K15

V12V12

U14U14

P4P4

R2R2

R1R1

T1T1

R3R3

T2T2

U2U2

V2V2

C8C8

E7E7

H17H17

F16F16

F18F18

E17E17

N1N1

K5K5

J1J1

J2J2

K1K1

K2K2

U19U19

V17V17

V16V16

W16W16

G16G16

H19H19

G18G18

J18J18

H18H18

G19G19

C18C18

B18B18

K18K18

K19K19

L18L18

L19L19

M18M18

G15G15

N19N19

N18N18

C10C10

B11B11

A11A11

B10B10

A10A10

B9B9

T12T12

U12U12

D6D6

D7D7

B13B13

C12C12

D8D8

B12B12

B8B8

A8A8

E3E3

E2E2

H4H4

M4M4

A13A13

W12W12

U15U15

M3M3

N5N5

N4N4

N2N2

V8V8

P3P3

P2P2

W9W9

R10R10

D12D12

D13D13

B14B14

A14A14

V9V9

T13T13

U10U10

R13R13

W10W10

V10V10

E18E18

F17F17

TM4C129XNCZADU2A

P18P18

T18T18

T19T19

R18R18

E19E19

D19D19

D18D18

G4G4

L8L8

L9L9

M8M8

M9M9

N10N10

V1V1

W1W1

W2W2

M10M10

K10K10

K13K13

K14K14

K6K6

K9K9

F10F10

J11J11

J12J12

H10H10

H11H11

H12H12

A1A1

A18A18

A19A19

A2A2

B1B1

B19B19

P19P19

M17M17

U18U18

F4F4

G5G5

F3F3

L10L10

L11L11

J8J8

J9J9

L12L12

M11M11

M12M12

P10P10

K11K11

K12K12

K7K7

K8K8

G10G10

H9H9

J10J10

V18V18

V19V19

W18W18

W19W19

E13E13

C5C5

H16H16

E10E10

TM4C129XNCZADU2B

12

10K

R39

1 20

R4

12

10K

R33

1 251

R31

12

0.1uF

C12

12

0.1uF

C39

12

0.1uF

C41

XOSC0

GNDX

MOSC0

GNDX2

MOSC1

RESET

HIBWAKE

CAN1RXCAN1TX

USB0DPUSB0DMUSB0VBUSUSB0IDUSB0EPENUSB0PLFT

DEBUG_RXDEBUG_TXTCKTMSTDITDO

PF1/LED2

MDIORX_DVRX_ERTX_CLK

TX_ENEN0TXEREN0INTRNCOLCRSRXD0RXD1RXD2RXD3EN0RREF_CLK

TXD0

TXD2TXD3

MDC

RESET_N

U5RXU5TX

I2C8SCLI2C8SDA

PQ7/LED_GADC3ADC2ADC1ADC0

U3RXU3TXSPI0SCKSPI0CS

U7RXRX_CLK

SPI0SDOSPI0SDI

CAN0RXCAN0TXPP6PD0/AIN15PD1/T0CCP0

U3RTSU3CTSI2C6SCLI2C6SDA

U7TX

EXTDBG

PE4

VB

AT

GND

RESET

HIB

WAKE

3.3V

GNDGNDGND GND

VDDC_1P2V_INT

GND

GND

3.3V

PF1/LED2

GND

GND GND

GND

MDIO

RX_DV

RX_ER

TX_CLK

TX_EN

EN0TXER

EN0INTRN

COL

CRS

RXD0

RXD1

RXD2

RXD3

EN0RREF_CLK

TXD0

TXD1

TXD2

TXD3

MDC

RESET_N

U5RX

U5TX

I2C8SCL

I2C8SDA

PQ7/LED_G

ADC3

ADC2

ADC1

ADC0

U3RX

U3TX

SPI0SCK

SPI0CS

U7RX

RX_CLK

SPI0SDO

SPI0SDI

CAN0RX

CAN0TX

PP6

PD0/AIN15

PD1/T0CCP0

U3RTS

U3CTS

I2C6SCL

I2C6SDA

3.3V

GND

3.3V

U7TX

EXTDBG

PE4

3.3V

SPI3CSSPI3SCKSPI3SDOSPI3SDI

1 2

3 4

SW1

RESETRESET

GND

DEBUG_RX

DEBUG_TX

TCK

TMS

TDI

TDO

SPI3CS

SPI3SCK

SPI3SDO

SPI3SDI

SPARE4

SPARE5

USB0DP

USB0DM

USB0VBUS

USB0ID

USB0EPEN

USB0PLFT

CAN1TX

CAN1RX

12

1uF

C19

T_TRST

SPARE6

EN0RREF_CLK TX_CLK

SPARE1

SPARE2

SPARE3SPARE3SPARE2SPARE1

SPARE4SPARE5SPARE6


PG0/PPSPG0/PPS

33R46

TXD1

1 2

2.2K

R1

1 2

2.2K

R2

3.3V

12

2.2K

R59

12

2.2K

R61

3.3V

1.0Meg

R5

12

FB11000 OHM

33R43

12

0

R30

12

0R37

12

0R32

12

0

R38

33pFC14

33pFC15

1 20R401 20R471 20R61 20R8

2.2k

R3

2.2k

R60

33pFC45

33pFC46

33pFC47

33pFC48

GND GND GND GND

Design Files www.ti.com

8 Design Files

8.1 Schematics

Figure 18. Microcontroller Schematic

18 Compact CAN-to-Ethernet Converter Using 32-Bit ARM® Cortex™-M4F MCU TIDU706A–January 2015–Revised February 2015Submit Documentation Feedback


http://www.ti.com


NOTE: Pull up resistors and decoupling cap should be located near U1

NOTE: C40 and C66 must be located near pin 2 and 7 of T1

ACTIVITY(GREEN)

SPEED(AMBER)

LINK(RED)

12

49.9

R10

12

49.9

R9

12

49.9

R13

12

49.9

R11

12

4.87K

R41

12

0.1uF

C22

12

0.1uF

C24

12

0.1uF

C1112

0.1uF

C13

12

4700 pF

C9

12D12

1 2

330

R50

12

1M

R28

VIN5

EN4

GND2

OUT1

OC3

TPS2051BDBVT

U3

12

10K

R42

12

4.7UF 6.3V

C21

12

4.7UF 6.3V

C17

V15V15

V14V14

W13W13

V13V13

W15W15

P17P17

N16N16

R17R17

P16P16

TM4C129XNCZADU2C

12

10K

R44

12

3300pF

C3

1 2

1M

R7

1 2

D51 2

D4

1 2

D16

TX+1

TX-2

RX+3

TERM1A4

TERM1B5

RX-6

TERM2A7

TERM2B8

CHASISSH2

CHASISSH1

J1

RJ45_NOMAG_NOLED

12

75

R29

12

75

R34

12

75

R26

12

75

R27

12

1000pF

C8

12D14

1 2

330

R55

12D13

1 2

330

R53

GND

USB0DP

USB0DM

USB0VBUSUSB0ID

USB0EPENUSB0PLFT

PF1/LED2

RXD3

TXD2

EN0TX-

EN0RX-

EN0TX+

EN0RX+

LED1

LED1

LED2

LED2

LED0

LED0

$$$22985

USB_PLFT

USB_ENUSB_EN

TX+_RJ45TX-_RJ45RX+_RJ45

RX-_RJ45

3.3V

GND

3.3V

3.3V

GND GND

3.3V

GND GND

GND

RXD3

TXD2

PF1/LED2

LED0

LED1

LED2

+VBUS

GND

+5V

GND

GND

GND

GND

3.3V

GND

USB_EN

GND

GND

USB_EN

GND

LED2

CHGND

CHGND

LED1

LED0

VB

1

D-

2

D+

3

ID4

G5

6

7

10 11

8

9

J5 ZX62R-AB-5P

USB0DP

USB0DM

USB0ID

USB0VBUSUSB0EPEN

USB0PLFT

3.3V

33R3533R3633R1433R15

CHGND

1 20

R24

1 20

R23

1 20

R48

TP19 TP20

D1+1

D1-6

NC5

GN

D2

D2+3

D2-4

D3

TPD4E1U06DCK

TD+1

TCT2

TD-3

TX-14

TX+16

NC412

NC313

NC14

NC25

CMT15

RD+6

RCT7

RD-8

RX-9

RX+11

CMT10

TRANSMIT

RECEIVE

T1

HX1198FNL

CHGND

www.ti.com Design Files

Figure 19. 10/100 Ethernet USB Schematic

19TIDU706A–January 2015–Revised February 2015 Compact CAN-to-Ethernet Converter Using 32-Bit ARM® Cortex™-M4F MCUSubmit Documentation Feedback


http://www.ti.com


GND

RS485-A

RS485-B

RS485-A

RS485-B

10µFC1

0.1µFC2

0.1µFC10

3.3V

GND

R1

RE2

DE3

D4

GND5

A6

B7

VCC8

U1

SN65HVD72DR

TXD1

GND2

VCC3

RXD4

VRXD5

CANL6

CANH7

S8

SN65HVD256D

U4

CAN1TXCAN1TX

GND

CAN1RXCAN1RX

GND

0.1µF

C30

GND

+5V

U3RTS

U3TX

U3RX

U3TX

CANH

CANL

CANH

CANL

1

2

J6

1

2

J2

CANH

CANL

RS485-A

RS485-B

1

3

2

D6DESD1P0RFW-7

1

3

2

D7DESD1P0RFW-7

1

3

2

D2DESD1P0RFW-7

1

3

2

D1DESD1P0RFW-7

GND

3.3V

CANH CANL RS485-B RS485-A

0.1µFC7

1

2

3

4

5

6

J10

HEADER_TMM-103-01-G-D-RA

CAN1TX

CAN1RX

U3RTS

U3RX

U3TX

GND

3.3V

120R45 120

R25


Figure 20. CAN, RS485 Schematic



http://www.ti.com


TX_EN

1 2

3 4

5 6

7 8

9 10

11 12

13 14

15 16

17 18

19 20

21 22

23 24

25 26

27 28

29 30

31 32

33 34

35 36

37 38

39 40

41 42

43 44

45 46

47 48

49 50

J9

ERM8-025-05.0-L-DV-K-TR

GND GND


SPI0CSSPI0SCKSPI0SDOSPI0SDIU5TXU5RXU7TXU7RX

RESET_N

A2

K1

D10

DFLS1200-71

2

J8

GND

+5V

12

0

R62

+5V

1 20

R58

I2C8SCL

I2C8SDA

SPI3CS

SPI3SCK

SPI3SDO

SPI3SDI

CAN0RX

CAN0TX

RESET_N

U5TX

U5RX

U7TX

U7RX

EN0INTRN

PG0/PPS

1_5V_PS

SPI0CS

SPI0SCK

SPI0SDO

SPI0SDI

MDIOMDC

RXD3RXD2RXD0RXD1RX_DVRX_CLKRX_ER

TX_ENTXD0TXD1TXD2TXD3COLCRS

TX_CLK

TXD0

TXD1

TXD2

TXD3

COL

CRS

MDIO

MDC

TX_CLK

RXD3

RXD2

RXD0

RXD1

RX_DV

RX_CLK

RX_ER3.3V

GND

0.1

R57

0.1µF

C44

GND


OU

T1

GN

D2

V+

3V

IN+

4

VIN

-5

INA196AIDBVR

U6

EN0TXEREN0TXER

EN0INTRNPG0/PPS

1

3

2

D11DESD1P0RFW-7

GND

+5V

TP6

TP17

TP12

TP13


SPI0SCKSPI0SDOSPI0SDIU5TXU5RXU7TXU7RX

RESET_N

I2C8SCL

I2C8SDA

SPI3CS

SPI3SCK

SPI3SDO

SPI3SDI

CAN0RX

CAN0TX

RESET_N

U5TX

U5RX

U7TX

U7RX

SPI0CS

SPI0SCK

SPI0SDO

SPI0SDI

EN0TXEREN0TXER

TP5

TP14

TP7

TP8

TP4

TP3

TP1

TP2

TP18

SPI0CS

TP15

TP16

TP11

TP10

TP9


Figure 21. MII and RMII Interface Schematic



http://www.ti.com


1 210k

R18

EXTDBG

3.3V

1 2

3 4

5 6

7 8

9 10

J7

HEADER_2041501

TMS

TCK

TDO

TDI

3.3V

GND

EXTDBGDEBUG_TX

DEBUG_RX

EXTDBG

T_TRST

12

10K

R17

12

10K

R20

12

10K

R54

12

10K

R52

3.3V

1

2

J4

1 2

3 4

5 6

7 8

9 10

J3

HEADER_2041501

ADC3

ADC2

ADC1

ADC0

SPARE4

SPARE1

SPARE2

SPARE3

I2C6SCL

I2C6SDA

Current Measure

EN3

VIN2

SLEEP8

NC4

FB5

PG7

SW9

VOS10

AGND6

PGND1

PW

PD

11

TPS62177DQCU5

12

2.2K

R19

12

1K

R21

12

0

R22

12

22uF, 6.3V

C6

1 2

10uH

L1

IND-WE-7440

1 2

1 Ohm, 1%

R16

12

100K

R51

12

2.2uF 50V

C43

1

TL2

1

TL3

1

TL1

HIB

GND GND

3.3V

GND

HIB

+5V

GND

+5V

GND

12

D8

12

330

R12

12

D15

12

330

R56

GND GND

+5V

3.3V

3.3V

3.9V

D9

1SMB5915BT3G

GND

12

0.1uF

C42

12

22uF, 6.3V

C36

GND

12

0.1uF

C37

1 2

0

R49


Figure 22. Power Supply Schematic

Figure 23. Spare and Debug Schematic



http://www.ti.com



8.2 Bill of MaterialsTo download the bill of materials (BOM), see the design files at TIDA-00203.

Table 5. BOM

FITTED QTY REFERENCE PART DESCRIPTION MANUFACTURER MANUFACTURER PART #Fitted 1 C1 CAP, CERM, 10uF, 6.3V, +/-20%, X5R, 0603 Kemet C0603C106M9PACTUFitted 3 C2, C7, C10 CAP, CERM, 0.1uF, 16V, +/-10%, X5R, 0603 MuRata GRM188R61C104KA01DFitted 1 C3 Capacitor, 3300pF, 50V, 10%, X7R, 0603 TDK Corporation C1608X7R1H332KFitted 4 C4, C27, C28, C34 Capacitor, 0.01uF 25V, 10% 0402 X7R Taiyo Yuden TMK105B7103KV-F

C5, C11, C12, C13, C16, C22, C23, C24,Fitted 16 Capacitor, 0.1uF 50V, 20% 0603 X7R TDK Corporation C1608X7R1H104MC25, C35, C37, C38, C39, C40, C41, C42Fitted 1 C6 Capacitor, 22uF 6.3V 20% X5R 0805 TDK Corporation C2012X5R0J226MFitted 1 C8 CAP CER 1000PF 2KV 20% X7R 1210 KEMET C1210C102MGRACTUFitted 1 C9 Capacitor, 4700pF, 2kV, 10%, X7R, 1812 AVX 1812GC472KAT1AFitted 6 C14, C15, C45, C46, C47, C48 CAP, CERM, 33pF, 50V, +/-5%, C0G/NP0, 0402 MuRata GRM1555C1H330JA01DFitted 2 C17, C21 Capacitor, 4.7uF, 6.3V, 10% 0805, X5R Taiyo Yuden JMK212BJ475KG-TFitted 1 C18 Capacitor, 2.2uF, 16V, 10%, 0603, X5R Murata GRM188R61C225KE15DFitted 4 C19, C20, C26, C32 Capacitor, 1uF , X5R, 10V, 0402 TDK Corporation C1005X5R1A105M050BBFitted 3 C29, C31, C33 Capacitor, 0.1uF 16V, 10% 0402 X7R Taiyo Yuden EMK105B7104KV-FFitted 2 C30, C44 CAP, CERM, 0.1uF, 25V, +/-5%, X7R, 0603 AVX 06033C104JAT2AFitted 1 C36 Capacitor, 22uF 6.3V 20% X5R 0805 TDK Corporation C2012X5R0J226M/1.25Fitted 1 C43 Capacitor, 2.2uF 50V 10% X5R 0805 TDK Corporation C2012X5R1H225KFitted 5 D1, D2, D6, D7, D11 Diode, P-N, 70V, 0.2A, SOT-323 Diodes Inc DESD1P0RFW-7

Quad Channel High Speed ESD Protection Device,Fitted 1 D3 Texas Instruments TPD4E1U06DCKDCK0006AFitted 3 D4, D5, D16 Diode, 5.6V ESD Suppressor 0402 Epcos B72590D0050H160Fitted 2 D8, D14 LED, Green 565nm, Clear 0805 SMD Lite on LTST-C171GKTFitted 1 D9 Diode, Zener, 3.9V, 550mW, SMB ON Semiconductor 1SMB5915BT3GFitted 1 D10 Diode, Schottky, 200V, 1A, PowerDI123 Diodes Inc. DFLS1200-7Fitted 2 D12, D15 LED AMBER CLEAR 0805 SMD Lite on LTST-C170AKTFitted 1 D13 LED, Red 630nm, Clear 0805 SMD Lite on LTST-C171EKTFitted 1 FB1 FERRITE CHIP 1000 OHM 300MA 0603 TDK Corporation MMZ1608B102CFitted 6 FID1, FID2, FID3, FID4, FID5, FID6 Fiducial mark. There is nothing to buy or mount. N/A N/A

Machine Screw, Round, #4-40 x 1/4, Nylon, PhilipsFitted 6 H1, H2, H3, H4, H5, H6 B&F Fastener Supply NY PMS 440 0025 PHpanheadFitted 1 J1 Connector, RJ45 NO MAG, shielded THRU HOLE TE conncetivity 6116526-1Fitted 4 J2, J4, J6, J8 Terminal Block, 4x1, 2.54mm, TH On Shore Technology Inc OSTVN02A150



http://www.ti.com

http://www.ti.com/tool/TIDA-00203



Table 5. BOM (continued)FITTED QTY REFERENCE PART DESCRIPTION MANUFACTURER MANUFACTURER PART #Fitted 2 J3, J7 Header, 2X5 2mm spacing Harwin Inc M22-2020505

Connector, USB micro AB Receptacle ReversedFitted 1 J5 HIROSE ELECTRIC CO. LTD. ZX62R-AB-5PSMDFitted 1 J9 CONN MICRO HS TERM STRP HDR 50 POS Samtec ERM8-025-05.0-L-DV-K-TRNot 0 J10 Header, 2mm, Low Profile 2x3 Samtec TMM-103-01-G-D-RAFitted

Fitted 1 L1 Inductor 10uH, SMD 2.8x2.8mm, 0.5A, 0.47 Ohm Wurth Electronics Inc 744029100Not Thermal Transfer Printable Labels, 0.650 W x 0.200"0 LBL1 000 per roll" BradyFitted H - 10

Fitted 5 R1, R2, R19, R59, R61 Resistor, 2.2K OHM 1/10W 5% 0603 SMD Vishay-Dale CRCW06032K20JNEAFitted 2 R3, R60 RES, 2.2k ohm, 5%, 0.063W, 0402 Vishay-Dale CRCW04022K20JNED

R4, R6, R8, R23, R24, R30, R32, R37, Panasonic ElectronicFitted 12 Resistor, 0 ohm, 1/10W, 5%, 0402 ERJ-2GE0R00XR38, R40, R47, R48 ComponentsNot 0 R5 RES, 1.0Meg ohm, 5%, 0.063W, 0402 Vishay-Dale CRCW04021M00JNEDFitted

Panasonic ElectronicFitted 1 R7 Resistor, 1M OHM 1/10W 5% 0603 SMD ERJ-3GEYJ105VComponentsPanasonic ElectronicFitted 4 R9, R10, R11, R13 Resistor, 49.9 OHM 1/10W 1% 0603 Thick ERJ-3EKF49R9VComponentsPanasonic ElectronicFitted 2 R12, R56 Resistor, 330 ohm, 1/10W, 5%, 0402 RC0402FR-07330RLComponents

Fitted 5 R14, R15, R35, R36, R46 RES, 33 ohm, 5%, 0.063W, 0402 Vishay-Dale CRCW040233R0JNEDPanasonic ElectronicFitted 1 R16 Resistor, 1 OHM 1/10W 1% 0603, Thick ERJ-3RQF1R0VComponents

Fitted 8 R17, R18, R20, R33, R39, R44, R52, R54 Resistor, 10k ohm, 1/10W, 5%, 0402 Thick Film Yageo America RC0402FR-0710KLPanasonic ElectronicFitted 1 R21 Resistor, 1K Ohm, 1/10W, 5%, SMD, Thick ERJ-3GEYJ102VComponentsPanasonic ElectronicFitted 4 R22, R49, R58, R62 Resistor, 0 OHM 1/10W 0603 SMD ERJ-3GEY0R00VComponents

Fitted 2 R25, R45 RES, 120 ohm, 1%, 0.25W, 1206 Yageo America RC1206FR-07120RLPanasonic ElectronicFitted 4 R26, R27, R29, R34 Resistor, 75 Ohm, 1/10W, 1%, SMD, Thick ERJ-3EKF75R0VComponentsPanasonic ElectronicFitted 1 R28 RES 1M OHM 5% 1206 TF ERJ-8GEYJ105VComponentsPanasonic ElectronicFitted 1 R31 Resistor, 51 ohm, 1/10W, 5%, 0402 ERJ-2GEJ510XComponentsPanasonic ElectronicFitted 1 R41 Resistor, 4.87K Ohm, 1/10W, 1%, SMD, Thick ERJ-3EKF4871VComponents



http://www.ti.com



Table 5. BOM (continued)FITTED QTY REFERENCE PART DESCRIPTION MANUFACTURER MANUFACTURER PART #

Panasonic ElectronicFitted 1 R42 Resistor, 10K OHM 1/10W 5% 0603 SMD ERJ-3GEYJ103VComponentsNot 0 R43 RES, 33 ohm, 5%, 0.063W, 0402 Vishay-Dale CRCW040233R0JNEDFitted

Panasonic ElectronicFitted 3 R50, R53, R55 Resistor, 330 OHM 1/10W 5% 0603 SMD ERJ-3GEYJ331VComponentsPanasonic ElectronicFitted 1 R51 Resistor, 100K OHM 1/10W 5% 0603 Thick ERJ-3GEYJ104VComponents

Fitted 1 R57 RES, 0.1 ohm, 1%, 0.1W, 0603 Panasonic ERJ-3RSFR10VFitted 1 SW1 Switch, Tact 6mm SMT, 160gf Omron Electronics Inc-EMC Div B3S-1000

TRANSFORMER, MDL, XFMR SGL ETHR LAN,Fitted 1 T1 PULSE ELECTRONICS HX1198FNLSOIC-16Fitted 1 U1 IC, RS485 TRANSCEIVER LP, 8-SOIC Texas Instruments SN65HVD72DRFitted 1 U2 Stellaris MCU TM4C129XNCZAD 212 BGA Texas Instruments TM4C129XNCZADFitted 1 U3 Load Switch, 5.5V, SOT23-5, TPS2051BDBV Texas Instruments TPS2051BDBVT

CAN Transceiver with Fast Loop Times for HighlyFitted 1 U4 Loaded Networks, 85 mA, 5 V, -40 to 125 degC, 8- Texas Instruments SN65HVD256D

pin SOIC (D), Green (RoHS & no Sb/Br)Fitted 1 U5 Regulator, Step Down 3.3V, 0.5A Texas Instruments TPS62177DQC

IC, Current Shunt Monitor, -16V to 80V Common-Fitted 1 U6 Texas Instruments INA196AIDBVRMode RangeFitted 1 Y1 Crystal, 25.00MHz 5.0x3.2mm SMT CTS-Frequency Controls 445I23D25M00000



http://www.ti.com



8.3 PCB LayoutThe complete board is designed in a 2 × 3 inch form-factor PCB. To download the layer plots, see thedesign files at TIDA-00203.

Figure 24. Top Soldermask Figure 25. Top Overlay

Figure 26. Top Layer Figure 27. L2 GND Plane



http://www.ti.com




Figure 28. L3 PWR Plane Figure 29. Bottom Layer

Figure 30. Bottom Soldermask Figure 31. Bottom Overlay



http://www.ti.com



8.4 Altium ProjectTo download the Altium project files, see the design files at TIDA-00203.

Figure 32. Altium Top Layer Figure 33. Altium Bottom Layer



http://www.ti.com




8.5 Gerber FilesTo download the Gerber files, see the design files at TIDA-00203.

Figure 34. Fabrication Drawing



http://www.ti.com




8.6 Assembly Drawings

Figure 35. Top Paste Assembly Figure 36. Bottom Paste Assembly

Figure 37. Top Assembly Figure 38. Bottom Assembly



http://www.ti.com



8.7 Software FilesTo download the software files, see the design files at TIDA-00203.

9 References

1. Texas Instruments, System Design Guidelines for the TM4C129x Family of Tiva™ C SeriesMicrocontrollers, Application Report (SPMA056).

2. Texas Instruments, Tiva ™ TM4C12 9X Development Board, User's Guide (SPMU360).3. Texas Instruments, Tiva™ TM4C1292NCZAD Microcontroller, Data Sheet (SPMS444).4. Texas Instruments, Tiva ™ C Series TM4C1294 Connected LaunchPad Evaluation Kit, User's Guide

(SPMU365).5. Texas Instruments, Introduction to the Controller Area Network (CAN), Application Report (SLOA101).6. Texas Instruments, Controller Area Network Physical Layer Requirements, Application Report

(SLLA270).



http://www.ti.com


http://www.ti.com/lit/pdf/SPMA056

http://www.ti.com/lit/pdf/SPMU360

http://www.ti.com/lit/pdf/SPMS444

http://www.ti.com/lit/pdf/SPMU365

http://www.ti.com/lit/pdf/SLOA101

http://www.ti.com/lit/pdf/SLLA270


IMPORTANT NOTICE FOR TI REFERENCE DESIGNS

Texas Instruments Incorporated ("TI") reference designs are solely intended to assist designers (“Buyers”) who are developing systems thatincorporate TI semiconductor products (also referred to herein as “components”). Buyer understands and agrees that Buyer remainsresponsible for using its independent analysis, evaluation and judgment in designing Buyer’s systems and products.TI reference designs have been created using standard laboratory conditions and engineering practices. TI has not conducted anytesting other than that specifically described in the published documentation for a particular reference design. TI may makecorrections, enhancements, improvements and other changes to its reference designs.Buyers are authorized to use TI reference designs with the TI component(s) identified in each particular reference design and to modify thereference design in the development of their end products. HOWEVER, NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPELOR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY THIRD PARTY TECHNOLOGYOR INTELLECTUAL PROPERTY RIGHT, IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right,or other intellectual property right relating to any combination, machine, or process in which TI components or services are used.Information published by TI regarding third-party products or services does not constitute a license to use such products or services, or awarranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectualproperty of the third party, or a license from TI under the patents or other intellectual property of TI.TI REFERENCE DESIGNS ARE PROVIDED "AS IS". TI MAKES NO WARRANTIES OR REPRESENTATIONS WITH REGARD TO THEREFERENCE DESIGNS OR USE OF THE REFERENCE DESIGNS, EXPRESS, IMPLIED OR STATUTORY, INCLUDING ACCURACY ORCOMPLETENESS. TI DISCLAIMS ANY WARRANTY OF TITLE AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESSFOR A PARTICULAR PURPOSE, QUIET ENJOYMENT, QUIET POSSESSION, AND NON-INFRINGEMENT OF ANY THIRD PARTYINTELLECTUAL PROPERTY RIGHTS WITH REGARD TO TI REFERENCE DESIGNS OR USE THEREOF. TI SHALL NOT BE LIABLEFOR AND SHALL NOT DEFEND OR INDEMNIFY BUYERS AGAINST ANY THIRD PARTY INFRINGEMENT CLAIM THAT RELATES TOOR IS BASED ON A COMBINATION OF COMPONENTS PROVIDED IN A TI REFERENCE DESIGN. IN NO EVENT SHALL TI BELIABLE FOR ANY ACTUAL, SPECIAL, INCIDENTAL, CONSEQUENTIAL OR INDIRECT DAMAGES, HOWEVER CAUSED, ON ANYTHEORY OF LIABILITY AND WHETHER OR NOT TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES, ARISING INANY WAY OUT OF TI REFERENCE DESIGNS OR BUYER’S USE OF TI REFERENCE DESIGNS.TI reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services perJESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevantinformation before placing orders and should verify that such information is current and complete. All semiconductor products are soldsubject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s termsand conditions of sale of semiconductor products. Testing and other quality control techniques for TI components are used to the extent TIdeems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is notnecessarily performed.TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provideadequate design and operating safeguards.Reproduction of significant portions of TI information in TI data books, data sheets or reference designs is permissible only if reproduction iswithout alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable forsuch altered documentation. Information of third parties may be subject to additional restrictions.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirementsconcerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or supportthat may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards thatanticipate dangerous failures, monitor failures and their consequences, lessen the likelihood of dangerous failures and take appropriateremedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components inBuyer’s safety-critical applications.In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is tohelp enable customers to design and create their own end-product solutions that meet applicable functional safety standards andrequirements. Nonetheless, such components are subject to these terms.No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the partieshave executed an agreement specifically governing such use.Only those TI components that TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use inmilitary/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components thathave not been so designated is solely at Buyer's risk, and Buyer is solely responsible for compliance with all legal and regulatoryrequirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use ofnon-designated products, TI will not be responsible for any failure to meet ISO/TS16949.IMPORTANT NOTICE

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2015, Texas Instruments Incorporated

Compact CAN-to-Ethernet Converter Using 32-Bit ARM® Cortex

Documents

Transcript of Compact CAN-to-Ethernet Converter Using 32-Bit ARM® Cortex