IS2008S-IS2010S-IS2013S-IS2015S-Bluetooth-Mono-Audio ...

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IS2008S/IS2010S/IS2013S/ IS2015S Bluetooth ® Mono Audio SOC Introduction The IS20xxS Mono Audio chip is a compact, highly integrated, CMOS single-chip RF and baseband Integrated Chip (IC) with Enhanced Data Rate (EDR) for 2.4 GHz applications. The IS20xxS Mono Audio chip is compliant with Bluetooth ® 4.1 specifications and completely backward-compatible with Bluetooth 3.0, 2.0 or 1.2 systems. The IS20xxS Mono Audio chip incorporates Bluetooth 1/2/3 Mbps RF, single-cycle 8-bit MCU, TX/RX modem, 5-port memory controller, task/hopping controller, UART interface and Microchip’s Bluetooth software stack to achieve the required Bluetooth 4.1 specifications with EDR functions. For voice and audio applications, the IS20xxS Mono Audio chip also integrates a Digital Signal Processor (DSP) co-processor, a PLL and a dedicated Codec to provide superior audio and voice quality. For the enhanced audio applications, SBC (Sub-band Coding)/AAC_LC (Advanced Audio Coding) decoding functions are also carried out by the DSP to satisfy the Bluetooth A2DP (Advanced Audio Distribution Profile) requirements. For voice applications, basic Continuous Variable Slope Data (CVSD) encoding and decoding with enhanced noise reduction and echo cancellation are implemented by the built-in DSP to achieve better quality in both the sending and receiving sides. Additionally, to minimize the external components required for portable devices, a battery voltage sensor, battery charger, a switching regulator and Low Dropout (LDO) are integrated to reduce system Bill of Materials (BOM) cost for various Bluetooth applications. A Mono 1-channel 2.3W Class-D Amplifier (CDA), which provides up to 100 dB Signal-to-noise Ratio (SNR), is also built-in to reduce the BOM cost and PCB area. The IS20xxS Mono Audio chip series includes: IS2008S IS2010S IS2013S IS2015S Features Compliant with Bluetooth specification 4.1 Supports the following Bluetooth audio profiles: HFP 1.6 HSP 1.1 A2DP 1.2 AVRCP 1.5 SPP 1.0 PBAP 1.0 Baseband Features 16 MHz main clock input Built-in internal ROM for program memory Connects simultaneously to two hosts (phones, tablets) over HFP/A2DP profiles Adaptive Frequency Hopping (AFH) avoids occupied RF channels © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS70005472A-page 1

Transcript of IS2008S-IS2010S-IS2013S-IS2015S-Bluetooth-Mono-Audio ...

IS2008SIS2010SIS2013SIS2015S

Bluetoothreg Mono Audio SOC

IntroductionThe IS20xxS Mono Audio chip is a compact highly integrated CMOS single-chip RF and baseband Integrated Chip(IC) with Enhanced Data Rate (EDR) for 24 GHz applications The IS20xxS Mono Audio chip is compliant withBluetoothreg 41 specifications and completely backward-compatible with Bluetooth 30 20 or 12 systems

The IS20xxS Mono Audio chip incorporates Bluetooth 123 Mbps RF single-cycle 8-bit MCU TXRX modem 5-portmemory controller taskhopping controller UART interface and Microchiprsquos Bluetooth software stack to achieve therequired Bluetooth 41 specifications with EDR functions

For voice and audio applications the IS20xxS Mono Audio chip also integrates a Digital Signal Processor (DSP)co-processor a PLL and a dedicated Codec to provide superior audio and voice quality For the enhanced audioapplications SBC (Sub-band Coding)AAC_LC (Advanced Audio Coding) decoding functions are also carried out bythe DSP to satisfy the Bluetooth A2DP (Advanced Audio Distribution Profile) requirements

For voice applications basic Continuous Variable Slope Data (CVSD) encoding and decoding with enhanced noisereduction and echo cancellation are implemented by the built-in DSP to achieve better quality in both the sending andreceiving sides

Additionally to minimize the external components required for portable devices a battery voltage sensor batterycharger a switching regulator and Low Dropout (LDO) are integrated to reduce system Bill of Materials (BOM) costfor various Bluetooth applications A Mono 1-channel 23W Class-D Amplifier (CDA) which provides up to 100 dBSignal-to-noise Ratio (SNR) is also built-in to reduce the BOM cost and PCB area

The IS20xxS Mono Audio chip series includesbull IS2008Sbull IS2010Sbull IS2013Sbull IS2015S

Featuresbull Compliant with Bluetooth specification 41bull Supports the following Bluetooth audio profiles

ndash HFP 16ndash HSP 11ndash A2DP 12ndash AVRCP 15ndash SPP 10ndash PBAP 10

Baseband Featuresbull 16 MHz main clock inputbull Built-in internal ROM for program memorybull Connects simultaneously to two hosts (phones tablets) over HFPA2DP profilesbull Adaptive Frequency Hopping (AFH) avoids occupied RF channels

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Datasheet DS70005472A-page 1

bull Supports a fast connection

Audio Codecbull 20-bit Digital-to-Analog Converter (DAC) and 16-bit Analog-to-Digital Converter (ADC) codecbull 98 dB SNR DAC playbackbull Built-in 1-channel 23W Class D amplifier for a 4Ω speaker (for IS201315S only)

RF Featuresbull Compatible with Bluetooth 41 (EDR) system in 24 GHz ISM bandbull Combined TXRX RF terminal simplifies external matching and reduces external antenna switchesbull Maximum TX output power control is +4 dBm with 20 dB level control from register controlbull Built-in TR switch for Class 23 applicationbull To avoid temperature variation temperature sensor with temperature calibration is utilized into bias current and

gain controlbull Integrated synthesizer requires no external Voltage-Controlled Oscillator (VCO) varactor diode resonator and

loop filterbull Crystal oscillation with built-in digital trimming for temperature or process variations

DSP Audio Processingbull Supports 64 Kbps A-Law or μ-Law PCM format or CVSD (Continuous Variable Slope Delta Modulation) for

SCO channel operationbull Supports noise suppressionbull Supports echo suppressionbull SBC and optional AAC decodingbull Packet Loss Concealment (PLC)bull Built-in voice prompts for four languages (ChineseEnglishSpanishFrench) and 20 events for each one

Note  Configure this functionality in the IS20XXS_UI toolbull Supports Serial Copy Management System (SCMS-T) content protection

Peripheralsbull Built-in lithium-ion battery charger (up to 350 mA)bull Integrated 18V and 3V configurable switching regulator and LDObull Built-in ADC for battery monitor and voltage sensorbull A line-in port for external audio inputbull Two LED drivers

Flexible HCI Interfacebull High speed HCI-UART interface (supports up to 921600 bps)

Package DetailsTable 1 Package Details

Parameter IS2008S IS2010S IS2013S IS2015S

Package type QFN QFN

Pin count 48 56

Package size(1) 6x6x09 7x7x09

Note 1 All dimensions are in millimeters (mm) unless specified

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Datasheet DS70005472A-page 2

Applicationsbull Mono headsets with A2DPbull Mono speaker phones

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Datasheet DS70005472A-page 3

Table of Contents

Introduction1

Features 1

1 Quick References6

11 Reference Documentation612 Acronyms and Abbreviation 6

2 Device Overview 8

21 Key Features822 Pin Details 10

3 Audio 17

31 Digital Signal Processor 1732 Codec1833 Auxiliary Port 1834 Class D Audio Amplifier18

4 Transceiver19

41 Transmitter 1942 Receiver 1943 Synthesizer1944 Modem 1945 Adaptive Frequency Hopping (AFH) 19

5 Microcontroller20

51 Memory 2052 External Reset2053 Reference Clock20

6 Power Management Unit (PMU) 22

61 Charging a Battery 2262 Voltage Monitoring2263 Low Dropout Regulator 2264 Switching Regulator 2365 LED Driver23

7 Application Information24

71 Power Supply 2472 Host MCU Interface2473 Timing Sequence of UART Application 2574 General Purpose IO pins28

8 Antenna Placement Rule 30

9 Electrical Characteristics31

10 Packaging Information 37

101 Chip Identification System37

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102 Package Marking Information37103 Package Details 38

11 Reflow Profile and Storage Condition 43

111 Stencil of SMT Assembly Suggestion 43112 Reflow Profile 44113 Storage Condition44

12 Reference Circuit 46

13 Document Revision History59

The Microchip Website60

Product Change Notification Service60

Customer Support 60

Microchip Devices Code Protection Feature 60

Legal Notice 61

Trademarks 61

Quality Management System 62

Worldwide Sales and Service63

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Datasheet DS70005472A-page 5

1 Quick References

11 Reference DocumentationFor further details refer to the following

bull IS20xxBM1xBM2x DSP Application Notebull IS200xIS201xIS202x UART Command SOP

12 Acronyms and AbbreviationTable 1-1 Acronyms and Abbreviations

Acronyms and Abbreviations Description

AAC_LC Advanced Audio Coding ndash Low Complexity

A2DP Advanced Audio Distribution Profile

ADC Analog-to-Digital Converter

AFH Adaptive Frequency Hopping

BDR Basic Data Rate

BOM Bill of Materials

BPF Band Pass Filter

CVSD Continuous Variable Slope Data

DAC Digital-to-Analog Converter

DSP Digital Signal Processor

EDR Enhanced Data Rate

GFSK Gaussian Frequency Shift Keying

IC Integrated Chip

LDO Low Dropout

LNA Low Noise Amplifier

NFC Near-field Communication

PA Power Amplifier

PLC Packet Loss Concealment

PMU Power Management Unit

POR Power-on Reset

RF Radio Frequency

RSSI Received Signal Strength Indicator

SBC Sub-band Coding

SCMS-T Supports Serial Copy Management System

SNR Signal-to-Noise Ratio

IS2008SIS2010SIS2013SIS2015SQuick References

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Datasheet DS70005472A-page 6

continuedAcronyms and Abbreviations Description

UART Universal Asynchronous Receiver Transmitter

VCO Voltage-Controlled Oscillator

WDT Watchdog Timer

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Datasheet DS70005472A-page 7

2 Device OverviewThe IS20xxS SoC integrates

bull Bluetooth 41 radio transceiverbull Power Management Unit (PMU)bull Digital Signal Processor (DSP)bull 1-channel Class-D Amplifier (CDA)

The following figure illustrates the block diagram of the IS20xxS SoC

Figure 2-1 Block Diagram of IS20xxS

8051

16 KB patch RAM

448 KB ROM

44 KB RAM

24-bit DSP Core

MCU

158 KB ROM

88 KB RAM

DSP

IS20xx

Classic RF

MACMODEM

Bluetooth + EDRTransceiver

RF Controller

Antenna

16 MHz Crystal

EEPROM

Power Switch

LED

BAT Charger

18 V BUCK

30 V LDO2

LED Driver2

PMULi-IonBAT

2-Channel DAC

Digital Core

2-Channel ADC

Audio Codec

(For IS20082010 only)

Speaker2W

Stereo Class-D AMP

MIC1

MIC2

Speaker

AUX_IN(analog signal) I2C

GPIOs or HWIO Port 0~3

21 Key FeaturesThe following table provides the key features of the IS20xxS family

Table 2-1 Key Features

Feature IS2008S IS2010S IS2013S IS2015S

Application Headset Headset Speaker Speaker

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continuedFeature IS2008S IS2010S IS2013S IS2015S

StereoMono Mono Mono Mono Mono

Package QFN QFN QFN QFN

Pin count 48 48 56 56

Dimensions (mm) 6x6 6x6 7x7 7x7

Audio DAC output 1-channel 1-channel 1-channel 1-channel

DAC (single-ended) SNR at28V (dB) -98 -98 -98 -98

DAC (capless) SNR at 28V(dB) -96 -96 -96 -96

ADC SNR at 28V (dB) -90 -90 -90 -90

I2S digital output No No No No

Analog Auxiliary-Input No No Yes Yes

Mono microphone 2 2 1 1

External audio amplifierinterface No No Yes Yes

Built-in CDA No No 1-channel 1-channel

UART Yes Yes Yes Yes

LED driver 2 2 2 2

Integrated DC-DC step-down regulator Yes Yes Yes Yes

DC 5V adapter input Yes Yes Yes Yes

Battery charger (350 mAmaximum) Yes Yes Yes Yes

GPIO 6 6 9 9

Button Support 6 6 6 6

NFC Yes Yes Yes Yes

Voice prompt Yes Yes Yes Yes

Multi-tone Yes Yes Yes Yes

DSP sound effect No No Yes Yes

Bluetooth Profiles

A2DP 12 12 12 12

AVRCP 15 15 15 15

HFP 16 16 16 16

HSP 11 11 11 11

PBAP 10 10 10 10

SPP No 10 No 10

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Datasheet DS70005472A-page 9

22 Pin DetailsThe following figure illustrates the pin diagram of the IS2008S and IS2010S

Figure 2-2 IS2008S and IS2010S Pin Diagram

The following table provides the pin description of the IS2008S and IS2010S

Table 2-2 Pin Description

IS2008S andIS2010S Pin No Pin Type(1) Pin Name Description

1 P VCOM Internal biasing voltage for codec

2 I MICN2 Mic2 mono differential analog negative input

3 I MICP2 Mic2 mono differential analog positive input

4 I MICN1 Mic1 mono differential analog negative input

5 I MICP1 Mic1 mono differential analog positive input

6 P MICBIAS Electric microphone biasing voltage

7 P VDD_CORE Core 12V power input connect to CLDO_O pin

8 O P1_2 IO pin default pull-high input EEPROM clock SCL

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continuedIS2008S and

IS2010S Pin No Pin Type(1) Pin Name Description

9 IO P1_3 IO pin default pull-high input EEPROM data SDA

10 I RST_N System Reset pin active when rising edge

11 P VDD_IO IO power supply input (27-33V) connect to LDO31_VOpin

12 IO P0_1

IO pin default pull-high input(2)

bull FWD key when class 2 RF (default) active-lowbull Class 1 TX control signal of external RF TR switch

active high

13 IO P1_5

IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0bull Slide switch detector active-lowbull Buzzer signal output

14 I HCI_RXD HCI UART data input

15 O HCI_TXD HCI UART data output

16 P CODEC_VO 31V LDO output for codec power

17 P LDO31_VIN 31V LDO input connect to SYS_PWR pin

18 P LDO31_VO 31V LDO output

19 P ADAP_IN 5V power adapter input

20 P BAT_IN 33-42V Li-ion battery input

21 - NC No Connection

22 P SAR_VDD SAR 18V input connect to BK_O pin

23 P SYS_PWR Power output which comes from BAT_IN or ADAP_IN

24 P BK_VDD 18V buck VDD Power Input connect to SYS_PWR pin

25 P BK_LX 18V buck pin for switch

26 P BK_O 18V buck feedback input

27 I PWR Multi function push button and power-on key

28 I LED2 LED Driver 2

29 I LED1 LED Driver 1

30 IO P0_3

IO pin default pull-high input(2)

bull REV key (default) active-lowbull Buzzer signal outputbull Out_Ind_1bull Class 1 RX control signal of external RF TR switch

active high

31 P CLDO_O 12V core LDO output

32 P PMIC_IN PMU blocks power input connect to BK_O pin

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continuedIS2008S and

IS2010S Pin No Pin Type(1) Pin Name Description

33 P RFLDO_O 128V RF LDO output

34 P VBG Bandgap output reference for decoupling interference

35 P ULPC_VSUS ULPC 12V output power

36 I XO_N 16 MHz crystal input negative

37 I XO_P 16 MHz crystal input positive

38 P VCC_RF RF power input (128V) for both synthesizer and TXRXblock connect to RFLDO_O pin

39 IO RTX RF path (transmitreceive)

40 I P0_2IO pin default pull-high input(2)

PlayPause key (default) active-low

41 I P2_0IO pin default pull-high input system configuration

H Application L Baseband (IBDK mode)

42 I P2_7IO pin default pull high input(2)

Volume up key (default) active-low

43 I P0_5IO pin default pull high input(2)

Volume down (default) active-low

44 P VDD_IO IO power supply input (27-33V) connect to LDO31_VOpin

45 P VDD_AOPositive power supply dedicated to codec outputamplifiers connect to CODEC_VO pin

46 O AOHPM Headphone common mode outputsense input

47 O AOHPL Left channel analog headphone output

48 P VDDA Positive power supplyreference voltage for codecconnect to CODEC_VO pin

49 P EP Exposed pads used as ground (GND) pins

Notes 1 The conventions used in the table are indicated as follows

ndash I = Input pinndash O = Output pinndash IO = InputOutput pinndash P = Power pin

2 All IO pins are configured using the IS20XXS_UI tool a Windowsreg-based utility

The following figure illustrates the pin diagram of the IS2013S and IS2015S

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Datasheet DS70005472A-page 12

Figure 2-3 IS2013S and IS2015S Pin Diagram

The following table provides the pin description of the IS2013SIS2015S

Table 2-3 Pin Description

IS2013S andIS2015S Pin No Pin Type(1) Pin Name Description

1 P VDDAO Positive power supply dedicated to codec output amplifiersConnect to CODEC_VO pin

2 O AOHPM Headphone common mode outputsense input

3 O AOHPL Left channel analog headphone output

4 P VDDA Positive power supplyreference voltage for codec connect toCODEC_VO pin

5 P VCOM Internal biasing voltage for codec

6 I MICN1 Mic1 mono differential analog negative input

7 I MICP1 Mic1 mono differential analog positive input

8 P MICBIAS Electric microphone biasing voltage

9 I AIL Left channel single-ended analog inputs

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continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

10 P VDD_CORE Core 12V power input connect to CLDO_O pin

11 O P1_2 IO pin default pull high input EEPROM clock SCL

12 IO P1_3 IO pin default pull high input EEPROM data SDA

13 I RST_N System Reset pin active when rising edge

14 P VDD_IO IO power supply input (27-33V) connect to LDO31_VO pin

15 IO P0_1

IO pin default pull-high input(2)

bull FWD key when class 2 RF (default) active-lowbull Class 1 TX Control signal of external RF TR switch

active high

16 I P2_4IO pin default pull high input system configuration

L Boot mode with P2_0 low combination

17 IO P0_4IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0

18 IO P1_5

IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0bull Slide switch detector active-lowbull Buzzer signal output

19 I HCI_RXD HCI UART input data

20 O HCI_TXD HCI UART output data

21 P CODEC_VO 31V LDO output for codec power

22 P LDO31_VIN 31V LDO input connect to SYS_PWR pin

23 P LDO31_VO 31V LDO output

24 P ADAP_IN 5V power adapter input

25 P BAT_IN 33 to 42V Li-ion battery input

26 P SAR_VDD SAR 18V input connect to BK_O pin

27 P SYS_PWR Power output which come from BAT_IN or ADAP_IN

28 P LDO18_VDD 18V LDO VDD Power Input connect to SYS_PWR pin

29 P LDO18_O 18V LDO output

30 I PWR Multi-Function Push button and power on key

31 - NC No Connection

32 I LED2 LED Driver 2

33 I LED1 LED Driver 1

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Datasheet DS70005472A-page 14

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

34 IO P0_0IO pin default pull-high input(2)

bull Slide switch detector active-lowbull UARTTX_IND active-low

35 IO P0_3

IO pin default pull-high input(2)

bull REV key (default) active-lowbull Buzzer signal outputbull Out_Ind_1bull Class 1 RX control signal of external RF TR switch

active high

36 I EANEmbedded ROMExternal Flash enable

H Embedded L External Flash

37 P CLDO_O 12V core LDO output

38 P PMIC_IN PMU blocks power input connect to BK_O pin

39 P RFLDO_O 128V RF LDO output

40 P VBG Bandgap output reference for decoupling interference

41 P ULPC_VSUS ULPC 12V output power

42 I XO_N 16 MHz crystal input negative

43 I XO_P 16 MHz crystal input positive

44 P VCC_RFRF power input (128V) for both synthesizer and TXRXblock connect to RFLDO_O pin

45 IO RTX RF path (transmitreceive)

46 I P0_2IO pin default pull-high input(2)

PlayPause key (default) active-low

47 I P2_0IO pin default pull-high input system configuration

H Application L Baseband (IBDK mode)

48 I P2_7IO pin default pull-high input(2)

Volume up key (default) active-low

49 I P3_0IO pin default pull-high input(2)

Line-in detector (default) active-low

50 I P0_5IO pin default pull-high input(2)

Volume down (default) active-low

51 P VDD_IO IO power supply input (27-33V) connect to LDO31_VO pin

52 P AVDD_CDA Supply voltage of audio amplifier

53 P VBP_CDA Reference voltage output

54 O HPON_CDA Negative BTL output of channel-1

55 O HPOP_CDA Positive BTL output of channel-1

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Datasheet DS70005472A-page 15

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

56 P PVDD_CDA Supply voltage of power stage ch-1

57 P EP Exposed pads used as ground (GND) pins

Notes 1 The conventions used in the table are indicated as follows

ndash I = Input pinndash O = Output pinndash IO = InputOutput pinndash P = Power pin

2 All IO pins are configured using the UI tool a Windows-based utility

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Datasheet DS70005472A-page 16

3 AudioThe input and output audio signals have different stages and each stage is programmed to vary the gain responsecharacteristics For microphones both single-ended inputs and differential inputs are supported To maintain ahigh-quality signal provide a stable bias voltage source to the condenser microphonersquos FET Use the DC-blockingcapacitors at both positive and negative sides of the input Internally this analog signal is converted to 16-bit 8 kHzlinear PCM data

31 Digital Signal ProcessorA Digital Signal Processor (DSP) is used to perform speech and audio processing The advanced speech featuressuch as acoustic echo cancellation and noise reduction are built in To reduce nonlinear distortion and to help echocancellation an outgoing signal level to the speaker is monitored and adjusted to avoid saturation of the speakeroutput or microphone input Adaptive filtering is also applied to track the echo path impulse in response to provide anecho-free and full-duplex user experience

The embedded noise reduction algorithm helps to extract clean speech signals from the noisy inputs capturedby microphones and improves mutual understanding in communication The advanced audio features such asmulti-band dynamic range control parametric multi-band equalizer audio widening and virtual bass are built in Theaudio effect algorithms improve the userrsquos audio listening experience in terms of better quality audio after audiosignal processing

The following figures illustrate the processing flow of speakerphone applications for speech and audio signalprocessing

Figure 3-1 Speech Processing

Figure 3-2 Audio Processing

The DSP parameters such as EQ Speaker Gain Mic Gain Sound Effect and more are configured using the DSPtool For additional information on the DSP tool refer to the IS20xxBM1xBM2x DSP Application Note

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Datasheet DS70005472A-page 17

Note  The DSP tool and IS20xxBM1xBM2x DSP Application Note are available for download at the Microchipwebsite

32 CodecThe built-in codec has a high SNR performance and it consists of an ADC a DAC and additional analog circuitry

33 Auxiliary PortThe SoC supports one analog (line-in) signal from the external audio source The analog signal is processed bythe DSP to generate different sound effects (multi-band dynamic range compression and audio widening) which areconfigured using the DSP tool

34 Class D Audio AmplifierThe Class D amplifier has a significant advantage in many applications due to its lower power dissipation whichproduces less heat The IS2013S and IS2015S SoC have a built-in Class D amplifier that reduces circuit board spaceand system cost The efficiency of the amplifier extends the battery life in portable systems

The Class D amplifier is implemented by using a full-bridge output stage A full bridge uses two half-bridge stages todrive the load differentially The Class D amplifier provides a good SNR and enough drive capability for a 4Ω speakerdriver

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Datasheet DS70005472A-page 18

4 TransceiverThe SoC is designed and optimized for Bluetooth 24 GHz systems It contains a complete radio frequencytransmitterreceiver section An internal synthesizer generates a stable clock to synchronize with another device

41 TransmitterThe internal Power Amplifier (PA) has a maximum output power of +4 dBm with 20 dB power level control Applythis to Class 2 or Class 3 radios without an external RF PA The transmitter directly performs the IQ conversionto minimize the frequency drift and it can access the 20 dB power range with the temperature compensationmechanism

42 ReceiverThe Low-Noise Amplifier (LNA) operates with TR-combined mode for the single port application It saves the pin onthe package without having an external TXRX switch

The ADC is used to sample the input analog signal and convert it into a digital signal for demodulator analysisA channel filter is integrated into a receiver channel before the ADC to reduce the external component count andincrease the anti-interference capability

The image rejection filter is used to reject the image frequency for the low-IF architecture and it is also intended toreduce the external Band Pass Filter (BPF) component for a super heterodyne architecture

The Received Signal Strength Indicator (RSSI) signal feedback to the processor is used to control the RF outputpower to make a good trade-off for effective distance and current consumption

43 SynthesizerA synthesizer generates a clock for radio transceiver operation The VCO inside with a tunable internal LC tankcan reduce any variation for components A crystal oscillator with an internal digital trimming circuit provides a stableclock for the synthesizer

44 ModemFor Bluetooth 12 specifications and below 1 Mbps is the standard data rate based on the Gaussian Frequency ShiftKeying (GFSK) modulation scheme This basic rate modem meets BDR requirements of Bluetooth 20 with EDRspecifications

For Bluetooth 20 and above specifications EDR is introduced to provide the data rates of 123 Mbps Thisenhanced data rate modem meets EDR requirements of Bluetooth 20 with EDR specifications For the basebandboth BDR and EDR utilize the same 1 MHz symbol rate and 16 kHz slot rate For BDR 1 symbol represents 1-bitHowever each symbol in the payload part of the EDR packets represents 2-bit or 3-bit This is achieved by using twodifferent modulations π4 DQPSK and 8 DPSK

45 Adaptive Frequency Hopping (AFH)The SoC has an AFH function to avoid RF interference It has an algorithm to check the nearby interference and tochoose the clear channel for the transceiver Bluetooth signal

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Datasheet DS70005472A-page 19

5 MicrocontrollerA single-cycle 8-bit microcontroller is built into the SoC to execute the Bluetooth protocols It operates from 16 MHzto higher frequencies where the firmware dynamically adjusts the trade-off between the computing power and thepower consumption In the ROM version the MCU firmware is hard-wired to minimize power consumption for thefirmware execution and to save the external Flash cost

51 MemoryThere are sufficient ROM and RAM to fulfill the processor requirements in which a synchronous single port RAMinterface is used The register bank dedicated single port memory and Flash memory are connected to theprocessor bus The processor coordinates with all link control procedures and the data movement happens using aset of pointer registers

52 External ResetThe IS20xxS SoC provides a Watchdog Timer (WDT) to reset the SoC It has an integrated Power-on Reset (POR)circuit that resets all circuits to a known Power-on state This action is also driven by an external Reset signal whichis used to control the device externally by forcing it into a POR state The RST_N signal input is active-low and noconnection is required in most of the applications

53 Reference ClockThe IS20xxS SoC is composed of an integrated crystal oscillation function that uses a 16 MHz external crystal andtwo specified loading capacitors to provide a high quality system reference timer source Use this feature to removethe initial tolerance frequency errors which are associated with the crystal and its equivalent loading capacitance inthe mass production Achieve the frequency trim by adjusting the crystal loading capacitance through the on-chip trimcapacitors (Ctrim)

The value of the trimming capacitance is 200 fF (200x10-15 F) per LSB at the 5-bit word and the overall adjustableclock frequency is plusmn40 kHz The following figure illustrates the crystal connection of the IS20xxS SoC with twocapacitors

Figure 5-1 Crystal Connection

IS20XXS

XO_N

CL1

XO_P

CL2

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Datasheet DS70005472A-page 20

Notes 1 Ctrim = 200 fF (1 to 31) Cint = 3 pF2 CL = [(CL1 x CL2) (CL1 + CL2)] + (Ctrim 2) + Cint (set trim value as 16 Ctrim = 32 pF)3 For a 16 MHz crystal where CL = 9 pF the CL1 = CL2 = 91 pF)4 For the CL selection refer to the data sheet of the crystal

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Datasheet DS70005472A-page 21

6 Power Management Unit (PMU)The IS20xxS SoC has an integrated PMU The main features of the PMU are a lithium-ion battery charger and avoltage regulator A power switch is used to switch over the power source between a battery and an adapter Alsothe PMU provides current to the LED drivers

61 Charging a BatteryThe IS20xxS SoC has a built-in battery charger which is optimized for lithium-polymer batteries The battery chargerincludes a current sensor for a charging control user programmable current regulator and high accuracy voltageregulator

The charging current parameters are configured by using the UI (IS20XXS_UI) tool Whenever the adapter isplugged-in the charging circuit will be activated Reviving pre-charging constant current mode constant voltagemode and re-charging functions are implemented The maximum charging current is 350 mA The following figureillustrates the charging curve of a battery

Figure 6-1 Battery Charging Curve

62 Voltage MonitoringA 10-bit successive approximation register ADC (SAR ADC) provides a dedicated channel for battery voltage leveldetection The warning level is programmed by using the UI tool The ADC provides a granular resolution to enablethe MCU to take control over the charging process

63 Low Dropout RegulatorA built-in LDO Regulator is used to convert the battery or adapter power for the power supply It also integratesthe hardware architecture to control the power-onoff procedure The built-in programmable LDOs provide power forcodec and digital IO pads Also it is used to buffer the high input voltage from the battery or adapter This LDOrequires a 1 μF bypass capacitor

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 22

64 Switching RegulatorThe built-in programmable output voltage regulator converts the battery voltage to RF and base band core powersupply This converter has a high conversion efficiency and a fast transient response

65 LED DriverThe IS20xxS SoC consists of two LED drivers to control the LEDs The LED drivers provide enough sink current(16-step control and 035 mA for each step) and the LED is connected directly to the IS20xxS SoC

Note  Configure the LED settings using the IS20XXS_UI tool

The following figure illustrates the LED driver in the IS20xxS SoC

Figure 6-2 LED DRIVER

IS20xxS

LED2

SYS_PWR

LED1

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 23

7 Application InformationThis section describes the power supply connection host MCU UART interface and various modes in detail

71 Power SupplyThe following figure illustrates the connection from the BAT_IN pin to various other voltage supply pins of theIS20xxS SoC

The BAT_IN input pin powers the IS20xxS SoC To charge the battery connect the external 5V power adapter toADAP_IN

Figure 7-1 Power Tree Diagram

VDDA VDDAO

VDD_IO

3V LDO

18V Buck

SAR_VDD

LDO31_VIN

CODEC_VO

LDO31_VO

BK_VDD

BK_LX

BK_O

VDD_CORE

VCC_RF

12V LDOPMIC_IN

CLDO_O

RFLDO_O

PVDD_CDA

Li-Io

n BA

T BAT_IN

ADAP_IN

SYS_PWRPower Switch

5V Adapter

(42~30V)

(45~55V)(42~30V)

(30~27V)

(33 ~27V)

(18V)

(12V)

(128V)

72 Host MCU InterfaceAn external MCU controls the IS20xxS SoC using the UART command set The following figure illustrates the UARTinterface between the IS20xxS SoC and an external MCU

Figure 7-2 Host MCU Interface Over UART

IS20xxSHCI_TXD

HCI_RXD

PWR

P0_0

MCUUART_TX

UART_RX

MCU_WAKEUP

BT_WAKEUP

UART Interface

UART Interface

The MCU controls the IS20xxS SoC over the UART interface and wakes up the SoC using the PWR pin The MCUfunction wakes up by connecting to the P0_0 pin of the IS20xxS

Refer to the IS200xIS201xIS202x UART Command SOP document for a list of functions that the IS20xxS SoCsupports and how to use the IS20XXS_UI tool to set up the system using the UART command

Note  The IS200xIS201xIS202x UART Command SOP document is available for download from the Microchipwebsite at IS200xIS201xIS202x UART Command SOP

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 24

73 Timing Sequence of UART ApplicationThe following figures illustrate the various UART control signal timing sequences

Figure 7-3 Power-OnOff Sequence

BAT_IN

SYS_PWR

1 ms

Power- oninitial idle Power-on Power-on Power-off idle

MCU state

MFB (PWR)

BK_OLDO31_VO

400 ms

RST_N

MCU sends UART command (UART_RX)

UART Command

MCU sends power-off UART Command

Power-on ACK ACK ACKIS20xxS response UART state

(UART_TX)

Set ldquoPower-on Directlyrdquo boot

any

10 ms

20 msKeep all IS20xxSand MCU connection to low level

2s

(See Figure 7-4) (See Figure 7-5)

IS20xxS disconnect and auto power-off

gt 1s

Figure 7-4 Timing Sequence of RX Indication after Power-On

Resume 32 kHz mode

MFB (PWR)MCU sends UART command

MFB pulse must be longer than the UART command slot time

150 ms

2 ms 2 ms

Enter 32 kHz mode

1 ms

UART Command

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 25

Figure 7-5 Timing Sequence of Power-Off

BAT_IN +4V

MFB

MCU Sends RST_N

BK_OUT

LDO31_VO

UART Bus

2s 1s

IS20xxS Sends Power-off ACK

Notes 1 EEPROM clock = 100 kHz2 For a byte wire 001 ms x 32 clock x 2 = 640 μs3 It is recommended that ramp-down time be more than 640 μs during the power-off sequence to ensure safe

operation of the device

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 26

Figu

re 7

-6 

Tim

ing

Sequ

ence

of P

ower

-On

(NA

CK

)

BAT

_IN

SYS_

PWR

1 m

s Pow

er-

onin

itial

idle

Pow

er-o

nM

CU

sta

te

MFB

(PW

R)

BK_O

LD

O31

_VO

400

ms

RST

_N

MC

U s

ends

UAR

T co

mm

and

(UAR

T_R

X)

UAR

T C

omm

and

NAC

KPo

wer

-on

ACK

ACK

IS20

xxS

resp

onse

UAR

T st

ate

(UAR

T_TX

)

Set ldquo

Pow

er-o

n D

irect

lyrdquo b

oot

10 m

s

20 m

s

Ret

ry i

f AC

K is

not

rece

ived

200

ms

any

Wai

t

Max

imum

5 ti

mes

(1s)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 27

Figure 7-7 Reset Timing Sequence in Case of No Response from SoC to Host MCU

MFB (PWR)

MCU sends UART command UART

Command

UART Command

IS20xxS UART

If no response

RST_N

1ms

X ms1ms

1ms

1ms

Note  The MCU sends the UART command again when the SoC is not responding to its first UART command Ifthe SoC is not responding to the second UART command within X ms the MCU forces the system to reset

Figure 7-8 Timing Sequence of Power Drop Protection

BAT_IN +4V

RST_N from Reset IC

Power

SYS_PWR

IS20xxS

Reset OUT VDDGND

MCU Reset

Reset IC

29V

1 It is recommended that the battery be connected on a BAT_IN pin of the SoC for the power supply2 If an external power source or a power adapter is used to provide the power to the SoC (ADAP_IN) use a

voltage supervisor IC3 The RESET IC output pin must be open drain with delay time of le 10 ms and the recommended part is

TCM809SVNB713

74 General Purpose IO pinsThe following table provides the details of various functions that are mapped to the IO pins of the IS20xxS SoCand these IOs are configured by using the IS20XXS_UI tool The first button (Button 0) must be configured as thepower-onoff key and can be set using the PWR pin The remaining pins are configured for any one of the defaultfunctions (short press long press double press and combinations)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 28

Table 7-1 IO Pin Configuration

Sl No Pin Name Buttons Default Functions(1)

1 PowerMFB Button 0 PWR

2 P0_2 Button 1 PlayPause

3 P2_7 Button 2 Volume Up

4 P0_5 Button 3 Volume Down

5 P0_1 Button 4 FWD

6 P0_3 Button 5 REV

Note 1 These functions can be configured using the IS20XXS_UI tool

Few signals are generated to indicate or control outside devices The most popular applications are NFC for easypairing external audio amplifier for louder speaker and buzzer for indication

Table 7-2 IO Pins for Added Functions

Functions(1) IO Configurable Features

Slide switch P0_0P1_5

Buzzer P0_3

NFC detect P0_4P1_5

External amplifier enable P1_5

Note 1 These functions can be configured using the IS20XXS_UI tool

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 29

8 Antenna Placement RuleFor Bluetooth-enabled products the antenna placement affects the overall performance The antenna requires freespace to radiate RF signals and it must not be surrounded by the GND plane

The following figure illustrates a typical example of the good and poor antenna placement on the main applicationboard with the GND plane

Figure 8-1 Antenna Placement Examples

The following figure illustrates the keep-out area recommended for the PCB antenna

Figure 8-2 Keep-Out Area Recommended for PCB Antenna

Note  For additional information on the antenna placement refer to the antenna-specific data sheet from theantenna manufacturer

IS2008SIS2010SIS2013SIS2015SAntenna Placement Rule

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 30

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

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Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

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Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

bull Supports a fast connection

Audio Codecbull 20-bit Digital-to-Analog Converter (DAC) and 16-bit Analog-to-Digital Converter (ADC) codecbull 98 dB SNR DAC playbackbull Built-in 1-channel 23W Class D amplifier for a 4Ω speaker (for IS201315S only)

RF Featuresbull Compatible with Bluetooth 41 (EDR) system in 24 GHz ISM bandbull Combined TXRX RF terminal simplifies external matching and reduces external antenna switchesbull Maximum TX output power control is +4 dBm with 20 dB level control from register controlbull Built-in TR switch for Class 23 applicationbull To avoid temperature variation temperature sensor with temperature calibration is utilized into bias current and

gain controlbull Integrated synthesizer requires no external Voltage-Controlled Oscillator (VCO) varactor diode resonator and

loop filterbull Crystal oscillation with built-in digital trimming for temperature or process variations

DSP Audio Processingbull Supports 64 Kbps A-Law or μ-Law PCM format or CVSD (Continuous Variable Slope Delta Modulation) for

SCO channel operationbull Supports noise suppressionbull Supports echo suppressionbull SBC and optional AAC decodingbull Packet Loss Concealment (PLC)bull Built-in voice prompts for four languages (ChineseEnglishSpanishFrench) and 20 events for each one

Note  Configure this functionality in the IS20XXS_UI toolbull Supports Serial Copy Management System (SCMS-T) content protection

Peripheralsbull Built-in lithium-ion battery charger (up to 350 mA)bull Integrated 18V and 3V configurable switching regulator and LDObull Built-in ADC for battery monitor and voltage sensorbull A line-in port for external audio inputbull Two LED drivers

Flexible HCI Interfacebull High speed HCI-UART interface (supports up to 921600 bps)

Package DetailsTable 1 Package Details

Parameter IS2008S IS2010S IS2013S IS2015S

Package type QFN QFN

Pin count 48 56

Package size(1) 6x6x09 7x7x09

Note 1 All dimensions are in millimeters (mm) unless specified

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 2

Applicationsbull Mono headsets with A2DPbull Mono speaker phones

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 3

Table of Contents

Introduction1

Features 1

1 Quick References6

11 Reference Documentation612 Acronyms and Abbreviation 6

2 Device Overview 8

21 Key Features822 Pin Details 10

3 Audio 17

31 Digital Signal Processor 1732 Codec1833 Auxiliary Port 1834 Class D Audio Amplifier18

4 Transceiver19

41 Transmitter 1942 Receiver 1943 Synthesizer1944 Modem 1945 Adaptive Frequency Hopping (AFH) 19

5 Microcontroller20

51 Memory 2052 External Reset2053 Reference Clock20

6 Power Management Unit (PMU) 22

61 Charging a Battery 2262 Voltage Monitoring2263 Low Dropout Regulator 2264 Switching Regulator 2365 LED Driver23

7 Application Information24

71 Power Supply 2472 Host MCU Interface2473 Timing Sequence of UART Application 2574 General Purpose IO pins28

8 Antenna Placement Rule 30

9 Electrical Characteristics31

10 Packaging Information 37

101 Chip Identification System37

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Datasheet DS70005472A-page 4

102 Package Marking Information37103 Package Details 38

11 Reflow Profile and Storage Condition 43

111 Stencil of SMT Assembly Suggestion 43112 Reflow Profile 44113 Storage Condition44

12 Reference Circuit 46

13 Document Revision History59

The Microchip Website60

Product Change Notification Service60

Customer Support 60

Microchip Devices Code Protection Feature 60

Legal Notice 61

Trademarks 61

Quality Management System 62

Worldwide Sales and Service63

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 5

1 Quick References

11 Reference DocumentationFor further details refer to the following

bull IS20xxBM1xBM2x DSP Application Notebull IS200xIS201xIS202x UART Command SOP

12 Acronyms and AbbreviationTable 1-1 Acronyms and Abbreviations

Acronyms and Abbreviations Description

AAC_LC Advanced Audio Coding ndash Low Complexity

A2DP Advanced Audio Distribution Profile

ADC Analog-to-Digital Converter

AFH Adaptive Frequency Hopping

BDR Basic Data Rate

BOM Bill of Materials

BPF Band Pass Filter

CVSD Continuous Variable Slope Data

DAC Digital-to-Analog Converter

DSP Digital Signal Processor

EDR Enhanced Data Rate

GFSK Gaussian Frequency Shift Keying

IC Integrated Chip

LDO Low Dropout

LNA Low Noise Amplifier

NFC Near-field Communication

PA Power Amplifier

PLC Packet Loss Concealment

PMU Power Management Unit

POR Power-on Reset

RF Radio Frequency

RSSI Received Signal Strength Indicator

SBC Sub-band Coding

SCMS-T Supports Serial Copy Management System

SNR Signal-to-Noise Ratio

IS2008SIS2010SIS2013SIS2015SQuick References

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 6

continuedAcronyms and Abbreviations Description

UART Universal Asynchronous Receiver Transmitter

VCO Voltage-Controlled Oscillator

WDT Watchdog Timer

IS2008SIS2010SIS2013SIS2015SQuick References

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 7

2 Device OverviewThe IS20xxS SoC integrates

bull Bluetooth 41 radio transceiverbull Power Management Unit (PMU)bull Digital Signal Processor (DSP)bull 1-channel Class-D Amplifier (CDA)

The following figure illustrates the block diagram of the IS20xxS SoC

Figure 2-1 Block Diagram of IS20xxS

8051

16 KB patch RAM

448 KB ROM

44 KB RAM

24-bit DSP Core

MCU

158 KB ROM

88 KB RAM

DSP

IS20xx

Classic RF

MACMODEM

Bluetooth + EDRTransceiver

RF Controller

Antenna

16 MHz Crystal

EEPROM

Power Switch

LED

BAT Charger

18 V BUCK

30 V LDO2

LED Driver2

PMULi-IonBAT

2-Channel DAC

Digital Core

2-Channel ADC

Audio Codec

(For IS20082010 only)

Speaker2W

Stereo Class-D AMP

MIC1

MIC2

Speaker

AUX_IN(analog signal) I2C

GPIOs or HWIO Port 0~3

21 Key FeaturesThe following table provides the key features of the IS20xxS family

Table 2-1 Key Features

Feature IS2008S IS2010S IS2013S IS2015S

Application Headset Headset Speaker Speaker

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Datasheet DS70005472A-page 8

continuedFeature IS2008S IS2010S IS2013S IS2015S

StereoMono Mono Mono Mono Mono

Package QFN QFN QFN QFN

Pin count 48 48 56 56

Dimensions (mm) 6x6 6x6 7x7 7x7

Audio DAC output 1-channel 1-channel 1-channel 1-channel

DAC (single-ended) SNR at28V (dB) -98 -98 -98 -98

DAC (capless) SNR at 28V(dB) -96 -96 -96 -96

ADC SNR at 28V (dB) -90 -90 -90 -90

I2S digital output No No No No

Analog Auxiliary-Input No No Yes Yes

Mono microphone 2 2 1 1

External audio amplifierinterface No No Yes Yes

Built-in CDA No No 1-channel 1-channel

UART Yes Yes Yes Yes

LED driver 2 2 2 2

Integrated DC-DC step-down regulator Yes Yes Yes Yes

DC 5V adapter input Yes Yes Yes Yes

Battery charger (350 mAmaximum) Yes Yes Yes Yes

GPIO 6 6 9 9

Button Support 6 6 6 6

NFC Yes Yes Yes Yes

Voice prompt Yes Yes Yes Yes

Multi-tone Yes Yes Yes Yes

DSP sound effect No No Yes Yes

Bluetooth Profiles

A2DP 12 12 12 12

AVRCP 15 15 15 15

HFP 16 16 16 16

HSP 11 11 11 11

PBAP 10 10 10 10

SPP No 10 No 10

IS2008SIS2010SIS2013SIS2015SDevice Overview

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Datasheet DS70005472A-page 9

22 Pin DetailsThe following figure illustrates the pin diagram of the IS2008S and IS2010S

Figure 2-2 IS2008S and IS2010S Pin Diagram

The following table provides the pin description of the IS2008S and IS2010S

Table 2-2 Pin Description

IS2008S andIS2010S Pin No Pin Type(1) Pin Name Description

1 P VCOM Internal biasing voltage for codec

2 I MICN2 Mic2 mono differential analog negative input

3 I MICP2 Mic2 mono differential analog positive input

4 I MICN1 Mic1 mono differential analog negative input

5 I MICP1 Mic1 mono differential analog positive input

6 P MICBIAS Electric microphone biasing voltage

7 P VDD_CORE Core 12V power input connect to CLDO_O pin

8 O P1_2 IO pin default pull-high input EEPROM clock SCL

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Datasheet DS70005472A-page 10

continuedIS2008S and

IS2010S Pin No Pin Type(1) Pin Name Description

9 IO P1_3 IO pin default pull-high input EEPROM data SDA

10 I RST_N System Reset pin active when rising edge

11 P VDD_IO IO power supply input (27-33V) connect to LDO31_VOpin

12 IO P0_1

IO pin default pull-high input(2)

bull FWD key when class 2 RF (default) active-lowbull Class 1 TX control signal of external RF TR switch

active high

13 IO P1_5

IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0bull Slide switch detector active-lowbull Buzzer signal output

14 I HCI_RXD HCI UART data input

15 O HCI_TXD HCI UART data output

16 P CODEC_VO 31V LDO output for codec power

17 P LDO31_VIN 31V LDO input connect to SYS_PWR pin

18 P LDO31_VO 31V LDO output

19 P ADAP_IN 5V power adapter input

20 P BAT_IN 33-42V Li-ion battery input

21 - NC No Connection

22 P SAR_VDD SAR 18V input connect to BK_O pin

23 P SYS_PWR Power output which comes from BAT_IN or ADAP_IN

24 P BK_VDD 18V buck VDD Power Input connect to SYS_PWR pin

25 P BK_LX 18V buck pin for switch

26 P BK_O 18V buck feedback input

27 I PWR Multi function push button and power-on key

28 I LED2 LED Driver 2

29 I LED1 LED Driver 1

30 IO P0_3

IO pin default pull-high input(2)

bull REV key (default) active-lowbull Buzzer signal outputbull Out_Ind_1bull Class 1 RX control signal of external RF TR switch

active high

31 P CLDO_O 12V core LDO output

32 P PMIC_IN PMU blocks power input connect to BK_O pin

IS2008SIS2010SIS2013SIS2015SDevice Overview

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Datasheet DS70005472A-page 11

continuedIS2008S and

IS2010S Pin No Pin Type(1) Pin Name Description

33 P RFLDO_O 128V RF LDO output

34 P VBG Bandgap output reference for decoupling interference

35 P ULPC_VSUS ULPC 12V output power

36 I XO_N 16 MHz crystal input negative

37 I XO_P 16 MHz crystal input positive

38 P VCC_RF RF power input (128V) for both synthesizer and TXRXblock connect to RFLDO_O pin

39 IO RTX RF path (transmitreceive)

40 I P0_2IO pin default pull-high input(2)

PlayPause key (default) active-low

41 I P2_0IO pin default pull-high input system configuration

H Application L Baseband (IBDK mode)

42 I P2_7IO pin default pull high input(2)

Volume up key (default) active-low

43 I P0_5IO pin default pull high input(2)

Volume down (default) active-low

44 P VDD_IO IO power supply input (27-33V) connect to LDO31_VOpin

45 P VDD_AOPositive power supply dedicated to codec outputamplifiers connect to CODEC_VO pin

46 O AOHPM Headphone common mode outputsense input

47 O AOHPL Left channel analog headphone output

48 P VDDA Positive power supplyreference voltage for codecconnect to CODEC_VO pin

49 P EP Exposed pads used as ground (GND) pins

Notes 1 The conventions used in the table are indicated as follows

ndash I = Input pinndash O = Output pinndash IO = InputOutput pinndash P = Power pin

2 All IO pins are configured using the IS20XXS_UI tool a Windowsreg-based utility

The following figure illustrates the pin diagram of the IS2013S and IS2015S

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Datasheet DS70005472A-page 12

Figure 2-3 IS2013S and IS2015S Pin Diagram

The following table provides the pin description of the IS2013SIS2015S

Table 2-3 Pin Description

IS2013S andIS2015S Pin No Pin Type(1) Pin Name Description

1 P VDDAO Positive power supply dedicated to codec output amplifiersConnect to CODEC_VO pin

2 O AOHPM Headphone common mode outputsense input

3 O AOHPL Left channel analog headphone output

4 P VDDA Positive power supplyreference voltage for codec connect toCODEC_VO pin

5 P VCOM Internal biasing voltage for codec

6 I MICN1 Mic1 mono differential analog negative input

7 I MICP1 Mic1 mono differential analog positive input

8 P MICBIAS Electric microphone biasing voltage

9 I AIL Left channel single-ended analog inputs

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Datasheet DS70005472A-page 13

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

10 P VDD_CORE Core 12V power input connect to CLDO_O pin

11 O P1_2 IO pin default pull high input EEPROM clock SCL

12 IO P1_3 IO pin default pull high input EEPROM data SDA

13 I RST_N System Reset pin active when rising edge

14 P VDD_IO IO power supply input (27-33V) connect to LDO31_VO pin

15 IO P0_1

IO pin default pull-high input(2)

bull FWD key when class 2 RF (default) active-lowbull Class 1 TX Control signal of external RF TR switch

active high

16 I P2_4IO pin default pull high input system configuration

L Boot mode with P2_0 low combination

17 IO P0_4IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0

18 IO P1_5

IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0bull Slide switch detector active-lowbull Buzzer signal output

19 I HCI_RXD HCI UART input data

20 O HCI_TXD HCI UART output data

21 P CODEC_VO 31V LDO output for codec power

22 P LDO31_VIN 31V LDO input connect to SYS_PWR pin

23 P LDO31_VO 31V LDO output

24 P ADAP_IN 5V power adapter input

25 P BAT_IN 33 to 42V Li-ion battery input

26 P SAR_VDD SAR 18V input connect to BK_O pin

27 P SYS_PWR Power output which come from BAT_IN or ADAP_IN

28 P LDO18_VDD 18V LDO VDD Power Input connect to SYS_PWR pin

29 P LDO18_O 18V LDO output

30 I PWR Multi-Function Push button and power on key

31 - NC No Connection

32 I LED2 LED Driver 2

33 I LED1 LED Driver 1

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Datasheet DS70005472A-page 14

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

34 IO P0_0IO pin default pull-high input(2)

bull Slide switch detector active-lowbull UARTTX_IND active-low

35 IO P0_3

IO pin default pull-high input(2)

bull REV key (default) active-lowbull Buzzer signal outputbull Out_Ind_1bull Class 1 RX control signal of external RF TR switch

active high

36 I EANEmbedded ROMExternal Flash enable

H Embedded L External Flash

37 P CLDO_O 12V core LDO output

38 P PMIC_IN PMU blocks power input connect to BK_O pin

39 P RFLDO_O 128V RF LDO output

40 P VBG Bandgap output reference for decoupling interference

41 P ULPC_VSUS ULPC 12V output power

42 I XO_N 16 MHz crystal input negative

43 I XO_P 16 MHz crystal input positive

44 P VCC_RFRF power input (128V) for both synthesizer and TXRXblock connect to RFLDO_O pin

45 IO RTX RF path (transmitreceive)

46 I P0_2IO pin default pull-high input(2)

PlayPause key (default) active-low

47 I P2_0IO pin default pull-high input system configuration

H Application L Baseband (IBDK mode)

48 I P2_7IO pin default pull-high input(2)

Volume up key (default) active-low

49 I P3_0IO pin default pull-high input(2)

Line-in detector (default) active-low

50 I P0_5IO pin default pull-high input(2)

Volume down (default) active-low

51 P VDD_IO IO power supply input (27-33V) connect to LDO31_VO pin

52 P AVDD_CDA Supply voltage of audio amplifier

53 P VBP_CDA Reference voltage output

54 O HPON_CDA Negative BTL output of channel-1

55 O HPOP_CDA Positive BTL output of channel-1

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Datasheet DS70005472A-page 15

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

56 P PVDD_CDA Supply voltage of power stage ch-1

57 P EP Exposed pads used as ground (GND) pins

Notes 1 The conventions used in the table are indicated as follows

ndash I = Input pinndash O = Output pinndash IO = InputOutput pinndash P = Power pin

2 All IO pins are configured using the UI tool a Windows-based utility

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Datasheet DS70005472A-page 16

3 AudioThe input and output audio signals have different stages and each stage is programmed to vary the gain responsecharacteristics For microphones both single-ended inputs and differential inputs are supported To maintain ahigh-quality signal provide a stable bias voltage source to the condenser microphonersquos FET Use the DC-blockingcapacitors at both positive and negative sides of the input Internally this analog signal is converted to 16-bit 8 kHzlinear PCM data

31 Digital Signal ProcessorA Digital Signal Processor (DSP) is used to perform speech and audio processing The advanced speech featuressuch as acoustic echo cancellation and noise reduction are built in To reduce nonlinear distortion and to help echocancellation an outgoing signal level to the speaker is monitored and adjusted to avoid saturation of the speakeroutput or microphone input Adaptive filtering is also applied to track the echo path impulse in response to provide anecho-free and full-duplex user experience

The embedded noise reduction algorithm helps to extract clean speech signals from the noisy inputs capturedby microphones and improves mutual understanding in communication The advanced audio features such asmulti-band dynamic range control parametric multi-band equalizer audio widening and virtual bass are built in Theaudio effect algorithms improve the userrsquos audio listening experience in terms of better quality audio after audiosignal processing

The following figures illustrate the processing flow of speakerphone applications for speech and audio signalprocessing

Figure 3-1 Speech Processing

Figure 3-2 Audio Processing

The DSP parameters such as EQ Speaker Gain Mic Gain Sound Effect and more are configured using the DSPtool For additional information on the DSP tool refer to the IS20xxBM1xBM2x DSP Application Note

IS2008SIS2010SIS2013SIS2015SAudio

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Datasheet DS70005472A-page 17

Note  The DSP tool and IS20xxBM1xBM2x DSP Application Note are available for download at the Microchipwebsite

32 CodecThe built-in codec has a high SNR performance and it consists of an ADC a DAC and additional analog circuitry

33 Auxiliary PortThe SoC supports one analog (line-in) signal from the external audio source The analog signal is processed bythe DSP to generate different sound effects (multi-band dynamic range compression and audio widening) which areconfigured using the DSP tool

34 Class D Audio AmplifierThe Class D amplifier has a significant advantage in many applications due to its lower power dissipation whichproduces less heat The IS2013S and IS2015S SoC have a built-in Class D amplifier that reduces circuit board spaceand system cost The efficiency of the amplifier extends the battery life in portable systems

The Class D amplifier is implemented by using a full-bridge output stage A full bridge uses two half-bridge stages todrive the load differentially The Class D amplifier provides a good SNR and enough drive capability for a 4Ω speakerdriver

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Datasheet DS70005472A-page 18

4 TransceiverThe SoC is designed and optimized for Bluetooth 24 GHz systems It contains a complete radio frequencytransmitterreceiver section An internal synthesizer generates a stable clock to synchronize with another device

41 TransmitterThe internal Power Amplifier (PA) has a maximum output power of +4 dBm with 20 dB power level control Applythis to Class 2 or Class 3 radios without an external RF PA The transmitter directly performs the IQ conversionto minimize the frequency drift and it can access the 20 dB power range with the temperature compensationmechanism

42 ReceiverThe Low-Noise Amplifier (LNA) operates with TR-combined mode for the single port application It saves the pin onthe package without having an external TXRX switch

The ADC is used to sample the input analog signal and convert it into a digital signal for demodulator analysisA channel filter is integrated into a receiver channel before the ADC to reduce the external component count andincrease the anti-interference capability

The image rejection filter is used to reject the image frequency for the low-IF architecture and it is also intended toreduce the external Band Pass Filter (BPF) component for a super heterodyne architecture

The Received Signal Strength Indicator (RSSI) signal feedback to the processor is used to control the RF outputpower to make a good trade-off for effective distance and current consumption

43 SynthesizerA synthesizer generates a clock for radio transceiver operation The VCO inside with a tunable internal LC tankcan reduce any variation for components A crystal oscillator with an internal digital trimming circuit provides a stableclock for the synthesizer

44 ModemFor Bluetooth 12 specifications and below 1 Mbps is the standard data rate based on the Gaussian Frequency ShiftKeying (GFSK) modulation scheme This basic rate modem meets BDR requirements of Bluetooth 20 with EDRspecifications

For Bluetooth 20 and above specifications EDR is introduced to provide the data rates of 123 Mbps Thisenhanced data rate modem meets EDR requirements of Bluetooth 20 with EDR specifications For the basebandboth BDR and EDR utilize the same 1 MHz symbol rate and 16 kHz slot rate For BDR 1 symbol represents 1-bitHowever each symbol in the payload part of the EDR packets represents 2-bit or 3-bit This is achieved by using twodifferent modulations π4 DQPSK and 8 DPSK

45 Adaptive Frequency Hopping (AFH)The SoC has an AFH function to avoid RF interference It has an algorithm to check the nearby interference and tochoose the clear channel for the transceiver Bluetooth signal

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Datasheet DS70005472A-page 19

5 MicrocontrollerA single-cycle 8-bit microcontroller is built into the SoC to execute the Bluetooth protocols It operates from 16 MHzto higher frequencies where the firmware dynamically adjusts the trade-off between the computing power and thepower consumption In the ROM version the MCU firmware is hard-wired to minimize power consumption for thefirmware execution and to save the external Flash cost

51 MemoryThere are sufficient ROM and RAM to fulfill the processor requirements in which a synchronous single port RAMinterface is used The register bank dedicated single port memory and Flash memory are connected to theprocessor bus The processor coordinates with all link control procedures and the data movement happens using aset of pointer registers

52 External ResetThe IS20xxS SoC provides a Watchdog Timer (WDT) to reset the SoC It has an integrated Power-on Reset (POR)circuit that resets all circuits to a known Power-on state This action is also driven by an external Reset signal whichis used to control the device externally by forcing it into a POR state The RST_N signal input is active-low and noconnection is required in most of the applications

53 Reference ClockThe IS20xxS SoC is composed of an integrated crystal oscillation function that uses a 16 MHz external crystal andtwo specified loading capacitors to provide a high quality system reference timer source Use this feature to removethe initial tolerance frequency errors which are associated with the crystal and its equivalent loading capacitance inthe mass production Achieve the frequency trim by adjusting the crystal loading capacitance through the on-chip trimcapacitors (Ctrim)

The value of the trimming capacitance is 200 fF (200x10-15 F) per LSB at the 5-bit word and the overall adjustableclock frequency is plusmn40 kHz The following figure illustrates the crystal connection of the IS20xxS SoC with twocapacitors

Figure 5-1 Crystal Connection

IS20XXS

XO_N

CL1

XO_P

CL2

IS2008SIS2010SIS2013SIS2015SMicrocontroller

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 20

Notes 1 Ctrim = 200 fF (1 to 31) Cint = 3 pF2 CL = [(CL1 x CL2) (CL1 + CL2)] + (Ctrim 2) + Cint (set trim value as 16 Ctrim = 32 pF)3 For a 16 MHz crystal where CL = 9 pF the CL1 = CL2 = 91 pF)4 For the CL selection refer to the data sheet of the crystal

IS2008SIS2010SIS2013SIS2015SMicrocontroller

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 21

6 Power Management Unit (PMU)The IS20xxS SoC has an integrated PMU The main features of the PMU are a lithium-ion battery charger and avoltage regulator A power switch is used to switch over the power source between a battery and an adapter Alsothe PMU provides current to the LED drivers

61 Charging a BatteryThe IS20xxS SoC has a built-in battery charger which is optimized for lithium-polymer batteries The battery chargerincludes a current sensor for a charging control user programmable current regulator and high accuracy voltageregulator

The charging current parameters are configured by using the UI (IS20XXS_UI) tool Whenever the adapter isplugged-in the charging circuit will be activated Reviving pre-charging constant current mode constant voltagemode and re-charging functions are implemented The maximum charging current is 350 mA The following figureillustrates the charging curve of a battery

Figure 6-1 Battery Charging Curve

62 Voltage MonitoringA 10-bit successive approximation register ADC (SAR ADC) provides a dedicated channel for battery voltage leveldetection The warning level is programmed by using the UI tool The ADC provides a granular resolution to enablethe MCU to take control over the charging process

63 Low Dropout RegulatorA built-in LDO Regulator is used to convert the battery or adapter power for the power supply It also integratesthe hardware architecture to control the power-onoff procedure The built-in programmable LDOs provide power forcodec and digital IO pads Also it is used to buffer the high input voltage from the battery or adapter This LDOrequires a 1 μF bypass capacitor

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 22

64 Switching RegulatorThe built-in programmable output voltage regulator converts the battery voltage to RF and base band core powersupply This converter has a high conversion efficiency and a fast transient response

65 LED DriverThe IS20xxS SoC consists of two LED drivers to control the LEDs The LED drivers provide enough sink current(16-step control and 035 mA for each step) and the LED is connected directly to the IS20xxS SoC

Note  Configure the LED settings using the IS20XXS_UI tool

The following figure illustrates the LED driver in the IS20xxS SoC

Figure 6-2 LED DRIVER

IS20xxS

LED2

SYS_PWR

LED1

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 23

7 Application InformationThis section describes the power supply connection host MCU UART interface and various modes in detail

71 Power SupplyThe following figure illustrates the connection from the BAT_IN pin to various other voltage supply pins of theIS20xxS SoC

The BAT_IN input pin powers the IS20xxS SoC To charge the battery connect the external 5V power adapter toADAP_IN

Figure 7-1 Power Tree Diagram

VDDA VDDAO

VDD_IO

3V LDO

18V Buck

SAR_VDD

LDO31_VIN

CODEC_VO

LDO31_VO

BK_VDD

BK_LX

BK_O

VDD_CORE

VCC_RF

12V LDOPMIC_IN

CLDO_O

RFLDO_O

PVDD_CDA

Li-Io

n BA

T BAT_IN

ADAP_IN

SYS_PWRPower Switch

5V Adapter

(42~30V)

(45~55V)(42~30V)

(30~27V)

(33 ~27V)

(18V)

(12V)

(128V)

72 Host MCU InterfaceAn external MCU controls the IS20xxS SoC using the UART command set The following figure illustrates the UARTinterface between the IS20xxS SoC and an external MCU

Figure 7-2 Host MCU Interface Over UART

IS20xxSHCI_TXD

HCI_RXD

PWR

P0_0

MCUUART_TX

UART_RX

MCU_WAKEUP

BT_WAKEUP

UART Interface

UART Interface

The MCU controls the IS20xxS SoC over the UART interface and wakes up the SoC using the PWR pin The MCUfunction wakes up by connecting to the P0_0 pin of the IS20xxS

Refer to the IS200xIS201xIS202x UART Command SOP document for a list of functions that the IS20xxS SoCsupports and how to use the IS20XXS_UI tool to set up the system using the UART command

Note  The IS200xIS201xIS202x UART Command SOP document is available for download from the Microchipwebsite at IS200xIS201xIS202x UART Command SOP

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 24

73 Timing Sequence of UART ApplicationThe following figures illustrate the various UART control signal timing sequences

Figure 7-3 Power-OnOff Sequence

BAT_IN

SYS_PWR

1 ms

Power- oninitial idle Power-on Power-on Power-off idle

MCU state

MFB (PWR)

BK_OLDO31_VO

400 ms

RST_N

MCU sends UART command (UART_RX)

UART Command

MCU sends power-off UART Command

Power-on ACK ACK ACKIS20xxS response UART state

(UART_TX)

Set ldquoPower-on Directlyrdquo boot

any

10 ms

20 msKeep all IS20xxSand MCU connection to low level

2s

(See Figure 7-4) (See Figure 7-5)

IS20xxS disconnect and auto power-off

gt 1s

Figure 7-4 Timing Sequence of RX Indication after Power-On

Resume 32 kHz mode

MFB (PWR)MCU sends UART command

MFB pulse must be longer than the UART command slot time

150 ms

2 ms 2 ms

Enter 32 kHz mode

1 ms

UART Command

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 25

Figure 7-5 Timing Sequence of Power-Off

BAT_IN +4V

MFB

MCU Sends RST_N

BK_OUT

LDO31_VO

UART Bus

2s 1s

IS20xxS Sends Power-off ACK

Notes 1 EEPROM clock = 100 kHz2 For a byte wire 001 ms x 32 clock x 2 = 640 μs3 It is recommended that ramp-down time be more than 640 μs during the power-off sequence to ensure safe

operation of the device

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 26

Figu

re 7

-6 

Tim

ing

Sequ

ence

of P

ower

-On

(NA

CK

)

BAT

_IN

SYS_

PWR

1 m

s Pow

er-

onin

itial

idle

Pow

er-o

nM

CU

sta

te

MFB

(PW

R)

BK_O

LD

O31

_VO

400

ms

RST

_N

MC

U s

ends

UAR

T co

mm

and

(UAR

T_R

X)

UAR

T C

omm

and

NAC

KPo

wer

-on

ACK

ACK

IS20

xxS

resp

onse

UAR

T st

ate

(UAR

T_TX

)

Set ldquo

Pow

er-o

n D

irect

lyrdquo b

oot

10 m

s

20 m

s

Ret

ry i

f AC

K is

not

rece

ived

200

ms

any

Wai

t

Max

imum

5 ti

mes

(1s)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 27

Figure 7-7 Reset Timing Sequence in Case of No Response from SoC to Host MCU

MFB (PWR)

MCU sends UART command UART

Command

UART Command

IS20xxS UART

If no response

RST_N

1ms

X ms1ms

1ms

1ms

Note  The MCU sends the UART command again when the SoC is not responding to its first UART command Ifthe SoC is not responding to the second UART command within X ms the MCU forces the system to reset

Figure 7-8 Timing Sequence of Power Drop Protection

BAT_IN +4V

RST_N from Reset IC

Power

SYS_PWR

IS20xxS

Reset OUT VDDGND

MCU Reset

Reset IC

29V

1 It is recommended that the battery be connected on a BAT_IN pin of the SoC for the power supply2 If an external power source or a power adapter is used to provide the power to the SoC (ADAP_IN) use a

voltage supervisor IC3 The RESET IC output pin must be open drain with delay time of le 10 ms and the recommended part is

TCM809SVNB713

74 General Purpose IO pinsThe following table provides the details of various functions that are mapped to the IO pins of the IS20xxS SoCand these IOs are configured by using the IS20XXS_UI tool The first button (Button 0) must be configured as thepower-onoff key and can be set using the PWR pin The remaining pins are configured for any one of the defaultfunctions (short press long press double press and combinations)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 28

Table 7-1 IO Pin Configuration

Sl No Pin Name Buttons Default Functions(1)

1 PowerMFB Button 0 PWR

2 P0_2 Button 1 PlayPause

3 P2_7 Button 2 Volume Up

4 P0_5 Button 3 Volume Down

5 P0_1 Button 4 FWD

6 P0_3 Button 5 REV

Note 1 These functions can be configured using the IS20XXS_UI tool

Few signals are generated to indicate or control outside devices The most popular applications are NFC for easypairing external audio amplifier for louder speaker and buzzer for indication

Table 7-2 IO Pins for Added Functions

Functions(1) IO Configurable Features

Slide switch P0_0P1_5

Buzzer P0_3

NFC detect P0_4P1_5

External amplifier enable P1_5

Note 1 These functions can be configured using the IS20XXS_UI tool

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 29

8 Antenna Placement RuleFor Bluetooth-enabled products the antenna placement affects the overall performance The antenna requires freespace to radiate RF signals and it must not be surrounded by the GND plane

The following figure illustrates a typical example of the good and poor antenna placement on the main applicationboard with the GND plane

Figure 8-1 Antenna Placement Examples

The following figure illustrates the keep-out area recommended for the PCB antenna

Figure 8-2 Keep-Out Area Recommended for PCB Antenna

Note  For additional information on the antenna placement refer to the antenna-specific data sheet from theantenna manufacturer

IS2008SIS2010SIS2013SIS2015SAntenna Placement Rule

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 30

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

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Worldwide Sales and Service

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Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Applicationsbull Mono headsets with A2DPbull Mono speaker phones

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 3

Table of Contents

Introduction1

Features 1

1 Quick References6

11 Reference Documentation612 Acronyms and Abbreviation 6

2 Device Overview 8

21 Key Features822 Pin Details 10

3 Audio 17

31 Digital Signal Processor 1732 Codec1833 Auxiliary Port 1834 Class D Audio Amplifier18

4 Transceiver19

41 Transmitter 1942 Receiver 1943 Synthesizer1944 Modem 1945 Adaptive Frequency Hopping (AFH) 19

5 Microcontroller20

51 Memory 2052 External Reset2053 Reference Clock20

6 Power Management Unit (PMU) 22

61 Charging a Battery 2262 Voltage Monitoring2263 Low Dropout Regulator 2264 Switching Regulator 2365 LED Driver23

7 Application Information24

71 Power Supply 2472 Host MCU Interface2473 Timing Sequence of UART Application 2574 General Purpose IO pins28

8 Antenna Placement Rule 30

9 Electrical Characteristics31

10 Packaging Information 37

101 Chip Identification System37

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Datasheet DS70005472A-page 4

102 Package Marking Information37103 Package Details 38

11 Reflow Profile and Storage Condition 43

111 Stencil of SMT Assembly Suggestion 43112 Reflow Profile 44113 Storage Condition44

12 Reference Circuit 46

13 Document Revision History59

The Microchip Website60

Product Change Notification Service60

Customer Support 60

Microchip Devices Code Protection Feature 60

Legal Notice 61

Trademarks 61

Quality Management System 62

Worldwide Sales and Service63

IS2008SIS2010SIS2013SIS2015S

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Datasheet DS70005472A-page 5

1 Quick References

11 Reference DocumentationFor further details refer to the following

bull IS20xxBM1xBM2x DSP Application Notebull IS200xIS201xIS202x UART Command SOP

12 Acronyms and AbbreviationTable 1-1 Acronyms and Abbreviations

Acronyms and Abbreviations Description

AAC_LC Advanced Audio Coding ndash Low Complexity

A2DP Advanced Audio Distribution Profile

ADC Analog-to-Digital Converter

AFH Adaptive Frequency Hopping

BDR Basic Data Rate

BOM Bill of Materials

BPF Band Pass Filter

CVSD Continuous Variable Slope Data

DAC Digital-to-Analog Converter

DSP Digital Signal Processor

EDR Enhanced Data Rate

GFSK Gaussian Frequency Shift Keying

IC Integrated Chip

LDO Low Dropout

LNA Low Noise Amplifier

NFC Near-field Communication

PA Power Amplifier

PLC Packet Loss Concealment

PMU Power Management Unit

POR Power-on Reset

RF Radio Frequency

RSSI Received Signal Strength Indicator

SBC Sub-band Coding

SCMS-T Supports Serial Copy Management System

SNR Signal-to-Noise Ratio

IS2008SIS2010SIS2013SIS2015SQuick References

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 6

continuedAcronyms and Abbreviations Description

UART Universal Asynchronous Receiver Transmitter

VCO Voltage-Controlled Oscillator

WDT Watchdog Timer

IS2008SIS2010SIS2013SIS2015SQuick References

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 7

2 Device OverviewThe IS20xxS SoC integrates

bull Bluetooth 41 radio transceiverbull Power Management Unit (PMU)bull Digital Signal Processor (DSP)bull 1-channel Class-D Amplifier (CDA)

The following figure illustrates the block diagram of the IS20xxS SoC

Figure 2-1 Block Diagram of IS20xxS

8051

16 KB patch RAM

448 KB ROM

44 KB RAM

24-bit DSP Core

MCU

158 KB ROM

88 KB RAM

DSP

IS20xx

Classic RF

MACMODEM

Bluetooth + EDRTransceiver

RF Controller

Antenna

16 MHz Crystal

EEPROM

Power Switch

LED

BAT Charger

18 V BUCK

30 V LDO2

LED Driver2

PMULi-IonBAT

2-Channel DAC

Digital Core

2-Channel ADC

Audio Codec

(For IS20082010 only)

Speaker2W

Stereo Class-D AMP

MIC1

MIC2

Speaker

AUX_IN(analog signal) I2C

GPIOs or HWIO Port 0~3

21 Key FeaturesThe following table provides the key features of the IS20xxS family

Table 2-1 Key Features

Feature IS2008S IS2010S IS2013S IS2015S

Application Headset Headset Speaker Speaker

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Datasheet DS70005472A-page 8

continuedFeature IS2008S IS2010S IS2013S IS2015S

StereoMono Mono Mono Mono Mono

Package QFN QFN QFN QFN

Pin count 48 48 56 56

Dimensions (mm) 6x6 6x6 7x7 7x7

Audio DAC output 1-channel 1-channel 1-channel 1-channel

DAC (single-ended) SNR at28V (dB) -98 -98 -98 -98

DAC (capless) SNR at 28V(dB) -96 -96 -96 -96

ADC SNR at 28V (dB) -90 -90 -90 -90

I2S digital output No No No No

Analog Auxiliary-Input No No Yes Yes

Mono microphone 2 2 1 1

External audio amplifierinterface No No Yes Yes

Built-in CDA No No 1-channel 1-channel

UART Yes Yes Yes Yes

LED driver 2 2 2 2

Integrated DC-DC step-down regulator Yes Yes Yes Yes

DC 5V adapter input Yes Yes Yes Yes

Battery charger (350 mAmaximum) Yes Yes Yes Yes

GPIO 6 6 9 9

Button Support 6 6 6 6

NFC Yes Yes Yes Yes

Voice prompt Yes Yes Yes Yes

Multi-tone Yes Yes Yes Yes

DSP sound effect No No Yes Yes

Bluetooth Profiles

A2DP 12 12 12 12

AVRCP 15 15 15 15

HFP 16 16 16 16

HSP 11 11 11 11

PBAP 10 10 10 10

SPP No 10 No 10

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Datasheet DS70005472A-page 9

22 Pin DetailsThe following figure illustrates the pin diagram of the IS2008S and IS2010S

Figure 2-2 IS2008S and IS2010S Pin Diagram

The following table provides the pin description of the IS2008S and IS2010S

Table 2-2 Pin Description

IS2008S andIS2010S Pin No Pin Type(1) Pin Name Description

1 P VCOM Internal biasing voltage for codec

2 I MICN2 Mic2 mono differential analog negative input

3 I MICP2 Mic2 mono differential analog positive input

4 I MICN1 Mic1 mono differential analog negative input

5 I MICP1 Mic1 mono differential analog positive input

6 P MICBIAS Electric microphone biasing voltage

7 P VDD_CORE Core 12V power input connect to CLDO_O pin

8 O P1_2 IO pin default pull-high input EEPROM clock SCL

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Datasheet DS70005472A-page 10

continuedIS2008S and

IS2010S Pin No Pin Type(1) Pin Name Description

9 IO P1_3 IO pin default pull-high input EEPROM data SDA

10 I RST_N System Reset pin active when rising edge

11 P VDD_IO IO power supply input (27-33V) connect to LDO31_VOpin

12 IO P0_1

IO pin default pull-high input(2)

bull FWD key when class 2 RF (default) active-lowbull Class 1 TX control signal of external RF TR switch

active high

13 IO P1_5

IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0bull Slide switch detector active-lowbull Buzzer signal output

14 I HCI_RXD HCI UART data input

15 O HCI_TXD HCI UART data output

16 P CODEC_VO 31V LDO output for codec power

17 P LDO31_VIN 31V LDO input connect to SYS_PWR pin

18 P LDO31_VO 31V LDO output

19 P ADAP_IN 5V power adapter input

20 P BAT_IN 33-42V Li-ion battery input

21 - NC No Connection

22 P SAR_VDD SAR 18V input connect to BK_O pin

23 P SYS_PWR Power output which comes from BAT_IN or ADAP_IN

24 P BK_VDD 18V buck VDD Power Input connect to SYS_PWR pin

25 P BK_LX 18V buck pin for switch

26 P BK_O 18V buck feedback input

27 I PWR Multi function push button and power-on key

28 I LED2 LED Driver 2

29 I LED1 LED Driver 1

30 IO P0_3

IO pin default pull-high input(2)

bull REV key (default) active-lowbull Buzzer signal outputbull Out_Ind_1bull Class 1 RX control signal of external RF TR switch

active high

31 P CLDO_O 12V core LDO output

32 P PMIC_IN PMU blocks power input connect to BK_O pin

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Datasheet DS70005472A-page 11

continuedIS2008S and

IS2010S Pin No Pin Type(1) Pin Name Description

33 P RFLDO_O 128V RF LDO output

34 P VBG Bandgap output reference for decoupling interference

35 P ULPC_VSUS ULPC 12V output power

36 I XO_N 16 MHz crystal input negative

37 I XO_P 16 MHz crystal input positive

38 P VCC_RF RF power input (128V) for both synthesizer and TXRXblock connect to RFLDO_O pin

39 IO RTX RF path (transmitreceive)

40 I P0_2IO pin default pull-high input(2)

PlayPause key (default) active-low

41 I P2_0IO pin default pull-high input system configuration

H Application L Baseband (IBDK mode)

42 I P2_7IO pin default pull high input(2)

Volume up key (default) active-low

43 I P0_5IO pin default pull high input(2)

Volume down (default) active-low

44 P VDD_IO IO power supply input (27-33V) connect to LDO31_VOpin

45 P VDD_AOPositive power supply dedicated to codec outputamplifiers connect to CODEC_VO pin

46 O AOHPM Headphone common mode outputsense input

47 O AOHPL Left channel analog headphone output

48 P VDDA Positive power supplyreference voltage for codecconnect to CODEC_VO pin

49 P EP Exposed pads used as ground (GND) pins

Notes 1 The conventions used in the table are indicated as follows

ndash I = Input pinndash O = Output pinndash IO = InputOutput pinndash P = Power pin

2 All IO pins are configured using the IS20XXS_UI tool a Windowsreg-based utility

The following figure illustrates the pin diagram of the IS2013S and IS2015S

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Datasheet DS70005472A-page 12

Figure 2-3 IS2013S and IS2015S Pin Diagram

The following table provides the pin description of the IS2013SIS2015S

Table 2-3 Pin Description

IS2013S andIS2015S Pin No Pin Type(1) Pin Name Description

1 P VDDAO Positive power supply dedicated to codec output amplifiersConnect to CODEC_VO pin

2 O AOHPM Headphone common mode outputsense input

3 O AOHPL Left channel analog headphone output

4 P VDDA Positive power supplyreference voltage for codec connect toCODEC_VO pin

5 P VCOM Internal biasing voltage for codec

6 I MICN1 Mic1 mono differential analog negative input

7 I MICP1 Mic1 mono differential analog positive input

8 P MICBIAS Electric microphone biasing voltage

9 I AIL Left channel single-ended analog inputs

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Datasheet DS70005472A-page 13

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

10 P VDD_CORE Core 12V power input connect to CLDO_O pin

11 O P1_2 IO pin default pull high input EEPROM clock SCL

12 IO P1_3 IO pin default pull high input EEPROM data SDA

13 I RST_N System Reset pin active when rising edge

14 P VDD_IO IO power supply input (27-33V) connect to LDO31_VO pin

15 IO P0_1

IO pin default pull-high input(2)

bull FWD key when class 2 RF (default) active-lowbull Class 1 TX Control signal of external RF TR switch

active high

16 I P2_4IO pin default pull high input system configuration

L Boot mode with P2_0 low combination

17 IO P0_4IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0

18 IO P1_5

IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0bull Slide switch detector active-lowbull Buzzer signal output

19 I HCI_RXD HCI UART input data

20 O HCI_TXD HCI UART output data

21 P CODEC_VO 31V LDO output for codec power

22 P LDO31_VIN 31V LDO input connect to SYS_PWR pin

23 P LDO31_VO 31V LDO output

24 P ADAP_IN 5V power adapter input

25 P BAT_IN 33 to 42V Li-ion battery input

26 P SAR_VDD SAR 18V input connect to BK_O pin

27 P SYS_PWR Power output which come from BAT_IN or ADAP_IN

28 P LDO18_VDD 18V LDO VDD Power Input connect to SYS_PWR pin

29 P LDO18_O 18V LDO output

30 I PWR Multi-Function Push button and power on key

31 - NC No Connection

32 I LED2 LED Driver 2

33 I LED1 LED Driver 1

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Datasheet DS70005472A-page 14

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

34 IO P0_0IO pin default pull-high input(2)

bull Slide switch detector active-lowbull UARTTX_IND active-low

35 IO P0_3

IO pin default pull-high input(2)

bull REV key (default) active-lowbull Buzzer signal outputbull Out_Ind_1bull Class 1 RX control signal of external RF TR switch

active high

36 I EANEmbedded ROMExternal Flash enable

H Embedded L External Flash

37 P CLDO_O 12V core LDO output

38 P PMIC_IN PMU blocks power input connect to BK_O pin

39 P RFLDO_O 128V RF LDO output

40 P VBG Bandgap output reference for decoupling interference

41 P ULPC_VSUS ULPC 12V output power

42 I XO_N 16 MHz crystal input negative

43 I XO_P 16 MHz crystal input positive

44 P VCC_RFRF power input (128V) for both synthesizer and TXRXblock connect to RFLDO_O pin

45 IO RTX RF path (transmitreceive)

46 I P0_2IO pin default pull-high input(2)

PlayPause key (default) active-low

47 I P2_0IO pin default pull-high input system configuration

H Application L Baseband (IBDK mode)

48 I P2_7IO pin default pull-high input(2)

Volume up key (default) active-low

49 I P3_0IO pin default pull-high input(2)

Line-in detector (default) active-low

50 I P0_5IO pin default pull-high input(2)

Volume down (default) active-low

51 P VDD_IO IO power supply input (27-33V) connect to LDO31_VO pin

52 P AVDD_CDA Supply voltage of audio amplifier

53 P VBP_CDA Reference voltage output

54 O HPON_CDA Negative BTL output of channel-1

55 O HPOP_CDA Positive BTL output of channel-1

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Datasheet DS70005472A-page 15

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

56 P PVDD_CDA Supply voltage of power stage ch-1

57 P EP Exposed pads used as ground (GND) pins

Notes 1 The conventions used in the table are indicated as follows

ndash I = Input pinndash O = Output pinndash IO = InputOutput pinndash P = Power pin

2 All IO pins are configured using the UI tool a Windows-based utility

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Datasheet DS70005472A-page 16

3 AudioThe input and output audio signals have different stages and each stage is programmed to vary the gain responsecharacteristics For microphones both single-ended inputs and differential inputs are supported To maintain ahigh-quality signal provide a stable bias voltage source to the condenser microphonersquos FET Use the DC-blockingcapacitors at both positive and negative sides of the input Internally this analog signal is converted to 16-bit 8 kHzlinear PCM data

31 Digital Signal ProcessorA Digital Signal Processor (DSP) is used to perform speech and audio processing The advanced speech featuressuch as acoustic echo cancellation and noise reduction are built in To reduce nonlinear distortion and to help echocancellation an outgoing signal level to the speaker is monitored and adjusted to avoid saturation of the speakeroutput or microphone input Adaptive filtering is also applied to track the echo path impulse in response to provide anecho-free and full-duplex user experience

The embedded noise reduction algorithm helps to extract clean speech signals from the noisy inputs capturedby microphones and improves mutual understanding in communication The advanced audio features such asmulti-band dynamic range control parametric multi-band equalizer audio widening and virtual bass are built in Theaudio effect algorithms improve the userrsquos audio listening experience in terms of better quality audio after audiosignal processing

The following figures illustrate the processing flow of speakerphone applications for speech and audio signalprocessing

Figure 3-1 Speech Processing

Figure 3-2 Audio Processing

The DSP parameters such as EQ Speaker Gain Mic Gain Sound Effect and more are configured using the DSPtool For additional information on the DSP tool refer to the IS20xxBM1xBM2x DSP Application Note

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Datasheet DS70005472A-page 17

Note  The DSP tool and IS20xxBM1xBM2x DSP Application Note are available for download at the Microchipwebsite

32 CodecThe built-in codec has a high SNR performance and it consists of an ADC a DAC and additional analog circuitry

33 Auxiliary PortThe SoC supports one analog (line-in) signal from the external audio source The analog signal is processed bythe DSP to generate different sound effects (multi-band dynamic range compression and audio widening) which areconfigured using the DSP tool

34 Class D Audio AmplifierThe Class D amplifier has a significant advantage in many applications due to its lower power dissipation whichproduces less heat The IS2013S and IS2015S SoC have a built-in Class D amplifier that reduces circuit board spaceand system cost The efficiency of the amplifier extends the battery life in portable systems

The Class D amplifier is implemented by using a full-bridge output stage A full bridge uses two half-bridge stages todrive the load differentially The Class D amplifier provides a good SNR and enough drive capability for a 4Ω speakerdriver

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Datasheet DS70005472A-page 18

4 TransceiverThe SoC is designed and optimized for Bluetooth 24 GHz systems It contains a complete radio frequencytransmitterreceiver section An internal synthesizer generates a stable clock to synchronize with another device

41 TransmitterThe internal Power Amplifier (PA) has a maximum output power of +4 dBm with 20 dB power level control Applythis to Class 2 or Class 3 radios without an external RF PA The transmitter directly performs the IQ conversionto minimize the frequency drift and it can access the 20 dB power range with the temperature compensationmechanism

42 ReceiverThe Low-Noise Amplifier (LNA) operates with TR-combined mode for the single port application It saves the pin onthe package without having an external TXRX switch

The ADC is used to sample the input analog signal and convert it into a digital signal for demodulator analysisA channel filter is integrated into a receiver channel before the ADC to reduce the external component count andincrease the anti-interference capability

The image rejection filter is used to reject the image frequency for the low-IF architecture and it is also intended toreduce the external Band Pass Filter (BPF) component for a super heterodyne architecture

The Received Signal Strength Indicator (RSSI) signal feedback to the processor is used to control the RF outputpower to make a good trade-off for effective distance and current consumption

43 SynthesizerA synthesizer generates a clock for radio transceiver operation The VCO inside with a tunable internal LC tankcan reduce any variation for components A crystal oscillator with an internal digital trimming circuit provides a stableclock for the synthesizer

44 ModemFor Bluetooth 12 specifications and below 1 Mbps is the standard data rate based on the Gaussian Frequency ShiftKeying (GFSK) modulation scheme This basic rate modem meets BDR requirements of Bluetooth 20 with EDRspecifications

For Bluetooth 20 and above specifications EDR is introduced to provide the data rates of 123 Mbps Thisenhanced data rate modem meets EDR requirements of Bluetooth 20 with EDR specifications For the basebandboth BDR and EDR utilize the same 1 MHz symbol rate and 16 kHz slot rate For BDR 1 symbol represents 1-bitHowever each symbol in the payload part of the EDR packets represents 2-bit or 3-bit This is achieved by using twodifferent modulations π4 DQPSK and 8 DPSK

45 Adaptive Frequency Hopping (AFH)The SoC has an AFH function to avoid RF interference It has an algorithm to check the nearby interference and tochoose the clear channel for the transceiver Bluetooth signal

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Datasheet DS70005472A-page 19

5 MicrocontrollerA single-cycle 8-bit microcontroller is built into the SoC to execute the Bluetooth protocols It operates from 16 MHzto higher frequencies where the firmware dynamically adjusts the trade-off between the computing power and thepower consumption In the ROM version the MCU firmware is hard-wired to minimize power consumption for thefirmware execution and to save the external Flash cost

51 MemoryThere are sufficient ROM and RAM to fulfill the processor requirements in which a synchronous single port RAMinterface is used The register bank dedicated single port memory and Flash memory are connected to theprocessor bus The processor coordinates with all link control procedures and the data movement happens using aset of pointer registers

52 External ResetThe IS20xxS SoC provides a Watchdog Timer (WDT) to reset the SoC It has an integrated Power-on Reset (POR)circuit that resets all circuits to a known Power-on state This action is also driven by an external Reset signal whichis used to control the device externally by forcing it into a POR state The RST_N signal input is active-low and noconnection is required in most of the applications

53 Reference ClockThe IS20xxS SoC is composed of an integrated crystal oscillation function that uses a 16 MHz external crystal andtwo specified loading capacitors to provide a high quality system reference timer source Use this feature to removethe initial tolerance frequency errors which are associated with the crystal and its equivalent loading capacitance inthe mass production Achieve the frequency trim by adjusting the crystal loading capacitance through the on-chip trimcapacitors (Ctrim)

The value of the trimming capacitance is 200 fF (200x10-15 F) per LSB at the 5-bit word and the overall adjustableclock frequency is plusmn40 kHz The following figure illustrates the crystal connection of the IS20xxS SoC with twocapacitors

Figure 5-1 Crystal Connection

IS20XXS

XO_N

CL1

XO_P

CL2

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Datasheet DS70005472A-page 20

Notes 1 Ctrim = 200 fF (1 to 31) Cint = 3 pF2 CL = [(CL1 x CL2) (CL1 + CL2)] + (Ctrim 2) + Cint (set trim value as 16 Ctrim = 32 pF)3 For a 16 MHz crystal where CL = 9 pF the CL1 = CL2 = 91 pF)4 For the CL selection refer to the data sheet of the crystal

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Datasheet DS70005472A-page 21

6 Power Management Unit (PMU)The IS20xxS SoC has an integrated PMU The main features of the PMU are a lithium-ion battery charger and avoltage regulator A power switch is used to switch over the power source between a battery and an adapter Alsothe PMU provides current to the LED drivers

61 Charging a BatteryThe IS20xxS SoC has a built-in battery charger which is optimized for lithium-polymer batteries The battery chargerincludes a current sensor for a charging control user programmable current regulator and high accuracy voltageregulator

The charging current parameters are configured by using the UI (IS20XXS_UI) tool Whenever the adapter isplugged-in the charging circuit will be activated Reviving pre-charging constant current mode constant voltagemode and re-charging functions are implemented The maximum charging current is 350 mA The following figureillustrates the charging curve of a battery

Figure 6-1 Battery Charging Curve

62 Voltage MonitoringA 10-bit successive approximation register ADC (SAR ADC) provides a dedicated channel for battery voltage leveldetection The warning level is programmed by using the UI tool The ADC provides a granular resolution to enablethe MCU to take control over the charging process

63 Low Dropout RegulatorA built-in LDO Regulator is used to convert the battery or adapter power for the power supply It also integratesthe hardware architecture to control the power-onoff procedure The built-in programmable LDOs provide power forcodec and digital IO pads Also it is used to buffer the high input voltage from the battery or adapter This LDOrequires a 1 μF bypass capacitor

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 22

64 Switching RegulatorThe built-in programmable output voltage regulator converts the battery voltage to RF and base band core powersupply This converter has a high conversion efficiency and a fast transient response

65 LED DriverThe IS20xxS SoC consists of two LED drivers to control the LEDs The LED drivers provide enough sink current(16-step control and 035 mA for each step) and the LED is connected directly to the IS20xxS SoC

Note  Configure the LED settings using the IS20XXS_UI tool

The following figure illustrates the LED driver in the IS20xxS SoC

Figure 6-2 LED DRIVER

IS20xxS

LED2

SYS_PWR

LED1

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 23

7 Application InformationThis section describes the power supply connection host MCU UART interface and various modes in detail

71 Power SupplyThe following figure illustrates the connection from the BAT_IN pin to various other voltage supply pins of theIS20xxS SoC

The BAT_IN input pin powers the IS20xxS SoC To charge the battery connect the external 5V power adapter toADAP_IN

Figure 7-1 Power Tree Diagram

VDDA VDDAO

VDD_IO

3V LDO

18V Buck

SAR_VDD

LDO31_VIN

CODEC_VO

LDO31_VO

BK_VDD

BK_LX

BK_O

VDD_CORE

VCC_RF

12V LDOPMIC_IN

CLDO_O

RFLDO_O

PVDD_CDA

Li-Io

n BA

T BAT_IN

ADAP_IN

SYS_PWRPower Switch

5V Adapter

(42~30V)

(45~55V)(42~30V)

(30~27V)

(33 ~27V)

(18V)

(12V)

(128V)

72 Host MCU InterfaceAn external MCU controls the IS20xxS SoC using the UART command set The following figure illustrates the UARTinterface between the IS20xxS SoC and an external MCU

Figure 7-2 Host MCU Interface Over UART

IS20xxSHCI_TXD

HCI_RXD

PWR

P0_0

MCUUART_TX

UART_RX

MCU_WAKEUP

BT_WAKEUP

UART Interface

UART Interface

The MCU controls the IS20xxS SoC over the UART interface and wakes up the SoC using the PWR pin The MCUfunction wakes up by connecting to the P0_0 pin of the IS20xxS

Refer to the IS200xIS201xIS202x UART Command SOP document for a list of functions that the IS20xxS SoCsupports and how to use the IS20XXS_UI tool to set up the system using the UART command

Note  The IS200xIS201xIS202x UART Command SOP document is available for download from the Microchipwebsite at IS200xIS201xIS202x UART Command SOP

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 24

73 Timing Sequence of UART ApplicationThe following figures illustrate the various UART control signal timing sequences

Figure 7-3 Power-OnOff Sequence

BAT_IN

SYS_PWR

1 ms

Power- oninitial idle Power-on Power-on Power-off idle

MCU state

MFB (PWR)

BK_OLDO31_VO

400 ms

RST_N

MCU sends UART command (UART_RX)

UART Command

MCU sends power-off UART Command

Power-on ACK ACK ACKIS20xxS response UART state

(UART_TX)

Set ldquoPower-on Directlyrdquo boot

any

10 ms

20 msKeep all IS20xxSand MCU connection to low level

2s

(See Figure 7-4) (See Figure 7-5)

IS20xxS disconnect and auto power-off

gt 1s

Figure 7-4 Timing Sequence of RX Indication after Power-On

Resume 32 kHz mode

MFB (PWR)MCU sends UART command

MFB pulse must be longer than the UART command slot time

150 ms

2 ms 2 ms

Enter 32 kHz mode

1 ms

UART Command

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 25

Figure 7-5 Timing Sequence of Power-Off

BAT_IN +4V

MFB

MCU Sends RST_N

BK_OUT

LDO31_VO

UART Bus

2s 1s

IS20xxS Sends Power-off ACK

Notes 1 EEPROM clock = 100 kHz2 For a byte wire 001 ms x 32 clock x 2 = 640 μs3 It is recommended that ramp-down time be more than 640 μs during the power-off sequence to ensure safe

operation of the device

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 26

Figu

re 7

-6 

Tim

ing

Sequ

ence

of P

ower

-On

(NA

CK

)

BAT

_IN

SYS_

PWR

1 m

s Pow

er-

onin

itial

idle

Pow

er-o

nM

CU

sta

te

MFB

(PW

R)

BK_O

LD

O31

_VO

400

ms

RST

_N

MC

U s

ends

UAR

T co

mm

and

(UAR

T_R

X)

UAR

T C

omm

and

NAC

KPo

wer

-on

ACK

ACK

IS20

xxS

resp

onse

UAR

T st

ate

(UAR

T_TX

)

Set ldquo

Pow

er-o

n D

irect

lyrdquo b

oot

10 m

s

20 m

s

Ret

ry i

f AC

K is

not

rece

ived

200

ms

any

Wai

t

Max

imum

5 ti

mes

(1s)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 27

Figure 7-7 Reset Timing Sequence in Case of No Response from SoC to Host MCU

MFB (PWR)

MCU sends UART command UART

Command

UART Command

IS20xxS UART

If no response

RST_N

1ms

X ms1ms

1ms

1ms

Note  The MCU sends the UART command again when the SoC is not responding to its first UART command Ifthe SoC is not responding to the second UART command within X ms the MCU forces the system to reset

Figure 7-8 Timing Sequence of Power Drop Protection

BAT_IN +4V

RST_N from Reset IC

Power

SYS_PWR

IS20xxS

Reset OUT VDDGND

MCU Reset

Reset IC

29V

1 It is recommended that the battery be connected on a BAT_IN pin of the SoC for the power supply2 If an external power source or a power adapter is used to provide the power to the SoC (ADAP_IN) use a

voltage supervisor IC3 The RESET IC output pin must be open drain with delay time of le 10 ms and the recommended part is

TCM809SVNB713

74 General Purpose IO pinsThe following table provides the details of various functions that are mapped to the IO pins of the IS20xxS SoCand these IOs are configured by using the IS20XXS_UI tool The first button (Button 0) must be configured as thepower-onoff key and can be set using the PWR pin The remaining pins are configured for any one of the defaultfunctions (short press long press double press and combinations)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 28

Table 7-1 IO Pin Configuration

Sl No Pin Name Buttons Default Functions(1)

1 PowerMFB Button 0 PWR

2 P0_2 Button 1 PlayPause

3 P2_7 Button 2 Volume Up

4 P0_5 Button 3 Volume Down

5 P0_1 Button 4 FWD

6 P0_3 Button 5 REV

Note 1 These functions can be configured using the IS20XXS_UI tool

Few signals are generated to indicate or control outside devices The most popular applications are NFC for easypairing external audio amplifier for louder speaker and buzzer for indication

Table 7-2 IO Pins for Added Functions

Functions(1) IO Configurable Features

Slide switch P0_0P1_5

Buzzer P0_3

NFC detect P0_4P1_5

External amplifier enable P1_5

Note 1 These functions can be configured using the IS20XXS_UI tool

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 29

8 Antenna Placement RuleFor Bluetooth-enabled products the antenna placement affects the overall performance The antenna requires freespace to radiate RF signals and it must not be surrounded by the GND plane

The following figure illustrates a typical example of the good and poor antenna placement on the main applicationboard with the GND plane

Figure 8-1 Antenna Placement Examples

The following figure illustrates the keep-out area recommended for the PCB antenna

Figure 8-2 Keep-Out Area Recommended for PCB Antenna

Note  For additional information on the antenna placement refer to the antenna-specific data sheet from theantenna manufacturer

IS2008SIS2010SIS2013SIS2015SAntenna Placement Rule

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 30

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Table of Contents

Introduction1

Features 1

1 Quick References6

11 Reference Documentation612 Acronyms and Abbreviation 6

2 Device Overview 8

21 Key Features822 Pin Details 10

3 Audio 17

31 Digital Signal Processor 1732 Codec1833 Auxiliary Port 1834 Class D Audio Amplifier18

4 Transceiver19

41 Transmitter 1942 Receiver 1943 Synthesizer1944 Modem 1945 Adaptive Frequency Hopping (AFH) 19

5 Microcontroller20

51 Memory 2052 External Reset2053 Reference Clock20

6 Power Management Unit (PMU) 22

61 Charging a Battery 2262 Voltage Monitoring2263 Low Dropout Regulator 2264 Switching Regulator 2365 LED Driver23

7 Application Information24

71 Power Supply 2472 Host MCU Interface2473 Timing Sequence of UART Application 2574 General Purpose IO pins28

8 Antenna Placement Rule 30

9 Electrical Characteristics31

10 Packaging Information 37

101 Chip Identification System37

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Datasheet DS70005472A-page 4

102 Package Marking Information37103 Package Details 38

11 Reflow Profile and Storage Condition 43

111 Stencil of SMT Assembly Suggestion 43112 Reflow Profile 44113 Storage Condition44

12 Reference Circuit 46

13 Document Revision History59

The Microchip Website60

Product Change Notification Service60

Customer Support 60

Microchip Devices Code Protection Feature 60

Legal Notice 61

Trademarks 61

Quality Management System 62

Worldwide Sales and Service63

IS2008SIS2010SIS2013SIS2015S

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Datasheet DS70005472A-page 5

1 Quick References

11 Reference DocumentationFor further details refer to the following

bull IS20xxBM1xBM2x DSP Application Notebull IS200xIS201xIS202x UART Command SOP

12 Acronyms and AbbreviationTable 1-1 Acronyms and Abbreviations

Acronyms and Abbreviations Description

AAC_LC Advanced Audio Coding ndash Low Complexity

A2DP Advanced Audio Distribution Profile

ADC Analog-to-Digital Converter

AFH Adaptive Frequency Hopping

BDR Basic Data Rate

BOM Bill of Materials

BPF Band Pass Filter

CVSD Continuous Variable Slope Data

DAC Digital-to-Analog Converter

DSP Digital Signal Processor

EDR Enhanced Data Rate

GFSK Gaussian Frequency Shift Keying

IC Integrated Chip

LDO Low Dropout

LNA Low Noise Amplifier

NFC Near-field Communication

PA Power Amplifier

PLC Packet Loss Concealment

PMU Power Management Unit

POR Power-on Reset

RF Radio Frequency

RSSI Received Signal Strength Indicator

SBC Sub-band Coding

SCMS-T Supports Serial Copy Management System

SNR Signal-to-Noise Ratio

IS2008SIS2010SIS2013SIS2015SQuick References

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 6

continuedAcronyms and Abbreviations Description

UART Universal Asynchronous Receiver Transmitter

VCO Voltage-Controlled Oscillator

WDT Watchdog Timer

IS2008SIS2010SIS2013SIS2015SQuick References

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Datasheet DS70005472A-page 7

2 Device OverviewThe IS20xxS SoC integrates

bull Bluetooth 41 radio transceiverbull Power Management Unit (PMU)bull Digital Signal Processor (DSP)bull 1-channel Class-D Amplifier (CDA)

The following figure illustrates the block diagram of the IS20xxS SoC

Figure 2-1 Block Diagram of IS20xxS

8051

16 KB patch RAM

448 KB ROM

44 KB RAM

24-bit DSP Core

MCU

158 KB ROM

88 KB RAM

DSP

IS20xx

Classic RF

MACMODEM

Bluetooth + EDRTransceiver

RF Controller

Antenna

16 MHz Crystal

EEPROM

Power Switch

LED

BAT Charger

18 V BUCK

30 V LDO2

LED Driver2

PMULi-IonBAT

2-Channel DAC

Digital Core

2-Channel ADC

Audio Codec

(For IS20082010 only)

Speaker2W

Stereo Class-D AMP

MIC1

MIC2

Speaker

AUX_IN(analog signal) I2C

GPIOs or HWIO Port 0~3

21 Key FeaturesThe following table provides the key features of the IS20xxS family

Table 2-1 Key Features

Feature IS2008S IS2010S IS2013S IS2015S

Application Headset Headset Speaker Speaker

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Datasheet DS70005472A-page 8

continuedFeature IS2008S IS2010S IS2013S IS2015S

StereoMono Mono Mono Mono Mono

Package QFN QFN QFN QFN

Pin count 48 48 56 56

Dimensions (mm) 6x6 6x6 7x7 7x7

Audio DAC output 1-channel 1-channel 1-channel 1-channel

DAC (single-ended) SNR at28V (dB) -98 -98 -98 -98

DAC (capless) SNR at 28V(dB) -96 -96 -96 -96

ADC SNR at 28V (dB) -90 -90 -90 -90

I2S digital output No No No No

Analog Auxiliary-Input No No Yes Yes

Mono microphone 2 2 1 1

External audio amplifierinterface No No Yes Yes

Built-in CDA No No 1-channel 1-channel

UART Yes Yes Yes Yes

LED driver 2 2 2 2

Integrated DC-DC step-down regulator Yes Yes Yes Yes

DC 5V adapter input Yes Yes Yes Yes

Battery charger (350 mAmaximum) Yes Yes Yes Yes

GPIO 6 6 9 9

Button Support 6 6 6 6

NFC Yes Yes Yes Yes

Voice prompt Yes Yes Yes Yes

Multi-tone Yes Yes Yes Yes

DSP sound effect No No Yes Yes

Bluetooth Profiles

A2DP 12 12 12 12

AVRCP 15 15 15 15

HFP 16 16 16 16

HSP 11 11 11 11

PBAP 10 10 10 10

SPP No 10 No 10

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Datasheet DS70005472A-page 9

22 Pin DetailsThe following figure illustrates the pin diagram of the IS2008S and IS2010S

Figure 2-2 IS2008S and IS2010S Pin Diagram

The following table provides the pin description of the IS2008S and IS2010S

Table 2-2 Pin Description

IS2008S andIS2010S Pin No Pin Type(1) Pin Name Description

1 P VCOM Internal biasing voltage for codec

2 I MICN2 Mic2 mono differential analog negative input

3 I MICP2 Mic2 mono differential analog positive input

4 I MICN1 Mic1 mono differential analog negative input

5 I MICP1 Mic1 mono differential analog positive input

6 P MICBIAS Electric microphone biasing voltage

7 P VDD_CORE Core 12V power input connect to CLDO_O pin

8 O P1_2 IO pin default pull-high input EEPROM clock SCL

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Datasheet DS70005472A-page 10

continuedIS2008S and

IS2010S Pin No Pin Type(1) Pin Name Description

9 IO P1_3 IO pin default pull-high input EEPROM data SDA

10 I RST_N System Reset pin active when rising edge

11 P VDD_IO IO power supply input (27-33V) connect to LDO31_VOpin

12 IO P0_1

IO pin default pull-high input(2)

bull FWD key when class 2 RF (default) active-lowbull Class 1 TX control signal of external RF TR switch

active high

13 IO P1_5

IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0bull Slide switch detector active-lowbull Buzzer signal output

14 I HCI_RXD HCI UART data input

15 O HCI_TXD HCI UART data output

16 P CODEC_VO 31V LDO output for codec power

17 P LDO31_VIN 31V LDO input connect to SYS_PWR pin

18 P LDO31_VO 31V LDO output

19 P ADAP_IN 5V power adapter input

20 P BAT_IN 33-42V Li-ion battery input

21 - NC No Connection

22 P SAR_VDD SAR 18V input connect to BK_O pin

23 P SYS_PWR Power output which comes from BAT_IN or ADAP_IN

24 P BK_VDD 18V buck VDD Power Input connect to SYS_PWR pin

25 P BK_LX 18V buck pin for switch

26 P BK_O 18V buck feedback input

27 I PWR Multi function push button and power-on key

28 I LED2 LED Driver 2

29 I LED1 LED Driver 1

30 IO P0_3

IO pin default pull-high input(2)

bull REV key (default) active-lowbull Buzzer signal outputbull Out_Ind_1bull Class 1 RX control signal of external RF TR switch

active high

31 P CLDO_O 12V core LDO output

32 P PMIC_IN PMU blocks power input connect to BK_O pin

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Datasheet DS70005472A-page 11

continuedIS2008S and

IS2010S Pin No Pin Type(1) Pin Name Description

33 P RFLDO_O 128V RF LDO output

34 P VBG Bandgap output reference for decoupling interference

35 P ULPC_VSUS ULPC 12V output power

36 I XO_N 16 MHz crystal input negative

37 I XO_P 16 MHz crystal input positive

38 P VCC_RF RF power input (128V) for both synthesizer and TXRXblock connect to RFLDO_O pin

39 IO RTX RF path (transmitreceive)

40 I P0_2IO pin default pull-high input(2)

PlayPause key (default) active-low

41 I P2_0IO pin default pull-high input system configuration

H Application L Baseband (IBDK mode)

42 I P2_7IO pin default pull high input(2)

Volume up key (default) active-low

43 I P0_5IO pin default pull high input(2)

Volume down (default) active-low

44 P VDD_IO IO power supply input (27-33V) connect to LDO31_VOpin

45 P VDD_AOPositive power supply dedicated to codec outputamplifiers connect to CODEC_VO pin

46 O AOHPM Headphone common mode outputsense input

47 O AOHPL Left channel analog headphone output

48 P VDDA Positive power supplyreference voltage for codecconnect to CODEC_VO pin

49 P EP Exposed pads used as ground (GND) pins

Notes 1 The conventions used in the table are indicated as follows

ndash I = Input pinndash O = Output pinndash IO = InputOutput pinndash P = Power pin

2 All IO pins are configured using the IS20XXS_UI tool a Windowsreg-based utility

The following figure illustrates the pin diagram of the IS2013S and IS2015S

IS2008SIS2010SIS2013SIS2015SDevice Overview

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Datasheet DS70005472A-page 12

Figure 2-3 IS2013S and IS2015S Pin Diagram

The following table provides the pin description of the IS2013SIS2015S

Table 2-3 Pin Description

IS2013S andIS2015S Pin No Pin Type(1) Pin Name Description

1 P VDDAO Positive power supply dedicated to codec output amplifiersConnect to CODEC_VO pin

2 O AOHPM Headphone common mode outputsense input

3 O AOHPL Left channel analog headphone output

4 P VDDA Positive power supplyreference voltage for codec connect toCODEC_VO pin

5 P VCOM Internal biasing voltage for codec

6 I MICN1 Mic1 mono differential analog negative input

7 I MICP1 Mic1 mono differential analog positive input

8 P MICBIAS Electric microphone biasing voltage

9 I AIL Left channel single-ended analog inputs

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Datasheet DS70005472A-page 13

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

10 P VDD_CORE Core 12V power input connect to CLDO_O pin

11 O P1_2 IO pin default pull high input EEPROM clock SCL

12 IO P1_3 IO pin default pull high input EEPROM data SDA

13 I RST_N System Reset pin active when rising edge

14 P VDD_IO IO power supply input (27-33V) connect to LDO31_VO pin

15 IO P0_1

IO pin default pull-high input(2)

bull FWD key when class 2 RF (default) active-lowbull Class 1 TX Control signal of external RF TR switch

active high

16 I P2_4IO pin default pull high input system configuration

L Boot mode with P2_0 low combination

17 IO P0_4IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0

18 IO P1_5

IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0bull Slide switch detector active-lowbull Buzzer signal output

19 I HCI_RXD HCI UART input data

20 O HCI_TXD HCI UART output data

21 P CODEC_VO 31V LDO output for codec power

22 P LDO31_VIN 31V LDO input connect to SYS_PWR pin

23 P LDO31_VO 31V LDO output

24 P ADAP_IN 5V power adapter input

25 P BAT_IN 33 to 42V Li-ion battery input

26 P SAR_VDD SAR 18V input connect to BK_O pin

27 P SYS_PWR Power output which come from BAT_IN or ADAP_IN

28 P LDO18_VDD 18V LDO VDD Power Input connect to SYS_PWR pin

29 P LDO18_O 18V LDO output

30 I PWR Multi-Function Push button and power on key

31 - NC No Connection

32 I LED2 LED Driver 2

33 I LED1 LED Driver 1

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Datasheet DS70005472A-page 14

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

34 IO P0_0IO pin default pull-high input(2)

bull Slide switch detector active-lowbull UARTTX_IND active-low

35 IO P0_3

IO pin default pull-high input(2)

bull REV key (default) active-lowbull Buzzer signal outputbull Out_Ind_1bull Class 1 RX control signal of external RF TR switch

active high

36 I EANEmbedded ROMExternal Flash enable

H Embedded L External Flash

37 P CLDO_O 12V core LDO output

38 P PMIC_IN PMU blocks power input connect to BK_O pin

39 P RFLDO_O 128V RF LDO output

40 P VBG Bandgap output reference for decoupling interference

41 P ULPC_VSUS ULPC 12V output power

42 I XO_N 16 MHz crystal input negative

43 I XO_P 16 MHz crystal input positive

44 P VCC_RFRF power input (128V) for both synthesizer and TXRXblock connect to RFLDO_O pin

45 IO RTX RF path (transmitreceive)

46 I P0_2IO pin default pull-high input(2)

PlayPause key (default) active-low

47 I P2_0IO pin default pull-high input system configuration

H Application L Baseband (IBDK mode)

48 I P2_7IO pin default pull-high input(2)

Volume up key (default) active-low

49 I P3_0IO pin default pull-high input(2)

Line-in detector (default) active-low

50 I P0_5IO pin default pull-high input(2)

Volume down (default) active-low

51 P VDD_IO IO power supply input (27-33V) connect to LDO31_VO pin

52 P AVDD_CDA Supply voltage of audio amplifier

53 P VBP_CDA Reference voltage output

54 O HPON_CDA Negative BTL output of channel-1

55 O HPOP_CDA Positive BTL output of channel-1

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Datasheet DS70005472A-page 15

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

56 P PVDD_CDA Supply voltage of power stage ch-1

57 P EP Exposed pads used as ground (GND) pins

Notes 1 The conventions used in the table are indicated as follows

ndash I = Input pinndash O = Output pinndash IO = InputOutput pinndash P = Power pin

2 All IO pins are configured using the UI tool a Windows-based utility

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Datasheet DS70005472A-page 16

3 AudioThe input and output audio signals have different stages and each stage is programmed to vary the gain responsecharacteristics For microphones both single-ended inputs and differential inputs are supported To maintain ahigh-quality signal provide a stable bias voltage source to the condenser microphonersquos FET Use the DC-blockingcapacitors at both positive and negative sides of the input Internally this analog signal is converted to 16-bit 8 kHzlinear PCM data

31 Digital Signal ProcessorA Digital Signal Processor (DSP) is used to perform speech and audio processing The advanced speech featuressuch as acoustic echo cancellation and noise reduction are built in To reduce nonlinear distortion and to help echocancellation an outgoing signal level to the speaker is monitored and adjusted to avoid saturation of the speakeroutput or microphone input Adaptive filtering is also applied to track the echo path impulse in response to provide anecho-free and full-duplex user experience

The embedded noise reduction algorithm helps to extract clean speech signals from the noisy inputs capturedby microphones and improves mutual understanding in communication The advanced audio features such asmulti-band dynamic range control parametric multi-band equalizer audio widening and virtual bass are built in Theaudio effect algorithms improve the userrsquos audio listening experience in terms of better quality audio after audiosignal processing

The following figures illustrate the processing flow of speakerphone applications for speech and audio signalprocessing

Figure 3-1 Speech Processing

Figure 3-2 Audio Processing

The DSP parameters such as EQ Speaker Gain Mic Gain Sound Effect and more are configured using the DSPtool For additional information on the DSP tool refer to the IS20xxBM1xBM2x DSP Application Note

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Datasheet DS70005472A-page 17

Note  The DSP tool and IS20xxBM1xBM2x DSP Application Note are available for download at the Microchipwebsite

32 CodecThe built-in codec has a high SNR performance and it consists of an ADC a DAC and additional analog circuitry

33 Auxiliary PortThe SoC supports one analog (line-in) signal from the external audio source The analog signal is processed bythe DSP to generate different sound effects (multi-band dynamic range compression and audio widening) which areconfigured using the DSP tool

34 Class D Audio AmplifierThe Class D amplifier has a significant advantage in many applications due to its lower power dissipation whichproduces less heat The IS2013S and IS2015S SoC have a built-in Class D amplifier that reduces circuit board spaceand system cost The efficiency of the amplifier extends the battery life in portable systems

The Class D amplifier is implemented by using a full-bridge output stage A full bridge uses two half-bridge stages todrive the load differentially The Class D amplifier provides a good SNR and enough drive capability for a 4Ω speakerdriver

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Datasheet DS70005472A-page 18

4 TransceiverThe SoC is designed and optimized for Bluetooth 24 GHz systems It contains a complete radio frequencytransmitterreceiver section An internal synthesizer generates a stable clock to synchronize with another device

41 TransmitterThe internal Power Amplifier (PA) has a maximum output power of +4 dBm with 20 dB power level control Applythis to Class 2 or Class 3 radios without an external RF PA The transmitter directly performs the IQ conversionto minimize the frequency drift and it can access the 20 dB power range with the temperature compensationmechanism

42 ReceiverThe Low-Noise Amplifier (LNA) operates with TR-combined mode for the single port application It saves the pin onthe package without having an external TXRX switch

The ADC is used to sample the input analog signal and convert it into a digital signal for demodulator analysisA channel filter is integrated into a receiver channel before the ADC to reduce the external component count andincrease the anti-interference capability

The image rejection filter is used to reject the image frequency for the low-IF architecture and it is also intended toreduce the external Band Pass Filter (BPF) component for a super heterodyne architecture

The Received Signal Strength Indicator (RSSI) signal feedback to the processor is used to control the RF outputpower to make a good trade-off for effective distance and current consumption

43 SynthesizerA synthesizer generates a clock for radio transceiver operation The VCO inside with a tunable internal LC tankcan reduce any variation for components A crystal oscillator with an internal digital trimming circuit provides a stableclock for the synthesizer

44 ModemFor Bluetooth 12 specifications and below 1 Mbps is the standard data rate based on the Gaussian Frequency ShiftKeying (GFSK) modulation scheme This basic rate modem meets BDR requirements of Bluetooth 20 with EDRspecifications

For Bluetooth 20 and above specifications EDR is introduced to provide the data rates of 123 Mbps Thisenhanced data rate modem meets EDR requirements of Bluetooth 20 with EDR specifications For the basebandboth BDR and EDR utilize the same 1 MHz symbol rate and 16 kHz slot rate For BDR 1 symbol represents 1-bitHowever each symbol in the payload part of the EDR packets represents 2-bit or 3-bit This is achieved by using twodifferent modulations π4 DQPSK and 8 DPSK

45 Adaptive Frequency Hopping (AFH)The SoC has an AFH function to avoid RF interference It has an algorithm to check the nearby interference and tochoose the clear channel for the transceiver Bluetooth signal

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Datasheet DS70005472A-page 19

5 MicrocontrollerA single-cycle 8-bit microcontroller is built into the SoC to execute the Bluetooth protocols It operates from 16 MHzto higher frequencies where the firmware dynamically adjusts the trade-off between the computing power and thepower consumption In the ROM version the MCU firmware is hard-wired to minimize power consumption for thefirmware execution and to save the external Flash cost

51 MemoryThere are sufficient ROM and RAM to fulfill the processor requirements in which a synchronous single port RAMinterface is used The register bank dedicated single port memory and Flash memory are connected to theprocessor bus The processor coordinates with all link control procedures and the data movement happens using aset of pointer registers

52 External ResetThe IS20xxS SoC provides a Watchdog Timer (WDT) to reset the SoC It has an integrated Power-on Reset (POR)circuit that resets all circuits to a known Power-on state This action is also driven by an external Reset signal whichis used to control the device externally by forcing it into a POR state The RST_N signal input is active-low and noconnection is required in most of the applications

53 Reference ClockThe IS20xxS SoC is composed of an integrated crystal oscillation function that uses a 16 MHz external crystal andtwo specified loading capacitors to provide a high quality system reference timer source Use this feature to removethe initial tolerance frequency errors which are associated with the crystal and its equivalent loading capacitance inthe mass production Achieve the frequency trim by adjusting the crystal loading capacitance through the on-chip trimcapacitors (Ctrim)

The value of the trimming capacitance is 200 fF (200x10-15 F) per LSB at the 5-bit word and the overall adjustableclock frequency is plusmn40 kHz The following figure illustrates the crystal connection of the IS20xxS SoC with twocapacitors

Figure 5-1 Crystal Connection

IS20XXS

XO_N

CL1

XO_P

CL2

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Datasheet DS70005472A-page 20

Notes 1 Ctrim = 200 fF (1 to 31) Cint = 3 pF2 CL = [(CL1 x CL2) (CL1 + CL2)] + (Ctrim 2) + Cint (set trim value as 16 Ctrim = 32 pF)3 For a 16 MHz crystal where CL = 9 pF the CL1 = CL2 = 91 pF)4 For the CL selection refer to the data sheet of the crystal

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Datasheet DS70005472A-page 21

6 Power Management Unit (PMU)The IS20xxS SoC has an integrated PMU The main features of the PMU are a lithium-ion battery charger and avoltage regulator A power switch is used to switch over the power source between a battery and an adapter Alsothe PMU provides current to the LED drivers

61 Charging a BatteryThe IS20xxS SoC has a built-in battery charger which is optimized for lithium-polymer batteries The battery chargerincludes a current sensor for a charging control user programmable current regulator and high accuracy voltageregulator

The charging current parameters are configured by using the UI (IS20XXS_UI) tool Whenever the adapter isplugged-in the charging circuit will be activated Reviving pre-charging constant current mode constant voltagemode and re-charging functions are implemented The maximum charging current is 350 mA The following figureillustrates the charging curve of a battery

Figure 6-1 Battery Charging Curve

62 Voltage MonitoringA 10-bit successive approximation register ADC (SAR ADC) provides a dedicated channel for battery voltage leveldetection The warning level is programmed by using the UI tool The ADC provides a granular resolution to enablethe MCU to take control over the charging process

63 Low Dropout RegulatorA built-in LDO Regulator is used to convert the battery or adapter power for the power supply It also integratesthe hardware architecture to control the power-onoff procedure The built-in programmable LDOs provide power forcodec and digital IO pads Also it is used to buffer the high input voltage from the battery or adapter This LDOrequires a 1 μF bypass capacitor

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Datasheet DS70005472A-page 22

64 Switching RegulatorThe built-in programmable output voltage regulator converts the battery voltage to RF and base band core powersupply This converter has a high conversion efficiency and a fast transient response

65 LED DriverThe IS20xxS SoC consists of two LED drivers to control the LEDs The LED drivers provide enough sink current(16-step control and 035 mA for each step) and the LED is connected directly to the IS20xxS SoC

Note  Configure the LED settings using the IS20XXS_UI tool

The following figure illustrates the LED driver in the IS20xxS SoC

Figure 6-2 LED DRIVER

IS20xxS

LED2

SYS_PWR

LED1

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Datasheet DS70005472A-page 23

7 Application InformationThis section describes the power supply connection host MCU UART interface and various modes in detail

71 Power SupplyThe following figure illustrates the connection from the BAT_IN pin to various other voltage supply pins of theIS20xxS SoC

The BAT_IN input pin powers the IS20xxS SoC To charge the battery connect the external 5V power adapter toADAP_IN

Figure 7-1 Power Tree Diagram

VDDA VDDAO

VDD_IO

3V LDO

18V Buck

SAR_VDD

LDO31_VIN

CODEC_VO

LDO31_VO

BK_VDD

BK_LX

BK_O

VDD_CORE

VCC_RF

12V LDOPMIC_IN

CLDO_O

RFLDO_O

PVDD_CDA

Li-Io

n BA

T BAT_IN

ADAP_IN

SYS_PWRPower Switch

5V Adapter

(42~30V)

(45~55V)(42~30V)

(30~27V)

(33 ~27V)

(18V)

(12V)

(128V)

72 Host MCU InterfaceAn external MCU controls the IS20xxS SoC using the UART command set The following figure illustrates the UARTinterface between the IS20xxS SoC and an external MCU

Figure 7-2 Host MCU Interface Over UART

IS20xxSHCI_TXD

HCI_RXD

PWR

P0_0

MCUUART_TX

UART_RX

MCU_WAKEUP

BT_WAKEUP

UART Interface

UART Interface

The MCU controls the IS20xxS SoC over the UART interface and wakes up the SoC using the PWR pin The MCUfunction wakes up by connecting to the P0_0 pin of the IS20xxS

Refer to the IS200xIS201xIS202x UART Command SOP document for a list of functions that the IS20xxS SoCsupports and how to use the IS20XXS_UI tool to set up the system using the UART command

Note  The IS200xIS201xIS202x UART Command SOP document is available for download from the Microchipwebsite at IS200xIS201xIS202x UART Command SOP

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Datasheet DS70005472A-page 24

73 Timing Sequence of UART ApplicationThe following figures illustrate the various UART control signal timing sequences

Figure 7-3 Power-OnOff Sequence

BAT_IN

SYS_PWR

1 ms

Power- oninitial idle Power-on Power-on Power-off idle

MCU state

MFB (PWR)

BK_OLDO31_VO

400 ms

RST_N

MCU sends UART command (UART_RX)

UART Command

MCU sends power-off UART Command

Power-on ACK ACK ACKIS20xxS response UART state

(UART_TX)

Set ldquoPower-on Directlyrdquo boot

any

10 ms

20 msKeep all IS20xxSand MCU connection to low level

2s

(See Figure 7-4) (See Figure 7-5)

IS20xxS disconnect and auto power-off

gt 1s

Figure 7-4 Timing Sequence of RX Indication after Power-On

Resume 32 kHz mode

MFB (PWR)MCU sends UART command

MFB pulse must be longer than the UART command slot time

150 ms

2 ms 2 ms

Enter 32 kHz mode

1 ms

UART Command

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 25

Figure 7-5 Timing Sequence of Power-Off

BAT_IN +4V

MFB

MCU Sends RST_N

BK_OUT

LDO31_VO

UART Bus

2s 1s

IS20xxS Sends Power-off ACK

Notes 1 EEPROM clock = 100 kHz2 For a byte wire 001 ms x 32 clock x 2 = 640 μs3 It is recommended that ramp-down time be more than 640 μs during the power-off sequence to ensure safe

operation of the device

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 26

Figu

re 7

-6 

Tim

ing

Sequ

ence

of P

ower

-On

(NA

CK

)

BAT

_IN

SYS_

PWR

1 m

s Pow

er-

onin

itial

idle

Pow

er-o

nM

CU

sta

te

MFB

(PW

R)

BK_O

LD

O31

_VO

400

ms

RST

_N

MC

U s

ends

UAR

T co

mm

and

(UAR

T_R

X)

UAR

T C

omm

and

NAC

KPo

wer

-on

ACK

ACK

IS20

xxS

resp

onse

UAR

T st

ate

(UAR

T_TX

)

Set ldquo

Pow

er-o

n D

irect

lyrdquo b

oot

10 m

s

20 m

s

Ret

ry i

f AC

K is

not

rece

ived

200

ms

any

Wai

t

Max

imum

5 ti

mes

(1s)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 27

Figure 7-7 Reset Timing Sequence in Case of No Response from SoC to Host MCU

MFB (PWR)

MCU sends UART command UART

Command

UART Command

IS20xxS UART

If no response

RST_N

1ms

X ms1ms

1ms

1ms

Note  The MCU sends the UART command again when the SoC is not responding to its first UART command Ifthe SoC is not responding to the second UART command within X ms the MCU forces the system to reset

Figure 7-8 Timing Sequence of Power Drop Protection

BAT_IN +4V

RST_N from Reset IC

Power

SYS_PWR

IS20xxS

Reset OUT VDDGND

MCU Reset

Reset IC

29V

1 It is recommended that the battery be connected on a BAT_IN pin of the SoC for the power supply2 If an external power source or a power adapter is used to provide the power to the SoC (ADAP_IN) use a

voltage supervisor IC3 The RESET IC output pin must be open drain with delay time of le 10 ms and the recommended part is

TCM809SVNB713

74 General Purpose IO pinsThe following table provides the details of various functions that are mapped to the IO pins of the IS20xxS SoCand these IOs are configured by using the IS20XXS_UI tool The first button (Button 0) must be configured as thepower-onoff key and can be set using the PWR pin The remaining pins are configured for any one of the defaultfunctions (short press long press double press and combinations)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 28

Table 7-1 IO Pin Configuration

Sl No Pin Name Buttons Default Functions(1)

1 PowerMFB Button 0 PWR

2 P0_2 Button 1 PlayPause

3 P2_7 Button 2 Volume Up

4 P0_5 Button 3 Volume Down

5 P0_1 Button 4 FWD

6 P0_3 Button 5 REV

Note 1 These functions can be configured using the IS20XXS_UI tool

Few signals are generated to indicate or control outside devices The most popular applications are NFC for easypairing external audio amplifier for louder speaker and buzzer for indication

Table 7-2 IO Pins for Added Functions

Functions(1) IO Configurable Features

Slide switch P0_0P1_5

Buzzer P0_3

NFC detect P0_4P1_5

External amplifier enable P1_5

Note 1 These functions can be configured using the IS20XXS_UI tool

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 29

8 Antenna Placement RuleFor Bluetooth-enabled products the antenna placement affects the overall performance The antenna requires freespace to radiate RF signals and it must not be surrounded by the GND plane

The following figure illustrates a typical example of the good and poor antenna placement on the main applicationboard with the GND plane

Figure 8-1 Antenna Placement Examples

The following figure illustrates the keep-out area recommended for the PCB antenna

Figure 8-2 Keep-Out Area Recommended for PCB Antenna

Note  For additional information on the antenna placement refer to the antenna-specific data sheet from theantenna manufacturer

IS2008SIS2010SIS2013SIS2015SAntenna Placement Rule

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 30

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

102 Package Marking Information37103 Package Details 38

11 Reflow Profile and Storage Condition 43

111 Stencil of SMT Assembly Suggestion 43112 Reflow Profile 44113 Storage Condition44

12 Reference Circuit 46

13 Document Revision History59

The Microchip Website60

Product Change Notification Service60

Customer Support 60

Microchip Devices Code Protection Feature 60

Legal Notice 61

Trademarks 61

Quality Management System 62

Worldwide Sales and Service63

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 5

1 Quick References

11 Reference DocumentationFor further details refer to the following

bull IS20xxBM1xBM2x DSP Application Notebull IS200xIS201xIS202x UART Command SOP

12 Acronyms and AbbreviationTable 1-1 Acronyms and Abbreviations

Acronyms and Abbreviations Description

AAC_LC Advanced Audio Coding ndash Low Complexity

A2DP Advanced Audio Distribution Profile

ADC Analog-to-Digital Converter

AFH Adaptive Frequency Hopping

BDR Basic Data Rate

BOM Bill of Materials

BPF Band Pass Filter

CVSD Continuous Variable Slope Data

DAC Digital-to-Analog Converter

DSP Digital Signal Processor

EDR Enhanced Data Rate

GFSK Gaussian Frequency Shift Keying

IC Integrated Chip

LDO Low Dropout

LNA Low Noise Amplifier

NFC Near-field Communication

PA Power Amplifier

PLC Packet Loss Concealment

PMU Power Management Unit

POR Power-on Reset

RF Radio Frequency

RSSI Received Signal Strength Indicator

SBC Sub-band Coding

SCMS-T Supports Serial Copy Management System

SNR Signal-to-Noise Ratio

IS2008SIS2010SIS2013SIS2015SQuick References

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 6

continuedAcronyms and Abbreviations Description

UART Universal Asynchronous Receiver Transmitter

VCO Voltage-Controlled Oscillator

WDT Watchdog Timer

IS2008SIS2010SIS2013SIS2015SQuick References

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 7

2 Device OverviewThe IS20xxS SoC integrates

bull Bluetooth 41 radio transceiverbull Power Management Unit (PMU)bull Digital Signal Processor (DSP)bull 1-channel Class-D Amplifier (CDA)

The following figure illustrates the block diagram of the IS20xxS SoC

Figure 2-1 Block Diagram of IS20xxS

8051

16 KB patch RAM

448 KB ROM

44 KB RAM

24-bit DSP Core

MCU

158 KB ROM

88 KB RAM

DSP

IS20xx

Classic RF

MACMODEM

Bluetooth + EDRTransceiver

RF Controller

Antenna

16 MHz Crystal

EEPROM

Power Switch

LED

BAT Charger

18 V BUCK

30 V LDO2

LED Driver2

PMULi-IonBAT

2-Channel DAC

Digital Core

2-Channel ADC

Audio Codec

(For IS20082010 only)

Speaker2W

Stereo Class-D AMP

MIC1

MIC2

Speaker

AUX_IN(analog signal) I2C

GPIOs or HWIO Port 0~3

21 Key FeaturesThe following table provides the key features of the IS20xxS family

Table 2-1 Key Features

Feature IS2008S IS2010S IS2013S IS2015S

Application Headset Headset Speaker Speaker

IS2008SIS2010SIS2013SIS2015SDevice Overview

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Datasheet DS70005472A-page 8

continuedFeature IS2008S IS2010S IS2013S IS2015S

StereoMono Mono Mono Mono Mono

Package QFN QFN QFN QFN

Pin count 48 48 56 56

Dimensions (mm) 6x6 6x6 7x7 7x7

Audio DAC output 1-channel 1-channel 1-channel 1-channel

DAC (single-ended) SNR at28V (dB) -98 -98 -98 -98

DAC (capless) SNR at 28V(dB) -96 -96 -96 -96

ADC SNR at 28V (dB) -90 -90 -90 -90

I2S digital output No No No No

Analog Auxiliary-Input No No Yes Yes

Mono microphone 2 2 1 1

External audio amplifierinterface No No Yes Yes

Built-in CDA No No 1-channel 1-channel

UART Yes Yes Yes Yes

LED driver 2 2 2 2

Integrated DC-DC step-down regulator Yes Yes Yes Yes

DC 5V adapter input Yes Yes Yes Yes

Battery charger (350 mAmaximum) Yes Yes Yes Yes

GPIO 6 6 9 9

Button Support 6 6 6 6

NFC Yes Yes Yes Yes

Voice prompt Yes Yes Yes Yes

Multi-tone Yes Yes Yes Yes

DSP sound effect No No Yes Yes

Bluetooth Profiles

A2DP 12 12 12 12

AVRCP 15 15 15 15

HFP 16 16 16 16

HSP 11 11 11 11

PBAP 10 10 10 10

SPP No 10 No 10

IS2008SIS2010SIS2013SIS2015SDevice Overview

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Datasheet DS70005472A-page 9

22 Pin DetailsThe following figure illustrates the pin diagram of the IS2008S and IS2010S

Figure 2-2 IS2008S and IS2010S Pin Diagram

The following table provides the pin description of the IS2008S and IS2010S

Table 2-2 Pin Description

IS2008S andIS2010S Pin No Pin Type(1) Pin Name Description

1 P VCOM Internal biasing voltage for codec

2 I MICN2 Mic2 mono differential analog negative input

3 I MICP2 Mic2 mono differential analog positive input

4 I MICN1 Mic1 mono differential analog negative input

5 I MICP1 Mic1 mono differential analog positive input

6 P MICBIAS Electric microphone biasing voltage

7 P VDD_CORE Core 12V power input connect to CLDO_O pin

8 O P1_2 IO pin default pull-high input EEPROM clock SCL

IS2008SIS2010SIS2013SIS2015SDevice Overview

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Datasheet DS70005472A-page 10

continuedIS2008S and

IS2010S Pin No Pin Type(1) Pin Name Description

9 IO P1_3 IO pin default pull-high input EEPROM data SDA

10 I RST_N System Reset pin active when rising edge

11 P VDD_IO IO power supply input (27-33V) connect to LDO31_VOpin

12 IO P0_1

IO pin default pull-high input(2)

bull FWD key when class 2 RF (default) active-lowbull Class 1 TX control signal of external RF TR switch

active high

13 IO P1_5

IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0bull Slide switch detector active-lowbull Buzzer signal output

14 I HCI_RXD HCI UART data input

15 O HCI_TXD HCI UART data output

16 P CODEC_VO 31V LDO output for codec power

17 P LDO31_VIN 31V LDO input connect to SYS_PWR pin

18 P LDO31_VO 31V LDO output

19 P ADAP_IN 5V power adapter input

20 P BAT_IN 33-42V Li-ion battery input

21 - NC No Connection

22 P SAR_VDD SAR 18V input connect to BK_O pin

23 P SYS_PWR Power output which comes from BAT_IN or ADAP_IN

24 P BK_VDD 18V buck VDD Power Input connect to SYS_PWR pin

25 P BK_LX 18V buck pin for switch

26 P BK_O 18V buck feedback input

27 I PWR Multi function push button and power-on key

28 I LED2 LED Driver 2

29 I LED1 LED Driver 1

30 IO P0_3

IO pin default pull-high input(2)

bull REV key (default) active-lowbull Buzzer signal outputbull Out_Ind_1bull Class 1 RX control signal of external RF TR switch

active high

31 P CLDO_O 12V core LDO output

32 P PMIC_IN PMU blocks power input connect to BK_O pin

IS2008SIS2010SIS2013SIS2015SDevice Overview

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Datasheet DS70005472A-page 11

continuedIS2008S and

IS2010S Pin No Pin Type(1) Pin Name Description

33 P RFLDO_O 128V RF LDO output

34 P VBG Bandgap output reference for decoupling interference

35 P ULPC_VSUS ULPC 12V output power

36 I XO_N 16 MHz crystal input negative

37 I XO_P 16 MHz crystal input positive

38 P VCC_RF RF power input (128V) for both synthesizer and TXRXblock connect to RFLDO_O pin

39 IO RTX RF path (transmitreceive)

40 I P0_2IO pin default pull-high input(2)

PlayPause key (default) active-low

41 I P2_0IO pin default pull-high input system configuration

H Application L Baseband (IBDK mode)

42 I P2_7IO pin default pull high input(2)

Volume up key (default) active-low

43 I P0_5IO pin default pull high input(2)

Volume down (default) active-low

44 P VDD_IO IO power supply input (27-33V) connect to LDO31_VOpin

45 P VDD_AOPositive power supply dedicated to codec outputamplifiers connect to CODEC_VO pin

46 O AOHPM Headphone common mode outputsense input

47 O AOHPL Left channel analog headphone output

48 P VDDA Positive power supplyreference voltage for codecconnect to CODEC_VO pin

49 P EP Exposed pads used as ground (GND) pins

Notes 1 The conventions used in the table are indicated as follows

ndash I = Input pinndash O = Output pinndash IO = InputOutput pinndash P = Power pin

2 All IO pins are configured using the IS20XXS_UI tool a Windowsreg-based utility

The following figure illustrates the pin diagram of the IS2013S and IS2015S

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 12

Figure 2-3 IS2013S and IS2015S Pin Diagram

The following table provides the pin description of the IS2013SIS2015S

Table 2-3 Pin Description

IS2013S andIS2015S Pin No Pin Type(1) Pin Name Description

1 P VDDAO Positive power supply dedicated to codec output amplifiersConnect to CODEC_VO pin

2 O AOHPM Headphone common mode outputsense input

3 O AOHPL Left channel analog headphone output

4 P VDDA Positive power supplyreference voltage for codec connect toCODEC_VO pin

5 P VCOM Internal biasing voltage for codec

6 I MICN1 Mic1 mono differential analog negative input

7 I MICP1 Mic1 mono differential analog positive input

8 P MICBIAS Electric microphone biasing voltage

9 I AIL Left channel single-ended analog inputs

IS2008SIS2010SIS2013SIS2015SDevice Overview

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Datasheet DS70005472A-page 13

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

10 P VDD_CORE Core 12V power input connect to CLDO_O pin

11 O P1_2 IO pin default pull high input EEPROM clock SCL

12 IO P1_3 IO pin default pull high input EEPROM data SDA

13 I RST_N System Reset pin active when rising edge

14 P VDD_IO IO power supply input (27-33V) connect to LDO31_VO pin

15 IO P0_1

IO pin default pull-high input(2)

bull FWD key when class 2 RF (default) active-lowbull Class 1 TX Control signal of external RF TR switch

active high

16 I P2_4IO pin default pull high input system configuration

L Boot mode with P2_0 low combination

17 IO P0_4IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0

18 IO P1_5

IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0bull Slide switch detector active-lowbull Buzzer signal output

19 I HCI_RXD HCI UART input data

20 O HCI_TXD HCI UART output data

21 P CODEC_VO 31V LDO output for codec power

22 P LDO31_VIN 31V LDO input connect to SYS_PWR pin

23 P LDO31_VO 31V LDO output

24 P ADAP_IN 5V power adapter input

25 P BAT_IN 33 to 42V Li-ion battery input

26 P SAR_VDD SAR 18V input connect to BK_O pin

27 P SYS_PWR Power output which come from BAT_IN or ADAP_IN

28 P LDO18_VDD 18V LDO VDD Power Input connect to SYS_PWR pin

29 P LDO18_O 18V LDO output

30 I PWR Multi-Function Push button and power on key

31 - NC No Connection

32 I LED2 LED Driver 2

33 I LED1 LED Driver 1

IS2008SIS2010SIS2013SIS2015SDevice Overview

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Datasheet DS70005472A-page 14

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

34 IO P0_0IO pin default pull-high input(2)

bull Slide switch detector active-lowbull UARTTX_IND active-low

35 IO P0_3

IO pin default pull-high input(2)

bull REV key (default) active-lowbull Buzzer signal outputbull Out_Ind_1bull Class 1 RX control signal of external RF TR switch

active high

36 I EANEmbedded ROMExternal Flash enable

H Embedded L External Flash

37 P CLDO_O 12V core LDO output

38 P PMIC_IN PMU blocks power input connect to BK_O pin

39 P RFLDO_O 128V RF LDO output

40 P VBG Bandgap output reference for decoupling interference

41 P ULPC_VSUS ULPC 12V output power

42 I XO_N 16 MHz crystal input negative

43 I XO_P 16 MHz crystal input positive

44 P VCC_RFRF power input (128V) for both synthesizer and TXRXblock connect to RFLDO_O pin

45 IO RTX RF path (transmitreceive)

46 I P0_2IO pin default pull-high input(2)

PlayPause key (default) active-low

47 I P2_0IO pin default pull-high input system configuration

H Application L Baseband (IBDK mode)

48 I P2_7IO pin default pull-high input(2)

Volume up key (default) active-low

49 I P3_0IO pin default pull-high input(2)

Line-in detector (default) active-low

50 I P0_5IO pin default pull-high input(2)

Volume down (default) active-low

51 P VDD_IO IO power supply input (27-33V) connect to LDO31_VO pin

52 P AVDD_CDA Supply voltage of audio amplifier

53 P VBP_CDA Reference voltage output

54 O HPON_CDA Negative BTL output of channel-1

55 O HPOP_CDA Positive BTL output of channel-1

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Datasheet DS70005472A-page 15

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

56 P PVDD_CDA Supply voltage of power stage ch-1

57 P EP Exposed pads used as ground (GND) pins

Notes 1 The conventions used in the table are indicated as follows

ndash I = Input pinndash O = Output pinndash IO = InputOutput pinndash P = Power pin

2 All IO pins are configured using the UI tool a Windows-based utility

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Datasheet DS70005472A-page 16

3 AudioThe input and output audio signals have different stages and each stage is programmed to vary the gain responsecharacteristics For microphones both single-ended inputs and differential inputs are supported To maintain ahigh-quality signal provide a stable bias voltage source to the condenser microphonersquos FET Use the DC-blockingcapacitors at both positive and negative sides of the input Internally this analog signal is converted to 16-bit 8 kHzlinear PCM data

31 Digital Signal ProcessorA Digital Signal Processor (DSP) is used to perform speech and audio processing The advanced speech featuressuch as acoustic echo cancellation and noise reduction are built in To reduce nonlinear distortion and to help echocancellation an outgoing signal level to the speaker is monitored and adjusted to avoid saturation of the speakeroutput or microphone input Adaptive filtering is also applied to track the echo path impulse in response to provide anecho-free and full-duplex user experience

The embedded noise reduction algorithm helps to extract clean speech signals from the noisy inputs capturedby microphones and improves mutual understanding in communication The advanced audio features such asmulti-band dynamic range control parametric multi-band equalizer audio widening and virtual bass are built in Theaudio effect algorithms improve the userrsquos audio listening experience in terms of better quality audio after audiosignal processing

The following figures illustrate the processing flow of speakerphone applications for speech and audio signalprocessing

Figure 3-1 Speech Processing

Figure 3-2 Audio Processing

The DSP parameters such as EQ Speaker Gain Mic Gain Sound Effect and more are configured using the DSPtool For additional information on the DSP tool refer to the IS20xxBM1xBM2x DSP Application Note

IS2008SIS2010SIS2013SIS2015SAudio

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Datasheet DS70005472A-page 17

Note  The DSP tool and IS20xxBM1xBM2x DSP Application Note are available for download at the Microchipwebsite

32 CodecThe built-in codec has a high SNR performance and it consists of an ADC a DAC and additional analog circuitry

33 Auxiliary PortThe SoC supports one analog (line-in) signal from the external audio source The analog signal is processed bythe DSP to generate different sound effects (multi-band dynamic range compression and audio widening) which areconfigured using the DSP tool

34 Class D Audio AmplifierThe Class D amplifier has a significant advantage in many applications due to its lower power dissipation whichproduces less heat The IS2013S and IS2015S SoC have a built-in Class D amplifier that reduces circuit board spaceand system cost The efficiency of the amplifier extends the battery life in portable systems

The Class D amplifier is implemented by using a full-bridge output stage A full bridge uses two half-bridge stages todrive the load differentially The Class D amplifier provides a good SNR and enough drive capability for a 4Ω speakerdriver

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Datasheet DS70005472A-page 18

4 TransceiverThe SoC is designed and optimized for Bluetooth 24 GHz systems It contains a complete radio frequencytransmitterreceiver section An internal synthesizer generates a stable clock to synchronize with another device

41 TransmitterThe internal Power Amplifier (PA) has a maximum output power of +4 dBm with 20 dB power level control Applythis to Class 2 or Class 3 radios without an external RF PA The transmitter directly performs the IQ conversionto minimize the frequency drift and it can access the 20 dB power range with the temperature compensationmechanism

42 ReceiverThe Low-Noise Amplifier (LNA) operates with TR-combined mode for the single port application It saves the pin onthe package without having an external TXRX switch

The ADC is used to sample the input analog signal and convert it into a digital signal for demodulator analysisA channel filter is integrated into a receiver channel before the ADC to reduce the external component count andincrease the anti-interference capability

The image rejection filter is used to reject the image frequency for the low-IF architecture and it is also intended toreduce the external Band Pass Filter (BPF) component for a super heterodyne architecture

The Received Signal Strength Indicator (RSSI) signal feedback to the processor is used to control the RF outputpower to make a good trade-off for effective distance and current consumption

43 SynthesizerA synthesizer generates a clock for radio transceiver operation The VCO inside with a tunable internal LC tankcan reduce any variation for components A crystal oscillator with an internal digital trimming circuit provides a stableclock for the synthesizer

44 ModemFor Bluetooth 12 specifications and below 1 Mbps is the standard data rate based on the Gaussian Frequency ShiftKeying (GFSK) modulation scheme This basic rate modem meets BDR requirements of Bluetooth 20 with EDRspecifications

For Bluetooth 20 and above specifications EDR is introduced to provide the data rates of 123 Mbps Thisenhanced data rate modem meets EDR requirements of Bluetooth 20 with EDR specifications For the basebandboth BDR and EDR utilize the same 1 MHz symbol rate and 16 kHz slot rate For BDR 1 symbol represents 1-bitHowever each symbol in the payload part of the EDR packets represents 2-bit or 3-bit This is achieved by using twodifferent modulations π4 DQPSK and 8 DPSK

45 Adaptive Frequency Hopping (AFH)The SoC has an AFH function to avoid RF interference It has an algorithm to check the nearby interference and tochoose the clear channel for the transceiver Bluetooth signal

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Datasheet DS70005472A-page 19

5 MicrocontrollerA single-cycle 8-bit microcontroller is built into the SoC to execute the Bluetooth protocols It operates from 16 MHzto higher frequencies where the firmware dynamically adjusts the trade-off between the computing power and thepower consumption In the ROM version the MCU firmware is hard-wired to minimize power consumption for thefirmware execution and to save the external Flash cost

51 MemoryThere are sufficient ROM and RAM to fulfill the processor requirements in which a synchronous single port RAMinterface is used The register bank dedicated single port memory and Flash memory are connected to theprocessor bus The processor coordinates with all link control procedures and the data movement happens using aset of pointer registers

52 External ResetThe IS20xxS SoC provides a Watchdog Timer (WDT) to reset the SoC It has an integrated Power-on Reset (POR)circuit that resets all circuits to a known Power-on state This action is also driven by an external Reset signal whichis used to control the device externally by forcing it into a POR state The RST_N signal input is active-low and noconnection is required in most of the applications

53 Reference ClockThe IS20xxS SoC is composed of an integrated crystal oscillation function that uses a 16 MHz external crystal andtwo specified loading capacitors to provide a high quality system reference timer source Use this feature to removethe initial tolerance frequency errors which are associated with the crystal and its equivalent loading capacitance inthe mass production Achieve the frequency trim by adjusting the crystal loading capacitance through the on-chip trimcapacitors (Ctrim)

The value of the trimming capacitance is 200 fF (200x10-15 F) per LSB at the 5-bit word and the overall adjustableclock frequency is plusmn40 kHz The following figure illustrates the crystal connection of the IS20xxS SoC with twocapacitors

Figure 5-1 Crystal Connection

IS20XXS

XO_N

CL1

XO_P

CL2

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Datasheet DS70005472A-page 20

Notes 1 Ctrim = 200 fF (1 to 31) Cint = 3 pF2 CL = [(CL1 x CL2) (CL1 + CL2)] + (Ctrim 2) + Cint (set trim value as 16 Ctrim = 32 pF)3 For a 16 MHz crystal where CL = 9 pF the CL1 = CL2 = 91 pF)4 For the CL selection refer to the data sheet of the crystal

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Datasheet DS70005472A-page 21

6 Power Management Unit (PMU)The IS20xxS SoC has an integrated PMU The main features of the PMU are a lithium-ion battery charger and avoltage regulator A power switch is used to switch over the power source between a battery and an adapter Alsothe PMU provides current to the LED drivers

61 Charging a BatteryThe IS20xxS SoC has a built-in battery charger which is optimized for lithium-polymer batteries The battery chargerincludes a current sensor for a charging control user programmable current regulator and high accuracy voltageregulator

The charging current parameters are configured by using the UI (IS20XXS_UI) tool Whenever the adapter isplugged-in the charging circuit will be activated Reviving pre-charging constant current mode constant voltagemode and re-charging functions are implemented The maximum charging current is 350 mA The following figureillustrates the charging curve of a battery

Figure 6-1 Battery Charging Curve

62 Voltage MonitoringA 10-bit successive approximation register ADC (SAR ADC) provides a dedicated channel for battery voltage leveldetection The warning level is programmed by using the UI tool The ADC provides a granular resolution to enablethe MCU to take control over the charging process

63 Low Dropout RegulatorA built-in LDO Regulator is used to convert the battery or adapter power for the power supply It also integratesthe hardware architecture to control the power-onoff procedure The built-in programmable LDOs provide power forcodec and digital IO pads Also it is used to buffer the high input voltage from the battery or adapter This LDOrequires a 1 μF bypass capacitor

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

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Datasheet DS70005472A-page 22

64 Switching RegulatorThe built-in programmable output voltage regulator converts the battery voltage to RF and base band core powersupply This converter has a high conversion efficiency and a fast transient response

65 LED DriverThe IS20xxS SoC consists of two LED drivers to control the LEDs The LED drivers provide enough sink current(16-step control and 035 mA for each step) and the LED is connected directly to the IS20xxS SoC

Note  Configure the LED settings using the IS20XXS_UI tool

The following figure illustrates the LED driver in the IS20xxS SoC

Figure 6-2 LED DRIVER

IS20xxS

LED2

SYS_PWR

LED1

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 23

7 Application InformationThis section describes the power supply connection host MCU UART interface and various modes in detail

71 Power SupplyThe following figure illustrates the connection from the BAT_IN pin to various other voltage supply pins of theIS20xxS SoC

The BAT_IN input pin powers the IS20xxS SoC To charge the battery connect the external 5V power adapter toADAP_IN

Figure 7-1 Power Tree Diagram

VDDA VDDAO

VDD_IO

3V LDO

18V Buck

SAR_VDD

LDO31_VIN

CODEC_VO

LDO31_VO

BK_VDD

BK_LX

BK_O

VDD_CORE

VCC_RF

12V LDOPMIC_IN

CLDO_O

RFLDO_O

PVDD_CDA

Li-Io

n BA

T BAT_IN

ADAP_IN

SYS_PWRPower Switch

5V Adapter

(42~30V)

(45~55V)(42~30V)

(30~27V)

(33 ~27V)

(18V)

(12V)

(128V)

72 Host MCU InterfaceAn external MCU controls the IS20xxS SoC using the UART command set The following figure illustrates the UARTinterface between the IS20xxS SoC and an external MCU

Figure 7-2 Host MCU Interface Over UART

IS20xxSHCI_TXD

HCI_RXD

PWR

P0_0

MCUUART_TX

UART_RX

MCU_WAKEUP

BT_WAKEUP

UART Interface

UART Interface

The MCU controls the IS20xxS SoC over the UART interface and wakes up the SoC using the PWR pin The MCUfunction wakes up by connecting to the P0_0 pin of the IS20xxS

Refer to the IS200xIS201xIS202x UART Command SOP document for a list of functions that the IS20xxS SoCsupports and how to use the IS20XXS_UI tool to set up the system using the UART command

Note  The IS200xIS201xIS202x UART Command SOP document is available for download from the Microchipwebsite at IS200xIS201xIS202x UART Command SOP

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copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 24

73 Timing Sequence of UART ApplicationThe following figures illustrate the various UART control signal timing sequences

Figure 7-3 Power-OnOff Sequence

BAT_IN

SYS_PWR

1 ms

Power- oninitial idle Power-on Power-on Power-off idle

MCU state

MFB (PWR)

BK_OLDO31_VO

400 ms

RST_N

MCU sends UART command (UART_RX)

UART Command

MCU sends power-off UART Command

Power-on ACK ACK ACKIS20xxS response UART state

(UART_TX)

Set ldquoPower-on Directlyrdquo boot

any

10 ms

20 msKeep all IS20xxSand MCU connection to low level

2s

(See Figure 7-4) (See Figure 7-5)

IS20xxS disconnect and auto power-off

gt 1s

Figure 7-4 Timing Sequence of RX Indication after Power-On

Resume 32 kHz mode

MFB (PWR)MCU sends UART command

MFB pulse must be longer than the UART command slot time

150 ms

2 ms 2 ms

Enter 32 kHz mode

1 ms

UART Command

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 25

Figure 7-5 Timing Sequence of Power-Off

BAT_IN +4V

MFB

MCU Sends RST_N

BK_OUT

LDO31_VO

UART Bus

2s 1s

IS20xxS Sends Power-off ACK

Notes 1 EEPROM clock = 100 kHz2 For a byte wire 001 ms x 32 clock x 2 = 640 μs3 It is recommended that ramp-down time be more than 640 μs during the power-off sequence to ensure safe

operation of the device

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 26

Figu

re 7

-6 

Tim

ing

Sequ

ence

of P

ower

-On

(NA

CK

)

BAT

_IN

SYS_

PWR

1 m

s Pow

er-

onin

itial

idle

Pow

er-o

nM

CU

sta

te

MFB

(PW

R)

BK_O

LD

O31

_VO

400

ms

RST

_N

MC

U s

ends

UAR

T co

mm

and

(UAR

T_R

X)

UAR

T C

omm

and

NAC

KPo

wer

-on

ACK

ACK

IS20

xxS

resp

onse

UAR

T st

ate

(UAR

T_TX

)

Set ldquo

Pow

er-o

n D

irect

lyrdquo b

oot

10 m

s

20 m

s

Ret

ry i

f AC

K is

not

rece

ived

200

ms

any

Wai

t

Max

imum

5 ti

mes

(1s)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 27

Figure 7-7 Reset Timing Sequence in Case of No Response from SoC to Host MCU

MFB (PWR)

MCU sends UART command UART

Command

UART Command

IS20xxS UART

If no response

RST_N

1ms

X ms1ms

1ms

1ms

Note  The MCU sends the UART command again when the SoC is not responding to its first UART command Ifthe SoC is not responding to the second UART command within X ms the MCU forces the system to reset

Figure 7-8 Timing Sequence of Power Drop Protection

BAT_IN +4V

RST_N from Reset IC

Power

SYS_PWR

IS20xxS

Reset OUT VDDGND

MCU Reset

Reset IC

29V

1 It is recommended that the battery be connected on a BAT_IN pin of the SoC for the power supply2 If an external power source or a power adapter is used to provide the power to the SoC (ADAP_IN) use a

voltage supervisor IC3 The RESET IC output pin must be open drain with delay time of le 10 ms and the recommended part is

TCM809SVNB713

74 General Purpose IO pinsThe following table provides the details of various functions that are mapped to the IO pins of the IS20xxS SoCand these IOs are configured by using the IS20XXS_UI tool The first button (Button 0) must be configured as thepower-onoff key and can be set using the PWR pin The remaining pins are configured for any one of the defaultfunctions (short press long press double press and combinations)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 28

Table 7-1 IO Pin Configuration

Sl No Pin Name Buttons Default Functions(1)

1 PowerMFB Button 0 PWR

2 P0_2 Button 1 PlayPause

3 P2_7 Button 2 Volume Up

4 P0_5 Button 3 Volume Down

5 P0_1 Button 4 FWD

6 P0_3 Button 5 REV

Note 1 These functions can be configured using the IS20XXS_UI tool

Few signals are generated to indicate or control outside devices The most popular applications are NFC for easypairing external audio amplifier for louder speaker and buzzer for indication

Table 7-2 IO Pins for Added Functions

Functions(1) IO Configurable Features

Slide switch P0_0P1_5

Buzzer P0_3

NFC detect P0_4P1_5

External amplifier enable P1_5

Note 1 These functions can be configured using the IS20XXS_UI tool

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 29

8 Antenna Placement RuleFor Bluetooth-enabled products the antenna placement affects the overall performance The antenna requires freespace to radiate RF signals and it must not be surrounded by the GND plane

The following figure illustrates a typical example of the good and poor antenna placement on the main applicationboard with the GND plane

Figure 8-1 Antenna Placement Examples

The following figure illustrates the keep-out area recommended for the PCB antenna

Figure 8-2 Keep-Out Area Recommended for PCB Antenna

Note  For additional information on the antenna placement refer to the antenna-specific data sheet from theantenna manufacturer

IS2008SIS2010SIS2013SIS2015SAntenna Placement Rule

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 30

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

1 Quick References

11 Reference DocumentationFor further details refer to the following

bull IS20xxBM1xBM2x DSP Application Notebull IS200xIS201xIS202x UART Command SOP

12 Acronyms and AbbreviationTable 1-1 Acronyms and Abbreviations

Acronyms and Abbreviations Description

AAC_LC Advanced Audio Coding ndash Low Complexity

A2DP Advanced Audio Distribution Profile

ADC Analog-to-Digital Converter

AFH Adaptive Frequency Hopping

BDR Basic Data Rate

BOM Bill of Materials

BPF Band Pass Filter

CVSD Continuous Variable Slope Data

DAC Digital-to-Analog Converter

DSP Digital Signal Processor

EDR Enhanced Data Rate

GFSK Gaussian Frequency Shift Keying

IC Integrated Chip

LDO Low Dropout

LNA Low Noise Amplifier

NFC Near-field Communication

PA Power Amplifier

PLC Packet Loss Concealment

PMU Power Management Unit

POR Power-on Reset

RF Radio Frequency

RSSI Received Signal Strength Indicator

SBC Sub-band Coding

SCMS-T Supports Serial Copy Management System

SNR Signal-to-Noise Ratio

IS2008SIS2010SIS2013SIS2015SQuick References

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 6

continuedAcronyms and Abbreviations Description

UART Universal Asynchronous Receiver Transmitter

VCO Voltage-Controlled Oscillator

WDT Watchdog Timer

IS2008SIS2010SIS2013SIS2015SQuick References

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 7

2 Device OverviewThe IS20xxS SoC integrates

bull Bluetooth 41 radio transceiverbull Power Management Unit (PMU)bull Digital Signal Processor (DSP)bull 1-channel Class-D Amplifier (CDA)

The following figure illustrates the block diagram of the IS20xxS SoC

Figure 2-1 Block Diagram of IS20xxS

8051

16 KB patch RAM

448 KB ROM

44 KB RAM

24-bit DSP Core

MCU

158 KB ROM

88 KB RAM

DSP

IS20xx

Classic RF

MACMODEM

Bluetooth + EDRTransceiver

RF Controller

Antenna

16 MHz Crystal

EEPROM

Power Switch

LED

BAT Charger

18 V BUCK

30 V LDO2

LED Driver2

PMULi-IonBAT

2-Channel DAC

Digital Core

2-Channel ADC

Audio Codec

(For IS20082010 only)

Speaker2W

Stereo Class-D AMP

MIC1

MIC2

Speaker

AUX_IN(analog signal) I2C

GPIOs or HWIO Port 0~3

21 Key FeaturesThe following table provides the key features of the IS20xxS family

Table 2-1 Key Features

Feature IS2008S IS2010S IS2013S IS2015S

Application Headset Headset Speaker Speaker

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 8

continuedFeature IS2008S IS2010S IS2013S IS2015S

StereoMono Mono Mono Mono Mono

Package QFN QFN QFN QFN

Pin count 48 48 56 56

Dimensions (mm) 6x6 6x6 7x7 7x7

Audio DAC output 1-channel 1-channel 1-channel 1-channel

DAC (single-ended) SNR at28V (dB) -98 -98 -98 -98

DAC (capless) SNR at 28V(dB) -96 -96 -96 -96

ADC SNR at 28V (dB) -90 -90 -90 -90

I2S digital output No No No No

Analog Auxiliary-Input No No Yes Yes

Mono microphone 2 2 1 1

External audio amplifierinterface No No Yes Yes

Built-in CDA No No 1-channel 1-channel

UART Yes Yes Yes Yes

LED driver 2 2 2 2

Integrated DC-DC step-down regulator Yes Yes Yes Yes

DC 5V adapter input Yes Yes Yes Yes

Battery charger (350 mAmaximum) Yes Yes Yes Yes

GPIO 6 6 9 9

Button Support 6 6 6 6

NFC Yes Yes Yes Yes

Voice prompt Yes Yes Yes Yes

Multi-tone Yes Yes Yes Yes

DSP sound effect No No Yes Yes

Bluetooth Profiles

A2DP 12 12 12 12

AVRCP 15 15 15 15

HFP 16 16 16 16

HSP 11 11 11 11

PBAP 10 10 10 10

SPP No 10 No 10

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 9

22 Pin DetailsThe following figure illustrates the pin diagram of the IS2008S and IS2010S

Figure 2-2 IS2008S and IS2010S Pin Diagram

The following table provides the pin description of the IS2008S and IS2010S

Table 2-2 Pin Description

IS2008S andIS2010S Pin No Pin Type(1) Pin Name Description

1 P VCOM Internal biasing voltage for codec

2 I MICN2 Mic2 mono differential analog negative input

3 I MICP2 Mic2 mono differential analog positive input

4 I MICN1 Mic1 mono differential analog negative input

5 I MICP1 Mic1 mono differential analog positive input

6 P MICBIAS Electric microphone biasing voltage

7 P VDD_CORE Core 12V power input connect to CLDO_O pin

8 O P1_2 IO pin default pull-high input EEPROM clock SCL

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 10

continuedIS2008S and

IS2010S Pin No Pin Type(1) Pin Name Description

9 IO P1_3 IO pin default pull-high input EEPROM data SDA

10 I RST_N System Reset pin active when rising edge

11 P VDD_IO IO power supply input (27-33V) connect to LDO31_VOpin

12 IO P0_1

IO pin default pull-high input(2)

bull FWD key when class 2 RF (default) active-lowbull Class 1 TX control signal of external RF TR switch

active high

13 IO P1_5

IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0bull Slide switch detector active-lowbull Buzzer signal output

14 I HCI_RXD HCI UART data input

15 O HCI_TXD HCI UART data output

16 P CODEC_VO 31V LDO output for codec power

17 P LDO31_VIN 31V LDO input connect to SYS_PWR pin

18 P LDO31_VO 31V LDO output

19 P ADAP_IN 5V power adapter input

20 P BAT_IN 33-42V Li-ion battery input

21 - NC No Connection

22 P SAR_VDD SAR 18V input connect to BK_O pin

23 P SYS_PWR Power output which comes from BAT_IN or ADAP_IN

24 P BK_VDD 18V buck VDD Power Input connect to SYS_PWR pin

25 P BK_LX 18V buck pin for switch

26 P BK_O 18V buck feedback input

27 I PWR Multi function push button and power-on key

28 I LED2 LED Driver 2

29 I LED1 LED Driver 1

30 IO P0_3

IO pin default pull-high input(2)

bull REV key (default) active-lowbull Buzzer signal outputbull Out_Ind_1bull Class 1 RX control signal of external RF TR switch

active high

31 P CLDO_O 12V core LDO output

32 P PMIC_IN PMU blocks power input connect to BK_O pin

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 11

continuedIS2008S and

IS2010S Pin No Pin Type(1) Pin Name Description

33 P RFLDO_O 128V RF LDO output

34 P VBG Bandgap output reference for decoupling interference

35 P ULPC_VSUS ULPC 12V output power

36 I XO_N 16 MHz crystal input negative

37 I XO_P 16 MHz crystal input positive

38 P VCC_RF RF power input (128V) for both synthesizer and TXRXblock connect to RFLDO_O pin

39 IO RTX RF path (transmitreceive)

40 I P0_2IO pin default pull-high input(2)

PlayPause key (default) active-low

41 I P2_0IO pin default pull-high input system configuration

H Application L Baseband (IBDK mode)

42 I P2_7IO pin default pull high input(2)

Volume up key (default) active-low

43 I P0_5IO pin default pull high input(2)

Volume down (default) active-low

44 P VDD_IO IO power supply input (27-33V) connect to LDO31_VOpin

45 P VDD_AOPositive power supply dedicated to codec outputamplifiers connect to CODEC_VO pin

46 O AOHPM Headphone common mode outputsense input

47 O AOHPL Left channel analog headphone output

48 P VDDA Positive power supplyreference voltage for codecconnect to CODEC_VO pin

49 P EP Exposed pads used as ground (GND) pins

Notes 1 The conventions used in the table are indicated as follows

ndash I = Input pinndash O = Output pinndash IO = InputOutput pinndash P = Power pin

2 All IO pins are configured using the IS20XXS_UI tool a Windowsreg-based utility

The following figure illustrates the pin diagram of the IS2013S and IS2015S

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 12

Figure 2-3 IS2013S and IS2015S Pin Diagram

The following table provides the pin description of the IS2013SIS2015S

Table 2-3 Pin Description

IS2013S andIS2015S Pin No Pin Type(1) Pin Name Description

1 P VDDAO Positive power supply dedicated to codec output amplifiersConnect to CODEC_VO pin

2 O AOHPM Headphone common mode outputsense input

3 O AOHPL Left channel analog headphone output

4 P VDDA Positive power supplyreference voltage for codec connect toCODEC_VO pin

5 P VCOM Internal biasing voltage for codec

6 I MICN1 Mic1 mono differential analog negative input

7 I MICP1 Mic1 mono differential analog positive input

8 P MICBIAS Electric microphone biasing voltage

9 I AIL Left channel single-ended analog inputs

IS2008SIS2010SIS2013SIS2015SDevice Overview

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Datasheet DS70005472A-page 13

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

10 P VDD_CORE Core 12V power input connect to CLDO_O pin

11 O P1_2 IO pin default pull high input EEPROM clock SCL

12 IO P1_3 IO pin default pull high input EEPROM data SDA

13 I RST_N System Reset pin active when rising edge

14 P VDD_IO IO power supply input (27-33V) connect to LDO31_VO pin

15 IO P0_1

IO pin default pull-high input(2)

bull FWD key when class 2 RF (default) active-lowbull Class 1 TX Control signal of external RF TR switch

active high

16 I P2_4IO pin default pull high input system configuration

L Boot mode with P2_0 low combination

17 IO P0_4IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0

18 IO P1_5

IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0bull Slide switch detector active-lowbull Buzzer signal output

19 I HCI_RXD HCI UART input data

20 O HCI_TXD HCI UART output data

21 P CODEC_VO 31V LDO output for codec power

22 P LDO31_VIN 31V LDO input connect to SYS_PWR pin

23 P LDO31_VO 31V LDO output

24 P ADAP_IN 5V power adapter input

25 P BAT_IN 33 to 42V Li-ion battery input

26 P SAR_VDD SAR 18V input connect to BK_O pin

27 P SYS_PWR Power output which come from BAT_IN or ADAP_IN

28 P LDO18_VDD 18V LDO VDD Power Input connect to SYS_PWR pin

29 P LDO18_O 18V LDO output

30 I PWR Multi-Function Push button and power on key

31 - NC No Connection

32 I LED2 LED Driver 2

33 I LED1 LED Driver 1

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Datasheet DS70005472A-page 14

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

34 IO P0_0IO pin default pull-high input(2)

bull Slide switch detector active-lowbull UARTTX_IND active-low

35 IO P0_3

IO pin default pull-high input(2)

bull REV key (default) active-lowbull Buzzer signal outputbull Out_Ind_1bull Class 1 RX control signal of external RF TR switch

active high

36 I EANEmbedded ROMExternal Flash enable

H Embedded L External Flash

37 P CLDO_O 12V core LDO output

38 P PMIC_IN PMU blocks power input connect to BK_O pin

39 P RFLDO_O 128V RF LDO output

40 P VBG Bandgap output reference for decoupling interference

41 P ULPC_VSUS ULPC 12V output power

42 I XO_N 16 MHz crystal input negative

43 I XO_P 16 MHz crystal input positive

44 P VCC_RFRF power input (128V) for both synthesizer and TXRXblock connect to RFLDO_O pin

45 IO RTX RF path (transmitreceive)

46 I P0_2IO pin default pull-high input(2)

PlayPause key (default) active-low

47 I P2_0IO pin default pull-high input system configuration

H Application L Baseband (IBDK mode)

48 I P2_7IO pin default pull-high input(2)

Volume up key (default) active-low

49 I P3_0IO pin default pull-high input(2)

Line-in detector (default) active-low

50 I P0_5IO pin default pull-high input(2)

Volume down (default) active-low

51 P VDD_IO IO power supply input (27-33V) connect to LDO31_VO pin

52 P AVDD_CDA Supply voltage of audio amplifier

53 P VBP_CDA Reference voltage output

54 O HPON_CDA Negative BTL output of channel-1

55 O HPOP_CDA Positive BTL output of channel-1

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Datasheet DS70005472A-page 15

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

56 P PVDD_CDA Supply voltage of power stage ch-1

57 P EP Exposed pads used as ground (GND) pins

Notes 1 The conventions used in the table are indicated as follows

ndash I = Input pinndash O = Output pinndash IO = InputOutput pinndash P = Power pin

2 All IO pins are configured using the UI tool a Windows-based utility

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Datasheet DS70005472A-page 16

3 AudioThe input and output audio signals have different stages and each stage is programmed to vary the gain responsecharacteristics For microphones both single-ended inputs and differential inputs are supported To maintain ahigh-quality signal provide a stable bias voltage source to the condenser microphonersquos FET Use the DC-blockingcapacitors at both positive and negative sides of the input Internally this analog signal is converted to 16-bit 8 kHzlinear PCM data

31 Digital Signal ProcessorA Digital Signal Processor (DSP) is used to perform speech and audio processing The advanced speech featuressuch as acoustic echo cancellation and noise reduction are built in To reduce nonlinear distortion and to help echocancellation an outgoing signal level to the speaker is monitored and adjusted to avoid saturation of the speakeroutput or microphone input Adaptive filtering is also applied to track the echo path impulse in response to provide anecho-free and full-duplex user experience

The embedded noise reduction algorithm helps to extract clean speech signals from the noisy inputs capturedby microphones and improves mutual understanding in communication The advanced audio features such asmulti-band dynamic range control parametric multi-band equalizer audio widening and virtual bass are built in Theaudio effect algorithms improve the userrsquos audio listening experience in terms of better quality audio after audiosignal processing

The following figures illustrate the processing flow of speakerphone applications for speech and audio signalprocessing

Figure 3-1 Speech Processing

Figure 3-2 Audio Processing

The DSP parameters such as EQ Speaker Gain Mic Gain Sound Effect and more are configured using the DSPtool For additional information on the DSP tool refer to the IS20xxBM1xBM2x DSP Application Note

IS2008SIS2010SIS2013SIS2015SAudio

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Datasheet DS70005472A-page 17

Note  The DSP tool and IS20xxBM1xBM2x DSP Application Note are available for download at the Microchipwebsite

32 CodecThe built-in codec has a high SNR performance and it consists of an ADC a DAC and additional analog circuitry

33 Auxiliary PortThe SoC supports one analog (line-in) signal from the external audio source The analog signal is processed bythe DSP to generate different sound effects (multi-band dynamic range compression and audio widening) which areconfigured using the DSP tool

34 Class D Audio AmplifierThe Class D amplifier has a significant advantage in many applications due to its lower power dissipation whichproduces less heat The IS2013S and IS2015S SoC have a built-in Class D amplifier that reduces circuit board spaceand system cost The efficiency of the amplifier extends the battery life in portable systems

The Class D amplifier is implemented by using a full-bridge output stage A full bridge uses two half-bridge stages todrive the load differentially The Class D amplifier provides a good SNR and enough drive capability for a 4Ω speakerdriver

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Datasheet DS70005472A-page 18

4 TransceiverThe SoC is designed and optimized for Bluetooth 24 GHz systems It contains a complete radio frequencytransmitterreceiver section An internal synthesizer generates a stable clock to synchronize with another device

41 TransmitterThe internal Power Amplifier (PA) has a maximum output power of +4 dBm with 20 dB power level control Applythis to Class 2 or Class 3 radios without an external RF PA The transmitter directly performs the IQ conversionto minimize the frequency drift and it can access the 20 dB power range with the temperature compensationmechanism

42 ReceiverThe Low-Noise Amplifier (LNA) operates with TR-combined mode for the single port application It saves the pin onthe package without having an external TXRX switch

The ADC is used to sample the input analog signal and convert it into a digital signal for demodulator analysisA channel filter is integrated into a receiver channel before the ADC to reduce the external component count andincrease the anti-interference capability

The image rejection filter is used to reject the image frequency for the low-IF architecture and it is also intended toreduce the external Band Pass Filter (BPF) component for a super heterodyne architecture

The Received Signal Strength Indicator (RSSI) signal feedback to the processor is used to control the RF outputpower to make a good trade-off for effective distance and current consumption

43 SynthesizerA synthesizer generates a clock for radio transceiver operation The VCO inside with a tunable internal LC tankcan reduce any variation for components A crystal oscillator with an internal digital trimming circuit provides a stableclock for the synthesizer

44 ModemFor Bluetooth 12 specifications and below 1 Mbps is the standard data rate based on the Gaussian Frequency ShiftKeying (GFSK) modulation scheme This basic rate modem meets BDR requirements of Bluetooth 20 with EDRspecifications

For Bluetooth 20 and above specifications EDR is introduced to provide the data rates of 123 Mbps Thisenhanced data rate modem meets EDR requirements of Bluetooth 20 with EDR specifications For the basebandboth BDR and EDR utilize the same 1 MHz symbol rate and 16 kHz slot rate For BDR 1 symbol represents 1-bitHowever each symbol in the payload part of the EDR packets represents 2-bit or 3-bit This is achieved by using twodifferent modulations π4 DQPSK and 8 DPSK

45 Adaptive Frequency Hopping (AFH)The SoC has an AFH function to avoid RF interference It has an algorithm to check the nearby interference and tochoose the clear channel for the transceiver Bluetooth signal

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Datasheet DS70005472A-page 19

5 MicrocontrollerA single-cycle 8-bit microcontroller is built into the SoC to execute the Bluetooth protocols It operates from 16 MHzto higher frequencies where the firmware dynamically adjusts the trade-off between the computing power and thepower consumption In the ROM version the MCU firmware is hard-wired to minimize power consumption for thefirmware execution and to save the external Flash cost

51 MemoryThere are sufficient ROM and RAM to fulfill the processor requirements in which a synchronous single port RAMinterface is used The register bank dedicated single port memory and Flash memory are connected to theprocessor bus The processor coordinates with all link control procedures and the data movement happens using aset of pointer registers

52 External ResetThe IS20xxS SoC provides a Watchdog Timer (WDT) to reset the SoC It has an integrated Power-on Reset (POR)circuit that resets all circuits to a known Power-on state This action is also driven by an external Reset signal whichis used to control the device externally by forcing it into a POR state The RST_N signal input is active-low and noconnection is required in most of the applications

53 Reference ClockThe IS20xxS SoC is composed of an integrated crystal oscillation function that uses a 16 MHz external crystal andtwo specified loading capacitors to provide a high quality system reference timer source Use this feature to removethe initial tolerance frequency errors which are associated with the crystal and its equivalent loading capacitance inthe mass production Achieve the frequency trim by adjusting the crystal loading capacitance through the on-chip trimcapacitors (Ctrim)

The value of the trimming capacitance is 200 fF (200x10-15 F) per LSB at the 5-bit word and the overall adjustableclock frequency is plusmn40 kHz The following figure illustrates the crystal connection of the IS20xxS SoC with twocapacitors

Figure 5-1 Crystal Connection

IS20XXS

XO_N

CL1

XO_P

CL2

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Datasheet DS70005472A-page 20

Notes 1 Ctrim = 200 fF (1 to 31) Cint = 3 pF2 CL = [(CL1 x CL2) (CL1 + CL2)] + (Ctrim 2) + Cint (set trim value as 16 Ctrim = 32 pF)3 For a 16 MHz crystal where CL = 9 pF the CL1 = CL2 = 91 pF)4 For the CL selection refer to the data sheet of the crystal

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Datasheet DS70005472A-page 21

6 Power Management Unit (PMU)The IS20xxS SoC has an integrated PMU The main features of the PMU are a lithium-ion battery charger and avoltage regulator A power switch is used to switch over the power source between a battery and an adapter Alsothe PMU provides current to the LED drivers

61 Charging a BatteryThe IS20xxS SoC has a built-in battery charger which is optimized for lithium-polymer batteries The battery chargerincludes a current sensor for a charging control user programmable current regulator and high accuracy voltageregulator

The charging current parameters are configured by using the UI (IS20XXS_UI) tool Whenever the adapter isplugged-in the charging circuit will be activated Reviving pre-charging constant current mode constant voltagemode and re-charging functions are implemented The maximum charging current is 350 mA The following figureillustrates the charging curve of a battery

Figure 6-1 Battery Charging Curve

62 Voltage MonitoringA 10-bit successive approximation register ADC (SAR ADC) provides a dedicated channel for battery voltage leveldetection The warning level is programmed by using the UI tool The ADC provides a granular resolution to enablethe MCU to take control over the charging process

63 Low Dropout RegulatorA built-in LDO Regulator is used to convert the battery or adapter power for the power supply It also integratesthe hardware architecture to control the power-onoff procedure The built-in programmable LDOs provide power forcodec and digital IO pads Also it is used to buffer the high input voltage from the battery or adapter This LDOrequires a 1 μF bypass capacitor

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 22

64 Switching RegulatorThe built-in programmable output voltage regulator converts the battery voltage to RF and base band core powersupply This converter has a high conversion efficiency and a fast transient response

65 LED DriverThe IS20xxS SoC consists of two LED drivers to control the LEDs The LED drivers provide enough sink current(16-step control and 035 mA for each step) and the LED is connected directly to the IS20xxS SoC

Note  Configure the LED settings using the IS20XXS_UI tool

The following figure illustrates the LED driver in the IS20xxS SoC

Figure 6-2 LED DRIVER

IS20xxS

LED2

SYS_PWR

LED1

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 23

7 Application InformationThis section describes the power supply connection host MCU UART interface and various modes in detail

71 Power SupplyThe following figure illustrates the connection from the BAT_IN pin to various other voltage supply pins of theIS20xxS SoC

The BAT_IN input pin powers the IS20xxS SoC To charge the battery connect the external 5V power adapter toADAP_IN

Figure 7-1 Power Tree Diagram

VDDA VDDAO

VDD_IO

3V LDO

18V Buck

SAR_VDD

LDO31_VIN

CODEC_VO

LDO31_VO

BK_VDD

BK_LX

BK_O

VDD_CORE

VCC_RF

12V LDOPMIC_IN

CLDO_O

RFLDO_O

PVDD_CDA

Li-Io

n BA

T BAT_IN

ADAP_IN

SYS_PWRPower Switch

5V Adapter

(42~30V)

(45~55V)(42~30V)

(30~27V)

(33 ~27V)

(18V)

(12V)

(128V)

72 Host MCU InterfaceAn external MCU controls the IS20xxS SoC using the UART command set The following figure illustrates the UARTinterface between the IS20xxS SoC and an external MCU

Figure 7-2 Host MCU Interface Over UART

IS20xxSHCI_TXD

HCI_RXD

PWR

P0_0

MCUUART_TX

UART_RX

MCU_WAKEUP

BT_WAKEUP

UART Interface

UART Interface

The MCU controls the IS20xxS SoC over the UART interface and wakes up the SoC using the PWR pin The MCUfunction wakes up by connecting to the P0_0 pin of the IS20xxS

Refer to the IS200xIS201xIS202x UART Command SOP document for a list of functions that the IS20xxS SoCsupports and how to use the IS20XXS_UI tool to set up the system using the UART command

Note  The IS200xIS201xIS202x UART Command SOP document is available for download from the Microchipwebsite at IS200xIS201xIS202x UART Command SOP

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Datasheet DS70005472A-page 24

73 Timing Sequence of UART ApplicationThe following figures illustrate the various UART control signal timing sequences

Figure 7-3 Power-OnOff Sequence

BAT_IN

SYS_PWR

1 ms

Power- oninitial idle Power-on Power-on Power-off idle

MCU state

MFB (PWR)

BK_OLDO31_VO

400 ms

RST_N

MCU sends UART command (UART_RX)

UART Command

MCU sends power-off UART Command

Power-on ACK ACK ACKIS20xxS response UART state

(UART_TX)

Set ldquoPower-on Directlyrdquo boot

any

10 ms

20 msKeep all IS20xxSand MCU connection to low level

2s

(See Figure 7-4) (See Figure 7-5)

IS20xxS disconnect and auto power-off

gt 1s

Figure 7-4 Timing Sequence of RX Indication after Power-On

Resume 32 kHz mode

MFB (PWR)MCU sends UART command

MFB pulse must be longer than the UART command slot time

150 ms

2 ms 2 ms

Enter 32 kHz mode

1 ms

UART Command

IS2008SIS2010SIS2013SIS2015SApplication Information

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Datasheet DS70005472A-page 25

Figure 7-5 Timing Sequence of Power-Off

BAT_IN +4V

MFB

MCU Sends RST_N

BK_OUT

LDO31_VO

UART Bus

2s 1s

IS20xxS Sends Power-off ACK

Notes 1 EEPROM clock = 100 kHz2 For a byte wire 001 ms x 32 clock x 2 = 640 μs3 It is recommended that ramp-down time be more than 640 μs during the power-off sequence to ensure safe

operation of the device

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 26

Figu

re 7

-6 

Tim

ing

Sequ

ence

of P

ower

-On

(NA

CK

)

BAT

_IN

SYS_

PWR

1 m

s Pow

er-

onin

itial

idle

Pow

er-o

nM

CU

sta

te

MFB

(PW

R)

BK_O

LD

O31

_VO

400

ms

RST

_N

MC

U s

ends

UAR

T co

mm

and

(UAR

T_R

X)

UAR

T C

omm

and

NAC

KPo

wer

-on

ACK

ACK

IS20

xxS

resp

onse

UAR

T st

ate

(UAR

T_TX

)

Set ldquo

Pow

er-o

n D

irect

lyrdquo b

oot

10 m

s

20 m

s

Ret

ry i

f AC

K is

not

rece

ived

200

ms

any

Wai

t

Max

imum

5 ti

mes

(1s)

IS2008SIS2010SIS2013SIS2015SApplication Information

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Datasheet DS70005472A-page 27

Figure 7-7 Reset Timing Sequence in Case of No Response from SoC to Host MCU

MFB (PWR)

MCU sends UART command UART

Command

UART Command

IS20xxS UART

If no response

RST_N

1ms

X ms1ms

1ms

1ms

Note  The MCU sends the UART command again when the SoC is not responding to its first UART command Ifthe SoC is not responding to the second UART command within X ms the MCU forces the system to reset

Figure 7-8 Timing Sequence of Power Drop Protection

BAT_IN +4V

RST_N from Reset IC

Power

SYS_PWR

IS20xxS

Reset OUT VDDGND

MCU Reset

Reset IC

29V

1 It is recommended that the battery be connected on a BAT_IN pin of the SoC for the power supply2 If an external power source or a power adapter is used to provide the power to the SoC (ADAP_IN) use a

voltage supervisor IC3 The RESET IC output pin must be open drain with delay time of le 10 ms and the recommended part is

TCM809SVNB713

74 General Purpose IO pinsThe following table provides the details of various functions that are mapped to the IO pins of the IS20xxS SoCand these IOs are configured by using the IS20XXS_UI tool The first button (Button 0) must be configured as thepower-onoff key and can be set using the PWR pin The remaining pins are configured for any one of the defaultfunctions (short press long press double press and combinations)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 28

Table 7-1 IO Pin Configuration

Sl No Pin Name Buttons Default Functions(1)

1 PowerMFB Button 0 PWR

2 P0_2 Button 1 PlayPause

3 P2_7 Button 2 Volume Up

4 P0_5 Button 3 Volume Down

5 P0_1 Button 4 FWD

6 P0_3 Button 5 REV

Note 1 These functions can be configured using the IS20XXS_UI tool

Few signals are generated to indicate or control outside devices The most popular applications are NFC for easypairing external audio amplifier for louder speaker and buzzer for indication

Table 7-2 IO Pins for Added Functions

Functions(1) IO Configurable Features

Slide switch P0_0P1_5

Buzzer P0_3

NFC detect P0_4P1_5

External amplifier enable P1_5

Note 1 These functions can be configured using the IS20XXS_UI tool

IS2008SIS2010SIS2013SIS2015SApplication Information

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Datasheet DS70005472A-page 29

8 Antenna Placement RuleFor Bluetooth-enabled products the antenna placement affects the overall performance The antenna requires freespace to radiate RF signals and it must not be surrounded by the GND plane

The following figure illustrates a typical example of the good and poor antenna placement on the main applicationboard with the GND plane

Figure 8-1 Antenna Placement Examples

The following figure illustrates the keep-out area recommended for the PCB antenna

Figure 8-2 Keep-Out Area Recommended for PCB Antenna

Note  For additional information on the antenna placement refer to the antenna-specific data sheet from theantenna manufacturer

IS2008SIS2010SIS2013SIS2015SAntenna Placement Rule

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 30

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

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copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

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Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

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copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

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Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

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Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

continuedAcronyms and Abbreviations Description

UART Universal Asynchronous Receiver Transmitter

VCO Voltage-Controlled Oscillator

WDT Watchdog Timer

IS2008SIS2010SIS2013SIS2015SQuick References

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 7

2 Device OverviewThe IS20xxS SoC integrates

bull Bluetooth 41 radio transceiverbull Power Management Unit (PMU)bull Digital Signal Processor (DSP)bull 1-channel Class-D Amplifier (CDA)

The following figure illustrates the block diagram of the IS20xxS SoC

Figure 2-1 Block Diagram of IS20xxS

8051

16 KB patch RAM

448 KB ROM

44 KB RAM

24-bit DSP Core

MCU

158 KB ROM

88 KB RAM

DSP

IS20xx

Classic RF

MACMODEM

Bluetooth + EDRTransceiver

RF Controller

Antenna

16 MHz Crystal

EEPROM

Power Switch

LED

BAT Charger

18 V BUCK

30 V LDO2

LED Driver2

PMULi-IonBAT

2-Channel DAC

Digital Core

2-Channel ADC

Audio Codec

(For IS20082010 only)

Speaker2W

Stereo Class-D AMP

MIC1

MIC2

Speaker

AUX_IN(analog signal) I2C

GPIOs or HWIO Port 0~3

21 Key FeaturesThe following table provides the key features of the IS20xxS family

Table 2-1 Key Features

Feature IS2008S IS2010S IS2013S IS2015S

Application Headset Headset Speaker Speaker

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 8

continuedFeature IS2008S IS2010S IS2013S IS2015S

StereoMono Mono Mono Mono Mono

Package QFN QFN QFN QFN

Pin count 48 48 56 56

Dimensions (mm) 6x6 6x6 7x7 7x7

Audio DAC output 1-channel 1-channel 1-channel 1-channel

DAC (single-ended) SNR at28V (dB) -98 -98 -98 -98

DAC (capless) SNR at 28V(dB) -96 -96 -96 -96

ADC SNR at 28V (dB) -90 -90 -90 -90

I2S digital output No No No No

Analog Auxiliary-Input No No Yes Yes

Mono microphone 2 2 1 1

External audio amplifierinterface No No Yes Yes

Built-in CDA No No 1-channel 1-channel

UART Yes Yes Yes Yes

LED driver 2 2 2 2

Integrated DC-DC step-down regulator Yes Yes Yes Yes

DC 5V adapter input Yes Yes Yes Yes

Battery charger (350 mAmaximum) Yes Yes Yes Yes

GPIO 6 6 9 9

Button Support 6 6 6 6

NFC Yes Yes Yes Yes

Voice prompt Yes Yes Yes Yes

Multi-tone Yes Yes Yes Yes

DSP sound effect No No Yes Yes

Bluetooth Profiles

A2DP 12 12 12 12

AVRCP 15 15 15 15

HFP 16 16 16 16

HSP 11 11 11 11

PBAP 10 10 10 10

SPP No 10 No 10

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 9

22 Pin DetailsThe following figure illustrates the pin diagram of the IS2008S and IS2010S

Figure 2-2 IS2008S and IS2010S Pin Diagram

The following table provides the pin description of the IS2008S and IS2010S

Table 2-2 Pin Description

IS2008S andIS2010S Pin No Pin Type(1) Pin Name Description

1 P VCOM Internal biasing voltage for codec

2 I MICN2 Mic2 mono differential analog negative input

3 I MICP2 Mic2 mono differential analog positive input

4 I MICN1 Mic1 mono differential analog negative input

5 I MICP1 Mic1 mono differential analog positive input

6 P MICBIAS Electric microphone biasing voltage

7 P VDD_CORE Core 12V power input connect to CLDO_O pin

8 O P1_2 IO pin default pull-high input EEPROM clock SCL

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 10

continuedIS2008S and

IS2010S Pin No Pin Type(1) Pin Name Description

9 IO P1_3 IO pin default pull-high input EEPROM data SDA

10 I RST_N System Reset pin active when rising edge

11 P VDD_IO IO power supply input (27-33V) connect to LDO31_VOpin

12 IO P0_1

IO pin default pull-high input(2)

bull FWD key when class 2 RF (default) active-lowbull Class 1 TX control signal of external RF TR switch

active high

13 IO P1_5

IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0bull Slide switch detector active-lowbull Buzzer signal output

14 I HCI_RXD HCI UART data input

15 O HCI_TXD HCI UART data output

16 P CODEC_VO 31V LDO output for codec power

17 P LDO31_VIN 31V LDO input connect to SYS_PWR pin

18 P LDO31_VO 31V LDO output

19 P ADAP_IN 5V power adapter input

20 P BAT_IN 33-42V Li-ion battery input

21 - NC No Connection

22 P SAR_VDD SAR 18V input connect to BK_O pin

23 P SYS_PWR Power output which comes from BAT_IN or ADAP_IN

24 P BK_VDD 18V buck VDD Power Input connect to SYS_PWR pin

25 P BK_LX 18V buck pin for switch

26 P BK_O 18V buck feedback input

27 I PWR Multi function push button and power-on key

28 I LED2 LED Driver 2

29 I LED1 LED Driver 1

30 IO P0_3

IO pin default pull-high input(2)

bull REV key (default) active-lowbull Buzzer signal outputbull Out_Ind_1bull Class 1 RX control signal of external RF TR switch

active high

31 P CLDO_O 12V core LDO output

32 P PMIC_IN PMU blocks power input connect to BK_O pin

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 11

continuedIS2008S and

IS2010S Pin No Pin Type(1) Pin Name Description

33 P RFLDO_O 128V RF LDO output

34 P VBG Bandgap output reference for decoupling interference

35 P ULPC_VSUS ULPC 12V output power

36 I XO_N 16 MHz crystal input negative

37 I XO_P 16 MHz crystal input positive

38 P VCC_RF RF power input (128V) for both synthesizer and TXRXblock connect to RFLDO_O pin

39 IO RTX RF path (transmitreceive)

40 I P0_2IO pin default pull-high input(2)

PlayPause key (default) active-low

41 I P2_0IO pin default pull-high input system configuration

H Application L Baseband (IBDK mode)

42 I P2_7IO pin default pull high input(2)

Volume up key (default) active-low

43 I P0_5IO pin default pull high input(2)

Volume down (default) active-low

44 P VDD_IO IO power supply input (27-33V) connect to LDO31_VOpin

45 P VDD_AOPositive power supply dedicated to codec outputamplifiers connect to CODEC_VO pin

46 O AOHPM Headphone common mode outputsense input

47 O AOHPL Left channel analog headphone output

48 P VDDA Positive power supplyreference voltage for codecconnect to CODEC_VO pin

49 P EP Exposed pads used as ground (GND) pins

Notes 1 The conventions used in the table are indicated as follows

ndash I = Input pinndash O = Output pinndash IO = InputOutput pinndash P = Power pin

2 All IO pins are configured using the IS20XXS_UI tool a Windowsreg-based utility

The following figure illustrates the pin diagram of the IS2013S and IS2015S

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 12

Figure 2-3 IS2013S and IS2015S Pin Diagram

The following table provides the pin description of the IS2013SIS2015S

Table 2-3 Pin Description

IS2013S andIS2015S Pin No Pin Type(1) Pin Name Description

1 P VDDAO Positive power supply dedicated to codec output amplifiersConnect to CODEC_VO pin

2 O AOHPM Headphone common mode outputsense input

3 O AOHPL Left channel analog headphone output

4 P VDDA Positive power supplyreference voltage for codec connect toCODEC_VO pin

5 P VCOM Internal biasing voltage for codec

6 I MICN1 Mic1 mono differential analog negative input

7 I MICP1 Mic1 mono differential analog positive input

8 P MICBIAS Electric microphone biasing voltage

9 I AIL Left channel single-ended analog inputs

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 13

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

10 P VDD_CORE Core 12V power input connect to CLDO_O pin

11 O P1_2 IO pin default pull high input EEPROM clock SCL

12 IO P1_3 IO pin default pull high input EEPROM data SDA

13 I RST_N System Reset pin active when rising edge

14 P VDD_IO IO power supply input (27-33V) connect to LDO31_VO pin

15 IO P0_1

IO pin default pull-high input(2)

bull FWD key when class 2 RF (default) active-lowbull Class 1 TX Control signal of external RF TR switch

active high

16 I P2_4IO pin default pull high input system configuration

L Boot mode with P2_0 low combination

17 IO P0_4IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0

18 IO P1_5

IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0bull Slide switch detector active-lowbull Buzzer signal output

19 I HCI_RXD HCI UART input data

20 O HCI_TXD HCI UART output data

21 P CODEC_VO 31V LDO output for codec power

22 P LDO31_VIN 31V LDO input connect to SYS_PWR pin

23 P LDO31_VO 31V LDO output

24 P ADAP_IN 5V power adapter input

25 P BAT_IN 33 to 42V Li-ion battery input

26 P SAR_VDD SAR 18V input connect to BK_O pin

27 P SYS_PWR Power output which come from BAT_IN or ADAP_IN

28 P LDO18_VDD 18V LDO VDD Power Input connect to SYS_PWR pin

29 P LDO18_O 18V LDO output

30 I PWR Multi-Function Push button and power on key

31 - NC No Connection

32 I LED2 LED Driver 2

33 I LED1 LED Driver 1

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 14

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

34 IO P0_0IO pin default pull-high input(2)

bull Slide switch detector active-lowbull UARTTX_IND active-low

35 IO P0_3

IO pin default pull-high input(2)

bull REV key (default) active-lowbull Buzzer signal outputbull Out_Ind_1bull Class 1 RX control signal of external RF TR switch

active high

36 I EANEmbedded ROMExternal Flash enable

H Embedded L External Flash

37 P CLDO_O 12V core LDO output

38 P PMIC_IN PMU blocks power input connect to BK_O pin

39 P RFLDO_O 128V RF LDO output

40 P VBG Bandgap output reference for decoupling interference

41 P ULPC_VSUS ULPC 12V output power

42 I XO_N 16 MHz crystal input negative

43 I XO_P 16 MHz crystal input positive

44 P VCC_RFRF power input (128V) for both synthesizer and TXRXblock connect to RFLDO_O pin

45 IO RTX RF path (transmitreceive)

46 I P0_2IO pin default pull-high input(2)

PlayPause key (default) active-low

47 I P2_0IO pin default pull-high input system configuration

H Application L Baseband (IBDK mode)

48 I P2_7IO pin default pull-high input(2)

Volume up key (default) active-low

49 I P3_0IO pin default pull-high input(2)

Line-in detector (default) active-low

50 I P0_5IO pin default pull-high input(2)

Volume down (default) active-low

51 P VDD_IO IO power supply input (27-33V) connect to LDO31_VO pin

52 P AVDD_CDA Supply voltage of audio amplifier

53 P VBP_CDA Reference voltage output

54 O HPON_CDA Negative BTL output of channel-1

55 O HPOP_CDA Positive BTL output of channel-1

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 15

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

56 P PVDD_CDA Supply voltage of power stage ch-1

57 P EP Exposed pads used as ground (GND) pins

Notes 1 The conventions used in the table are indicated as follows

ndash I = Input pinndash O = Output pinndash IO = InputOutput pinndash P = Power pin

2 All IO pins are configured using the UI tool a Windows-based utility

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 16

3 AudioThe input and output audio signals have different stages and each stage is programmed to vary the gain responsecharacteristics For microphones both single-ended inputs and differential inputs are supported To maintain ahigh-quality signal provide a stable bias voltage source to the condenser microphonersquos FET Use the DC-blockingcapacitors at both positive and negative sides of the input Internally this analog signal is converted to 16-bit 8 kHzlinear PCM data

31 Digital Signal ProcessorA Digital Signal Processor (DSP) is used to perform speech and audio processing The advanced speech featuressuch as acoustic echo cancellation and noise reduction are built in To reduce nonlinear distortion and to help echocancellation an outgoing signal level to the speaker is monitored and adjusted to avoid saturation of the speakeroutput or microphone input Adaptive filtering is also applied to track the echo path impulse in response to provide anecho-free and full-duplex user experience

The embedded noise reduction algorithm helps to extract clean speech signals from the noisy inputs capturedby microphones and improves mutual understanding in communication The advanced audio features such asmulti-band dynamic range control parametric multi-band equalizer audio widening and virtual bass are built in Theaudio effect algorithms improve the userrsquos audio listening experience in terms of better quality audio after audiosignal processing

The following figures illustrate the processing flow of speakerphone applications for speech and audio signalprocessing

Figure 3-1 Speech Processing

Figure 3-2 Audio Processing

The DSP parameters such as EQ Speaker Gain Mic Gain Sound Effect and more are configured using the DSPtool For additional information on the DSP tool refer to the IS20xxBM1xBM2x DSP Application Note

IS2008SIS2010SIS2013SIS2015SAudio

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 17

Note  The DSP tool and IS20xxBM1xBM2x DSP Application Note are available for download at the Microchipwebsite

32 CodecThe built-in codec has a high SNR performance and it consists of an ADC a DAC and additional analog circuitry

33 Auxiliary PortThe SoC supports one analog (line-in) signal from the external audio source The analog signal is processed bythe DSP to generate different sound effects (multi-band dynamic range compression and audio widening) which areconfigured using the DSP tool

34 Class D Audio AmplifierThe Class D amplifier has a significant advantage in many applications due to its lower power dissipation whichproduces less heat The IS2013S and IS2015S SoC have a built-in Class D amplifier that reduces circuit board spaceand system cost The efficiency of the amplifier extends the battery life in portable systems

The Class D amplifier is implemented by using a full-bridge output stage A full bridge uses two half-bridge stages todrive the load differentially The Class D amplifier provides a good SNR and enough drive capability for a 4Ω speakerdriver

IS2008SIS2010SIS2013SIS2015SAudio

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 18

4 TransceiverThe SoC is designed and optimized for Bluetooth 24 GHz systems It contains a complete radio frequencytransmitterreceiver section An internal synthesizer generates a stable clock to synchronize with another device

41 TransmitterThe internal Power Amplifier (PA) has a maximum output power of +4 dBm with 20 dB power level control Applythis to Class 2 or Class 3 radios without an external RF PA The transmitter directly performs the IQ conversionto minimize the frequency drift and it can access the 20 dB power range with the temperature compensationmechanism

42 ReceiverThe Low-Noise Amplifier (LNA) operates with TR-combined mode for the single port application It saves the pin onthe package without having an external TXRX switch

The ADC is used to sample the input analog signal and convert it into a digital signal for demodulator analysisA channel filter is integrated into a receiver channel before the ADC to reduce the external component count andincrease the anti-interference capability

The image rejection filter is used to reject the image frequency for the low-IF architecture and it is also intended toreduce the external Band Pass Filter (BPF) component for a super heterodyne architecture

The Received Signal Strength Indicator (RSSI) signal feedback to the processor is used to control the RF outputpower to make a good trade-off for effective distance and current consumption

43 SynthesizerA synthesizer generates a clock for radio transceiver operation The VCO inside with a tunable internal LC tankcan reduce any variation for components A crystal oscillator with an internal digital trimming circuit provides a stableclock for the synthesizer

44 ModemFor Bluetooth 12 specifications and below 1 Mbps is the standard data rate based on the Gaussian Frequency ShiftKeying (GFSK) modulation scheme This basic rate modem meets BDR requirements of Bluetooth 20 with EDRspecifications

For Bluetooth 20 and above specifications EDR is introduced to provide the data rates of 123 Mbps Thisenhanced data rate modem meets EDR requirements of Bluetooth 20 with EDR specifications For the basebandboth BDR and EDR utilize the same 1 MHz symbol rate and 16 kHz slot rate For BDR 1 symbol represents 1-bitHowever each symbol in the payload part of the EDR packets represents 2-bit or 3-bit This is achieved by using twodifferent modulations π4 DQPSK and 8 DPSK

45 Adaptive Frequency Hopping (AFH)The SoC has an AFH function to avoid RF interference It has an algorithm to check the nearby interference and tochoose the clear channel for the transceiver Bluetooth signal

IS2008SIS2010SIS2013SIS2015STransceiver

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 19

5 MicrocontrollerA single-cycle 8-bit microcontroller is built into the SoC to execute the Bluetooth protocols It operates from 16 MHzto higher frequencies where the firmware dynamically adjusts the trade-off between the computing power and thepower consumption In the ROM version the MCU firmware is hard-wired to minimize power consumption for thefirmware execution and to save the external Flash cost

51 MemoryThere are sufficient ROM and RAM to fulfill the processor requirements in which a synchronous single port RAMinterface is used The register bank dedicated single port memory and Flash memory are connected to theprocessor bus The processor coordinates with all link control procedures and the data movement happens using aset of pointer registers

52 External ResetThe IS20xxS SoC provides a Watchdog Timer (WDT) to reset the SoC It has an integrated Power-on Reset (POR)circuit that resets all circuits to a known Power-on state This action is also driven by an external Reset signal whichis used to control the device externally by forcing it into a POR state The RST_N signal input is active-low and noconnection is required in most of the applications

53 Reference ClockThe IS20xxS SoC is composed of an integrated crystal oscillation function that uses a 16 MHz external crystal andtwo specified loading capacitors to provide a high quality system reference timer source Use this feature to removethe initial tolerance frequency errors which are associated with the crystal and its equivalent loading capacitance inthe mass production Achieve the frequency trim by adjusting the crystal loading capacitance through the on-chip trimcapacitors (Ctrim)

The value of the trimming capacitance is 200 fF (200x10-15 F) per LSB at the 5-bit word and the overall adjustableclock frequency is plusmn40 kHz The following figure illustrates the crystal connection of the IS20xxS SoC with twocapacitors

Figure 5-1 Crystal Connection

IS20XXS

XO_N

CL1

XO_P

CL2

IS2008SIS2010SIS2013SIS2015SMicrocontroller

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 20

Notes 1 Ctrim = 200 fF (1 to 31) Cint = 3 pF2 CL = [(CL1 x CL2) (CL1 + CL2)] + (Ctrim 2) + Cint (set trim value as 16 Ctrim = 32 pF)3 For a 16 MHz crystal where CL = 9 pF the CL1 = CL2 = 91 pF)4 For the CL selection refer to the data sheet of the crystal

IS2008SIS2010SIS2013SIS2015SMicrocontroller

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 21

6 Power Management Unit (PMU)The IS20xxS SoC has an integrated PMU The main features of the PMU are a lithium-ion battery charger and avoltage regulator A power switch is used to switch over the power source between a battery and an adapter Alsothe PMU provides current to the LED drivers

61 Charging a BatteryThe IS20xxS SoC has a built-in battery charger which is optimized for lithium-polymer batteries The battery chargerincludes a current sensor for a charging control user programmable current regulator and high accuracy voltageregulator

The charging current parameters are configured by using the UI (IS20XXS_UI) tool Whenever the adapter isplugged-in the charging circuit will be activated Reviving pre-charging constant current mode constant voltagemode and re-charging functions are implemented The maximum charging current is 350 mA The following figureillustrates the charging curve of a battery

Figure 6-1 Battery Charging Curve

62 Voltage MonitoringA 10-bit successive approximation register ADC (SAR ADC) provides a dedicated channel for battery voltage leveldetection The warning level is programmed by using the UI tool The ADC provides a granular resolution to enablethe MCU to take control over the charging process

63 Low Dropout RegulatorA built-in LDO Regulator is used to convert the battery or adapter power for the power supply It also integratesthe hardware architecture to control the power-onoff procedure The built-in programmable LDOs provide power forcodec and digital IO pads Also it is used to buffer the high input voltage from the battery or adapter This LDOrequires a 1 μF bypass capacitor

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 22

64 Switching RegulatorThe built-in programmable output voltage regulator converts the battery voltage to RF and base band core powersupply This converter has a high conversion efficiency and a fast transient response

65 LED DriverThe IS20xxS SoC consists of two LED drivers to control the LEDs The LED drivers provide enough sink current(16-step control and 035 mA for each step) and the LED is connected directly to the IS20xxS SoC

Note  Configure the LED settings using the IS20XXS_UI tool

The following figure illustrates the LED driver in the IS20xxS SoC

Figure 6-2 LED DRIVER

IS20xxS

LED2

SYS_PWR

LED1

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 23

7 Application InformationThis section describes the power supply connection host MCU UART interface and various modes in detail

71 Power SupplyThe following figure illustrates the connection from the BAT_IN pin to various other voltage supply pins of theIS20xxS SoC

The BAT_IN input pin powers the IS20xxS SoC To charge the battery connect the external 5V power adapter toADAP_IN

Figure 7-1 Power Tree Diagram

VDDA VDDAO

VDD_IO

3V LDO

18V Buck

SAR_VDD

LDO31_VIN

CODEC_VO

LDO31_VO

BK_VDD

BK_LX

BK_O

VDD_CORE

VCC_RF

12V LDOPMIC_IN

CLDO_O

RFLDO_O

PVDD_CDA

Li-Io

n BA

T BAT_IN

ADAP_IN

SYS_PWRPower Switch

5V Adapter

(42~30V)

(45~55V)(42~30V)

(30~27V)

(33 ~27V)

(18V)

(12V)

(128V)

72 Host MCU InterfaceAn external MCU controls the IS20xxS SoC using the UART command set The following figure illustrates the UARTinterface between the IS20xxS SoC and an external MCU

Figure 7-2 Host MCU Interface Over UART

IS20xxSHCI_TXD

HCI_RXD

PWR

P0_0

MCUUART_TX

UART_RX

MCU_WAKEUP

BT_WAKEUP

UART Interface

UART Interface

The MCU controls the IS20xxS SoC over the UART interface and wakes up the SoC using the PWR pin The MCUfunction wakes up by connecting to the P0_0 pin of the IS20xxS

Refer to the IS200xIS201xIS202x UART Command SOP document for a list of functions that the IS20xxS SoCsupports and how to use the IS20XXS_UI tool to set up the system using the UART command

Note  The IS200xIS201xIS202x UART Command SOP document is available for download from the Microchipwebsite at IS200xIS201xIS202x UART Command SOP

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 24

73 Timing Sequence of UART ApplicationThe following figures illustrate the various UART control signal timing sequences

Figure 7-3 Power-OnOff Sequence

BAT_IN

SYS_PWR

1 ms

Power- oninitial idle Power-on Power-on Power-off idle

MCU state

MFB (PWR)

BK_OLDO31_VO

400 ms

RST_N

MCU sends UART command (UART_RX)

UART Command

MCU sends power-off UART Command

Power-on ACK ACK ACKIS20xxS response UART state

(UART_TX)

Set ldquoPower-on Directlyrdquo boot

any

10 ms

20 msKeep all IS20xxSand MCU connection to low level

2s

(See Figure 7-4) (See Figure 7-5)

IS20xxS disconnect and auto power-off

gt 1s

Figure 7-4 Timing Sequence of RX Indication after Power-On

Resume 32 kHz mode

MFB (PWR)MCU sends UART command

MFB pulse must be longer than the UART command slot time

150 ms

2 ms 2 ms

Enter 32 kHz mode

1 ms

UART Command

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 25

Figure 7-5 Timing Sequence of Power-Off

BAT_IN +4V

MFB

MCU Sends RST_N

BK_OUT

LDO31_VO

UART Bus

2s 1s

IS20xxS Sends Power-off ACK

Notes 1 EEPROM clock = 100 kHz2 For a byte wire 001 ms x 32 clock x 2 = 640 μs3 It is recommended that ramp-down time be more than 640 μs during the power-off sequence to ensure safe

operation of the device

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 26

Figu

re 7

-6 

Tim

ing

Sequ

ence

of P

ower

-On

(NA

CK

)

BAT

_IN

SYS_

PWR

1 m

s Pow

er-

onin

itial

idle

Pow

er-o

nM

CU

sta

te

MFB

(PW

R)

BK_O

LD

O31

_VO

400

ms

RST

_N

MC

U s

ends

UAR

T co

mm

and

(UAR

T_R

X)

UAR

T C

omm

and

NAC

KPo

wer

-on

ACK

ACK

IS20

xxS

resp

onse

UAR

T st

ate

(UAR

T_TX

)

Set ldquo

Pow

er-o

n D

irect

lyrdquo b

oot

10 m

s

20 m

s

Ret

ry i

f AC

K is

not

rece

ived

200

ms

any

Wai

t

Max

imum

5 ti

mes

(1s)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 27

Figure 7-7 Reset Timing Sequence in Case of No Response from SoC to Host MCU

MFB (PWR)

MCU sends UART command UART

Command

UART Command

IS20xxS UART

If no response

RST_N

1ms

X ms1ms

1ms

1ms

Note  The MCU sends the UART command again when the SoC is not responding to its first UART command Ifthe SoC is not responding to the second UART command within X ms the MCU forces the system to reset

Figure 7-8 Timing Sequence of Power Drop Protection

BAT_IN +4V

RST_N from Reset IC

Power

SYS_PWR

IS20xxS

Reset OUT VDDGND

MCU Reset

Reset IC

29V

1 It is recommended that the battery be connected on a BAT_IN pin of the SoC for the power supply2 If an external power source or a power adapter is used to provide the power to the SoC (ADAP_IN) use a

voltage supervisor IC3 The RESET IC output pin must be open drain with delay time of le 10 ms and the recommended part is

TCM809SVNB713

74 General Purpose IO pinsThe following table provides the details of various functions that are mapped to the IO pins of the IS20xxS SoCand these IOs are configured by using the IS20XXS_UI tool The first button (Button 0) must be configured as thepower-onoff key and can be set using the PWR pin The remaining pins are configured for any one of the defaultfunctions (short press long press double press and combinations)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 28

Table 7-1 IO Pin Configuration

Sl No Pin Name Buttons Default Functions(1)

1 PowerMFB Button 0 PWR

2 P0_2 Button 1 PlayPause

3 P2_7 Button 2 Volume Up

4 P0_5 Button 3 Volume Down

5 P0_1 Button 4 FWD

6 P0_3 Button 5 REV

Note 1 These functions can be configured using the IS20XXS_UI tool

Few signals are generated to indicate or control outside devices The most popular applications are NFC for easypairing external audio amplifier for louder speaker and buzzer for indication

Table 7-2 IO Pins for Added Functions

Functions(1) IO Configurable Features

Slide switch P0_0P1_5

Buzzer P0_3

NFC detect P0_4P1_5

External amplifier enable P1_5

Note 1 These functions can be configured using the IS20XXS_UI tool

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 29

8 Antenna Placement RuleFor Bluetooth-enabled products the antenna placement affects the overall performance The antenna requires freespace to radiate RF signals and it must not be surrounded by the GND plane

The following figure illustrates a typical example of the good and poor antenna placement on the main applicationboard with the GND plane

Figure 8-1 Antenna Placement Examples

The following figure illustrates the keep-out area recommended for the PCB antenna

Figure 8-2 Keep-Out Area Recommended for PCB Antenna

Note  For additional information on the antenna placement refer to the antenna-specific data sheet from theantenna manufacturer

IS2008SIS2010SIS2013SIS2015SAntenna Placement Rule

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 30

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

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ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

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Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

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Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

2 Device OverviewThe IS20xxS SoC integrates

bull Bluetooth 41 radio transceiverbull Power Management Unit (PMU)bull Digital Signal Processor (DSP)bull 1-channel Class-D Amplifier (CDA)

The following figure illustrates the block diagram of the IS20xxS SoC

Figure 2-1 Block Diagram of IS20xxS

8051

16 KB patch RAM

448 KB ROM

44 KB RAM

24-bit DSP Core

MCU

158 KB ROM

88 KB RAM

DSP

IS20xx

Classic RF

MACMODEM

Bluetooth + EDRTransceiver

RF Controller

Antenna

16 MHz Crystal

EEPROM

Power Switch

LED

BAT Charger

18 V BUCK

30 V LDO2

LED Driver2

PMULi-IonBAT

2-Channel DAC

Digital Core

2-Channel ADC

Audio Codec

(For IS20082010 only)

Speaker2W

Stereo Class-D AMP

MIC1

MIC2

Speaker

AUX_IN(analog signal) I2C

GPIOs or HWIO Port 0~3

21 Key FeaturesThe following table provides the key features of the IS20xxS family

Table 2-1 Key Features

Feature IS2008S IS2010S IS2013S IS2015S

Application Headset Headset Speaker Speaker

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 8

continuedFeature IS2008S IS2010S IS2013S IS2015S

StereoMono Mono Mono Mono Mono

Package QFN QFN QFN QFN

Pin count 48 48 56 56

Dimensions (mm) 6x6 6x6 7x7 7x7

Audio DAC output 1-channel 1-channel 1-channel 1-channel

DAC (single-ended) SNR at28V (dB) -98 -98 -98 -98

DAC (capless) SNR at 28V(dB) -96 -96 -96 -96

ADC SNR at 28V (dB) -90 -90 -90 -90

I2S digital output No No No No

Analog Auxiliary-Input No No Yes Yes

Mono microphone 2 2 1 1

External audio amplifierinterface No No Yes Yes

Built-in CDA No No 1-channel 1-channel

UART Yes Yes Yes Yes

LED driver 2 2 2 2

Integrated DC-DC step-down regulator Yes Yes Yes Yes

DC 5V adapter input Yes Yes Yes Yes

Battery charger (350 mAmaximum) Yes Yes Yes Yes

GPIO 6 6 9 9

Button Support 6 6 6 6

NFC Yes Yes Yes Yes

Voice prompt Yes Yes Yes Yes

Multi-tone Yes Yes Yes Yes

DSP sound effect No No Yes Yes

Bluetooth Profiles

A2DP 12 12 12 12

AVRCP 15 15 15 15

HFP 16 16 16 16

HSP 11 11 11 11

PBAP 10 10 10 10

SPP No 10 No 10

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 9

22 Pin DetailsThe following figure illustrates the pin diagram of the IS2008S and IS2010S

Figure 2-2 IS2008S and IS2010S Pin Diagram

The following table provides the pin description of the IS2008S and IS2010S

Table 2-2 Pin Description

IS2008S andIS2010S Pin No Pin Type(1) Pin Name Description

1 P VCOM Internal biasing voltage for codec

2 I MICN2 Mic2 mono differential analog negative input

3 I MICP2 Mic2 mono differential analog positive input

4 I MICN1 Mic1 mono differential analog negative input

5 I MICP1 Mic1 mono differential analog positive input

6 P MICBIAS Electric microphone biasing voltage

7 P VDD_CORE Core 12V power input connect to CLDO_O pin

8 O P1_2 IO pin default pull-high input EEPROM clock SCL

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 10

continuedIS2008S and

IS2010S Pin No Pin Type(1) Pin Name Description

9 IO P1_3 IO pin default pull-high input EEPROM data SDA

10 I RST_N System Reset pin active when rising edge

11 P VDD_IO IO power supply input (27-33V) connect to LDO31_VOpin

12 IO P0_1

IO pin default pull-high input(2)

bull FWD key when class 2 RF (default) active-lowbull Class 1 TX control signal of external RF TR switch

active high

13 IO P1_5

IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0bull Slide switch detector active-lowbull Buzzer signal output

14 I HCI_RXD HCI UART data input

15 O HCI_TXD HCI UART data output

16 P CODEC_VO 31V LDO output for codec power

17 P LDO31_VIN 31V LDO input connect to SYS_PWR pin

18 P LDO31_VO 31V LDO output

19 P ADAP_IN 5V power adapter input

20 P BAT_IN 33-42V Li-ion battery input

21 - NC No Connection

22 P SAR_VDD SAR 18V input connect to BK_O pin

23 P SYS_PWR Power output which comes from BAT_IN or ADAP_IN

24 P BK_VDD 18V buck VDD Power Input connect to SYS_PWR pin

25 P BK_LX 18V buck pin for switch

26 P BK_O 18V buck feedback input

27 I PWR Multi function push button and power-on key

28 I LED2 LED Driver 2

29 I LED1 LED Driver 1

30 IO P0_3

IO pin default pull-high input(2)

bull REV key (default) active-lowbull Buzzer signal outputbull Out_Ind_1bull Class 1 RX control signal of external RF TR switch

active high

31 P CLDO_O 12V core LDO output

32 P PMIC_IN PMU blocks power input connect to BK_O pin

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 11

continuedIS2008S and

IS2010S Pin No Pin Type(1) Pin Name Description

33 P RFLDO_O 128V RF LDO output

34 P VBG Bandgap output reference for decoupling interference

35 P ULPC_VSUS ULPC 12V output power

36 I XO_N 16 MHz crystal input negative

37 I XO_P 16 MHz crystal input positive

38 P VCC_RF RF power input (128V) for both synthesizer and TXRXblock connect to RFLDO_O pin

39 IO RTX RF path (transmitreceive)

40 I P0_2IO pin default pull-high input(2)

PlayPause key (default) active-low

41 I P2_0IO pin default pull-high input system configuration

H Application L Baseband (IBDK mode)

42 I P2_7IO pin default pull high input(2)

Volume up key (default) active-low

43 I P0_5IO pin default pull high input(2)

Volume down (default) active-low

44 P VDD_IO IO power supply input (27-33V) connect to LDO31_VOpin

45 P VDD_AOPositive power supply dedicated to codec outputamplifiers connect to CODEC_VO pin

46 O AOHPM Headphone common mode outputsense input

47 O AOHPL Left channel analog headphone output

48 P VDDA Positive power supplyreference voltage for codecconnect to CODEC_VO pin

49 P EP Exposed pads used as ground (GND) pins

Notes 1 The conventions used in the table are indicated as follows

ndash I = Input pinndash O = Output pinndash IO = InputOutput pinndash P = Power pin

2 All IO pins are configured using the IS20XXS_UI tool a Windowsreg-based utility

The following figure illustrates the pin diagram of the IS2013S and IS2015S

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 12

Figure 2-3 IS2013S and IS2015S Pin Diagram

The following table provides the pin description of the IS2013SIS2015S

Table 2-3 Pin Description

IS2013S andIS2015S Pin No Pin Type(1) Pin Name Description

1 P VDDAO Positive power supply dedicated to codec output amplifiersConnect to CODEC_VO pin

2 O AOHPM Headphone common mode outputsense input

3 O AOHPL Left channel analog headphone output

4 P VDDA Positive power supplyreference voltage for codec connect toCODEC_VO pin

5 P VCOM Internal biasing voltage for codec

6 I MICN1 Mic1 mono differential analog negative input

7 I MICP1 Mic1 mono differential analog positive input

8 P MICBIAS Electric microphone biasing voltage

9 I AIL Left channel single-ended analog inputs

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 13

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

10 P VDD_CORE Core 12V power input connect to CLDO_O pin

11 O P1_2 IO pin default pull high input EEPROM clock SCL

12 IO P1_3 IO pin default pull high input EEPROM data SDA

13 I RST_N System Reset pin active when rising edge

14 P VDD_IO IO power supply input (27-33V) connect to LDO31_VO pin

15 IO P0_1

IO pin default pull-high input(2)

bull FWD key when class 2 RF (default) active-lowbull Class 1 TX Control signal of external RF TR switch

active high

16 I P2_4IO pin default pull high input system configuration

L Boot mode with P2_0 low combination

17 IO P0_4IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0

18 IO P1_5

IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0bull Slide switch detector active-lowbull Buzzer signal output

19 I HCI_RXD HCI UART input data

20 O HCI_TXD HCI UART output data

21 P CODEC_VO 31V LDO output for codec power

22 P LDO31_VIN 31V LDO input connect to SYS_PWR pin

23 P LDO31_VO 31V LDO output

24 P ADAP_IN 5V power adapter input

25 P BAT_IN 33 to 42V Li-ion battery input

26 P SAR_VDD SAR 18V input connect to BK_O pin

27 P SYS_PWR Power output which come from BAT_IN or ADAP_IN

28 P LDO18_VDD 18V LDO VDD Power Input connect to SYS_PWR pin

29 P LDO18_O 18V LDO output

30 I PWR Multi-Function Push button and power on key

31 - NC No Connection

32 I LED2 LED Driver 2

33 I LED1 LED Driver 1

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 14

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

34 IO P0_0IO pin default pull-high input(2)

bull Slide switch detector active-lowbull UARTTX_IND active-low

35 IO P0_3

IO pin default pull-high input(2)

bull REV key (default) active-lowbull Buzzer signal outputbull Out_Ind_1bull Class 1 RX control signal of external RF TR switch

active high

36 I EANEmbedded ROMExternal Flash enable

H Embedded L External Flash

37 P CLDO_O 12V core LDO output

38 P PMIC_IN PMU blocks power input connect to BK_O pin

39 P RFLDO_O 128V RF LDO output

40 P VBG Bandgap output reference for decoupling interference

41 P ULPC_VSUS ULPC 12V output power

42 I XO_N 16 MHz crystal input negative

43 I XO_P 16 MHz crystal input positive

44 P VCC_RFRF power input (128V) for both synthesizer and TXRXblock connect to RFLDO_O pin

45 IO RTX RF path (transmitreceive)

46 I P0_2IO pin default pull-high input(2)

PlayPause key (default) active-low

47 I P2_0IO pin default pull-high input system configuration

H Application L Baseband (IBDK mode)

48 I P2_7IO pin default pull-high input(2)

Volume up key (default) active-low

49 I P3_0IO pin default pull-high input(2)

Line-in detector (default) active-low

50 I P0_5IO pin default pull-high input(2)

Volume down (default) active-low

51 P VDD_IO IO power supply input (27-33V) connect to LDO31_VO pin

52 P AVDD_CDA Supply voltage of audio amplifier

53 P VBP_CDA Reference voltage output

54 O HPON_CDA Negative BTL output of channel-1

55 O HPOP_CDA Positive BTL output of channel-1

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 15

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

56 P PVDD_CDA Supply voltage of power stage ch-1

57 P EP Exposed pads used as ground (GND) pins

Notes 1 The conventions used in the table are indicated as follows

ndash I = Input pinndash O = Output pinndash IO = InputOutput pinndash P = Power pin

2 All IO pins are configured using the UI tool a Windows-based utility

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 16

3 AudioThe input and output audio signals have different stages and each stage is programmed to vary the gain responsecharacteristics For microphones both single-ended inputs and differential inputs are supported To maintain ahigh-quality signal provide a stable bias voltage source to the condenser microphonersquos FET Use the DC-blockingcapacitors at both positive and negative sides of the input Internally this analog signal is converted to 16-bit 8 kHzlinear PCM data

31 Digital Signal ProcessorA Digital Signal Processor (DSP) is used to perform speech and audio processing The advanced speech featuressuch as acoustic echo cancellation and noise reduction are built in To reduce nonlinear distortion and to help echocancellation an outgoing signal level to the speaker is monitored and adjusted to avoid saturation of the speakeroutput or microphone input Adaptive filtering is also applied to track the echo path impulse in response to provide anecho-free and full-duplex user experience

The embedded noise reduction algorithm helps to extract clean speech signals from the noisy inputs capturedby microphones and improves mutual understanding in communication The advanced audio features such asmulti-band dynamic range control parametric multi-band equalizer audio widening and virtual bass are built in Theaudio effect algorithms improve the userrsquos audio listening experience in terms of better quality audio after audiosignal processing

The following figures illustrate the processing flow of speakerphone applications for speech and audio signalprocessing

Figure 3-1 Speech Processing

Figure 3-2 Audio Processing

The DSP parameters such as EQ Speaker Gain Mic Gain Sound Effect and more are configured using the DSPtool For additional information on the DSP tool refer to the IS20xxBM1xBM2x DSP Application Note

IS2008SIS2010SIS2013SIS2015SAudio

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 17

Note  The DSP tool and IS20xxBM1xBM2x DSP Application Note are available for download at the Microchipwebsite

32 CodecThe built-in codec has a high SNR performance and it consists of an ADC a DAC and additional analog circuitry

33 Auxiliary PortThe SoC supports one analog (line-in) signal from the external audio source The analog signal is processed bythe DSP to generate different sound effects (multi-band dynamic range compression and audio widening) which areconfigured using the DSP tool

34 Class D Audio AmplifierThe Class D amplifier has a significant advantage in many applications due to its lower power dissipation whichproduces less heat The IS2013S and IS2015S SoC have a built-in Class D amplifier that reduces circuit board spaceand system cost The efficiency of the amplifier extends the battery life in portable systems

The Class D amplifier is implemented by using a full-bridge output stage A full bridge uses two half-bridge stages todrive the load differentially The Class D amplifier provides a good SNR and enough drive capability for a 4Ω speakerdriver

IS2008SIS2010SIS2013SIS2015SAudio

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 18

4 TransceiverThe SoC is designed and optimized for Bluetooth 24 GHz systems It contains a complete radio frequencytransmitterreceiver section An internal synthesizer generates a stable clock to synchronize with another device

41 TransmitterThe internal Power Amplifier (PA) has a maximum output power of +4 dBm with 20 dB power level control Applythis to Class 2 or Class 3 radios without an external RF PA The transmitter directly performs the IQ conversionto minimize the frequency drift and it can access the 20 dB power range with the temperature compensationmechanism

42 ReceiverThe Low-Noise Amplifier (LNA) operates with TR-combined mode for the single port application It saves the pin onthe package without having an external TXRX switch

The ADC is used to sample the input analog signal and convert it into a digital signal for demodulator analysisA channel filter is integrated into a receiver channel before the ADC to reduce the external component count andincrease the anti-interference capability

The image rejection filter is used to reject the image frequency for the low-IF architecture and it is also intended toreduce the external Band Pass Filter (BPF) component for a super heterodyne architecture

The Received Signal Strength Indicator (RSSI) signal feedback to the processor is used to control the RF outputpower to make a good trade-off for effective distance and current consumption

43 SynthesizerA synthesizer generates a clock for radio transceiver operation The VCO inside with a tunable internal LC tankcan reduce any variation for components A crystal oscillator with an internal digital trimming circuit provides a stableclock for the synthesizer

44 ModemFor Bluetooth 12 specifications and below 1 Mbps is the standard data rate based on the Gaussian Frequency ShiftKeying (GFSK) modulation scheme This basic rate modem meets BDR requirements of Bluetooth 20 with EDRspecifications

For Bluetooth 20 and above specifications EDR is introduced to provide the data rates of 123 Mbps Thisenhanced data rate modem meets EDR requirements of Bluetooth 20 with EDR specifications For the basebandboth BDR and EDR utilize the same 1 MHz symbol rate and 16 kHz slot rate For BDR 1 symbol represents 1-bitHowever each symbol in the payload part of the EDR packets represents 2-bit or 3-bit This is achieved by using twodifferent modulations π4 DQPSK and 8 DPSK

45 Adaptive Frequency Hopping (AFH)The SoC has an AFH function to avoid RF interference It has an algorithm to check the nearby interference and tochoose the clear channel for the transceiver Bluetooth signal

IS2008SIS2010SIS2013SIS2015STransceiver

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 19

5 MicrocontrollerA single-cycle 8-bit microcontroller is built into the SoC to execute the Bluetooth protocols It operates from 16 MHzto higher frequencies where the firmware dynamically adjusts the trade-off between the computing power and thepower consumption In the ROM version the MCU firmware is hard-wired to minimize power consumption for thefirmware execution and to save the external Flash cost

51 MemoryThere are sufficient ROM and RAM to fulfill the processor requirements in which a synchronous single port RAMinterface is used The register bank dedicated single port memory and Flash memory are connected to theprocessor bus The processor coordinates with all link control procedures and the data movement happens using aset of pointer registers

52 External ResetThe IS20xxS SoC provides a Watchdog Timer (WDT) to reset the SoC It has an integrated Power-on Reset (POR)circuit that resets all circuits to a known Power-on state This action is also driven by an external Reset signal whichis used to control the device externally by forcing it into a POR state The RST_N signal input is active-low and noconnection is required in most of the applications

53 Reference ClockThe IS20xxS SoC is composed of an integrated crystal oscillation function that uses a 16 MHz external crystal andtwo specified loading capacitors to provide a high quality system reference timer source Use this feature to removethe initial tolerance frequency errors which are associated with the crystal and its equivalent loading capacitance inthe mass production Achieve the frequency trim by adjusting the crystal loading capacitance through the on-chip trimcapacitors (Ctrim)

The value of the trimming capacitance is 200 fF (200x10-15 F) per LSB at the 5-bit word and the overall adjustableclock frequency is plusmn40 kHz The following figure illustrates the crystal connection of the IS20xxS SoC with twocapacitors

Figure 5-1 Crystal Connection

IS20XXS

XO_N

CL1

XO_P

CL2

IS2008SIS2010SIS2013SIS2015SMicrocontroller

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 20

Notes 1 Ctrim = 200 fF (1 to 31) Cint = 3 pF2 CL = [(CL1 x CL2) (CL1 + CL2)] + (Ctrim 2) + Cint (set trim value as 16 Ctrim = 32 pF)3 For a 16 MHz crystal where CL = 9 pF the CL1 = CL2 = 91 pF)4 For the CL selection refer to the data sheet of the crystal

IS2008SIS2010SIS2013SIS2015SMicrocontroller

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 21

6 Power Management Unit (PMU)The IS20xxS SoC has an integrated PMU The main features of the PMU are a lithium-ion battery charger and avoltage regulator A power switch is used to switch over the power source between a battery and an adapter Alsothe PMU provides current to the LED drivers

61 Charging a BatteryThe IS20xxS SoC has a built-in battery charger which is optimized for lithium-polymer batteries The battery chargerincludes a current sensor for a charging control user programmable current regulator and high accuracy voltageregulator

The charging current parameters are configured by using the UI (IS20XXS_UI) tool Whenever the adapter isplugged-in the charging circuit will be activated Reviving pre-charging constant current mode constant voltagemode and re-charging functions are implemented The maximum charging current is 350 mA The following figureillustrates the charging curve of a battery

Figure 6-1 Battery Charging Curve

62 Voltage MonitoringA 10-bit successive approximation register ADC (SAR ADC) provides a dedicated channel for battery voltage leveldetection The warning level is programmed by using the UI tool The ADC provides a granular resolution to enablethe MCU to take control over the charging process

63 Low Dropout RegulatorA built-in LDO Regulator is used to convert the battery or adapter power for the power supply It also integratesthe hardware architecture to control the power-onoff procedure The built-in programmable LDOs provide power forcodec and digital IO pads Also it is used to buffer the high input voltage from the battery or adapter This LDOrequires a 1 μF bypass capacitor

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 22

64 Switching RegulatorThe built-in programmable output voltage regulator converts the battery voltage to RF and base band core powersupply This converter has a high conversion efficiency and a fast transient response

65 LED DriverThe IS20xxS SoC consists of two LED drivers to control the LEDs The LED drivers provide enough sink current(16-step control and 035 mA for each step) and the LED is connected directly to the IS20xxS SoC

Note  Configure the LED settings using the IS20XXS_UI tool

The following figure illustrates the LED driver in the IS20xxS SoC

Figure 6-2 LED DRIVER

IS20xxS

LED2

SYS_PWR

LED1

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 23

7 Application InformationThis section describes the power supply connection host MCU UART interface and various modes in detail

71 Power SupplyThe following figure illustrates the connection from the BAT_IN pin to various other voltage supply pins of theIS20xxS SoC

The BAT_IN input pin powers the IS20xxS SoC To charge the battery connect the external 5V power adapter toADAP_IN

Figure 7-1 Power Tree Diagram

VDDA VDDAO

VDD_IO

3V LDO

18V Buck

SAR_VDD

LDO31_VIN

CODEC_VO

LDO31_VO

BK_VDD

BK_LX

BK_O

VDD_CORE

VCC_RF

12V LDOPMIC_IN

CLDO_O

RFLDO_O

PVDD_CDA

Li-Io

n BA

T BAT_IN

ADAP_IN

SYS_PWRPower Switch

5V Adapter

(42~30V)

(45~55V)(42~30V)

(30~27V)

(33 ~27V)

(18V)

(12V)

(128V)

72 Host MCU InterfaceAn external MCU controls the IS20xxS SoC using the UART command set The following figure illustrates the UARTinterface between the IS20xxS SoC and an external MCU

Figure 7-2 Host MCU Interface Over UART

IS20xxSHCI_TXD

HCI_RXD

PWR

P0_0

MCUUART_TX

UART_RX

MCU_WAKEUP

BT_WAKEUP

UART Interface

UART Interface

The MCU controls the IS20xxS SoC over the UART interface and wakes up the SoC using the PWR pin The MCUfunction wakes up by connecting to the P0_0 pin of the IS20xxS

Refer to the IS200xIS201xIS202x UART Command SOP document for a list of functions that the IS20xxS SoCsupports and how to use the IS20XXS_UI tool to set up the system using the UART command

Note  The IS200xIS201xIS202x UART Command SOP document is available for download from the Microchipwebsite at IS200xIS201xIS202x UART Command SOP

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 24

73 Timing Sequence of UART ApplicationThe following figures illustrate the various UART control signal timing sequences

Figure 7-3 Power-OnOff Sequence

BAT_IN

SYS_PWR

1 ms

Power- oninitial idle Power-on Power-on Power-off idle

MCU state

MFB (PWR)

BK_OLDO31_VO

400 ms

RST_N

MCU sends UART command (UART_RX)

UART Command

MCU sends power-off UART Command

Power-on ACK ACK ACKIS20xxS response UART state

(UART_TX)

Set ldquoPower-on Directlyrdquo boot

any

10 ms

20 msKeep all IS20xxSand MCU connection to low level

2s

(See Figure 7-4) (See Figure 7-5)

IS20xxS disconnect and auto power-off

gt 1s

Figure 7-4 Timing Sequence of RX Indication after Power-On

Resume 32 kHz mode

MFB (PWR)MCU sends UART command

MFB pulse must be longer than the UART command slot time

150 ms

2 ms 2 ms

Enter 32 kHz mode

1 ms

UART Command

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 25

Figure 7-5 Timing Sequence of Power-Off

BAT_IN +4V

MFB

MCU Sends RST_N

BK_OUT

LDO31_VO

UART Bus

2s 1s

IS20xxS Sends Power-off ACK

Notes 1 EEPROM clock = 100 kHz2 For a byte wire 001 ms x 32 clock x 2 = 640 μs3 It is recommended that ramp-down time be more than 640 μs during the power-off sequence to ensure safe

operation of the device

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 26

Figu

re 7

-6 

Tim

ing

Sequ

ence

of P

ower

-On

(NA

CK

)

BAT

_IN

SYS_

PWR

1 m

s Pow

er-

onin

itial

idle

Pow

er-o

nM

CU

sta

te

MFB

(PW

R)

BK_O

LD

O31

_VO

400

ms

RST

_N

MC

U s

ends

UAR

T co

mm

and

(UAR

T_R

X)

UAR

T C

omm

and

NAC

KPo

wer

-on

ACK

ACK

IS20

xxS

resp

onse

UAR

T st

ate

(UAR

T_TX

)

Set ldquo

Pow

er-o

n D

irect

lyrdquo b

oot

10 m

s

20 m

s

Ret

ry i

f AC

K is

not

rece

ived

200

ms

any

Wai

t

Max

imum

5 ti

mes

(1s)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 27

Figure 7-7 Reset Timing Sequence in Case of No Response from SoC to Host MCU

MFB (PWR)

MCU sends UART command UART

Command

UART Command

IS20xxS UART

If no response

RST_N

1ms

X ms1ms

1ms

1ms

Note  The MCU sends the UART command again when the SoC is not responding to its first UART command Ifthe SoC is not responding to the second UART command within X ms the MCU forces the system to reset

Figure 7-8 Timing Sequence of Power Drop Protection

BAT_IN +4V

RST_N from Reset IC

Power

SYS_PWR

IS20xxS

Reset OUT VDDGND

MCU Reset

Reset IC

29V

1 It is recommended that the battery be connected on a BAT_IN pin of the SoC for the power supply2 If an external power source or a power adapter is used to provide the power to the SoC (ADAP_IN) use a

voltage supervisor IC3 The RESET IC output pin must be open drain with delay time of le 10 ms and the recommended part is

TCM809SVNB713

74 General Purpose IO pinsThe following table provides the details of various functions that are mapped to the IO pins of the IS20xxS SoCand these IOs are configured by using the IS20XXS_UI tool The first button (Button 0) must be configured as thepower-onoff key and can be set using the PWR pin The remaining pins are configured for any one of the defaultfunctions (short press long press double press and combinations)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 28

Table 7-1 IO Pin Configuration

Sl No Pin Name Buttons Default Functions(1)

1 PowerMFB Button 0 PWR

2 P0_2 Button 1 PlayPause

3 P2_7 Button 2 Volume Up

4 P0_5 Button 3 Volume Down

5 P0_1 Button 4 FWD

6 P0_3 Button 5 REV

Note 1 These functions can be configured using the IS20XXS_UI tool

Few signals are generated to indicate or control outside devices The most popular applications are NFC for easypairing external audio amplifier for louder speaker and buzzer for indication

Table 7-2 IO Pins for Added Functions

Functions(1) IO Configurable Features

Slide switch P0_0P1_5

Buzzer P0_3

NFC detect P0_4P1_5

External amplifier enable P1_5

Note 1 These functions can be configured using the IS20XXS_UI tool

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 29

8 Antenna Placement RuleFor Bluetooth-enabled products the antenna placement affects the overall performance The antenna requires freespace to radiate RF signals and it must not be surrounded by the GND plane

The following figure illustrates a typical example of the good and poor antenna placement on the main applicationboard with the GND plane

Figure 8-1 Antenna Placement Examples

The following figure illustrates the keep-out area recommended for the PCB antenna

Figure 8-2 Keep-Out Area Recommended for PCB Antenna

Note  For additional information on the antenna placement refer to the antenna-specific data sheet from theantenna manufacturer

IS2008SIS2010SIS2013SIS2015SAntenna Placement Rule

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 30

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

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Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

continuedFeature IS2008S IS2010S IS2013S IS2015S

StereoMono Mono Mono Mono Mono

Package QFN QFN QFN QFN

Pin count 48 48 56 56

Dimensions (mm) 6x6 6x6 7x7 7x7

Audio DAC output 1-channel 1-channel 1-channel 1-channel

DAC (single-ended) SNR at28V (dB) -98 -98 -98 -98

DAC (capless) SNR at 28V(dB) -96 -96 -96 -96

ADC SNR at 28V (dB) -90 -90 -90 -90

I2S digital output No No No No

Analog Auxiliary-Input No No Yes Yes

Mono microphone 2 2 1 1

External audio amplifierinterface No No Yes Yes

Built-in CDA No No 1-channel 1-channel

UART Yes Yes Yes Yes

LED driver 2 2 2 2

Integrated DC-DC step-down regulator Yes Yes Yes Yes

DC 5V adapter input Yes Yes Yes Yes

Battery charger (350 mAmaximum) Yes Yes Yes Yes

GPIO 6 6 9 9

Button Support 6 6 6 6

NFC Yes Yes Yes Yes

Voice prompt Yes Yes Yes Yes

Multi-tone Yes Yes Yes Yes

DSP sound effect No No Yes Yes

Bluetooth Profiles

A2DP 12 12 12 12

AVRCP 15 15 15 15

HFP 16 16 16 16

HSP 11 11 11 11

PBAP 10 10 10 10

SPP No 10 No 10

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 9

22 Pin DetailsThe following figure illustrates the pin diagram of the IS2008S and IS2010S

Figure 2-2 IS2008S and IS2010S Pin Diagram

The following table provides the pin description of the IS2008S and IS2010S

Table 2-2 Pin Description

IS2008S andIS2010S Pin No Pin Type(1) Pin Name Description

1 P VCOM Internal biasing voltage for codec

2 I MICN2 Mic2 mono differential analog negative input

3 I MICP2 Mic2 mono differential analog positive input

4 I MICN1 Mic1 mono differential analog negative input

5 I MICP1 Mic1 mono differential analog positive input

6 P MICBIAS Electric microphone biasing voltage

7 P VDD_CORE Core 12V power input connect to CLDO_O pin

8 O P1_2 IO pin default pull-high input EEPROM clock SCL

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 10

continuedIS2008S and

IS2010S Pin No Pin Type(1) Pin Name Description

9 IO P1_3 IO pin default pull-high input EEPROM data SDA

10 I RST_N System Reset pin active when rising edge

11 P VDD_IO IO power supply input (27-33V) connect to LDO31_VOpin

12 IO P0_1

IO pin default pull-high input(2)

bull FWD key when class 2 RF (default) active-lowbull Class 1 TX control signal of external RF TR switch

active high

13 IO P1_5

IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0bull Slide switch detector active-lowbull Buzzer signal output

14 I HCI_RXD HCI UART data input

15 O HCI_TXD HCI UART data output

16 P CODEC_VO 31V LDO output for codec power

17 P LDO31_VIN 31V LDO input connect to SYS_PWR pin

18 P LDO31_VO 31V LDO output

19 P ADAP_IN 5V power adapter input

20 P BAT_IN 33-42V Li-ion battery input

21 - NC No Connection

22 P SAR_VDD SAR 18V input connect to BK_O pin

23 P SYS_PWR Power output which comes from BAT_IN or ADAP_IN

24 P BK_VDD 18V buck VDD Power Input connect to SYS_PWR pin

25 P BK_LX 18V buck pin for switch

26 P BK_O 18V buck feedback input

27 I PWR Multi function push button and power-on key

28 I LED2 LED Driver 2

29 I LED1 LED Driver 1

30 IO P0_3

IO pin default pull-high input(2)

bull REV key (default) active-lowbull Buzzer signal outputbull Out_Ind_1bull Class 1 RX control signal of external RF TR switch

active high

31 P CLDO_O 12V core LDO output

32 P PMIC_IN PMU blocks power input connect to BK_O pin

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 11

continuedIS2008S and

IS2010S Pin No Pin Type(1) Pin Name Description

33 P RFLDO_O 128V RF LDO output

34 P VBG Bandgap output reference for decoupling interference

35 P ULPC_VSUS ULPC 12V output power

36 I XO_N 16 MHz crystal input negative

37 I XO_P 16 MHz crystal input positive

38 P VCC_RF RF power input (128V) for both synthesizer and TXRXblock connect to RFLDO_O pin

39 IO RTX RF path (transmitreceive)

40 I P0_2IO pin default pull-high input(2)

PlayPause key (default) active-low

41 I P2_0IO pin default pull-high input system configuration

H Application L Baseband (IBDK mode)

42 I P2_7IO pin default pull high input(2)

Volume up key (default) active-low

43 I P0_5IO pin default pull high input(2)

Volume down (default) active-low

44 P VDD_IO IO power supply input (27-33V) connect to LDO31_VOpin

45 P VDD_AOPositive power supply dedicated to codec outputamplifiers connect to CODEC_VO pin

46 O AOHPM Headphone common mode outputsense input

47 O AOHPL Left channel analog headphone output

48 P VDDA Positive power supplyreference voltage for codecconnect to CODEC_VO pin

49 P EP Exposed pads used as ground (GND) pins

Notes 1 The conventions used in the table are indicated as follows

ndash I = Input pinndash O = Output pinndash IO = InputOutput pinndash P = Power pin

2 All IO pins are configured using the IS20XXS_UI tool a Windowsreg-based utility

The following figure illustrates the pin diagram of the IS2013S and IS2015S

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 12

Figure 2-3 IS2013S and IS2015S Pin Diagram

The following table provides the pin description of the IS2013SIS2015S

Table 2-3 Pin Description

IS2013S andIS2015S Pin No Pin Type(1) Pin Name Description

1 P VDDAO Positive power supply dedicated to codec output amplifiersConnect to CODEC_VO pin

2 O AOHPM Headphone common mode outputsense input

3 O AOHPL Left channel analog headphone output

4 P VDDA Positive power supplyreference voltage for codec connect toCODEC_VO pin

5 P VCOM Internal biasing voltage for codec

6 I MICN1 Mic1 mono differential analog negative input

7 I MICP1 Mic1 mono differential analog positive input

8 P MICBIAS Electric microphone biasing voltage

9 I AIL Left channel single-ended analog inputs

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 13

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

10 P VDD_CORE Core 12V power input connect to CLDO_O pin

11 O P1_2 IO pin default pull high input EEPROM clock SCL

12 IO P1_3 IO pin default pull high input EEPROM data SDA

13 I RST_N System Reset pin active when rising edge

14 P VDD_IO IO power supply input (27-33V) connect to LDO31_VO pin

15 IO P0_1

IO pin default pull-high input(2)

bull FWD key when class 2 RF (default) active-lowbull Class 1 TX Control signal of external RF TR switch

active high

16 I P2_4IO pin default pull high input system configuration

L Boot mode with P2_0 low combination

17 IO P0_4IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0

18 IO P1_5

IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0bull Slide switch detector active-lowbull Buzzer signal output

19 I HCI_RXD HCI UART input data

20 O HCI_TXD HCI UART output data

21 P CODEC_VO 31V LDO output for codec power

22 P LDO31_VIN 31V LDO input connect to SYS_PWR pin

23 P LDO31_VO 31V LDO output

24 P ADAP_IN 5V power adapter input

25 P BAT_IN 33 to 42V Li-ion battery input

26 P SAR_VDD SAR 18V input connect to BK_O pin

27 P SYS_PWR Power output which come from BAT_IN or ADAP_IN

28 P LDO18_VDD 18V LDO VDD Power Input connect to SYS_PWR pin

29 P LDO18_O 18V LDO output

30 I PWR Multi-Function Push button and power on key

31 - NC No Connection

32 I LED2 LED Driver 2

33 I LED1 LED Driver 1

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 14

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

34 IO P0_0IO pin default pull-high input(2)

bull Slide switch detector active-lowbull UARTTX_IND active-low

35 IO P0_3

IO pin default pull-high input(2)

bull REV key (default) active-lowbull Buzzer signal outputbull Out_Ind_1bull Class 1 RX control signal of external RF TR switch

active high

36 I EANEmbedded ROMExternal Flash enable

H Embedded L External Flash

37 P CLDO_O 12V core LDO output

38 P PMIC_IN PMU blocks power input connect to BK_O pin

39 P RFLDO_O 128V RF LDO output

40 P VBG Bandgap output reference for decoupling interference

41 P ULPC_VSUS ULPC 12V output power

42 I XO_N 16 MHz crystal input negative

43 I XO_P 16 MHz crystal input positive

44 P VCC_RFRF power input (128V) for both synthesizer and TXRXblock connect to RFLDO_O pin

45 IO RTX RF path (transmitreceive)

46 I P0_2IO pin default pull-high input(2)

PlayPause key (default) active-low

47 I P2_0IO pin default pull-high input system configuration

H Application L Baseband (IBDK mode)

48 I P2_7IO pin default pull-high input(2)

Volume up key (default) active-low

49 I P3_0IO pin default pull-high input(2)

Line-in detector (default) active-low

50 I P0_5IO pin default pull-high input(2)

Volume down (default) active-low

51 P VDD_IO IO power supply input (27-33V) connect to LDO31_VO pin

52 P AVDD_CDA Supply voltage of audio amplifier

53 P VBP_CDA Reference voltage output

54 O HPON_CDA Negative BTL output of channel-1

55 O HPOP_CDA Positive BTL output of channel-1

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 15

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

56 P PVDD_CDA Supply voltage of power stage ch-1

57 P EP Exposed pads used as ground (GND) pins

Notes 1 The conventions used in the table are indicated as follows

ndash I = Input pinndash O = Output pinndash IO = InputOutput pinndash P = Power pin

2 All IO pins are configured using the UI tool a Windows-based utility

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 16

3 AudioThe input and output audio signals have different stages and each stage is programmed to vary the gain responsecharacteristics For microphones both single-ended inputs and differential inputs are supported To maintain ahigh-quality signal provide a stable bias voltage source to the condenser microphonersquos FET Use the DC-blockingcapacitors at both positive and negative sides of the input Internally this analog signal is converted to 16-bit 8 kHzlinear PCM data

31 Digital Signal ProcessorA Digital Signal Processor (DSP) is used to perform speech and audio processing The advanced speech featuressuch as acoustic echo cancellation and noise reduction are built in To reduce nonlinear distortion and to help echocancellation an outgoing signal level to the speaker is monitored and adjusted to avoid saturation of the speakeroutput or microphone input Adaptive filtering is also applied to track the echo path impulse in response to provide anecho-free and full-duplex user experience

The embedded noise reduction algorithm helps to extract clean speech signals from the noisy inputs capturedby microphones and improves mutual understanding in communication The advanced audio features such asmulti-band dynamic range control parametric multi-band equalizer audio widening and virtual bass are built in Theaudio effect algorithms improve the userrsquos audio listening experience in terms of better quality audio after audiosignal processing

The following figures illustrate the processing flow of speakerphone applications for speech and audio signalprocessing

Figure 3-1 Speech Processing

Figure 3-2 Audio Processing

The DSP parameters such as EQ Speaker Gain Mic Gain Sound Effect and more are configured using the DSPtool For additional information on the DSP tool refer to the IS20xxBM1xBM2x DSP Application Note

IS2008SIS2010SIS2013SIS2015SAudio

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 17

Note  The DSP tool and IS20xxBM1xBM2x DSP Application Note are available for download at the Microchipwebsite

32 CodecThe built-in codec has a high SNR performance and it consists of an ADC a DAC and additional analog circuitry

33 Auxiliary PortThe SoC supports one analog (line-in) signal from the external audio source The analog signal is processed bythe DSP to generate different sound effects (multi-band dynamic range compression and audio widening) which areconfigured using the DSP tool

34 Class D Audio AmplifierThe Class D amplifier has a significant advantage in many applications due to its lower power dissipation whichproduces less heat The IS2013S and IS2015S SoC have a built-in Class D amplifier that reduces circuit board spaceand system cost The efficiency of the amplifier extends the battery life in portable systems

The Class D amplifier is implemented by using a full-bridge output stage A full bridge uses two half-bridge stages todrive the load differentially The Class D amplifier provides a good SNR and enough drive capability for a 4Ω speakerdriver

IS2008SIS2010SIS2013SIS2015SAudio

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 18

4 TransceiverThe SoC is designed and optimized for Bluetooth 24 GHz systems It contains a complete radio frequencytransmitterreceiver section An internal synthesizer generates a stable clock to synchronize with another device

41 TransmitterThe internal Power Amplifier (PA) has a maximum output power of +4 dBm with 20 dB power level control Applythis to Class 2 or Class 3 radios without an external RF PA The transmitter directly performs the IQ conversionto minimize the frequency drift and it can access the 20 dB power range with the temperature compensationmechanism

42 ReceiverThe Low-Noise Amplifier (LNA) operates with TR-combined mode for the single port application It saves the pin onthe package without having an external TXRX switch

The ADC is used to sample the input analog signal and convert it into a digital signal for demodulator analysisA channel filter is integrated into a receiver channel before the ADC to reduce the external component count andincrease the anti-interference capability

The image rejection filter is used to reject the image frequency for the low-IF architecture and it is also intended toreduce the external Band Pass Filter (BPF) component for a super heterodyne architecture

The Received Signal Strength Indicator (RSSI) signal feedback to the processor is used to control the RF outputpower to make a good trade-off for effective distance and current consumption

43 SynthesizerA synthesizer generates a clock for radio transceiver operation The VCO inside with a tunable internal LC tankcan reduce any variation for components A crystal oscillator with an internal digital trimming circuit provides a stableclock for the synthesizer

44 ModemFor Bluetooth 12 specifications and below 1 Mbps is the standard data rate based on the Gaussian Frequency ShiftKeying (GFSK) modulation scheme This basic rate modem meets BDR requirements of Bluetooth 20 with EDRspecifications

For Bluetooth 20 and above specifications EDR is introduced to provide the data rates of 123 Mbps Thisenhanced data rate modem meets EDR requirements of Bluetooth 20 with EDR specifications For the basebandboth BDR and EDR utilize the same 1 MHz symbol rate and 16 kHz slot rate For BDR 1 symbol represents 1-bitHowever each symbol in the payload part of the EDR packets represents 2-bit or 3-bit This is achieved by using twodifferent modulations π4 DQPSK and 8 DPSK

45 Adaptive Frequency Hopping (AFH)The SoC has an AFH function to avoid RF interference It has an algorithm to check the nearby interference and tochoose the clear channel for the transceiver Bluetooth signal

IS2008SIS2010SIS2013SIS2015STransceiver

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 19

5 MicrocontrollerA single-cycle 8-bit microcontroller is built into the SoC to execute the Bluetooth protocols It operates from 16 MHzto higher frequencies where the firmware dynamically adjusts the trade-off between the computing power and thepower consumption In the ROM version the MCU firmware is hard-wired to minimize power consumption for thefirmware execution and to save the external Flash cost

51 MemoryThere are sufficient ROM and RAM to fulfill the processor requirements in which a synchronous single port RAMinterface is used The register bank dedicated single port memory and Flash memory are connected to theprocessor bus The processor coordinates with all link control procedures and the data movement happens using aset of pointer registers

52 External ResetThe IS20xxS SoC provides a Watchdog Timer (WDT) to reset the SoC It has an integrated Power-on Reset (POR)circuit that resets all circuits to a known Power-on state This action is also driven by an external Reset signal whichis used to control the device externally by forcing it into a POR state The RST_N signal input is active-low and noconnection is required in most of the applications

53 Reference ClockThe IS20xxS SoC is composed of an integrated crystal oscillation function that uses a 16 MHz external crystal andtwo specified loading capacitors to provide a high quality system reference timer source Use this feature to removethe initial tolerance frequency errors which are associated with the crystal and its equivalent loading capacitance inthe mass production Achieve the frequency trim by adjusting the crystal loading capacitance through the on-chip trimcapacitors (Ctrim)

The value of the trimming capacitance is 200 fF (200x10-15 F) per LSB at the 5-bit word and the overall adjustableclock frequency is plusmn40 kHz The following figure illustrates the crystal connection of the IS20xxS SoC with twocapacitors

Figure 5-1 Crystal Connection

IS20XXS

XO_N

CL1

XO_P

CL2

IS2008SIS2010SIS2013SIS2015SMicrocontroller

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Datasheet DS70005472A-page 20

Notes 1 Ctrim = 200 fF (1 to 31) Cint = 3 pF2 CL = [(CL1 x CL2) (CL1 + CL2)] + (Ctrim 2) + Cint (set trim value as 16 Ctrim = 32 pF)3 For a 16 MHz crystal where CL = 9 pF the CL1 = CL2 = 91 pF)4 For the CL selection refer to the data sheet of the crystal

IS2008SIS2010SIS2013SIS2015SMicrocontroller

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 21

6 Power Management Unit (PMU)The IS20xxS SoC has an integrated PMU The main features of the PMU are a lithium-ion battery charger and avoltage regulator A power switch is used to switch over the power source between a battery and an adapter Alsothe PMU provides current to the LED drivers

61 Charging a BatteryThe IS20xxS SoC has a built-in battery charger which is optimized for lithium-polymer batteries The battery chargerincludes a current sensor for a charging control user programmable current regulator and high accuracy voltageregulator

The charging current parameters are configured by using the UI (IS20XXS_UI) tool Whenever the adapter isplugged-in the charging circuit will be activated Reviving pre-charging constant current mode constant voltagemode and re-charging functions are implemented The maximum charging current is 350 mA The following figureillustrates the charging curve of a battery

Figure 6-1 Battery Charging Curve

62 Voltage MonitoringA 10-bit successive approximation register ADC (SAR ADC) provides a dedicated channel for battery voltage leveldetection The warning level is programmed by using the UI tool The ADC provides a granular resolution to enablethe MCU to take control over the charging process

63 Low Dropout RegulatorA built-in LDO Regulator is used to convert the battery or adapter power for the power supply It also integratesthe hardware architecture to control the power-onoff procedure The built-in programmable LDOs provide power forcodec and digital IO pads Also it is used to buffer the high input voltage from the battery or adapter This LDOrequires a 1 μF bypass capacitor

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 22

64 Switching RegulatorThe built-in programmable output voltage regulator converts the battery voltage to RF and base band core powersupply This converter has a high conversion efficiency and a fast transient response

65 LED DriverThe IS20xxS SoC consists of two LED drivers to control the LEDs The LED drivers provide enough sink current(16-step control and 035 mA for each step) and the LED is connected directly to the IS20xxS SoC

Note  Configure the LED settings using the IS20XXS_UI tool

The following figure illustrates the LED driver in the IS20xxS SoC

Figure 6-2 LED DRIVER

IS20xxS

LED2

SYS_PWR

LED1

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 23

7 Application InformationThis section describes the power supply connection host MCU UART interface and various modes in detail

71 Power SupplyThe following figure illustrates the connection from the BAT_IN pin to various other voltage supply pins of theIS20xxS SoC

The BAT_IN input pin powers the IS20xxS SoC To charge the battery connect the external 5V power adapter toADAP_IN

Figure 7-1 Power Tree Diagram

VDDA VDDAO

VDD_IO

3V LDO

18V Buck

SAR_VDD

LDO31_VIN

CODEC_VO

LDO31_VO

BK_VDD

BK_LX

BK_O

VDD_CORE

VCC_RF

12V LDOPMIC_IN

CLDO_O

RFLDO_O

PVDD_CDA

Li-Io

n BA

T BAT_IN

ADAP_IN

SYS_PWRPower Switch

5V Adapter

(42~30V)

(45~55V)(42~30V)

(30~27V)

(33 ~27V)

(18V)

(12V)

(128V)

72 Host MCU InterfaceAn external MCU controls the IS20xxS SoC using the UART command set The following figure illustrates the UARTinterface between the IS20xxS SoC and an external MCU

Figure 7-2 Host MCU Interface Over UART

IS20xxSHCI_TXD

HCI_RXD

PWR

P0_0

MCUUART_TX

UART_RX

MCU_WAKEUP

BT_WAKEUP

UART Interface

UART Interface

The MCU controls the IS20xxS SoC over the UART interface and wakes up the SoC using the PWR pin The MCUfunction wakes up by connecting to the P0_0 pin of the IS20xxS

Refer to the IS200xIS201xIS202x UART Command SOP document for a list of functions that the IS20xxS SoCsupports and how to use the IS20XXS_UI tool to set up the system using the UART command

Note  The IS200xIS201xIS202x UART Command SOP document is available for download from the Microchipwebsite at IS200xIS201xIS202x UART Command SOP

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 24

73 Timing Sequence of UART ApplicationThe following figures illustrate the various UART control signal timing sequences

Figure 7-3 Power-OnOff Sequence

BAT_IN

SYS_PWR

1 ms

Power- oninitial idle Power-on Power-on Power-off idle

MCU state

MFB (PWR)

BK_OLDO31_VO

400 ms

RST_N

MCU sends UART command (UART_RX)

UART Command

MCU sends power-off UART Command

Power-on ACK ACK ACKIS20xxS response UART state

(UART_TX)

Set ldquoPower-on Directlyrdquo boot

any

10 ms

20 msKeep all IS20xxSand MCU connection to low level

2s

(See Figure 7-4) (See Figure 7-5)

IS20xxS disconnect and auto power-off

gt 1s

Figure 7-4 Timing Sequence of RX Indication after Power-On

Resume 32 kHz mode

MFB (PWR)MCU sends UART command

MFB pulse must be longer than the UART command slot time

150 ms

2 ms 2 ms

Enter 32 kHz mode

1 ms

UART Command

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 25

Figure 7-5 Timing Sequence of Power-Off

BAT_IN +4V

MFB

MCU Sends RST_N

BK_OUT

LDO31_VO

UART Bus

2s 1s

IS20xxS Sends Power-off ACK

Notes 1 EEPROM clock = 100 kHz2 For a byte wire 001 ms x 32 clock x 2 = 640 μs3 It is recommended that ramp-down time be more than 640 μs during the power-off sequence to ensure safe

operation of the device

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 26

Figu

re 7

-6 

Tim

ing

Sequ

ence

of P

ower

-On

(NA

CK

)

BAT

_IN

SYS_

PWR

1 m

s Pow

er-

onin

itial

idle

Pow

er-o

nM

CU

sta

te

MFB

(PW

R)

BK_O

LD

O31

_VO

400

ms

RST

_N

MC

U s

ends

UAR

T co

mm

and

(UAR

T_R

X)

UAR

T C

omm

and

NAC

KPo

wer

-on

ACK

ACK

IS20

xxS

resp

onse

UAR

T st

ate

(UAR

T_TX

)

Set ldquo

Pow

er-o

n D

irect

lyrdquo b

oot

10 m

s

20 m

s

Ret

ry i

f AC

K is

not

rece

ived

200

ms

any

Wai

t

Max

imum

5 ti

mes

(1s)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 27

Figure 7-7 Reset Timing Sequence in Case of No Response from SoC to Host MCU

MFB (PWR)

MCU sends UART command UART

Command

UART Command

IS20xxS UART

If no response

RST_N

1ms

X ms1ms

1ms

1ms

Note  The MCU sends the UART command again when the SoC is not responding to its first UART command Ifthe SoC is not responding to the second UART command within X ms the MCU forces the system to reset

Figure 7-8 Timing Sequence of Power Drop Protection

BAT_IN +4V

RST_N from Reset IC

Power

SYS_PWR

IS20xxS

Reset OUT VDDGND

MCU Reset

Reset IC

29V

1 It is recommended that the battery be connected on a BAT_IN pin of the SoC for the power supply2 If an external power source or a power adapter is used to provide the power to the SoC (ADAP_IN) use a

voltage supervisor IC3 The RESET IC output pin must be open drain with delay time of le 10 ms and the recommended part is

TCM809SVNB713

74 General Purpose IO pinsThe following table provides the details of various functions that are mapped to the IO pins of the IS20xxS SoCand these IOs are configured by using the IS20XXS_UI tool The first button (Button 0) must be configured as thepower-onoff key and can be set using the PWR pin The remaining pins are configured for any one of the defaultfunctions (short press long press double press and combinations)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 28

Table 7-1 IO Pin Configuration

Sl No Pin Name Buttons Default Functions(1)

1 PowerMFB Button 0 PWR

2 P0_2 Button 1 PlayPause

3 P2_7 Button 2 Volume Up

4 P0_5 Button 3 Volume Down

5 P0_1 Button 4 FWD

6 P0_3 Button 5 REV

Note 1 These functions can be configured using the IS20XXS_UI tool

Few signals are generated to indicate or control outside devices The most popular applications are NFC for easypairing external audio amplifier for louder speaker and buzzer for indication

Table 7-2 IO Pins for Added Functions

Functions(1) IO Configurable Features

Slide switch P0_0P1_5

Buzzer P0_3

NFC detect P0_4P1_5

External amplifier enable P1_5

Note 1 These functions can be configured using the IS20XXS_UI tool

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 29

8 Antenna Placement RuleFor Bluetooth-enabled products the antenna placement affects the overall performance The antenna requires freespace to radiate RF signals and it must not be surrounded by the GND plane

The following figure illustrates a typical example of the good and poor antenna placement on the main applicationboard with the GND plane

Figure 8-1 Antenna Placement Examples

The following figure illustrates the keep-out area recommended for the PCB antenna

Figure 8-2 Keep-Out Area Recommended for PCB Antenna

Note  For additional information on the antenna placement refer to the antenna-specific data sheet from theantenna manufacturer

IS2008SIS2010SIS2013SIS2015SAntenna Placement Rule

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 30

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

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Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

22 Pin DetailsThe following figure illustrates the pin diagram of the IS2008S and IS2010S

Figure 2-2 IS2008S and IS2010S Pin Diagram

The following table provides the pin description of the IS2008S and IS2010S

Table 2-2 Pin Description

IS2008S andIS2010S Pin No Pin Type(1) Pin Name Description

1 P VCOM Internal biasing voltage for codec

2 I MICN2 Mic2 mono differential analog negative input

3 I MICP2 Mic2 mono differential analog positive input

4 I MICN1 Mic1 mono differential analog negative input

5 I MICP1 Mic1 mono differential analog positive input

6 P MICBIAS Electric microphone biasing voltage

7 P VDD_CORE Core 12V power input connect to CLDO_O pin

8 O P1_2 IO pin default pull-high input EEPROM clock SCL

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 10

continuedIS2008S and

IS2010S Pin No Pin Type(1) Pin Name Description

9 IO P1_3 IO pin default pull-high input EEPROM data SDA

10 I RST_N System Reset pin active when rising edge

11 P VDD_IO IO power supply input (27-33V) connect to LDO31_VOpin

12 IO P0_1

IO pin default pull-high input(2)

bull FWD key when class 2 RF (default) active-lowbull Class 1 TX control signal of external RF TR switch

active high

13 IO P1_5

IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0bull Slide switch detector active-lowbull Buzzer signal output

14 I HCI_RXD HCI UART data input

15 O HCI_TXD HCI UART data output

16 P CODEC_VO 31V LDO output for codec power

17 P LDO31_VIN 31V LDO input connect to SYS_PWR pin

18 P LDO31_VO 31V LDO output

19 P ADAP_IN 5V power adapter input

20 P BAT_IN 33-42V Li-ion battery input

21 - NC No Connection

22 P SAR_VDD SAR 18V input connect to BK_O pin

23 P SYS_PWR Power output which comes from BAT_IN or ADAP_IN

24 P BK_VDD 18V buck VDD Power Input connect to SYS_PWR pin

25 P BK_LX 18V buck pin for switch

26 P BK_O 18V buck feedback input

27 I PWR Multi function push button and power-on key

28 I LED2 LED Driver 2

29 I LED1 LED Driver 1

30 IO P0_3

IO pin default pull-high input(2)

bull REV key (default) active-lowbull Buzzer signal outputbull Out_Ind_1bull Class 1 RX control signal of external RF TR switch

active high

31 P CLDO_O 12V core LDO output

32 P PMIC_IN PMU blocks power input connect to BK_O pin

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 11

continuedIS2008S and

IS2010S Pin No Pin Type(1) Pin Name Description

33 P RFLDO_O 128V RF LDO output

34 P VBG Bandgap output reference for decoupling interference

35 P ULPC_VSUS ULPC 12V output power

36 I XO_N 16 MHz crystal input negative

37 I XO_P 16 MHz crystal input positive

38 P VCC_RF RF power input (128V) for both synthesizer and TXRXblock connect to RFLDO_O pin

39 IO RTX RF path (transmitreceive)

40 I P0_2IO pin default pull-high input(2)

PlayPause key (default) active-low

41 I P2_0IO pin default pull-high input system configuration

H Application L Baseband (IBDK mode)

42 I P2_7IO pin default pull high input(2)

Volume up key (default) active-low

43 I P0_5IO pin default pull high input(2)

Volume down (default) active-low

44 P VDD_IO IO power supply input (27-33V) connect to LDO31_VOpin

45 P VDD_AOPositive power supply dedicated to codec outputamplifiers connect to CODEC_VO pin

46 O AOHPM Headphone common mode outputsense input

47 O AOHPL Left channel analog headphone output

48 P VDDA Positive power supplyreference voltage for codecconnect to CODEC_VO pin

49 P EP Exposed pads used as ground (GND) pins

Notes 1 The conventions used in the table are indicated as follows

ndash I = Input pinndash O = Output pinndash IO = InputOutput pinndash P = Power pin

2 All IO pins are configured using the IS20XXS_UI tool a Windowsreg-based utility

The following figure illustrates the pin diagram of the IS2013S and IS2015S

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 12

Figure 2-3 IS2013S and IS2015S Pin Diagram

The following table provides the pin description of the IS2013SIS2015S

Table 2-3 Pin Description

IS2013S andIS2015S Pin No Pin Type(1) Pin Name Description

1 P VDDAO Positive power supply dedicated to codec output amplifiersConnect to CODEC_VO pin

2 O AOHPM Headphone common mode outputsense input

3 O AOHPL Left channel analog headphone output

4 P VDDA Positive power supplyreference voltage for codec connect toCODEC_VO pin

5 P VCOM Internal biasing voltage for codec

6 I MICN1 Mic1 mono differential analog negative input

7 I MICP1 Mic1 mono differential analog positive input

8 P MICBIAS Electric microphone biasing voltage

9 I AIL Left channel single-ended analog inputs

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 13

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

10 P VDD_CORE Core 12V power input connect to CLDO_O pin

11 O P1_2 IO pin default pull high input EEPROM clock SCL

12 IO P1_3 IO pin default pull high input EEPROM data SDA

13 I RST_N System Reset pin active when rising edge

14 P VDD_IO IO power supply input (27-33V) connect to LDO31_VO pin

15 IO P0_1

IO pin default pull-high input(2)

bull FWD key when class 2 RF (default) active-lowbull Class 1 TX Control signal of external RF TR switch

active high

16 I P2_4IO pin default pull high input system configuration

L Boot mode with P2_0 low combination

17 IO P0_4IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0

18 IO P1_5

IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0bull Slide switch detector active-lowbull Buzzer signal output

19 I HCI_RXD HCI UART input data

20 O HCI_TXD HCI UART output data

21 P CODEC_VO 31V LDO output for codec power

22 P LDO31_VIN 31V LDO input connect to SYS_PWR pin

23 P LDO31_VO 31V LDO output

24 P ADAP_IN 5V power adapter input

25 P BAT_IN 33 to 42V Li-ion battery input

26 P SAR_VDD SAR 18V input connect to BK_O pin

27 P SYS_PWR Power output which come from BAT_IN or ADAP_IN

28 P LDO18_VDD 18V LDO VDD Power Input connect to SYS_PWR pin

29 P LDO18_O 18V LDO output

30 I PWR Multi-Function Push button and power on key

31 - NC No Connection

32 I LED2 LED Driver 2

33 I LED1 LED Driver 1

IS2008SIS2010SIS2013SIS2015SDevice Overview

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Datasheet DS70005472A-page 14

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

34 IO P0_0IO pin default pull-high input(2)

bull Slide switch detector active-lowbull UARTTX_IND active-low

35 IO P0_3

IO pin default pull-high input(2)

bull REV key (default) active-lowbull Buzzer signal outputbull Out_Ind_1bull Class 1 RX control signal of external RF TR switch

active high

36 I EANEmbedded ROMExternal Flash enable

H Embedded L External Flash

37 P CLDO_O 12V core LDO output

38 P PMIC_IN PMU blocks power input connect to BK_O pin

39 P RFLDO_O 128V RF LDO output

40 P VBG Bandgap output reference for decoupling interference

41 P ULPC_VSUS ULPC 12V output power

42 I XO_N 16 MHz crystal input negative

43 I XO_P 16 MHz crystal input positive

44 P VCC_RFRF power input (128V) for both synthesizer and TXRXblock connect to RFLDO_O pin

45 IO RTX RF path (transmitreceive)

46 I P0_2IO pin default pull-high input(2)

PlayPause key (default) active-low

47 I P2_0IO pin default pull-high input system configuration

H Application L Baseband (IBDK mode)

48 I P2_7IO pin default pull-high input(2)

Volume up key (default) active-low

49 I P3_0IO pin default pull-high input(2)

Line-in detector (default) active-low

50 I P0_5IO pin default pull-high input(2)

Volume down (default) active-low

51 P VDD_IO IO power supply input (27-33V) connect to LDO31_VO pin

52 P AVDD_CDA Supply voltage of audio amplifier

53 P VBP_CDA Reference voltage output

54 O HPON_CDA Negative BTL output of channel-1

55 O HPOP_CDA Positive BTL output of channel-1

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Datasheet DS70005472A-page 15

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

56 P PVDD_CDA Supply voltage of power stage ch-1

57 P EP Exposed pads used as ground (GND) pins

Notes 1 The conventions used in the table are indicated as follows

ndash I = Input pinndash O = Output pinndash IO = InputOutput pinndash P = Power pin

2 All IO pins are configured using the UI tool a Windows-based utility

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 16

3 AudioThe input and output audio signals have different stages and each stage is programmed to vary the gain responsecharacteristics For microphones both single-ended inputs and differential inputs are supported To maintain ahigh-quality signal provide a stable bias voltage source to the condenser microphonersquos FET Use the DC-blockingcapacitors at both positive and negative sides of the input Internally this analog signal is converted to 16-bit 8 kHzlinear PCM data

31 Digital Signal ProcessorA Digital Signal Processor (DSP) is used to perform speech and audio processing The advanced speech featuressuch as acoustic echo cancellation and noise reduction are built in To reduce nonlinear distortion and to help echocancellation an outgoing signal level to the speaker is monitored and adjusted to avoid saturation of the speakeroutput or microphone input Adaptive filtering is also applied to track the echo path impulse in response to provide anecho-free and full-duplex user experience

The embedded noise reduction algorithm helps to extract clean speech signals from the noisy inputs capturedby microphones and improves mutual understanding in communication The advanced audio features such asmulti-band dynamic range control parametric multi-band equalizer audio widening and virtual bass are built in Theaudio effect algorithms improve the userrsquos audio listening experience in terms of better quality audio after audiosignal processing

The following figures illustrate the processing flow of speakerphone applications for speech and audio signalprocessing

Figure 3-1 Speech Processing

Figure 3-2 Audio Processing

The DSP parameters such as EQ Speaker Gain Mic Gain Sound Effect and more are configured using the DSPtool For additional information on the DSP tool refer to the IS20xxBM1xBM2x DSP Application Note

IS2008SIS2010SIS2013SIS2015SAudio

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 17

Note  The DSP tool and IS20xxBM1xBM2x DSP Application Note are available for download at the Microchipwebsite

32 CodecThe built-in codec has a high SNR performance and it consists of an ADC a DAC and additional analog circuitry

33 Auxiliary PortThe SoC supports one analog (line-in) signal from the external audio source The analog signal is processed bythe DSP to generate different sound effects (multi-band dynamic range compression and audio widening) which areconfigured using the DSP tool

34 Class D Audio AmplifierThe Class D amplifier has a significant advantage in many applications due to its lower power dissipation whichproduces less heat The IS2013S and IS2015S SoC have a built-in Class D amplifier that reduces circuit board spaceand system cost The efficiency of the amplifier extends the battery life in portable systems

The Class D amplifier is implemented by using a full-bridge output stage A full bridge uses two half-bridge stages todrive the load differentially The Class D amplifier provides a good SNR and enough drive capability for a 4Ω speakerdriver

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Datasheet DS70005472A-page 18

4 TransceiverThe SoC is designed and optimized for Bluetooth 24 GHz systems It contains a complete radio frequencytransmitterreceiver section An internal synthesizer generates a stable clock to synchronize with another device

41 TransmitterThe internal Power Amplifier (PA) has a maximum output power of +4 dBm with 20 dB power level control Applythis to Class 2 or Class 3 radios without an external RF PA The transmitter directly performs the IQ conversionto minimize the frequency drift and it can access the 20 dB power range with the temperature compensationmechanism

42 ReceiverThe Low-Noise Amplifier (LNA) operates with TR-combined mode for the single port application It saves the pin onthe package without having an external TXRX switch

The ADC is used to sample the input analog signal and convert it into a digital signal for demodulator analysisA channel filter is integrated into a receiver channel before the ADC to reduce the external component count andincrease the anti-interference capability

The image rejection filter is used to reject the image frequency for the low-IF architecture and it is also intended toreduce the external Band Pass Filter (BPF) component for a super heterodyne architecture

The Received Signal Strength Indicator (RSSI) signal feedback to the processor is used to control the RF outputpower to make a good trade-off for effective distance and current consumption

43 SynthesizerA synthesizer generates a clock for radio transceiver operation The VCO inside with a tunable internal LC tankcan reduce any variation for components A crystal oscillator with an internal digital trimming circuit provides a stableclock for the synthesizer

44 ModemFor Bluetooth 12 specifications and below 1 Mbps is the standard data rate based on the Gaussian Frequency ShiftKeying (GFSK) modulation scheme This basic rate modem meets BDR requirements of Bluetooth 20 with EDRspecifications

For Bluetooth 20 and above specifications EDR is introduced to provide the data rates of 123 Mbps Thisenhanced data rate modem meets EDR requirements of Bluetooth 20 with EDR specifications For the basebandboth BDR and EDR utilize the same 1 MHz symbol rate and 16 kHz slot rate For BDR 1 symbol represents 1-bitHowever each symbol in the payload part of the EDR packets represents 2-bit or 3-bit This is achieved by using twodifferent modulations π4 DQPSK and 8 DPSK

45 Adaptive Frequency Hopping (AFH)The SoC has an AFH function to avoid RF interference It has an algorithm to check the nearby interference and tochoose the clear channel for the transceiver Bluetooth signal

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Datasheet DS70005472A-page 19

5 MicrocontrollerA single-cycle 8-bit microcontroller is built into the SoC to execute the Bluetooth protocols It operates from 16 MHzto higher frequencies where the firmware dynamically adjusts the trade-off between the computing power and thepower consumption In the ROM version the MCU firmware is hard-wired to minimize power consumption for thefirmware execution and to save the external Flash cost

51 MemoryThere are sufficient ROM and RAM to fulfill the processor requirements in which a synchronous single port RAMinterface is used The register bank dedicated single port memory and Flash memory are connected to theprocessor bus The processor coordinates with all link control procedures and the data movement happens using aset of pointer registers

52 External ResetThe IS20xxS SoC provides a Watchdog Timer (WDT) to reset the SoC It has an integrated Power-on Reset (POR)circuit that resets all circuits to a known Power-on state This action is also driven by an external Reset signal whichis used to control the device externally by forcing it into a POR state The RST_N signal input is active-low and noconnection is required in most of the applications

53 Reference ClockThe IS20xxS SoC is composed of an integrated crystal oscillation function that uses a 16 MHz external crystal andtwo specified loading capacitors to provide a high quality system reference timer source Use this feature to removethe initial tolerance frequency errors which are associated with the crystal and its equivalent loading capacitance inthe mass production Achieve the frequency trim by adjusting the crystal loading capacitance through the on-chip trimcapacitors (Ctrim)

The value of the trimming capacitance is 200 fF (200x10-15 F) per LSB at the 5-bit word and the overall adjustableclock frequency is plusmn40 kHz The following figure illustrates the crystal connection of the IS20xxS SoC with twocapacitors

Figure 5-1 Crystal Connection

IS20XXS

XO_N

CL1

XO_P

CL2

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Datasheet DS70005472A-page 20

Notes 1 Ctrim = 200 fF (1 to 31) Cint = 3 pF2 CL = [(CL1 x CL2) (CL1 + CL2)] + (Ctrim 2) + Cint (set trim value as 16 Ctrim = 32 pF)3 For a 16 MHz crystal where CL = 9 pF the CL1 = CL2 = 91 pF)4 For the CL selection refer to the data sheet of the crystal

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Datasheet DS70005472A-page 21

6 Power Management Unit (PMU)The IS20xxS SoC has an integrated PMU The main features of the PMU are a lithium-ion battery charger and avoltage regulator A power switch is used to switch over the power source between a battery and an adapter Alsothe PMU provides current to the LED drivers

61 Charging a BatteryThe IS20xxS SoC has a built-in battery charger which is optimized for lithium-polymer batteries The battery chargerincludes a current sensor for a charging control user programmable current regulator and high accuracy voltageregulator

The charging current parameters are configured by using the UI (IS20XXS_UI) tool Whenever the adapter isplugged-in the charging circuit will be activated Reviving pre-charging constant current mode constant voltagemode and re-charging functions are implemented The maximum charging current is 350 mA The following figureillustrates the charging curve of a battery

Figure 6-1 Battery Charging Curve

62 Voltage MonitoringA 10-bit successive approximation register ADC (SAR ADC) provides a dedicated channel for battery voltage leveldetection The warning level is programmed by using the UI tool The ADC provides a granular resolution to enablethe MCU to take control over the charging process

63 Low Dropout RegulatorA built-in LDO Regulator is used to convert the battery or adapter power for the power supply It also integratesthe hardware architecture to control the power-onoff procedure The built-in programmable LDOs provide power forcodec and digital IO pads Also it is used to buffer the high input voltage from the battery or adapter This LDOrequires a 1 μF bypass capacitor

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 22

64 Switching RegulatorThe built-in programmable output voltage regulator converts the battery voltage to RF and base band core powersupply This converter has a high conversion efficiency and a fast transient response

65 LED DriverThe IS20xxS SoC consists of two LED drivers to control the LEDs The LED drivers provide enough sink current(16-step control and 035 mA for each step) and the LED is connected directly to the IS20xxS SoC

Note  Configure the LED settings using the IS20XXS_UI tool

The following figure illustrates the LED driver in the IS20xxS SoC

Figure 6-2 LED DRIVER

IS20xxS

LED2

SYS_PWR

LED1

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 23

7 Application InformationThis section describes the power supply connection host MCU UART interface and various modes in detail

71 Power SupplyThe following figure illustrates the connection from the BAT_IN pin to various other voltage supply pins of theIS20xxS SoC

The BAT_IN input pin powers the IS20xxS SoC To charge the battery connect the external 5V power adapter toADAP_IN

Figure 7-1 Power Tree Diagram

VDDA VDDAO

VDD_IO

3V LDO

18V Buck

SAR_VDD

LDO31_VIN

CODEC_VO

LDO31_VO

BK_VDD

BK_LX

BK_O

VDD_CORE

VCC_RF

12V LDOPMIC_IN

CLDO_O

RFLDO_O

PVDD_CDA

Li-Io

n BA

T BAT_IN

ADAP_IN

SYS_PWRPower Switch

5V Adapter

(42~30V)

(45~55V)(42~30V)

(30~27V)

(33 ~27V)

(18V)

(12V)

(128V)

72 Host MCU InterfaceAn external MCU controls the IS20xxS SoC using the UART command set The following figure illustrates the UARTinterface between the IS20xxS SoC and an external MCU

Figure 7-2 Host MCU Interface Over UART

IS20xxSHCI_TXD

HCI_RXD

PWR

P0_0

MCUUART_TX

UART_RX

MCU_WAKEUP

BT_WAKEUP

UART Interface

UART Interface

The MCU controls the IS20xxS SoC over the UART interface and wakes up the SoC using the PWR pin The MCUfunction wakes up by connecting to the P0_0 pin of the IS20xxS

Refer to the IS200xIS201xIS202x UART Command SOP document for a list of functions that the IS20xxS SoCsupports and how to use the IS20XXS_UI tool to set up the system using the UART command

Note  The IS200xIS201xIS202x UART Command SOP document is available for download from the Microchipwebsite at IS200xIS201xIS202x UART Command SOP

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Datasheet DS70005472A-page 24

73 Timing Sequence of UART ApplicationThe following figures illustrate the various UART control signal timing sequences

Figure 7-3 Power-OnOff Sequence

BAT_IN

SYS_PWR

1 ms

Power- oninitial idle Power-on Power-on Power-off idle

MCU state

MFB (PWR)

BK_OLDO31_VO

400 ms

RST_N

MCU sends UART command (UART_RX)

UART Command

MCU sends power-off UART Command

Power-on ACK ACK ACKIS20xxS response UART state

(UART_TX)

Set ldquoPower-on Directlyrdquo boot

any

10 ms

20 msKeep all IS20xxSand MCU connection to low level

2s

(See Figure 7-4) (See Figure 7-5)

IS20xxS disconnect and auto power-off

gt 1s

Figure 7-4 Timing Sequence of RX Indication after Power-On

Resume 32 kHz mode

MFB (PWR)MCU sends UART command

MFB pulse must be longer than the UART command slot time

150 ms

2 ms 2 ms

Enter 32 kHz mode

1 ms

UART Command

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 25

Figure 7-5 Timing Sequence of Power-Off

BAT_IN +4V

MFB

MCU Sends RST_N

BK_OUT

LDO31_VO

UART Bus

2s 1s

IS20xxS Sends Power-off ACK

Notes 1 EEPROM clock = 100 kHz2 For a byte wire 001 ms x 32 clock x 2 = 640 μs3 It is recommended that ramp-down time be more than 640 μs during the power-off sequence to ensure safe

operation of the device

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 26

Figu

re 7

-6 

Tim

ing

Sequ

ence

of P

ower

-On

(NA

CK

)

BAT

_IN

SYS_

PWR

1 m

s Pow

er-

onin

itial

idle

Pow

er-o

nM

CU

sta

te

MFB

(PW

R)

BK_O

LD

O31

_VO

400

ms

RST

_N

MC

U s

ends

UAR

T co

mm

and

(UAR

T_R

X)

UAR

T C

omm

and

NAC

KPo

wer

-on

ACK

ACK

IS20

xxS

resp

onse

UAR

T st

ate

(UAR

T_TX

)

Set ldquo

Pow

er-o

n D

irect

lyrdquo b

oot

10 m

s

20 m

s

Ret

ry i

f AC

K is

not

rece

ived

200

ms

any

Wai

t

Max

imum

5 ti

mes

(1s)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 27

Figure 7-7 Reset Timing Sequence in Case of No Response from SoC to Host MCU

MFB (PWR)

MCU sends UART command UART

Command

UART Command

IS20xxS UART

If no response

RST_N

1ms

X ms1ms

1ms

1ms

Note  The MCU sends the UART command again when the SoC is not responding to its first UART command Ifthe SoC is not responding to the second UART command within X ms the MCU forces the system to reset

Figure 7-8 Timing Sequence of Power Drop Protection

BAT_IN +4V

RST_N from Reset IC

Power

SYS_PWR

IS20xxS

Reset OUT VDDGND

MCU Reset

Reset IC

29V

1 It is recommended that the battery be connected on a BAT_IN pin of the SoC for the power supply2 If an external power source or a power adapter is used to provide the power to the SoC (ADAP_IN) use a

voltage supervisor IC3 The RESET IC output pin must be open drain with delay time of le 10 ms and the recommended part is

TCM809SVNB713

74 General Purpose IO pinsThe following table provides the details of various functions that are mapped to the IO pins of the IS20xxS SoCand these IOs are configured by using the IS20XXS_UI tool The first button (Button 0) must be configured as thepower-onoff key and can be set using the PWR pin The remaining pins are configured for any one of the defaultfunctions (short press long press double press and combinations)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 28

Table 7-1 IO Pin Configuration

Sl No Pin Name Buttons Default Functions(1)

1 PowerMFB Button 0 PWR

2 P0_2 Button 1 PlayPause

3 P2_7 Button 2 Volume Up

4 P0_5 Button 3 Volume Down

5 P0_1 Button 4 FWD

6 P0_3 Button 5 REV

Note 1 These functions can be configured using the IS20XXS_UI tool

Few signals are generated to indicate or control outside devices The most popular applications are NFC for easypairing external audio amplifier for louder speaker and buzzer for indication

Table 7-2 IO Pins for Added Functions

Functions(1) IO Configurable Features

Slide switch P0_0P1_5

Buzzer P0_3

NFC detect P0_4P1_5

External amplifier enable P1_5

Note 1 These functions can be configured using the IS20XXS_UI tool

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 29

8 Antenna Placement RuleFor Bluetooth-enabled products the antenna placement affects the overall performance The antenna requires freespace to radiate RF signals and it must not be surrounded by the GND plane

The following figure illustrates a typical example of the good and poor antenna placement on the main applicationboard with the GND plane

Figure 8-1 Antenna Placement Examples

The following figure illustrates the keep-out area recommended for the PCB antenna

Figure 8-2 Keep-Out Area Recommended for PCB Antenna

Note  For additional information on the antenna placement refer to the antenna-specific data sheet from theantenna manufacturer

IS2008SIS2010SIS2013SIS2015SAntenna Placement Rule

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 30

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

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copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

continuedIS2008S and

IS2010S Pin No Pin Type(1) Pin Name Description

9 IO P1_3 IO pin default pull-high input EEPROM data SDA

10 I RST_N System Reset pin active when rising edge

11 P VDD_IO IO power supply input (27-33V) connect to LDO31_VOpin

12 IO P0_1

IO pin default pull-high input(2)

bull FWD key when class 2 RF (default) active-lowbull Class 1 TX control signal of external RF TR switch

active high

13 IO P1_5

IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0bull Slide switch detector active-lowbull Buzzer signal output

14 I HCI_RXD HCI UART data input

15 O HCI_TXD HCI UART data output

16 P CODEC_VO 31V LDO output for codec power

17 P LDO31_VIN 31V LDO input connect to SYS_PWR pin

18 P LDO31_VO 31V LDO output

19 P ADAP_IN 5V power adapter input

20 P BAT_IN 33-42V Li-ion battery input

21 - NC No Connection

22 P SAR_VDD SAR 18V input connect to BK_O pin

23 P SYS_PWR Power output which comes from BAT_IN or ADAP_IN

24 P BK_VDD 18V buck VDD Power Input connect to SYS_PWR pin

25 P BK_LX 18V buck pin for switch

26 P BK_O 18V buck feedback input

27 I PWR Multi function push button and power-on key

28 I LED2 LED Driver 2

29 I LED1 LED Driver 1

30 IO P0_3

IO pin default pull-high input(2)

bull REV key (default) active-lowbull Buzzer signal outputbull Out_Ind_1bull Class 1 RX control signal of external RF TR switch

active high

31 P CLDO_O 12V core LDO output

32 P PMIC_IN PMU blocks power input connect to BK_O pin

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 11

continuedIS2008S and

IS2010S Pin No Pin Type(1) Pin Name Description

33 P RFLDO_O 128V RF LDO output

34 P VBG Bandgap output reference for decoupling interference

35 P ULPC_VSUS ULPC 12V output power

36 I XO_N 16 MHz crystal input negative

37 I XO_P 16 MHz crystal input positive

38 P VCC_RF RF power input (128V) for both synthesizer and TXRXblock connect to RFLDO_O pin

39 IO RTX RF path (transmitreceive)

40 I P0_2IO pin default pull-high input(2)

PlayPause key (default) active-low

41 I P2_0IO pin default pull-high input system configuration

H Application L Baseband (IBDK mode)

42 I P2_7IO pin default pull high input(2)

Volume up key (default) active-low

43 I P0_5IO pin default pull high input(2)

Volume down (default) active-low

44 P VDD_IO IO power supply input (27-33V) connect to LDO31_VOpin

45 P VDD_AOPositive power supply dedicated to codec outputamplifiers connect to CODEC_VO pin

46 O AOHPM Headphone common mode outputsense input

47 O AOHPL Left channel analog headphone output

48 P VDDA Positive power supplyreference voltage for codecconnect to CODEC_VO pin

49 P EP Exposed pads used as ground (GND) pins

Notes 1 The conventions used in the table are indicated as follows

ndash I = Input pinndash O = Output pinndash IO = InputOutput pinndash P = Power pin

2 All IO pins are configured using the IS20XXS_UI tool a Windowsreg-based utility

The following figure illustrates the pin diagram of the IS2013S and IS2015S

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 12

Figure 2-3 IS2013S and IS2015S Pin Diagram

The following table provides the pin description of the IS2013SIS2015S

Table 2-3 Pin Description

IS2013S andIS2015S Pin No Pin Type(1) Pin Name Description

1 P VDDAO Positive power supply dedicated to codec output amplifiersConnect to CODEC_VO pin

2 O AOHPM Headphone common mode outputsense input

3 O AOHPL Left channel analog headphone output

4 P VDDA Positive power supplyreference voltage for codec connect toCODEC_VO pin

5 P VCOM Internal biasing voltage for codec

6 I MICN1 Mic1 mono differential analog negative input

7 I MICP1 Mic1 mono differential analog positive input

8 P MICBIAS Electric microphone biasing voltage

9 I AIL Left channel single-ended analog inputs

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 13

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

10 P VDD_CORE Core 12V power input connect to CLDO_O pin

11 O P1_2 IO pin default pull high input EEPROM clock SCL

12 IO P1_3 IO pin default pull high input EEPROM data SDA

13 I RST_N System Reset pin active when rising edge

14 P VDD_IO IO power supply input (27-33V) connect to LDO31_VO pin

15 IO P0_1

IO pin default pull-high input(2)

bull FWD key when class 2 RF (default) active-lowbull Class 1 TX Control signal of external RF TR switch

active high

16 I P2_4IO pin default pull high input system configuration

L Boot mode with P2_0 low combination

17 IO P0_4IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0

18 IO P1_5

IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0bull Slide switch detector active-lowbull Buzzer signal output

19 I HCI_RXD HCI UART input data

20 O HCI_TXD HCI UART output data

21 P CODEC_VO 31V LDO output for codec power

22 P LDO31_VIN 31V LDO input connect to SYS_PWR pin

23 P LDO31_VO 31V LDO output

24 P ADAP_IN 5V power adapter input

25 P BAT_IN 33 to 42V Li-ion battery input

26 P SAR_VDD SAR 18V input connect to BK_O pin

27 P SYS_PWR Power output which come from BAT_IN or ADAP_IN

28 P LDO18_VDD 18V LDO VDD Power Input connect to SYS_PWR pin

29 P LDO18_O 18V LDO output

30 I PWR Multi-Function Push button and power on key

31 - NC No Connection

32 I LED2 LED Driver 2

33 I LED1 LED Driver 1

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 14

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

34 IO P0_0IO pin default pull-high input(2)

bull Slide switch detector active-lowbull UARTTX_IND active-low

35 IO P0_3

IO pin default pull-high input(2)

bull REV key (default) active-lowbull Buzzer signal outputbull Out_Ind_1bull Class 1 RX control signal of external RF TR switch

active high

36 I EANEmbedded ROMExternal Flash enable

H Embedded L External Flash

37 P CLDO_O 12V core LDO output

38 P PMIC_IN PMU blocks power input connect to BK_O pin

39 P RFLDO_O 128V RF LDO output

40 P VBG Bandgap output reference for decoupling interference

41 P ULPC_VSUS ULPC 12V output power

42 I XO_N 16 MHz crystal input negative

43 I XO_P 16 MHz crystal input positive

44 P VCC_RFRF power input (128V) for both synthesizer and TXRXblock connect to RFLDO_O pin

45 IO RTX RF path (transmitreceive)

46 I P0_2IO pin default pull-high input(2)

PlayPause key (default) active-low

47 I P2_0IO pin default pull-high input system configuration

H Application L Baseband (IBDK mode)

48 I P2_7IO pin default pull-high input(2)

Volume up key (default) active-low

49 I P3_0IO pin default pull-high input(2)

Line-in detector (default) active-low

50 I P0_5IO pin default pull-high input(2)

Volume down (default) active-low

51 P VDD_IO IO power supply input (27-33V) connect to LDO31_VO pin

52 P AVDD_CDA Supply voltage of audio amplifier

53 P VBP_CDA Reference voltage output

54 O HPON_CDA Negative BTL output of channel-1

55 O HPOP_CDA Positive BTL output of channel-1

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 15

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

56 P PVDD_CDA Supply voltage of power stage ch-1

57 P EP Exposed pads used as ground (GND) pins

Notes 1 The conventions used in the table are indicated as follows

ndash I = Input pinndash O = Output pinndash IO = InputOutput pinndash P = Power pin

2 All IO pins are configured using the UI tool a Windows-based utility

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 16

3 AudioThe input and output audio signals have different stages and each stage is programmed to vary the gain responsecharacteristics For microphones both single-ended inputs and differential inputs are supported To maintain ahigh-quality signal provide a stable bias voltage source to the condenser microphonersquos FET Use the DC-blockingcapacitors at both positive and negative sides of the input Internally this analog signal is converted to 16-bit 8 kHzlinear PCM data

31 Digital Signal ProcessorA Digital Signal Processor (DSP) is used to perform speech and audio processing The advanced speech featuressuch as acoustic echo cancellation and noise reduction are built in To reduce nonlinear distortion and to help echocancellation an outgoing signal level to the speaker is monitored and adjusted to avoid saturation of the speakeroutput or microphone input Adaptive filtering is also applied to track the echo path impulse in response to provide anecho-free and full-duplex user experience

The embedded noise reduction algorithm helps to extract clean speech signals from the noisy inputs capturedby microphones and improves mutual understanding in communication The advanced audio features such asmulti-band dynamic range control parametric multi-band equalizer audio widening and virtual bass are built in Theaudio effect algorithms improve the userrsquos audio listening experience in terms of better quality audio after audiosignal processing

The following figures illustrate the processing flow of speakerphone applications for speech and audio signalprocessing

Figure 3-1 Speech Processing

Figure 3-2 Audio Processing

The DSP parameters such as EQ Speaker Gain Mic Gain Sound Effect and more are configured using the DSPtool For additional information on the DSP tool refer to the IS20xxBM1xBM2x DSP Application Note

IS2008SIS2010SIS2013SIS2015SAudio

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 17

Note  The DSP tool and IS20xxBM1xBM2x DSP Application Note are available for download at the Microchipwebsite

32 CodecThe built-in codec has a high SNR performance and it consists of an ADC a DAC and additional analog circuitry

33 Auxiliary PortThe SoC supports one analog (line-in) signal from the external audio source The analog signal is processed bythe DSP to generate different sound effects (multi-band dynamic range compression and audio widening) which areconfigured using the DSP tool

34 Class D Audio AmplifierThe Class D amplifier has a significant advantage in many applications due to its lower power dissipation whichproduces less heat The IS2013S and IS2015S SoC have a built-in Class D amplifier that reduces circuit board spaceand system cost The efficiency of the amplifier extends the battery life in portable systems

The Class D amplifier is implemented by using a full-bridge output stage A full bridge uses two half-bridge stages todrive the load differentially The Class D amplifier provides a good SNR and enough drive capability for a 4Ω speakerdriver

IS2008SIS2010SIS2013SIS2015SAudio

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 18

4 TransceiverThe SoC is designed and optimized for Bluetooth 24 GHz systems It contains a complete radio frequencytransmitterreceiver section An internal synthesizer generates a stable clock to synchronize with another device

41 TransmitterThe internal Power Amplifier (PA) has a maximum output power of +4 dBm with 20 dB power level control Applythis to Class 2 or Class 3 radios without an external RF PA The transmitter directly performs the IQ conversionto minimize the frequency drift and it can access the 20 dB power range with the temperature compensationmechanism

42 ReceiverThe Low-Noise Amplifier (LNA) operates with TR-combined mode for the single port application It saves the pin onthe package without having an external TXRX switch

The ADC is used to sample the input analog signal and convert it into a digital signal for demodulator analysisA channel filter is integrated into a receiver channel before the ADC to reduce the external component count andincrease the anti-interference capability

The image rejection filter is used to reject the image frequency for the low-IF architecture and it is also intended toreduce the external Band Pass Filter (BPF) component for a super heterodyne architecture

The Received Signal Strength Indicator (RSSI) signal feedback to the processor is used to control the RF outputpower to make a good trade-off for effective distance and current consumption

43 SynthesizerA synthesizer generates a clock for radio transceiver operation The VCO inside with a tunable internal LC tankcan reduce any variation for components A crystal oscillator with an internal digital trimming circuit provides a stableclock for the synthesizer

44 ModemFor Bluetooth 12 specifications and below 1 Mbps is the standard data rate based on the Gaussian Frequency ShiftKeying (GFSK) modulation scheme This basic rate modem meets BDR requirements of Bluetooth 20 with EDRspecifications

For Bluetooth 20 and above specifications EDR is introduced to provide the data rates of 123 Mbps Thisenhanced data rate modem meets EDR requirements of Bluetooth 20 with EDR specifications For the basebandboth BDR and EDR utilize the same 1 MHz symbol rate and 16 kHz slot rate For BDR 1 symbol represents 1-bitHowever each symbol in the payload part of the EDR packets represents 2-bit or 3-bit This is achieved by using twodifferent modulations π4 DQPSK and 8 DPSK

45 Adaptive Frequency Hopping (AFH)The SoC has an AFH function to avoid RF interference It has an algorithm to check the nearby interference and tochoose the clear channel for the transceiver Bluetooth signal

IS2008SIS2010SIS2013SIS2015STransceiver

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 19

5 MicrocontrollerA single-cycle 8-bit microcontroller is built into the SoC to execute the Bluetooth protocols It operates from 16 MHzto higher frequencies where the firmware dynamically adjusts the trade-off between the computing power and thepower consumption In the ROM version the MCU firmware is hard-wired to minimize power consumption for thefirmware execution and to save the external Flash cost

51 MemoryThere are sufficient ROM and RAM to fulfill the processor requirements in which a synchronous single port RAMinterface is used The register bank dedicated single port memory and Flash memory are connected to theprocessor bus The processor coordinates with all link control procedures and the data movement happens using aset of pointer registers

52 External ResetThe IS20xxS SoC provides a Watchdog Timer (WDT) to reset the SoC It has an integrated Power-on Reset (POR)circuit that resets all circuits to a known Power-on state This action is also driven by an external Reset signal whichis used to control the device externally by forcing it into a POR state The RST_N signal input is active-low and noconnection is required in most of the applications

53 Reference ClockThe IS20xxS SoC is composed of an integrated crystal oscillation function that uses a 16 MHz external crystal andtwo specified loading capacitors to provide a high quality system reference timer source Use this feature to removethe initial tolerance frequency errors which are associated with the crystal and its equivalent loading capacitance inthe mass production Achieve the frequency trim by adjusting the crystal loading capacitance through the on-chip trimcapacitors (Ctrim)

The value of the trimming capacitance is 200 fF (200x10-15 F) per LSB at the 5-bit word and the overall adjustableclock frequency is plusmn40 kHz The following figure illustrates the crystal connection of the IS20xxS SoC with twocapacitors

Figure 5-1 Crystal Connection

IS20XXS

XO_N

CL1

XO_P

CL2

IS2008SIS2010SIS2013SIS2015SMicrocontroller

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 20

Notes 1 Ctrim = 200 fF (1 to 31) Cint = 3 pF2 CL = [(CL1 x CL2) (CL1 + CL2)] + (Ctrim 2) + Cint (set trim value as 16 Ctrim = 32 pF)3 For a 16 MHz crystal where CL = 9 pF the CL1 = CL2 = 91 pF)4 For the CL selection refer to the data sheet of the crystal

IS2008SIS2010SIS2013SIS2015SMicrocontroller

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 21

6 Power Management Unit (PMU)The IS20xxS SoC has an integrated PMU The main features of the PMU are a lithium-ion battery charger and avoltage regulator A power switch is used to switch over the power source between a battery and an adapter Alsothe PMU provides current to the LED drivers

61 Charging a BatteryThe IS20xxS SoC has a built-in battery charger which is optimized for lithium-polymer batteries The battery chargerincludes a current sensor for a charging control user programmable current regulator and high accuracy voltageregulator

The charging current parameters are configured by using the UI (IS20XXS_UI) tool Whenever the adapter isplugged-in the charging circuit will be activated Reviving pre-charging constant current mode constant voltagemode and re-charging functions are implemented The maximum charging current is 350 mA The following figureillustrates the charging curve of a battery

Figure 6-1 Battery Charging Curve

62 Voltage MonitoringA 10-bit successive approximation register ADC (SAR ADC) provides a dedicated channel for battery voltage leveldetection The warning level is programmed by using the UI tool The ADC provides a granular resolution to enablethe MCU to take control over the charging process

63 Low Dropout RegulatorA built-in LDO Regulator is used to convert the battery or adapter power for the power supply It also integratesthe hardware architecture to control the power-onoff procedure The built-in programmable LDOs provide power forcodec and digital IO pads Also it is used to buffer the high input voltage from the battery or adapter This LDOrequires a 1 μF bypass capacitor

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 22

64 Switching RegulatorThe built-in programmable output voltage regulator converts the battery voltage to RF and base band core powersupply This converter has a high conversion efficiency and a fast transient response

65 LED DriverThe IS20xxS SoC consists of two LED drivers to control the LEDs The LED drivers provide enough sink current(16-step control and 035 mA for each step) and the LED is connected directly to the IS20xxS SoC

Note  Configure the LED settings using the IS20XXS_UI tool

The following figure illustrates the LED driver in the IS20xxS SoC

Figure 6-2 LED DRIVER

IS20xxS

LED2

SYS_PWR

LED1

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 23

7 Application InformationThis section describes the power supply connection host MCU UART interface and various modes in detail

71 Power SupplyThe following figure illustrates the connection from the BAT_IN pin to various other voltage supply pins of theIS20xxS SoC

The BAT_IN input pin powers the IS20xxS SoC To charge the battery connect the external 5V power adapter toADAP_IN

Figure 7-1 Power Tree Diagram

VDDA VDDAO

VDD_IO

3V LDO

18V Buck

SAR_VDD

LDO31_VIN

CODEC_VO

LDO31_VO

BK_VDD

BK_LX

BK_O

VDD_CORE

VCC_RF

12V LDOPMIC_IN

CLDO_O

RFLDO_O

PVDD_CDA

Li-Io

n BA

T BAT_IN

ADAP_IN

SYS_PWRPower Switch

5V Adapter

(42~30V)

(45~55V)(42~30V)

(30~27V)

(33 ~27V)

(18V)

(12V)

(128V)

72 Host MCU InterfaceAn external MCU controls the IS20xxS SoC using the UART command set The following figure illustrates the UARTinterface between the IS20xxS SoC and an external MCU

Figure 7-2 Host MCU Interface Over UART

IS20xxSHCI_TXD

HCI_RXD

PWR

P0_0

MCUUART_TX

UART_RX

MCU_WAKEUP

BT_WAKEUP

UART Interface

UART Interface

The MCU controls the IS20xxS SoC over the UART interface and wakes up the SoC using the PWR pin The MCUfunction wakes up by connecting to the P0_0 pin of the IS20xxS

Refer to the IS200xIS201xIS202x UART Command SOP document for a list of functions that the IS20xxS SoCsupports and how to use the IS20XXS_UI tool to set up the system using the UART command

Note  The IS200xIS201xIS202x UART Command SOP document is available for download from the Microchipwebsite at IS200xIS201xIS202x UART Command SOP

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 24

73 Timing Sequence of UART ApplicationThe following figures illustrate the various UART control signal timing sequences

Figure 7-3 Power-OnOff Sequence

BAT_IN

SYS_PWR

1 ms

Power- oninitial idle Power-on Power-on Power-off idle

MCU state

MFB (PWR)

BK_OLDO31_VO

400 ms

RST_N

MCU sends UART command (UART_RX)

UART Command

MCU sends power-off UART Command

Power-on ACK ACK ACKIS20xxS response UART state

(UART_TX)

Set ldquoPower-on Directlyrdquo boot

any

10 ms

20 msKeep all IS20xxSand MCU connection to low level

2s

(See Figure 7-4) (See Figure 7-5)

IS20xxS disconnect and auto power-off

gt 1s

Figure 7-4 Timing Sequence of RX Indication after Power-On

Resume 32 kHz mode

MFB (PWR)MCU sends UART command

MFB pulse must be longer than the UART command slot time

150 ms

2 ms 2 ms

Enter 32 kHz mode

1 ms

UART Command

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 25

Figure 7-5 Timing Sequence of Power-Off

BAT_IN +4V

MFB

MCU Sends RST_N

BK_OUT

LDO31_VO

UART Bus

2s 1s

IS20xxS Sends Power-off ACK

Notes 1 EEPROM clock = 100 kHz2 For a byte wire 001 ms x 32 clock x 2 = 640 μs3 It is recommended that ramp-down time be more than 640 μs during the power-off sequence to ensure safe

operation of the device

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 26

Figu

re 7

-6 

Tim

ing

Sequ

ence

of P

ower

-On

(NA

CK

)

BAT

_IN

SYS_

PWR

1 m

s Pow

er-

onin

itial

idle

Pow

er-o

nM

CU

sta

te

MFB

(PW

R)

BK_O

LD

O31

_VO

400

ms

RST

_N

MC

U s

ends

UAR

T co

mm

and

(UAR

T_R

X)

UAR

T C

omm

and

NAC

KPo

wer

-on

ACK

ACK

IS20

xxS

resp

onse

UAR

T st

ate

(UAR

T_TX

)

Set ldquo

Pow

er-o

n D

irect

lyrdquo b

oot

10 m

s

20 m

s

Ret

ry i

f AC

K is

not

rece

ived

200

ms

any

Wai

t

Max

imum

5 ti

mes

(1s)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 27

Figure 7-7 Reset Timing Sequence in Case of No Response from SoC to Host MCU

MFB (PWR)

MCU sends UART command UART

Command

UART Command

IS20xxS UART

If no response

RST_N

1ms

X ms1ms

1ms

1ms

Note  The MCU sends the UART command again when the SoC is not responding to its first UART command Ifthe SoC is not responding to the second UART command within X ms the MCU forces the system to reset

Figure 7-8 Timing Sequence of Power Drop Protection

BAT_IN +4V

RST_N from Reset IC

Power

SYS_PWR

IS20xxS

Reset OUT VDDGND

MCU Reset

Reset IC

29V

1 It is recommended that the battery be connected on a BAT_IN pin of the SoC for the power supply2 If an external power source or a power adapter is used to provide the power to the SoC (ADAP_IN) use a

voltage supervisor IC3 The RESET IC output pin must be open drain with delay time of le 10 ms and the recommended part is

TCM809SVNB713

74 General Purpose IO pinsThe following table provides the details of various functions that are mapped to the IO pins of the IS20xxS SoCand these IOs are configured by using the IS20XXS_UI tool The first button (Button 0) must be configured as thepower-onoff key and can be set using the PWR pin The remaining pins are configured for any one of the defaultfunctions (short press long press double press and combinations)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 28

Table 7-1 IO Pin Configuration

Sl No Pin Name Buttons Default Functions(1)

1 PowerMFB Button 0 PWR

2 P0_2 Button 1 PlayPause

3 P2_7 Button 2 Volume Up

4 P0_5 Button 3 Volume Down

5 P0_1 Button 4 FWD

6 P0_3 Button 5 REV

Note 1 These functions can be configured using the IS20XXS_UI tool

Few signals are generated to indicate or control outside devices The most popular applications are NFC for easypairing external audio amplifier for louder speaker and buzzer for indication

Table 7-2 IO Pins for Added Functions

Functions(1) IO Configurable Features

Slide switch P0_0P1_5

Buzzer P0_3

NFC detect P0_4P1_5

External amplifier enable P1_5

Note 1 These functions can be configured using the IS20XXS_UI tool

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 29

8 Antenna Placement RuleFor Bluetooth-enabled products the antenna placement affects the overall performance The antenna requires freespace to radiate RF signals and it must not be surrounded by the GND plane

The following figure illustrates a typical example of the good and poor antenna placement on the main applicationboard with the GND plane

Figure 8-1 Antenna Placement Examples

The following figure illustrates the keep-out area recommended for the PCB antenna

Figure 8-2 Keep-Out Area Recommended for PCB Antenna

Note  For additional information on the antenna placement refer to the antenna-specific data sheet from theantenna manufacturer

IS2008SIS2010SIS2013SIS2015SAntenna Placement Rule

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 30

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

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Worldwide Sales and Service

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Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

continuedIS2008S and

IS2010S Pin No Pin Type(1) Pin Name Description

33 P RFLDO_O 128V RF LDO output

34 P VBG Bandgap output reference for decoupling interference

35 P ULPC_VSUS ULPC 12V output power

36 I XO_N 16 MHz crystal input negative

37 I XO_P 16 MHz crystal input positive

38 P VCC_RF RF power input (128V) for both synthesizer and TXRXblock connect to RFLDO_O pin

39 IO RTX RF path (transmitreceive)

40 I P0_2IO pin default pull-high input(2)

PlayPause key (default) active-low

41 I P2_0IO pin default pull-high input system configuration

H Application L Baseband (IBDK mode)

42 I P2_7IO pin default pull high input(2)

Volume up key (default) active-low

43 I P0_5IO pin default pull high input(2)

Volume down (default) active-low

44 P VDD_IO IO power supply input (27-33V) connect to LDO31_VOpin

45 P VDD_AOPositive power supply dedicated to codec outputamplifiers connect to CODEC_VO pin

46 O AOHPM Headphone common mode outputsense input

47 O AOHPL Left channel analog headphone output

48 P VDDA Positive power supplyreference voltage for codecconnect to CODEC_VO pin

49 P EP Exposed pads used as ground (GND) pins

Notes 1 The conventions used in the table are indicated as follows

ndash I = Input pinndash O = Output pinndash IO = InputOutput pinndash P = Power pin

2 All IO pins are configured using the IS20XXS_UI tool a Windowsreg-based utility

The following figure illustrates the pin diagram of the IS2013S and IS2015S

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 12

Figure 2-3 IS2013S and IS2015S Pin Diagram

The following table provides the pin description of the IS2013SIS2015S

Table 2-3 Pin Description

IS2013S andIS2015S Pin No Pin Type(1) Pin Name Description

1 P VDDAO Positive power supply dedicated to codec output amplifiersConnect to CODEC_VO pin

2 O AOHPM Headphone common mode outputsense input

3 O AOHPL Left channel analog headphone output

4 P VDDA Positive power supplyreference voltage for codec connect toCODEC_VO pin

5 P VCOM Internal biasing voltage for codec

6 I MICN1 Mic1 mono differential analog negative input

7 I MICP1 Mic1 mono differential analog positive input

8 P MICBIAS Electric microphone biasing voltage

9 I AIL Left channel single-ended analog inputs

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 13

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

10 P VDD_CORE Core 12V power input connect to CLDO_O pin

11 O P1_2 IO pin default pull high input EEPROM clock SCL

12 IO P1_3 IO pin default pull high input EEPROM data SDA

13 I RST_N System Reset pin active when rising edge

14 P VDD_IO IO power supply input (27-33V) connect to LDO31_VO pin

15 IO P0_1

IO pin default pull-high input(2)

bull FWD key when class 2 RF (default) active-lowbull Class 1 TX Control signal of external RF TR switch

active high

16 I P2_4IO pin default pull high input system configuration

L Boot mode with P2_0 low combination

17 IO P0_4IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0

18 IO P1_5

IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0bull Slide switch detector active-lowbull Buzzer signal output

19 I HCI_RXD HCI UART input data

20 O HCI_TXD HCI UART output data

21 P CODEC_VO 31V LDO output for codec power

22 P LDO31_VIN 31V LDO input connect to SYS_PWR pin

23 P LDO31_VO 31V LDO output

24 P ADAP_IN 5V power adapter input

25 P BAT_IN 33 to 42V Li-ion battery input

26 P SAR_VDD SAR 18V input connect to BK_O pin

27 P SYS_PWR Power output which come from BAT_IN or ADAP_IN

28 P LDO18_VDD 18V LDO VDD Power Input connect to SYS_PWR pin

29 P LDO18_O 18V LDO output

30 I PWR Multi-Function Push button and power on key

31 - NC No Connection

32 I LED2 LED Driver 2

33 I LED1 LED Driver 1

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 14

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

34 IO P0_0IO pin default pull-high input(2)

bull Slide switch detector active-lowbull UARTTX_IND active-low

35 IO P0_3

IO pin default pull-high input(2)

bull REV key (default) active-lowbull Buzzer signal outputbull Out_Ind_1bull Class 1 RX control signal of external RF TR switch

active high

36 I EANEmbedded ROMExternal Flash enable

H Embedded L External Flash

37 P CLDO_O 12V core LDO output

38 P PMIC_IN PMU blocks power input connect to BK_O pin

39 P RFLDO_O 128V RF LDO output

40 P VBG Bandgap output reference for decoupling interference

41 P ULPC_VSUS ULPC 12V output power

42 I XO_N 16 MHz crystal input negative

43 I XO_P 16 MHz crystal input positive

44 P VCC_RFRF power input (128V) for both synthesizer and TXRXblock connect to RFLDO_O pin

45 IO RTX RF path (transmitreceive)

46 I P0_2IO pin default pull-high input(2)

PlayPause key (default) active-low

47 I P2_0IO pin default pull-high input system configuration

H Application L Baseband (IBDK mode)

48 I P2_7IO pin default pull-high input(2)

Volume up key (default) active-low

49 I P3_0IO pin default pull-high input(2)

Line-in detector (default) active-low

50 I P0_5IO pin default pull-high input(2)

Volume down (default) active-low

51 P VDD_IO IO power supply input (27-33V) connect to LDO31_VO pin

52 P AVDD_CDA Supply voltage of audio amplifier

53 P VBP_CDA Reference voltage output

54 O HPON_CDA Negative BTL output of channel-1

55 O HPOP_CDA Positive BTL output of channel-1

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 15

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

56 P PVDD_CDA Supply voltage of power stage ch-1

57 P EP Exposed pads used as ground (GND) pins

Notes 1 The conventions used in the table are indicated as follows

ndash I = Input pinndash O = Output pinndash IO = InputOutput pinndash P = Power pin

2 All IO pins are configured using the UI tool a Windows-based utility

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 16

3 AudioThe input and output audio signals have different stages and each stage is programmed to vary the gain responsecharacteristics For microphones both single-ended inputs and differential inputs are supported To maintain ahigh-quality signal provide a stable bias voltage source to the condenser microphonersquos FET Use the DC-blockingcapacitors at both positive and negative sides of the input Internally this analog signal is converted to 16-bit 8 kHzlinear PCM data

31 Digital Signal ProcessorA Digital Signal Processor (DSP) is used to perform speech and audio processing The advanced speech featuressuch as acoustic echo cancellation and noise reduction are built in To reduce nonlinear distortion and to help echocancellation an outgoing signal level to the speaker is monitored and adjusted to avoid saturation of the speakeroutput or microphone input Adaptive filtering is also applied to track the echo path impulse in response to provide anecho-free and full-duplex user experience

The embedded noise reduction algorithm helps to extract clean speech signals from the noisy inputs capturedby microphones and improves mutual understanding in communication The advanced audio features such asmulti-band dynamic range control parametric multi-band equalizer audio widening and virtual bass are built in Theaudio effect algorithms improve the userrsquos audio listening experience in terms of better quality audio after audiosignal processing

The following figures illustrate the processing flow of speakerphone applications for speech and audio signalprocessing

Figure 3-1 Speech Processing

Figure 3-2 Audio Processing

The DSP parameters such as EQ Speaker Gain Mic Gain Sound Effect and more are configured using the DSPtool For additional information on the DSP tool refer to the IS20xxBM1xBM2x DSP Application Note

IS2008SIS2010SIS2013SIS2015SAudio

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 17

Note  The DSP tool and IS20xxBM1xBM2x DSP Application Note are available for download at the Microchipwebsite

32 CodecThe built-in codec has a high SNR performance and it consists of an ADC a DAC and additional analog circuitry

33 Auxiliary PortThe SoC supports one analog (line-in) signal from the external audio source The analog signal is processed bythe DSP to generate different sound effects (multi-band dynamic range compression and audio widening) which areconfigured using the DSP tool

34 Class D Audio AmplifierThe Class D amplifier has a significant advantage in many applications due to its lower power dissipation whichproduces less heat The IS2013S and IS2015S SoC have a built-in Class D amplifier that reduces circuit board spaceand system cost The efficiency of the amplifier extends the battery life in portable systems

The Class D amplifier is implemented by using a full-bridge output stage A full bridge uses two half-bridge stages todrive the load differentially The Class D amplifier provides a good SNR and enough drive capability for a 4Ω speakerdriver

IS2008SIS2010SIS2013SIS2015SAudio

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 18

4 TransceiverThe SoC is designed and optimized for Bluetooth 24 GHz systems It contains a complete radio frequencytransmitterreceiver section An internal synthesizer generates a stable clock to synchronize with another device

41 TransmitterThe internal Power Amplifier (PA) has a maximum output power of +4 dBm with 20 dB power level control Applythis to Class 2 or Class 3 radios without an external RF PA The transmitter directly performs the IQ conversionto minimize the frequency drift and it can access the 20 dB power range with the temperature compensationmechanism

42 ReceiverThe Low-Noise Amplifier (LNA) operates with TR-combined mode for the single port application It saves the pin onthe package without having an external TXRX switch

The ADC is used to sample the input analog signal and convert it into a digital signal for demodulator analysisA channel filter is integrated into a receiver channel before the ADC to reduce the external component count andincrease the anti-interference capability

The image rejection filter is used to reject the image frequency for the low-IF architecture and it is also intended toreduce the external Band Pass Filter (BPF) component for a super heterodyne architecture

The Received Signal Strength Indicator (RSSI) signal feedback to the processor is used to control the RF outputpower to make a good trade-off for effective distance and current consumption

43 SynthesizerA synthesizer generates a clock for radio transceiver operation The VCO inside with a tunable internal LC tankcan reduce any variation for components A crystal oscillator with an internal digital trimming circuit provides a stableclock for the synthesizer

44 ModemFor Bluetooth 12 specifications and below 1 Mbps is the standard data rate based on the Gaussian Frequency ShiftKeying (GFSK) modulation scheme This basic rate modem meets BDR requirements of Bluetooth 20 with EDRspecifications

For Bluetooth 20 and above specifications EDR is introduced to provide the data rates of 123 Mbps Thisenhanced data rate modem meets EDR requirements of Bluetooth 20 with EDR specifications For the basebandboth BDR and EDR utilize the same 1 MHz symbol rate and 16 kHz slot rate For BDR 1 symbol represents 1-bitHowever each symbol in the payload part of the EDR packets represents 2-bit or 3-bit This is achieved by using twodifferent modulations π4 DQPSK and 8 DPSK

45 Adaptive Frequency Hopping (AFH)The SoC has an AFH function to avoid RF interference It has an algorithm to check the nearby interference and tochoose the clear channel for the transceiver Bluetooth signal

IS2008SIS2010SIS2013SIS2015STransceiver

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 19

5 MicrocontrollerA single-cycle 8-bit microcontroller is built into the SoC to execute the Bluetooth protocols It operates from 16 MHzto higher frequencies where the firmware dynamically adjusts the trade-off between the computing power and thepower consumption In the ROM version the MCU firmware is hard-wired to minimize power consumption for thefirmware execution and to save the external Flash cost

51 MemoryThere are sufficient ROM and RAM to fulfill the processor requirements in which a synchronous single port RAMinterface is used The register bank dedicated single port memory and Flash memory are connected to theprocessor bus The processor coordinates with all link control procedures and the data movement happens using aset of pointer registers

52 External ResetThe IS20xxS SoC provides a Watchdog Timer (WDT) to reset the SoC It has an integrated Power-on Reset (POR)circuit that resets all circuits to a known Power-on state This action is also driven by an external Reset signal whichis used to control the device externally by forcing it into a POR state The RST_N signal input is active-low and noconnection is required in most of the applications

53 Reference ClockThe IS20xxS SoC is composed of an integrated crystal oscillation function that uses a 16 MHz external crystal andtwo specified loading capacitors to provide a high quality system reference timer source Use this feature to removethe initial tolerance frequency errors which are associated with the crystal and its equivalent loading capacitance inthe mass production Achieve the frequency trim by adjusting the crystal loading capacitance through the on-chip trimcapacitors (Ctrim)

The value of the trimming capacitance is 200 fF (200x10-15 F) per LSB at the 5-bit word and the overall adjustableclock frequency is plusmn40 kHz The following figure illustrates the crystal connection of the IS20xxS SoC with twocapacitors

Figure 5-1 Crystal Connection

IS20XXS

XO_N

CL1

XO_P

CL2

IS2008SIS2010SIS2013SIS2015SMicrocontroller

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 20

Notes 1 Ctrim = 200 fF (1 to 31) Cint = 3 pF2 CL = [(CL1 x CL2) (CL1 + CL2)] + (Ctrim 2) + Cint (set trim value as 16 Ctrim = 32 pF)3 For a 16 MHz crystal where CL = 9 pF the CL1 = CL2 = 91 pF)4 For the CL selection refer to the data sheet of the crystal

IS2008SIS2010SIS2013SIS2015SMicrocontroller

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 21

6 Power Management Unit (PMU)The IS20xxS SoC has an integrated PMU The main features of the PMU are a lithium-ion battery charger and avoltage regulator A power switch is used to switch over the power source between a battery and an adapter Alsothe PMU provides current to the LED drivers

61 Charging a BatteryThe IS20xxS SoC has a built-in battery charger which is optimized for lithium-polymer batteries The battery chargerincludes a current sensor for a charging control user programmable current regulator and high accuracy voltageregulator

The charging current parameters are configured by using the UI (IS20XXS_UI) tool Whenever the adapter isplugged-in the charging circuit will be activated Reviving pre-charging constant current mode constant voltagemode and re-charging functions are implemented The maximum charging current is 350 mA The following figureillustrates the charging curve of a battery

Figure 6-1 Battery Charging Curve

62 Voltage MonitoringA 10-bit successive approximation register ADC (SAR ADC) provides a dedicated channel for battery voltage leveldetection The warning level is programmed by using the UI tool The ADC provides a granular resolution to enablethe MCU to take control over the charging process

63 Low Dropout RegulatorA built-in LDO Regulator is used to convert the battery or adapter power for the power supply It also integratesthe hardware architecture to control the power-onoff procedure The built-in programmable LDOs provide power forcodec and digital IO pads Also it is used to buffer the high input voltage from the battery or adapter This LDOrequires a 1 μF bypass capacitor

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 22

64 Switching RegulatorThe built-in programmable output voltage regulator converts the battery voltage to RF and base band core powersupply This converter has a high conversion efficiency and a fast transient response

65 LED DriverThe IS20xxS SoC consists of two LED drivers to control the LEDs The LED drivers provide enough sink current(16-step control and 035 mA for each step) and the LED is connected directly to the IS20xxS SoC

Note  Configure the LED settings using the IS20XXS_UI tool

The following figure illustrates the LED driver in the IS20xxS SoC

Figure 6-2 LED DRIVER

IS20xxS

LED2

SYS_PWR

LED1

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 23

7 Application InformationThis section describes the power supply connection host MCU UART interface and various modes in detail

71 Power SupplyThe following figure illustrates the connection from the BAT_IN pin to various other voltage supply pins of theIS20xxS SoC

The BAT_IN input pin powers the IS20xxS SoC To charge the battery connect the external 5V power adapter toADAP_IN

Figure 7-1 Power Tree Diagram

VDDA VDDAO

VDD_IO

3V LDO

18V Buck

SAR_VDD

LDO31_VIN

CODEC_VO

LDO31_VO

BK_VDD

BK_LX

BK_O

VDD_CORE

VCC_RF

12V LDOPMIC_IN

CLDO_O

RFLDO_O

PVDD_CDA

Li-Io

n BA

T BAT_IN

ADAP_IN

SYS_PWRPower Switch

5V Adapter

(42~30V)

(45~55V)(42~30V)

(30~27V)

(33 ~27V)

(18V)

(12V)

(128V)

72 Host MCU InterfaceAn external MCU controls the IS20xxS SoC using the UART command set The following figure illustrates the UARTinterface between the IS20xxS SoC and an external MCU

Figure 7-2 Host MCU Interface Over UART

IS20xxSHCI_TXD

HCI_RXD

PWR

P0_0

MCUUART_TX

UART_RX

MCU_WAKEUP

BT_WAKEUP

UART Interface

UART Interface

The MCU controls the IS20xxS SoC over the UART interface and wakes up the SoC using the PWR pin The MCUfunction wakes up by connecting to the P0_0 pin of the IS20xxS

Refer to the IS200xIS201xIS202x UART Command SOP document for a list of functions that the IS20xxS SoCsupports and how to use the IS20XXS_UI tool to set up the system using the UART command

Note  The IS200xIS201xIS202x UART Command SOP document is available for download from the Microchipwebsite at IS200xIS201xIS202x UART Command SOP

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 24

73 Timing Sequence of UART ApplicationThe following figures illustrate the various UART control signal timing sequences

Figure 7-3 Power-OnOff Sequence

BAT_IN

SYS_PWR

1 ms

Power- oninitial idle Power-on Power-on Power-off idle

MCU state

MFB (PWR)

BK_OLDO31_VO

400 ms

RST_N

MCU sends UART command (UART_RX)

UART Command

MCU sends power-off UART Command

Power-on ACK ACK ACKIS20xxS response UART state

(UART_TX)

Set ldquoPower-on Directlyrdquo boot

any

10 ms

20 msKeep all IS20xxSand MCU connection to low level

2s

(See Figure 7-4) (See Figure 7-5)

IS20xxS disconnect and auto power-off

gt 1s

Figure 7-4 Timing Sequence of RX Indication after Power-On

Resume 32 kHz mode

MFB (PWR)MCU sends UART command

MFB pulse must be longer than the UART command slot time

150 ms

2 ms 2 ms

Enter 32 kHz mode

1 ms

UART Command

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 25

Figure 7-5 Timing Sequence of Power-Off

BAT_IN +4V

MFB

MCU Sends RST_N

BK_OUT

LDO31_VO

UART Bus

2s 1s

IS20xxS Sends Power-off ACK

Notes 1 EEPROM clock = 100 kHz2 For a byte wire 001 ms x 32 clock x 2 = 640 μs3 It is recommended that ramp-down time be more than 640 μs during the power-off sequence to ensure safe

operation of the device

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 26

Figu

re 7

-6 

Tim

ing

Sequ

ence

of P

ower

-On

(NA

CK

)

BAT

_IN

SYS_

PWR

1 m

s Pow

er-

onin

itial

idle

Pow

er-o

nM

CU

sta

te

MFB

(PW

R)

BK_O

LD

O31

_VO

400

ms

RST

_N

MC

U s

ends

UAR

T co

mm

and

(UAR

T_R

X)

UAR

T C

omm

and

NAC

KPo

wer

-on

ACK

ACK

IS20

xxS

resp

onse

UAR

T st

ate

(UAR

T_TX

)

Set ldquo

Pow

er-o

n D

irect

lyrdquo b

oot

10 m

s

20 m

s

Ret

ry i

f AC

K is

not

rece

ived

200

ms

any

Wai

t

Max

imum

5 ti

mes

(1s)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 27

Figure 7-7 Reset Timing Sequence in Case of No Response from SoC to Host MCU

MFB (PWR)

MCU sends UART command UART

Command

UART Command

IS20xxS UART

If no response

RST_N

1ms

X ms1ms

1ms

1ms

Note  The MCU sends the UART command again when the SoC is not responding to its first UART command Ifthe SoC is not responding to the second UART command within X ms the MCU forces the system to reset

Figure 7-8 Timing Sequence of Power Drop Protection

BAT_IN +4V

RST_N from Reset IC

Power

SYS_PWR

IS20xxS

Reset OUT VDDGND

MCU Reset

Reset IC

29V

1 It is recommended that the battery be connected on a BAT_IN pin of the SoC for the power supply2 If an external power source or a power adapter is used to provide the power to the SoC (ADAP_IN) use a

voltage supervisor IC3 The RESET IC output pin must be open drain with delay time of le 10 ms and the recommended part is

TCM809SVNB713

74 General Purpose IO pinsThe following table provides the details of various functions that are mapped to the IO pins of the IS20xxS SoCand these IOs are configured by using the IS20XXS_UI tool The first button (Button 0) must be configured as thepower-onoff key and can be set using the PWR pin The remaining pins are configured for any one of the defaultfunctions (short press long press double press and combinations)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 28

Table 7-1 IO Pin Configuration

Sl No Pin Name Buttons Default Functions(1)

1 PowerMFB Button 0 PWR

2 P0_2 Button 1 PlayPause

3 P2_7 Button 2 Volume Up

4 P0_5 Button 3 Volume Down

5 P0_1 Button 4 FWD

6 P0_3 Button 5 REV

Note 1 These functions can be configured using the IS20XXS_UI tool

Few signals are generated to indicate or control outside devices The most popular applications are NFC for easypairing external audio amplifier for louder speaker and buzzer for indication

Table 7-2 IO Pins for Added Functions

Functions(1) IO Configurable Features

Slide switch P0_0P1_5

Buzzer P0_3

NFC detect P0_4P1_5

External amplifier enable P1_5

Note 1 These functions can be configured using the IS20XXS_UI tool

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 29

8 Antenna Placement RuleFor Bluetooth-enabled products the antenna placement affects the overall performance The antenna requires freespace to radiate RF signals and it must not be surrounded by the GND plane

The following figure illustrates a typical example of the good and poor antenna placement on the main applicationboard with the GND plane

Figure 8-1 Antenna Placement Examples

The following figure illustrates the keep-out area recommended for the PCB antenna

Figure 8-2 Keep-Out Area Recommended for PCB Antenna

Note  For additional information on the antenna placement refer to the antenna-specific data sheet from theantenna manufacturer

IS2008SIS2010SIS2013SIS2015SAntenna Placement Rule

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 30

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Figure 2-3 IS2013S and IS2015S Pin Diagram

The following table provides the pin description of the IS2013SIS2015S

Table 2-3 Pin Description

IS2013S andIS2015S Pin No Pin Type(1) Pin Name Description

1 P VDDAO Positive power supply dedicated to codec output amplifiersConnect to CODEC_VO pin

2 O AOHPM Headphone common mode outputsense input

3 O AOHPL Left channel analog headphone output

4 P VDDA Positive power supplyreference voltage for codec connect toCODEC_VO pin

5 P VCOM Internal biasing voltage for codec

6 I MICN1 Mic1 mono differential analog negative input

7 I MICP1 Mic1 mono differential analog positive input

8 P MICBIAS Electric microphone biasing voltage

9 I AIL Left channel single-ended analog inputs

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 13

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

10 P VDD_CORE Core 12V power input connect to CLDO_O pin

11 O P1_2 IO pin default pull high input EEPROM clock SCL

12 IO P1_3 IO pin default pull high input EEPROM data SDA

13 I RST_N System Reset pin active when rising edge

14 P VDD_IO IO power supply input (27-33V) connect to LDO31_VO pin

15 IO P0_1

IO pin default pull-high input(2)

bull FWD key when class 2 RF (default) active-lowbull Class 1 TX Control signal of external RF TR switch

active high

16 I P2_4IO pin default pull high input system configuration

L Boot mode with P2_0 low combination

17 IO P0_4IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0

18 IO P1_5

IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0bull Slide switch detector active-lowbull Buzzer signal output

19 I HCI_RXD HCI UART input data

20 O HCI_TXD HCI UART output data

21 P CODEC_VO 31V LDO output for codec power

22 P LDO31_VIN 31V LDO input connect to SYS_PWR pin

23 P LDO31_VO 31V LDO output

24 P ADAP_IN 5V power adapter input

25 P BAT_IN 33 to 42V Li-ion battery input

26 P SAR_VDD SAR 18V input connect to BK_O pin

27 P SYS_PWR Power output which come from BAT_IN or ADAP_IN

28 P LDO18_VDD 18V LDO VDD Power Input connect to SYS_PWR pin

29 P LDO18_O 18V LDO output

30 I PWR Multi-Function Push button and power on key

31 - NC No Connection

32 I LED2 LED Driver 2

33 I LED1 LED Driver 1

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 14

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

34 IO P0_0IO pin default pull-high input(2)

bull Slide switch detector active-lowbull UARTTX_IND active-low

35 IO P0_3

IO pin default pull-high input(2)

bull REV key (default) active-lowbull Buzzer signal outputbull Out_Ind_1bull Class 1 RX control signal of external RF TR switch

active high

36 I EANEmbedded ROMExternal Flash enable

H Embedded L External Flash

37 P CLDO_O 12V core LDO output

38 P PMIC_IN PMU blocks power input connect to BK_O pin

39 P RFLDO_O 128V RF LDO output

40 P VBG Bandgap output reference for decoupling interference

41 P ULPC_VSUS ULPC 12V output power

42 I XO_N 16 MHz crystal input negative

43 I XO_P 16 MHz crystal input positive

44 P VCC_RFRF power input (128V) for both synthesizer and TXRXblock connect to RFLDO_O pin

45 IO RTX RF path (transmitreceive)

46 I P0_2IO pin default pull-high input(2)

PlayPause key (default) active-low

47 I P2_0IO pin default pull-high input system configuration

H Application L Baseband (IBDK mode)

48 I P2_7IO pin default pull-high input(2)

Volume up key (default) active-low

49 I P3_0IO pin default pull-high input(2)

Line-in detector (default) active-low

50 I P0_5IO pin default pull-high input(2)

Volume down (default) active-low

51 P VDD_IO IO power supply input (27-33V) connect to LDO31_VO pin

52 P AVDD_CDA Supply voltage of audio amplifier

53 P VBP_CDA Reference voltage output

54 O HPON_CDA Negative BTL output of channel-1

55 O HPOP_CDA Positive BTL output of channel-1

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 15

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

56 P PVDD_CDA Supply voltage of power stage ch-1

57 P EP Exposed pads used as ground (GND) pins

Notes 1 The conventions used in the table are indicated as follows

ndash I = Input pinndash O = Output pinndash IO = InputOutput pinndash P = Power pin

2 All IO pins are configured using the UI tool a Windows-based utility

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 16

3 AudioThe input and output audio signals have different stages and each stage is programmed to vary the gain responsecharacteristics For microphones both single-ended inputs and differential inputs are supported To maintain ahigh-quality signal provide a stable bias voltage source to the condenser microphonersquos FET Use the DC-blockingcapacitors at both positive and negative sides of the input Internally this analog signal is converted to 16-bit 8 kHzlinear PCM data

31 Digital Signal ProcessorA Digital Signal Processor (DSP) is used to perform speech and audio processing The advanced speech featuressuch as acoustic echo cancellation and noise reduction are built in To reduce nonlinear distortion and to help echocancellation an outgoing signal level to the speaker is monitored and adjusted to avoid saturation of the speakeroutput or microphone input Adaptive filtering is also applied to track the echo path impulse in response to provide anecho-free and full-duplex user experience

The embedded noise reduction algorithm helps to extract clean speech signals from the noisy inputs capturedby microphones and improves mutual understanding in communication The advanced audio features such asmulti-band dynamic range control parametric multi-band equalizer audio widening and virtual bass are built in Theaudio effect algorithms improve the userrsquos audio listening experience in terms of better quality audio after audiosignal processing

The following figures illustrate the processing flow of speakerphone applications for speech and audio signalprocessing

Figure 3-1 Speech Processing

Figure 3-2 Audio Processing

The DSP parameters such as EQ Speaker Gain Mic Gain Sound Effect and more are configured using the DSPtool For additional information on the DSP tool refer to the IS20xxBM1xBM2x DSP Application Note

IS2008SIS2010SIS2013SIS2015SAudio

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 17

Note  The DSP tool and IS20xxBM1xBM2x DSP Application Note are available for download at the Microchipwebsite

32 CodecThe built-in codec has a high SNR performance and it consists of an ADC a DAC and additional analog circuitry

33 Auxiliary PortThe SoC supports one analog (line-in) signal from the external audio source The analog signal is processed bythe DSP to generate different sound effects (multi-band dynamic range compression and audio widening) which areconfigured using the DSP tool

34 Class D Audio AmplifierThe Class D amplifier has a significant advantage in many applications due to its lower power dissipation whichproduces less heat The IS2013S and IS2015S SoC have a built-in Class D amplifier that reduces circuit board spaceand system cost The efficiency of the amplifier extends the battery life in portable systems

The Class D amplifier is implemented by using a full-bridge output stage A full bridge uses two half-bridge stages todrive the load differentially The Class D amplifier provides a good SNR and enough drive capability for a 4Ω speakerdriver

IS2008SIS2010SIS2013SIS2015SAudio

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 18

4 TransceiverThe SoC is designed and optimized for Bluetooth 24 GHz systems It contains a complete radio frequencytransmitterreceiver section An internal synthesizer generates a stable clock to synchronize with another device

41 TransmitterThe internal Power Amplifier (PA) has a maximum output power of +4 dBm with 20 dB power level control Applythis to Class 2 or Class 3 radios without an external RF PA The transmitter directly performs the IQ conversionto minimize the frequency drift and it can access the 20 dB power range with the temperature compensationmechanism

42 ReceiverThe Low-Noise Amplifier (LNA) operates with TR-combined mode for the single port application It saves the pin onthe package without having an external TXRX switch

The ADC is used to sample the input analog signal and convert it into a digital signal for demodulator analysisA channel filter is integrated into a receiver channel before the ADC to reduce the external component count andincrease the anti-interference capability

The image rejection filter is used to reject the image frequency for the low-IF architecture and it is also intended toreduce the external Band Pass Filter (BPF) component for a super heterodyne architecture

The Received Signal Strength Indicator (RSSI) signal feedback to the processor is used to control the RF outputpower to make a good trade-off for effective distance and current consumption

43 SynthesizerA synthesizer generates a clock for radio transceiver operation The VCO inside with a tunable internal LC tankcan reduce any variation for components A crystal oscillator with an internal digital trimming circuit provides a stableclock for the synthesizer

44 ModemFor Bluetooth 12 specifications and below 1 Mbps is the standard data rate based on the Gaussian Frequency ShiftKeying (GFSK) modulation scheme This basic rate modem meets BDR requirements of Bluetooth 20 with EDRspecifications

For Bluetooth 20 and above specifications EDR is introduced to provide the data rates of 123 Mbps Thisenhanced data rate modem meets EDR requirements of Bluetooth 20 with EDR specifications For the basebandboth BDR and EDR utilize the same 1 MHz symbol rate and 16 kHz slot rate For BDR 1 symbol represents 1-bitHowever each symbol in the payload part of the EDR packets represents 2-bit or 3-bit This is achieved by using twodifferent modulations π4 DQPSK and 8 DPSK

45 Adaptive Frequency Hopping (AFH)The SoC has an AFH function to avoid RF interference It has an algorithm to check the nearby interference and tochoose the clear channel for the transceiver Bluetooth signal

IS2008SIS2010SIS2013SIS2015STransceiver

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 19

5 MicrocontrollerA single-cycle 8-bit microcontroller is built into the SoC to execute the Bluetooth protocols It operates from 16 MHzto higher frequencies where the firmware dynamically adjusts the trade-off between the computing power and thepower consumption In the ROM version the MCU firmware is hard-wired to minimize power consumption for thefirmware execution and to save the external Flash cost

51 MemoryThere are sufficient ROM and RAM to fulfill the processor requirements in which a synchronous single port RAMinterface is used The register bank dedicated single port memory and Flash memory are connected to theprocessor bus The processor coordinates with all link control procedures and the data movement happens using aset of pointer registers

52 External ResetThe IS20xxS SoC provides a Watchdog Timer (WDT) to reset the SoC It has an integrated Power-on Reset (POR)circuit that resets all circuits to a known Power-on state This action is also driven by an external Reset signal whichis used to control the device externally by forcing it into a POR state The RST_N signal input is active-low and noconnection is required in most of the applications

53 Reference ClockThe IS20xxS SoC is composed of an integrated crystal oscillation function that uses a 16 MHz external crystal andtwo specified loading capacitors to provide a high quality system reference timer source Use this feature to removethe initial tolerance frequency errors which are associated with the crystal and its equivalent loading capacitance inthe mass production Achieve the frequency trim by adjusting the crystal loading capacitance through the on-chip trimcapacitors (Ctrim)

The value of the trimming capacitance is 200 fF (200x10-15 F) per LSB at the 5-bit word and the overall adjustableclock frequency is plusmn40 kHz The following figure illustrates the crystal connection of the IS20xxS SoC with twocapacitors

Figure 5-1 Crystal Connection

IS20XXS

XO_N

CL1

XO_P

CL2

IS2008SIS2010SIS2013SIS2015SMicrocontroller

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 20

Notes 1 Ctrim = 200 fF (1 to 31) Cint = 3 pF2 CL = [(CL1 x CL2) (CL1 + CL2)] + (Ctrim 2) + Cint (set trim value as 16 Ctrim = 32 pF)3 For a 16 MHz crystal where CL = 9 pF the CL1 = CL2 = 91 pF)4 For the CL selection refer to the data sheet of the crystal

IS2008SIS2010SIS2013SIS2015SMicrocontroller

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 21

6 Power Management Unit (PMU)The IS20xxS SoC has an integrated PMU The main features of the PMU are a lithium-ion battery charger and avoltage regulator A power switch is used to switch over the power source between a battery and an adapter Alsothe PMU provides current to the LED drivers

61 Charging a BatteryThe IS20xxS SoC has a built-in battery charger which is optimized for lithium-polymer batteries The battery chargerincludes a current sensor for a charging control user programmable current regulator and high accuracy voltageregulator

The charging current parameters are configured by using the UI (IS20XXS_UI) tool Whenever the adapter isplugged-in the charging circuit will be activated Reviving pre-charging constant current mode constant voltagemode and re-charging functions are implemented The maximum charging current is 350 mA The following figureillustrates the charging curve of a battery

Figure 6-1 Battery Charging Curve

62 Voltage MonitoringA 10-bit successive approximation register ADC (SAR ADC) provides a dedicated channel for battery voltage leveldetection The warning level is programmed by using the UI tool The ADC provides a granular resolution to enablethe MCU to take control over the charging process

63 Low Dropout RegulatorA built-in LDO Regulator is used to convert the battery or adapter power for the power supply It also integratesthe hardware architecture to control the power-onoff procedure The built-in programmable LDOs provide power forcodec and digital IO pads Also it is used to buffer the high input voltage from the battery or adapter This LDOrequires a 1 μF bypass capacitor

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 22

64 Switching RegulatorThe built-in programmable output voltage regulator converts the battery voltage to RF and base band core powersupply This converter has a high conversion efficiency and a fast transient response

65 LED DriverThe IS20xxS SoC consists of two LED drivers to control the LEDs The LED drivers provide enough sink current(16-step control and 035 mA for each step) and the LED is connected directly to the IS20xxS SoC

Note  Configure the LED settings using the IS20XXS_UI tool

The following figure illustrates the LED driver in the IS20xxS SoC

Figure 6-2 LED DRIVER

IS20xxS

LED2

SYS_PWR

LED1

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 23

7 Application InformationThis section describes the power supply connection host MCU UART interface and various modes in detail

71 Power SupplyThe following figure illustrates the connection from the BAT_IN pin to various other voltage supply pins of theIS20xxS SoC

The BAT_IN input pin powers the IS20xxS SoC To charge the battery connect the external 5V power adapter toADAP_IN

Figure 7-1 Power Tree Diagram

VDDA VDDAO

VDD_IO

3V LDO

18V Buck

SAR_VDD

LDO31_VIN

CODEC_VO

LDO31_VO

BK_VDD

BK_LX

BK_O

VDD_CORE

VCC_RF

12V LDOPMIC_IN

CLDO_O

RFLDO_O

PVDD_CDA

Li-Io

n BA

T BAT_IN

ADAP_IN

SYS_PWRPower Switch

5V Adapter

(42~30V)

(45~55V)(42~30V)

(30~27V)

(33 ~27V)

(18V)

(12V)

(128V)

72 Host MCU InterfaceAn external MCU controls the IS20xxS SoC using the UART command set The following figure illustrates the UARTinterface between the IS20xxS SoC and an external MCU

Figure 7-2 Host MCU Interface Over UART

IS20xxSHCI_TXD

HCI_RXD

PWR

P0_0

MCUUART_TX

UART_RX

MCU_WAKEUP

BT_WAKEUP

UART Interface

UART Interface

The MCU controls the IS20xxS SoC over the UART interface and wakes up the SoC using the PWR pin The MCUfunction wakes up by connecting to the P0_0 pin of the IS20xxS

Refer to the IS200xIS201xIS202x UART Command SOP document for a list of functions that the IS20xxS SoCsupports and how to use the IS20XXS_UI tool to set up the system using the UART command

Note  The IS200xIS201xIS202x UART Command SOP document is available for download from the Microchipwebsite at IS200xIS201xIS202x UART Command SOP

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 24

73 Timing Sequence of UART ApplicationThe following figures illustrate the various UART control signal timing sequences

Figure 7-3 Power-OnOff Sequence

BAT_IN

SYS_PWR

1 ms

Power- oninitial idle Power-on Power-on Power-off idle

MCU state

MFB (PWR)

BK_OLDO31_VO

400 ms

RST_N

MCU sends UART command (UART_RX)

UART Command

MCU sends power-off UART Command

Power-on ACK ACK ACKIS20xxS response UART state

(UART_TX)

Set ldquoPower-on Directlyrdquo boot

any

10 ms

20 msKeep all IS20xxSand MCU connection to low level

2s

(See Figure 7-4) (See Figure 7-5)

IS20xxS disconnect and auto power-off

gt 1s

Figure 7-4 Timing Sequence of RX Indication after Power-On

Resume 32 kHz mode

MFB (PWR)MCU sends UART command

MFB pulse must be longer than the UART command slot time

150 ms

2 ms 2 ms

Enter 32 kHz mode

1 ms

UART Command

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 25

Figure 7-5 Timing Sequence of Power-Off

BAT_IN +4V

MFB

MCU Sends RST_N

BK_OUT

LDO31_VO

UART Bus

2s 1s

IS20xxS Sends Power-off ACK

Notes 1 EEPROM clock = 100 kHz2 For a byte wire 001 ms x 32 clock x 2 = 640 μs3 It is recommended that ramp-down time be more than 640 μs during the power-off sequence to ensure safe

operation of the device

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 26

Figu

re 7

-6 

Tim

ing

Sequ

ence

of P

ower

-On

(NA

CK

)

BAT

_IN

SYS_

PWR

1 m

s Pow

er-

onin

itial

idle

Pow

er-o

nM

CU

sta

te

MFB

(PW

R)

BK_O

LD

O31

_VO

400

ms

RST

_N

MC

U s

ends

UAR

T co

mm

and

(UAR

T_R

X)

UAR

T C

omm

and

NAC

KPo

wer

-on

ACK

ACK

IS20

xxS

resp

onse

UAR

T st

ate

(UAR

T_TX

)

Set ldquo

Pow

er-o

n D

irect

lyrdquo b

oot

10 m

s

20 m

s

Ret

ry i

f AC

K is

not

rece

ived

200

ms

any

Wai

t

Max

imum

5 ti

mes

(1s)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 27

Figure 7-7 Reset Timing Sequence in Case of No Response from SoC to Host MCU

MFB (PWR)

MCU sends UART command UART

Command

UART Command

IS20xxS UART

If no response

RST_N

1ms

X ms1ms

1ms

1ms

Note  The MCU sends the UART command again when the SoC is not responding to its first UART command Ifthe SoC is not responding to the second UART command within X ms the MCU forces the system to reset

Figure 7-8 Timing Sequence of Power Drop Protection

BAT_IN +4V

RST_N from Reset IC

Power

SYS_PWR

IS20xxS

Reset OUT VDDGND

MCU Reset

Reset IC

29V

1 It is recommended that the battery be connected on a BAT_IN pin of the SoC for the power supply2 If an external power source or a power adapter is used to provide the power to the SoC (ADAP_IN) use a

voltage supervisor IC3 The RESET IC output pin must be open drain with delay time of le 10 ms and the recommended part is

TCM809SVNB713

74 General Purpose IO pinsThe following table provides the details of various functions that are mapped to the IO pins of the IS20xxS SoCand these IOs are configured by using the IS20XXS_UI tool The first button (Button 0) must be configured as thepower-onoff key and can be set using the PWR pin The remaining pins are configured for any one of the defaultfunctions (short press long press double press and combinations)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 28

Table 7-1 IO Pin Configuration

Sl No Pin Name Buttons Default Functions(1)

1 PowerMFB Button 0 PWR

2 P0_2 Button 1 PlayPause

3 P2_7 Button 2 Volume Up

4 P0_5 Button 3 Volume Down

5 P0_1 Button 4 FWD

6 P0_3 Button 5 REV

Note 1 These functions can be configured using the IS20XXS_UI tool

Few signals are generated to indicate or control outside devices The most popular applications are NFC for easypairing external audio amplifier for louder speaker and buzzer for indication

Table 7-2 IO Pins for Added Functions

Functions(1) IO Configurable Features

Slide switch P0_0P1_5

Buzzer P0_3

NFC detect P0_4P1_5

External amplifier enable P1_5

Note 1 These functions can be configured using the IS20XXS_UI tool

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 29

8 Antenna Placement RuleFor Bluetooth-enabled products the antenna placement affects the overall performance The antenna requires freespace to radiate RF signals and it must not be surrounded by the GND plane

The following figure illustrates a typical example of the good and poor antenna placement on the main applicationboard with the GND plane

Figure 8-1 Antenna Placement Examples

The following figure illustrates the keep-out area recommended for the PCB antenna

Figure 8-2 Keep-Out Area Recommended for PCB Antenna

Note  For additional information on the antenna placement refer to the antenna-specific data sheet from theantenna manufacturer

IS2008SIS2010SIS2013SIS2015SAntenna Placement Rule

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 30

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

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copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

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copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

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copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

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All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

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Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

10 P VDD_CORE Core 12V power input connect to CLDO_O pin

11 O P1_2 IO pin default pull high input EEPROM clock SCL

12 IO P1_3 IO pin default pull high input EEPROM data SDA

13 I RST_N System Reset pin active when rising edge

14 P VDD_IO IO power supply input (27-33V) connect to LDO31_VO pin

15 IO P0_1

IO pin default pull-high input(2)

bull FWD key when class 2 RF (default) active-lowbull Class 1 TX Control signal of external RF TR switch

active high

16 I P2_4IO pin default pull high input system configuration

L Boot mode with P2_0 low combination

17 IO P0_4IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0

18 IO P1_5

IO pin default pull high input(2)

bull NFC detection pin active-lowbull Out_Ind_0bull Slide switch detector active-lowbull Buzzer signal output

19 I HCI_RXD HCI UART input data

20 O HCI_TXD HCI UART output data

21 P CODEC_VO 31V LDO output for codec power

22 P LDO31_VIN 31V LDO input connect to SYS_PWR pin

23 P LDO31_VO 31V LDO output

24 P ADAP_IN 5V power adapter input

25 P BAT_IN 33 to 42V Li-ion battery input

26 P SAR_VDD SAR 18V input connect to BK_O pin

27 P SYS_PWR Power output which come from BAT_IN or ADAP_IN

28 P LDO18_VDD 18V LDO VDD Power Input connect to SYS_PWR pin

29 P LDO18_O 18V LDO output

30 I PWR Multi-Function Push button and power on key

31 - NC No Connection

32 I LED2 LED Driver 2

33 I LED1 LED Driver 1

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 14

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

34 IO P0_0IO pin default pull-high input(2)

bull Slide switch detector active-lowbull UARTTX_IND active-low

35 IO P0_3

IO pin default pull-high input(2)

bull REV key (default) active-lowbull Buzzer signal outputbull Out_Ind_1bull Class 1 RX control signal of external RF TR switch

active high

36 I EANEmbedded ROMExternal Flash enable

H Embedded L External Flash

37 P CLDO_O 12V core LDO output

38 P PMIC_IN PMU blocks power input connect to BK_O pin

39 P RFLDO_O 128V RF LDO output

40 P VBG Bandgap output reference for decoupling interference

41 P ULPC_VSUS ULPC 12V output power

42 I XO_N 16 MHz crystal input negative

43 I XO_P 16 MHz crystal input positive

44 P VCC_RFRF power input (128V) for both synthesizer and TXRXblock connect to RFLDO_O pin

45 IO RTX RF path (transmitreceive)

46 I P0_2IO pin default pull-high input(2)

PlayPause key (default) active-low

47 I P2_0IO pin default pull-high input system configuration

H Application L Baseband (IBDK mode)

48 I P2_7IO pin default pull-high input(2)

Volume up key (default) active-low

49 I P3_0IO pin default pull-high input(2)

Line-in detector (default) active-low

50 I P0_5IO pin default pull-high input(2)

Volume down (default) active-low

51 P VDD_IO IO power supply input (27-33V) connect to LDO31_VO pin

52 P AVDD_CDA Supply voltage of audio amplifier

53 P VBP_CDA Reference voltage output

54 O HPON_CDA Negative BTL output of channel-1

55 O HPOP_CDA Positive BTL output of channel-1

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 15

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

56 P PVDD_CDA Supply voltage of power stage ch-1

57 P EP Exposed pads used as ground (GND) pins

Notes 1 The conventions used in the table are indicated as follows

ndash I = Input pinndash O = Output pinndash IO = InputOutput pinndash P = Power pin

2 All IO pins are configured using the UI tool a Windows-based utility

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 16

3 AudioThe input and output audio signals have different stages and each stage is programmed to vary the gain responsecharacteristics For microphones both single-ended inputs and differential inputs are supported To maintain ahigh-quality signal provide a stable bias voltage source to the condenser microphonersquos FET Use the DC-blockingcapacitors at both positive and negative sides of the input Internally this analog signal is converted to 16-bit 8 kHzlinear PCM data

31 Digital Signal ProcessorA Digital Signal Processor (DSP) is used to perform speech and audio processing The advanced speech featuressuch as acoustic echo cancellation and noise reduction are built in To reduce nonlinear distortion and to help echocancellation an outgoing signal level to the speaker is monitored and adjusted to avoid saturation of the speakeroutput or microphone input Adaptive filtering is also applied to track the echo path impulse in response to provide anecho-free and full-duplex user experience

The embedded noise reduction algorithm helps to extract clean speech signals from the noisy inputs capturedby microphones and improves mutual understanding in communication The advanced audio features such asmulti-band dynamic range control parametric multi-band equalizer audio widening and virtual bass are built in Theaudio effect algorithms improve the userrsquos audio listening experience in terms of better quality audio after audiosignal processing

The following figures illustrate the processing flow of speakerphone applications for speech and audio signalprocessing

Figure 3-1 Speech Processing

Figure 3-2 Audio Processing

The DSP parameters such as EQ Speaker Gain Mic Gain Sound Effect and more are configured using the DSPtool For additional information on the DSP tool refer to the IS20xxBM1xBM2x DSP Application Note

IS2008SIS2010SIS2013SIS2015SAudio

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 17

Note  The DSP tool and IS20xxBM1xBM2x DSP Application Note are available for download at the Microchipwebsite

32 CodecThe built-in codec has a high SNR performance and it consists of an ADC a DAC and additional analog circuitry

33 Auxiliary PortThe SoC supports one analog (line-in) signal from the external audio source The analog signal is processed bythe DSP to generate different sound effects (multi-band dynamic range compression and audio widening) which areconfigured using the DSP tool

34 Class D Audio AmplifierThe Class D amplifier has a significant advantage in many applications due to its lower power dissipation whichproduces less heat The IS2013S and IS2015S SoC have a built-in Class D amplifier that reduces circuit board spaceand system cost The efficiency of the amplifier extends the battery life in portable systems

The Class D amplifier is implemented by using a full-bridge output stage A full bridge uses two half-bridge stages todrive the load differentially The Class D amplifier provides a good SNR and enough drive capability for a 4Ω speakerdriver

IS2008SIS2010SIS2013SIS2015SAudio

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 18

4 TransceiverThe SoC is designed and optimized for Bluetooth 24 GHz systems It contains a complete radio frequencytransmitterreceiver section An internal synthesizer generates a stable clock to synchronize with another device

41 TransmitterThe internal Power Amplifier (PA) has a maximum output power of +4 dBm with 20 dB power level control Applythis to Class 2 or Class 3 radios without an external RF PA The transmitter directly performs the IQ conversionto minimize the frequency drift and it can access the 20 dB power range with the temperature compensationmechanism

42 ReceiverThe Low-Noise Amplifier (LNA) operates with TR-combined mode for the single port application It saves the pin onthe package without having an external TXRX switch

The ADC is used to sample the input analog signal and convert it into a digital signal for demodulator analysisA channel filter is integrated into a receiver channel before the ADC to reduce the external component count andincrease the anti-interference capability

The image rejection filter is used to reject the image frequency for the low-IF architecture and it is also intended toreduce the external Band Pass Filter (BPF) component for a super heterodyne architecture

The Received Signal Strength Indicator (RSSI) signal feedback to the processor is used to control the RF outputpower to make a good trade-off for effective distance and current consumption

43 SynthesizerA synthesizer generates a clock for radio transceiver operation The VCO inside with a tunable internal LC tankcan reduce any variation for components A crystal oscillator with an internal digital trimming circuit provides a stableclock for the synthesizer

44 ModemFor Bluetooth 12 specifications and below 1 Mbps is the standard data rate based on the Gaussian Frequency ShiftKeying (GFSK) modulation scheme This basic rate modem meets BDR requirements of Bluetooth 20 with EDRspecifications

For Bluetooth 20 and above specifications EDR is introduced to provide the data rates of 123 Mbps Thisenhanced data rate modem meets EDR requirements of Bluetooth 20 with EDR specifications For the basebandboth BDR and EDR utilize the same 1 MHz symbol rate and 16 kHz slot rate For BDR 1 symbol represents 1-bitHowever each symbol in the payload part of the EDR packets represents 2-bit or 3-bit This is achieved by using twodifferent modulations π4 DQPSK and 8 DPSK

45 Adaptive Frequency Hopping (AFH)The SoC has an AFH function to avoid RF interference It has an algorithm to check the nearby interference and tochoose the clear channel for the transceiver Bluetooth signal

IS2008SIS2010SIS2013SIS2015STransceiver

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 19

5 MicrocontrollerA single-cycle 8-bit microcontroller is built into the SoC to execute the Bluetooth protocols It operates from 16 MHzto higher frequencies where the firmware dynamically adjusts the trade-off between the computing power and thepower consumption In the ROM version the MCU firmware is hard-wired to minimize power consumption for thefirmware execution and to save the external Flash cost

51 MemoryThere are sufficient ROM and RAM to fulfill the processor requirements in which a synchronous single port RAMinterface is used The register bank dedicated single port memory and Flash memory are connected to theprocessor bus The processor coordinates with all link control procedures and the data movement happens using aset of pointer registers

52 External ResetThe IS20xxS SoC provides a Watchdog Timer (WDT) to reset the SoC It has an integrated Power-on Reset (POR)circuit that resets all circuits to a known Power-on state This action is also driven by an external Reset signal whichis used to control the device externally by forcing it into a POR state The RST_N signal input is active-low and noconnection is required in most of the applications

53 Reference ClockThe IS20xxS SoC is composed of an integrated crystal oscillation function that uses a 16 MHz external crystal andtwo specified loading capacitors to provide a high quality system reference timer source Use this feature to removethe initial tolerance frequency errors which are associated with the crystal and its equivalent loading capacitance inthe mass production Achieve the frequency trim by adjusting the crystal loading capacitance through the on-chip trimcapacitors (Ctrim)

The value of the trimming capacitance is 200 fF (200x10-15 F) per LSB at the 5-bit word and the overall adjustableclock frequency is plusmn40 kHz The following figure illustrates the crystal connection of the IS20xxS SoC with twocapacitors

Figure 5-1 Crystal Connection

IS20XXS

XO_N

CL1

XO_P

CL2

IS2008SIS2010SIS2013SIS2015SMicrocontroller

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 20

Notes 1 Ctrim = 200 fF (1 to 31) Cint = 3 pF2 CL = [(CL1 x CL2) (CL1 + CL2)] + (Ctrim 2) + Cint (set trim value as 16 Ctrim = 32 pF)3 For a 16 MHz crystal where CL = 9 pF the CL1 = CL2 = 91 pF)4 For the CL selection refer to the data sheet of the crystal

IS2008SIS2010SIS2013SIS2015SMicrocontroller

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 21

6 Power Management Unit (PMU)The IS20xxS SoC has an integrated PMU The main features of the PMU are a lithium-ion battery charger and avoltage regulator A power switch is used to switch over the power source between a battery and an adapter Alsothe PMU provides current to the LED drivers

61 Charging a BatteryThe IS20xxS SoC has a built-in battery charger which is optimized for lithium-polymer batteries The battery chargerincludes a current sensor for a charging control user programmable current regulator and high accuracy voltageregulator

The charging current parameters are configured by using the UI (IS20XXS_UI) tool Whenever the adapter isplugged-in the charging circuit will be activated Reviving pre-charging constant current mode constant voltagemode and re-charging functions are implemented The maximum charging current is 350 mA The following figureillustrates the charging curve of a battery

Figure 6-1 Battery Charging Curve

62 Voltage MonitoringA 10-bit successive approximation register ADC (SAR ADC) provides a dedicated channel for battery voltage leveldetection The warning level is programmed by using the UI tool The ADC provides a granular resolution to enablethe MCU to take control over the charging process

63 Low Dropout RegulatorA built-in LDO Regulator is used to convert the battery or adapter power for the power supply It also integratesthe hardware architecture to control the power-onoff procedure The built-in programmable LDOs provide power forcodec and digital IO pads Also it is used to buffer the high input voltage from the battery or adapter This LDOrequires a 1 μF bypass capacitor

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 22

64 Switching RegulatorThe built-in programmable output voltage regulator converts the battery voltage to RF and base band core powersupply This converter has a high conversion efficiency and a fast transient response

65 LED DriverThe IS20xxS SoC consists of two LED drivers to control the LEDs The LED drivers provide enough sink current(16-step control and 035 mA for each step) and the LED is connected directly to the IS20xxS SoC

Note  Configure the LED settings using the IS20XXS_UI tool

The following figure illustrates the LED driver in the IS20xxS SoC

Figure 6-2 LED DRIVER

IS20xxS

LED2

SYS_PWR

LED1

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 23

7 Application InformationThis section describes the power supply connection host MCU UART interface and various modes in detail

71 Power SupplyThe following figure illustrates the connection from the BAT_IN pin to various other voltage supply pins of theIS20xxS SoC

The BAT_IN input pin powers the IS20xxS SoC To charge the battery connect the external 5V power adapter toADAP_IN

Figure 7-1 Power Tree Diagram

VDDA VDDAO

VDD_IO

3V LDO

18V Buck

SAR_VDD

LDO31_VIN

CODEC_VO

LDO31_VO

BK_VDD

BK_LX

BK_O

VDD_CORE

VCC_RF

12V LDOPMIC_IN

CLDO_O

RFLDO_O

PVDD_CDA

Li-Io

n BA

T BAT_IN

ADAP_IN

SYS_PWRPower Switch

5V Adapter

(42~30V)

(45~55V)(42~30V)

(30~27V)

(33 ~27V)

(18V)

(12V)

(128V)

72 Host MCU InterfaceAn external MCU controls the IS20xxS SoC using the UART command set The following figure illustrates the UARTinterface between the IS20xxS SoC and an external MCU

Figure 7-2 Host MCU Interface Over UART

IS20xxSHCI_TXD

HCI_RXD

PWR

P0_0

MCUUART_TX

UART_RX

MCU_WAKEUP

BT_WAKEUP

UART Interface

UART Interface

The MCU controls the IS20xxS SoC over the UART interface and wakes up the SoC using the PWR pin The MCUfunction wakes up by connecting to the P0_0 pin of the IS20xxS

Refer to the IS200xIS201xIS202x UART Command SOP document for a list of functions that the IS20xxS SoCsupports and how to use the IS20XXS_UI tool to set up the system using the UART command

Note  The IS200xIS201xIS202x UART Command SOP document is available for download from the Microchipwebsite at IS200xIS201xIS202x UART Command SOP

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 24

73 Timing Sequence of UART ApplicationThe following figures illustrate the various UART control signal timing sequences

Figure 7-3 Power-OnOff Sequence

BAT_IN

SYS_PWR

1 ms

Power- oninitial idle Power-on Power-on Power-off idle

MCU state

MFB (PWR)

BK_OLDO31_VO

400 ms

RST_N

MCU sends UART command (UART_RX)

UART Command

MCU sends power-off UART Command

Power-on ACK ACK ACKIS20xxS response UART state

(UART_TX)

Set ldquoPower-on Directlyrdquo boot

any

10 ms

20 msKeep all IS20xxSand MCU connection to low level

2s

(See Figure 7-4) (See Figure 7-5)

IS20xxS disconnect and auto power-off

gt 1s

Figure 7-4 Timing Sequence of RX Indication after Power-On

Resume 32 kHz mode

MFB (PWR)MCU sends UART command

MFB pulse must be longer than the UART command slot time

150 ms

2 ms 2 ms

Enter 32 kHz mode

1 ms

UART Command

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 25

Figure 7-5 Timing Sequence of Power-Off

BAT_IN +4V

MFB

MCU Sends RST_N

BK_OUT

LDO31_VO

UART Bus

2s 1s

IS20xxS Sends Power-off ACK

Notes 1 EEPROM clock = 100 kHz2 For a byte wire 001 ms x 32 clock x 2 = 640 μs3 It is recommended that ramp-down time be more than 640 μs during the power-off sequence to ensure safe

operation of the device

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 26

Figu

re 7

-6 

Tim

ing

Sequ

ence

of P

ower

-On

(NA

CK

)

BAT

_IN

SYS_

PWR

1 m

s Pow

er-

onin

itial

idle

Pow

er-o

nM

CU

sta

te

MFB

(PW

R)

BK_O

LD

O31

_VO

400

ms

RST

_N

MC

U s

ends

UAR

T co

mm

and

(UAR

T_R

X)

UAR

T C

omm

and

NAC

KPo

wer

-on

ACK

ACK

IS20

xxS

resp

onse

UAR

T st

ate

(UAR

T_TX

)

Set ldquo

Pow

er-o

n D

irect

lyrdquo b

oot

10 m

s

20 m

s

Ret

ry i

f AC

K is

not

rece

ived

200

ms

any

Wai

t

Max

imum

5 ti

mes

(1s)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 27

Figure 7-7 Reset Timing Sequence in Case of No Response from SoC to Host MCU

MFB (PWR)

MCU sends UART command UART

Command

UART Command

IS20xxS UART

If no response

RST_N

1ms

X ms1ms

1ms

1ms

Note  The MCU sends the UART command again when the SoC is not responding to its first UART command Ifthe SoC is not responding to the second UART command within X ms the MCU forces the system to reset

Figure 7-8 Timing Sequence of Power Drop Protection

BAT_IN +4V

RST_N from Reset IC

Power

SYS_PWR

IS20xxS

Reset OUT VDDGND

MCU Reset

Reset IC

29V

1 It is recommended that the battery be connected on a BAT_IN pin of the SoC for the power supply2 If an external power source or a power adapter is used to provide the power to the SoC (ADAP_IN) use a

voltage supervisor IC3 The RESET IC output pin must be open drain with delay time of le 10 ms and the recommended part is

TCM809SVNB713

74 General Purpose IO pinsThe following table provides the details of various functions that are mapped to the IO pins of the IS20xxS SoCand these IOs are configured by using the IS20XXS_UI tool The first button (Button 0) must be configured as thepower-onoff key and can be set using the PWR pin The remaining pins are configured for any one of the defaultfunctions (short press long press double press and combinations)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 28

Table 7-1 IO Pin Configuration

Sl No Pin Name Buttons Default Functions(1)

1 PowerMFB Button 0 PWR

2 P0_2 Button 1 PlayPause

3 P2_7 Button 2 Volume Up

4 P0_5 Button 3 Volume Down

5 P0_1 Button 4 FWD

6 P0_3 Button 5 REV

Note 1 These functions can be configured using the IS20XXS_UI tool

Few signals are generated to indicate or control outside devices The most popular applications are NFC for easypairing external audio amplifier for louder speaker and buzzer for indication

Table 7-2 IO Pins for Added Functions

Functions(1) IO Configurable Features

Slide switch P0_0P1_5

Buzzer P0_3

NFC detect P0_4P1_5

External amplifier enable P1_5

Note 1 These functions can be configured using the IS20XXS_UI tool

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 29

8 Antenna Placement RuleFor Bluetooth-enabled products the antenna placement affects the overall performance The antenna requires freespace to radiate RF signals and it must not be surrounded by the GND plane

The following figure illustrates a typical example of the good and poor antenna placement on the main applicationboard with the GND plane

Figure 8-1 Antenna Placement Examples

The following figure illustrates the keep-out area recommended for the PCB antenna

Figure 8-2 Keep-Out Area Recommended for PCB Antenna

Note  For additional information on the antenna placement refer to the antenna-specific data sheet from theantenna manufacturer

IS2008SIS2010SIS2013SIS2015SAntenna Placement Rule

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 30

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

34 IO P0_0IO pin default pull-high input(2)

bull Slide switch detector active-lowbull UARTTX_IND active-low

35 IO P0_3

IO pin default pull-high input(2)

bull REV key (default) active-lowbull Buzzer signal outputbull Out_Ind_1bull Class 1 RX control signal of external RF TR switch

active high

36 I EANEmbedded ROMExternal Flash enable

H Embedded L External Flash

37 P CLDO_O 12V core LDO output

38 P PMIC_IN PMU blocks power input connect to BK_O pin

39 P RFLDO_O 128V RF LDO output

40 P VBG Bandgap output reference for decoupling interference

41 P ULPC_VSUS ULPC 12V output power

42 I XO_N 16 MHz crystal input negative

43 I XO_P 16 MHz crystal input positive

44 P VCC_RFRF power input (128V) for both synthesizer and TXRXblock connect to RFLDO_O pin

45 IO RTX RF path (transmitreceive)

46 I P0_2IO pin default pull-high input(2)

PlayPause key (default) active-low

47 I P2_0IO pin default pull-high input system configuration

H Application L Baseband (IBDK mode)

48 I P2_7IO pin default pull-high input(2)

Volume up key (default) active-low

49 I P3_0IO pin default pull-high input(2)

Line-in detector (default) active-low

50 I P0_5IO pin default pull-high input(2)

Volume down (default) active-low

51 P VDD_IO IO power supply input (27-33V) connect to LDO31_VO pin

52 P AVDD_CDA Supply voltage of audio amplifier

53 P VBP_CDA Reference voltage output

54 O HPON_CDA Negative BTL output of channel-1

55 O HPOP_CDA Positive BTL output of channel-1

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 15

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

56 P PVDD_CDA Supply voltage of power stage ch-1

57 P EP Exposed pads used as ground (GND) pins

Notes 1 The conventions used in the table are indicated as follows

ndash I = Input pinndash O = Output pinndash IO = InputOutput pinndash P = Power pin

2 All IO pins are configured using the UI tool a Windows-based utility

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 16

3 AudioThe input and output audio signals have different stages and each stage is programmed to vary the gain responsecharacteristics For microphones both single-ended inputs and differential inputs are supported To maintain ahigh-quality signal provide a stable bias voltage source to the condenser microphonersquos FET Use the DC-blockingcapacitors at both positive and negative sides of the input Internally this analog signal is converted to 16-bit 8 kHzlinear PCM data

31 Digital Signal ProcessorA Digital Signal Processor (DSP) is used to perform speech and audio processing The advanced speech featuressuch as acoustic echo cancellation and noise reduction are built in To reduce nonlinear distortion and to help echocancellation an outgoing signal level to the speaker is monitored and adjusted to avoid saturation of the speakeroutput or microphone input Adaptive filtering is also applied to track the echo path impulse in response to provide anecho-free and full-duplex user experience

The embedded noise reduction algorithm helps to extract clean speech signals from the noisy inputs capturedby microphones and improves mutual understanding in communication The advanced audio features such asmulti-band dynamic range control parametric multi-band equalizer audio widening and virtual bass are built in Theaudio effect algorithms improve the userrsquos audio listening experience in terms of better quality audio after audiosignal processing

The following figures illustrate the processing flow of speakerphone applications for speech and audio signalprocessing

Figure 3-1 Speech Processing

Figure 3-2 Audio Processing

The DSP parameters such as EQ Speaker Gain Mic Gain Sound Effect and more are configured using the DSPtool For additional information on the DSP tool refer to the IS20xxBM1xBM2x DSP Application Note

IS2008SIS2010SIS2013SIS2015SAudio

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 17

Note  The DSP tool and IS20xxBM1xBM2x DSP Application Note are available for download at the Microchipwebsite

32 CodecThe built-in codec has a high SNR performance and it consists of an ADC a DAC and additional analog circuitry

33 Auxiliary PortThe SoC supports one analog (line-in) signal from the external audio source The analog signal is processed bythe DSP to generate different sound effects (multi-band dynamic range compression and audio widening) which areconfigured using the DSP tool

34 Class D Audio AmplifierThe Class D amplifier has a significant advantage in many applications due to its lower power dissipation whichproduces less heat The IS2013S and IS2015S SoC have a built-in Class D amplifier that reduces circuit board spaceand system cost The efficiency of the amplifier extends the battery life in portable systems

The Class D amplifier is implemented by using a full-bridge output stage A full bridge uses two half-bridge stages todrive the load differentially The Class D amplifier provides a good SNR and enough drive capability for a 4Ω speakerdriver

IS2008SIS2010SIS2013SIS2015SAudio

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 18

4 TransceiverThe SoC is designed and optimized for Bluetooth 24 GHz systems It contains a complete radio frequencytransmitterreceiver section An internal synthesizer generates a stable clock to synchronize with another device

41 TransmitterThe internal Power Amplifier (PA) has a maximum output power of +4 dBm with 20 dB power level control Applythis to Class 2 or Class 3 radios without an external RF PA The transmitter directly performs the IQ conversionto minimize the frequency drift and it can access the 20 dB power range with the temperature compensationmechanism

42 ReceiverThe Low-Noise Amplifier (LNA) operates with TR-combined mode for the single port application It saves the pin onthe package without having an external TXRX switch

The ADC is used to sample the input analog signal and convert it into a digital signal for demodulator analysisA channel filter is integrated into a receiver channel before the ADC to reduce the external component count andincrease the anti-interference capability

The image rejection filter is used to reject the image frequency for the low-IF architecture and it is also intended toreduce the external Band Pass Filter (BPF) component for a super heterodyne architecture

The Received Signal Strength Indicator (RSSI) signal feedback to the processor is used to control the RF outputpower to make a good trade-off for effective distance and current consumption

43 SynthesizerA synthesizer generates a clock for radio transceiver operation The VCO inside with a tunable internal LC tankcan reduce any variation for components A crystal oscillator with an internal digital trimming circuit provides a stableclock for the synthesizer

44 ModemFor Bluetooth 12 specifications and below 1 Mbps is the standard data rate based on the Gaussian Frequency ShiftKeying (GFSK) modulation scheme This basic rate modem meets BDR requirements of Bluetooth 20 with EDRspecifications

For Bluetooth 20 and above specifications EDR is introduced to provide the data rates of 123 Mbps Thisenhanced data rate modem meets EDR requirements of Bluetooth 20 with EDR specifications For the basebandboth BDR and EDR utilize the same 1 MHz symbol rate and 16 kHz slot rate For BDR 1 symbol represents 1-bitHowever each symbol in the payload part of the EDR packets represents 2-bit or 3-bit This is achieved by using twodifferent modulations π4 DQPSK and 8 DPSK

45 Adaptive Frequency Hopping (AFH)The SoC has an AFH function to avoid RF interference It has an algorithm to check the nearby interference and tochoose the clear channel for the transceiver Bluetooth signal

IS2008SIS2010SIS2013SIS2015STransceiver

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 19

5 MicrocontrollerA single-cycle 8-bit microcontroller is built into the SoC to execute the Bluetooth protocols It operates from 16 MHzto higher frequencies where the firmware dynamically adjusts the trade-off between the computing power and thepower consumption In the ROM version the MCU firmware is hard-wired to minimize power consumption for thefirmware execution and to save the external Flash cost

51 MemoryThere are sufficient ROM and RAM to fulfill the processor requirements in which a synchronous single port RAMinterface is used The register bank dedicated single port memory and Flash memory are connected to theprocessor bus The processor coordinates with all link control procedures and the data movement happens using aset of pointer registers

52 External ResetThe IS20xxS SoC provides a Watchdog Timer (WDT) to reset the SoC It has an integrated Power-on Reset (POR)circuit that resets all circuits to a known Power-on state This action is also driven by an external Reset signal whichis used to control the device externally by forcing it into a POR state The RST_N signal input is active-low and noconnection is required in most of the applications

53 Reference ClockThe IS20xxS SoC is composed of an integrated crystal oscillation function that uses a 16 MHz external crystal andtwo specified loading capacitors to provide a high quality system reference timer source Use this feature to removethe initial tolerance frequency errors which are associated with the crystal and its equivalent loading capacitance inthe mass production Achieve the frequency trim by adjusting the crystal loading capacitance through the on-chip trimcapacitors (Ctrim)

The value of the trimming capacitance is 200 fF (200x10-15 F) per LSB at the 5-bit word and the overall adjustableclock frequency is plusmn40 kHz The following figure illustrates the crystal connection of the IS20xxS SoC with twocapacitors

Figure 5-1 Crystal Connection

IS20XXS

XO_N

CL1

XO_P

CL2

IS2008SIS2010SIS2013SIS2015SMicrocontroller

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 20

Notes 1 Ctrim = 200 fF (1 to 31) Cint = 3 pF2 CL = [(CL1 x CL2) (CL1 + CL2)] + (Ctrim 2) + Cint (set trim value as 16 Ctrim = 32 pF)3 For a 16 MHz crystal where CL = 9 pF the CL1 = CL2 = 91 pF)4 For the CL selection refer to the data sheet of the crystal

IS2008SIS2010SIS2013SIS2015SMicrocontroller

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 21

6 Power Management Unit (PMU)The IS20xxS SoC has an integrated PMU The main features of the PMU are a lithium-ion battery charger and avoltage regulator A power switch is used to switch over the power source between a battery and an adapter Alsothe PMU provides current to the LED drivers

61 Charging a BatteryThe IS20xxS SoC has a built-in battery charger which is optimized for lithium-polymer batteries The battery chargerincludes a current sensor for a charging control user programmable current regulator and high accuracy voltageregulator

The charging current parameters are configured by using the UI (IS20XXS_UI) tool Whenever the adapter isplugged-in the charging circuit will be activated Reviving pre-charging constant current mode constant voltagemode and re-charging functions are implemented The maximum charging current is 350 mA The following figureillustrates the charging curve of a battery

Figure 6-1 Battery Charging Curve

62 Voltage MonitoringA 10-bit successive approximation register ADC (SAR ADC) provides a dedicated channel for battery voltage leveldetection The warning level is programmed by using the UI tool The ADC provides a granular resolution to enablethe MCU to take control over the charging process

63 Low Dropout RegulatorA built-in LDO Regulator is used to convert the battery or adapter power for the power supply It also integratesthe hardware architecture to control the power-onoff procedure The built-in programmable LDOs provide power forcodec and digital IO pads Also it is used to buffer the high input voltage from the battery or adapter This LDOrequires a 1 μF bypass capacitor

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 22

64 Switching RegulatorThe built-in programmable output voltage regulator converts the battery voltage to RF and base band core powersupply This converter has a high conversion efficiency and a fast transient response

65 LED DriverThe IS20xxS SoC consists of two LED drivers to control the LEDs The LED drivers provide enough sink current(16-step control and 035 mA for each step) and the LED is connected directly to the IS20xxS SoC

Note  Configure the LED settings using the IS20XXS_UI tool

The following figure illustrates the LED driver in the IS20xxS SoC

Figure 6-2 LED DRIVER

IS20xxS

LED2

SYS_PWR

LED1

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 23

7 Application InformationThis section describes the power supply connection host MCU UART interface and various modes in detail

71 Power SupplyThe following figure illustrates the connection from the BAT_IN pin to various other voltage supply pins of theIS20xxS SoC

The BAT_IN input pin powers the IS20xxS SoC To charge the battery connect the external 5V power adapter toADAP_IN

Figure 7-1 Power Tree Diagram

VDDA VDDAO

VDD_IO

3V LDO

18V Buck

SAR_VDD

LDO31_VIN

CODEC_VO

LDO31_VO

BK_VDD

BK_LX

BK_O

VDD_CORE

VCC_RF

12V LDOPMIC_IN

CLDO_O

RFLDO_O

PVDD_CDA

Li-Io

n BA

T BAT_IN

ADAP_IN

SYS_PWRPower Switch

5V Adapter

(42~30V)

(45~55V)(42~30V)

(30~27V)

(33 ~27V)

(18V)

(12V)

(128V)

72 Host MCU InterfaceAn external MCU controls the IS20xxS SoC using the UART command set The following figure illustrates the UARTinterface between the IS20xxS SoC and an external MCU

Figure 7-2 Host MCU Interface Over UART

IS20xxSHCI_TXD

HCI_RXD

PWR

P0_0

MCUUART_TX

UART_RX

MCU_WAKEUP

BT_WAKEUP

UART Interface

UART Interface

The MCU controls the IS20xxS SoC over the UART interface and wakes up the SoC using the PWR pin The MCUfunction wakes up by connecting to the P0_0 pin of the IS20xxS

Refer to the IS200xIS201xIS202x UART Command SOP document for a list of functions that the IS20xxS SoCsupports and how to use the IS20XXS_UI tool to set up the system using the UART command

Note  The IS200xIS201xIS202x UART Command SOP document is available for download from the Microchipwebsite at IS200xIS201xIS202x UART Command SOP

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 24

73 Timing Sequence of UART ApplicationThe following figures illustrate the various UART control signal timing sequences

Figure 7-3 Power-OnOff Sequence

BAT_IN

SYS_PWR

1 ms

Power- oninitial idle Power-on Power-on Power-off idle

MCU state

MFB (PWR)

BK_OLDO31_VO

400 ms

RST_N

MCU sends UART command (UART_RX)

UART Command

MCU sends power-off UART Command

Power-on ACK ACK ACKIS20xxS response UART state

(UART_TX)

Set ldquoPower-on Directlyrdquo boot

any

10 ms

20 msKeep all IS20xxSand MCU connection to low level

2s

(See Figure 7-4) (See Figure 7-5)

IS20xxS disconnect and auto power-off

gt 1s

Figure 7-4 Timing Sequence of RX Indication after Power-On

Resume 32 kHz mode

MFB (PWR)MCU sends UART command

MFB pulse must be longer than the UART command slot time

150 ms

2 ms 2 ms

Enter 32 kHz mode

1 ms

UART Command

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 25

Figure 7-5 Timing Sequence of Power-Off

BAT_IN +4V

MFB

MCU Sends RST_N

BK_OUT

LDO31_VO

UART Bus

2s 1s

IS20xxS Sends Power-off ACK

Notes 1 EEPROM clock = 100 kHz2 For a byte wire 001 ms x 32 clock x 2 = 640 μs3 It is recommended that ramp-down time be more than 640 μs during the power-off sequence to ensure safe

operation of the device

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 26

Figu

re 7

-6 

Tim

ing

Sequ

ence

of P

ower

-On

(NA

CK

)

BAT

_IN

SYS_

PWR

1 m

s Pow

er-

onin

itial

idle

Pow

er-o

nM

CU

sta

te

MFB

(PW

R)

BK_O

LD

O31

_VO

400

ms

RST

_N

MC

U s

ends

UAR

T co

mm

and

(UAR

T_R

X)

UAR

T C

omm

and

NAC

KPo

wer

-on

ACK

ACK

IS20

xxS

resp

onse

UAR

T st

ate

(UAR

T_TX

)

Set ldquo

Pow

er-o

n D

irect

lyrdquo b

oot

10 m

s

20 m

s

Ret

ry i

f AC

K is

not

rece

ived

200

ms

any

Wai

t

Max

imum

5 ti

mes

(1s)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 27

Figure 7-7 Reset Timing Sequence in Case of No Response from SoC to Host MCU

MFB (PWR)

MCU sends UART command UART

Command

UART Command

IS20xxS UART

If no response

RST_N

1ms

X ms1ms

1ms

1ms

Note  The MCU sends the UART command again when the SoC is not responding to its first UART command Ifthe SoC is not responding to the second UART command within X ms the MCU forces the system to reset

Figure 7-8 Timing Sequence of Power Drop Protection

BAT_IN +4V

RST_N from Reset IC

Power

SYS_PWR

IS20xxS

Reset OUT VDDGND

MCU Reset

Reset IC

29V

1 It is recommended that the battery be connected on a BAT_IN pin of the SoC for the power supply2 If an external power source or a power adapter is used to provide the power to the SoC (ADAP_IN) use a

voltage supervisor IC3 The RESET IC output pin must be open drain with delay time of le 10 ms and the recommended part is

TCM809SVNB713

74 General Purpose IO pinsThe following table provides the details of various functions that are mapped to the IO pins of the IS20xxS SoCand these IOs are configured by using the IS20XXS_UI tool The first button (Button 0) must be configured as thepower-onoff key and can be set using the PWR pin The remaining pins are configured for any one of the defaultfunctions (short press long press double press and combinations)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 28

Table 7-1 IO Pin Configuration

Sl No Pin Name Buttons Default Functions(1)

1 PowerMFB Button 0 PWR

2 P0_2 Button 1 PlayPause

3 P2_7 Button 2 Volume Up

4 P0_5 Button 3 Volume Down

5 P0_1 Button 4 FWD

6 P0_3 Button 5 REV

Note 1 These functions can be configured using the IS20XXS_UI tool

Few signals are generated to indicate or control outside devices The most popular applications are NFC for easypairing external audio amplifier for louder speaker and buzzer for indication

Table 7-2 IO Pins for Added Functions

Functions(1) IO Configurable Features

Slide switch P0_0P1_5

Buzzer P0_3

NFC detect P0_4P1_5

External amplifier enable P1_5

Note 1 These functions can be configured using the IS20XXS_UI tool

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 29

8 Antenna Placement RuleFor Bluetooth-enabled products the antenna placement affects the overall performance The antenna requires freespace to radiate RF signals and it must not be surrounded by the GND plane

The following figure illustrates a typical example of the good and poor antenna placement on the main applicationboard with the GND plane

Figure 8-1 Antenna Placement Examples

The following figure illustrates the keep-out area recommended for the PCB antenna

Figure 8-2 Keep-Out Area Recommended for PCB Antenna

Note  For additional information on the antenna placement refer to the antenna-specific data sheet from theantenna manufacturer

IS2008SIS2010SIS2013SIS2015SAntenna Placement Rule

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 30

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

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copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

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copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

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Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

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The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

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Worldwide Sales and Service

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Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

continuedIS2013S and

IS2015S Pin No Pin Type(1) Pin Name Description

56 P PVDD_CDA Supply voltage of power stage ch-1

57 P EP Exposed pads used as ground (GND) pins

Notes 1 The conventions used in the table are indicated as follows

ndash I = Input pinndash O = Output pinndash IO = InputOutput pinndash P = Power pin

2 All IO pins are configured using the UI tool a Windows-based utility

IS2008SIS2010SIS2013SIS2015SDevice Overview

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 16

3 AudioThe input and output audio signals have different stages and each stage is programmed to vary the gain responsecharacteristics For microphones both single-ended inputs and differential inputs are supported To maintain ahigh-quality signal provide a stable bias voltage source to the condenser microphonersquos FET Use the DC-blockingcapacitors at both positive and negative sides of the input Internally this analog signal is converted to 16-bit 8 kHzlinear PCM data

31 Digital Signal ProcessorA Digital Signal Processor (DSP) is used to perform speech and audio processing The advanced speech featuressuch as acoustic echo cancellation and noise reduction are built in To reduce nonlinear distortion and to help echocancellation an outgoing signal level to the speaker is monitored and adjusted to avoid saturation of the speakeroutput or microphone input Adaptive filtering is also applied to track the echo path impulse in response to provide anecho-free and full-duplex user experience

The embedded noise reduction algorithm helps to extract clean speech signals from the noisy inputs capturedby microphones and improves mutual understanding in communication The advanced audio features such asmulti-band dynamic range control parametric multi-band equalizer audio widening and virtual bass are built in Theaudio effect algorithms improve the userrsquos audio listening experience in terms of better quality audio after audiosignal processing

The following figures illustrate the processing flow of speakerphone applications for speech and audio signalprocessing

Figure 3-1 Speech Processing

Figure 3-2 Audio Processing

The DSP parameters such as EQ Speaker Gain Mic Gain Sound Effect and more are configured using the DSPtool For additional information on the DSP tool refer to the IS20xxBM1xBM2x DSP Application Note

IS2008SIS2010SIS2013SIS2015SAudio

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 17

Note  The DSP tool and IS20xxBM1xBM2x DSP Application Note are available for download at the Microchipwebsite

32 CodecThe built-in codec has a high SNR performance and it consists of an ADC a DAC and additional analog circuitry

33 Auxiliary PortThe SoC supports one analog (line-in) signal from the external audio source The analog signal is processed bythe DSP to generate different sound effects (multi-band dynamic range compression and audio widening) which areconfigured using the DSP tool

34 Class D Audio AmplifierThe Class D amplifier has a significant advantage in many applications due to its lower power dissipation whichproduces less heat The IS2013S and IS2015S SoC have a built-in Class D amplifier that reduces circuit board spaceand system cost The efficiency of the amplifier extends the battery life in portable systems

The Class D amplifier is implemented by using a full-bridge output stage A full bridge uses two half-bridge stages todrive the load differentially The Class D amplifier provides a good SNR and enough drive capability for a 4Ω speakerdriver

IS2008SIS2010SIS2013SIS2015SAudio

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 18

4 TransceiverThe SoC is designed and optimized for Bluetooth 24 GHz systems It contains a complete radio frequencytransmitterreceiver section An internal synthesizer generates a stable clock to synchronize with another device

41 TransmitterThe internal Power Amplifier (PA) has a maximum output power of +4 dBm with 20 dB power level control Applythis to Class 2 or Class 3 radios without an external RF PA The transmitter directly performs the IQ conversionto minimize the frequency drift and it can access the 20 dB power range with the temperature compensationmechanism

42 ReceiverThe Low-Noise Amplifier (LNA) operates with TR-combined mode for the single port application It saves the pin onthe package without having an external TXRX switch

The ADC is used to sample the input analog signal and convert it into a digital signal for demodulator analysisA channel filter is integrated into a receiver channel before the ADC to reduce the external component count andincrease the anti-interference capability

The image rejection filter is used to reject the image frequency for the low-IF architecture and it is also intended toreduce the external Band Pass Filter (BPF) component for a super heterodyne architecture

The Received Signal Strength Indicator (RSSI) signal feedback to the processor is used to control the RF outputpower to make a good trade-off for effective distance and current consumption

43 SynthesizerA synthesizer generates a clock for radio transceiver operation The VCO inside with a tunable internal LC tankcan reduce any variation for components A crystal oscillator with an internal digital trimming circuit provides a stableclock for the synthesizer

44 ModemFor Bluetooth 12 specifications and below 1 Mbps is the standard data rate based on the Gaussian Frequency ShiftKeying (GFSK) modulation scheme This basic rate modem meets BDR requirements of Bluetooth 20 with EDRspecifications

For Bluetooth 20 and above specifications EDR is introduced to provide the data rates of 123 Mbps Thisenhanced data rate modem meets EDR requirements of Bluetooth 20 with EDR specifications For the basebandboth BDR and EDR utilize the same 1 MHz symbol rate and 16 kHz slot rate For BDR 1 symbol represents 1-bitHowever each symbol in the payload part of the EDR packets represents 2-bit or 3-bit This is achieved by using twodifferent modulations π4 DQPSK and 8 DPSK

45 Adaptive Frequency Hopping (AFH)The SoC has an AFH function to avoid RF interference It has an algorithm to check the nearby interference and tochoose the clear channel for the transceiver Bluetooth signal

IS2008SIS2010SIS2013SIS2015STransceiver

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Datasheet DS70005472A-page 19

5 MicrocontrollerA single-cycle 8-bit microcontroller is built into the SoC to execute the Bluetooth protocols It operates from 16 MHzto higher frequencies where the firmware dynamically adjusts the trade-off between the computing power and thepower consumption In the ROM version the MCU firmware is hard-wired to minimize power consumption for thefirmware execution and to save the external Flash cost

51 MemoryThere are sufficient ROM and RAM to fulfill the processor requirements in which a synchronous single port RAMinterface is used The register bank dedicated single port memory and Flash memory are connected to theprocessor bus The processor coordinates with all link control procedures and the data movement happens using aset of pointer registers

52 External ResetThe IS20xxS SoC provides a Watchdog Timer (WDT) to reset the SoC It has an integrated Power-on Reset (POR)circuit that resets all circuits to a known Power-on state This action is also driven by an external Reset signal whichis used to control the device externally by forcing it into a POR state The RST_N signal input is active-low and noconnection is required in most of the applications

53 Reference ClockThe IS20xxS SoC is composed of an integrated crystal oscillation function that uses a 16 MHz external crystal andtwo specified loading capacitors to provide a high quality system reference timer source Use this feature to removethe initial tolerance frequency errors which are associated with the crystal and its equivalent loading capacitance inthe mass production Achieve the frequency trim by adjusting the crystal loading capacitance through the on-chip trimcapacitors (Ctrim)

The value of the trimming capacitance is 200 fF (200x10-15 F) per LSB at the 5-bit word and the overall adjustableclock frequency is plusmn40 kHz The following figure illustrates the crystal connection of the IS20xxS SoC with twocapacitors

Figure 5-1 Crystal Connection

IS20XXS

XO_N

CL1

XO_P

CL2

IS2008SIS2010SIS2013SIS2015SMicrocontroller

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Datasheet DS70005472A-page 20

Notes 1 Ctrim = 200 fF (1 to 31) Cint = 3 pF2 CL = [(CL1 x CL2) (CL1 + CL2)] + (Ctrim 2) + Cint (set trim value as 16 Ctrim = 32 pF)3 For a 16 MHz crystal where CL = 9 pF the CL1 = CL2 = 91 pF)4 For the CL selection refer to the data sheet of the crystal

IS2008SIS2010SIS2013SIS2015SMicrocontroller

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 21

6 Power Management Unit (PMU)The IS20xxS SoC has an integrated PMU The main features of the PMU are a lithium-ion battery charger and avoltage regulator A power switch is used to switch over the power source between a battery and an adapter Alsothe PMU provides current to the LED drivers

61 Charging a BatteryThe IS20xxS SoC has a built-in battery charger which is optimized for lithium-polymer batteries The battery chargerincludes a current sensor for a charging control user programmable current regulator and high accuracy voltageregulator

The charging current parameters are configured by using the UI (IS20XXS_UI) tool Whenever the adapter isplugged-in the charging circuit will be activated Reviving pre-charging constant current mode constant voltagemode and re-charging functions are implemented The maximum charging current is 350 mA The following figureillustrates the charging curve of a battery

Figure 6-1 Battery Charging Curve

62 Voltage MonitoringA 10-bit successive approximation register ADC (SAR ADC) provides a dedicated channel for battery voltage leveldetection The warning level is programmed by using the UI tool The ADC provides a granular resolution to enablethe MCU to take control over the charging process

63 Low Dropout RegulatorA built-in LDO Regulator is used to convert the battery or adapter power for the power supply It also integratesthe hardware architecture to control the power-onoff procedure The built-in programmable LDOs provide power forcodec and digital IO pads Also it is used to buffer the high input voltage from the battery or adapter This LDOrequires a 1 μF bypass capacitor

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 22

64 Switching RegulatorThe built-in programmable output voltage regulator converts the battery voltage to RF and base band core powersupply This converter has a high conversion efficiency and a fast transient response

65 LED DriverThe IS20xxS SoC consists of two LED drivers to control the LEDs The LED drivers provide enough sink current(16-step control and 035 mA for each step) and the LED is connected directly to the IS20xxS SoC

Note  Configure the LED settings using the IS20XXS_UI tool

The following figure illustrates the LED driver in the IS20xxS SoC

Figure 6-2 LED DRIVER

IS20xxS

LED2

SYS_PWR

LED1

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 23

7 Application InformationThis section describes the power supply connection host MCU UART interface and various modes in detail

71 Power SupplyThe following figure illustrates the connection from the BAT_IN pin to various other voltage supply pins of theIS20xxS SoC

The BAT_IN input pin powers the IS20xxS SoC To charge the battery connect the external 5V power adapter toADAP_IN

Figure 7-1 Power Tree Diagram

VDDA VDDAO

VDD_IO

3V LDO

18V Buck

SAR_VDD

LDO31_VIN

CODEC_VO

LDO31_VO

BK_VDD

BK_LX

BK_O

VDD_CORE

VCC_RF

12V LDOPMIC_IN

CLDO_O

RFLDO_O

PVDD_CDA

Li-Io

n BA

T BAT_IN

ADAP_IN

SYS_PWRPower Switch

5V Adapter

(42~30V)

(45~55V)(42~30V)

(30~27V)

(33 ~27V)

(18V)

(12V)

(128V)

72 Host MCU InterfaceAn external MCU controls the IS20xxS SoC using the UART command set The following figure illustrates the UARTinterface between the IS20xxS SoC and an external MCU

Figure 7-2 Host MCU Interface Over UART

IS20xxSHCI_TXD

HCI_RXD

PWR

P0_0

MCUUART_TX

UART_RX

MCU_WAKEUP

BT_WAKEUP

UART Interface

UART Interface

The MCU controls the IS20xxS SoC over the UART interface and wakes up the SoC using the PWR pin The MCUfunction wakes up by connecting to the P0_0 pin of the IS20xxS

Refer to the IS200xIS201xIS202x UART Command SOP document for a list of functions that the IS20xxS SoCsupports and how to use the IS20XXS_UI tool to set up the system using the UART command

Note  The IS200xIS201xIS202x UART Command SOP document is available for download from the Microchipwebsite at IS200xIS201xIS202x UART Command SOP

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 24

73 Timing Sequence of UART ApplicationThe following figures illustrate the various UART control signal timing sequences

Figure 7-3 Power-OnOff Sequence

BAT_IN

SYS_PWR

1 ms

Power- oninitial idle Power-on Power-on Power-off idle

MCU state

MFB (PWR)

BK_OLDO31_VO

400 ms

RST_N

MCU sends UART command (UART_RX)

UART Command

MCU sends power-off UART Command

Power-on ACK ACK ACKIS20xxS response UART state

(UART_TX)

Set ldquoPower-on Directlyrdquo boot

any

10 ms

20 msKeep all IS20xxSand MCU connection to low level

2s

(See Figure 7-4) (See Figure 7-5)

IS20xxS disconnect and auto power-off

gt 1s

Figure 7-4 Timing Sequence of RX Indication after Power-On

Resume 32 kHz mode

MFB (PWR)MCU sends UART command

MFB pulse must be longer than the UART command slot time

150 ms

2 ms 2 ms

Enter 32 kHz mode

1 ms

UART Command

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 25

Figure 7-5 Timing Sequence of Power-Off

BAT_IN +4V

MFB

MCU Sends RST_N

BK_OUT

LDO31_VO

UART Bus

2s 1s

IS20xxS Sends Power-off ACK

Notes 1 EEPROM clock = 100 kHz2 For a byte wire 001 ms x 32 clock x 2 = 640 μs3 It is recommended that ramp-down time be more than 640 μs during the power-off sequence to ensure safe

operation of the device

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 26

Figu

re 7

-6 

Tim

ing

Sequ

ence

of P

ower

-On

(NA

CK

)

BAT

_IN

SYS_

PWR

1 m

s Pow

er-

onin

itial

idle

Pow

er-o

nM

CU

sta

te

MFB

(PW

R)

BK_O

LD

O31

_VO

400

ms

RST

_N

MC

U s

ends

UAR

T co

mm

and

(UAR

T_R

X)

UAR

T C

omm

and

NAC

KPo

wer

-on

ACK

ACK

IS20

xxS

resp

onse

UAR

T st

ate

(UAR

T_TX

)

Set ldquo

Pow

er-o

n D

irect

lyrdquo b

oot

10 m

s

20 m

s

Ret

ry i

f AC

K is

not

rece

ived

200

ms

any

Wai

t

Max

imum

5 ti

mes

(1s)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 27

Figure 7-7 Reset Timing Sequence in Case of No Response from SoC to Host MCU

MFB (PWR)

MCU sends UART command UART

Command

UART Command

IS20xxS UART

If no response

RST_N

1ms

X ms1ms

1ms

1ms

Note  The MCU sends the UART command again when the SoC is not responding to its first UART command Ifthe SoC is not responding to the second UART command within X ms the MCU forces the system to reset

Figure 7-8 Timing Sequence of Power Drop Protection

BAT_IN +4V

RST_N from Reset IC

Power

SYS_PWR

IS20xxS

Reset OUT VDDGND

MCU Reset

Reset IC

29V

1 It is recommended that the battery be connected on a BAT_IN pin of the SoC for the power supply2 If an external power source or a power adapter is used to provide the power to the SoC (ADAP_IN) use a

voltage supervisor IC3 The RESET IC output pin must be open drain with delay time of le 10 ms and the recommended part is

TCM809SVNB713

74 General Purpose IO pinsThe following table provides the details of various functions that are mapped to the IO pins of the IS20xxS SoCand these IOs are configured by using the IS20XXS_UI tool The first button (Button 0) must be configured as thepower-onoff key and can be set using the PWR pin The remaining pins are configured for any one of the defaultfunctions (short press long press double press and combinations)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 28

Table 7-1 IO Pin Configuration

Sl No Pin Name Buttons Default Functions(1)

1 PowerMFB Button 0 PWR

2 P0_2 Button 1 PlayPause

3 P2_7 Button 2 Volume Up

4 P0_5 Button 3 Volume Down

5 P0_1 Button 4 FWD

6 P0_3 Button 5 REV

Note 1 These functions can be configured using the IS20XXS_UI tool

Few signals are generated to indicate or control outside devices The most popular applications are NFC for easypairing external audio amplifier for louder speaker and buzzer for indication

Table 7-2 IO Pins for Added Functions

Functions(1) IO Configurable Features

Slide switch P0_0P1_5

Buzzer P0_3

NFC detect P0_4P1_5

External amplifier enable P1_5

Note 1 These functions can be configured using the IS20XXS_UI tool

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 29

8 Antenna Placement RuleFor Bluetooth-enabled products the antenna placement affects the overall performance The antenna requires freespace to radiate RF signals and it must not be surrounded by the GND plane

The following figure illustrates a typical example of the good and poor antenna placement on the main applicationboard with the GND plane

Figure 8-1 Antenna Placement Examples

The following figure illustrates the keep-out area recommended for the PCB antenna

Figure 8-2 Keep-Out Area Recommended for PCB Antenna

Note  For additional information on the antenna placement refer to the antenna-specific data sheet from theantenna manufacturer

IS2008SIS2010SIS2013SIS2015SAntenna Placement Rule

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 30

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

3 AudioThe input and output audio signals have different stages and each stage is programmed to vary the gain responsecharacteristics For microphones both single-ended inputs and differential inputs are supported To maintain ahigh-quality signal provide a stable bias voltage source to the condenser microphonersquos FET Use the DC-blockingcapacitors at both positive and negative sides of the input Internally this analog signal is converted to 16-bit 8 kHzlinear PCM data

31 Digital Signal ProcessorA Digital Signal Processor (DSP) is used to perform speech and audio processing The advanced speech featuressuch as acoustic echo cancellation and noise reduction are built in To reduce nonlinear distortion and to help echocancellation an outgoing signal level to the speaker is monitored and adjusted to avoid saturation of the speakeroutput or microphone input Adaptive filtering is also applied to track the echo path impulse in response to provide anecho-free and full-duplex user experience

The embedded noise reduction algorithm helps to extract clean speech signals from the noisy inputs capturedby microphones and improves mutual understanding in communication The advanced audio features such asmulti-band dynamic range control parametric multi-band equalizer audio widening and virtual bass are built in Theaudio effect algorithms improve the userrsquos audio listening experience in terms of better quality audio after audiosignal processing

The following figures illustrate the processing flow of speakerphone applications for speech and audio signalprocessing

Figure 3-1 Speech Processing

Figure 3-2 Audio Processing

The DSP parameters such as EQ Speaker Gain Mic Gain Sound Effect and more are configured using the DSPtool For additional information on the DSP tool refer to the IS20xxBM1xBM2x DSP Application Note

IS2008SIS2010SIS2013SIS2015SAudio

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 17

Note  The DSP tool and IS20xxBM1xBM2x DSP Application Note are available for download at the Microchipwebsite

32 CodecThe built-in codec has a high SNR performance and it consists of an ADC a DAC and additional analog circuitry

33 Auxiliary PortThe SoC supports one analog (line-in) signal from the external audio source The analog signal is processed bythe DSP to generate different sound effects (multi-band dynamic range compression and audio widening) which areconfigured using the DSP tool

34 Class D Audio AmplifierThe Class D amplifier has a significant advantage in many applications due to its lower power dissipation whichproduces less heat The IS2013S and IS2015S SoC have a built-in Class D amplifier that reduces circuit board spaceand system cost The efficiency of the amplifier extends the battery life in portable systems

The Class D amplifier is implemented by using a full-bridge output stage A full bridge uses two half-bridge stages todrive the load differentially The Class D amplifier provides a good SNR and enough drive capability for a 4Ω speakerdriver

IS2008SIS2010SIS2013SIS2015SAudio

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 18

4 TransceiverThe SoC is designed and optimized for Bluetooth 24 GHz systems It contains a complete radio frequencytransmitterreceiver section An internal synthesizer generates a stable clock to synchronize with another device

41 TransmitterThe internal Power Amplifier (PA) has a maximum output power of +4 dBm with 20 dB power level control Applythis to Class 2 or Class 3 radios without an external RF PA The transmitter directly performs the IQ conversionto minimize the frequency drift and it can access the 20 dB power range with the temperature compensationmechanism

42 ReceiverThe Low-Noise Amplifier (LNA) operates with TR-combined mode for the single port application It saves the pin onthe package without having an external TXRX switch

The ADC is used to sample the input analog signal and convert it into a digital signal for demodulator analysisA channel filter is integrated into a receiver channel before the ADC to reduce the external component count andincrease the anti-interference capability

The image rejection filter is used to reject the image frequency for the low-IF architecture and it is also intended toreduce the external Band Pass Filter (BPF) component for a super heterodyne architecture

The Received Signal Strength Indicator (RSSI) signal feedback to the processor is used to control the RF outputpower to make a good trade-off for effective distance and current consumption

43 SynthesizerA synthesizer generates a clock for radio transceiver operation The VCO inside with a tunable internal LC tankcan reduce any variation for components A crystal oscillator with an internal digital trimming circuit provides a stableclock for the synthesizer

44 ModemFor Bluetooth 12 specifications and below 1 Mbps is the standard data rate based on the Gaussian Frequency ShiftKeying (GFSK) modulation scheme This basic rate modem meets BDR requirements of Bluetooth 20 with EDRspecifications

For Bluetooth 20 and above specifications EDR is introduced to provide the data rates of 123 Mbps Thisenhanced data rate modem meets EDR requirements of Bluetooth 20 with EDR specifications For the basebandboth BDR and EDR utilize the same 1 MHz symbol rate and 16 kHz slot rate For BDR 1 symbol represents 1-bitHowever each symbol in the payload part of the EDR packets represents 2-bit or 3-bit This is achieved by using twodifferent modulations π4 DQPSK and 8 DPSK

45 Adaptive Frequency Hopping (AFH)The SoC has an AFH function to avoid RF interference It has an algorithm to check the nearby interference and tochoose the clear channel for the transceiver Bluetooth signal

IS2008SIS2010SIS2013SIS2015STransceiver

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 19

5 MicrocontrollerA single-cycle 8-bit microcontroller is built into the SoC to execute the Bluetooth protocols It operates from 16 MHzto higher frequencies where the firmware dynamically adjusts the trade-off between the computing power and thepower consumption In the ROM version the MCU firmware is hard-wired to minimize power consumption for thefirmware execution and to save the external Flash cost

51 MemoryThere are sufficient ROM and RAM to fulfill the processor requirements in which a synchronous single port RAMinterface is used The register bank dedicated single port memory and Flash memory are connected to theprocessor bus The processor coordinates with all link control procedures and the data movement happens using aset of pointer registers

52 External ResetThe IS20xxS SoC provides a Watchdog Timer (WDT) to reset the SoC It has an integrated Power-on Reset (POR)circuit that resets all circuits to a known Power-on state This action is also driven by an external Reset signal whichis used to control the device externally by forcing it into a POR state The RST_N signal input is active-low and noconnection is required in most of the applications

53 Reference ClockThe IS20xxS SoC is composed of an integrated crystal oscillation function that uses a 16 MHz external crystal andtwo specified loading capacitors to provide a high quality system reference timer source Use this feature to removethe initial tolerance frequency errors which are associated with the crystal and its equivalent loading capacitance inthe mass production Achieve the frequency trim by adjusting the crystal loading capacitance through the on-chip trimcapacitors (Ctrim)

The value of the trimming capacitance is 200 fF (200x10-15 F) per LSB at the 5-bit word and the overall adjustableclock frequency is plusmn40 kHz The following figure illustrates the crystal connection of the IS20xxS SoC with twocapacitors

Figure 5-1 Crystal Connection

IS20XXS

XO_N

CL1

XO_P

CL2

IS2008SIS2010SIS2013SIS2015SMicrocontroller

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 20

Notes 1 Ctrim = 200 fF (1 to 31) Cint = 3 pF2 CL = [(CL1 x CL2) (CL1 + CL2)] + (Ctrim 2) + Cint (set trim value as 16 Ctrim = 32 pF)3 For a 16 MHz crystal where CL = 9 pF the CL1 = CL2 = 91 pF)4 For the CL selection refer to the data sheet of the crystal

IS2008SIS2010SIS2013SIS2015SMicrocontroller

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 21

6 Power Management Unit (PMU)The IS20xxS SoC has an integrated PMU The main features of the PMU are a lithium-ion battery charger and avoltage regulator A power switch is used to switch over the power source between a battery and an adapter Alsothe PMU provides current to the LED drivers

61 Charging a BatteryThe IS20xxS SoC has a built-in battery charger which is optimized for lithium-polymer batteries The battery chargerincludes a current sensor for a charging control user programmable current regulator and high accuracy voltageregulator

The charging current parameters are configured by using the UI (IS20XXS_UI) tool Whenever the adapter isplugged-in the charging circuit will be activated Reviving pre-charging constant current mode constant voltagemode and re-charging functions are implemented The maximum charging current is 350 mA The following figureillustrates the charging curve of a battery

Figure 6-1 Battery Charging Curve

62 Voltage MonitoringA 10-bit successive approximation register ADC (SAR ADC) provides a dedicated channel for battery voltage leveldetection The warning level is programmed by using the UI tool The ADC provides a granular resolution to enablethe MCU to take control over the charging process

63 Low Dropout RegulatorA built-in LDO Regulator is used to convert the battery or adapter power for the power supply It also integratesthe hardware architecture to control the power-onoff procedure The built-in programmable LDOs provide power forcodec and digital IO pads Also it is used to buffer the high input voltage from the battery or adapter This LDOrequires a 1 μF bypass capacitor

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 22

64 Switching RegulatorThe built-in programmable output voltage regulator converts the battery voltage to RF and base band core powersupply This converter has a high conversion efficiency and a fast transient response

65 LED DriverThe IS20xxS SoC consists of two LED drivers to control the LEDs The LED drivers provide enough sink current(16-step control and 035 mA for each step) and the LED is connected directly to the IS20xxS SoC

Note  Configure the LED settings using the IS20XXS_UI tool

The following figure illustrates the LED driver in the IS20xxS SoC

Figure 6-2 LED DRIVER

IS20xxS

LED2

SYS_PWR

LED1

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 23

7 Application InformationThis section describes the power supply connection host MCU UART interface and various modes in detail

71 Power SupplyThe following figure illustrates the connection from the BAT_IN pin to various other voltage supply pins of theIS20xxS SoC

The BAT_IN input pin powers the IS20xxS SoC To charge the battery connect the external 5V power adapter toADAP_IN

Figure 7-1 Power Tree Diagram

VDDA VDDAO

VDD_IO

3V LDO

18V Buck

SAR_VDD

LDO31_VIN

CODEC_VO

LDO31_VO

BK_VDD

BK_LX

BK_O

VDD_CORE

VCC_RF

12V LDOPMIC_IN

CLDO_O

RFLDO_O

PVDD_CDA

Li-Io

n BA

T BAT_IN

ADAP_IN

SYS_PWRPower Switch

5V Adapter

(42~30V)

(45~55V)(42~30V)

(30~27V)

(33 ~27V)

(18V)

(12V)

(128V)

72 Host MCU InterfaceAn external MCU controls the IS20xxS SoC using the UART command set The following figure illustrates the UARTinterface between the IS20xxS SoC and an external MCU

Figure 7-2 Host MCU Interface Over UART

IS20xxSHCI_TXD

HCI_RXD

PWR

P0_0

MCUUART_TX

UART_RX

MCU_WAKEUP

BT_WAKEUP

UART Interface

UART Interface

The MCU controls the IS20xxS SoC over the UART interface and wakes up the SoC using the PWR pin The MCUfunction wakes up by connecting to the P0_0 pin of the IS20xxS

Refer to the IS200xIS201xIS202x UART Command SOP document for a list of functions that the IS20xxS SoCsupports and how to use the IS20XXS_UI tool to set up the system using the UART command

Note  The IS200xIS201xIS202x UART Command SOP document is available for download from the Microchipwebsite at IS200xIS201xIS202x UART Command SOP

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 24

73 Timing Sequence of UART ApplicationThe following figures illustrate the various UART control signal timing sequences

Figure 7-3 Power-OnOff Sequence

BAT_IN

SYS_PWR

1 ms

Power- oninitial idle Power-on Power-on Power-off idle

MCU state

MFB (PWR)

BK_OLDO31_VO

400 ms

RST_N

MCU sends UART command (UART_RX)

UART Command

MCU sends power-off UART Command

Power-on ACK ACK ACKIS20xxS response UART state

(UART_TX)

Set ldquoPower-on Directlyrdquo boot

any

10 ms

20 msKeep all IS20xxSand MCU connection to low level

2s

(See Figure 7-4) (See Figure 7-5)

IS20xxS disconnect and auto power-off

gt 1s

Figure 7-4 Timing Sequence of RX Indication after Power-On

Resume 32 kHz mode

MFB (PWR)MCU sends UART command

MFB pulse must be longer than the UART command slot time

150 ms

2 ms 2 ms

Enter 32 kHz mode

1 ms

UART Command

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 25

Figure 7-5 Timing Sequence of Power-Off

BAT_IN +4V

MFB

MCU Sends RST_N

BK_OUT

LDO31_VO

UART Bus

2s 1s

IS20xxS Sends Power-off ACK

Notes 1 EEPROM clock = 100 kHz2 For a byte wire 001 ms x 32 clock x 2 = 640 μs3 It is recommended that ramp-down time be more than 640 μs during the power-off sequence to ensure safe

operation of the device

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 26

Figu

re 7

-6 

Tim

ing

Sequ

ence

of P

ower

-On

(NA

CK

)

BAT

_IN

SYS_

PWR

1 m

s Pow

er-

onin

itial

idle

Pow

er-o

nM

CU

sta

te

MFB

(PW

R)

BK_O

LD

O31

_VO

400

ms

RST

_N

MC

U s

ends

UAR

T co

mm

and

(UAR

T_R

X)

UAR

T C

omm

and

NAC

KPo

wer

-on

ACK

ACK

IS20

xxS

resp

onse

UAR

T st

ate

(UAR

T_TX

)

Set ldquo

Pow

er-o

n D

irect

lyrdquo b

oot

10 m

s

20 m

s

Ret

ry i

f AC

K is

not

rece

ived

200

ms

any

Wai

t

Max

imum

5 ti

mes

(1s)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 27

Figure 7-7 Reset Timing Sequence in Case of No Response from SoC to Host MCU

MFB (PWR)

MCU sends UART command UART

Command

UART Command

IS20xxS UART

If no response

RST_N

1ms

X ms1ms

1ms

1ms

Note  The MCU sends the UART command again when the SoC is not responding to its first UART command Ifthe SoC is not responding to the second UART command within X ms the MCU forces the system to reset

Figure 7-8 Timing Sequence of Power Drop Protection

BAT_IN +4V

RST_N from Reset IC

Power

SYS_PWR

IS20xxS

Reset OUT VDDGND

MCU Reset

Reset IC

29V

1 It is recommended that the battery be connected on a BAT_IN pin of the SoC for the power supply2 If an external power source or a power adapter is used to provide the power to the SoC (ADAP_IN) use a

voltage supervisor IC3 The RESET IC output pin must be open drain with delay time of le 10 ms and the recommended part is

TCM809SVNB713

74 General Purpose IO pinsThe following table provides the details of various functions that are mapped to the IO pins of the IS20xxS SoCand these IOs are configured by using the IS20XXS_UI tool The first button (Button 0) must be configured as thepower-onoff key and can be set using the PWR pin The remaining pins are configured for any one of the defaultfunctions (short press long press double press and combinations)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 28

Table 7-1 IO Pin Configuration

Sl No Pin Name Buttons Default Functions(1)

1 PowerMFB Button 0 PWR

2 P0_2 Button 1 PlayPause

3 P2_7 Button 2 Volume Up

4 P0_5 Button 3 Volume Down

5 P0_1 Button 4 FWD

6 P0_3 Button 5 REV

Note 1 These functions can be configured using the IS20XXS_UI tool

Few signals are generated to indicate or control outside devices The most popular applications are NFC for easypairing external audio amplifier for louder speaker and buzzer for indication

Table 7-2 IO Pins for Added Functions

Functions(1) IO Configurable Features

Slide switch P0_0P1_5

Buzzer P0_3

NFC detect P0_4P1_5

External amplifier enable P1_5

Note 1 These functions can be configured using the IS20XXS_UI tool

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 29

8 Antenna Placement RuleFor Bluetooth-enabled products the antenna placement affects the overall performance The antenna requires freespace to radiate RF signals and it must not be surrounded by the GND plane

The following figure illustrates a typical example of the good and poor antenna placement on the main applicationboard with the GND plane

Figure 8-1 Antenna Placement Examples

The following figure illustrates the keep-out area recommended for the PCB antenna

Figure 8-2 Keep-Out Area Recommended for PCB Antenna

Note  For additional information on the antenna placement refer to the antenna-specific data sheet from theantenna manufacturer

IS2008SIS2010SIS2013SIS2015SAntenna Placement Rule

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 30

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Note  The DSP tool and IS20xxBM1xBM2x DSP Application Note are available for download at the Microchipwebsite

32 CodecThe built-in codec has a high SNR performance and it consists of an ADC a DAC and additional analog circuitry

33 Auxiliary PortThe SoC supports one analog (line-in) signal from the external audio source The analog signal is processed bythe DSP to generate different sound effects (multi-band dynamic range compression and audio widening) which areconfigured using the DSP tool

34 Class D Audio AmplifierThe Class D amplifier has a significant advantage in many applications due to its lower power dissipation whichproduces less heat The IS2013S and IS2015S SoC have a built-in Class D amplifier that reduces circuit board spaceand system cost The efficiency of the amplifier extends the battery life in portable systems

The Class D amplifier is implemented by using a full-bridge output stage A full bridge uses two half-bridge stages todrive the load differentially The Class D amplifier provides a good SNR and enough drive capability for a 4Ω speakerdriver

IS2008SIS2010SIS2013SIS2015SAudio

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 18

4 TransceiverThe SoC is designed and optimized for Bluetooth 24 GHz systems It contains a complete radio frequencytransmitterreceiver section An internal synthesizer generates a stable clock to synchronize with another device

41 TransmitterThe internal Power Amplifier (PA) has a maximum output power of +4 dBm with 20 dB power level control Applythis to Class 2 or Class 3 radios without an external RF PA The transmitter directly performs the IQ conversionto minimize the frequency drift and it can access the 20 dB power range with the temperature compensationmechanism

42 ReceiverThe Low-Noise Amplifier (LNA) operates with TR-combined mode for the single port application It saves the pin onthe package without having an external TXRX switch

The ADC is used to sample the input analog signal and convert it into a digital signal for demodulator analysisA channel filter is integrated into a receiver channel before the ADC to reduce the external component count andincrease the anti-interference capability

The image rejection filter is used to reject the image frequency for the low-IF architecture and it is also intended toreduce the external Band Pass Filter (BPF) component for a super heterodyne architecture

The Received Signal Strength Indicator (RSSI) signal feedback to the processor is used to control the RF outputpower to make a good trade-off for effective distance and current consumption

43 SynthesizerA synthesizer generates a clock for radio transceiver operation The VCO inside with a tunable internal LC tankcan reduce any variation for components A crystal oscillator with an internal digital trimming circuit provides a stableclock for the synthesizer

44 ModemFor Bluetooth 12 specifications and below 1 Mbps is the standard data rate based on the Gaussian Frequency ShiftKeying (GFSK) modulation scheme This basic rate modem meets BDR requirements of Bluetooth 20 with EDRspecifications

For Bluetooth 20 and above specifications EDR is introduced to provide the data rates of 123 Mbps Thisenhanced data rate modem meets EDR requirements of Bluetooth 20 with EDR specifications For the basebandboth BDR and EDR utilize the same 1 MHz symbol rate and 16 kHz slot rate For BDR 1 symbol represents 1-bitHowever each symbol in the payload part of the EDR packets represents 2-bit or 3-bit This is achieved by using twodifferent modulations π4 DQPSK and 8 DPSK

45 Adaptive Frequency Hopping (AFH)The SoC has an AFH function to avoid RF interference It has an algorithm to check the nearby interference and tochoose the clear channel for the transceiver Bluetooth signal

IS2008SIS2010SIS2013SIS2015STransceiver

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 19

5 MicrocontrollerA single-cycle 8-bit microcontroller is built into the SoC to execute the Bluetooth protocols It operates from 16 MHzto higher frequencies where the firmware dynamically adjusts the trade-off between the computing power and thepower consumption In the ROM version the MCU firmware is hard-wired to minimize power consumption for thefirmware execution and to save the external Flash cost

51 MemoryThere are sufficient ROM and RAM to fulfill the processor requirements in which a synchronous single port RAMinterface is used The register bank dedicated single port memory and Flash memory are connected to theprocessor bus The processor coordinates with all link control procedures and the data movement happens using aset of pointer registers

52 External ResetThe IS20xxS SoC provides a Watchdog Timer (WDT) to reset the SoC It has an integrated Power-on Reset (POR)circuit that resets all circuits to a known Power-on state This action is also driven by an external Reset signal whichis used to control the device externally by forcing it into a POR state The RST_N signal input is active-low and noconnection is required in most of the applications

53 Reference ClockThe IS20xxS SoC is composed of an integrated crystal oscillation function that uses a 16 MHz external crystal andtwo specified loading capacitors to provide a high quality system reference timer source Use this feature to removethe initial tolerance frequency errors which are associated with the crystal and its equivalent loading capacitance inthe mass production Achieve the frequency trim by adjusting the crystal loading capacitance through the on-chip trimcapacitors (Ctrim)

The value of the trimming capacitance is 200 fF (200x10-15 F) per LSB at the 5-bit word and the overall adjustableclock frequency is plusmn40 kHz The following figure illustrates the crystal connection of the IS20xxS SoC with twocapacitors

Figure 5-1 Crystal Connection

IS20XXS

XO_N

CL1

XO_P

CL2

IS2008SIS2010SIS2013SIS2015SMicrocontroller

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 20

Notes 1 Ctrim = 200 fF (1 to 31) Cint = 3 pF2 CL = [(CL1 x CL2) (CL1 + CL2)] + (Ctrim 2) + Cint (set trim value as 16 Ctrim = 32 pF)3 For a 16 MHz crystal where CL = 9 pF the CL1 = CL2 = 91 pF)4 For the CL selection refer to the data sheet of the crystal

IS2008SIS2010SIS2013SIS2015SMicrocontroller

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 21

6 Power Management Unit (PMU)The IS20xxS SoC has an integrated PMU The main features of the PMU are a lithium-ion battery charger and avoltage regulator A power switch is used to switch over the power source between a battery and an adapter Alsothe PMU provides current to the LED drivers

61 Charging a BatteryThe IS20xxS SoC has a built-in battery charger which is optimized for lithium-polymer batteries The battery chargerincludes a current sensor for a charging control user programmable current regulator and high accuracy voltageregulator

The charging current parameters are configured by using the UI (IS20XXS_UI) tool Whenever the adapter isplugged-in the charging circuit will be activated Reviving pre-charging constant current mode constant voltagemode and re-charging functions are implemented The maximum charging current is 350 mA The following figureillustrates the charging curve of a battery

Figure 6-1 Battery Charging Curve

62 Voltage MonitoringA 10-bit successive approximation register ADC (SAR ADC) provides a dedicated channel for battery voltage leveldetection The warning level is programmed by using the UI tool The ADC provides a granular resolution to enablethe MCU to take control over the charging process

63 Low Dropout RegulatorA built-in LDO Regulator is used to convert the battery or adapter power for the power supply It also integratesthe hardware architecture to control the power-onoff procedure The built-in programmable LDOs provide power forcodec and digital IO pads Also it is used to buffer the high input voltage from the battery or adapter This LDOrequires a 1 μF bypass capacitor

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 22

64 Switching RegulatorThe built-in programmable output voltage regulator converts the battery voltage to RF and base band core powersupply This converter has a high conversion efficiency and a fast transient response

65 LED DriverThe IS20xxS SoC consists of two LED drivers to control the LEDs The LED drivers provide enough sink current(16-step control and 035 mA for each step) and the LED is connected directly to the IS20xxS SoC

Note  Configure the LED settings using the IS20XXS_UI tool

The following figure illustrates the LED driver in the IS20xxS SoC

Figure 6-2 LED DRIVER

IS20xxS

LED2

SYS_PWR

LED1

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 23

7 Application InformationThis section describes the power supply connection host MCU UART interface and various modes in detail

71 Power SupplyThe following figure illustrates the connection from the BAT_IN pin to various other voltage supply pins of theIS20xxS SoC

The BAT_IN input pin powers the IS20xxS SoC To charge the battery connect the external 5V power adapter toADAP_IN

Figure 7-1 Power Tree Diagram

VDDA VDDAO

VDD_IO

3V LDO

18V Buck

SAR_VDD

LDO31_VIN

CODEC_VO

LDO31_VO

BK_VDD

BK_LX

BK_O

VDD_CORE

VCC_RF

12V LDOPMIC_IN

CLDO_O

RFLDO_O

PVDD_CDA

Li-Io

n BA

T BAT_IN

ADAP_IN

SYS_PWRPower Switch

5V Adapter

(42~30V)

(45~55V)(42~30V)

(30~27V)

(33 ~27V)

(18V)

(12V)

(128V)

72 Host MCU InterfaceAn external MCU controls the IS20xxS SoC using the UART command set The following figure illustrates the UARTinterface between the IS20xxS SoC and an external MCU

Figure 7-2 Host MCU Interface Over UART

IS20xxSHCI_TXD

HCI_RXD

PWR

P0_0

MCUUART_TX

UART_RX

MCU_WAKEUP

BT_WAKEUP

UART Interface

UART Interface

The MCU controls the IS20xxS SoC over the UART interface and wakes up the SoC using the PWR pin The MCUfunction wakes up by connecting to the P0_0 pin of the IS20xxS

Refer to the IS200xIS201xIS202x UART Command SOP document for a list of functions that the IS20xxS SoCsupports and how to use the IS20XXS_UI tool to set up the system using the UART command

Note  The IS200xIS201xIS202x UART Command SOP document is available for download from the Microchipwebsite at IS200xIS201xIS202x UART Command SOP

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 24

73 Timing Sequence of UART ApplicationThe following figures illustrate the various UART control signal timing sequences

Figure 7-3 Power-OnOff Sequence

BAT_IN

SYS_PWR

1 ms

Power- oninitial idle Power-on Power-on Power-off idle

MCU state

MFB (PWR)

BK_OLDO31_VO

400 ms

RST_N

MCU sends UART command (UART_RX)

UART Command

MCU sends power-off UART Command

Power-on ACK ACK ACKIS20xxS response UART state

(UART_TX)

Set ldquoPower-on Directlyrdquo boot

any

10 ms

20 msKeep all IS20xxSand MCU connection to low level

2s

(See Figure 7-4) (See Figure 7-5)

IS20xxS disconnect and auto power-off

gt 1s

Figure 7-4 Timing Sequence of RX Indication after Power-On

Resume 32 kHz mode

MFB (PWR)MCU sends UART command

MFB pulse must be longer than the UART command slot time

150 ms

2 ms 2 ms

Enter 32 kHz mode

1 ms

UART Command

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 25

Figure 7-5 Timing Sequence of Power-Off

BAT_IN +4V

MFB

MCU Sends RST_N

BK_OUT

LDO31_VO

UART Bus

2s 1s

IS20xxS Sends Power-off ACK

Notes 1 EEPROM clock = 100 kHz2 For a byte wire 001 ms x 32 clock x 2 = 640 μs3 It is recommended that ramp-down time be more than 640 μs during the power-off sequence to ensure safe

operation of the device

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 26

Figu

re 7

-6 

Tim

ing

Sequ

ence

of P

ower

-On

(NA

CK

)

BAT

_IN

SYS_

PWR

1 m

s Pow

er-

onin

itial

idle

Pow

er-o

nM

CU

sta

te

MFB

(PW

R)

BK_O

LD

O31

_VO

400

ms

RST

_N

MC

U s

ends

UAR

T co

mm

and

(UAR

T_R

X)

UAR

T C

omm

and

NAC

KPo

wer

-on

ACK

ACK

IS20

xxS

resp

onse

UAR

T st

ate

(UAR

T_TX

)

Set ldquo

Pow

er-o

n D

irect

lyrdquo b

oot

10 m

s

20 m

s

Ret

ry i

f AC

K is

not

rece

ived

200

ms

any

Wai

t

Max

imum

5 ti

mes

(1s)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 27

Figure 7-7 Reset Timing Sequence in Case of No Response from SoC to Host MCU

MFB (PWR)

MCU sends UART command UART

Command

UART Command

IS20xxS UART

If no response

RST_N

1ms

X ms1ms

1ms

1ms

Note  The MCU sends the UART command again when the SoC is not responding to its first UART command Ifthe SoC is not responding to the second UART command within X ms the MCU forces the system to reset

Figure 7-8 Timing Sequence of Power Drop Protection

BAT_IN +4V

RST_N from Reset IC

Power

SYS_PWR

IS20xxS

Reset OUT VDDGND

MCU Reset

Reset IC

29V

1 It is recommended that the battery be connected on a BAT_IN pin of the SoC for the power supply2 If an external power source or a power adapter is used to provide the power to the SoC (ADAP_IN) use a

voltage supervisor IC3 The RESET IC output pin must be open drain with delay time of le 10 ms and the recommended part is

TCM809SVNB713

74 General Purpose IO pinsThe following table provides the details of various functions that are mapped to the IO pins of the IS20xxS SoCand these IOs are configured by using the IS20XXS_UI tool The first button (Button 0) must be configured as thepower-onoff key and can be set using the PWR pin The remaining pins are configured for any one of the defaultfunctions (short press long press double press and combinations)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 28

Table 7-1 IO Pin Configuration

Sl No Pin Name Buttons Default Functions(1)

1 PowerMFB Button 0 PWR

2 P0_2 Button 1 PlayPause

3 P2_7 Button 2 Volume Up

4 P0_5 Button 3 Volume Down

5 P0_1 Button 4 FWD

6 P0_3 Button 5 REV

Note 1 These functions can be configured using the IS20XXS_UI tool

Few signals are generated to indicate or control outside devices The most popular applications are NFC for easypairing external audio amplifier for louder speaker and buzzer for indication

Table 7-2 IO Pins for Added Functions

Functions(1) IO Configurable Features

Slide switch P0_0P1_5

Buzzer P0_3

NFC detect P0_4P1_5

External amplifier enable P1_5

Note 1 These functions can be configured using the IS20XXS_UI tool

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 29

8 Antenna Placement RuleFor Bluetooth-enabled products the antenna placement affects the overall performance The antenna requires freespace to radiate RF signals and it must not be surrounded by the GND plane

The following figure illustrates a typical example of the good and poor antenna placement on the main applicationboard with the GND plane

Figure 8-1 Antenna Placement Examples

The following figure illustrates the keep-out area recommended for the PCB antenna

Figure 8-2 Keep-Out Area Recommended for PCB Antenna

Note  For additional information on the antenna placement refer to the antenna-specific data sheet from theantenna manufacturer

IS2008SIS2010SIS2013SIS2015SAntenna Placement Rule

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 30

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

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Worldwide Sales and Service

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Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

4 TransceiverThe SoC is designed and optimized for Bluetooth 24 GHz systems It contains a complete radio frequencytransmitterreceiver section An internal synthesizer generates a stable clock to synchronize with another device

41 TransmitterThe internal Power Amplifier (PA) has a maximum output power of +4 dBm with 20 dB power level control Applythis to Class 2 or Class 3 radios without an external RF PA The transmitter directly performs the IQ conversionto minimize the frequency drift and it can access the 20 dB power range with the temperature compensationmechanism

42 ReceiverThe Low-Noise Amplifier (LNA) operates with TR-combined mode for the single port application It saves the pin onthe package without having an external TXRX switch

The ADC is used to sample the input analog signal and convert it into a digital signal for demodulator analysisA channel filter is integrated into a receiver channel before the ADC to reduce the external component count andincrease the anti-interference capability

The image rejection filter is used to reject the image frequency for the low-IF architecture and it is also intended toreduce the external Band Pass Filter (BPF) component for a super heterodyne architecture

The Received Signal Strength Indicator (RSSI) signal feedback to the processor is used to control the RF outputpower to make a good trade-off for effective distance and current consumption

43 SynthesizerA synthesizer generates a clock for radio transceiver operation The VCO inside with a tunable internal LC tankcan reduce any variation for components A crystal oscillator with an internal digital trimming circuit provides a stableclock for the synthesizer

44 ModemFor Bluetooth 12 specifications and below 1 Mbps is the standard data rate based on the Gaussian Frequency ShiftKeying (GFSK) modulation scheme This basic rate modem meets BDR requirements of Bluetooth 20 with EDRspecifications

For Bluetooth 20 and above specifications EDR is introduced to provide the data rates of 123 Mbps Thisenhanced data rate modem meets EDR requirements of Bluetooth 20 with EDR specifications For the basebandboth BDR and EDR utilize the same 1 MHz symbol rate and 16 kHz slot rate For BDR 1 symbol represents 1-bitHowever each symbol in the payload part of the EDR packets represents 2-bit or 3-bit This is achieved by using twodifferent modulations π4 DQPSK and 8 DPSK

45 Adaptive Frequency Hopping (AFH)The SoC has an AFH function to avoid RF interference It has an algorithm to check the nearby interference and tochoose the clear channel for the transceiver Bluetooth signal

IS2008SIS2010SIS2013SIS2015STransceiver

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 19

5 MicrocontrollerA single-cycle 8-bit microcontroller is built into the SoC to execute the Bluetooth protocols It operates from 16 MHzto higher frequencies where the firmware dynamically adjusts the trade-off between the computing power and thepower consumption In the ROM version the MCU firmware is hard-wired to minimize power consumption for thefirmware execution and to save the external Flash cost

51 MemoryThere are sufficient ROM and RAM to fulfill the processor requirements in which a synchronous single port RAMinterface is used The register bank dedicated single port memory and Flash memory are connected to theprocessor bus The processor coordinates with all link control procedures and the data movement happens using aset of pointer registers

52 External ResetThe IS20xxS SoC provides a Watchdog Timer (WDT) to reset the SoC It has an integrated Power-on Reset (POR)circuit that resets all circuits to a known Power-on state This action is also driven by an external Reset signal whichis used to control the device externally by forcing it into a POR state The RST_N signal input is active-low and noconnection is required in most of the applications

53 Reference ClockThe IS20xxS SoC is composed of an integrated crystal oscillation function that uses a 16 MHz external crystal andtwo specified loading capacitors to provide a high quality system reference timer source Use this feature to removethe initial tolerance frequency errors which are associated with the crystal and its equivalent loading capacitance inthe mass production Achieve the frequency trim by adjusting the crystal loading capacitance through the on-chip trimcapacitors (Ctrim)

The value of the trimming capacitance is 200 fF (200x10-15 F) per LSB at the 5-bit word and the overall adjustableclock frequency is plusmn40 kHz The following figure illustrates the crystal connection of the IS20xxS SoC with twocapacitors

Figure 5-1 Crystal Connection

IS20XXS

XO_N

CL1

XO_P

CL2

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Datasheet DS70005472A-page 20

Notes 1 Ctrim = 200 fF (1 to 31) Cint = 3 pF2 CL = [(CL1 x CL2) (CL1 + CL2)] + (Ctrim 2) + Cint (set trim value as 16 Ctrim = 32 pF)3 For a 16 MHz crystal where CL = 9 pF the CL1 = CL2 = 91 pF)4 For the CL selection refer to the data sheet of the crystal

IS2008SIS2010SIS2013SIS2015SMicrocontroller

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 21

6 Power Management Unit (PMU)The IS20xxS SoC has an integrated PMU The main features of the PMU are a lithium-ion battery charger and avoltage regulator A power switch is used to switch over the power source between a battery and an adapter Alsothe PMU provides current to the LED drivers

61 Charging a BatteryThe IS20xxS SoC has a built-in battery charger which is optimized for lithium-polymer batteries The battery chargerincludes a current sensor for a charging control user programmable current regulator and high accuracy voltageregulator

The charging current parameters are configured by using the UI (IS20XXS_UI) tool Whenever the adapter isplugged-in the charging circuit will be activated Reviving pre-charging constant current mode constant voltagemode and re-charging functions are implemented The maximum charging current is 350 mA The following figureillustrates the charging curve of a battery

Figure 6-1 Battery Charging Curve

62 Voltage MonitoringA 10-bit successive approximation register ADC (SAR ADC) provides a dedicated channel for battery voltage leveldetection The warning level is programmed by using the UI tool The ADC provides a granular resolution to enablethe MCU to take control over the charging process

63 Low Dropout RegulatorA built-in LDO Regulator is used to convert the battery or adapter power for the power supply It also integratesthe hardware architecture to control the power-onoff procedure The built-in programmable LDOs provide power forcodec and digital IO pads Also it is used to buffer the high input voltage from the battery or adapter This LDOrequires a 1 μF bypass capacitor

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 22

64 Switching RegulatorThe built-in programmable output voltage regulator converts the battery voltage to RF and base band core powersupply This converter has a high conversion efficiency and a fast transient response

65 LED DriverThe IS20xxS SoC consists of two LED drivers to control the LEDs The LED drivers provide enough sink current(16-step control and 035 mA for each step) and the LED is connected directly to the IS20xxS SoC

Note  Configure the LED settings using the IS20XXS_UI tool

The following figure illustrates the LED driver in the IS20xxS SoC

Figure 6-2 LED DRIVER

IS20xxS

LED2

SYS_PWR

LED1

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 23

7 Application InformationThis section describes the power supply connection host MCU UART interface and various modes in detail

71 Power SupplyThe following figure illustrates the connection from the BAT_IN pin to various other voltage supply pins of theIS20xxS SoC

The BAT_IN input pin powers the IS20xxS SoC To charge the battery connect the external 5V power adapter toADAP_IN

Figure 7-1 Power Tree Diagram

VDDA VDDAO

VDD_IO

3V LDO

18V Buck

SAR_VDD

LDO31_VIN

CODEC_VO

LDO31_VO

BK_VDD

BK_LX

BK_O

VDD_CORE

VCC_RF

12V LDOPMIC_IN

CLDO_O

RFLDO_O

PVDD_CDA

Li-Io

n BA

T BAT_IN

ADAP_IN

SYS_PWRPower Switch

5V Adapter

(42~30V)

(45~55V)(42~30V)

(30~27V)

(33 ~27V)

(18V)

(12V)

(128V)

72 Host MCU InterfaceAn external MCU controls the IS20xxS SoC using the UART command set The following figure illustrates the UARTinterface between the IS20xxS SoC and an external MCU

Figure 7-2 Host MCU Interface Over UART

IS20xxSHCI_TXD

HCI_RXD

PWR

P0_0

MCUUART_TX

UART_RX

MCU_WAKEUP

BT_WAKEUP

UART Interface

UART Interface

The MCU controls the IS20xxS SoC over the UART interface and wakes up the SoC using the PWR pin The MCUfunction wakes up by connecting to the P0_0 pin of the IS20xxS

Refer to the IS200xIS201xIS202x UART Command SOP document for a list of functions that the IS20xxS SoCsupports and how to use the IS20XXS_UI tool to set up the system using the UART command

Note  The IS200xIS201xIS202x UART Command SOP document is available for download from the Microchipwebsite at IS200xIS201xIS202x UART Command SOP

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copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 24

73 Timing Sequence of UART ApplicationThe following figures illustrate the various UART control signal timing sequences

Figure 7-3 Power-OnOff Sequence

BAT_IN

SYS_PWR

1 ms

Power- oninitial idle Power-on Power-on Power-off idle

MCU state

MFB (PWR)

BK_OLDO31_VO

400 ms

RST_N

MCU sends UART command (UART_RX)

UART Command

MCU sends power-off UART Command

Power-on ACK ACK ACKIS20xxS response UART state

(UART_TX)

Set ldquoPower-on Directlyrdquo boot

any

10 ms

20 msKeep all IS20xxSand MCU connection to low level

2s

(See Figure 7-4) (See Figure 7-5)

IS20xxS disconnect and auto power-off

gt 1s

Figure 7-4 Timing Sequence of RX Indication after Power-On

Resume 32 kHz mode

MFB (PWR)MCU sends UART command

MFB pulse must be longer than the UART command slot time

150 ms

2 ms 2 ms

Enter 32 kHz mode

1 ms

UART Command

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 25

Figure 7-5 Timing Sequence of Power-Off

BAT_IN +4V

MFB

MCU Sends RST_N

BK_OUT

LDO31_VO

UART Bus

2s 1s

IS20xxS Sends Power-off ACK

Notes 1 EEPROM clock = 100 kHz2 For a byte wire 001 ms x 32 clock x 2 = 640 μs3 It is recommended that ramp-down time be more than 640 μs during the power-off sequence to ensure safe

operation of the device

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 26

Figu

re 7

-6 

Tim

ing

Sequ

ence

of P

ower

-On

(NA

CK

)

BAT

_IN

SYS_

PWR

1 m

s Pow

er-

onin

itial

idle

Pow

er-o

nM

CU

sta

te

MFB

(PW

R)

BK_O

LD

O31

_VO

400

ms

RST

_N

MC

U s

ends

UAR

T co

mm

and

(UAR

T_R

X)

UAR

T C

omm

and

NAC

KPo

wer

-on

ACK

ACK

IS20

xxS

resp

onse

UAR

T st

ate

(UAR

T_TX

)

Set ldquo

Pow

er-o

n D

irect

lyrdquo b

oot

10 m

s

20 m

s

Ret

ry i

f AC

K is

not

rece

ived

200

ms

any

Wai

t

Max

imum

5 ti

mes

(1s)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 27

Figure 7-7 Reset Timing Sequence in Case of No Response from SoC to Host MCU

MFB (PWR)

MCU sends UART command UART

Command

UART Command

IS20xxS UART

If no response

RST_N

1ms

X ms1ms

1ms

1ms

Note  The MCU sends the UART command again when the SoC is not responding to its first UART command Ifthe SoC is not responding to the second UART command within X ms the MCU forces the system to reset

Figure 7-8 Timing Sequence of Power Drop Protection

BAT_IN +4V

RST_N from Reset IC

Power

SYS_PWR

IS20xxS

Reset OUT VDDGND

MCU Reset

Reset IC

29V

1 It is recommended that the battery be connected on a BAT_IN pin of the SoC for the power supply2 If an external power source or a power adapter is used to provide the power to the SoC (ADAP_IN) use a

voltage supervisor IC3 The RESET IC output pin must be open drain with delay time of le 10 ms and the recommended part is

TCM809SVNB713

74 General Purpose IO pinsThe following table provides the details of various functions that are mapped to the IO pins of the IS20xxS SoCand these IOs are configured by using the IS20XXS_UI tool The first button (Button 0) must be configured as thepower-onoff key and can be set using the PWR pin The remaining pins are configured for any one of the defaultfunctions (short press long press double press and combinations)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 28

Table 7-1 IO Pin Configuration

Sl No Pin Name Buttons Default Functions(1)

1 PowerMFB Button 0 PWR

2 P0_2 Button 1 PlayPause

3 P2_7 Button 2 Volume Up

4 P0_5 Button 3 Volume Down

5 P0_1 Button 4 FWD

6 P0_3 Button 5 REV

Note 1 These functions can be configured using the IS20XXS_UI tool

Few signals are generated to indicate or control outside devices The most popular applications are NFC for easypairing external audio amplifier for louder speaker and buzzer for indication

Table 7-2 IO Pins for Added Functions

Functions(1) IO Configurable Features

Slide switch P0_0P1_5

Buzzer P0_3

NFC detect P0_4P1_5

External amplifier enable P1_5

Note 1 These functions can be configured using the IS20XXS_UI tool

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 29

8 Antenna Placement RuleFor Bluetooth-enabled products the antenna placement affects the overall performance The antenna requires freespace to radiate RF signals and it must not be surrounded by the GND plane

The following figure illustrates a typical example of the good and poor antenna placement on the main applicationboard with the GND plane

Figure 8-1 Antenna Placement Examples

The following figure illustrates the keep-out area recommended for the PCB antenna

Figure 8-2 Keep-Out Area Recommended for PCB Antenna

Note  For additional information on the antenna placement refer to the antenna-specific data sheet from theantenna manufacturer

IS2008SIS2010SIS2013SIS2015SAntenna Placement Rule

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 30

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

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copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

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copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

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Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

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Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

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Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

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Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

5 MicrocontrollerA single-cycle 8-bit microcontroller is built into the SoC to execute the Bluetooth protocols It operates from 16 MHzto higher frequencies where the firmware dynamically adjusts the trade-off between the computing power and thepower consumption In the ROM version the MCU firmware is hard-wired to minimize power consumption for thefirmware execution and to save the external Flash cost

51 MemoryThere are sufficient ROM and RAM to fulfill the processor requirements in which a synchronous single port RAMinterface is used The register bank dedicated single port memory and Flash memory are connected to theprocessor bus The processor coordinates with all link control procedures and the data movement happens using aset of pointer registers

52 External ResetThe IS20xxS SoC provides a Watchdog Timer (WDT) to reset the SoC It has an integrated Power-on Reset (POR)circuit that resets all circuits to a known Power-on state This action is also driven by an external Reset signal whichis used to control the device externally by forcing it into a POR state The RST_N signal input is active-low and noconnection is required in most of the applications

53 Reference ClockThe IS20xxS SoC is composed of an integrated crystal oscillation function that uses a 16 MHz external crystal andtwo specified loading capacitors to provide a high quality system reference timer source Use this feature to removethe initial tolerance frequency errors which are associated with the crystal and its equivalent loading capacitance inthe mass production Achieve the frequency trim by adjusting the crystal loading capacitance through the on-chip trimcapacitors (Ctrim)

The value of the trimming capacitance is 200 fF (200x10-15 F) per LSB at the 5-bit word and the overall adjustableclock frequency is plusmn40 kHz The following figure illustrates the crystal connection of the IS20xxS SoC with twocapacitors

Figure 5-1 Crystal Connection

IS20XXS

XO_N

CL1

XO_P

CL2

IS2008SIS2010SIS2013SIS2015SMicrocontroller

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 20

Notes 1 Ctrim = 200 fF (1 to 31) Cint = 3 pF2 CL = [(CL1 x CL2) (CL1 + CL2)] + (Ctrim 2) + Cint (set trim value as 16 Ctrim = 32 pF)3 For a 16 MHz crystal where CL = 9 pF the CL1 = CL2 = 91 pF)4 For the CL selection refer to the data sheet of the crystal

IS2008SIS2010SIS2013SIS2015SMicrocontroller

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 21

6 Power Management Unit (PMU)The IS20xxS SoC has an integrated PMU The main features of the PMU are a lithium-ion battery charger and avoltage regulator A power switch is used to switch over the power source between a battery and an adapter Alsothe PMU provides current to the LED drivers

61 Charging a BatteryThe IS20xxS SoC has a built-in battery charger which is optimized for lithium-polymer batteries The battery chargerincludes a current sensor for a charging control user programmable current regulator and high accuracy voltageregulator

The charging current parameters are configured by using the UI (IS20XXS_UI) tool Whenever the adapter isplugged-in the charging circuit will be activated Reviving pre-charging constant current mode constant voltagemode and re-charging functions are implemented The maximum charging current is 350 mA The following figureillustrates the charging curve of a battery

Figure 6-1 Battery Charging Curve

62 Voltage MonitoringA 10-bit successive approximation register ADC (SAR ADC) provides a dedicated channel for battery voltage leveldetection The warning level is programmed by using the UI tool The ADC provides a granular resolution to enablethe MCU to take control over the charging process

63 Low Dropout RegulatorA built-in LDO Regulator is used to convert the battery or adapter power for the power supply It also integratesthe hardware architecture to control the power-onoff procedure The built-in programmable LDOs provide power forcodec and digital IO pads Also it is used to buffer the high input voltage from the battery or adapter This LDOrequires a 1 μF bypass capacitor

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 22

64 Switching RegulatorThe built-in programmable output voltage regulator converts the battery voltage to RF and base band core powersupply This converter has a high conversion efficiency and a fast transient response

65 LED DriverThe IS20xxS SoC consists of two LED drivers to control the LEDs The LED drivers provide enough sink current(16-step control and 035 mA for each step) and the LED is connected directly to the IS20xxS SoC

Note  Configure the LED settings using the IS20XXS_UI tool

The following figure illustrates the LED driver in the IS20xxS SoC

Figure 6-2 LED DRIVER

IS20xxS

LED2

SYS_PWR

LED1

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 23

7 Application InformationThis section describes the power supply connection host MCU UART interface and various modes in detail

71 Power SupplyThe following figure illustrates the connection from the BAT_IN pin to various other voltage supply pins of theIS20xxS SoC

The BAT_IN input pin powers the IS20xxS SoC To charge the battery connect the external 5V power adapter toADAP_IN

Figure 7-1 Power Tree Diagram

VDDA VDDAO

VDD_IO

3V LDO

18V Buck

SAR_VDD

LDO31_VIN

CODEC_VO

LDO31_VO

BK_VDD

BK_LX

BK_O

VDD_CORE

VCC_RF

12V LDOPMIC_IN

CLDO_O

RFLDO_O

PVDD_CDA

Li-Io

n BA

T BAT_IN

ADAP_IN

SYS_PWRPower Switch

5V Adapter

(42~30V)

(45~55V)(42~30V)

(30~27V)

(33 ~27V)

(18V)

(12V)

(128V)

72 Host MCU InterfaceAn external MCU controls the IS20xxS SoC using the UART command set The following figure illustrates the UARTinterface between the IS20xxS SoC and an external MCU

Figure 7-2 Host MCU Interface Over UART

IS20xxSHCI_TXD

HCI_RXD

PWR

P0_0

MCUUART_TX

UART_RX

MCU_WAKEUP

BT_WAKEUP

UART Interface

UART Interface

The MCU controls the IS20xxS SoC over the UART interface and wakes up the SoC using the PWR pin The MCUfunction wakes up by connecting to the P0_0 pin of the IS20xxS

Refer to the IS200xIS201xIS202x UART Command SOP document for a list of functions that the IS20xxS SoCsupports and how to use the IS20XXS_UI tool to set up the system using the UART command

Note  The IS200xIS201xIS202x UART Command SOP document is available for download from the Microchipwebsite at IS200xIS201xIS202x UART Command SOP

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 24

73 Timing Sequence of UART ApplicationThe following figures illustrate the various UART control signal timing sequences

Figure 7-3 Power-OnOff Sequence

BAT_IN

SYS_PWR

1 ms

Power- oninitial idle Power-on Power-on Power-off idle

MCU state

MFB (PWR)

BK_OLDO31_VO

400 ms

RST_N

MCU sends UART command (UART_RX)

UART Command

MCU sends power-off UART Command

Power-on ACK ACK ACKIS20xxS response UART state

(UART_TX)

Set ldquoPower-on Directlyrdquo boot

any

10 ms

20 msKeep all IS20xxSand MCU connection to low level

2s

(See Figure 7-4) (See Figure 7-5)

IS20xxS disconnect and auto power-off

gt 1s

Figure 7-4 Timing Sequence of RX Indication after Power-On

Resume 32 kHz mode

MFB (PWR)MCU sends UART command

MFB pulse must be longer than the UART command slot time

150 ms

2 ms 2 ms

Enter 32 kHz mode

1 ms

UART Command

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 25

Figure 7-5 Timing Sequence of Power-Off

BAT_IN +4V

MFB

MCU Sends RST_N

BK_OUT

LDO31_VO

UART Bus

2s 1s

IS20xxS Sends Power-off ACK

Notes 1 EEPROM clock = 100 kHz2 For a byte wire 001 ms x 32 clock x 2 = 640 μs3 It is recommended that ramp-down time be more than 640 μs during the power-off sequence to ensure safe

operation of the device

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 26

Figu

re 7

-6 

Tim

ing

Sequ

ence

of P

ower

-On

(NA

CK

)

BAT

_IN

SYS_

PWR

1 m

s Pow

er-

onin

itial

idle

Pow

er-o

nM

CU

sta

te

MFB

(PW

R)

BK_O

LD

O31

_VO

400

ms

RST

_N

MC

U s

ends

UAR

T co

mm

and

(UAR

T_R

X)

UAR

T C

omm

and

NAC

KPo

wer

-on

ACK

ACK

IS20

xxS

resp

onse

UAR

T st

ate

(UAR

T_TX

)

Set ldquo

Pow

er-o

n D

irect

lyrdquo b

oot

10 m

s

20 m

s

Ret

ry i

f AC

K is

not

rece

ived

200

ms

any

Wai

t

Max

imum

5 ti

mes

(1s)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 27

Figure 7-7 Reset Timing Sequence in Case of No Response from SoC to Host MCU

MFB (PWR)

MCU sends UART command UART

Command

UART Command

IS20xxS UART

If no response

RST_N

1ms

X ms1ms

1ms

1ms

Note  The MCU sends the UART command again when the SoC is not responding to its first UART command Ifthe SoC is not responding to the second UART command within X ms the MCU forces the system to reset

Figure 7-8 Timing Sequence of Power Drop Protection

BAT_IN +4V

RST_N from Reset IC

Power

SYS_PWR

IS20xxS

Reset OUT VDDGND

MCU Reset

Reset IC

29V

1 It is recommended that the battery be connected on a BAT_IN pin of the SoC for the power supply2 If an external power source or a power adapter is used to provide the power to the SoC (ADAP_IN) use a

voltage supervisor IC3 The RESET IC output pin must be open drain with delay time of le 10 ms and the recommended part is

TCM809SVNB713

74 General Purpose IO pinsThe following table provides the details of various functions that are mapped to the IO pins of the IS20xxS SoCand these IOs are configured by using the IS20XXS_UI tool The first button (Button 0) must be configured as thepower-onoff key and can be set using the PWR pin The remaining pins are configured for any one of the defaultfunctions (short press long press double press and combinations)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 28

Table 7-1 IO Pin Configuration

Sl No Pin Name Buttons Default Functions(1)

1 PowerMFB Button 0 PWR

2 P0_2 Button 1 PlayPause

3 P2_7 Button 2 Volume Up

4 P0_5 Button 3 Volume Down

5 P0_1 Button 4 FWD

6 P0_3 Button 5 REV

Note 1 These functions can be configured using the IS20XXS_UI tool

Few signals are generated to indicate or control outside devices The most popular applications are NFC for easypairing external audio amplifier for louder speaker and buzzer for indication

Table 7-2 IO Pins for Added Functions

Functions(1) IO Configurable Features

Slide switch P0_0P1_5

Buzzer P0_3

NFC detect P0_4P1_5

External amplifier enable P1_5

Note 1 These functions can be configured using the IS20XXS_UI tool

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 29

8 Antenna Placement RuleFor Bluetooth-enabled products the antenna placement affects the overall performance The antenna requires freespace to radiate RF signals and it must not be surrounded by the GND plane

The following figure illustrates a typical example of the good and poor antenna placement on the main applicationboard with the GND plane

Figure 8-1 Antenna Placement Examples

The following figure illustrates the keep-out area recommended for the PCB antenna

Figure 8-2 Keep-Out Area Recommended for PCB Antenna

Note  For additional information on the antenna placement refer to the antenna-specific data sheet from theantenna manufacturer

IS2008SIS2010SIS2013SIS2015SAntenna Placement Rule

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 30

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Notes 1 Ctrim = 200 fF (1 to 31) Cint = 3 pF2 CL = [(CL1 x CL2) (CL1 + CL2)] + (Ctrim 2) + Cint (set trim value as 16 Ctrim = 32 pF)3 For a 16 MHz crystal where CL = 9 pF the CL1 = CL2 = 91 pF)4 For the CL selection refer to the data sheet of the crystal

IS2008SIS2010SIS2013SIS2015SMicrocontroller

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 21

6 Power Management Unit (PMU)The IS20xxS SoC has an integrated PMU The main features of the PMU are a lithium-ion battery charger and avoltage regulator A power switch is used to switch over the power source between a battery and an adapter Alsothe PMU provides current to the LED drivers

61 Charging a BatteryThe IS20xxS SoC has a built-in battery charger which is optimized for lithium-polymer batteries The battery chargerincludes a current sensor for a charging control user programmable current regulator and high accuracy voltageregulator

The charging current parameters are configured by using the UI (IS20XXS_UI) tool Whenever the adapter isplugged-in the charging circuit will be activated Reviving pre-charging constant current mode constant voltagemode and re-charging functions are implemented The maximum charging current is 350 mA The following figureillustrates the charging curve of a battery

Figure 6-1 Battery Charging Curve

62 Voltage MonitoringA 10-bit successive approximation register ADC (SAR ADC) provides a dedicated channel for battery voltage leveldetection The warning level is programmed by using the UI tool The ADC provides a granular resolution to enablethe MCU to take control over the charging process

63 Low Dropout RegulatorA built-in LDO Regulator is used to convert the battery or adapter power for the power supply It also integratesthe hardware architecture to control the power-onoff procedure The built-in programmable LDOs provide power forcodec and digital IO pads Also it is used to buffer the high input voltage from the battery or adapter This LDOrequires a 1 μF bypass capacitor

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 22

64 Switching RegulatorThe built-in programmable output voltage regulator converts the battery voltage to RF and base band core powersupply This converter has a high conversion efficiency and a fast transient response

65 LED DriverThe IS20xxS SoC consists of two LED drivers to control the LEDs The LED drivers provide enough sink current(16-step control and 035 mA for each step) and the LED is connected directly to the IS20xxS SoC

Note  Configure the LED settings using the IS20XXS_UI tool

The following figure illustrates the LED driver in the IS20xxS SoC

Figure 6-2 LED DRIVER

IS20xxS

LED2

SYS_PWR

LED1

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 23

7 Application InformationThis section describes the power supply connection host MCU UART interface and various modes in detail

71 Power SupplyThe following figure illustrates the connection from the BAT_IN pin to various other voltage supply pins of theIS20xxS SoC

The BAT_IN input pin powers the IS20xxS SoC To charge the battery connect the external 5V power adapter toADAP_IN

Figure 7-1 Power Tree Diagram

VDDA VDDAO

VDD_IO

3V LDO

18V Buck

SAR_VDD

LDO31_VIN

CODEC_VO

LDO31_VO

BK_VDD

BK_LX

BK_O

VDD_CORE

VCC_RF

12V LDOPMIC_IN

CLDO_O

RFLDO_O

PVDD_CDA

Li-Io

n BA

T BAT_IN

ADAP_IN

SYS_PWRPower Switch

5V Adapter

(42~30V)

(45~55V)(42~30V)

(30~27V)

(33 ~27V)

(18V)

(12V)

(128V)

72 Host MCU InterfaceAn external MCU controls the IS20xxS SoC using the UART command set The following figure illustrates the UARTinterface between the IS20xxS SoC and an external MCU

Figure 7-2 Host MCU Interface Over UART

IS20xxSHCI_TXD

HCI_RXD

PWR

P0_0

MCUUART_TX

UART_RX

MCU_WAKEUP

BT_WAKEUP

UART Interface

UART Interface

The MCU controls the IS20xxS SoC over the UART interface and wakes up the SoC using the PWR pin The MCUfunction wakes up by connecting to the P0_0 pin of the IS20xxS

Refer to the IS200xIS201xIS202x UART Command SOP document for a list of functions that the IS20xxS SoCsupports and how to use the IS20XXS_UI tool to set up the system using the UART command

Note  The IS200xIS201xIS202x UART Command SOP document is available for download from the Microchipwebsite at IS200xIS201xIS202x UART Command SOP

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 24

73 Timing Sequence of UART ApplicationThe following figures illustrate the various UART control signal timing sequences

Figure 7-3 Power-OnOff Sequence

BAT_IN

SYS_PWR

1 ms

Power- oninitial idle Power-on Power-on Power-off idle

MCU state

MFB (PWR)

BK_OLDO31_VO

400 ms

RST_N

MCU sends UART command (UART_RX)

UART Command

MCU sends power-off UART Command

Power-on ACK ACK ACKIS20xxS response UART state

(UART_TX)

Set ldquoPower-on Directlyrdquo boot

any

10 ms

20 msKeep all IS20xxSand MCU connection to low level

2s

(See Figure 7-4) (See Figure 7-5)

IS20xxS disconnect and auto power-off

gt 1s

Figure 7-4 Timing Sequence of RX Indication after Power-On

Resume 32 kHz mode

MFB (PWR)MCU sends UART command

MFB pulse must be longer than the UART command slot time

150 ms

2 ms 2 ms

Enter 32 kHz mode

1 ms

UART Command

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 25

Figure 7-5 Timing Sequence of Power-Off

BAT_IN +4V

MFB

MCU Sends RST_N

BK_OUT

LDO31_VO

UART Bus

2s 1s

IS20xxS Sends Power-off ACK

Notes 1 EEPROM clock = 100 kHz2 For a byte wire 001 ms x 32 clock x 2 = 640 μs3 It is recommended that ramp-down time be more than 640 μs during the power-off sequence to ensure safe

operation of the device

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 26

Figu

re 7

-6 

Tim

ing

Sequ

ence

of P

ower

-On

(NA

CK

)

BAT

_IN

SYS_

PWR

1 m

s Pow

er-

onin

itial

idle

Pow

er-o

nM

CU

sta

te

MFB

(PW

R)

BK_O

LD

O31

_VO

400

ms

RST

_N

MC

U s

ends

UAR

T co

mm

and

(UAR

T_R

X)

UAR

T C

omm

and

NAC

KPo

wer

-on

ACK

ACK

IS20

xxS

resp

onse

UAR

T st

ate

(UAR

T_TX

)

Set ldquo

Pow

er-o

n D

irect

lyrdquo b

oot

10 m

s

20 m

s

Ret

ry i

f AC

K is

not

rece

ived

200

ms

any

Wai

t

Max

imum

5 ti

mes

(1s)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 27

Figure 7-7 Reset Timing Sequence in Case of No Response from SoC to Host MCU

MFB (PWR)

MCU sends UART command UART

Command

UART Command

IS20xxS UART

If no response

RST_N

1ms

X ms1ms

1ms

1ms

Note  The MCU sends the UART command again when the SoC is not responding to its first UART command Ifthe SoC is not responding to the second UART command within X ms the MCU forces the system to reset

Figure 7-8 Timing Sequence of Power Drop Protection

BAT_IN +4V

RST_N from Reset IC

Power

SYS_PWR

IS20xxS

Reset OUT VDDGND

MCU Reset

Reset IC

29V

1 It is recommended that the battery be connected on a BAT_IN pin of the SoC for the power supply2 If an external power source or a power adapter is used to provide the power to the SoC (ADAP_IN) use a

voltage supervisor IC3 The RESET IC output pin must be open drain with delay time of le 10 ms and the recommended part is

TCM809SVNB713

74 General Purpose IO pinsThe following table provides the details of various functions that are mapped to the IO pins of the IS20xxS SoCand these IOs are configured by using the IS20XXS_UI tool The first button (Button 0) must be configured as thepower-onoff key and can be set using the PWR pin The remaining pins are configured for any one of the defaultfunctions (short press long press double press and combinations)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 28

Table 7-1 IO Pin Configuration

Sl No Pin Name Buttons Default Functions(1)

1 PowerMFB Button 0 PWR

2 P0_2 Button 1 PlayPause

3 P2_7 Button 2 Volume Up

4 P0_5 Button 3 Volume Down

5 P0_1 Button 4 FWD

6 P0_3 Button 5 REV

Note 1 These functions can be configured using the IS20XXS_UI tool

Few signals are generated to indicate or control outside devices The most popular applications are NFC for easypairing external audio amplifier for louder speaker and buzzer for indication

Table 7-2 IO Pins for Added Functions

Functions(1) IO Configurable Features

Slide switch P0_0P1_5

Buzzer P0_3

NFC detect P0_4P1_5

External amplifier enable P1_5

Note 1 These functions can be configured using the IS20XXS_UI tool

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 29

8 Antenna Placement RuleFor Bluetooth-enabled products the antenna placement affects the overall performance The antenna requires freespace to radiate RF signals and it must not be surrounded by the GND plane

The following figure illustrates a typical example of the good and poor antenna placement on the main applicationboard with the GND plane

Figure 8-1 Antenna Placement Examples

The following figure illustrates the keep-out area recommended for the PCB antenna

Figure 8-2 Keep-Out Area Recommended for PCB Antenna

Note  For additional information on the antenna placement refer to the antenna-specific data sheet from theantenna manufacturer

IS2008SIS2010SIS2013SIS2015SAntenna Placement Rule

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 30

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

6 Power Management Unit (PMU)The IS20xxS SoC has an integrated PMU The main features of the PMU are a lithium-ion battery charger and avoltage regulator A power switch is used to switch over the power source between a battery and an adapter Alsothe PMU provides current to the LED drivers

61 Charging a BatteryThe IS20xxS SoC has a built-in battery charger which is optimized for lithium-polymer batteries The battery chargerincludes a current sensor for a charging control user programmable current regulator and high accuracy voltageregulator

The charging current parameters are configured by using the UI (IS20XXS_UI) tool Whenever the adapter isplugged-in the charging circuit will be activated Reviving pre-charging constant current mode constant voltagemode and re-charging functions are implemented The maximum charging current is 350 mA The following figureillustrates the charging curve of a battery

Figure 6-1 Battery Charging Curve

62 Voltage MonitoringA 10-bit successive approximation register ADC (SAR ADC) provides a dedicated channel for battery voltage leveldetection The warning level is programmed by using the UI tool The ADC provides a granular resolution to enablethe MCU to take control over the charging process

63 Low Dropout RegulatorA built-in LDO Regulator is used to convert the battery or adapter power for the power supply It also integratesthe hardware architecture to control the power-onoff procedure The built-in programmable LDOs provide power forcodec and digital IO pads Also it is used to buffer the high input voltage from the battery or adapter This LDOrequires a 1 μF bypass capacitor

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 22

64 Switching RegulatorThe built-in programmable output voltage regulator converts the battery voltage to RF and base band core powersupply This converter has a high conversion efficiency and a fast transient response

65 LED DriverThe IS20xxS SoC consists of two LED drivers to control the LEDs The LED drivers provide enough sink current(16-step control and 035 mA for each step) and the LED is connected directly to the IS20xxS SoC

Note  Configure the LED settings using the IS20XXS_UI tool

The following figure illustrates the LED driver in the IS20xxS SoC

Figure 6-2 LED DRIVER

IS20xxS

LED2

SYS_PWR

LED1

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 23

7 Application InformationThis section describes the power supply connection host MCU UART interface and various modes in detail

71 Power SupplyThe following figure illustrates the connection from the BAT_IN pin to various other voltage supply pins of theIS20xxS SoC

The BAT_IN input pin powers the IS20xxS SoC To charge the battery connect the external 5V power adapter toADAP_IN

Figure 7-1 Power Tree Diagram

VDDA VDDAO

VDD_IO

3V LDO

18V Buck

SAR_VDD

LDO31_VIN

CODEC_VO

LDO31_VO

BK_VDD

BK_LX

BK_O

VDD_CORE

VCC_RF

12V LDOPMIC_IN

CLDO_O

RFLDO_O

PVDD_CDA

Li-Io

n BA

T BAT_IN

ADAP_IN

SYS_PWRPower Switch

5V Adapter

(42~30V)

(45~55V)(42~30V)

(30~27V)

(33 ~27V)

(18V)

(12V)

(128V)

72 Host MCU InterfaceAn external MCU controls the IS20xxS SoC using the UART command set The following figure illustrates the UARTinterface between the IS20xxS SoC and an external MCU

Figure 7-2 Host MCU Interface Over UART

IS20xxSHCI_TXD

HCI_RXD

PWR

P0_0

MCUUART_TX

UART_RX

MCU_WAKEUP

BT_WAKEUP

UART Interface

UART Interface

The MCU controls the IS20xxS SoC over the UART interface and wakes up the SoC using the PWR pin The MCUfunction wakes up by connecting to the P0_0 pin of the IS20xxS

Refer to the IS200xIS201xIS202x UART Command SOP document for a list of functions that the IS20xxS SoCsupports and how to use the IS20XXS_UI tool to set up the system using the UART command

Note  The IS200xIS201xIS202x UART Command SOP document is available for download from the Microchipwebsite at IS200xIS201xIS202x UART Command SOP

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 24

73 Timing Sequence of UART ApplicationThe following figures illustrate the various UART control signal timing sequences

Figure 7-3 Power-OnOff Sequence

BAT_IN

SYS_PWR

1 ms

Power- oninitial idle Power-on Power-on Power-off idle

MCU state

MFB (PWR)

BK_OLDO31_VO

400 ms

RST_N

MCU sends UART command (UART_RX)

UART Command

MCU sends power-off UART Command

Power-on ACK ACK ACKIS20xxS response UART state

(UART_TX)

Set ldquoPower-on Directlyrdquo boot

any

10 ms

20 msKeep all IS20xxSand MCU connection to low level

2s

(See Figure 7-4) (See Figure 7-5)

IS20xxS disconnect and auto power-off

gt 1s

Figure 7-4 Timing Sequence of RX Indication after Power-On

Resume 32 kHz mode

MFB (PWR)MCU sends UART command

MFB pulse must be longer than the UART command slot time

150 ms

2 ms 2 ms

Enter 32 kHz mode

1 ms

UART Command

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 25

Figure 7-5 Timing Sequence of Power-Off

BAT_IN +4V

MFB

MCU Sends RST_N

BK_OUT

LDO31_VO

UART Bus

2s 1s

IS20xxS Sends Power-off ACK

Notes 1 EEPROM clock = 100 kHz2 For a byte wire 001 ms x 32 clock x 2 = 640 μs3 It is recommended that ramp-down time be more than 640 μs during the power-off sequence to ensure safe

operation of the device

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 26

Figu

re 7

-6 

Tim

ing

Sequ

ence

of P

ower

-On

(NA

CK

)

BAT

_IN

SYS_

PWR

1 m

s Pow

er-

onin

itial

idle

Pow

er-o

nM

CU

sta

te

MFB

(PW

R)

BK_O

LD

O31

_VO

400

ms

RST

_N

MC

U s

ends

UAR

T co

mm

and

(UAR

T_R

X)

UAR

T C

omm

and

NAC

KPo

wer

-on

ACK

ACK

IS20

xxS

resp

onse

UAR

T st

ate

(UAR

T_TX

)

Set ldquo

Pow

er-o

n D

irect

lyrdquo b

oot

10 m

s

20 m

s

Ret

ry i

f AC

K is

not

rece

ived

200

ms

any

Wai

t

Max

imum

5 ti

mes

(1s)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 27

Figure 7-7 Reset Timing Sequence in Case of No Response from SoC to Host MCU

MFB (PWR)

MCU sends UART command UART

Command

UART Command

IS20xxS UART

If no response

RST_N

1ms

X ms1ms

1ms

1ms

Note  The MCU sends the UART command again when the SoC is not responding to its first UART command Ifthe SoC is not responding to the second UART command within X ms the MCU forces the system to reset

Figure 7-8 Timing Sequence of Power Drop Protection

BAT_IN +4V

RST_N from Reset IC

Power

SYS_PWR

IS20xxS

Reset OUT VDDGND

MCU Reset

Reset IC

29V

1 It is recommended that the battery be connected on a BAT_IN pin of the SoC for the power supply2 If an external power source or a power adapter is used to provide the power to the SoC (ADAP_IN) use a

voltage supervisor IC3 The RESET IC output pin must be open drain with delay time of le 10 ms and the recommended part is

TCM809SVNB713

74 General Purpose IO pinsThe following table provides the details of various functions that are mapped to the IO pins of the IS20xxS SoCand these IOs are configured by using the IS20XXS_UI tool The first button (Button 0) must be configured as thepower-onoff key and can be set using the PWR pin The remaining pins are configured for any one of the defaultfunctions (short press long press double press and combinations)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 28

Table 7-1 IO Pin Configuration

Sl No Pin Name Buttons Default Functions(1)

1 PowerMFB Button 0 PWR

2 P0_2 Button 1 PlayPause

3 P2_7 Button 2 Volume Up

4 P0_5 Button 3 Volume Down

5 P0_1 Button 4 FWD

6 P0_3 Button 5 REV

Note 1 These functions can be configured using the IS20XXS_UI tool

Few signals are generated to indicate or control outside devices The most popular applications are NFC for easypairing external audio amplifier for louder speaker and buzzer for indication

Table 7-2 IO Pins for Added Functions

Functions(1) IO Configurable Features

Slide switch P0_0P1_5

Buzzer P0_3

NFC detect P0_4P1_5

External amplifier enable P1_5

Note 1 These functions can be configured using the IS20XXS_UI tool

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 29

8 Antenna Placement RuleFor Bluetooth-enabled products the antenna placement affects the overall performance The antenna requires freespace to radiate RF signals and it must not be surrounded by the GND plane

The following figure illustrates a typical example of the good and poor antenna placement on the main applicationboard with the GND plane

Figure 8-1 Antenna Placement Examples

The following figure illustrates the keep-out area recommended for the PCB antenna

Figure 8-2 Keep-Out Area Recommended for PCB Antenna

Note  For additional information on the antenna placement refer to the antenna-specific data sheet from theantenna manufacturer

IS2008SIS2010SIS2013SIS2015SAntenna Placement Rule

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 30

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

64 Switching RegulatorThe built-in programmable output voltage regulator converts the battery voltage to RF and base band core powersupply This converter has a high conversion efficiency and a fast transient response

65 LED DriverThe IS20xxS SoC consists of two LED drivers to control the LEDs The LED drivers provide enough sink current(16-step control and 035 mA for each step) and the LED is connected directly to the IS20xxS SoC

Note  Configure the LED settings using the IS20XXS_UI tool

The following figure illustrates the LED driver in the IS20xxS SoC

Figure 6-2 LED DRIVER

IS20xxS

LED2

SYS_PWR

LED1

IS2008SIS2010SIS2013SIS2015SPower Management Unit (PMU)

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 23

7 Application InformationThis section describes the power supply connection host MCU UART interface and various modes in detail

71 Power SupplyThe following figure illustrates the connection from the BAT_IN pin to various other voltage supply pins of theIS20xxS SoC

The BAT_IN input pin powers the IS20xxS SoC To charge the battery connect the external 5V power adapter toADAP_IN

Figure 7-1 Power Tree Diagram

VDDA VDDAO

VDD_IO

3V LDO

18V Buck

SAR_VDD

LDO31_VIN

CODEC_VO

LDO31_VO

BK_VDD

BK_LX

BK_O

VDD_CORE

VCC_RF

12V LDOPMIC_IN

CLDO_O

RFLDO_O

PVDD_CDA

Li-Io

n BA

T BAT_IN

ADAP_IN

SYS_PWRPower Switch

5V Adapter

(42~30V)

(45~55V)(42~30V)

(30~27V)

(33 ~27V)

(18V)

(12V)

(128V)

72 Host MCU InterfaceAn external MCU controls the IS20xxS SoC using the UART command set The following figure illustrates the UARTinterface between the IS20xxS SoC and an external MCU

Figure 7-2 Host MCU Interface Over UART

IS20xxSHCI_TXD

HCI_RXD

PWR

P0_0

MCUUART_TX

UART_RX

MCU_WAKEUP

BT_WAKEUP

UART Interface

UART Interface

The MCU controls the IS20xxS SoC over the UART interface and wakes up the SoC using the PWR pin The MCUfunction wakes up by connecting to the P0_0 pin of the IS20xxS

Refer to the IS200xIS201xIS202x UART Command SOP document for a list of functions that the IS20xxS SoCsupports and how to use the IS20XXS_UI tool to set up the system using the UART command

Note  The IS200xIS201xIS202x UART Command SOP document is available for download from the Microchipwebsite at IS200xIS201xIS202x UART Command SOP

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 24

73 Timing Sequence of UART ApplicationThe following figures illustrate the various UART control signal timing sequences

Figure 7-3 Power-OnOff Sequence

BAT_IN

SYS_PWR

1 ms

Power- oninitial idle Power-on Power-on Power-off idle

MCU state

MFB (PWR)

BK_OLDO31_VO

400 ms

RST_N

MCU sends UART command (UART_RX)

UART Command

MCU sends power-off UART Command

Power-on ACK ACK ACKIS20xxS response UART state

(UART_TX)

Set ldquoPower-on Directlyrdquo boot

any

10 ms

20 msKeep all IS20xxSand MCU connection to low level

2s

(See Figure 7-4) (See Figure 7-5)

IS20xxS disconnect and auto power-off

gt 1s

Figure 7-4 Timing Sequence of RX Indication after Power-On

Resume 32 kHz mode

MFB (PWR)MCU sends UART command

MFB pulse must be longer than the UART command slot time

150 ms

2 ms 2 ms

Enter 32 kHz mode

1 ms

UART Command

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 25

Figure 7-5 Timing Sequence of Power-Off

BAT_IN +4V

MFB

MCU Sends RST_N

BK_OUT

LDO31_VO

UART Bus

2s 1s

IS20xxS Sends Power-off ACK

Notes 1 EEPROM clock = 100 kHz2 For a byte wire 001 ms x 32 clock x 2 = 640 μs3 It is recommended that ramp-down time be more than 640 μs during the power-off sequence to ensure safe

operation of the device

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 26

Figu

re 7

-6 

Tim

ing

Sequ

ence

of P

ower

-On

(NA

CK

)

BAT

_IN

SYS_

PWR

1 m

s Pow

er-

onin

itial

idle

Pow

er-o

nM

CU

sta

te

MFB

(PW

R)

BK_O

LD

O31

_VO

400

ms

RST

_N

MC

U s

ends

UAR

T co

mm

and

(UAR

T_R

X)

UAR

T C

omm

and

NAC

KPo

wer

-on

ACK

ACK

IS20

xxS

resp

onse

UAR

T st

ate

(UAR

T_TX

)

Set ldquo

Pow

er-o

n D

irect

lyrdquo b

oot

10 m

s

20 m

s

Ret

ry i

f AC

K is

not

rece

ived

200

ms

any

Wai

t

Max

imum

5 ti

mes

(1s)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 27

Figure 7-7 Reset Timing Sequence in Case of No Response from SoC to Host MCU

MFB (PWR)

MCU sends UART command UART

Command

UART Command

IS20xxS UART

If no response

RST_N

1ms

X ms1ms

1ms

1ms

Note  The MCU sends the UART command again when the SoC is not responding to its first UART command Ifthe SoC is not responding to the second UART command within X ms the MCU forces the system to reset

Figure 7-8 Timing Sequence of Power Drop Protection

BAT_IN +4V

RST_N from Reset IC

Power

SYS_PWR

IS20xxS

Reset OUT VDDGND

MCU Reset

Reset IC

29V

1 It is recommended that the battery be connected on a BAT_IN pin of the SoC for the power supply2 If an external power source or a power adapter is used to provide the power to the SoC (ADAP_IN) use a

voltage supervisor IC3 The RESET IC output pin must be open drain with delay time of le 10 ms and the recommended part is

TCM809SVNB713

74 General Purpose IO pinsThe following table provides the details of various functions that are mapped to the IO pins of the IS20xxS SoCand these IOs are configured by using the IS20XXS_UI tool The first button (Button 0) must be configured as thepower-onoff key and can be set using the PWR pin The remaining pins are configured for any one of the defaultfunctions (short press long press double press and combinations)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 28

Table 7-1 IO Pin Configuration

Sl No Pin Name Buttons Default Functions(1)

1 PowerMFB Button 0 PWR

2 P0_2 Button 1 PlayPause

3 P2_7 Button 2 Volume Up

4 P0_5 Button 3 Volume Down

5 P0_1 Button 4 FWD

6 P0_3 Button 5 REV

Note 1 These functions can be configured using the IS20XXS_UI tool

Few signals are generated to indicate or control outside devices The most popular applications are NFC for easypairing external audio amplifier for louder speaker and buzzer for indication

Table 7-2 IO Pins for Added Functions

Functions(1) IO Configurable Features

Slide switch P0_0P1_5

Buzzer P0_3

NFC detect P0_4P1_5

External amplifier enable P1_5

Note 1 These functions can be configured using the IS20XXS_UI tool

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 29

8 Antenna Placement RuleFor Bluetooth-enabled products the antenna placement affects the overall performance The antenna requires freespace to radiate RF signals and it must not be surrounded by the GND plane

The following figure illustrates a typical example of the good and poor antenna placement on the main applicationboard with the GND plane

Figure 8-1 Antenna Placement Examples

The following figure illustrates the keep-out area recommended for the PCB antenna

Figure 8-2 Keep-Out Area Recommended for PCB Antenna

Note  For additional information on the antenna placement refer to the antenna-specific data sheet from theantenna manufacturer

IS2008SIS2010SIS2013SIS2015SAntenna Placement Rule

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 30

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

7 Application InformationThis section describes the power supply connection host MCU UART interface and various modes in detail

71 Power SupplyThe following figure illustrates the connection from the BAT_IN pin to various other voltage supply pins of theIS20xxS SoC

The BAT_IN input pin powers the IS20xxS SoC To charge the battery connect the external 5V power adapter toADAP_IN

Figure 7-1 Power Tree Diagram

VDDA VDDAO

VDD_IO

3V LDO

18V Buck

SAR_VDD

LDO31_VIN

CODEC_VO

LDO31_VO

BK_VDD

BK_LX

BK_O

VDD_CORE

VCC_RF

12V LDOPMIC_IN

CLDO_O

RFLDO_O

PVDD_CDA

Li-Io

n BA

T BAT_IN

ADAP_IN

SYS_PWRPower Switch

5V Adapter

(42~30V)

(45~55V)(42~30V)

(30~27V)

(33 ~27V)

(18V)

(12V)

(128V)

72 Host MCU InterfaceAn external MCU controls the IS20xxS SoC using the UART command set The following figure illustrates the UARTinterface between the IS20xxS SoC and an external MCU

Figure 7-2 Host MCU Interface Over UART

IS20xxSHCI_TXD

HCI_RXD

PWR

P0_0

MCUUART_TX

UART_RX

MCU_WAKEUP

BT_WAKEUP

UART Interface

UART Interface

The MCU controls the IS20xxS SoC over the UART interface and wakes up the SoC using the PWR pin The MCUfunction wakes up by connecting to the P0_0 pin of the IS20xxS

Refer to the IS200xIS201xIS202x UART Command SOP document for a list of functions that the IS20xxS SoCsupports and how to use the IS20XXS_UI tool to set up the system using the UART command

Note  The IS200xIS201xIS202x UART Command SOP document is available for download from the Microchipwebsite at IS200xIS201xIS202x UART Command SOP

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 24

73 Timing Sequence of UART ApplicationThe following figures illustrate the various UART control signal timing sequences

Figure 7-3 Power-OnOff Sequence

BAT_IN

SYS_PWR

1 ms

Power- oninitial idle Power-on Power-on Power-off idle

MCU state

MFB (PWR)

BK_OLDO31_VO

400 ms

RST_N

MCU sends UART command (UART_RX)

UART Command

MCU sends power-off UART Command

Power-on ACK ACK ACKIS20xxS response UART state

(UART_TX)

Set ldquoPower-on Directlyrdquo boot

any

10 ms

20 msKeep all IS20xxSand MCU connection to low level

2s

(See Figure 7-4) (See Figure 7-5)

IS20xxS disconnect and auto power-off

gt 1s

Figure 7-4 Timing Sequence of RX Indication after Power-On

Resume 32 kHz mode

MFB (PWR)MCU sends UART command

MFB pulse must be longer than the UART command slot time

150 ms

2 ms 2 ms

Enter 32 kHz mode

1 ms

UART Command

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 25

Figure 7-5 Timing Sequence of Power-Off

BAT_IN +4V

MFB

MCU Sends RST_N

BK_OUT

LDO31_VO

UART Bus

2s 1s

IS20xxS Sends Power-off ACK

Notes 1 EEPROM clock = 100 kHz2 For a byte wire 001 ms x 32 clock x 2 = 640 μs3 It is recommended that ramp-down time be more than 640 μs during the power-off sequence to ensure safe

operation of the device

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 26

Figu

re 7

-6 

Tim

ing

Sequ

ence

of P

ower

-On

(NA

CK

)

BAT

_IN

SYS_

PWR

1 m

s Pow

er-

onin

itial

idle

Pow

er-o

nM

CU

sta

te

MFB

(PW

R)

BK_O

LD

O31

_VO

400

ms

RST

_N

MC

U s

ends

UAR

T co

mm

and

(UAR

T_R

X)

UAR

T C

omm

and

NAC

KPo

wer

-on

ACK

ACK

IS20

xxS

resp

onse

UAR

T st

ate

(UAR

T_TX

)

Set ldquo

Pow

er-o

n D

irect

lyrdquo b

oot

10 m

s

20 m

s

Ret

ry i

f AC

K is

not

rece

ived

200

ms

any

Wai

t

Max

imum

5 ti

mes

(1s)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 27

Figure 7-7 Reset Timing Sequence in Case of No Response from SoC to Host MCU

MFB (PWR)

MCU sends UART command UART

Command

UART Command

IS20xxS UART

If no response

RST_N

1ms

X ms1ms

1ms

1ms

Note  The MCU sends the UART command again when the SoC is not responding to its first UART command Ifthe SoC is not responding to the second UART command within X ms the MCU forces the system to reset

Figure 7-8 Timing Sequence of Power Drop Protection

BAT_IN +4V

RST_N from Reset IC

Power

SYS_PWR

IS20xxS

Reset OUT VDDGND

MCU Reset

Reset IC

29V

1 It is recommended that the battery be connected on a BAT_IN pin of the SoC for the power supply2 If an external power source or a power adapter is used to provide the power to the SoC (ADAP_IN) use a

voltage supervisor IC3 The RESET IC output pin must be open drain with delay time of le 10 ms and the recommended part is

TCM809SVNB713

74 General Purpose IO pinsThe following table provides the details of various functions that are mapped to the IO pins of the IS20xxS SoCand these IOs are configured by using the IS20XXS_UI tool The first button (Button 0) must be configured as thepower-onoff key and can be set using the PWR pin The remaining pins are configured for any one of the defaultfunctions (short press long press double press and combinations)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 28

Table 7-1 IO Pin Configuration

Sl No Pin Name Buttons Default Functions(1)

1 PowerMFB Button 0 PWR

2 P0_2 Button 1 PlayPause

3 P2_7 Button 2 Volume Up

4 P0_5 Button 3 Volume Down

5 P0_1 Button 4 FWD

6 P0_3 Button 5 REV

Note 1 These functions can be configured using the IS20XXS_UI tool

Few signals are generated to indicate or control outside devices The most popular applications are NFC for easypairing external audio amplifier for louder speaker and buzzer for indication

Table 7-2 IO Pins for Added Functions

Functions(1) IO Configurable Features

Slide switch P0_0P1_5

Buzzer P0_3

NFC detect P0_4P1_5

External amplifier enable P1_5

Note 1 These functions can be configured using the IS20XXS_UI tool

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 29

8 Antenna Placement RuleFor Bluetooth-enabled products the antenna placement affects the overall performance The antenna requires freespace to radiate RF signals and it must not be surrounded by the GND plane

The following figure illustrates a typical example of the good and poor antenna placement on the main applicationboard with the GND plane

Figure 8-1 Antenna Placement Examples

The following figure illustrates the keep-out area recommended for the PCB antenna

Figure 8-2 Keep-Out Area Recommended for PCB Antenna

Note  For additional information on the antenna placement refer to the antenna-specific data sheet from theantenna manufacturer

IS2008SIS2010SIS2013SIS2015SAntenna Placement Rule

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 30

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

73 Timing Sequence of UART ApplicationThe following figures illustrate the various UART control signal timing sequences

Figure 7-3 Power-OnOff Sequence

BAT_IN

SYS_PWR

1 ms

Power- oninitial idle Power-on Power-on Power-off idle

MCU state

MFB (PWR)

BK_OLDO31_VO

400 ms

RST_N

MCU sends UART command (UART_RX)

UART Command

MCU sends power-off UART Command

Power-on ACK ACK ACKIS20xxS response UART state

(UART_TX)

Set ldquoPower-on Directlyrdquo boot

any

10 ms

20 msKeep all IS20xxSand MCU connection to low level

2s

(See Figure 7-4) (See Figure 7-5)

IS20xxS disconnect and auto power-off

gt 1s

Figure 7-4 Timing Sequence of RX Indication after Power-On

Resume 32 kHz mode

MFB (PWR)MCU sends UART command

MFB pulse must be longer than the UART command slot time

150 ms

2 ms 2 ms

Enter 32 kHz mode

1 ms

UART Command

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 25

Figure 7-5 Timing Sequence of Power-Off

BAT_IN +4V

MFB

MCU Sends RST_N

BK_OUT

LDO31_VO

UART Bus

2s 1s

IS20xxS Sends Power-off ACK

Notes 1 EEPROM clock = 100 kHz2 For a byte wire 001 ms x 32 clock x 2 = 640 μs3 It is recommended that ramp-down time be more than 640 μs during the power-off sequence to ensure safe

operation of the device

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 26

Figu

re 7

-6 

Tim

ing

Sequ

ence

of P

ower

-On

(NA

CK

)

BAT

_IN

SYS_

PWR

1 m

s Pow

er-

onin

itial

idle

Pow

er-o

nM

CU

sta

te

MFB

(PW

R)

BK_O

LD

O31

_VO

400

ms

RST

_N

MC

U s

ends

UAR

T co

mm

and

(UAR

T_R

X)

UAR

T C

omm

and

NAC

KPo

wer

-on

ACK

ACK

IS20

xxS

resp

onse

UAR

T st

ate

(UAR

T_TX

)

Set ldquo

Pow

er-o

n D

irect

lyrdquo b

oot

10 m

s

20 m

s

Ret

ry i

f AC

K is

not

rece

ived

200

ms

any

Wai

t

Max

imum

5 ti

mes

(1s)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 27

Figure 7-7 Reset Timing Sequence in Case of No Response from SoC to Host MCU

MFB (PWR)

MCU sends UART command UART

Command

UART Command

IS20xxS UART

If no response

RST_N

1ms

X ms1ms

1ms

1ms

Note  The MCU sends the UART command again when the SoC is not responding to its first UART command Ifthe SoC is not responding to the second UART command within X ms the MCU forces the system to reset

Figure 7-8 Timing Sequence of Power Drop Protection

BAT_IN +4V

RST_N from Reset IC

Power

SYS_PWR

IS20xxS

Reset OUT VDDGND

MCU Reset

Reset IC

29V

1 It is recommended that the battery be connected on a BAT_IN pin of the SoC for the power supply2 If an external power source or a power adapter is used to provide the power to the SoC (ADAP_IN) use a

voltage supervisor IC3 The RESET IC output pin must be open drain with delay time of le 10 ms and the recommended part is

TCM809SVNB713

74 General Purpose IO pinsThe following table provides the details of various functions that are mapped to the IO pins of the IS20xxS SoCand these IOs are configured by using the IS20XXS_UI tool The first button (Button 0) must be configured as thepower-onoff key and can be set using the PWR pin The remaining pins are configured for any one of the defaultfunctions (short press long press double press and combinations)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 28

Table 7-1 IO Pin Configuration

Sl No Pin Name Buttons Default Functions(1)

1 PowerMFB Button 0 PWR

2 P0_2 Button 1 PlayPause

3 P2_7 Button 2 Volume Up

4 P0_5 Button 3 Volume Down

5 P0_1 Button 4 FWD

6 P0_3 Button 5 REV

Note 1 These functions can be configured using the IS20XXS_UI tool

Few signals are generated to indicate or control outside devices The most popular applications are NFC for easypairing external audio amplifier for louder speaker and buzzer for indication

Table 7-2 IO Pins for Added Functions

Functions(1) IO Configurable Features

Slide switch P0_0P1_5

Buzzer P0_3

NFC detect P0_4P1_5

External amplifier enable P1_5

Note 1 These functions can be configured using the IS20XXS_UI tool

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 29

8 Antenna Placement RuleFor Bluetooth-enabled products the antenna placement affects the overall performance The antenna requires freespace to radiate RF signals and it must not be surrounded by the GND plane

The following figure illustrates a typical example of the good and poor antenna placement on the main applicationboard with the GND plane

Figure 8-1 Antenna Placement Examples

The following figure illustrates the keep-out area recommended for the PCB antenna

Figure 8-2 Keep-Out Area Recommended for PCB Antenna

Note  For additional information on the antenna placement refer to the antenna-specific data sheet from theantenna manufacturer

IS2008SIS2010SIS2013SIS2015SAntenna Placement Rule

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 30

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Figure 7-5 Timing Sequence of Power-Off

BAT_IN +4V

MFB

MCU Sends RST_N

BK_OUT

LDO31_VO

UART Bus

2s 1s

IS20xxS Sends Power-off ACK

Notes 1 EEPROM clock = 100 kHz2 For a byte wire 001 ms x 32 clock x 2 = 640 μs3 It is recommended that ramp-down time be more than 640 μs during the power-off sequence to ensure safe

operation of the device

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 26

Figu

re 7

-6 

Tim

ing

Sequ

ence

of P

ower

-On

(NA

CK

)

BAT

_IN

SYS_

PWR

1 m

s Pow

er-

onin

itial

idle

Pow

er-o

nM

CU

sta

te

MFB

(PW

R)

BK_O

LD

O31

_VO

400

ms

RST

_N

MC

U s

ends

UAR

T co

mm

and

(UAR

T_R

X)

UAR

T C

omm

and

NAC

KPo

wer

-on

ACK

ACK

IS20

xxS

resp

onse

UAR

T st

ate

(UAR

T_TX

)

Set ldquo

Pow

er-o

n D

irect

lyrdquo b

oot

10 m

s

20 m

s

Ret

ry i

f AC

K is

not

rece

ived

200

ms

any

Wai

t

Max

imum

5 ti

mes

(1s)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 27

Figure 7-7 Reset Timing Sequence in Case of No Response from SoC to Host MCU

MFB (PWR)

MCU sends UART command UART

Command

UART Command

IS20xxS UART

If no response

RST_N

1ms

X ms1ms

1ms

1ms

Note  The MCU sends the UART command again when the SoC is not responding to its first UART command Ifthe SoC is not responding to the second UART command within X ms the MCU forces the system to reset

Figure 7-8 Timing Sequence of Power Drop Protection

BAT_IN +4V

RST_N from Reset IC

Power

SYS_PWR

IS20xxS

Reset OUT VDDGND

MCU Reset

Reset IC

29V

1 It is recommended that the battery be connected on a BAT_IN pin of the SoC for the power supply2 If an external power source or a power adapter is used to provide the power to the SoC (ADAP_IN) use a

voltage supervisor IC3 The RESET IC output pin must be open drain with delay time of le 10 ms and the recommended part is

TCM809SVNB713

74 General Purpose IO pinsThe following table provides the details of various functions that are mapped to the IO pins of the IS20xxS SoCand these IOs are configured by using the IS20XXS_UI tool The first button (Button 0) must be configured as thepower-onoff key and can be set using the PWR pin The remaining pins are configured for any one of the defaultfunctions (short press long press double press and combinations)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 28

Table 7-1 IO Pin Configuration

Sl No Pin Name Buttons Default Functions(1)

1 PowerMFB Button 0 PWR

2 P0_2 Button 1 PlayPause

3 P2_7 Button 2 Volume Up

4 P0_5 Button 3 Volume Down

5 P0_1 Button 4 FWD

6 P0_3 Button 5 REV

Note 1 These functions can be configured using the IS20XXS_UI tool

Few signals are generated to indicate or control outside devices The most popular applications are NFC for easypairing external audio amplifier for louder speaker and buzzer for indication

Table 7-2 IO Pins for Added Functions

Functions(1) IO Configurable Features

Slide switch P0_0P1_5

Buzzer P0_3

NFC detect P0_4P1_5

External amplifier enable P1_5

Note 1 These functions can be configured using the IS20XXS_UI tool

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 29

8 Antenna Placement RuleFor Bluetooth-enabled products the antenna placement affects the overall performance The antenna requires freespace to radiate RF signals and it must not be surrounded by the GND plane

The following figure illustrates a typical example of the good and poor antenna placement on the main applicationboard with the GND plane

Figure 8-1 Antenna Placement Examples

The following figure illustrates the keep-out area recommended for the PCB antenna

Figure 8-2 Keep-Out Area Recommended for PCB Antenna

Note  For additional information on the antenna placement refer to the antenna-specific data sheet from theantenna manufacturer

IS2008SIS2010SIS2013SIS2015SAntenna Placement Rule

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 30

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Figu

re 7

-6 

Tim

ing

Sequ

ence

of P

ower

-On

(NA

CK

)

BAT

_IN

SYS_

PWR

1 m

s Pow

er-

onin

itial

idle

Pow

er-o

nM

CU

sta

te

MFB

(PW

R)

BK_O

LD

O31

_VO

400

ms

RST

_N

MC

U s

ends

UAR

T co

mm

and

(UAR

T_R

X)

UAR

T C

omm

and

NAC

KPo

wer

-on

ACK

ACK

IS20

xxS

resp

onse

UAR

T st

ate

(UAR

T_TX

)

Set ldquo

Pow

er-o

n D

irect

lyrdquo b

oot

10 m

s

20 m

s

Ret

ry i

f AC

K is

not

rece

ived

200

ms

any

Wai

t

Max

imum

5 ti

mes

(1s)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 27

Figure 7-7 Reset Timing Sequence in Case of No Response from SoC to Host MCU

MFB (PWR)

MCU sends UART command UART

Command

UART Command

IS20xxS UART

If no response

RST_N

1ms

X ms1ms

1ms

1ms

Note  The MCU sends the UART command again when the SoC is not responding to its first UART command Ifthe SoC is not responding to the second UART command within X ms the MCU forces the system to reset

Figure 7-8 Timing Sequence of Power Drop Protection

BAT_IN +4V

RST_N from Reset IC

Power

SYS_PWR

IS20xxS

Reset OUT VDDGND

MCU Reset

Reset IC

29V

1 It is recommended that the battery be connected on a BAT_IN pin of the SoC for the power supply2 If an external power source or a power adapter is used to provide the power to the SoC (ADAP_IN) use a

voltage supervisor IC3 The RESET IC output pin must be open drain with delay time of le 10 ms and the recommended part is

TCM809SVNB713

74 General Purpose IO pinsThe following table provides the details of various functions that are mapped to the IO pins of the IS20xxS SoCand these IOs are configured by using the IS20XXS_UI tool The first button (Button 0) must be configured as thepower-onoff key and can be set using the PWR pin The remaining pins are configured for any one of the defaultfunctions (short press long press double press and combinations)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 28

Table 7-1 IO Pin Configuration

Sl No Pin Name Buttons Default Functions(1)

1 PowerMFB Button 0 PWR

2 P0_2 Button 1 PlayPause

3 P2_7 Button 2 Volume Up

4 P0_5 Button 3 Volume Down

5 P0_1 Button 4 FWD

6 P0_3 Button 5 REV

Note 1 These functions can be configured using the IS20XXS_UI tool

Few signals are generated to indicate or control outside devices The most popular applications are NFC for easypairing external audio amplifier for louder speaker and buzzer for indication

Table 7-2 IO Pins for Added Functions

Functions(1) IO Configurable Features

Slide switch P0_0P1_5

Buzzer P0_3

NFC detect P0_4P1_5

External amplifier enable P1_5

Note 1 These functions can be configured using the IS20XXS_UI tool

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 29

8 Antenna Placement RuleFor Bluetooth-enabled products the antenna placement affects the overall performance The antenna requires freespace to radiate RF signals and it must not be surrounded by the GND plane

The following figure illustrates a typical example of the good and poor antenna placement on the main applicationboard with the GND plane

Figure 8-1 Antenna Placement Examples

The following figure illustrates the keep-out area recommended for the PCB antenna

Figure 8-2 Keep-Out Area Recommended for PCB Antenna

Note  For additional information on the antenna placement refer to the antenna-specific data sheet from theantenna manufacturer

IS2008SIS2010SIS2013SIS2015SAntenna Placement Rule

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 30

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

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Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

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Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

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Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

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Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Figure 7-7 Reset Timing Sequence in Case of No Response from SoC to Host MCU

MFB (PWR)

MCU sends UART command UART

Command

UART Command

IS20xxS UART

If no response

RST_N

1ms

X ms1ms

1ms

1ms

Note  The MCU sends the UART command again when the SoC is not responding to its first UART command Ifthe SoC is not responding to the second UART command within X ms the MCU forces the system to reset

Figure 7-8 Timing Sequence of Power Drop Protection

BAT_IN +4V

RST_N from Reset IC

Power

SYS_PWR

IS20xxS

Reset OUT VDDGND

MCU Reset

Reset IC

29V

1 It is recommended that the battery be connected on a BAT_IN pin of the SoC for the power supply2 If an external power source or a power adapter is used to provide the power to the SoC (ADAP_IN) use a

voltage supervisor IC3 The RESET IC output pin must be open drain with delay time of le 10 ms and the recommended part is

TCM809SVNB713

74 General Purpose IO pinsThe following table provides the details of various functions that are mapped to the IO pins of the IS20xxS SoCand these IOs are configured by using the IS20XXS_UI tool The first button (Button 0) must be configured as thepower-onoff key and can be set using the PWR pin The remaining pins are configured for any one of the defaultfunctions (short press long press double press and combinations)

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 28

Table 7-1 IO Pin Configuration

Sl No Pin Name Buttons Default Functions(1)

1 PowerMFB Button 0 PWR

2 P0_2 Button 1 PlayPause

3 P2_7 Button 2 Volume Up

4 P0_5 Button 3 Volume Down

5 P0_1 Button 4 FWD

6 P0_3 Button 5 REV

Note 1 These functions can be configured using the IS20XXS_UI tool

Few signals are generated to indicate or control outside devices The most popular applications are NFC for easypairing external audio amplifier for louder speaker and buzzer for indication

Table 7-2 IO Pins for Added Functions

Functions(1) IO Configurable Features

Slide switch P0_0P1_5

Buzzer P0_3

NFC detect P0_4P1_5

External amplifier enable P1_5

Note 1 These functions can be configured using the IS20XXS_UI tool

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 29

8 Antenna Placement RuleFor Bluetooth-enabled products the antenna placement affects the overall performance The antenna requires freespace to radiate RF signals and it must not be surrounded by the GND plane

The following figure illustrates a typical example of the good and poor antenna placement on the main applicationboard with the GND plane

Figure 8-1 Antenna Placement Examples

The following figure illustrates the keep-out area recommended for the PCB antenna

Figure 8-2 Keep-Out Area Recommended for PCB Antenna

Note  For additional information on the antenna placement refer to the antenna-specific data sheet from theantenna manufacturer

IS2008SIS2010SIS2013SIS2015SAntenna Placement Rule

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 30

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

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Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

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The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

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All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

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Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Table 7-1 IO Pin Configuration

Sl No Pin Name Buttons Default Functions(1)

1 PowerMFB Button 0 PWR

2 P0_2 Button 1 PlayPause

3 P2_7 Button 2 Volume Up

4 P0_5 Button 3 Volume Down

5 P0_1 Button 4 FWD

6 P0_3 Button 5 REV

Note 1 These functions can be configured using the IS20XXS_UI tool

Few signals are generated to indicate or control outside devices The most popular applications are NFC for easypairing external audio amplifier for louder speaker and buzzer for indication

Table 7-2 IO Pins for Added Functions

Functions(1) IO Configurable Features

Slide switch P0_0P1_5

Buzzer P0_3

NFC detect P0_4P1_5

External amplifier enable P1_5

Note 1 These functions can be configured using the IS20XXS_UI tool

IS2008SIS2010SIS2013SIS2015SApplication Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 29

8 Antenna Placement RuleFor Bluetooth-enabled products the antenna placement affects the overall performance The antenna requires freespace to radiate RF signals and it must not be surrounded by the GND plane

The following figure illustrates a typical example of the good and poor antenna placement on the main applicationboard with the GND plane

Figure 8-1 Antenna Placement Examples

The following figure illustrates the keep-out area recommended for the PCB antenna

Figure 8-2 Keep-Out Area Recommended for PCB Antenna

Note  For additional information on the antenna placement refer to the antenna-specific data sheet from theantenna manufacturer

IS2008SIS2010SIS2013SIS2015SAntenna Placement Rule

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 30

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

8 Antenna Placement RuleFor Bluetooth-enabled products the antenna placement affects the overall performance The antenna requires freespace to radiate RF signals and it must not be surrounded by the GND plane

The following figure illustrates a typical example of the good and poor antenna placement on the main applicationboard with the GND plane

Figure 8-1 Antenna Placement Examples

The following figure illustrates the keep-out area recommended for the PCB antenna

Figure 8-2 Keep-Out Area Recommended for PCB Antenna

Note  For additional information on the antenna placement refer to the antenna-specific data sheet from theantenna manufacturer

IS2008SIS2010SIS2013SIS2015SAntenna Placement Rule

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 30

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

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India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

9 Electrical CharacteristicsThis section provides an overview of the IS20xxS SoC electrical characteristics

Table 9-1 Absolute Maximum Ratings

Parameter Symbol Minimum Maximum Unit

Digital core supply voltage VDD_CORE 0 135 V

RF supply voltage VCC_RF 0 135 V

SAR ADC supply voltage SAR_VDD 0 21 V

Codec supply voltage VDDAVDDAO 0 33 V

IO supply voltage VDD_IO 0 36 V

Buck supply voltage BK_VDD 0 43 V

Supply voltage LDO31_VIN 0 43 V

Battery input voltage BAT_IN 0 43 V

Adapter input voltage ADAP_IN 0 70 V

Storage temperature TSTORE -65 +150

Operation temperature TOPERATION -20 +70

Note  Stresses listed on the preceding table cause permanent damage to the device This is a stress rating onlyThe functional operation of the device at those or any other conditions and those indicated in the operation listingsof this specification are not implied Exposure to maximum rating conditions for extended periods affects devicereliability

The following tables provide the recommended operating conditions and the electrical specifications of the IS20xxSSoC

Table 9-2 Recommended Operating Condition

Parameter Symbol Minimum Typical Maximum Unit

Digital core supply voltage VDD_CORE 114 12 126 V

RF supply voltage VCC_RF 122 128 134 V

SAR ADC supply voltage SAR_VDD 162 18 198 V

Codec supply voltage VDDAVDDAO 27 28 30 V

IO supply voltage VDD_IO 27 30 33 V

Buck supply voltage BK_VDD 3 37 425 V

Supply voltage LDO31_VIN 3 37 425 V

Battery input voltage BAT_IN 3 37 425 V

Adapter input voltage ADAP_IN 45 5 55 V

Operation temperature TOPERATION -20 +25 +70

Note  All these supply voltages are programmed through the EEPROM parameters

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 31

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Table 9-3 Buck Switching Regulator

Parameter Minimum Typical Maximum Unit

Input voltage 30 37 425 V

Output voltage (Iload = 70 mA andVin = 4V) 17 18 205 V

Output voltage accuracy mdash plusmn5 mdash

Output voltage adjustable step mdash 50 mdash mVStep

Output adjustment range -01 mdash +025 V

Average load current (ILOAD) 120 mdash mdash mA

Conversion efficiency (BAT = 38Vand Iload = 50 mA) mdash 88(1) mdash

Quiescent current (PFM) mdash mdash 40 μA

Output current (peak) 200 mdash mdash mA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-4 Low-dropout Regulator

Parameter Minimum Typical Maximum Unit

Input Voltage 30 37 425 V

Output VoltageCODEC_VO mdash 28 mdash

VIO_VO mdash 28 mdash

Output Accuracy (VIN = 37V ILOAD = 100 mA and +27) mdash plusmn5 mdash

Output current (average) mdash mdash 100 mA

Drop-out voltage

(Iload = maximum output current)mdash mdash 300 mV

Quiescent current (excluding load and Iload lt 1 mA) mdash 45 mdash μA

Shutdown current mdash mdash lt1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-5 Battery Charger

Parameter Minimum Typical Maximum Unit

Input voltage (ADAP_IN) 45 50 55 V

Supply current to charger only mdash 3 45 mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 32

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

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Worldwide Sales and Service

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Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

continuedParameter Minimum Typical Maximum Unit

Maximum batteryfast chargecurrent (ENX2 =0)

Headroom gt 07V (ADAP_IN = 5V) 170 200 240 mA

Headroom = 03V (ADAP_IN = 45V) 160 180 240 mA

Maximum batteryfast chargecurrent (ENX2 =1)

Headroom gt 07V (ADAP_IN = 5V) 300 350 420 mA

Headroom = 03V (ADAP_IN = 45V) 180 220 270 mA

Trickle charge voltage threshold mdash 3 mdash V

Battery charge termination current ( of fast charge current) mdash 10 mdash

Notes 1 Headroom = VADAP_IN ndash VBAT2 ENX2 is not allowed to be enabled when VADAP_IN ndash VBAT gt 2V3 These parameters are characterized but not tested in manufacturing

Table 9-6 LED Diver

Parameter Minimum Typical Maximum Unit

Open-drain voltage mdash mdash 36 V

Programmable current range 0 mdash 525 mA

Intensity control mdash 16 mdash step

Current step mdash 035 mdash mA

Power-down open-draincurrent mdash mdash 1 μA

Shutdown current mdash mdash 1 μA

Notes 1 Test condition SAR_VDD = 18V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-7 Audio Codec Digital-to-Analog Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Over-sampling rate mdash 128 mdash fs

Resolution 16 mdash 20 Bits

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at capless mode) for 48 kHz mdash 96 mdash dB

Signal-to-noise Ratio (2)

(SNR at single-ended mode) for 48 kHzmdash 98 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

Analog gain -28 mdash 3 dB

Analog gain resolution mdash 1 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 33

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

continuedParameter (Condition)(1) Minimum Typical Maximum Unit

Output voltage full-scale swing (AVDD = 28V) 495 7425 mdash mV rms

Maximum output power (16Ω load) mdash 345 mdash mW

Maximum output power (32Ω load) mdash 172 mdash mW

Allowed loadResistive 8 16 OC Ω

Capacitive mdash mdash 500 pF

THD+N (16Ω load) mdash mdash 005

Signal-to-noise Ratio (SNR at 16Ω load) mdash mdash mdash 96 dB

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted THD + N lt 001 0 dBFS signal and Load = 100 kΩ3 These parameters are characterized but not tested in manufacturing

Table 9-8 Audio Codec Analog-to-Digital Converter

Parameter (Condition)(1) Minimum Typical Maximum Unit

Resolution mdash mdash 16 Bit

Output sample rate 8 mdash 48 kHz

Signal-to-noise Ratio (2) (SNR at MIC or Line-in mode) mdash 90 mdash dB

Digital gain -54 mdash 485 dB

Digital gain resolution mdash 2 to 6 mdash dB

MIC boost gain mdash 20 mdash dB

Analog gain mdash mdash 60 dB

Analog gain resolution mdash 20 mdash dB

Input full scale at maximum gain (differential) mdash 4 mdash mVrms

Input full scale at minimum gain (differential) mdash 800 mdash mVrms

3 dB bandwidth mdash 20 mdash kHz

Microphone mode (input impedance) mdash 24 mdash kΩ

THD+N (microphone input) at 30 mVrms input mdash 002 mdash

Notes 1 T = +25 VDD = 30V 1 kHz sine wave input and Bandwidth = 20 Hz ndash 20 kHz2 fin = 1 kHz Bandwidth = 20 Hz ndash 20 kHz A-weighted and THD + N lt 1 150 mVpp input3 These parameters are characterized but not tested in manufacturing

Table 9-9 Single-Channel ClassndashD Amplifier

Parameter (Condition) Minimum Typical Maximum Unit

Standalone SNR (A-weighting) mdash 100 mdash dB

Gain mdash 12 mdash dB

PSRR (217 Hz 200 mV on PVDD) mdash 70 mdash dB

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 34

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

continuedParameter (Condition) Minimum Typical Maximum Unit

Efficiency4Ω 80 mdash 85

8Ω 85 mdash 90

Supply voltage 30 37 45 V

Load mdash 40 mdash Ω

Quiescent current (1 channel) mdash 20 mdash mA

Sample frequency mdash 250 mdash kHz

Over current limits mdash 23 mdash A

Shutdown current mdash 10 mdash μA

Notes 1 Test condition PVDD_CDA = 42V and temperature = 252 These parameters are characterized but not tested in manufacturing

Table 9-10 Transmitter Section for BDR and EDR

Parameter Minimum Typical Maximum BluetoothSpecification Unit

Maximum RF transmit power mdash 30 40 -6 to 4 dBm

Relative transmit power -4 -12 1 -4 to 1 dB

Notes 1 The RF Transmit power is calibrated during production using the MP tool software and MT8852 Bluetooth test

equipment2 Test condition VCC_RF = 128V and temperature = +25

Table 9-11 Receiver Section for BDR and EDR

Parameter Packet Type Minimum Typical Maximum BluetoothSpecification Unit

Sensitivity at 01 BER GFSK mdash -90 mdash le-70 dBm

Sensitivity at 001 BERπ4 DQPSK mdash -91 mdash le-70 dBm

8 DPSK mdash -82 mdash le-70 dBm

Notes 1 Test condition VCC_RF = 128V and temperature = +252 These parameters are characterized but not tested in manufacturing

Table 9-12 System Current Consumption

System Status Typical Maximum Unit

System Off mode 2 5 μA

Standby mode 08 mdash mA

Link mode 04 mdash mA

SCO Link 78 mdash mA

A2DP Link (Vp-p = 200 mV 1k tone signal) 107 mdash mA

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 35

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Notes 1 Consider the current consumption values with the IS2010 EVB as a test platform2 Test condition BAT_IN = 38V link with the HTC EYE smartphone The distance between the smartphone and

EVB is 30 cm

IS2008SIS2010SIS2013SIS2015SElectrical Characteristics

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 36

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

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Worldwide Sales and Service

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Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

10 Packaging InformationThis section provides information on package marking package details and footprint dimensions of the IS20xxS SoC

101 Chip Identification SystemPart No X -Y

(Chip Name) (Package Type) (Version)

Legendbull Chip Name

ndash IS2008Sndash IS2010Sndash IS2013Sndash IS2015S

bull Package Typendash S = QFN (Saw Type) Package

bull Versionndash ldquo-203rdquo represents the chip version is 203

For examplebull IS2015S-002 002 version ROM code IS2015 chip in QFN type packagebull IS2010S-203 203 version ROM code IS2010 chip in QFN type package

102 Package Marking InformationThe following figure illustrates the package marking information of the IS20xxS

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 37

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

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Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

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Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Figure 10-1 Package Marking Information

Page 36

Page 36

48 Lead QFN (6x6x09 mm) 56 Lead QFN (7x7x09 mm)

Pin 1 Index

Pin 1 Index Pin 1 Index

Legend

XXX Chip serial number version and e3 Pb-free JEDEC designator for Matte Tin (Sn)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ldquo1rdquo)

NNN Alphanumeric traceability code

103 Package DetailsThe following figures illustrate the footprint dimensions and the chip outline details of the IS2008S and IS2010S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 38

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Figure 10-2 IS2008S and IS2010S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 39

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

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ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

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Datasheet DS70005472A-page 62

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Worldwide Sales and Service

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Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Figure 10-3 IS2008S and IS2010S Footprint Dimensions

PAD LENGTHPAD WIDTH

PAD PITCHPAD COUNT

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

The following figures illustrate the footprint dimensions and the chip outline details of the IS2013S and IS2015S SoC

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 40

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Figure 10-4 IS2013S and IS2015S Chip Outline Details

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 41

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Figure 10-5 IS2013S and IS2015S Footprint Dimensions

Note  For the most current package drawings refer to the Microchip Packaging Specification available at httpwwwmicrochipcompackaging

IS2008SIS2010SIS2013SIS2015SPackaging Information

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 42

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

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To register go to wwwmicrochipcompcn and follow the registration instructions

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Users of Microchip products can receive assistance through several channels

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Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

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The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

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Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

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Worldwide Sales and Service

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Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

11 Reflow Profile and Storage ConditionThis chapter describes reflow profiles and stencil information of the IS20xxS SoC

111 Stencil of SMT Assembly SuggestionThe stencil of the SMT assembly suggestion contains the following sections

1111 Stencil Type and Thicknessbull Laser cuttingbull Stainless steelbull Thickness 05 mm pitch thickness less than 015 mm

1112 Aperture Size and Shape for Terminal Padbull Aspect ratio (widththickness) is more than 15bull Aperture shape

ndash The stencil aperture is designed to match the pad size on the PCBndash Oval-shaped opening is used to get the optimum paste releasendash Rounded corners to minimize cloggingndash Positive taper walls (5deg tapering) with the bottom opening larger than the top opening

1113 Aperture Design for Thermal Padbull Small multiple openings are used instead of one big opening as shown in the following figure

Figure 11-1 IS20xxS SoC Reflow Profile Aperture Design

bull 60 to 80 solder paste coveragebull Rounded corners to minimize cloggingbull Positive taper walls (5deg tapering) with the bottom opening is larger than the top opening as shown in the

following figureFigure 11-2 IS20xxS SoC Stencil Type

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

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Datasheet DS70005472A-page 43

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

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Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

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Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

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Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

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Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

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Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

112 Reflow ProfileThe following figure illustrates the reflow profile and its specific features are

bull Standard Condition IPCJEDEC J-STD-020bull Preheat 150 to 200 for 60 to180 secondsbull Average ramp-up rate (217 to peak) 1 to 2sec maxbull Temperature maintained above 217 60 to 150 secondsbull Time within 5 of actual peak temperature 20 to 40 secondsbull Peak temperature 260 with +5-0 tolerancebull Ramp-down rate (peak to 217) 3sec maxbull Time within 25 to peak temperature 8 minutes maxbull Cycle interval 5 minutes

Figure 11-3 Reflow Profile

+150degC

+200degC

+217degC

+255degCRamp-up rate1~2degCsec max+217degC to peak

Peak +260degC (+50degC tolerance)

Ramp-down rate+3degCsec maxpeak to +217degC

20 to 40 sec

Time (sec)

60 to 180 sec 60 to 150 sec

113 Storage ConditionUsers must follow these specific storage conditions for the IS20xxS SoC

bull Calculated shelf life in the sealed bag 24 months at lt40 and lt90 Relative Humidity (RH)bull Once the bag is opened devices that are subjected to reflow solder or other high temperature process must be

mounted within 168 hours of factory conditions that is lt3060 RH

The following figure illustrates the IS20xxS SoC bag label details

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 44

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Figure 11-4 Storage Conditions

IS2008SIS2010SIS2013SIS2015SReflow Profile and Storage Condition

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 45

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

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Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

12 Reference CircuitThis section provides the reference schematics of IS2008S IS2010S IS2013S and IS2015SFigure 12-1 IS2008SIS2010S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

P0_3

VBGULPC_VSUS

MFB

VBG

ULPC_VSUS

LED1LED2

P0_1

ADAP

_IN

P1_5

P0_2

P0_5

P2_7

P2_0

MIC_P2MIC_N2

MIC_P1MIC_N1

P1_2P1_3RST_N

AOH

PLAO

HPM

HC

I_TX

DH

CI_

RXD

RFLDO_O1V8

1V2

1V8

CODEC_VO

2V8

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8

SYS_PWR

SYS_PWR

RFLDO_O

MIC_BIAS

2V8

1V2

ADAP_IN

MIC_N2MIC_P2MIC_N1MIC_P1

RST_N

HC

I_R

XDH

CI_

TXD

LED2LED1

AOH

PMAO

HPL

P0_1

P1_5

P0_3

P0_5

P2_7

P2_0

P0_2

MFB

C791u16V

ANT1

ANT-MP8

1

C321u16V

C291u16V

C7710u16V

C871u16V

X1X4P-16MHZ

4 13 2

C251u16V

C402p50V

C311u16V

C219p50V

C281u16V

R681K1

12

C261u16V

C191u16V

C361u16V

L10L10uH-2

C831u16V

C841u16V

IS2008SIS2010S

U6

IS2010S_MH+2MIC

MICN22

AO

HP

L47

VD

DA

48

VCOM1

MICN14

MICP15

MICBIAS6

VDD_CORE7

VDD_IO11 RST_N10

P128

P139

P05

43

HC

I_TX

D15

HC

I_R

XD

14

XO

_P37

XO_N36

ULPC_VSUS35

P27

42

VBG34

RFLDO_O33

PMIC_IN32

CLDO_O31

NC

21

SY

S_P

WR

23

P20

41

P15

13

P02

40

P0112

VD

D_I

O44

RTX

39

VC

C_R

F38

EP

49

VD

DA

O45

AO

HP

M46

MICP23

P0330

CO

DE

C_V

O16

LDO

31_V

IN17

LDO

31_V

O18

AD

AP

_IN

19

BA

T_IN

20

SA

R_V

DD

22

BK

_VD

D24

BK_LX25BK_O26PWR27

LED129

LED228

C801u16V

C8210u16V

TP9RF-TP1

C861u16V

L227nH

R691K

12

C8110u16V

C411u16V

C249p50V

C3NP-0402

C271u16V

C341u16V

L368p50V

C231u16V

C781u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 46

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

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Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Figure 12-2 IS2008SIS2010S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

C3801u16V

C391u16V

R18NP-0603

R174K7

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 47

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Figure 12-3 IS2008SIS2010S Audio Interface (Optional Circuit)

AOHPMS

AOHPL

MIC1

MIC2

MIC2+

MIC1+

MIC1-

MIC2-

AOHPM

AOHPL

MIC_P1

MIC_N1

MIC1+

MIC1-

MIC_P2

MIC_N2

MIC2+

MIC2-

MIC_BIAS

MIC_BIAS

MIC_P1

MIC_N1

MIC_P2

MIC_N2

AOHPM

AOHPL

C42220p50V

D14SPE0572

21

TP51

C4647u10V

C440047u25V

D16SPE0572

21

TP131

R91K

1 2

TP61

TP111

R112K

1 2

C11 10p50V

R61K

1 2

TP71

C15 10p50V

C350047u25V

C2047u10V

D12SPE0572

21

C37220p50V

TP81

C2247u10V

D13SPE0572

21

C1239p50V

C430047u25V

D10SPE0572

21

C1739p50V

R71K

1 2

R102K

1 2

R81K

1 2

C400047u25V

D11SPE0572

21

C4547u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 48

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Figure 12-4 IS2008SIS2010S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN P2_7

P0_2

P0_3

P0_5

P0_1

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7

C6415p50V

SW9SW-TACT

12

34SW4

SW-TACT

12

34

C6615p50V

C6515p50V

SW5

SW-TACT

12

34SW6

SW-TACT

12

34

C6815p50V

C6715p50V

SW8

SW-TACT

12

34SW7

SW-TACT

12

34

Figure 12-5 IS2008SIS2010S LED (Optional Circuit)

LED1

LED2 SYS_PWR

LED1

LED2LED2LED-HR12

LED1LED-B12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 49

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Figure 12-6 IS2008SIS2010S NFC (Optional Circuit)

P1_5

MFB

SYS_PWR

P1_5

D22CDSU400B1 2

R291201

1 2

R252701

1 2

R13NP-0805

Q7

STS2306

312

R301K1

12

G D

S

Q9STS2301

13

2

TP291

R231M

12

TP301

D21CDSU400B

1 2

D20

21

Figure 12-7 IS2008SIS2010S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

R282K

12

Q3

MMBT3904

321

C701u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 50

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Figure 12-8 IS2008SIS2010S Slide Switch (Optional Circuit)

P1_5MFB

SYS_PWR

2V8

Q8

STS2306

312

GD

SQ14STS2301

13

2 R5010K

12

R141K

12

C13610u16V

R129

100K

1 2

R52

100K1

2

ONSW10

SW-1BIT

1 2

Figure 12-9 IS2008SIS2010S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

BK_OUT

BAT-

ADAPGNDHCI_TXD

RESET

HCI_RXD

CODEC_VDD

BAT+P2_0

VDD_IO

RST_N

HCI_RXD

HCI_TXD

P2_0

1V2

RFLDO_O

ADAP_IN

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

RST_N

P2_0

TP281

TP251

TP261

TP151

TP271

TP171

TP161

TP191

TP211

TP351

TP221

TP201

TP241

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 51

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Figure 12-10 IS2013SIS2015S Reference Circuit (Main Circuit)

(Peak Current 400 mA)

(1uF X5R or 47uF Y5V)

(Peak current 1A )

(C88 should closeto IC)

AOHPLAOHPM

AIL

MFB

MIC_P1MIC_N1

VBG

ULPC_VSUS

P1_2P1_3RST_N

VBGULPC_VSUS

HC

I_TX

DH

CI_

RXD

P0_0P0_3

P2_4

P0_1

P0_4

LED1LED2

P0_2

P0_5

P2_7

P2_0

P3_0

P3_0

HPO

PH

PON

CODEC_VO

1V8

MIC_BIAS

2V8

ADAP_IN

RFLDO_O1V8

1V2

1V8SYS_PWR

BAT_IN

CODEC_VO

2V8SYS_PWR

SYS_PWR

2V8

RFLDO_O

1V2

CDA_PWR

PVDD_CDA_IN

AOHPLAOHPM

MIC_N1MIC_P1

AIL

RST_N

HC

I_R

XDH

CI_

TXD

P0_1

P0_4

P2_4

LED2LED1P0_0

MFB

P0_3

P2_7

P2_0

P0_2

P0_5

P3_0

HPO

PH

PON

C8210u16V

R681K1

12

C341u16V

IS2013SIS2015S

U6

AOHPL3

VDDA4

VCOM5

MICN16

MICP17

MICBIAS8

VDD_IO14 RST_N13

P1211

P1312

VDD_CORE10

P24

16

EP

57

VDDAO1

AOHPM2

PV

DD

_CD

A56

HP

OP

_CD

A55

HP

ON

_CD

A54

VB

P_C

DA

53

AV

DD

_CD

A52

XO_N42

ULPC_VSUS41

AIL9

VBG40

RFLDO_O39

PMIC_IN38

CLDO_O37

EAN36

P27

48

P04

17

LED133

LED232

PWR30

LDO18_O29

P0034

P20

47P

3049

P02

46

P01

15

VD

D_I

O51

RTX

45

VC

C_R

F44

XO

_P43

P05

50H

CI_

RX

D19

HC

I_TX

D20

P0335

P15

18

CO

DE

C_V

O21

LDO

31_V

IN22

LDO

31_V

O23

AD

AP

_IN

24

BA

T_IN

25

SA

R_V

DD

26

SY

S_P

WR

27

LDO

18_V

DD

28

NC31

C402p50V

C161u16V

TP9RF-TP1

C231u16V

C3NP-0402

C191u16V

C801u16V

ANT1

ANT-MP8

1

C411u16V

X1X4P-16MHZ

4 13 2

C311u16V

C871u16V

C841u16V

C810u16V

C361u16V

FB9GSMA201209

12

C791u16V

C831u16V

C281u16V

C271u16V

C181u16V

C291u16V

C781u16V

C261u16V

C7710u16V

R691K1

12

C861u16V

C8810u16V

C321u16V

C251u16V

C249p50V

L368p50V

C8110u16V

C219p50V

L227nH

+C117100u16V

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 52

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Figure 12-11 IS2013SIS2015S EEPROM (Main Circuit)

EEPROM

P1_2P1_3

2V8

R174K7

12

C3801u16V

U7ACE24C64

A01

A12

A23

GND4

SDA5SCL6WP7VCC8

R18NP-0603

C391u16V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 53

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Figure 12-12 IS2013SIS2015S Audio Interface (Optional Circuit)

LINEINPUT

AOHPMS

AOHPL

MIC1

MIC_P1

MIC_N1

AIRR

AILL AIL

AOHPM

AOHPL

MIC1+

MIC1+

MIC1-MIC1-

AIRR

AILL

MIC_BIAS

MIC_P1

MIC_N1

AIL

AOHPM

AOHPL

P3_0

D14SPE0572

21

D13SPE0572

21

C1739p50V

R7 1K1 2

TP131

C350047u25V

C15 10p50V

R61300

1 2

C1239p50V

C401u16V

C420047u25V

C11 10p50V

R6 1K1 2

TP111

R63NP-0603

D16SPE0572

21

TP61

D18SPE0572

21

R62NP-0603

C2247u10V

D19SPE0572

21

P3TSH-3865D

4

3

210

1

C37220p50V

C3001u16V

R60300

1 2

D10SPE0572

21

R102K

1 2

TP51

C2047u10V

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 54

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Figure 12-13 IS2013SIS2015S Audio Options (Optional Circuit)

FWD

VOL_UP

PLAYPAUSE

REV

VOL_DN

P0_2

P0_5 P2_7

P0_1P0_3

MFB

SYS_PWR

MFB

P0_2

P0_3 P0_1

P0_5 P2_7SW8

SW-TACT

12

34 C6815p50V

SW6

SW-TACT

12

34 C6615p50V

SW5

SW-TACT

12

34 C6515p50V

SW9SW-TACT

12

34C6415p50V

SW4

SW-TACT

12

34

SW7

SW-TACT

12

34 C6715p50V

Figure 12-14 IS2013SIS2015S CDA (Optional Circuit)

(Close to IC)

HPON_OHPOP_OHPOP_O

HPON_OHPOP

HPONTP32 1

FB6GSMA201209

12

D24SPE0572

21

TP31 1

D23SPE0572

21

C50220p50V

C43220p50V

FB5GSMA201209

12

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 55

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Figure 12-15 IS2013SIS2015S External Power Switch (Optional Circuit)

(Vo=(1+ R24R16)125)

Warning 45V max

OPTIONAL 45V Booster CircuitIf no boost add R26 0-ohm

Optional if ADAP_INgt5V

ADAP_IN

BAT_IN

5VCDA_PWR

CODEC_VO

2V8

U3SM4839N

S1

S2

S3

G4

D8

D7

D6

D5

+C60

100u16V

12

R91K1

12

L1L10uH-3

D11N5822

21

D21N4002

21

R1620

12 R11

20K

12

C331u16V

R22 NP-0603

R21 01 2

U2 RT9266E

CE1

EXT2

GND3

LX4

VDD5

FB6

R241M

1 2

C710u16V

U1APL1117-VC

ADJ

GND

1O

UT2

IN3C6

10u16V

R26NP-0805

R16390K

1 2

+C61

100u16V

12

C501u16V

R20NP-0603

G D

S

Q4STS2301

13

2

R21K81

12

Figure 12-16 IS2013SIS2015S LED (Optional Circuit)

LED2

LED1

SYS_PWR

LED1

LED2

LED1LED-B12

LED2LED-HR12

Figure 12-17 IS2013SIS2015S NFC (Optional Circuit)

P0_4

MFB

SYS_PWR

P0_4

D20

21

Q7

STS2306

312

G D

S

Q9STS2301

13

2R301K1

12

R252701

1 2

TP301

D21CDSU400B

1 2

D22CDSU400B1 2

R231M

12

R291201

1 2

R13NP-0805

TP291

Note  Only for NFC tag with rectifier circuit

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 56

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Figure 12-18 IS2013SIS2015S Reset (Optional Circuit)

RST_N

ADAP_IN

RST_N

C701u16V

Q3

MMBT3904

321

R282K

12

Figure 12-19 IS2013SIS2015S Slide Switch (Optional Circuit)

P0_0MFB

SYS_PWR

2V8

P0_0

R5010K

12

SW10

SW-1BIT

1 2

R141K

12

R129

100K

1 2GD

SQ14STS2301

13

2

C13610u16V

R52

100K

12

Q8

STS2306

312

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 57

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Figure 12-20 IS2013SIS2015S Test Point (Optional Circuit)

CORE_LDO

RF_LDO

GNDADAP

BAT-

LDO18_OUT

HCI_RXD

RESET

HCI_TXD

CODEC_VDD

P2_0 BAT+

VDD_IO

P2_4

RST_N

P2_0

P2_4

HCI_TXD

HCI_RXD

ADAP_IN

1V2

RFLDO_O

1V8

BAT_IN

CODEC_VO

2V8

HCI_TXD

HCI_RXD

P2_0

P2_4

TP201

TP271

TP211

TP221

TP241

TP151

TP191

TP251

TP231

TP261

TP171

TP351

TP281

TP161

IS2008SIS2010SIS2013SIS2015SReference Circuit

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 58

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

13 Document Revision HistoryRevision Date Section Description

A 062021 Documentbull Updated from ISSC to Microchip templatebull Assigned a new Microchip document numberbull ISBN number added

IS2008SIS2010SIS2013SIS2015SDocument Revision History

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 59

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

The Microchip Website

Microchip provides online support via our website at wwwmicrochipcom This website is used to make files andinformation easily available to customers Some of the content available includes

bull Product Support ndash Data sheets and errata application notes and sample programs design resources userrsquosguides and hardware support documents latest software releases and archived software

bull General Technical Support ndash Frequently Asked Questions (FAQs) technical support requests onlinediscussion groups Microchip design partner program member listing

bull Business of Microchip ndash Product selector and ordering guides latest Microchip press releases listing ofseminars and events listings of Microchip sales offices distributors and factory representatives

Product Change Notification Service

Microchiprsquos product change notification service helps keep customers current on Microchip products Subscribers willreceive email notification whenever there are changes updates revisions or errata related to a specified productfamily or development tool of interest

To register go to wwwmicrochipcompcn and follow the registration instructions

Customer Support

Users of Microchip products can receive assistance through several channels

bull Distributor or Representativebull Local Sales Officebull Embedded Solutions Engineer (ESE)bull Technical Support

Customers should contact their distributor representative or ESE for support Local sales offices are also available tohelp customers A listing of sales offices and locations is included in this document

Technical support is available through the website at wwwmicrochipcomsupport

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices

bull Microchip products meet the specifications contained in their particular Microchip Data Sheetbull Microchip believes that its family of products is secure when used in the intended manner and under normal

conditionsbull There are dishonest and possibly illegal methods being used in attempts to breach the code protection features

of the Microchip devices We believe that these methods require using the Microchip products in a manneroutside the operating specifications contained in Microchiprsquos Data Sheets Attempts to breach these codeprotection features most likely cannot be accomplished without violating Microchiprsquos intellectual property rights

bull Microchip is willing to work with any customer who is concerned about the integrity of its codebull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code Code

protection does not mean that we are guaranteeing the product is ldquounbreakablerdquo Code protection is constantlyevolving We at Microchip are committed to continuously improving the code protection features of our productsAttempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright ActIf such acts allow unauthorized access to your software or other copyrighted work you may have a right to suefor relief under that Act

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 60

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchipproducts Information regarding device applications and the like is provided only for your convenience and may besuperseded by updates It is your responsibility to ensure that your application meets with your specifications

THIS INFORMATION IS PROVIDED BY MICROCHIP ldquoAS ISrdquo MICROCHIP MAKES NO REPRESENTATIONSOR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED WRITTEN OR ORAL STATUTORYOR OTHERWISE RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF NON-INFRINGEMENT MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSEOR WARRANTIES RELATED TO ITS CONDITION QUALITY OR PERFORMANCE

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT SPECIAL PUNITIVE INCIDENTAL ORCONSEQUENTIAL LOSS DAMAGE COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THEINFORMATION OR ITS USE HOWEVER CAUSED EVEN IF MICROCHIP HAS BEEN ADVISED OF THEPOSSIBILITY OR THE DAMAGES ARE FORESEEABLE TO THE FULLEST EXTENT ALLOWED BY LAWMICROCHIPS TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USEWILL NOT EXCEED THE AMOUNT OF FEES IF ANY THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FORTHE INFORMATION Use of Microchip devices in life support andor safety applications is entirely at the buyerrsquos riskand the buyer agrees to defend indemnify and hold harmless Microchip from any and all damages claims suits orexpenses resulting from such use No licenses are conveyed implicitly or otherwise under any Microchip intellectualproperty rights unless otherwise stated

Trademarks

The Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTimeBitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBloxKeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logoMOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire ProchipDesigner QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServerTachyon TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip TechnologyIncorporated in the USA and other countries

AgileSwitch APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper SpeedControl HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASICProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictraTimeProvider WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA

Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut Augmented SwitchingBlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoControllerdsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN Espresso T1S EtherGREEN IdealBridgeIn-Circuit Serial Programming ICSP INICnet Intelligent Paralleling Inter-Chip Connectivity JitterBlocker maxCryptomaxView memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetachOmniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICERipple Blocker RTAX RTG4 SAM-ICE Serial Quad IO simpleMAP SimpliPHY SmartBuffer SMART-IS storCladSQI SuperSwitcher SuperSwitcher II Switchtec SynchroPHY Total Endurance TSHARC USBCheck VariSenseVectorBlox VeriPHY ViewSpan WiperLock XpressConnect and ZENA are trademarks of Microchip TechnologyIncorporated in the USA and other countries

SQTP is a service mark of Microchip Technology Incorporated in the USA

The Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks ofMicrochip Technology Inc in other countries

GestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of MicrochipTechnology Inc in other countries

All other trademarks mentioned herein are property of their respective companiescopy 2021 Microchip Technology Incorporated Printed in the USA All Rights Reserved

ISBN 978-1-5224-8375-5

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 61

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

Quality Management SystemFor information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality

IS2008SIS2010SIS2013SIS2015S

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 62

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service

AMERICAS ASIAPACIFIC ASIAPACIFIC EUROPECorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200Fax 480-792-7277Technical SupportwwwmicrochipcomsupportWeb AddresswwwmicrochipcomAtlantaDuluth GATel 678-957-9614Fax 678-957-1455Austin TXTel 512-257-3370BostonWestborough MATel 774-760-0087Fax 774-760-0088ChicagoItasca ILTel 630-285-0071Fax 630-285-0075DallasAddison TXTel 972-818-7423Fax 972-818-2924DetroitNovi MITel 248-848-4000Houston TXTel 281-894-5983IndianapolisNoblesville INTel 317-773-8323Fax 317-773-5453Tel 317-536-2380Los AngelesMission Viejo CATel 949-462-9523Fax 949-462-9608Tel 951-273-7800Raleigh NCTel 919-844-7510New York NYTel 631-435-6000San Jose CATel 408-735-9110Tel 408-436-4270Canada - TorontoTel 905-695-1980Fax 905-695-2078

Australia - SydneyTel 61-2-9868-6733China - BeijingTel 86-10-8569-7000China - ChengduTel 86-28-8665-5511China - ChongqingTel 86-23-8980-9588China - DongguanTel 86-769-8702-9880China - GuangzhouTel 86-20-8755-8029China - HangzhouTel 86-571-8792-8115China - Hong Kong SARTel 852-2943-5100China - NanjingTel 86-25-8473-2460China - QingdaoTel 86-532-8502-7355China - ShanghaiTel 86-21-3326-8000China - ShenyangTel 86-24-2334-2829China - ShenzhenTel 86-755-8864-2200China - SuzhouTel 86-186-6233-1526China - WuhanTel 86-27-5980-5300China - XianTel 86-29-8833-7252China - XiamenTel 86-592-2388138China - ZhuhaiTel 86-756-3210040

India - BangaloreTel 91-80-3090-4444India - New DelhiTel 91-11-4160-8631India - PuneTel 91-20-4121-0141Japan - OsakaTel 81-6-6152-7160Japan - TokyoTel 81-3-6880- 3770Korea - DaeguTel 82-53-744-4301Korea - SeoulTel 82-2-554-7200Malaysia - Kuala LumpurTel 60-3-7651-7906Malaysia - PenangTel 60-4-227-8870Philippines - ManilaTel 63-2-634-9065SingaporeTel 65-6334-8870Taiwan - Hsin ChuTel 886-3-577-8366Taiwan - KaohsiungTel 886-7-213-7830Taiwan - TaipeiTel 886-2-2508-8600Thailand - BangkokTel 66-2-694-1351Vietnam - Ho Chi MinhTel 84-28-5448-2100

Austria - WelsTel 43-7242-2244-39Fax 43-7242-2244-393Denmark - CopenhagenTel 45-4485-5910Fax 45-4485-2829Finland - EspooTel 358-9-4520-820France - ParisTel 33-1-69-53-63-20Fax 33-1-69-30-90-79Germany - GarchingTel 49-8931-9700Germany - HaanTel 49-2129-3766400Germany - HeilbronnTel 49-7131-72400Germany - KarlsruheTel 49-721-625370Germany - MunichTel 49-89-627-144-0Fax 49-89-627-144-44Germany - RosenheimTel 49-8031-354-560Israel - RarsquoananaTel 972-9-744-7705Italy - MilanTel 39-0331-742611Fax 39-0331-466781Italy - PadovaTel 39-049-7625286Netherlands - DrunenTel 31-416-690399Fax 31-416-690340Norway - TrondheimTel 47-72884388Poland - WarsawTel 48-22-3325737Romania - BucharestTel 40-21-407-87-50Spain - MadridTel 34-91-708-08-90Fax 34-91-708-08-91Sweden - GothenbergTel 46-31-704-60-40Sweden - StockholmTel 46-8-5090-4654UK - WokinghamTel 44-118-921-5800Fax 44-118-921-5820

Worldwide Sales and Service

copy 2021 Microchip Technology Incand its subsidiaries

Datasheet DS70005472A-page 63

  • Introduction
  • Features
  • Table of Contents
  • 1 Quick References
    • 11 Reference Documentation
    • 12 Acronyms and Abbreviation
      • 2 Device Overview
        • 21 Key Features
        • 22 Pin Details
          • 3 Audio
            • 31 Digital Signal Processor
            • 32 Codec
            • 33 Auxiliary Port
            • 34 Class D Audio Amplifier
              • 4 Transceiver
                • 41 Transmitter
                • 42 Receiver
                • 43 Synthesizer
                • 44 Modem
                • 45 Adaptive Frequency Hopping (AFH)
                  • 5 Microcontroller
                    • 51 Memory
                    • 52 External Reset
                    • 53 Reference Clock
                      • 6 Power Management Unit (PMU)
                        • 61 Charging a Battery
                        • 62 Voltage Monitoring
                        • 63 Low Dropout Regulator
                        • 64 Switching Regulator
                        • 65 LED Driver
                          • 7 Application Information
                            • 71 Power Supply
                            • 72 Host MCU Interface
                            • 73 Timing Sequence of UART Application
                            • 74 General Purpose IO pins
                              • 8 Antenna Placement Rule
                              • 9 Electrical Characteristics
                              • 10 Packaging Information
                                • 101 Chip Identification System
                                • 102 Package Marking Information
                                • 103 Package Details
                                  • 11 Reflow Profile and Storage Condition
                                    • 111 Stencil of SMT Assembly Suggestion
                                      • 1111 Stencil Type and Thickness
                                      • 1112 Aperture Size and Shape for Terminal Pad
                                      • 1113 Aperture Design for Thermal Pad
                                        • 112 Reflow Profile
                                        • 113 Storage Condition
                                          • 12 Reference Circuit
                                          • 13 Document Revision History
                                          • The Microchip Website
                                          • Product Change Notification Service
                                          • Customer Support
                                          • Microchip Devices Code Protection Feature
                                          • Legal Notice
                                          • Trademarks
                                          • Quality Management System
                                          • Worldwide Sales and Service