Steps in Designing Shielded Enclosures
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Transcript of Steps in Designing Shielded Enclosures
Steps in Designing Shielded Steps in Designing Shielded
EnclosuresEnclosures
Praveen Pothapragada
Chief Engineer
Equipto Electronics Corporation
351 Woodlawn avenue
Aurora IL 60506
PH: 630-859-7840 X 122
Email: [email protected]
OutlineOutline
• Reasons for EMC
• Ways of Reaching EMC
• Company Background
• Standards• Standards
• Design of Shielded Enclosures
• Testing results
• Questions
2Copyright 2010 Equipto Electronics Corporation
Why do we need EMC?Why do we need EMC?
• Unintentional Electro Magnetic Interference.
• Intentional Electro Magnetic Interference.
3Copyright 2010 Equipto Electronics Corporation
Why do we need EMC?Why do we need EMC?
• Unintentional Electro Magnetic Interference.
• Intentional Electro Magnetic Interference.
5Copyright 2010 Equipto Electronics Corporation
Ways of reaching EMCWays of reaching EMC
• At the component level (e.g.: Individual PC boards or
chassis)
• Shielded enclosures• Shielded enclosures
• Anechoic Chambers, Shielded Rooms and Faraday
Cages.
9Copyright 2010 Equipto Electronics Corporation
Advantages of Shielded EnclosuresAdvantages of Shielded Enclosures
• Can be incorporated after the system is designed.
• Portable compared to Shielded rooms.
• Can be a less expensive solution compared to • Can be a less expensive solution compared to
shielding individual components or the shielded
rooms.
10Copyright 2010 Equipto Electronics Corporation
Applications of Shielded EnclosuresApplications of Shielded Enclosures
• Data centers where we need redundancy
• Industrial production lines for critical operations
• Department of Defense (protect communications)• Department of Defense (protect communications)
• Other applications where EMC is critical
11Copyright 2010 Equipto Electronics Corporation
Company BackgroundCompany Background
• Started in 1960, EEC specializes in modular design for
electronic packaging solutions.
• Our sheet metal fabrication facility is spread over • Our sheet metal fabrication facility is spread over
125,000 sq.ft in Aurora IL and has 50 employees.
• We specialize in custom solutions for shielded, shock
and vibration and seismic applications.
• Our Shielded enclosure line started over 25 years
ago.
12Copyright 2010 Equipto Electronics Corporation
EMC StandardsEMC Standards
• IEEE-299-2006
• MIL-STD-461
• NSA 94-106• NSA 94-106
• FCC Part 15
• Tempest
• MIL-STD-188 (HEMP)
13Copyright 2010 Equipto Electronics Corporation
Design of Shielded EnclosuresDesign of Shielded Enclosures
• Selection of Enclosure Material
• Galvanic Compatibility
• Selection of Gaskets
• Input/Output
• Testing
14Copyright 2010 Equipto Electronics Corporation
Selection of Enclosure MaterialSelection of Enclosure Material
• Radiated Emissions/Susceptibility?
• Shielding levels required.
• Thickness of material.
• Other mechanical properties
15Copyright 2010 Equipto Electronics Corporation
Selection of Enclosure MaterialSelection of Enclosure Material
• Radiated Emissions/Susceptibility?
For Radiated Emissions we want to choose a
material that absorbs (e.g C.R.S or Stainless material that absorbs (e.g C.R.S or Stainless
Steel).
For Susceptibility we want to choose material
that reflects (e.g Aluminum).
16Copyright 2010 Equipto Electronics Corporation
Selection of Enclosure MaterialSelection of Enclosure Material
• Shielding levels required.
=
20)(n AttenuatioEnclosureWithoutStrengthField
LogdB
17Copyright 2010 Equipto Electronics Corporation
=
20)(n Attenuatio 10
StrengthFieldCompliant
EnclosureWithoutStrengthFieldLogdB
Selection of Enclosure MaterialSelection of Enclosure Material
• Shielding levels required.
20)(n Attenuatio 10
=StrengthFieldCompliant
EnclosureWithoutStrengthFieldLogdB
19Copyright 2010 Equipto Electronics Corporation
MHz 300 @ dB 88 5
1012020 (dB) sEffectines Shielding
20)(n Attenuatio
3
10
10
≈
×=
=
Log
StrengthFieldCompliantLogdB
Selection of Enclosure MaterialSelection of Enclosure Material
BRAdB ++=)( S.E
GdB
fGtdB
µ
µ
2310E
3
log106.353)( R
10338.3)(A
+=
××= −
G – relative conductivity (copper)
f – frequency (Hz)
µ - relative permeability (free
space)
r1- distance between source to
shield (in)
21Copyright 2010 Equipto Electronics Corporation
f
GdB
fGr
GfrdB
rfdB
µ
µµ
µ
6
10P
1
1
10H
2
1
310E
10log102.108)( R
354.0136.0462.0
log20)( R
log106.353)( R
×+=
++=
+= shield (in)
t – thickness (mils)
Selection of Enclosure MaterialSelection of Enclosure Material
Other mechanical properties
• Weldability
Formability• Formability
• Availability
• Protection against magnetic fields
(Aluminum, 300 series Stainless steels)
22Copyright 2010 Equipto Electronics Corporation
Design of Shielded EnclosuresDesign of Shielded Enclosures
• Selection of Enclosure Material
• Galvanic Compatibility
• Selection of Gaskets
• Input/Output
• Testing
23Copyright 2010 Equipto Electronics Corporation
Design of Shielded EnclosuresDesign of Shielded Enclosures
• Selection of Enclosure Material
• Galvanic Compatibility
• Selection of Gaskets
• Input/Output
• Testing
25Copyright 2010 Equipto Electronics Corporation
Selection of GasketsSelection of Gaskets
• Reason for having gaskets
• Type of opening
–Wiping or compression
• Shielding effectiveness
• Galvanic Compatibility
26Copyright 2010 Equipto Electronics Corporation
Door Opening Design
Advantages:
• High level of Shielding
Effectiveness
Disadvantages:
27Copyright 2010 Equipto Electronics Corporation
Disadvantages:
• Must be
manufactured precisely.
• Use of heavier gauge
material.
Design of Shielded EnclosuresDesign of Shielded Enclosures
• Input/Output
– Vents
– Power Line Filters
– Connectors
28Copyright 2010 Equipto Electronics Corporation
Vents
Example: Determine SE @ 10 GHz for 1/8”Honeycomb 1” Long.
usable. is honeycomb theGHz 55.36 GHz 10 Since
36.55125.0
92.692.6 Frequency Cutoff
<
=== GHzD
C
29Copyright 2010 Equipto Electronics Corporation
5D
L
for vents thumbof Rule
dB 256125.0
13232)( SE
usable. is honeycomb theGHz 55.36 GHz 10 Since
≥
≈×
≈×
≈
<
D
LdB
Design of Shielded EnclosuresDesign of Shielded Enclosures
• Input/Output
– Vents
– Power Line Filters
– Connectors
30Copyright 2010 Equipto Electronics Corporation
Design of Shielded EnclosuresDesign of Shielded Enclosures
• Selection of Enclosure Material
• Galvanic Compatibility
• Selection of Gaskets
• Input/Output
• Testing
31Copyright 2010 Equipto Electronics Corporation
80
100
120
Equipto R6 Magnetic Field Shielding Effectiveness
Door Latch Top Corner; Horizontal Door Latch Top Corner; Vertical
Door Top Center; Vertical Door Hinge Top Corner; Vertical
Door Hinge Top Corner; Horizontal Door Hinge Side; Middle; Horizontal
Copyright Equipto Electronics Corporation 34
0
20
40
60
80
0.01 0.1 1 10 100
dB
Frequency MHz
100
120
140
160
180
Resonant Range and High Frequency Shielding
Door Latch Edge; Vertical Door Latch Edge; Horizontal
Copyright Equipto Electronics Corporation 35
0
20
40
60
80
100
10 100 1000 10000 100000
dB
Frequency (MHz)
60
80
100
120
140
160
dB
Electric Field Shielding Effectiveness
1 kHz
10 kHz
100 kHz
1 MHz
Copyright Equipto Electronics Corporation 38
0
20
40
Measurement Location
10 MHz
40
60
80
100
120
140
160
dB
Plane Wave Shielding Effectiveness - Horizontal Polarization
100 MHz
400 MHz
1 GHz
10 GHz
Copyright Equipto Electronics Corporation 39
0
20
Measurement Location
40
60
80
100
120
140
160
dB
Plane Wave Shielding Effectiveness - Vertical Polarization
100 MHz
400 MHz
1 GHz
10 GHz
Copyright Equipto Electronics Corporation 40
0
20
Measurement Location
ReferencesReferences
• The design of shielded enclosures by Louis T. Gnecco
• Chomerics (EMI Shielding Theory)
• MIL-F-14072D
NSA 94-106• NSA 94-106
• MIL-STD-461F
• EMPrimus SCADA/DCS Testing
• www.APELC.com
• www.diehl.de
41Copyright 2010 Equipto Electronics Corporation