Munich, Germany — ASM AssemblySystems has been named the overallwinner in Produktion magazine’s an-

nual “Factory of the Year/Global Ex-cellence in Operations” contest. Spon-sored by Produktion and by consultan-

cy A.T. Kearney, the respected awardrecognizes the exceptional flexibility ofASM’s placement machine production.By consistently focusing on the valuechain with concepts like lean manu-facturing, lot size 1 and by developingan innovative factory floor layout, thecompany can accommodate order fluc-tuations of up to 60 percent — an im-portant competitive factor for the sup-plier of production equipment to theelectronics industry.

The company has implementedmany successful digital initiatives tomake it more productive, includingmonitors that display order-specific

Cambridge, MA — Almost all solidmaterials, from rubber and glass togranite and steel, inevitably expandwhen heated. Only in very rare in-stances do certain materials buckthis thermodynamic trend andshrink with heat. For instance, coldwater will contract at temperaturesbetween 0 and 4°C (32 and 39.2°F),before expanding. Engineers fromMIT and elsewhere are now addingto this curious class of heat-shrink-ing materials. The team, led byNicholas X. Fang, associate professorof engineering at MIT, has manufac-tured tiny, star-shaped structuresout of interconnected beams, ortrusses. The structures, each about

the size of a sugar cube, quicklyshrink when heated to about 282°C(540°F).

Each structure’s trusses aremade from typical materials that ex-pand with heat. Fang and his col-leagues realized that these trusses,when arranged in certain architec-tures, can pull the structure inward,causing it to shrink like a Hobermansphere — a collapsible toy ball madefrom interconnecting lattices andjoints.

The researchers consider thestructures to be “metamaterials” —

composite materials whose configu-rations exhibit strange, often coun-terintuitive properties that are notnormally found in nature. In somecases, these structures’ resistance toexpanding when heated — ratherthan their shrinking response per se— may be especially useful. Such ma-terials could find applications incomputer chips, for example, whichcan warp and deform when heatedfor long periods of time.

“Printed circuit boards can heatup when there’s a CPU running, and

THE GLOBAL HI-TECH ELECTRONICS PUBLICATION December, 2016

SIPLACE placement machines, such as the SIPLACE TX, are produced at ASM’s facility in Munich, Germany.

Handling Heat withShrinking Metamaterials

ASM Munich Named “Factory of the Year”

Continued on page 8

Next Month’s Focus

Productionand

Packaging

Naples, FL — Megan Wendling, pres-ident of global electronics marketingand assembly consultancy firm MWAssociates, has been honored withtwo awards by SMTA China. She hasreceived the organization’s Councilor

of the Year award, for the eighth con-secutive year, along with the LongService award.

The awards were presented byAbby Tsoi of SMTA China. Wendlingcontinuously supports SMTA China’sevents while actively promoting SM-TA China conferences, events andtechnical seminars globally, and hasdone so for many years.

Wendling’s role as advisorycouncil member of SMTA China is to

Electronic Manufacturing

Products

This Month's Focus:

Test and Measurement

MWA’s Megan

Wendling

Receives

SMTA AwardsPlasma system manufacturer

PVA TePla enables the deposi-

tion of organic silicone coatings

on next-generation medical de-

vices, allowing for antimicro-

bial, anticorrosive, hydrophilic,

and other surfaces.

Yamaha’s SMT placement sys-

tems get a major software up-

grade, enabling maintenance

self-diagnostics and perform-

ance optimization. Section be-

gins on…Page 24

Page 20

VOLUME 31 - NUMBER 12

Continued on page 6

TePla Coats Next-Gen

Medical Devices

Page 46

Test strategies from JTAG to

reduce PCB failure; protect-

ing sensitive electronics with

conformal coating (Rehm);

testing with ultrasound to de-

tect defects in components

post-reflow(Sonoscan); self-

configuring sensors for ma-

chine monitoring (Kaman).

Beginning on…

Continued on page 6

Megan Wendling (left) receivesSMTA awards from Abby Tsoi

(right).

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MDM West

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Poorly-secured, Internet-enabled devices have become targets in the lat-est round of cyber attacks. The recent attack on Internet infrastructurecompany Dyn in late October, in which a huge number of IoT devices

were used to obstruct access to sites including Twitter, Amazon, Netflix, Pay-Pal, and many others, begs for greater security for the Internet of Things andconnected devices. Dyn is a major DNS provider that translates URLs into theactual numerical IP addresses of the servers that host websites, a bit like anInternet phonebook.

In this case, a massive amount of Internet-enabled devices, includingDVRs and video cameras fell prey to a piece of malware that exploited theirconnectivity to flood Dyn’s network with illegitimate traffic. The consequencewas a series of Internet outages that reached from Dyn’s headquarters in NewHampshire to the West Coast.

This sort of cyber attack demonstrates the need for robust informationsecurity. With more and more data being transmitted globally per year — Cis-co forecasts annual traffic exceeding 2.3 zettabytes by 2020 — we should ex-pect the task of keeping our connected systems safe to become only more dif-ficult. This year’s electronica in Munich, Germany, demonstrated a rapidly ex-panding global component market, especially for automotive and industrialelectronics. The trend toward automation and the Internet of Things is driv-ing requirements for more and better sensing, information, and communica-tions technology in our factories, vehicles and homes.

The German Electrical and Electronic Manufacturers’ Association (ZVEI)has reported that electrical and electronic components account for 30 percent oftoday’s automobile production value. With the headlong rush into autonomousdriving, vehicle controls are becoming incredibly complex electronic systems.With such emphasis on connected technologies in vehicles, the concern of keep-ing them secure and protecting their passengers must be addressed. Possible is-sues range from attacks on vehicle data systems to interference with entiresmart road infrastructures. In the next few years, we are likely to see au-tonomous driving begin to play a role in our everyday lives, with some expertsforecasting millions of such vehicles taking to the roads by 2020.

In February, U.S.Tech heads to ATX/MD&M West in Anaheim, California,and then on to IPC APEX in San Diego. These strong shows are also sure to seenew ideas about the security of interconnected production equipment on the shopfloor. Now that 2017 is upon us, we canhope for and wish all of our readers a safe,prosperous and secure new year. r

Page 4 December, 2016www.us- tech.com

Lithium. It’s number 3 in the Periodic Table, it is the lightest of knownmetals, and was first used as early as the 2nd Century A.D. in ancientGreece by physician Soranus to control bipolar disorders. The Greek

physician didn’t know it was the lithium that was working the wonders, butthe element occurred naturally in the alkaline waters in his town of Ephesus,and helped people with mania and depression. It wasn’t isolated as an ele-ment until 1817 in Sweden.

Lithium is an incendiary, a fact that has come home to roost with themany lithium battery fires we have experienced, most recently in a wholebunch of new Samsung cell phones that were so crammed full of functionali-ty that there apparently was not enough room for battery and processor heatto dissipate adequately. And not too long ago, Boeing had to ground all of itsspanking-new 787 Dreamliners because of fires in the lithium batteries thatwere part of the aircraft’s electrical system.

Why has this become such a problem now? Because we have been takingtoo much of today’s technology for granted, without noticing the pimples onotherwise flawless complexions. The tiniest of defects or leaks in the batterycase can spell disaster because pure lithium exposed to the atmosphere willexplode, it’s that flammable. Yet we find it in batteries in millions of cellphones, tablets and computers, simply because it’s so much more efficient atstoring energy in batteries than anything else that the scientific communityhas discovered to date. For all of their potentially disastrous properties, lithi-um ion rechargeable batteries are still a vast improvement over nickel-cadmi-um batteries which did a gradual disappearing act once the lithium productswere deemed practicable.

If we are manufacturing and using so many Li-ion batteries, why arethere still incidents of spontaneous fires? For one thing, designers of productsthat use these storage devices tend to think of lithium batteries as a commod-ity, a technology that has been well developed and refined. That idea is fineas far as it goes, but there are still suppliers — particularly in China — whowill think nothing of cutting corners where safety margins and materials areconcerned, and let the buyer beware. The manufacturing buyer must also bevery aware of the potential danger, because his products can get some verybad press and end up with very costly recalls, as in the case of Samsung. Andas for the Boeing Dreamliner, the “fix” has been to provide better battery con-tainment in fireproof boxes to prevent the spread of any more lithium fires.Containment? How about a redesign? I don’t think I would want to board aDreamliner until this problem has been totally resolved.

In the good news department, there has been a breakthrough develop-ment at the University of Maryland in College Park. Researchers there havereplaced the hazardous lithium-coated carbon disc at the heart of coin-cellbatteries with a lithium-coated ceramic disc. The new disc has resisted all ef-forts to purposely ignite it, and may point the way toward a whole new classof non-combustible lithium batteries. And it still remains to be seen whetheror not this technology can be upsized to the larger batteries that we use incomputers, electric automobiles and Dreamliners. Manufacturing such a bat-tery would require retooling an entire industry, and since over 85 percent ofall Li-ion batteries are now made in Asia, it gives U.S. manufacturers a newopportunity to rebuild and reshore a major part of the electronics manufac-turing industry. Tesla is building its gigafactory, a gargantuan battery plantin Nevada that is expected to be up and running by 2020. Now it’s time forother U.S. companies to follow suit. r

SOUNDING OFF

By Walter Salm

Editor Emeritus

Hijacking on the Information Highway

More GigafactoriesNeeded

Tech-Op-edTech-Op-ed

PUBLISHER’S

NOTE

By Jacob Fattal

Publisher

December, 2016 Page 5www.us- tech.com

advise the chapter’s executive com-mittee on proficiency matters as wellas public relations for the SMTAchapters and council.

She received both awards be-cause of her exceptional, consistentsupport of the SMTA. The awardsare based on MW Associates’ contri-butions to the SMTA, including at-tendance at technical programs, sup-

port of chapter and national leaders,and encouragement and support ofparticipating members over thecourse of many years.

“I am honored to receive boththe Councilor of the Year award andthe Long Service award from SMTAChina,” says Wendling. “It is a pleas-ure to work with Abby and help himpromote the association and all of theevents and activities that go alongwith it.” MW Associates has offices inNaples, Florida, Los Angeles, De-troit, Tokyo, Beijing, Shanghai, andShenzhen.

Web: www.meganwendling.com.

instructions, processing steps pro-jected onto work surfaces, and net-worked tools that generate data fortraceability. ASM’s factory in Mu-nich is capable of producing upwardsof 1,000 machines per year, alongwith the necessary supporting mod-ules and equipment. Different plat-form configurations are produced ona single production line and the dis-tance between work cells is opti-mized to provide maximum flexibili-ty during manufacturing. Of the 500employees onsite, many work flexiblehours or by contract, further boostingprocess efficiency.

According to the panel of judges,ASM’s production of SIPLACE SMTplacement solutions demonstratesthat flexibility and efficiency don’thave to be mutually exclusive. In theirexplanation for naming the ASM plantin Munich the contest, they point outthat ASM shines with top ratingsalong the entire value chain.

“We won the Global Excellencein Operations Award in 2012, whichwas an incentive for us to keep mak-ing improvements. Being named‘Factory of the Year’ for 2016 is proofthat our team was able to push thelimits even further in terms of effi-ciency and flexibility,” said Jörg

Cwojdzinski, head of global supplychain management at ASM. He seesthe award as more than a recognitionof classic improvements. “With ourSmart Supply Chain program we arecurrently pushing digitalization andautomation for a smart assemblyprocess. We are still in the earlystages, but the positive impact ofthese innovations on our quality andother important KPIs obviously im-pressed the panel of judges duringtheir visits and deliberations. Itshows that we are on the right pathas we move toward the smart factoryof the future.”

The annual “Factory of theYear/Global Excellence in Opera-tions” awards have been presentedfor 25 years. In addition to an overallwinner, awards are presented in var-ious subcategories. The contest forthe manufacturing industry is highlyrespected among plant and supplychain managers. The winners are de-termined by a team of auditors basedon extensive surveys, benchmarkanalyses and factory visits.

Contact: ASM Assembly Sys-tems, LLC, 3975 Lakefield Court,Suite 106, Suwanee, GA 30024 % 770-797-3000 fax: 770-797-3457 E-mail: easales.sea@asmpt.com Web: http://dek.com r

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ASM Munich Named “Factory of the Year”Continued from page 1

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MWA’s Megan Wendling Receives SMTA Awards

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this sudden heating may affect theirperformance,” Fang says. “So you real-ly have to take great care in account-ing for this thermal stress or shock.”

The researchers have publishedtheir results in the journal PhysicalReview Letters. Fang’s co-authors in-clude former MIT postdoc Qi Ge,along with lead author Qiming Wangof the University of Southern Califor-nia, Jonathan Hopkins of the Univer-sity of California at Los Angeles, andJulie Jackson and ChristopherSpadaccini of Lawrence LivermoreNational Laboratory (LLNL).

Printing Ingredients

In the mid-1990s, scientists pro-posed theoretical structures whosearrangement should exhibit a prop-erty called “negative thermal expan-sion,” or NTE. The key to thearrangement was to build three-di-mensional, lattice-like structuresfrom two types of materials, eachwith a different NTE coefficient, orrate of expansion upon heating.

When the whole structure isheated, one material should expandfaster and pull the other material in-ward, shrinking the entire structureas a result.

“These theoretical papers weretalking about how these types ofstructures could really break the con-ventional limit of thermal expan-sion,” Fang says. “But at the time,they were limited by how things weremade. That’s where we saw this as agood opportunity for micro-fabrica-tion to demonstrate this concept.”

Fang’s lab has pioneered a 3Dprinting technique called micro-stereolithography, in which the re-searchers use light from a projectorto print very small structures in liq-uid resin, layer by layer.

“We can take the same idea asan inkjet printer, and print and so-lidify different ingredients, all on thesame template,” Fang says.

Taking inspiration from thegeneral framework proposed previ-ously by theorists, Fang and his col-leagues printed small, three-dimen-sional, star-shaped structures madefrom interconnecting beams. Theyfabricated each beam from one of twoingredients: a stiff, slow-to-expandcopper-containing material, and amore elastic, fast-expanding polymersubstance. The internal beams weremade from the elastic material, whilethe outer trusses were composed ofstiff copper.

“If we have proper placement ofthese beams and lattices, then evenif every individual component ex-pands, because of the way they pulleach other, the overall lattice couldactually shrink,” Fang says.

“The problem we’re treating is athermal mismatch problem,” saysWang. “These materials have differ-ent thermal expansion coefficients,so once we increase the temperature,they interact with each other andpull inward, so the overall struc-ture’s volume decreases.”

Room to Experiment

The researchers put their com-posite structures to the test by plac-ing them within a small glass cham-ber and slowly increasing the cham-ber’s temperature, from room tem-

perature to about 540°F (282°C).They observed that as structure washeated, it first maintained its initialshape, then gradually bent inward,shrinking in size.

“It shrinks by about one part ina thousand, or about 0.6 percent,”Fang says. While that may not seemsignificant, Fang adds that “the veryfact that it shrinks is impressive.”For most applications, Fang says de-signers may simply prefer structuresthat do not expand when heated.

In addition to their experi-ments, the researchers developed acomputational model to characterizethe relationships between the inter-connecting beams, the spaces be-tween the beams, and the directionand degree to which they expandwith heat. The researchers can con-trol how much a structure will shrinkby tuning two main “knobs” in themodel: the dimensions of the individ-ual beams, and their relative stiff-ness, which is directly related to amaterial’s rate of heat expansion.

“We now have a tuning methodfor digitally placing individual com-ponents of different stiffness andthermal expansion within a struc-ture, and we can force a particularbeam or section to deflect or extendin a desired fashion,” Fang says.“There is room to experiment withother materials, such as carbon nan-otubes, which are stronger andlighter. Now we can have more fun inthe lab exploring these differentstructures.” This research was sup-ported, in part, by the Defense Ad-vanced Research Projects Agency.

Web: www.news.mit.edu r

Handling Heat with Shrinking MetamaterialsContinued from page 1

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This 3D printed structure is designed to shrink when exposedto heat, based on the stretching

and pulling of its internal beamsand trusses. Image: Qiming Wang.

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Minimizing the changeover count Changeover time can be reduced by performing MFU batch changeover.

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Placement and pressure insertion for larger parts Supports parts with a height of up to 1.5 inches (38.1mm).

The new AIMEXIII from Fuji is the latest innovation in small footprint, all-in-one placement technology.

Using the same concepts from previous AIMEX series machines, this newest addition also supports; Large panels (up to 28” x 30.4”), one minute head exchange without tools, smart feeders and auto rail width & auto backup pin placement.

The AIMEXIII can place components as small as 03015 at a rated speed of 35,000cph with an accuracy of 25um using the new H24G placement head. Advanced linear motor and vision processing technology allow the AIMEXIII to be the fastest, most innovative placement machine to date.

The new Dyna Head can place components ranging from 01005 ~ 74 x 74mm and connectors up to 32mm x 180mm using a wide variety of standard nozzles, specialty nozzles and mechanical chucks. The AIMEXIII is available in both single or dual gantry & single or dual lane con�gurations allowing the user to customize the unit for speci�c production needs.

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Flexible High-mix Production

Given the medical imaging in-dustry’s growing requirementsfor power savings, higher reso-

lution and the need to support inte-grated security and communications,the unit volume of semiconductorsused in medical imaging is expected toincrease at a five-year compound an-nual growth rate of 8.2 percent, from46 million in 2015 to a projected 73million in 2020.

Even with increasing demand forenergy-efficient and integrated com-ponents, year-over-year global rev-enue growth from semiconductorsused in medical imaging was flat, dueto optical component price erosion,reaching $1.1 billion in 2015.

Semiconductor Market Trends

One of the most importanttrends in the semiconductor industrytoday is the development of chip so-lutions that integrate several compo-nents into a single chip package tominimize size, save energy and lowerproduction cost without sacrificingfunctionality.

As the size of semiconductors

continues to decline, imaging sys-tems that used to cost more than amillion dollars and took up largeamounts of space have evolved intosmaller, less-expensive systems thatcan be used in small clinics or doc-tors’ offices. The IHS Markit Indus-trial Semiconductor Market Trackerfollows four types of medical imagingequipment: ultrasound, X-ray, mag-netic resonance imaging (MRI), andcomputed tomography (CT).

The ultrasound market is fore-cast to grow 4.7 percent over the nextfive years. Portable ultrasound inChina is not growing as fast as previ-ously expected, due to lower capitalinvestments and strategy shifts to-ward higher-end systems from majorsuppliers. With ultrasound typicallycosting less than CT and MRI,healthcare reform is likely to favorthe more widespread adoption of ul-trasound, which bodes well for pa-tients and doctors opting for systemsthat minimize radiation exposure.

The X-ray market is expected togrow 5.3 percent, led by mobile X-rayreplacing existing analog mobile sys-

tems with more efficient and higher-priced digital X-ray systems — espe-cially in the Asia-Pacific region.

The MRI market is expected togrow 6.4 percent, due to higher de-mand for open MRI in emerging mar-kets, which is more cost-effective than closedsystems. Open MRI hasnot gained traction inthe United States andother mature markets,because of its lower fieldstrength and weakerimage quality whencompared with closedMRI.

The CT market isexpected to grow 4.2percent, led by 64-slicesystems which are morecost-effective than the128-slice systems, but still providesufficient image quality for diagnosticpurposes. As the 128-slice systemmarket matures and the devices be-come more affordable, it will gradual-ly gain momentum. The demand forless-than-16-slice systems and 17- to63-slice systems will continue to de-cline, because emerging regions areprice-sensitive and quality is not theprimary consideration.

Semiconductors Thrive in Medical Imaging

The demand for high-qualityand innovative medical imaging hasincreased the advancement, perform-ance and penetration of semiconduc-tors and sensors. Ongoing componentprice erosion continues to intensifyacross the semiconductor industry, assemiconductor manufacturing contin-ues to increase significantly in China.

Complementary metal-oxidesemiconductor (CMOS) image sen-sors are predominant in CT and X-ray systems, allowing for amplifiedcross-sectional image slices ofscanned body areas with higher reso-lution, faster data throughputs andbetter diagnostics. CMOS is anemerging technology that is pre-ferred over charge-coupled device(CCD) technology, due to lower cost,higher readout speed and less noise.Scanner performance improvementsand innovations have significantlyincreased slice count, leading tofaster and clearer images. It is also alot safer for patients, due to its re-duced radiation dosage levels.

More power discrete and modulesemiconductors are required for mo-tor control and input power refine-ment — especially in MRI systems re-quiring greater magnetic fieldstrength, with the transition to 3 Tes-la (3T) technology. Analog semicon-ductors are also prevalent in the med-ical imaging market, due to the inte-gration of low-noise amplifiers, volt-age-to-current amplifiers, and multi-channel analog-to-digital converters(ADCs) into single analog front-end

integrated circuits (AFE ICs). Thesecircuits are much smaller and dissi-pate less power than previous-genera-tion parts, while providing twice theperformance. Analog advancementshave addressed the low-power and

low-cost needs of CT scanners withhigh slice counts and clearer images.A high-resolution ADC must be usedduring an MRI scan to produce astrong magnetic field.

Processors and MCUs

Processors are another crucialcomponent and differentiator inmedical imaging devices. These in-clude microcontrollers (MCUs), mi-croprocessors (MPUs), digital signalprocessors (DSPs), applications/me-dia processors (APs) and config-urable system-on-chip devices(CSoCs). AP is defined under appli-cation-specific logic. Configurableprocessors, including field-program-mable gate arrays (FPGAs) andCSoCs, are defined under program-mable logic devices. Processor trendsin medical imaging reflect trendsthat are occurring across the semi-conductor industry.

MCUs typically control human-machine interface functions, motorcontrol, power management control,connectivity, security and other func-tions that have little to do with imageprocessing. They are inexpensive com-pared to image processors, and theyare also less likely to fail in adverseenvironments with a lot of radioactiv-ity, high temperatures or electromag-netic interference, which makes themwell-suited for use in medical imagingequipment. MCUs are used in touch-screens and keyboard controllers, mo-tor controllers, sensor fusion, networkconnectivity, safety, and security. Im-provements in the equipment’s ease-of-use, comfort and control are prima-rily due to the use of MCUs. As imag-ing equipment trends from large, clin-ically installed models to mobile andportable solutions, these features willbe in high demand, requiring higherquantities of MCUs with greater func-tionality.

Contact: IHS Markit, 4th FloorRopemaker Place, 25 RopemakerStreet, London, EC2Y 9LY U.K. % +44-20-7260-2000 Web: www.ihsmarkit.com r

Tech WaTch

Page 10 December, 2016www.us- tech.com

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to select the supply chain that youneed, rather than following a trendor using the supply chain that suitsyour vendor. Your vendors may havemixed priorities, and while theyprobably have good intentions, theywill still want to balance the utiliza-

tion of their factories around theworld. This might mean that yourproduct is being made in a location

that is better for your supplier’sbusiness objectives than for yours.

The alternative to following es-tablished trends is also fraught withdanger. Moving production to Chinawas the biggest trend 10 years ago,and while it saved money for somecompanies, it was only the best solu-tion for a few. Many companies havesince moved projects back from Chi-na to Eastern Europe, CentralAmerica, and even to higher-cost re-gions like the USA where proximityto design and the consumer marketis a big value-added component.

Supply Chain 101

Creating the ideal supply chainis matter of identifying priorities. Istime-to-market the most importantthing? Is it price at volume, or is it acompliance or quality demand thattakes the lead?

The second task of designing

the right supply chain is to decidewhere to manufacture and whetheror not to use a single source. Theearly part of product developmentmay require a much closer relation-ship with the vendor than later inthe process when proximity to thecustomer becomes more important.This may mean finding a partnerwith multiple geographical locationsor it may mean using two complete-ly different vendors that can sharedesign and product data.

A risk when using two vendorsoccurs when they are kept separateand the whole design for manufac-turability phase has to happentwice.

What about fulfillment? Earlyconsideration as to the location ofyour customers and how to get prod-uct to them is essential. If you havethe time, sea freight can save a lot ofmoney, but the cost of goods at seain terms of inventory will need to bebalanced with the risk that comeswith having a six-week delay builtinto the supply chain. Agility can bekey in any supply chain, particular-ly with fast-moving consumer goodswhere the market is fickle and newdesigns need to come to marketquickly.

Downstream vendors can alsohave an impact on supply chain de-velopment. Supply chains do not op-erate in vacuums. They are complexand connected ecosystems. Your ma-terials and their sources will influ-ence the choice of vendor. Mechani-cal parts such as metals or plasticsmay dictate the best place to build agiven product. This may be truewith your vendor’s vendors too.You’ll need to explore a few tiersdown to get the right sort of robustand low-risk supply chain.

Risk Analysis

We have all read plenty of arti-cles on reshoring. You should neverbe led entirely by politics, but it isworth considering what political,cultural or marketing value yourmanufacturing location brings. It isinteresting to see Apple productsemblazoned with the words “De-signed in California,” in order todraw attention away from the factthat they are “Made in China.”

Thought should also be given tothe so-called “soft” issues that canbecome serious when getting intofields like military and aerospace, orwhen a preference becomes a com-pliance issue.

What is your perspective on so-cial and environmental issues?What is the potential fallout of bad

publicity surrounding certain loca-tions, labor relations or conflict ma-terials?

Finally, consider risk mitiga-tion in the supply chain. Dividing abusiness between two vendors can

be risky, especially when the prod-uct is initially in modest volumes.But, being with a single vendorbrings its own share of risk. Otherrisks come from further down thesupply chain with downstream ven-dors. A proper risk analysis is essen-tial to supply chain planning.

Clearly, not all products arecreated equal. As a result, vendorand supply chain selection is a mix-ture of science and art, and experi-ence with the process. Getting itright is not easy, but getting itwrong can be disastrous! r

Supply Chain

Page 12 December, 2016www.us- tech.com

Supply Chain

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John Daker is a career operations,engineering and supply chain profes-sional with more than 15 years ofglobal operations experience that hebrings to his role at Riverwood. Hehas held engineering, operations,and program management roles atseveral companies including NASA,Flextronics, NHT, PowerFile, andTesla Motors. John has worked withproducts in consumer electronics,networking, photonics, and managedmanufacturing facilities producingaudio components and electric vehi-cle power trains.

Riverwood Solutions helps OEMsand Brand Owning Enterprises of allsizes with manufacturing strategy,supply chain operations optimization,sourcing, and supply relationships.The company provides consulting andmanaged services to the world’s lead-ing technology product companies.

December, 2016 Page 13www.us- tech.com

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Page 14 December, 2016www.us- tech.com

PeoPle in the news

Plexus Appoints Steve Frisch CEONeenah, WI — Plexus Corp., has appointed Steve Frisch to the position of exec-utive vice president and CEO. With the promotion, Mr. Frisch assumes respon-sibility for the company’s global manufacturing and engineering operations, go-to-market, supply chain, and quality functions. Mr. Frisch is an experiencedleader with a comprehensive knowledge of the industry and customer base.Throughout his 26-year tenure with Plexus he has built a reputation for devel-oping talent and delivering results. Mr. Frisch joined the company in 1999 as adesign engineer and in the course of his career, has served as executive vicepresident and chief customer officer, executive vice president of global customersolutions, and as EMEA regional president.

Web: www.plexus.com

Scienscope Hires Mary Westmorelandto Field Service Applications TeamChino, CA — Scienscope International has added Mary Westmoreland to its fieldservice/applications team. Ms. Westmoreland will be based in the company’s Chi-no office. She joins Scienscope with more than 10 years of industry experience inSMT and through-hole, semiconductors, fiber optics, and electromechanical as-sembly. She will travel to Scienscope’s domestic and international customers, inaddition to providing in-house service and applications training. Ms. Westmore-land earned degrees in electronics and computer technology as well as in techni-cal management from DeVry University.

Web: www.scienscope.com

Seica Adds Cesar Mendez to Sales TeamSalem, NH — Seica has hired Cesar Mendez as the latest member of its Mex-ico sales team. In his sales role, he will be a key player in lead generation ac-tivities and customer support, working with many OEM and CM clients. Hisexperience includes managing large automotive accounts for a previous em-ployer. Based in Seica’s Guadalajara office, Mr. Mendez will also spend timeat the company’s technical office in Queretaro, Mexico. His focus will be onselling all of the company’s products, as well as partnership products, such asconformal coat AOI, board and assembly handling equipment, and various as-sembly work-cell products.

Web: www.seica.com

Simplimatic Welcomes John Artmanand Shawn SemerForest, VA — Simplimatic Automation has added two new members to its lead-ership team, John Artman as vice president of business development, and ShawnSemer as vice president of packaging sales. Mr. Artman has more than 25 yearsof experience in sales, business development, engineering, and automationequipment project management. In the past, he has held various leadership rolesincluding project engineering manager, sales manager, and vice president ofbusiness development at several global assembly and automation companies.Mr. Semer has 20 years of sales, engineering and project management experi-ence in the areas of packaging, palletizing and robotics. He has held several pre-vious influential roles, such as mechanical engineer, national account manager,sales manager, and vice president of sales.

Web: www.simplimatic.com

DEN-ON Honors Longest-Term EmployeeTokyo, Japan — DEN-ON Instruments is celebrating its longest-term employ-ee, Masaaki Uchiyama. Mr. Uchiyama started with the company after highschool at age 16, and 28 years later, he is the longest-term employee in DEN-ON’s 53-year history. Mr. Uchiyama developed his skills through self-motiva-tion and hard work and was eventually promoted to factory manager. He isresponsible for overseeing all manufacturing, procurement and shipping. Ac-cording to Raymond LaFleur, DEN-ON’s general manager of overseas salesand marketing, Mr. Uchiyama is one of the key figures that has helped thecompany earn its reputation for quality.

Web: www.denondic.co.jp

Graybar Names Stephen Cray VP Seattle DistrictSt. Lous, MO — Graybar has appointed Stephen Cray as its district vice pres-ident in Seattle. As of January 2017, Mr. Cray will replace Kirk Snure, whoplans to retire as district vice president after more than 31 years with thecompany. Graybar’s Seattle district is one of 13 operating districts for the em-ployee-owned company, serving customers throughout Washington, Oregon,Idaho, Montana, Alaska, and Hawaii. In total, the district includes 12 loca-tions and more than 430 employees. Mr. Cray has 30 years of experience inthe electronics industry and has been with Graybar for more than a decade.He currently serves as director of electrical sales in the company’s SouthernCalifornia region, a position he has held since 2008.

Web: www.graybar.com

www.us- tech.comDecember, 2016 Page 15

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Wacker to Open Expanded Silicone R&D Facility in U.S.Ann Arbor, MI — Wacker is expanding its research anddevelopment facilities for silicones by establishing a newR&D center in Ann Arbor, Michigan. The facility will sup-port the company’s overall business and product develop-ment throughout the Americas. In the first phase, thecompany is investing mainly in equipment and installa-tion for the new labs. The facility will officially open inthe first half of 2017.

Located in Michigan Innovation Head-quarters, a co-work campus facility in AnnArbor, the center consists of several labs forresearch, development and analytics. Proj-ects that the company plans to pursue in-clude health and medical care applications,solutions for coatings and paints, silicone-based softeners, and personal care products.The labs will be operated by Wacker Chemi-cal Corporation (WCC), the Wacker Group’sAmerican subsidiary, and staffed by highly-specialized experts in the field of silicone andpolymer chemistry.

“Our facility is among several high-techdevelopment operations in a 90,000 square footco-work campus,” said David Wilhoit, WCCpresident and CEO. “This scientific co-workcommunity is ideal for Wacker, and for verygood reason: It puts us in the midst of a busi-ness incubator atmosphere where ideas can bedeveloped and brought quickly to market.”

Main considerations for selecting theAnn Arbor location were the availability of highly-skilledtalent pools, and the close proximity to respected areauniversities and to Wacker’s production site in Adrian.“With Ann Arbor considered a technology hub, it comple-ments the company’s business model to be close to its cus-tomers and close to regional market trends,” Wilhoitpointed out.

According to Robert Gnann, head of the Group’s sil-

icone division Wacker Silicones, the research and devel-opment center continues the company’s expansion of itsglobal R&D footprint. “We already have R&D operationsin Germany and in Asia. Our R&D center in Ann Arbor,combined with our Adrian site, furthers the strategic re-gionalization of Wacker’s global network of research anddevelopment,” Gnann explained. “Our aim is to offer long-term technical assistance for customers and support fu-

ture business growth. By enhancing research efforts inthe field of silicone technology, our emphasis will be ondeveloping new and advanced applications in growthmarkets such as health, medical and personal care, elec-tronics, life sciences, and coatings.”

Contact: Wacker Chemical Corp., 3301 Sutton Road,Adrian, MI 49221 % 888-922-5374 fax: 517-264-8246 E-mail: info.usa@wacker.com Web: www.wacker.com

Guadalajara, Mexico — Rehm Ther-mal Systems has opened a new tech-nology center in Guadalajara, Mexi-co. Officially inaugurated in October,the facility recently hosted its firsttechnology day event, which focusedon the company’s energy-efficient,sustainable reflow soldering and fu-ture trends in electronic assemblyproduction.

Customers and partners fromthe Greater Mexico region had the op-portunity to become familiar with thenew facility and the company’s equip-ment. With over 3,000 ft2 (280m2) ofspace, the technology center offersservices that combine theory andpractice. Rehm’s VisionXP+, a partic-

ularly efficient reflow convection sol-dering system, is currently availablefor soldering trials and extensivetests. As the facility expands, othersystems will also be made available.

In addition to the opening cere-mony, visitors participated in lec-tures and workshops to learn aboutsustainable reflow soldering and toexchange ideas with experts on thelatest trends, such as the emergingtopic of e-mobility.

“With the new technology cen-ter in Guadalajara, we will be able toprovide individual customer support,coupled with the latest technologydevelopments and fast responsetimes, as well as further expand ourservices,” emphasized Michael Han-ke, Rehm’s global sales manager.Plant operators can visit the technol-ogy center and explore the functionsof the VisionXP+ system, participatein training courses and receive prac-tical tips for process optimization.

Contact: Rehm Thermal Sys-tems, LLC, 3080 Northfield Place,Suite 109, Roswell, GA 30076 % 770-442-8913 fax: 770-442-8914 E-mail: p.handler@rehm-group.comWeb: www.rehm-group.com

Page 16 December, 2016www.us- tech.com

Business newsBusiness news

Morrisville, NC — Juki Automation Systems (JAS) pre-sented Horizon Sales with three of its “Representative ofthe Year” awards for 2016. Bob Black, president and CEOof Juki, gave the awards to Dave Trail, principal, HorizonSales, at a recent banquet held during the Juki Americasnational sales meeting that took place at the company’s

facility in Morrisville.This is the seventh consecutive year that Horizon

Sales has earned the award for highest sales. In addition,Horizon received awards for highest printer sales andhighest selective solder sales.

“Horizon had another great year offering the fullrange of Juki products and our customer basehas embraced the full product line once again,”commented Trail. “We have had much successpenetrating the small shops and the largershops as well, and both have continued toagree that the Juki products and support staffare the best in the industry. This terrific cus-tomer acceptance has allowed us to once againrise to the top of the Juki sales organization.”

Horizon Sales takes great pride in itsability to maintain a strong customer base asa well as the stability and longevity of its coreproduct lines. The rep firm manages and sellsequipment in Michigan, Ohio, Indiana, Ken-tucky, and Western Pennsylvania, and re-cently added Illinois, Eastern Iowa and Wis-consin.

Contact: Juki Automation Systems, Inc.,507 Airport Boulevard, Morrisville, NC27560 % 919-460-0111 E-mail: gryden@jas-smt.com Web: www.jukiamericas.com

Juki Presents Horizon Saleswith Top Three Rep Awards

The team at Horizon Sales from left to right: Joshua Casper,David Trail, Tom Baro, Kathleen Thompson, and David Smith.

Rehm Thermal InauguratesTech Centerin Mexico

A researcher works with a silicone fluid compound.

From left to right: David Monroy,Michael Hanke, Rodrigo

Sanchez, Luis Garcia, StefanieStier, and Dr. Hans Bell of RehmThermal Systems inaugurate the

new technology center inGuadalajara, Mexico.

Business Briefs

NEO Tech Wins Third Raytheon Supplier AwardChatsworth, CA — NEO Tech has won the Raytheon IDS Supplier 4 StarAward for its performance in 2015. The award was presented to the companyduring the IDS supplier conference that took place in Danvers, Massachu-setts. This marks the third consecutive year that NEO Tech has won theaward. Raytheon’s Integrated Defense Systems business instituted the annu-al supplier excellence awards program to recognize suppliers who have pro-vided outstanding service and partnership, exceeding customer requirements.NEO Tech was one of 82 companies recognized by Raytheon’s Integrated De-fense Systems business for 4-Star honors.

Contact: NEO Tech, 9340 Owensmouth Avenue, Chatsworth, CA 91311% 818-495-8617 E-mail: info@neotech.com Web: www.neotech.com

Kurtz Ersa Expands Presence in MexicoGuadalajara, Mexico — Kurtz Ersa North America has opened a new demo andtechnology center in Guadalajara, Mexico. The company’s inaugural event fo-cused on its future growth and emerging technologies. The company’s subsidiaryin Mexico, Kurtz Ersa Mexico, was established in 2013. The company has seenexponential growth in the automotive and electronic industries in the countrysince it opened its first facility. The technology center houses Ersa’s completerange of soldering systems, including the Hotflow 3/20 reflow oven, Versaflow3/45 soldering system and the HR 600/2 automated rework system.

Contact: Kurtz Ersa North America, Inc., 1779 Pilgrim Road, Plymouth, WI 53073 % 920-893-1779 fax: 920-893-1562 E-mail: ernie.grice@kurtzersa.com Web: www.ersa.com

Cogiscan Enables Industry 4.0 withSiemens PLMBromont, Quebec, Canada — Cogiscan is partnering with Siemens PLM Soft-ware to provide a complete manufacturing software solution to enable Industry4.0 for EMS companies. The Cogiscan suite of TTC solutions includes world-classmaterial control, traceability and TTC analytics to achieve significant improve-ments in visibility, quality and productivity. Siemens PLM Software is a providerof product lifecycle management and manufacturing operations managementsoftware for all industries, including the out-of-the-box SIMATIC IT UnicameMES solution for electronic manufacturing. Together, Cogiscan and Siemenswill help companies optimize their processes, from planning and developmentthrough to manufacturing, production and support.

Contact: Cogiscan, 28-B boulevard de l’Aeroport, Bromont, Quebec,Canada J2L 2N8 % 450-534-2644 E-mail: info@cogiscan.com Web: www.cogiscan.com

Virtual Industries Updates WebsiteColorado Springs, CO — Virtual Industries has updated its website (www.vir-tual-ii.com) and made it compatible with mobile devices. One of the main fea-tures of the new website is the ability to transact with PayPal for shopping on-line. All of the company’s latest vacuum handling solutions have been addedto the online store. The company’s success has come from developing innova-tive manual vacuum handling tools and pick-up tips based on customer feed-back and requests. These tools provide customer-specific solutions that makeassembly and processing operations more productive and ergonomic.

Contact: Virtual Industries, Inc., 2130 Victor Place, Colorado Springs,CO 80915 % 719-572-5566 E-mail: nmendez@virtual-ii.com Web: www.virtual-ii.com

NuSil Completes Merger with AvantorCenter Valley, PA — The merger of Avantor Performance Materials and NuSilTechnology LLC has been successfully completed. The intent to merge was an-nounced on August 31, 2016. Michael Stubblefield, who has served as CEO ofAvantor Performance Materials since 2014, will serve as CEO of the combinedentity. New Mountain Capital, the majority owner of both legacy companies, re-mains as the majority owner post-merger. The combined company becomes aglobal provider of ultra-high-purity materials for the life sciences and advancedtechnology markets, offering more than 30,000 products that meet increasinglystringent standards across technology-driven and highly-regulated markets.

Contact: NuSil Technology LLC, 1050 Cindy Lane, Carpinteria, CA93013 % 805-684-8780 Web: www.nusil.com

Newark element14 Integrates CalcuQuoteDallas, TX — CalcuQuote and Newark element14 have introduced a direct in-tegration allowing electronics manufacturing services (EMS) companies usingCalcuQuote to query Newark element14’s supply database for contract pricingand real-time availability. Using CalcuQuote’s materials cost module, EMScompanies connect to Newark element14’s application programming interfaceand search for manufacturing part numbers in a BOM. CalcuQuote then re-turns Newark element14’s availability, as well as the customer’s contract pric-ing for those parts. The direct partnership reportedly allows Newark ele-ment14’s customers to price assemblies quickly, easily and more accurately.

Contact: CalcuQuote, 3215 San Sebastian Drive, Carrollton, TX 75006 % 909-278-8233 E-mail: info@calcuquote.com Web: www.calcuquote.com

December, 2016 Page 17www.us- tech.com

With touchscreens, flex cir-cuits, keypads, and mem-brane switches becoming

more technologically advanced,OEMs are becoming increasingly de-pendent on sourcing subassembliesto third-party suppliers. At the sametime, subassemblies are critical to anOEM’s finished product and must besourced carefully to achieve consis-tent quality, timely turnaround andcompetitive pricing. In many cases,contracting with suppliers that offeraccess to global manufacturing facili-ties and in-house engineering sup-port can be instrumental to the suc-cess of an OEM.

One of the most significant chal-lenges is locating reliable supplierswho can meet these qualificationswith pricing that can improve prof-itability. Some of the more successfulOEMs point to a few uncomplicatedstrategies that help strengthen sub-assembly sourcing, achieving fasterturnaround, ensuring product qualityand functionality, and increasingadded profitability.

Access to Global Resources

Selecting a domestic subassem-bly supplier with global manufactur-ing resources can provide OEMs withsignificant economic advantages —

provided that the manufacturing pro -cesses are managed by the supplier.

For example, many OEMs thatcontract directly with offshore sup-pliers experience communication dif-ficulties that can lead to errors withsubassembly materials or dimen-sions, avoidable logistical difficulties,or even cost miscalculations. Howev-er, some OEM suppliers have noproblem in providing high-qualityproducts through relationships withoffshore fabricators that work seam-lessly with the domestic supplier’sengineering and management team.

“We have found that offshorefabricators can be effective partnersin manufacturing for North Ameri-can subassembly suppliers, providedthat the proper communications andmanagement controls are in place,”says Hector Macias, director ofNorthpoint Technologies, located in

El Paso, Texas. Macias adds thatsuch fabrication partnerships can al-so be financially beneficial to OEMcustomers by providing savings oncost and eliminating the need forcapital investments.

Northpoint Technologies is amanufacturer of components andsubassemblies for electronic devicesused in the medical, automotive, de-fense, telecommunications, industri-al, and consumer markets. The com-pany’s expertise includes silicon and

membrane switches, flexible PCBsand assemblies, touchscreens andwire harnesses.

When Justin Blush was insearch of a silicon membrane for amicroscope control switch, he foundNorthpoint Technology. Blush, leadtechnician at Prescott’s, Inc., a re-manufacturer of surgical micro-scopes, says his company’s own mold-ing and machine shop was unable tofabricate the membrane, which wasincorporated into a switch that en-abled a microscope to zoom in andout on a subject. “I was happy just tohave a supplier and expected the fab-rication and shipping process to takeat least six to eight weeks, as withour traditional suppliers,” Blush ex-plains. “I was amazed to learn thatthe membrane required only a two-week turnaround, and at a fraction ofthe price I expected.”

Fast Functional Prototypes

The timely delivery of proto-types and quick turnaround of revi-sions are vital to expediting the man-ufacturing process. When subassem-bly suppliers with offshore manufac-turing facilities can produce proto-types in-house with quick turn-around times, the process is muchmore efficient.

Due to those factors, prototyp-ing is one of the functions that suc-cessful suppliers seldom outsource.Macias considers prototyping a criti-cal step in product development.These are produced using aluminumor “soft” molds, and are of such qual-ity that they are usually consideredto be product samples or the equiva-lent of first article production pieces.

“The prototypes we require arereal, functional samples that we sendto customers to inspect and test,”says Terry Swick, president and co-founder of Swick-White, a manufac-turer of electric enclosures, controlpanels, membrane switches, andgraphic overlays. “Assuming theymeet specifications, they can install

them as finished subassemblies inproducts and ship them out to cus-tomers with confidence.”

At other times OEMs will haverequirements that are beyond theusual request. Suppliers who havethe in-house capabilities producecomplex items domestically can sat-isfy the extra demand by producingadditional functional prototypes thathave been approved for production.

Volume Flexibility

Whether subassemblies or indi-vidual parts are fabricated domesti-cally or overseas, minimum volumerequirements can force OEMs to pur-chase more parts than they require.However, a few subassembly suppli-ers are moving away from volume re-quirements to better serve the OEM.

When Steve Stoehr, engineer-ing manager at GS Global Resources(GSGR) was sourcing a keypad aspart of switch and control panels in-stalled for heavy-duty equipmentlike agricultural machinery and firetrucks, he expected to make a sizablevolume commitment to the keypadmanufacturer. Based in Mukwonago,Wisconsin, GSGR develops and im-plements a broad range of electronicand hydraulic control systems forvarious OEMs. “Most of our supplierswant high-volume orders, just likeother industries,” explains Stoehr.“Five or six years ago we foundNorthpoint Technologies, which hasbeen very good about taking on evenlow-volume projects. That’s a realplus for us and our customers.”

Adding Value

Finally, many OEMs are find-ing suppliers that provide significantvalue-added services, with offeringsranging from engineering assistanceto recommendations for streamliningthe manufacturing process. In somecases, graphic design assistance,such as special icons or other sym-bols on keypads and other controls,can provide important safety or secu-rity features.

In another example, Stoehr foundthat subassembly suppliers couldbring important value added throughthe kitting of loose parts. He arrangedwith Northpoint to have special kits,containing 20 loose keypad buttons, tobe packaged in order to expedite as-sembly on the production line.

“Getting great value-added serv-ices through a single source is impor-tant to GSGR,” Stoehr says. “It is notonly more convenient, but when youcouple that with consistent quality,quick turnaround and competitiveprices, it helps us provide better serv-ice to our customers, as well.”

Contact: Northpoint Technolo-gies, Inc., 13321 Tobacco Road, El Paso, TX % 915-591-6300 E-mail: sales@northpoint.com Web: www.northpointech.com r

Page 18 www.us- tech.com

ManageMentManageMent

December, 2016

How to Choose the Right Subassembly Supplier

By Ed Sullivan

A domestic subassemblysupplier with global

manufacturing resourcescan provide OEMs with significant advantages.

December, 2016 Page 19www.us- tech.com

Silicon dioxide, or silica, is one of the mostabundant minerals on earth. Most commonlyfound in nature as quartz, it is the major con-

stituent of sand and a primary component in sili-cone and glass. Now, this basic compound is beingused in plasma-enhanced chemical vapor deposi-tion (PECVD) techniques as an anti-microbial bar-rier, a primer to promote adhesion between stain-less steel and proprietary coatings, or to create hy-drophobic or hydrophilic surfaces.

For many medical device manufacturers, theapplication of proprietary coatings and surfacetreatments can play a significant role not only innew product development, but also when upgrad-ing legacy medical devices under 510(k) guide-lines. As a result, the medical device industry isaggressively investigating and applying plasma-applied coatings to products such as stainless steelguide wires, catheters, stents, and vascular surgi-cal tools.

“We are always looking for unique and novelways to make our products more robust and be-come the market leader, but to do that we need tobring more technology to our devices.

Often, that is going to involve some form ofcoating to functionalize the surface,” explainsAaron Baldwin of MicroVention, a company thatoffers a variety of neuro-interventional productsincluding access products, intraluminal stents, oc-clusion balloons and polymer coils.

“PECVD can take a product to the next levelby addressing surface reaction issues such as bio-compatibility or lubricity. It is a unique and elo-quent way to deposit and enhance coatings be-

cause it allows you to tailor the surface while re-taining the bulk material’s properties you need,”he adds.

PECVD of Organic Silicones

Plasma-enhanced chemical vapor deposition isa process used to deposit thin films from a gas state

(vapor) to a solid state on a substrate. To deposit sil-icon dioxide using PECVD, organic silicones are of-ten required as the feedstock. Within this family,the best known are hexamethyldisiloxane (HMD-SO) and tetramethyldisiloxane (TMDSO).

HMDSO, in particular, is an affordable andflexible reagent that is commercially available in ahigh-purity, liquid form. The volatile, colorless liq-uid can be plasma-polymerized to create a varietyof surface coatings that are safe for medical use.Depending on the composition of oxygen to HMD-SO, the property of the surface can be hydrophobicor hydrophilic.

In fact, it is this flexibility that makes HMD-SO and other siloxanes the ideal choice forPECVD. By adjusting the parameters and othergases added, chemists can tightly control the ma-terial to address a wide range of applications.

In the medical device industry, the primaryuses of organic silicones fall into the primary cate-gories of protective barriers (antimicrobial, anti-fungal and anti-corrosion) as a primer betweenstainless steel or exotic metals and proprietarysurface coatings, or to modify the surface to be-come hydrophobic or hydrophilic.

Primer Adhesion and Anti-Corrosion

When the substrate is metallic, like stainlesssteel or other exotic alloys, it can be difficult to ad-

Page 20 December, 2016www.us- tech.com

ElEctronic Mfg SErvicESElEctronic Mfg SErvicES

Organic Silicone Coatings for Next-Gen Medical Devices

By Jeff Elliott

Continued on next page

Organic silicones can be deposited on medicaldevices, such as catheters, as a surface primer

to promote the adhesion of other coatings.

here a coating to the surface. In these cases, HMD-SO can be used as an intermediate layer to im-prove the adhesion between a coating and the sub-strate.

Guide wires are a good example. To ease in-sertion, stainless steel guide wires are often coatedwith proprietary surface coatings to lubricatethem. By applying a thin layer of silicon dioxide,the coating then grafts nicely to a stainless sur-face.

Organic silicones can also be applied as alinking chemistry between other difficult-to-ad-here to surfaces such as ceramics and PTFE(Teflon). Drug delivery devices that utilize ceram-ic nozzles with micron-sized openings can becomeclogged and are often coated with PTFE to preventsuch occurrences. Depositing a 100-150 nm layer ofHMDSO promotes the bond betweenthe two substances.

Anticorrosion Protection

Anticorrosion is becoming in-creasingly important in medical de-vices, particularly to protect thesmall microelectronic circuit boardsused today in products or implantedin the body such as hearing aids, in-traocular devices, implantable sen-sors and pacemakers.

To protect electronics againstcorrosion, HMDSO coatings are ap-plied in a relatively thick coating of amicron or more. HDMSO is waterand gas repellent – properties thatare required to prevent corrosion. Athin layer (100 nm or so) of PTFE canalso be applied if the HMDSO will beexposed to harsh chemical acids orbases.

Hydrophobic/Hydrophilic Surfaces

For vascular surgical tools andinstruments that may become fouledwith tissue debris or blood, a plasmaenhanced chemical deposition tech-nique can provide a coating thatkeeps the surgeon’s tools cleaner forlonger periods of time.

This is typically accomplishedby applying a hydrophobic (water-re-pellent) coating that repels water orbiological fluids like blood. Whenused on vascular surgical devices,blood and tissue sheets off very easi-ly so that the surgeon can see moreeasily when cutting, for example.

At the other end of the spectrumare hydrophilic (affinity to water) de-vices. Depending on what is required,organic silicones can be used to createsuch surfaces with either polar or dis-persive surface energy. Potential ap-plications include coating polypropy-lene or polystyrene plates with alco-hol or to facilitate protein bonding tothe surface.

Antimicrobial Surfaces

There are many strategies toachieve an anti-microbial surface,which include cell harpoons, amphi-pathic surfaces, antiseptics bound tothe surface, and non-stick coatings.

In a unique application, chemi-cal vapor deposition is being used toembed nanosilver particles in a thinlayer of organic silicone to preventmicrobial adhesion and protectagainst corrosion. Nanosilver, or col-loidal silver, has been known for itsantimicrobial effects from the earliestdays of its use. Using a PECVDprocess, the tiny silver ions can beembedded in a thin layer of silicondioxide to kill any bacteria present.

Fine-Tuning PECVD Application

Despite the flexibility of

PECVD-applied organic silicones, developing theprecise chemistries, added gases and even plasmaequipment design requires a close, collaborativerelationship between medical device designers andequipment manufacturers.

Because MicroVention already had an estab-lished relationship with PVA TePla – several of itsplasma chambers were already being used to aidcoating adhesion – Baldwin began consulting withthem on a project to determine the benefits of coat-ings for stents.

According to Baldwin, plasma equipmentmanufacturers fall into two categories: those thatproduce commercial off-the-shelf products andthose that design and engineer systems to fit theneeds of a specific application in order to resolveunique surface energy challenges.

December, 2016 Page 21www.us- tech.com

Organic Silicone Coatings for Next-Gen Medical DevicesContinued from previous page

Continued on page 23

PVA TePla inline high-capacity PECVD machine.

Page 22 December, 2016www.us- tech.com

The Internet of Things (IoT), In-dustry 4.0 and smart manufac-turing are enabled by obtaining

large amounts of machine data — arevolutionary process which is ex-pected to change the face of the elec-tronics industry in the coming years.Recent technology has made gather-ing data very easy, and the next stepis to make use of the information inreal-time to improve production effi-ciency. Production machinery will nolonger simply create the product, butthe product will communicate withthe machinery and tell it exactlywhat to do. The Industry 4.0 idealconnects embedded system technolo-gies and smart production processesto drastically transform industry andproduction, paving the way for smartfactory development.

IoT techniques and technologiesare not new; the network infrastruc-ture, software protocols and formatsare well-established with excellentdevelopment and diagnostic toolsthat quickly connect and scale sys-tems across the shop floor.

Ideally, all sensors should be in-telligent and collaborate to make amassively intelligent network of de-vices to help companies to build ul-tra-smart manufacturing lines. Thefuture is on its way, but in the mean-time, many in the industry are still

looking at the big data phase of thedigital revolution.

Currently, engineers are notsure how to make the most of data;for example, how data can be ana-lyzed successfully to reduce a ma-chine’s downtime. The development

phase of capturing manufacturingdata needs to occur first, before it canbe employed in the full productionenvironment. One area of applicationis the reflow soldering process. Cur-rent technology typically requiresimmense expertise in thermal dy-

namics and control systems to pro-vide ovens that can successfully sol-der assemblies of all shapes andsizes. Some higher-end ovens alreadyhave data collection capabilities andbespoke systems are being imple-mented that capture chronologicalprocess information. The availabledata are usually taken from the con-trol system feedback sensors whichgive a good indication of process per-formance, but may not be informa-tive enough to provide the level of in-sight required to maximize produc-tion efficiencies.

Improved Oven Data

Real-time oven monitoring sys-tems have been around for decades.One example is the original Solder-star automatic profiling system(APS) introduced in 2005, which in-cluded a single rigid probe fittedalong the fixed conveyor to enablemeasurement of process tempera-tures close to product level. Theprobe technology has evolved overtime, and now a fast-response flexi-ble probe is fitted to both the left andright sides of the process to detectproblems in both single- and dual-lane conveyor systems more quicklyand comprehensively.

The data captured by these newprobes is much more valuable andgives a true reflection of how theprocess is responding to oven loadingor extraction system change. Anotheradvantage of these third-party partymeasurement systems is the abilitynot only to monitor machine parame-ters such as temperature and speed,but to combine this information withreal profile data and predict how thecurrent process is performing in

terms of peak temperature, time, andother process or component parame-ters.

Why is this information useful?Other than ensuring the confidencethat every assembly that comes offthe line is within defined limits, it isuseful for predicting trends in theprocess that are likely to result in areduction of soldering quality or in amachine stoppage. Using SPC andtracking the performance data avail-able from these measurement sys-tems will allow trends to be predict-ed. When combined with improvedmaintenance scheduling, trackingtrends can result in improvements inuptime and yield.

Smart Manufacturing

Traditionally, the main adop -ters of real-time reflow oven monitor-ing systems have been manufactur-ers of medical, safety-critical andmilitary products. Today, the tech-nology is now widely accepted in oth-er industries, especially in high-val-ue sectors like the automotive indus-try, or where high production vol-umes are normal. The drive forsmart, lean and collaborative sys-tems has driven specialist manufac-turers of thermal profiling equip-ment to take machine monitoringplatforms to the next level.

SolderStar’s real-time monitor-ing solution SMARTLine is essential-ly a suite of hardware and softwareproducts that allows electronic manu-facturers to gain real insight into howthe thermal process is performing.

It can be scaled across multiplemanufacturing lines or factories andprovides the networking, data collec-tion and collaboration modules thatenable the oven to be as smart as anyother piece of equipment on the line.Using existing networking protocols,infrastructures and network configu-rations makes deployment simple andensures that the end users are com-fortable with long-term management.

Using data exchange formatssuch as XML also makes thingsmuch simpler from both a develop-ment and integration point of view.Any format can be used, but the web-based techniques championed for IoTare already well-established. Thereare XML processing libraries foreach of the major development lan-guages, many of which are free andmake the reading and writing ofthese formats an easy task for a soft-ware engineer.

Developments Underway

Companies like SolderStar arepushing the development of technolo-gies that will lead to the smart facto-ries of tomorrow. With existingmeasurement technology developedto make the transition, the next stepis to further refine connectivity solu-tions that allow the measurementunits to be networked, gather infor-mation and share it with any othersystem.

The company has answered thecall to bring big data capabilities to

From Machine Monitoring toSmart Manufacturing

A centralized software system gathers machine data and makes decisions to finely tune production.

By Mark Stansfield, SolderStar

Continued on next page

reflow ovens. SolderStar provides da-ta for every assembly that passesdown the line, including zone tem-peratures, speed, barcode, date/time,and soldering profile parameters. Inaddition, its systems offer live infor-mation about what is happening onthe line. The system is two-way,streaming measurement data fromthe oven, and also requesting theSMARTLine system to perform ac-tions on the line — such as driving alight tower or forcing a SMEMA sig-nal to stop the feed of product intothe oven.

In order to show the power thatdata can bring to production, Solder-Star has developed a focused software

tool, SMARTLine — Central. The soft-ware system is web-based and receivesdata from the networked nodes fittedto the ovens and needs little or no con-figuration for each new site. All itemsare automatically created as data be-gins to flow into the system. Informa-tion is stored using SQL and NoSQL toprovide robust and scalable data gath-ering. It can be run on anything froma single board computer to a virtual-ized server, depending on the amountof data.

Groups of specialized sensorsembedded in the production line withlocal decision-making capabilitiesare better suited to the developmentof the smart factory than a centralsystem that makes decisions based

on lower intelligence units. This al-lows for multiple decisions to bemade in real-time at the productionline, and the information gathered isavailable to any system that canmake use of it.

One example is the reduction ofenergy and nitrogen consumption,with its obvious cost savings. By ana-lyzing oven throughput over time,plus integration of data from othersystems, such as oxygen sensors andreal-time power consumption meas-urement, it allows for the data to beused in a way that saves significantexpense. Future development in oventechnology will allow machines to becontrolled more intelligently and re-motely creating a low-cost model for

manufacturing flow. Alternatively, if end users al-

ready have this capability, then inte-gration portals will allow the rawprocess data to be received and ana-lyzed by a third-party system thatuses the data to make informed deci-sions. The future holds the possibili-ty to monitor all machine datathrough technology developed by for-ward-thinking companies, resultingin increased productivity and prof-itability.

Contact: SolderStar LLC, 4500140th Avenue North, Suite 101,Clearwater, FL 33762 % 727-461-2270 fax: 727-538-4237 E-mail: info@solderstar.com Web: www.solderstar.com r

December, 2016 Page 23www.us- tech.com

From Machine Monitoring to Smart ManufacturingContinued from previous page

Companies such as PVA TePlaare often tasked with the latter. Inmany ways, the application of plas-ma to meet unique surface require-ments is the domain of chemists andother scientists. This is reflected inthe accumulation of experts at thecompany, which includes three Ph.D.scientists and surface, polymer,physical, bio and organic chemists, aswell as engineers, plasma physicistsand metallurgists.

When companies present PVATePla with a challenging surfacechemistry problem they are encour-aged to visit the company’s lab in Co-rona, California. This gives them anopportunity to brainstorm with atechnical team and run experimentstogether.

It is during these technical cus-tomer/supplier meetings that manyof the best experimental matricesand ideas are produced. In additionto designing and manufacturing plas-ma systems, the company also servesas a contract manufacturer and hasthe in-house equipment to run partsand conduct experiments, with fullcustomer involvement.

At PVA TePla every system isdesigned to meet the specific require-ments of the application, which caninclude unique fixtures and elec-trodes, and chamber modification toaccommodate throughput and coat-ing uniformity.

With organic silicones, the abili-ty to thoroughly clean the chamberafter each application is a major con-sideration as it coats the entire inte-rior of the chamber (including theelectrodes) in addition to the prod-ucts receiving the coating. As a re-sult, the company modifies the cham-ber to make it more easily cleanableby the end user after every coatingapplication.

Contact: PVA TePla America,Inc., 251 Corporate Terrace, Corona,CA 92879 % 951-371-2500 fax: 951-371-9792 Web: www.pvateplaamerica.com r

Organic SiliconeCoatings forNext-GenMedical DevicesContinued from page 21

Alpha Launches MasterTensioning Frame

ElEctronic Mfg Products

Page 24 www.us- tech.com

ElEctronic Mfg Products

Somerset, NJ — Alpha Assembly So-lutions has launched its tensoRED™Master Tensioning Frame, the latestdevelopment in the company’s state-of-the-art printing stencil frames.The frame has been specially de-signed to provide higher and moreeven tension than the company’s pre-vious tensoRED frame. No air pres-

sure on the frame is necessary, re-sulting in significantly reducedmaintenance costs and improved re-liability.

The even tension across theframe results in less paste smearing,as well as reduced variation and im-proved alignment over volume de-posits when compared with Alpha’s

Tetra Master Frame. The frame re-quires a minimum of one loading sta-tion per customer and is available incommon printer sizes and additionaladapters that configure smallerframe sizes to fit into full 29 in. (73.7cm) printer openings. The frame canbe used with a number of the compa-ny’s stencil products, including

ALPHA® Precision Milled Stencils,ALPHA Cut, ALPHA Nickel Cut, andALPHA Form.

Contact: Alpha Assembly Solu-tions, 300 Atrium Drive, Somerset,NJ 08873 % 908-791-3045 fax: 908-791-2399 E-mail: laurie.kneller@alphaassembly.comWeb: www.alphaassembly.com

tensoRED Master Tensioning Frame.

December, 2016

Acton, MA — CAMI Research has in-troduced a new board for its Cable-Eye cable and harness test systems.Populated with solder pads to acceptboth aligned and staggered, 1.25 and1.5 mm (0.05 and 0.06 in.), surfacemount and through-hole connectors,the board addresses any market with

a demand for board-to-board connec-tions. Rated to 700 VDC and 500VAC, the CB51 may be used on allCableEye models.

The CB51, sold without connec-tors, contains four sets of 60 solderpads to accommodate numerous con-

figurations of surface mount andthrough-hole connectors. There arefour preset locations for automaticdetection and display of any-pin-count connector up to 60 pins. Singlesets may be fitted with any combina-tion of lower-pin-count connectorsthat total 60 or less (e.g. a 40-pin

with a 10-pin). Connectorssoldered in non-preset posi-tions will also appear graph-ically when mapped with op-tional PinMap™ software.Sold as a set of two boards,each test board may bepaired with other CableEyeadapter boards to accommo-date any combination of con-nectors.

The board is designedfor products that may requireHiPot testing and have board-to-board connections, such asbox builds or other containeddevices like AV equipmentand telecom prod ucts. Thecompany’s boards are includ-ed in CableEye’s standard,renewable one-year warranty

of the tester for which it was pur-chased.

Contact: CAMI Research, Inc.,42 Nagog Park, Suite 115, Acton,MA 01720 % 978-266-2655 E-mail: info@camiresearch.com Web: www.camiresearch.com

CAMI Research IntrosCable Test Board

CB51 surface mount and through-holeconnector board.

December, 2016 Page 25www.us- tech.com

Adrian, MI — Wacker is unveiling two new encap-sulation compounds for LEDs. The Lumisil® 740and 770 cure to form highly-transparent siliconeelastomers. Both silicones withstand exceptionallyhigh operating temperatures and strong light radi-ation without yellowing or becoming brittle, mak-ing them useful for high-performance LEDs.

The two-component LED encapsulants cureat room temperature through a platinum-cat-alyzed addition reaction. Typical of polydimethyl-siloxanes, the cured rubber grades have a refrac-tive index of 1.41, including them in the family ofnormal refractive index (NRI) encapsulants.

A special feature of the 740 and 770 is theirextremely high heat, light and thermal shock re-sistance. After 500 hours of storage at 245°C(473°F), Lumisil 740 displayed neither yellowingnor embrittlement. Even after 1,000 hours, thechange in the cured rubber grades was insignifi-cant. The 740 has proven particular-ly resistant to combined heat andlight exposure. In a thermal shocktest from +125 to –45°C (257 to–49°F), both materials are able towithstand more than 1,000 test cy-cles. The encapsulation compoundsthus compensate for the thermo-me-chanical stresses that arise as a re-sult of differing thermal expansionsin the LED materials.

Due to their stability, the new silicones areparticularly suitable for encapsulating LED chipswith strong heat generation and intense light emis-sion. The two grades differ mainly in the hardness

of the cured products. Lumisil 740 cures to form amaterial with a Shore A hardness of 50, while the770 is formulated to be slightly harder at Shore A70. Lumisil 740 is useful for the encapsulation ofmulti-chip LEDs that are applied using the chip-on-board technology — mounted directly onto the print-ed circuit board, tightly packed, without casing. Lu-misil 770, on the other hand, is a good material forencapsulating single-chip LEDs.

The viscosity of the two encapsulation mate-rials has been adjusted so that they can easily beapplied by dispensing. Both materials are self-ad-hesive. They adhere to the semiconductor chip andto conventional reflector and casing substrateswithout pretreatment.

Contact: Wacker Chemical Corp., 3301 SuttonRoad, Adrian, MI 49221 % 888-922-5374 fax: 517-264-8246 E-mail: info.usa@wacker.com Web: www.wacker.com

Wacker Adds to Lumisil Line of Encapsulants

Dispensable NRI LED encapsulant.

Rowley, MA — Mycronic has receivedan order for several MY600 jet print-er systems from a high-volume man-ufacturer based in Asia. The cus-

tomer has several 24-hour produc-tion locations in the region. Thisorder is the third of its kind from thecustomer and delivery is set to takeplace before the end of 2016.

Mycronic offers electronicsmanufacturing equipment includingproduction systems for non-contactapplication of solder paste and othermaterials, robotic mounting systemsfor component placement, automatedstorage systems, and advanced soft-ware for effective process manage-ment. The company’s equipment isused globally in many areas of theelectronics manufacturing industry.Traditionally, the company has fo-cused on offering systems to cus-tomers with low-to-mid volume man-ufacturing where the need for flexi-bility is high. The MY600 was devel-oped to offer the electronics industrya competitive alternative or a com-plement to the traditional stencilprinter. The systems can also be con-figured for high-speed dispensing ofseveral kinds of mounting fluids.

Contact: Mycronic, Inc., 320Newburyport Turnpike, Rowley, MA01969 % 978-948-6919 fax: 978-948-6915 Web: www.mycronic.com

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Page 26 December, 2016www.us- tech.com

Exceeds ANSI/ESD standards for ESD protectionWorking range of –60° to 250° FPermanent ESD properties over life of productHigh load-bearing capacityReinforced composites bring a whole new level of performance to electronics assembly. And the leading name in FRP is MFG. Call us toll-free at (800) 458-6050.

Learn more about Fibrestat at www.mfgtray.com.

The material matters in material handling

Lubbock, TX — X-FAB SiliconFoundries has reached a milestone inits establishment of a semiconductorfoundry that supports 6 in. (152 mm)silicon carbide (SiC) wafer produc-tion. The company, in collab-oration with the U.S. De-partment of Energy (DoE)and the PowerAmerica In-stitute, has deployed a hightemperature implanter at itsfacility in Lubbock, TX.

Leveraging its existing,high-volume silicon produc-tion lines, the company canoffer the economies of scaleneeded to encourage wide-spread adoption of power de-vices based on SiC sub-strates.

As a result it is fully-equipped to present the in-dustry with responsive,market scalable and cost-ef-fective manufacturing capa-bilities. X-FAB’s SiC offeringalso draws on the company’sreputation for tackling challengingapplications. It has been predictedthat the automotive and industrialsectors are going to be responsible fordriving SiC uptake, and the companyis focused on providing key technolo-gies for these areas.

With the installation and quali-fication of the high temperature im-planter, the company is now ready tosupport its SiC customers as theymove from prototyping to volumeproduction in 2017.

X-FAB is an analog, mixed-sig-nal and MEMS foundry group that

manufactures silicon wafers for auto-motive, industrial, consumer, med-ical and other applications. The com-pany offers a commitment to qualitystandards, manufacturing excellence

and innovative solutions by usingmodular CMOS processes in geome-tries ranging from 0.13-1.0 µm andspecial BCD, SOI and MEMSprocesses. The company’s mixed-sig-nal ICs, sensors and MEMS are man-ufactured at six production facilitiesacross Germany, France, Malaysia,and the U.S.

Contact: X-FAB, Inc., 2301 NUniversity Avenue, Lubbock, TX79415 % 806-747-4400 fax: 806-747-3111 E-mail: info@xfab.com Web: www.xfab.com

X-FAB Deploys HighTemperature Implanter

Silicon carbide wafer.

Cypress, CA — Metcal has introduced its USF-1000solder wire feeder, designed to add a new level ofcontrol and convenience to the soldering process.With the ability to integrate easily with the compa-ny’s MX-5200 or MX-500 series solder systems, thesolder wire feeder increases soldering speed whileeliminating wasteful tangles and unspooling.

The MX-5200 series has the option of dual-si-multaneous use, meaning that two handpieces canwork from one power supply at the same time. Thedynamic option enables the two handpieces to share80W of output power based on demand, adding ap-plication flexibility and speed. Four different hand-pieces and a comprehensive range of soldering andrework cartridges support the MX-5200. These in-clude the Metcal Advanced™ handpiece for SMD re-work, a Metcal Ultra-Fine™ hand-piece for fine access, a precisiontweezer capable of removing a rangeof components from 0201 chips to 28mm (1.1 in.) SOICs, and a desolderinggun to safely remove through-holecomponents.

Metcal also offers its Scorpion rework system,a precise machine that addresses the technical de-mands of today’s component manufacturers. Thecompany’s automatic placement package is capa-ble of 50 mm (2 in.) of motorized travel in the z-axis and a full 360° in theta. The automatic place-ment package offers fine motor control in the z-axis and theta during alignment of the componentto the pad. Force feedback control during theplacement process enables the unit to accuratelypick and place components without disturbing thecomponent or solder.

Contact: Metcal, 10800 Valley View Street,Cypress, CA 90630 % 714-799-9910 fax: 714-828-2001 E-mail: jsimmons@metcal.com Web: www.metcal.com

December, 2016 Page 27www.us- tech.com

info@nordsonasymtek.com

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We’ve got a conformal coating solution that fits.Whether you run a small operation or manage an industry

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Northfield, MN — All Flex has com-piled a library of videos as an educa-tional resource for customers, designengineers and electronic techniciansinterested in flexible circuitry.

Unlike rigid printed circuitboards, flexible circuits serve morethan an electrical function within adevice or electronic package and arehighly-customized in their materialselection, mechanical properties andoverall construction.

With the large number of varia-tions in flexible circuit design, OEMengineers struggle to understand allof the options, and how flexible cir-cuits can be used to solve problems ormeet the key requirements of theirelectronic packages.

Despite an established level ofwritten documentation available onflexible circuitry, customers still de-mand one-on-one education on de-sign principles, options to solve prob-lems, and a general knowledge offlexible circuitry. By providing a se-ries of videos, customers can morequickly and easily understand flexcircuits instead of trying to filterthrough design guides to figure outhow to apply the technology to partic-ular requirements.

The industry has lacked “how-to” style videos that communicate di-rectly to engineers about flexible cir-cuit technologies. All Flex engineersand technical experts present the in-formation in the videos rather thanprofessionally skilled speakers. Thisreinforces the company’s commitmentto designers and the engineering com-munity by enabling engineer-to-engi-neer dialog and communication.

Contact: All Flex, Inc., 1705Cannon Lane, Northfield, MN 55057% 877-663-7162 E-mail: jstopperan@allflexinc.com Web: www.allflexinc.com

All FlexCompilesFlexible CircuitVideos

Shingle Springs, CA — PDR Americ-as has introduced an intra-ocular-ad-justable “read zone” thermal sensorfor high-end rework — the PDR Z+Class sensor. The temperature sen-sor has been specifically engineeredto provide the accuracy needed forhigh-yield rework programs.

This upgraded version of PDR’sanalog Z Class sensor is now availablewith embedded digital technology de-signed for 10th order polynomial reso-

lution to provide some of the most ac-curate sensing technology in its class.Accurate to within ±1 percent at250°C (482°F), the rework sensor alsoprovides precise, intra-ocular LEDtargeting of the area to be measured,eliminating independent laser findersthat require merging the detector, thelaser and distance to target.

The Z+ Class thermal sensorsare focusable to measure single pointsurface area targets within a diame-ter range of to 1-12 mm (0.04-0.47in.) without having to account for dis-tance to target calculations. This ver-satility offers accurate in-processcontrol for densely populated PCB re-work tasks involving very smallpackages in addition to QFNs, QFPs,µBGAs, connectors and high spherecount super BGAs.

The sensor technology works byoptically targeting the object to bemeasured through the sensor lens(intra-ocular sighting). A WYSIWYGsensor incorporating a visible LEDpulse emitted from the detectionchip, the LED target, or “read point,”and the area being measured are ofequal proportion. This patented de-sign there fore lends itself to synchro-nous read point adjustment from a 1-12 mm (0.04-0.47 in.) spot size whilekeeping the temperature detectionarea and targeting LED illuminationspot diameter equal. This technologyprovides not only accurate tempera-ture readings but offers the operatora visual target identifier during therework process.

This technology provides notonly accurate temperature readingsbut offers the operator a visual targetidentifier during the rework process.

Contact: PDR Americas, 3869Dividend Drive, Shingle Springs, CA95682 % 530-676-6262 E-mail: sales@pdrxy.com Web: www.pdr-rework.com

Page 28 December, 2016www.us- tech.com

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Duluth, GA — Viscom has installedseveral of its S3088 ultra blue AOI sys-tems in Cirtronics’ facility in Milford,NH. Cirtronics has added one of themachines to each of its productionlines in its 175,000 ft2 manufacturingspace.

After evaluating the S3088 ex-tensively, as well as competitive sys-tems, Cir tron ics found that the Vis-com unit most effectively met itsneeds. The S3088 addresses the grow-ing demand for reliable and easy-to-use 3D AOI technology at an econom-ical price. One orthogonal and fourangled view cameras provide full 3Ddefect detection coverage for compo-nents and solder joints on PCBs. Thealgorithm-based technology that Vis-com provides will deliver greatermeasurement accuracy while inspect-ing components and solder joints,which in turn provides feedback togain tighter process control, optimiz-ing the overall quality for each ofCirtronics’ products.

Cirtronics is a locally-owned andoperated contract manufacturer forelectronics, electro-mechanical assem-blies and box builds for a wide range ofmarkets including med/tech, robotics,communications, aerospace, military,security, industry and others. Cirtron-

ics is an employee-owned company(ESOP) and qualifies for U.S. govern-ment woman-owned and small busi-ness status (WBENC certified WBE &WOSB).

Contact: Viscom Inc., 1775Breckinridge Parkway, Suite 500,Duluth, GA 30096 % 678-966-9835 fax: 678-966-9828 E-mail: info@viscomusa.com Web: www.viscomusa.com and

Cirtronics, 528 Route 13 South, Mil-ford, NH 03055 % 603-249-9190 fax: 603-249-9194 Web: www.cirtronics.com

Viscom Selected as 3D AOISupplier by Cirtronics

A Cirtronics technician using the S3088.

PDR Launches Intra-OcularThermal Sensor for Rework

December, 2016 Page 29www.us- tech.com

Committed to Excellence

For 40 years, Biamp Systems has been manufacturing the best audio hardware for the pro-AV market. Around the world, around the clock, Biamp equipment delivers, manages, and enhances sound; and now it delivers low-latency, 4K net-worked video. Juki helps them do it. Their newest addition of Juki RX-6 placement machines enables Biamp to continue to do what they do best: experiment, tinker, and to make the impossible actually practical.

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Page 30 December, 2016www.us- tech.com

Torrington, CT — Dymax’s Multi-Cure® 9451 black conformal coatinghas received UL V0 flammability cer-tification for materials used in print-ed circuit boards. Formulated for UVand secondary heat cure, the materi-al is used for environmental protec-tion of PCBs, wire harnesses, elec-tronic components, and other sur-faces. Its opaque black color is in-tended to cover marking, labelingand other identification as well assensitive information on the circuitboard, and is targeted at tamper-evi-dent applications.

Tests conducted on a materialunder the UL 94 V0 conditions pro-vide the information necessary forcomparing the relative burning char-acteristics of different materials and

to assess any change in burningcharacteristics prior to, or during,use. By meeting the UL flammabilityrequirements, Dymax can now pro-vide its customers with an added

level of confidence surrounding thequality and functionality of the “trueblack” 9451. This certification com-plements existing testing standardsfor the 9451, which is also RoHS 2-compliant.

Contact: Dymax Corp., 318 In-dustrial Lane, Torrington, CT 06790% 860-482-1010 fax: 860-496-0608E-mail: info@dymax.com Web: www.dymax.com

Bedford, MA — Diversified Technolo-gies, Inc., (DTI) has released a com-pact, solid-state, high-voltage DCpower supply designed to provide ef-ficiency and reliability in a small en-closure.

The DTI 250 kW HVPS seriesswitching mode power supply is afully-integrated solid-state unit thatprovides 15 to 100 kV adjustable out-put with greater than 92 percent effi-ciency and over 100,000 hoursMTBF. This high-voltage power sup-ply is packaged in a 24 x 36 x 74 in.(61 x 91.4 x 188 cm) H cabinet, usestap water for cooling, and eliminatesthe complexity involved with con-necting and controlling multiplesmaller switching power supplies.

With less than 0.1 percent rip-ple and regulation and less than 10joules stored energy depending uponconfiguration, it offers full over-volt-age and over-current protection up to+30 percent or preset to ±0.1 percentmaximum ripple.

Contact: Diversified Technolo-gies, Inc., 35 Wiggins Avenue, Bedford, MA 01730 % 781-275-9444 E-mail: kempkes@divtecs.com Web: www.divtecs.com

Dymax Certifies BlackConformal Coating

DTI ReleasesHigh-VoltagePower Supply

Multi-Cure 9451 protective conformal coating.

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December, 2016 Page 31www.us- tech.com

Canton, GA — Treston (formerlySovella) has introduced a new line ofproducts to its QuickShip program,and has developed an easy-to-use de-sign tool, making it simple to designand order Treston workstations. Re-cently, the company unified its globalbrand under the name Treston inorder to increase internal efficiencyand to provide its products and servic-es with increased speed and flexibility.

The company’s 3D design toolwalks the user through a four-stepprocess of designing a complete work-station for any specific application.

The tool is free to use, requires nosoftware and can be found at the com-pany’s website. The online applicationis used to select various types of work-station frames, sizes, materials, up-right modules, and accessories. Oncethe workstation is designed, the usercan easily request a price quote.

Adding to its QuickShip pro-gram, the company has launched aline of products that includes over 90of its best-selling products that areready to ship in five days. The compa-ny’s TP four-leg bench, LMT lightmotor table, and Concept manualbench are included in the selection, aswell as many accessory options, suchas shelves, lighting, and power. ESDoptions are also available. While offer-ing a large selection of standard prod-ucts aimed at creating customized so-lutions, the company recognizes theneed for quick and easy ordering of itsmost popular items. QuickShip prod-ucts come packaged in a single boxwith easy-to-follow assembly instruc-tions. Assembly instructions can alsobe downloaded from the company’s on-line library.

Contact: Treston (formerlySovella), Inc., 156 Bluffs Court, Canton, GA 30114 % 770-721-7980 E-mail: infousa@sovella.com Web: www.sovella.com

Page 32 December, 2016www.us- tech.com

komaxwire.com

The Mira 230

has a new robust and

sturdy design that supports an extraor-

dinary processing range from AWG 32 to AWG 8. It sets a new benchmark by its unique sequencing capabilities that can be stored in a library for quick reproduction. The Mira 230 can strip and cut inner conductors with a variety of parameters without a program change. It comes equipped with a simple graphical user interface that ensures a quick learning process.

THE NEW BENCHMARK IN WIRE STRIPPING

Oxford, CT — Mirtec has sold one ofits MV-6 OMNI 3D AOI systems toCaltronics, a PCB manufacturingand electronic design company. Thesystem was purchased at the SMTAInternational exhibition in Rose-mont, Illinois.

The MV-6 OMNI is configuredwith the company’s exclusiveOMNI-VISION® 3D inspec-tion system which combines15 MP CoaXPress cameratechnology with a digitalmulti-frequency quad moiré3D system that provides pre-cision inspection of SMT de-vices on finished PCB assem-blies. This proprietary sys-tem yields precise heightmeasurements used to detectlifted component and liftedlead defects as well as to per-form 3D solder fillet inspec-tion post-reflow. When fully-configured, the machine containsfour 10 MP side-view cameras in ad-dition to the 15 MP CoaXPress top-down camera and an eight-phasecolor lighting system.

Along with contract manufactur-ing, Caltronics provides PCB design

and prototyping services through tomanufacturing, testing and logistics.The company specializes in bringingits clients’ ideas from design to fin-ished product. By purchasing theMirtec system, the company can nowverify component placement and sol-der joint integrity on its PCB assem-

blies in three dimensions with thepower of five HD cameras.

Contact: Mirtec Corp., 3 MorseRoad, Oxford, CT 06478 % 203-881-5559 fax: 203-881-3322 E-mail: bdamico@mindspring.com Web: www.mirtecusa.com

Caltronics PurchasesMirtec 3D AOI System

Cal Houdek (left) co-owner of Caltronicsand Brian D’Amico (right) president of

Mirtec Corp.

Treston Adds Workstationsto QuickShip Program

Customizable industrial workstation.

December, 2016 Page 33www.us- tech.com

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LOWERCOSTS

HIGHERQUALITY

Hackensack, NJ — Designed for usein a vacuum, Master Bond’s Master-Sil 973S-LO is an adhesive, sealantand coating that meets NASA low-outgassing requirements. The elec-trically conductive, two-componentsilicone can be used in the aerospace,electronic, opto-electronic and spe-cialty OEM industries.

With a low volume resistivity,the adhesive is a silver-filled com-pound that bonds well to a wide vari-ety of substrates, including metals,composites, glass, ceramics, rubbers,and many types of plastics. As is typ-ical of most silicones, 973S-LO ishighly-flexible with an elongation of50-100 percent. This allows it towithstand thermal cycling and me-chanical shock. The adhesive can beused in temperatures from 120 to400°F (49 to 204°C).

MasterSil 973S-LO demon-strates paste consistency with mini-

mal flow, which allows it to be used asa formed-in-place conductive gasketmaterial. As an addition-cured sili-cone, the material does not require airfor cross-linking. Unlike many sili-cones, it can cure wide cross-sectionsand in depths beyond 1 in. (25.4 mm).This formulation offers a variety ofcure schedules at elevated tempera-

tures, including 25-45 minutes at 250to 300°F (121 to 149°C) or 1-2 hours at160 to 200°F (71 to 93°C).

The material is available in 50g(1.8 oz) syringe kits and additionalsizes can be requested. The materialhas a shelf life of six months at 75°F(24°C) in its original, unopened con-tainers.

Contact: Master Bond, Inc.,154 Hobart Street, Hackensack, NJ07601 % 201-343-8983 fax: 201-343-2132 E-mail: jbrenner@masterbond.com Web: www.masterbond.com

Master Bond’s Silicone MeetsNASA Outgassing Specs

MasterSil 973S-LO low-outgassing adhesive.

Page 34 December, 2016www.us- tech.com

cogiscan.com

THE ENABLING TECHNOLOGY FOR INDUSTRY 4.0

Oakland, CA — EMS provider Digi-com Electronics is now generating itsown nitrogen to use in its hand, se-lective and reflow soldering process-es to strengthen bonds and to im-prove solder adhesion. Adding nitro-gen minimizes device failure andprovides higher levels of PCB integri-ty, especially in mission-critical prod-

ucts for the medical, military, aero-space, and RF wireless industries.

Many major product failures re-sult from a weakness in the solderjoint that connects the wire bond tothe PCB or the solder connecting thedevice or package to the board. Nar-row pitch processes seem to benefit themost and the company cites studiesthat show a 50-60 percent reduction indefects when using nitrogen in the re-flow process. The nitrogen is generat-ed and piped directly to machine in-puts and work areas at a prescribedvolume and pressure to achieve satu-ration of the inert gas and to eliminate

oxidation at critical moments duringthe soldering operation.

Digicom Electronics offers ad-vanced electronics manufacturingwith quality that fits the needs oflarger enterprises while at the sametime providing the benefits and indi-vidual attention needed to servestart-up companies. The company

collaborates with its customers fromdesign to the final, fully-compliantproduct. Material procurement andmanagement services include plan-ning, purchasing, expediting, andwarehousing of components and ma-terials. Digicom has ISO 9001:2008,ISO 13485:2003 medical devicesquality, quality system regulation 21CFR 820, mil-spec 45208, ITAR, andother certifications.

Contact: Digicom Electronics,Inc., 7799 Pardee Lane, Oakland,CA 94621 % 510-639-7003 fax: 510-639-7090 E-mail: info@digicom.orgWeb: www.digicom.com

Digicom Adds Nitrogen

to Soldering and Reflow

Soldering system using nitrogen during reflow.

New Bedford, MA — Cornell Dubilier Electronicshas introduced the latest in its series of Flatpackruggedized flat aluminum electrolytic capacitors,the MLSG. The series of products targets compactpower supply applications in military and aero-space, as well as other critical systems. Design en-hancements and a new electrolyte push the MLSGto nearly double the operating life of its predecessor,at no added cost. Two principal package profiles areoffered in this technology, the MLSG Flatpack,which measures 0.5 in. (1.3 cm) thick and 1.75 in.(4.5 cm) wide, and the MLSG Slimpack, measuring0.5 in. (1.3 cm) thick by 1.0 in. (2.5 cm) wide, bothoffered in length increments of, 1.5, 2.0, 2.5, and 3.0in. (3.8, 5.0, 6.3, and 7.6 cm).

MLSG Flatpack capacitors canbe made to withstand up to 50g vi-brations (10g standard) and operateat altitudes greater than 80,000 ft(24.4 km). With stainless steel casesand near-hermetic welded seals, theyare built for extended duty in harshconditions and a high level of per-formance is maintained over the fulloperating temperature range. Capac-itance retention at –55°C (–67°F) isvery strong, with excellent high tem-perature performance up to +125°C(+257°F). The new electrolyte systemis fully REACH-compliant, allowingthe components to be used in a broadrange of applications where space ef-ficiency and long life are required.

A wide range of standard capac-itance values from 220 to 24,000 µFare available, with voltage ratings upto 250 VDC. The flat package designdoes more than save space; it is easi-

ly cooled, and can offer the flexibility of gangingtwo or more capacitors in ways that conventionalelectrolytic devices cannot.

Device options include high-vibration (HV) towithstand up to 50g and high-reliability (HR), withburn-in at rated voltage and 85°C (185°F). Wherea true glass-to-metal hermetic seal is required,CDE offers the MLSH Slimpack, which is similar-ly constructed in a flat stainless steel package. It isavailable in nine values, from 120 to 3,200 µF,with ratings up to 250 VDC.

Contact: Cornell Dubilier Electronics, Inc.,140 Technology Place, Liberty, SC 29657 % 864-843-2626 fax: 864-843-2402 E-mail: mdipietro@cde.com Web: www.cde.com

CDE Intros Flat Aluminum Electrolytic Capacitors

Flat electrolytic capacitors.

Delaware, OH — Engineered Materi-als Systems has introduced its 640-35 (dam) and 640-46 (fill) dam andfill, UV-cured chip encapsulants forchip-on-board smart card applica-tions. The new materials are de-signed to protect wirebonds and toreduce the stresses associated withthermal cycling. The materials havebeen engineered to withstand circuitboard reliability test criteria.

The chip encapsulants cure rap-idly when exposed to intense UVlight and have been developed for en-capsulating the small chips in smartcard applications where fast process-ing is required. The two materialsare the latest additions to the compa-ny’s extensive line of electronic mate-rials for semiconductor, circuit as-sembly, photovoltaic, printer head,camera module, disk drive, and pho-tonic applications.

Contact: Engineered MaterialsSystems, Inc., 100 Innovation Court,Delaware, OH 43015 % 740-362-4444 fax: 740-362-4433 Web: www.emsadhesives.com

EMS: Damand Fill ChipEncapsulants

Dam and fill encapsulants forsmart card assembly.

December, 2016 Page 35www.us- tech.com

Page 36 December, 2016www.us- tech.com

Kennesaw, GA — Yamaha MotorCorporation has introduced new soft-ware developments for its SMTplacement systems designed to im-prove productivity and simplifymaintenance. These include im-provements in nozzle care, amaintenance monitor, e-Vision,and a new grouping optimization.

The company’s nozzle healthcare checks nozzle health aftercleaning or periodically as deter-mined by the user. The machineexamines the outside of the nozzlefor the presence of dirt or foreignobjects, and checks functionality,including clogging, center correc-tion, and O-ring health. The sys-tem will automatically self-diag-nose nozzle appearance and func-tionality, and replace any faultyor flagged nozzles with spare oneswithout interrupting production.

The new maintenance moni-tor simplifies maintenance by help-ing the operator implement a mainte-nance plan, all guided by a simplemaintenance interface. The mainte-nance monitor stays on top of a num-ber of functions and alerts the opera-tor when periodic maintenance is re-quired. It also displays when futuremaintenance tasks are due, as well asa chronological log of previous com-pleted maintenance actions.

Yamaha’s e-Vision allows oper-ators to fine-tune machine perform-ance, enabling moderately skilledusers (rather than high-level engi-neers) to perform optimization func-tions that include automatic algo-

rithm selection, automated part sizemeasurement and auto part tuning.The optimizations allow the machineto measure part parameters auto-

matically, speeding set up, improv-ing placement performance and min-imizing part dumping.

The new grouping optimizationfeature is a production planner help-ful for the high-mix production envi-ronments typically found in EMS fa-cilities today. The manufacturing en-gineer can use this tool to optimizeplanned production for a shift.

Contact: Yamaha Motor IMAmer ica, Inc., 1270 Chastain Road,Kennesaw, GA 30144 % 770-420-5825 E-mail: info-yima@yamaha-motor.com Web: www.yamaha-motor-im.com

Yamaha Improves Mounting

Platform Software

Z:LEX YSM20W mounting platform with production

optimization software.

ESD-SAFE™ LABELS & TAPES

HELP PROTECT STATIC SENSITIVE DEVICES ANSI/ESD S20.20 COMPLIANT

LABELS & TAPES

Materials for Harsh Environments1.603.352.1415polyonics.com

Tempe, AZ — Versum Materials hasintroduced its GASGUARD® eV tem-perature control system, which hasbeen designed to deliver reliable fab-

wide heat sourcing and control ofelectronic specialty gases that re-quire heating to maintain or increaseflow. It is engineered for the deliveryof gases including NH3, CO2,SiH2Cl2, WF6, SiCl4, BCl3, HF, C4F6,HBr, CH3F or any liquified com-pressed gas used during semiconduc-tor fabrication and the manufactur-ing of TFT-LCDs and photovoltaics.

The temperature control systemcontains the company’s trusted gasdelivery technology with an ECCheater/controller, two blankets andtwo heat traces in a platform thatcan eliminate the time spent specify-ing, installing and commissioningthird-party equipment. The integrat-ed system also allows fabs to scalemanufacturing with the assurancethat the components of the deliverysystem will not need to be upgradedor replaced.

The GASGUARD eV system’snewly redesigned heater blanket hassingle-piece construction for both theheater and insulation, dual voltage(120 or 208-240V supply) and over-

temperature protection reliabilitythrough redundant bimetallic switch-es for a more precise delivery of heat-ed gases to the fabrication tools.

Versum has expanded the mon-itoring and control links between theheater/controller and AP11 con-troller to encompass benchmark gasdelivery control that provides userswith enhanced uptime, simplifiedtroubleshooting and increased con-troller reliability.

The unit also has a single powerfeed (with an optional dual powersource) and integrated GFRI protec-tion to lower installation costs. Evenwith the additional functionality, thesystem has a reduced footprint that re-

sults in more usable floor space in thefab. Available as either a single- ormultiple-source system, the tempera-ture control system has Class 1, Divi-sion 2, ATEX, CE, and CSA approvals,as well as other certifications.

The GASGUARD line of gas de-livery systems includes automatic,semi-automatic and manual configu-rations from single-source to multi-ple-cylinder source and purge sys-tems.

Contact: Versum Materials,Inc., 8555 S River Parkway, Tempe,AZ 85284 % 602-282-1000 E-mail: mike.drabenstott@versummaterials.com Web: www.versummaterials.com

December, 2016 Page 37www.us- tech.com

Under the trade name SEMICOSIL® 961 TC, which o�ers thermal conductivity of 2.0 W/mK, WACKER expands its thermally conductive silicone portfolio by introducing a new gap filler material for electronics and electrical device applications. The constantly increasing demand for heat dissipation between two substrates with high tolerances requires a thermally conductive gap filler material which is easy and cost e�ective to process, durable and e�ectively protects functionality.

These applications include:

• Automotive and transport electronics

• Electric and hybrid electric batteries (cell potting)

• Power electronics

• Consumer electronics

SEMICOSIL® 961 TC is a highly filled, two-part silicone rubber that cures at room temperature via a platinum-catalyzed addition reaction to form a soft silicone elastomer. The cured rubber achieves a thermal conductivity of two watts per meter kelvin (2.0 W/mK) and, at the same time, is electrically insulating.

Before it cures, SEMICOSIL® 961 TC is a non-sag material. However, its viscosity decreases with increased shearing; for example, during mixing and metering. Its shear-thinning properties allow the silicone rubber to be easily dispensed in bead form using standard dosing equipment. The high shear-thinning characteristic also ensures very high dosing accuracy, along with increased dispensing speeds compared to similar products currently in the market.

Notable material features and benefits:

• Cures at room temperature or faster at elevated temperatures

• Faster cycle times

• Low volatile content (<350 ppm)

• UL 94 V-0 rating (WACKER test result)

• Constant properties between -50 °C and +180 °C after cured

• Electrically insulative

• Very good vibration dampening

• High thermal and thermal-shock resistance

• Improved service life of mixing and metering equipment due to low abrasion

SEMICOSIL® 961 TC ensures optimum heat transfer from the electrical circuit to a heat sink. The gap filler material is first applied to the heat sink. The circuit board is then pressed onto the heat sink or fitted by means of a vacuum process. During compression, a continuous film forms that conforms securely to the surfaces of the two adjoining parts. In this way, surface irregularities and tolerances can be perfectly evened out. Furthermore, the film surface area maximizes the contact of the two adjoining parts and thus enhances heat transfer properties.

Thanks to its soft consistency, SEMICOSIL® 961 TC ensures a reliable, tight fit even if there are frequent temperature changes and vibrations. SEMICOSIL® 961 TC can be used over a wide temperature range as its properties remain unchanged between -50 °C and +180 °C. High thermal and thermal-shock resistance and the ability to absorb vibrations are important performance factors for applications in automotive electronics and other sensitive electronic devices.

SEMICOSIL® 961 TC is a two-component system that o�ers nearly identical viscosities for each of the two components to minimize waste often associated with mixing two-component materials with vastly dissimilar viscosities. Despite its high filler loading, it has a comparatively minor abrasive e�ect on the mixing and metering equipment used to apply it. This means there is less abrasive damage to feed pumps, for example, than is usually the case with highly filled silicone rubber. Consequently, significantly longer service lives of mixing and metering equipment and major cost advantages in processing are possible.

The new SEMICOSIL® 961 TC silicone rubber gap filler material contains hardly any volatile components. In terms of fire-safety properties, tests show that the silicone product meets the specifications for classification V-0 as per UL 94 of Underwriters Laboratories.

For further information about SEMICOSIL® 961 TC thermally conductive 2.0 W/mK gap filler material, contact info.usa@wacker.com or phone 888 922 5374 and speak with a WACKER Technical Service Manager. To download a product information sheet: www.wacker.com/semicosil

By Mr. William Russell, WACKER Marketing Manager

ELECTRONICS AND ELECTRICAL DEVICES.

A: Optimized dispensability for faster cycle timesB: Available packaging: pails and cartsC: Processability validated with reputable equipment manufacturers

A

B C

The heat-conducting SEMICOSIL® 961 TC silicone filler from WACKER is applied directly to the heat sink. Once the electrical circuit is pressed on, the gap filler cures to form a soft, cushioning silicone layer that optimally transfers heat to the heat sink.

1 7

Versum Releases Gas Temperature Control System

GASGUARD eV gas temperaturecontrol system.

Waltham, MA — Qioptiq, an Exceli-tas Technologies® company, has in-troduced its Fetura+™ advancedzoom lens. The enhanced Fetura+ en-ables high-speed and reliable opticalperformance in the machine visionand inspection markets.

Useful for high-throughputmicro-inspection, non-contact dimen-sional measurement and general au-tomated imaging applications, thezoom lens is built with a linear railcoupled with precision optics thatallow it to travel through its 12.5:1zoom range in less than one second.Due to its design, the zoom lens alsooffers a service life of over 1,000,000cycles and delivers exacting repeata-bility in any orientation.

The Fetura+ is fully-compatiblewith the company’s Optem FUSIONlens system optics and accessories.The zoom lens can be customizedwith added features or modifiedhousing requirements. With fully-programmable operation, the lenscan be integrated easily as the opti-cal core of a complete, custom imag-ing assembly.

Contact: Excelitas TechnologiesCorp., 200 West Street, Waltham,MA 02451 % 855-382-2677 fax: 781-290-4702 Web: www.excelitas.com

Qioptiq Intros High-SpeedZoom Lens forAutomatedImaging

Fetura+ high-speed zoom lens.

Page 38 December, 2016www.us- tech.com

Test Probes · Test Fixtures

More information about INGUN:www.ingun.us

TEST PROBES: 20.000 VARIANTS IN MORE THAN 400 SERIES

INGUN USA, Inc. | 252 Latitude Lane, Ste 102 | Lake Wylie SC 29710 | USA Phone: +1 (803) 831 1200 | mailbox@ingun.us | www.ingun.us

HIGH-FREQUENCY PROBES: LARGEST SPECTRUM

TEST FIXTURES: FROM STANDARD TO SPECIAL TEST

FIXTURES

email: info@seikausa.com web: seikausa.com

The UC-250M-CV Board Cleaner offers a dual cleaning feature using a combination of a brush roller with the silicone/adhesive cleaning rollers. The combination dual dust removal system assures better results than a single brush or adhesive roller system. The UC-250M-CV has the ability to clean the top surface of PCB even chip components attached on the bottom-side. Additionally, the cleaner features an antistatic bar (ionizer) to neutralize static and prevent dust from collecting on the top surface of the PCB.

The UC-250M-CV Board Cleaner offeers a

Unitech UC-250M-CV Board CleanerWinner of the 2016 NPI Award for Cleaning Equipment!

3528 Torrance Blvd. Suite 100Torrance, CA 90503Main: 310-540-7310Fax: 310-540-7930

26218 Industrial Blvd.Hayward, CA 94545Tel: 510-293-0580Fax: 510-293-0940

1580 Boggs Rd. Suite 900Duluth, GA 30096Main: 770-446-3116Fax: 770-446-3118

Cypress, CA — Techcon Systems, aproduct group of OK International,has launched its TS8100 series posi-tive displacement progressive cavity(PC) pump. The continuous volumet-ric dispense pump is based on PCtechnology and uses a special statorand rotor design to provide consis-tent and accurate dispensing output.The pump can dispense a wide rangeof fluids, from low-viscosity coatingsto high-viscosity greases.

The turning rotor on the TS8100moves the fluid in tightly-sealed cavi-ties through the stator’s fluid cham-bers to create a volumetric fluid flowthat does not change the shape or sizeof the fluid. Accuracy and repeatabili-ty of ±1 percent is possible.

The TS8100 comes standardwith a syringe bracket, mountingbracket kit, luer lock fitting, cleaningkit and dispensing tip selection pack.Typical applications include under-

filling PCBA components, encapsula-tion and potting applications, apply-ing lubrication on automotive parts,and dispensing pastes and flux.

Contact: Techcon Systems,10800 Valley View Street, Cypress,CA 90630 % 714-230-2398 E-mail: jsimmons@okinternational.com Web: www.techconsystems.com

Techcon Launches PositiveDisplacement PC Pump

TS8100 dispensing system.

Cranston, RI — Epoxies, Etc., has de-veloped its 20-1634 lightweight sili-cone potting compound to keep overalldesign weight down. The new com-pound is less than half the weight ofmost commercially available pottingand encapsulating compounds. Thematerial uses advanced micro-balloontechnology fillers with a resulting spe-cific gravity of 0.82. Many filled pot-ting compounds have specific gravitiesof 2.0 or higher. The compound is use-ful for applications that require lowweight, flexibility, high heat resist-ance, and excellent electrical insula-

tion properties. It is formulated with-out solvents or other toxic materials.

Contact: Epoxies, Etc., 21 Star-line Way, Cranston, RI 02921 % 401-946-5564 fax: 401-946-5526 E-mail: sales@epoxies.com Web: www.epoxies.com

Epoxies: Lightweight SiliconePotting Compound

Silicone potting compound.

December, 2016 Page 39www.us- tech.com

www.hammondmfg.com (716) 630-7030

Hammond Manufacturing is a leading sup-plier of enclosures, transformers and datacommu-nications infrastructure with stocking distributors across the globe. Plus with over 10,000 products in stock in our massive distribution center, we have what you need when you need it now.

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Let’s evaluate the convolution of the bill of materials (BOM) with all oftoday’s fragmented processes, each with its own jealously protected soft-ware. A design engineer (DE) receives a project request to design a cir-

cuit. DE opens the schematic capture program and designs the circuit. As partof the design process, the BOM is started. In this BOM is entered a 1k, 1/2Wresistor, designated R1, with a tolerance of 0.5 percent and 25 PPM TC. Thecircuit is run through a simulator and found to deliver the desired perform-ance. The package is then passed to the mechanical designer. Initial BOMcolumns include quantity, description, value, tolerance, temperature coeffi-cient, and reference designator.

The mechanical designer produces a 3D model of the PCB with dimensionsin Solidworks that shows a location for a component with dimensions of 120 x60 mils (3.0 x 1.5 mm). The package is then passed to the CAD designer.

The CAD designer imports the schematic and the model into his programand then chooses a 1206 package for the resistor to match the size provided inthe model. The designer goes to the web and downloads a .stp file for thispackage. The designer then creates a PCB layout by merging the physical lo-cation with the logical part in accordance with the net list. The package isthen passed to the component engineer. Additional data columns not in theBOM: package, x/y location, and rotation.

The component engineer (CE) takes the BOM and goes to the standardparts list to assign a physical part to the logical part, R1. The CE discoversthey do not have a standard part with these characteristics, so a new partmust be created in the part master of the manufacturing system software. TheBOM is then sent to the PCB engineer. Additional BOM columns: manufac-turer, manufacturer’s part number, and approved alternates.

The PCB engineer is not familiar with this particular application, andmust hold a meeting to determine which standards are required. There is noprecedent, so the PCB engineercopies and pastes PCB notes for a“wellhead” application. The engi-neer then amends the BOM withthe description of the PCB andpasses the package to documentcontrol. No additional columnsare required.

Document control requestsGerber files from the CAD design-er and then assigns part numbersto the reference designators in the BOM. The solid model, the Gerber file andthe BOM are now “controlled” in the manufacturing software.

The BOM is sent to the strategic ops manager to determine which of theglobal sourcing directors are needed to negotiate the pricing for the PCB andthe resistor. Two are needed because PCBs usually have a unique commoditycode. The BOM is imported into the ERP software which only accepts the at-tributes of quantity, price, description, manufacturer, manufacturer’s partnumber, and alternates, with the rest of the engineering data often omitted.Once the price negotiations are complete, orders are placed, and documentcontrol is instructed to provide the PCB specifications to the winning fabrica-tor. Following the resolution of all EQs, the single resistor and the PCB arereceived, inspected, and inventoried.

The strategic ops manager now directs global sourcing to select a con-tract manufacturer with the right technical capabilities. The parts kit ispulled from inventory and shipped to the supplier. The CM receives a copy ofthe BOM from the ERP system, but (since the kit was provided) much of thepurchasing data is not relevant. The data columns needed by the CM are inthe original CAD design package, which is stored in the customer’s manufac-turing system. The CM’s CAM engineer is put in contact with the customer’sdocument control. It is determined that document control has a BOM with ref-erence designator, value and tolerance, but does not have the CAD file con-taining the package, x/y location, and rotation that are needed for program-ming an SMT machine. These must be procured from design engineering.

It is also determined that document control does not have the stencil filefrom the PCB vendor as it was not requested by global sourcing. The CM nowbecomes the “integrator” requesting the data they need from each of thegroups within the OEM and dealing with the various software packages usedby each department. To be successful, the CM must assemble a BOM that hasall the columns required to build the product by merging the design and CADBOMs with the manufacturing and ERP BOMs.

This satiric convolution of the BOM is created by the use of specific soft-ware systems within each operating department and exacerbated by the ab-sence of a high level integration system that can deal with disparate softwaresystems and their unique extracts. The simplicity of a single engineer manag-ing an entire project is lost in this compartmentalization of product data. Theirony is that an outside resource, the CM, now emulates that simplicity by act-ing as the “de facto” single engineer.

Contact: DIVSYS International, LLC, 8110 Zionsville Road, Indianapolis, IN 46268 % 317-405-9427 E-mail: sales@divsys.com Web: www.divsys.com r

Convolution of the BOM: HowMuch Could a Resistor Cost?

Production

By Stanley L. Bentley, P.E., Senior Technical Advisor, DIVSYS International

Convolution of the BOM is createdby the use of specific software systems within each operating

department and exacerbated by theabsence of a high level integration

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www.xjtag.comAdvertorial

Cadencewww.xjtag.com XJTAG Technology Partner

Engineers now need to be ableto determine at the schematic stagehow they can best implement Flashprogramming, JTAG debugging andboundary scan testing. With OrCADCapture users now have access toXJTAG DFT Assistant to help checkthat JTAG chains on the board aresetup correctly and ready tosupport testing, debugging andprogramming. By eliminating errorsand helping ensure the JTAG chainis used to its full potential, DFTAssistant helps boost test coverageand ensures that prototype boardscan be tested and programmed withboundary scan as soon as they arereceived back from assembly.

Verifying designs at the schematicstage delivers advantages from thebeginning of the product lifecycle. Itcan help check for errors before anyhardware is built. The extra effort reallystarts to show its value when thefirst prototype boards are producedenabling connection tests to be done inminutes whereas manual probing cantake hours to locate shorts or opensif the board will not start up. Havinga working JTAG capability early in thedebug stage will enable accelerateboard bring up and enable firmwareprogramming and CPU debuggingas well as boundary scan testing.

“We saw that our customerscould benefit from direct integrationof JTAG in OrCAD Capture,”comments Kishore Karnane, DirectorProduct Management, CadenceOrCAD Solutions. “XJTAG was theideal partner to help us achieve this,bringing their specialist knowledgeand their expertise in testabilityissues and design.”

The result of this collaboration,XJTAG DFT Assistant for OrCADCapture, consists of the XJTAGChain Checker and XJTAG Access

Viewer. XJTAG Chain Checkeridentifies common design issuessuch as connection errors in theJTAG chain design or incorrecttermination of signals at TestAccess Ports (TAPs). A singlemistake in this area of the productdesign could prevent the chainfrom working, so it is vital thatchecks are done before the PCB is produced.

XJTAG Access Viewer helpsengineers assess the testability oftheir design, and identify wherecoverage could be improved, bydisplaying the extent of JTAGaccess as an overlay on theschematic diagram. A helpfulselection tool enables engineers toanalyze specific areas of interesteasily by displaying the test accessto nets (read, write, power/ground

or no access) individually or ingroups by selecting them usingcheckboxes. The nets are colorcoded by their JTAG access to aid inspection.

Kishore Karnane sums up,“XJTAG DFT Assistant enables usto deliver even greater value for ourcustomers by providing powerfultestability analysis. The deepunderstanding of JTAG / boundaryscan and design automation, byXJTAG, has ensured a high-qualitysolution that enables users of OrCADCapture to create even better productsmore quickly and efficiently.”

Cadence products are distributedby FlowCAD in Germany, Austria,Switzerland, Poland, Czech Republic,Slovakia, Hungary, Romania, Bulgariaand South Africa. www.FlowCAD.com

“Wir müssen frühzeitig in der Designphase feststellen, wie dieTestabdeckung mit der minimalen Anzahl von Testpunkten maximiertwerden kann. Daher ist es entscheidend, zu wissen, welchen JTAG-Zugangin der schematischen Phase zur Verfügung steht. Der XJTAG DFT-Assistentfür OrCAD Capture erleichtert es uns, die Testabdeckung bei der Entwicklungdes Designs vorauszusehen. So können wir unsere Tests optimieren, bevordie Leiterplatte hergestellt wird.”“We need to determine early in the design phase how to maximize test

coverage using the minimum number of test points. So it is vital to knowwhat JTAG access is available at the schematic stage. The XJTAG DFTAssistant for OrCAD Capture makes it easy for us to see the test coverageas the design evolves and this allows us to optimize our testing before thePCB is produced.”

OrCAD Capture has a multitude of features that help engineersmanage their PCB designs efficiently, from initial schematic entrythrough design analysis and rule checking, layout optimisation,component selection and BOM management. Tools such asautomated wiring accelerate laborious processes, viewers withcolor coding help inspect nets and navigate connection hierarchies,and database and search tools help streamline component selection.

“Developed by XJTAG, the software for OrCAD Capture will significantly increase the Design for Test andDebug capabilities of the schematic capture and PCB design system.”

Company Cadence Design SystemsHQ USA

Nature of Leading provider of electronic business design automation (EDA) tools,

software, IP and servicesMain Broad portfolio of tools for theproducts design and verification of chips,

packages, boards, entire systemsCustomers Global electronic design communityFounded 1988Employees 6700+ worldwideRevenues US $1.7 billionLocations San Jose, California, USA

Offices worldwideWeb site www.cadence.com

opinion Urs AllemannDirector Design Services ed electronic design agSwitzerland

New XJTAG® DFT Assistanttool for OrCAD® Capture

Free, easy-to-use ‘Design for Test’ plugin so you can catch errors before layout and avoid costly re-spins

DataBank

December, 2016www.us- tech.comPage 42

The migration of data from iso-lated networks to the cloud iscompletely changing the way

businesses operate and gather infor-mation about their products and cus-tomers.

With recent advances made inthe areas of big data and analytics,and in pure computing power, com-panies can now gather and leveragemassive amounts of data, and enjoyunparalleled access to that informa-tion on a global scale.

As part of its broad “Mobility ForTomorrow” strategy, Schaeffler, anautomotive and industrial supplier,has partnered with IBM to create theSchaeffler Cloud, a digital platformfor processing large amounts of data.

The company expects that thecloud will provide enough valuable

insights to improve its operationssignificantly.

Digital Ecosystem

IBM is providing the technologyand acting as a consultant in the de-velopment of a digital ecosystem tosupport Schaeffler in the integrationof its mechatronic components, sys-tems and machines into the rapidlyexpanding world of the Internet ofThings (IoT). The two companies arealso working together to create mar-ket-ready services based on the newdigital platform. The open digital en-vironment is designed to make inter-acting with customers as smooth aspossible.

“Our aim is to connect data fromacross products and processes,” saysPeter Gutzmer, deputy CEO and CTO

of Schaeffler AG. “Using analytics weturn this primary data into valuableinsight which is used to increase theefficiency of our operations and devel-op innovative services for our cus-tomers.”

“We are concentrating on ex-panding the integration of sensorsinto our existing products, as well asdeveloping new products with inte-grated cognitive software,” com-ments Gerhard Baum, Schaeffler’schief digital officer. “Not only will themachines and transport infrastruc-ture within the production environ-ment be connected, but individualplants will also be linked to thewhole supply chain. We want to digi-tally optimize processes and proce-dures as well as create new service-oriented processes, driving the digi-tal interaction between people andIT systems.”

“The joint implementation ofSchaeffler’s digital agenda is theperfect fit to leverage and promoteour new cognitive IoT capabilitiesfor the manufacturing sector,” saysIvo Koerner, board member sales,IBM Germany. The base will be aglobal, hybrid cloud infrastructureusing IBM’s application platform“Bluemix” with Watson IoT to createdifferentiating applications and mo-bile apps for the IoT.

Schaeffler’s components, suchas bearings or clutch release sys-tems, are used in machines and vehi-cles and produce critical informationabout condition and movement. Thecompany has invested heavily in re-search and development in recentyears and has incorporated sensors,actuators and control units with em-bedded software into its products.The parts are then able to collect andprocess valuable data on the condi-tion of a machine and then convertthe data into added-value services.

Goals of the Partnership

During the first phase of thepartnership, Schaeffler and IBM havedeveloped specific goals including:

Wind Energy Sector Mainte-nance. Schaeffler produces some ofthe huge bearings that allow turbinesto spin freely. Replacing these bear-ings is complicated and expensive,and also results in downtime and lostenergy. IBM and Schaeffler are ex-ploring how machine learning can re-veal additional insights about the per-formance of equipment in differentoperating conditions. Sensors in theequipment, and in the bearings them-selves, will report on the actual condi-tion of the components in real-time. Inaddition, using weather forecastsfrom IBM’s subsidiary the WeatherCompany, turbine operators will be

able to plan ahead and replace partsduring less windy periods.

Digitized Train Monitoring. Withdecades of experience in the railwaysector, Schaeffler works closely withrail manufacturers and operators toprovide bearings and other parts for

use in passenger trains and freightvehicles. Using insights from thecloud, the company will be able to en-hance its predictive maintenancesystems for railways, improving bothefficiency and safety. Smart bearingswill be able to measure their own vi-bration, temperature, torque, andspeed, triggering alerts and inform-ing railway operators about possiblesafety issues.

Industry 4.0 Tooling Machines.IBM’s technology will support Scha-effler’s Industry 4.0 strategy for tool-ing machines, helping to improveoverall equipment efficiency (OEE).This includes the optimization of pro-duction processes, real-time analysisof data and context-driven mainte-nance, along with the networkingand optimization of multiple ma-chines within a production line. Theobjective is to continuously refineproduction and the supply chain.

Connected Equipment Opera-tions Center. The company is nowable to monitor the condition of thou-sands of machines and pieces ofequipment remotely. This data istransmitted to an operations centerand stored in the Schaeffler Cloud.The information is processed algorith-mically to help make predictionsabout machine performance and tocreate opportunities for optimization.Irregularities and potential faults areautomatically identified, allowingquick corrective action to be taken.

Connected Vehicles. The companyalso develops and manufacturesproducts for engine, transmissionand chassis applications. New tech-nologies are allowing the company toextend the functionality and lifespanof automotive components. Real-timeanalytics and cognitive systems areturning data from systems and com-ponents into valuable informationused by manufacturers to increasethe reliability of their vehicles.

Contact: Schaeffler Group USA,Inc., 208 Springhill Farm Road, Fort Mill, SC 29715 % 803-548-8500 E-mail: info.us@schaeffler.com Web: www.schaeffler.ca r

PartneringPartnering

Schaeffler Partners with IBM to Create Cloud-Based Platform

By Gerhard Baum, Chief Digital Officer, Schaeffler and Juergen Henn, Executive Partner, IBM Global Business Services

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Page 44 December, 2016www.us- tech.com

Distribution

Mouser Showcases 3D-Printed Self-Driving Vehicle with DroneMansfield, TX — Mouser Electronics, along with Local Motors and celebrity en-gineer Grant Imahara have developed the final build of a transformative 3D-printed vehicle with drone launching technology. The Mouser version of theLocal Motors Strati is the latest project from the company’s popular Empower-ing Innovation Together™ program. The vehicle has been designed with “flymode,” which makes use of a drone mounted on the rear of the vehicle that canbe launched to give the driver and passenger an unprecedented birds-eye viewof the surroundings. Both can watch the drone’s footage on dash-mounted view-ing screens, providing a 360° perspective from the air. Joining Imahara for thefirst official test drive was the winner of the Essence of Autonomy design con-test, Finn Yonkers, whose design was the inspiration for this unique project.The Empowering Innovation Together project’s overall aim is to explore the fas-cinating options available once self-driving vehicles become the norm.

Contact: Mouser Electronics, 1000 N Main Street, Mansfield, TX 76063% 817-804-3888 E-mail: sales@mouser.com Web: www.mouser.com

Juki Distributing Scienscope X-ray Component CounterMorrisville, NC — Juki Automation Systems (JAS) has signed an agreementwith Scienscope International to distribute the AXI5100c inline X-ray compo-nent counter as the company’s exclusive supplier in the Americas. The twocompanies have seen a positive response to the partnership since the recentSMTA International exhibition. In addition to counting reeled components,the AXI5100c also can count components in ESD bags, storage sticks andtrays. The AXI5100c is a fully-automated inline system that can handle theloading and unloading of components using various conveyors, loaders/un-loaders and even robots. A key advantage of the inline counter is the abilityto communicate directly with Juki ISM component storage towers offeringcomplete and confident automation of component inventory.

Contact: Juki Automation Systems, Inc., 507 Airport Boulevard, Morrisville, NC 27560 % 919-460-0111 E-mail: gryden@jas-smt.com Web: www.jukiamericas.com

Avnet Releases Zynq Transceiver Evaluation Kit GloballyPhoenix, AZ — Global technology distributor Avnet has released its Zynq trans-ceiver evaluation kit, a low-cost reference design that streamlines evaluation ofXilinx® Zynq®-7000 all-programmable SoC systems. These systems are basedon the PicoZed™ family of system-on-modules (SOMs) for solutions that requiretransmission of large amounts of data at high communication rates or over longdistances. The kit, which targets applications in markets including medical, se-curity, embedded computing, and industrial automation, is available to cus-tomers in the Americas, Europe, the Middle East, and Asia. No startup fees arerequired for evaluation and development. The transceiver evaluation kit con-tains the PicoZed 7015 SOM, which includes four high-speed serial transceiverlanes. The kit also includes fully-tested cables and adapters.

Contact: Avnet, Inc., 2211 S 47th Street, Phoenix, AZ 85034 % 480-643-2000 Web: www. avnet.com

PDR Appoints Rep LM Instruments for Mid-AtlanticShingle Springs, CA — PDR Americas, has appointed manufacturer’s rep com-pany LM Instruments to represent PDR throughout Delaware, Maryland, Vir-ginia, and West Virginia. The manufacturer’s representative specializes in theautomation and instrumentation industries. PDR cites the LM team’s profes-sionalism and reputation for putting the interest of customers first as reasons forthe appointment. LM’s engineers have improved the processes of its customersfor more than 30 years. PDR provides rework systems at the forefront of reworktechnology by providing air-nozzle-free systems with advanced in-process controlfeatures and visible light designed to take the guesswork out of rework.

Contact: PDR Americas, 3869 Dividend Drive, Shingle Springs, CA95682 % 530-676-6262 E-mail: sales@pdrxy.com Web: www.pdr-rework.com

FRAMOS, Vitec, WPG Create Distributor ViMOSOttawa, Ontario, Canada — Imaging specialist FRAMOS, electronics distrib-utor Vitec and semiconductor distributor WPG have created the joint ventureViMOS technologies GmbH, a high-tech distributor to serve clients across Eu-rope. The new distributor will have its headquarters in Munich, Germany,and focus mainly on large customers in the automotive and medical markets.Semiconductor customers will benefit from a price-to-quality ratio that comesfrom Asian market access, European support and quality assurance. ViMOSprovides sales, in-depth technical solutions support, marketing, and qualitystandards to ensure smooth design and production processes. FRAMOSclients in the imaging and machine vision sectors benefit from access to high-end semiconductor products and networking synergies.

Contact: FRAMOS Technologies, Inc., 57 Auriga Drive, Suite 223, Ot-tawa, Ontario, Canada K2E 8B2 % 613-208-1082 E-mail: info@framos.comWeb: www.framos.com

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See at electronica, Hall A1, Stand 470

To give electronic devices the longest possibleoperational lifespan, conformal coating wasdeveloped to protect components, and ensures

that today’s electronics function properly in a vari-ety of harsh conditions. Despite the unrelentingminiaturization of components, a suitable coatingapplication method is required to continue keepingPCBs safe from moisture, dust, vibration, and otherambient influences. During the development of aPCB layout. A frequently overlooked factor is thatapplication-specific system limits also apply to thecoating process. If this is not taken into considera-tion early on in the development process, selectivecoating can become a significant challenge.

As a result, complex PCBs may have to bemasked through a time-consuming manual processor complete PCBs may need to be sent out to anexternal coating supplier in spite of an existing,automated in-house coating system. RehmThermal Systems designed its Protecto coatingsystem in cooperation with KC-Produkte GmbH toprovide conformal coating without additional out-sourcing expense. The highly-flexible customer-specific layout and its various application methodsallow it to be used with many different types ofPCBs. The company also offers individualized sys-tems with up to four different application methodsfor specific requirements.

Targeted Prep and Planning

Before the protective coating is actuallyapplied, numerous factors must taken intoaccount. The conditions that the boards will besubjected to should be evaluated, including ambi-

ent temperature, temperature fluctuation, UVradiation, atmospheric humidity, dust, and vibra-tion. Among other things, which areas of the PCBit will be absolutely necessary to cover with theprotective coating need to be specified, as well aswhich areas must not be coated under any circum-stances. Plugs, terminals, test contacts and groundpads may not be coated as a rule, because wettingthem with the coating may lead to malfunction of

the entire board.Depending on the application method, the lay-

out should include a minimum clearance betweenthe areas to be coated and the areas to be leftuncoated, because inadvertent application of thecoating within the specified exclusion area mightoccur. Due to the capillary effect, even an extremely

small contact surface between the protective coatingand a plug housing, for example, is enough to resultin complete wetting of the periphery and the pins,which results in functional failure.

Choosing Materials

Factors that determine the choice of coatingmaterial include viscosity, environmental consider-ations such as evaporating VOC regulations, andthe availability of the right dispensing equipment.Drying ovens that use IR radiators, convection orUV radiation restrict the selection of possible pro-tective coatings because of the drying process itself.Above all, however, the application methods of thecoating system dictate which materials are best.

Rehm designed its Protecto system to beadapted as flexibly as possible in various manufac-turing environments. The basic model with oneapplicator is an entry-level system to get startedwith conformal coating. However, with up to fourdifferent applicators equipped simultaneously, thesystem can be used to coat several PCBs at thesame time or to use up to four separate materialswithout requiring any changeover time.

A diverse range of applicators and nozzles forthe coating process is available. As with the choiceof coating system, the process and materials dic-tate the types of applicators. Diaphragm valves arewell-suited for more aggressive media. Needlevalves are rugged and have minimal dead space.Atomizer valves are preferred for coating largesurfaces. Piston valves are especially useful forhighly-viscous dam materials. Eccentric wormgear valves ensure high levels of volumetric repro-

ducibility and the curtain nozzle can coat largesurface areas quickly and with little spatter.

The jetting valve is highly versatile. In combi-nation with the patented StreamCoat® nozzle, itoffers the user a very broad range of applications.It’s also the only extremely narrow nozzle offeredby Rehm. With an outside diameter of just 2.5 mm(0.1 in.), the nozzle is capable of advancing deepinto highly-populated areas with tall componentsand tight spaces.

Types of Application

Diaphragm valves belong to a generic productgroup including time/pressure-controlled valves.Where the coating of electronic PCBs is concerned,diaphragm applicators are used mainly to applyvarious dam materials and to encapsulate smallcomponents. During dam material application, thedistance from the dispensing needle to the surfaceof the component must be selected correctly. If thedistance is too small, the nozzle might sink intothe freshly-applied material causing it to becomesmeared when the nozzle is removed. An exces-sively large distance is also unfavorable because itcan result in uncontrolled application of the dammaterial. In particular where travel around acurved contour is involved, the results may deviatesignificantly from the planned coating application.

Also, the speed of the axis system must bematched to material pressure and quantity. If theaxis system moves too fast, material flow is inter-rupted at the applicator and the dam will havegaps. Typical process speeds are within a range of10-100 mm/s (0.4-3.9 in./s). By varying materialpressure and selecting the right material needle,the quantity of applied material, and thus the

thickness of the dam, can be varied easily. Typicalapplications for diaphragm valves are in the low-to medium-viscosity range. Rehm offers a specialmaterial needle for these types of valves, which

Using Conformal Coating to ProtectSensitive ElectronicsBy Manuel Schwarzenbolz, Product Manager, Rehm Thermal Systems

Rehm’s StreamCoat nozzle reaching betweentall components.

Continued on page 52

Page 46 December, 2016www.us- tech.com

Customized coating system with room forfour applicators.

PCB with applied protective coating.

December, 2016 Page 47www.us- tech.com

Having worked within an established compa-ny in the world of PCB assembly testing formany years we still come across companies

(OEMs) who will tell us, “We don’t need to test,because we demand that the contract manufactur-er (CM) only send us 100 percent working boards.”But, demanding and receiving are two differentmatters. No one can totally accomplish this, andeven if they could, what does it actually cost?There’s an old saying in the engineering industry:“If it hasn’t been tested, then it doesn’t work” —

rather, you should assume it doesn’t work. Mostpeople however assume the opposite, and that iswhere the problems start.

But Testing’s Not My Problem

An OEM might not know or careif its boards are being tested or not,but it should. For example, the CMmight only perform a cursory func-tional test using some type of hotmock-up, which may only power upthe board and see if it appears to beworking correctly. If the board failsthis test, it is cast aside and anotheris built to replace it until the order iscomplete. Depending on the CM’sprocess quality and yield, any num-ber of boards could be hitting the“bone pile,” leaving the OEM withsignificant extra expense. However,if it costs less to diagnose and fix aboard rather than to create an entire-ly new one, then of course it makessense to test more vigorously.

The degree and type of testing isimportant to consider. A simple designlike a flashlight can be tested by turn-ing it on and off. To extend this test itcould be turned on and off many timesto check the integrity of the principalmoving component — the switch. Thisis known as a functional test. Other

types of testing include structural test-ing, which breaks down the testprocess to check the smallest elementsof the design. In a flashlight, this couldbe the continuity of the conductors tothe switch, the switch isolation andclosed resistance, the voltage of thebatteries, and bulb impedance. Thisapproach to testing gives a much moreprecise reason for device failure.

The decision to test must bebased on hard facts and knowledge ofthe manufacturing process. Both theOEM and CM must discuss design fortest (DFT), fault coverage, diagnosticsresolution (test system performance),and other factors before determiningthe most effective test method. Mostgood test systems will now provide afault coverage assessment figure, but

how that information is derived should be consid-ered. Independent fault coverage assessment sys-tems are also available that can take inputs from a

variety of test systems and aggregate the results.These require a great deal of understanding andmaintenance and are generally suited to largeorganizations with a dedicated DFT staff.

Determining Test Strategy

When defining the optimal test system, besure to ask the following questions:

l What is the maximum size of the unit under test (UUT)?

l Are the boards mainly analog or digital?l Do the boards support JTAG/boundary scan?l Are there any unusual aspects to test, e.g. RF

or high-voltage?

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Page 48 December, 2016www.us- tech.com

Using Self-Configuring Sensors forMachine Condition Monitoring

Condition monitoring that requires sensors isquickly becoming an imperative throughoutmany industries. New digital signal condi-

tioner technology is available that simplifies theuse of eddy current (inductive) displacement sen-sors for high-precision and high-reliability applica-tions. This technology is useful for monitoringmovement, position, vibration, alignment, ordeflection, especially where parts operate in hightemperatures or environmental contaminants.Unlike previous versions that required circuitmodifications and manual calibration to match therequired target, sensor, cable length, and range,

the new digital signal conditioners configure them-selves in a matter of minutes. In addition, the tech-nology works with a wide variety of sensors.

High-Performance Sensing

Many sensor options are available for machinecondition monitoring, including inductive technolo-gy, linear variable differential transformers(LVDTs), laser triangulation, capacitive, and ultra-

sonic systems, as well air gauging, Hall effect, andoptical systems. Each technology has distinctadvantages and disadvantages, depending on theapplication.

Eddy current sensors are generally muchmore insensitive to environmental contaminantsthan other options. They operate on the principleof impedance variation caused by eddy currentsinduced in a conductive target by a sensor coil. Thesensor coil is excited by a high-frequency oscillator,which generates an electromagnetic field that cou-ples with the target. Signal conditioning electron-ics sense impedance variation as the gap betweensensor and target changes and translates it into ausable displacement signal. This technology pro-vides extremely high resolution.

Eddy current sensors can “see through” non-conductive materials, making these sensors usefulin such applications as paint, rubber, and paperthickness. They can also be a good option for oper-ation over a wide variety of temperatures and inmany environments, including dust, oil, gas, dieselfuel, liquid oxygen, and rocket fuel.

Inductive technology is used for many high-performance sensor applications, especially thoseneeding high frequency responses in challengingenvironments and temperatures. They allow oper-ators to monitor a machine and determine when ithas to be taken offline for maintenance.Conversely, the sensor may indicate that themachine is running well, so maintenance is not yetrequired. If, for example, the machine in questionis a critical pump operating in an inaccessible loca-tion, precise information on machine condition canbe critical to a company’s bottom line.

High precision inductive sensors can also beused to monitor or control the quality of a process.

The sensors provide a real time control signal tothe machine or a display to the operators so theycan adjust machine performance.

Self-Configuring Inductive SignalConditioners

Previous signal conditioner technologyrequired hardware or software configuration toaccommodate different sensors, target materials,

cable lengths, and range. This was costly and timeconsuming to set up. New digital signal processors,including the digiVIT from Kaman, simplify the useof eddy current sensors for high-performance appli-cations. Calibration is performed by menu optionsand pushbuttons on the front panel as opposed toadjustment of analog potentiometers.

By Will Meenan, Kaman Precision Products

Inductive/eddy current technology sensors induce current flow in a target

without contact.

Continued on page 53

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Before plastic-packaged ICs and other compo-nent types are mounted on a board, they arefrequently inspected by a variety of methods

including acoustic micro imaging tools to ensurequality. Ultrasound is able to reveal structuraldefects in ICs, flip chips, ceramic chip capacitorsand other components whose materials and geom-etry (typically, with at least one flat surface) makeacoustic imaging possible.

Acoustic imaging is usually carried out on prod-ucts for military, aerospace, medical and high-endconsumer applications. Imaging systems such asthose found in Sonoscan’s C-SAM® series image andanalyze internal structural defects so that theoffending components can be removedfrom production.

Pre-screening acoustic imaging,usually in large quantities of a singlecomponent type, finds the delamina-tions and other gap-type defects thatform during component fabricationor handling. Internal gaps in compo-nents present two dangers: they mayexpand through thermal cycling andmechanical shock until they break aconnection, and they are natural col-lection points for water and otherchemicals that percolate into pack-ages, where they form corrosive cellsthat may break connections.

Spotting Trouble

Occasionally, defects can occurafter acoustic screening. The firsthint of trouble may come when anunusually large number of boardsfail electrical tests. If optical, visualinspection of the board and of thecomponents shows no obvious cause,the mounted components can beinspected again acoustically. Theassumption is that something wentwrong between initial acousticinspection and end-of-line electricaltesting. In the past, the culprit wasoften local overheating duringreflow, but today, the defects aremore likely to also be caused byimproper handling. One possibility isthat the auto placement/insertionmay have damaged the components.In some failures, the problem is sim-ply that no acoustic inspection wasperformed before mounting.

Scanning a populated board dif-fers substantially from scanning aJEDEC-style tray of loose compo-nents. In a tray, all parts are identicaland on the same plane. The ultra-sound-pulsing transducer can remainat the same height throughout thescan. On a board, however, the com-ponents and other structures havevarying heights. Gating of the returnechoes may also differ. In a tray, theuser may gate on (accept for imaging)only those echoes from material inter-faces within a depth of interest — theinterface between the mold compoundand the die face, for example, in apackage type that has a history ofdefects at that interface. But in scan-ning a populated board, gates arelikely to be wider to encompass com-ponents of different thicknesses.

Acoustic Imaging

When a pulse of ultrasoundleaves the transducer, it does its workin a few millionths of a second. Itenters the layer of water that couplesthe transducer to the sample; at thiswater-to-solid interface, a portion ofthe ultrasound is reflected back to thetransducer and a portion crosses theinterface into the mold compound (touse a plastic-packaged IC as an exam-ple). As the ultrasound passes through

the mold compound, it is absorbed to some degree,but there are no large material interfaces. The moldcompound also sends back smaller echoes from par-ticles and voids in the material, and these echoes arethen used to help characterize the mold material.

As the ultrasonic pulse approaches the dieface, one of two things may happen. First, if at agiven x/y scanning coordinate there is a delamina-tion or other air-filled gap on top of the die, theultrasound will never reach the die itself. Instead,it will almost all be reflected by the interfacebetween the mold compound and the air, even ifthe air-filled gap is only 20 nm thick. Second, if themold compound is firmly bonded to the top of the

die, a portion of the ultrasound will be reflectedback to the transducer, while another portion willcross this material interface and travel deeper intothe package, sending back echoes from deepermaterial interfaces.

These two events, reflection and transmis-sion, occur at thousands of x/y coordinates per sec-ond as the transducer scans a component. Eachecho from within the gated depth of interestbecomes a pixel in the completed acoustic image.As the transducer scans, it will collect high-ampli-tude echoes from the mold-compound-to-air inter-face, and medium-amplitude echoes from mold-

Continued on page 51

Post-Reflow Acoustic Micro ImagingBy Tom Adams, Consultant, Sonoscan

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RoHS

l What is the volume of boards to betested?l Should a third party handle theresponsibility?

Very large boards can eliminatecertain types of test options, such asthe use of flying probers. Similarly,boards with a large number of testpoints may require a vacuum or com-pressed air system to engage the UUTwith the test pins. RF boards mayrequire testing within a shielded(Faraday cage) enclosure toprotect against electromag-netic influences. High-volt-age boards require addition-al fail-safes and trip switch-es to guard the user fromdangerous power suppliesor from the UUT itself. Ineach of these cases, the fix-ture supplier is a valuablefriend and can offer adviceon many aspects of fixturedesign, or on whether or notit is possible to use a gener-ic, reconfigurable system.

Choosing TestEquipment

The test fixture itselfis simply the access mecha-nism that allows the user to probespecific test points on the UUT withthe required fidelity. On its own it ismostly useless so it should be com-bined with an optimized set of testequipment. Some smaller businesseswill try to use the same test equip-ment that the developer used to debugduring design. However, most designtools are not made to withstand therigors of production testing and do notalways support production test soft-ware that allows them to be integrat-ed into broader test strategies.Pushing forward with a mismatchedtest strategy can lead to a confusingand compromising system that mayinclude multiple user interfaces andcreate a complicated, possibly illogi-cal, test procedure. It might be prefer-able to decide first on the test execu-tive and then select instruments thatcan be controlled by it.

The next decision is to deter-mine the diagnostics resolution thatthe process requires, which affectsthe types of instruments needed. Inthe earlier flashlight example, thesimple functional test of turning it onand off gives a diagnostics resolutionof the entire device. But, by using adigital multimeter (DMM), forinstance, the battery voltage, theswitch open and close resistance, thebulb’s impedance, and the continuityof the interconnections could all bemeasured. The diagnostic resolutionis then much higher, allowing forrepair and rework rather than scrap-ping the entire product.

For a basic (structural) auto-mated test equipment (ATE) system,such as a manufacturing defects ana-lyzer (MDA), only a few simple meas-urements are necessary — voltage,frequency, timer, and continuityacross a few hundred channels.Adding pattern generation anddetection, i.e. digital I/O channelsthen allows testing to be extendedinto the functional domain. The fur-ther addition of JTAG/boundary scan(IEEE Std. 1149.1) interfaces intro-duces possibilities for full device-to-device interconnection testing, mem-ory cluster connection tests, logic

tests, device programming (flashmemory, CPLDs), and more. All ofthese features can be found in JTAGTechnologies’ JT 5705/FXT module,an ultra-compact tester. The JT 5705can provide almost everything neces-sary for the required diagnostic reso-lution. If the application has otherrequirements, it is easy to select spe-cialized instruments to augment thetester’s capabilities, including oscil-loscopes, RF generators, powermeters, timer counters, and matrixswitchers. Testers that combine

functional and structural testaspects are commonly known as“combinational testers.”

FPGA technology also allowsflexibility in test systems by allowingreconfigurable instruments to beembedded within the fabric of adevice and are typically controlled byPXI or JTAG interfaces. JTAGTechnologies’ JT 5705 and JT 5112MIOS units are reconfigurable testermodules that may be controlled andreprogrammed by JTAG. Test instru-ments that can be built include seri-al bus interfaces (SPI, CAN, I2C,Ethernet), DDRx memory interfaces,and others.

Software for CombinationalTesters

After selecting the fixture,instruments and power supplies, thenext step is to choose a test executivesoftware solution. Some of the morepopular software options includeNational Instruments, Python, Micro -soft .NET framework, Marvin’s AT -Easy, Keysight VEE, and JTAGTechnologies AEX manager.

National Instruments offers arange of options from the ubiquitousLabVIEW to LabWindows/CVI andTestStand. The LabVIEW graphicalprogramming system was originallydesigned as a tool for research scien-tists but now appeals to many non-programmers in the ATE world.LabVIEW/CVI offers a more conven-tional programmers interface (API)but is not a full implementation ofANSI C. National Instruments soft-ware is well-supported by a host ofinstrument drivers often written bythe instrument vendor.

Often known as the engineer’sprogramming tool, Python is praisedfor having the simplicity of BASICwith many of the advanced featuresand flexibilities of C. Another majorattraction is that it is open-sourceand thus essentially free. PyVISA isa Python “wrapper” that offers easyaccess to shared DLLs built into theVirtual Instrument Software Archi -tecture specification laid down in the

Mixed-signal I/O module for existing JTAG controllers.

Reducing the PCB Bone PileContinued from page 47High mass, heat-sinking,

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December, 2016 Page 51www.us- tech.com

compound-to-die interfaces. The firstwill be bright white in the grayscaleacoustic image, while the second willbe some shade of gray. By conven-

tion, published images often use acolor map that displays gap-typedefects as red.

Image Analysis

Figures 1 and 2 are C-SAMimages of one small region of a popu-lated PCB. This small, thin telecom-munications board had over 100 com-ponents of various sizes. In Figure 1,only echoes from the first interfaceencountered by the pulse are used tomake the acoustic image. This sur-face scan shows the surface of eachfeature, no matter at what depth itlies within the gate selected — thetop surface of a large IC package, thetop surface of a small capacitor, andthe top surface of the PCB. A surfacescan such as this is sensitive to thefeatures about 50 µm below the sur-face. The large white area around theIC package reveals that the boardsurface in this region is significantlybrighter than the other areas of thecircuit board, a phenomenon that istypical of a multilayer board whosetop layer may be delaminated, thus

returning more of the ultrasoundthan if it were bonded.

Figure 2 is a C-SAM image ofthe echoes from material interfacesbelow the top surface of the highestcomponent, but within the gateddepth. The large die is at center. Thearea of the die paddle surroundingthe die shows many red regions, indi-cating that the mold compound isdelaminated from the substrate. Therisk is that the delaminations willexpand under the die and block heatdissipated. In addition, the board

area surrounding the IC is black,which confirms that the top layer ofthe board is delaminated.

Also, surrounding this compo-nent are several small componentsimaged in red that may or may not bedefective as the ultrasound needs tobe focused at their depth to be sure.When the transducer is scanning aboard, the single flat top surface thatmost components have is lacking.Instead, the transducer travels in itssingle plane and receives return echosignals from whatever the pulsestrikes — the flat top of an IC pack-age, the curved side of a capacitor, orthe board texture.

Many of these return echo sig-nals will not correlate well with theexpectation, for example, that a red oryellow feature is definitely a gap-typedefect. Red may simply be the soft-ware’s interpretation of echoes fromthe curved side of an out-of-focus smallcomponent. In some cases, however, asmall component may deserve a moredetailed analysis.

The multilayer ceramic chipcapacitor shown in Figure 3 was firstidentified as questionable in a whole-board scan. Ceramic chip capacitorspresent a special problem becausethey may contain vertical cracks thatwill cause failure by creating path-ways between electrodes. Verticalcracks reflect very little ultrasound,so a different method was used for ahigh-resolution image of this capaci-

Post-Reflow AcousticMicro Imaging

Figure 3: Arrows pinpoint cracksin mounted multilayer ceramic

chip capacitors.

Figure 1: Surface scan C-SAMimage of a portion of a

populated board.

Figure 2: Subsurface C-SAMimage of the same area as

Figure 1. In the large IC pack-age, delaminations (red) of themold compound from the die

paddle nearly surround the die.

Continued on page 53

Continued from page 49

was developed and patented by KC-Produkte. With this needle, low- tomedium-viscosity dam materials canbe applied with the help of optionaldistribution air.

The curtain nozzle is similar toa needle valve except that an electro-pneumatic controller is used to rap-idly open and close the needle.Compressed air is applied continu-ously to a duct, which is closed by asolenoid valve. As soon as the sole-noid valve is electrically actuated,the duct is opened and the pneumat-ic pressure lifts a piston along thematerial needle. The material flow isthen controlled as it exits the nozzle.When the electrical signal is stopped,the duct is evacuated and a springpushes the material needle back intoits seat, cutting off the flow of mate-rial. With the help of a knurled screwattached to its head, the needle’sstroke can be adjusted. The width ofthe curtain can be adjusted as well,from 3-20 mm (0.1-0.8 in.).

The Protecto allows the selec-tion of desired curtain widths, andcan do so automatically, so that vari-ous web widths can be implementedin the same program. The system isalso able to apply material with thecurtain nozzle at speeds of up to 600mm/s (2 ft/s). This allows the systemto coat very large surfaces quickly.This is also a low-spatter process,since the nozzle works without atom-izer air. This process is unsuitablefor high viscosity materials, or forthe coating of small and preciseareas. In addition, this method cre-

ates a “shadow” where no material isapplied when passing over a tall com-ponent. These areas then need to be

approached from the other side, orthe nozzle must be brought to astandstill directly over those loca-tions to coat the area fully.

Taking a close look at the PCBsbeing produced and the manufactur-ing environment, along with consult-ing system specialists, simplifies theselection of a coating system. Rehmhas developed its Protecto system tobe highly flexible and customer-ori-ented for use in electronics manufac-turing.

Contact: Rehm ThermalSystems, LLC, 3080 NorthfieldPlace, Suite 109, Roswell, GA 30076% 770-442-8913 fax: 770-442-8914E-mail: p.handler@rehm-group.comWeb: www.rehm-group.com r

Page 52 December, 2016www.us- tech.com

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Rehm’s Protecto conformal coating system.

Continued from page 46

1990s. This allows a high-level con-trol of conventional instrumentswhile JTAG Technologies also pro-vides its own library for boundary-scan activities.

Microsoft’s .NET framework isthe company’s latest coding environ-ment and provides language interop-erability across several programminglanguages. Programs written for.NET execute in a software environ-ment known as Common LanguageRuntime (CLR), a virtual machinethat provides security, memory man-agement and exception handling.Languages supported range from C#to VisualBasic.

Specifications andDocumentation

Having previously defined abroad test strategy it will be neces-sary to provide a detailed test speci-fication per UUT. This is especiallyimportant in cases where a thirdparty or systems integrator isinvolved. Glib requests such as “Testas much as you can!” are pretty muchmeaningless and can provoke muchfuture argument and contractualwrangling. The test specification willalso figure in the acceptance specifi-cation of the tester along with checksfor compliance with electrical safetyand EMC measures.

Documentation of the finishedsystem is another important aspectthat can extend the useful life of atester. A great many carefully engi-neered systems have been aban-

doned when a lead engineer moveson from an organization withoutleaving adequate documentation.

Commissioning andMaintenance

The commissioning process for anew test system should be the samewhether the equipment was developedin-house or supplied by a third party.In each case, the system must beinspected for compliance to safetyspecifications before it is even poweredup. The UUT program can be subse-quently executed with a known good(golden) board to check for false fail-ures. If possible, a board with knownfailures that are covered by the testershould be run through. Limits check-ing should be fine-tuned to cover thespread of acceptable results.

Maintenance is perhaps the mostneglected part of a test system. In anytester there will be consumable itemsthat will eventually need to bereplaced. Test probes, connectors andcables all have a finite lifespan andshould be replaced on a schedulerather than later on when an issuearises, which leads to extra time spenttracking down the problem. Similarly,most analog measuring equipmentrequires periodic calibration or at thevery least should be checked against agood traceable instrument. Also, easyaccess to tester components forreplacement and service must be con-sidered at the design stage.

Clearly there is a great deal toconsider before embarking on a testsystem build. Consider what is more

Reducing the PCB Bone PileContinued from page 50

Continued on next page

tor — gating was limited to the backsurface of the capacitor. No reflectedechoes are collected from the body ofthe capacitor. Instead, the pulses arereflected from the back surface anddisplay any cracks they encounter onthe way back to the transducer. Thecracks are imaged as highly visibleacoustic shadows. The red arrows inFigure 3 show two cracks imaged inthis way. There is a possible smallcrack in the lower left of the uppercapacitor.

When problem solving requiresadditional diagnostic information,Sonoscan has developed numerousimaging modules that can be usedwithout removing the components

from the board. The Quantitative B-scan Analysis Mode (Q-BAM™) tech-nique can be used to nondestructivelycross-section a component throughany vertical plane.

The Time Do main™ mode can beused to zero in on fine details of struc-tural defects. The PolyGate™ modecan be used to image a component inthin non-destructive slices. Withoutremoving the components from theboard, a great deal can be learnedabout structural defects and theircauses.

Contact: Sonoscan, Inc., 2149 EPratt Boulevard, Elk Grove Village,IL 60007 % 847-437-6400 fax: 847-437-1550 E-mail: info@sonoscan.comWeb: www.sonoscan.com r

Reconfiguration, if required,can be performed in a matter of min-utes. A highly linear output signal isachieved internally using digital lin-earization techniques. Temperaturecompensation of the output signal,desirable to minimize measurementtemperature effects, is performed bythe internal microprocessor and canbe easily set up by the user, in manycases in-situ.

The digiVIT has user-program-mable functions including relay setpoints for out-of-tolerance or processcontrol indications, digital low pass fil-tering to improve resolution, anadjustable sensor sample rate, andquick two-point adjustment instead offull calibration when replacing brokensensors. The digiVIT is suitable forapplications requiring precision andease of use at a reasonable price.Examples of customer uses include:

Metal Stamping Process. In thismetal stamping process, the cus-tomer’s feed stock needed to bechecked for straightness and flat-ness. The metal type was changedseveral times a day. Eddy currenttechnology was suitable for the oilymachine environment, but requiredrecalibration to each different type ofmetal, which was too time-consum-ing. With the digiVIT, recalibrationtook a matter of minutes, making themeasurement practical.

Assembly Machine Calibration.For this customer, monthly sensor cal-ibration was required for quality con-trol purposes. The sensors were locat-ed far from the signal conditionermaking calibration of analog sensorsdifficult and time-consuming. Repla -cing the analog systems with adigiVIT signal conditioner requiredonly a two-point calibration adjust-ment, reducing calibration time signif-icantly.

Paper Thickness Measuring. Thiscustomer combined a digiVIT with a

laser and performed a special cali-bration over a limited range to opti-mize resolution. Digital filtering andin-situ temperature compensationwere enabled to further improve per-formance. The digiVIT proved easyfor the customer to implement.

Kaman’s digiVIT allows users towork with a wide variety of measuringsystem configurations and operate inmany conditions. For applicationswhere high performance is a must,this new digital signal conditionertechnology is an attractive option.

Contact: Kaman PrecisionProducts, 217 Smith Street,Middletown, CT 06457 % 860-632-4536 Web: www.kaman.com r

December, 2016 Page 53www.us- tech.com

Self-Configuring Sensorsfor Machine MonitoringContinued from page 48

important for an application, therequired diagnostics resolution orhow accurately a given fault can bepinpointed. This determines thetypes of hardware needed and thesoftware programs to support it.Better resolution requires moreinstrumentation and also (usually)more test points. However, the lattercan be mitigated by the use ofJTAG/boundary scan techniques ondesigns that support this technology.

Since JTAG/boundary scan usesbuilt-in pin access provided by theICs themselves, hardware overheadcan be reduced by removing testpoints while increasing test coverageand adding useful resources such asin-system programming of CPLDs,flash devices and the embeddedmemories in microprocessors.

Contact: JTAG Technologies,Inc., 111 N West Street, Suite A,Easton, MD 21601 % 410-770-4415fax: 410-770-4774 E-mail: info@jtag.com Web: www.jtag.com r

Reducing the

PCB Bone Pile

Post-Reflow AcousticMicro ImagingContinued from page 51

Continued from previous page

December, 2016www.us- tech.com

New ProductsNew Products

Page 54

Selco Intros Custom TPE

Thermistor AssembliesReno, NV — Using an over-moldingprocess to ensure no chance of mois-ture intrusion in the probe assembly,Selco Products’ custom TPE thermis-tors are well-suited for use in appli-cations with overall operating tem-perature ranges of –40 to +135°C(–40 to +275°F).

Made with robust, UL-certified TPE material, thesecustom assemblies are usefulfor harsh moisture environ-ments. The TPE housingmaterial is fused to the TPElead wire insulation duringthe over-molding processwhich creates a moisture-proof seal between the probehousing and the lead wireinsulation. Depending onapplication requirements,these custom thermistorassemblies can have an accu-racy as high as ±0.2°C over 0-70°C or a tolerance of ±1-10 percent.In specific applications such as NSFor medical, FDA-approved TPEmaterial can be supplied.

Custom assemblies are pro-duced with a probe housing size of0.25 x 1.13 in. (6.4 x 28.7 mm) and

other dimensions can be provided asrequired. They are supplied with 22AWG TPE insulated leads. The leadlength can be specified by the cus-tomer and comes in gray, black,white and other colors if necessary.The leads can be supplied with con-

nectors, lead stripping, or blunt cutas desired.

Contact: Selco Products, 8780Technology Way, Reno, NV 89521 % 800-257-3526 E-mail: sales@selcoproducts.com Web: www.selcoproducts.com

Custom thermistor assembly.

Diodes Inc. Intros QuasiResonant PWM Controller

Plano, TX — The AP3301 quasi-reso-nant (QR) PWM controller introducedby Diodes, Inc., enables the implemen-tation of high-performance, cost-effec-tive power supplies that are capable ofmeeting DOE6/COC Tier 2 efficiencyrequirements at all load levels.Targeting the key market of AC-DC adapters for set-top box andgaming console applications, thiscontroller also meets the auxiliarypower requirements of ATX/BTXcomputer motherboards and issuited for use in open-frameswitching power supplies.

Multiple operating modesallow the AP3301 to perform effi-ciently at different load levels.Under low- or no-load conditions,the IC uses a burst mode to mini-mize standby power consumptionwhile operating at a minimumswitching frequency of approximate-ly 20 kHz to avoid audible noise. Atintermediate loads, a valley-lock QRmode with frequency foldbackimproves efficiency and EMI per-formance. For heavy loads, or underlow line input conditions, the con-troller enters a continuous conduc-tion mode (CCM) at a fixed 62 kHzswitching frequency. A built-in fre-quency dithering function helpsreduce EMI emission in both CCM

and QR modes. The AP3301 provides compre-

hensive protection features thatinclude: AC-input brown-out protec-tion, cycle-by-cycle current limit, pre-cise output over-voltage protection,

internal over-temperature protection,overload protection, and a pin faultprotection circuit, which detects float-ing or short connections on key signalpins and disables PWM switching toprotect the power system.

Contact: Diodes, Inc., 4949Hedgcoxe Road, Suite 200, Plano,TX 75024 % 972-987-3900 fax: 972-731-3510 E-mail: inquiries@diodes.com Web: www.diodes.com

AP3301 QR PWM controller.

TT Electronics LaunchesZero Ohm Resistor

Perry, OH — TT Electronics haslaunched a zero ohm resistor designedfor making optional connections onPCB assemblies. The LRZ0603 is acompact 6A zero ohm resistor and isavailable in surface-mount ceramicchip format.

The resistor is aimed at design -ers of a wide range of products,including power supplies, smallmotor or actuator drive systems andpower management products. Thezero ohm resistor is used for makingoptional connecting points on a PCB,allowing a common PCB to be usedfor multiple product variants, savingon design time and inventory. The

LRZ0603 can also be used as acrossover to simplify — and reducethe cost of — PCB design by reducingthe number of layers needed.

The LRZ0603 has a high currentrating of 6A in a 0603 size, reducingthe PCB area required for a high cur-rent link. It is AEC-Q200 qualified,providing the assured reliability of anautomotive grade component. Theresistor’s ultra-low residual resistance

value is close to the ideal zero ohmcharacteristic with negligible voltagedrop, and its low internal thermalimpedance minimizes heating in theassembly, improving reliability andreducing field failures.

The LRZ0603 uses a coppermaterial to achieve low residualresistance and low internal thermalimpedance. A thick-film copper con-ductive element is screen printedonto a 96 percent alumina substrate,resulting in far higher current rat-ings for a given footprint. Its wrap-around copper terminations have anelectroplated nickel barrier and a sol-derable coating, which provides

“leach” resistance properties as wellas solderability.

Chips can withstand immersionin solder at 260°C (500°F) for 30 sec-onds and are suitable for reflow orwave soldering processes.

Contact: TT Electronics, 3700Lane Road, Perry, OH 44081 % 440-352-8961 E-mail: sales@ttelectronicsamericas.com Web: www.ttelectronics.com

Zero ohm surface mount resistors.

Rochester, Kent, UK — Crystal Dis -play Systems (CDS) has developed aline of rugged, reliable TFEL (thin-film electroluminescent) displays —

Lumineq®. Lumineq TFEL non-trans-parent displays are used in aerospace,mining, marine, military, medical andmany more demanding environments.TFEL displays are robust and reliable,and are used in extreme environmentswhere traditional displays cannot copewith the conditions.

The displays are built for de -manding conditions including cold,heat, wind, dust, vibration, sunlight,and even G-forces. The electrolumi-nescent panels retain at least 75 per-cent of their original brightness aftermore than 100,000 hours of opera-tion. The technology offers excellentimage quality in a wide range of chal-lenging visual conditions and appli-cations. The rugged TFEL displaysdo not require heaters or coolers andoperate in a temperature range of–40 to +105°C (–40 to +221°F). Thedisplays demonstrate instant pixelresponse over the entire temperaturerange and no motion blur.

The user’s viewing experience isenhanced by 179° vertical and hori-zontal viewing angles, enablingmulti-person and off-axis viewing.The panels offer high brightness andcontrast as well as TFEL’s emissivepixel technology, which makes smalltext more legible than LCDs, creat-ing a reliable viewing experience for

industrial applications.Their ruggedness and flexibility

is also intensified by a wide dimmingrange and 200 G-force shock durabil-ity, and a 250,000-hour mean timebetween failures (MTBF) for the dis-play glass. The RoHS II-certified dis-plays (for worldwide compliance) arealso easy to integrate into existingsystems.

Lumineq TFEL displays arealso electromagnetic-compatible asthey support the end product in com-plying with FCC Part 15, Subpart J,Class B and EN55022, Level B, whenhoused in a suitable enclosure.

Lumineq transparent TASEL®

displays combine the rugged andreliable build of TFELs with theunique freedom of designing a com-

pletely transparent display. TASELdisplays are built for high-end appli-cations, with a sleek look and first-class viewing experience. The basisof the display, the glass, is easily cus-tomized and can be drilled or cut toany size necessary. TASEL modulesare transparent when not in use, andunused areas of the display remainclear as the rest is illuminated,curved displays and custom shapesare also available.

Contact: Crystal DisplaySystems, Unit 24, Space BusinessCentre, Knight Road, Rochester,Kent, BH1 1AA, UK % +44-0-1634-327420 E-mail: info@crystal-display.com Web: www.crystal-display.com

December, 2016 Page 55www.us- tech.com

IT’S WHAT’S ON THE INSIDE THAT COUNTS®

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Optional Covers are available for additional retention, if required Ideal for low profile, space saving PCB applications Suitable for Industrial and Consumer product applications Request Catalog M65

Electroluminescent displays.

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Endeavor:ExplosiveOrdinanceDisposalRobotsBedford, MA — Endeavor Robotics andLeidos, Inc., have partnered to pursuethe U.S. Navy Advanced ExplosiveOrdinance Disposal Robotic System(AEODRS) program, increments 2 and3. The Endeavor and Leidos partner-ship brings together a mature and suc-cessful ground robotics systems inte-grator with a large enterprise in thefederal technology solutions sector tocreate a low-risk and capable team forthe U.S. Navy.

With over 25 years of experi-ence, Endeavor Robotics has deliv-ered more than 6,000 ground robotsworldwide.

These systems have been deliv-ered in more than 125 customer-driv-en configurations in four unmannedground vehicle weight classes to aidin a wide variety of tactical missionsacross military, public safety andindustrial sectors.

The company has integratedmore than 140 third-party capabilitymodules throughout the family ofrobots with a high degree of interop-erability. The company’s productsinclude 25 different disruptors, sevenCBRNE sensors, six types of manip-ulators, various radios with cyberse-curity provisions, firing systems,EO/IR cameras, and X-ray systems.

Contact: Endeavor Robotics, 8 Crosby Drive, MS 6-2, Bedford, MA01730 % 781-430-3090 E-mail: sales@endeavorrobotics.com Web: www.endeavorrobotics.com

Page 56 December, 2016www.us- tech.com

Waukegan, IL — JST Corporationhas introduced a line of USB Type-Cconnectors, the next-generation USB

standard for data, power andaudio/video connections. USB Type-Cconnectors allow faster speeds, morepowerful connectivity and simplerdirectional connections than previ-ous USB connectors for both con-sumer and industrial applications.

The connector enables datatransmission of up to 10 Gbps and pro-vides 5A of power (AC/DC). The USBType-C receptacle provides a space-saving, low-profile interface connec-tion with a height of only 3.5 mm (0.14in.) and a depth of only 8.8 mm ( 0.35in.). The reversible mating interfaceenables secure, reliable matingregardless of whether the plug isinserted facing upward or downward.

When applying power, the sig-

nal lines are rated for 5A and thepower contacts are rated at 20V andare available in 24 circuits (2 rows or

12). The USB Type-C connector hasan operating temperature of –25 to+85°C (–13 to +185°F) including tem-perature rise when applying an elec-trical current. The connector has DIPcontact leads on the front side andSMT leads on the rear.

Its rugged construction includesan outer cover shell with a laser-weld-ed joint around the shell that providesstrength against wrenching and pro-tection against scooping insertion andwithdrawal. SMT headers are provid-ed on embossed tape for automaticplacement machines.

Contact: JST Corp., 1957Lakeside Drive, Waukegan, IL60085 % 800-947-1110 fax: 847-473-1373 Web: www.jst.com

JST Intros USB Type-CReversible Mating Connectors

USB Type-C connectors.

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Auburn, MA — PI (Physik Instrumente) has intro-duced its P-616 NanoCube® three-axis piezo scan-ner, a redesign of the company’s successful P-611,3D positioning stage. Based on a parallel-kinemat-ic design, with only one lightweight moving plat-form for all three axes, higher precision anddynamics are available in a more compact pack-age. As the newest miniature multi-axis stagefrom PI, the P-616 NanoCube is also the company’ssmallest and lightest system with capacitive feed-back delivering 100 µm travel range.

The positioner is operated by the company’snew E-727 digital servo piezo controller. Comparedto conventional analog piezo controllers, it offersthe advantage of higher linearity,faster settling and scanning speed,and easy access to all motion parame-ters. The positioner comes with a soft-ware package which has drivers forLabVIEW, dynamic libraries forWindows and Linux, and MATLAB.Interfaces include USB, SPI, RS-232,and analog. It also supports functionssuch as wave generation, data record-

ing, auto zero, and I/O triggering.The stage is driven by ceramic-encapsulated,

preloaded PICMA® piezo actuators that providebetter performance and reliability than conven-tional insulated piezo actuators. Actuators, guid-ance, and sensors are maintenance-free, not sub-ject to wear, and offer extraordinary lifetime andcost-effectiveness. According to the company, inreliability tests carried out by NASA/JPL the actu-ators survived 100 billion cycles without failure.

Contact: PI (Physik Instrumente) L.P., 16Albert Street, Auburn, MA 01501 % 508-832-3456fax: 508-832-0506 E-mail: info@pi-usa.us Web: www.pi-usa.us

December, 2016 Page 57www.us- tech.com

ProtectoDispensing

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NanoCube three-axis piezo scanner.

PI Intros High-Speed Three-Axis Piezo Motion Stage

BEI Kimco:Reliableand QuietBrushlessDC MotorsVista, CA — BEI Kimco has releasedtwo new types of brushless DC(BLDC) motors designed to meet thehigh-performance motor require-ments for laboratory centrifugemachines. Centrifuges are used inbiology, chemistry and hospital labsto rapidly spin and separate liquidsamples into layers for analysis.These machines have varying re -quirements in motor functionalityand size, as well as speeds that canrange from just a few thousand RPMto higher than 50,000 RPM.

The DIT11-15 and DIH40-49meet the necessary specifications ofindividual centrifuges, including oper-ating speeds approaching 25,000RPM. While the DIT11-15 motordelivers relatively moderate torquelevels of 3.0 oz/in., given its size of 1.1x 1.3 in. (28 x 33 mm), it does incorpo-rate integral drive electronics for amore simplified external controlscheme. The DIH40-49 design is capa-ble of power levels up to 500W in asize of 4 x 4.9 in. (10.2 x 12.5 cm). Thetwo brushless motors operate withvery low noise, due to a precision rotorsystem and special bearings.

Contact: BEI Kimco, 1499Poinsettia Avenue, Suite 160, Vista,CA 92081 % 760-597-7042 fax: 760-597-6320 E-mail: sales@beikimco.com Web: www.beikimco.com

Brushless DC motor.

Page 58 December, 2016www.us- tech.com

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Tampa, FL — Leader Tech has intro-duced a fast, easy and inexpensiveway to create a custom prototype of ahigh-performance circuit boardshield.

The Board Shield Prototype Kit(BSB) is a do-it-yourself kit that con-

tains all of the components necessaryto quickly create a one- or two-piece,production-quality circuit boardshield without any special tools orprevious experience.

The kit streamlines a project’sdevelopment and EMI test stages byoffering a selection of Leader Tech

CBS fences, Tech Clips and SMS cov-ers, as well as customizable materi-als to create the necessary shield.The kit also includes an instructionsheet with assembly photos and step-by-step directions detailing theprocess of cutting and forming the

cover materials to fit the size andshape of a particular board.

Contact: Leader Tech, Inc.,12420 Race Track Road, Tampa, FL33626 % 813-855-6921 or 302-547-7111 E-mail: sales@leadertechinc.com Web: www.leadertechinc.com

Leader Tech IntrosPrototype Kit for Custom

PC Board Shielding

Board shield prototype kit.

Erlanger, KY — SEHO has designedits PowerWave N2 wave solderingsystem for medium-to-large produc-tion volumes and has optimized it forlow nitrogen consumption and highenergy efficiency. The PowerWaveN2 contains an innovative fluxerunit that reduces flux consumptionsignificantly and keeps maintenancecosts low. The spray fluxer withHVLP (high-volume low-pressure)technology ensures a stable spray jetand precise spray pattern even at theouter edges of PCBs. The machinecan also handle alcohol- and water-based fluxes without any problems.

Its flexible preheating zone con-figuration has an active length of1.8m (5.9 ft) enables the system to becustomized to specific productionneeds. Depending on the require-

ments, the PowerWave N2 may beequipped with infrared heating zones,

immediately reacting quartz emitters,or with convection heating modules.

The soldering area is also adjustableand automatically adjusts nozzleheights for different processes. Thesystem also includes a programmablesoldering mode, which is a tool to opti-mize the soldering process for difficultassemblies. Up-to-date wave formersensure maximum flexibility in the sol-dering area as well as high-qualitysoldering results.

Contact: SEHO North America,Inc., 1420 Jamike Drive, Suite 300,Erlanger, KY 41018 % 859-371-7346E-mail: sehona@sehona.com Web: www.sehona.comPowerWave N2 wave soldering system.

SEHO Offers High-Efficiency Wave Soldering System

Coto IntrosMiniatureMagneticSensors andSwitchesNorth Kingstown, RI — Coto Tech nol -ogy has introduced its RedRock™RR110 analog sensor, RR120 digitalsensor and RR130 digital switch. Withstandard SOT-23 packages, thedevices are half the size of the compa-ny’s CT05 molded reed switches. Thenew high-performance sensors andswitches have been designed for multi-ple applications across various mar-kets, offering sensitivity, a small pack-age size and a competitive price. Thedevices are suitable for next-genera-tion of medical, automotive, instru -mentation, and industrial applications,due to their high magnetic sensitivity

with high hysteresis, EMF resistance,and low power consumption.

The RR110, RR120, and RR130meet the strict power constraints ofbattery-operated portable devicesand electronics, suiting the needs ofemerging medical device applicationsincluding ingestibles and implants.Their small package size makes thecomponents useful for current med-ical applications including portableinsulin pumps, capsule endoscopes,hearing aids, insulin pens, medicalwearables, and other small, battery-powered medical electronic devices.Other applications include consumersmart wearables and “wake up”mode switching on microprocessors.

Contact: Coto Technology, Inc.,66 Whitecap Drive, NorthKingstown, RI 02852 % 401-583-7261 E-mail: redrock@cotorelay.comWeb: www.cotorelay.com

RedRock ultra-miniature sensors.

December, 2016 Page 59www.us- tech.com

Page 60 December, 2016www.us- tech.com

Neu Dynamics Corp is an ISO 9001:2008 certified Tool, Mold and Die man-ufacturer specializing in tooling and equipment used in buildingSemiconductors, Electronics, components and a wide variety of the devicesused in automotive, telecommunications, solar and medical applications.

We further offer small to medium volume contract molding services formicroelectronic packages such as BGA, QFN, MLP, optical components etc.We also have capability to provide insert molding services for items such asconnectors.

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Vista, CA — APEM has added to itsexpanding range of joystick productswith its BH series paddle controller.The newly-designed paddle controloffers non-contact Hall effect technol-ogy in a compact size.

Developed for use in both mildand extreme environments, the BHseries provides a smooth and respon-sive movement at the user’s finger-tips. The controllers are useful forapplications including remote controlboxes, agricultural vehicles and inmaterial handling environmentswhere precision and reliable opera-

tion are crucial. The BH ergonomic handles are

available with five different color fea-tures and a soft touch rubber grip.Measuring only 60 mm (2.4 in.) tall,the controllers offer three output con-

figurations and are sealed up toIP67. As with all of the company’sproducts, the handles are tested toglobal environmental standards.

Contact: APEM, Inc., 970 ParkCenter Drive, Vista, CA 92081 % 760-598-2518 fax: 760-598-2524 E-mail: info@apem.com Web: www.apem.com

APEM Intros SingleAxis Hall Effect Paddle

BH series paddle controller.

Ivyland, PA — NDC is now offeringtwo new systems, the Air-VacONYX29DB pick-and-place machinefor semiconductor assembly, and thePINK V6-G low-pressure plasmatreatment system.

The ONYX29DB is a versatileand precise tabletop unit that canperform a wide variety of tasksincluding dispensing, pick-and-place,assembly, and sorting. The system isbeneficial for manufacturers withhigh-mix, low-volume products. Theautomated system is designed specif-ically for semiconductor assemblyincluding flip-chip and die bonding,and can handle MEMS devices, opti-cal component placements and verysmall components, down to 200 µm2.Its powerful 2,000W top heater deliv-ers hot gas to the die area with tem-peratures ranging from 50 to 450°C(122 to 842°F), allowing for thermo-

compression bonding and reflow. Thegas is delivered through standardand custom nozzles, and a quick-change design allows them to beswapped out easily without tooling.

The PINK® V6-G is a low-pres-sure tabletop plasma treatment sys-tem for industrial small series produc-tion as well as for plasma treatment inR&D laboratories. It can be used forsurface treatment process cleaningand activation and its integrated PLCstores process parameters. Optional

features of the system include a vacu-um pump, ozone trap, up to two addi-tional gas inlets, rotary drum for thetreatment of bulk material, shelves,lateral microwave coupling, soft startand slow vent, and a VPN/USB/Ethernet interface and controller forremote maintenance.

Contact: Neu Dynamics Corp.,110 Steamwhistle Drive, Ivyland,PA 18974 % 800-910-8150 fax: 215-355-7365 E-mail: sales@neudynamics.com Web: www.neudynamics.com

Fountain Inn, SC — AVXCorporation has released a newseries of low-profile, low pass filters,based on the company’s patented

multilayer organic (MLO®) high-den-sity interconnect technology. Thenew LP series MLO low pass filtersuse a combination of high dielectricconstant and low-loss materials toenable the fabrication of multilayer,

stacked passive devices, such asinductors and capacitors, with highvolumetric efficiency, high Q, andexceptional electrical performance.

Designed to support both awide frequency range (0.4 to 6.5GHz) and several wireless stan-dards, LP series low pass filtershave an ultra-low 0.55 mm (0.02in.) height profile, and exhibitexcellent isolation, low insertionloss, low parasitics, and 50Wimpedance, making them suit-able for use in a variety of wire-less applications, includingmobile communication devices,GPS, vehicle location systems,wireless LAN, satellite receivers,and instrumentation.

With land grid array sur-face-mount packaging expan-sion-matched to most organicPCB materials, AVX’s MLO lowpass filters also deliver improvedreliability over standard siliconand ceramic devices, includinglow-temperature co-fired ceram-

ic (LTCC) devices, which can alsobe used to create multilayer stackedpassives.

RoHS-compliant, the filters arecurrently available in four versionswith varying lengths and fixedwidths and heights, and are supplied

with gold terminations that are com-patible with automatic, reflow, wave,vapor phase, and manual solderingprocesses. The series has an operat-ing temperature range of –55 to+85°C (–67 to +185°F), can be

shipped in waffle or bulk packagingand has a lead time of approximately12 weeks.

Contact: AVX Corp., One AVXBoulevard, Fountain Inn, SC 29644% 864-967-2150 Web: www.avx.com

December, 2016 Page 61www.us- tech.com

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Page 62 December, 2016www.us- tech.com

Mont-Saint-Guibert, Belgium —

Semiconductor manufacturer CIS-SOID has teamed up with DataDevice Corporation (DDC) to developa compact, reliable silicon-carbide(SiC) MOSFET intelligent powermodule (IPM) for aerospace powerconverters and motor control.

DDC’s subsidiary of Beta Trans -former Technology Corporation willdevelop high-reliability and high-tem-perature transformer modules,embedding both power and pulsetransformers, optimized for CIS -SOID’s HADES2® isolated gate driv-er. The solution will be used inCISSOID’s SiC MOSFET IPMs, SiCIPMs designed for high power densityapplications, and also IPMs in her-metically-sealed packages developedfor harsh environments, includingunpressurized locations and extremetemperatures.

Transformer modules are beingdeveloped, validated and qualifiedfor temperature ranges from –55 to

+225°C (–67 to 437°F). Magneticcores and other transformer materi-als have been carefully selected tooffer stable behavior and reliableoperation within the temperaturerange. The transformers will provideisolation in excess of 2500 VDC andare optimized for low parasitic capac-

itances in order to support highdV/dt, typically up to 50 kV/µs, com-mon with fast-switching SiC transis-tors. These transformers have beenoptimized to work with the HADES2isolated gate driver chipset.

The power transformer is usedinside a flyback DC-DC convertersupplying both low- and high-sideisolated gate drivers while pulsetransformers are transmitting PWMand fault signals.

Contact: CISSOID, Rue EmileFrancqui 3, 1435 Mont-Saint-Guibert, Belgium % +32-1048-9210fax: +32-1088-9875 E-mail: sales@cissoid.com Web: www.cissoid.com

CISSOID and DDCCreate Compact IPM

SiC MOSFET intelligent power module.

San Diego, CA — Crydom has intro-duced its DRML1 load monitoringmodule, designed specifically forNOVA22 solid-state relays (SSRs),

which monitors up to eight heating ele-ments with similar current value, for atotal current ranging from 1.2-50A.

The DRML1 module measuresthe current value and compares itwith a pre-set “teach” value, which is

stored during installation. Normaloperation is monitored and failuresare detected. An alarm is activatedwhen the module detects undercur-rents in the heating circuit less than–12.5 percent of the nominal current.The module allows for other alarmconditions to be detected such as:over-current condition (when the cur-rent exceeds the maximum of +12.5percent of the nominal current),blown fuses (open load), damaged(short-circuited SCR) and interruptedSSR, as well as those in half-waveoperation. The teach value is set bythe operator either with the “Teach-In” pushbutton, placed on the front, orwith the external “Teach-In” input.

The module allows the user toselect the maximum current value of20 or 50A, operates with a minimumpartial load detectable value of 150mA, and includes an adjustablealarm response delay (0.1, 1 or 5 sec-onds). This avoids fault messagesgenerated by voltage drops.

Malfunctions are indicated by amulticolor LED and can be localizedsystematically by the alarm outputwhich allows up to 128 DRML1 mod-ules to be connected to a collectivealarm. The LED indicates when poweris on and also when the Teach-In func-tion is activated (blue), when the inputsignal is on (green) and when analarm condition is activated (red).

The DRML1 is designed fordirect installation on NOVA22 solid-state relays (both panel mount PM22series and DIN-rail mount DR22series models), and its plastic enclo-sure provides IP20 level protection.The module is C-UL-US recognizedand compliant with IEC 61000-4(EMC) and IEC 60068-2 (shock andvibration) requirements as well asmeeting CE low-voltage and RoHSspecifications.

Contact: Crydom, Inc., 2745Paseo de las Americas 5014, SanDiego, CA 92154 % 877-502-5500 fax: 619-210-1590 E-mail: sales@crydom.com Web: www.crydom.com

December, 2016 Page 63www.us- tech.com

KYZENAnalyst.com

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W OW O R LR L DWDW I DI D E E E NE N V IV I R OR O N MN M E NE N TATA L LL LY Y R ER E S PS P O NO N S IS I B LB L E E C LC L E AE A N IN I N GN G T T E CE C H NH N O LO LO GO G I EI E SS

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Load monitoring module forNOVA22 SSRs.

Crydom Launches Load Monitoring Module

FujipolyOffers FastFree TIMSamplesCarteret, NJ — Some of the mostcumbersome steps in evaluating theperformance of a thermal interfacematerial (TIM) involve requestingproduct samples and receivingquotes. To eliminate this frustration,Fujipoly® has created an online suiteof features that allow engineers torequest free samples and quotes withthe click of a mouse.

The registration process takesless than two minutes to completeand even allows users to createdefault shipping and billing loca-tions. The highly-rated “Request aSample” feature guides engineers to

the right product by using dropdownmenus to specify Sarcon® materialtype, thermal conductivity, thick-ness, length, and width. The systemthen generates a unique part numberthat is used to seamlessly create thesample order. To make it even easier,a quote can also be generated byclicking a box and entering thedesired quantity.

Contact: Fujipoly AmericaCorp., 900 Milik Street, Carteret,NJ 07008 % 732-969-0100 fax: 732-969-3311 E-mail: info@fujipoly.comWeb: www.fujipoly.com

Fujipoly’s quick-delivery thermalinterface material samples.

Sunnyvale, CA — XP Power haslaunched its ECF40 series of single-output, 40W AC-DC power supplies.The open-frame, convection-cooledunits are capable of delivering thefull 40W output without the need forany external forced airflow, up to50°C (122°F).

The ECF40 measures 1.5 x 3 x1.1 in. (38 x 76 x 28 mm) and suits awide range of applications in thehealthcare, industrial and technolo-gy sectors, across an operating tem-perature range of –40 to +70°C (–40to +158°F). The footprint spacerequired in the end system with theECF40 is 44 percent smaller than

the standard size, and reportedly, 25percent smaller than the currentsmallest product on the market. Therange comprises six models provid-ing all popular nominal output volt-ages from 12 to 48 VDC. The voltageon all models can be manuallytrimmed ±10 percent by a user-acces-sible potentiometer on the supply.

The series consumes less than0.15W during no-load conditionshelping designers ensure their endproduct can comply with the mostrecent energy efficiency standards.In addition, with a high typical effi-ciency of 90 percent or higher, theflat efficiency curve ensures that theECF40 operates reliably.

The ECF40 series is certified toITE IEC/UL/EN 60950-1, to IEC/EN60601-1 and to ANSI/AMMIES60601-1 3rd edition medical safetystandards, has 4,000 VAC input tooutput isolation, two AC line fuses, amaximum of 250 µA leakage currentand provides two means of patientprotection (2 MOPP). The units oper-ate at full power over a 90-264 VACinput range, and down to 80 VAC withminimal derating. Models comply withClass B conducted EMC specificationwithout the need for any additionalexternal filtering components.

Contact: XP Power, 990 BeneciaAvenue, Sunnyvale, CA 94085 % 971-322-0326 E-mail: ddarrow@xppower.com Web: www.xppower.com

Page 64 December, 2016www.us- tech.com

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Oyster Bay, NY — Mill-Max has intro-duced its Vertical SMT SuperSpeedUSB 3.1 Type C receptacle to its line ofUSB I/O sockets. The receptacle istwice as fast as USB 3.0, transfersdata more efficiently, hashigher throughput, andhas improved I/O powerefficiency. In addition tothis vertical SMT version,the company also carriestop-mount and mid-mountstyle receptacles.

The sockets are builtwith a full-metal housingfor enhanced EMI/RFIprevention. Also, the USBType C connectors haveno polarization so cableswith Type C plugs can beconnected regardless oforientation. The sockets maintainbackward compatibility with previ-ous USB versions and can be used forstorage, smartphones and mobilecomputing, docking, automotive elec-tronics, and many other applications.

The company also carries USB

SMT and through-hole Type A and B,compatible with USB 1.0 and 2.0specifications; USB 3.0 through-holemount socket Type A and B recepta-cles; USB 3.0 micro-B SMT socket

Type B receptacles and mini USBSMT socket Types A and B.

Contact: Mill-Max Mfg. Corp.,190 Pine Hollow Road, Oyster Bay,NY 11771 % 516-922-6000 E-mail: rritter@mill-max.com Web: www.mill-max.com

Mill-Max Offers USB3.1 Type C Receptacle

USB 3.1 Type C receptacles.

XP Power Launches SmallOpen Frame Power Supply

Compact open-frame power supply.

Port Chester, NY — Swissbit is pre-senting its new S-46 and S-46µ seriesof SD and micro SD memory cardsfor applications that demand highendurance and performance. Bothproducts combine the market’s latestMLC flash components with a page-based firmware translation layer(FTL) and a single bit per cell storagemode. According to the company, thisresults in high random performanceand an endurance that exceeds thatof industry-standard SD memorycards considerably.

The Swissbit S-46 SD memorycards have capacities of 2 to 64 GBwhile the S-46µ micro SD memorycards range from 2 to 16 GB, and workin a storage mode where only a singlebit is used per MLC cell. This pSLCmode can be operated much fasterthan standard MLC mode andincreases the permitted program-erase (PE) cycles of MLC. In addition,the sub-page based FTL allows the

firmware to reduce the write amplifi-cation to low values especially for ran-dom writes. The company claims thatwhen compared with standard indus-trial SD memory cards, the resultingendurance can be up to 600 timesgreater. The S-46 and S-46µ cardscomply with UHS-I bus mode, up tospeed class 10 and offer a sequentialdata rate close to 50 MB/s and a blaz-ing random write data rate of up to1,400 IOPS (Input/Output OperationsPer Second).

The new products are equippedwith the proven read disturb man-agement (RDM) alongside anautonomous, performance-neutralbackground “auto refresh” process.This type of data care management

extends the data reliability especial-ly in read-intensive applications.

Due to the sub-page based manage-ment the busy time is kept below thespecified limit under all conditions,allowing a high sustained IOPS rateand guaranteeing compatibility withthe most widespread industrial andnetworking SD applications.

The supporting Swissbit lifetime monitor (SLTM) offers highly-detailed status information about thecards and provides a valuable predic-tion of the expected lifetime allowingfor scheduled maintenance.

Contact: Swissbit NA, Inc., 18Willett Avenue, Suite 202, PortChester, NY 10573 % 914-935-1400fax: 914-935-9865 E-mail: sales@swissbitna.com Web: www.swissbit.com

December, 2016 Page 65www.us- tech.com

S-46 SD memory card with pSLC.

Swissbit Intros SD and Micro SD Memory Cards

FairviewExpandsSchottkyDetectorPortfolioAllen, TX — Fairview Microwave hasexpanded its portfolio of zero biasSchottky detectors with new coaxialpackaged diode detectors that displayextremely flat frequency responseover broad RF and microwave fre-quencies from 10 MHz to 26.5 GHz.

The new detectors have compactcylindrical packages made of passi-vated stainless steel and offer a vari-ety of popular I/O SMA, BNC and N-type connector configuration thatmake them useful for precision testand measurement equipment, instru-mentation and subsystem assem blies.Applications of the detectors include

power measurement, leveling pulsedsignal sources, AM noise measure-ments, radar or missile guidance sys-tems, system level performance moni-toring, and pulsed RF measurements.

With matched inputs for excel-lent VSWR, the detectors have volt-age sensitivity levels that range from100 to 500 mV/mW for small signaldetection, negative video outputpolarity, and can withstand maxi-mum input power levels up to 20dBm CW. The detectors operate in atemperature range of 0 to 90°C (32 to194°F) and can be stored in tempera-tures of –65 to +125°C (–85 to+257°F).

Contact: Fairview Microwave,Inc., 1130 Junction Drive, Suite 100,Allen, TX 75013 % 800-715-4396fax: 972-649-6689 E-mail: sales@fairviewmicrowave.comWeb: www.fairviewmicrowave.com

Coaxial packaged Schottky diode detectors.

Page 66 December, 2016www.us- tech.com

www.westbond.com1551 S. Harris Court Anaheim, CA 92806 Tel 714·978·1551

Manufactured in the U.S.A. since 1966

Simplimatic Automation Develops

Innovative Packaging LineForest, VA — Simplimatic Automation has devel-oped a line for a multi-million dollar beverage com-pany that includes the control and coordinationnecessary for a high-speed, automatic canningprocess. While planning, the team ran across a sig-nificant challenge: Due to a new configuration ofthe packaging line, a long, curving section of con-veyor had to be moved and shoehorned into a shortarea between two critical stations on the line. Thenew section, now straightened and only 6 ft (1.8m)long, would carry one, two or three lanes of packsto a shrink film bundler/track packer.

Other requirements for the reconfigured lineincluded: automatic changeover to maintain theintegrity of the packs as they enter the shrink filmbundler, the accommodation of multiple lanewidths, precise and repeatable operation, high-throughput over a long lifespan, corrosion resist-ance, food-safe lubricants, and control byEthernet-based communications.

Line Overview

A conveyor system unifies the new line.Empty cans are de-palletized and enter the line,filled cans are bundled and shrink-wrapped, andtrays of packs are routed to a palletizer. On aver-age, 1,450 beverage cans are filled and seamed perminute. Filled cans are fed into a pack cartonerthat produces 4-, 6-, 8-, 10, and 12-packs of 12 and16 oz cans, depending on the run. The line accom-modates more than 100 SKUs. After cartoning,packs are divided into lanes by an active rollerwheel conveyor before being fed into the bundler.

One of the highlights of the line is that it pro-duces a wide range of bundle and tray pack pat-terns to accommodate retailer preferences.

Different combinations of packs and lanes add tothe diversity of pack patterns available.

Due to topological considerations and choicesmade late in the project regarding the types of

machines to be used at the end of line, the new 6 ft(1.8m) section of conveyor had to be sandwiched inbetween the lane switch device and the tray pack-er. The design team needed to develop a lanedivider solution that would ensure that packsentering that section — at a maximum of 62 packsper minute — maintained precise orientation with-

in their designated lanes. Not only were one, twoor three lanes required for various tray patterns,but also those lanes needed different widths,depending on the packs.

Pneumatic Actuation

The most elegant design turned out to be low-ering metal plate dividers between the lanes. Thedivider design had the advantage of being a sim-ple, low-cost solution that would maintain laneseparation. Lowering the middle divider, for exam-ple, maintains a two lane infeed. Lowering theouter plates, while the middle remained up, main-tains three lanes. Having all the plates raisedallows for one lane operation.

Guide bars on the sides of the conveyorextend or retract to maintain proper width of thelanes. Working with Festo, one of the Simpli -matic’s suppliers, the design team ran cost benefitand performance analyses on whether electric orpneumatic actuators would be the optimum choicefor lowering and raising the dividers and extend-ing and retracting the width guides.

These applications require relatively fewmovements per day. In terms of long service life, lowcost, and high reliability in this application, pneu-matic actuation was the most cost-effective choice.For the raising and lowering lane-maintaining actu-ators, a Festo design engineer suggested double rodactuators with a 100 mm (3.9 in.) stroke.

“Double rod actuators provide exceptionalrigidity,” says Mark Eanes, sales engineer atFesto. “The assured rigidity is an asset in main-taining the specified orientation of the dividersover their service life.”

By Bernie Moltchan, Sales Manager — Beverage, Simplimatic Automation

Conveyor system with pneumatic product lane dividers.

Continued on next page

South El Monte, CA — Electro-Mech’snew SW45023 exit lamp door switchhas been designed, tested andapproved by Airbus Industries forinstallation in its A350 aircraft. TheDPST illuminated switch includesseveral design requirements specifiedby Airbus, including custom PC pinsfor mating to the higher assembly con-nector; push-on, remain-in, and push-off switch function; 2A resistive load at28VDC input; custom PC pin housingfor protection during transit; and acase dimple for alignment with thehigher assembly connector.

The company’s SW45028 accom -panying lens cap has also been

approved by Airbus. The lens cap isdesigned to accommodate one T1 3/4(5 mm) midget flange base lamp orLED. A lightbulb logo can also beadded as an option.

Lightweight and compact, theunit weighs less than 15g (0.5 oz) andmeasures less than 0.75 in. (19 mm)in diameter. The switch requiresapproximately 1.4 in. (35.5 mm) ofspace behind the panel and includesPC pins for plug-in mating. Theswitch is rated for 2A resistive at 28VDC and has a minimum lifespan of200,000 cycles.

Contact: Electro-MechComponents, Inc., 1826 FloradaleAvenue, South El Monte, CA 91733% 888-442-7180 fax: 626-350-8070E-mail: terry@electromechcomp.comWeb: www.electromechcomp.com

December, 2016 Page 67www.us- tech.com

Electro-Mech Lamp Switch Approved by Airbus

SW45023 exit door lamp switch.SimplimaticInnovativePackagingLine

Because this section of convey-or is near a wash-down area, lightamounts of overspray are a part ofthe environment. Eanes made sureSimplimatic would receive corro-sion-resistant cylinders, which havefood-grade grease and seals incorpo-rated into the bodies. Adding theNSF-H1-rated grease was a customfeature, but did not require anyextra time in delivery due to fasthandling by the the team at Festo.These cylinders incorporate thecompany’s PPS self-adjusting aircushioning feature that providesfast setup (no adjusting screwsneeded) and long service life, due tothe soft stop at the end of the stroke.

For the changing width require -ment, Eanes identified four positioncylinders for the application. Thesepneumatic actuators extend or retractto four unique positions. The cylinderswere also specified as corrosion-resist-ant with food-grade lubrication. Festosupplied its IP67-rated MPA-L valvemanifold to control the actuators.

The unit for the Simplimaticapplication was a 16-station mani-fold. Dual 3/2 solenoid valves wereused to control the four positioncylinders. The MPA-L is a compactmanifold with direct fieldbus com-munications through the Festo CPXbus node.

Only one power line and oneEthernet cable had to be run to thevalve bank for a clean installation.CAD models were supplied for allkey components, which streamlinedfabrication for Simplimatic.

Eanes provided schematics ofthe pneumatic system early in theproject, via the company’s Fluid -Draw software, ensuring that thefunctionality of the valves matchedthe demands of the application.

“Overall, the close collaborationwith a long time supplier meant thatdesign solutions came in faster andwith sure results,” says RayMoltchan, Simplimatic senior mech -anical engineer. “This freed up ourdesign team to move on to new chal-lenges. It also lowered our engineer-ing overhead.”

Contact: SimplimaticAutomation, 1046 W London ParkDrive, Forest, VA 24551 % 800-294-2003 or 434-385-9181 fax: 434-385-7813 Web: www.simplimatic.com r

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Page 68 December, 2016www.us- tech.com

We move electronics.

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Jackson, MO — Link Electronics hasintroduced its LEI-564, which allowsactive format description (AFD) datato be inserted into an HD/SD videosignal, ensuring that the video isproperly displayed, despite aspectratio changes.

The compact LEI-564 acceptseither SD-SDI or HD-SDI input andtransmits a re-clocked signal outthrough dual SDI outputs, providing

a way to use AFD for the implemen-tation of the up/down conversionprocess, eliminating manual adjust-ment of picture size. This technology,which is ideal for use with DTVreceivers, up/down converters andother video equipment used withinbroadcast, educational, governmentand other environments, is designedto ease workflow and preserve imagequality, especially for video produc-tions stored in HD format, with con-version to SD as needed for finaltransmission.

The video signal format can be270 Mb/s SD or 1.5 Gb/s HD, withautomatic detection of most SD andHD video standards with signal pres-

ence and format indicated on the dis-play. AFD data is inserted as verticalancillary data on video lines allowedper format, designated by the user.The unit is controlled by an eight-character display, with menu naviga-tion by two buttons and a rotaryencoder.

Four modes of operation includeDetect, Insert, Delete, and Auto,which is used for inserting AFD only

if there is no AFD detected. Detectmode displays the AFD already inthe stream. Settings are saved inflash for easy configuration. The unitcan regenerate the video payloadidentifier (VPID), 352M for all out-puts. The LEI-564 comes in a 1Uchassis that is housed in the samecase as the industry-accepted 700series, with a black front panel dis-tinguishing between the two series.Three 500 or 700 series can bemounted in the PRT-700 rack tray.

Contact: Link Electronics, Inc.,2360 N High Street, Suite 10,Jackson, MO % 573-334-4433 E-mail sales@linkelectronics.com Web: www.linkelectronics.com

Link Electronics: ActiveFormat Description Tool

LEI-564 AFD code inserter.

Chatsworth, CA — Aitech Defense Systems nowoffers a fanless, rugged GPGPU (general-purposegraphics processing unit) supercomputer that meas-ures only 20 in.3 (327.7 cm3), while providing 1teraFLOP of parallel processing. The self-contained,military-grade A176 Cyclone has been designed forSFF (small form factor) power density and delivers60 gigaFLOPs/W in a compact, low-power HPEC(high performance embedded computer).

Using NVIDIA Maxwell architecture for theGPU subsystem, the A176 integrates 256 CUDAcores with 4 GB of LPDDR4 RAM. The quad-coreARM Cortex A57 CPU provides an operating fre-quency to 1.9 GHz per core, with an overall maxi-mum power consumption of only 17W(8-10W typical).

GPUs unburden the CPU fromheavy computation, enabling fasterprocessing of the overall system, aprinciple taken from the graphics-intensive gaming industry. A com-pact, rugged system that deliversthese levels of processing presentsnew opportunities for an embeddeddesigner working with an HPEC.

Its excellent processing, low-power and compact size make theGPU suitable for embedded deeplearning, computer vision, graphics,and GPU computing applications,especially in harsh environments.Specific uses include C4ISR, intelli-

gent video analytics, image capture and process-ing, UAS and UGV applications, signal processing,and persistent video surveillance.

The A176 Cyclone measures 4.3 x 4.3 x 1.2 in.(11 x 11 x 3 cm) and weighs less than 2.2 lb (1 kg).Its operating temperature is –40 to +70°C (–40 to+158°F) with vibration and shock to VITA 47 levelsV2 and OS1, respectively. The system withstandsrain, dust, salt fog and bench handling to MIL-STD-810G and EMI/RFI levels to MIL-STD-461.

Contact: Aitech Defense Systems, Inc., 19756Prairie Street, Chatsworth, CA 91311 % 888-248-3248 fax: 818-407-1502 E-mail: sales@rugged.comWeb: www.rugged.com

December, 2016 Page 69www.us- tech.com

1 2 16:36

Aitech Develops Rugged and CompactGraphics Supercomputer

Four-Channel

PbSe Detectors

From Laser

ComponentsBedford, NH — Laser Components isnow manufacturing its lead selenide(PbSe) detectors with four channels.The quad version is an attractivealternative to other methods for gasmeasurement. Four selected PbSechips are arranged in quadrants,equipped with their own filters, andhoused in a TO-8 or TP-39 can. Thereadout of all channels is carried outsimultaneously. For an improved sig-nal in the long-wave range, cooledversions are also available.

In the past, when applyingPbSe detectors, it was necessary touse either several single detectors or

filter wheels to detect different wave-lengths. The new solution savesspace in a system and time duringmeasurement, as well as loweringthe cost of procurement. When com-pared with Pyroelectric detectors,PbSe detectors are a better choicewherever higher sensitivity andspeed are needed.

Contact: Laser ComponentsUSA, Inc., 116 South River Road,Building C, Bedford, NH 03110 % 603-821-704 fax: 603-821-704 E-mail: info@laser-components.com Web: www.lasercomponents.com

Four-channel PbSe detector.

A176 GPGPU supercomputer.

Rohnert Park, CA — LEMO hasrecently improved the design of its Tseries watertight (IP68) connectors.The outer shell design has changedfrom the company’s standard lookand the connectors now have threelatches instead of two.

The series offers an innovativesolution for defense/security, testand measurement, medical and anyother application that requires awatertight connection. The connec-tors are small and use the same orig-inal LEMO push-pull technology.Based on the LEMO B series, the T

series has been specially constructedwith an inner sleeve and extra seal-ing to provide its IP68 water protec-tion. The connectors are available intwo- to nine-contact configurations.Contacts can be terminated by sol-dering to the wire, crimping onto thewire, or directly to a PCB. A keyingsystem ensures correct connectoralignment and the connector outershell offers full EMI shielding.

The T series of connectors usesthe same high-performance contactsystem and configurations as thepopular LEMO B series, providing awide selection of options that can bemade available quickly. It is back-

ward-compatible with the B series,with the same receptacle panel-holediameter, which benefits customerslooking to upgrade existing designs.

The connector outer shell isavailable in black chrome finish orplated brass, making the productsuitable for defense systems such asaircraft communications, land vehi-cles, night-vision equipment, simula-tion or personal battle equipment, aswell as in test and measurement andother industries where environmen-tal conditions require ruggedizedequipment.

Contact: LEMO USA, Inc., 635Park Court, Rohnert Park, CA94928 % 707-206-3776 fax: 707-206-3774 E-mail: jcarlson@lemo.comWeb: www.lemo.com

Montreal, Quebec, Canada — Matrox®

Imaging has launched its Indio I/Oand communication card for visionapplications. The PCIe x1 add-in cardoffers discrete I/Os with real-time syn-chronization and industrial network-ing using the EtherNet/IP, Modbus®,

and PROFI NET protocols, turningany PC into a vision controller.

With eight inputs and eight out-puts, the Indio provides jumper-selectable signaling in both 24V andTTL-level standards, making it suit-able for both industrial and laborato-

ry use. I/Os are optically-isolated andthe outputs have resettable fuses tosafeguard against damage fromunintended use. Configurable forboth sinking and sourcing, the I/Osare accessed from a standard 37-pinD-sub connector.

Delivering real-time input/output management through adedicated hardware-assisted mech -anism, the Indio enables precisetiming of output events, based oneither elapsed time or specificinput events.

Input events can be receiveddirectly from a discrete input,including from a rotary encoder orfrom a count derived from a dis-crete input. Output events can bestored on a hardware based list,and can be triggered by a discreteinput event or one of multiple cas-cading timers.

The Indio also makes a gigabitEthernet port (RJ45) available forindustrial networking using theEtherNet/IP, Modbus, and PROFI -NET protocols. To ensure a timelyresponse, PROFINET communicationis hardware-assisted. Alternatively,the port can connect to and power aGigE Vision® camera by way of Powerover Ethernet (PoE) support, reducing

the cabling required.Designed for use with both the

Matrox Imaging Library (MIL) 10SDK and the newly launched MatroxDesign Assistant 5 flowchart-basedintegrated development environment

(IDE), the I/O card provides systemintegrators and machine builders theability to fully-utilize Matrox visionsoftware in their PC of choice.

Contact: Matrox ElectronicSystems Ltd., 1055 St. RegisBoulevard, Dorval, Quebec, CanadaH9P 2T4 % 514-822-6000 fax: 514-822-6363 E-mail: imaging.info@matrox.com Web: www.matrox.com

Page 70 December, 2016www.us- tech.com

LEMO Improves WatertightConnector Series

T series IP68-rated connectors.

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December, 2016 Page 71www.us- tech.com

THIS IS RELIABILITY

Integrated EMI Shielding with LCD display for fast design cycle

Projected capacitive touchscreen for simple interface

Complete assembly for reduced design complexity

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CHO-TOUCH LCD Displays have been designed to reduce time to market and simplify the customer design experience. Parker Chomerics integrates touchscreens, EMI shielding, optical bonding and high performance LCDs into a complete assembly that is ready to go out of the box.

Concord, NH — Melexis has intro-duced its MLX90819 sensor IC — amid-range (10-50 bar) pressure sen-sor. Available as a bare die, the ICruns on a standard 5V supply. Thesensor is used to determine fluidpressure levels in a wide variety ofautomotive and industrial applica-tions, including engine oil, transmis-

sion fluid and fuel line monitoring.The IC delivers a relative pressurevalue, has a 1 ms response time, and±2.5 percent over life accuracy and±0.2 percent linearity across itsentire operational pressure range.

By using advanced process tech-nology, the MLX90819 benefits froma microcontroller-based architecture.This allows a much higher degree ofsophistication to be incorporatedonto the semiconductor die — with alldigital processing, data conversion,temperature offset, gain compensa-tion and filtering tasks taken care ofdirectly.

A 16-bit analog-to-digital con-

verter (ADC), 12-bit digital-to-analog(DAC) and high-performance 16-bitprocessor core are embedded directlyinto each sensor IC. The cost andcomplexity implications of discreteMEMS solutions, as well as the spaceutilization and sealing wear-and-tearissues that blight traditional non-MEMS solutions, can be avoided.

The IC can deliver either ananalog signal or a single edgenibble transmission (SENT)output for applications requir-ing a digital output.

This robust IC is suitedto both heavy-duty industrialand automotive deployment,with full AECQ100 compli-ance and a specified tempera-ture range of –40 to 150°C(–40 to 302°F). An automotiveover-voltage protection mech-anism is included in order to

ensure ongoing reliability. An array of diagnostic features

further support its long term opera-tional integrity. These include analogoutput clamping level and brokentrack detection, plus numerous dis-tinctive diagnostic messages passedby the SENT protocol (such as inter-nal temperature or pressure errors,external over-voltage/under-voltageconditions). The sensor ICs areshipped in a die-on-foil format.

Contact: Melexis, Inc., 41 LockeRoad, Concord, NH 03301 % 248-306-5400 E-mail: sales_usa@melexis.com Web: www.melexis.com

Melexis Intros Mid-RangePressure Sensor IC

MLX90819 pressure sensor ICs.

Page 72 December, 2016www.us- tech.com

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Bradford, PA — KOA Speer Elec -tronics has introduced its TLR2BPcurrent sense resistor with a 1.5Wpower rating in a 1206 package. TheTLR2BP is a metal plate resistorthat provides excellent dimensionalaccuracy and low height with a thick-ness as low as 0.6 mm (0.024 in.). Inaddition, it offers superior corrosionand heat resistance with an operat-ing temperature of –65 to +170°C(–85 to +338°F).

KOA Speer’s TLR2BP resistorhas low TCR available down to ±50ppm/°C with resistance tolerance of±1 percent. The TLR2BP is offered inresistance values of 1 mW up to 20mW and is AEC-Q200 qualified.

Used primarily for currentdetection, the TLR2BP current senseresistors are suitable for use intransportation, industrial, telecom-munications, and consumer electron-

ics markets in applications such aspersonal computing devices, DC-DCconversion, automotive modules,

motor control, and power supplies.Contact: KOA Speer Electronics,

Inc., 199 Bolivar Drive, Bradford,PA 16701 % 814-362-5536 fax: 814-362-8883 Web: www.koaspeer.com

KOA Speer: New Metal PlateCurrent Sense Resistor

TLR2BP current sense resistors

Tualatin, OR — CUI has expandedits portfolio of power, audio and sig-nal connectors with the addition of aUSB product line. The new connectorfamily incorporates USB 2.0 and 3.0connectors available in Type A, TypeB, Micro AB, Micro B, Mini AB, andMini B versions. Able to support datarates of up to 5 Gb/s in the USB 3.0

models, the new product family issuitable for a variety of I/O applica-tions in consumer and portable elec-tronic devices, including mobile com-puting equipment, digital audiodevices and high-volume storageproducts.

Offered in jack or plug connectortypes with horizontal or vertical ori-entations depending on the model, the

new USB line contains a number ofmounting styles that include surfacemount, cable mount, mid-mount SMT,and through-hole, allowing them toplug into virtually any design.

All models are rated for 30 VAC,and have current ratings of 1 or 1.8A,along with reliability as high as 10,000mating cycles. Color insulator options

of black, blue and white are alsooffered. The USB connectors have anoperating temperature range of –25 to+85°C (–13 to +185°F) and are RoHS-compliant.

Contact: CUI, Inc., 20050 SW112th Avenue, Tualatin, OR 97062% 503-612-2300 fax: 503-612-2383E-mail: jschnabel@cui.com Web: www.cui.com

CUI Adds USB toInterconnect Portfolio

USB connectors.

Providence, RI — Laser ResearchOptics, a division of Meller Optics, hasreleased a line of sapphire cover glasswindows and lenses for industrial cut-ting lasers that are reportedly moredurable than fused silica, reducing theneed for cover glass changes.

The company’s sapphire fiberlaser windows have a Mohs hardnessrating of 9, which is second only todiamond, and have A/R coatings onboth sides to provide transmission ofgreater than 99.5 percent at 1.06µ,with greater than 90 percent at 650-670 nm. Suitable for use as shieldson 1064 nm cutting lasers, thesehighly-polished sapphire windowsare capable of withstanding steelsplatter, flash and debris. Availablein sizes from 0.5 to 2 in. (12.7 to 50.8mm), the windows have a 10-5scratch-dig finish and provide a 1/4wave transmitted wavefront. Sap -

phire C-Plane windows are alsooffered coated on one or both sides.

Contact: Laser Research Optics,120 Corliss Street, Providence, RI02904 % 888-239-5545 E-mail: scott@laserresearch.net Web: www.laserresearch.net

Laser Research Optics IntrosSapphire Cover Windows

Sapphire fiber laser windows.

Waterloo, Ontario, Canada — Teledyne DALSA ispresenting its new BOA™ Spot ID vision sensors— the latest in its series of low-cost and easy-to-integrate vision solutions for the factory floor. BOASpot ID combines 1D/2D code reading with OCRand verification tools for a number of product iden-tification and verification applications, includingquality control, traceability and logistics manage-ment, and product validation.

The sensors are available in two models. Astandard IDS model includes the core 1D/2Ddecoders, while the expanded IDE model addsadvanced direct part marking (DPM) decoding,OCR and verification tools. These new vision sen-sors can decode 1D barcodes with bar widths andspacing down to 1.5 pixels and 2D matrix codeswith cell or dot sizes down to 2 pixels. Image filtersand control parameters are provided to enhancereadability of poorly printed codes and codes print-ed on plastic or metallic surfaces using laser/chem-ical etch, ink jet or dot peen marking methods.

Grading algorithms are included for verifying

the quality of decoded symbols against ISO/IECand AIM industry standards. Like earlier models,the BOA Spot ID combines the power and flexibil-ity of a BOA vision system with integrated LEDlighting, lens cover, and easy-to-use software todeliver high value capabilities at a low cost of own-ership. Its robust build quality with IP67 ratingmakes the BOA Spot ID suitable for harsh indus-trial conditions.

Inspections using BOA Spot vision sensorscan be triggered by parts in motion or from a PLCafter being moved into a stationary position.Standard factory protocols, such as EtherNet/IPand PROFINET, are directly supported for com-municating with third-party equipment or the fac-tory enterprise. Through-hole and surface mountoptions, along with a slim form factor allow theBOA Spot to fit into tight places.

Contact: Teledyne DALSA, Inc., 605McMurray Road, Waterloo, Ontario, Canada N2V2E9 % 519-886-6000 fax: 519-886-8023 Web: www.teledynedalsa.com

December, 2016 Page 73www.us- tech.com

Vacuum Tweezer Solutions

For nearly thirty years we have been a leading supplier of vacuum

handling solutions to the world’s high technology fi rms. Our

patented ESD safe products are used by CLASS I clean room

personnel, electronic assemblers, semiconductor manufacturers, the

optics industry and universities around the world. Our success

comes from developing innovative manual vacuum handling tools and

pick-up tips based on customer requests and customer feedback.

These tools provide customer specifi c solutions that make assembly and processing

operations more productive and ergonomic. Parts range in size from 0.13mm (0.005”) up to

300mm (12.0”) for easy handling.

• Self-contained vacuum tweezers

• Portable, battery-operated continuous vacuum handling

systems

• Bench top 110/220 volt vacuum tweezer systems

• Low cost options

These hand tools replace tweezers and other gripping means for many

applications, making them ideally suited for ergonomic manipulation of parts during assembly, inspection, rework

and service operations.

Virtual Industries offers a broad line of accessories

including miniature rubber vacuum cups, PEEK wafer

handling tips, and precision machined handling tips for critical

handling operations.

Visit our website or contact us for additional information.

2130 Victor Place, Colorado Springs, Colorado 80915 USAWebsite: virtual-ii.com E-mail: sales@virtual-ii.com USA Telephone: 719-572-5566 Fax: 719-572-5504

BOA Spot ID vision sensors.

Teledyne DALSA Presents Low-Cost Vision Sensors

Altech OffersAll-in-OneUPS PowerSolutionFlemington, NJ — CBI all-in-oneUPS (uninterruptible power supply)power solutions from Altech® com-bine multiple functions in a singledevice for use as a power supply unit,battery charger, battery care module,or as a backup module. The device iscompatible with a range of commonbattery types and is fully equippedwith a real-time diagnostics systemto continuously monitor battery sta-tus, charging levels, and potentialbattery faults. The CBI device suitsbattery-power applications in anysetting where battery reliability andbackup power are essential.

The CBI UPS device is availablein 12, 24 and 48 VDC output versionsfor pairing with conventional batterytypes, including open lead acid,sealed lead acid, lead gel, and nickel-cadmium (NiCd). The device hasthree charging levels (recovery, boostand trickle), allows for adjustment ofcharging current from 20 to 100 per-cent of output current, and automat-ically distributes available powerbetween load and battery. Efficiencyup to 91 percent is achieved throughits switching technology.

The device’s battery-chargingfunction is microprocessor-controlledand uses algorithms to detect a bat-tery’s condition and then choose theappropriate charging mode. Real-time diagnostics enable easy batterydiagnosis and fault identification dis-played by LED to protect againstpotentially occurring faults, such asshort circuit, inverted polarity, over-load, or disconnection of the battery.If the CBI device ever becomes dis-connected from the main powersource, the battery will serve to sup-ply the load until battery voltagereaches 1.5V per cell, preventingdeep battery discharge. The CBIdevice performs over a wide tempera-ture range from –40 to +70°C (–40 to+158°F) and is housed in a compactand rugged metal case offered in threesizes. The device can be DIN-railmounted using its built-in bracket.

Contact: Altech Corp., 35 RoyalRoad, Flemington, NJ 08822 % 908-806-9400 fax: 908-806-9490 E-mail: info@altechcorp.com Web: www.altechcorp.com

Page 74 December, 2016www.us- tech.com

Wacker Silicone R&D to the Forefront

Munich, Germany — With 2015 salesof $5.8 billion and R&D expendituresof around $191 million, WackerChemie AG styles itself as one of themost research-intensive companiesin the chemical industry. Accordingto the company’s reports, it generat-ed about 37 percent of its sales fromsilicone products in 2015. The com-pany has recently released over adozen new products including textilesensors made from thin siliconefilms, high-modulus silicone rubbergrades, clear silicone encapsulantsfor LEDs and optical lenses, andadditives for manufacturing wood-plastic composites. The company hasalso introduced an industrial-scale3D printer for silicones. The newproducts are designed for a variety ofapplications across the automotive,electronics, lighting, and healthcaremarkets.

Industrial Silicone 3D Printing

“Silicones are increasingly be -ing used in several sectors due to ris-ing material requirements and theapproaching limits of standard mate-rials,” says Robert Gnann, head ofWacker’s silicones business division.“The unique physical and chemicalproperties of silicones can be com-bined in several ways, and theirexcellent process properties havemade them indispensable in manyindustries.”

The company is now offering atrailblazing line of products led bytwo technologies: textile sensorsbased on extremely thin siliconefilms designed to enable a virtualreality display of body movement,

and an industrial-scale 3D printerfor silicones.

“So far, it has not been possibleto print silicone parts with existingindustrial 3D technology,” saysGnann. “The 3D process developed

by Wacker, named ACEO®, is a mile-stone in additive manufacturing.With ACEO technology, it is possibleto manufacture silicone parts andassemblies with complex geome-tries.”

The industrial 3D printer isbased on a drop-on-demand methoddeveloped by the company. Theprinter head deposits tiny siliconedroplets on a substrate. The work-piece is then built up layer by layer.

The silicone is formulated so that thedroplets flow together before the UV-curing process begins. The dropletsand layers produce a homogenousworkpiece similar to an injection-molded part. By using water-solublesupport materials, overhang materi-als and internal lattices can also becreated.

The use of additive manufactur-ing is growing rapidly in medicalapplications. Bio-modeling and cus-tomized geometries are particularlypromising areas. Silicones are heat-resistant, flexible at low tempera-tures, transparent, and biocompati-ble. They are also easy to pigmentand demonstrate good damping prop-erties.

Ultra-Thin Textile Sensors

Three years ago Wacker intro-duced its Elastosil® film. Since then,the company has been developingspecific applications for the materialwith a particular focus on textile sen-sors, exploiting the electrical proper-ties of silicone. The film is embeddedbetween two conductive electrodesmade of carbon-black-filled silicones.Together, the layers form a flexiblecapacitor that can store an electriccharge. If the silicone capacitor issubjected to tension or compression,its capacitance changes. The subtletyof these changes can be measured

By Florian Degenhart, Wacker Chemie AG

Elastosil film being manufactured in a cleanroom in Burghausen, Germany.

Continued on next page

and used for sensory purposes.Elastosil film is made under

cleanroom conditions without the useof solvents. The company’s produc-tion process creates extremely thinsilicone films in a range of thickness-es from 20-400 µm. The film thick-ness across the entire width andlength of the film web deviates fromspecification by ±5 percent at most.This silicone film enables the devel-

opment and realization of innovativesensors and actuators for segmentssuch as robotics, medical technology,and lifestyle products. The range ofapplications extends from pumps,switches, electrical relays and mem-branes to movement sensors in tex-tiles.

Liquid Silicone Rubber

Wacker has developed severalnew grades of liquid silicone rubber(LSR): Elastosil LR 3003/90, LR3020/60, LR 3072/50, and LR3016/65, along with LR 5040, whichis a new LSR that contains signifi-cantly less volatile components. LR3003/90 has been designed to curerapidly to form an exceptionally hardand high-modulus elastomer with ahardness of 90 Shore A. This makes

the material suitable for cost-effec-tive, large-scale production of dimen-sionally stable silicone products. Itcan also be used as the hard compo-nent in hard/soft combinations. Thecompany has also introduced a liquidsilicone rubber that cures to form asteam-resistant and hydrolytically-stable elastomer. Standard siliconeelastomers can only withstandsuperheated steam for short periods,

making them less suitable for manu-facturing seals and gaskets exposedto hot fluids. The company’s 3020/60grade is largely resistant to hydroly-sis and retains its elasticity when incontact with superheated steam. Thefast-curing LSR is suitable for high-ly-automated injection-molding, ena -bling large-scale production of mold-ed seals and other products that needto permanently or regularly with-stand hot water or steam.

The self-adhesive LSR 3072/50bonds to a number of thermoplastics,such as polyamide (PA) and poly-butylene terephthalate (PBT) with-out pretreatment. The LSR curesquickly to form an oil-bleeding elas-tomer with high elastic recovery. The

material is particularly suited forsealing two-component molded parts.Typical areas of application includeautomotive electronics and electricalsystems, where the product is used insingle-wire seals and connector hous-ings with radial seals applied byinjection molding.

The 3016/65 is designed especial-ly for automotive engineering applica-tions. In addition to its excellentmechanical properties the materialhas enhanced resistance to substanceslike hot motor oil, even after long peri-ods of time. The company’s LR 5040 isa non-post-cure, low-volatile LSR. Theproduct contains significantly lessvolatile components than existingproducts, which allows it to provide

good transparency and mechanicalproperties without post-curing. Inmany cases, such as baby care, med-ical and food-contact applications,processors can skip post-curing, sav-ing money and time. The LSR is alsowell-suited for injection molding.

Silicone Encapsulants for Lighting

Wacker has also released newencapsulants for LEDs (primaryoptics), and for optical lenses andcoupling elements (secondary optics):Lumisil® 590 and 591, 740 and 770,and 7601. Lumisil 590 and 591 arehighly-transparent, addition-curingsilicone encapsulants. They form

December, 2016 Page 75www.us- tech.com

Wacker Silicone R&D to the Forefront

A technician determines thecompression set of an elastomerby storing compressed materialin various conditions, such as

superheated steam.

Stiffness comparison of Elastosil LR 3003/90 (left) and

standard LSR (right).

1 2 9:15 AM

Continued from previous page

Continued on next page

elastomers with a refractive index of1.53, which ranks them among high-refractive-index (HRI) encapsulants,enabling excellent light efficiency.

The silicones are almost com-pletely transparent to light in thevisible spectral range (400-700 nm)and do not yellow under intense radi-ation. Lumisil 590 and 591 aredesigned to protect LED chips fromenvironmental influences to prolongtheir service lives. These siliconecompounds are able to be processedin industrial metering processes,such as dispensing.

Lumisil 740 and 770 are nor-mal-refractive-index (NRI) encapsu-

lants that have a refractive index of1.41, which is typical of polydi-methylsiloxanes.

Along with protecting chipsfrom environmental influences, theycan serve as carriers of luminescentdyes, selectively influencing the colorof the light emitted by the LED. Aspecial feature of 740 and 770 is theirextremely high heat, light and ther-mal-shock resistance.

Due to their stability, the newsilicones are particularly suitable forencapsulating LED chips with strongheat generation and intense lightemission.

Wacker developed its LumisilLR 7601 for manufacturers of optical

lenses and coupling elements. Theproduct is predominantly character-ized by a significantly lower volatilescontent than the previous grade,which reduces post-curing time. Theencapsulant is suitable for lenses,sensors and optical coupling elementsin lighting technologies and can beprocessed cost-effectively in large-scale injection molding processes.

Further Product Highlights

The company is also introducingnew polymer additives for bioplasticcompounds. Its Vinnex® additivesconsiderably enhance the processingand properties of biopolyesters orblends with starch.

Vinnex 2526 has been formulat-ed to simplify the manufacture ofhighly-transparent, rigid polylacticacid (PLA) films. The company’sVinnex 2522, 2523 and 2525 productlines are designed to significantlyimprove processing and heat-sealingproperties in paper coatings withPLA or polybutylene succinate.

Vinnex 8880 was created to optimizethe flow properties in the melt forinjection-molding applications and3D printing, so that temperature-sensitive and complex items can bereadily produced.

Wacker’s Primer G 790 toluene-free (TF) is used to achieve reliableadhesion between addition-curingsilicone rubbers and hard substratessuch as aluminum, stainless steel orglass. In comparison with many con-ventional adhesion promoters, theprimer contains no toluene or otheraromatic compounds.

The Elastosil® color paste FLUV fluorescent was designed for thefluorescent marking of addition-cur-ing silicone rubber. Silicone moldedparts or coatings pigmented with thenew paste shine a deep blue-violetunder UV light. Silicone processorscan make use of this property todevelop computer-controlled qualitycontrol systems in manufacturing.

The electrically-conductive sili-cone rubber dispersion Powersil® 403has been developed for furnishingthe outer conductive film on fittingsfor transmission and distributioncables.

The product yields a coatingcharacterized by high elasticity, goodmechanical properties and scrubresistance. This makes the disper-sion suitable even for cable fittings tobe installed by cold-shrink processes.The product contains no aromaticcompounds such as toluene.

Finally, Semicosil® 811, a rapid-curing silicone rubber adhesive forelectric applications, is designed foroven-free processing. Even with littleheating, the product rapidly bonds toseveral substrates. Manufacturers ofelectronic components are able toadapt the processing of the adhesiveto production processes in a flexibleway, cutting down cycle times. Dueto its durability, which is typical ofsilicones, 811 is especially suitablefor automotive electronics and dis-play applications.

Contact: Wacker ChemicalCorp., 3301 Sutton Road, Adrian,MI 49221 % 888-922-5374 fax: 517-264-8246 E-mail: info.usa@wacker.com Web: www.wacker.com r

Page 76 December, 2016www.us- tech.com

Wacker Silicone R&D to the Forefront

Wacker’s ACEO technologyenables complex silicone 3D

printing.

Continued from previous page

December, 2016 Page 77www.us- tech.com

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Eagan, MN — Ironwood Electronicsrecently introduced a new BGA sock-et design that uses a high-perform-ance elastomer capable of 75 GHz

with low inductance and is suitablefor applications with wide tempera-ture ranges. The GT-BGA-2052 sock-et is designed for 17 x 17 mm (0.7 x0.7 in.) package sizes and operates at

bandwidths up to 75 GHz with lessthan 1 dB of insertion loss.

The socket is designed to dissi-pate a few watts through the compres-

sion screw and can be customizedup to 100W with a modified findesign on top of the screw andwith the addition of an axial flowfan. The contact resistance is typ-ically 30 mW per pin.

The socket is mounted onthe target PCB with no solderingand uses little space on theboard, which allows other com-ponents to be placed close by.Other passive components canbe placed on the back side of thePCB by creating custom cutoutsin the stiffener plate. The socketis built with a clamshell lid,allowing ICs to be changed outquickly. The GT-BGA-2052 sock-et is constructed with a high-per-formance and low-inductanceelastomer contactor. Its operat-ing temperature range is –55 to

+160°C (–67 to +320°F).Contact: Ironwood Electronics,

1335 Eagandale Court, Eagan, MN55121 % 952-229-8200 E-mail: info@ironwoodelectronics.com Web: www.ironwoodelectronics.com

Ironwood Intros HighPerformance BGA Socket

GT-BGA-2052 socket.

Middletown, CT — The memory divi-sion of Kaman Precision Products isnow offering its Model 9700 series ofhigh-performance, ruggedized digitalstorage systems. The 9700 is a com-

plete data transfer system designedto align with Future AirborneCapability Environment (FACE™)standards and operate in the harsh-est military, aerospace and industri-al environments. The new productsinclude an electronics module, aground station adapter with encryp-

tion key enabled, and encryption keyprogrammer. The series also con-tains the company’s new SATA card,with a ruggedized design, small formfactor, high memory density, and on-card encryption providing data-at-rest functionality. The Kaman SATAcard is hermetically-sealed to protectit from the most severe conditions.

The company also offers itsproven model 9410 data storage solu-tion. The storage system has an HVdifferential SCSI interface with athroughput of 500 kB/s and a storagecapacity of up to 64 GB, contains twoKaman Sentinel PC cards and runson 28 VDC.

Contact: Kaman PrecisionProducts, 217 Smith Street,Middletown, CT 06457 % 860-632-4536 E-mail: memory@kaman.com Web: www.kaman.com

Digital Data StorageSystems from Kaman

Model 9740 data storage system.

Highland Village, TX — EOS Powerhas released a series of ultra-low-pro-file (ULP) medical and commercial,high-efficiency, AC/DC power supplies

with power densities of up to 30 W/in3

and height profiles of 0.75 in. (19 mm).

The (M)ULP40, 180 and 250Wseries offer customers a standard 2 x4 and 3 x 5 in. (5 x 10 and 7.5 x 12.5cm) open frame medical and commer-cial grade power solutions in height-restricted environments withouthaving to change mechanical foot-prints and still increasing device effi-ciency. According to the company,the height profile is a market first inthis AC/DC open frame power rangewhich expands the options availableto design engineers.

Contact: EOS North America,790 Oakwood Court, HighlandVillage, TX 75077 % 972-273-0600fax: 972-317-5450 E-mail: paul.scholz@eospower.com Web: www.eospower.com

EOS Power Releases Low-Profile Power Supplies

Low-profile AC/DC power supply.

Page 78 December, 2016www.us- tech.com

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Bridgeville, PA — OKW has unveilednew IP65 silicone sealing kits for itsNET-BOX wall mount enclosures.The optional seals’ pre-molded con-tours make them easier to fit thantraditional round cord versions —

speeding up installation times.NET-BOX is useful for a wide

range of applications, including con-trol units, building management,data acquisition, data systems engi-neering, measurement, supervisionterminals with access control, andmedical technology. Its curved top lidconceals cables and connectors.

The enclosures’ three-part con-struction makes screws invisible fromthe front. Anti-tamper Torx T10screws are supplied as standard. Thethree-point wall mounting systemensures that there is no need to openthe main electronics section. Only thefront lid has to be refitted after instal-lation. The bottom section has screwpillars for mounting PCBs. Available

in three sizes from 5.5 x 5.5 x 1.8 in.(14 x 14 x 4.6 cm) to 8.7 x 8.7 x 2 in. (22x 22 x 5 cm), the boxes offer plenty ofspace for PCBs and interfaces. Casesare molded from high-quality lightgray (RAL 7035) ASA+PC-FR (UL 94V-0) for UV stability.

Contact: OKW Enclosures, Inc.,3000 Old Pond Road, Bridgeville, PA15017 % 412-220-9244 E-mail: seanb@okwenclosures.com Web: www.okwenclosures.com

OKW Seals NET-BOXEnclosures to IP65

NET-BOX enclosures.

Phoenix, AZ — ON Semiconductor hasintroduced a highly-integrated single-chip power bank solution for the devel-opment of next-generation lithium ionpowered products. The LC709501Ftotal lithium ion battery solutionoffers broad a broad power and volt-age/current output range of 5, 9 and12V operation, with a maximumcharge/discharge capability of up to30W through simple FET selection.

The LC709501F determineswhat type of device is connected andautomatically selects the fastest avail-able method for charging. Advancedusers can even reprogram theLC709501F to support custom charge/discharge profiles, as well as USBType C and PD “Policy Engine” func-tions. This single-chip solution in -cludes integrated fuel gauge function,configurable I/O, LED drivers, I2Cinterface, and drivers for externalpower MOSFETs, providing systemflexibility. A design reference kit isavailable to speed product time tomarket. The LC709501F supports var-ious output power levels up to 30W bychanging external MOSFETs. In addi-

tion, it includes an integrated USB 2.0full speed host controller.

The USB host controller supportsconnectivity with iOS and Androidapps that enable the device to commu-

nicate with the smartphone and use itsdisplay to show information concern-ing the battery health and the charg-ing process.

Contact: ON Semiconductor,5005 E McDowell Road, Phoenix, AZ85008 % 602-244-6600 Web: www.onsemi.com

ON Semiconductor IntrosIntelligent Power Controller

LC709501F Li-ion battery control chip.

Pittman Adds 32 BrushlessMotors to e-Commerce Store

Harleysville, PA — Pittman®, a busi-ness unit of AMETEK PrecisionMotion Control, has added itsEC044A and EC042B series brush-less motors to its 24-hour PittmanExpress e-Commerce store. Bothseries come with the company’s E30encoder and PLG42S planetary gearfor outstanding performance in acompact package.

The EC044A is an economical44 mm (1.7 in.) brushless motoravailable in a range of lengths, wind-ings and gear ratios. Performanceranges from 0.04 to 4 Nm of ratedtorque with rated speeds from 40 to4,500 rpm. The EC042B offers veryhigh torque in a small, 42 mm (1.65in.) diameter motor. Performanceranges from 0.06 to 8.8 Nm of ratedtorque with speeds from 40 to 4,500rpm in stock solutions.

The Pittman Express e-Com -merce store offers a range of solutions

that are available immediately, whilealso offering modifications.

Contact: Pittman Motors, 343Godshall Drive, Harleysville, PA19438 % 267-933-2105 E-mail:info.pittman-motors@ametek.comWeb: www.pittman-motors.com

Brushless motors.

Auburn Hills, MI — Rigaku Innovative Tech -nologies (RIT) has launched a program to cleanand recoat old synchrotron optics, either retaskingthem for new applications, or to refurbish andrepair them for continued use. The process offers aless costly alternative to the purchasing of newoptics. Along with refurbished products, the com-pany offers new optics and coating for synchrotronapplications.

Synchrotron beamline end stations and ana-lytical instruments most often operate with high-intensity X-rays. Such high-intensity beams canresult in damage to single film and multilayercoatings. Because synchrotron and similar custom-made optics typically require extremely precisecoatings on premium quality substrates, thesesubstrates and coatings can be very expensive andrequire long lead times.

Optical refurbishment is an effective and effi-cient solution to address the majorchallenges experienced in synchro-tron applications. The process pro-vides recovery of optical performanceby removing the damaged multilayeror single film and re-depositing anew coating, removal of contami-nants without damaging the underly-ing multilayer structure, and preser-vation of the original high-qualitysubstrate surface without the needfor re-polishing. The process allowsfor maintenance of low micro rough-ness on any scale, from low spatialfrequency roughness to high spatial

frequency roughness. RIT’s process can restoresome damage to high spatial frequency roughness.If the optic is too damaged in any roughness scale,

mechanical re-polishing may still be required.RIT also manufactures new synchrotron

optics, with high reflectivity and high precisioncoatings available on mirrors up to 1.5m (4.9 ft)long. These coatings can be single film, bi-materialor tri-material multilayers, with protective topcoats and adhesion layers available. The companycan produce optics with coatings in narrow stripesto allow multiple material systems, as well as mul-tiple d-spacing films coated on the same optic. Inaddition, the company produces double multilayermonochromators on optics up to 1.5m (4.9 ft) long.In these applications, substrates such as Si (111)and other natural crystals can form one stripe ofthe monochromator.

Contact: Rigaku Innovative Technologies,Inc., 1900 Taylor Road, Auburn Hills, MI 48326 % 248-232-6400 E-mail: info@rigaku.com Web: www.rigaku.com

December, 2016 Page 79www.us- tech.com

Can sit across iOS, Android and Windows devices for full platform ubiquity

For more information

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Properly categorize all of your content, from brochures and catalogs to user manuals.

Tight version control, so that older documentation is never presented to users of the app.

Provide a truly responsive, smartphone friendly viewing mode for smartphone users, called PhoneView.

Permission management to make sure you can control who sees what documents.

Enhanced search options for easy discoverability among readers.

YUDU’s mobile Document Center App can provide employees and customers with a single destination from which to access brochures and catalogs to user manuals and datasheets.

Organize and take control of your documents

Refurbished striped optics.

Rigaku Launches Optics Refurbishment Program

Samtec USASupports AvnetTransceiverEvaluation KitNew Albany, IN — Engineers con-stantly face challenges routing multi-gigabit transceivers (MGTs). The newAvnet Zynq Transceiver EvaluationKit (AZTEK) provides a low-cost refer-ence design that streamlines the eval-uation of FPGA SoC MGTs thatrequire transmission of large amountsof data at high communication rates orover long distances.

The AZTEK kit uses Samtec’sSMA RF316 cable assemblies thatroute high-data signals in industrial,

consumer, medical and a variety ofother applications, which makesthese assemblies useful in theAZTEK platform. AZTEK includesfully-tested Samtec cables assem-blies that minimize developmenttime with FPGA SoC MGTs.

The RF316 series cable assem-blies provide off-board Zynq trans-ceiver connectivity and 50W imped-ance up to 6 GHz. The company’s fullline of RF solutions includes 50W and75W cable assemblies, connectors andcomponents, as well as micro highfrequency U.FL and W.FL systems.

Contact: Samtec USA, 520 ParkEast Boulevard, New Albany, IN47151 % 812-944-6733 fax: 812-948-5047 E-mail: info@samtec.com Web: www.samtec.com

Transceiver evaluation kit withSamtec cable assemblies.

Rosemont, IL — The ASSEMBLYShow, held from October 25-27, inRosemont, Illinois, at the Donald E.Stephens Convention Center was agreat success, with the producersreporting growth in all areas. Theexhibit hall floor had 276 exhibitsoccupying 67,000 ft2 (6,224m2), a 12percent increase over 2015. Withover 7,000 industry professionalsfrom 48 states and 41 countries reg-istered to attend, the show also saw a5 percent increase in registrationsover 2015. The exhibitors respondedenthusiastically with over 70 percentrenewing booth space on-site for nextyear’s show, which will take place inthe same venue October 24-26, 2017.

“When we launched TheASSEM BLY Show four years ago wewere committed to providing theattendees an interactive show floorwhere they could see working machin-

ery offering solutions. We are pleasedthat this year’s event had the mostlive equipment in the exhibit hall aswell as a comprehensive educationprogram, exhibitors showcasing theirlatest products and solutions, andvaluable networking opportunities,”said Tom Esposito, publisher ofASSEMBLY Magazine. “We arethrilled with the response from theindustry and thank the exhibitors,attendees, and speakers who madethis such a worthwhile event for thefourth year in a row.”

The exhibit hall displayed work-ing machinery, representing the bestfrom the vendor community. Exhib -itors included Promess, ASG, Festoand Accounting Business Solutions byJCS and Schmidt Technology.Theevent kicked off with the very popular“Taste of Rosemont” networkingreception on Tuesday evening, spon-

sored by ASG, which attracted hun-dreds of attendees who had thechance to enjoy food and drink in acasual setting while visiting with theexhibitors on the show floor. All of theattendees and exhibitors then had achance to network and mingle onWednesday evening at a fun and live-ly pub night, complete with largescreen TVs showing the World Series.The evening was sponsored by Festo.

The robust conference program,which kicked off on Tuesday, includedindustry experts sharing their knowl-

edge about the industrial IoT, manag-ing mixed model assembly lines, col-laborative robotics, bringing manufac-turing back to America, and concur-rent production. The education pro-gram wrapped up with a panel discus-sion on recruiting and retainingwomen in manufacturing with pan-elists Chelsea Baker from ABBGroup, Elizabeth Rolinski fromJohnson Controls, Shelley RyanCarlson, Danfoss, and Gina Vassallofrom Caterpillar, who discussed work-

Page 80 December, 2016www.us- tech.com

hi-TeCh evenTShi-TeCh evenTS

MORE SHOWS: www.topline.tv/tradeshows.cfm

2017EDITOrIAL CALENDAr

ISSUE EDITORIAL SHOW DATE LOCATION

Jan/Feb Production & PackagingElectronics West/MDM PPAPEX PP APEX

DesignConATX/ Electronics West/MDMAPEX

Jan. 31-Feb. 2Feb. 7-9Feb. 14-16

Santa Clara, CAAnaheim, CASan Diego, CA

March Test & MeasurementATX Midwest PP

APECATX Midwest

March 28-30March 29-30

Tampa, FLCleveland, OH

April/May SMT & ProductionNepcon China PPSMT/Hybrid/PKG PPEDS PP

Nepcon ChinaESC Wire Processing TechSMT/Hybrid/PKGEastecEDS

April 25-27May 3-4May 11-12May 16-18May 16-18May 16-19

Shanghai, ChinaBoston, MAMilwaukee, WINuremberg, Germany

Las Vegas, NVJune Components & Distribution

ATX East /MDM PPATX East /MDM June 13-15 New York, NY

July Test & AutomationSemicon West/Intersolar PP

SEMICON West/Intersolar July 11-13 San Francisco, CA

August Production & PackagingNepcon South China PP

Nepcon South China Aug. 29-31 Shenzhen, China

September PCB & AutomationSMTAI PP

AutotestconWESTECPCB West SMTAIIMAPS

Sept. 12-14Sept. 12-14Sept. 13-15Sept. 19-20Oct. 10-12

Schaumburg, ILLos Angeles, CASanta Clara, CARosemont, ILRaleigh, NC

October Assembly & Production Productronica PP

The Assembly ShowSouth-TecFABTECHMDM MinneapolisProductronica

Oct. 24-26Oct. 24-26Nov. 7-9Nov. 8-9Nov. 14-17

Rosemont, ILGreenville, SCChicago, ILMinneapolis, MNMunich, Germany

Nov/Dec Components & DistributionElectronics West/MDM PP

ATX/ Electronics West/ Feb. 13-15 Anaheim, CA

PP = Product Preview

Trade Show Calendar

Mfg. Advancements Showcased atExpanded ASSEMBLY Show

December 14-16, 2016, SEMICON Japan. * Tokyo Big Sight, Tokyo, Japan.

Contact: SEMI, 3081 Zanker Road, San Jose, CA 95134 % 408-943-6900 fax: 408-428-9600

Web: www.semi.org

May 11-12, 2017, Electrical Wire Processing Tech Expo. *Wisconsin Center,

Milwaukee, WI. Contact: Expo Productions, Inc., 510 Hartbrook Drive, Hartland, WI 53029

% 262-367-5500 E-mail: cheryl@epishows.com Web: www.epishows.com

January 31-February 2, 2017, DesignCon. *Santa Clara Convention Center, Santa

Clara, CA. Contact: UBM Canon, 2901 28th Street, Suite 100, Santa Monica, CA 90405

% 310-445-4200 Web: www.ubmcanon.com

January 5-8, 2017, CES. *Las Vegas Convention Center, Las Vegas, NV. Contact:

Consumer Technology Association, 1919 S Eads Street, Arlington, VA 22202 % 866-233-7968

E-mail: cesreg@cta.tech Web: www.ces.tech

February 14-16, 2017, IPC APEX Expo. *San Diego Convention Center, San Diego, CA.

Contact: IPC, 3000 Lakeside Drive, 105 N Bannockburn, IL 60015 % 847-615-7100

fax: 847-615-7105 Web: www.ipc.org

March 29-30, 2017, ATX Midwest. * Cleveland Convention Center, Cleveland, OH.

Contact: UBM Canon, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200

Web: www.ubmcanon.com

February 7-9, 2017, MD&M West. *Anaheim Convention Center, Anaheim, CA.

Contact: UBM Canon, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200

Web: www.ubmcanon.com

March 26-30, 2017, APEC. * Tampa Convention Center, Tampa, FL. Contact: Courtesy

Associates, 2025 M Street NW, Suite 800, Washington DC 20036 % 202-973-8664

fax: 202-331-0111 E-mail: apec@apec-conf.org Web: www.apec-conf.org

April 19, 2017, SMTA Atlanta Expo. *Infinite Energy Parkway (formerly Gwinnett

Center), 6400 Sugarloaf Parkway, Duluth, GA. Contact: SMTA, 6600 City West Parkway,

Suite 300, Eden Prairie, MN 55344 % 952-920-7682 fax: 952-926-1819 Web: www.smta.org

April 24-25, 2017, IEEE Wireless and Microwave Technology Conference WAMI-

CON 2017. *Hilton Cocoa Beach, Cocoa Beach, FL. Contact: IEEE, 3 Park Avenue, 17th

Floor, New York, NY 10016 % 212-419-7900 fax: 212-752-4929 E-mail: ieee-mce@ieee.org

Web: www.wamicon.org

Messe München Partnerswith SEMI EuropeBerlin, Germany — SEMI and MesseMünchen have partnered to co-locateSEMICON Europa with productroni-ca and electronica (alternating years)in Munich, Germany. The co-locatedevents will be held for the first timefrom November 14-17, 2017, at theMesse München Exhibition Center,creating one of the strongest singleevents for electronics manufacturingin Europe, and broadening the rangeof attendees across the electronics

supply chain. Attendees of produc-tronica and electronica are now givenan extended platform with the inclu-sion of SEMICON Europa, which isfocused largely on the electronicsmanufacturing supply chain andsemiconductor manufacturing. Theco-located events will expandattendee opportunities to exchangeideas and promote technologicalprogress.

Continued on next page March 14-16, 2017, SEMICON China. * Shanghai New International Expo Centre,

Shanghai, China. Contact: SEMI, 3081 Zanker Road, San Jose, CA 95134 % 408-943-6900

fax: 408-428-9600 E-mail: semihq@semi.org Web: www.semi.org

December 7-9, 2016, IPC APEX South China. * Shenzhen Convention & Exhibition

Center, Shenzhen, China. Contact: IPC, 3000 Lakeside Drive, 105 N Bannockburn, IL 60015

% 847-615-7100 fax: 847-615-7105 Web: www.ipc.org

April 25-27, 2017, Nepcon China. *Shanghai World EXPO Exhibition and Convention

Center, Shanghai, China. Contact: Reed Exhibitions (Shanghai) Co., Ltd., 42F Intercontinental

Center, 100 Yutong Road, Zhabei District, Shanghai, 200070 % +86-21-2231-7000 fax: +86-21-

2231-7181 E-mail: tim.wang@reedexpo.com.cn Web: www.nepconchina.com

May 16-18, 2017, Eastec. *Eastern States Exposition, West Springfield, MA. Contact:

SME, One SME Drive, Dearborn, MI 48128 % 313-425-3000 E-mail: service@sme.org Web:

www.sme.org

Continued on next page

May 16-19, 2017, EDS. *The Mirage Las Vegas, Las Vegas, NV. Contact: EDS, 1111

Alderman Drive, Suite 400, Alpharetta, GA 30005 % 312-648-1140 fax: 312-648-4282

E-mail: eds@edsconnects.com Web: www.edsconnects.com

May 16-18, 2017, SMT/Hybrid/Packaging. *Nuremberg Exhibition Centre, Nuremberg,

Germany. Contact: Mesago Messe Frankfurt GmbH, Rotebuehlstrasse 83-85, D-70178

Stuttgart, Germany % +49-711-61946-0 fax: +49-711-61946-91 E-mail: smt@mesago.com

Web: www.smthybridpackaging.com

Santa Monica, CA — UBM will revealthe winners of its 16th annual GoldenMousetrap Awards on the first day ofthe company’s Anaheim event, whichwill be held from February 7-9, 2017,at the Anaheim Convention Center, inAnaheim, California. The broad-rang-ing event includes ATX West,Electronics West, MD&M West,Pacific Design and Manufacturing,PLASTEC West, and WestPack. Theawards recognize companies, tech-nologies and individuals that are driv-ing progress and innovation in prod-

uct design and manufacturing.With its Golden Mousetrap

Awards, UBM honors the current ren-aissance of design and manufacturingby celebrating those companies andpeople who are making it possible,while showcasing engineering andmanufacturing as rewarding careerchoices for the next generation of ris-ing stars.

“We are pleased to announceNorth America’s largest annualdesign and manufacturing tradeshow and conference. Spanning sixindustries — packaging, plastics,medical, electronics, automation androbotics, and design — the show will

focus on trends that shape manufac-turing today and for the future,” saidNina Brown, vice president of events,UBM Americas. “In addition to adiverse calendar of content, educa-tion and expo events, join us for the16th annual Golden MousetrapAwards on February 7th where wewill celebrate the pioneering people,companies, and technologies in prod-uct design and manufacturing.”

Golden Mousetrap Award cate-gories include: automation and con-trol; design tools: hardware and soft-ware; electronics and test; materialsand assembly; and Gadget Freak ofthe Year (in partnership with Allied

Electronics). Within these five dis-tinct categories, there are 17 subcat-egories of products. All products sub-mitted for award consideration arecommercially available in the U.S.

During the ceremony, DesignNews will present a lifetime achieve-ment award to an engineering lumi-nary who has made extraordinarycontributions to the field during hisor her career, as well as to a risingstar engineer whose career showstremendous opportunity ahead.

Contact: UBM Canon, 2901 28thStreet, Suite 100, Santa Monica, CA90405 % 310-445-4200 Web: www.ubmcanon.com

December, 2016 Page 81www.us- tech.com

UBM to Host 16th Annual Golden Mousetrap Awards

Messe MünchenSEMI Europe

Falk Senger, managing directorof Messe München, said of theannouncement, “The co-location ofthese events strengthens the globalorientation of electronica and pro-ductronica, in addition to reinforcingthe importance of Munich as one ofthe epicenters of the internationalelectronics industry.”

SEMICON Europa showcasesthe most advanced and innovativeelectronics manufacturing technologyin Europe. Key segments includesemiconductor front-end and back-endmanufacturing, MEMS/sensors, sec-ondary equipment, advanced packag-ing, and applications such as theInternet of Things (IoT).

“The co-location of SEMICONEuropa with productronica and elec-tronica is an excellent fit withSEMI’s global trade associationstrategy to connect the breadth ofthe global electronics manufacturingsupply chain,” said Denny McGuirk,president and CEO of SEMI. Munichis a convenient central location inEurope with easy access for interna-tional visitors. The co-located eventsare expected to bring tens of thou-sands of visitors together.

Contact: SEMI, 3081 ZankerRoad, San Jose, CA 95134 % 408-943-6900 fax: 408-428-9600 E-mail: semihq@semi.org Web: www.semi.org

Continued from previous page

ASSEMBLYShow...ing in the male-dominated manufac-turing and engineering field and whydiversity and inclusion is so impor-tant to the manufacturing process.

In addition, there were a dozeneducational sessions that were held intheaters set up on the exhibit hallfloor. All of the presentations and ses-sion recordings are available at theASSEMBLY Show’s website (www. -the assemblyshow.com). Presentationswere given by LACO Technologies,Henkel, RedViking, Panduit, NordsonEFD, Festo, Desoutter, Destaco,Balluff, Reshor ing Institute, RexrothBosch Group, and FlexCraft. Topicsincluded air leak testing methods,merging digital and physical manufac-turing, tackling today’s dispensinghead aches, machine safety, Industry4.0, and flexible automation.

Contact: BNP Media, 2401 WBig Beaver Road, Suite 700, Troy,MI 48084 % 248-362-3700 E-mail: amy@theassemblyshow.comWeb: www.theassemblyshow.com

SAN DIEGOCONVENTION CENTERCALIFORNIA | USA

TURN INSPIRATION INTO ELECTRONICS

INDUSTRY INNOVATION

Tuesday, February 14, 2017 | 8:30am-9:30amMayim Bialik, Actress & Neuroscientist“The Big Bang Theory - Making Science Cool (and Funny)”Wednesday, February 15, 2017 | 8:00am-9:00am

“The Future of Drones”

CONFERENCE & EXHIBITIONFEBRUARY 14-16

SFEBRUARY 1 1-16

Continued from previous page

Page 82 December, 2016www.us- tech.com

Advertiser..................................Page No. Advertiser..................................Page No. Advertiser...................................Page No.

ADVERTISER’S INDEX

ACCULOGIC . . . . . . . . . . . . . . . . . . . . . .33

ACL STATICIDE . . . . . . . . . . . . . . . . . . .40

ADI AMERICAN DISTRIBUTORS . . . .14

ADVANCED TEST EQPT RENTAL . . . .52

ALL FLEX . . . . . . . . . . . . . . . . . . . . . . . .64

AMERICAN HAKKO PRODUCTS . . . . .23

AMTECH MICROELECTRONICS . . . . .36

APEX . . . . . . . . . . . . . . . . . . . . . . . . . . . . .81

ASM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

AVEN TOOL . . . . . . . . . . . . . . . . . . . . . . .58

BETA LAYOUT USA . . . . . . . . . . . . . . . .40

CAMI RESEARCH . . . . . . . . . . . . . . . . . .17

CAMI RESEARCH . . . . . . . . . . . . . . . . . .48

CICOR TECHNOLOGIES . . . . . . . . . . . .61

COGISCAN . . . . . . . . . . . . . . . . . . . . . . . .34

CONECSUS . . . . . . . . . . . . . . . . . . . . . . .56

COUNT ON TOOLS . . . . . . . . . . . . . . . . .26

COUNT ON TOOLS . . . . . . . . . . . . . . . . .36

DESIGN-2-PART SHOWS . . . . . . . . . . . .18

DIGI-KEY . . . . . . . . . . . . . . . . . . . . . . . . . 2

DIVSYS INTL . . . . . . . . . . . . . . . . . . . . . .54

DL TECHNOLOGY . . . . . . . . . . . . . . . . .28

DOVE ELECTRONIC COMPONENT . .11

ECD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

EMI FILTER . . . . . . . . . . . . . . . . . . . . . .74

EPLAN SOFTWARE & SERVICES . . . .30

EUBANKS ENGINEERING . . . . . . . . . .43

EXATRON . . . . . . . . . . . . . . . . . . . . . . . .10

FANCORT INDUSTRIES . . . . . . . . . . . .68

FKN SYSTEK . . . . . . . . . . . . . . . . . . . . . .32

FLEXLINK SYSTEMS . . . . . . . . . . . . . . .68

FOSTER AND JAMES . . . . . . . . . . . . . .78

FUJI AMERICA . . . . . . . . . . . . . . . . . . . . 9

GLENBROOK TECHNOLOGIES . . . . . .14

GOWANDA ELECTRONICS . . . . . . . . .44

HAMMOND MFG . . . . . . . . . . . . . . . . . .39

HASCO RELAYS . . . . . . . . . . . . . . . . . . .62

HELUKABEL . . . . . . . . . . . . . . . . . . . . . .25

IDT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28

IMAGINEERING . . . . . . . . . . . . . . . . . . . 2

INGUN USA . . . . . . . . . . . . . . . . . . . . . . .38

INLAND EMPIRE COMPONENTS . . . .65

INLAND EMPIRE COMPONENTS . . . .82

INVENTEC DEHON . . . . . . . . . . . . . . . .64

IPTE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

IRONWOOD ELECTRONICS . . . . . . . . .50

JANOME INDUSTRIAL . . . . . . . . . . . . .72

JAPAN UNIX . . . . . . . . . . . . . . . . . . . . . .75

JTAG TECHNOLOGIES . . . . . . . . . . . . .69

JUKI AUTOMATION SYSTEMS . . . . . .29

KEYSTONE ELECTRONICS . . . . . . . . .55

KOH YOUNG . . . . . . . . . . . . . . . . . . . . . .53

KOKI SOLDER AMERICA . . . . . . . . . . .70

KOMAX . . . . . . . . . . . . . . . . . . . . . . . . . . .32

KYZEN . . . . . . . . . . . . . . . . . . . . . . . . . . .63

MASTER APPLIANCE . . . . . . . . . . . . . . 8

MCDRY . . . . . . . . . . . . . . . . . . . . . . . . . . .77

MENTOR GRAPHICS . . . . . . . . . . . . . . .59

MICRO CONTROL COMPANY . . . . . . .24

MICROSCAN . . . . . . . . . . . . . . . . . . . . . .60

MILL-MAX MFG . . . . . . . . . . . . . . . . . . .15

MILLER-STEPHENSON CHEMICAL . .58

MIRTEC . . . . . . . . . . . . . . . . . . . . . . . . . .19

MOLDED FIBERGLASS TRAY . . . . . . .26

NATHAN TROTTER . . . . . . . . . . . . . . . .20

NEU DYNAMICS . . . . . . . . . . . . . . . . . . .60

NIHON SUPERIOR . . . . . . . . . . . . . . . . .34

NORCOM SYSTEMS . . . . . . . . . . . . . . . .72

NORDSON ASYMTEK . . . . . . . . . . . . . .27

NORDSON DAGE . . . . . . . . . . . . . . . . . .49

NORDSON YESTECH . . . . . . . . . . . . . . .83

NTE ELECTRONICS . . . . . . . . . . . . . . . .12

PACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50

PANASONIC FACTORY SOLUTIONS .13

PARKER HANNIFIN/CHOMERICS . . .71

PI-PHYSIK . . . . . . . . . . . . . . . . . . . . . . . .71

PICO ELECTRONICS . . . . . . . . . . . . . . .52

PILLARHOUSE USA . . . . . . . . . . . . . . . .70

PLASMA ETCH . . . . . . . . . . . . . . . . . . . .66

POLYONICS . . . . . . . . . . . . . . . . . . . . . . .36

PPM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .82

PROTOTRON CIRCUITS . . . . . . . . . . . .22

PVA TEPLA AMERICA . . . . . . . . . . . . . .33

RCD COMPONENTS . . . . . . . . . . . . . . . .84

REHM THERMAL SYSTEMS . . . . . . . .57

SAKI AMERICA . . . . . . . . . . . . . . . . . . . .31

SALINE LECTRONICS . . . . . . . . . . . . . .35

SCHLEUNIGER . . . . . . . . . . . . . . . . . . . .42

SCIENSCOPE . . . . . . . . . . . . . . . . . . . . .51

SEHO SYSTEMS GmbH . . . . . . . . . . . . .30

SEIKA MACHINERY . . . . . . . . . . . . . . .38

SHENMAO GROUP . . . . . . . . . . . . . . . . .61

SIKAMA INTERNATIONAL . . . . . . . . . .56

SPEA AMERICA . . . . . . . . . . . . . . . . . . .47

STEINEL . . . . . . . . . . . . . . . . . . . . . . . . .62

SUNSTONE CIRCUITS . . . . . . . . . . . . .21

TAPECON . . . . . . . . . . . . . . . . . . . . . . . . .74

TEST RESEARCH . . . . . . . . . . . . . . . . . .76

TEXMAC . . . . . . . . . . . . . . . . . . . . . . . . . .67

TOMKEN INDUSTRIES . . . . . . . . . . . . .45

TOPLINE . . . . . . . . . . . . . . . . . . . . . . . . .82

TOTAL POWER INT'L . . . . . . . . . . . . . .44

US TECH . . . . . . . . . . . . . . . . . . . . . . . . .78

VIRTUAL INDUSTRIES . . . . . . . . . . . . .73

WACKER CHEMICAL . . . . . . . . . . . . . .37

WEST BOND . . . . . . . . . . . . . . . . . . . . . .66

XJTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . .41

YAMAHA . . . . . . . . . . . . . . . . . . . . . . . . . 5

YUDU MEDIA . . . . . . . . . . . . . . . . . . . . .79

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Send your list now to purchasing@iecsolutions.com

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December, 2016 Page 83www.us- tech.com

Page 84 December, 2016www.us- tech.com

In addition to a full line of standard components, RCD has been a key supplier of commercial & military-grade specialty products for 40 years, including some of the world’s smallest, largest, high/low temp extreme, high vibration/ power/ voltage/ current/ frequency and most stable state-of-the-art components ever made...

- Specialty fusing, microwave & hi-temp caps & resistors - Critical-use hi-rel components for mil/ space/ medical - Heat-sink/ water-cooled components, braking resistors

- R/C snubbers, hybrids, voltage dividers

- Choice of RoHS or SnPb plated terminations - SM & leaded inductors/ transformers/ choke coils

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sales@rcdcomponents.com Web:www.rcdcomponents.com

The Industry’s Widest Range of Passives