VS-VSKT26.., VS-VSKH26.., VS-VSKL26.., VS-VSKN26.. Series

10
VS-VSKT26.., VS-VSKH26.., VS-VSKL26.., VS-VSKN26.. Series www.vishay.com Vishay Semiconductors Revision: 26-Jul-2018 1 Document Number: 94629 For technical questions within your region: [email protected] , [email protected] , [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 AAP Gen 7 (TO-240AA) Power Modules Thyristor/Diode and Thyristor/Thyristor, 27 A MECHANICAL DESCRIPTION The AAP Gen 7 (TO-240AA), new generation of APP module, combines the excellent thermal performances obtained by the usage of exposed direct bonded copper substrate, with advanced compact simple package solution and simplified internal structure with minimized number of interfaces. FEATURES High voltage Industrial standard package UL approved file E78996 Low thermal resistance Designed and qualified for industrial level • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 BENEFITS Excellent thermal performances obtained by the usage of exposed direct bonded copper substrate Up to 1600 V High surge capability Easy mounting on heatsink ELECTRICAL DESCRIPTION These modules are intended for general purpose high voltage applications such as high voltage regulated power supplies, lighting circuits, temperature and motor speed control circuits, UPS and battery charger. PRIMARY CHARACTERISTICS I T(AV) or I F(AV) 27 A Type Modules - thyristor, standard Package AAP Gen 7 (TO-240AA) ADD-A-PAK MAJOR RATINGS AND CHARACTERISTICS SYMBOL CHARACTERISTICS VALUES UNITS I T(AV) or I F(AV) 85 °C 27 A I O(RMS) As AC switch 60 I TSM, I FSM 50 Hz 400 60 Hz 420 I 2 t 50 Hz 800 kA 2 s 60 Hz 730 I 2 t 8000 kA 2 s V RRM Range 400 to 1600 V T Stg -40 to +125 °C T J -40 to +125 °C

Transcript of VS-VSKT26.., VS-VSKH26.., VS-VSKL26.., VS-VSKN26.. Series

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AAP Gen 7 (TO-240AA) Power Modules Thyristor/Diode and Thyristor/Thyristor, 27 A

MECHANICAL DESCRIPTIONThe AAP Gen 7 (TO-240AA), new generation of APP module, combines the excellent thermal performances obtained by the usage of exposed direct bonded copper substrate, with advanced compact simple package solution and simplified internal structure with minimized number of interfaces.

FEATURES

• High voltage

• Industrial standard package

• UL approved file E78996

• Low thermal resistance

• Designed and qualified for industrial level

• Material categorization: for definitions of compliance please see www.vishay.com/doc?99912

BENEFITS

• Excellent thermal performances obtained by the usage of exposed direct bonded copper substrate

• Up to 1600 V

• High surge capability

• Easy mounting on heatsink

ELECTRICAL DESCRIPTION

These modules are intended for general purpose high voltage applications such as high voltage regulated power supplies, lighting circuits, temperature and motor speed control circuits, UPS and battery charger.

PRIMARY CHARACTERISTICSIT(AV) or IF(AV) 27 A

Type Modules - thyristor, standard

Package AAP Gen 7 (TO-240AA)

ADD-A-PAK

MAJOR RATINGS AND CHARACTERISTICSSYMBOL CHARACTERISTICS VALUES UNITS

IT(AV) or IF(AV) 85 °C 27

AIO(RMS) As AC switch 60

ITSM,

IFSM

50 Hz 400

60 Hz 420

I2t50 Hz 800

kA2s60 Hz 730

I2t 8000 kA2s

VRRM Range 400 to 1600 V

TStg -40 to +125 °C

TJ -40 to +125 °C

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ELECTRICAL SPECIFICATIONS

Notes(1) I2t for time tx = I2t x tx(2) Average power = VT(TO) x IT(AV) + rt x (IT(RMS))2(3) 16.7 % x x IAV < I < x IAV(4) I > x IAV

VOLTAGE RATINGS

TYPE NUMBERVOLTAGE

CODE

VRRM, MAXIMUM REPETITIVE PEAK

REVERSE VOLTAGE V

VRSM, MAXIMUM NON-REPETITIVE PEAK

REVERSE VOLTAGE V

VDRM, MAXIMUM REPETITIVE PEAK OFF-STATE VOLTAGE,

GATE OPEN CIRCUIT V

IRRM, IDRMAT 125 °C

mA

VS-VSK.26

04 400 500 400

15

06 600 700 600

08 800 900 800

10 1000 1100 1000

12 1200 1300 1200

14 1400 1500 1400

16 1600 1700 1600

ON-STATE CONDUCTIONPARAMETER SYMBOL TEST CONDITIONS VALUES UNITS

Maximum average on-state current (thyristors) IT(AV) 180° conduction, half sine wave,TC = 85 °C

27

A

Maximum average forward current (diodes) IF(AV)

Maximum continuous RMS on-state current,as AC switch

IO(RMS) 60

Maximum peak, one-cycle non-repetitive on-state or forward current

ITSM

orIFSM

t = 10 ms No voltagereapplied Sinusoidal

half wave,initial TJ = TJ maximum

400

t = 8.3 ms 420

t = 10 ms 100 % VRRMreapplied

335

t = 8.3 ms 350

Maximum I2t for fusing I2t

t = 10 ms No voltagereapplied

Initial TJ = TJ maximum

800

A2st = 8.3 ms 730

t = 10 ms 100 % VRRMreapplied

560

t = 8.3 ms 510

Maximum I2t for fusing I2t (1) t = 0.1 ms to 10 ms, no voltage reapplied TJ = TJ maximum

8000 A2s

Maximum value or threshold voltage VT(TO) (2)Low level (3)

TJ = TJ maximum0.86

VHigh level (4) 1.09

Maximum value of on-state slope resistance

rt (2)Low level (3)

TJ = TJ maximum9.58

mHigh level (4) 7.31

Maximum peak on-state or forward voltageVTM ITM = x IT(AV)

TJ = 25 °C 1.65 VVFM IFM = x IF(AV)

Maximum non-repetitive rate of rise ofturned on current

dI/dtTJ = 25 °C, from 0.67 VDRM,ITM = x IT(AV), Ig = 500 mA, tr < 0.5 μs, tp > 6 μs

150 A/μs

Maximum holding current IHTJ = 25 °C, anode supply = 6 V,resistive load, gate open circuit

200mA

Maximum latching current IL TJ = 25 °C, anode supply = 6 V, resistive load 400

orI(RMS) I(RMS)

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Note• Table shows the increment of thermal resistance RthJC when devices operate at different conduction angles than DC

TRIGGERINGPARAMETER SYMBOL TEST CONDITIONS VALUES UNITS

Maximum peak gate power PGM 10W

Maximum average gate power PG(AV) 2.5

Maximum peak gate current IGM 2.5 A

Maximum peak negative gate voltage -VGM 10

VMaximum gate voltage required to trigger VGT

TJ = -40 °CAnode supply = 6 Vresistive load

4.0

TJ = 25 °C 2.5

TJ = 125 °C 1.7

Maximum gate current required to trigger IGT

TJ = -40 °CAnode supply = 6 Vresistive load

270

mATJ = 25 °C 150

TJ = 125 °C 80

Maximum gate voltage that will not trigger VGD TJ = 125 °C, rated VDRM applied 0.25 V

Maximum gate current that will not trigger IGD TJ = 125 °C, rated VDRM applied 6 mA

BLOCKINGPARAMETER SYMBOL TEST CONDITIONS VALUES UNITS

Maximum peak reverse and off-state leakage current at VRRM, VDRM

IRRM,

IDRMTJ = 125 °C, gate open circuit 15 mA

Maximum RMS insulation voltage VINS 50 Hz3000 (1 min)

3600 (1 s)V

Maximum critical rate of rise of off-state voltage dV/dt TJ = 125 °C, linear to 0.67 VDRM 1000 V/μs

THERMAL AND MECHANICAL SPECIFICATIONSPARAMETER SYMBOL TEST CONDITIONS VALUES UNITS

Junction operating and storagetemperature range

TJ, TStg -40 to +125 °C

Maximum internal thermal resistance,junction to case per leg

RthJC DC operation 0.76

°C/WTypical thermal resistance,case to heatsink per module

RthCS Mounting surface flat, smooth and greased 0.1

Mounting torque ± 10 %to heatsink A mounting compound is recommended and the

torque should be rechecked after a period of3 hours to allow for the spread of the compound.

4Nm

busbar 3

Approximate weight75 g

2.7 oz.

Case style JEDEC® AAP Gen 7 (TO-240AA)

R CONDUCTION PER JUNCTION

DEVICESSINE HALF WAVE CONDUCTION RECTANGULAR WAVE CONDUCTION

UNITS180° 120° 90° 60° 30° 180° 120° 90° 60° 30°

VSK.26.. 0.212 0.258 0.330 0.466 0.72 0.166 0.276 0.357 0.482 0.726 °C/W

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Fig. 1 - Current Ratings Characteristics

Fig. 2 - Current Ratings Characteristics

Fig. 3 - On-State Power Loss Characteristics

Fig. 4 - On-State Power Loss Characteristics

Fig. 5 - Maximum Non-Repetitive Surge Current

Fig. 6 - Maximum Non-Repetitive Surge Current

Average on-state current (A)

Max

imum

allo

wab

le c

ase

tem

pera

ture

(°C

)

0 5 10 15 20 25 3080

90

100

110

120

130

180°120°

90°60°30°

RthJC (DC) = 0.76°C/W

0 10 20 30 40 5080

90

100

110

120

130

180°120°

90°60°30°

DC

RthJC (DC) = 0.76 °C/W

Average on-state current (A)

Max

imum

allo

wab

le c

ase

tem

pera

ture

(°C

)

Average on-state current (A)

Max

imum

ave

rage

on-

stat

e po

wer

loss

(W)

0 5 10 15 20 25 300

10

20

30

40

50180°120°

90°60°30°

RMS limit

Per leg, Tj = 125°C

Average on-state current (A)

Max

imum

ave

rage

on-

stat

e po

wer

loss

(W)

0 10 20 30 40 500

10

20

30

40

50

60180°120°

90°60°30°

RMS limit

DC

Per leg, Tj = 125°C

Pea

k ha

lf si

ne w

ave

on-s

tate

cur

rent

(A)

Number of equal amplitude half cycle current pulses (N)

1 10 100150

200

250

300

350

400At any rated load condition and with rated Vrrm applied following surge

Initial Tj = Tj max @ 60 Hz 0.0083 s

@ 50 Hz 0.0100s

Per leg

Pea

k ha

lf si

ne w

ave

on-s

tate

cur

rent

(A)

Pulse train duration (s)

0.01 0.1 1150

200

250

300

350

400Maximum Non-repetitive Surge

Current. Controlof conduction may not be maintained.

Versus Pulse Train DurationInitial Tj = 125°C

No Voltage ReappliedRated Vrrm reapplied

Per leg

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Fig. 7 - On-State Power Loss Characteristics

Fig. 8 - On-State Power Loss Characteristics

Fig. 9 - On-State Power Loss Characteristics

Total RMS output current (A)

Max

imum

tota

l on-

stat

e po

wer

loss

(W)

Maximum allowable ambient temperature (°C)

0 20 40 60 80 100 120 140

RthSA = 0.1 °C/W0.3 °C/W0.5 °C/W0.7 °C/W1 °C/W1.5 °C/W2 °C/W3 °C/W4 °C/W8 °C/W

0 10 20 30 40 50 600

10

20

30

40

50

60

70

80

90

100

180°120°90°60°30°

VSK.26 SeriesPer moduleTj = 125°C

Total output current (A)

Max

imum

tota

l pow

er lo

ss (W

)

Maximum allowable ambient temperature (°C)

0 20 40 60 80 100 120 140

RthSA = 0.1 °C/W0.3 °C/W0.5 °C/W0.7 °C/W1 °C/W1.5 °C/W3 °C/W8 °C/W

0 10 20 30 40 50 600

50

100

150

200

250

180°(sine)180°(rect)

2 x VSK.26 Seriessingle phase bridge connected

Tj = 125°C

Total output current (A) Maximum allowable ambient temperature (°C)

Max

imum

tota

l pow

er lo

ss (W

)

0 20 40 60 80 100 120 140

RthSA = 0.1 °C/W0.3 °C/W0.4 °C/W0.5 °C/W0.7 °C/W1 °C/W1.5 °C/W3 °C/W

0 20 40 60 800

50

100

150

200

250

300

120°(rect)

3 x VSK.26 Seriesthree phase bridge connected

Tj = 125°C

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Fig. 10 - On-State Voltage Drop Characteristics

Fig. 11 - Thermal Impedance ZthJC Characteristics

Fig. 12 - Gate Characteristics

Instantaneous on-state voltage (V)

Inst

anta

neou

s on

-sta

te c

urre

nt (A

)

0.0 1.0 2.0 3.0 4.0 5.0 6.01

10

100

1000

Tj = 25°C

Tj = 125°C

Per leg

Square wave pulse duration (s)

Tran

sien

t the

rmal

impe

danc

e Z th

JC (

°C/W

)

0.001 0.01 0.1 1 100.01

0.1

1

10Steady state valueRthJC = 0.76 °C/W(DC operation)

Per leg

0.1

1

10

100

0.001 0.01 0.1 1 10 100 1000

(b)(a)

Rectangular gate pulse

(4) (3) (2) (1)

(1) PGM = 100 W, tp = 500 µs(2) PGM = 50 W, tp = 1 ms(3) PGM = 20 W, tp = 25 ms(4) PGM = 10 W, tp = 5 ms

TJ = -40 °C

TJ = 25 °C

TJ = 125 °C

a)Recommended load line for

b)Recommended load line for

VGD

IGDFrequency Limited by PG(AV)

rated di/dt: 20 V, 30 ohmstr = 0.5 µs, tp >= 6 µs

<= 30% rated di/dt: 20 V, 65 ohmstr = 1 µs, tp >= 6 µs

IRK.26.. Series

Inst

anta

neou

s ga

te v

olta

ge (V

)

Instantaneous gate current (A)

VSK.

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ORDERING INFORMATION TABLE

Note• To order the optional hardware go to www.vishay.com/doc?95172

CIRCUIT CONFIGURATIONCIRCUIT DESCRIPTION CIRCUIT CONFIGURATION CODE CIRCUIT DRAWING

Two SCRs doubler circuit T

SCR/diode doubler circuit, positive control H

SCR/diode doubler circuit, negative control L

2 - Module type3 - Circuit configuration (see Circuit Configuration table)4 - Current code (26 A)5 - Voltage code (see Voltage Ratings table)

Device code

21 43 5

K T 26 / 16

1 - Vishay Semiconductors product

VS-VS

+

-

K1(5)

K2(7)

G2(6)

G1(4)

~(1)

(2)

(3)

VSKT

1

2

3

4 5 7 6

+

-

K1(5)

G1(4)

~(1)

(2)

(3)

VSKH

1

2

3

4 5

+

-

K2(7)

G2(6)

~(1)

(2)

(3)

VSKL

1

2

3

7 6

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SCR/diode common anodes N

Two SCRs common cathodes U

Two SCRs common anodes V

LINKS TO RELATED DOCUMENTS

Dimensions www.vishay.com/doc?95368

CIRCUIT CONFIGURATIONCIRCUIT DESCRIPTION CIRCUIT CONFIGURATION CODE CIRCUIT DRAWING

+

+

K1(5)

G1(4)

-(1)

(2)

(3)

VSKN

1

2

3

4 5

-

-

K1(5)

K2(7)

G2(6)

G1(4)

+(1)

(2)

(3)

VSKU

1

2

3

4 5 7 6

1

2

3

4 5 7 6

VSKV

+

+

K1(5)

K2(7)

G2(6)

G1(4)

-(1)

(2)

(3)

Document Number: 95368 For technical questions, contact: [email protected] www.vishay.comRevision: 11-Nov-08 1

ADD-A-PAK Generation VII - Thyristor

Outline DimensionsVishay Semiconductors

DIMENSIONS in millimeters (inches)35

RE

F.

30 ±

0.5

(1.1

8 ±

0.0

20)

29 ±

0.5

(1 ±

0.0

20)

Viti M5 x 0.8Screws M5 x 0.8

18 (0.7) REF.

15.5 ± 0.5(0.6 ± 0.020)

Fast-on tab 2.8 x 0.8 (0.110 x 0.03)

6.7

± 0

.3 (

0.26

± 0

.012

)

30 ±

1 (

1.18

± 0

.039

)

24 ±

0.5

(1 ±

0.0

20)

1

2 3

45

76

80 ± 0.3 (3.15 ± 0.012)

92 ± 0.75 (3.6 ± 0.030)

20 ± 0.5 (0.79 ± 0.020)

20 ± 0.5 (0.79 ± 0.020)

15 ± 0.5 (0.59 ± 0.020)

22.6

± 0

.2(0

.89

± 0

.008

)

6.3

± 0

.2 (

0.24

8 ±

0.0

08)

5.8

± 0

.25

(0.2

28 ±

0.0

10)

4 ±

0.2

(0.

157

± 0

.008

)

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