High Grade and Industrial Technologies - FTP Directory Listing

From Design to Production

Oil Drilli

ng

Industry

Defence

Railways

Space Aeronautics

Medical

www.microspire.c m

Wo u n d M a g n e t i c s E x p e r t s

High Gra

de and Industri

al Technologies

High Gra

de and Industri

al Technologies

® ®

132

67

8

54

9

13

1112

15

1617

22

2119

20

23

18

24

25

2526

27

28

3130

29

10

14

Morocco (Casablanca)- Main production site - 200 employees- Manual and semi automated production- EN / AS 9100 certified- ISO 9001 / V 2000 certified- Manufacturing of medium series and

high grade components- Rotors and stators windings- Plastic injected magnetics

Illange (Metz)- Head office - 80 employees- Design - Prototyping - Industrialisation -

Internal and external production inspection -Supply chain management

- Quality control - logistics- ISO 9001 / V 2000 certified- EN / AS 9100 certified- ISO 14001 in processManufacturing of :- Small series and high grade components- Medium power magnetics

China (Dongguan)- 2 approved subcontractors- High volumes industrial quality- Local sourcing- ISO 9001 / V 2000 certified

Wo u n d M a g n e t i c s E x p e r t s A Worldwide presence

Wo u n d M a g n e t i c s E x p e r t s Locations

France (Illange)

Morocco (Casablanca)

China (Dongguan)


MicrospireR&D department :12 PhD engineers,

engineers andtechnicians,

test laboratory ...

Key Accounts• Aeronautics & Defence

• Space• Oil drilling

• Railways• Industrial• Medical

• 92-95: Electrical models

EN60950, EN61558,DO160, ETSI, MIL STD981, RNC CNES Q 60

504/5, ...

characterization and• 95-98: Material

thermal modeling• 98-01: Characterization

• 01-07: CAD softwareof emitted magnetic field

In collaboration with CNRS :financial support for

post doctorate theses

Design and productionin accordance

with standards

ESA qualified series : MPCI(3201/008), SESI (3201/009)

Capability approval forcustom designs with

SESI Technology

Collaborations :European Space Agency,

CNES French Space Agency

Gathering expertise foryour custom designs

Our know-how in electronic functions

Semi - Custom

Hig

h G

rade

Tec

hnol

ogie

sS

tand

ard

Tech

nolo

gies

CustomMagnetic cores and

FunctionsStandard magnetic cores

and Custom FunctionsComponents

Off The Shelves

COTS

Hig

h G

rade

Tec

hnol

ogie

sS

tand

ard

Tech

nolo

gies

Medium Power Engineering Support Flying / Custom terminations Dedicated Team

1°105

105 106 107

1°104

104

1°103

103100

MODULUS ZO from primary

Frequency (Hertz)

Mo

du

lus

(O

hm

s)

PHASE ZO from primary100

50

0

-50

-100100 103 104 105 106 107

Ph

as

e (

De

gre

es

)

Frequency (Hertz)

4 3 5p

rs3rsrs1

s1 600 s 1 s3 00m

5 01m 5u 5u

p

D

6

1 6p

5

1 p

3

3 7p

100

inf

1

F

F1

50mp4

Lp4

Lp3

0 5

Lp

5

Lp1

5

1

1

1 4p1

p

p3

r1

1 4p

60

1

5 3p

valeur efficace de ce courant :

ourant secondaire ui alent I

ou

ran

t se

con

dai

re

Ti e s

Ise I Ise I Is I dtT

T

αmax T


Certifications

&

Qualifications


EUROPEAN DIRECTIVESR.o.H.S. and W.E.E.E.


Partnership

ContentsHigh Grade technologies

Custom Design Technologies

RF and Data Magnetics

Power Magnetics

Industrial TechnologiesCustom Designs

RF and Data Magnetics

Power Magnetics

Telecom Products

Engineering ServicesEngineering Services

Design Specification Data


www.microspire.c m


High G

rade Technolo

gies

High G

rade Technolo

gies

®

®


Hybrid Magnetics

Aluminium foil winding components

Transfer-Molded Components


Customized medium power EE core

Customized toroidal Inductors

Customized medium power C core Inductors

High Grade Custom Planar Magnetics

Construction

Electrical Data

SMPS Topologies

Mounting, Connections

glue

kapton

copper

copper

copper

kapton

kapton

kapton

ferritepins

ferrite

PCB

PCB

solder

Operations

OUT

PHASE I PHASE II and II' PHASE III and III'

IN OUT IN OUT IN

2d Bobbinxxx

turns

1st Bobbinxxx

turns

1

2

3

4

1

2

3

4

1

2

3

4

REAR SIDE

FRONT SIDE

1 2 3 2 1

Build-to-print Rotors and Stators manufacturing

SESI SMD Power Inductors and Transformers

The possible functions in the SESI design

Weight: 35 grams

Pad Layout (mm)SESI 22 WE

11.43(3 x 3.81)

MICROSPIRE

MB0XXXX-

Part Nber

YY/WW/M

26.0 MAX 3.0

4 1

85

26

Area forgluing

39.0

32.0

29.0

32.0

±0.4

36.0

0/+

1

Pin section2.0 x 0.30

13.30MAX

25.5

Shielded versions

Weight: 36 grams

Pad Layout (mm)

17.78(7 x 2.54)

MICROSPIRE

MB0XXXX-

Part Nber

YY/WW/M

26 MAX 1.3

8 1

169

26

Area forgluing

41.9

32.0

29.0

32.0

±0.4

SESI 22.1 WE

38.0

0/+

1

Pin section0.80 x 0.50 thick

25.5

2.50

13.30MAX

Weight: 16.5 grams

Pad Layout (mm)

15.24(8 x 1.905)

MICROSPIRE

MB0XXXX-

Part Nber

YY/WW/M

21.2 MAX 1.2

9 1

1810

Area forgluing

32.9

27.0

25.0

MA

X

26.0

MA

X

SESI 18.1 WE

31.9

MA

X

Pin section1 x 0.30

9.4MAX

Weight: 9.0 grams

Pad Layout (mm)SESI 15 WE

11.43(3 x 3.81)

22 M

AX MICROSPIRE

MB0XXXX-

Part Nber

YY/WW/M

17.3 MAX

17

2.2

4 1

85

13.3

Area forgluing

24.0

18.5

16.3

17.6

MA

X

8.80MAX


SESI Custom Technologies

2

150 μm

29±0.5

25±0.2

19.3 +0-0.3 ≤ 9.0

23 ±

0.1

8 x 1.9

1.0 0.3

SESI 18.1W

36.5±0.5

30.8±0.4

29.0±0.4

2.5±0.2

11.9 MAX

8.8±0.1

180 μm

≤ 23.4

7 x 2.540.8 0.5

SESI 22.1W

39MAX

30.8±0.4

2.5

180 µm

25 MAX 12 MAX

8 x 2.28

0.8 0.5

SESI 22.2W

42.7

5 ±

0.3

2.6

34 MAX 14.5 MAX

7 x 3.81

0.9 0.45

SESI 32W

52.0

+1.5

-0

Custom packages with additional terminations

150 µm

1.4 +0.2-0.1

16.0 MAX

22

MA

X

8.0MAX

0.8 ±0.12.28

SESI 15.1W

0.4

16.5

MA

X

Ø M

AX

h MAX

Toroidal Transfer Custom Magnetics

Technology characteristics

Standard functions in TT technology

Max dimensions of your custom toroidal core into TT technology

Typical Dimensions (mm)

Electrical Data ( 25°C )

2.80 MAX

1st significant figure (2 times wider)

2nd significant figure

Multiplier (nH)

2.16

MA

X

2.67 MAX

0.460.13

2.66

2.62.8

3.7

0.9

6

"S" Version

"A" Version

1 10 100

110

100

90

80

70

60

50

40

30

20

Frequency - MHz

100 µH to 180 nH

220-330-3

90 nH

1.1 to 1.8 µH

1.1 to 1.8 µH

560 to 820 nH

2.2 µH

470 to 680 nH

270 nH

Q vs frequency

Packaging

Chip Inductors - MPCI 10000 Series

Cross reference chart

To Order MPCI 10 ### ### x y z

QPL ComponentsMiniature Chip Inductors MSCI 10000


2.80 MAX2.41


Multiplier (nH)

2.54

MA

X

2.67 MAX

0.6

2.66

2.62.8

3.7

0.13

0.9

6

"S" Version

"A" Version

1st significant figure (2 times wider)80

70

60

50

40

30

20

10

1000 µH

390 µH

15 µH to

56 µH

Hµ 001 ot Hµ 28

101Frequency - MHz

Q vs frequency

Packaging




4.14 MAX

1st significant figure (2 times wider)


Multiplier (nH)

3.3

MA

X

3.38 MAX

0.64MAX

0.13

3.38

3.7

3

4.1

4 M

AX

4.2

1.85

"S" Version

"A" Version

1.02

100 µH

82 µH

33 µH

10 µH

330 nH

100 nH

82 nH

33 nH

10 nH

8.2 µH

3.3 µH

820nH

20

40

60

80

100

120

140

10001 3 5 10 30 50 100 300 500

Frequency - MHz

Q vs frequencyPackaging



100 µH

82 µH

33 µH

10 µH

330 nH

100 nH

82 nH

33 nH

10 nH

8.2 µH

3.3 µH

820nH

20

40

60

80

100

120

140

10001 3 5 10 30 50 100 300 500

Frequency - MHz

Connections

PCB Layout(suggested)

3.402.50

1st significant figure(2 times wider)


Multiplier (nH)

3.30

5.70

5

3.8

1

2

4.80

5.80



To Order MPCI 233 ### ### xy

Q vs frequencyTypical Dimensions(mm)

Packaging

MB4x xxx

1

3

6

4

1

2

3

6

4

Standard Center tap

1

2

3

6

5

4

Shielded Version

PackagingApplications

Connections


10.1 ± 0.3

Surface-mount case WRFT4# ### 1S

6.9 +0.2 -0 0.15

5.5 ± 0.2

5.5 ± 0.2

Pin Section 0.7 x 0.3

4.5± 0.2

0.1 +0.2 -0


yywwP

Through-hole case WRFT4# ### 1P

7.62

90° 105°

5.5 ± 0.2

6.80 MAX

5.5 ± 0.2

4.5 ± 0.2

5.3 MAX

yywwP

yywwP

Pin 6 DOT

Weight :1 gram

6°

5

4

1°

2-CT

3

SMD shielded case WRFT4# ### 1Q

10.1 ± 0.3

7.10 MAX

3.556

PCB Layout (suggested)

1

2

3 4

5

6

1

2

3 4

5

6

12

6

1.78

1.1

1.78

7.62

Drill Diameter0.9 min.

Topview

1

2

3 4

5

6

1

2

3 4

5

6

12

6

1.78

1.1

1.78

7.62

Drill Diameter0.9 min.

Topview

11.0

1.10

7.20

3.556

Marking

Wide Band RF Transformers - WRFT 4x Series

Electrical Data (25°C)

To Order WRFT4 # ### 1x

2

8

7 6

5

3

41

Impe

danc

e (Ω

)

Frequency - MHz

HCESC10 xxx 1x10000

1000

100

10

1

0,1

0,011E+02 1E+03 1E+04 1E+05 1E+06 1E+07 1E+08

HCESC10 15KHCESC10 56KHCESC10 M47

Att

en

uati

on

(d

B)

30

35

25

20

15

10

5

0

HCESC10 xxx 1x

HCESC10 15K

HCESC10 56K

HCESC10 M47

Frequency - MHz

1E+04 1E+05 1E+06 1E+07 1E+08


To Order HCESC10 ### 1x


4.50 MAX

Through-hole HCESC10 ### 1P

Surface-mount HCESC10 ### 1S

4.30 MAX

0.7 x 03

5.334

10

12.8

12.06 16 MAX

1 8

5 4 0.7

9.4

2

Connections

Packaging

Response Curves

Common-Mode Chokes - HCESC Series

Electrical Data

To Order DLEF42 020 1S Packaging

Application

Att

en

ua

tio

n (

dB

)

25

20

15

10

5

0

-5

COMMON MODE

DIFFERENTIAL MODE

Frequency - MHz

1E+05 1E+06 1E+07 1E+08 1E+09

Response Curves Typical Dimensions (mm)

10.1 ± 0.3

Surface-mount case

5.5 ± 0.2 5.5 ± 0.2


4.5± 0.2

6.9 +0.2 -0 0.15

0.1 +0.2 -0

1

2

3 4

5

6

12

6

1.78

1.1

Topview

1

2

3 4

5

6

12

6

1.78

1.1

Topview

yywwP

DL42

Marking

5

2

6

1

Standard

Connections PCB Layout(suggested)

Data Line EMI Filters - DLEF 42 Series

1

3

4

6


Ampl

itude

(dBm

)

Frequency - MHz

LOAD : 600 Ω @ 0 dBm

-2.0

-1.5

-1.0

-0.5

0.0

-2.5

-3.0

-3.5

-4.0

-4.5

-5.010 100 1000 10000 100000

Frequency Response Distorsion

Frequency - MHz

LOAD : 600 Ω @ 0 dBm

T.H

DIST

ORS

ION

+ NO

ISE

(dBm

)

-60

-50

-70

-80

-90

-100

-11010 1000 10000


10.72.15 MAX1.5

12.7

0.4 0.7

7.1MAX

0.8

9.2MAX

1

3

4

6

2.54

18 MAX

MTLM 1234 Mil

13.7 MAX

2±0.3

10.5MAX

10.5MAX

1

3

4

6

15 MAX

MTLM 1234 MQShielded casing

PCB Layout(suggested - only MTLM 1234 Mil)

13.5

2.4

2.54

1.0

Connections

Application

Line-Matching Transformer - MTLM 1234 Mil

4

5

6

7

8

1

2

3

DBIT x 3 S

yywwP


To Order DBIT # 3S

Notes

Typical Dimensions(mm, top view)

Marking

Connections

MIL-STD 1553 Interface Transformers - DBIT x 3 S

18 4.5

5.082.54

1.5


16 5.25

26.5 MAX

2.5

-0

+0

.5

5.08 2.54

0.7

16

3.81 MAX

1

3 8

4

0.4

0.1

Packaging

WSo

P1 PoUnreeling

MIL-STD 1553 Interface Transformers - DBIT xx 4 S

4

8

1

2

3

5

7

1

2

3

A B

DBIT xx 4 S

yywwP


Marking

Connections


To Order DBIT ## 4S Notes

10.0

3.811.905

1.3

14.6


11.0

10.16

3.81

0.7

0.3

10

.16

± 0

.2

1.905

4.9

MA

X

< 150 µm 13.2 ± 0.40

3

1 8

4

Packaging

WSo

F

P1 PoUnreeling

4

5

6

7

8

1

2

3

DBIT x 5 S

yywwP


Marking

Connections



To Order DBIT # 5S

Notes

18 4.5

5.082.54

1.5


16

26.5 MAX

5.08

0.7

0.4

0.1

16

5 -0 +0.5 MAX

2.54

1

3 8

4

2.5

-0

+0

.5

Packaging

WSo

P1 PoUnreeling


DBITx7P

2.54

11 ±

1

5.0

8

16

16

7.3 MAX

12.70

Pin Ø 0.65Electrolytic

tin plating

Top view

1

2

3 8

7

6

5

4

4

5

6

7

8

1

2

3

DBIT x 7 P

yywwP

Marking

Connections

MIL-STD 1553 Interface Transformers - DBIT x 7 P

NotesElectrical Data ( 25°C )

To Order DBIT # 7P

MIL-STD 1553 Interface Transformers - DBIT x 7 P10


To Order DBIT # 7 P10


DBITx7P10 Bottom view

2.54

17.0

5.0

8

16 ±

0.3

7.3 MAX

12.70


tin plating

1 4

16 ±0.3

4

5

6

7

8

1

2

3

DBIT x 7 P10

yywwP

Marking

Connections



To Order DBIT # 7 S

Packaging

WSo

P1 PoUnreeling

18 4.5

5.082.54

1.5

PCB Layout (suggested, DBIT x 7 S)

Typical Dimensions (mm)16

26.5 MAX

5.08

0.7

0.4

0.1

16

7.3MAX

2.54

1

3 8

4

2.5

-0 +

0.5

4

5

6

7

8

1

2

3

DBIT x 7 S

yywwP

Marking

Connections

4

5

6

7

8

1

2

3

DBIT 5 7 S400Top view

1.9

0.7

3.8

1

11.0

13.2 ± 0.40

7.5 MAX

Pin section:0.70 x 0.30 thick

1

3 8

4

DBIT 5 7 P400Top viewBottom view

10.1

6 ±

0.2

15.6

0

10.16

6.1

010.1

6

5

8 4

1 3

1

4

8

2

3

6

7


tin plating

7.6

2

2.54

7.62

DBIT 5 7P400

yywwP

< 150 µm


Connections

MIL-STD 1553 Interface Transformers - DBIT 5 7 x400


To Order DBIT 5 7x400

Notes

10.0

14.6

3.811.905

1.3

PCB Layout(suggested, DBIT 5 7 S400)

Packaging

WSo

P1 PoUnreeling

18.0

27.0

27

.0

1.5

//200.μm

25.2±0.50

7.50

1 2 3 4

5

6

7

891011

12

13

14

15

16

Pin section:0.7 x 0.4(width x thick)

Topview

5.08

16.0 ±0.20/square

10.16

≈19.025.2 ±0.50

2.5

-0 +

0.5

SBIT

x 7.5S

YYWW

4

5

6

7

8

(14)

(15)

(16)

(17)

(18)

(11)

(12)

(13)

1

2

3

Marking ConnectionsPCB Layout(suggested)

To Order SBIT # 7.5S Notes

Dual staked MIL-STD 1553 Interface Transformers - SBIT x 7.5S




pitch 2.54

12.70 mm ± 0.20

12.7

0 m

m ±

0.2

0

15.88 ± 0.20

1 2 3 4

5

6

7

8 11 12 13 14

15

16

17

18

15.8

8 ±

0.2

0

7.8

7 ±

0.2

0

0.65

11.8

0 ± 0

.30

Topview

SBITx 7.8PYYWW

4

5

6

7

8

(14)

(15)

(16)

(17)

(18)

(11)

(12)

(13)

1

2

3

Marking

ConnectionsPCB Layout(suggested)

To Order SBIT # 7.8P Notes


Dual staked MIL-STD 1553 Interface Transformers - SBIT x 7.8P

4.0 ±0.18.00 ±0.1

12.0

±0

.3

5.5

0 ±

0.1

Unreeling

To Order MPCI H01 ### 1xy


Packaging

Application


4.14 MAX

3.3

MA

X

3.38 MAX

0.64MAX

0.13

3.38 MAX

3.7

3

4.1

4 M

AX

4.40 MAX

1.8

5

"S" Version

"A" Version

1.02

1K0

Miniature Fixed Chip Inductors - H01 Series

QPL ComponentsMiniature Chip Inductors MSCI H01


3.40

2.503.

30

5.70

5

3.8

K38


4.80

5.80

To Order MPCI 233 H01 ### 1x


Application Packaging

Miniature Fixed Chip Inductors - 233 H01 Series


18

45 ESI 01

xxx 1x

yy/ww

3.50

9.50

1.1 1.1

7.9

13.9

W terminalsJ leaded

1-4

5-8

SMD Power Inductors - ESI 01

I

1 / f

I ripple

I ratedI peak

t

Notes

To Order ESI01 ### 1x

ConnectionsMarking Dimensions (mm)


7.50

7.40

5.334 = 3 x 1.778

8.50 MAX

0.80

2.0 Max , 1.50typ 0.10 +0.2 -0

8.40 MAX

12,5 ± 0,5

W terminalsJ leaded

9,20 ± 0,30

7.50 +0,3 -0

8.40 MAX

0.80

0.15

Packaging

F

WSo

P1 Po Unreeling

SMD Power Inductors - ESI7


To Order ESI 7 ### 1S

7 xxx

yy/ww/M

9.0 -0.60

7.10 +0.20

5.60+0.20

3.80+0.20MAX

2.50

1

2

4

3


Bottom view 10.0

3.0

4.50 0.6

1-2

3-4

I

1 / f

I ripple

I ratedI peak

t

Notes

Connections

Marking

Dimensions (mm) PCB Layout (suggested)

Packaging

F

WSo

P1 PoUnreeling

SE 9 xxx

xR yywwP

10.7MAX

13.4 MAX

0.9 to 1.3

2.9 x 0.25MAX

10.6 MAX

5.8MAX

8.4 14.4

3.0

I

1 / f

I ripple

I ratedI peak

t

To Order SESI 9 ### #WR

Electrical Data ( 25°C ) Notes

Connections Marking

Dimensions(mm, top view)


Packaging

SMD Power Inductors - SESI 9WR High Reliability Applications

F

WSo

P1 PoUnreeling


SE 91 xxx

xR yywwP

10.7MAX

13.4 MAX

0.9 to 1.3

1.5 x0.28MAX

10.6 MAX

5.8MAX

5.7

1

2

4

3

8.4 14.4

3.2

8.4

1

2

4

3

SMD Power Inductors - SESI 9.1WR High Reliability Applications

I

1 / f

I ripple

I ratedI peak

t

Notes

To Order SESI 9.1 ### #WR Connections Marking



Packaging

F

WSo

P1 PoUnreeling


QPL ComponentsSMD Power Inductors SESI 9.1WR

To Order SESI 14 ### 1SR


SE 14 xxx

xR yywwP

16MAX

16.3 MAX

5.4MAX

9 ± 0.05

7 18

15.2

Connections Marking

Dimensions(mm, bottom view)

SMD Power Inductors - SESI 14SR High Reliability Applications

I

1 / f

I ripple

I ratedI peak

t

Notes


Packaging

F

WSo

P1 PoUnreeling


QPL ComponentsSMD Power Inductors SESI 14SR



I

1 / f

I ripple

I ratedI peak

t


SE 15 xxx

xR yywwP

1.3 to 1.6

16MAX

22 MAX

1.2 x 0.4MAX

16.3 MAX

7.9MAX

1

4

8

5

16 24

3.812.1

Connections Marking


1

4

8

5

Notes


Packaging

F

WSo

P1 PoUnreeling


QPL ComponentsSMD Power Inductors SESI 15WR


To Order SESI 15 ### #SR

SMD Power Inductors - SESI 15SR High Reliability Applications

Notes

I

1 / f

I ripple

I ratedI peak

t

SE 15 xxx

xR yywwP

16MAX

16.3 MAX

7.4MAX

9 ± 0.05

7 18

15.2

Connections Marking

Dimensions(mm, bottom view)


Packaging

F

WSo

P1 PoUnreeling


QPL ComponentsSMD Power Inductors SESI 15SR




I

1 / f

I ripple

I ratedI peak

t

SE 18 xxx

xR yywwP

1.3 to 1.6

19.8 MAX

26 MAX

2.1 x 0.4 MAX

22.0 ± 0.3

8.9MAX

1

4

8

5

21 28

3.813.0

Connections Marking


1

4

8

5

Notes

Packaging PCB Layout(suggested)

F

WSo

P1 PoUnreeling



1.3 to 1.6

23.5MAX

35.3 MAX

2.1 x 0.45MAX

30.8 ± 0.4

12.2MAX

1

4

8

5

29.0

37.5

3.8

13

.0



I

1 / f

I ripple

I ratedI peak

t

SE 22 xxx

xR yywwP

Connections

Marking

1

4

8

5

Notes


Packaging

F

WSo

P1 PoUnreeling

To Order SESI 32 ### 1PR


18

169

33.5 MAX

3.81

3.5

0.9 x 0.45

42.5± 0.4

48.35

13.7MAX

48.3

5

26.67 MAX

Dimensions (mm)

SESI 32 xxx

xR yywwP

Marking1

8

16

9

Connections


I

1 / f

I ripple

I ratedI peak

t

Notes

Packaging

Applications


Electrical Data

134 2

865 7

Connections(Top view)

Differential Mode Chokes for DC/DC Embedded Applications DMC 22 xxx 1WR Series

DM22 xxx

xR yywwP

Marking

130µm

23.5 MAX

3 x 3.81

2.1 x 0.45 MAX

30.8± 0.4

35.3MAX

1.3 to 1.6

12.2MAX

1 4

8 5


Packaging

F

WSo

P1 PoUnreeling

29.0 37.5

3.813.0


CM 14 xxx

xR yywwP

1-2 5-6

7-83-4

14.0 ± 0.30Pin 1

20 0/1.0

12.4

± 0

.15

14.0

± 0

.30

3 x

3.1

75

1

45

8

1.2

x 0

.80

150 µm1.05 to 1.45

21.5

15.02.1

3.175

Electrical Data



Marking

Connections

CMC 14 Common Mode Chokes SeriesHigh Grade - Improved Temperature Stability

Notes

Packaging

WSo

P1 PoUnreeling

Electrical Data


CM

17 x

xx

xR

yyw

wP

1 8

54

17.0 ± 0.4 Pin 1

26.5 ± 0.5

15.4

± 0

.4

17.0

± 0

.4

3 x

3.8

1

1

45

8

1.2

x 0

.80

150 µm

1.5 to 2

28.0

20.0

2.2

3 x3.81



Marking

Connections

Notes

Packaging

WSo

P1 PoUnreeling

CMC17

0,01

0,1

1

10

100

0,01 0,1 1 10 100FREQUENCY (MHz)

30M

13M

5M8

1M2

2M6

M45

69M

IM

PE

DA

NC

E (

k)

ImpedanceCMC17

FREQUENCY (MHz)

AT

TE

NU

AT

ION

(d

B)

0

10

20

30

40

50

0,01 0,1 1 10 100

1M2

2M6

5M8

30M

13M

69M

M45

Attenuation

50Ω

50Ω

50Ω

SIN

Att. (dB) = 20 log 10

50ΩVTEST

VTEST

VDUAL

VREF

VREF

CMC

Attenuation Measurement Circuit

-80%

-60%

-40%

-20%

0%

20%

40%

60%

80%

100%

120%

-75 -50 -25 0 25 50 75 100 125 150 175

CMC17 range

Standard MnZn ferrite

High perm ferrite

Δ L

/L (

%)

Operating Temperature (°C)

Variation vs Temperature


Derating CurvesCMC17 M45

Ambient temperature (°C)

Max a

llo

wab

le R

MS

cu

rren

t (A

)

2

6

10

14

18

25 35 45 55 65 75 85 95 105 115 125

ΔT = 80°CΔT = 70°C

ΔT = 90°C

ΔT = 50°C

ΔT = 40°C

ΔT = 60°C

ΔT = 20°C

ΔT = 10°C

ΔT = 30°C

Max a

llo

wab

le R

MS

cu

rren

t (A

)


CMC17 2M6

0

2

4

6

8

25 35 45 55 65 75 85 95 105 115 125

ΔT = 80°CΔT = 70°C

ΔT = 90°C

ΔT = 50°C

ΔT = 40°C

ΔT = 60°C

ΔT = 20°C

ΔT = 10°C

ΔT = 30°C

Max a

llo

wab

le R

MS

cu

rren

t (A

)


0

1

2

3

4

25 35 45 55 65 75 85 95 105 115 125

ΔT = 80°C

ΔT = 70°C

ΔT = 90°C

ΔT = 50°C

ΔT = 40°C

ΔT = 60°C

ΔT = 20°C

ΔT = 10°C

ΔT = 30°C

CMC17 13M

0

2

4

6

8

10

12

25 35 45 55 65 75 85 95 105 115 125

ΔT = 80°CΔT = 70°C

ΔT = 90°C

ΔT = 50°C

ΔT = 40°C

ΔT = 60°C

ΔT = 20°C

ΔT = 10°C

ΔT = 30°C

Max a

llo

wab

le R

MS

cu

rren

t (A

)


CMC17 1M2

Max a

llo

wab

le R

MS

cu

rren

t (A

)


0

1

2

3

4

5

6

25 35 45 55 65 75 85 95 105 115 125

ΔT = 80°CΔT = 70°C

ΔT = 90°C

ΔT = 50°C

ΔT = 40°C

ΔT = 60°C

ΔT = 20°C

ΔT = 10°C

ΔT = 30°C

CMC17 5M8M

ax a

llo

wab

le R

MS

cu

rren

t (A

)


CMC17 30M

0

0,5

1

1,5

2

2,5

3

25 35 45 55 65 75 85 95 105 115 125

ΔT = 80°CΔT = 70°C

ΔT = 90°C

ΔT = 50°C

ΔT = 40°C

ΔT = 60°C

ΔT = 20°C

ΔT = 10°C

ΔT = 30°C

Max a

llo

wab

le R

MS

cu

rren

t (A

)


CMC17 69M

0

0,5

1

1,5

2

25 35 45 55 65 75 85 95 105 115 125

ΔT = 80°CΔT = 70°C

ΔT = 90°C

ΔT = 50°CΔT = 40°C

ΔT = 60°C

ΔT = 20°C

ΔT = 10°C

ΔT = 30°C


Common Mode Chokes for DC/DC Embedded Applications CMC 2WR Series

1.3 to 1.6

16 MAX

3 x 3.81

22MAX

1.2 x 0.4 MAX

16.3MAX

7.9MAX

1 4

8 5

130µm

Electrical Data


CM15 xxx

xR yywwP

134 2

865 7

internal crossingfor correct connection

16 24

3.812.1


Connections(top view)

Common Mode Chokes for DC/DC Embedded Applications CMC 15 xxx 2WR Series

MarkingPackaging

F

WSo

P1 PoUnreeling

CMC15

0,01

0,1

1

10

100

1000

0,01 0,1 1 10 100

FREQUENCY (MHz)

IM

PE

DA

NC

E (

k)

2M01M0

M47

M11M22

52K

4M0

ImpedanceCMC15

0

10

20

30

40

50

60

70

0,01 0,1 1 10 100

FREQUENCY (MHz)

AT

TE

NU

AT

ION

(d

B)

2M01M0

M47

M11M22

52K

4M0

Attenuation


-60%

-40%

-20%

0%

20%

40%

60%

80%

100%

120%

140%

-75 -50 -25 0 25 50 75 100 125 150 175 200 225


ΔL

/L (

%)

Tc



50Ω

50Ω

50Ω

SIN

Att. (dB) = 20 log 10

50ΩVTEST

VTEST

VDUAL

VREF

VREF

CMC

Derating CurvesCMC15 52K

∆T = 80°C∆T = 70°C

∆T = 90°C

∆T = 50°C∆T = 40°C

∆T = 60°C

∆T = 20°C

∆T=10°C

∆T = 30°C


Max

allo

wab

le R

MS

curr

ent (

A)

0

3

6

9

12

25 35 45 55 65 75 85 95 105 115 125

∆T = 80°C∆T = 70°C

∆T = 90°C

∆T = 50°C∆T = 40°C

∆T = 60°C

∆T = 20°C

∆T=10°C

∆T = 30°C

0

1

2

3

4

5

25 35 45 55 65 75 85 95 105 115 125Ambient temperature (°C)

Max

allo

wab

le R

MS

curr

ent (

A)

CMC15 M22

CMC15 1M0

0

0,5

1

1,5

2

2,5


Max

allo

wab

le R

MS

curr

ent (

A)

∆T = 80°C∆T = 70°C

∆T = 90°C

∆T = 50°C∆T = 40°C

∆T = 60°C

∆T = 20°C

∆T=10°C

∆T = 30°C

0

2,5

5

7,5


Max

allo

wab

le R

MS

curr

ent (

A)

∆T = 80°C∆T = 70°C

∆T = 90°C

∆T = 50°C∆T = 40°C

∆T = 60°C

∆T = 20°C

∆T=10°C

∆T = 30°C

CMC15 M11

∆T = 80°C∆T = 70°C

∆T = 90°C

∆T = 50°C∆T = 40°C

∆T = 60°C

∆T = 20°C

∆T=10°C

∆T = 30°C

CMC15 M47

0

1

2

3

4


Max

allo

wab

le R

MS

curr

ent (

A)

CMC15 2M0

0

0,5

1

1,5


Max

allo

wab

le R

MS

curr

ent (

A) ∆T = 80°C

∆T = 70°C

∆T = 90°C

∆T = 50°C∆T = 40°C

∆T = 60°C

∆T = 20°C

∆T=10°C

∆T = 30°C

CMC15 4M0

0

0,2

0,4

0,6

0,8

1


Max

allo

wab

le R

MS

curr

ent (

A) ∆T = 80°C

∆T = 70°C

∆T = 90°C

∆T = 50°C∆T = 40°C

∆T = 60°C

∆T = 20°C

∆T=10°C

∆T = 30°C


Electrical Data

130µm

19.8 MAX

3 x 3.81

2.1 x 0.4 MAX

22.0± 0.3

26MAX

1.3 to 1.6

8.7MAX

1 4

8 5


21 28

3.813.0



CM18 xxx

xR yywwP

Marking

134 2

865 7



Packaging

F

WSo

P1 PoUnreeling

CMC18

0,01

0,1

1

10

100

1000

0,01 0,1 1 10 100

FREQUENCY (MHz)

IM

PE

DA

NC

E (

k)

2M41M1

M54

M13M27

60K

4M9

ImpedanceCMC18

0

10

20

30

40

50

60

70

0,01 0,1 1 10 100

FREQUENCY (MHz)

AT

TE

NU

AT

ION

(d

B)

2M4

1M1M54

M13M27

60K

4M9

Attenuation


-60%

-40%

-20%

0%

20%

40%

60%

80%

100%

120%

140%

-75 -50 -25 0 25 50 75 100 125 150 175 200 225


ΔL

/L (

%)

Tc



50Ω

50Ω

50Ω

SIN

Att. (dB) = 20 log 10

50ΩVTEST

VTEST

VDUAL

VREF

VREF

CMC


0

4

8

12

16


Max

allo

wab

le R

MS

curr

ent (

A) ∆T = 80°C

∆T = 70°C

∆T = 90°C

∆T = 50°C∆T = 40°C

∆T = 60°C

∆T = 20°C

∆T=10°C

∆T = 30°C

CMC18 M27

0

2,5

5

7,5

25 35 45 55 65 75 85 95 105 115 125Ambient Temperature (°C)

Max

allo

wab

le R

MS

curr

ent (

A)

∆T = 80°C∆T = 70°C

∆T = 90°C

∆T = 50°C∆T = 40°C

∆T = 60°C

∆T = 20°C

∆T=10°C

∆T = 30°C

CMC18 1M1

0

1

2

3


Max

allo

wab

le R

MS

curr

ent (

A) ∆T = 70°C

∆T = 90°C

∆T = 50°C∆T = 40°C

∆T = 60°C

∆T = 20°C

∆T=10°C

∆T = 30°C

∆T = 80°C

CMC18 M13

0

3

6

9

12

25 35 45 55 65 75 85 95 105 115 125Ambient temperature(°C)

Max

allo

wab

le R

MS

curr

ent (

A)

∆T = 80°C∆T = 70°C

∆T = 90°C

∆T = 50°C∆T = 40°C

∆T = 60°C

∆T = 20°C

∆T=10°C

∆T = 30°C

CMC18 M54

0

1

2

3

4

5


Max

allo

wab

le R

MS

curr

ent (

A)

∆T = 80°C∆T = 70°C

∆T = 90°C

∆T = 50°C∆T = 40°C

∆T = 60°C

∆T = 20°C

∆T=10°C

∆T = 30°C

CMC18 2M4

0

0,5

1

1,5

2


Max

allo

wab

le R

MS

curr

ent (

A)

∆T = 80°C∆T = 70°C

∆T = 90°C

∆T = 50°C∆T = 40°C

∆T = 60°C

∆T = 20°C

∆T=10°C

∆T = 30°C

CMC18 4M9

0

0,5

1

1,5


Max

allo

wab

le R

MS

curr

ent (

A)

∆T = 80°C∆T = 70°C

∆T = 90°C

∆T = 50°C∆T = 40°C

∆T = 60°C

∆T = 20°C

∆T=10°C

∆T = 30°C


Electrical Data


134 2

865 7



CM22 xxx

xR yywwP

Marking

130µm

23.5 MAX

3 x 3.81

2.1 x 0.45 MAX

30.8± 0.4

35.3MAX

1.3 to 1.6

12.2MAX

1 4

8 5


Packaging

F

WSo

P1 PoUnreeling

29.0 37.5

3.813.0


CMC22

0,01

0,1

1

10

100

1000

0,01 0,1 1 10 100

FREQUENCY (MHz)

IM

PE

DA

NC

E (

k)

3M31M6

M74

M14M34

58K

ImpedanceCMC22

0

10

20

30

40

50

60

70

0,01 0,1 1 10 100

FREQUENCY (MHz)

AT

TE

NU

AT

ION

(d

B)

3M3

1M6M74

M14M34

58K

Attenuation


-60%

-40%

-20%

0%

20%

40%

60%

80%

100%

120%

140%

-75 -50 -25 0 25 50 75 100 125 150 175 200 225


ΔL

/L (

%)

Tc



50Ω

50Ω

50Ω

SIN

Att. (dB) = 20 log 10

50ΩVTEST

VTEST

VDUAL

VREF

VREF

CMC


0

5

10

15

20

25


Max

allo

wab

le R

MS

curr

ent (

A)

∆T = 30°C

∆T=10°C

∆T = 80°C∆T = 70°C

∆T = 90°C

∆T = 50°C∆T = 40°C

∆T = 60°C

∆T = 20°C

∆T = 80°C∆T = 70°C

∆T = 90°C

∆T = 50°C∆T = 40°C

∆T = 60°C

∆T = 20°C

∆T=10°C

∆T = 30°C

CMC22 M34

0

2

4

6

8

10


Max

allo

wab

le R

MS

curr

ent (

A)

∆T = 80°C∆T = 70°C

∆T = 90°C

∆T = 50°C∆T = 40°C

∆T = 60°C

∆T = 20°C

∆T=10°C

∆T = 30°C

CMC22 1M6

0

1

2

3

4

5


Max

allo

wab

le R

MS

curr

ent (

A)

CMC22 M14

0

3

6

9

12

15


Max

allo

wab

le R

MS

curr

ent (

A)

∆T = 80°C∆T = 70°C

∆T = 90°C

∆T = 50°C∆T = 40°C

∆T = 60°C

∆T = 20°C

∆T=10°C

∆T = 30°C

∆T = 80°C∆T = 70°C

∆T = 90°C

∆T = 50°C∆T = 40°C

∆T = 60°C

∆T = 20°C

∆T=10°C

∆T = 30°C

CMC22 M74

0

2,5

5

7,5


Max

allo

wab

le R

MS

curr

ent (

A)

∆T = 80°C∆T = 70°C

∆T = 90°C

∆T = 50°C∆T = 40°C

∆T = 30°C

∆T = 60°C

∆T = 20°C

∆T=10°C

CMC22 3M3

0

1

2

3


Max

allo

wab

le R

MS

curr

ent (

A)


CMC22 58K

0

5

10

15

20

25


Max

allo

wab

le R

MS

curr

ent (

A)

∆T = 30°C

∆T=10°C

∆T = 80°C∆T = 70°C

∆T = 90°C

∆T = 50°C∆T = 40°C

∆T = 60°C

∆T = 20°C

9.7A

13.7A

MAX OPERATING TEMP(GUARANTEED)

AREA WHERE OPERATINGTEMPERATURE IS > +125°C

EXTENDED LIFETIMEGUARANTEED AREA

Technical note - Appendix CMC 15 - 18 - 22 & CMC 17 Temperature Application

Flyback Transformers for DC/DC Embedded Applications FLYT Series

Electrical Data

Flyback Transformers for DC/DC converters - FLYT 15 Series

1.3 to 1.6

16 MAX

3 x 3.81

22MAX

1.2 x 0.4 MAX

16.3MAX

7.9MAX

1 4

8 5

130µm


FL15 xxx

xR yywwP

16 24

3.812.1


MarkingPackaging

F

WSo

P1 PoUnreeling

Electrical Data


130µm

19.8 MAX

3 x 3.81

2.1 x 0.4 MAX

22.0± 0.3

26MAX

1.3 to 1.6

8.7MAX

1 4

8 5


21 28

3.813.0


FL18 xxx

xR yywwP

MarkingPackaging

F

WSo

P1 PoUnreeling

Electrical Data


FL22 xxx

xR yywwP

Marking

130µm

23.5 MAX

3 x 3.81

2.1 x 0.45 MAX

30.8± 0.4

35.3MAX

1.3 to 1.6

12.2MAX

1 4

8 5


Packaging

F

WSo

P1 PoUnreeling

29.0 37.5

3.813.0


3.50

9.50

1.1 1.1

7.9

13.9

W terminalsJ leaded

1 8

4 5

CT

01

1

00

26

1J

y

y/w

w

6

8

2

4

5

7

1

3

SEC 1PRIM 1

SEC 2PRIM 2


Notes

Application

7.50

7.40

5.334 = 3 x 1.778

8.50 MAX

0.80

2.0 Max , 1.50typ 0.10 +0.2 -0

8.40 MAX

12,5 ± 0,5

W terminalsJ leaded

9,20 ± 0,30

7.50 +0,3 -0

8.40 MAX

0.80

0.15

PCB Layout (mm)

Connections Marking

Current sense Transformer - CT01 100 261x

6

8

2

4

5

7 Z load

1

3

6

8

2

4

5

7

1

3 Z load

To Order CT01 100 261 x Dimensions (mm)

Packaging

F

WSo

P1 Po Unreeling

CT 08 xxx

xR yywwP

Marking face

Dot for pin 1

Bottom View

15.80

3.00

8.70

1.40

3.8113.97

10.50

15.00

3 4

2

1

3

4

Marking face

Dot for pin 1

Bottom View

15.80

3.00

8.70

1.40

3.8113.97

10.50

15.00

3 4

2

1

3

4

Application Schem.n3 n1 n2

DTR L

iL IOUT

VOUTV

(-VD)

D

C

R

V2

V1

V3

Ve

Dm Tp

i1i3

VT

i2

RL

VOUT

CT08 200 221R

n3 n1 n2DTR L

iL IOUT

VOUTV

(-VD)

D

C

R

V2

V1

V3

Ve

Dm Tp

i1i3

VT

i2

RL

VOUT

CT08 200 221R

1 4

IIN

PRIM(Np)

SEC(Ns)

RL VOUT

2 3

1 4

IIN

PRIM(Np)

SEC(Ns)

RL VOUT

2 3


Marking

Notes

Connections


Current Transformer for DC/DC ApplicationsCT08 200 221 PR

8.4 14.4

3.2

8.4

CT 91 xxx

xR yywwP

1

2

3

4

Z load


To Order CT91 ### 231 WR Notes

Application

I

Ipk

IDC

αT T

ΔI10.7MAX

13.4 MAX

0.9 to 1.3

1.5 x0.28MAX

10.6 MAX

5.8MAX

5.7

1

2

4

3


Connections


Marking

Current sense Transformer, up to 10Apk - CT91 xxx 231 WR

Packaging

F

WSo

P1 PoUnreeling

16 24

14

5 8

3.812.0

CT 15 xxx

xR yywwP

1

3

8

7

2

4

6

5


To Order CT15 200 231 WR

Notes

1.3 to 1.6

16MAX

22 MAX

1.2 x 0.4MAX

16.3 MAX

7.9MAX

1

4

8

5


Connections


Marking

Current sense Transformer, 1/200/200 up to 17Apk - CT15 200 231 WR

Packaging

F

WSo

P1 PoUnreeling

6

5

2

4

8

7 Z load

1

3

6

5

2

4

8

7

1

3 Z load

Type B

Type A

3

PRIM SEC

2

4

1

3

PRIM SEC

4

2

1

Connections


Notes

Gate Drive Transformer GDT91 Series

GDT91 xxx xx

xR yywwP

10.7MAX

13.4 MAX

0.9 to 1.3

1.5 x0.28MAX

10.6 MAX

5.8MAX

5.7

1

2

4

3

8.4 14.4

3.2

8.4

Marking



Packaging

F

WSo

P1 PoUnreeling

1.3 to 1.6

16 MAX

3 x 3.81

22MAX

1.2 x 0.4 MAX

16.3MAX

7.9MAX

1 4

8 5

Notes

Dimensions (mm, top view) PCB Layout(suggested)

Connections

GDT 15 xxx

xR yywwP

Marking

Type B

Type A

7PRIM

SEC

8

2

1

7

PRIM SEC

8

2

1

5

SEC

6

4

3

16 24

3.812.1

Gate Drive Transformer GDT15 Series


Packaging

F

WSo

P1 PoUnreeling


www.microspire.c m


Industri

al Technolo

gies

Industri

al Technolo

gies

Custom Power Magnetics

EFD, ER and EP series

ETD Coils and Transformers

RM series

Planar Magnetics

Custom Power Magnetics

Current and Voltage Transformers

Electro-Magnetic Sensors

Self-Bonded Coils

Injection-Moulded Coils / Bobbin Coils

Custom bobbins

Electrical Data

Connections

Response Curves

Att

en

uati

on

(d

B)

Typical Attenuation versus Frequency on 50 OhmsDLEF1x 020 1S

25

20

15

10

5

0

-5

Frequency (Hz)

1E+05 1E+06 1E+07 1E+08 1E+09

@100mV

COMMON MODE

DIFFERENTIAL MODE


7.8

8

5

1

4

5

3.81

5.4

7.4 max

4.3

5

0.4

1.21

cap

Bottom view

Top view

DLEF0x xxx xS

DLEF1x xxx xS

with cap

without cap

DLEFx2 xxx xS

DLEFx4 xxx xS

DLEFx3 xxx xS

6.2

1.21

0.8

2

Data Line EMI Filters - DLEF Series

Packaging


Electrical Data

Typical Impedance versus FrequencyESC11 xxx xS

10 000

1 000

100

10

1

0.1

0.01

1E+02 1E+03 1E+04 1E+05 1E+06 1E+07 1E+08

Frequency (Hz)

Mo

du

lus (

Oh

ms)

ESC11 15K

ESC11 56K

ESC11 M47

@ 100mV

@ 100mV

ESC11 15K

ESC11 56K

ESC11 M47

Typical Attenuation versus Frequency on 50 OhmsESC11 xxx xS

30

25

20

15

10

5

0

Att

en

uati

on

(d

B)

1E+04 1E+05 1E+06 1E+07 1E+08

Frequency (Hz)

7.8

8

5

1

4

5

3.81

5.4

7.4 max

4.3

5

0.4

1.21

cap

Bottom view

Top view

ESC0x xxx xS

ESC1x xxx xS

with cap

without cap

Connections

6.2

0.8

2

1.21

1

2

4

3

5

6

8

7

EMI Suppression Chokes - ESC Series

Packaging


Electrical Data

14

12.5 10.16

12.7 10

□ 0.5

3.5

Horizontal design ICMCxx xxx xH

5 6

1 10

9

14 10.16

7.62 15

□ 0.5

3.5

Vertical design ICMCxx xxx xV

5 6

1 10


Symbols

Connections2-fold chokes ICMC12 xxx xx

1 10

65

4-fold chokes ICMC14 xxx xx

1 10

2 9

4 7

5 6

Common-Mode Chokes - ICMC Series

Measurement CircuitFrequency Response

Electrical Data

To Order LCMC 20 4M7 1S

MB08216-0

0

5

10

15

20

25

30

35

40

45

1E+02 1E+03 1E+04 1E+05 1E+06 1E+07 1E+08

Frequency (Hz)

Att

en

uati

on

(d

B)

Typical attenuation versus frequency on 50 Ohms

@100mV

LCMC 20 4M7 1S

VREF

VTEST

SINVDUAL

50 Ω

50 Ω

50 Ω

50 Ω

Typical Dimensions (mm) Connections

4

1 2

3

Pin 1 Identifier

4 x Ø 1.14 TYPContact surface

7.62 TYP

8.76± 0.25

10.16 ± 0.25

Bottom view

0.64

6.35max

6.22± 0.05

Marking

1 yywwP

LC 20 4M7

1

2

4

3

Line Common Mode Choke - LCMC

Electrical Data


7.8

8

5

1

4

5

3.81

5.4

7.4 max

4.3

5

0.4

1.21

cap

Bottom view

Top view

WRFT0x xxx xS

WRFT1x xxx xS

with cap

without cap

Connections

8

5

1

4

8

6-7

5

1

4

Standard

Center tap

PRI

PRI PRI

6.2

0.8

2

1.21

Wide Band RF Transformers - WRFT Series

Packaging PCB Layout(suggested)

Flyback Safety Insulating Transformers FSIT Series

16 MAX

15.5

MA

X

15 MAX

Ø 0.6 ±0.1

10

6

1

5

Bottom view

8.6±0.3

2.5

±0

.3

FSIT 13 FSIT 16Bottom view

17 MAX

Ø 0.6

19 MAX

19.5

MA

X

10 1

7 5

2.7

x 5

=13.5

±0

.5

12.2±0.5

3.5

x3

=10.5

±0

.5

TypicalDimensions(mm)

FSIT 13 Series & FSIT 16 SeriesFlyback Safety Insulating Transformers

Electrical Data - FSIT 13

Electrical Data - FSIT 16

Electrical Data FSIT 20.1

Bottom viewFSIT 20

16.5

MA

X

5 4

22 MAX 21.5 MAX 15.0 TYP

Ø 0.7

8 1

5 T

YP

Bottom viewFSIT 20.1

6 5

15.24 TYP10 1

3.8

1 T

YP

17

MA

X

22 MAX

0.45Ø 0.68

21.5MAX


FSIT 20 Series & FSIT 20.1 SeriesFlyback Safety Insulating Transformers

Electrical Data FSIT 20

TypicalDimensions(mm)

28 MAX 28.5 MAX

5.08TYP

20.32 TYP

Bottom View

5

110

6□ 0.7

20.5

MA

X

35.5 MAX 35.5 MAX

□ 0.7 25.4 TYP

Bottom View

1

67

135.08TYP

25.5

MA

X

FSIT 25 Series & FSIT 29 SeriesFlyback Safety Insulating Transformers



Electrical Data Connections


a

3.5

bL

HW

1 2

4 3

3.5 H

L

W

1

2

3

4

8

7

6

5

b c

a

1 4

2 3

2 7

3 6

Applications

Common-Mode Chokes - CMESC 10-14

Electrical Data

a

3.5

bL

HW

1 2

4 3

Typical Dimensions (mm) Connections

1 4

2 3

Common-Mode Chokes - CMESC 17

Att. (dB) = 20 log 10TEST

REF

V

V

50Ω

SIN

50Ω

50Ω

50ΩVTEST

CMESC

VREF

VDUAL

CMC17

0,01

0,1

1

10

100

0,01 0,1 1 10 100FREQUENCY (MHz)

30M

13M

5M8

1M2

2M6

M45

69M

IM

PE

DA

NC

E (

k)

ImpedanceCMC17

FREQUENCY (MHz)

AT

TE

NU

AT

ION

(d

B)

0

10

20

30

40

50

0,01 0,1 1 10 100

1M2

2M6

5M8

30M

13M

69M

M45

Attenuation


-80%

-60%

-40%

-20%

0%

20%

40%

60%

80%

100%

120%

-75 -50 -25 0 25 50 75 100 125 150 175

CMESC17 range

Standard MnZn ferrite

High perm ferrite

Δ L

/L (

%)



CMESC 17 Common Mode Chokes SeriesImproved Temperature Stability

Typical Dimensions (mm - see tables)

D

W

1,5max

15±3

Toroidal Chokes - TC Series

Electrical Data

Electrical Data


7 8

5 6

3 4

1 2

H

L

3.5 ±0.5I

a c

b

D

ConnectionsSeries

Differentialmode

STRAP

Parallel

7 8

65

3 4

21

IN OUT

7 8

65

3 4

21

IN+ IN-

OUT- OUT+

7 8

65

3 4

21

IN OUT

Symbols

Energy Storage Inductors - ESI Series

Electrical Data (25°C)

8.7 max

7max

4

6

3

1

150

150

B

A

Dot for Pin 1

3.70±0.2

Ht 5.33

8.30

1.0

3.50

9.505.30 3.00

34

0.6 ±0.1

NotesTypical Dimensions (mm)

Connections

A

B

1T

1

3

Z load

Current sense Transformer up to 2.2ACT05 xxx 231 W

Packaging

Ko

BoF

WSo

Ao

P1

Po

SMD Line-Matching Transformer - MTLM 1234

Connections

Frequency Response Distorsion

Dimensions (mm)

Electrical Data

Packaging7

1.80 1.25

9

13

2 x 2.54

1.70

1.8

11.2

5.08

1.25

1

3

6

4

-5.0

-4.5

-4.0

-3.5

-3.0

-2.5

-2.0

-1.5

-1.0

-0.5

0.0

10 100 1000 10000 100000

AMPLITUDE (dBm) LOAD : 600 Ω @ 0 dBm

FREQ (Hz)

-110

-100

-90

-80

-70

-60

-50

10 1000 10000

T.H. DISTORTION + NOISE (dBm) LOAD : 600 @ -10 dBm

FREQ (Hz)

Line-Matching Transformers - MTLM SeriesFeatures

Electrical Data

ApplicationsDimensions and Connections

1 3

6 4

7.62

18

18 12.7

14 MAX

0.5

3.5 min6

4

1

3Ø 0.6

1 3

6 4

7.62

18

18 12.7

5

0.5

3.5 min

14

6

4

1

3

5

Ø 0.6

15.2

14.9 10.166 10

1 5

10.16

3.5

13.2 Ø 0.6

6

10

1

5

6

10

10 6

1 5

1

5

13.7 13

12

2.54 1.27

20.32

3.175

1

8

4

23

25 15.24

Ø 0.65

5

8

1

4

3x5.08 3.5

17

4

8

1

22

26 15.24

5

3x5.08

1

4

8

5

23

150

150

600

3

16.5

Ø 0.7

56 kbps Line-Matching Transformer - MTLM 2056 series

Dimensions (mm) Connections

Construction

Frequency ResponseDistorsion

Electrical Data

Packaging

1 3

6 4

7.62

18

18 12.7

13.4

0.5

3.5 min

Ø 0.6

MTLM 2056

6

4

1

3

1:1

-5.0

-4.5

-4.0

-3.5

-3.0

-2.5

-2.0

-1.5

-1.0

-0.5

0.0

10 100 1k 10k


FREQ (Hz)

-120

-110

-100

-90

-80

-70

-60

-50

100 1k 10k

T.H. DISTORSION + NOISE (dBm) LOAD : 600 @ -10 dBm

FREQ (Hz)

-5.0

-4.5

-4.0-3.5-3.0-2.5

-2.0

-1.5-1.0-0.5 0.0

10 100 1k 20k10k


FREQ (Hz)


www.microspire.c m


+-

C43.5p

r

rs2

rs1

Is1600k

Is21.2

Is

5.01m

25u

C5

-1.2p

C3

3.7p

100G

RinfE

E1F

F1

250m

Rp4

Lp4

92k

Lp3

20.5k

Lp2

2.5k

p1

5k

1

1

1.4

Rp3

5 95 105 115

T = 30°C

T=10

0°C

T = 40°C

T = 20°C

Engineerin

g Serv

ices

Electrical Modelling of Magnetics

1°105

105 106 107

1°104

104

1°103

103100

MODULUS ZO from primary

Frequency (Hertz)

Mo

du

lus

(O

hm

s)

PHASE ZO from primary100

50

0

-50

-100100 103 104 105 106 107

Ph

as

e (

De

gre

es

)

Frequency (Hertz)

Component optimisationthrough electrical model

Thermal characterizationof components/packages

CMC22 M27

0

5

10

15

20

25

25 35 45 55 65 75 85 95 105 115 125AMBIENT TEMPERATURE (°C)

MA

X A

LLO

WA

BLE

RM

S C

UR

REN

T (A

)

∆T = 30°C

∆T=10°C

∆T = 80°C∆T = 70°C

∆T = 90°C

∆T = 50°C∆T = 40°C

∆T = 60°C

∆T = 20°C

0

20

40

60

80

100

120

140

160

180

0,0 1,0 2,0 3,0 4,0 5,0 6,0

SESI 18 - TEMP INCREASE VS LOSSES

Total Losses (W)

ΔT

(°C

)

DT (°C) - 25°C

DT (°C) - 50°C

DT (°C) - 75°C

DT (°C) - 100°C

DT (°C) - 125°C

SESI 18 - EQUIVALENT THERMAL RESISTANCE

27

28

29

30

31

32

33

34

35

36

37

0,0 1,0 2,0 3,0 4,0 5,0 6,0

Total Losses (W)

Rth

(°C

/W)

RTH (°C/W) - 25°C

RTH (°C/W) - 50°C

RTH (°C/W) - 75°C

RTH (°C/W) - 100°C

RTH (°C/W) - 125°C

+-

C4 3.5p

rs3rs2rs1

Is1 600k Is2 1.2 Is3 200m

5.01m 25u 5u

C2

2.9p

C

D

C6

1.6p

C5

-1.2p

C3

3.7p

100G

Rinf

E

E1

F

F1

250mRp4

Lp4

92k

Lp3

20.5k

Lp2

2.5k

Lp1

2.5k

1

1

1.4Rp1

Rp2

Rp3

r1

124Rp

260k

C1A

B

5.3p

Engineering Services

ADSL Central Office Splitters

Public Telephone Filters

Train Detection Filters

Engineering ServicesHigh Performance Passive Filters

Component optimisationthrough 2D/3D simulation

Electromagnetic Characteristics of Magnetics

Engineering Services

www.microspire.c m

High Grade and Industrial Technologies - FTP Directory Listing

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Transcript of High Grade and Industrial Technologies - FTP Directory Listing