2. Heat conduction concepts - EPFL

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2. Heat conduction concepts John Richard Thome 24 février 2008 John Richard Thome (LTCM - SGM - EPFL) Heat transfer - Conduction 24 février 2008 1 / 33

Transcript of 2. Heat conduction concepts - EPFL

2. Heat conduction concepts

John Richard Thome

24 février 2008

John Richard Thome (LTCM - SGM - EPFL) Heat transfer - Conduction 24 février 2008 1 / 33

2.1 Fourier’s Law

Consider the general temperature distribution in a three-dimensional body. Forsome reason, there is a space- and time-dependent temperature field in the body.

T = T (x , y , z , t)

The vector that has both the magnitude and direction of the maximum increase oftemperature at each point is called the temperature gradient, ∇T :

∇T ≡ −→i ∂T∂x +

−→j ∂T∂y +

−→k ∂T

∂z (2.1)

Fourier’s law−→q = −k∇T (2.2)

qx = −k ∂T∂x

John Richard Thome (LTCM - SGM - EPFL) Heat transfer - Conduction 24 février 2008 2 / 33

2.1 Fourier’s Law

NotesThe medium in wich conduction occurs is isotropic, such k is independent ofthe direction of the coordinatesThe ratio of thermal conductivity to the heat capacity of a material gives ameasure of the ability of the material to conduct thermal energy relative toits ability to store thermal energy. Defined as α in m2

s . A large value of αmean rapid diffusion of heat.

α =k

ρ c

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2.1 Fourier’s Law

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2.1 Heat diffusion equation

Typically, our objectives are to knowThe temperature distributionThe local heat flux at boundaries or locations of interest

Control volume in a heat-flow field :

John Richard Thome (LTCM - SGM - EPFL) Heat transfer - Conduction 24 février 2008 5 / 33

2.1 Heat diffusion equation

We apply the conservation of energy to a three-dimensional control volume toobtain this

Q̇in + Q̇generated − Q̇out = Q̇stored

We can write the heat conducted out of dS, in watt, as

(−k∇T ) ·(−→n dS

)(2.4)

The heat generated (or consumed) within the region R must be added to the totalheat flow into S to get the overall rate of heat addition to R

Q = −∫

S(−k∇T ) ·

(−→n dS)

+

∫R

q̇dR (2.5)

The rate of energy increase of the region R is

Q =

∫R

(ρc ∂T

∂t

)dR (2.6)

John Richard Thome (LTCM - SGM - EPFL) Heat transfer - Conduction 24 février 2008 6 / 33

2.1 Heat diffusion equation

Where the derivate of T is in partial form because T is a function of both −→r andt. Finally, after rearranging the terms, we obtain∫

Sk∇T · −→n dS =

∫R

[ρc ∂T

∂t − q̇]

dR (2.7)

To get the left-hand side into a convenient form, we introduce Gauss’s theorem,wich converts a surface integral into a volume integral. We therefore get the heatdiffusion equation in three dimensions :

∇ · k∇T + q̇ = ρc ∂T∂t (2.10)

Heat diffusion equation : At any point in the material the rate of energy transferby conduction into a unit volume plus the volumetric rate ofthermal energy generation must equal the rate of change ofthermal energy stored within the volume.

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2.1 Heat diffusion equation

The limitation on this equation are :Incompressible medium.No convection.

Complements :If the variation of k with T is small, k can be factored out to get

∇2T +q̇k =

∂T∂t (2.11)

For steady-state conditions

∇ · k∇T + q̇ = 0

For one-dimension conduction without energy generation

ddx

(k dT

dx

)= 0

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2.1 Heat diffusion equation

The term ∇2T is called the Laplacian. It arises thus in a Cartesian coordinatedsystem

∇2T =∂2T∂x2 +

∂2T∂y2 +

∂2T∂z2 (2.12)

The Laplacian can be expressed in cylindrical coordinates

∇2T =1r

∂r

(r ∂T

∂r

)+

1r2

∂2T∂θ2 +

∂2T∂z2 (2.13)

The Laplacian can also be expressed in spherical coordinates

∇2T =1r

∂2(rT )

∂r2 +1

r2 sin θ

∂θ

(sin θ

∂T∂θ

)+

1r2 sin2 θ

∂2T∂φ2 (2.14)

John Richard Thome (LTCM - SGM - EPFL) Heat transfer - Conduction 24 février 2008 9 / 33

2.1 Heat diffusion equation

John Richard Thome (LTCM - SGM - EPFL) Heat transfer - Conduction 24 février 2008 10 / 33

2.2 Solutions of the heat diffusion equation

Step 1 : Pick the coordinate scheme that best fits the problem and identifythe independent variables that determine T.

Step 2 : Write the appropriate d.e., starting with one of the forms of theheat equation.

Step 3 : Obtain the general solution of the d.e.

Step 4 : Write the "side conditions" on the d.e. (initial and boundaryconditions).

John Richard Thome (LTCM - SGM - EPFL) Heat transfer - Conduction 24 février 2008 11 / 33

2.2 Solutions of the heat diffusion equation

Step 5 : Substitute the general solution in the boundary and initialconditions and solve for the constants.

Step 6 : Put the calculated constants back in the general solution to get theparticular solution to the problem.

Step 7 : Play with the solution, look it over, see what it has to tell you.Make any checks you can think of to be sure it is correct.

Step 8 : If the temperature field is now correctly established, you cancalculate the heat flux at any point in the body by substituting Tback into Fourier’s law.

John Richard Thome (LTCM - SGM - EPFL) Heat transfer - Conduction 24 février 2008 12 / 33

2.2 The simple slab

Heat conduction in a slab :

For steady-state, one dimensional heat conduction without internal heatgeneration, the heat equation reduces to :

ddx

(k dT

dx

)= 0

John Richard Thome (LTCM - SGM - EPFL) Heat transfer - Conduction 24 février 2008 13 / 33

2.2 The simple slab

Thus, for one-dimensional, steady-state conduction, the heat flux is a constantand independant of x. If the thermal conductivity k is assumed to be constant -often a good assumption -, then integrating twice gives the general solution

T (x) = C1x + C2

The applicable boundary conditions are

T (0) = T1

T (L) = T2

So, the solution isT (x) =

T2 − T1L x + T1

The heat conduction rate isq = k ∆T

L

John Richard Thome (LTCM - SGM - EPFL) Heat transfer - Conduction 24 février 2008 14 / 33

2.3 Thermal resistance and the electrical analogy

We can also represent heat flow through the slab with a diagram that is perfectlyanalogous to an electric circuit.

John Richard Thome (LTCM - SGM - EPFL) Heat transfer - Conduction 24 février 2008 15 / 33

2.3 Thermal resistance and the electrical analogy

We can write the last equation as a thermal resistance expression for conduction

Q =∆TL/kA

where L/kA assumes the role of a thermal resistance, to which give the symbolRt,cond . The equivalent electrical expression (Ohm’s law) is

Re =L

σA

Expression for convection isRt,conv =

1hA

Expression for radiation isRt,rad =

1hradA

John Richard Thome (LTCM - SGM - EPFL) Heat transfer - Conduction 24 février 2008 16 / 33

2.3 Thermal resistance and electrical analogy

The total resistance for series is

Rtot =n∑

i=1Rti

Thus heat transfer analysis can be done using circuit representations as

Q =T1 − Tn

Rtot=

T1 − T2Rt,12

=T2 − T3

Rt,23= ... =

Tn−1 − TnRt,(n−1)n

John Richard Thome (LTCM - SGM - EPFL) Heat transfer - Conduction 24 février 2008 17 / 33

2.3 Contact resistance

No two solid surfaces will ever form perfect thermal contact when they are pressedtogether. Heat transfer through the contact plane between two solid surfaces :

John Richard Thome (LTCM - SGM - EPFL) Heat transfer - Conduction 24 février 2008 18 / 33

2.3 Contact resistance

We treat the contact surface by placing an interfacial conductance, hc , in serieswith the conducting materials on either side. Then

Q = Ahc∆T

The interfacial conductance, hc , depends on the following factorsThe surface finish and cleanliness of the contacting solids.The materials that are in contact.The pressure with which the surfaces are forced together.The substance in the interstitial spaces.The temperature at the contact plane.

John Richard Thome (LTCM - SGM - EPFL) Heat transfer - Conduction 24 février 2008 19 / 33

2.3 Contact resistance

Table with some typical interfacial conductances for normal surface finishes andmoderate contact pressures (about 1 and 10 atm). Air gaps not evacuated unlessso indicated.

John Richard Thome (LTCM - SGM - EPFL) Heat transfer - Conduction 24 février 2008 20 / 33

2.3 Contact resistance

Conduction through two unit-area slabs with a contact resistance :

John Richard Thome (LTCM - SGM - EPFL) Heat transfer - Conduction 24 février 2008 21 / 33

2.3 Radial systems

For steady-state, one-dimensional heat flow, equation reduces to

1r

ddr

(k r dT

dr

)= 0

Applying the same boundary conditions as earlier, we obtain

T (r) = Ti −∆T

ln (ro/ri)ln

(rri

)At any station, r :

qradial = −k ∂T∂r

So the heat flux falls off inversely with radius. Let us see if this is the case for acylinder of length l :

Q (W ) = (2πrl) q =2πkl∆Tln (ro/ri)

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2.3 Radial systems

Heat transfer through a cylinder with a fixed wall temperature :

John Richard Thome (LTCM - SGM - EPFL) Heat transfer - Conduction 24 février 2008 23 / 33

2.3 Radial systems

Finally, we again recognize Ohm’s law in this result and write the thermalresistance for a cylinder

Rt,cyl =ln (ro/ri)

2πlk (2.22)

This can be compared with the resistance of a plane wall

Rt,wall =L

kA

Both resistances are inversely proportional to k, but each reflects a differentgeometry. Expression for convection is

Rt,conv =1

2πrlh

Expression for radiation isRt,rad =

12πrlhrad

John Richard Thome (LTCM - SGM - EPFL) Heat transfer - Conduction 24 février 2008 24 / 33

2.3 Application

Example 2.7 : An interesting consequence of the preceding result can be broughtout with a specific example. Suppose that we insulate a 0.5 cm O.D. coppersteam line with 85 percents magnesia to prevent the steam from condensing toorapidly. The steam is under pressure and stays at 150◦C. The copper is thin andhighly conductive - obviously a tiny resistance in series with the convective andinsulation resistances, as we see in figure (next slide). The condensation of steaminside the tube also offers very little resistance. But on the outside, a heat transfercoefficient of h=20 W/m2K offers fairly high resistance. It turns out thatinsulation can actually improve heat transfer in this case.

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2.3 Application

Thermal circuit for an insulated tube :

John Richard Thome (LTCM - SGM - EPFL) Heat transfer - Conduction 24 février 2008 26 / 33

2.3 Application

The two significant resistances, for a cylinder of unit lenght (l=1m) are

Rt,cond =ln (ro/ri)

2πlk =ln (ro/ri)

2π 0.0074K/W

Rt,conv =1

2πroh=

12π 20 ro

K/W

Rt,conv falls off rapidly when ro is increased, because the outside area is increasing.Accordingly, the total resistance passes through a minimum in this case. Such avalue could be obtained from the requirement that

dRtotdr = 0

Hencer =

kh

John Richard Thome (LTCM - SGM - EPFL) Heat transfer - Conduction 24 février 2008 27 / 33

2.3 Application

The critical radius of insulation written for a cylinder of unit length (l=1m) :

John Richard Thome (LTCM - SGM - EPFL) Heat transfer - Conduction 24 février 2008 28 / 33

2.3 Application

To determined whether the foregoing result maximizes or minimizes the totalresistance, the second derivative must be evaluated. From the above result

r ≡ rcrit

In the present example, adding insulation will increase heat loss instead ofreducing it, until rcrit = k/h = 0.0037m or rcrit/ri = 1.48. Indeed, insulation willnot even start to do any good until ro/ri = 2.32. We call rcrit thecritical radius of insulation.

John Richard Thome (LTCM - SGM - EPFL) Heat transfer - Conduction 24 février 2008 29 / 33

2.4 Overall heat transfer coefficient, U

We often want to transfer heat through composite resistances. It is veryconvenient to have a number, U, that works like this :

Q = UA∆T (2.32)

In general, the relationship is

Rtot =n∑

i=1Rti =

1UA

Overall heat transfer coefficient : This number, U, is defined largely by thesystem, and in many cases it proves to be insensitive to theoperating conditions of the system. It is therefore important toremember which area an overall heat transfer coefficient is basedon. It is particularly important that A and U be consistent.

John Richard Thome (LTCM - SGM - EPFL) Heat transfer - Conduction 24 février 2008 30 / 33

2.4 Overall heat transfer coefficient, U

Typical values of U :The fluids with low thermal conductivities (tars, oils, ...) usually yield lowvalues of h. When such fluid flows on one side of an exchanger, U willgenerally be pulled down.Condensing and boiling are very effective heat transfer processes. Theygreatly improve U but they cannot override one very small value of h on theother side of the exchange.

In fact :For a high U, all resistances in the exchanger must be low.The highly conducting liquids give high values of h and U.

John Richard Thome (LTCM - SGM - EPFL) Heat transfer - Conduction 24 février 2008 31 / 33

2.4 Fouling resistance

The inside of one of the simplest heat exchanger is new and clean on the left, buton the right it has built up a layer of scale.

Rf =1

Uold− 1

Unew(2.36)

John Richard Thome (LTCM - SGM - EPFL) Heat transfer - Conduction 24 février 2008 32 / 33

2.4 Fouling resistance

1UA =

1U0A0

=1

UiAi

For a old pipe based on Ai

Uold =1

1hi

+ri ln(r0/rp)

kinsul+

ri ln(rp/ri )kpipe

+ rir0 h0

+ Rf

whereU is the overall heat transfer coefficient (Wm−2K−1)h is the heat transfer coefficient (Wm−2K−1)Rf is the fouling factor (W−1m2K)r is the rayon (m)k is the thermal conductivity(Wm−1K−1)

John Richard Thome (LTCM - SGM - EPFL) Heat transfer - Conduction 24 février 2008 33 / 33